Wiring board and electrical connection device

Abstract

To enable enhancement of heat dissipation effect of a heated wiring conductor, in order to suppress a temperature rise of a wiring board.SOLUTION: Provided is a wiring board used for an electrical connection device electrically connecting an inspection device and an object to be inspected, including: a first wiring region connected with the inspection device, on one surface thereof; a second wiring region connected with each of a plurality of electrical contact parts coming into contact with an electrode terminal of the object to be inspected, on the other surface; and at least a first annular groove part provided on an outer periphery of the first wiring region on the one surface and / or a second annular groove part provided on an outer periphery of the second wiring region on the other surface.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a wiring board and an electrical connection device, and can be applied to an electrical connection device such as a probe card used for electrical inspection such as an energization test of each semiconductor integrated circuit formed on a semiconductor wafer, for example.

Background Art

[0002] For example, there are various types of wiring boards used for probe cards. As one of them, in order to increase the substrate strength, some use high-temperature co-fired ceramics (HTCC). However, since it is fired at a high temperature, tungsten or molybdenum with a high melting point is used as the wiring conductor. The melting point of tungsten is 3,422°C, and the melting point of molybdenum is 2,622°C.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Generally, in a resin substrate, the wiring conductor is formed of copper, and the electrical resistivity of copper is as low as 1.68×10 -8 Ω·m. On the other hand, the electrical resistivity of tungsten used as the wiring conductor of the above-described wiring board is as high as 5.29×10 -8 Ω·m, which is 3.14 times that of copper.

[0005] When the electrical resistivity is high, the wiring conductor generates heat due to the applied current, and the wiring board expands due to this heat. In the wiring board of the probe card, this thermal expansion causes a displacement in the positions between the terminals (for example, probe pads) of the wiring board and the electrical contacts (for example, probes). As a result, the accuracy of the electrical inspection of the semiconductor integrated circuit as the object to be inspected can be affected.

[0006] Therefore, in view of the above-described problems, the present invention aims to provide a wiring board capable of enhancing the heat dissipation effect of the heat-generating wiring conductor in order to suppress the temperature rise of the wiring board.

Means for Solving the Problems

[0007] In order to solve such problems, a first aspect of the present invention is a wiring board used in an electrical connection device that electrically connects between an inspection device and an object to be inspected. One surface has a first wiring region for connecting to the inspection device, and the other surface has a second wiring region for connecting to each of a plurality of electrical contacts that contact the electrode terminals of the object to be inspected. At least, a first annular groove portion is provided on the outer periphery of the first wiring region on one surface, and / or a second annular groove portion is provided on the outer periphery of the second wiring region on the other surface.

[0008] A second aspect of the present invention is an electrical connection device that electrically connects between an inspection device and an object to be inspected. It electrically connects to the inspection device and has the wiring board of the first aspect of the present invention that is electrically connected to each of a plurality of electrical contacts that contact the electrode terminals of the object to be inspected.

Effects of the Invention

[0009] According to the present invention, in order to suppress the temperature rise of the wiring board, the heat dissipation effect of the heat-generating wiring conductor can be enhanced.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Mode for Carrying Out the Invention

[0011] (A) Main Embodiment Hereinafter, embodiments of the wiring board and the electrical connection device according to the present invention will be described in detail with reference to the drawings.

[0012] (A-1) Configuration of the Electrical Connection Device FIG. 1 is a configuration diagram showing the configuration of the electrical connection device according to the embodiment.

[0013] In FIG. 1, the electrical connection device 10 according to the embodiment is electrically connected to an inspection unit (tester) TE, and includes a support member 11, a wiring board 12, a connection board (interposer) 13, a multilayer wiring board 14, a connection unit 15, and a probe board 16.

[0014] In the following drawings, the same or corresponding components are denoted by the same or corresponding reference numerals. It should be noted that each drawing is a schematic diagram, and the dimensions, thicknesses, etc. of each component are different from the actual ones. Also, the dimensions and ratios of corresponding components are different between the drawings. The embodiments shown below illustrate devices and methods for embodying the technical idea of the present disclosure, and do not limit the materials, shapes, structures, arrangements, etc. of the components of the present disclosure. Also, each drawing shows the main components, but is not limited to the illustrated members, and actually includes members not shown.

[0015] The electrical connection device 10 is used for the electrical inspection of the object under test 83, and exchanges electrical signals between the object under test 83 and the tester (inspection device) TE. The electrical connection device 10 has electrical contacts (probes) that make electrical contact with the electrode terminals 84 of the object under test 83.

[0016] The electrical connection device 10 is mounted on the test head of the tester TE, and at the time of inspection, electrically contacts the corresponding electrical contacts with each electrode terminal 84 of the object under test 83 to electrically connect between the tester TE and the object under test 83.

[0017] That is, at the time of inspection, the electrical connection device 10 supplies an electrical signal from the tester TE to the electrode terminal 84 of the object under test 83 via the electrical contact, and the electrical connection device 10 gives an electrical signal from the object under test 83 to the tester TE via the electrical contact. In this way, by the electrical connection device 10 electrically connecting between the object under test 83 and the tester TE, the tester TE can inspect the electrical characteristics of the object under test 83.

[0018] [Object under test 83] The object under test 83 is an object whose electrical characteristics are inspected by the tester TE. For example, the object under test 83 is a semiconductor integrated circuit before dicing formed on a semiconductor wafer, has a large number of transistors such as a semiconductor integrated circuit (IC chip device), etc., and is assumed to have a high allowable current during inspection. The shape of the object under test 83 is not particularly limited, and for example, it is rectangular or triangular in top view.

[0019] The object under test 83 is placed, for example, on the upper surface of the chuck 82 connected to the driving unit 81 such as a multi-axis stage. By driving the driving unit 81, the position of the object under test 83 on the chuck 82 can be adjusted. During inspection, the object under test 83 on the chuck 82 and the electrical contact of the electrical connection device 10 are relatively brought closer so that each electrode terminal 84 of the object under test 83 and the corresponding electrical contact are in electrical contact.

[0020] [Probe board 16] The probe board 16 is a board having a plurality of probes. The probes of the probe board 16 are provided at positions corresponding to the positions of the electrode terminals of the object under test 83. Also, the upper end portions of the probes of the probe board 16 can be electrically connected to the connection terminals provided on the other surface (for example, the lower surface) of the multilayer wiring board 14.

[0021] The probes provided on the probe board 16 may be vertical probes or any of cantilever type probes.

[0022] [Support member 11] The support member 11 is arranged at the central portion of the upper surface of the wiring board 12 and stabilizes the posture of the wiring board 12. The support member 11 is a member also called a stiffener.

[0023] [Wiring board 12] The wiring board 12 is a substantially circular plate-shaped printed board formed of a synthetic resin material such as polyimide. The wiring board 12 is a test head wiring board that is electrically connected to the test head.

[0024] On one surface (e.g., the upper surface) of the wiring board 12, a wiring pattern is formed, and electronic components such as resistors and capacitors are provided. A plurality of tester connection parts (not shown) for connecting to the electric circuit of the tester TE are provided at the outer edge part of the wiring board 12, and each tester connection part is connected to the printed wiring on the wiring board 12.

[0025] For example, a plurality of through holes (via holes) penetrating in the plate thickness direction (Z-axis direction) are formed in the wiring board 12. Conductive connectors are inserted into the through holes and are connected to the connection terminals on the probe board 16. Thereby, electrical connection can be made between the wiring board 12 and the probe board 16 via the conductive connectors.

[0026] [Connection unit 15] The connection unit 15 is a member for connecting the connection board 13 and the multilayer wiring board 14 to the probe board 16. By the connection unit 15 supporting the connection board 13 and the multilayer wiring board 14 and enabling the mounting of the probe board 16, electrical connection can be made between the upper end parts of the respective probes (probe needles) of the probe board 16 and the plurality of terminal parts on the lower surface of the wiring board 12.

[0027] For example, the connection unit 15 includes a connection board 13 and a multilayer wiring board 14, which will be described later, between one surface (e.g., the upper surface) of the probe board 16 and the other surface (e.g., the lower surface) of the wiring board 12, and electrical connection is made between each probe and each terminal part on the lower surface of the wiring board 12 via the connection board 13 and the multilayer wiring board 14.

[0028] [Connection board 13] The connection substrate 13 is provided with connection terminals such as pogo pins, and electrically connects the connection terminals formed on the other surface (for example, the lower surface) of the wiring substrate 12 and the connection terminals formed on one surface (for example, the upper surface) of the multilayer wiring substrate 14. Here, an example using a well-known pogo pin formed to be elastically deformable in the axial direction as the connection terminal will be described, but it is not limited thereto. As connection terminals other than pogo pins, for example, well-known terminals formed of simple bars or plates, connectors, etc. can also be used.

[0029] [Multilayer wiring substrate 14] The multilayer wiring substrate 14 is a substrate that electrically connects the upper ends of a plurality of probes provided on the probe substrate 16 and the connection terminals on the other surface (for example, the lower surface) of the connection substrate 13.

[0030] For example, the multilayer wiring substrate 14 is, for example, an insulating substrate, has connection terminals on one surface (for example, the upper surface), and has connection terminals on the other surface (for example, the lower surface). Also, inside the multilayer wiring substrate 14, a wiring path is formed that connects the plurality of connection terminals provided on one surface and the connection terminals provided on the other surface. The connection terminals on the other surface of the multilayer wiring substrate 14 are provided at positions corresponding to the positions of the probes of the probe substrate 16. Therefore, each probe of the probe substrate 16 can be electrically connected to each connection terminal on the other surface (lower surface) of the multilayer wiring substrate 14.

[0031] Note that the wiring conductor of the multilayer wiring substrate 14 is a conductive metal, and depending on the type and manufacturing method of the multilayer wiring substrate 14, for example, it can be copper, copper alloy, tungsten, molybdenum, etc.

[0032] For example, in the case of the multilayer wiring substrate 14 formed of a resin such as polyimide, copper, copper alloy, etc. can be used for the wiring pattern, connection terminals, internal wiring paths, etc. formed on the substrate. Also, for example, when forming the multilayer wiring substrate 14 by co-firing high-temperature ceramics, firing at a high temperature, in that case, the wiring conductor can be tungsten, molybdenum, etc.

[0033] (A-2) Heat dissipation structure of multilayer wiring board 14 (Part 1) The following describes the heat dissipation structure of the multilayer wiring board 14. When an electric current flows during the electrical inspection of the object under inspection 83, Joule heat is generated in the wiring conductor, and this structure effectively dissipates the heat. Therefore, it can be widely applied not only to the type of wiring conductor but also not limited to the multilayer wiring board 14, as long as it is a substrate having a wiring conductor.

[0034] FIG. 2 is a plan view of the multilayer wiring board 14, FIG. 3 is a perspective view of the multilayer wiring board 14, and FIG. 4 is a cross-sectional view taken along line A-A of the multilayer wiring board 14 in FIG. 2.

[0035] As illustrated in FIGS. 2 to 4, the multilayer wiring board 14 is a substantially rectangular plate-shaped substrate. Note that the shape of the multilayer wiring board 14 is not limited to a rectangle.

[0036] On one surface (for example, the upper surface) of the multilayer wiring board 14, a wiring pattern is formed, and a plurality of connection terminals 21 connected to the wiring pattern are provided. Each of the plurality of connection terminals 21 can be connected to a connection terminal typified by a pogo pin of the connection board 13. In one surface of the multilayer wiring board 14, the region where the wiring pattern and the connection terminals 21 are provided is called the first wiring region 142.

[0037] Also, a wiring pattern is formed on the other surface (for example, the lower surface) of the multilayer wiring board 14, and a plurality of connection terminals 22 connected to the wiring pattern are provided. Each of the plurality of connection terminals 22 can be connected to a probe of the probe board 16. As illustrated in FIG. 4, in the other surface of the multilayer wiring board 14, the region where the wiring pattern and the connection terminals 22 are provided is called the second wiring region 144.

[0038] As illustrated in FIG. 4, the connection terminal 21 on one surface and the connection terminal 22 on the other surface are electrically connected via the internal wiring path 23. Also, as illustrated in FIG. 4, inside the multilayer wiring board 14, a power supply layer 24 for applying a power supply current as a main power supply is provided during the inspection of the object to be inspected 83. A relatively large power supply current is applied to the power supply layer 24, which can be said to be one of the heat generation sources where heat is generated.

[0039] As illustrated in FIGS. 2 to 4, an annular groove portion (hereinafter also referred to as the "first annular groove portion") 141 is provided along the four peripheral edges 143 of one surface of the multilayer wiring board 14. In other words, the groove portion 141 is provided around the substantially rectangular first wiring region 142.

[0040] Also, as illustrated in FIG. 4, the groove portion 141 is provided at a position corresponding to a part of the power supply layer 24 inside the multilayer wiring board 14. For example, the groove portion 141 is provided at a position corresponding to the position of the end portion 241 of the power supply layer 24. In the case of this example, the groove portion 141 is provided above the position of the end portion 241 of the power supply layer 24.

[0041] By providing the groove portion 141 at a position corresponding to the position of the end portion 241 of the power supply layer 24 in this way, the heat generated in the power supply layer 24 as a heat generation source is transmitted to the groove portion 141 through the base material, and the heat is transmitted from the groove portion 141 with an open upper part into the air, enabling heat dissipation.

[0042] Also, by providing the groove portion 141 annularly so as to surround the first wiring region 142 on one surface of the multilayer wiring board 14, the entire substrate can be uniformly heat-dissipated.

[0043] Furthermore, in the multilayer wiring board 14, the second wiring region 144 on the other surface is the side that connects to probes arranged at a narrow pitch, and the connection terminals 22 are also arranged at a narrow pitch. In contrast, although the connection terminals 21 in the first wiring region 142 on one surface are also arranged at a narrow pitch, it is not as narrow as the pitch interval of the connection terminals 22 in the second wiring region 144. Therefore, by providing the groove portion 141 annularly on one surface of the multilayer wiring board 14, the heat generated in the entire board can be effectively and uniformly dissipated.

[0044] Here, in order not to be affected by noise, the bottom of the groove portion 141 is made not to reach the power supply layer 24. For example, if the power supply layer 24 is provided at a position about several millimeters (e.g., 4 - 6 mm) from one surface of the multilayer wiring board 14, the depth of the groove portion 141 is set to a depth that does not reach the power supply layer 24 (in this example, for example, about 3.5 - 5.5 mm).

[0045] In the examples of FIGS. 2 to 4, for the convenience of attaching the multilayer wiring board 14, the case where the edge portion 143 of the multilayer wiring board 14 is provided is illustrated, but from the viewpoint of enhancing the heat dissipation effect, the edge portion 143 may not be provided.

[0046] (A - 3) Heat dissipation structure of the multilayer wiring board 14 (Part 2) Next, with reference to FIGS. 5 and 6, the heat dissipation structure (Part 2) of the multilayer wiring board 14 will be described.

[0047] FIG. 5 is a plan view of the multilayer wiring board 14 of the embodiment, and FIG. 6 is a cross-sectional view taken along line B - B of the multilayer wiring board 14 in FIG. 5.

[0048] The heat dissipation structure of the board illustrated in FIGS. 5 and 6 provides a Peltier element 31 as a thermoelectric element in the groove portion 141 illustrated in FIGS. 2 to 4. Further, as illustrated in FIG. 6, the Peltier element 31 provided in the groove portion 141 has a terminal 32 for supplying a direct current to the Peltier element 31 and a terminal 33 for outputting the flowing current.

[0049] The Peltier element 31 is an element having an n-type semiconductor (denoted as "N" in FIG. 6), a p-type semiconductor (denoted as "P" in FIG. 6), and metal electrodes. When a direct current flows in a certain direction, it has the property of absorbing heat (cooling) on one surface of the element and dissipating heat on the other surface.

[0050] Therefore, as illustrated in FIG. 6, one surface (the heat absorption surface) of the Peltier element 31 is set to the side where the power supply layer 24, which is the heat generation source, is located, and the other surface (the heat dissipation surface) of the Peltier element 31 is set to the opening side of the groove portion 141. Thereby, the Peltier element 31 provided in the groove portion 141 absorbs the heat generated in the power supply layer 24, and further the Peltier element 31 dissipates heat toward the opening of the groove portion 141.

[0051] By providing the annular groove portion 141 on one surface of the multilayer wiring substrate 14, the heat dissipation effect can be enhanced. However, by providing the Peltier element 31 in the groove portion 141 and flowing a direct current through the Peltier element 31 to function the effect of the Peltier element 31 moving heat, the heat dissipation effect can be further enhanced.

[0052] In this embodiment, in order to uniformly dissipate heat from the substrate, the Peltier element 31 is filled in the entire annular groove portion 141 provided annularly on one surface of the multilayer wiring substrate 14. However, in order to dissipate heat from a part of the substrate, the Peltier element 31 may be provided in a part of the groove portion 141.

[0053] (A-4) Heat dissipation structure of the multilayer wiring substrate 14 (version 3) Next, with reference to FIGS. 7 and 8, the heat dissipation structure (version 3) of the multilayer wiring substrate 14 will be described.

[0054] FIG. 7 is a cross-sectional view of the multilayer wiring substrate 14 of the embodiment, and FIG. 8 is an explanatory diagram for explaining heat transfer by the heat dissipation structure.

[0055] The heat dissipation structure of the substrate illustrated in FIGS. 7 and 8 provides an annular groove portion (hereinafter, also referred to as "second annular groove portion") 145 in the outer region of the second wiring region 144 at the center of the other surface (for example, the lower surface) of the multilayer wiring substrate 14.

[0056] On the other side of the multilayer wiring board 14, in the second wiring region 144, there are connection terminals 22 arranged at a narrow pitch. Therefore, it is difficult to provide a groove within the region of the second wiring region 144 for heat dissipation. However, on the other side of the multilayer wiring board 14, outside the region of the second wiring region 144 (outer region), there is a support region 146 for ensuring support by the connection unit 15.

[0057] Therefore, as illustrated in FIGS. 7 and 8, a groove portion 145 is provided in the support region 146 of the multilayer wiring board 14. The groove portion 145 is provided at a position corresponding to a part of the power supply layer 24 inside the multilayer wiring board 14. For example, the groove portion 145 is provided at a position corresponding to the position of the end portion 241 of the power supply layer 24. In the case of this example, the groove portion 145 is provided below the position of the end portion 241 of the power supply layer 24.

[0058] Furthermore, a Peltier element 31 is provided in the groove portion 145, with one surface (heat absorption surface) of the Peltier element 31 facing the side where the power supply layer 24 is located, and the other surface (heat dissipation surface) of the Peltier element 31 facing the opening side of the groove portion 145.

[0059] Here, the support region 146 is a portion supported by the connection unit 15. However, as illustrated in FIG. 8, the Peltier element 31 provided in the groove portion 145 transfers heat to the connection unit 15, and further the connection unit 15 transfers heat to the support member 11, and the support member 11 dissipates heat into the air.

[0060] At this time, in order to improve the heat transfer through the connection unit 15 and the support member 11, a heat conductive paste may be applied to the surfaces of the connection unit 15 and the support member 11.

[0061] (A-5) Modification example of the heat dissipation structure of the multilayer wiring board 14 As illustrated in FIG. 9, on one side of the multilayer wiring board 14, an annular groove portion 141 and a Peltier element 31 are provided in the groove portion 141, and further on the other side, an annular groove portion 145 and a Peltier element 31 are provided in the groove portion 145. Thus, the heat dissipation effect can be further enhanced.

[0062] In FIG. 9, the case where the Peltier element 31 is provided in the groove portion 141 on one surface of the multilayer wiring board 14 is illustrated. However, the Peltier element 31 may not be provided in the groove portion 141, and only the groove portion 141 may be provided.

[0063] Also, as shown in FIG. 10, the multilayer wiring board 14 may include four recesses 147 (147a to 147d) formed in a substantially symmetric arrangement on the outer periphery of one surface of the multilayer wiring board 14 instead of the annular groove portion 141.

[0064] For example, on one surface of the multilayer wiring board 14, partition portions 148 (148a to 148d) are provided in a groove portion along the outer periphery, and the recesses partitioned by the partition portions 148 are defined as recesses 147a to 147d. Here, the substantially symmetric arrangement means that, for example, the recess 147a and the recess 147c are provided at positions facing each other on one surface of the multilayer wiring board 14, and such an arrangement is defined as a symmetric arrangement. Similarly, the recess 147b and the recess 147d are at positions facing each other on one surface of the multilayer wiring board 14 and are in a substantially symmetric arrangement. Note that the substantially symmetric arrangement is not limited to the arrangement of the recesses 147 in FIG. 10.

[0065] In this way, by providing the recesses 147 formed in a substantially symmetric arrangement, when the multilayer wiring board 14 has the recesses 147, the thickness of the multilayer wiring board 14 can be ensured and the rigidity can be increased. Furthermore, the Peltier element 31 may be provided at an appropriate position of the recess 147.

[0066] (A-6) Effects of the Embodiment As described above, according to the embodiment, in order to suppress the temperature rise of the multilayer wiring board, the heat dissipation effect of the heat-generating wiring conductor can be enhanced.

Description of Reference Numerals

[0067] 10: Electrical connection device, 11: Support member, 12: Wiring board, 13: Connection board, 14: Multilayer wiring board, 15: Connection unit, 16: Probe board, 21: Connection terminal, 22: Connection terminal, 23: Wiring path, 24: Power supply layer, 31: Peltier element, 32: Terminal, 33: Terminal, 81: Driving unit, 82: Chuck, 83: Object to be inspected, 84: Electrode terminal, 141: Groove portion, 142: First wiring region, 143: Edge portion, 144: Second wiring region, 145: Groove portion, 146: Support region, 147(147a~147d): Recessed portion, 148(148a~148d): Partition portion, 241: End portion, TE: Tester.

Claims

1. A wiring board used for an electrical connection device that electrically connects between an inspection device and a subject to be inspected, having a first wiring region connected to the inspection device on one surface, having a second wiring region connected to each of a plurality of electrical contacts that contact the electrode terminals of the subject to be inspected on the other surface, comprising at least a first annular groove portion on the outer periphery of the first wiring region on the one surface and / or a second annular groove portion on the outer periphery of the second wiring region on the other surface The wiring board is characterized by this.

2. The wiring board is provided with a power supply layer that applies a current between the first wiring region and the second wiring region inside the wiring board, The wiring board according to claim 1, wherein the first annular groove portion and / or the second annular groove portion are provided at positions corresponding to positions of a part of the power supply layer.

3. The wiring board according to claim 2, wherein the first annular groove portion and / or the second annular groove portion have a heat sink member that absorbs heat generated in the power supply layer, transfers the heat, and dissipates the heat.

4. In the case where the second annular groove portion is provided on the outer periphery of the second wiring region on the other surface, the second annular groove portion has a heat sink member that absorbs heat, transfers the heat, and dissipates the heat, the second annular groove portion is provided in a support region that is an end portion of the other surface and is supported by an external support member, The wiring board according to claim 1, wherein the heat absorbed by the heat sink member of the second annular groove portion is transmitted to the external support member to dissipate the heat.

5. An electrical connection device that electrically connects between an inspection device and a subject to be inspected, characterized by having the wiring board according to any one of claims 1 to 4, which is electrically connected to the inspection device and electrically connected to each of a plurality of electrical contacts that contact the electrode terminals of the subject to be inspected.

Images