Processing device and processing method of workpiece

Abstract

To provide a processing device capable of inhibiting increase in the size of the processing device.SOLUTION: A processing device may process a first workpiece and a second workpiece and includes: a first processing unit having a first chuck table which holds the first workpiece, a first processing mechanism which processes the first workpiece, and a first moving mechanism which moves the first chuck table between a first transport position and a first processing area; and a second processing unit having a second chuck table which holds the second workpiece, a second processing mechanism which processes the second workpiece, and a second moving mechanism which moves the second chuck table between a second transport position and a second processing area. The first transport position and the second transport position are set between the first processing area and the second processing area. The first transport position, the second transport position, the first processing area, and the second processing area are set on the same straight line.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a processing apparatus capable of processing a plurality of workpieces, and a method for processing workpieces for processing a plurality of workpieces.

Background Art

[0002] Device chips including devices are manufactured by dividing a wafer on which a plurality of devices are formed into individual pieces. Further, a plurality of device chips are mounted on a predetermined substrate, and the mounted device chips are coated and sealed with a resin layer (mold resin) to obtain a package substrate. By dividing this package substrate into individual pieces, a packaged device including a plurality of packaged device chips is manufactured. Device chips and packaged devices are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] For dividing workpieces such as wafers and package substrates, processing apparatuses such as a cutting apparatus that cuts a workpiece with an annular cutting blade and a laser processing apparatus that performs laser processing on a workpiece are used. For example, the cutting apparatus includes a chuck table that holds a workpiece and a spindle on which a cutting blade is mounted. By holding the workpiece with the chuck table and cutting into the workpiece while rotating the cutting blade, the workpiece is cut and divided (see Patent Document 1).

[0004] In the above cutting apparatus, loading of the workpiece onto the chuck table, processing of the workpiece, and unloading of the workpiece from the chuck table are sequentially performed. Thereafter, the same operation is repeated, and a plurality of workpieces are processed one by one in order. However, in such an operation method of the cutting apparatus, the loading operation of the next workpiece cannot be started until the processed workpiece is unloaded from the chuck table. As a result, a waiting period for conveyance occurs, and the processing efficiency of the workpiece by the cutting apparatus decreases.

[0005] Therefore, a cutting device in which two chuck tables are arranged in parallel has been proposed (see Patent Document 2). By mounting two chuck tables on the cutting device, while one workpiece held by one chuck table is being processed, it becomes possible to load another workpiece onto the other chuck table or unload another workpiece from the other chuck table. As a result, the waiting period for conveyance is shortened and the processing efficiency is improved.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0007] When mounting a plurality of chuck tables on a processing device as described above, in order to make each chuck table independently movable, a plurality of moving mechanisms are installed in parallel. Also, in order to avoid interference (contact, etc.) between the chuck tables, it is necessary to secure a moving space for each chuck table independently. As a result, the processing device becomes larger, the number of processing devices that can be installed in the factory is limited, and the degree of freedom in the layout of the processing devices also decreases.

[0008] The present invention has been made in view of such problems, and an object thereof is to provide a processing device and a method for processing a workpiece that can suppress the enlargement of the processing device.

Means for Solving the Problems

[0009] According to one aspect of the present invention, there is provided a processing apparatus capable of processing a plurality of workpieces, comprising: a first chuck table for holding a first workpiece; a first processing mechanism for processing the first workpiece held by the first chuck table; a first moving mechanism for moving the first chuck table between a first transfer position where the first workpiece is transferred and a first processing area where the first workpiece is processed by the first processing mechanism; a second chuck table for holding a second workpiece; a second processing mechanism for processing the second workpiece held by the second chuck table; and a second moving mechanism for moving the second chuck table between a second transfer position where the second workpiece is transferred and a second processing area where the second workpiece is processed by the second processing mechanism. The first transfer position and the second transfer position are set between the first processing area and the second processing area, and the first transfer position, the second transfer position, the first processing area, and the second processing area are set on the same straight line along the moving directions of the first chuck table and the second chuck table.

[0010] Preferably, the first transfer position and the second transfer position have an overlapping area. Further preferably, the first processing unit includes a pair of first processing mechanisms arranged to face each other in a direction intersecting the moving direction of the first chuck table, and the second processing unit includes a pair of second processing mechanisms arranged to face each other in a direction intersecting the moving direction of the second chuck table. Still further preferably, the first processing unit and the second processing unit are separable from each other.

[0011] Further, according to another aspect of the present invention, there is provided a method for processing workpieces, which includes: a first conveying step of conveying a first workpiece to a first chuck table positioned at a first conveying position; a first processing step of moving the first chuck table holding the first workpiece to a first processing area and processing the first workpiece with a first processing mechanism; a second conveying step of conveying a second workpiece to a second chuck table positioned at a second conveying position while the first chuck table is positioned in the first processing area; and a second processing step of moving the second chuck table holding the second workpiece to a second processing area and processing the second workpiece with a second processing mechanism. The first conveying position and the second conveying position are set between the first processing area and the second processing area, and the first conveying position, the second conveying position, the first processing area, and the second processing area are set on the same straight line along the moving direction of the first chuck table and the second chuck table.

[0012] Preferably, the first conveying position and the second conveying position have an overlapping area with each other.

Advantages of the Invention

[0013] In the processing apparatus and the method for processing workpieces according to one aspect of the present invention, the first conveying position and the second conveying position are set between the first processing area and the second processing area, and the first conveying position, the second conveying position, the first processing area, and the second processing area are set on the same straight line along the moving direction of the first chuck table and the second chuck table. As a result, a part of the area where the workpieces are conveyed can be shared by the first processing unit and the second processing unit. Consequently, the space required for installing the first processing unit and the second processing unit is reduced, and the enlargement of the processing apparatus is suppressed.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0015] Hereinafter, embodiments according to an aspect of the present invention will be described with reference to the accompanying drawings. First, a configuration example of a processing apparatus according to the present embodiment will be described. FIG. 1 is a plan view schematically showing a processing apparatus (a cutting apparatus) 2 capable of performing cutting processing on a plurality of workpieces 11. In FIG. 1, the X-axis direction (processing feed direction, first horizontal direction, left-right direction) and the Y-axis direction (indexing feed direction, second horizontal direction, front-rear direction) are perpendicular to each other. Also, the Z-axis direction (up-down direction, height direction, vertical direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0016] The processing apparatus 2 includes a base 4 that supports or houses each component constituting the processing apparatus 2. At the front end portion (the lower end portion in FIG. 1) of the base 4, a pair of cassette mounting tables 6A and 6B are provided. On the cassette mounting tables 6A and 6B, cassettes 8A and 8B capable of accommodating a plurality of workpieces 11 that are objects of processing by the processing apparatus 2 are placed, respectively. For example, the cassettes 8A and 8B are box-shaped containers and include a plurality of storage shelves in which the workpieces 11 are stored.

[0017] For example, the workpiece 11 is a disk-shaped wafer made of a semiconductor material such as single-crystalline silicon, and has surfaces (upper surface) and back surfaces (lower surface) that are generally parallel to each other. The workpiece 11 is partitioned into a plurality of rectangular regions by streets (division planned lines) arranged in a grid pattern so as to intersect each other. In addition, devices such as IC (Integrated Circuit), LSI (Large Scale Integration), LED (Light Emitting Diode), and MEMS (Micro Electro Mechanical Systems) devices are formed in each of the plurality of regions partitioned by the streets. By dividing the workpiece 11 along the streets with the processing apparatus 2, a plurality of chips (device chips) each including a device are manufactured.

[0018] However, there are no restrictions on the material, shape, structure, size, etc. of the workpiece 11. For example, the workpiece 11 may be a wafer (substrate) of any shape made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), glass, ceramics, resin, metal, etc. Further, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the devices formed on the workpiece 11, and the workpiece 11 may not have any devices formed thereon.

[0019] Furthermore, the workpiece 11 may be a package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate. For example, the package substrate is formed by mounting a plurality of device chips on a predetermined substrate and covering and sealing the mounted device chips with a resin layer (mold resin). By cutting and dividing the package substrate with the processing apparatus 2, a plurality of chips (package devices) each including a plurality of packaged device chips are manufactured.

[0020] When processing the workpiece 11 with the processing device 2, for the convenience of handling (conveying, holding, etc.) the workpiece 11, the workpiece 11 may be supported by an annular frame 13. For example, the frame 13 is an annular member made of a metal such as SUS (stainless steel), and a circular opening penetrating the frame 13 in the thickness direction is provided at the central portion of the frame 13. Note that the diameter of the opening of the frame 13 is larger than the diameter of the workpiece 11.

[0021] A circular sheet 15 is fixed to the workpiece 11 and the frame 13. For example, as the sheet 15, a tape including a film-like base material formed in a circular shape and an adhesive layer (paste layer) provided on the base material is used. However, the sheet 15 may be a thermocompression bonding sheet that does not have an adhesive layer and can be thermocompression bonded to the workpiece 11 and the frame 13.

[0022] With the workpiece 11 disposed inside the opening of the frame 13, the central portion of the sheet 15 is attached to the lower surface side of the workpiece 11, and the outer peripheral portion of the sheet 15 is attached to the lower surface side of the frame 13. Thereby, the workpiece 11 is supported by the frame 13 via the sheet 15. Then, the workpiece 11 is accommodated in the cassette 8A or the cassette 8B while being supported by the frame 13.

[0023] A conveying unit (conveying mechanism) 10 for conveying the workpiece 11 is provided behind (upward in FIG. 1) the cassette mounting tables 6A and 6B. The conveying unit 10 performs the unloading of the workpiece 11 from the cassettes 8A and 8B and the loading of the workpiece 11 into the cassettes 8A and 8B.

[0024] For example, an articulated robot is used as the conveying unit 10. Specifically, the conveying unit 10 includes an articulated arm 12 that rotates in a horizontal plane (in the XY plane), a holding unit 14 that is attached to the tip (one end) of the articulated arm 12 and holds the workpiece 11, and a guide rail 16 to which the base end (the other end) of the articulated arm 12 is connected.

[0025] For example, the holding part 14 is composed of a plate-shaped member made of metal, resin, etc. The width and thickness of the holding part 14 are set so that the holding part 14 can be inserted into the cassettes 8A and 8B. Further, the holding part 14 is provided with a plurality of suction holes (not shown) that open at the tip of the holding part 14. The plurality of suction holes are connected to a suction source (not shown) such as an ejector via a flow path (not shown) formed inside the holding part 14. When the suction force (negative pressure) of the suction source is applied to the suction holes with the suction holes of the holding part 14 facing the workpiece 11 (or the frame 13), the workpiece 11 (or the frame 13) is suction-held by the holding part 14.

[0026] However, as long as the holding part 14 can hold the workpiece 11 (or the frame 13), there is no limitation on the configuration of the holding part 14. For example, the holding part 14 may be a Bernoulli type non-contact suction pad. In this case, the holding part 14 uses the Bernoulli effect to hold the workpiece 11 (or the frame 13) in a non-contact manner.

[0027] The guide rail 16 is installed along the X-axis direction and supports the base end portion of the articulated arm 12. Further, a moving unit (not shown) and a lifting unit (not shown) are connected to the base end portion of the articulated arm 12. The moving unit is, for example, a ball screw type moving mechanism that moves the articulated arm 12 in the X-axis direction along the guide rail 16. The lifting unit is composed of, for example, an electric actuator and moves (lifts and lowers) the articulated arm 12 in the Z-axis direction.

[0028] By rotating, moving, and raising and lowering the multi-joint arm 12, the holding part 14 can be positioned at an arbitrary position and in an arbitrary orientation. When unloading the workpiece 11 from the cassettes 8A and 8B, the holding part 14 is inserted into the cassettes 8A and 8B, and the workpiece 11 (or the frame 13) is sucked and held by the holding part 14. In this state, by moving the holding part 14 outside the cassettes 8A and 8B, the workpiece 11 is pulled out from the cassettes 8A and 8B. On the other hand, when loading the workpiece 11 into the cassettes 8A and 8B, after the holding part 14 holding the workpiece 11 (or the frame 13) in a sucked state is inserted into the cassettes 8A and 8B, the suction holding of the workpiece 11 (or the frame 13) by the holding part 14 is released.

[0029] A temporary stage 18 is provided behind the transfer unit 10. The workpiece 11 unloaded from the cassettes 8A and 8B and the workpiece 11 to be loaded into the cassettes 8A and 8B are temporarily held on the temporary stage 18. The temporary stage 18 may be provided with an alignment mechanism (not shown) for positioning the workpiece 11 at a predetermined position. For example, the alignment mechanism is constituted by a plurality of movable pins that contact the outer peripheral edge of the frame 13.

[0030] A transfer unit (transfer mechanism) 20 for transferring the workpiece 11 is provided behind the temporary stage 18. Also, behind the transfer unit 20, a pair of processing units (first processing unit) 26A and a processing unit (second processing unit) 26B for processing the workpiece 11 are provided. The transfer unit 20 transfers the workpiece 11 between the temporary stage 18 and the processing units 26A and 26B, and performs the loading of the workpiece 11 into the processing units 26A and 26B and the unloading of the workpiece 11 from the processing units 26A and 26B.

[0031] For example, an articulated robot is used as the transfer unit 20. Specifically, the transfer unit 20 includes an articulated arm 22 that rotates in a horizontal plane (within the XY plane), and a holding unit 24 that is attached to the tip (one end) of the articulated arm 22 and holds the workpiece 11. By rotating the articulated arm 22, the holding unit 24 can be positioned at an arbitrary position.

[0032] For example, the holding unit 24 includes a disk-shaped support member and a plurality of suction pads (not shown) attached to the lower surface side of the support member. The tip (lower end) of the suction pad constitutes a suction surface that sucks the workpiece 11 (or the frame 13), and the suction surface of the suction pad is connected to a suction source (not shown) such as an ejector. When the suction force (negative pressure) of the suction source is applied to the suction surface in a state where the plurality of suction pads are in contact with the upper surface side of the workpiece 11 (or the frame 13), the workpiece 11 (or the frame 13) is sucked and held by the holding unit 24.

[0033] However, as long as the holding unit 24 can hold the workpiece 11 (or the frame 13), there is no limitation on the configuration of the holding unit 24. For example, the holding unit 24 may be a Bernoulli type non-contact suction pad. In this case, the holding unit 24 uses the Bernoulli effect to hold the workpiece 11 (or the frame 13) in a non-contact manner.

[0034] The processing units 26A and 26B each correspond to a processing part (cutting part) that performs cutting processing on the workpiece 11. In FIG. 1, for convenience of explanation, some components of the processing units 26A and 26B are omitted or simplified. Hereinafter, the details of the processing units 26A and 26B will be described.

[0035] FIG. 2 is a perspective view showing the processing units 26A and 26B. The processing units 26A and 26B are independent processing apparatuses (cutting apparatuses), and each can independently perform cutting processing on the workpiece 11.

[0036] The processing unit 26A includes a base 28A that supports or houses each component constituting the processing unit 26A. On the upper surface of the base 28A, a moving mechanism (first moving mechanism) 30A is installed. The moving mechanism 30A includes a pair of X-axis guide rails 32A arranged along the X-axis direction. A flat X-axis moving table 34A is slidably mounted on the pair of X-axis guide rails 32A along the X-axis guide rails 32A.

[0037] On the lower surface (back surface) side of the X-axis moving table 34A, a nut portion (not shown) is provided. An X-axis ball screw 36A arranged along the X-axis direction between the pair of X-axis guide rails 32A is screwed into this nut portion. Further, at the end of the X-axis ball screw 36A, an X-axis motor 38A such as a servo motor for rotating the X-axis ball screw 36A is connected. When the X-axis motor 38A rotates the X-axis ball screw 36A, the X-axis moving table 34A moves in the X-axis direction along the X-axis guide rails 32A.

[0038] On the upper surface (front surface) of the X-axis moving table 34A, a chuck table (first chuck table) 40A for holding the workpiece 11 is installed. The upper surface of the chuck table 40A is a flat surface generally parallel to the horizontal plane (XY plane), and constitutes a circular holding surface 40Aa for holding the workpiece 11. The holding surface 40Aa is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), etc. formed inside the chuck table 40A.

[0039] Further, the chuck table 40A includes a plurality of clamps 40Ab that grip and fix the frame 13 (see FIG. 1) that supports the workpiece 11. The plurality of clamps 40Ab are arranged at substantially equal intervals along the circumferential direction of the holding surface 40Aa around the holding surface 40Aa. When the workpiece 11 is placed on the chuck table 40A, the frame 13 is fixed by the plurality of clamps 40Ab.

[0040] When the moving mechanism 30A is actuated to move the X-axis moving table 34A along the X-axis guide rail 32A, the chuck table 40A moves along the X-axis direction. Further, a rotation drive source (not shown) such as a motor for rotating the chuck table 40A around a rotation axis generally parallel to the Z-axis direction is connected to the chuck table 40A.

[0041] Further, on the upper surface side of the base 28A, a gantry-shaped support structure 42A is installed so as to straddle the moving mechanism 30A. A pair of moving mechanisms (first moving mechanisms) 44A are installed at both end portions on the surface side of the support structure 42A.

[0042] Specifically, on the surface side of the support structure 42A, a pair of Y-axis guide rails 46 are fixed along the Y-axis direction. A flat plate-shaped Y-axis moving plate 48 provided in each of the pair of moving mechanisms 44A is slidably mounted along the Y-axis guide rails 46. Further, between the pair of Y-axis guide rails 46, a pair of Y-axis ball screws 50 are provided along the Y-axis direction.

[0043] Nut portions (not shown) are respectively provided on the back surface sides of the pair of Y-axis moving plates 48. One of the Y-axis ball screws 50 is screwed into the nut portion of one of the Y-axis moving plates 48, and the other Y-axis ball screw 50 is screwed into the nut portion of the other Y-axis moving plate 48. Further, a Y-axis motor 52 such as a servo motor for rotating the Y-axis ball screw 50 is connected to the end portion of the Y-axis ball screw 50. When the Y-axis motor 52 rotates the Y-axis ball screw 50, the Y-axis moving plate 48 moves in the Y-axis direction along the Y-axis guide rails 46.

[0044] On the surface side of the Y-axis moving plate 48, a pair of Z-axis guide rails 54 are fixed along the Z-axis. A flat plate-shaped Z-axis moving plate 56 is slidably mounted along the Z-axis guide rails 54. Further, between the pair of Z-axis guide rails 54, a Z-axis ball screw 58 is provided along the Z-axis direction.

[0045] On the back side of the Z-axis moving plate 56, a nut portion (not shown) is provided, and a Z-axis ball screw 58 is screwed into this nut portion. Further, at the end of the Z-axis ball screw 58, a Z-axis motor 60 such as a servo motor for rotating the Z-axis ball screw 58 is connected. When the Z-axis motor 60 rotates the Z-axis ball screw 58, the Z-axis moving plate 56 moves in the Z-axis direction along the Z-axis guide rail 54.

[0046] Below each of the pair of Z-axis moving plates 56, a processing mechanism (first processing mechanism) 62A is fixed. The pair of processing mechanisms 62A are arranged so as to face each other in a direction (Y-axis direction) intersecting the moving direction (X-axis direction) of the chuck table 40A. And an annular cutting blade (first cutting blade) 64A for cutting the workpiece 11 is mounted on each of the pair of processing mechanisms 62A. The processing mechanism 62A performs a cutting process on the workpiece 11 by cutting into the workpiece 11 held by the chuck table 40A while rotating the cutting blade 64A.

[0047] FIG. 3 is a perspective view showing the processing mechanism 62A. The processing mechanism 62A includes a housing 70 formed in a hollow cylindrical shape. In the housing 70, a columnar spindle 72 arranged along the Y-axis direction is accommodated. The tip end portion (one end side) of the spindle 72 is exposed from the housing 70. Further, at the base end portion (the other end side) of the spindle 72, a rotation drive source (not shown) such as a motor for rotating the spindle 72 is connected.

[0048] A blade mount 74 is fixed to the tip end portion of the spindle 72. The blade mount 74 is made of a metal such as an aluminum alloy, and includes a disc-shaped flange portion 76 and a columnar support shaft (boss portion) 78 protruding from the central portion of the surface 76a of the flange portion 76. An annular convex portion 76b protruding from the surface 76a is provided along the outer peripheral edge of the flange portion 76 on the outer peripheral portion of the flange portion 76. The tip end surface of the convex portion 76b is formed substantially parallel to the surface 76a. Further, a screw portion 78a is formed on the outer peripheral surface of the support shaft 78.

[0049] An annular cutting blade 64A for cutting a workpiece 11 is mounted on a blade mount 74. For example, the cutting blade 64A includes an annular base 64a made of a metal such as an aluminum alloy, and an annular cutting edge 64b formed along the outer peripheral edge of the base 64a. Further, a circular opening 64c penetrating the cutting blade 64A in the thickness direction is provided at the center of the cutting blade 64A (the center of the base 64a).

[0050] The cutting edge 64b is formed so as to protrude radially outward from the outer peripheral edge of the base 64a. For example, the cutting edge 64b is formed by fixing abrasive grains made of diamond, cubic boron nitride (cBN), or the like with a binder such as a nickel plating layer. However, there is no limitation on the materials of the abrasive grains and the binder, and they are appropriately selected according to the material of the workpiece 11 and the like.

[0051] An annular fixing nut 80 for fixing the cutting blade 64A is fastened to the threaded portion 78a of the support shaft 78. A circular opening penetrating the fixing nut 80 in the thickness direction is provided at the center of the fixing nut 80. Further, a thread groove 80a corresponding to the threaded portion 78a of the support shaft 78 is formed on the inner peripheral surface exposed inside the opening of the fixing nut 80.

[0052] The cutting blade 64A is mounted on the blade mount 74 so that the support shaft 78 is inserted into the opening 64c. In this state, when the fixing nut 80 is screwed onto the threaded portion 78a of the support shaft 78 and tightened, the cutting blade 64A is clamped by the tip surface of the convex portion 76b of the flange portion 76 and the fixing nut 80. In this way, the cutting blade 64A is mounted on the tip of the spindle 72 via the blade mount 74. Then, the cutting blade 64A rotates around a rotation axis substantially parallel to the Y-axis direction by the power transmitted from a rotation drive source (not shown) via the spindle 72 and the blade mount 74.

[0053] The processing mechanism 62A is also provided with a nozzle (not shown) for supplying a liquid such as pure water (processing liquid). During the processing of the workpiece 11, the processing liquid is supplied from this nozzle to the workpiece 11 and the cutting blade 64A. Thereby, the workpiece 11 and the cutting blade 64A are cooled, and the chips (processing chips) generated by the cutting of the workpiece 11 are washed away.

[0054] As shown in FIG. 2, an imaging unit 66 is provided at a position adjacent to the processing mechanism 62A. For example, the imaging unit 66 is constituted by a camera (visible light camera, infrared camera, etc.) including an optical microscope and an imaging element such as a CCD (Charged-Coupled Devices) sensor or a CMOS (Complementary Metal-Oxide-Semiconductor) sensor. By imaging the workpiece 11 held by the chuck table 40A with the imaging unit 66, an imaging image of the workpiece 11 is acquired. The imaging image is used for alignment between the workpiece 11 and the cutting blade 64A, evaluation of the workpiece 11, and the like.

[0055] When the moving mechanism 30A is operated to move the X-axis moving table 34A along the X-axis direction, the chuck table 40A, the processing mechanism 62A, and the imaging unit 66 move relatively along the X-axis direction. Also, when the moving mechanism 44A is operated to move the Y-axis moving plate 48 along the Y-axis direction, the chuck table 40A, the processing mechanism 62A, and the imaging unit 66 move relatively along the Y-axis direction. Further, when the moving mechanism 44A is operated to move the Z-axis moving plate 56 along the Z-axis direction, the chuck table 40A, the processing mechanism 62A, and the imaging unit 66 move relatively (lift and lower) along the Z-axis direction.

[0056] The processing unit 26B is configured in the same manner as the processing unit 26A. Specifically, the processing unit 26B includes a base 28B and a moving mechanism (second moving mechanism) 30B installed on the upper surface of the base 28B. The moving mechanism 30B includes a pair of X-axis guide rails 32B, an X-axis moving table 34B, an X-axis ball screw 36B, and an X-axis motor 38B (see FIG. 1). The details of the configuration and functions of the base 28B and the moving mechanism 30B are the same as those of the base 28A and the moving mechanism 30A, respectively.

[0057] On the upper surface (surface) of the X-axis moving table 34B, a chuck table (second chuck table) 40B for holding the workpiece 11 is installed. The configuration and functions of the chuck table 40B are the same as those of the chuck table 40A.

[0058] Specifically, the upper surface of the chuck table 40B is a flat surface generally parallel to the horizontal plane (XY plane), and constitutes a circular holding surface 40Ba for holding the workpiece 11. The holding surface 40Ba is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), etc. formed inside the chuck table 40B. Further, the chuck table 40B includes a plurality of clamps 40Bb for gripping and fixing the frame 13 (see FIG. 1) that supports the workpiece 11. Furthermore, a rotation drive source (not shown) such as a motor for rotating the chuck table 40B around a rotation axis generally parallel to the Z-axis direction is connected to the chuck table 40B.

[0059] Also, on the upper surface side of the base 28B, a portal-shaped support structure 42B is installed so as to straddle the moving mechanism 30B. A pair of moving mechanisms (second moving mechanisms) 44B are installed at both end portions on the surface side of the support structure 42B. The configuration and functions of the moving mechanism 44B are the same as those of the moving mechanism 44A.

[0060] A processing mechanism (second processing mechanism) 62B is fixed to each of the pair of moving mechanisms 44B. The pair of processing mechanisms 62B are arranged to face each other in a direction (Y-axis direction) intersecting the moving direction (X-axis direction) of the chuck table 40B. And an annular cutting blade (second cutting blade) 64B for cutting the workpiece 11 is mounted on each of the pair of processing mechanisms 62B. The configurations and functions of the processing mechanism 62B and the cutting blade 64B are the same as those of the processing mechanism 62A and the cutting blade 64A, respectively (see FIG. 3).

[0061] When the moving mechanism 30B is actuated to move the X-axis moving table 34B along the X-axis direction, the chuck table 40B and the processing mechanism 62B move relatively along the X-axis direction. Also, when the moving mechanism 44B is actuated, the chuck table 40B and the processing mechanism 62B move relatively along the Y-axis direction and the Z-axis direction.

[0062] When cutting blades 64A are mounted on the pair of processing mechanisms 62A respectively, the pair of cutting blades 64A are arranged to face each other (see FIG. 1). Similarly, when cutting blades 64B are mounted on the pair of processing mechanisms 62B respectively, the pair of cutting blades 64B are arranged to face each other (see FIG. 1). That is, the processing units 26A and 26B respectively correspond to so-called facing dual spindle type cutting devices. However, the number of processing mechanisms provided in the processing units 26A and 26B may be one set each.

[0063] The processing unit 26A and the processing unit 26B are configured to be separable from each other. Specifically, the base 28A of the processing unit 26A and the base 28B of the processing unit 26B are constituted by independent members. Therefore, only one of the processing unit 26A and the processing unit 26B can be separated from the other and moved, or the processing unit 26A and the processing unit 26B can be moved to different places respectively. Thereby, operations such as modification, disassembly, and maintenance of the processing units 26A and 26B can be carried out individually.

[0064] When operating the processing device 2, the processing unit 26A and the processing unit 26B are connected. For example, one side surface of the base 28A and one side surface of the base 28B are arranged to be in contact with or close to each other, and the base 28A and the base 28B are connected by a connecting member such as a bolt. Thereby, the processing unit 26A and the processing unit 26B are integrated.

[0065] As shown in FIG. 1, cleaning units (cleaning mechanisms) 90 and 92 for cleaning the workpiece 11 are provided in front of (below in FIG. 1) the conveying unit 20. For example, the cleaning unit 90 is arranged on one side (right side in FIG. 1) of the temporary placement stage 18, and the cleaning unit 92 is arranged on the other side (left side in FIG. 1) of the temporary placement stage 18.

[0066] When the workpiece 11 is processed by the processing units 26A and 26B, processing chips adhering to the workpiece 11 may remain. Therefore, the processed workpiece 11 is cleaned by the cleaning unit 90 and the cleaning unit 92. Thereby, foreign matters such as processing chips adhering to the workpiece 11 are washed away.

[0067] The cleaning unit 90 cleans the lower surface side of the workpiece 11. For example, the cleaning unit 90 includes a flexible cleaning member (not shown) made of a sponge, a non-woven fabric, or the like. By bringing the cleaning member into contact with the lower surface side of the workpiece 11 and rubbing the lower surface side of the workpiece 11 with the cleaning member, foreign matters adhering to the lower surface side of the workpiece 11 are removed, and the lower surface side of the workpiece 11 is cleaned. When the sheet 15 is fixed to the lower surface side of the workpiece 11 as shown in FIG. 1, the lower surface of the sheet 15 is cleaned by the cleaning unit 90. On the other hand, when the sheet 15 is not fixed to the workpiece 11, the lower surface of the workpiece 11 is cleaned by the cleaning unit 90.

[0068] Further, the cleaning unit 90 may include a cleaning nozzle (not shown) provided inside or near the cleaning member. The cleaning nozzle supplies a liquid such as pure water (cleaning liquid) to the lower surface side of the workpiece 11 and the cleaning member. By rubbing the lower surface side of the workpiece 11 with the cleaning member while supplying the cleaning liquid, foreign matter can be easily removed from the lower surface side of the workpiece 11.

[0069] The cleaning unit 92 cleans the upper surface side of the workpiece 11. For example, the cleaning unit 92 includes a spinner table 94 that holds and rotates the workpiece 11, and a cleaning nozzle 96 that supplies a liquid such as pure water (cleaning liquid) to the workpiece 11 held by the spinner table 94.

[0070] The upper surface of the spinner table 94 is a flat surface substantially parallel to the horizontal plane (XY plane), and constitutes a holding surface 94a for holding the workpiece 11. The holding surface 94a is connected to a suction source (not shown) such as an ejector via a flow path (not shown) formed inside the spinner table 94, a valve, etc. Further, the spinner table 94 includes a plurality of clamps (not shown) that grip and fix the frame 13 that supports the workpiece 11. The plurality of clamps are provided around the holding surface 94a and are arranged at predetermined intervals along the circumferential direction of the holding surface 94a. Furthermore, a rotation drive source (not shown) such as a motor that rotates the spinner table 94 around a rotation axis substantially parallel to the Z-axis direction is connected to the spinner table 94.

[0071] The cleaning nozzle 96 supplies the cleaning liquid toward the holding surface 94a of the spinner table 94. Further, a moving mechanism (not shown) for moving the cleaning nozzle 96 along a plane (XY plane) parallel to the holding surface 94a is connected to the cleaning nozzle 96. By operating the moving mechanism, the cleaning nozzle 96 can be positioned at a position where it does not overlap the holding surface 94a of the spinner table 94 (retracted position) and a position where it overlaps (supply position).

[0072] In front of the conveying unit 10, an inspection unit 98 for inspecting the workpiece 11 is provided. For example, the inspection unit 98 is installed adjacent to the cassette mounting tables 6A and 6B at the front end of the base 4. The inspection unit 98 inspects the workpiece 11 processed by the processing units 26A and 26B and cleaned by the cleaning units 90 and 92, and checks whether the appropriate processing and cleaning have been performed on the workpiece 11.

[0073] For example, the inspection unit 98 includes a chuck table (not shown) for holding the workpiece 11 and a camera (not shown) for imaging the workpiece 11. Then, the inspection unit 98 holds the processed workpiece 11 on the chuck table and images it with the camera. Thereby, an imaging image representing the processing marks formed on the workpiece 11 is obtained. Then, the inspection unit 98 performs predetermined image processing on the imaging image to identify the position, dimensions, shape, number, etc. of the processing marks formed on the workpiece 11, and determines whether the workpiece 11 has been appropriately processed based on this information. Further, the inspection unit 98 may inspect whether foreign matter is attached to the workpiece 11 based on the imaging image of the workpiece 11.

[0074] Furthermore, the processing apparatus 2 includes a controller (control unit, control section, control device) 100 for controlling the processing apparatus 2. The controller 100 is connected to each component (conveying unit 10, temporary placement stage 18, conveying unit 20, processing units 26A and 26B, cleaning units 90 and 92, inspection unit 98, etc.) constituting the processing apparatus 2. Also, each component (transfer mechanisms 30A and 30B, chuck tables 40A and 40B, transfer mechanisms 44A and 44B, processing mechanisms 62A and 62B, imaging unit 66, etc.) constituting the processing units 26A and 26B is also connected to the controller 100.

[0075] The controller 100 controls the operations of the components of the processing device 2 by outputting control signals to each component, and operates the processing device 2. For example, the controller 100 is constituted by a computer, and includes a processing unit that executes processes such as calculations necessary for the operation of the processing device 2, and a storage unit that stores various types of information (data, programs, etc.) used for the operation of the processing device 2. The processing unit is constituted by a processor such as a CPU (Central Processing Unit). The storage unit is constituted by a memory such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0076] When machining the workpiece 11 with the processing device 2, a plurality of workpieces 11 are accommodated in the cassettes 8A and 8B, and the cassettes 8A and 8B are respectively set on the cassette mounting tables 6A and 6B. Then, the transfer unit 10 unloads the workpiece 11 from the cassette 8A or the cassette 8B and places it on the temporary placement stage 18.

[0077] Next, the transfer unit 20 holds the workpiece 11 placed on the temporary placement stage 18 and transfers it to the chuck table 40A of the processing unit 26A or the chuck table 40B of the processing unit 26B. Then, the workpiece 11 is sucked and held by the chuck table 40A or the chuck table 40B, and is cut by a pair of cutting blades 64A or a pair of cutting blades 64B.

[0078] When the machining of the workpiece 11 is completed, the suction and holding of the workpiece 11 by the chuck table 40A or the chuck table 40B is released. Then, the transfer unit 20 holds and transfers the workpiece 11 and positions it directly above the cleaning unit 90. In this state, the lower surface side of the workpiece 11 is cleaned by the cleaning unit 90. Thereafter, the transfer unit 20 transfers the workpiece 11 to the cleaning unit 92.

[0079] The workpiece 11 conveyed to the cleaning unit 92 is held by the spinner table 94. Specifically, with the cleaning nozzle 96 positioned at the retracted position, the workpiece 11 is placed on the spinner table 94 such that the upper surface side is exposed upward and the lower surface side (sheet 15 side) faces the holding surface 94a. When the suction force (negative pressure) of the suction source is applied to the holding surface 94a in this state, the workpiece 11 is suction-held by the spinner table 94 via the sheet 15.

[0080] Next, the cleaning nozzle 96 is positioned at a position (supply position) overlapping the rotation axis of the spinner table 94. Then, while rotating the spinner table 94, the cleaning liquid is supplied from the cleaning nozzle 96 toward the workpiece 11. As a result, the cleaning liquid is supplied to the central portion of the workpiece 11, and the cleaning liquid flows radially toward the outer peripheral edge of the rotating workpiece 11 due to the centrifugal force of the workpiece 11. As a result, the upper surface side of the workpiece 11 is cleaned, and foreign matter adhering to the upper surface side of the workpiece 11 is removed.

[0081] The workpiece 11 cleaned by the cleaning units 90, 92 is conveyed to the inspection unit 98 by the conveying unit 10 as necessary and inspected by the inspection unit 98. Thereafter, the workpiece 11 is carried out of the inspection unit 98 by the conveying unit 10 and stored in the cassette 8A or the cassette 8B.

[0082] Next, the details of the processing of the workpiece 11 by the processing units 26A, 26B will be described. FIG. 4 is a plan view showing the processing units 26A, 26B. In FIG. 4, for convenience of explanation, some components of the processing units 26A, 26B are omitted or simplified.

[0083] When performing a cutting process on the workpiece 11, the workpiece 11 is conveyed between the temporary placement stage 18 (see FIG. 1) and the chuck table 40A or the chuck table 40B by the aforementioned conveying unit 20 (see FIG. 1). When the workpiece 11 is loaded into or unloaded from the chuck table 40A, the chuck table 40A is positioned at the conveying position (first conveying position) 110A by the moving mechanism 30A. Also, when the workpiece 11 is loaded into or unloaded from the chuck table 40B, the chuck table 40B is positioned at the conveying position (second conveying position) 110B by the moving mechanism 30B.

[0084] Here, the moving mechanism 30A can position the chuck table 40A such that a part of the chuck table 40A protrudes from one end of the base 28A (the end on the side of the base 28B, the left end in FIG. 4). And the conveying position 110A is set such that a part of it protrudes from the base 28A and overlaps with the base 28B. Therefore, when the chuck table 40A is positioned at the conveying position 110A, a part of the chuck table 40A is arranged to protrude from the base 28A and overlap with the base 28B.

[0085] Similarly, the moving mechanism 30B can position the chuck table 40B such that a part of the chuck table 40B protrudes from one end of the base 28B (the end on the side of the base 28A, the right end in FIG. 4). And the conveying position 110B is set such that a part of it protrudes from the base 28B and overlaps with the base 28A. Therefore, when the chuck table 40B is positioned at the conveying position 110B, a part of the chuck table 40B is arranged to protrude from the base 28B and overlap with the base 28A.

[0086] When the processing units 26A and 26B are configured as described above, the transfer positions 110A and 110B are set so as to have an overlapping region with each other. That is, a part of the region where the workpiece 11 is transferred is shared by the processing unit 26A and the processing unit 26B. FIG. 4 illustrates a state where the left end of the transfer position 110A and the right end of the transfer position 110B overlap each other.

[0087] When the workpiece 11 is processed by the processing unit 26A, the moving mechanism 30A moves the chuck table 40A holding the workpiece 11 from the transfer position 110A and positions it in the processing region (first processing region) 112A. The processing region 112A corresponds to the region where the workpiece 11 is processed by a pair of processing mechanisms 62A (see FIGS. 1 and 2). Thereafter, in the processing region 112A, the workpiece 11 held by the chuck table 40A is cut by a pair of cutting blades 64A (see FIG. 1). When the cutting process of the workpiece 11 is completed, the moving mechanism 30A positions the chuck table 40A from the processing region 112A back to the transfer position 110A.

[0088] Similarly, when the workpiece 11 is processed by the processing unit 26B, the moving mechanism 30B moves the chuck table 40B holding the workpiece 11 from the transfer position 110B and positions it in the processing region (second processing region) 112B. The processing region 112B corresponds to the region where the workpiece 11 is processed by a pair of processing mechanisms 62B (see FIGS. 1 and 2). Thereafter, in the processing region 112B, the workpiece 11 held by the chuck table 40B is cut by a pair of cutting blades 64B (see FIG. 1). When the cutting process of the workpiece 11 is completed, the moving mechanism 30B positions the chuck table 40B from the processing region 112B back to the transfer position 110B.

[0089] As shown in FIG. 4, the transfer positions 110A and 110B are set between the processing areas 112A and 112B. The transfer positions 110A and 110B and the processing areas 112A and 112B are set on the same straight line 114 along the moving direction (X-axis direction) of the chuck tables 40A and 40B. Note that the straight line 114 corresponds to an imaginary line parallel to the moving direction (X-axis direction) of the chuck tables 40A and 40B. The moving mechanism 30A moves the chuck table 40A between the transfer position 110A and the processing area 112A, and the moving mechanism 30B moves the chuck table 40B between the transfer position 110B and the processing area 112B.

[0090] As described above, by arranging the transfer positions 110A and 110B and the processing areas 112A and 112B on the same straight line, a part of the transfer positions 110A and 110B can be overlapped with each other, and a part of the area where the workpiece 11 is transferred can be shared by the processing units 26A and 26B. As a result, the space required for installing the processing units 26A and 26B is reduced, and the enlargement of the processing apparatus 2 can be suppressed.

[0091] Note that if the chuck tables 40A and 40B can be moved independently, the configurations of the processing units 26A and 26B can be changed as appropriate. For example, the X-axis guide rails 32A and 32B may be connected to each other. Also, the base 28A and the base 28B may be configured by the same member, or the X-axis guide rails 32A and 32B may be configured by the same member. Further, the X-axis ball screws 36A and 36B may be installed in parallel so as to straddle the boundary between the bases 28A and 28B. In this case, the X-axis ball screws 36A and 36B are arranged substantially parallel to each other along the X-axis direction so that both the X-axis ball screw 36A and the X-axis ball screw 36B overlap the bases 28A and 28B.

[0092] Next, a specific example of a workpiece processing method for processing a plurality of workpieces 11 by the processing units 26A and 26B will be described. FIG. 5 is a flowchart showing the workpiece processing method.

[0093] Hereinafter, as an example, the case where the first workpiece 11 (workpiece 11A) is processed by the processing unit 26A and the second workpiece 11 (workpiece 11B) is processed by the processing unit 26B will be described with reference to FIGS. 6(A) and 6(B). In FIGS. 6(A) and 6(B), for convenience of explanation, some of the components of the processing units 26A and 26B are omitted or simplified, and the frames 13 and the sheets 15 (see FIG. 1) that support the workpieces 11A and 11B are omitted.

[0094] When processing the workpieces 11A and 11B with the processing units 26A and 26B, first, a first conveying step S1 of conveying the workpiece 11A to the chuck table 40A positioned at the conveying position 110A is performed. FIG. 6(A) is a plan view showing the processing units 26A and 26B in the first conveying step S1.

[0095] In the first conveying step S1, the workpiece 11A (the first workpiece 11) is carried out from the cassette 8A or the cassette 8B (see FIG. 1) by the conveying unit 10 (see FIG. 1) and placed on the temporary stage 18 (see FIG. 1). Further, the moving mechanism 30A is activated, and the chuck table 40A is positioned at the conveying position 110A. At this time, the moving mechanism 30B retracts the chuck table 40B to the processing area 112B so that the chuck table 40A and the chuck table 40B do not interfere with each other.

[0096] Then, the workpiece 11A placed on the temporary stage 18 (see FIG. 1) is held by the conveying unit 20 (see FIG. 1) and placed on the chuck table 40A positioned at the conveying position 110A. In this state, by applying the suction force (negative pressure) of the suction source to the holding surface 40Aa of the chuck table 40A, the workpiece 11A is suction-held by the chuck table 40A. In this way, the workpiece 11A is conveyed to the chuck table 40A.

[0097] Next, the chuck table 40A holding the workpiece 11A is moved to the machining area 112A, and a first machining step S2 of machining the workpiece 11A with the machining mechanism 62A is performed. In the first machining step S2, by cutting into the workpiece 11A while rotating the cutting blade 64A, a predetermined cutting process is performed on the workpiece 11A.

[0098] There is no limitation on the content of the cutting process performed on the workpiece 11A. For example, by cutting the cutting blade 64A along the street set on the workpiece 11A, the workpiece 11A is divided into a plurality of chips (full cut), or a cutting groove is formed in the workpiece 11A (half cut). Further, so-called edge trimming processing of annularly cutting the outer peripheral portion of the chamfered workpiece 11A with the cutting blade 64A may be performed. In the first machining step S2, the workpiece 11A may be machined using only one of the pair of machining mechanisms 62A, or the workpiece 11A may be machined using both of the pair of machining mechanisms 62A.

[0099] Then, while the chuck table 40A is positioned in the machining area 112A, a second transfer step S3 of transferring the workpiece 11B to the chuck table 40B positioned at the transfer position 110B is performed. FIG. 6(B) is a plan view showing the machining units 26A and 26B in the second transfer step S3.

[0100] When the aforementioned first transfer step S1 is completed, the workpiece 11B (the second workpiece 11) is carried out from the cassette 8A or the cassette 8B (see FIG. 1) by the transfer unit 10 (see FIG. 1) and placed on the temporary stage 18 (see FIG. 1). Further, during the period of machining, immediately before machining, and immediately after machining of the workpiece 11A by the machining mechanism 62A, the chuck table 40A is positioned in the machining area 112A. During this period, the moving mechanism 30B operates, and the chuck table 40B is positioned at the transfer position 110B.

[0101] Then, in the second transfer step S3, the workpiece 11B placed on the temporary stage 18 is held by the transfer unit 20 (see FIG. 1) and placed on the chuck table 40B positioned at the transfer position 110B. In this state, by applying the suction force (negative pressure) of the suction source to the holding surface 40Ba (see FIG. 2) of the chuck table 40B, the workpiece 11B is suction-held by the chuck table 40B. In this way, the workpiece 11B is transferred to the chuck table 40B.

[0102] Note that it is preferable that the transfer of the workpiece 11B to the chuck table 40B is performed before the machining of the workpiece 11A by the machining mechanism 62A is completed. Thereby, the unloading operation of the machined workpiece 11A can be promptly started.

[0103] Next, the chuck table 40B holding the workpiece 11B is moved to the machining area 112B, and a second machining step S4 of machining the workpiece 11B with the machining mechanism 62B is performed. In the first machining step S2, by cutting into the workpiece 11B while rotating the cutting blade 64B, predetermined cutting is performed on the workpiece 11B.

[0104] There is no limitation on the content of the cutting performed on the workpiece 11B. For example, machining of the same content as the machining of the workpiece 11A by the machining mechanism 62A is performed on the workpiece 11B by the machining mechanism 62B. Note that in the second machining step S4, the workpiece 11B may be machined using only one of the pair of machining mechanisms 62B, or the workpiece 11B may be machined using both of the pair of machining mechanisms 62B.

[0105] As described above, in the method for machining a workpiece according to the present embodiment, the machining of the workpiece 11A held by the chuck table 40A and the transfer of the workpiece 11B to the chuck table 40B are performed simultaneously. Thereby, the machining efficiency of the workpieces 11A and 11B by the machining units 26A and 26B can be improved.

[0106] Thereafter, while the chuck table 40B is positioned in the machining area 112B, the chuck table 40A is positioned at the transfer position 110A, and the workpiece 11A is unloaded from the chuck table 40A. Specifically, during the machining, immediately before machining, and immediately after machining of the workpiece 11B by the machining mechanism 62B, the chuck table 40B is positioned in the machining area 112B. During this period, the moving mechanism 30A operates to position the chuck table 40A at the transfer position 110A.

[0107] Next, the suction and holding of the workpiece 11A by the chuck table 40A is released. Then, the workpiece 11A is held by the transfer unit 20 (see FIG. 1) and transferred from the chuck table 40A. Thereafter, as described above, the workpiece 11A is washed by the washing units 90, 92 (see FIG. 1) and inspected by the inspection unit 98 (see FIG. 1), and the workpiece 11A is finally accommodated in the cassette 8A or the cassette 8B (see FIG. 1).

[0108] Furthermore, when the third workpiece 11 is machined, the third workpiece 11 is unloaded from the cassette 8A or the cassette 8B (see FIG. 1) and placed on the temporary placement stage 18 (see FIG. 1). Then, the third workpiece 11 is transferred to the chuck table 40A positioned at the transfer position 110A by the transfer unit 20 (see FIG. 1). The transfer procedure of the workpiece 11 at this time is the same as the first transfer step S1. It is preferable that the unloading of the workpiece 11A from the chuck table 40A and the loading of the third workpiece 11 onto the chuck table 40A are carried out before the machining of the workpiece 11B by the machining mechanism 62B is completed.

[0109] Thereafter, the third workpiece 11 is machined in the same procedure as the first machining step S2. Also, while the chuck table 40A is positioned in the machining area 112A, the chuck table 40B is positioned at the transfer position 110B, and the workpiece 11B is unloaded from the chuck table 40B. Note that the unloading procedure of the workpiece 11B is the same as the unloading procedure of the workpiece 11A.

[0110] Further, in the same procedure as the second conveyance step S3 and the second processing step S4, the fourth workpiece 11 is conveyed to the chuck table 40B and processed by the processing mechanism 62B. In this way, the conveyance of the workpiece 11 to the chuck table 40A and the conveyance of the workpiece 11 to the chuck table 40B are alternately performed.

[0111] As described above, in the processing apparatus 2 and the workpiece processing method according to the present embodiment, the conveyance positions 110A and 110B are set between the processing regions 112A and 112B, and the conveyance positions 110A and 110B and the processing regions 112A and 112B are set on a straight line 114 along the moving direction of the chuck tables 40A and 40B (see FIG. 4). Thereby, a part of the region where the workpiece 11 is conveyed can be shared by the processing units 26A and 26B. As a result, the space required for installing the processing units 26A and 26B is reduced, and the enlargement of the processing apparatus 2 is suppressed.

[0112] In the above embodiment, the case where the processing apparatus 2 is a cutting apparatus and the processing units 26A and 26B include the processing mechanisms 62A and 62B for cutting the workpiece 11 with the cutting blades 64A and 64B has been described. However, the type of the processing apparatus 2 is not limited. For example, the processing apparatus 2 may be a laser processing apparatus, a grinding apparatus, a polishing apparatus, or the like.

[0113] When the processing apparatus 2 is a laser processing apparatus, the processing units 26A and 26B each include a chuck table for holding the workpiece and a processing mechanism (laser irradiation unit) for irradiating the workpiece with a laser beam. For example, the laser irradiation unit includes a laser oscillator that pulse-oscillates a laser beam having a predetermined wavelength and a condenser that condenses the laser beam emitted from the laser oscillator. The workpiece is held by the chuck table, and the laser beam irradiated from the laser irradiation unit is condensed on the surface, back surface, or inside of the workpiece, thereby performing laser processing on the workpiece.

[0114] When the processing device 2 is a grinding device, each of the processing units 26A and 26B includes a chuck table for holding the workpiece and a processing mechanism (grinding unit) for performing grinding on the workpiece. The grinding unit includes a spindle, and an annular grinding wheel including a plurality of grinding wheels is attached to the tip of the spindle. Then, the workpiece is held by the chuck table, and the grinding wheel is brought into contact with the workpiece while rotating the chuck table and the grinding wheel. Thereby, the workpiece is subjected to grinding.

[0115] When the processing device 2 is a polishing device, each of the processing units 26A and 26B includes a chuck table for holding the workpiece and a processing mechanism (polishing unit) for performing polishing on the workpiece. The polishing unit includes a spindle, and a disk-shaped polishing pad is attached to the tip of the spindle. Then, the workpiece is held by the chuck table, and the polishing pad is brought into contact with the workpiece while rotating the chuck table and the polishing pad. Thereby, the workpiece is subjected to polishing.

[0116] In addition, the structures, methods, etc. according to the above embodiments can be appropriately changed and implemented without departing from the scope of the object of the present invention.

Explanation of Reference Numerals

[0117] 11, 11A, 11B Workpiece 13 Frame 15 Sheet 2 Processing device (cutting device) 4 Base 6A, 6B Cassette mounting table 8A, 8B Cassette 10 Conveying unit (conveying mechanism) 12 Articulated arm 14 Holding part 16 Guide rail 18 Temporary placement stage 20 Conveying unit (conveying mechanism) 22 Articulated arm 24 Holding part 26A, 26B Processing unit 28A and 28B bases 30A and 30B moving mechanisms 32A and 32B X-axis guide rails 34A and 34B X-axis moving tables 36A and 36B X-axis ball screws 38A and 38B X-axis motors 40A and 40B chuck tables 40Aa and 40Ba holding surfaces 40Ab and 40Bb clamps 42A and 42B support structures 44A and 44B moving mechanisms 46 Y-axis guide rail 48 Y-axis moving plate 50 Y-axis ball screw 52 Y-axis motor 54 Z-axis guide rail 56 Z-axis moving plate 58 Z-axis ball screw 60 Z-axis motor 62A and 62B processing mechanisms 64A and 64B cutting blades 64a base 64b cutting edge 64c opening 66 imaging unit 70 housing 72 spindle 74 blade mount 76 flange part 76a surface 76b convex part 78 support shaft (boss part) 78a threaded part 80 fixing nut 80a thread groove 90 cleaning unit (cleaning mechanism) 92 cleaning unit (cleaning mechanism) 94 spinner table 94a holding surface 96 cleaning nozzle 98 inspection unit 100 controller (control unit, control section, control device) Carrying positions of 110A and 110B Processing areas of 112A and 112B Straight line 114

Claims

1. A processing apparatus capable of processing a plurality of workpieces, comprising: a first chuck table for holding a first workpiece; a first processing mechanism for processing the first workpiece held by the first chuck table; and a first moving mechanism for moving the first chuck table between a first transfer position where the first workpiece is transferred and a first processing area where the first workpiece is processed by the first processing mechanism, a first processing unit including; a second chuck table for holding a second workpiece; a second processing mechanism for processing the second workpiece held by the second chuck table; and a second moving mechanism for moving the second chuck table between a second transfer position where the second workpiece is transferred and a second processing area where the second workpiece is processed by the second processing mechanism, a second processing unit including; the first transfer position and the second transfer position are set between the first processing area and the second processing area; The processing apparatus, characterized in that the first transfer position, the second transfer position, the first processing area, and the second processing area are set on the same straight line along the moving direction of the first chuck table and the second chuck table.

2. The processing apparatus according to claim 1, characterized in that the first transfer position and the second transfer position have an overlapping area with each other.

3. The first processing unit includes a pair of first processing mechanisms arranged to face each other in a direction intersecting the moving direction of the first chuck table; The processing apparatus according to claim 1 or 2, characterized in that the second processing unit includes a pair of second processing mechanisms arranged to face each other in a direction intersecting the moving direction of the second chuck table.

4. The processing apparatus according to claim 1 or 2, characterized in that the first processing unit and the second processing unit are separable from each other.

5. A method for processing workpieces for processing a plurality of workpieces, comprising: a first transfer step of transferring a first workpiece to a first chuck table positioned at a first transfer position; a first processing step of moving the first chuck table holding the first workpiece to a first processing area and processing the first workpiece with a first processing mechanism; While the first chuck table is positioned in the first processing area, a second conveying step of conveying a second workpiece to a second chuck table positioned at a second conveying position; a second processing step of moving the second chuck table holding the second workpiece to a second processing area and processing the second workpiece with a second processing mechanism, and the first conveying position and the second conveying position are set between the first processing area and the second processing area; the first conveying position, the second conveying position, the first processing area, and the second processing area are set on the same straight line along the moving direction of the first chuck table and the second chuck table. A method for processing a workpiece, characterized in that.

6. The method for processing a workpiece according to claim 5, characterized in that the first conveying position and the second conveying position have an overlapping area with each other.

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