Polishing pad dresser and dressing device

Abstract

To provide a polishing pad dresser which can suppress vibration during dressing, and to provide a dressing device.SOLUTION: A dresser 6 comprises: a polishing pad dresser 10 disposed above a polishing pad 3; and a rotatable dress head 7 to which the polishing pad dresser 10 is attached. The polishing pad dresser 10 includes: a circular metal base 13; a chip 14 located on the metal base 13; and an elastic member 12 located on the side opposite to the chip 14 of the metal base 13. The chip 14 has a plurality of protrusions 15 which protrude toward the side opposite to the metal base 13 and in each of which a surface is formed by means of a diamond film 17. The polishing pad dresser 10 is mounted on the dress head 7 such that the elastic member 12 is located between the dress head 7 and the metal base 13.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a dresser for a polishing pad for dressing a polishing pad of a polishing apparatus for polishing a semiconductor wafer or the like, and a dressing apparatus.

Background Art

[0002] Patent Document 1 describes a dresser (conditioner) for dressing (conditioning) a polishing pad of a polishing apparatus. This dresser has a base metal such as stainless steel and a plurality of chips made of a Si wafer attached on the base metal. The chips are configured such that a diamond film is formed on a plurality of protrusions by a CVD (Chemical Vapor Deposition) method. A dresser using chips having a diamond film formed on a plurality of protrusions by the CVD method is called a CVD dresser.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a CVD dresser, the tips of a plurality of protrusions are in a state where they are sharper and have the same height compared to diamond abrasive grains. For this reason, when the resistance between the chip and the polishing pad becomes high during dressing, vibrations of about 0 to 1 kHz called chatter (hereinafter also referred to as "chatter vibration") are likely to occur in the CVD dresser. When such vibrations occur, stable dressing cannot be performed, and there is also a possibility that the protrusions of the chip may break. Note that in an electroplated chip in which a plurality of diamond abrasive grains are fixed by electroplating and a bonded chip in which a plurality of diamond abrasive grains are fixed by a bonding layer (metal bond, vitrified bond, resin bond, etc.), chatter vibration hardly occurs.

[0005] Therefore, an object of the present invention is to provide a dresser for a polishing pad and a dressing apparatus that can suppress vibration during dressing.

Means for Solving the Problems

[0006] [1] The dresser for a polishing pad according to the present invention includes a dresser body having an annular base and chips disposed on the base, and an elastic member disposed on the side of the base opposite to the chips. The chips have a plurality of protrusions protruding on the side opposite to the base and having surfaces formed by diamond films.

[0007] In this dresser for a polishing pad, the polishing pad can be dressed by attaching the base to the dressing head of the dressing apparatus and rotating the dressing head. Here, since the dresser for a polishing pad has a plurality of protrusions in which the chips protrude on the side opposite to the base and the surfaces are formed by diamond films, when the resistance between the chips and the polishing pad increases during dressing of the polishing pad, a chattering vibration is likely to occur. However, since the elastic member is disposed on the side of the base opposite to the chips, the elastic member is disposed between the dressing head and the base, and the chattering vibration is attenuated by the elastic member. Thereby, the chattering vibration during dressing can be suppressed.

[0008] [2] In the dresser for a polishing pad according to [1], the Shore A hardness of the elastic member may be 45 or more and 95 or less. In this dresser for a polishing pad, since the Shore A hardness of the elastic member is 45 or more and 95 or less, the dresser for a polishing pad can be stably attached to the dressing head, and the chattering vibration can be suppressed.

[0009] [3] In the dresser for a polishing pad according to [1] or [2], the elastic member may be rubber. In this dresser for a polishing pad, since the elastic member is rubber, the chattering vibration can be appropriately suppressed.

[0010] [4] In the dresser for a polishing pad according to any one of [1] to [3], the tip has a base material and a diamond film formed on the base material, and the base material may contain silicon. In this dresser for a polishing pad, since the base material contains silicon, a plurality of protrusions of the tip can be easily formed.

[0011] [5] In the dresser for a polishing pad according to any one of [1] to [4], the tip of each of the plurality of protrusions may be formed at an acute angle. In this dresser for a polishing pad, since the tip of each of the plurality of protrusions is formed at an acute angle, when the resistance between the tip and the polishing pad increases during dressing of the polishing pad, a chattering vibration is likely to occur. However, since an elastic member is disposed on the side opposite to the tip of the base metal, the chattering vibration can be suppressed.

[0012] [6] In the dresser for a polishing pad according to any one of [1] to [5], the variation in the height of the plurality of protrusions with respect to the base metal may be 0 mm or more and 0.3 mm or less. In this dresser for a polishing pad, since the variation in the height of the plurality of protrusions with respect to the base metal is 0 mm or more and 0.3 mm or less, when the resistance between the tip and the polishing pad increases during dressing of the polishing pad, a chattering vibration is likely to occur. However, since an elastic member is disposed on the side opposite to the tip of the base metal, the chattering vibration can be suppressed.

[0013] [7] In the dresser for a polishing pad according to any one of [1] to [6], the elastic member may extend in the circumferential direction of the base metal. In this dresser for a polishing pad, since the elastic member extends in the circumferential direction of the base metal, the dresser for a polishing pad can be stably attached to the dressing head, and the chattering vibration can be effectively suppressed.

[0014] [8] In the dresser for a polishing pad according to any one of [1] to [7], the elastic member may be formed in an annular shape. In this dresser for a polishing pad, since the elastic member is formed in an annular shape, the dresser for a polishing pad can be stably attached to the dressing head, and chattering vibration can be effectively suppressed.

[0015] [9] In the dresser for a polishing pad according to any one of [1] to [8], a groove into which the elastic member is fitted may be formed on the mounting surface of the base metal on the side opposite to the tip. In this dresser for a polishing pad, since a groove into which the elastic member is fitted is formed on the mounting surface of the base metal on the side opposite to the tip, by fitting the elastic member into the groove, the positioning of the elastic member with respect to the base metal can be easily performed, and the elastic member can be easily attached to the base metal.

[0016]

[10] In the dresser for a polishing pad according to [9], the thickness of the elastic member may be greater than the depth of the groove. In this dresser for a polishing pad, since the thickness of the elastic member is greater than the depth of the groove, even when the elastic member is fitted to the bottom of the groove, chattering vibration can be suppressed by the elastic member.

[0017]

[11] In the dresser for a polishing pad according to [9] or

[10] , the protruding length of the elastic member with respect to the base metal in the thickness direction of the base metal when the elastic member is fitted into the groove may be 0.1 mm or more and 3 mm or less. In this dresser for a polishing pad, since the protruding length of the elastic member with respect to the base metal in the thickness direction of the base metal when the elastic member is fitted into the groove is 0.1 mm or more and 3 mm or less, the dresser for a polishing pad can be stably attached to the dressing head, and chattering vibration can be effectively suppressed.

[0018] In the dresser for a polishing pad according to

[11] , [9] or

[10] , the groove may be formed at the peripheral portion of the mounting surface. In this dresser for a polishing pad, since the groove is formed at the peripheral portion of the mounting surface, an elastic member can be easily fitted into the groove. Further, by fitting the elastic member into the groove, the elastic member can be arranged in a wider range, the dresser for a polishing pad can be stably attached to the dressing head, and chattering vibration can be effectively suppressed.

[0019] In the dresser for a polishing pad according to

[12] , [9] or

[10] , the groove may be formed to be concentric with the mounting surface at a position spaced apart from the peripheral portion of the mounting surface. In this dresser for a polishing pad, since the groove is formed to be concentric with the mounting surface at a position spaced apart from the peripheral portion of the mounting surface, it is possible to prevent the elastic member fitted in the groove from falling off the groove. Further, by fitting the elastic member into the groove, the dresser for a polishing pad can be stably attached to the dressing head, and chattering vibration can be effectively suppressed.

[0020] In the dresser for a polishing pad according to any one of [1] to

[13] , the elastic member may be arranged so as to cover only a part of the mounting surface on the side opposite to the tip of the base metal. In this dresser for a polishing pad, since the elastic member is arranged so as to cover only a part of the mounting surface on the side opposite to the tip of the base metal, a gap is formed between the dressing head and the base metal. Therefore, since the elastic member can easily elastically expand and contract, chattering vibration can be effectively suppressed.

[0021] The dressing device according to the present invention includes the dresser for a polishing pad according to any one of [1] to

[13] , and a rotatable dressing head to which the dresser for a polishing pad is attached. The dresser for a polishing pad is attached to the dressing head such that an elastic member is arranged between the dressing head and the base metal. In this dressing device, since the above-described dresser for a polishing pad is provided, chattering vibration during dressing can be suppressed.

[0022]

[15] In the dressing device described in

[14] , a gap may be formed between the dress head and the base metal. In this dressing device, a gap is formed between the dress head and the base metal. Therefore, since the elastic member can easily elastically expand and contract, chatter vibration can be effectively suppressed.

Advantages of the Invention

[0023] According to the present invention, vibration during dressing can be suppressed.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Mode for Carrying Out the Invention

[0025] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, the same or corresponding elements are denoted by the same reference numerals, and redundant descriptions are omitted.

[0026] FIG. 1 is a schematic perspective view showing a polishing apparatus according to the present embodiment. As shown in FIG. 1, a polishing apparatus 1 according to the present embodiment is an apparatus for polishing a semiconductor wafer. The polishing apparatus 1 includes a rotatable rotary table 2, a polishing pad 3 disposed on the rotary table 2 and rotating integrally with the rotary table 2, a rotatable polishing head 4 disposed above the polishing pad 3, a nozzle 5 disposed above the polishing pad 3 for supplying slurry or pure water onto the polishing pad 3, and a dressing device 6 for dressing the polishing pad 3. Each of the rotary table 2 and the polishing head 4 is rotationally driven by a driving device (not shown). In the polishing apparatus 1, a semiconductor wafer is attached to the lower end of the polishing head 4, the rotary table 2 and the polishing head 4 are rotated, slurry or pure water is supplied from the nozzle 5 onto the polishing pad 3, and the semiconductor wafer is pressed against the polishing pad 3 by the polishing head 4 with a predetermined pressure, whereby the semiconductor wafer is polished.

[0027] FIG. 2 is a schematic cross-sectional view showing the dressing device according to the present embodiment. As shown in FIGS. 1 and 2, the dressing device 6 according to the present embodiment includes a rotatable dress head 7 disposed above the polishing pad 3 and a dresser 10 for the polishing pad attached to the lower end of the dress head 7. The dress head 7 is rotationally driven by a driving device (not shown).

[0028] FIG. 3 is a schematic bottom view showing a dresser for a polishing pad according to the present embodiment. FIG. 4 is a schematic plan view showing the dresser for a polishing pad according to the present embodiment. FIG. 5 is a cross-sectional view taken along line V-V shown in FIG. 3. FIG. 6 is a cross-sectional view taken along line VI-VI shown in FIG. 3. As shown in FIGS. 2 to 6, the dresser 10 for a polishing pad according to the present embodiment includes a dresser body 11 and an elastic member 12. The dresser body 11 has an annular base metal 13 and a plurality of chips 14 disposed on the base metal 13. The base metal 13 is formed of stainless steel (SUS) or the like.

[0029] The surface of the base metal 13 on the side opposite to the plurality of chips 14 is referred to as an attachment surface 13a. A groove 13b into which the elastic member 12 is fitted is formed in the attachment surface 13a. The groove 13b is formed at the peripheral portion of the attachment surface 13a. That is, the groove 13b is formed over the entire circumference along the periphery of the attachment surface 13a so as to be concentric with the attachment surface 13a.

[0030] Each of the plurality of chips 14 (hereinafter simply referred to as "chip 14") is a member for dressing the polishing pad 3. The surface of the chip 14 on the side opposite to the base metal 13 is referred to as an action surface 14a. The action surface 14a is a surface for dressing the polishing pad 3. The chip 14 is attached to the base metal 13. The attachment of the chip 14 to the base metal 13 can be performed, for example, by adhesion. The chip 14 has a plurality of protrusions 15 protruding to the side opposite to the base metal 13 and having surfaces formed by diamond films 17. The plurality of protrusions 15 are portions for dressing the polishing pad 3 and are formed on the action surface 14a. The shape of each of the plurality of protrusions 15 is not particularly limited, and for example, can be a sharp shape such as a conical shape or a polygonal pyramid shape at the tip.

[0031] Chip 14 has a base material 16 and a diamond film 17 formed on a surface of the base material 16 opposite to the base metal 13. The base material 16 is formed of a material containing silicon such as silicon (Si) or silicon carbide (SiC). The base material 16 has a plurality of protrusions protruding on the side opposite to the base metal 13. The plurality of protrusions of the base material 16 are portions excluding the diamond film 17 among the plurality of protrusions 15 of the chip 14. The diamond film 17 is formed on the surface of the base material 16 opposite to the base metal 13. Therefore, the diamond film 17 is also formed on the plurality of protrusions of the base material 16. The diamond film 17 is formed on the base material 16 by a CVD method.

[0032] Here, with reference to FIG. 7, an example of a method for manufacturing the dresser body 11 will be described. FIGS. 7(a), 7(b), and 7(c) are cross-sectional views for explaining an example of a method for manufacturing the dresser body.

[0033] First, as shown in FIG. 7(a), a base material 16 having a plurality of protrusions is produced. The production of the base material 16 having a plurality of protrusions can be performed, for example, by the method described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2018-032745). In this method, first, a wafer such as Si is prepared, and an underlayer film is formed on the wafer by a CVD method. Next, a resist film is formed on the underlayer film, and the resist film is exposed through a mask. Next, the exposed resist film is developed, and the underlayer film and the wafer are etched. Thereby, a plurality of protrusions are formed on the wafer. Thereafter, the wafer is diced to obtain a base material 16 having a plurality of protrusions.

[0034] Next, as shown in FIG. 7(b), a diamond film 17 is formed on the base material 16 by a CVD method. Examples of the CVD method for forming the diamond film 17 include a thermal filament CVD method and the like. Thereby, a chip 14 having a plurality of protrusions 15 is obtained.

[0035] Next, as shown in FIG. 7(c), the chip 14 is attached to the base metal 13. The attachment of the chip 14 to the base metal 13 can be performed, for example, by adhering the surface of the base metal 13 opposite to the attachment surface 13a and the surface of the chip 14 opposite to the working surface 14a with an adhesive 18. Thus, the dresser body 11 is obtained.

[0036] In the dresser body 11 configured in this way, the tip of each of the plurality of protrusions 15 of the chip 14 is formed at an acute angle. Further, the tip of each of the plurality of protrusions 15 of the chip 14 is formed at a more acute angle than the tip of the diamond abrasive grains of the electrodeposited chip and the bonded chip.

[0037] Also, in the dresser body 11 configured in this way, the variation in the height of the plurality of protrusions 15 with respect to the base metal 13 is 0 mm or more and 0.2 mm or less, 0 mm or more and 0.15 mm or less, or 0 mm or more and 0.1 mm or less. This variation can be measured, for example, by a laser microscope.

[0038] The elastic member 12 is disposed on the side of the base metal 13 opposite to the chip 14. By the way, in the dresser 10 for a polishing pad, since the chip 14 has a plurality of protrusions 15 protruding to the side opposite to the base metal 13 and having a surface formed by the diamond film 17, when the resistance between the chip 14 and the polishing pad 3 becomes high during dressing of the polishing pad 3, chatter vibration is likely to occur. Therefore, the dresser 10 for a polishing pad is provided with an elastic member 12 disposed on the side of the base metal 13 opposite to the chip 14 in order to attenuate this chatter vibration and suppress the chatter vibration. That is, the elastic member 12 is a member for suppressing this chatter vibration.

[0039] From the viewpoint of suppressing chatter vibration, the Shore A hardness of the elastic member 12 is 45 or more and 95 or less, 45 or more and 90 or less, or 45 or more and 85 or less. This Shore A hardness can be measured, for example, by a Shore A hardness tester.

[0040] The material of the elastic member 12 is not particularly limited, and for example, it can be rubber such as nitrile rubber, fluororubber, silicone rubber, resin, or the like.

[0041] As shown in FIGS. 2, 4, and 6, the elastic member 12 is formed in an annular shape and is fitted into a groove 13b formed in the mounting surface 13a of the base metal 13. For this reason, the elastic member 12 extends in the circumferential direction D1 of the base metal 13 and is arranged so as to cover only a part of the mounting surface 13a.

[0042] The thickness a of the elastic member 12 is greater than the depth b of the groove 13b. The elastic member 12 is constituted by, for example, an O-ring having a wire diameter thicker than the depth b of the groove 13b. The protruding length c of the elastic member 12 with respect to the base metal 13 in the thickness direction D2 of the base metal 13 when the elastic member 12 is fitted into the groove 13b is, for example, 0.1 mm or more and 3 mm or less, 0.1 mm or more and 2 mm or less, or 0.1 mm or more and 1 mm or less. The protruding length c is also a value obtained by subtracting the depth b of the groove 13b from the thickness a of the elastic member 12.

[0043] Note that the elastic member 12 may be detachably attached to the base metal 13, may be non-detachably attached to the base metal 13, or may simply be arranged on the side opposite to the chip 14 of the base metal 13 without being attached to the base metal 13.

[0044] As shown in FIGS. 1 and 2, the dresser 10 for a polishing pad configured in this way is attached to the dressing head 7 such that the elastic member 12 is arranged between the dressing head 7 of the dressing device 6 and the base metal 13. At this time, since the thickness a of the elastic member 12 is greater than the depth b of the groove 13b, the dressing head 7 and the base metal 13 are in a separated state. Further, since the elastic member 12 is not arranged on the entire surface of the mounting surface 13a but is formed in an annular shape and arranged so as to cover only a part of the mounting surface 13a, a gap d is formed between the dressing head 7 and the base metal 13. The attachment of the dresser 10 for a polishing pad to the dressing head 7 can be performed, for example, by screwing, magnetic adsorption, or the like.

[0045] As described above, in the dresser 10 for a polishing pad according to the present embodiment, by attaching the base metal 13 to the dressing head 7 of the dressing device 6 and rotating the dressing head 7, the polishing pad 3 can be dressed. Here, since the dresser 10 for a polishing pad has a plurality of protrusions 15 in which the chips 14 protrude to the side opposite to the base metal 13 and the surface is formed by the diamond film 17, when the resistance between the chips 14 and the polishing pad 3 increases during dressing of the polishing pad 3, a structure is formed in which chattering vibration is likely to occur. However, since the elastic member 12 is disposed on the side of the base metal 13 opposite to the chips 14, the elastic member 12 is disposed between the dressing head 7 and the base metal 13, and the chattering vibration is attenuated by the elastic member 12. Thereby, the chattering vibration during dressing can be suppressed.

[0046] Further, in this dresser 10 for a polishing pad, since the Shore A hardness of the elastic member 12 is 45 or more and 95 or less, 45 or more and 90 or less, or 45 or more and 85 or less, the dresser 10 for a polishing pad can be stably attached to the dressing head 7, and chattering vibration can be suppressed.

[0047] Further, in this dresser 10 for a polishing pad, since the elastic member 12 is rubber, chattering vibration can be appropriately suppressed.

[0048] Further, in this dresser 10 for a polishing pad, since the base material 16 contains silicon, a plurality of protrusions 15 of the chips 14 can be easily formed.

[0049] Further, in this dresser 10 for a polishing pad, since the tip of each of the plurality of protrusions 15 is formed at an acute angle, when the resistance between the chips 14 and the polishing pad 3 increases during dressing of the polishing pad 3, a structure is formed in which chattering vibration is likely to occur. However, since the elastic member 12 is disposed on the side of the base metal 13 opposite to the chips 14, chattering vibration can be suppressed.

[0050] In addition, in this dresser 10 for a polishing pad, since the variation in the height of the plurality of protrusions 15 with respect to the base metal 13 is 0 mm or more and 0.3 mm or less, 0 mm or more and 0.2 mm or less, or 0 mm or more and 0.1 mm or less, when the resistance between the chip 14 and the polishing pad 3 increases during dressing of the polishing pad 3, a chattering vibration is likely to occur. However, since the elastic member 12 is disposed on the side of the base metal 13 opposite to the chip 14, the chattering vibration can be suppressed.

[0051] In addition, in this dresser 10 for a polishing pad, since the elastic member 12 extends in the circumferential direction D1 of the base metal 13, the dresser 10 for a polishing pad can be stably attached to the dressing head 7, and the chattering vibration can be effectively suppressed.

[0052] In addition, in this dresser 10 for a polishing pad, since the elastic member 12 is formed in an annular shape, the dresser 10 for a polishing pad can be stably attached to the dressing head 7, and the chattering vibration can be effectively suppressed.

[0053] In addition, in this dresser 10 for a polishing pad, since a groove 13b into which the elastic member 12 is fitted is formed in the mounting surface 13a on the side of the base metal 13 opposite to the chip 14, by fitting the elastic member 12 into the groove 13b, the positioning of the elastic member 12 with respect to the base metal 13 can be easily performed, and the elastic member 12 can be easily attached to the base metal 13.

[0054] In addition, in this dresser 10 for a polishing pad, since the thickness a of the elastic member 12 is greater than the depth b of the groove 13b, even when the elastic member 12 is fitted to the bottom of the groove 13b, the chattering vibration can be suppressed by the elastic member 12.

[0055] In addition, in this dresser 10 for a polishing pad, when the elastic member 12 is fitted into the groove 13b, the protruding length c of the elastic member 12 with respect to the base metal 13 in the thickness direction D2 of the base metal 13 is 0.1 mm or more and 3 mm or less, 0.1 mm or more and 2 mm or less, or 0.1 mm or more and 1 mm or less. Therefore, the dresser 10 for a polishing pad can be stably attached to the dressing head 7, and chattering vibration can be effectively suppressed.

[0056] In addition, in this dresser 10 for a polishing pad, since the groove 13b is formed at the peripheral edge of the mounting surface 13a, the elastic member 12 can be easily fitted into the groove 13b. Further, by fitting the elastic member 12 into the groove 13b, the elastic member 12 can be arranged in a wider range, the dresser 10 for a polishing pad can be stably attached to the dressing head 7, and chattering vibration can be effectively suppressed.

[0057] In addition, in this dresser 10 for a polishing pad, since the elastic member 12 is arranged so as to cover only a part of the mounting surface 13a on the side opposite to the tip 14 of the base metal 13, a gap is formed between the dressing head 7 and the base metal 13. Therefore, since the elastic member 12 is easily elastically expanded and contracted, chattering vibration can be effectively suppressed.

[0058] In the dressing device 6 according to the present embodiment, since the above-described dresser 10 for a polishing pad is provided, chattering vibration during dressing can be suppressed.

[0059] In addition, in this dressing device 6, a gap is formed between the dressing head 7 and the base metal 13. Therefore, since the elastic member 12 is easily elastically expanded and contracted, chattering vibration can be effectively suppressed.

[0060] The present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the gist of the present invention.

[0061] For example, in the above-described embodiment, the groove 13b into which the elastic member 12 is fitted is described as being formed at the peripheral edge of the mounting surface 13a. However, the position, shape, etc. of the groove 13b into which the elastic member 12 is fitted are not particularly limited. Further, in the above-described embodiment, the elastic member 12 is described as being formed in an annular shape. However, the shape, etc. of the elastic member are not particularly limited.

[0062] FIG. 8 is a schematic plan view showing a dresser for a polishing pad according to a modified example. In the dresser 10A for a polishing pad shown in FIG. 8, the groove 13Ab is formed concentrically with the mounting surface 13Aa at a position spaced apart from the peripheral edge of the mounting surface 13Aa of the base metal 13A. And an annular elastic member 12A is fitted into this groove 13Ab.

[0063] FIG. 9 is a schematic plan view showing a dresser for a polishing pad according to a modified example. In the dresser 10B for a polishing pad shown in FIG. 9, the groove 13Bb is formed concentrically with the mounting surface 13Ba at a position spaced apart from the peripheral edge of the mounting surface 13Ba of the base metal 13B. And a C-shaped or linear elastic member 12B is fitted into this groove 13Bb.

[0064] Thus, in the dressers 10A and 10B for a polishing pad, since the grooves 13Ab and 13Bb are formed concentrically with the mounting surfaces 13Aa and 13Ba at positions spaced apart from the peripheral edges of the mounting surfaces 13Aa and 13Ba, it is possible to suppress the elastic members 12A and 12B fitted in the grooves 13Ab and 13Bb from falling off the grooves 13Ab and 13Bb. Further, by fitting the elastic members 12A and 12B into the grooves 13Ab and 13Bb, the dressers 10A and 10B for a polishing pad can be stably attached to the dressing head 7, and chattering vibration can be effectively suppressed.

[0065] Further, in the above-described embodiment, it is described that the groove 13b is formed in the mounting surface 13a and the elastic member 12 is fitted into the groove 13b. However, if the elastic member can be attached to the mounting surface, the groove does not have to be formed in the mounting surface.

[0066] FIG. 10 is a schematic plan view showing a dresser for a polishing pad according to a modified example. In the dresser 10C for a polishing pad shown in FIG. 10, no groove is formed in the mounting surface 13Ca of the base metal 13C, and a plurality of rectangular elastic members 12C are adhered to the mounting surface 13Ca.

[0067] Thus, by adhering the elastic member to the mounting surface, the elastic member can be attached to the mounting surface without forming a groove in the mounting surface.

[0068] Further, the elastic member may be formed in a solid shape having no cavity inside, or may be formed in a hollow shape such as a tube having a cavity inside. For example, the elastic member 12 in the above embodiment, the elastic member 12A shown in FIG. 8, and the elastic member 12B shown in FIG. 9 may be solid members or may be hollow (tubular) members.

Example

[0069] Next, examples and comparative examples of the present invention will be described. Note that the present invention is not limited to the following examples.

[0070] (Example 1) An underlying film was formed on a Si wafer by CVD method, a resist film was formed on the underlying film, and the resist film was exposed through a mask. Next, the exposed resist film was developed, and the underlying film and the Si wafer were etched to form a plurality of protrusions on the Si wafer. Next, the Si wafer was diced to produce a plurality of substrates having a plurality of protrusions. Next, a diamond film was formed on the substrate by CVD method to produce chips having a plurality of protrusions whose surfaces were formed by the diamond film. The size of the chips was 6 mm × 10 mm. SEM photographs of the produced chips are shown in FIGS. 11 and 12. The SEM photographs shown in FIGS. 11 and 12 are images of the working surfaces of the chips on which a plurality of protrusions are formed. As shown in FIGS. 11 and 12, each of the plurality of protrusions was formed in a hexagonal pyramid shape with a sharp tip. Further, the plurality of protrusions had substantially the same height.

[0071] Next, the dresser body was fabricated by bonding five chips to the base metal. Further, a groove was formed in the peripheral portion of the mounting surface on the side opposite to the chips of the base metal, and an O-ring, which is an elastic member, was fitted into the groove to dispose the O-ring on the side opposite to the chips of the base metal. Thereby, the dresser for the polishing pad of Example 1 was fabricated. The outer diameter of the base metal was 101.6 mm, the thickness of the base metal was 4.3 mm, the depth of the groove was 1.5 mm, and the thickness of the O-ring was 2.0 mm.

[0072] Using the fabricated dresser for the polishing pad of Example 1, a chatter vibration evaluation was performed. In the chatter vibration evaluation, the base metal was attached to the dress head such that an O-ring was disposed between the dress head of the polishing apparatus and the base metal. While rotating the rotary table and the polishing pad and rotating the dress head, slurry was supplied onto the polishing pad from the nozzle, and the chips were pressed against the polishing pad by the dress head with a predetermined pressure to dress the polishing pad. Further, the degree of chatter vibration during dressing was evaluated. In the evaluation, as a chatter value indicating the degree of chatter vibration, a value obtained by integrating the vibration acceleration obtained from the acceleration sensor attached to the dress head from 0 kHz to 1 kHz was measured. The results are shown in FIG. 13.

[0073] (Example 2) A dresser for the polishing pad of Example 2 was fabricated under the same conditions as in Example 1 except that seven chips were bonded to the base metal. Using the fabricated dresser for the polishing pad of Example 2, the same chatter vibration evaluation as in Example 1 was performed. The results are shown in FIG. 13.

[0074] (Example 3) A dresser for the polishing pad of Example 2 was fabricated under the same conditions as in Example 1 except that nine chips were bonded to the base metal. Using the fabricated dresser for the polishing pad of Example 2, the same chatter vibration evaluation as in Example 1 was performed. The results are shown in FIG. 13.

[0075] (Comparative Example 1) A dresser for a polishing pad of Comparative Example 1 was fabricated under the same conditions as in Example 1, except that no groove was formed on the mounting surface of the base metal and no O-ring was used. Using the fabricated dresser for a polishing pad of Comparative Example 1, the same chatter vibration evaluation as in Example 1 was performed. Since the dresser for a polishing pad of Comparative Example 1 did not use an O-ring, the base metal was directly attached to the dressing head. The results are shown in Fig. 13.

[0076] (Comparative Example 2) A dresser for a polishing pad of Comparative Example 2 was fabricated under the same conditions as in Example 2, except that no groove was formed on the mounting surface of the base metal and no O-ring was used. Using the fabricated dresser for a polishing pad of Comparative Example 2, the same chatter vibration evaluation as in Example 1 was performed. Since the dresser for a polishing pad of Comparative Example 2 did not use an O-ring, the base metal was directly attached to the dressing head. The results are shown in Fig. 13.

[0077] (Comparative Example 3) A dresser for a polishing pad of Comparative Example 3 was fabricated under the same conditions as in Example 3, except that no groove was formed on the mounting surface of the base metal and no O-ring was used. Using the fabricated dresser for a polishing pad of Comparative Example 3, the same chatter vibration evaluation as in Example 1 was performed. Since the dresser for a polishing pad of Comparative Example 3 did not use an O-ring, the base metal was directly attached to the dressing head. The results are shown in Fig. 13.

[0078] (Evaluation Results) Fig. 13 is a graph showing the results of Examples 1 to 3 and Comparative Examples 1 to 3. As shown in Fig. 13, in Examples 1 to 3 where the O-ring was disposed on the side opposite to the tip of the base metal, the chatter values were significantly smaller than those in Comparative Examples 1 to 3 where no O-ring was used. Also, almost no chatter vibration occurred in Examples 1 to 3. From this result, it was found that chatter vibration can be suppressed by disposing the O-ring on the side opposite to the tip of the base metal.

Description of Reference Numerals

[0079] 1…Grinding device, 2…Rotary table, 3…Grinding pad, 4…Grinding head, 5…Nozzle, 6…Dressing device, 7…Dress head, 10, 10A, 10B, 10C…Dresser for grinding pad, 11…Dresser body, 12, 12A, 12B, 12C…Elastic member, 13, 13A, 13B, 13C…Base metal, 13a, 13Aa, 13Ba, 13Ca…Mounting surface, 13b, 13Ab, 13Bb…Groove, 14…Chip, 14a…Working surface, 15…Projection, 16…Substrate, 17…Diamond film, 18…Adhesive, a…Thickness, b…Depth, c…Projection length, D1…Circumferential direction, D2…Thickness direction.

Claims

1. a dresser body having an annular base metal and a tip disposed on the base metal; an elastic member disposed on the opposite side of the base metal from the tip, The tip has a plurality of protrusions that protrude from the opposite side of the base metal and have a surface formed with a diamond film. Dresser for polishing pads.

2. The Shore A hardness of the elastic member is 45 or more and 95 or less.

2. The polishing pad dresser according to claim 1.

3. The elastic member is rubber.

2. The polishing pad dresser according to claim 1.

4. The tip has a substrate and the diamond film formed on the substrate, The substrate contains silicon.

2. The polishing pad dresser according to claim 1.

5. The tip of each of the plurality of protrusions is formed at an acute angle.

2. The polishing pad dresser according to claim 1.

6. Each of the plurality of protrusions has a side surface that extends in an arch shape toward a tip.

6. The polishing pad dresser according to claim 5.

7. The variation in height of the plurality of protrusions relative to the base metal is 0 mm or more and 0.3 mm or less.

2. The polishing pad dresser according to claim 1.

8. The elastic member extends in the circumferential direction of the base metal.

2. The polishing pad dresser according to claim 1.

9. The elastic member is formed in an annular shape.

2. The polishing pad dresser according to claim 1.

10. a groove into which the elastic member is fitted is formed on a mounting surface of the base metal opposite to the tip; 2. The polishing pad dresser according to claim 1.

11. The thickness of the elastic member is greater than the depth of the groove.

11. The polishing pad dresser according to claim 10.

12. When the elastic member is fitted into the groove, the protruding length of the elastic member relative to the base metal in the thickness direction of the base metal is 0.1 mm or more and 3 mm or less.

11. The polishing pad dresser according to claim 10.

13. The groove is formed on the peripheral edge of the mounting surface.

11. The polishing pad dresser according to claim 10.

14. The groove is formed concentrically with the mounting surface at a position spaced from the peripheral edge of the mounting surface.

11. The polishing pad dresser according to claim 10.

15. the elastic member is disposed so as to cover only a portion of the mounting surface of the base metal on the side opposite to the chip; 2. The polishing pad dresser according to claim 1.

16. Each of the plurality of protrusions has a ridge extending in an arcuate shape from a tip.

2. The polishing pad dresser according to claim 1.

17. Each of the plurality of protrusions has six ridges extending from the tip.

17. The polishing pad dresser according to claim 16.

18. Adjacent protrusions among the plurality of protrusions are connected by ridges extending in an arch shape from the tips of the respective plurality of protrusions.

2. The polishing pad dresser according to claim 1.

19. At least one of the plurality of protrusions has six ridges extending from the tip.

19. The polishing pad dresser according to claim 18.

20. a polishing pad dresser according to any one of claims 1 to 19, which is disposed above a polishing pad; a rotatable dressing head to which the polishing pad dresser is attached; the polishing pad dresser is attached to the dressing head such that the elastic member is disposed between the dressing head and the base metal; Dressing device.

21. A gap is formed between the dress head and the base metal.

21. The dressing device according to claim 20.

Images