Information processing apparatus, method for controlling information processing apparatus, imprint apparatus, and article manufacturing method

Abstract

To efficiently estimate a mechanism of occurrence of pattern formation failure.SOLUTION: An information processing apparatus estimates a mechanism of occurrence of a failure of formation on a substrate performed by an imprint device that performs, by using a mold having a pattern, imprint processing of sequentially forming patterns of an imprint material in a plurality of shot areas on the substrate. The information processing apparatus has: first acquisition means that acquires inspection information of the substrate on which the pattern of the imprint material is formed; second acquisition means that acquires shot area information in forming the pattern of the mold in the shot area on the substrate, and imprint information including order information of the imprint processing; division means that, according to the imprint information, divides the inspection information of the plurality of substrates into a plurality of inspection information for respective areas, on the basis of an area division rule for dividing an area of the substrate into a plurality of areas; and estimation means that specifies characteristics of an area where formation failure occurs and a change over time, from the plurality of pieces of inspection information for respective areas, and estimates one or more mechanisms of occurrence from the specified characteristics of the change over time.SELECTED DRAWING: Figure 16

Description

Technical Field

[0001] The present invention relates to an information processing apparatus, a control method for an information processing apparatus, an imprint apparatus, and a method for manufacturing an article.

Background Art

[0002] As one of the techniques for forming a fine pattern on a substrate (wafer), a method of transferring a pattern of a mold (mask) to the substrate through a projection optical system using an exposure apparatus is used. On the other hand, as another technique for forming a fine pattern on a substrate, there is a pattern forming apparatus (imprint apparatus). The imprint apparatus can transfer a pattern to the imprint material on the substrate by bringing a mold having a pattern formed thereon into contact with the imprint material supplied onto the substrate, irradiating light to cure the imprint material, and then separating the mold from the imprint material. The imprint material is, for example, a photocurable resin.

[0003] Conventionally, as a method for estimating the cause of a defective pattern transferred by an imprint apparatus, there is a method disclosed in Patent Document 1. In Patent Document 1, a pattern formed on an imprint material is imaged a plurality of times, and based on the temporal change of the obtained plurality of images, it is determined whether the cause of the defective pattern is due to damage to the mold or due to foreign matter attached to the mold.

[0004] Further, in Patent Document 2, attention is paid to the periodicity of the occurrence of a defective formation of an inspection target, and the presence or absence of an abnormality in the manufacturing process is determined according to the presence or absence of periodicity. In Patent Document 3, defective formations are analyzed and classified based on various rules such as known defective formation determination rules for estimating the cause of defective formations and statistical rules based on characteristics of defective formations such as color, size, and edge sharpness.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

[0006] However, when estimating the factors causing pattern formation defects in an imprint apparatus, unlike a general exposure apparatus that transfers a pattern onto a substrate through a projection optical system, pattern generation by an imprint apparatus involves physical contact between an imprint material and a mold. Therefore, it is necessary to pay attention to the temporal characteristics such as the continuity of occurrence and the interval between occurrences of formation defects for each specific region of the substrate onto which the pattern has been transferred. At that time, in order to capture the temporal characteristics, it is necessary to use imprint information such as the order in which the imprints were made.

[0007] Conventionally, the determination of specific regions and the extraction of temporal characteristics for estimating and classifying the factors causing formation defects have been manually combined based on experience by engineers with advanced analysis techniques using formation defect information and imprint information such as the imprint order. Therefore, it has been necessary to spend a great deal of time on the analysis of formation defects and the identification of factors.

[0008] Therefore, an object of the present invention is to provide an information processing apparatus capable of efficiently estimating the mechanism of pattern formation defects. [Means for Solving the Problems]

[0009] To achieve the above object, an information processing apparatus according to an aspect of the present invention is an information processing apparatus for estimating the generation mechanism in a formation defect on a substrate by an imprint apparatus that performs an imprint process of sequentially forming a pattern of an imprint material on a plurality of shot regions on the substrate using a mold having a pattern. The information processing apparatus includes: a first acquisition unit that acquires inspection information of a substrate on which a pattern of the imprint material is formed; a second acquisition unit that acquires imprint information including shot region information and order information of the imprint process when forming the pattern of the mold on the shot regions on the substrate; a division unit that divides inspection information of a plurality of substrates into region-by-region inspection information based on a region division rule for dividing regions of the substrate into a plurality of regions according to the imprint information; and an estimation unit that identifies a generation region of a formation defect and characteristics of change over time from the plurality of region-by-region inspection information, and estimates one or more generation mechanisms from the identified characteristics of change over time.

Effect of the Invention

[0010] According to the present invention, it is possible to provide an information processing apparatus capable of efficiently estimating the generation mechanism of pattern formation defects.

Brief Description of the Drawings

[0011]

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Embodiments for Carrying Out the Invention

[0012] Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described using examples and figures. In each figure, the same members or elements are given the same reference numerals, and overlapping explanations are omitted or simplified.

[0013] <Embodiment 1> Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a configuration diagram of an imprint apparatus IMP in this embodiment. FIG. 2 is an enlarged view showing the state near the mold M of the imprint apparatus IMP in this embodiment.

[0014] The imprint apparatus IMP is an apparatus that performs an imprint process of sequentially forming a pattern of an imprint material IM on a plurality of shot regions on a substrate using a mold having a pattern. The imprint process is a process of bringing the imprint material IM on the substrate S into contact with the pattern region MP of the mold M to cure the imprint material IM and separating the cured product of the imprint material IM from the mold M. By this imprint process, a pattern of the imprint material IM is formed on the substrate S.

[0015] As the imprint material, a curable composition (sometimes also referred to as an uncured resin) that cures when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat, etc. can be used. The electromagnetic waves can be, for example, light selected from the range of its wavelength being 10 nm or more and 1 mm or less, for example, infrared rays, visible light, ultraviolet rays, etc. The curable composition can be a composition that cures by irradiation with light or by heating. Among these, the photocurable composition that cures by irradiation with light contains at least a polymerizable compound and a photoinitiator, and may further contain a non-polymerizable compound or a solvent as necessary.

[0016] The non-coincident compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component, and the like. The imprint material can be arranged on the substrate in a droplet shape, or in an island shape or a film shape formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25 °C) can be, for example, 1 mPa·s or more and 100 mPa·s or less. As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin, etc. can be used. If necessary, a member made of a material different from the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or a quartz glass.

[0017] In the present embodiment, the direction is indicated in the XYZ coordinate system with the direction parallel to the surface of the substrate S as the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are defined as the X-direction, Y-direction, and Z-direction, respectively, and the rotations around the X-axis, Y-axis, and Z-axis are defined as θX, θY, and θZ, respectively. The control or drive regarding the X-axis, Y-axis, and Z-axis means the control or drive regarding the directions parallel to the X-axis, Y-axis, and Z-axis, respectively. Also, the control or drive regarding the θX-axis, θY-axis, and θZ-axis means the control or drive regarding the rotations around the axes parallel to the X-axis, Y-axis, and Z-axis, respectively. Also, the position is information that can be specified based on the coordinates of the X-axis, Y-axis, and Z-axis, and the orientation is information that can be specified by the values of the θX-axis, θY-axis, and θZ-axis. Positioning means controlling the position and / or orientation. Alignment may include controlling the position and / or orientation of at least one of the substrate and the mold.

[0018] The imprint apparatus IMP includes a substrate holding unit 102 that holds the substrate S, a substrate driving mechanism 105 that drives the substrate S by driving the substrate holding unit 102, a base 104 that supports the substrate holding unit 102, and a position measuring unit 103 that measures the position of the substrate holding unit 102. The substrate driving mechanism 105 can include a motor such as a linear motor, for example.

[0019] The imprint apparatus IMP includes a mold holding unit 121 that holds a mold (mold) M, a mold driving mechanism 122 that drives the mold M by driving the mold holding unit 121, and a support structure 130 that supports the mold driving mechanism 122. The mold driving mechanism 122 may include a motor such as a voice coil motor, for example.

[0020] The substrate driving mechanism 105 and the mold driving mechanism 122 constitute a driving mechanism that adjusts the relative position and relative orientation between the substrate S and the mold M. The adjustment of the relative position between the substrate S and the mold M by the driving mechanism includes driving for the contact of the mold with the imprint material on the substrate S and the separation of the mold from the cured imprint material (pattern of the cured product). The substrate driving mechanism 105 may be configured to drive the substrate S in a plurality of axes (for example, three axes of the X-axis, Y-axis, and θZ-axis, preferably six axes of the X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis). The mold driving mechanism 122 may be configured to drive the mold M in a plurality of axes (for example, three axes of the Z-axis, θX-axis, and θY-axis, preferably six axes of the X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis).

[0021] The imprint apparatus IMP includes a mold transfer mechanism 140 that transfers the mold M and a mold cleaner 150. The mold transfer mechanism 140 may be configured to transfer the mold M to the mold holding unit 121, or transfer the mold M from the mold holding unit 121 to a mold stocker (not shown) or the mold cleaner 150, for example. The mold cleaner 150 cleans the mold M with ultraviolet rays, chemical solutions, or the like.

[0022] The mold holding unit 121 may include a window member 125 that forms a pressure control space CS on the side of the back surface of the mold M (the surface opposite to the pattern region MP on which the pattern to be transferred to the substrate S is formed). The imprint apparatus IMP includes a deformation mechanism 123 that deforms the pattern region (pattern portion) MP of the mold M into a convex shape toward the substrate S by controlling the pressure in the pressure control space CS (hereinafter referred to as the cavity pressure), as schematically shown in FIG. 2.

[0023] In addition, the imprint apparatus IMP includes an alignment measuring instrument 106, a wide-angle alignment measuring instrument 151, a curing unit 107, an imaging unit 112, and an optical member 111. The alignment measuring instrument 106 measures the relative position between the marks by illuminating the alignment marks on the substrate S and the mold M and imaging their images. The alignment measuring instrument 106 can be positioned by a drive mechanism (not shown) according to the position of the alignment marks to be observed. The wide-angle alignment measuring instrument 151 is a measuring instrument having a wider field of view than the alignment measuring instrument 106, and measures the position of the substrate S by illuminating the alignment marks on the substrate S and imaging their images. By measuring the position of the substrate S with the wide-angle alignment measuring instrument, the alignment marks on the substrate S can be moved into the field of view of the alignment measuring instrument 106. The curing unit 107 irradiates the imprint material IM with energy (e.g., light such as ultraviolet light) for curing the imprint material IM through the optical member 111, thereby curing the imprint material IM. The imaging unit 112 images the substrate S, the mold M, and the imprint material IM through the optical member 111 and the window member 125.

[0024] The imprint apparatus IMP may include a dispenser 108 for disposing the imprint material IM on the substrate S. The dispenser 108 discharges the imprint material IM so that the imprint material IM is disposed on the substrate S according to, for example, a drop recipe indicating the disposition of the imprint material IM. The imprint apparatus IMP may include a control unit 110 that controls the substrate drive mechanism 105, the mold drive mechanism 122, the deformation mechanism 123, the mold transfer mechanism 140, the mold cleaner 150, the alignment measuring instrument 106, the curing unit 107, the imaging unit 112, the dispenser 108, etc.

[0025] The control unit 110 includes a CPU, a memory (storage unit), etc., is composed of at least one computer, and is connected to each component of the imprint device IMP via a line. Further, the control unit comprehensively controls the operations and adjustments of each component of the entire imprint device IMP according to the program stored in the memory. Also, the control unit may be configured integrally (within a common housing) with other parts of the imprint device IMP, or may be configured separately (within a separate housing) from other parts of the imprint device IMP, or may be installed at a location separate from the imprint device IMP and controlled remotely.

[0026] In this embodiment, the control unit 110 includes a computer mechanism 113 that is an information processing device. For example, it can be configured by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), or an ASIC (abbreviation for Application Specific Integrated Circuit), or a general-purpose computer in which a program is incorporated, or a combination of all or part of these.

[0027] FIG. 3 is a flowchart showing the processing flow of the imprint device IMP in this embodiment. The operations shown in FIG. 2 can be controlled by the control unit 110. That is, each operation (processing) shown in the flowchart of FIG. 2 is controlled by the control unit 110 of the imprint device IMP executing the program stored in the memory. Also, for each step, by prefixing an S to denote it, the notation of the step is omitted.

[0028] First, in S101, the substrate S is transported by a substrate transport mechanism (not shown) from the transport source (for example, the relay part with the preprocessing device) onto the substrate holding part 102. The position of the transported substrate S on the substrate holding part 102 is measured by observing the marks on the substrate S with the wide-angle alignment measuring instrument 151. Based on the position measured here, the substrate S is positioned.

[0029] In S102 to S106 described below, imprinting processing (pattern formation) is performed on the shot area to be imprinted (imprint area, pattern formation area) among the plurality of shot areas of the substrate S.

[0030] Next, in S102, the imprint material IM is disposed by the dispenser 108 on the shot area to be imprinted among the plurality of shot areas of the substrate S. This process is performed by discharging the imprint material IM from the dispenser 108 while driving the substrate S by the substrate driving mechanism 105.

[0031] Next, in S103, the substrate S and the mold M are relatively driven by at least one of the mold driving mechanism 122 and the substrate driving mechanism 105 so that the pattern area MP of the mold M contacts the imprint material IM on the shot area to be imprinted. In one example, the mold M is driven by the mold driving mechanism 122 so that the pattern area MP of the mold M contacts the imprint material IM on the shot area to be imprinted. In the process of bringing the pattern area MP of the mold M into contact with the imprint material IM, the pattern area MP of the mold M is deformed into a convex shape toward the substrate S by the deformation mechanism 123.

[0032] Next, in S104, alignment is performed between the shot area to be imprinted on the substrate S and the pattern area MP of the mold M. The alignment is performed while measuring the relative position between the alignment mark of the shot area to be imprinted and the alignment mark of the mold M by the alignment measuring instrument 106 so that the relative position falls within the allowable range of the target relative position. In the alignment, the substrate S and the mold M are relatively driven by at least one of the mold driving mechanism 122 and the substrate driving mechanism 105. The target relative position between the alignment mark of the shot area to be imprinted and the alignment mark of the mold M is determined by a correction value determined from the results of a past overlay inspection device or the like.

[0033] Next, in S105, energy for curing the imprint material IM is irradiated onto the imprint material IM between the substrate S and the pattern region MP of the mold M by the cured portion 107, whereby the imprint material IM is cured and a cured product of the imprint material IM is formed.

[0034] Next, in S106, the substrate S and the mold M are relatively driven by at least one of the mold driving mechanism 122 and the substrate driving mechanism 105 so that the cured product of the imprint material IM and the pattern region MP of the mold M are separated. In one example, the mold M is driven by the mold driving mechanism 122 so that the cured product of the imprint material IM and the pattern region MP of the mold M are separated. Even when the cured product of the imprint material IM and the pattern region MP of the mold M are separated, the pattern region MP of the mold M can be deformed into a convex shape toward the substrate S. Further, imaging by the imaging unit 112 is executed, and the separation state between the imprint material IM and the mold M is observed based on the captured image.

[0035] Next, in S107, the control unit 110 determines whether the imprint process including the processes of S102 to S106 has been executed for all the shot regions of the substrate S. As a result of the determination, if the processes of S102 to S106 have been executed for all the shot regions of the substrate S, the process proceeds to S108. On the other hand, if the processes of S102 to S106 have not been executed for all the shot regions of the substrate S, that is, if there are unprocessed shot regions, the process returns to S102 and the same process is repeated. In this case, the imprint process of S102 to S106 is executed for the selected shot region among the unprocessed shot regions in the same manner as above.

[0036] Next, in S108, in order to detect a formation defect, an image of the pattern after imprinting is captured. For example, an image around the shot area is captured using the wide-angle alignment measuring instrument 151. When the field of view of the wide-angle alignment measuring instrument 151 is narrow with respect to the shot area, a plurality of images are captured while changing the position of the substrate S by driving the substrate driving mechanism 105 to capture a desired area. The image captured in S108 may be used as a learning image described later or as a detection image. Here, an example of capturing an image with the wide-angle alignment measuring instrument 151 is described, but it is not limited thereto.

[0037] For example, similar images may be captured using the alignment measuring instrument 106, the imaging unit 112, etc. This process has been described as an example when an imprint apparatus is used as a formation defect inspection means or as a part thereof. When a formation defect inspection apparatus is used as the formation defect inspection means, this process is not performed in the imprint apparatus, and a process similar to this process is performed in the formation defect inspection apparatus.

[0038] Also, in this embodiment, an example in which S108 is performed after performing the imprint process on all the shot areas has been described, but it is not limited thereto. After forming a pattern in each shot area (after S106), an image of the pattern after imprinting may be captured for each shot area. Also, as will be described later, an image of the pattern may be captured in the same manner as S108 for a substrate carried out from the imprint apparatus by a device other than the imprint apparatus.

[0039] Next, in S109, the substrate S is transported from the substrate holding unit 102 to a transport destination (for example, a relay unit with a post-processing device) by a substrate transport mechanism (not shown). The operation shown in FIG. 2 is executed for each of the plurality of substrates when a lot composed of a plurality of substrates is processed.

[0040] FIG. 4 is a diagram illustrating the configuration of an article manufacturing system 401 for manufacturing articles such as semiconductor devices. The article manufacturing system 401 may include, for example, one or more lithography apparatuses 404, one or more inspection apparatuses 405, one or more processing apparatuses 406, and a control apparatus 403. Further, it may also include a formation defect classification apparatus 407 having an information processing apparatus or an information handling apparatus configured therein. That is, the information processing apparatus (control unit) provided in the imprint apparatus IMP or the information processing apparatus outside the imprint apparatus IMP (for example, a PC) may be the formation defect classification apparatus 407. In other words, the information processing apparatus (control unit) provided in the imprint apparatus IMP or the information processing apparatus outside the imprint apparatus IMP (for example, a PC) may also function as the formation defect classification apparatus 407. Note that the information processing apparatus (control unit) provided in the inspection apparatus 405 may be the formation defect classification apparatus 407, and the information processing apparatuses provided in the imprint apparatus IMP and the inspection apparatus 405 respectively may be the formation defect classification apparatus 407.

[0041] Examples of the lithography apparatus 404 include apparatuses such as an imprint apparatus IMP and an exposure apparatus. Examples of the inspection apparatus 405 include apparatuses such as an overlay inspection apparatus, a CD inspection apparatus, a formation defect inspection apparatus, and an electrical characteristic inspection apparatus. Further, examples of the processing apparatus 406 include apparatuses such as an etching apparatus and a film forming apparatus.

[0042] These lithography apparatuses 404, inspection apparatuses 405, and processing apparatuses 406 are communicably connected to a control apparatus 403, which is an external apparatus different from the imprint apparatus IMP, via a network 402. Then, these lithography apparatuses 404, inspection apparatuses 405, and processing apparatuses 406 can be controlled by the control apparatus 403. Note that the lithography apparatuses 404, inspection apparatuses 405, and processing apparatuses 406 may be independently controlled by control units in their respective apparatuses.

[0043] Here, the information processing apparatus can be configured by, for example, a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), or an ASIC (abbreviation for Application Specific Integrated Circuit), or a general-purpose computer in which a program is incorporated, or a combination of all or part of these, similar to the control units of the imprint apparatus IMP and the exposure apparatus.

[0044] The imprint apparatus IMP, or the formation defect classification apparatus 407, or a combination thereof also functions as formation defect classification means. Here, the imprint apparatus IMP, or the formation defect classification apparatus 407, or a combination thereof that also functions as formation defect classification means also functions as acquisition means for acquiring inspection information on formation defects from an inspection apparatus (for example, a formation defect inspection apparatus) or a storage medium. An information processing apparatus (including, for example, the formation defect classification apparatus 407) and a wide-angle alignment measuring instrument 151, which is an example of an image capturing means for the substrate, may function as formation defect inspection means. Also, a combination of the wide-angle alignment measuring instrument 151 of the imprint apparatus and an information processing apparatus connected to the network 402 may be used as formation defect classification means.

[0045] The substrate S is divided into a plurality of shot regions. FIG. 5 is a diagram showing an example of the shot regions on the substrate S. In the imprint apparatus IMP, a pattern is formed for each shot region in one imprint operation (S102 to S106). Also, by repeating the same process for each shot region, a pattern is formed over the entire substrate S. The shot regions include a shot region (hereinafter referred to as the FF shot region 501) having substantially the same shape and size as the pattern region MP of the mold M, and a shot region that is partially missing because it is in the peripheral portion of the substrate (hereinafter referred to as the PF shot region 502). That is, the FF shot region 501 is a shot region that does not include the outer periphery of the substrate S, and the PF shot region 502 is a shot region that includes the outer periphery of the substrate S.

[0046] In the imprinting process where the mold type M contacts the substrate, the suitable imprinting processes in the FF shot area 501 and the PF shot area 502 are different. Note that FF is an abbreviation for Full Field, and PF is an abbreviation for Partial Field. Also, the suitable imprinting processes are different even between the PF shot areas 502 with different shapes. These imprinting processes read the pre-set imprinting process conditions (sometimes called recipes) from a file or the like according to the position on the substrate S of the shot area, and proceed according to the read imprinting process conditions.

[0047] FIG. 6 is a diagram illustrating a system configuration related to the classification of formation defects in the present embodiment. The formation defect classification device 407 includes an information collection unit 605, a formation defect cause estimation unit 606, an imprint setting update unit 607, a solution display unit 608, an estimation rule update unit 609, and an estimation rule 610 inside.

[0048] The formation defect classification device 407 is connected to the imprint device IMP and the inspection device 405 via the network 402. As described above, a system in which the formation defect classification device 407 and the imprint device IMP are communicably connected is called an imprint system. Also, a system in which the formation defect classification device 407, the imprint device IMP, and the inspection device 405 are communicably connected as shown in FIG. 6 may be called a formation processing system.

[0049] The information collection unit 605 collects the data necessary for the formation defect classification device 407 from each device such as the imprint device IMP and the inspection device 405.

[0050] The formation defect cause estimation unit 606 estimates the cause of the formation defect using the data (inspection information, imprint information, etc.) collected by the information collection unit 605 and the estimation rule 610. The formation defect cause estimation unit 606 outputs the estimated estimation result and its solution (solution based on the cause of the formation defect). Specifically, the solution is output to the solution display unit 608, the imprint setting update unit 507, etc.

[0051] The defect cause display unit 608 displays the cause of the forming defect and its solution based on the estimation result transmitted from the forming defect cause estimation unit 606 on a display device (display unit).

[0052] In addition, using the estimation result estimated by the forming defect cause estimation unit 606, it is also possible to adjust the imprint processing conditions such as the arrangement pattern of the imprint material IM, the method and conditions for pressing the mold M against the imprint material IM, etc. by the imprint setting update unit 607. Further, in order to improve the forming defect classification accuracy, it is also possible to add and update the estimation rule 610 via the estimation rule update unit 609.

[0053] FIG. 7 is a diagram illustrating the hardware configuration of the forming defect classification device 407. Each component of the forming defect classification device 407 functions according to a program. In the example of FIG. 7, the CPU 702 is a processing device (arithmetic device) that performs calculations for control according to a program and controls each component connected to the system bus 701.

[0054] The ROM 703 is a read-only memory for data, and stores programs and data. The RAM 704 is a memory for reading and writing data, and is used for storing programs and data. Also, the RAM 704 is used for temporarily storing data such as the results of calculations by the CPU 702. The HDD 705 is also used as a program for the operating system (OS) of the information processing device, and as a temporary storage area for programs and data.

[0055] The HDD 705 is slower in data input / output compared to the RAM 704, but it can store a large amount of data. The HDD 705 is preferably a non-volatile memory device that can store data as persistent data so that the stored data can be referenced over a long period. In FIG. 7, a magnetic storage device (HDD) is configured as the storage device, but it may also be a device that loads an external medium such as a CD, DVD, or memory card to read and write data. The communication unit (communication device) 707 is connected to the network 402 to perform data communication using a communication protocol such as TCP / IP and is used when communicating with other information processing devices.

[0056] The input unit (input device) 708 is a device for inputting characters and data into the information processing device, and various keyboards, mice, etc. are applicable. The display unit (display device) 709 is a device for displaying information necessary for the operation of the information processing device, processing results, etc., and a CRT or a liquid crystal monitor, etc. are applicable.

[0057] FIG. 8 is a flowchart showing an example of the flow of a conventional process for estimating the cause of a formation defect. Also, by attaching an S at the beginning to denote each process (step), the notation of the process (step) is omitted. It should be noted that it is assumed that the imprint device IMP is performing an imprint process on the target substrate in parallel while the process of FIG. 8 is being carried out.

[0058] First, in S801, in order to confirm that there are no formation defects on the substrate S that has been subjected to an imprint process in all shot regions on the substrate S by the imprint device IMP and then carried out from the imprint device IMP, a sampling inspection is performed by the inspection device 405.

[0059] Next, in S802, the substrate S selected by the sampling inspection is inspected by the inspection device 405 to determine whether there are any formation defects on the substrate S selected by the sampling inspection. As a result of the determination, if no formation defect is found on the inspected substrate, the process returns to S801 and waits until the next sampling inspection is performed. Note that the process may be terminated once. At this time, the imprint device IMP continues the imprint process. That is, the imprint device IMP continues the imprint process in parallel with the process of FIG. 8 without interrupting the imprint process on other substrates currently being processed. On the other hand, if a formation defect is found on the inspected substrate, the process proceeds to S803. If a formation defect is found, there is a possibility that formation defects have also occurred on substrates that are not subject to the sampling inspection.

[0060] Next, in S803, a main inspection is performed by the inspection device 405. In this main inspection, substrates that are not subject to the sampling inspection, that is, substrates not selected by the sampling inspection, are inspected by the inspection device 405 to check for the presence or absence of formation defects.

[0061] Next, in S804, the information collection unit 605 of the formation defect classification device 407 acquires the inspection information inspected in S803 from the inspection device 405 and inputs it to the formation defect classification device 407. Next, in S805, the formation defect cause estimation unit 606 of the formation defect classification device 407 estimates the cause of each formation defect based on the inspection information acquired from the inspection device 405.

[0062] Next, in S805, the formation defect cause estimation unit 606 of the formation defect classification device 407 outputs solutions for each formation defect estimated in S804.

[0063] Next, an example of a formation defect in the imprint process will be described. FIG. 9 is a side view showing a state in which the mold M and the substrate S are in contact via a resin (imprint material IM) (for example, at S105). FIG. 9(A) is an example diagram showing the state of seepage of the imprint material IM. FIG. 9(B) is an example diagram showing a state in which a part of the pattern region MP of the mold M is unfilled with the imprint material IM.

[0064] Here, "exudation" refers to the case where the imprint material IM protrudes from the mold M as shown in Fig. 9(A). Also, "unfilled" refers to the case where a portion where the imprint material IM is not filled is generated between the mold M and the substrate S as shown in Fig. 9(B).

[0065] As described above, when exudation or unfilling of the imprint material IM occurs, an example of the image captured at S108 will be described below with reference to Fig. 10. Fig. 10 shows an example where a pattern is formed in the shot region at the upper part of the image. Fig. 10(A) is a diagram showing the state where the imprint material IM is filled up to the shot region boundary 901. Fig. 10(B) is a diagram showing the state where the imprint material IM is not filled up to the shot region boundary 901. Fig. 10(C) is a diagram showing an example where the exuded imprint material IM exceeds the shot region boundary 901.

[0066] When exudation or unfilling of the imprint material IM does not occur, as shown in Fig. 10(A), the imprint material IM is filled up to the shot region boundary 901 and a pattern is formed. Here, when the imprint material IM is unfilled in at least a part of the mold M, as shown in Fig. 10(B), the portion where the imprint material IM is not filled up to the shot region boundary 901 is imaged white (or black). Also, when the imprint material IM is exuded, as shown in Fig. 10(C), the exuded imprint material IM is imaged black (or white) beyond the shot region boundary 901.

[0067] Next, an example of the generation mechanism of formation defects in the imprint process will be described. Usually, formation defects such as exudation and unfilling occur by curing the imprint material IM under inappropriate imprint processing conditions, such as overfilling or underfilling the imprint material IM. Therefore, similar formation defects may occur in the shot region of the substrate S that has undergone imprint processing under inappropriate imprint processing conditions.

[0068] However, if the imprinting process is repeated for a long time or a large number of times, the imprint material IM and the mold M will change over time due to repeated contact and separation, resulting in defective formation due to causes other than the excess or deficiency of the imprint material IM depending on the imprint processing conditions. And the defective formation caused by such reasons occurs sporadically between multiple shots. Therefore, it is necessary to find solutions from the causes of defective formation by paying attention not only to a single defective formation but also to the occurrence area and change over time of defective formation occurring in multiple substrates and multiple shots. Specific examples will be described below.

[0069] An example of the generation mechanism of defective formation related to the mold M in the imprinting process will be described below with reference to FIGS. 11 and 12. FIG. 11 is a diagram illustrating defective formation related to the mold M. FIG. 11(A) is a diagram showing an example in which the imprint material adheres between the grooves such as the side walls and patterns of the mold M. FIG. 11(B) is a diagram showing an example in which the imprint material adheres between the grooves such as the side walls and patterns of the mold M and hardens in that state. FIG. 11(C) is a diagram showing an example in which the imprint material that has adhered or adhered and hardened between the grooves such as the side walls and patterns of the mold M falls onto the substrate S.

[0070] Here, when separating the mold from the cured product of the imprint material in S106, the imprint material IM may adhere between the grooves such as the side walls and patterns of the mold M as shown in FIG. 11(A). The imprint material IM attached to the mold M hardens in the state of being attached to the mold M as shown in FIG. 11(B) by repeating the imprinting process. For example, the imprint material IM attached to the side wall of the mold M hypertrophies by further repeating the imprinting process and hardening. And when it reaches a certain size, as shown in FIG. 11(C), it peels off from the mold M and falls onto the imprint material IM arranged on the substrate S.

[0071] This defective formation (the defective formation shown in FIG. 11) may cause the imprint material IM adhering to the mold M to fall off the mold M, resulting in the imprint material IM on the substrate S being extruded and oozing out. Since this phenomenon depends on the amount of the imprint material IM adhering to the mold M, the characteristics of the time-dependent change in the defective formation may include sporadic occurrence. Also, since the imprint material IM adhering to the mold M falls from the side wall of the mold M, it is also a characteristic that it occurs at the outer peripheral portion of the shot region of the substrate S. Hereinafter, this defective formation is referred to as cumulative oozing.

[0072] Another example of a defective formation related to the mold M will be described with reference to FIG. 12. FIG. 12 is a diagram illustrating a defective formation related to the mold M. FIG. 12(A) is a diagram showing the state of the imprint material IM adhering to the pattern region MP of the mold M during imprinting. FIG. 12(B) is a diagram showing the state in which the imprint material IM adhering to the pattern region MP of the mold M grows larger as the imprinting process is repeated. FIG. 12(C) is a diagram showing the state in which the mold M is pressed against the imprint material IM applied on the substrate S with the imprint material IM adhering to the pattern region MP of the mold M. FIG. 12(D) is a diagram showing the state in which the imprint material IM that should originally be cured on the substrate S is extruded to expand the unfilled generation region.

[0073] During the imprinting process, as shown in FIG. 12(A), the imprint material IM may adhere to the pattern region MP of the mold M during imprinting. Then, as shown in FIG. 12(B), as the imprinting process is repeated, the imprint material IM adhering to the pattern region MP of the mold M may grow larger in the groove of the pattern region MP of the mold M. Therefore, as shown in FIGS. 12(C) and 12(D), each time imprinting is performed, the region where the pattern disappears expands, resulting in a defective formation in which the imprint material IM that should originally be cured on the substrate S is extruded to expand the unfilled generation region.

[0074] The characteristics of this defective formation (the defective formation shown in Fig. 12) include that the imprint material IM attached to the pattern area MP of the mold M hypertrophies in the groove, and gradually disappears each time the pattern area MP of the mold M makes an imprint. Also, it is a characteristic that a defective formation occurs in the same pattern area between the shot areas of the substrate S. Hereinafter, this defective formation is referred to as pattern clogging.

[0075] Next, an example of the generation mechanism of defective formation regarding the imprint order in the imprint process will be described below with reference to Fig. 13. Fig. 13 is a diagram illustrating defective formations related to the imprint order. Fig. 13(A) is a diagram showing a state where the imprint material is placed (supplied, applied) on a part of the cured product IM2, which is the cured product of the imprint material IM that underwent an imprint operation immediately before. Fig. 13(B) is a diagram showing a state where the mold M is separated with the imprint material IM placed on a part of the cured product IM2. Fig. 13(C) is a diagram showing a state where unnecessary imprint material IM is placed on the cured product IM2.

[0076] For example, the substrate S is divided into a plurality of shot areas. In the imprint apparatus IMP, a pattern is formed in one shot area by one imprint operation (S102 to S106).

[0077] Then, when the imprint operation is completed, usually the adjacent shot area is patterned. During the imprint operation of this adjacent shot area, due to an excessive amount of the imprint material IM1 placed in S102, the imprint material may be placed (applied) on the cured product IM2, which is the cured product of the imprint material IM that underwent an imprint operation immediately before. By performing S105 to S106 in that state, as shown in Fig. 13(B) and Fig. 13(C), unnecessary imprint material is placed in the shot area that underwent an imprint operation immediately before, which may result in a defective formation.

[0078] The feature of this defective formation (the defective formation shown in Fig. 13) is that the defective formation is formed on the cured imprint material of the adjacent shot that has been cured. Therefore, the defective formation changes over time depending on the presence or absence of the imprint of the adjacent shot after imprinting. In addition, it has the feature that the defective formation occurs only in a specific direction such as the X direction or Y direction of the adjacent shot. Hereinafter, this defective formation will be referred to as the adjacent shot edge defective formation.

[0079] As another example, the imprint operation of the FF shot area after the imprint operation in the PF shot area will be described with reference to Fig. 14. Fig. 14 is a diagram illustrating a defective formation related to the imprint order. Fig. 14(A) is a diagram showing a state where the imprint material IM oozes out around the substrate S in the PF shot area. Fig. 14(B) is a diagram showing a state where it adheres to the mold M in the shape of the periphery of the substrate S. Fig. 14(C) is a diagram showing a state where the oozed imprint material IM adheres to the mold M and the mold M is about to be pressed against the imprint material IM on the FF shot area. Fig. 14(D) is a diagram showing a state where the oozed imprint material IM adheres to the mold M and is placed on the FF shot area.

[0080] Since the shape of the PF shot area varies depending on the shot area on the substrate S, the imprint processing conditions differ for each PF shot area. Therefore, the imprint processing or the imprint processing conditions may become complicated. And when inappropriate imprint processing conditions are set, the imprint material IM may ooze out around the substrate S in the PF shot area as shown in Fig. 14(A).

[0081] The imprint material IM that has oozed out around the substrate S adheres to the mold M in the shape of the periphery of the substrate S at S103 to S106 as shown in Fig. 14(B). In that state, by next performing the imprint processing on the FF shot area, the imprint material IM attached to the mold M is placed on the FF shot area in the shape of the periphery of the substrate S at S103 as shown in Fig. 14(C) and Fig. 14(D), resulting in a defective formation.

[0082] FIG. 15 is a diagram showing the characteristics of the formation defect shown in FIG. 14. The characteristics of this formation defect (the formation defect shown in FIG. 14) are that when imprinting is performed in the FF shot region after imprinting in the PF shot region, the formation defect changes over time in the FF shot region. Also, it is characteristic that the same shape as the contact portion is generated as a formation defect in the FF shot region in the peripheral portion of the substrate S in the immediately preceding PF shot region. Hereinafter, this formation defect is referred to as a transfer formation defect.

[0083] As described above, the formation defects in the imprint process are reproduced as the same kind of phenomena of seepage and non-filling, but the formation defects change for each region due to the contact between the substrate S, the mold M, and the imprint material IM. Therefore, in order to solve the formation defects of the imprint apparatus IMP, it is necessary to inspect not only the formation defects on a single substrate but also the imprint status of a plurality of substrates S and shot regions. Then, based on the occurrence region of the formation defect for each region and the characteristics of the change over time, the generation mechanism of the formation defect is estimated. Furthermore, it is necessary to estimate the cause of the formation defect according to each generation mechanism and implement a solution for solving the formation defect from the estimated cause of the formation defect.

[0084] The formation defect classification device 407 of the present embodiment, which is also an information processing device, can estimate the generation mechanism of the formation defect and the cause of the formation defect, and present the solution to the user (for example, an operator). When presenting the solution to the user, the formation defect classification device 407 is characterized in that it can derive the solution and present it to the user by using the occurrence region of the formation defect and the characteristics of the change over time of a plurality of substrates S and shot regions.

[0085] Specifically, the inspection information for each substrate is divided into regions and orders based on a plurality of predefined division rules (region division rules). From the plurality of generated formation defect situations after division, the generation mechanism is estimated by matching the occurrence region of the formation defect for each region and the characteristics of the change over time based on the predefined rules. Then, from the estimated generation mechanism, the cause and solution for the predefined generation mechanism are presented.

[0086] FIG. 16 is a flowchart showing an example of a process for estimating the mechanism of occurrence of formation defects from a plurality of formation defects. Also, by prefixing each process (step) with S, the notation of the process (step) is omitted. Incidentally, it is assumed that the imprint apparatus IMP is performing an imprint process on the target substrate in parallel even while the process of FIG. 16 is being performed.

[0087] First, in S1601, in order to confirm that there are no formation defects on the substrate S that has been subjected to an imprint process in all shot regions on the substrate S by the imprint apparatus IMP and then unloaded from the imprint apparatus IMP, a sampling inspection is performed by the inspection apparatus 405.

[0088] Next, in S1602, the substrate S selected by the sampling inspection is inspected by the inspection apparatus 405 to determine whether there are any formation defects in the substrate S selected by the sampling inspection. As a result of the determination, if no formation defects are found in the inspected substrate, the process returns to S1601 and waits until the next sampling inspection is performed. Incidentally, the process may be terminated once. At this time, the imprint apparatus IMP continues the imprint process. That is, the imprint apparatus IMP continues to perform the imprint process in parallel with the process of FIG. 16 without interrupting the imprint process on other substrates that are currently being processed. On the other hand, if formation defects are found in the inspected substrate, the process proceeds to S1603.

[0089] Incidentally, if formation defects are found in the inspection in S1602, there is a possibility that formation defects have also occurred in the substrates that are not the targets of the sampling inspection. Also, in order to derive the causes and countermeasures in accordance with the mechanism of occurrence of formation defects from the temporal change of formation defects, it is necessary to inspect the formation defects of a plurality of substrates S.

[0090] Next, in S1603, a full inspection is performed by the inspection apparatus 405. In this full inspection, the substrates that were not the targets of the sampling inspection, that is, the substrates not selected by the sampling inspection, are inspected by the inspection apparatus 405 to check for the presence or absence of formation defects.

[0091] Next, in S1604, the information collection unit 605 of the formation defect classification device 407 acquires inspection information on the plurality of substrates inspected in S1603 from the inspection device 405 and inputs it to the formation defect classification device 407. Incidentally, in this process, the information collection unit 605 also functions as a second acquisition means for acquiring imprint information from the imprint device IMP.

[0092] Next, in S1605, the information collection unit 605 of the formation defect classification device 407 acquires imprint information from the imprint device IMP and inputs it to the formation defect classification device 407. Incidentally, in this process, the information collection unit 605 also functions as a second acquisition means for acquiring imprint information from the imprint device IMP.

[0093] Next, in S1606, the formation defect cause estimation unit 606 of the formation defect classification device 407 extracts the occurrence region of the formation defect and the characteristics of the change over time based on the inspection information and imprint information regarding the plurality of input substrates, and estimates the occurrence mechanism of the formation defect.

[0094] Next, in S1607, the formation defect cause estimation unit 606 of the formation defect classification device 407 estimates the cause based on the occurrence mechanism of the formation defect estimated in S1606, and outputs information such as the estimation result, the estimated cause, and the solution to the cause. Incidentally, for example, the formation defect cause estimation unit 606 outputs each of these details to the solution display unit 608 and the imprint setting update unit 607. Further, the solution display unit 608 may display the cause and solution of the formation defect based on the estimation result output from the formation defect cause estimation unit 606 on the display device 409. In this process, the solution display unit 608 also functions as a display control means.

[0095] Next, in S1608, the imprint setting update unit 607 of the formation defect classification device 407 changes the imprint setting of the imprint device IMP based on the solution output in S1606. Note that the change of the imprint setting in S1608 may be performed by the user (operator) who confirmed the solution on the screen of the display device 409. Alternatively, the solution may be input to the imprint device IMP via the imprint setting update unit 607 to change the imprint setting.

[0096] The imprint information in this embodiment includes shot-related information at the time of imprint and information other than shots. Here, the shot-related information at the time of imprint includes shot area information that records the shot area when imprinting on the substrate. Further, it includes shot order information that records the order of the shots when imprinting, and further includes imprint processing condition information for imprinting in S102 to S106.

[0097] In addition, the information other than shots includes one or more of the identifier of the substrate S, the identifier of the mold M, the type of the layout of the mold M, the identifier of the imprint device IMP, the identifier of the unit of the imprint device IMP, and the lot information of the substrate S.

[0098] The inspection information in this embodiment includes one or more pieces of information on the characteristics of the formation defects, such as the identifier of the substrate S, the presence or absence of formation defects, the number of formation defects, the type of formation defects, the formation defect occurrence area, the size of the substrate S, the shape of the substrate S, and the angle (angle information) of the substrate S.

[0099] In this embodiment, the imprint information and the inspection information having the identifier of the same substrate are input to the formation defect classification device 407 via the information collection unit 605 as information on the same substrate. At this time, the information collection unit 605 acquires the imprint information from the imprint device IMP and the inspection information from the inspection device 405, respectively. Note that the information collection unit 605 may acquire these imprint information and inspection information from other storage media that store them together, the storage medium of the formation defect classification device 407, or the like.

[0100] The formation defect classification device 407 manages an inspection information division algorithm, a feature extraction algorithm, and a generation mechanism mapping in the estimation rule 610. The inspection information division algorithm (division means) is an algorithm for a process of regionally dividing, grouping, and sorting a plurality of inspection information based on a plurality of imprint information to create a group of formation defect information for each region. The feature extraction algorithm is an algorithm for a process of extracting formation defect features for each region, which are features of changes over time, from the group of formation defect information for each region. The generation mechanism mapping is a mapping rule for realizing a process of estimating the generation mechanism from a plurality of formation defect features for each region.

[0101] The formation defect cause estimation unit 606 estimates the generation mechanism of the formation defect based on the estimation rule acquired from the estimation rule 610. Specifically, according to the acquired imprint information, based on a region division rule for dividing the region of the substrate into a plurality of regions, from a plurality of inspection information for each region obtained by dividing the inspection information of a plurality of substrates into inspection information for each region, the generation region of the formation defect and the features of changes over time are specified. Then, one or more generation mechanisms are estimated from the specified features of changes over time. The generation mechanism estimation process at this time will be described below with reference to FIG. 17.

[0102] FIG. 17 is a flowchart showing the flow of a process for estimating the generation mechanism of a formation defect in the present embodiment. Also, by attaching an S at the beginning to represent each process (step), the notation of the process (step) is omitted.

[0103] First, in S1701, in the "region division step" of the inspection information division algorithm, the inspection information is re-divided for each region on the substrate specified by the algorithm using, as judgment materials, shot region information of the imprint information, imprint detailed setting information, etc.

[0104] Next, in S1702, in the "grouping step" of the inspection information division algorithm, the subdivided inspection information is grouped for each condition specified by the algorithm using, as judgment materials, the imprint information, etc.

[0105] Next, in S1703, in the "alignment process" of the inspection information division algorithm, in order to extract the characteristics of changes over time from the grouped inspection information, the shot order, etc. are used as judgment materials to determine the extraction order of the characteristics of the grouped inspection information. Then, the determined group of inspection information is used as the formation defect information group by region.

[0106] Next, in S1704, the feature extraction algorithm extracts the characteristics of the change over time of specific formation defects. The feature extraction algorithm is a rule-based algorithm that determines the formation defect features by region based on, for example, that the change amount of the occurrence rate of the formation defects defined in advance for each region-by-region formation defect information group reaches the target value, or that the types of formation defects that occur match the predetermined formation defects.

[0107] Next, in S1705, for the occurrence mechanism mapping, a mapping table of a plurality of region-by-region formation defect features to be satisfied in order to estimate the occurrence mechanism is defined in advance. Then, the occurrence mechanism is estimated by matching the region-by-region formation defect features extracted from the feature extraction algorithm with the previous mapping table.

[0108] The occurrence mechanism mapping has a mapping table that holds one or more pieces of cause information and solution information for each occurrence mechanism. By means of the occurrence mechanism mapping, the cause of occurrence and the solution for the identified occurrence mechanism can be presented to the operator.

[0109] The inspection information division algorithm, the feature extraction algorithm, and the occurrence mechanism mapping managed by the estimation rule 610 have a function of being added and updated via the estimation rule update unit 609 from the outside in order to add and change the occurrence mechanism of detectable formation defects.

[0110] The formation defect classification device 407 has a function of displaying information (e.g., information on formation defects by region) serving as the basis for estimating the generation mechanism on a display device such as the display unit 609. What is displayed on the display device such as the display unit 609 is performed, for example, by the solution display unit (display control means) 608 of the formation defect classification device 407. Hereinafter, an example of displaying information on formation defects will be described with reference to FIGS. 18 to 23.

[0111] FIG. 18 is a diagram illustrating a method of displaying information on formation defects in the present embodiment. FIG. 18(A) is a diagram showing an example of animating an image of a formation defect information group by region in the order arranged by the formation defect inspection information division algorithm and displaying the situation of the change over time of the formation defect by region on a GUI such as the display unit 609. The solution display unit 608 can cause the user to confirm the situation of the change over time of the formation defect by displaying the image of the formation defect information group by region in an animation format in the order arranged by the formation defect inspection information division algorithm.

[0112] FIG. 18(B) is a diagram showing an example of displaying the occurrence situation of formation defects in the formation defect information group by region in a graph format or a table format. The solution display unit 608 can make it easier for the user to perform statistical analysis by displaying the occurrence situation of formation defects in the formation defect information group by region in a graph format or a table format.

[0113] FIG. 18(C) is a diagram showing an example of displaying the shot region and shot order on the substrate and the location where the formation defect occurs on the image of the substrate. The solution display unit 608 can make it easier for the user to confirm the relevance between the cause of the formation defect and the occurrence situation by displaying the shot region and shot order on the substrate and the location where the formation defect occurs on the image of the substrate.

[0114] In this way, the solution display unit 608 can display the situation of the change over time of the formation defects by region in a GUI such as the display unit 609 in any of the graph format, table format, or animation format. Further, the solution display unit 608 may display the situation of the change over time of the formation defects by region in the GUI such as the display unit 609 by combining any two or all of the graph format, table format, and animation format. Also in such a case of the display process, the solution display unit 608 functions as a display control means.

[0115] In addition, the solution display unit 608 may highlight the shot images of the formation defects, the values on the graph, and the cells on the table that match the conditions of the feature extraction algorithm used in the generation mechanism mapping with colors, symbols, etc. Thereby, it becomes easier for the user to visually confirm the basis of the generation mechanism.

[0116] By defining the optimal screen display format for the generation mechanism in the generation mechanism mapping, the user can easily realize the optimal screen display for the analysis of the formation defects with a simple operation. In addition, in order to enable the addition and change of detectable generation mechanisms, the screen display format can be added and changed from the outside. The solution display unit 608 can add or change a plurality of display formats as described above based on instructions for addition or change from these external sources (for example, the user). Also in this process, the solution display unit 608 functions as a control means.

[0117] In addition, the formation defect classification device 407 may be not outside the imprint device IMP and the inspection device 405, but inside the imprint device IMP or the inspection device 405. That is, the imprint device IMP or the inspection device 405 may have the formation defect classification device 407 inside. Also, the imprint information and the inspection information are not limited to being acquired from the imprint device IMP and the inspection device 405, and may be input by devices or operators other than the imprint device IMP and the inspection device 405.

[0118] <Example 1> The formation defect classification device 407 will hereinafter show an example of distinguishing and specifying the generation mechanism of over- or under-application of the imprint material IM, which is a typical formation defect in imprint processing, and the generation mechanism of similar formation defects. Examples of formation defects similar to normal over-application include, for example, cumulative over-application and adjacent shot edge formation defects.

[0119] Hereinafter, description will be made with reference to FIGS. 19 and 20. FIG. 19 is a diagram illustrating a divided shot area of a substrate S in which a formation defect has occurred in Example 1. In this example, in the "area division step" of the inspection information division algorithm, the shot area is divided according to the area division rule of dividing the area for each distance from the outer periphery of the shot area.

[0120] Normal over-application, cumulative over-application, and adjacent shot edge formation defects occur in the outer peripheral portion of the imprinted shot area. Therefore, the inspection information of the shot area shown in FIG. 19(A) is divided into the outer peripheral portion of the shot area and the portion other than the outer peripheral portion of the shot area as shown in FIGS. 19(B) and 19(C) by the area division step (S1701) of the inspection information division algorithm. Next, by the grouping step (S1702) of the inspection information division algorithm, the divided inspection information is grouped for each substrate. Next, by the alignment step (S1703) of the inspection information division algorithm, the grouped inspection information is aligned in shot order.

[0121] In addition, in order to classify the detailed information of the formation defect, the outer peripheral portion of the shot area may be divided into finer areas as shown in FIG. 19(D). In that case, it is preferable that the grouping step (S1702) of the inspection information division algorithm performs grouping for each substrate and for each arrangement of the divided areas.

[0122] FIG. 20 is a diagram illustrating grouped shot regions of a substrate with formation defects in Example 1. In this example, in the "region division step" of the inspection information division algorithm, inspection information is divided into regions for each shot region according to the region division rule of dividing the region according to the imprint processing order of the shot region.

[0123] In the case of adjacent shot edge formation defects, since the formation defects are formed on the cured product of the imprint material, it is necessary to consider the imprint order and the direction of the next shot region to be imprinted. Therefore, when there is a shot region to be imprinted on the substrate as shown in FIG. 20(A), the inspection information is divided into regions for each shot region by the region division step (S1701) of the inspection information division algorithm. Next, by the grouping step (S1702) of the inspection information division algorithm, the shots adjacent in the -X direction starting from the shot region at the substrate edge are grouped as R1, R2, R3, ···. That is, as shown in FIG. 20(B), the shot at the outermost end in the X direction is R0, the shot adjacent to R0 in the -X direction is R1, and the shot adjacent to it in the -X direction is R2. In this way, the shots adjacent in the -X direction starting from the shot region at the substrate edge are grouped as R1, R2, R3, ···. Next, by the alignment step (S1703) of the inspection information division algorithm, the grouped inspection information is aligned in the shot order. It should be noted that it may also be a method of dividing the region in the reverse direction of the X direction or dividing the region with respect to the Y direction.

[0124] Next, an example of extracting the characteristics of the change over time from the inspection information for each region divided, grouped, and aligned as described above and estimating the generation mechanism of each formation defect is shown. The difference in the characteristics of the change over time between normal leaching and accumulation-type leaching in this embodiment is the occurrence rate of formation defects in the outer peripheral portion of the shot region. For example, in the case of normal leaching, formation defects in the outer peripheral portion of the shot region occur with a high probability of 90% or more. Also, for example, in the case of accumulation-type leaching, formation defects in the outer peripheral portion of the shot region occur with a low probability of less than 50%. Therefore, from the characteristics of the occurrence rate of formation defects in the outer peripheral portion of the shot region, the generation mechanisms of normal leaching and accumulation-type leaching can be distinguished.

[0125] In the case of normal leaching and accumulation leaching, when there are defects in the formation of adjacent shot ends, it becomes difficult to distinguish based solely on the defect occurrence rate in the outer peripheral part of the shot area. Therefore, a feature extraction algorithm for extracting the characteristics of the change over time of defects for each shot area starting from the right end of the substrate shown in FIG. 20 is used in combination.

[0126] For example, when imprinting in the X direction of FIG. 20, if a defect is formed on the cured imprint material adjacent to the -X side, no defect occurs in the area-specific inspection information of R0 for the adjacent shot end formation defect. And defects occur in the area-specific inspection information of R1, R2, R3, ···. Such characteristics of change over time are not seen in normal leaching or accumulation leaching. Therefore, from the low defect occurrence rate in R0 and the high defect occurrence rate in R1, R2, R3, ···, the generation mechanisms of adjacent shot end formation defects and normal leaching and accumulation leaching can be distinguished.

[0127] In addition, normal leaching and adjacent shot end formation defects are affected by imprinting process conditions such as the amount and arrangement of the imprint material IM used for each shot and the pressing force during imprinting. Therefore, it is also conceivable to use the imprinting process conditions as the grouping criteria during the grouping step (S1702) of the inspection information splitting algorithm. Also, in the case of a defect with a generation mechanism affected by foreign matter attached to the mold M like accumulation leaching, it is also conceivable to use the identifier of the mold M as the grouping criteria in the grouping step (S1702) of the inspection information splitting algorithm.

[0128] FIG. 21 is a diagram illustrating the management of the correspondence relationship between the identified generation mechanism, cause, and solution. And if the generation mechanism can be identified, by managing the correspondence relationship between the generation mechanism, cause, and solution in the form of a table like FIG. 21, the cause and solution for the generation mechanism can be specified. By having the solution display unit 608 display on a display device such as the display unit 709 in the form of a table in which the correspondence relationship between the generation mechanism, cause, and solution like FIG. 21 is specified, the operator can easily specify the cause and solution for the generation mechanism.

[0129] Furthermore, for one generation mechanism, a plurality of causes and solutions may be defined. Also, either both the cause and solution for the generation mechanism or either the cause or solution for the generation mechanism may be displayed. That is, the solution display unit 608 may display at least one of the causes or solutions of one or more formation defects corresponding to the generation mechanism on the screen of the display device.

[0130] <Example 2> An example in which the formation defect classification device 407 identifies the generation mechanism of the transfer formation defect is shown below with reference to FIG. 22. FIG. 22 is a diagram illustrating grouped shots of a substrate in which a formation defect has occurred in Example 2. In the case of a transfer formation defect, after attaching the imprint material IM that causes the formation defect to the mold M in the PF shot region, the imprint material IM attached to the mold M during imprinting in the FF shot region is dropped onto the substrate to form a formation defect. Therefore, it is necessary to consider the imprint order of the PF shot region and the subsequent FF shot region.

[0131] Therefore, when there is a shot region for imprinting on the substrate S as shown in FIG. 22(A), region division is performed for each shot region by the region division step (S1701) of the inspection information division algorithm. That is, region division is performed for each shot region according to the region division rule of dividing by the imprint processing order from the shot region including the outer periphery of the substrate S (PF shot region) to the shot region not including the outer periphery of the substrate S (FF shot region).

[0132] Next, by the grouping step (S1702) of the inspection information division algorithm, as shown in FIG. 22(B), the m-th PF shot region is designated as PFm, and the n-th FF shot region after the m-th PF shot region is designated as FFmn and grouped.

[0133] The numerical values within the rectangles in FIGS. 22(A) and 22(B) indicate the shot order of each substrate. Note that after imprinting the PF shot area at the end of the Nth substrate, a transfer formation defect may occur in the first FF shot area of the (N + 1)th substrate. Therefore, grouping is performed for each combination of the same imprinting device and the same type. That is, it may also group the formation defect information by region for different substrates. In the sorting step (S1703) of the inspection information division algorithm, the grouped inspection information is sorted in the shot order.

[0134] Next, an example is shown in which the characteristics of the change over time are extracted and specified from the formation defect information by region that has been regionally divided, grouped, and sorted as described above, and the generation mechanism of the transfer formation defect is estimated from the specified characteristics of the change over time.

[0135] The transfer formation defect occurs when the imprint material IM attached to the mold during the imprinting of a specific PF shot area adheres to the next FF shot area to be imprinted. And its shape becomes linear like the contact part around the substrate. Therefore, there is a characteristic that a linear formation defect occurs in the FF shot area imprinted immediately after PFm, which is a factor causing a formation defect such as FFm1 or FFm2. Therefore, it is possible to distinguish that the inspection information by region showing the characteristic of the change over time, where the formation defect occurrence rate is low in PFm and the occurrence rate of the linear formation defect in FFm1 is high, corresponds to the transfer formation defect. Also, the fact that the occurrence rate of the linear formation defect decreases as the distance from PFm increases for FFm2, FFm3, FFm4 ··· is also one of the characteristics of the transfer formation defect.

[0136] <Example 3> An example of the function in which the formation defect classification device 407 displays the information used as the basis for estimating the generation mechanism is shown below with reference to FIG. 23. FIG. 23 is a diagram illustrating a method of displaying the formation defect information in Example 3.

[0137] In the case of poor formation of pattern clogging, every time imprinting is performed with a specific mold, the imprinting material IM hypertrophies between the grooves (pattern regions MP) of the mold M, and the region where the pattern disappears spreads. Fig. 23(A) shows an example of displaying on the GUI an animation showing the temporal change in the occurrence region of poor formation due to pattern clogging.

[0138] 2301 shown in Fig. 23(A) is the main screen for animating the temporal change in the poor formation of pattern clogging for each shot. The rectangular region in the figure is an image of the shot region on the substrate S. 2302 is a sub-screen that is divided for each shot region from the image of the inspection information acquired from the inspection device and arranged in the shot order for display. Each rectangle in the figure is an image of the shot region on the substrate S. 2303 indicates the image shown in 2301 among the images shown in 2302. 2304 indicates the occurrence region of the poor formation of pattern clogging detected within the shot region.

[0139] Here, the images for each shot region in the sub-screen 2302 are animated and displayed on the main screen 2301 in the shot order. Then, the size of the poor formation displayed on the main screen 2301 increases as the animation progresses. By performing the animation display, it is possible for the operator to easily visually grasp how the poor formation of pattern clogging hypertrophies.

[0140] Next, Figs. 23(B) and 23(C) show examples of displaying in table format the data determined to be poor formation from the inspection information. Column M indicates the mold formed with the same pattern. Columns S1 to S4 indicate the shot regions of the first to fourth shots when the pattern is transferred to the substrate. The numerical values in columns S1 to S4 indicate the size of the poor formation that occurred within the corresponding shot region among the inspection information acquired from the inspection device. 2305 shows an example of highlighting in dotted line format the numerical values of the shot regions determined to have pattern clogging. Note that the highlighting 2305 may be emphasized not only by dotted lines but also by color, font size, cell color, etc.

[0141] By expressing the size of the formation defect in tabular form, it becomes easier to grasp the change over time of the formation defect. Also, by arranging the occurrence status of formation defects on multiple substrates, it becomes easier to specify the range of substrates on which formation defects occur, and it becomes easier for the operator to understand the basis for solutions to formation defects.

[0142] In the case of Fig. 23(B), since pattern clogging occurs only in a specific mold, it is assumed that the imprint material adheres as an impurity in the groove of mold M where pattern clogging occurs. And in order to solve the pattern clogging of that mold, it can be determined that mold cleaning is necessary. Also, in the case of Fig. 23(C), pattern clogging occurs in all molds of the same pattern. This is assumed to be due to inappropriate imprint processing conditions for the pattern common to multiple molds. Therefore, it can be determined that readjustment of the imprint processing conditions is necessary. Note that this example is not limited to the form shown in Fig. 23, and for example, a method of displaying in graph form may also be used.

[0143] In this way, in the present embodiment, in the screen display form according to the generation mechanism of the formation defect, information (for example, formation defect by region) serving as the basis of the generation mechanism, the cause of the formation defect corresponding to the generation mechanism, solutions, etc. can be displayed on the GUI. Thereby, it becomes easier for the operator to grasp the basis of the generation mechanism of the formation defect estimated by the formation defect classification device 407 and the necessity of solutions.

[0144] Also, the solution display unit 608 can switch the display form (graph form, table form, animation form) of the change over time of the formation defect by region according to the generation mechanism. Note that these switches may be made to switch based on an instruction from the outside (for example, the user).

[0145] As described above, the formation defect cause estimation unit 606 specifies the occurrence area of the formation defect by area and the characteristics of the change over time from the values or amounts of change between the plurality of inspection information by area based on rules. Further, the formation defect cause estimation unit 606 can also estimate the occurrence mechanism in the formation defect based on rules from the combination of the occurrence area of the formation defect in one or more areas by area and the characteristics of the change over time.

[0146] In addition, the area division rules, the estimation method of the occurrence mechanism of the formation defect, the factors of the formation defect, the solutions to the formation defect, etc. can also be added or changed from the outside. Also in this case, the solution display unit 608 adds or changes the area division rules, the estimation method of the occurrence mechanism of the formation defect, the factors of the formation defect, the solutions to the formation defect, etc. based on the instructions of addition or change from these external sources (for example, users), in the same manner as described above.

[0147] Further, the formation defect classification device 407 in the present embodiment has area division rules for dividing the area of the substrate S into a plurality of areas according to imprint information and the like as described above. The area division rules include area division rules for dividing the area according to the distance from the outer periphery of the shot area described with reference to FIG. 19. Further, area division rules for dividing the area according to the imprint processing order of the shot area described with reference to FIG. 20 are also included. Further, area division rules for dividing the area according to the moving direction of the substrate S during the imprint processing described with reference to FIG. 18(C) are also included. Further, area division rules for dividing the area according to the imprint processing order from the shot area including the outer periphery of the substrate S to the shot area not including the outer periphery of the substrate S described with reference to FIG. 22 are also included.

[0148] As described above, according to the formation defect classification device (information processing device) 407 in the present embodiment, it is possible to efficiently estimate the occurrence mechanism of the pattern formation defect with high accuracy and present a solution based on the cause of the formation defect.

[0149] <Embodiment related to an article manufacturing method> The method for manufacturing an article according to this embodiment is suitable for manufacturing articles such as microdevices like semiconductor devices and elements having a fine structure. The method for manufacturing an article of this embodiment includes a step of forming a pattern (a step of processing a substrate) on a composition applied to a substrate using the above-described imprint apparatus IMP, and a step of processing the substrate on which the pattern has been formed in such a step. Further, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, composition peeling, dicing, bonding, packaging, etc.). The method for manufacturing an article of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

[0150] The pattern of the cured product formed using the imprint apparatus IMP is used permanently for at least a part of various articles or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold, etc. Examples of the electric circuit element include a volatile or non-volatile semiconductor memory such as DRAM, SRAM, flash memory, MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for substrate processing such as imprint.

[0151] The pattern of the cured product is used as it is as at least a part of the constituent members of the above article or temporarily as a composition mask. After etching or ion implantation, etc. is performed in the substrate processing step, the composition mask is removed.

[0152] Next, a specific method for manufacturing an article will be described with reference to FIG. 24. As shown in FIG. 24(A), a substrate 1z such as a silicon substrate having a workpiece 2z such as an insulator formed on its surface is prepared, and subsequently, a composition 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state where a plurality of droplet-shaped compositions 3z are applied on the substrate 1z is shown.

[0153] As shown in FIG. 24(B), the mold 4z is opposed to the composition 3z on the substrate 1z with the side on which the concavo-convex pattern is formed facing the composition 3z. As shown in FIG. 24(C), the substrate 1z provided with the composition 3z and the mold 4z are brought into contact with each other and pressure is applied (contact step). The composition 3z is filled in the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z as energy for curing in this state, the composition 3z cures (curing step). At this time, in this embodiment, based on the spectral sensitivity characteristics obtained in the apparatus, it is possible to irradiate the composition with light at an irradiation amount that achieves the optimum degree of photopolymerization.

[0154] As shown in FIG. 24(D), after the composition 3z is cured and the mold 4z and the substrate 1z are separated from each other, a pattern of the cured product of the composition 3z is formed on the substrate 1z (pattern formation step, molding step). The pattern of this cured product has a shape in which the concave portion of the mold 4z corresponds to the convex portion of the cured product and the convex portion of the mold 4z corresponds to the concave portion of the cured product. That is, the concavo-convex pattern of the mold 4z is transferred to the composition 3z.

[0155] As shown in FIG. 24(E), when etching is performed using the pattern of the cured product as an etching-resistant mask, the portion of the surface of the workpiece 2z where the cured product is absent or remains thinly is removed to form a groove 5z. As shown in FIG. 24(F), when the pattern of the cured product is removed, an article having a groove 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured product is removed, but it may not be removed after processing and may be used, for example, as a film for interlayer insulation included in a semiconductor element or the like, that is, as a constituent member of the article. Although an example in which a mold for circuit pattern transfer provided with a concavo-convex pattern is used as the mold 4z has been described, a flat template having a flat portion without a concavo-convex pattern may also be used.

[0156] As described above, the preferred embodiments of the present invention have been described. However, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof. Also, the above-described embodiments may be combined and implemented.

[0157] The disclosure of the present embodiment includes the following configurations and methods.

[0158] (Configuration 1) In an information processing apparatus for estimating the generation mechanism in a formation defect on a substrate by an imprint apparatus that performs an imprint process of sequentially forming a pattern of an imprint material on a plurality of shot regions on the substrate using a mold having a pattern, a first acquisition means for acquiring inspection information of a substrate on which the pattern of the imprint material is formed; a second acquisition means for acquiring imprint information including shot region information and order information of the imprint process when forming the pattern of the mold on the shot regions on the substrate; a dividing means for dividing inspection information of a plurality of substrates into region-by-region inspection information based on a region division rule for dividing the region of the substrate into a plurality of regions according to the imprint information; an estimation means for specifying a generation region of a formation defect and characteristics of change over time from the plurality of region-by-region inspection information, and estimating one or more generation mechanisms from the specified characteristics of change over time. An information processing apparatus characterized by the above.

[0159] (Configuration 2) The information processing apparatus according to Configuration 1, wherein the imprint information includes at least imprint process condition information, an identifier of the substrate, and an identifier of the mold.

[0160] (Configuration 3) The information processing apparatus according to Configuration 1 or 2, wherein the imprint information includes one or more of the imprint process order of the substrate, the type of layout of the mold, an identifier of the imprint apparatus, an identifier of a unit of the imprint apparatus, and lot information of the substrate.

[0161] (Configuration 4) The inspection information includes one or more of the identifier of the substrate, the presence or absence of the formation defect, the number of the formation defects, the type of the formation defects, the formation defect occurrence area, the size of the substrate, the shape of the substrate, and the angle information of the substrate. The information processing apparatus according to any one of Configurations 1 to 3, characterized in that.

[0162] (Configuration 5) The area division rule includes a rule for dividing areas according to the distance from the outer periphery of the shot area. The information processing apparatus according to any one of Configurations 1 to 4, characterized in that.

[0163] (Configuration 6) The area division rule includes a rule for dividing areas according to the imprint processing order of the shot area. The information processing apparatus according to any one of Configurations 1 to 5, characterized in that.

[0164] (Configuration 7) The area division rule includes a rule for dividing areas according to the moving direction of the substrate during imprint processing. The information processing apparatus according to any one of Configurations 1 to 6, characterized in that.

[0165] (Configuration 8) The area division rule includes a rule for dividing areas according to the imprint processing order from the shot area including the outer periphery of the substrate to the shot area not including the outer periphery of the substrate. The information processing apparatus according to any one of Configurations 1 to 7, characterized in that.

[0166] (Configuration 9) The estimation means specifies the occurrence area and the characteristics of the change over time of the area-specific formation defect based on rules from the values or change amounts between the plurality of area-specific inspection information. The information processing apparatus according to any one of Configurations 1 to 8, characterized in that.

[0167] (Configuration 10) The estimation means estimates the generation mechanism based on rules from the combination of the occurrence area and the characteristics of the change over time of one or more area-specific formation defects. The information processing apparatus according to any one of Configurations 1 to 9, characterized in that.

[0168] (Configuration 11) An information processing apparatus according to any one of Configurations 1 to 10, comprising display control means for causing a display device to display the temporal change of formation defects in at least one of a graph format, a table format, and an animation format.

[0169] (Configuration 12) The information processing apparatus according to Configuration 11, wherein the display control means causes the display device to display the temporal change of formation defects by region in any one or in combination of all of a graph format, a table format, and an animation format.

[0170] (Configuration 13) The information processing apparatus according to Configuration 11 or 12, wherein the display control means switches the display format of the temporal change of formation defects by region according to the generation mechanism.

[0171] (Configuration 14) The information processing apparatus according to any one of Configurations 11 to 13, wherein the display control means causes the display device to display the formation defects by region that are the basis of the generation mechanism.

[0172] (Configuration 15) The information processing apparatus according to any one of Configurations 11 to 14, wherein the display control means causes the display device to display at least one of the causes or solutions of one or more formation defects corresponding to the generation mechanism.

[0173] (Configuration 16) An information processing apparatus according to any one of Configurations 1 to 15, comprising control means capable of adding or changing one or more of the region division rules, the estimation method of the generation mechanism, the factors of the formation defects, the solutions of the formation defects, and the display format of the temporal change of formation defects by region.

[0174] (Configuration 17) The estimation means estimates the cause of the formation defect of the substrate based on the occurrence area of the formation defect by region and the characteristics of the change over time, and outputs a solution to the formation defect of the substrate based on the estimated estimation result. The information processing apparatus according to any one of Configurations 1 to 16.

[0175] (Configuration 18) In a control method of an information processing apparatus for estimating the generation mechanism in the formation defect on the substrate by an imprint apparatus that performs an imprint process of sequentially forming a pattern of an imprint material on a plurality of shot areas on the substrate using a mold having a pattern, acquire inspection information of the substrate on which the pattern of the imprint material is formed, acquire imprint information including shot area information and order information of the imprint process when forming the pattern of the mold on the shot area on the substrate, divide the inspection information of a plurality of substrates into inspection information by region based on a region division rule for dividing the region of the substrate into a plurality of regions according to the imprint information, specify the occurrence area of the formation defect and the characteristics of the change over time from the plurality of inspection information by region, and estimate one or more generation mechanisms from the specified characteristics of the change over time, A control method of an information processing apparatus, characterized by the above.

[0176] (Configuration 19) An imprint apparatus, characterized by having the information processing apparatus according to any one of Configurations 1 to 17.

[0177] (Configuration 20) A pattern forming step of forming a concavo-convex pattern on the substrate using the imprint apparatus according to Configuration 19, A processing step of processing the substrate on which the pattern is formed in the pattern forming step, A step of manufacturing an article from the substrate processed in the processing step, A method for manufacturing an article, characterized by including the above.

[0178] Further, a part or all of the control in each of the above-described embodiments may be supplied to the defect classification device 407, the imprint device IMP, etc. via a network or various storage media by a computer program that realizes the functions of each of the above-described embodiments. Then, a computer (or a CPU, MPU, etc.) in the defect classification device 407, the imprint device IMP, etc. may read and execute the program. In that case, the program and the storage medium storing the program will constitute the present invention.

Explanation of Signs

[0179] IMP Imprint device 405 Inspection device 407 Defect classification device (information processing device) 605 Information collection unit 606 Defect cause estimation unit 607 Imprint setting update unit 608 Solution display unit 609 Estimation rule update unit 610 Estimation rule

Claims

1. In an information processing apparatus for estimating the generation mechanism in formation defects on a substrate by an imprint apparatus that performs an imprint process of sequentially forming a pattern of an imprint material on a plurality of shot regions on the substrate using a mold having a pattern, a first acquisition means for acquiring inspection information of a substrate on which the pattern of the imprint material is formed; a second acquisition means for acquiring imprint information including shot region information and order information of the imprint process when forming the pattern of the mold on the shot regions on the substrate; a dividing means for dividing inspection information of a plurality of substrates into region-by-region inspection information based on a region division rule for dividing the region of the substrate into a plurality of regions according to the imprint information; estimating means for specifying a generation region of a formation defect and characteristics of change over time from the plurality of region-by-region inspection information, and estimating one or more generation mechanisms from the specified characteristics of change over time. An information processing apparatus characterized by the above.

2. The information processing apparatus according to claim 1, wherein the imprint information includes at least imprint process condition information, an identifier of the substrate, and an identifier of the mold.

3. The information processing apparatus according to claim 1, wherein the imprint information includes one or more of the imprint process order of the substrate, the type of layout of the mold, an identifier of the imprint apparatus, an identifier of a unit of the imprint apparatus, and lot information of the substrate.

4. The information processing apparatus according to claim 1, wherein the inspection information includes one or more of an identifier of the substrate, presence or absence of the formation defect, number of the formation defects, type of the formation defects, formation defect generation region, size of the substrate, shape of the substrate, and angle information of the substrate.

5. The information processing apparatus according to claim 1, wherein the region division rule includes a rule for dividing regions according to the distance from the outer periphery of the shot region.

6. The information processing apparatus according to claim 1, wherein the region division rule includes a rule for dividing regions according to the imprint process order of the shot region.

7. The information processing apparatus according to claim 1, wherein the region division rule includes a rule for dividing regions according to the moving direction of the substrate during the imprint process.

8. The information processing apparatus according to claim 1, wherein the area division rule includes a rule for dividing areas according to the imprint processing order of the shot area including the outer periphery of the substrate and the shot area not including the outer periphery of the substrate.

9. The information processing apparatus according to claim 1, wherein the estimation means specifies, based on a rule, the occurrence area and the characteristics of the change over time of the formation defect by area from the values or the amounts of change between the inspection information by area.

10. The information processing apparatus according to claim 1, wherein the estimation means estimates, based on a rule, the occurrence mechanism from a combination of the occurrence area of one or more formation defects by area and the characteristics of the change over time.

11. The information processing apparatus according to claim 1, further comprising display control means for causing a display device to display the change over time of the formation defect in at least one of a graph format, a table format, and an animation format.

12. The information processing apparatus according to claim 11, wherein the display control means causes the display device to display the change over time of the formation defect by area in any one or a combination of all of a graph format, a table format, and an animation format.

13. The information processing apparatus according to claim 11, wherein the display control means switches the display format of the change over time of the formation defect by area according to the occurrence mechanism.

14. The information processing apparatus according to claim 11, wherein the display control means causes the display device to display the formation defect by area that is the basis of the occurrence mechanism.

15. The information processing apparatus according to claim 11, wherein the display control means causes the display device to display at least any one of the causes or solutions of one or more formation defects corresponding to the occurrence mechanism.

16. The information processing apparatus according to claim 1, further comprising control means capable of adding or changing one or more of the area division rule, the method for estimating the occurrence mechanism, the factors of the formation defect, the solutions to the formation defect, and the display format of the change over time of the formation defect by area.

17. The information processing apparatus according to claim 1, wherein the estimation means estimates the cause of the formation defect of the substrate based on the occurrence area of the formation defect by area and the characteristics of the change over time, and outputs a solution to the formation defect of the substrate based on the estimated result.

18. In a control method of an information processing apparatus for estimating a generation mechanism in a formation defect on a substrate by an imprint apparatus that performs an imprint process of sequentially forming a pattern of an imprint material on a plurality of shot regions on the substrate using a mold having a pattern, acquire inspection information of a substrate on which a pattern of the imprint material is formed; acquire imprint information including shot region information and order information of the imprint process when forming the pattern of the mold on the shot regions on the substrate; divide inspection information of a plurality of substrates into region-by-region inspection information based on a region division rule for dividing the region of the substrate into a plurality of regions according to the imprint information; specify a generation region of a formation defect and characteristics of temporal change from the plurality of region-by-region inspection information, and estimate one or more generation mechanisms from the specified characteristics of temporal change; A control method of an information processing apparatus, characterized by the above.

19. An imprint apparatus, characterized by having the information processing apparatus according to any one of Claims 1 to 17.

20. A pattern forming step of forming a concavo-convex pattern on the substrate using the imprint apparatus according to Claim 19; A processing step of processing the substrate on which the pattern is formed in the pattern forming step; A step of manufacturing an article from the substrate processed in the processing step; A method for manufacturing an article, characterized by including the above.

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