Semiconductor module

Abstract

To provide a semiconductor module that utilizes a molded package, allows external terminals to be freely laid out, and also allows the adoption of special terminal shapes.SOLUTION: A semiconductor module includes a molded package in which a semiconductor chip is sealed with a transfer molding resin, and a package assembly attached to a package terminal protruding from the side surface of the molded package, and the package assembly includes a printed circuit board that is physically and electrically connected to the package terminal, and an external terminal that is mounted on the printed circuit board and electrically connected to the package terminal.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a semiconductor module, and more particularly, to a semiconductor module in which external terminals can be freely laid out.

Background Art

[0002] As a sealing technology for power semiconductor chips due to its high reliability and high heat resistance, a technology of a mold type package using a thermosetting resin such as an epoxy resin generally used in the manufacture of integrated circuits (ICs) is used.

[0003] As a general manufacturing process, a circuit pattern or the like is formed on a metal plate material such as copper (Cu) and a Cu alloy, circuit elements are connected to the circuit pattern, and then a lead frame punched by pressing or the like is sandwiched between upper and lower mold dies constituting a mold die, a transfer molding resin is injected into a cavity in the mold die, and the package is formed by heating and applying pressure to cause a curing reaction.

[0004] Therefore, external terminals connected to a higher-level system such as a control system are prismatic and are formed by protruding from the side surface of the package and bending upward or downward. Therefore, it is difficult for a mold type package to cope with a mounting method of press-fitting into a through hole of a printed circuit board (PCB) such as a system using press-fit terminals widely adopted in a general-purpose case type power module as disclosed in FIG. 8(a) of Non-Patent Document 1.

Prior Art Documents

Non-Patent Documents

[0005]

Non-Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In a conventional mold-type package, since it is molded by a mold die, the external terminals protrude from the side surface of the package due to the structure, and the terminal shape is also a prismatic shape, and it has a shape bent upward or downward. Therefore, there has been a problem that it is impossible to freely layout the external terminals or adopt a special terminal shape such as press fit.

[0007] The present disclosure has been made to solve the above problems, and an object thereof is to provide a semiconductor module that can freely layout external terminals and adopt a special terminal shape while using a mold-type package.

Means for Solving the Problems

[0008] The semiconductor module according to the present disclosure includes a mold-type package in which a semiconductor chip is sealed with a transfer molding resin, and a package assembly attached to package terminals protruding from the package side surface of the mold-type package. The package assembly has a printed circuit board physically and electrically connected to the package terminals, and external terminals mounted on the printed circuit board and electrically connected to the package terminals.

Effects of the Invention

[0009] According to the semiconductor module according to the present disclosure, it is possible to obtain a semiconductor module that can freely layout external terminals and adopt a special terminal shape while using a mold-type package.

Brief Description of the Drawings

[0010]

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Embodiments for Carrying Out the Invention

[0011] <First> In the following description, the drawings are schematically shown, and the mutual relationships of the sizes and positions of the images respectively shown in different drawings are not necessarily accurately described and can be appropriately changed. Also, in the following description, the same reference numerals are given to the same components for illustration, and their names and functions are also the same. Therefore, detailed descriptions thereof may be omitted.

[0012] Also, in the following description, terms meaning specific positions and directions such as "upper", "lower", "side", "front", and "back" may be used, but these terms are used for convenience to facilitate understanding of the content of the embodiment and have no relation to the direction in actual implementation.

[0013] <Embodiment 1> FIG. 1 is a side view showing the configuration of a semiconductor package 1 which is a general mold type package, and package terminals 2 project from the side surface of the package and are bent upward.

[0014] FIG. 2 is a side view showing the configuration of the semiconductor module 100 of Embodiment 1 according to the present disclosure. As shown in FIG. 2, in the semiconductor module 100, a package assembly 101 is attached to the semiconductor package 1. The package assembly 101 includes a PCB 3 attached to the package terminals 2 of the semiconductor package 1, a plurality of terminal blocks 4 mounted on the PCB 3, and press-fit terminals 5 as external terminals connected to each of the terminal blocks 4.

[0015] The package assembly 101 has the package terminals 2 of the semiconductor package 1 inserted into through holes (not shown) of the PCB 3 and is physically and electrically connected to a circuit pattern (not shown) provided on the surface of the PCB 3. Each terminal block 4 mounts a plurality of press-fit terminals 5 as external terminals, and the plurality of press-fit terminals 5 are electrically connected to the circuit pattern. Thus, even the package terminals 2 protruding from the side surface of the semiconductor package 1 can be effectively and inexpensively electrically connected to the press-fit terminals. Therefore, even when a system higher than the semiconductor module 100 is compatible with the press-fit terminals, the semiconductor module 100 can be connected.

[0016] Also, the terminals that can be mounted on the PCB 3 are not limited to press-fit terminals and can also be compatible with terminals such as cylindrical terminals, spring terminals, and connectors. Therefore, even when a system higher than the semiconductor module 100 is compatible with terminals other than press-fit terminals, the semiconductor module 100 can be connected.

[0017] Also, in the PCB 3 shown in FIG. 2, the terminal block 4 is provided inside the position where the package terminal 2 is inserted and protrudes, and the plurality of press-fit terminals 5 can be freely laid out without being affected by the arrangement position of the package terminal 2.

[0018] Also, in the PCB 3 of the semiconductor module 100A shown in FIG. 3, the terminal block 4 is provided outside the position where the package terminal 2 is inserted and protrudes. Therefore, even when the semiconductor package 1 is small, by utilizing the package assembly 101, the degree of freedom is increased, and by providing a margin in the terminal pitch, the layout of the circuit pattern becomes easier, so that it becomes possible to cope even in industrial fields restricted by the higher-level system. Therefore, it becomes possible to use the semiconductor modules 100 and 100A also in industrial equipment using a general-purpose case-type power module as disclosed in FIG. 8(a) of Non-Patent Document 1.

[0019] In addition, by designing the terminal positions of the semiconductor package 1 according to the upper-level system, it is no longer necessary to increase the size of the semiconductor package 1. Therefore, the material cost of the semiconductor package 1 can be suppressed, and the productivity can also be improved.

[0020] <Embodiment 2> FIG. 4 is a side view showing the configuration of the semiconductor module 200 according to Embodiment 2 of the present disclosure. As shown in FIG. 4, in the semiconductor module 200, a package assembly 201 is attached to the semiconductor package 1. The package assembly 201 is enhanced in functionality by mounting electronic components 6 such as capacitors and resistors on the PCB 3, is attached to the package terminals 2, and is fixed to the semiconductor package 1 with an adhesive 7 or the like.

[0021] Therefore, the rigidity of the PCB 3 can be increased, deformation due to heat and external stress can be suppressed, the insertion and extraction characteristics required for the press-fit terminals 5 can be improved, and the reliability of the mounted electronic components 6 can be enhanced.

[0022] In addition, a recess 8 is provided on the upper surface of the semiconductor package 1 facing the PCB 3. The PCB 3 is a double-sided mounting substrate with electronic components 6 mounted on the upper and lower surfaces. The package body is configured to be able to accommodate the electronic components 6 on the lower surface in the recess 8 when the PCB 3 is mounted.

[0023] Therefore, when the semiconductor package 1 is small, by using the double-sided mounting PCB 3, the electronic components 6 can be efficiently laid out, and the whole including the package assembly 201 can be made smaller than when using the single-sided mounting PCB 3. In addition, since circuit formation can be performed by the PCB 3, the components of existing products can be aggregated, and the product can be made smaller more effectively.

[0024] <Modification Example> FIG. 5 is a perspective view showing the configuration of the semiconductor module 200A according to the modified example of Embodiment 2 of the present disclosure, and FIG. 6 is a side view of the semiconductor module 200A viewed from the long side. As shown in FIGS. 5 and 6, in the semiconductor module 200A, it is the same as the semiconductor module 200 in that electronic components 6 such as capacitors and resistors are mounted on the PCB 3, but a plurality of semiconductor packages 1 are mounted on the base plate 10, and the base plate 10 and the PCB 3 are connected via a plurality of fixing bases 12 provided on the base plate 10, thereby enhancing the rigidity of the PCB 3.

[0025] The fixing base 12 and the PCB 3 are coupled by fixing screws 11 passing through the PCB 3. Each package terminal 2 of the semiconductor package 1 is inserted into a through hole (not shown) of the PCB 3 and is physically and electrically connected to a circuit pattern (not shown) provided on the surface of the PCB 3, and the tip protrudes from the surface of the PCB 3. In addition, in FIG. 5, a plurality of terminal boards 9 are also provided, but the description thereof is omitted.

[0026] By mounting a plurality of semiconductor packages 1 on the base plate 10 and connecting them via the PCB 3, the terminal positions of the individual semiconductor packages 1 are not affected by the mounting accuracy of the individual semiconductor packages 1, and common signals can be connected within the PCB 3 to aggregate the terminal boards 9.

[0027] In addition, in FIGS. 5 and 6, a configuration in which a plurality of semiconductor packages 1 are mounted on the base plate 10 is shown, but it is also possible to adopt a configuration in which the semiconductor packages 1 are not mounted on the base plate 10 and only the respective package terminals 2 are mounted on the PCB 3.

[0028] <Embodiment 3> FIG. 7 is a side view showing the configuration of the semiconductor module 300 according to Embodiment 3 of the present disclosure. As shown in FIG. 7, in the semiconductor module 300, a package assembly 301 is attached to the surface-mount type semiconductor package 13. The package assembly 301 has mounting terminals 15 of the semiconductor package 13 physically and electrically connected, such as by soldering, to a circuit pattern (not shown) on the lower surface of the bottom-mounted type PCB 3. The configuration of the other PCB 3 is the same as the PCB 3 shown in FIG. 1.

[0029] Note that although the bottom-mounted type PCB 3 is shown in FIG. 7, the top-mounted type PCB 3 can also be used. FIG. 8 is a side view showing the configuration of the semiconductor module 300A. As shown in FIG. 8, in the semiconductor module 300A, the surface-mount type semiconductor package 13 is mounted on a package assembly 302. The package assembly 302 has mounting terminals 15 of the semiconductor package 13 physically and electrically connected, such as by soldering, to a circuit pattern (not shown) on the upper surface of the top-mounted type PCB 3.

[0030] Also, as shown in FIG. 9, a double-sided mounting type PCB 3 can also be used, and surface-mount type semiconductor packages 13 and 14 can be attached to the upper surface and the lower surface of the double-sided mounting type PCB 3, respectively. The semiconductor package 14 is, for example, a reverse-vent semiconductor package. By mounting the semiconductor packages 13 and 14, a parallel circuit can be formed, and it becomes possible to increase the power capacity of the semiconductor device in a small space.

[0031] Also, the shape of the PCB 3 substrate can be deformed according to the product, and when the semiconductor package 1A is small, a PCB 3 substrate provided with U-shaped notches on two opposing sides of the PCB 3 substrate can be used.

[0032] FIG. 10 is a perspective view showing a PCB 16 provided with U-shaped cutouts 161 on two opposite sides, and FIG. 11 is a side view showing a state where a PCB 16 with a semiconductor package 13 mounted on its lower surface is mounted on a heat sink 10a, and the heat sink 10a and the PCB 16 are coupled by fixing screws 11. The fixing screws 11 couple the heat sink 10a and the PCB 16 through the cutouts 161 of the PCB 16. By coupling both of them with the fixing screws 11, the coupling between the semiconductor package 13 and the heat sink 10a can be efficiently performed.

[0033] <Embodiment 4> FIG. 12 is a side view showing the configuration of a semiconductor module 400 according to Embodiment 4 of the present disclosure. As shown in FIG. 12, in the semiconductor module 400, a package assembly 401 is attached to a surface-mount type semiconductor package 13. The package assembly 401 has mounting terminals 15 of the semiconductor package 13 physically and electrically connected, such as by soldering, to a circuit pattern (not shown) on the lower surface of a bottom-mount type PCB 3, and the terminal portion is sealed with a resin 17 such as a direct potting (DP) resin or an underfill material.

[0034] The direct potting resin is a resin used when resin-sealing a power semiconductor chip, and for example, an epoxy resin can be used.

[0035] The underfill material is an epoxy resin containing fine fillers having a low viscosity and a particle size of about several μm, and enters narrow gaps by capillary action and contributes to insulation and fixing between components when cured.

[0036] In this way, by sealing the terminal portion with a DP resin or an underfill material, it is possible to ensure the creepage distance between the terminals of the semiconductor package 13 and ensure space insulation. In addition, it is possible to prevent adhesion of dust and the like to the terminals and improve reliability.

[0037] <Embodiment 5> FIG. 13 is a side view showing the configuration of the semiconductor module 500 according to Embodiment 5 of the present disclosure. As shown in FIG. 13, in the semiconductor module 500, a package assembly 501 is attached to a surface-mount type semiconductor package 13. The package assembly 501 has mounting terminals 15 of the semiconductor package 13 physically and electrically connected, such as by soldering, to a circuit pattern (not shown) on the lower surface of the bottom surface mount type PCB 3, and a case-shaped guide 18 is provided to accommodate the semiconductor package 13. Inside the guide 18, a resin 17 such as a DP resin or an underfill material is sealed, and the semiconductor package 13 including the terminal portions is resin-sealed.

[0038] Thus, even when the creepage distance cannot be ensured by miniaturizing the package, insulation between the terminals can be guaranteed by the resin 17.

[0039] That is, in a molded package, since a voltage close to the breakdown voltage is applied between the main electrodes, it is necessary to take a creepage distance between the terminals and with respect to the substrate on which it is mounted. However, by covering with a DP resin or the like, the creepage surface can be eliminated. Therefore, even when the molded package is made smaller as a whole and the distance between the terminals is narrowed to such an extent that the creepage distance cannot be ensured in the semiconductor package alone, insulation between the terminals can be maintained by covering with a DP resin or the like.

[0040] <Embodiment 6> FIG. 14 is a side view showing the configuration of the semiconductor module 600 according to Embodiment 6 of the present disclosure. As shown in FIG. 14, in the semiconductor module 600, a package assembly 601 is attached to a surface-mount type non-insulated semiconductor package 19.

[0041] The non-insulated semiconductor package 19 is, for example, a package in which conductor members such as a die pad for mounting a semiconductor chip and a heat sink are directly exposed on the back surface of the package, and the back surface has conductor members such as Cu exposed, and can be joined to the substrate with a soldering material, silver (Ag), or Cu sinter for electrical conduction.

[0042] In FIG. 14, for the non-insulated semiconductor package 19, its back surface is joined to the Cu pattern 20 provided on the upper surface of the DBC (Direct Bonded Copper) substrate DB that functions as an insulating substrate via a bonding material 22 such as a solder material, Ag, or Cu sinter. The DBC substrate DB is composed of a ceramic substrate 21 that functions as an insulating layer, a Cu pattern 20 provided on the upper surface of the ceramic substrate 21, and a heat spreader 23 on which the ceramic substrate 21 is mounted. The Cu pattern 20 is provided such that it is electrically separated into a portion to which the non-insulated semiconductor package 19 is joined and a portion to which the mounting terminals 15 are physically and electrically connected by soldering or the like.

[0043] In the package assembly 601, a conductor member (not shown) exposed on the back surface of the non-insulated semiconductor package 19 is physically and electrically connected to the Cu pattern 20 on the upper surface of the DBC substrate DB by soldering or the like, and a case-shaped guide 18 is provided to accommodate the non-insulated semiconductor package 19. Inside the guide 18, a resin 17 such as a DP resin or an underfill material is sealed, and the non-insulated semiconductor package 19 including the terminal portion is resin-sealed.

[0044] Thereby, even when the creepage distance cannot be ensured by miniaturizing the package, the insulation between the terminals can be guaranteed by the resin 17.

[0045] As the package assembly applied to the non-insulated semiconductor package 19, a package assembly 602 as shown in FIG. 15 can also be adopted. In FIG. 15, for the non-insulated semiconductor package 19, its back surface is joined to the Cu pattern 20 provided on the upper surface of the DBC substrate DB1 via a bonding material 22. The DBC substrate DB1 is composed of a ceramic substrate 21 and Cu patterns 20 provided on the upper and lower surfaces of the ceramic substrate 21. The Cu pattern 20 on the upper surface is provided such that it is electrically separated into a portion to which the non-insulated semiconductor package 19 is joined and a portion to which the mounting terminals 15 are physically and electrically connected by soldering or the like.

[0046] The package assembly 602 has a conductor member (not shown) exposed on the back surface of the non-insulated semiconductor package 19 physically and electrically connected, such as by soldering, to the Cu pattern 20 on the upper surface of the DBC substrate DB1, and a case-shaped guide 18 is provided to accommodate the non-insulated semiconductor package 19. Resin 17 is encapsulated inside the guide 18, and the non-insulated semiconductor package 19 including the terminal portion is resin-encapsulated.

[0047] <Embodiment 7> FIG. 16 is a side view showing the configuration of a semiconductor module 700 according to Embodiment 7 of the present disclosure. As shown in FIG. 16, in the semiconductor module 700, a package assembly 701 is attached to a surface-mount type semiconductor package 13. The package assembly 701 has the back surface of the semiconductor package 13 joined to the upper surface of the heat spreader 23 of the DBC substrate DB2 via a heat-dissipating bonding material 24 such as a highly heat-dissipating adhesive resin or an adhesive sheet, and a case-shaped guide 18 is provided to accommodate the semiconductor package 13. Resin 17 such as DP resin or an underfill material is encapsulated inside the guide 18, and the non-insulated semiconductor package 19 including the terminal portion is resin-encapsulated.

[0048] Thus, even when the creepage distance cannot be ensured by miniaturizing the package, insulation between terminals can be guaranteed by the resin 17.

[0049] The DBC substrate DB2 is composed of a ceramic substrate 21 that functions as an insulating layer, a Cu pattern 20 provided on the upper surface of the ceramic substrate 21, and a heat spreader 23. The ceramic substrate 21 is provided at a position corresponding to the lower part of the Cu pattern 20 to which the mounting terminals 15 are physically and electrically connected, such as by soldering.

[0050] <Embodiment 8> FIG. 17 is a side view showing the configuration of the semiconductor module 800 according to Embodiment 8 of the present disclosure. As shown in FIG. 17, in the semiconductor module 800, the main current terminal 26 of the semiconductor package 25 for high current is attached to the PCB 3. Note that the package terminal 2 of the semiconductor package 25 is also attached to the PCB 3, but the illustration is omitted.

[0051] The package assembly 801 includes a PCB 3, a plurality of terminal blocks 4 mounted on the PCB 3, press-fit terminals 5 connected to each of the terminal blocks 4, an upper main terminal electrode 27 provided on the upper surface of the PCB 3, a lower main terminal electrode 28 provided on the lower surface of the PCB 3, and internal board wiring 29. The upper main terminal electrode 27 and the lower main terminal electrode 28 are electrically connected to each other via the internal board wiring 29.

[0052] The main current terminal 26 protruding from the side surface of the semiconductor package 25 is physically and electrically connected to the lower main terminal electrode 28 by soldering or the like.

[0053] FIG. 18 is a perspective view showing a configuration example of the semiconductor package 25. As shown in FIG. 18, the main current terminal 26 and the package terminal 2 protrude from the opposing side surfaces of the semiconductor package 25 and are bent so as to be parallel to the side surface of the package. The main current terminal 26 is further bent in a direction perpendicular to the side surface of the package.

[0054] FIG. 19 is a perspective view showing the configuration of the semiconductor module 800. As shown in FIG. 19, in the semiconductor module 800, electronic components 6 such as capacitors and resistors are mounted on the PCB 3, a plurality of semiconductor packages 25 (not shown) are mounted on the base plate 10, and the base plate 10 and the PCB 3 are connected via a plurality of fixing bases 12 provided on the base plate 10, thereby enhancing the rigidity of the PCB 3. The fixing base 12 and the PCB 3 are coupled by fixing screws 11 that penetrate the PCB 3. Each package terminal 2 of the semiconductor package 25 is inserted into a through hole (not shown) of the PCB 3 and is physically and electrically connected to a circuit pattern (not shown) provided on the surface of the PCB 3, and the tip protrudes from the surface of the PCB 3.

[0055] On the upper surface of the PCB 3, a plurality of upper surface main terminal electrodes 27 are arranged along two long sides of the PCB 3 at positions outside the press-fit terminals 5. Note that the functions of the plurality of upper surface main terminal electrodes 27 arranged along one long side and the plurality of upper surface main terminal electrodes 27 arranged along the other long side are different, but since the relationship with the present disclosure is weak, the description thereof is omitted.

[0056] The plurality of upper surface main terminal electrodes 27 provided on the upper surface of the PCB 3 can be freely laid out, and can be connected to the upper system without changing the terminal arrangement of the semiconductor package 25 according to the upper system of the semiconductor module 800.

[0057] <Modification Example> FIG. 20 is a side view showing the configuration of a semiconductor module 800A which is a modification of Embodiment 8 according to the present disclosure, and only the PCB 3 is shown in a cross-sectional view. As shown in FIG. 20, in the semiconductor module 800A, the package assembly 802 includes the PCB 3, a plurality of terminal blocks 4 mounted on the PCB 3, press-fit terminals 5 connected to each of the terminal blocks 4, upper surface main terminal electrodes 27 and 27a provided on the upper surface of the PCB 3, lower surface main terminal electrodes 28 and 28a provided on the lower surface of the PCB 3, and in-board wirings 29 and 29a. The upper surface main terminal electrode 27 and the lower surface main terminal electrode 28 are electrically connected to each other via the in-board wiring 29, and the upper surface main terminal electrode 27a and the lower surface main terminal electrode 28a are electrically connected to each other via the in-board wiring 29a. The upper surface main terminal electrode 27 and the lower surface main terminal electrode 28 are arranged on opposite sides with the semiconductor package 25 interposed therebetween, and the upper surface main terminal electrode 27a and the lower surface main terminal electrode 28a are arranged on opposite sides with the semiconductor package 25 interposed therebetween. For this reason, the directions of the currents flowing through the in-board wirings 29 and 29a are opposite to each other. In FIG. 20, a configuration is shown in which the main current terminals 26 protrude from two side surfaces of one semiconductor package 25, but it is also possible to arrange two semiconductor packages 25 such that the main current terminals 26 protrude from one side surface of each in opposite directions.

[0058] The main current terminal 26 protruding from one side surface of the semiconductor package 25 is physically and electrically connected to the lower surface main terminal electrode 28 by soldering or the like, and the main current terminal 26 protruding from the other side surface of the semiconductor package 25 is physically and electrically connected to the lower surface main terminal electrode 28a by soldering or the like.

[0059] The in-board wirings 29 and 29a are laminated and arranged so as to be parallel plates within the substrate, and since the directions of the currents flowing through them are opposite to each other, it is possible to reduce inductance and noise.

[0060] Note that within the scope of the present disclosure, each embodiment can be freely combined, or each embodiment can be appropriately modified or omitted.

[0061] The present disclosure described above is collectively described as an appendix.

[0062] (Appendix 1) A semiconductor module comprising: a molded package in which a semiconductor chip is encapsulated with a transfer molding resin; and a package assembly attached to package terminals protruding from a package side surface of the molded package, the package assembly including a printed circuit board physically and electrically connected to the package terminals, and external terminals mounted on the printed circuit board and electrically connected to the package terminals.

[0063] (Appendix 2) The semiconductor module according to Appendix 1, wherein the external terminals are mounted at a position closer to the center of the molded package than the package side surface.

[0064] (Appendix 3) The semiconductor module according to Appendix 1, wherein the external terminals are mounted at a position farther from the center of the molded package than the package side surface.

[0065] (Appendix 4) The semiconductor module according to Appendix 1, wherein the printed circuit board is adhered to a surface of the molded package.

[0066] (Appendix 5) The semiconductor module according to Appendix 1, wherein electronic components are mounted on the printed circuit board.

[0067] (Appendix 6) The semiconductor module according to Appendix 5, wherein the electronic components are mounted on both sides of the substrate. ​

[0068] (Appendix 7) The mold-type package is a plurality of mold-type packages, The printed circuit board is, The semiconductor module according to Appendix 1, which is physically and electrically connected to each of the package terminals of the plurality of mold-type packages.

[0069] (Appendix 8) The mold-type package is, The semiconductor module according to Appendix 1, which is a surface-mounted mold-type package.

[0070] (Appendix 9) The printed circuit board is, The semiconductor module according to Appendix 8, in which the surface-mounted mold-type package is mounted on both sides of the substrate.

[0071] (Appendix 10) The surface-mounted mold-type package is, The semiconductor module according to Appendix 8, in which the package terminals are sealed with resin.

[0072] (Appendix 11) The package assembly is, Further having a case-shaped guide for accommodating the surface-mounted mold-type package, The semiconductor module according to Appendix 8, in which resin is sealed in the guide to seal the surface-mounted mold-type package including the package terminals.

[0073] (Appendix 12) The printed circuit board is, A first main terminal electrode provided on the first surface of the printed circuit board, which protrudes from the package side surface of the surface-mounted mold-type package and is physically and electrically connected to a main current terminal through which a main current flows, A second main terminal electrode provided on a second surface of the printed circuit board opposite to the first surface, provided inside the printed circuit board, The semiconductor module according to appended claim 8, further comprising internal wiring on the substrate that electrically connects the first main terminal electrode and the second main terminal electrode.

[0074] (Appended claim 13) The internal wiring on the substrate The semiconductor module according to appended claim 12, wherein the internal wiring on the substrate is laminated and arranged to be parallel to other internal wiring on the substrate inside the printed circuit board.

[0075] (Appended claim 14) A molded package in which a semiconductor chip is encapsulated with transfer molding resin, and a package assembly attached to package terminals protruding from the side surface of the molded package, wherein the molded package is a non-insulated semiconductor package in which a conductor member mounting the semiconductor chip is exposed from the surface, and the package assembly includes an insulating substrate to which the conductor member of the non-insulated semiconductor package is physically and electrically connected, and external terminals mounted on the insulating substrate and electrically connected to the package terminals. A semiconductor module having the same.

[0076] (Appended claim 15) A molded package in which a semiconductor chip is encapsulated with transfer molding resin, and a package assembly attached to package terminals protruding from the side surface of the molded package, wherein the package assembly includes an insulating substrate physically connected to the surface of the molded package, and external terminals mounted on the insulating substrate and electrically connected to the package terminals. A semiconductor module having the same.

Description of reference numerals

[0077] 1, 13, 19 Molded package, 2, 15 Package terminal, 3 PCB, 5 Press-fit terminal, 18 Guide, 27 Upper surface main terminal electrode, 28 Lower surface main terminal electrode, 29 Inner wiring of substrate, DB, DB1, D2 DBC substrate.

Claims

1. A molded package in which a semiconductor chip is encapsulated with a transfer molding resin, and a package assembly attached to package terminals protruding from the package side surface of the molded package, comprising: The package assembly is a printed circuit board physically and electrically connected to the package terminals, and an external terminal mounted on the printed circuit board and electrically connected to the package terminals. A semiconductor module.

2. The external terminal is mounted at a position closer to the center of the molded package than the package side surface. The semiconductor module according to claim 1.

3. The external terminal is mounted at a position farther from the center of the molded package than the package side surface. The semiconductor module according to claim 1.

4. The printed circuit board is adhered to the surface of the molded package. The semiconductor module according to claim 1.

5. The printed circuit board has electronic components mounted thereon. The semiconductor module according to claim 1.

6. The printed circuit board is mounted with the electronic components on both sides of the board. The semiconductor module according to claim 5.

7. The molded package is a plurality of molded packages, and the printed circuit board is physically and electrically connected to the respective package terminals of the plurality of molded packages. The semiconductor module according to claim 1.

8. The molded package is a surface mount type molded package. The semiconductor module according to claim 1.

9. The printed circuit board is mounted with the surface mount type molded packages on both sides of the board. The semiconductor module according to claim 8.

10. The surface mount type molded package is sealed with resin at the package terminals. The semiconductor module according to claim 8.

11. The package assembly further includes a case-shaped guide for housing the surface mount type molded package, and resin is sealed in the guide to seal the surface mount type molded package including the package terminals. The semiconductor module according to claim 8.

12. The printed circuit board is A first main terminal electrode provided on a first surface of the printed circuit board, which protrudes from the package side surface of the surface-mounted molded package and is physically and electrically connected to a main current terminal through which a main current flows. A second main terminal electrode provided on a second surface of the printed circuit board opposite to the first surface. It is provided inside the printed circuit board. The semiconductor module according to claim 8, further comprising an in-board wiring provided inside the printed circuit board for electrically connecting the first main terminal electrode and the second main terminal electrode.

13. The in-board wiring The semiconductor module according to claim 12, wherein the in-board wiring is laminated and arranged inside the printed circuit board so as to form a parallel plate with other in-board wirings.

14. A molded package in which a semiconductor chip is encapsulated with a transfer molding resin, and A package assembly attached to a package terminal protruding from the package side surface of the molded package, The molded package Is a non-insulated semiconductor package in which a conductor member for mounting the semiconductor chip is exposed from the surface, The package assembly An insulating substrate to which the conductor member of the non-insulated semiconductor package is physically and electrically connected, and An external terminal mounted on the insulating substrate and electrically connected to the package terminal.

15. A molded package in which a semiconductor chip is encapsulated with a transfer molding resin, and A package assembly attached to a package terminal protruding from the package side surface of the molded package, The package assembly An insulating substrate to which the surface of the molded package is physically connected, and An external terminal mounted on the insulating substrate and electrically connected to the package terminal.

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