Semiconductor processing device and polishing device

Abstract

To provide a semiconductor processing device capable of preventing fatigue damage caused by vibration of an attached member (second member).SOLUTION: A semiconductor processing device according to the present disclosure includes a first rod-shaped member, a first member to which the first rod-shaped member is fixed, a second member having a first hole formed therein, and a first elastic member, and the first rod-shaped member is inserted into the first hole, and the first elastic member is positioned inside the first hole so as to surround the outer peripheral surface of the first rod-shaped member.SELECTED DRAWING: Figure 6B

Description

Technical Field

[0001] The present invention relates to a semiconductor processing apparatus and a polishing apparatus.

Background Art

[0002] A polishing apparatus is used to polish a semiconductor substrate. An example of such a polishing apparatus is disclosed in Patent Document 1. The polishing unit (polishing apparatus) disclosed in Patent Document 1 includes a top ring that holds a wafer, a rotary joint, and a fluid pipe connected to the rotary joint, as shown in FIG. 5 thereof. And a part of the fluid supplied from the fluid pipe is supplied to the top ring via the rotary joint.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, the rotary joint can vibrate violently due to the rotation of the shaft. For this reason, the fixing of the fluid pipe connected to the rotary joint may become loose, and there is a risk that liquid may leak from the fluid pipe. And in order to prevent the scattering of the liquid leaked from the fluid pipe, a cover may be attached to the polishing unit. When such a cover is firmly screwed to the frame of the polishing unit, the cover may receive repeated stress due to the vibration of the rotary joint and may be fatigue-damaged in a relatively short period. In particular, such a problem may often occur when the cover is made of a resin material.

[0005] In addition, since the members attached near the vibration source are also subjected to repeated stress due to vibration, there is a risk that members other than the cover may also experience fatigue failure in a relatively short period of time.

[0006] Therefore, one of the objectives of the present disclosure is to provide a semiconductor processing apparatus and a polishing apparatus that can suppress fatigue failure of the attached member (second member) due to vibration.

Means for Solving the Problems

[0007] The semiconductor processing apparatus according to the present disclosure is a semiconductor processing apparatus, comprising a first rod-shaped member, a first member to which the first rod-shaped member is fixed, a second member in which a first hole is formed, and a first elastic member. The first rod-shaped member is inserted into the first hole, and the first elastic member is disposed so as to surround the outer peripheral surface of the first rod-shaped member inside the first hole.

[0008] The polishing apparatus according to the present disclosure is a polishing apparatus, which is the semiconductor processing apparatus according to claim 1 or 2, and comprises a polishing table configured to be attachable with a polishing pad for polishing a substrate, and a top ring for holding the substrate and polishing the substrate while pressing the substrate against the polishing pad.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6A

Figure 6B

Figure 6C

Figure 6D

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and duplicate explanations are omitted.

[0011] <Substrate processing apparatus 100> FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus 100 according to an embodiment of the present invention. The substrate processing apparatus 100 is an apparatus for performing processing on a semiconductor substrate W. The semiconductor substrate W includes wafers such as silicon wafers, glass wafers, and quartz wafers. As shown in FIG. 1, the substrate processing apparatus 100 includes a load / unload module 102, a polishing module 103, and a cleaning module 104. Further, the substrate processing apparatus 100 includes a control unit 105 that controls the substrate processing operation. In the present disclosure, an apparatus that performs some processing on a semiconductor substrate W is included in the semiconductor processing apparatus. That is, the substrate processing apparatus 100 and the polishing apparatus 200 described later are included in the semiconductor processing apparatus.

[0012] <Load / unload module 102> The load / unload module 102 includes four front load portions 120 on which a wafer cassette 124 capable of storing a large number of substrates W is placed. These front load portions 120 are arranged along the width direction (a direction perpendicular to the longitudinal direction) of the substrate processing apparatus 100. The front load portion 120 is configured to be able to mount an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). Further, the load / unload module 102 includes two transfer robots 122 that are movable on a rail 121 laid along the arrangement of the front load portions 120. The transfer robot 122 accesses the wafer cassette 124 mounted on the front load portion 120 by moving on the rail 121 and transfers the substrate W.

[0013] <Polishing module 103> The polishing module 103 has a function of polishing (planarizing) the substrate W. The polishing module 103 includes a first polishing apparatus (CMP apparatus: Chemical Mechanical Polishing apparatus) 200A, a second polishing apparatus 200B, a third polishing apparatus 200C, and a fourth polishing apparatus 200D. The first polishing apparatus 200A, the second polishing apparatus 200B, the third polishing apparatus 200C, and the fourth polishing apparatus 200D are arranged along the longitudinal direction of the substrate processing apparatus 100.

[0014] Referring to FIG. 1, as an example, the first polishing apparatus 200A includes a polishing table 230, a top ring 231, a polishing liquid supply nozzle 232, a dresser 233, and an atomizer 234. A polishing pad 210 having a polishing surface is attached to the polishing table 230. The top ring 231 has a function of polishing the substrate W by pressing the substrate W held thereon against the polishing pad 210 on the polishing table 230. The polishing liquid supply nozzle 232 is configured to supply a polishing liquid and a dressing liquid (e.g., pure water) to the polishing pad 210. The dresser 233 has a function of dressing the polishing surface of the polishing pad 210. The atomizer 234 has a function of spraying a mixed fluid of a liquid (e.g., pure water) and a gas (e.g., nitrogen gas) or a liquid (e.g., pure water) in a mist form onto the polishing surface. For example, it has a function of spraying a mixed fluid of a liquid (e.g., pure water) and a gas (e.g., nitrogen gas) or a liquid (e.g., pure water) in a mist form onto the polishing surface.

[0015] The first polishing apparatus 200A, the second polishing apparatus 200B, the third polishing apparatus 200C, and the fourth polishing apparatus 200D have the same configuration as each other. Therefore, the descriptions of the second polishing apparatus 200B, the third polishing apparatus 200C, and the fourth polishing apparatus 200D are omitted. Also, in the present disclosure, the first polishing apparatus 200A, the second polishing apparatus 200B, the third polishing apparatus 200C, and the fourth polishing apparatus 200D may be referred to as the polishing apparatus 200. The detailed configuration of the polishing apparatus 200 will be described later.

[0016] Next, a transport mechanism for transporting the substrate W will be described. The substrate processing apparatus 100 includes, as a transport mechanism, a lifter 111, a first linear transporter 106, a swing transporter 112, a second linear transporter 107, and a temporary placement table 180.

[0017] The lifter 111 receives the substrate W from the transfer robot 122 and passes the substrate W to the first linear transporter 106. The first linear transporter 106 transports the substrate W received from the lifter 111 among the first transfer position TP1, the second transfer position TP2, the third transfer position TP3, and the fourth transfer position TP4. The first polishing device 200A and the second polishing device 200B receive the substrate W from the first linear transporter 106 and polish it. After polishing, the first polishing device 200A and the second polishing device 200B pass the substrate W to the first linear transporter 106.

[0018] The swing transporter 112 transfers the substrate W between the first linear transporter 106 and the second linear transporter 107. The second linear transporter 107 transports the substrate W received from the swing transporter 112 among the fifth transfer position TP5, the sixth transfer position TP6, and the seventh transfer position TP7. The third polishing device 200C and the fourth polishing device 200D receive the substrate W from the second linear transporter 107 and polish it. The third polishing device 200C and the fourth polishing device 200D pass the polished substrate W to the second linear transporter 107. The substrate W polished by the polishing module 103 is placed on the temporary table 180 by the swing transporter 112 and passed to the cleaning module 104.

[0019] <Cleaning module 104> The cleaning module 104 has the function of performing a cleaning process and a drying process on the substrate W polished by the polishing module 103. The cleaning module 104 includes a first cleaning chamber 190, a first transfer chamber 191, a second cleaning chamber 192, a second transfer chamber 193, and a drying chamber 194.

[0020] The substrate W that has been polished by the polishing module 103 is transported to the first cleaning chamber 190 via the first transfer chamber 191 and cleaned. Thereafter, the substrate W is transported to the second cleaning chamber 192 via the first transfer chamber 191 and cleaned again. Then, the substrate W that has been cleaned in the first cleaning chamber 190 and the second cleaning chamber 192 is transported to the drying chamber 194 via the second transfer chamber 193. The substrate W is dried in the drying chamber 194. The dried substrate W is taken out from the drying chamber 194 by the transfer robot 122 and transported to the wafer cassette 124 of the front load unit 120.

[0021] <Polishing apparatus 200> Next, with reference to FIG. 2, a more detailed configuration of the polishing apparatus 200 will be described. FIG. 2 is a perspective view schematically showing the polishing apparatus 200. Referring to FIG. 2, the top ring 231 is supported by a top ring shaft (an example of a shaft) 236. The upper surface of the polishing table 230 has a polishing pad 210 attached thereto. The upper surface of the polishing pad 210 constitutes a polishing surface for polishing the substrate W. The top ring 231 and the polishing table 230 are configured to rotate around their axial centers as indicated by the arrows. The substrate W is held by vacuum suction on the lower surface of the top ring 231. During polishing, polishing liquid is supplied from the polishing liquid supply nozzle 232 to the polishing surface of the polishing pad 210, and the substrate W to be polished is pressed against the polishing surface by the top ring 231 and polished.

[0022] FIG. 3 is a cross-sectional view schematically showing the support structure of the top ring 231 of the polishing apparatus 200. Referring to FIG. 3, the polishing apparatus 200 further includes, as an example, a top ring head 260, a pulley 261, a pulley 262, a belt 263, and a motor M1. The top ring head 260 rotatably supports a top ring shaft 236. Further, the top ring shaft 236 is connected to the rotating shaft of the motor M1 via the pulley 261, the pulley 262, and the belt 263. Therefore, when the motor M1 rotates, the top ring shaft 236 and the top ring 231 rotate around their axis. The motor M1 is attached to the upper part of the top ring head 260.

[0023] Furthermore, the polishing apparatus 200 includes a top ring base (an example of a base) 265. The polishing apparatus 200 includes a driving device (not shown) inside the top ring base 265 for moving the top ring 231 and the top ring shaft 236 up and down. The driving device is not particularly limited, and may have a mechanism having a ball screw and a servo motor, an air cylinder, or the like for moving the top ring 231 and the top ring shaft 236 up and down.

[0024] Furthermore, the polishing apparatus 200 includes a support shaft 267, a bearing 272, and a motor M2. The top ring head 260 is rotatably supported by the support shaft 267 via the bearing 272. The support shaft 267 is a fixed shaft and does not rotate. A motor M2 is fixed to the top ring head 260. The rotating shaft of the motor M2 is connected to the support shaft 267 via a rotation transmission mechanism (not shown) such as a gear. Therefore, when the motor M2 rotates, the top ring head 260 operates to swing around the support shaft 267. Then, due to the swinging movement of the top ring head 260, the top ring 231 can move between a polishing position above the polishing table 230 and a conveyance position beside the polishing table 230.

[0025] Furthermore, the polishing apparatus 200 includes a rotary joint 269, a pressure adjustment device 275, a plurality of pipes 270, a fixing member 400, and a rotation prevention member 280.

[0026] <Fixing member 400> FIG. 4 is a perspective view around the rotary joint 269, where the pipes 270 are omitted here. FIG. 5 is a perspective view with the rotary joint 269 omitted from FIG. 4. FIGS. 6A to 6D are cross-sectional views of part A when viewed in the DA direction of FIG. 5, part B when viewed in the DB direction, part C when viewed in the DC direction, and part D when viewed in the DD direction, respectively. Referring to FIGS. 4 and 5, the fixing member 400 has, as an example, a thin plate-shaped frame 410 that extends in the vertical direction. The lower end of the frame 410 is fixed to the top ring base 265 (see FIG. 3). Also, a rotation prevention member 280 is fixed to the upper end of the frame 410 by two fastening members 282 (see FIG. 5).

[0027] <Rotation prevention member 280> Referring to FIGS. 4 and 5, the rotation prevention member 280 includes, as an example, a thin plate-shaped plate member 284 and a U-shaped buffer member 286 and extends in the horizontal direction. A U-shaped notch 288 is formed in the plate member 284. And the rotary joint 269 is positioned so as to fit into the notch 288 (see FIG. 4). Thereby, the rotation of the rotary joint 269 is restricted. That is, the rotation prevention member 280 supports the rotary joint 269 so as not to be rotatable. Also, the buffer member 286 is attached to the portion of the notch 288 so as to be positioned between the rotary joint 269 and the plate member 284. The buffer member 286 is, as an example, rubber. Also, the buffer member 286 may be resin (such as PVC, POM, etc.) as an example. Thereby, the vibration transmitted from the rotary joint 269 to the plate member 284 is reduced.

[0028] <Plurality of pipes 270> The plurality of pipes 270 fluidly connect the pressure regulating device 275 and the rotary joint 269 (see Fig. 3).

[0029] <Rotary joint 269> The rotary joint 269 is located above the top ring base 265 and rotatably supports the top ring shaft 236 about a vertical rotation axis X (see Fig. 3). The rotary joint 269 has a function of supplying the fluid supplied from the plurality of pipes 270 to a plurality of pressure chambers (not shown) inside the top ring 231 through a through hole (not shown) inside the top ring shaft 236. For this reason, each of the pressure chambers inside the top ring 231 is in fluid communication with the pressure regulating device 275 via the through hole inside the top ring shaft 236, the rotary joint 269, and the pipe 270. Thereby, by the pressure regulating device 275 supplying fluid to the pressure chamber, the inside of the pressure chamber can be pressurized or depressurized. And the polishing device 200 can adjust the pressing force for each region of the surface of the substrate W during polishing of the substrate W by adjusting the pressure inside the plurality of pressure chambers.

[0030] Also, when the top ring shaft 236 rotates, a seal member (not shown) of the rotary joint 269 may slide and generate heat. If the seal member generates heat, the seal member may expand and have an adverse effect on the sealing performance. For this reason, a liquid (cooling water) for cooling the seal member is supplied to the rotary joint 269 via the pipe 270. As a result, the seal member of the rotary joint 269 is cooled. Also, water (quenching water) used as lubrication for the sliding of the seal member is also supplied to the rotary joint 269 via the pipe 270.

[0031] Referring to FIG. 4 here, the rotary joint 269 has a connection port 271 on its side to which the pipe 270 is connected. By the way, the rotary joint 269 may vibrate due to the rotation of the top ring shaft 236. Due to the vibration of the rotary joint 269, the fixing of the pipe 270 to the connection port 271 may become loose, and there is a risk that liquid may leak from the gap between the pipe 270 and the connection port 271. Also, due to the vibration, the pipe 270 and the connection port 271 may be damaged, and there is a risk that liquid may leak from the damaged part. Furthermore, if the seal member of the rotary joint 269 deteriorates, there is a risk that cooling water or quench water may leak.

[0032] On the other hand, a drain hole 266 for flowing liquid to the drain pipe 268 is formed on the upper surface of the top ring base 265 (see FIG. 5). Thereby, the polishing apparatus 200 can discharge the liquid that has flowed down to the top ring base 265 from the drain hole 266.

[0033] In the present disclosure, a member that generates vibration is included in the vibration source. And the rotary joint 269 generates vibration when the internal seal member slides during the rotation of the top ring shaft 236. For this reason, the rotary joint 269 is included in the vibration source. Also, in the present disclosure, the vibration source may include, as an example, a member that vibrates at a vibration frequency of 0.1 Hz or more, 1 Hz or more, or 10 Hz or more.

[0034] Also, as described above, since the rotary joint 269 vibrates, there is a risk that the liquid leaked from the gap between the pipe 270 and the connection port 271 or the liquid leaked from the rotary joint 269 itself due to seal deterioration inside the rotary joint 269 may scatter due to the vibration before being discharged from the drain hole 266. In order to suppress such scattering of the liquid, the polishing apparatus 200 includes a cover assembly 300 (see FIG. 3).

[0035] <Cover assembly 300> Hereinafter, with reference to FIGS. 3 to 7, a more detailed configuration of the cover assembly 300 will be described. FIG. 7 is a perspective view of the cover assembly 300.

[0036] The cover assembly 300 is, for example, located above the top ring base 265 and attached to the fixing member 400 (see FIG. 3). Referring to FIG. 7, the cover assembly 300 includes a first cover (an example of a second member) 320 having a main body 324 and a second cover (an example of a third member) 360 having a main body 364. In the cover assembly 300, as an example, the main body 324 of the first cover 320 and the main body 364 of the second cover 360 are separate members. However, in another embodiment according to the present disclosure, the main body 324 of the first cover 320 and the main body 364 of the second cover 360 may be integrally formed.

[0037] The main body 324 of the first cover 320 is, for example, a resin member made of a resin such as polyvinyl chloride (PVC). Also, the main body 324 has, as an example, a thin plate-shaped first wall 326, a thin plate-shaped second wall 328, a thin plate-shaped third wall (an example of a wall) 330, a thin plate-shaped first curved wall 332, and a thin plate-shaped second curved wall 334. The second wall 328 extends in a direction orthogonal to the first wall 326. The third wall 330 extends parallel to the first wall 326. Also, the first curved wall 332 connects the first wall 326 and the second wall 328. The second curved wall 334 connects the second wall 328 and the third wall 330. Further, the first wall 326 has a thick plate portion 338 that is thicker than other portions of the main body 324. The plate thickness of the thick plate portion 338 is, for example, 7 mm. On the other hand, the plate thickness of the portion of the first wall 326 other than the thick plate portion 338 is, for example, 3 mm. Also, the plate thicknesses of the second wall 328, the third wall 330, the first curved wall 332, and the second curved wall 334 are, for example, 3 mm. Furthermore, in the first cover 320, the first wall 326, the second wall 328, the third wall 330, the first curved wall 332, and the second curved wall 334 are integrally formed.

[0038] Further, the lower end of the first cover 320 is located below the connection port 271 (see FIG. 4). Also, a recess 273 is formed on the upper surface of the top ring base 265. And at least a part of the first cover 320 fits into the recess 273 of the top ring base 265 (see FIG. 4). Further, the first cover 320 surrounds at least a part around the rotation axis X (see FIG. 4). Thereby, the first cover 320 can suppress the scattering of the liquid accumulated on the upper surface of the top ring base 265 due to vibration. In other words, the first cover 320 can suppress the scattering of the liquid leaked from the connection port 271 of the rotary joint 296 or the rotary joint 269 itself.

[0039] Also, the upper end of the first cover 320 is located below the connection port 271. In another embodiment according to the present disclosure, the upper end of the first cover 320 may be located at the same height as the connection port 271, or may be located above the connection port 271.

[0040] On the other hand, the main body 364 of the second cover 360 is, for example, a resin member made of a resin such as polyvinyl chloride (PVC). Also, the main body 364 has, for example, a thin plate-like first wall 366, a thin plate-like second wall 368, a thin plate-like third wall (an example of a wall) 370, a thin plate-like first curved wall 372, and a thin plate-like second curved wall 374. The second wall 368 extends in a direction orthogonal to the first wall 366. The third wall 370 extends parallel to the first wall 366. Also, the first curved wall 372 connects the first wall 366 and the second wall 368. The second curved wall 374 connects the second wall 368 and the third wall 370. Also, the first wall 366 has a thick plate portion 378 that is thicker than other portions of the main body 364. The plate thickness of the thick plate portion 378 is, for example, 7 mm. On the other hand, the plate thickness of the portion of the first wall 326 other than the thick plate portion 378 is, for example, 3 mm. Also, the plate thicknesses of the second wall 368, the third wall 370, the first curved wall 372, and the second curved wall 374 are, for example, 3 mm. Further, in the second cover 360, the first wall 366, the second wall 368, the third wall 370, the first curved wall 372, and the second curved wall 374 are integrally formed.

[0041] Further, the lower end of the second cover 360 is located below the connection port 271 (see FIG. 4). And at least a part of the second cover 360 is fitted into the recess 273 of the top ring base 265 (see FIG. 4). Further, the second cover 360 surrounds at least a part around the rotation axis X (see FIG. 4). Thereby, the second cover 360 can suppress the scattering of the liquid accumulated on the upper surface of the top ring base 265 due to vibration. In other words, the second cover 360 can suppress the scattering of the liquid leaked from the connection port 271 of the rotary joint 296 or the rotary joint 269 itself.

[0042] Also, the upper end of the second cover 360 is located below the connection port 271. In another embodiment according to the present disclosure, the upper end of the second cover 360 may be located at the same height as the connection port 271, or may be located above the connection port 271.

[0043] Also, the first cover 320, the second cover 360, and the plate nut 420 described later are integrated and surround the entire circumference around the rotation axis X.

[0044] Also, as shown in FIG. 7, the third wall 330 of the first cover 320 has an end face 336. On the other hand, the third wall 370 of the second cover 360 has an opposing end face 376 that contacts or faces the end face 336 with a minute gap. That is, the end face 336 and the opposing end face 376 extend parallel to each other. And the end face 336 extends at an angle with respect to the thickness direction of the third wall 330 of the first cover 320. On the other hand, the opposing end face 376 extends at an angle with respect to the thickness direction of the third wall 370 of the second cover 360. Thereby, it is difficult to form a space that leads to the inside and outside of the wall in the thickness direction at the joint between the end face 336 and the opposing end face 376. As a result, it is difficult for the liquid to scatter from the joint between the first cover 320 and the second cover 360.

[0045] Next, the attachment structure of the first cover 320 to the fixing member 400 will be described. Referring to FIGS. 6A and 6B, as an example, the polishing apparatus 200 includes a first rod-shaped member 510, a first elastic member 520, a second rod-shaped member 530, and a second elastic member 540. Further, the fixing member 400 has a frame 410 and a plate-shaped plate nut 420.

[0046] The first rod-shaped member 510 is, for example, a bolt and has a head 512, a male screw portion 514 connected to the head 512, and a cylindrical portion 516 connected to the male screw portion 514. The male screw portion 514 is threaded. The cylindrical portion 516 is not threaded. The outer diameter of the cylindrical portion 516 is, for example, 3.1 mm. The first rod-shaped member 510 passes through a through hole 412 formed in the frame 410, and the male screw portion 514 is fixed to the female screw portion 422 of the plate nut 420. In this way, the first rod-shaped member 510 is fixed to the fixing member 400. In another embodiment according to the present disclosure, the first rod-shaped member 510 may be fixed to the frame 410 by a hexagonal nut or the like instead of the plate nut 420. Also, the plate nut 420 may be omitted and the through hole 412 may be internally threaded.

[0047] On the other hand, the second rod-shaped member 530 is, for example, a bolt and has a head 532, a male screw portion 534 connected to the head 532, and a cylindrical portion 536 connected to the male screw portion 534. The male screw portion 534 is threaded. The cylindrical portion 536 is not threaded. The outer diameter of the cylindrical portion 536 is, for example, 3.1 mm. The second rod-shaped member 530 passes through a through hole 414 formed in the frame 410, and the male screw portion 534 is fixed to the female screw portion 424 of the plate nut 420. In this way, the second rod-shaped member 530 is fixed to the fixing member 400. In another embodiment according to the present disclosure, the second rod-shaped member 530 may be fixed to the frame 410 by a hexagonal nut or the like instead of the plate nut 420. Also, the plate nut 420 may be omitted and the through hole 414 may be internally threaded. Further, the second rod-shaped member 530 extends parallel to the first rod-shaped member 510.

[0048] Also, as shown in FIG. 6B, a first hole 340 and a second hole 342 are formed in the thick plate portion 338 of the first cover 320. A first rod-shaped member 510 is inserted into the first hole 340. The first elastic member 520 is composed of a member such as rubber that is softer than the main body 324, for example. The hardness of the first elastic member 520 is, for example, A70 or less in Shore A durometer hardness. More specifically, the first elastic member 520 is, for example, an O-ring of P-3. Also, the first elastic member 520 is arranged so as to surround the outer peripheral surface of the first rod-shaped member 510 inside the first hole 340, for example. More specifically, a groove 344 is formed in the first hole 340, and the first elastic member 520 is fitted into the groove 344. And the first elastic member 520 holds the cylindrical portion 516 of the first rod-shaped member 510. That is, the inner diameter of the first elastic member 520 is smaller than the outer diameter of the cylindrical portion 516 of the first rod-shaped member 510. On the other hand, a second rod-shaped member 530 is inserted into the second hole 342. The second elastic member 540 is composed of a member such as rubber that is softer than the main body 324, for example. The hardness of the second elastic member 540 is, for example, A70 or less in Shore A durometer hardness. More specifically, the second elastic member 540 is, for example, an O-ring of P-3. Also, the second elastic member 540 is arranged so as to surround the outer peripheral surface of the second rod-shaped member 530 inside the second hole 342, for example. More specifically, a groove 346 is formed in the second hole 342, and the second elastic member 540 is fitted into the groove 346. And the second elastic member 540 holds the cylindrical portion 536 of the second rod-shaped member 530. That is, the inner diameter of the second elastic member 540 is smaller than the outer diameter of the cylindrical portion 536 of the second rod-shaped member 530.

[0049] Incidentally, as described above, the rotation stopper member 280 fixed to the fixing member 400 supports the rotary joint 269 which is a vibration source (see FIG. 3). Therefore, the fixing member 400 is configured such that the vibration of the rotary joint 269 is transmitted and it vibrates. Incidentally, as an example, the fixing member 400 is configured to vibrate at a vibration frequency of 40 Hz or more. Therefore, when the cover is firmly screwed to the fixing member 400, the cover may be subjected to repeated stress due to the vibration of the fixing member 400 and may be fatigue-damaged in a relatively short period. In particular, such a problem may frequently occur when the cover is made of a resin material.

[0050] On the other hand, in the polishing apparatus 200, the first cover 320 is supported by the fixing member 400 by being supported by the first rod-shaped member 510 via the first elastic member 520 and being supported by the second rod-shaped member 530 via the second elastic member 540. That is, the first cover 320 is not fixed to the fixing member 400 by screws. Therefore, the repeated stress acting on the first cover 320 is reduced by the first elastic member 520 and the second elastic member 540. As a result, the polishing apparatus 200 can suppress the fatigue failure of the first cover 320 attached to the fixing member 400 due to the repeated stress. In the present disclosure, "member A is fixed to member B by screws" means that member A is fixed to member B by rotating a fastening member having screws and tightening the fastening member having screws.

[0051] As described above, in the polishing apparatus 200, the first elastic member 520 is fitted into the groove 344 and However, the polishing apparatus 200 does not necessarily have such a configuration. FIG. 8 is a perspective view showing a first rod-shaped member 510 according to another embodiment of the present disclosure. As shown in FIG. 8, the first elastic member 520 may be fixed to the first rod-shaped member 510. More specifically, the first elastic member 520 may be fixed to the first rod-shaped member 510 by being joined to the first rod-shaped member 510 by adhesion, press-fitting, caulking, or the like. Similarly, the second elastic member 540 may be fixed to the second rod-shaped member 530 by being joined to the second rod-shaped member 530 by adhesion, press-fitting, caulking, or the like.

[0052] Further, when the first cover 320 is supported only by the first rod-shaped member 510, the first cover 320 may rotate about the first rod-shaped member 510. That is, the position of the first cover 320 is not determined. On the other hand, in the polishing apparatus 200, the first cover 320 is supported by the first rod-shaped member 510 and the second rod-shaped member 530. Therefore, the first cover 320 does not rotate about the first rod-shaped member 510. In other words, in the polishing apparatus 200, the position of the first cover 320 is determined.

[0053] Referring to FIG. 6B, the first rod-shaped member 510 and the second rod-shaped member 530 extend in the horizontal direction. Further, the second rod-shaped member 530 is located vertically below the first rod-shaped member 510. As a result, the vertical bending stress received by the first hole 340 from the first rod-shaped member 510 and the vertical bending stress received by the second hole 342 from the second rod-shaped member 530 are reduced compared to the case where the first rod-shaped member 510 and the second rod-shaped member 530 are arranged side by side in the horizontal direction. As a result, in the polishing apparatus 200, the portions of the first hole 340 and the second hole 342 of the first cover 320 are less likely to be damaged.

[0054] Next, the attachment structure of the second cover 360 to the fixing member 400 will be described. Referring to FIGS. 6A and 6C, as an example, the polishing apparatus 200 includes a first rod-shaped member 610, a first elastic member 620, a second rod-shaped member 630, and a second elastic member 640.

[0055] The first rod-shaped member 610 is, for example, a bolt and has a head 612, a male threaded portion 614 connected to the head 612, and a cylindrical portion 616 connected to the male threaded portion 614. The male threaded portion 614 is threaded. The cylindrical portion 616 is not threaded. The outer diameter of the cylindrical portion 616 is, for example, 3.1 mm. The first rod-shaped member 610 passes through a through hole 416 formed in the frame 410, and the male threaded portion 614 is fixed to the female threaded portion 426 of the plate nut 420. In this way, the first rod-shaped member 610 is fixed to the fixing member 400. In another embodiment according to the present disclosure, the first rod-shaped member 610 may be fixed to the frame 410 by a hexagonal nut or the like instead of the plate nut 420. Also, the plate nut 420 may be omitted, and the through hole 416 may be internally threaded.

[0056] On the other hand, the second rod-shaped member 630 is, for example, a bolt and has a head 632, a male threaded portion 634 connected to the head 632, and a cylindrical portion 636 connected to the male threaded portion 634. The male threaded portion 634 is threaded. The cylindrical portion 636 is not threaded. The outer diameter of the cylindrical portion 636 is, for example, 3.1 mm. The second rod-shaped member 630 passes through a through hole 418 formed in the frame 410, and the male threaded portion 634 is fixed to the female threaded portion 428 of the plate nut 420. In this way, the second rod-shaped member 630 is fixed to the fixing member 400. In another embodiment according to the present disclosure, the second rod-shaped member 630 may be fixed to the frame 410 by a hexagonal nut or the like instead of the plate nut 420. Also, the plate nut 420 may be omitted, and the through hole 418 may be internally threaded. Also, the second rod-shaped member 630 extends parallel to the first rod-shaped member 610.

[0057] Also, as shown in FIG. 6C, a first hole 380 and a second hole 382 are formed in the thick plate portion 378 of the second cover 360. Then, the first rod-shaped member 610 is inserted into the first hole 380 It is inserted. The first elastic member 620 is composed of a member such as rubber that is softer than the main body 364 as an example. The hardness of the first elastic member 620 is, for example, A70 or less in terms of type A durometer hardness. More specifically, the first elastic member 620 is, for example, an O-ring of P-3. Also, the first elastic member 620 is arranged so as to surround the outer peripheral surface of the first rod-shaped member 610 inside the first hole 380 as an example. More specifically, a groove 384 is formed in the first hole 380, and the first elastic member 620 is fitted into the groove 384. And the first elastic member 620 holds the cylindrical portion 616 of the first rod-shaped member 610. That is, the inner diameter of the first elastic member 620 is smaller than the outer diameter of the cylindrical portion 616 of the first rod-shaped member 610. On the other hand, the second rod-shaped member 630 is inserted into the second hole 382. The second elastic member 640 is composed of a member such as rubber that is softer than the main body 364 as an example. The hardness of the second elastic member 640 is, for example, A70 or less in terms of type A durometer hardness. More specifically, the second elastic member 640 is, for example, an O-ring of P-3. Also, the second elastic member 640 is arranged so as to surround the outer peripheral surface of the second rod-shaped member 630 inside the second hole 382 as an example. More specifically, a groove 386 is formed in the second hole 382, and the second elastic member 640 is fitted into the groove 386. And the second elastic member 640 holds the cylindrical portion 636 of the second rod-shaped member 630. That is, the inner diameter of the second elastic member 640 is smaller than the outer diameter of the cylindrical portion 636 of the second rod-shaped member 630.

[0058] Also, in the polishing apparatus 200, the second cover 360 is supported by the fixing member 400 by being supported by the first rod-shaped member 610 via the first elastic member 620 and being supported by the second rod-shaped member 630 via the second elastic member 640. That is, the second cover 360 is not fixed to the fixing member 400 by screws.

[0059] Also, referring to FIG. 6C, the first rod-shaped member 610 and the second rod-shaped member 630 extend in the horizontal direction. Further, the second rod-shaped member 630 is located vertically below the first rod-shaped member 610.

[0060] Next, referring to FIG. 6D, the top ring base 265 includes, as an example, a wall 264. The first cover 320 includes, as an example, a first cushion member 348 and a second cushion member 350. The first cushion member 348 and the second cushion member 350 are, as an example, foam materials and are configured to include polyvinyl chloride. In another embodiment according to the present disclosure, the first cushion member 348 and the second cushion member 350 may be materials softer than the main body 324 of the first cover 320. The first cushion member 348 and the second cushion member 350 are, as an example, attached to the main body 324. The wall 264 is configured to restrict the movement of the first cover 320 in the first direction D1 by contacting the first cushion member 348 of the first cover 320. The first direction D1 is the direction in which the first rod-shaped member 510 extends and the direction in which the first cover 320 moves away from the fixing member 400. Therefore, it is difficult for the first rod-shaped member 510 to come out of the first hole 340, and it is difficult for the second rod-shaped member 530 to come out of the second hole 342. As a result, the first cover 320 is difficult to fall off.

[0061] Also, the first cushion member 348 is configured to contact the wall 264 and push the main body 324 in the second direction D2 opposite to the first direction D1. On the other hand, the second cushion member 350 is located between the main body 324 and the frame 410 of the fixing member 400 and is configured to push the main body 324 in the first direction D1. Thereby, the first cushion member 348 and the second cushion member 350 reduce the repeated stress applied to the main body 324 of the first cover 320 due to vibration in the first direction D1 and the second direction D2. As a result, in the polishing apparatus 200, the main body 324 of the first cover 320 is difficult to be damaged.

[0062] Note that the second cover 360 may also include a first cushion member 348 and a second cushion member 350 so as to correspond to the first cover 320.

[0063] Further, the first cover 320 includes, as an example, two lower cushion members 352 (see FIG. 6D). The lower cushion member 352 is, as an example, a foam material and is configured to include polyvinyl chloride. In another embodiment according to the present disclosure, the lower cushion member 352 may be a material softer than the main body 324 of the first cover 320. The lower cushion member 352 is, as an example, attached to the lower surface of the main body 324. Further, the lower cushion member 352 is configured to contact the top ring base 265 and support the main body 324 from below. Thereby, in the polishing apparatus 220, the stress for supporting the first cover 320 related to the first hole 340 and the second hole 342 of the first cover 320 is reduced. As a result, breakage of the main body 324 is suppressed.

[0064] Note that the second cover 360 may also include a lower cushion member 352 so as to correspond to the first cover 320.

[0065] As described above, the present disclosure has illustrated the attachment structure of the first cover 320 and the second cover 360 to the fixing member 400, but the present disclosure is not limited only to the attachment structure of the first cover 320 and the second cover 360 to the fixing member 400. The attachment structure of the present disclosure is applicable to any member. In particular, the attachment structure of the present disclosure is effective when another member is attached to a member configured to vibrate.

[0066] [Appendix] Some or all of the above embodiments may be described as follows in the appendix, but are not limited thereto.

[0067] (Appendix 1) The semiconductor processing apparatus according to Appendix 1 is a semiconductor processing apparatus, including a first rod-shaped member, a first member to which the first rod-shaped member is fixed, a second member in which a first hole is formed, and a first elastic member. The first rod-shaped member is inserted into the first hole, and the first elastic member is disposed so as to surround the outer peripheral surface of the first rod-shaped member inside the first hole.

[0068] (Effect) The semiconductor processing apparatus according to Supplementary Note 1 can suppress fatigue failure of the second member attached to the first member due to repeated stress.

[0069] (Supplementary Note 2) The semiconductor processing apparatus according to Supplementary Note 2 is the semiconductor processing apparatus according to Supplementary Note 1, wherein the second member is not fixed to the first member by a screw.

[0070] (Supplementary Note 3) The semiconductor processing apparatus according to Supplementary Note 3 is the semiconductor processing apparatus according to Supplementary Note 1 or 2, further comprising a vibration source for vibrating the first member.

[0071] (Supplementary Note 4) The semiconductor processing apparatus according to Supplementary Note 4 is the semiconductor processing apparatus according to any one of Supplementary Notes 1 to 3, comprising a second rod-shaped member fixed to the first member and extending in parallel with the first rod-shaped member, and a second elastic member, wherein a second hole is formed in the second member, the second rod-shaped member is inserted into the second hole, and the second elastic member is arranged so as to surround an outer peripheral surface of the second rod-shaped member inside the second hole.

[0072] In the semiconductor processing apparatus according to Supplementary Note 4, the position of the second member is determined.

[0073] (Supplementary Note 5) The semiconductor processing apparatus according to Supplementary Note 5 is the semiconductor processing apparatus according to any one of Supplementary Notes 1 to 4, wherein the first rod-shaped member and the second rod-shaped member extend in a horizontal direction, and the second rod-shaped member is located vertically below the first rod-shaped member.

[0074] According to the semiconductor processing apparatus according to Supplementary Note 5, the bending stress received by the first hole from the first rod-shaped member and the bending stress received by the second hole from the second rod-shaped member are reduced as compared with the case where the first hole and the second hole are arranged side by side in the horizontal direction.

[0075] (Supplementary Note 6) The semiconductor processing apparatus according to Supplementary Note 6 is the semiconductor processing apparatus according to any one of Supplementary Notes 1 to 5, and includes a wall for restricting the movement of the second member in a first direction which is the direction in which the first rod-shaped member extends and the second member moves away from the first member by contacting the second member.

[0076] In the semiconductor processing apparatus according to Supplementary Note 6, the first rod-shaped member is difficult to come out of the first hole.

[0077] (Supplementary Note 7) The semiconductor processing apparatus according to Supplementary Note 7 is the semiconductor processing apparatus according to Supplementary Note 6, and the second member includes a main body, a first cushion member that contacts the wall and pushes the main body in a second direction opposite to the first direction, and a second cushion member that is located between the main body and the first member and pushes the main body in the first direction.

[0078] In the semiconductor processing apparatus according to Supplementary Note 7, the main body of the second member is difficult to be damaged.

[0079] (Supplementary Note 8) The semiconductor processing apparatus according to Supplementary Note 8 is the semiconductor processing apparatus according to any one of Supplementary Notes 1 to 7, and includes a base located below the second member. The second member includes a main body and a lower cushion member that contacts the base and supports the main body from below.

[0080] The semiconductor processing apparatus according to Supplementary Note 8 can reduce the stress applied to the first hole of the second member and can prevent the main body from being damaged.

[0081] (Supplementary Note 9) The semiconductor processing apparatus according to Supplementary Note 9 is the semiconductor processing apparatus according to Supplementary Note 8, and a drain hole for flowing liquid to a drain pipe is formed in the base.

[0082] The semiconductor processing apparatus according to Supplementary Note 9 can discharge the liquid flowing down to the base from the drain hole.

[0083] (Supplementary Note 10) The semiconductor processing apparatus according to Additional Note 10 is the semiconductor processing apparatus described in Additional Note 3, wherein the vibration source is a rotary joint, the rotary joint has a connection port to which a pipe is connected on a side surface thereof, and supports a shaft configured to be rotatable about a rotation axis extending in the vertical direction, the lower end of the second member is located below the connection port, and the second member is a cover that surrounds at least a part of the periphery of the rotation axis.

[0084] According to the semiconductor processing apparatus according to Additional Note 11, the second member, which is a cover, can suppress the scattering of liquid leaking from the connection port of the rotary joint or the rotary joint itself.

[0085] (Additional Note 11) The semiconductor processing apparatus according to Additional Note 11 is the semiconductor processing apparatus described in Additional Note 10, and includes a third member, the lower end of the third member is located below the connection port, the third member is a cover that surrounds at least a part of the periphery of the rotation axis, the second member has a wall having an end face, the third member has a wall having an opposing end face that contacts or faces the end face with a minute gap, and the end face and the opposing end face extend at an angle with respect to the thickness direction of the wall of the second member and the thickness direction of the wall of the third member.

[0086] According to the semiconductor processing apparatus according to Additional Note 11, it is difficult for liquid to scatter from the joint between the second member and the third member.

[0087] (Additional Note 12) The semiconductor processing apparatus according to Additional Note 12 is the semiconductor processing apparatus described in Additional Note 10 or 11, and further includes a locking member that is fixed to the first member and supports the rotary joint in a non-rotatable manner.

[0088] (Additional Note 13) The semiconductor processing apparatus according to Additional Note 13 is the semiconductor processing apparatus described in any one of Additional Notes 1 to 12, and the second member includes a resin member.

[0089] (Additional Note 14) The semiconductor processing apparatus according to Supplementary Note 14 is the semiconductor processing apparatus described in any one of Supplementary Notes 1 to 13, wherein the first rod-shaped member is a bolt, the first elastic member is an O-ring, and the first member includes a frame and a plate nut for fixing the first rod-shaped member to the frame.

[0090] (Supplementary Note 15) The polishing apparatus according to Supplementary Note 15 is a polishing apparatus, wherein the polishing apparatus is the semiconductor processing apparatus described in any one of Supplementary Notes 1 to 14, and includes a polishing table configured to be attachable with a polishing pad for polishing a substrate, and a top ring for holding the substrate and polishing the substrate while pressing the substrate against the polishing pad.

[0091] The polishing apparatus according to Supplementary Note 15 has the same effect as the semiconductor processing apparatus according to Supplementary Note 1. That is, this polishing apparatus can suppress fatigue failure due to repeated stress of the second member attached to the first member.

[0092] As described above, the embodiments of the present invention and the respective modified examples thereof have been described. Needless to say, each of the above-described examples is for facilitating the understanding of the present invention and does not limit the present invention. The present invention can be appropriately changed and improved without departing from its gist, and equivalents thereof are included in the present invention. Also, within the range where at least a part of the above-described problems can be solved, or at least a part of the effects can be achieved, any combination or omission of the respective components described in the claims and the specification is possible.

Explanation of Reference Numerals

[0093] 100: Substrate processing apparatus (semiconductor processing apparatus) 200: Polishing apparatus (semiconductor processing apparatus) 210: Polishing pad 230: Polishing table 231: Top ring 236: Top ring shaft (shaft) 265: Top ring base (base) 266: Drain hole 268: Drain pipe 269: Rotary joint 270: Pipe 271: Connection port 280: Anti-rotation member 300: Cover assembly 320: First cover (second member) 324: Body 330: Third wall (wall) 336: End face 340: First hole 342: Second hole 348: First cushion member 350: Second cushion member 352: Lower cushion member 360: Second cover (third member) 364: Body 370: Third wall (wall) 376: Opposite end face 400: Fixed member (first member) 410: Frame 420: Plate nut 510: First rod-shaped member 520: First elastic member 530: Second rod-shaped member 540: Second elastic member D1: First direction D2: Second direction X: Rotation axis W: Substrate

Claims

1. A semiconductor processing apparatus, a first rod-shaped member, a first member to which the first rod-shaped member is fixed, a second member in which a first hole is formed, and a first elastic member, wherein the first rod-shaped member is inserted into the first hole, and the first elastic member is disposed so as to surround an outer peripheral surface of the first rod-shaped member inside the first hole. A semiconductor processing apparatus.

2. The semiconductor processing apparatus according to claim 1, wherein the second member is not fixed to the first member by a screw. A semiconductor processing apparatus.

3. The semiconductor processing apparatus according to claim 1 or 2, further comprising a vibration source for vibrating the first member. A semiconductor processing apparatus.

4. The semiconductor processing apparatus according to claim 1 or 2, comprising a second rod-shaped member fixed to the first member and extending parallel to the first rod-shaped member, and a second elastic member, wherein a second hole is formed in the second member, the second rod-shaped member is inserted into the second hole, and the second elastic member is disposed so as to surround an outer peripheral surface of the second rod-shaped member inside the second hole. A semiconductor processing apparatus.

5. The semiconductor processing apparatus according to claim 4, wherein the first rod-shaped member and the second rod-shaped member extend in a horizontal direction, and the second rod-shaped member is located vertically below the first rod-shaped member. A semiconductor processing apparatus.

6. The semiconductor processing apparatus according to claim 1 or 2, comprising a wall for restricting movement of the second member in a first direction which is a direction in which the first rod-shaped member extends and in which the second member moves away from the first member by contacting the second member. A semiconductor processing apparatus.

7. The semiconductor processing apparatus according to claim 6, wherein the second member has a main body, a first cushioning member that contacts the wall and pushes the main body in a second direction opposite to the first direction, and a second cushioning member that is located between the main body and the first member and pushes the main body in the first direction. A semiconductor processing apparatus.

8. The semiconductor processing apparatus according to claim 1 or 2, comprising a base located below the second member, wherein the second member has a main body, and a lower cushioning member that contacts the base and supports the main body from below. A semiconductor processing apparatus.

9. The semiconductor processing apparatus according to claim 8, wherein... A semiconductor processing apparatus.

9. The semiconductor processing apparatus according to claim 8, The base is formed with drain holes for flowing liquid into a drain pipe. Semiconductor processing apparatus.

10. The semiconductor processing apparatus according to claim 3, wherein the vibration source is a rotary joint, the rotary joint has a connection port to which a pipe is connected on a side surface, and supports a shaft configured to be rotatable about a rotation axis extending in the vertical direction, a lower end of the second member is located below the connection port, the second member is a cover surrounding at least a part around the rotation axis, Semiconductor processing apparatus.

11. The semiconductor processing apparatus according to claim 10, comprising a third member, a lower end of the third member is located below the connection port, the third member is a cover surrounding at least a part around the rotation axis, the second member has a wall having an end face, the third member has a wall having an opposing end face that contacts or faces with a minute gap to the end face, the end face extends at an angle with respect to the thickness direction of the wall of the second member, the opposing end face extends at an angle with respect to the thickness direction of the wall of the third member, Semiconductor processing apparatus.

12. The semiconductor processing apparatus according to claim 10 or 11, further comprising a detent member fixed to the first member for non-rotatably supporting the rotary joint, Semiconductor processing apparatus.

13. The semiconductor processing apparatus according to claim 1 or 2, wherein the second member includes a resin member, Semiconductor processing apparatus.

14. The semiconductor processing apparatus according to claim 1 or 2, wherein the first rod-shaped member is a bolt, the first elastic member is an O-ring, the first member has a frame, and a plate nut for fixing the first rod-shaped member to the frame, and Semiconductor processing apparatus.

15. A polishing apparatus, wherein the polishing apparatus is the semiconductor processing apparatus according to claim 1 or 2, and includes a polishing table configured to be attachable with a polishing pad for polishing a substrate, and a top ring for holding the substrate and polishing the substrate while pressing the substrate against the polishing pad, and Polishing apparatus.

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