Chip holding means, and pickup device and chip transport device using the same

Abstract

To provide chip holding means, and a pickup device and a chip transport device using the same, which hold chip components in a non-contact manner while suppressing stress on the chip components.SOLUTION: In chip holding means, and a pickup device and a chip transport device using the same, a surface for holding a chip component has a plurality of gas ejection holes and a plurality of gas sucking holes arranged in a position adjacent to the outer periphery of the chip component when the chip component is held, thereby enabling gas ejection and sucking to be performed simultaneously.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to chip holding means for holding chip components, a pickup device using the same, and a chip transfer device.

Background Art

[0002] When mounting chip components such as semiconductor chips on a substrate, the chip components on the dicing tape are often picked up and then transferred to directly below the bonding head of the mounting device, and the bonding head that has received the chip components adheres the chip components to the substrate for mounting.

[0003] Here, FIG. 9 shows a state of picking up chip components on a dicing tape. As shown in FIG. 9(a), initially, the chip component C is in a state where the side opposite to the surface having the electrode B is attached to the dicing tape DT. From this state, the chip component C is pushed up by the needle 4 from the dicing tape DT side (FIG. 9(b)), and then the collet 3 holds the chip component C from the electrode surface side, and by stopping the pushing up by the needle, the dicing tape DT is peeled off from the chip component C as shown in FIG. 9(c), and the pickup is completed.

[0004] By the way, when mounting a chip component on a substrate, it is well known that there are face-up mounting in which the electrode surface of the chip component and the electrode surface of the substrate are in the same direction, and face-down mounting in which the electrode surface of the chip component faces the electrode surface of the substrate.

[0005] In a normal mounting device, in many cases, the bonding head arranged above the substrate holds and mounts the chip component. When performing face-down mounting, the chip component C has its electrode surface facing downward and is held by a chip slider 5 as shown in FIG. 10 and moves directly below the bonding head.

[0006] When transferring the chip component C from the state where the collet 3 holds the chip component C from the electrode surface side as shown in Fig. 9(c) to the chip slider 5 as shown in Fig. 10, chip transfer means is used to hold the chip component C from the side opposite to the electrode surface and then invert it.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0008] In face-down mounting, the electrodes of the chip component and the electrodes of the substrate are aligned and both electrodes are connected. However, either electrode is heated and melted, and the chip component is brought into close contact with the substrate for bonding. In recent years, as semiconductor miniaturization progresses, heating during mounting of semiconductor chips causes dimensional changes in the chip components (and substrates), and even with high-precision alignment, mounting defects may occur.

[0009] Against this background, a method called hybrid mounting, which suppresses dimensional changes by lowering the temperature during mounting, has attracted attention.

[0010] The chip components used in hybrid mounting have the height of the electrode tips on the electrode surface being equal to or less than the height of the insulating portion (occupying most of the area other than the electrodes), and the insulating portions of the chip components and the substrate are also joined together. By making the insulating portions of the chip components and the substrate in a state where functional groups such as hydroxyl groups are imparted to each (hereinafter referred to as the active state), bonding is performed at a relatively low temperature.

[0011] Here, the insulating portions of the chip component and the substrate are formed of silicon oxide or the like and become active by plasma treatment or the like. However, even in the active state, if it comes into contact with other substances, the active state deteriorates and it becomes difficult to join the insulating portions together.

[0012] Therefore, when trying to apply the form of picking up and transporting the chip component C by the conventional method shown in FIGS. 9 and 10 to hybrid mounting, the electrode surface of the chip component C comes into contact with the collet 3 and the chip slider 5, and the active state deteriorates. Even if the electrode surface of the substrate is in the active state, it is difficult to join them.

[0013] Therefore, it has been considered to use non-contact holding means for picking up and transporting chip components (Patent Document 1, Patent Document 2). The configuration of the non-contact holding means 2 described in Patent Document 1 and Patent Document 2 is, as shown in FIG. 11(a), while generating buoyancy on the object to be held by the pressurized flow PF, the reduced-pressure flow VF sucks and holds the object to be held. The ejection portion of the pressurized flow PF is a plurality of holes in Cited Document 1, while it is a porous material in Cited Document 2.

[0014] In any case, while applying a pressurized flow to substantially the entire surface of the object to be held except for the outer peripheral portion of the object to be held, the outer peripheral portion of the object to be held is sucked. As a result, as shown in FIG. 11(b), the chip component as the object to be held is in a floating state, that is, it can be held non-contact. In FIG. 11(b), by balancing the pressurized flow PF and the reduced-pressure flow VF, the chip component C maintains a state of being separated from the surface of the non-contact holding means 2 by a certain distance, and since the periphery of the chip component C is pulled by the reduced-pressure flow VF, it can be prevented from sliding in the lateral direction (in-plane direction). For this reason, the non-contact holding means 2 can be used for transporting the chip component C in the state shown in FIG. 11(b), and can be used for the chip slider 5 in FIG. 10.

[0015] In addition, since the pressure flow PF and the decompression flow VF are balanced and the chip component C is being held, the chip component C is held in a non-contact manner without falling even when the non-contact holding means 2 is inverted vertically. Therefore, the non-contact holding means 2 can be used to hold the chip component C from above in the state shown in FIG. 11(c), and can be used for the collet 3 in FIG. 9.

[0016] By using the non-contact holding means 2 shown in FIG. 11, it has become possible to pick up the chip component C from the dicing tape DT without directly contacting the electrode surface of the chip component C and deliver it to the bonding head of the mounting apparatus.

[0017] However, there are chip components used for hybrid mounting that are large in area and thin, and problems may occur when holding such chip components in a non-contact manner. FIG. 12 shows an example thereof. Since the chip component C is thin and easily curved, the peripheral portion of the chip component C may be drawn toward the suction holes 210 on the outer peripheral side and come into contact with the non-contact holding means 2. When such a phenomenon occurs, not only does the active state of the chip component C at the portion in contact with the non-contact holding means 2 decrease, but it may also be damaged due to stress caused by the curvature and contact.

[0018] The present invention has been made in view of the above problems, and provides chip holding means for suppressing stress on a chip component while holding the chip component in a non-contact manner, a pickup apparatus using the same, and a chip transfer apparatus.

Means for Solving the Problems

[0019] In order to solve the above problems, the invention according to claim 1 is Chip holding means for holding a chip component, A plurality of ejection holes for ejecting gas and a plurality of suction holes for sucking gas are arranged on the surface for holding the chip component, and the ejection holes are provided at positions adjacent to the outer periphery of the chip component when holding the chip component. Chip holding means capable of simultaneously ejecting and sucking gas.

[0020] The invention according to claim 2 is the chip holding means according to claim 1, wherein the chip holding means is provided with the ejection holes near the center of the chip component.

[0021] The invention according to claim 3 is a chip holding means for holding a chip component, wherein a plurality of ejection holes for ejecting gas and a plurality of suction holes for sucking gas are arranged on the surface for holding the chip component, and the opening area of the ejection holes is larger than the opening area of the suction holes.

[0022] The invention according to claim 4 is the chip holding means according to claim 3, wherein the suction holes are openings of a porous material.

[0023] The invention according to claim 5 is a chip holding means for holding a chip component, wherein a plurality of ejection holes for ejecting gas and a plurality of suction holes for sucking gas are arranged on the surface for holding the chip component, the opening area of the ejection holes is larger than the opening area of the suction holes, the ejection holes are provided at positions adjacent to the outer periphery of the chip component, and the chip holding means is capable of simultaneously ejecting and sucking gas.

[0024] The invention according to claim 6 is the chip holding means according to any one of claims 1 to 5, wherein the chip holding means holds the electrode surface side of the chip component in a non-contact manner.

[0025] The invention according to claim 7 is a pickup device that picks up the chip component peeled from a dicing sheet using the chip holding means according to any one of claims 1 to 5. the chip holding means holds the electrode surface side of the chip component in a non-contact manner.

[0026] The invention according to claim 7 is a pickup device that picks up the chip component peeled from a dicing sheet using the chip holding means according to any one of claims 1 to 5. A chip transfer device that transfers the chip component without contacting the electrode surface of the chip component.

Advantages of the Invention

[0027] According to the present invention, even for thin and thick chip components, it is possible to hold them non - contactingly without applying large stress, and it is possible to prevent contamination of the electrode surface due to contact with other objects during pickup and transfer. Therefore, in bonding that activates the electrode surface such as hybrid bonding, it is suitable because the surface active state can be maintained.

Brief Description of the Drawings

[0028]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

[0029] Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an illustration of a chip holding means 101 according to Embodiment 1 of the present application. FIG. 1(a) is a view seen from the chip holding surface side, and FIG. 1(b) is a cross-sectional view showing a state in which the components of the chip holding means 101 are holding a chip component C. Also, the quadrangle drawn by a dotted line in FIG. 1(a) represents the outer periphery of the chip component C to be held.

[0030] ​As shown in FIG. 1(b), the chip holding means 101 has a suction hole 110 and a jet hole 120 on the chip holding surface 101S. The suction hole 110 communicates with the decompression flow path 11, and the jet hole 120 communicates with the pressurization flow path 12. Here, the decompression flow path 11 is connected to a decompression means (for example, a vacuum pump) not shown, and the air near the suction hole 110 is sucked (by the decompression flow). Further, the pressurization flow path 12 is connected to a pressurization means (for example, a compressor) not shown, and an air flow (pressurization flow) is jetted from the jet hole 120. Note that, by connecting to a high-pressure gas cylinder as the pressurization means, a gas other than air may be jetted from the jet hole.

[0031] FIGS. 1(a) and 1(b) show an arrangement example of the suction holes 110 and the jet holes 120 provided in plurality on the chip holding surface 101S. When the suction holes 110 are arranged in substantially the entire area for holding the chip component C, the arrangement positions of the jet holes 120 are limited to the positions adjacent to the outer periphery of the chip component C and the central portion of the chip component C when holding the chip component C. Here, in order to distinguish the jet hole 120 at the central portion of the chip component C from others, it is denoted as the central jet hole 120M.

[0032] As shown in FIG. 1(a), the suction holes 110 and the jet holes 120 are arranged, and the jetting and suction of air (which may include a gas other than air) are performed simultaneously, and by balancing the jetting and suction, the chip component C is held in a non-contact manner on the chip holding surface 101S. Further, the outer peripheral portion of the chip component C does not contact the chip holding surface 101S due to the air flow received from the jet hole 120. Also, since the central jet hole 120M also receives an air flow, even if the size of the chip component C is large and the thickness is small, the central portion of the chip component C does not contact the chip holding surface 101S. That is, the electrode surface of the chip component C does not contact and break the chip holding surface 101S, and if it is in an active state, that state can be maintained.

[0033] In addition, when holding the chip component C, since it is preferable to suck the entire surface uniformly, it is preferable to arrange a large number of suction holes 110 uniformly over substantially the entire surface facing the chip component C. For this reason, comparing the individual suction holes 110 with the ejection holes 120, the opening area of the ejection holes 120 is larger than that of the suction holes 110.

[0034] Thus, the chip holding means 101 can hold the chip component C in a non-contact manner. Therefore, by using the chip holding means 101 instead of the collet 3 shown in FIG. 9, a pickup device can be configured to hold and pick up the chip component C in a non-contact manner on the electrode surface as shown in FIG. 2(a). Further, by using the chip holding means 101 instead of the chip slider 5 shown in FIG. 10, a chip transfer device can be configured to hold the chip component C in a non-contact manner on the electrode surface and transfer it to directly below the bonding head (of the mounting device) as shown in FIG. 2(b). In FIGS. 2(a) and 2(b), the electrode B of the chip component C is depicted as protruding, but this is for clarifying the surface on which the electrode B exists (the same applies to FIGS. 5(a) and 5(b)).

[0035] Note that, in the first embodiment of the present invention, the arrangement example adjacent to the outer periphery of the chip component C when holding the chip component C is not limited to FIG. 1(a). For example, side ejection holes 120E may be arranged on the four sides of a quadrilateral as in the first modification of the first embodiment shown in FIG. 3(a), or a configuration may be adopted in which corner ejection holes 120C are arranged at the four corners of a quadrilateral as in the second modification of the first embodiment shown in FIG. 3(b).

[0036] Further, instead of arranging a large number of suction holes 110 uniformly, it is also possible to use a porous body, and an example thereof is shown in FIG. 4 as the chip holding means 102 according to the second embodiment of the present invention. In FIG. 4, FIG. 4(a) is a view seen from the chip holding surface side, and FIG. 4(b) is a cross-sectional view showing a state in which the components of the chip holding means 102 are holding the chip component C. Also, the quadrilateral drawn by the dotted line in FIG. 4(a) represents the outer periphery of the chip component C to be held.

[0037] As shown in FIG. 4(b), the chip holding means 102 has a porous portion 110P and ejection holes 120 on the chip holding surface 102S. The porous portion 110P communicates with the reduced-pressure flow path 11, and the ejection holes 120 communicate with the pressurized flow path 12. Here, the reduced-pressure flow path 11 is connected to a reduced-pressure means (e.g., a vacuum pump) not shown, and the air near the porous portion 110P is sucked. Further, the pressurized flow path 12 is connected to a pressurizing means (e.g., a compressor) not shown, and an air flow is ejected from the ejection holes 120. Note that, by connecting to a high-pressure gas cylinder as the pressurizing means, a gas other than air may be ejected from the ejection holes.

[0038] FIGS. 4(a) and 4(b) show an arrangement example of the porous portion 110P provided on the chip holding surface 102S and a plurality of ejection holes 120. When the porous portion 110P is arranged in substantially the entire area where the chip component C is held, the arrangement positions of the ejection holes 120 are limited to the positions adjacent to the outer periphery of the chip component C and the central portion of the chip component C when holding the chip component C. Here, in order to distinguish the ejection hole 120 at the central portion of the chip component C from others, it is denoted as the central ejection hole 120M.

[0039] As shown in FIG. 4(a), the porous portion 110P and the ejection holes 120 are arranged, and air (which may include a gas other than air) is ejected simultaneously. By balancing the ejection, suction, and suction, the chip component C is held in a non-contact manner on the chip holding surface 101S. Further, the outer peripheral portion of the chip component C does not contact the chip holding surface 101S due to the air flow received from the ejection holes 120. Also, since the central ejection hole 120M also receives an air flow, even if the size of the chip component C is large and thin, the central portion of the chip component C does not contact the chip holding surface 101S. That is, the electrode surface of the chip component C does not contact and break on the chip holding surface 101S, and if it is in an active state, that state can be maintained.

[0040] By using the porous portion 110P, an effect substantially equivalent to that in which a large number of holes smaller than the opening area of the suction hole 110 in FIG. 1(a) are uniformly arranged can be obtained.

[0041] Thus, the chip holding means 102 can hold the chip component C in a non-contact manner. Therefore, by using the chip holding means 102 instead of the collet 3 shown in FIG. 9, a pickup device can be configured to hold and pick up the chip component C in a non-contact manner on the electrode surface as shown in FIG. 5(a). Further, by using the chip holding means 101 instead of the chip slider 5 shown in FIG. 10, a chip transfer device can be configured to hold the chip component C in a non-contact manner on the electrode surface and transfer it to directly below the bonding head (of the mounting device) as shown in FIG. 5(b).

[0042] Note that also in the second embodiment of the present invention, the arrangement example adjacent to the outer periphery of the chip component C when holding the chip component C is not limited to FIG. 4(a). For example, side ejection holes 120E may be arranged on the four sides of a quadrilateral as in the first modification of the second embodiment shown in FIG. 6(a), or a configuration may be adopted in which corner ejection holes 120C are arranged at the four corners of a quadrilateral as in the second modification of the second embodiment shown in FIG. 6(b).

[0043] Incidentally, in the embodiments described so far, the central ejection hole 120M was provided at a position corresponding to the center of the chip component C, but if the chip component C to be held is small and difficult to bend, it is also possible to omit the central ejection hole 120M. As such an example, the chip holding surface of the third modification of the first embodiment is shown in FIG. 7(a), and the chip holding surface of the third modification of the second embodiment is shown in FIG. 7(b).

[0044] As described above, the chip holding means of the first embodiment and the second embodiment (and the modifications of both embodiments) described so far are provided with ejection holes on the outer periphery of the chip, and by applying an air flow to the outer peripheral portion of the chip component C, it actively prevents the outer periphery of the chip component C from coming into contact with the chip holding surface. In addition to this, it has also been found that by making the opening area of the suction holes 110 smaller than that of the ejection holes 120 and increasing the number when comparing the individual suction holes 110 and ejection holes 120, it is possible to prevent a part of the chip component C from being strongly attracted to the chip holding surface.

[0045] Therefore, when the feature of making the opening area of the suction holes smaller than that of the ejection holes and increasing the number of suction holes is applied to the form in which the suction holes are provided on the outer periphery of the chip, it has been found that it is effective in preventing damage to the chip component C. FIG. 8 shows Embodiment 3, and in FIG. 8(a), the suction holes 130 arranged at positions corresponding to the four corners of the chip component C are smaller in number and smaller than the ejection holes 140 (arranged outside the outer peripheral portion of the chip). Further, Embodiment 4 shown in FIG. 8(b) has a porous body 150P arranged at positions corresponding to the four corners of the chip component C, and the individual holes of the porous body 150P are smaller in number and smaller than the ejection holes 160. In both Embodiment 3 and Embodiment 4, since the four corners are being sucked, while having the feature that the held chip component C is difficult to be displaced horizontally (in the chip surface direction), the outer peripheral portion of the chip component C is difficult to come into contact with the chip holding surface.

[0046] As described above, according to the present invention, it becomes possible to hold a thin and thick chip component in a non-contact manner without applying a large stress, and it is possible to prevent contamination of the electrode surface due to contact with other objects during pickup and conveyance. Therefore, in a bonding performed by activating the electrode surface such as hybrid bonding, it is suitable because the surface active state can be maintained.

Explanation of Signs

[0047] 2 Non-contact holding means 3 Collet 4 Needle 5 Chip slider 11 Vacuum flow path 12 Pressure flow path 101, 102 Chip holding means 101S, 102S Chip holding surface 110 Suction hole 110P Porous body 120 Ejection hole 120C Corner ejection hole 120E Side ejection hole 120M Central ejection hole B Electrode C Chip component DT Dicing tape PF Pressure flow VF Vacuum flow

Claims

1. Chip holding means for holding a chip component, wherein a plurality of ejection holes for ejecting gas and a plurality of suction holes for sucking gas are arranged on the surface for holding the chip component, the ejection holes are provided at positions adjacent to the outer periphery of the chip component when holding the chip component, and the chip holding means capable of simultaneously ejecting and sucking gas.

2. The chip holding means according to claim 1, wherein the ejection holes are also provided near the center of the chip component.

3. Chip holding means for holding a chip component, wherein a plurality of ejection holes for ejecting gas and a plurality of suction holes for sucking gas are arranged on the surface for holding the chip component, and the opening area of the ejection holes is larger than the opening area of the suction holes.

4. The chip holding means according to claim 3, wherein the suction holes are openings of a porous material.

5. Chip holding means for holding a chip component, wherein a plurality of ejection holes for ejecting gas and a plurality of suction holes for sucking gas are arranged on the surface for holding the chip component, the opening area of the ejection holes is larger than the opening area of the suction holes, the ejection holes are provided at positions adjacent to the outer periphery of the chip component, and the chip holding means capable of simultaneously ejecting and sucking gas.

6. The chip holding means according to any one of claims 1 to 5, which holds the electrode surface side of the chip component without contact.

7. A pickup device that picks up the chip component peeled from a dicing sheet by using the chip holding means according to any one of claims 1 to 5.

8. A chip transfer device that transfers the chip component without contacting the electrode surface of the chip component by using the chip holding means according to any one of claims 1 to 5.

9. A chip transfer device that transfers the chip component without contacting the electrode surface of the chip component by using the chip holding means according to any one of claims 1 to 5.

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