Processing device

Abstract

To provide a processing device which allows processed waste contained in mist of processing water scattering in a processing chamber to be accumulated in an exhaust pipe and taken out and effectively discharges mist from the processing chamber.SOLUTION: A grinding device (a processing device) 1 includes: a chuck table (a holding unit) 10; a grinding unit (a processing unit) 20; a processing chamber S; a processing water supply part 40; and an exhaust part 50 which discharges mist of grinding water, which receives centrifugal force generated by rotation of a grinding wheel 25b to scatter, from the processing chamber S. The exhaust part 50 includes: an exhaust port 31c which is open on the side plate 31C of the processing chamber S; and an exhaust pipe 51 which connects the exhaust port 31c with a suction source 54. The exhaust pipe 51 includes: a horizontal pipe 51A horizontally extending from the exhaust port 31c; a vertical pipe 51B vertically extending from the horizontal pipe 51A; an elbow 51C connecting the horizontal pipe 51A with the vertical pipe 51B; and a take-out part 60 which has an accumulation part 62B where processed waste is accumulated and which is disposed so as to be detachably attached to the horizontal pipe 51A and the elbow 51C.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a processing apparatus that processes a workpiece such as a wafer held by a holding unit accommodated in a processing chamber with a processing tool while supplying processing water to the workpiece and the processing tool.

Background Art

[0002] For example, in the manufacturing process of semiconductor devices such as ICs and LSIs used in various electronic devices, in order to miniaturize and lighten the semiconductor devices, the back surface of the wafer is ground by a grinding device and the wafer is thinned to a predetermined thickness. That is, in the grinding device, the wafer held by the holding unit accommodated in the processing chamber is ground to a predetermined thickness by a grinding wheel as a processing tool while supplying grinding water to the wafer and the grinding wheel (see, for example, Patent Documents 1 and 2).

[0003] By the way, in the above grinding device, when the wafer is ground by the grinding wheel while supplying grinding water to the wafer and the grinding wheel, the grinding water is sprayed by the rotation of the grinding wheel and scattered in the processing chamber, and there is a problem that the grinding chips contained in the spray adhere to the inner wall of the processing chamber. For this reason, the spray of the grinding water is discharged from the processing chamber. That is, an exhaust port opening in the side plate of the processing chamber is communicated with a suction source by an exhaust pipe, and the spray in the processing chamber is discharged to the outside through the exhaust pipe from the exhaust port by the suction source.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, when the amount of grinding debris contained in the spray of grinding water is large, grinding debris accumulates in the exhaust pipe, reducing the discharge amount of the spray, and a problem occurs in that the grinding debris cannot be effectively discharged from the processing chamber. In addition, a problem occurs in that the grinding debris forms a lump in the exhaust pipe, blocking a part of the exhaust pipe and preventing the discharge of the spray from the exhaust pipe.

[0006] The present invention has been made in view of the above problems, and an object thereof is to provide a processing apparatus capable of collecting and taking out processing debris contained in the spray of processing water scattered in the processing chamber in the exhaust pipe and effectively discharging the spray from the processing chamber.

Means for Solving the Problems

[0007] The present invention for achieving the above object includes a holding unit for holding a workpiece, a processing unit for rotating a cutting tool to process the workpiece, a processing chamber for accommodating the workpiece held by the holding unit and the cutting tool, a processing water supply unit for supplying processing water to the workpiece and the cutting tool in the processing chamber, and an exhaust unit for discharging the spray of processing water scattered by the centrifugal force generated by the rotation of the cutting tool from the processing chamber. The exhaust unit includes an exhaust port opening in a side plate of the processing chamber, and an exhaust pipe connecting the exhaust port and a suction source. The exhaust pipe includes a horizontal pipe extending horizontally from the exhaust port, a vertical pipe extending vertically from the horizontal pipe, an elbow connecting the horizontal pipe and the vertical pipe, and a take-out part having a storage part for storing processing debris and detachably arranged on the horizontal pipe and the elbow.

Effects of the Invention

[0008] According to the present invention, in the process where the sprayed grinding water generated in the processing chamber flows through the vertical pipe of the exhaust pipe, when the grinding chips with a large specific gravity fall by their own weight and are received and collected by the storage part of the take-out part, only the sprayed mist from which the grinding water has been removed flows through the exhaust pipe. Therefore, grinding chips do not accumulate inside the exhaust pipe to obstruct the flow of the sprayed mist in the exhaust pipe. As a result, the discharge amount of the sprayed mist from the processing chamber does not decrease, and the effect that the grinding chips can be effectively discharged from the processing chamber can be obtained.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described based on the accompanying drawings.

[0011] [Configuration of the Grinding Device] First, the configuration of a grinding device which is a form of the processing device according to the present invention will be described based on FIGS. 1 to 3. In the following description, the directions of the arrows shown in FIG. 1 are taken as the X-axis direction (left-right direction), Y-axis direction (front-back direction), and Z-axis direction (up-down direction), respectively.

[0012] The grinding apparatus 1 shown in Fig. 1 grinds a disk-shaped wafer W as a workpiece, and includes the following components. That is, the grinding apparatus 1 includes a chuck table 10 which is a holding unit that holds the wafer W (see Fig. 2) and rotates around its axis, a grinding unit (processing unit) 20 that grinds the wafer W sucked and held by the chuck table 10, a processing chamber S (see Fig. 2) that houses the wafer W held by the chuck table 10 and the grinding wheel 25 of the grinding unit 20, a processing water supply unit 40 that supplies grinding water (processing water) to the wafer W and the grinding stone 25b as a processing tool in the processing chamber S, and an exhaust unit 50 that discharges the spray of the grinding water scattered by the centrifugal force generated by the rotation of the grinding wheel 25 from the processing chamber S to the outside as main components (see Fig. 3).

[0013] Here, the wafer W as a workpiece is composed of a single-crystalline silicon base material, and a plurality of devices (not shown) are formed on the surface facing downward in the state shown in Fig. 1. Then, the surface of the wafer W (the lower surface in Fig. 1) is sucked and held by the holding surface of the chuck table 10, and the back surface (the upper surface in Fig. 1) is ground by the grinding unit 20.

[0014] Next, the configurations of the chuck table 10, the grinding unit 20, the processing chamber S, the processing water supply unit 40, and the exhaust unit 50, which are the main components of the grinding apparatus 1, will be described respectively.

[0015] (Chuck Table) The chuck table 10 is a disk-shaped member, and a disk-shaped porous member 10A is incorporated in the upper central portion thereof as shown in Fig. 2. Here, the porous member 10A is composed of a porous ceramic or the like, and its upper surface constitutes a holding surface that sucks and holds the disk-shaped wafer W. Note that the porous member 10A of the chuck table 10 is selectively connected to a suction source (not shown) such as a vacuum pump.

[0016] The chuck table 10 is rotationally driven at a predetermined speed about its axis by a rotation mechanism 2 shown in FIG. 2. That is, as shown in FIG. 2, the chuck table 10 includes a rotation shaft 11 that extends vertically and integrally downward from its center, and this rotation shaft 11 is rotationally driven at a predetermined speed by the rotation mechanism 2. The rotation shaft 11 of the chuck table 10 is rotatably supported by an annular frame 13 via a bearing 12, and the frame 13 is supported by a slider 71 via an inclination adjustment mechanism 14.

[0017] Here, the rotation mechanism 2 includes a servo motor 3 as a drive source, and this servo motor 3 is supported in a vertical state by a bracket 4 attached to the lower surface of the frame 13. A small-diameter drive pulley 5 is attached to the upper end of an output shaft (motor shaft) 3a extending upward from this servo motor 3. Further, a large-diameter driven pulley 6 is attached to the outer periphery of the lower part of the rotation shaft 11 of the chuck table 10, and an endless timing belt 7 is wound around this driven pulley 6 and the drive pulley 5. Therefore, if the servo motor 3 is activated to rotationally drive the drive pulley 5, the rotation of the drive pulley 5 is decelerated via the timing belt 7 and transmitted to the driven pulley 6, and the driven pulley 6, the rotation shaft 11, and the chuck table 10 are rotationally driven at a predetermined speed in the direction of the arrow in FIG. 2.

[0018] Further, as shown in FIG. 1, the grinding apparatus 1 according to the present invention includes a rectangular box-shaped base 100 that is long in the Y-axis direction (left-right direction), and the chuck table 10 faces a rectangular opening 100a that is long in the Y-axis direction and opens in the base 100. The periphery of the chuck table 10 in the opening 100a is covered by a rectangular plate-shaped cover 8, and the front and rear portions of the cover 8 in the opening 100a are respectively covered by bellows-shaped expandable and contractible covers 9 that move and expand and contract together with the cover 8.

[0019] Incidentally, inside the base 100, as shown in Fig. 2, a horizontal movement mechanism 70 is provided. This horizontal movement mechanism 70 is a mechanism for moving the slider 71 and the chuck table 10 in the horizontal direction (Y-axis direction). The slider 71 and the chuck table 10 are slidable in the Y-axis direction along a pair of left and right guide rails 72 (only one is shown in Fig. 2) arranged parallel to each other along the Y-axis direction. And between the pair of left and right guide rails 72, a rotatable ball screw 73 extending in the Y-axis direction is arranged. One end of the ball screw 73 in the Y-axis direction (the right end in Fig. 1) is connected to a servomotor 74 that can rotate forward and backward, which is a drive source. And a nut member 75 protruding downward from the slider 71 is screwed onto the ball screw 73.

[0020] Therefore, when the servomotor 74 is activated to rotate the ball screw 73 forward and backward, the nut member 75 screwed onto this ball screw 73 slides in the Y-axis direction along the ball screw 73 together with the slider 71. Thus, the chuck table 10 also moves integrally along the Y-axis direction together with the slider 71. As a result, the wafer W sucked and held on the holding surface of the chuck table 10 also moves along the Y-axis direction.

[0021] (Grinding Unit) The grinding unit 20, which is a processing unit, as shown in Figs. 1 and 2, includes a spindle motor 22 housed in a holder 21, a vertical spindle 23 rotationally driven around its axis by the spindle motor 22, a disc-shaped mount 24 attached to the lower end of the spindle 23, and a grinding wheel 25 detachably attached to the lower surface of the mount 24. Here, the grinding wheel 25 is composed of a disc-shaped base 25a and a plurality of grinding wheels 25b, which are cutting tools arranged in an annular shape and attached to the lower surface of the base 25a. Note that the grinding wheel 25b is a rectangular block-shaped cutting tool for grinding the wafer W, and its lower surface constitutes a grinding surface that contacts the upper surface (the surface to be ground) of the wafer W.

[0022] Incidentally, the grinding unit 20 can move up and down along the vertical direction (Z-axis direction) by the elevating mechanism 80. Here, the elevating mechanism 80 is disposed on the -Y-axis direction end face of a rectangular box-shaped column 110 vertically erected on the +Y-axis direction end of the upper surface of the base 100. This elevating mechanism 80 moves up and down a rectangular plate-shaped elevating plate 81 attached to the back surface of the holder 21 of the grinding unit 20, together with the holder 21, the spindle 23 held by the holder 21, and the grinding wheel 25, along the Z-axis direction along a pair of left and right guide rails 82. Here, the pair of left and right guide rails 82 are disposed vertically and parallel to each other on the front surface of the column 110.

[0023] Also, between the pair of left and right guide rails 82, a rotatable ball screw 83 is vertically erected along the Z-axis direction (vertical direction). The upper end of the ball screw 83 is connected to a servo motor 84 capable of normal and reverse rotation, which is a drive source. Here, the servo motor 84 is attached to the column 110 in a vertical state via a rectangular plate-shaped bracket 85 attached to the upper surface of the column 110. Also, the lower end of the ball screw 83 is rotatably supported by the column 110. A nut member 86 (see FIG. 2) horizontally protruding rearward (+Y-axis direction) is screwed onto the ball screw 83 on the back surface of the elevating plate 81.

[0024] Therefore, if the servo motor 84 is activated to rotate the ball screw 83 forward and backward, the elevating plate 81 to which the nut member 86 screwed onto the ball screw 83 is attached moves up and down along the Z-axis direction together with the grinding unit 20 along the pair of guide rails 82. Thus, the grinding unit 20 moves up and down to set the grinding amount (grinding cost) of the grinding wheel 25b with respect to the wafer W.

[0025] (Processing chamber) As shown in FIGS. 1 and 2, the processing chamber S is a space formed inside a rectangular box-shaped processing chamber cover 31 erected on the base 100. In this processing chamber S, the wafer W held by the chuck table 10 and the grinding wheel 25 of the grinding unit 20 are accommodated. That is, a circular hole 31a through which the spindle 23 of the grinding unit 20 passes is formed at the center of the upper wall 31A of the processing chamber cover 31, and the mount 24 and the grinding wheel 25 attached to the lower end of the spindle 23 passing through this circular hole 31a are accommodated inside the processing chamber S.

[0026] Also, a rectangular opening 31b for the chuck table 10 movable in the Y-axis direction to pass through is formed in the side wall (front wall) 31B of the processing chamber cover 31, and this opening 31b is opened and closed by a shutter 32 in the shape of a rectangular plate.

[0027] (Processing water supply section) The processing water supply section 40 supplies grinding water, which is the processing water, to the contact part (grinding part) between the wafer W being ground in the processing chamber S and the grinding wheel 25b, which is the processing tool. It includes a grinding water supply source 41 and a pipe 42 extending from the grinding water supply source 41 and connected to the axial center of the spindle motor 22 of the grinding unit 20. An on-off valve V is provided in the pipe 42. Here, although not shown, supply paths communicating with each other are formed in the axial centers of the spindle motor 22, the spindle 23, and the mount 24 of the grinding unit 20. A plurality of supply paths radially extending outward in the radial direction are formed in the mount 24 from the supply path formed in its axial center. These supply paths are respectively connected to a plurality of injection nozzles 26 in the shape of circular holes formed vertically in the base 25a of the grinding wheel 25. Note that pure water is preferably used as the grinding water.

[0028] (Exhaust section) The exhaust section 50 discharges the spray generated when the grinding water supplied from the grinding water supply source 41 of the machining water supply section 40 to the contact section (grinding section) between the wafer W and the grinding wheel 25b scatters around due to the rotation of the grinding wheel 25b to the outside of the machining chamber S during the grinding process of the wafer W in the machining chamber S. As shown in FIGS. 1 and 2, this exhaust section 50 includes a circular hole-shaped exhaust port 31c that opens in the side wall (rear wall) 31C of the machining chamber S and an exhaust pipe 51 that extends from the exhaust port 31c.

[0029] The exhaust pipe 51 is a pipe bent in an L shape, and includes a horizontal pipe 51A that extends horizontally from the exhaust port 31c, a vertical pipe 51B that extends vertically upward from the end of the horizontal pipe 51A, and an elbow (90° elbow) 51C that connects these horizontal pipe 51A and vertical pipe 51B. An exhaust concentration box 52 in the shape of a rectangular box is connected to the upper end of the vertical pipe 51B. And the exhaust concentration box 52 is connected to the suction source 54 via the pipe 53. Therefore, the inside of the machining chamber S is connected to the suction source 54 via the exhaust port 31c, the exhaust pipe 51, the exhaust concentration box 52, and the pipe 53.

[0030] Also, as shown in FIGS. 1 and 2, a circular hole-shaped drain port 31d opens at the lower part of the side wall (rear wall) 31C of the machining chamber cover 31, and the inside of the machining chamber S is connected to the drain source 56 via the drain port 31d and a drain pipe 55 that extends from the drain port 31d.

[0031] By the way, a take-out part 60 having a storage part 62B for storing grinding chips (processing chips) contained in the spray of the grinding water is detachably arranged inside the horizontal pipe 51A of the exhaust pipe 51 and the elbow 51C. Here, as shown in FIGS. 5 and 7, the take-out part 60 is composed of an inner and outer double cylindrical first liner 61 and a second liner 62, and these first liner 61 and second liner 62 are detachably connected to each other (see FIGS. 5 and 8(a)). Hereinafter, the detailed configuration of the take-out part 60 will be described based on FIGS. 4 to 7.

[0032] That is, a ring-shaped flange 63 is bonded to one end (the left end in FIGS. 5 and 7) of the first liner 61 which is one of the members constituting the extraction part 60. Circular hole-shaped bolt insertion holes 63a are formed at two positions on the left and right facing each other in the radial direction of this flange 63 (see FIG. 7). Further, on the outer periphery of the first liner 61, two tapered seal members 64, 65 and two straight ring-shaped (annular) seal members 66, 67 are bonded at appropriate intervals in the axial direction. Here, the tapered seal members 64, 65 are formed in a tapered shape such that their outer diameters decrease in the axial direction (to the right in FIGS. 5 and 7). The four seal members 64 to 67 are made of an elastic body such as rubber.

[0033] Also, the second liner 62 which is the other member constituting the extraction part 60 includes a cylindrical part 62A having a larger diameter than the first liner 61, and a saucer-shaped storage part 62B attached to the end part (the right end part in FIGS. 5 and 7) of the cylindrical part 62A. Here, a ring-shaped seal member 68 is bonded to the outer periphery of the end part of the second liner 62, and a packing 69 is fitted to the periphery of the opening that opens above the storage part 62B. The seal member 68 and the packing 69 are made of an elastic body such as rubber.

[0034] Thus, the cylindrical part 62A of the second liner 62 fits onto the outer periphery of the end part (the right end part in FIGS. 5 and 7) of the first liner 61, and the first liner 61 and the second liner 62 that fit together are detachably (disassemblable and assemblable) connected. That is, as shown in FIG. 7, four engaging grooves 62a are formed in the cylindrical part 62A of the second liner 62 at an equal angular pitch (90° pitch) in the circumferential direction. Here, each engaging groove 62a is formed by a first groove 62a1 and a second groove 62a2 that are formed parallel to each other along the axial direction, and a circumferential third groove 62a3 that connects these first groove 62a1 and second groove 62a2. The first groove 62a1 is configured as a notch groove whose one end opens at the end part of the second liner 62, and the second groove 62a2 and the third groove 62a3 are configured as closed grooves.

[0035] On the other hand, as shown in FIG. 7, four engaging pins 61a that engage with the four engaging grooves 62a of the second liner 62 project in the circumferential direction at an equal angular pitch (90° pitch) on the outer periphery of one end of the first liner 61. Therefore, with the four engaging pins 61a of the first liner 61 aligned with the positions of the first grooves 62a1 of the four engaging grooves 62a formed in the cylindrical portion 62A of the second liner 62, when the cylindrical portion 62A of the second liner 62 is fitted onto the outer periphery of the end of the first liner 61 and these first liner 61 and second liner 62 are relatively moved in a direction approaching each other, the engaging pins 61a of the first liner 61 engage with the first grooves 62a1 of the engaging grooves 62a of the second liner 62 and slide in the axial direction.

[0036] In the above state, when the engaging pins 61a of the first liner 61 move to the ends of the first grooves 62a1 of the engaging grooves 62a of the second liner 62, if the first liner 61 and the second liner 62 are relatively rotated by a predetermined angle, the engaging pins 61a of the first liner 61 slide along the third grooves 62a3 of the engaging grooves 62a of the second liner 62 and reach the second grooves 62a2. Then, if the first liner 61 and the second liner 62 are relatively pulled apart in the axial direction from this state, the engaging pins 61a of the first liner 61 slide along the second grooves 62a2 of the engaging grooves 62a of the second liner 62, and as shown in FIG. 8(a), when the engaging pins 61a move to the ends of the respective second grooves 62a2, the first liner 61 and the second liner 62 are connected and integrated, and the extraction portion 60 is assembled. The disassembly of the extraction portion 60 is performed in the reverse procedure of the above, but this will be described later with reference to FIG. 8.

[0037] And thus, the extraction unit 60 configured as described above is fitted and fixed into the horizontal pipe 51A and the elbow 51C of the exhaust pipe 51 from the processing chamber S side as follows. That is, as shown in FIG. 5, the extraction unit 60 is inserted into the horizontal pipe 51A and the elbow 51C of the exhaust pipe 51 from the processing chamber S side with the second liner 62 first. Specifically, the extraction unit 60 is inserted into the horizontal pipe 51A and the elbow 51C of the exhaust pipe 51 until the flange 63 of the first liner 61 abuts against the side wall (rear wall) 31C of the processing chamber cover 31. However, a ring-shaped packing 91 is provided between the flange 63 and the side wall (rear wall) 31C of the processing chamber cover 31.

[0038] As described above, when the extraction unit 60 is inserted into the horizontal pipe 51A and the elbow 51C of the exhaust pipe 51, as shown in FIG. 5, the radial gap between the first liner 61 and the horizontal pipe 51A is sealed by two tapered seal members 64, 65, and the radial gap between the first liner 61 and the cylindrical portion 62A of the second liner 62 is sealed by two seal members 66, 67. Also, the radial gap between the cylindrical portion 62A of the second liner 62 and the horizontal pipe 51A is sealed by a seal member 68, and the gap between the peripheral edge of the opening of the storage portion 62B of the second liner 62 and the elbow 51C is sealed by a packing 69.

[0039] Thereafter, bolts 93 are respectively passed through the bolt insertion holes 63a formed in the flange 63 of the first liner 61 via washers 92, and when these bolts 93 are screwed into the side wall (rear wall) 31C of the processing chamber cover 31, the extraction unit 60 is detachably attached to the side wall (rear wall) 31C of the processing chamber cover 31 by the two bolts 93. Note that caps 94 made of an elastic body such as rubber are attached to the heads of the respective bolts 93, and the caps 94 prevent grinding chips from adhering to the heads of the respective bolts 93.

[0040] [Operation of the grinding device] Next, the operation of the grinding device 1 configured as described above, that is, the method of grinding the wafer W by the grinding device 1 will be described.

[0041] In the grinding device 1, when grinding the wafer W in the processing chamber S, as shown in FIG. 2, the wafer W is placed on the holding surface of the chuck table 10. Then, a suction source (not shown) connected to the porous member 10A of the chuck table 10 is driven to evacuate the porous member 10A. As a result, a negative pressure is generated in the porous member 10A, and the wafer W placed on the holding surface of the porous member 10A is sucked and held on the holding surface by the negative pressure.

[0042] From the above state, the horizontal movement mechanism 70 shown in FIG. 2 is driven to move the chuck table 10 in the Y-axis direction, and the wafer W sucked and held by the chuck table 10 is positioned below the grinding wheel 25 of the grinding unit 20. That is, when the servo motor 74 is activated to rotate the ball screw 73, a slider 71 to which a nut member (not shown) screwed onto the ball screw 73 is attached slides in the Y-axis direction along a pair of left and right guide rails 72 together with the chuck table 10 and the like. Therefore, the wafer W held on the holding surface of the chuck table 10 is positioned below the grinding wheel 25 of the grinding unit 20. At this time, the horizontal positional relationship between the two is adjusted so that the lower surface (processing surface) of the grinding wheel 25b passes through the center of the wafer W.

[0043] Also, the rotation mechanism 2 shown in FIG. 2 is driven to rotate the chuck table 10, and the wafer W held on the holding surface of the chuck table 10 is rotated at a predetermined speed. At the same time, the spindle motor 22 of the grinding unit 20 is driven to rotate the grinding wheel 25 at a predetermined speed.

[0044] As described above, with the wafer W and the grinding wheel 25 rotating, the elevating mechanism 80 is driven to lower the grinding wheel 25 in the -Z axis direction. Then, when the grinding surface of the rotating grinding wheel 25b contacts the upper surface of the wafer W, the grinding wheel 25b descends at a constant speed and the entire upper surface of the wafer W is ground by the grinding wheel 25b. When the wafer W is being ground, grinding water is supplied from the grinding water supply source 41 of the processing water supply unit 40 to the contact portion (grinding portion) between the wafer W and the grinding wheel 25b. The contact portion (grinding portion) is cooled by the grinding water, and the grinding chips generated by grinding the wafer W are washed away by the grinding water. Specifically, when the on-off valve V provided in the pipe 42 of the processing water supply unit 40 is opened, grinding water is supplied from the grinding water supply source 41 through the pipe 42 to the grinding unit 20. Then, the grinding water supplied to the grinding unit 20 jets downward from a plurality of injection nozzles 26 formed in the base 25a of the grinding wheel 25 through a supply path (not shown) formed in the spindle motor 22, the spindle 23, etc., and the grinding water is supplied to the contact portion (grinding portion) between the wafer W and the grinding wheel 25b.

[0045] Thus, as described above, when grinding water is supplied to the contact portion (grinding portion) between the wafer W and the grinding wheel 25b, the grinding water is scattered around due to the centrifugal force generated by the rotation of the grinding wheel 25, and a spray of grinding water is generated in the processing chamber S. This spray is discharged outside the processing chamber S through the exhaust pipe 51 by the suction source 54. Also, the grinding water staying at the bottom inside the processing chamber S is sucked by the drainage source 56 and discharged outside the processing chamber S through the drain pipe 55 from the drain port 31d of the processing chamber cover 31.

[0046] Here, the discharge of the spray of grinding water generated inside the processing chamber S to the outside of the processing chamber S will be described.

[0047] That is, when the suction source 54 is driven, the inside of the processing chamber S is suctioned, and the sprayed grinding water generated inside the processing chamber S flows from the exhaust port 31c of the processing chamber cover 31 to the exhaust pipe 51, and is discharged from the pipe 53 to the outside of the processing chamber S through the exhaust concentration box 52. Here, in the present embodiment, since the extraction part 60 is incorporated in the horizontal pipe 51A and the elbow 51C of the exhaust pipe 51, the spray inside the processing chamber S flows vertically upward through the extraction part 60 in the vertical pipe 51B of the exhaust pipe 51. However, during the process of the spray flowing through the vertical pipe 51B, the grinding chips contained in the spray fall within the vertical pipe 51B by their own weight and are received and collected by the storage part 62B provided in the second liner 62 of the extraction part 60.

[0048] Thus, as described above, when the grinding water spray generated inside the processing chamber S flows through the vertical pipe 51B of the exhaust pipe 51, the grinding chips with a large specific gravity fall by their own weight and are received and collected by the storage part 62B provided in the second liner 62 of the extraction part 60. Only the spray from which the grinding water has been removed flows through the exhaust pipe 51. Therefore, no grinding chips accumulate inside the exhaust pipe 51 to hinder the flow of the spray in the exhaust pipe 51. As a result, the discharge amount of the spray from the processing chamber S does not decrease, and the effect that the grinding chips can be effectively discharged from the processing chamber S is obtained.

[0049] By the way, at an appropriate time when the amount of the grinding chips collected and accumulated in the storage part 62B provided in the second liner 62 of the extraction part 60 exceeds a predetermined amount, for example, when the grinding wheel 25 is replaced, the extraction part 60 is removed from the exhaust pipe 51, and the grinding chips accumulated in the storage part 62B of the extraction part 60 are discarded. That is, after loosening and removing the two bolts 93 that fasten the extraction part 60 to the side wall (rear wall) 31C of the processing chamber cover 31, the extraction part 60 is pulled out toward the processing chamber S side. Here, in the present embodiment, since the first liner 61 and the second liner 62 of the extraction part 60 are detachable (separable), the second liner 62 provided with the storage part 62B can be removed from the first liner 61, and only the removed second liner 62 can be transported to the disposal place to discard the grinding chips accumulated in the storage part 62B.

[0050] Here, a method for disassembling the first liner 61 and the second liner 62 of the extraction part 60 will be described below with reference to FIGS. 8(a) to 8(d).

[0051] That is, when disassembling the extraction part 60 in which the first liner 61 and the second liner 62 are connected and integrated into the first liner 61 and the second liner 62 as shown in FIG. 8(a), the second liner 62 is pulled in the direction of the arrow in FIG. 8(a), and each engagement pin 61a of the first liner 61 is moved to the position of the third groove 62a3 of the engagement groove 62a of the second liner 62. Then, from this state, as shown in FIG. 8(b), for example, the first liner 61 is rotated by a predetermined angle in the direction of the arrow. Then, each engagement pin 61a of the first liner 61 moves along the third groove 62a3 of each engagement groove 62a of the second liner 62 to the first groove 63a1.

[0052] Next, as shown in FIG. 8(c), if the second liner 62 is pulled in the direction of the arrow with respect to the first liner 61, each engagement pin 61a of the second liner 62 slides along the first groove 62a1 of each engagement groove 62a of the second liner 62, and the engagement of the engagement pin 61a with the first groove 62a1 is released. Therefore, as shown in FIG. 8(d), the extraction part 60 can be disassembled into the first liner 61 and the second liner 62. Note that the liner is not limited to being divided into two parts. It may be divided into three parts or four parts. Also, it is not limited to having an engagement pin and an engagement groove. For example, it may be integrated by magnetic attraction with a magnet. Also, it may be configured to be integrally formed so as to be separable by fitting. Note that the first liner 61 and the second liner 62 do not necessarily have to be disassemblable, and they may be integrally configured.

[0053] Thus, when the wafer W held on the chuck table 10 in the processing chamber S is ground to a predetermined thickness by the grinding wheel 25b of the grinding unit 20, the grinding wheel 25 is lifted by the lifting mechanism 80, the grinding wheel 25b of the grinding wheel 25 is separated from the wafer W, and the grinding process for the wafer W is completed.

[0054] In the above embodiments, an example in which the present invention is applied to a grinding apparatus for grinding a wafer has been described. However, the present invention can be similarly applied to any other processing apparatus such as a cutting apparatus or a polishing apparatus other than the grinding apparatus. Further, the workpiece to be processed by the processing apparatus is not limited to a wafer, and may be any other thing other than a wafer.

[0055] In addition, the present invention is not limited to being applied to the embodiments described above, and it goes without saying that various modifications are possible within the scope of the technical idea described in the claims, the specification, and the drawings.

Explanation of Reference Numerals

[0056] 1: Grinding apparatus (processing apparatus), 2: Rotating mechanism, 3: Servo motor, 3a: Output shaft, 4: Bracket, 5: Driving pulley, 6: Driven pulley, 7: Timing belt, 8: Cover, 9: Telescopic cover, 10: Chuck table, 10A: Porous member, 11: Rotating shaft, 12: Bearing, 13: Frame, 14: Tilt adjustment mechanism, 20: Grinding unit (processing unit) 21: Holder, 22: Spindle motor, 23: Spindle, 24: Mount, 25: Grinding wheel, 25a: Base, 25b: Grinding stone (processing tool), 26: Injection nozzle, 31: Processing chamber cover, 31A: Upper wall, 31B: Side wall (front wall), 31C: Side wall (rear wall), 31a: Circular hole, 31b: Opening, 31c: Exhaust port, 31d: Drain port, 32: Shutter, 40: Processing water supply section, 41: Grinding water supply source, 42: Pipe, 50: Exhaust section, 51: Exhaust pipe, 51A: Horizontal pipe, 51B: Vertical pipe, 51C: Elbow, 52: Exhaust manifold, 53: Pipe, 54: Suction source, 55: Drain pipe, 56: Drainage source, 60: Take-out section, 61: First liner, 61a: Engagement pin, 62: Second liner, 62A: Cylindrical portion, 62B: Storage portion, 62a: Engagement groove, 62a1: First groove, 62a2: Second groove, 62a3: Third groove, 63: Flange, 63a: Bolt insertion hole, 64 - 68: Seal member, 69: Packing, 70: Horizontal movement mechanism, 71: Slider, 72: Guide rail, 73: Ball screw, 74: Servo motor, 75: Nut member, 80: Lifting mechanism, 81: Lifting plate, 82: Guide rail, 83: Ball screw, 84: Servo motor, 85: Bracket, 86: Nut member, 91: Packing, 92: Washer, 93: Bolt, 94: Cap, 100: Base, 100a: Opening, 110: Column, S: Processing chamber, V: On - off valve, W: Wafer (workpiece)

Claims

【Claim 1】 A processing apparatus comprising: a holding unit for holding a workpiece; a processing unit for rotating a cutting tool to process the workpiece; a processing chamber for accommodating the workpiece held by the holding unit and the cutting tool; a processing water supply unit for supplying processing water to the workpiece and the cutting tool in the processing chamber; and an exhaust unit for discharging a spray of the processing water scattered by centrifugal force generated by the rotation of the cutting tool from the processing chamber, wherein the exhaust unit comprises an exhaust port opening in a side plate of the processing chamber, an exhaust pipe connecting the exhaust port and a suction source, and is characterized in that the exhaust pipe comprises a horizontal pipe extending horizontally from the exhaust port, a vertical pipe extending vertically from the horizontal pipe, an elbow connecting the horizontal pipe and the vertical pipe, and a removal unit having a storage portion for storing machining chips and detachably disposed on the horizontal pipe and the elbow, and the processing apparatus is characterized by comprising the above components.

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