Substrate position detection device, substrate overlapping device, and substrate position detection method

Abstract

To surely detect both positions of an upper substrate and a lower substrate.SOLUTION: A substrate position detection device 110 includes: a holding part 30 which holds a substrate 301; a support part 20 which supports a substrate 302 at a predetermined interval below the substrate 301; an imaging part 71 which is provided above the substrate 301 and radially outside, arranged with an imaging optical axis 71c tilted at a predetermined angle θ relative to a vertical direction including the outer peripheral edge 301s of the substrate 301 or the outer peripheral edge 302s of the substrate 302, and can simultaneously image a part including the outer peripheral edge 301s of the substrate 301 and a part including the outer peripheral edge 302s of the substrate 302; and a processing part which detects the horizontal position of the substrate 302 on the basis of an image captured by the imaging part 71. A predetermined interval Z and the predetermined angle θ are set so as to separate information on the outer peripheral edge 301s of the substrate 301 and information on the outer peripheral edge 302s of the substrate 302 from the image in the processing part.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a substrate position detection device, a substrate stacking device, and a substrate position detection method.

Background Art

[0002] In a stacking device that stacks a substrate and a lower substrate that supports an upper substrate, in a stacking chamber, a reflector that reflects at least one outer peripheral end of the upper substrate and the lower substrate that are close to each other, and a camera that detects the outer peripheral end reflected by the reflector from outside the stacking chamber are provided. A configuration including a position detection unit is disclosed (see, for example, Patent Document 1). In such a configuration, the position detection unit detects the positions of at least three parts at the outer peripheral end, and specifies the amount of deviation of the detected positions from a reference position.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the configuration disclosed in Patent Document 1, the camera detects the outer peripheral ends of the upper substrate and the lower substrate reflected by the reflector with the camera. For this reason, in the stacking direction of the upper substrate and the lower substrate, when the outer dimension of one of the upper substrate and the lower substrate arranged on the side closer to the reflector is larger than the outer dimension of the other of the upper substrate and the lower substrate arranged on the side away from the reflector, the other outer peripheral edge of the upper substrate and the lower substrate may not be detected by the camera.

[0005] In view of the above circumstances, an object of the present invention is to provide a substrate position detection device, a substrate stacking device, and a substrate position detection method capable of reliably detecting the positions of both the upper substrate and the lower substrate.

Means for Solving the Problem

[0006] In a first aspect of the present invention, there are provided a holding part for holding an upper substrate, a support part for supporting a lower substrate with a predetermined interval therebelow, an imaging part provided above the upper substrate and radially outside, having an imaging optical axis inclined by a predetermined angle from the vertical direction including the outer peripheral edge of the upper substrate or the lower substrate, and capable of simultaneously imaging a part including the outer peripheral edge of the upper substrate and a part including the outer peripheral edge of the lower substrate, and a processing part for detecting the horizontal position of the lower substrate based on an image captured by the imaging part, wherein the predetermined interval and the predetermined angle are set so that information regarding the outer peripheral edge of the upper substrate and information regarding the outer peripheral edge of the lower substrate can be separated from the image in the processing part. A substrate position detecting device is provided.

[0007] In a second aspect of the present invention, there are provided a holding part for holding an upper substrate, a support part for supporting a lower substrate with a predetermined interval therebelow, an imaging part provided above the upper substrate and radially outside, having an imaging optical axis inclined by a predetermined angle from the vertical direction including the outer peripheral edge of the upper substrate or the lower substrate and directed toward the lower substrate, and capable of imaging a part including the outer peripheral edge of the lower substrate, and a processing part for detecting the horizontal position of the lower substrate based on an image captured by the imaging part. A substrate position detecting device is provided.

[0008] In a third aspect of the present invention, there is provided a substrate stacking device including the above-described substrate position detecting device.

[0009] In a fourth aspect of the present invention, there are provided a holding part for holding an upper substrate, a support part for supporting a lower substrate with a predetermined interval therebelow, an imaging part provided above the upper substrate and radially outside, having an imaging optical axis inclined by a predetermined angle from the vertical direction including the outer peripheral edge of the upper substrate or the lower substrate and directed toward the lower substrate, and capable of imaging a part including the outer peripheral edge of the lower substrate, and a processing part for detecting the horizontal position of the lower substrate based on an image captured by the imaging part. A substrate stacking device is provided.

[0010] In a fifth aspect of the present invention, there are included holding an upper substrate, supporting a lower substrate with a predetermined interval therebelow, imaging, from above and radially outside the upper substrate, a part including the outer peripheral edge of the upper substrate and a part including the outer peripheral edge of the lower substrate while inclining an imaging optical axis by a predetermined angle from a vertical direction including the outer peripheral edge of the upper substrate or the lower substrate, and detecting a horizontal position of the lower substrate based on the captured image, wherein the predetermined interval and the predetermined angle are set so that information regarding the outer peripheral edge of the upper substrate and information regarding the outer peripheral edge of the lower substrate can be separated from the image, and a substrate position detection method is provided.

Advantages of the Invention

[0011] According to the present invention, it becomes possible to reliably detect the positions of both the upper substrate and the lower substrate.

Brief Description of the Drawings

[0012]

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Embodiments for Carrying Out the Invention

[0013] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following description. Also, in the drawings, some parts are omitted for easier explanation of the embodiments. Furthermore, the scale is appropriately changed, such as magnifying or emphasizing some parts, and the size and shape may be different from the actual product. In the following figures, the directions in the figures will be described using the XYZ orthogonal coordinate system. In this XYZ orthogonal coordinate system, a plane parallel to the horizontal plane is defined as the XY plane. In this XY plane, the direction parallel to the conveyance direction of substrate 301 and substrate 302 is defined as the X direction, and the direction orthogonal to the X direction is defined as the Y direction. Also, the direction perpendicular to the XY plane is denoted as the Z direction (height direction). Each of the X direction, Y direction, and Z direction is described such that the direction indicated by the arrow in the figure is the + direction, and the direction opposite to the direction indicated by the arrow is the - direction.

[0014] <Substrate Stacking Device> The substrate stacking device 100 according to the embodiment will be described. FIG. 1 is a diagram showing an example of the substrate stacking device 100 according to the embodiment. The substrate stacking device 100 attaches a substrate 301 having an adhesive layer F formed thereon and a substrate 302 having an adhesive layer F formed thereon by bringing their adhesive layers F into contact with each other. Note that the adhesive layer F is not limited to being formed on both of the substrates 301 and 302, and may be formed on either one of the substrates 301 or 302. The adhesive layer F is formed by being applied and dried on the substrates 301 and 302 by, for example, a coating device or the like before being carried into the substrate stacking device 100. Note that this coating device may be provided in the substrate stacking device 100. Also, in some cases, an adhesive layer F may be formed on either one of the substrates 301 and 302, and a reaction layer, for example, may be formed on the other.

[0015] In this embodiment, among the two substrates to be attached, the upper substrate is referred to as substrate 301, and the lower substrate is referred to as substrate 302. Substrates 301 and 302 are, for example, glass substrates, semiconductor substrates, resin substrates, etc. In this embodiment, for example, the upper substrate 301 is a glass substrate and the lower substrate 302 is a silicon substrate. Further, the form in which substrates 301 and 302 are attached is referred to as substrate 300 (see FIG. 23). Substrates 301 and 302 are both circular substrates in plan view (viewed from the Z direction), but are not limited to circular substrates, and may be rectangular substrates (square, rectangular), elliptical substrates, oval substrates, etc. in plan view.

[0016] As shown in FIG. 1, the substrate stacking apparatus 100 includes a chamber 10, a support portion 20, a holding portion 30, a lifting mechanism 50, an alignment mechanism 60, an imaging mechanism 70, and a control portion 200.

[0017] In the substrate stacking apparatus 100, to bond substrates 301 and 302, first, substrate 301 is carried into the chamber 10, aligned by the alignment mechanism 60, then the support portion 20 raises substrate 301, and the horizontal position of substrate 301 is detected. After detecting the horizontal position, substrate 301 is raised and held by the holding portion 30. Then, substrate 302 is carried into the chamber 10, aligned by the alignment mechanism 60, then the support portion 20 raises substrate 302, and the horizontal position of substrate 302 is detected. After detecting the horizontal position, substrate 302 is raised by the support portion 20 and superposed on substrate 301 held by the holding portion 30.

[0018] Chamber 10 is disposed on the base 15 of the substrate stacking apparatus 100. Chamber 10 is formed in a box shape having a side wall 10a rising upward from the outer peripheral portion of the base 15 and a top plate 10b covering the upper part of the side wall 10a. The chamber 10 houses a support portion 20, a holding portion 30, a part of the lifting mechanism 50, and an alignment mechanism 60. Chamber 10 is formed in a box shape and has a side opening 11 in a part of the side wall 10a. The side opening 11 is formed on the -X side surface of the chamber 10 and communicates the inside and outside of the chamber 10. The side opening 11 is formed to have a size through which substrates 301, 302 held by the transfer device 90 and the substrate 300 obtained by pasting both of them can pass.

[0019] Substrates 301 and 302 are respectively carried into the chamber 10 through the side opening 11 by the arm 91 of the transfer device 90. Further, the substrate 300 is carried out from the inside of the chamber 10 through the side opening 11. In the present embodiment, the transfer device 90 includes two flat arms 91. When carrying the substrate 301 into the chamber 10, the transfer device 90 sucks the substrate 301 from above and holds it. When carrying the substrate 302 into the chamber 10 and when carrying the substrate 300 out of the chamber 10, the transfer device 90 sucks and holds the substrates 302 and 300 from below. Note that the arm 91 may be configured to place and hold the substrates 302 and 300 on the upper surface side of the arm 91 without sucking them when transporting the substrates 302 and 300. Note that the number of the arms 91 is not limited to two and may be three or more.

[0020] Chamber 10 is provided with a gate valve 12 for opening and closing the side opening 11. The gate valve 12 is disposed outside on the -X side surface of the chamber 10 and is slidable in the vertical direction (Z direction), for example, by a driving unit (not shown). The gate valve 12 opens and closes the side opening 11 by sliding.

[0021] Note that the inside of the chamber 10 may be sealed by closing the side opening 11 with the gate valve 12, and the inside of the chamber 10 may be in a vacuum atmosphere. Even if the side opening 11 is closed, the inside of the chamber 10 may be in an atmospheric pressure atmosphere. Further, a through-hole 10h through which the shaft portion 51 described later passes is provided in the top plate 10b of the chamber 10. The shaft portion 51 is inserted into the through-hole 10h.

[0022] In addition, the inside of the chamber 10 may be connected to a gas supply device (not shown). By supplying a predetermined gas from this gas supply device into the chamber 10, the atmosphere inside the chamber 10 can be replaced with a predetermined gas atmosphere. As the predetermined gas, for example, an inert gas with respect to the thin films and the like formed on the substrates 301 and 302 such as nitrogen gas, or dry air or the like is used. When the inside of the chamber 10 is in a vacuum atmosphere, the inside of the chamber 10 is connected to a suction device (not shown). By sucking (exhausting) the inside of the chamber 10 with this suction device, the inside of the chamber 10 can be made into a vacuum atmosphere. Further, the chamber 10 may be provided with a valve that can be opened to the outside in order to open the internal vacuum atmosphere.

[0023] The support portion 20 supports the substrates 301 and 302 carried into the chamber 10 from below. The support portion 20 has a lift pin 21, a moving portion 22 that is connected to the lower end of the lift pin 21 and moves up and down in the Z direction, a lift pin driving portion 23 that moves the moving portion 22 up and down, and a support plate (alignment support portion) 25.

[0024] The lift pin 21 is disposed at the center of the support portion 20. The lift pin 21 supports the substrates 301 and 302 by abutting against the substrates 301 and 302 from below. For example, a plurality of lift pins 21 are provided. When viewed from the vertical direction, the plurality of lift pins 21 are arranged concentrically at intervals in the circumferential direction on the radially outer side with respect to the central portions of the substrates 301 and 302. Note that only one lift pin 21 may be arranged at the center of the substrates 301 and 302. The lift pin 21 may be formed of, for example, a non-conductive material (such as resin, metal, ceramics, etc.).

[0025] The moving part 22 moves up and down by driving the lift pin driving part 23. As the lift pin driving part 23, for example, an electric rotary motor, a linear motor, an air cylinder device, a hydraulic cylinder device, etc. are used, and the driving force is transmitted to the moving part 22 by a transmission mechanism (not shown).

[0026] Also, when the lift pin 21 descends, the support part 20 supports the substrates 301 and 302. In the present embodiment, the support part 20 is formed of, for example, stainless steel, and a support plate 25 made of, for example, ceramic is provided on the upper surface side. The support plate 25 may be provided in a plate shape. The support plate 25 is provided above the base 15 via a plurality of support columns 26. In this case, the support plate 25 has a through hole 25h through which the lift pin 21 passes. The lift pin 21 is configured to protrude upward and retract from the support plate 25 through the through hole 25h. The support plate 25 may incorporate a heater for heating the substrates 301 and 302.

[0027] The support part 20 moves up and down the substrates 301, 302, and 300 supported by the lift pin 21. For this purpose, the lift pin 21 has, for example, a first position P1 (see FIGS. 8 and 15) for receiving each of the substrates 301 and 302 carried into the chamber 10, a second position P2 (see FIG. 10) for alignment by the alignment mechanism 60, a third position P3 (see FIGS. 12 and 18) for detecting the positions of the substrates 301 and 302, a fourth position P4 (see FIGS. 13 and 19) for holding the substrate 301 by the holding part 30, and a fifth position P5 (see FIG. 21) for superposing the substrate 302 on the substrate 301. Between these positions, the substrates 301 and 302 can move up and down. The lift pin 21 of the support part 20 supports the substrate 302 with a predetermined interval below the substrate 301 held by the holding part 30.

[0028] The holding part 30 is provided spaced above the support part 20. In this embodiment, a spacer 31 is used as the holding part 30. The spacer 31 holds the upper substrate 301. The spacer 31 is a member that holds the substrate 301 until it is superposed with the substrate 302. A plurality of spacers 31 are provided at intervals in the circumferential direction of the substrate 301 on the outer side in the radial direction of the substrate 301.

[0029] The plurality of spacers 31 are supported by, for example, a support member (not shown) extending downward from the top plate 10b of the chamber 10. The plurality of spacers 31 support a part of the peripheral edge of the substrate 301 from below. Each of the plurality of spacers 31 is horizontally movable between a position where it supports the substrate 301 from below and a position where it retracts to the outer side in the radial direction of the substrate 301 by a drive mechanism (not shown). The spacer 31 enters below the substrate 301 lifted by the lift pin 21 to receive the substrate 301 from the lift pin 21.

[0030] The elevating mechanism 50 lowers the upper plate 52 described later and presses the substrate 301 toward the substrate 302 side (support part 20 side) when bonding the substrate 301 and the substrate 302. The elevating mechanism 50 includes a shaft part 51, a drive part (not shown) that drives the shaft part 51, an upper plate 52, and a pressing pin 53. The shaft part 51 is disposed at the central part of the upper plate 52 when viewed from above, and applies a load (pressing force) to the central part of the upper plate 52. The shaft part 51 is inserted into the chamber 10 through the through part 10h. The shaft part 51 is a rod-shaped body with a circular cross-section and is formed of an outer diameter and a material (for example, metal, resin, ceramics, etc.) that do not deform or have deformation suppressed by the applied load. The drive part drives the shaft part 51. As the drive part, for example, an air cylinder device, a hydraulic cylinder device, a ball screw mechanism using an electric rotary motor, etc. are used.

[0031] The upper plate 52 is fixed to the lower end of the shaft portion 51. The upper plate 52 is a circular plate-like body when viewed from above. However, the upper plate 52 is not limited to a circular shape, and may be, for example, a rectangular shape (square shape, rectangular shape), an elliptical shape, an oval shape, etc. Further, the upper plate 52 is formed of, for example, metal, resin, ceramics, etc. The upper plate 52 is given rigidity such that it does not easily deform when the substrate 301 is pressed against the substrate 302. When attaching the substrate 301 and the substrate 302, the upper plate 52 presses the upper substrate 301 toward the lower substrate 302.

[0032] The upper plate 52 is disposed at a position that at least overlaps with the lift pin 21 when viewed from above. With this configuration, when the substrates 301 and 302 are overlapped, the substrates 301 and S2 can be sandwiched from above and below by the upper plate 52 and the lift pin 21, and the substrates 301 and 302 can be reliably overlapped. The upper plate 52 may be configured to include a heater (heating portion) for heating the substrates 301 and 302. Further, instead of the upper plate 52 including a heater, a heater for heating the inside of the chamber 10 may be provided.

[0033] A plurality of pressing pins 53 are provided in a state of protruding from the lower surface of the upper plate 52. Each of the plurality of pressing pins 53 is supported by an elastic member such as a coil spring and is provided so as to be immersible with respect to the lower surface of the upper plate 52. When attaching the substrate 301 and the substrate 302, the pressing pins 53 press the upper substrate 301 toward the lower substrate 302 while immersing from the lower surface of the upper plate 52. Further, after the substrate 301 and the substrate 302 are attached, the pressing pins 53 can enhance the peelability of the upper plate 52 with respect to the substrate 301 by the force of protruding from the lower surface of the upper plate 52 by the elastic member.

[0034] The alignment mechanism 60 positions the substrates 301 and 302 with respect to the support portion 20. The alignment mechanism 60 includes a plurality of alignment driving portions 61 and a plurality of alignment blocks 62. The alignment blocks 62 are used to align (position) the substrates 301 and 302 by sandwiching the substrates 301 and 302 from the radial direction. The plurality of alignment blocks 62 are arranged at intervals in the circumferential direction around the central axis Ax of the support plate 25 on the outer peripheral portion of the support plate 25.

[0035] A plurality of alignment blocks 62 are arranged, for example, three at intervals in the circumferential direction around the central axis Ax. The number of alignment blocks 62 may be four or more. Each of the plurality of alignment blocks 62 is movable in the horizontal direction along the upper surface of the support plate 25 by a guide (not shown). The alignment block 62 is preferably formed of a conductive material in order to prevent the substrates 301 and 302 from being charged.

[0036] The alignment driving portion 61 moves each of the plurality of alignment blocks 62 in the radial direction of the support plate 25. The alignment driving portion 61 has, for example, a driving source such as a cylinder device or an electric motor, and a transmission mechanism that transmits the driving force generated by the driving source to each of the alignment blocks 62.

[0037] The alignment mechanism 60 advances the plurality of alignment blocks 62 in the radial direction of the support plate 25 by driving the alignment driving portion 61, and sandwiches the substrates 301 and 302 by pushing the outer peripheral edges 301s and 302s of the substrates 301 and 302 placed on the support plate 25 in a direction parallel to the upper surface of the support plate 25. The alignment mechanism 60 aligns the substrates 301 and 302 with respect to the central axis Ax of the support portion 20 by advancing and retracting the alignment blocks 62 in the radial direction of the substrates 301 and 302 by driving the alignment driving portion 61.

[0038] The operation of the alignment mechanism 60 is controlled by the control unit 200. When the alignment block 62 is used, the control unit 200 reads, for example, the shapes of the substrates 301 and 302 obtained by other units (not shown), determines the respective alignment positions for the substrates 301 and 302, and then operates the alignment block 62. Note that the specific configuration of the alignment mechanism 60 is not limited in any way as long as it can perform the required functions, and it can be appropriately changed to other configurations.

[0039] FIG. 2 is a diagram showing the imaging unit 71 provided in the substrate stacking apparatus 100 according to the embodiment. FIG. 3 is a plan view showing an arrangement example of the imaging unit 71.

[0040] As shown in FIGS. 1 to 3, the imaging mechanism 70 includes an imaging unit 71 and an illumination 72. The imaging unit 71 can image a part including the outer peripheral edges 301s and 302s of the substrates 301 and 302. When detecting the horizontal positions of the substrates 301 and 302, the imaging unit 71 holds the substrates 301 and 302 at the third position P3 (see FIGS. 12 and 19) set to a predetermined height by the lift pins 21, and images a part including the outer peripheral edges 301s and 302s of the substrates 301 and 302. When detecting the horizontal position of the substrate 301, the imaging unit 71 positions the substrate 301 at a predetermined position below the spacer 31 by the lift pin 21, and images a part including the outer peripheral edge 301s of the substrate 301.

[0041] When detecting the horizontal position of the substrate 302, as shown in FIG. 2, the imaging unit 71 supports the substrate 301 with the spacer 31, positions the substrate 302 at a predetermined interval below the spacer 31 by the lift pin 21, and images a part including the outer peripheral edge 302s of the substrate 302. Here, the substrate 301 when the imaging unit 71 images the substrate 301 and the substrate 302 when the imaging unit 71 images the substrate 302 are arranged at the same third position P3 at the same height.

[0042] The imaging unit 71 is, for example, a CCD camera. The imaging unit 71 is provided so as to be located above the substrate 301 in a state where the substrate 301 is supported by the spacer 31. In the present embodiment, the imaging unit 71 is disposed outside the chamber 10. The imaging unit 71 is supported on the top plate 10b of the chamber 10 via a bracket (not shown). An opening 10s that penetrates the top plate 10b vertically is formed in the top plate 10b. A transparent window material 17 made of glass or the like is provided in the opening 10s. The imaging unit 71 images a part of the outer peripheral edges 301s, 302s of the substrates 301, 302 from the outside of the chamber 10 through the window material 17.

[0043] As shown in FIG. 3, when viewed from the vertical direction, the imaging unit 71 is provided on the radially outer side of the substrates 301, 302. In the present embodiment, a plurality of imaging units 71 are provided at intervals in the circumferential direction of the substrates 301, 302. For example, three imaging units 71 are provided at equal intervals in the circumferential direction. The three imaging units 71 are arranged such that their circumferential positions are different from those of the spacer 31 so that they do not overlap with the spacer 31 in the circumferential direction.

[0044] FIG. 4 is a diagram showing an example of an image captured by the imaging unit 71. As shown in FIG. 2, each imaging unit 71 is arranged with its imaging optical axis 71c inclined by a predetermined angle (tilt angle θ) from the vertical direction including the outer peripheral edge 302s of the substrate 301 or the substrate 302. Each imaging unit 71 is arranged to be inclined from the vertical direction so that it can image a part of the outer peripheral edge 302s of the substrate 302 in a state where the substrate 302 supported by the lift pin 21 is positioned at a predetermined interval Z below the substrate 301 supported by the spacer 31.

[0045] More specifically, even when the outer dimensions of the upper substrate 301 are larger than those of the lower substrate 302 within the allowable error range of the outer dimensions of the substrate 301, the imaging unit 71 is provided so that the outer peripheral edge 302s of the lower substrate 302 can be imaged. The above-mentioned interval Z and inclination angle θ are set in the processing unit 201 described later so that information regarding the outer peripheral edge 301s of the substrate 301 and information regarding the outer peripheral edge 302s of the substrate 302 can be separated from the image captured by the imaging unit 71.

[0046] When the imaging unit 71 detects the position of the substrate 302, with the substrate 302 supported by the lift pin 21 positioned below the substrate 301 supported by the spacer 31, as shown in FIG. 4, the imaging unit 71 is arranged to be tilted from the vertical direction so that it can simultaneously image a part of the outer peripheral edge 301s of the substrate 301 and a part of the outer peripheral edge 302s of the substrate 302.

[0047] As shown in FIG. 2, each imaging unit 71 is arranged with its imaging optical axis 71c tilted by a predetermined inclination angle θ from the vertical direction including the outer peripheral edge 301s of the substrate 301 or the outer peripheral edge 302s of the substrate 302. This inclination angle θ is, for example, 5°≦θ≦20° It is preferably set as such. A more preferable range of the inclination angle θ is 8°≦θ≦12°.

[0048] When the inclination angle θ is less than the lower limit of the above range, the outer peripheral edge 301s of the substrate 301 and the outer peripheral edge 302s of the substrate 302 may overlap in the image captured by the imaging unit 71. When the inclination angle θ exceeds the upper limit of the above range, the imaging unit 71 has to be arranged at a position that protrudes greatly radially outward, leading to an increase in the size of the substrate stacking apparatus 100.

[0049] Also, when imaging a part of the outer peripheral edge 302s of the substrate 302 with the imaging unit 71 in a state where the substrate 302 supported by the lift pin 21 is positioned below the substrate 301 supported by the spacer 31, the vertical interval Z between the substrate 301 and the substrate 302 is, for example, 5 mm ≤ Z ≤ 25 mm It is preferable to make it satisfy this condition. A more preferable range of this interval Z is, for example, 10 mm ≤ Z ≤ 15 mm That is.

[0050] When imaging the outer peripheral edge 302s of the substrate 302 in a state where the substrate 302 supported by the lift pin 21 is positioned below the substrate 301 supported by the spacer 31, the inclination angle θ of the imaging optical axis 71c of the imaging unit 71 is 0.6 / Z ≤ sinθ It is preferable to provide the imaging unit 71 so as to satisfy this condition. Further, when the imaging field diameter of the imaging unit 71 is D, the imaging unit 71 is arranged such that the outer peripheral edges 301s and 302s of the substrates 301 and 302 are within the range of the imaging field diameter of the imaging unit 71, 0.6 / Z ≤ sinθ ≤ 0.5D / Z It is preferable to provide the imaging unit 71 so as to satisfy this condition. In particular, the imaging unit 71 is 1.5 / Z ≤ sinθ ≤ 2.0 / Z It is preferable to provide the imaging unit 71 so as to satisfy this condition. In the present embodiment, the imaging unit 71 is provided such that sinθ = 1.75 / Z More specifically, in the present embodiment, the vertical interval Z between the substrate 301 and the substrate 302 is 10 mm, and the inclination angle θ of the imaging unit 71 is 10°. Here, in the present embodiment, the imaging field diameter D of the imaging unit 71 is 16 mm in diameter, but it may be in the range of 8 mm to 20 mm. Also, the imaging unit 71 may have a field of view angle (vertical × horizontal) in the range of 8 mm × 8 mm to 20 mm × 20 mm. The imaging unit 71 may have a field of view angle (vertical × horizontal) of 16 mm × 16 mm.

[0051] In this way, the imaging unit 71 is set with the imaging optical axis 71c inclined at a predetermined angle within a range where it can simultaneously image a part including the outer peripheral edge 301s of the substrate 301 and a part including the outer peripheral edge 302s of the substrate 302 from the radially outer side of the substrate 301 through the opening 10s. Further, as shown in FIG. 4, when notches 305 are provided on the outer peripheral edges 301s, 302s of the substrates 301, 302, the imaging unit 71 simultaneously images the notches 305 when imaging the outer peripheral edges 301s, 302s of the substrates 301, 302.

[0052] As shown in FIGS. 2 and 3, the illuminations 72 are arranged in the vicinity of each imaging unit 71. Each illumination 72 illuminates the inside of the chamber 10 through the opening 10s. The illumination 72 is provided on the top plate 10b of the chamber 10. The illumination 72 is provided, for example, at a position overlapping the vertical direction including the outer peripheral edges 301s, 302s of the substrates 301, 302.

[0053] The control unit 200 shown in FIG. 1 comprehensively controls the operations of each part in the substrate stacking device 100. The control unit 200 includes a processing unit 201 that detects the horizontal positions of the substrates 301, 302 based on the images captured by each imaging unit 71. The processing unit 201 calculates the center positions of the substrates 301, 302 from the information regarding the outer peripheral edges 301s, 302s of the substrates 301, 302, and calculates the amount of deviation from a preset reference position.

[0054] The processing unit 201 calculates the center positions of the substrates 301, 302 based on the positions of the outer peripheral edges 301s, 302s of the substrates 301, 302 captured by each imaging unit 71. Further, the processing unit 201 calculates the circumferential displacement of the substrates 301, 302 from the positions of the notches 305 on the outer peripheral edges 301s, 302s of the substrates 301, 302 captured by each imaging unit 71. The processing unit 201 determines whether the amount of deviation in the horizontal position and circumferential position of the substrates 301, 302 is within a preset threshold range.

[0055] Further, the processing unit 201 may calculate the diameter dimensions of the substrates 301 and 302 based on information regarding the outer peripheral edges 301s and 302s of the substrates 301 and 302 respectively acquired from the images captured by the plurality of imaging units 71. Further, the processing unit 201 may acquire information regarding the notches 305 formed on the outer peripheral edges 301s and 302s of the substrates 301 and 302 respectively acquired from the images captured by the plurality of imaging units 71, and detect the circumferential positions of the substrates 301 and 302 in the direction around the vertical axis including the centers of the substrates 301 and 302.

[0056] Among the substrate stacking apparatuses 100 as described above, a substrate position detection device 110 for detecting the horizontal positions of the substrates 301 and 302 is configured by the holding unit 30, the support unit 20, the imaging unit 71, and the processing unit 201.

[0057] <Substrate Position Detection Method> Next, the substrate position detection method according to the present embodiment will be described. FIG. 5 is a flowchart showing an example of the substrate position detection method according to the present embodiment. FIG. 6 is a flowchart showing an example of the substrate position detection method according to the present embodiment following FIG. 5. FIG. 7 is a flowchart showing an example of the substrate position detection method according to the present embodiment following FIG. 6. This substrate position detection method is executed, for example, according to an instruction from the control unit 200. FIGS. 8 to 23 are process diagrams showing an example of the operation of the substrate stacking apparatus 100. In these process diagrams, the description is simplified so that the movement of each part can be easily understood. Hereinafter, description will be made along the flowcharts of FIGS. 5 to 7.

[0058] First, the gate valve 12 of the chamber 10 is opened, and the upper substrate 301 is carried in (step S01). As shown in FIG. 8, the control unit 200 drives a drive unit (not shown) to raise the gate valve 12 and open the side opening 11. Subsequently, the substrate 301 (upper substrate) is carried into the chamber 10. At this time, the control unit 200 raises the lift pins 21 to the first position P1 which is the transfer height of the substrate 301.

[0059] The arm 91 of the transfer device 90 enters the interior of the chamber 10 from the side surface opening 11 while holding the substrate 301 on the lower surface side, and positions the substrate 301 above the lift pin 21. The arm 91 adsorbs and holds the substrate 301 by means of an adsorption pad (not shown) provided on the lower surface. Thereafter, the control unit 200 lowers the arm 91 and transfers the substrate 301 from the arm 91 to the lift pin 21 (step S02). The lift pin 21 abuts against the substrate 301 from below. Thereafter, the arm 91 exits the chamber 10.

[0060] Subsequently, the substrate 301 is placed on the support plate 25 (step S03). As shown in FIG. 9, the control unit 200 lowers the lift pin 21 that supports the substrate 301, moves the substrate 301 to the second position P2, and places it on the support plate 25 of the support unit 20. At this time, the lift pin 21 is lowered to a position below the support plate 25 (i.e., the lower surface of the substrate 301), and the substrate 301 is supported by the support plate 25. Further, the substrate 301 may be heated by a heater (not shown) incorporated in the support plate 25.

[0061] Subsequently, an alignment operation is performed on the substrate 301 (step S04). As shown in FIG. 10, the control unit 200 drives the alignment drive unit 61 to advance each alignment block 62 radially inward, and positions the substrate 301 by sandwiching the substrate 301 between the plurality of alignment blocks 62 on the support plate 25. After the alignment operation, the control unit 200 retracts each alignment block 62 radially outward.

[0062] Subsequently, the substrate 301 is raised to the third position P3 at a predetermined height below the spacer 31 (step S05). As shown in FIG. 11, the control unit 200 raises the lift pin 21 and receives the substrate 301 from the support plate 25. The control unit 200 further raises the lift pin 21 to raise the substrate 301 and raises it to the third position P3 at a preset predetermined height.

[0063] Subsequently, the outer peripheral edge 301s of the substrate 301 is imaged (step S06). As shown in FIG. 12, the control unit 200 applies illumination light to the outer peripheral edge 301s of the substrate 301 through the opening 10s with each of the plurality of illuminations 72. The control unit 200 images the outer peripheral edge 301s of the substrate 301 with each of the plurality of imaging units 71. Each imaging unit 71 outputs the data of the captured image to the control unit 200.

[0064] Subsequently, the horizontal position of the substrate 301 is detected (step S07). The processing unit 201 of the control unit 200 calculates the center position of the substrate 301 from the positions of the outer peripheral edge 301s at a plurality of positions in the circumferential direction of the substrate 301 based on the images of the substrate 301 captured by the plurality of imaging units 71. Further, the processing unit 201 calculates the amount of deviation of the calculated center position of the substrate 301 from a preset reference position. Also, the processing unit 201 calculates the positional deviation of the substrate 301 in the circumferential direction from the positions of the notches 305 of the outer peripheral edge 301s of the substrate 301 captured by each imaging unit 71.

[0065] Subsequently, it is determined whether or not the amount of deviation of the substrate 301 from the reference position is within the threshold range (step S08). The processing unit 201 determines whether or not the amounts of deviation in the horizontal direction and the circumferential direction of the calculated center position of the substrate 301 from the reference position are within a preset threshold range.

[0066] As a result, if the amount of deviation of the substrate 301 is within the threshold range, the process proceeds to step S11. On the other hand, if the amount of deviation of the substrate 301 is outside the threshold range, the control unit 200 returns to step S04 and causes the alignment operation of the substrate 301 to be performed again. After the control unit 200 performs the alignment operation of the substrate 301 again in step S04, steps S05 to S08 are repeated. When the amount of deviation of the substrate 301 becomes within the threshold range by performing the alignment operation again, the process proceeds to step S11.

[0067] When returning from step S08 to step S04, it is confirmed whether the number of repetitions of the alignment operation of the substrate 301 has reached a preset number of times after returning to step S04 (step S09). As a result, even after the alignment operation of the substrate 301 in step S04 is repeated a preset number of times, if the deviation amount of the substrate 301 is outside the threshold range, the control unit 200 outputs an alarm for indicating the occurrence of an abnormality to the operator of the substrate stacking device 100 by outputting an alarm sound, emitting alarm light, displaying an alarm message, etc. (step S10).

[0068] After detecting the horizontal position of the substrate 301, the substrate 301 is raised to the position of the spacer 31 (step S11). In step S11, the lift pin 21 is raised to raise the substrate 301 to the fourth position P4 above the spacer 31. Subsequently, the substrate 301 is held by the holding unit 30 and the spacer 31 (step S12). As shown in FIG. 13, the control unit 200 raises the lift pin 21 to raise the substrate 301 to the fourth position P4 above the spacer 31, and supports the substrate 301 from below with the spacer 31 of the holding unit 30. At this time, the spacer 31 is retracted radially outward so as not to interfere with the substrate 301 during the raising of the substrate 301. After the substrate 301 is raised to the fourth position P4, the spacer 31 is returned to its original position on the inner side in the radial direction. Subsequently, by lowering the lift pin 21, the substrate 301 is held by the spacer 31, and the lift pin 21 is in a state of being separated downward from the substrate 301.

[0069] FIG. 14 shows an example of the operation of the substrate stacking apparatus 100A according to another embodiment, and is a view in which the upper substrate 301 is held by the suction pad 33 of the holding unit 30A. In FIG. 14, members that are the same as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified. As shown in FIG. 14, the substrate stacking apparatus 100A includes a holding unit 30A instead of the holding unit 30 described above. The holding unit 30A includes a suction pad 33 on the lower surface side of the upper plate 52. The suction pad 33 sucks the upper surface of the substrate 301. The suction pad 33 sucks the upper surface of the substrate 301 supported by the lift pin 21 and receives the substrate 301 from the lift pin 21. The suction pad 33 is a so-called vacuum suction pad. A plurality of suction pads 33 may be provided on the lower surface side of the upper plate 52. Note that the suction pad 33 is not limited to a vacuum suction pad, and may be an electrostatic suction pad or an adhesive pad. When an adhesive pad is used, an adhesive peeling mechanism (not shown) used to separate the substrate 301 from the adhesive pad is provided.

[0070] In this substrate stacking apparatus 100A, in step S12 described above, the lift pin 21 is raised until the substrate 301 comes into contact with the suction pad 33. At this time, the suction pad 33 may be lowered while the lift pin 21 is being raised. Subsequently, by sucking the inside of the suction pad 33 in step S12 described above, the substrate 301 is adsorbed to the suction pad 33. That is, similar to FIG. 13 showing step S12 described above, the substrate 301 is held by the suction pad 33 (holding unit 30A).

[0071] Subsequent to FIG. 13, the substrate 302 (lower substrate) is carried into the chamber 10 (step S13). As shown in FIG. 15, the control unit 200 lowers the lift pin 21 to the handover height of the substrate 302. Thereafter, the substrate 302 is carried into the chamber 10 by the arm 91 and disposed at the first position P1 above the lift pin 21. The arm 91 sucks and holds the substrate 302 on the lower surface side.

[0072] Subsequently, the control unit 200 raises the lift pin 21 to transfer the substrate 302 from the arm 91 to the lift pin 21 (step S14). Thereafter, the arm 91 exits the chamber 10. Thereafter, the gate valve 12 is closed, and the inside of the chamber 10 is evacuated by a suction device (not shown).

[0073] Subsequently, as shown in FIG. 16, the lift pin 21 is lowered to move the substrate 302 to the second position P2 and place it on the support portion 20. The lift pin 21 is lowered to a position below the support plate 25 to support the substrate 302 only by the support plate 25 (step S15). With this configuration, the substrate 302 becomes non-contact with the lift pin 21 and is supported by the support plate 25. Thereafter, the substrate 302 may be heated by a heater built in the support plate 25.

[0074] Subsequently, an alignment operation is performed on the substrate 302 (step S16). As shown in FIG. 17, the control unit 200 drives the alignment drive unit 61 to advance each alignment block 62 inward in the radial direction, and positions the substrate 302 by sandwiching the substrate 302 with the plurality of alignment blocks 62. After the alignment operation, the control unit 200 retracts each alignment block 62 outward in the radial direction. The alignment operation in step S08 is the same as the alignment operation in step S04. Therefore, the substrate 301 and the substrate 302 are positioned at substantially the same position in plan view.

[0075] Subsequently, the substrate 302 is raised to the third position P3 at a predetermined height below the spacer 31 (step S17). As shown in FIG. 18, the control unit 200 raises the lift pin 21 to receive the substrate 302 from the support plate 25. The control unit 200 further raises the lift pin 21 to raise the substrate 302 to the third position P3 at a preset predetermined height. Here, the third position P3 where the substrate 302 is raised is the same height as the third position P3 where the substrate 301 was raised in step S05.

[0076] Subsequently, the outer peripheral edge 302s of the substrate 302 is imaged (step S18). As shown in FIG. 19, the control unit 200 applies illumination light to the outer peripheral edge 302s of the substrate 302 through the opening 10s with each of the plurality of illuminations 72. The control unit 200 images the outer peripheral edge 302s of the substrate 302 with each of the plurality of imaging units 71. At this time, as shown in FIG. 4, each imaging unit 71 simultaneously images the outer peripheral edge 302s of the substrate 302 and the outer peripheral edge 301s of the substrate 301 located above the substrate 302. Each imaging unit 71 outputs the data of the captured image to the control unit 200.

[0077] Note that, also in the substrate stacking apparatus 100A shown in FIG. 14, the outer peripheral edge 302s of the substrate 302 is imaged in step S18 in the same manner as described above. FIG. 20 shows an example of the operation of the substrate stacking apparatus 100A according to another embodiment, and is a view of the outer peripheral edge 302s of the lower substrate 302 imaged by the imaging unit 71. As shown in FIG. 20, with the upper substrate 301 held by the suction pad 33 of the holding unit 30A and the lower substrate 302 raised to the third position P3, the imaging unit 71 images the outer peripheral edge 302s of the substrate 302.

[0078] Subsequently, the horizontal position of the substrate 302 is detected (step S19). The processing unit 201 of the control unit 200 calculates the center position of the substrate 302 from the positions of the outer peripheral edge 302s at a plurality of circumferential positions of the substrate 302 based on the image of the substrate 302 captured by the plurality of imaging units 71. At this time, the processing unit 201 separates the information regarding the outer peripheral edge 301s of the substrate 301 and the information regarding the outer peripheral edge 302s of the substrate 302 from the images captured by the plurality of imaging units 71.

[0079] The processing unit 201 removes the information regarding the outer peripheral edge 301s of the substrate 301 from the image captured by the imaging unit 71 as shown in FIG. 4, and extracts only the information regarding the outer peripheral edge 302s of the substrate 302. Specifically, for this, the processing unit 201 identifies the lower edge 302s2 of the outer peripheral edge 302s located most downward among the upper edge 301s1, the lower edge 301s2 of the outer peripheral edge 301s of the substrate 301 in the image, and the upper edge 302s1 and the lower edge 302s2 of the outer peripheral edge 302s of the substrate 302 as the outer peripheral edge 302s of the substrate 302.

[0080] Based on only the information regarding the outer peripheral edge 302s of the specified substrate 302, the processing unit 201 calculates the center position of the substrate 302 as the horizontal position of the substrate 302, and calculates the amount of deviation of the calculated center position of the substrate 302 from a preset reference position. Further, the processing unit 201 calculates the positional deviation of the substrate 302 in the circumferential direction from the position of the notch 305 on the outer peripheral edge 302s of the substrate 302 captured by each imaging unit 71.

[0081] Subsequently, it is determined whether or not the amount of deviation of the substrate 302 from the reference position is within the threshold range (step S20). The processing unit 201 determines whether or not the amounts of deviation of the calculated center position of the substrate 302 in the horizontal direction and the circumferential direction from the reference position are within the preset threshold range.

[0082] As a result, if the amount of deviation of the substrate 302 is within the threshold range, the process proceeds to step S23. On the other hand, if the amount of deviation of the substrate 302 is outside the threshold range, the control unit 200 returns to step S16 and causes the alignment operation of the substrate 302 to be performed again. After the control unit 200 performs the alignment operation of the substrate 302 again in step S16, steps S17 to S20 are repeated. If the amount of deviation of the substrate 302 becomes within the threshold range by performing the alignment operation again, the process proceeds to step S23.

[0083] On the other hand, when returning from step S20 to step S16, it is confirmed whether or not the number of repetitions of the alignment operation of the substrate 301 in step S16 has reached a preset predetermined number (step S21). As a result, even after the alignment operation of the substrate 302 in step S16 is repeatedly performed a preset predetermined number of times, if the amount of deviation of the substrate 302 is outside the threshold range, the control unit 200 outputs an alarm for indicating the occurrence of an abnormality to the operator of the substrate stacking apparatus 100 by outputting an alarm sound, emitting alarm light, displaying an alarm message, etc. (step S22).

[0084] After aligning the substrate 302, as shown in FIG. 21, the control unit 200 raises the lift pin 21 to raise the substrate 302 to the fifth position P5, and overlaps the substrate 301 and the substrate 302 (step S23). At this time, the substrate 302 is raised by the lift pin 21 and overlapped with the substrate 301 from below, so that the substrate 301 and the substrate 302 are overlapped. In this state, the substrate 301 and the substrate 302 are in a state of partial contact. Subsequently, the spacer 31 is retracted to the outside in the radial direction of the substrate 301 (step S24). By step S24, the adhesive layer F of the substrate 301 and the adhesive layer F of the substrate 302 come into contact with each other, so that the substrate 301 and the substrate 302 are bonded together to form the substrate 300.

[0085] When overlapping the substrate 301 and the substrate 302, the upper plate 52 of the holding unit 30 is lowered, and the upper surface side of the substrate 301 is pressed by the pressing pin 53. The force for bonding the substrate 301 and the substrate 302 uses the elastic force of the elastic member that contracts when the pressing pin 53 is immersed in the upper plate 52. Instead of raising the lift pin 21, the upper plate 52 may be lowered, or the lift pin 21 may be raised and the upper plate 52 may be lowered.

[0086] Also, in the substrate overlapping apparatus 100A shown in FIG. 14, in step S23, the lift pin 21 is raised toward the upper substrate 301 held by the suction pad 33, and the lower substrate 302 is pressed against the substrate 301, so that the substrate 301 and the substrate 302 are bonded together. The force for bonding the substrate 301 and the substrate 302 is controlled by the force with which the lift pin 21 rises. Instead of raising the lift pin 21, the upper plate 52 may be lowered, or the lift pin 21 may be raised and the upper plate 52 may be lowered.

[0087] Subsequently, the stacked substrates 300 are lowered (step S25). After bonding the substrate 301 and the substrate 302, as shown in FIG. 22, the control unit 200 lowers the lift pins 21 and arranges the bonded substrate 300 at the height for unloading. At this time, the spacer 31 is retracted radially outward so as not to interfere with the substrate 300. By this process, the substrate 300 is separated from both the support portion 20 and the holding portion 30.

[0088] Subsequently, the gate valve 12 is opened to unload the substrate 300 from the chamber 10 (step S26). As shown in FIG. 23, after raising the gate valve 12 to open the side opening 11, the arm 91 of the transfer device 90 enters the chamber 10 from the side opening 11, and the arm 91 is disposed below the substrate 300 supported by the lift pins 21. Thereafter, the control unit 200 raises the arm 91 and adsorbs and holds the substrate 300 on the upper surface of the arm 91, thereby transferring the substrate 300 from the lift pins 21 to the arm 91.

[0089] Note that the arm 91 may be configured to place and hold the substrate 300 on the upper surface thereof without adsorbing and holding the substrate 300. Thereafter, when the arm 91 exits the chamber 10, the substrate 300 is unloaded outside the chamber 10. Thereafter, the control unit 200 closes the gate valve 12 to end a series of processes.

[0090] As described above, in the substrate stacking apparatus 100 according to the present embodiment, the outer peripheral edge 302s of the substrate 302 supported with a predetermined interval below the substrate 301 is provided above the substrate 301 and radially outside, and the imaging optical axis is inclined by a predetermined angle from the vertical direction including the outer peripheral edge 301s or 302s of the substrate 301 or 302 and imaged by the imaging unit 71. With this configuration, a part including the outer peripheral edge 301s of the substrate 301 and a part including the outer peripheral edge 302s of the substrate 302 are imaged at the same time, and information regarding the outer peripheral edge 301s of the substrate 301 and information regarding the outer peripheral edge 302s of the substrate 302 can be separated from the captured image. Therefore, it is possible to reliably detect the positions of both the substrate 301 and the substrate 302.

[0091] The embodiments of the present invention have been described above. However, the technical scope of the present invention is not limited to the aspects described in the above embodiments and the like. It is obvious to those skilled in the art that various changes or improvements can be made to the above embodiments. Also, forms with such changes or improvements are included in the technical scope of the present invention. One or more of the requirements described in the above embodiments may be omitted. Also, the requirements described in the above embodiments can be combined as appropriate. Also, the execution order of each operation shown in the embodiment can be realized in any order as long as the results of the previous operation are not used in the subsequent operation. Also, regarding the operations in the above embodiments, even if "first", "next", "subsequently", etc. are used for convenience in the description, it is not essential to perform them in this order.

[0092] In the above-described embodiment, the form of attaching the two substrates 301 and 302 is taken as an example for explanation, but it is not limited to this form. For example, another substrate may be attached to the substrate 300 to which the substrates 301 and 302 are attached.

[0093] Also, in the above-described embodiment, when positioning the substrates 301 and 302 with the alignment block 62, the substrates 301 and 302 are supported by the support plate 25. However, the substrates 301 and 302 may be positioned by sandwiching them with the alignment block 62 while being supported by the lift pins 21.

[0094] Also, in the above embodiment, when overlapping the substrates 301 and 302, the substrates 301 and 302 may be pressed against the holding part 30 by raising the lift pins 21, or the holding parts 30 and 30A may be lowered while maintaining the raised position of the lift pins 21 to bond the substrates 301 and 302 together.

[0095] Also, in the above embodiment, when overlapping the substrates 301 and 302, the positions of the substrates 301 and 302 are detected. However, when attaching the pre-overlapped substrates 301 and 302, the positions of the substrates 301 and 302 may be detected.

Explanation of Symbols

[0096] 10…Chamber 10b…Top Plate 10s…Opening 20…Supporting Portion 30, 30A…Holding Portion 60…Alignment Mechanism 71…Imaging Unit 71c…Imaging Optical Axis 100, 100A…Substrate Stacking Device 110…Substrate Position Detection Device 201…Processing Unit 301…Substrate (Upper Substrate) 301s…Outer Periphery 302…Substrate (Lower Substrate) 302s…Outer Periphery 305…Notch Z…Predetermined Interval θ…Tilt Angle (Predetermined Angle)

Claims

1. a holding part for holding an upper substrate; a support part for supporting a lower substrate with a predetermined interval below the upper substrate; an imaging part provided above the upper substrate and radially outside, with the imaging optical axis inclined by a predetermined angle from the vertical direction including the outer peripheral edge of the upper substrate or the lower substrate, and capable of simultaneously imaging a part including the outer peripheral edge of the upper substrate and a part including the outer peripheral edge of the lower substrate; a processing part for detecting the horizontal position of the lower substrate based on the image captured by the imaging part; and a substrate position detection device, wherein the predetermined interval and the predetermined angle are set such that information regarding the outer peripheral edge of the upper substrate and information regarding the outer peripheral edge of the lower substrate can be separated from the image in the processing part.

2. The substrate position detection device according to claim 1, wherein the processing part removes information regarding the outer peripheral edge of the upper substrate from the image and detects the horizontal position of the lower substrate based on the information regarding the outer peripheral edge of the lower substrate.

3. The substrate position detection device according to claim 2, wherein the processing part calculates the center position of the lower substrate from the information regarding the outer peripheral edge of the lower substrate and calculates the amount of deviation with respect to a preset reference position.

4. The substrate position detection device according to claim 3, wherein the processing part determines whether the amount of deviation is within a preset threshold range.

5. The predetermined interval and the predetermined angle are when the predetermined angle is θ and the predetermined interval is Z, 0.6 / Z ≤ sinθ and are set to satisfy the above, the substrate position detection device according to claim 1.

6. When the upper substrate is held by the holding part or when the upper substrate is supported by the support part before being held by the holding part, the imaging part images a part including the outer peripheral edge of the upper substrate, and the processing part detects the horizontal position of the upper substrate based on the image captured by the imaging part, the substrate position detection device according to claim 1.

7. The support part supports the upper substrate at the same height as the height when the lower substrate is imaged by the imaging part, and the imaging part images a part including the outer peripheral edge of the upper substrate supported by the support part, the substrate position detection device according to claim 6.

8. The substrate position detection device according to claim 1, wherein a plurality of the imaging parts are provided at intervals around an axis in the vertical direction including the center of the upper substrate or the lower substrate.

9. The substrate position detection device according to claim 8, wherein the processing unit calculates the diameter dimension of the lower substrate based on information regarding the outer peripheral edge of the lower substrate respectively acquired from the images captured by the plurality of imaging units.

10. It includes a chamber that houses the holding unit and the support unit and has an opening formed in the top plate. The imaging unit is disposed outside the chamber, and simultaneously images a part including the outer peripheral edge of the upper substrate and a part including the outer peripheral edge of the lower substrate from the radially outer side of the upper substrate through the opening, the substrate position detection device according to claim 1.

11. The imaging unit sets the imaging optical axis at the predetermined angle within a range where it can simultaneously image a part including the outer peripheral edge of the upper substrate and a part including the outer peripheral edge of the lower substrate from the radially outer side of the upper substrate through the opening, the substrate position detection device according to claim 10.

12. The imaging unit images a notch provided on the outer peripheral edge of the lower substrate together with a part of the outer peripheral edge of the lower substrate. The processing unit acquires information regarding the notch from the image captured by the imaging unit and detects the circumferential position of the lower substrate in the direction around the vertical axis including the center of the lower substrate, the substrate position detection device according to claim 1.

13. A holding unit that holds the upper substrate. A support unit that supports the lower substrate with a predetermined interval below the upper substrate. An imaging unit provided above and radially outside the upper substrate, with the imaging optical axis inclined by a predetermined angle from the vertical direction including the outer peripheral edge of the upper substrate or the lower substrate and directed toward the lower substrate, and capable of imaging a part including the outer peripheral edge of the lower substrate. A substrate position detection device including a processing unit that detects the horizontal position of the lower substrate based on the image captured by the imaging unit.

14. A substrate stacking device including the substrate position detection device according to any one of claims 1 to 13.

15. The support unit is provided so as to be able to move up and down. An alignment mechanism that adjusts the horizontal position of the lower substrate by sandwiching the lower substrate horizontally in a state where the lower substrate is supported by the support unit or in a state where the support unit is lowered and the lower substrate is supported by an alignment support unit, the substrate stacking device according to claim 14.

16. A holding unit that holds the upper substrate. A support unit that supports the lower substrate with a predetermined interval below the upper substrate. It is provided above the upper substrate and radially outside, and the imaging optical axis is arranged to be inclined by a predetermined angle from the vertical direction including the outer peripheral edge of the upper substrate or the lower substrate toward the lower substrate, and an imaging unit capable of imaging a part including the outer peripheral edge of the lower substrate; A substrate stacking device comprising a processing unit that detects the horizontal position of the lower substrate based on an image captured by the imaging unit.

17. Holding the upper substrate; Supporting the lower substrate with a predetermined interval below the upper substrate; From above and radially outside the upper substrate, incline the imaging optical axis by a predetermined angle from the vertical direction including the outer peripheral edge of the upper substrate or the lower substrate, and simultaneously image a part including the outer peripheral edge of the upper substrate and a part including the outer peripheral edge of the lower substrate; Detecting the horizontal position of the lower substrate based on the captured image; The substrate position detection method, wherein the predetermined interval and the predetermined angle are set so as to be able to separate information regarding the outer peripheral edge of the upper substrate and information regarding the outer peripheral edge of the lower substrate from the image.

18. Before supporting the lower substrate, imaging a part including the outer peripheral edge of the upper substrate in a state where the upper substrate is supported at the height for supporting the lower substrate; Detecting the horizontal position of the upper substrate based on the captured image;

19. Calculating the deviation amount with respect to a preset reference position from the horizontal position of the lower substrate; Determining whether or not the deviation amount is within a preset threshold range; Adjusting the horizontal position of the lower substrate when it is determined that the deviation amount is outside the threshold range.

Images