Multilayered capacitor

Abstract

To provide a multilayered capacitor having increased capacitance while having excellent electrode connectivity.SOLUTION: A multilayered capacitor according to the present disclosure includes: a capacitor body which includes a dielectric layer including a barium titanate-based compound as a main component, and an internal electrode including a conductive metal; and an external electrode disposed outside the capacitor body. The internal electrode, an interface disposed between the dielectric layer and the internal electrode, or all of them includes a co-material represented by the following chemical formula 1. Definitions related to the chemical formula 1 are as described in the specification.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a multilayer capacitor.

Background Art

[0002] Recently, as the multifunctionalization and miniaturization of electronic devices have advanced rapidly, the miniaturization and performance improvement of electronic components have also been progressing at a high speed. In addition, the requirements for the high reliability of electrical devices used in automobiles or network equipment, etc., and electronic components for industrial use have increased significantly.

[0003] In order to meet such market requirements, the technological development competition of manual components such as inductors, capacitors, or resistors has been accelerating. In particular, many efforts are required to preempt the market in the development of various products of multilayer ceramic capacitors (MLCCs), which are manual components with continuously increasing applications and usage amounts.

[0004] In addition, a multilayer capacitor is a capacitor manufactured in a form in which dielectric layers and internal electrodes are stacked, and is used in various electronic devices such as mobile phones, notebook computers, and LCD TVs.

[0005] Recently, with the development of technology, multilayer capacitors have been required to be miniaturized and have a higher capacitance. For this purpose, technological development has been carried out to increase the connectivity of the internal electrodes in contact with the dielectric layers to increase the effective electrode area, or to reduce the particle size of the dielectric material and the internal electrode material.

[0006] Currently, in order to reduce the thermal shrinkage temperature difference between the dielectric layer and the internal electrode, a method of adding a nano-sized barium titanate (BaTiO3) co-material during the manufacture of the internal electrode is used.

[0007] However, if the content of the barium titanate co-material increases, the film density of the internal electrode decreases, and there is a problem that a side effect occurs in which the co-material diffused into the dielectric layer during the firing process increases the thickness of the dielectric layer and decreases the capacitance of the capacitor.

Summary of the Invention

Problems to be Solved by the Invention

[0008] One aspect of the embodiment provides a multilayer capacitor with excellent electrode connectivity and an increased capacitance.

[0009] However, the problems to be solved by the embodiment are not limited to the above problems, and can be variously extended within the scope of the technical idea included in the embodiment.

Means for Solving the Problems

[0010] A multilayer capacitor according to one embodiment includes a dielectric layer containing a barium titanate-based compound as a main component; and a capacitor body including an internal electrode containing a conductive metal, and an external electrode disposed outside the capacitor body, and the internal electrode, an interface disposed between the dielectric layer and the internal electrode, or all of these include a co-material represented by the following Chemical Formula 1. [Chemical Formula 1] M n+1 AX n

[0011] In the above Chemical Formula 1, M includes Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, or a combination thereof, A includes any one or more selected from the group consisting of Group 11 elements to Group 16 elements, X includes C, N, or a combination thereof, n is an integer from 1 to 4.

[0012] The co-material can include Ti2AlC, V2AlC, Cr2AlC, Nb2AlC, Ta2AlC, Zr2AlC, Ti2AlN, Ti3AlC2, V3AlC2, Ta3AlC2, Zr3AlC2, Ti4AlN3, V4AlC3, Nb4AlC3, Ta4AlC3, (Mo,V)4AlC3, Mo4VAlC4, Ti3SiC2, Ti4SiC3, Ti2CdC, Sc2InC, Sc2SnC, Ti2GaC, Ti2InC, Ti2TlC, V2GaC, Cr2GaC, Ti2GaN, Ti2InN, V2GaN, Cr2GaN, Ti2GeC, Ti2SnC, Ti2PbC, V2GeC, Cr2GeC, V2PC, V2AsC, Ti2SC, Zr2InC, Zr2TlC, Nb2GaC, Nb2InC, Mo2GaC, Zr2InN, Zr2TlN, Zr2SnC, Zr2PbC, Nb2SnC, Nb2PC, Nb2AsC, Zr2SC, Nb2SC, Hf2InC, Hf2TlC, Ta2GaC, Hf2SnC, Hf2PbC, Hf2SnN, Hf2SC, Ti2ZnC, Ti2ZnN, V2ZnC, Nb2CuC, Mn2GaC, Mo2AuC, Ti2AuN, Ti3GaC2, Ti3InC2, Ti3GeC2, Ti3SnC2, Ti3ZnC2, Ti4GaC3, Ti4GeC3, or a combination thereof.

[0013] The barium titanate-based compound is Ba m TiO3 (0.995 ≦ m ≦ 1.010), (Ba 1-X Ca x ) m (Ti 1-y Zr y )O3 (0.995 ≦ m ≦ 1.010, 0 ≦ x ≦ 0.10, 0 < y ≦ 0.20), Ba m (Ti 1-x Zr x )O3 (0.995 ≦ m ≦ 1.010, x ≦ 0.10), (Ba 1-X Ca x ) m (Ti 1-y Sn y )O3 (0.995 ≦ m ≦ 1.010, 0 ≦ x ≦ 0.10, 0 < y ≦ 0.20), or a combination thereof.

[0014] The dielectric layer further contains a sub-component, and the sub-component can include dysprosium (Dy), vanadium (V), manganese (Mn), chromium (Cr), silicon (Si), aluminum (Al), magnesium (Mg), tin (Sn), antimony (Sb), germanium (Ge), gallium (Ga), barium (Ba), lanthanum (La), yttrium (Y), actinium (Ac), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), hafnium (Hf), indium (In), or a combination thereof.

[0015] The dielectric layer can further contain the co-material.

[0016] The conductive metal can include Ni, Cu, Ag, Pd, Au, alloys thereof, or a combination thereof.

[0017] The cross-sectional area occupied by the co-material with respect to the cross-sectional area of the internal electrode may be 0.1% to 30%.

[0018] A multilayer capacitor according to another embodiment includes a dielectric layer containing a barium titanate-based compound as a main component; and a capacitor body including an internal electrode containing a conductive metal, and an external electrode disposed outside the capacitor body. The internal electrode, the dielectric layer, an interface disposed between the dielectric layer and the internal electrode, or all of these contain a co-material represented by the following Chemical Formula 1.

[0019] [Chemical Formula 1] M n+1 AX n

[0020] In the above Chemical Formula 1, M contains Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, or a combination thereof, A contains any one or more selected from the group consisting of Group 11 elements to Group 16 elements, X contains C, N, or a combination thereof, n is an integer from 1 to 4.

[0021] The co-material can include Ti2AlC, V2AlC, Cr2AlC, Nb2AlC, Ta2AlC, Zr2AlC, Ti2AlN, Ti3AlC2, V3AlC2, Ta3AlC2, Zr3AlC2, Ti4AlN3, V4AlC3, Nb4AlC3, Ta4AlC3, (Mo, V)4AlC3, Mo4VAlC4, Ti3SiC2, Ti4SiC3, Ti2CdC, Sc2InC, Sc2SnC, Ti2GaC, Ti2InC, Ti2TlC, V2GaC, Cr2GaC, Ti2GaN, Ti2InN, V2GaN, Cr2GaN, Ti2GeC, Ti2SnC, Ti2PbC, V2GeC, Cr2GeC, V2PC, V2AsC, Ti2SC, Zr2InC, Zr2TlC, Nb2GaC, Nb2InC, Mo2GaC, Zr2InN, Zr2TlN, Zr2SnC, Zr2PbC, Nb2SnC, Nb2PC, Nb2AsC, Zr2SC, Nb2SC, Hf2InC, Hf2TlC, Ta2GaC, Hf2SnC, Hf2PbC, Hf2SnN, Hf2SC, Ti2ZnC, Ti2ZnN, V2ZnC, Nb2CuC, Mn2GaC, Mo2AuC, Ti2AuN, Ti3GaC2, Ti3InC2, Ti3GeC2, Ti3SnC2, Ti3ZnC2, Ti4GaC3, Ti4GeC3, or a combination thereof.

[0022] The barium titanate-based compound is Ba m TiO3 (0.995 ≤ m ≤ 1.010), (Ba 1-X Ca x ) m (Ti 1-y Zr y )O3 (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), Ba m (Ti 1-x Zr x)O3 (0.995 ≤ m ≤ 1.010, x ≤ 0.10), (Ba 1-X Ca x ) m (Ti 1-y Sn y )O3 (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), or combinations thereof can be included.

[0023] The dielectric layer further includes a sub-component, and the sub-component can include dysprosium (Dy), vanadium (V), manganese (Mn), chromium (Cr), silicon (Si), aluminum (Al), magnesium (Mg), tin (Sn), antimony (Sb), germanium (Ge), gallium (Ga), barium (Ba), lanthanum (La), yttrium (Y), actinium (Ac), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), hafnium (Hf), indium (In), or combinations thereof.

[0024] The conductive metal can include Ni, Cu, Ag, Pd, Au, alloys thereof, or combinations thereof.

[0025] The cross-sectional area occupied by the co-material with respect to the cross-sectional area of the internal electrode may be 0.1% to 30%.

Advantages of the Invention

[0026] According to the multilayer capacitor according to the embodiment, there is an advantage that the capacitance increases while excellent electrode connectivity is maintained.

[0027] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content, and should be more easily understood in the process of describing the specific embodiments of the present invention.

Brief Description of the Drawings

[0028]

Figure 1

Figure 2

Figure 3

Figure 4

Embodiments for Carrying Out the Invention

[0029] Hereinafter, embodiments of the present invention will be described in detail so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement it with reference to the attached drawings. For the purpose of clearly explaining the present invention in the drawings, parts that are unnecessary for the explanation are omitted, and the same reference numerals are given to the same or similar components throughout the specification. Also, the attached drawings are only for facilitating the understanding of the embodiments disclosed in this specification, and the technical idea disclosed in this specification is not limited by the attached drawings, and it must be understood that all changes, equivalents, and alternatives included in the idea and technical scope of the present invention are included.

[0030] Terms including ordinal numbers such as first, second, etc. can be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

[0031] When a component is referred to as being "connected to" or "connected with" another component, it should be understood that it may be directly connected to, connected to, or opposed to the other component, but there may also be other components in between. On the contrary, when a component is referred to as being "directly connected to" or "directly connected with" another component, it should be understood that there are no other components in between.

[0032] Throughout the specification, terms such as "comprising" or "having" are intended to specify the presence of the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and should not be construed as precluding the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. Thus, when a portion "comprises" a certain component, this means that it can further comprise other components rather than excluding other components unless there is a contrary statement.

[0033] FIG. 1 is a perspective view showing a multilayer capacitor 100 according to an embodiment, FIG. 2 is a cross-sectional view of the multilayer capacitor 100 taken along line I-I' of FIG. 1, and FIG. 3 is an exploded perspective view showing the laminated structure of the internal electrodes in the capacitor body 110 of FIG. 1.

[0034] To clearly explain this embodiment, if directions are defined, the L-axis, W-axis, and T-axis shown in the drawings respectively indicate the length direction, width direction, and thickness direction of the capacitor body 110. Here, the thickness direction (T-axis direction) may be a direction perpendicular to the broad surface (main surface) of the sheet-shaped component, and as an example, it can be used as the same concept as the lamination direction in which the dielectric layer 111 is laminated. The length direction (L-axis direction) may be a direction that extends parallel to the broad surface (main surface) of the sheet-shaped component and is substantially perpendicular to the thickness direction (T-axis direction), and as an example, it may be the direction in which the first external electrode 131 and the second external electrode 132 are located on both sides. The width direction (W-axis direction) may be a direction that extends parallel to the broad surface (main surface) of the sheet-shaped component and is substantially perpendicular to the thickness direction (T-axis direction) and the length direction (L-axis direction), and the length of the sheet-shaped component in the length direction (L-axis direction) may be even longer than the length in the width direction (W-axis direction).

[0035] Referring to FIGS. 1 to 3, a multilayer capacitor 100 according to an embodiment may include a capacitor body 110, and a first external electrode 131 and a second external electrode 132 disposed at both ends facing the length direction (L-axis direction) of the capacitor body 110.

[0036] The capacitor body 110 may be, for example, in a substantially hexahedral shape.

[0037] In this embodiment, for convenience of explanation, both surfaces of the capacitor body 110 facing each other in the thickness direction (T-axis direction) are defined as the first surface and the second surface, both surfaces connected to the first surface and the second surface and facing each other in the length direction (L-axis direction) are defined as the third surface and the fourth surface, and both surfaces connected to the first surface and the second surface and connected to the third surface and the fourth surface and facing each other in the width direction (W-axis direction) are defined as the fifth surface and the sixth surface.

[0038] As an example, the first surface, which is the lower surface, can be the surface facing the mounting direction. Also, the first surface to the sixth surface may be flat, but the present embodiment is not limited thereto. For example, the first surface to the sixth surface may be a curved surface with a convex center, and the corners that are the boundaries of each surface may be rounded.

[0039] The shape, dimensions, and number of stacked dielectric layers 111 of the capacitor body 110 are not limited to those shown in the drawings of the present embodiment.

[0040] The capacitor body 110 is obtained by stacking a plurality of dielectric layers 111 in the thickness direction (T-axis direction) and then firing, and includes a first internal electrode layer 121 and a second internal electrode layer 122 that are alternately arranged in the thickness direction (T-axis direction with the dielectric layers 111 interposed therebetween.

[0041] At this time, the boundaries between the respective adjacent dielectric layers 111 of the capacitor body 110 can be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM).

[0042] In addition, the capacitor body 110 can include an active region and cover regions 112 and 113.

[0043] The active region is a portion that contributes to forming the capacitance of the multilayer capacitor 100. As an example, the active region may be a region where the first internal electrode layer 121 or the second internal electrode layer 122 laminated along the thickness direction (T-axis direction) overlaps.

[0044] The cover regions 112 and 113 are margin portions in the thickness direction and can be respectively disposed on the first and second surface sides of the active region in the thickness direction (T-axis direction). Such cover regions 112 and 113 may be those in which a single dielectric layer 111 or two or more dielectric layers 111 are respectively laminated on the upper and lower surfaces of the active region.

[0045] In addition, the capacitor body 110 can further include side cover regions. The side cover regions are margin portions in the width direction and can be respectively disposed on the fifth and sixth surface sides of the active region in the width direction (W-axis direction). Such side cover regions can be formed by applying a conductive paste layer for forming an internal electrode only to a partial region of the surface of the dielectric green sheet when applying the conductive paste layer to the surface of the dielectric green sheet, laminating dielectric green sheets on both side surfaces of the surface of the dielectric green sheet where the conductive paste layer is not applied, and then firing.

[0046] The cover regions 112 and 113 and the side cover regions serve to prevent damage to the first internal electrode layer 121 and the second internal electrode layer 122 due to physical or chemical stress.

[0047] A multilayer capacitor according to an embodiment includes a dielectric layer 111 containing a barium titanate-based compound as a main component; a capacitor body including internal electrodes 121 and 122 containing a conductive metal, and an external electrode disposed outside the capacitor body, and the internal electrodes 121 and 122, an interface disposed between the dielectric layer 111 and the internal electrodes 121 and 122, or all of these contain a co-material represented by Chemical Formula 1. As an example, the dielectric layer 111 may further contain the co-material.

[0048] In one embodiment, the co-material is represented by the following Chemical Formula 1.

[0049] [Chemical Formula 1] M n+1 AX n

[0050] In the above Chemical Formula 1, M includes Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, or a combination thereof, A includes any one or more selected from the group consisting of Group 11 elements to Group 16 elements, X includes C, N, or a combination thereof, n is an integer from 1 to 4.

[0051] As an example, the A may include any one or more selected from the group consisting of Group 11 elements to Group 16 elements. As an example, the A may include Group 13 elements, Group 14 elements, and combinations thereof, and as a specific example, the A may include Al, Ga, In, Tl, Si, Ge, Sn, Pb, Zn, Cd, P, As, S, Cu, Au, or a combination thereof.

[0052] As an example, the co-material can include Ti2AlC, V2AlC, Cr2AlC, Nb2AlC, Ta2AlC, Zr2AlC, Ti2AlN, Ti3AlC2, V3AlC2, Ta3AlC2, Zr3AlC2, Ti4AlN3, V4AlC3, Nb4AlC3, Ta4AlC3, (Mo,V)4AlC3, Mo4VAlC4, Ti3SiC2, Ti4SiC3, Ti2CdC, Sc2InC, Sc2SnC, Ti2GaC, Ti2InC, Ti2TlC, V2GaC, Cr2GaC, Ti2GaN, Ti2InN, V2GaN, Cr2GaN, Ti2GeC, Ti2SnC, Ti2PbC, V2GeC, Cr2GeC, V2PC, V2AsC, Ti2SC, Zr2InC, Zr2TlC, Nb2GaC, Nb2InC, Mo2GaC, Zr2InN, Zr2TlN, Zr2SnC, Zr2PbC, Nb2SnC, Nb2PC, Nb2AsC, Zr2SC, Nb2SC, Hf2InC, Hf2TlC, Ta2GaC, Hf2SnC, Hf2PbC, Hf2SnN, Hf2SC, Ti2ZnC, Ti2ZnN, V2ZnC, Nb2CuC, Mn2GaC, Mo2AuC, Ti2AuN, Ti3GaC2, Ti3InC2, Ti3GeC2, Ti3SnC2, Ti3ZnC2, Ti4GaC3, Ti4GeC3, or a combination thereof.

[0053] As a specific example, the co-material can include Ti2AlC, Ti3AlC2, Ti3SiC2, Ti4SiC3, Ti2SnC, or a combination thereof.

[0054] The co-material can mean a substance added to delay the sintering rate of the conductive metal contained in the internal electrodes 121 and 122 and to keep the shrinkage start temperature the same as that of the dielectric material of the dielectric layer 111. The co-material is included in the conductive paste for the internal electrodes during the firing process of the capacitor body and may be included in the internal electrodes 121 and 122, the dielectric layer 111, the interface located between the dielectric layer 111 and the internal electrodes 121 and 122, or all of these after firing.

[0055] As an example, the co-material represented by the chemical formula 1 may be a MAX phases compound. The MAX phase compound is a compound having all the characteristics of metals and ceramics, and is characterized by very excellent thermal conductivity and electrical conductivity, and high strength and modulus. By including the co-material represented by the chemical formula 1 in the internal electrodes 121 and 122, the dielectric layer 111, the interface layer, or all of these, a multilayer capacitor with excellent electrode connectivity and increased capacitance can be realized.

[0056] Referring to FIG. 4, the co-material represented by the chemical formula 1 may be located within the internal electrodes 121 and 122, or may be disposed at an interface located between the internal electrodes 121 and 122 and the dielectric layer 111.

[0057] As an example, a part of the co-material contained in the conductive paste for the internal electrode during the firing process of the capacitor body is trapped within the internal electrodes 121 and 122, increasing the sintering temperature of the internal electrodes 121 and 122 and delaying the sintering of the internal electrodes 121 and 122 while improving the strength of the internal electrodes. Thereby, the connectivity of the internal electrodes 121 and 122 can be improved. Further, since the co-material has excellent electrical conductivity and can serve as an electrode within the internal electrodes 121 and 122, the connectivity of the internal electrodes 121 and 122 can be further improved.

[0058] As an example, a part of the co-material contained in the conductive paste for the internal electrode during the firing process of the capacitor body may be included in the interface located between the dielectric layer 111 and the internal electrodes 121 and 122. The co-material included in the interface can promote sintering at the interface and improve the interfacial adhesion force between the internal electrodes 121 and 122 and the dielectric layer 111.

[0059] As an example, in the firing process of the capacitor body, some other parts in the co-material contained in the conductive paste for the internal electrodes leak out from the conductive paste for the internal electrodes and diffuse to the dielectric green sheet side and are included in the dielectric layer 111. In the case of existing ceramic co-materials conventionally used, if they diffuse into the dielectric layer 111, there was a problem of increasing the thickness of the dielectric layer 111 and decreasing the capacitance of the capacitor. However, even if the co-material represented by the chemical formula 1 diffuses into the dielectric layer 111, since it is a substance with excellent electrical conductivity, the problem of increasing the thickness of the dielectric layer 111 can be solved.

[0060] The method for confirming the co-material represented by the chemical formula 1 in the internal electrodes 121, 122, the interface, or the dielectric layer 111 is as follows.

[0061] First, after putting the multilayer capacitor 100 into an epoxy mixture and curing it, polish the side surfaces in the L-axis direction and the T-axis direction of the capacitor body 110 to the 1 / 2 point in the W-axis direction (Polishing), fix it, and maintain it in a vacuum atmosphere chamber. Then, prepare a cross-sectional sample (hereinafter referred to as "cross-sectional sample") cut from the center in the W-axis direction of the capacitor body 110 in the L-axis direction and the T-axis direction.

[0062] After that, observe the cross-sectional sample with a transmission electron microscope (TEM) or a scanning electron microscope (SEM) to prepare a TEM or SEM image.

[0063] As an example, based on the results of analyzing the element distribution for each region through TEM-EDS or SEM-EDS analysis in the image, the interface located between the internal electrodes 121, 122 and the dielectric layer 111 can be confirmed with the boundary being the part where the dielectric substance (for example, Ba) is not detected. As another example, the internal electrodes 121, 122 and the dielectric layer 111 with a difference in light and dark can be confirmed by a method such as binarizing the image, and the interface located therebetween can be confirmed.

[0064] Thereafter, the presence of the co-material can be confirmed in the internal electrodes 121 and 122, the interface, or the dielectric layer 111 through the distribution analysis of the elements contained in the co-material represented by the chemical formula 1.

[0065] As an example, the cross-sectional area occupied by the co-material in the cross-sectional areas of the internal electrodes 121 and 122 may be 0.1% to 30%.

[0066] The cross-sectional area of the internal electrode can mean the area of the co-material trapped in the internal electrode.

[0067] When the area occupied by the co-material in the cross-sectional areas of the internal electrodes 121 and 122 is less than 0.1%, it may be difficult to sufficiently improve the electrode connectivity. Also, when the area occupied by the co-material in the areas of the internal electrodes 121 and 122 exceeds 30%, the short-circuit occurrence rate may increase due to the aggregation phenomenon, and the electrode connectivity may decrease.

[0068] Internal electrode The first internal electrode 121 and the second internal electrode 122 are electrodes having different polarities from each other, and are alternately arranged facing each other along the T-axis direction with the dielectric layer 111 interposed therebetween, and one end of each is exposed through the third surface and the fourth surface of the capacitor body 110.

[0069] The first internal electrode 121 and the second internal electrode 122 are electrically insulated from each other by the dielectric layer 111 disposed therebetween.

[0070] The ends of the first internal electrode 121 and the second internal electrode 122 alternately exposed through the third surface and the fourth surface of the capacitor body 110 are respectively connected to the first external electrode 131 and the second external electrode 132 and can be electrically connected.

[0071] In one embodiment, the internal electrodes 121 and 122 include a conductive metal and the co-material represented by the foregoing chemical formula 1.

[0072] Since the co-material represented by the above chemical formula 1 has been described above, the description thereof will be omitted here.

[0073] As an example, the conductive metal can include Ni, Cu, Ag, Pd, Au, alloys thereof, or combinations thereof. For example, it can include metals such as Ni, Cu, Ag, Pd, or Au, and alloys thereof, such as Ag-Pd alloy.

[0074] Also, the first internal electrode 121 and the second internal electrode 122 can also contain dielectric particles of the same composition system as the ceramic material contained in the dielectric layer 111.

[0075] The first internal electrode 121 and the second internal electrode 122 can be formed using a conductive paste containing a conductive metal. As the printing method of the conductive paste, a screen printing method or a gravure printing method can be used.

[0076] As an example, the average thickness of the first internal electrode 121 and the second internal electrode 122 may be 0.05 μm or more, 0.1 μm or more, 0.2 μm, or 0.25 μm or more, and may also be 2 μm or less, 1 μm or less, or 0.5 μm or less.

[0077] The average thickness of the first internal electrodes 121 and 122 can be measured by the following method.

[0078] In the scanning electron microscope (SEM) image of the cross-sectional sample, taking the central point in the L-axis direction or the W-axis direction of the first internal electrode 121 or the second internal electrode 122 as the reference point, the arithmetic mean value of the thicknesses of the first internal electrode 121 or the second internal electrode 122 at 10 points separated from the reference point by a predetermined interval can be obtained to obtain the average thickness of the internal electrode.

[0079] The interval between the 10 points can be adjusted according to the scale of the scanning electron microscope (SEM) image, and may be, for example, an interval of 1 μm to 100 μm, 1 μm to 50 μm, or 1 μm to 10 μm.

[0080] At this time, all 10 points must be located within the first internal electrode 121 or the second internal electrode 122. If all 10 points are not located within the first internal electrode 121 or the second internal electrode 122, the position of the reference point can be changed, or the interval between the 10 points can be adjusted.

[0081] Dielectric layer The dielectric layer 111 contains a dielectric, and the dielectric can include a main component and a sub-component.

[0082] The main component is the base material of the dielectric, has a high dielectric constant, and contributes to the formation of the dielectric constant of the multilayer capacitor 100.

[0083] As an example, the main component includes a barium titanate-based compound, and the barium titanate-based compound is Ba m TiO3 (0.995 ≦ m ≦ 1.010), (Ba 1-X Ca x ) m (Ti 1-y Zr y )O3 (0.995 ≦ m ≦ 1.010, 0 ≦ x ≦ 0.10, 0 < y ≦ 0.20), Ba m (Ti 1-x Zr x )O3 (0.995 ≦ m ≦ 1.010, x ≦ 0.10), (Ba 1-X Ca x ) m (Ti 1-y Sn y )O3 (0.995 ≦ m ≦ 1.010, 0 ≦ x ≦ 0.10, 0 < y ≦ 0.20), or a dielectric material including a combination thereof may be used.

[0084] As an example, the main component can include BaTiO3, Ba(Ti,Zr)O3, Ba(Ti,Sn)O3, (Ba,Ca)TiO3, (Ba,Ca)(Ti,Zr)O3, (Ba,Ca)(Ti,Sn)O3, (Ba,Sr)TiO3, (Ba,Sr)(Ti,Zr)O3, (Ba,Sr)(Ti,Sn)O3, or a combination thereof.

[0085] As an example, the secondary components can include dysprosium (Dy), vanadium (V), manganese (Mn), chromium (Cr), silicon (Si), aluminum (Al), magnesium (Mg), tin (Sn), antimony (Sb), germanium (Ge), gallium (Ga), barium (Ba), lanthanum (La), yttrium (Y), actinium (Ac), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), hafnium (Hf), indium (In), or combinations thereof.

[0086] The dielectric may further contain a ceramic additive, an organic solvent, a binder, a dispersant, or combinations thereof.

[0087] As an example, the dielectric layer 111 can further contain the co-material represented by Chemical Formula 1, and since it has been described above, detailed description is omitted here.

[0088] As an example, the average thickness of the dielectric layer 111 may be 0.3 μm or more, 0.5 μm or more, 1.0 μm or more, or 2.0 μm or more, and may also be 10 μm or less, 8.0 μm or less, 5.0 μm or less, or 3.0 μm or less.

[0089] The average thickness of the dielectric layer 111 can be measured by the following method.

[0090] First, prepare a scanning electron microscope image obtained by observing a cross-sectional sample with a scanning electron microscope (SEM).

[0091] In the scanning electron microscope (SEM) image of the cross-sectional sample, the arithmetic mean value of the thickness of the dielectric layer 111 may be used at 10 points separated by a predetermined interval from the reference point, with the reference point being the central point in the length direction (L-axis direction) or the width direction (W-axis direction) of the dielectric layer 111.

[0092] The interval between the 10 points can be adjusted according to the scale of the scanning electron microscope (SEM) image, and may be, for example, an interval of 1 μm to 100 μm, 1 μm to 50 μm, or 1 μm to 10 μm.

[0093] At this time, all 10 points must be located within the dielectric layer 111. If all 10 points are not located within the dielectric layer 111, the position of the reference point can be changed, or the interval between the 10 points can be adjusted.

[0094] External electrode The first external electrode 131 and the second external electrode 132 are provided with voltages of different polarities and are respectively connected to the exposed portions of the first internal electrode 121 and the second internal electrode 122 to be electrically connected.

[0095] With the above configuration, when a predetermined voltage is applied to the first external electrode 131 and the second external electrode 132, charges are accumulated between the first internal electrode 121 and the second internal electrode 122 facing each other. At this time, the capacitance of the multilayer capacitor 100 becomes proportional to the overlapping area of the first internal electrode 121 and the second internal electrode 122 that overlap each other along the T-axis direction in the active region.

[0096] The first external electrode 131 and the second external electrode 132 may each include a first connection portion and a second connection portion that are respectively disposed on the third surface and the fourth surface of the capacitor body 110 and connected to the first internal electrode 121 and the second internal electrode 122, the third surface and the fourth surface of the capacitor body 110, and a first band portion and a second band portion that are disposed at the corners where the first surface and the second surface or the fifth surface and the sixth surface are in contact.

[0097] The first band portion and the second band portion are each extended from the first connection portion and the second connection portion to a part of the first surface and the second surface or the fifth surface and the sixth surface of the capacitor body 110. The first band portion and the second band portion can serve to improve the adhesion strength of the first external electrode 131 and the second external electrode 132.

[0098] As an example, each of the first external electrode 131 and the second external electrode 132 can include a sintered metal layer that contacts the capacitor body 110, a conductive resin layer disposed to cover the sintered metal layer, and a plating layer disposed to cover the conductive resin layer.

[0099] The sintered metal layer can include a conductive metal and glass.

[0100] As an example, the sintered metal layer can include copper (Cu), nickel (Ni), silver (Ag), palladium (Pd), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), lead (Pb), alloys thereof, or combinations thereof as the conductive metal, and for example, copper (Cu) can include a copper (Cu) alloy. When the conductive metal includes copper, the metal other than copper may be included in an amount of 5 mol or less per 100 mol of copper.

[0101] As an example, the sintered metal layer can include a composition in which an oxide is mixed as glass, and for example, it may be one or more selected from the group consisting of silicon oxide, boron oxide, aluminum oxide, transition metal oxide, alkali metal oxide, and alkaline earth metal oxide. The transition metal is selected from the group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni), the alkali metal is selected from the group consisting of lithium (Li), sodium (Na), and potassium (K), and the alkaline earth metal may be one or more selected from the group consisting of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba).

[0102] Optionally, the conductive resin layer is formed on the sintered metal layer, and can be formed, for example, in a form that completely covers the sintered metal layer. On the other hand, the first external electrode 131 and the second external electrode 132 may not contain the sintered metal layer. In this case, the conductive resin layer will be in direct contact with the capacitor body 110.

[0103] The conductive resin layer extends to the first and second surfaces or the fifth and sixth surfaces of the capacitor body 110, and the length of the region (i.e., the band portion) where the conductive resin layer extends and is disposed on the first and second surfaces or the fifth and sixth surfaces of the capacitor body 110 may be longer than the length of the region (i.e., the band portion) where the sintered metal layer extends and is disposed on the first and second surfaces or the fifth and sixth surfaces of the capacitor body 110. That is, the conductive resin layer is formed on the sintered metal layer and can be formed in a form that completely covers the sintered metal layer.

[0104] The conductive resin layer contains resin and conductive metal.

[0105] The resin contained in the conductive resin layer has bonding properties and shock absorption properties, and is not particularly limited as long as it can be mixed with the conductive metal powder to make a paste. For example, it can contain phenolic resin, acrylic resin, silicone resin, epoxy resin, or polyimide resin.

[0106] The conductive metal contained in the conductive resin layer serves to be electrically connected to the first internal electrode 121 and the second internal electrode 122 or the sintered metal layer.

[0107] The conductive metal contained in the conductive resin layer can have a spherical shape, a flake shape, or a combination of these forms. That is, the conductive metal may consist only of the flake shape, or only of the spherical shape, or may be a form in which the flake shape and the spherical shape are mixed.

[0108] Here, the spherical shape can include forms that are not perfectly spherical. For example, it can include forms where the length ratio of the major axis to the minor axis (major axis / minor axis) is 1.45 or less. The flake-shaped powder means a powder having a flat and elongated form, and is not particularly limited. For example, the length ratio of the major axis to the minor axis (major axis / minor axis) may be 1.95 or more.

[0109] The first external electrode 131 and the second external electrode 132 can further include a plating layer disposed outside the conductive resin layer.

[0110] The plating layer can include nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), or the like, alone or an alloy thereof. As an example, the plating layer may be a nickel (Ni) plating layer or a tin (Sn) plating layer, or may be a form in which a nickel (Ni) plating layer and a tin (Sn) plating layer are sequentially laminated, or may be a form in which a tin (Sn) plating layer, a nickel (Ni) plating layer, and a tin (Sn) plating layer are sequentially laminated. Also, the plating layer can include a plurality of nickel (Ni) plating layers and / or a plurality of tin (Sn) plating layers.

[0111] The plating layer can improve the mountability with the substrate of the multilayer capacitor 100, the structural reliability, the durability against the outside, the heat resistance, and the equivalent series resistance (ESR).

[0112] Method for manufacturing a multilayer capacitor The manufacturing method of the multilayer capacitor according to another embodiment includes a step of manufacturing a capacitor body including a dielectric layer and an internal electrode, and a step of forming an external electrode outside the capacitor body.

[0113] First, the manufacturing of the capacitor body will be described.

[0114] In the manufacturing process of the capacitor body, a dielectric paste that becomes a dielectric layer after firing and a conductive paste that becomes an internal electrode after firing are prepared.

[0115] The dielectric paste is manufactured, for example, by the following method. The dielectric powder is uniformly mixed by means such as wet mixing, dried, and then heat-treated under predetermined conditions to obtain a plastic powder. An organic vehicle or an aqueous vehicle is added to the obtained plastic powder and kneaded to prepare a dielectric paste.

[0116] The obtained dielectric paste is sheeted by a technique such as the doctor blade method to obtain a dielectric green sheet. The dielectric paste may also contain additives selected from various dispersants, plasticizers, dielectrics, sub-component compounds, or glass, etc., if necessary.

[0117] The conductive paste for the internal electrode is prepared by kneading conductive powder made of a conductive metal or its alloy and a co-material represented by the following Chemical Formula 1 with a binder and a solvent.

[0118] [Chemical Formula 1] M n+1 AX n

[0119] In the above Chemical Formula 1, M includes Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, or a combination thereof, A includes any one or more selected from the group consisting of Group 11 elements to Group 16 elements, X includes C, N, or a combination thereof, n is an integer from 1 to 4.

[0120] Since the co-material represented by Chemical Formula 1 has been described above, detailed description is omitted here.

[0121] On the surface of the dielectric green sheet, a conductive paste for internal electrodes is applied in a predetermined pattern by various printing methods such as screen printing or transfer methods. Then, after laminating the dielectric green sheets with internal electrode patterns formed thereon in multiple layers, a dielectric green sheet laminate is obtained by pressing in the lamination direction. At this time, on the upper and lower surfaces of the dielectric green sheet laminate in the lamination direction, the dielectric green sheet and the internal electrode pattern can be laminated so that the dielectric green sheet is positioned.

[0122] Optionally, the obtained dielectric green sheet laminate can be cut into a predetermined size by dicing or the like.

[0123] Also, the dielectric green sheet laminate can be solidified and dried to remove a plasticizer or the like if necessary, and can be barrel polished using a horizontal centrifugal barrel polishing machine or the like after solidification and drying. In barrel polishing, the dielectric green sheet laminate is put into a barrel container together with media and a polishing liquid, and by applying rotational motion, vibration, etc. to the barrel container, unnecessary portions such as burrs generated during cutting can be polished. Also, after barrel polishing, the dielectric green sheet laminate can be washed with a cleaning liquid such as water and dried.

[0124] The dielectric green sheet laminate is subjected to a debinding process and a firing process to obtain a capacitor body.

[0125] The conditions of the debinding process can be appropriately adjusted according to the main component composition of the dielectric layer and the main component composition of the internal electrode. For example, the heating rate during the debinding process may be 5 °C / hour to 300 °C / hour, the holding temperature may be 180 °C to 400 °C, and the temperature holding time may be 0.5 hour to 24 hours. The debinding atmosphere may be air or a reducing atmosphere.

[0126] The conditions of the firing process can be appropriately adjusted according to the main component composition of the dielectric layer and the main component composition of the internal electrodes. For example, the temperature during firing may be 1200°C to 1350°C, or 1220°C to 1300°C, and the time may be 0.5 hours to 8 hours, or 1 hour to 3 hours. The firing atmosphere may be a reducing atmosphere. For example, it may be an atmosphere in which a mixed gas of nitrogen gas (N2) and hydrogen gas (H2) is humidified.

[0127] After the firing process, annealing can be carried out if necessary. Annealing is a process for re-oxidizing the dielectric layer, and can be carried out when the firing process is carried out in a reducing atmosphere. The conditions of the annealing process can also be appropriately adjusted according to the main component composition of the dielectric layer, etc. For example, the temperature during annealing may be 950°C to 1150°C, the time may be 0 hours to 20 hours, and the heating rate may be 50°C / hour to 500°C / hour. The annealing atmosphere may be a humidified nitrogen gas (N2) atmosphere, and the oxygen partial pressure may be 1.0×10 -9 MPa to 1.0×10 -5 MPa.

[0128] In the debinding process, firing process, or annealing process, in order to humidify nitrogen gas, mixed gas, etc., for example, a wetter can be used. In this case, the water temperature may be 5°C to 75°C. The debinding process, firing process, and annealing process can be carried out continuously or independently.

[0129] Optionally, surface treatments such as sandblasting, laser irradiation, or barrel polishing can be carried out on the third and fourth surfaces of the obtained capacitor body. By carrying out such surface treatments, the ends of the first internal electrode and the second internal electrode are exposed on the outermost surfaces of the third and fourth surfaces, whereby the electrical connection between the first external electrode and the second external electrode and the first internal electrode and the second internal electrode becomes good, and an alloy portion can be easily formed.

[0130] Thereafter, a paste for forming a sintered metal layer can be applied to the outer surface of the obtained capacitor body and then sintered to form a sintered metal layer.

[0131] The paste for forming a sintered metal layer can contain a conductive metal and glass. Since the descriptions of the conductive metal and glass are the same as those described above, repetitive explanations are omitted. Further, the paste for forming a sintered metal layer can selectively contain sub-components such as a binder, a solvent, a dispersant, a plasticizer, or an oxide powder. For example, ethyl cellulose, acrylic, or butyral can be used as the binder, and organic solvents such as terpineol, butyl carbitol, alcohol, methyl ethyl ketone, acetone, or toluene, or aqueous solvents can be used as the solvent.

[0132] As a method of applying the paste for forming a sintered metal layer to the outer surface of the capacitor body, a dipping method, various printing methods such as screen printing, an application method using a dispenser, or a spraying method using a spray can be used. The paste for the sintered metal layer is applied to at least the third and fourth surfaces of the capacitor body, and can also be selectively applied to a part of the first surface, the second surface, the fifth surface, or the sixth surface where the band portions of the first external electrode and the second external electrode are formed.

[0133] Thereafter, the capacitor body coated with the paste for forming a sintered metal layer is dried and sintered at a temperature of 700°C to 1000°C for 0.1 hour to 3 hours to form a sintered metal layer.

[0134] Optionally, a conductive resin layer can be formed by applying a paste for forming a conductive resin layer to the outer surface of the obtained capacitor body and then curing it.

[0135] The paste for forming a conductive resin layer can contain a resin and, optionally, a conductive metal or a non-conductive filler. Since the descriptions of the conductive metal and the resin are the same as those described above, repetitive explanations are omitted. Further, the paste for forming a conductive resin layer can optionally contain sub-components such as a binder, a solvent, a dispersant, a plasticizer, or oxide powder. For example, ethyl cellulose, acrylic, or butyral can be used as the binder, and organic solvents such as terpineol, butyl carbitol, alcohol, methyl ethyl ketone, acetone, or toluene, or aqueous solvents can be used as the solvent.

[0136] As an example, the method for forming a conductive resin layer can be formed by dipping the capacitor body 110 into the paste for forming a conductive resin layer and then curing it, or by printing the paste for forming a conductive resin layer on the surface of the capacitor body 110 by a screen printing method or a gravure printing method, or by applying the paste for forming a conductive resin layer on the surface of the capacitor body 110 and then curing it.

[0137] Next, a plating layer is formed outside the conductive resin layer.

[0138] As an example, the plating layer can be formed by a plating method, and can also be formed by sputtering or electric deposition.

[0139] Hereinafter, specific examples of the invention will be presented. However, the examples described below are only for specifically exemplifying or explaining the invention, and the scope of the invention should not be limited thereby.

[0140] [Examples] Example 1 A slurry for a dielectric containing BaTiO3 was produced, and a dielectric green sheet was produced using the slurry for a dielectric with an on-roll coater of a head discharge type.

[0141] After that, a conductive paste for an internal electrode was manufactured by including Ni and a Ti3AlC2 composite material as the conductive powder.

[0142] The conductive paste was printed on the surface of the dielectric green sheet, and a dielectric green sheet (width × length × height = 3.2 mm × 2.5 mm × 2.5 mm) with a conductive paste layer formed thereon was laminated and pressed to manufacture a dielectric green sheet laminate.

[0143] The dielectric green sheet laminate was subjected to a plasticizing process in a nitrogen atmosphere at 400 °C or lower and then fired under conditions of a firing temperature of 1300 °C or lower and a hydrogen concentration of 1.0% H2 or lower to manufacture a multilayer capacitor according to Example 1.

[0144] Example 2 A multilayer capacitor according to Example 2 was manufactured in the same manner as in Example 1, except that a conductive paste for an internal electrode containing Ti2AlC as a composite material instead of Ti3AlC2 was manufactured.

[0145] Example 3 A multilayer capacitor according to Example 3 was manufactured in the same manner as in Example 1, except that a conductive paste for an internal electrode containing Ti3SiC2 as a composite material instead of Ti3AlC2 was manufactured.

[0146] Example 4 A multilayer capacitor according to Example 4 was manufactured in the same manner as in Example 1, except that a conductive paste for an internal electrode containing Ti2SnC as a composite material instead of Ti3AlC2 was manufactured.

[0147] Comparative Example 1 A multilayer capacitor according to Comparative Example 1 was manufactured in the same manner as in Example 1, except that a conductive paste for an internal electrode containing BaTiO3 as a composite material instead of Ti3AlC2 was manufactured.

[0148] (Evaluation Example) Evaluation Example 1: Evaluation of electrode connectivity The electrode connectivity of the multilayer capacitors manufactured in Examples 1 to 4 and Comparative Example 1 was evaluated.

[0149] First, after placing the multilayer capacitor in an epoxy mixture and curing it, the sides of the capacitor body in the W-axis direction and the T-axis direction were polished to the 1 / 2 point in the L-axis direction. After fixing, it was maintained in a vacuum atmosphere chamber, and a cross-sectional sample cut from the center of the capacitor body in the L-axis direction in the W-axis direction and the T-axis direction was prepared. Then, the cross-sectional sample was observed with a scanning electron microscope (SEM) to prepare an SEM image.

[0150] After that, after selecting an arbitrary internal electrode and drawing a virtual line in the L-axis direction, the ratio of the unbroken internal electrode length to the total length of the internal electrode was measured and shown in Table 1 below.

[0151] Evaluation Example 2: Evaluation of capacitor capacitance The capacitance of the multilayer capacitors manufactured in Examples 1 to 4 and Comparative Example 1 was evaluated.

[0152] Specifically, the capacitance of each capacitor sample was measured using an LCR meter, and the measured capacitance was divided by 2.88 mm, which is the volume of the sample, to derive the capacitance per unit volume. The rated voltage of each sample was made the same at 50 V, and the rated voltage was multiplied by the capacitance per unit volume derived above to derive the capacitance of each multilayer capacitor. 3 Using the capacitance of the multilayer capacitor of Comparative Example 1 as a reference (100%), the capacitances of the multilayer capacitors of Examples 1 to 4 were converted to relative ratios and shown in Table 1 below.

[0153] Using the capacitance of the multilayer capacitor of Comparative Example 1 as a reference (100%), the capacitances of the multilayer capacitors of Examples 1 to 4 were converted to relative ratios and shown in Table 1 below.

[0154] Evaluation Example 3: Evaluation of moisture resistance reliability The moisture resistance reliability of the multilayer capacitors manufactured in Examples 1 to 4 and Comparative Example 1 was evaluated.

[0155] The moisture resistance reliability evaluation was performed by the 8585 test, and it was evaluated by applying a rated voltage of 1 Vr for 24 hours at a temperature condition of 85°C and a relative humidity condition of 85%.

[0156] At this time, if the insulation resistance (IR) value of the multilayer capacitor drops to 10 times or less of the initial insulation resistance (IR), 6 and if any one of the following conditions is met, it is evaluated as defective and marked as X in Table 1 below.

[0157] Also, if there is no multilayer electronic component whose insulation resistance (IR) value has dropped to 10 times or less of the initial insulation resistance (IR0), 6 it is evaluated as non-defective and marked as O in the following table.

[0158]

Table 1

[0159] Referring to Table 1, in the case of the multilayer capacitors of Examples 1 to 4 using the MAX phase compound as a co-material, when compared with Comparative Example 1, it can be confirmed that the capacitance of the capacitor is significantly superior while the electrode connectivity and moisture resistance reliability are excellent at the same level.

[0160] Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications can be made and implemented within the scope of the claims, the detailed description of the invention, and the accompanying drawings, and it is natural that this also belongs to the scope of the present invention.

Explanation of Reference Numerals

[0161] 100: Multilayer capacitor 110: Capacitor body 111: Dielectric layer 112, 113: Cover area 121: First internal electrode 122: Second internal electrode 131: First external electrode 132: Second external electrode

Claims

1. A capacitor body including a dielectric layer containing a barium titanate-based compound as a main component and an internal electrode containing a conductive metal, and an external electrode disposed outside the capacitor body, comprising: A multilayer capacitor, wherein the internal electrode, the interface disposed between the dielectric layer and the internal electrode, or all of these contain a co-material represented by the following Chemical Formula 1: [Chemical Formula 1] M ｎ＋１ AX ｎ In the above Chemical Formula 1, M includes Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, or a combination thereof, A includes any one or more selected from the group consisting of Group 11 elements to Group 16 elements, X includes C, N, or a combination thereof, n is an integer from 1 to 4.

2. The co-material is Ti ２ AlC, V ２ AlC, Cr ２ AlC, Nb ２ AlC, Ta ２ AlC, Zr ２ AlC, Ti ２ AlN, Ti ３ AlC ２ , V ３ AlC ２ , Ta ３ AlC ２ , Zr ３ AlC ２ , Ti ４ AlN ３ , V ４ AlC ３ , Nb ４ AlC ３ , Ta ４ AlC ３ , (Mo, V) ４ AlC ３ , Mo ４ VAlC ４ , Ti ３ SiC ２ , Ti ４ SiC ３ , Ti ２ CdC, Sc ２ InC, Sc ２ SnC, Ti ２ GaC, Ti ２ InC, Ti ２ TlC, V ２ GaC, Cr ２ GaC, Ti ２ GaN, Ti ２ InN, V ２ GaN, Cr ２ GaN, Ti ２ GeC, Ti ２ SnC, Ti ２ PbC, V ２ GeC, Cr ２ GeC, V ２ PC, V ２ AsC, Ti ２ SC, Zr ２ InC, Zr ２ TlC, Nb ２ GaC, Nb ２ InC, Mo ２ GaC, Zr ２ InN, Zr ２ TiN, Zr ２ SnC, Zr ２ PbC, Nb ２ SnC, Nb ２ PC, Nb ２ AsC, Zr ２ SC, Nb ２ SC, Hf ２ InC, Hf ２ TlC, Ta ２ GaC, Hf ２ SnC, Hf ２ PbC, Hf ２ SnN, Hf ２ SC, Ti ２ ZnC, Ti ２ ZnN, V ２ ZnC, Nb ２ CuC, Mn ２ GaC, Mo ２ AuC, Ti ２ AuN, Ti ３ GaC ２ , Ti ３ InC ２ , Ti ３ GeC ２ , Ti ３ SnC ２ , Ti ３ ZnC ２ , Ti ４ GaC ３ , Ti ４ GeC ３ The multilayer capacitor according to claim 1, comprising or a combination thereof.

3. The barium titanate-based compound is Ba ｍ TiO ３ (0.995 ≤ m ≤ 1.010), (Ba １－Ｘ Ca ｘ ) ｍ (Ti １－ｙ Zr ｙ )O ３ (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), Ba ｍ (Ti １－ｘ Zr ｘ )O ３ (0.995 ≤ m ≤ 1.010, x ≤ 0.10), (Ba １－Ｘ Ca ｘ ) ｍ (Ti １－ｙ Sn ｙ )O ３ (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), or a combination thereof, the multilayer capacitor according to claim 1.

4. The dielectric layer further includes a sub-component, The sub-component includes dysprosium (Dy), vanadium (V), manganese (Mn), chromium (Cr), silicon (Si), aluminum (Al), magnesium (Mg), tin (Sn), antimony (Sb), germanium (Ge), gallium (Ga), barium (Ba), lanthanum (La), yttrium (Y), actinium (Ac), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), hafnium (Hf), indium (In), or a combination thereof. The multilayer capacitor according to Claim 1.

5. The dielectric layer further includes the co-material. The multilayer capacitor according to Claim 1.

6. The conductive metal includes Ni, Cu, Ag, Pd, Au, an alloy thereof, or a combination thereof. The multilayer capacitor according to Claim 1.

7. The cross-sectional area occupied by the co-material with respect to the cross-sectional area of the internal electrode is 0.1% to 30%. The multilayer capacitor according to Claim 1.

8. A capacitor body including a dielectric layer containing a barium titanate-based compound as a main component and an internal electrode containing a conductive metal, and an external electrode disposed outside the capacitor body, comprising: A multilayer capacitor, wherein the internal electrode, the dielectric layer, the interface disposed between the dielectric layer and the internal electrode, or all of these contain a co-material represented by the following Chemical Formula 1: [Chemical Formula 1] M ｎ＋１ AX ｎ In the above Chemical Formula 1, M includes Ti, Zr, Hf, Sc, Cr, V, Nb, Ta, Mo, Mn, or a combination thereof, A includes any one or more selected from the group consisting of Group 11 elements to Group 16 elements, X includes C, N, or a combination thereof, n is an integer from 1 to 4. Claim 9 The co-material is Ti ２ AlC, V ２ AlC, Cr ２ AlC, Nb ２ AlC, Ta ２ AlC, Zr ２ AlC, Ti ２ AlN, Ti ３ AlC ２ , V ３ AlC ２ , Ta ３ AlC ２ , Zr ３ AlC ２ , Ti ４ AlN ３ , V ４ AlC ３ , Nb ４ AlC ３ , Ta ４ AlC ３ , (Mo, V) ４ AlC ３ , Mo ４ VAlC ４ , Ti ３ SiC ２ , Ti ４ SiC ３ , Ti ２ CdC, Sc ２ InC, Sc ２ SnC, Ti ２ GaC, Ti ２ InC, Ti ２ TlC, V ２ GaC, Cr ２ GaC, Ti ２ GaN, Ti ２ InN, V ２ GaN, Cr ２ GaN, Ti ２ GeC, Ti ２ SnC, Ti ２ PbC, V ２ GeC, Cr ２ GeC, V ２ PC, V ２ AsC, Ti ２ SC, Zr ２ InC, Zr ２ TlC, Nb ２ GaC, Nb ２ InC, Mo ２ GaC, Zr ２ InN, Zr ２ TiN, Zr ２ SnC, Zr ２ PbC, Nb ２ SnC, Nb ２ PC, Nb ２ AsC, Zr ２ SC, Nb ２ SC, Hf ２ InC, Hf ２ TlC, Ta ２ GaC, Hf ２ SnC, Hf ２ PbC, Hf ２ SnN, Hf ２ SC, Ti ２ ZnC, Ti ２ ZnN, V ２ ZnC, Nb ２ CuC, Mn ２ GaC, Mo ２ AuC, Ti ２ AuN, Ti ３ GaC ２ , Ti ３ InC ２ , Ti ３ GeC ２ , Ti ３ SnC ２ , Ti ３ ZnC ２ , Ti ４ GaC ３ , Ti ４ GeC ３ The multilayer capacitor according to claim 8, comprising, or a combination thereof. Claim 10 The barium titanate-based compound is Ba ｍ TiO ３ (0.995 ≤ m ≤ 1.010), (Ba １－Ｘ Ca ｘ ) ｍ (Ti １－ｙ Zr ｙ )O ３ (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), Ba ｍ (Ti １－ｘ Zr ｘ )O ３ (0.995 ≤ m ≤ 1.010, x ≤ 0.10), (Ba １－Ｘ Ca ｘ ) ｍ (Ti １－ｙ Sn ｙ )O ３ (0.995 ≤ m ≤ 1.010, 0 ≤ x ≤ 0.10, 0 < y ≤ 0.20), or a combination thereof, the multilayer capacitor according to claim 8. Claim 11 The dielectric layer further includes a sub-component, The sub-component includes dysprosium (Dy), vanadium (V), manganese (Mn), chromium (Cr), silicon (Si), aluminum (Al), magnesium (Mg), tin (Sn), antimony (Sb), germanium (Ge), gallium (Ga), barium (Ba), lanthanum (La), yttrium (Y), actinium (Ac), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium (Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium (Lu), hafnium (Hf), indium (In), or a combination thereof. The multilayer capacitor according to Claim 8. Claim 12 The conductive metal includes Ni, Cu, Ag, Pd, Au, an alloy thereof, or a combination thereof. The multilayer capacitor according to Claim 8. Claim 13 The cross-sectional area occupied by the co-material with respect to the cross-sectional area of the internal electrode is 0.1% to 30%. The multilayer capacitor according to Claim 8.

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