Capacitor

Abstract

To provide a capacitor with high capacitance by forming internal electrodes densely in a small space.SOLUTION: A capacitor according to an aspect comprises: a substrate; and a plurality of unit capacitor cells located on the substrate, each of the plurality of unit capacitor cells comprises a lower electrode; and an upper electrode located on the lower electrode, and the lower electrode in the first unit capacitor cell of the plurality of unit capacitor cells is connected to the upper electrode in the second unit capacitor cell of the plurality of unit capacitor cells.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a capacitor.

Background Art

[0002] As electronic components used in electronic devices, there are capacitors, inductors, piezoelectric elements, varistors, thermistors, etc. Among such ceramic electronic components, multilayer capacitors can be used in various electronic devices due to their advantages of being small in size, having a high capacitance guaranteed, and being easy to mount.

[0003] For example, multilayer capacitors can be used as chip capacitors mounted on substrates of various electronic products such as liquid-crystal-display (LCD), plasma display panel (PDP), organic light-emitting diode (OLED) and other video devices, computers, personal mobile terminals, and smartphones, and play a role in charging or discharging electricity.

[0004] Recently, due to the trend of miniaturization and thinning of electronic products, the demand for capacitors with a higher capacitance than conventional multilayer capacitors has been increasing.

Summary of the Invention

Problems to be Solved by the Invention

[0005] At least one of the embodiments provides a capacitor in which internal electrodes are formed at a high density in a small space and which has a high capacitance.

[0006] However, the problems to be solved by the embodiments of the present invention are not limited to the above-described problems, and can be variously extended within the scope of the technical idea included in the present invention.

Means for Solving the Problems

[0007] The capacitor on one side includes a substrate; a plurality of unit capacitor cells located on the substrate, each of the plurality of unit capacitor cells includes a lower electrode; and an upper electrode located on the lower electrode, and the lower electrode included in the first unit capacitor cell among the plurality of unit capacitor cells can be connected to the upper electrode included in the second unit capacitor cell among the plurality of unit capacitor cells.

[0008] It further includes a first external electrode; and a second external electrode located at a distance from the first external electrode in the length direction, and the first external electrode is connected to the lower electrode included in the first connection capacitor cell located at one end of the plurality of unit capacitor cells in the length direction, and the second external electrode can be connected to the upper electrode included in the second connection capacitor cell located at the other end of the plurality of unit capacitor cells in the length direction.

[0009] It can further include a first external connection layer connecting the first external electrode and the lower electrode included in the first connection capacitor cell; and a second external connection layer connecting the second external electrode and the upper electrode included in the second connection capacitor cell.

[0010] It can further include a first pad portion located between the first external connection layer and the first external electrode; and a second pad portion located between the second external connection layer and the second external electrode.

[0011] The first external electrode and the second external electrode can have a bump structure.

[0012] The first external electrode and the second external electrode can be provided in plurality.

[0013] Further, it further includes a first external electrode; and a second external electrode spaced apart from the first external electrode in the length direction, wherein the first external electrode is connected to the lower electrode included in the first connection capacitor cell located at one end in the length direction of the plurality of unit capacitor cells, and the second external electrode can be connected to the lower electrode included in the second connection capacitor cell located at the other end in the length direction of the plurality of unit capacitor cells.

[0014] Further, it further includes a first external electrode; and a second external electrode spaced apart from the first external electrode in the length direction, wherein the first external electrode is connected to the upper electrode included in the first connection capacitor cell located at one end in the length direction of the plurality of unit capacitor cells, and the second external electrode can be connected to the upper electrode included in the second connection capacitor cell located at the other end in the length direction of the plurality of unit capacitor cells.

[0015] Further, it can further include an internal connection layer having a via structure and connecting the lower electrode included in the first unit capacitor cell and the upper electrode included in the second unit capacitor cell.

[0016] Further, the lower electrode included in the first unit capacitor cell includes a lower exposed portion without the upper electrode on its upper side, the upper electrode included in the second unit capacitor cell includes an upper protruding portion protruding toward the lower exposed portion, and the internal connection layer can be located between the lower exposed portion and the upper protruding portion.

[0017] Further, the internal connection layer can include a first internal connection layer connected to the lower electrode; a second internal connection layer connected to the upper electrode; and a third internal connection layer connecting the first internal connection layer and the second internal connection layer.

[0018] Further, the third internal connection layer can have a plate-like structure.

[0019] The capacitor on the other side includes a substrate; and a plurality of unit capacitor cells located on the substrate. Each of the plurality of unit capacitor cells includes a lower electrode; and an upper electrode located on the lower electrode. The lower electrodes included in each of the plurality of unit capacitor cells are separated from each other, the upper electrodes included in each of the plurality of unit capacitor cells are separated from each other, and the plurality of unit capacitor cells can be connected to each other in series.

[0020] Further, a plurality of electrode embedding spaces having a groove structure are formed in the substrate, and the region where the plurality of electrode embedding spaces are formed is partitioned into a plurality of unit cell regions, and one of the plurality of unit capacitor cells can be located on one of the plurality of unit cell regions.

[0021] Also, the plurality of unit capacitor cells can be connected along a unit cell connection direction passing through each of the plurality of unit cell regions once.

[0022] Also, the plurality of unit cell regions include a plurality of first unit cell regions; and a plurality of second unit cell regions. The plurality of unit capacitor cells located on the plurality of first unit cell regions are connected along a first unit cell connection direction passing through the plurality of first unit cell regions, and the plurality of unit capacitor cells located on the plurality of second unit cell regions can be connected along a second unit cell connection direction passing through the plurality of second unit cell regions.

Advantages of the Invention

[0023] According to at least one of the embodiments, an internal electrode can be formed with high density in a small space, and a capacitor having a high capacitance can be provided.

Brief Description of the Drawings

[0024]

Figure 1

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DETAILED DESCRIPTION OF THE INVENTION

[0025] Hereinafter, with reference to the accompanying drawings, various embodiments of the present invention will be described in detail so that those skilled in the art can easily implement them in the technical field to which the present invention pertains. The present invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0026] To clearly explain the present invention, parts not related to the explanation are omitted, and the same reference numerals are used for the same or similar components throughout the specification.

[0027] Also, the sizes and thicknesses of the respective configurations shown in the drawings are arbitrarily shown for convenience of explanation, and the present invention is not necessarily limited to those shown in the drawings. In the drawings, the thicknesses are enlarged to clearly represent a plurality of layers and regions. And, in the drawings, for convenience of explanation, the thicknesses of some layers and regions are exaggerated.

[0028] Also, when a part such as a layer, film, region, or plate is "on" or "above" another part, this includes not only the case where it is "directly above" the other part but also the case where there is another part in between. Conversely, when a part is said to be "directly above" another part, it means that there is no other part in the middle. Also, being "on" or "above" the reference part means being located above or below the reference part, and does not necessarily mean being located "on" or "above" in the direction opposite to gravity.

[0029] Also, throughout the specification, a part "including" a certain component means that, unless otherwise stated to the contrary, it does not exclude other components but can further include other components.

[0030] Also, throughout this specification, "on a plane" means when the target part is viewed from above, and "in a cross-section" means when the cross-section obtained by cutting the target part vertically is viewed from the side.

[0031] FIG. 1 is a drawing showing a capacitor 1 in one embodiment, FIG. 2 is a longitudinal sectional view taken along line A-A' of FIG. 1, FIG. 3 is a drawing showing a structure in which a unit cell area (UCA) is arranged on a substrate 2, and FIG. 4 is a drawing showing area B in FIG. 2.

[0032] Referring to FIGS. 1 to 4, a capacitor 1 according to one embodiment may include a substrate 2, a lower electrode 10, an upper electrode 20, a dielectric layer 30, a first external electrode 61, and a second external electrode 62.

[0033] The substrate 2 may include a first surface 3 and a second surface 4 positioned in opposite directions. In FIG. 1, the first surface 3 is shown facing upward and the second surface 4 is shown facing downward. Thus, the first surface 3 can be defined as the upper surface and the second surface 4 can be defined as the lower surface. And the direction in which the first surface 3 and the second surface 4 are separated from each other can be defined as the thickness direction (T). And the direction in which the upper surface 3 is positioned with respect to the lower surface 4 can be defined as the upper side, and the direction in which the lower surface 4 is positioned with respect to the upper surface 3 can be defined as the lower side.

[0034] The substrate 2 can have a preset width in the width direction (W) intersecting the thickness direction (T). The width direction (W) can be orthogonal to the thickness direction (T). The substrate 2 can have a preset length in the length direction (L) intersecting the thickness direction (T) and the width direction (W). The length direction (L) can be orthogonal to the thickness direction (T) and the width direction (W). At this time, the length direction (L) is the direction in which the first external electrode 61 and the second external electrode 62 described later are separated from each other. Also, in the length direction (L), the direction in which the first external electrode 61 is located is one end of the length direction (L), and the direction in which the second external electrode 62 is located is the other end of the length direction (L). The length of the substrate 2 may be greater than the width of the substrate 2. Also, the length of the substrate 2 may be the same as the width of the substrate 2, or may be smaller than the width of the substrate 2.

[0035] The substrate 2 can include a support layer 5 and a substrate insulating layer 6. The substrate insulating layer 6 can be located on the support layer 5. As an example, the support layer 5 may be made of a silicon material or the like. And the substrate insulating layer 6 can be formed on the support layer 5 with a preset thickness. The substrate insulating layer 6 may be made of a silicon oxide (SiO2) material. As an example, the substrate insulating layer 6 can be formed on the support layer 5, which is a wafer, to have a preset thickness by a vapor deposition process. For the vapor deposition process, chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (Plasma Enhanced CVD), atomic layer deposition (Atomic Layer Deposition), etc. can be used.

[0036] A plurality of electrode embedding spaces 8 are formed in the substrate 2. The electrode embedding space 8 has a groove structure that enters from the first surface 3 toward the second surface 4. As an example, the electrode embedding space 8 can have a trench structure that enters from the first surface 3 toward the second surface 4. When the electrode embedding space 8 has a trench structure, the electrode embedding space 8 can have a structure that extends in the width direction (W) of the substrate 2. Also, the electrode embedding space 8 may be a space in the shape of a pillar 620 that enters from the first surface 3 to the second surface 4 of the substrate 2. The electrode embedding space 8 can be located in the substrate insulating layer 6. That is, the depth of the electrode embedding space 8 along the thickness direction (T) may be less than the thickness of the substrate insulating layer 6.

[0037] The region where the plurality of electrode embedding spaces 8 are formed can be partitioned into a plurality of unit cell areas (UCA). As an example, the region where the electrode embedding space 8 is formed can be partitioned into a plurality of unit cell areas (UCA) along the length direction (L). That is, the region where the electrode embedding space 8 is formed along the length direction (L) can be partitioned into at least two or more unit cell areas (UCA). FIGS. 2 and 3 illustrate the case where the region where the electrode embedding space 8 is formed along the length direction (L) is partitioned into four unit cell areas (UCA).

[0038] Based on the length direction (L), one or more electrode embedding spaces 8 can be located in each unit cell area (UCA). In FIG. 2, based on the length direction (L), it is shown that one electrode embedding space 8 is located in each unit cell area (UCA). However, this is exemplary, and based on the length direction (L), two or more electrode embedding spaces 8 can be located in each unit cell area (UCA). Also, based on the length direction (L), the number of electrode embedding spaces 8 located in each unit cell area (UCA) may be the same or different.

[0039] The capacitor 1 according to one embodiment includes a plurality of unit capacitor cells (UC). That is, a plurality of unit capacitor cells (UC) are located on the substrate 2. Each unit capacitor cell (UC) is respectively located on a unit cell area (UCA). That is, one unit capacitor cell (UC) is located on one unit cell area (UCA). Each unit capacitor cell (UC) includes a lower electrode 10, an upper electrode 20, and a dielectric layer 30 located on the unit cell area (UCA).

[0040] A plurality of lower electrodes 10 are located on the substrate 2. The lower electrode 10 can be located on the electrode embedding space 8. That is, the lower electrode 10 can be located on the inner surface of the electrode embedding space 8. Also, when a plurality of electrode embedding spaces 8 are located in one unit cell area (UCA), the lower electrode 10 is located in the section between the adjacent electrode embedding spaces 8 on the first surface 3 of the substrate 2 included in one unit cell area (UCA). Thereby, on one unit cell area (UCA), the area where the lower electrode 10 is located on the inner surface of the electrode embedding space 8 can be connected by the area located on the first surface 3 of the substrate 2. That is, on one unit cell area (UCA), one lower electrode 10 with its respective areas connected to each other can be located.

[0041] The lower electrode 10 is not located between adjacent unit cell areas (UCAs). And an insulating layer 50 can be located between the lower electrodes 10 respectively positioned in adjacent unit cell areas (UCAs). That is, one lower electrode 10 is located on each unit cell area (UCA), and the lower electrodes 10 located on different unit cell areas (UCAs) are separated from each other via the insulating layer 50.

[0042] A plurality of upper electrodes 20 are located on the substrate 2. The upper electrode 20 can be located on the lower electrode 10. The upper electrode 20 can be located on the electrode embedding space 8. That is, the upper electrode 20 can be located on the inner surface of the electrode embedding space 8. Also, when a plurality of electrode embedding spaces 8 are located in one unit cell area (UCA), the upper electrode 20 is located in the section between the adjacent electrode embedding spaces 8 on the first surface 3 of the substrate 2 included in one unit cell area (UCA). Thereby, on one unit cell area (UCA), the regions where the upper electrode 20 is located on the inner surface of the electrode embedding space 8 can be connected to each other by the regions located on the first surface 3 of the substrate 2. That is, one upper electrode 20 with its respective regions connected to each other can be located on one unit cell area (UCA).

[0043] The upper electrode 20 is not located between adjacent unit cell areas (UCAs). And an insulating layer 50 can be located between the upper electrodes 20 respectively positioned in adjacent unit cell areas (UCAs). That is, the upper electrodes 20 located on different unit cell areas (UCAs) are separated from each other via the insulating layer 50.

[0044] The upper electrode 20 may not be on at least a partial region of the lower electrode 10. Therefore, the lower electrode 10 can include a lower exposed portion 110 where there is no upper electrode 20 above it. The unit cell connection direction (CD) is positioned to pass through each unit cell area (UCA) once. That is, the unit cell connection direction (CD) is positioned to pass through each unit capacitor cell (UC) once. Of two adjacent lower electrodes 10 along the unit cell connection direction (CD), the lower exposed portion 110 can be positioned on one side of the unit cell connection direction (CD). Also, in a region where unit cell areas (UCA) are adjacent, the lower exposed portions 110 of the lower electrodes 10 positioned on each unit cell area (UCA) can face in the same direction along the unit cell connection direction (CD). As an example, the lower exposed portion 110 can face one end in the length direction (L) of the substrate 2 along the unit cell connection direction (CD). Thereby, the lower exposed portion 110 can be positioned in a direction in which two adjacent unit cell areas (UCA) face each other along the unit cell connection direction (CD). Also, for the lower electrode 10 positioned on the unit cell area (UCA) located at one end in the length direction (L), the lower exposed portion 110 can be positioned in a direction other than the direction facing the adjacent unit cell area (UCA). As an example, for the lower electrode 10 positioned on the unit cell area (UCA) located at one end in the length direction (L), the lower exposed portion 110 can be positioned in the direction facing one end in the length direction (L).

[0045] The upper electrode 20 can include an upper protruding portion 210 that protrudes toward an adjacent unit cell area (UCA). The upper protruding portion 210 can be located on the opposite side of the direction in which the lower exposed portion 110 is located along the unit cell connection direction (CD). Thereby, there is no lower electrode 10 located on the same unit cell area (UCA) below the upper protruding portion 210. The upper protruding portion 210 can protrude toward the lower exposed portion 110 of the lower electrode 10 located on an adjacent unit cell area (UCA). The upper protruding portion 210 can face the lower exposed portion 110 of the lower electrode 10 located on an adjacent unit cell area (UCA) in the thickness direction (T). Thereby, the upper electrode 20 and the lower electrode 10 respectively located in two adjacent unit cell areas (UCAs) will be connected by the internal connection layer 40. The internal connection layer 40 can connect the upper protruding portion 210 of the upper electrode 20 and the lower exposed portion 110 of the lower electrode 10 respectively located in two adjacent unit cell areas (UCAs). The internal connection layer 40 can be directly connected in contact with the upper protruding portion 210 and the lower exposed portion 110 respectively located on two adjacent unit cell areas (UCAs) at both ends. As an example, the internal connection layer 40 may be a via structure located between the upper protruding portion 210 and the lower exposed portion 110 respectively located on two adjacent unit cell areas (UCAs).

[0046] The dielectric layer 30 can be located between the lower electrode 10 and the upper electrode 20. The dielectric layer 30 may not be on the lower exposed portion 110 in some cases.

[0047] The first external electrode 61 is connected to the lower electrode 10 on the unit cell area (UCA) located at one end in the length direction (L). The first external electrode 61 can be located on the first surface 3 of the substrate 2. An insulating layer 50 can be located on the substrate 2 so that the lower electrode 10, the dielectric layer 30, and the upper electrode 20 are embedded therein. And the first external electrode 61 can be located such that at least a partial region is exposed outside the insulating layer 50 on the first surface 3 of the substrate 2. The first external electrode 61 can be connected to the lower exposed portion 110 of the lower electrode 10 located at one end in the length direction (L). The first external electrode 61 and the lower exposed portion 110 of the lower electrode 10 can be connected by the first external connection layer 46. Both ends of the first external connection layer 46 can be directly in contact with and connected to the first external electrode 61 and the lower exposed portion 110 of the lower electrode 10, respectively. As an example, the first external electrode 61 and the lower exposed portion 110 of the lower electrode 10 located at one end in the length direction (L) can face each other in the thickness direction (T). The first external connection layer 46 may be a via structure located between the first external electrode 61 and the lower exposed portion 110 of the lower electrode 10.

[0048] The second external electrode 62 can be located at a distance from the first external electrode 61 along the length direction (L). The second external electrode 62 is connected to the upper electrode 20 on the unit cell area (UCA) located at the other end in the length direction (L). The second external electrode 62 can be located on the first surface 3 of the substrate 2. The second external electrode 62 can be located such that at least a partial region is exposed outside the insulating layer 50 on the first surface 3 of the substrate 2. The second external electrode 62 can be connected to the upper electrode 20 located at the end on the opposite side of the first external electrode 61 along the length direction (L). The second external electrode 62 and the upper electrode 20 can be connected by the second external connection layer 47. Both ends of the second external connection layer 47 can be directly in contact with and connected to the second external electrode 62 and the upper electrode 20, respectively. As an example, the second external electrode 62 and the upper electrode 20 located at the other end in the length direction (L) can face each other in the thickness direction (T). The second external connection layer 47 may be a via structure located between the second external electrode 62 and the upper electrode 20.

[0049] The external electrode 60 can have a bump structure. The first external electrodes 61 are provided in plurality, and the plurality of first external electrodes 61 can be arranged to be spaced apart from each other along the width direction (W). When the plurality of first external electrodes 61 are arranged to be spaced apart from each other, when current flows through the first external electrodes 61, between two first external electrodes 61, the magnetic fields generated in the respective first external electrodes 61 will be in opposite directions. Thereby, the magnetic fluxes generated by the plurality of first external electrodes 61 cancel each other out, the magnetic field formed around the first external electrodes 61 decreases, and the equivalent series resistance and equivalent series inductance decrease.

[0050] Also, the second external electrodes 62 are provided in plurality, and the plurality of second external electrodes 62 can be arranged to be spaced apart from each other along the width direction (W). Thereby, when current flows through the second external electrodes 62, the magnetic field formed around the second external electrodes 62 decreases, and the equivalent series resistance and equivalent series inductance decrease.

[0051] FIG. 5 is a drawing showing the structure of the external electrode 60.

[0052] Referring to FIG. 5, the external electrode 60 can include a UBM 610 (Under bump metallization), a pillar 620, and a solder 630.

[0053] The UBM 610 can be provided such that at least a partial region is exposed outside the insulating layer 50. The UBM 610 is connected to the external connection layers 46 and 47. The UBM 610 is provided with a conductive material. The UBM 610 may be a metallic material. As an example, the UBM 610 may be copper, nickel, an alloy of nickel, an alloy of copper, etc. Also, the UBM 610 may have a single-layer or multi-layer structure. When the UBM 610 has a multi-layer structure, the materials of the respective layers may be the same or different.

[0054] The pillar 620 is located on the UBM 610. The pillar 620 can be directly in contact with and connected to the UBM 610. The pillar 620 is provided with a conductive material. The pillar 620 may be a metallic material. As an example, the pillar 620 may be copper or the like.

[0055] The solder 630 is located on the pillar 620. The solder 630 is provided with a conductive material. The solder 630 may be a metallic material. As an example, the solder 630 may be copper, gold, a tin alloy (e.g., SnAg), or the like.

[0056] A bonding layer 640 can be located between the solder 630 and the pillar 620. The bonding layer 640 is provided with a conductive material. The bonding layer 640 may be a metallic material. As an example, the bonding layer 640 may be nickel or the like. Also, the bonding layer 640 may be omitted, and the solder 630 can be directly connected to the pillar 620.

[0057] According to one embodiment, the capacitor 1 has a structure in which a lower electrode 10 included in one unit capacitor cell (UC) (i.e., the first unit capacitor cell) among two unit capacitor cells (UC) adjacent to each other along the unit cell connection direction (CD) and an upper electrode 20 included in the other unit capacitor cell (UC) (i.e., the second unit capacitor cell) are connected via an internal connection layer 40, and a plurality of unit capacitor cells (UC) are connected to each other. Among two unit capacitor cells (UC) adjacent to each other along the unit cell connection direction (CD), a lower exposed portion 110 can be located in one, and an upper protruding portion 210 can be located in the other. At this time, the lower exposed portion 110 can be located so as to face one side of the unit cell connection direction (CD), and the upper protruding portion 210 can be located so as to face the other side of the unit cell connection direction (CD). Thereby, two unit capacitor cells (UC) adjacent to each other along the unit cell connection direction (CD) can be connected via the upper protruding portion 210, the lower exposed portion 110, and the internal connection layer 40. That is, a plurality of unit capacitor cells (UC) are connected to each other in series along the unit cell connection direction (CD). And a first external electrode 61 can be connected to the lower electrode 10 of the unit capacitor cell (UC) located at one end in the length direction (L). Also, a second external electrode 62 can be connected to the upper electrode 20 of the unit capacitor cell (UC) located at the other end in the length direction (L). The lower electrode 10 connected to the first external electrode 61 becomes the first internal electrode. The upper electrode 20 connected to the second external electrode 62 becomes the second internal electrode. And the upper electrode 20 and the lower electrode 10 located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40 become floating electrodes. Thereby, the capacitor 1 according to another embodiment has an increased breakdown voltage magnitude and a significantly reduced likelihood of occurrence of a breakdown condition.

[0058] Also, according to one embodiment, the capacitor 1 can adjust the number of unit capacitor cells (UC) connected in series and adjust the number of floating electrodes.

[0059] In addition, for the capacitor 1 according to one embodiment, internal electrodes can be formed at high density in a small space in the unit capacitor cell (UC) by a vapor deposition process. As an example, the unit capacitor cell (UC) can be formed through chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition, atomic layer deposition, or the like. Thereby, capacitance of high capacitance can be formed in a relatively small region.

[0060] FIG. 6 is a drawing showing the structure of an external electrode 60a according to another embodiment.

[0061] Referring to FIG. 6, the external electrode 60a can include a UBM 610a and a solder 630a.

[0062] The UBM 610a can be provided such that at least a partial region is exposed outside the insulating layer 50. The UBM 610a is connected to the external connection layers 46 and 47. The UBM 610a is provided with a conductive material. The UBM 610a may be a metallic material. As an example, the UBM 610a may be copper, nickel, an alloy of nickel, an alloy of copper, or the like. Further, the UBM 610a may have a single-layer or multi-layer structure. When the UBM 610a has a multi-layer structure, the materials of the respective layers may be the same or different.

[0063] The solder 630a is located on the UBM 610a. The solder 630a is provided with a conductive material. The solder 630a may be a metallic material. As an example, the solder 630a may be copper, gold, a tin alloy (for example, SnAg), or the like.

[0064] FIG. 7 is a longitudinal sectional view of a capacitor 1b according to another embodiment.

[0065] Referring to FIG. 7, a capacitor 1b according to another embodiment may include a substrate 2b, a lower electrode 10b, an upper electrode 20b, a dielectric layer 30b, a first external electrode 61b, and a second external electrode 62b.

[0066] An electrode embedding space 8b is formed on the substrate 2b. The region where the electrode embedding space 8b is formed can be partitioned into a plurality of unit cell regions.

[0067] The structure of the substrate 2b and the structure in which the region where the electrode embedding space 8b is formed is partitioned into a plurality of unit cell regions are the same as or similar to the structures described above with reference to FIGS. 1 to 4, and repeated description will be omitted.

[0068] A capacitor 1b according to another embodiment includes a plurality of unit capacitor cells (UCb). Each unit capacitor cell (UCb) is located on a unit cell region respectively. That is, one unit capacitor cell (UCb) is located on one unit cell region. Each unit capacitor cell (UCb) includes a lower electrode 10b, an upper electrode 20b, and a dielectric layer 30b located on the unit cell region. Two unit capacitor cells (UCb) adjacent to each other along the unit cell connection direction are connected to each other.

[0069] A plurality of lower electrodes 10b are located on the substrate 2b. The lower electrode 10b can be located on the electrode embedding space 8b. That is, the lower electrode 10b can be located on the inner surface of the electrode embedding space 8b. Also, when a plurality of electrode embedding spaces 8b are located in one unit cell region, the lower electrode 10b is located in the section between the electrode embedding spaces 8b adjacent to each other on the first surface of the substrate 2b included in one unit cell region. Thereby, on one unit cell region, the region where the lower electrode 10b is located on the inner surface of the electrode embedding space 8b can be connected by the region located on the first surface of the substrate 2b. That is, on one unit cell region, one lower electrode 10b in which the respective regions are connected to each other can be located.

[0070] The lower electrode 10b is not between adjacent unit cell regions. And an insulating layer 50b can be located between the lower electrodes 10b respectively positioned in adjacent unit cell regions. That is, one lower electrode 10b is located on each unit cell region, and the lower electrodes 10b positioned on different unit cell regions are separated via the insulating layer 50b.

[0071] A plurality of upper electrodes 20b are located on the substrate 2b. The upper electrode 20b can be located on the lower electrode 10b. The upper electrode 20b can be located on the electrode embedding space 8b. That is, the upper electrode 20b can be located on the inner surface of the electrode embedding space 8b. Also, when a plurality of electrode embedding spaces 8b are located in one unit cell region, the upper electrode 20b is located in the section between the adjacent electrode embedding spaces 8b on the first surface of the substrate 2b included in one unit cell region. Thereby, on one unit cell region, the regions where the upper electrode 20b is located on the inner surface of the electrode embedding space 8b can be connected to each other by the region located on the first surface of the substrate 2b. That is, on one unit cell region, one upper electrode 20b with its respective regions connected to each other can be located.

[0072] The upper electrode 20b is not between adjacent unit cell regions. And an insulating layer 50b can be located between the upper electrodes 20b respectively positioned in adjacent unit cell regions. That is, the upper electrodes 20b positioned on different unit cell regions are separated via the insulating layer 50b.

[0073] The upper electrode 20b may not be on at least a partial region of the lower electrode 10b. As a result, the lower electrode 10b can include a lower exposed portion 110b that does not have the upper electrode 20b above it. Of two adjacent lower electrodes 10b along the unit cell connection direction, in one of them, the lower exposed portion 110b can be located on one side in the unit cell connection direction. Also, in a region where unit cell regions are adjacent, the lower exposed portions 110b of the lower electrodes 10b located on the respective unit cell regions can face in the same direction along the unit cell connection direction. As an example, the lower exposed portion 110b can face one end in the length direction (L) of the substrate 2b along the unit cell connection direction. Thereby, the lower exposed portion 110b can be located in a direction in which two adjacent unit cell regions face each other along the unit cell connection direction. Also, for the lower electrode 10b located on the unit cell region at one end in the length direction (L), the lower exposed portion 110b can be located in a direction other than the direction facing the adjacent unit cell region. As an example, for the lower electrode 10b located on the unit cell region at one end in the length direction (L), the lower exposed portion 110b can be located in the direction facing one end in the length direction (L). Also, for the lower electrode 10b located on the unit cell region at the other end in the length direction (L), the lower exposed portion 110b can be located in a direction other than the direction facing the adjacent unit cell region. As an example, for the lower electrode 10b located on the unit cell region at the other end in the length direction (L), the lower exposed portion 110b can be located in the direction facing the other end in the length direction (L). Thereby, for the lower electrode 10b located on the unit cell region at the other end in the length direction (L), the lower exposed portions 110b can be located on both sides in the length direction (L), respectively.

[0074] The upper electrode 20b can include an upper protruding portion 210b protruding toward an adjacent unit cell region. The upper protruding portion 210b can be located on the opposite side of the direction in which the lower exposed portion 110b is located along the unit cell connection direction. Thereby, there is no lower electrode 10b located on the same unit cell region below the upper protruding portion 210b. The upper protruding portion 210b can protrude toward the lower exposed portion 110b of the lower electrode 10b located on an adjacent unit cell region. The upper protruding portion 210b can face the lower exposed portion 110b of the lower electrode 10b located on an adjacent unit cell region in the thickness direction (T). Thereby, the upper electrode 20b and the lower electrode 10b respectively located in two adjacent unit cell regions can be connected by the internal connection layer 40b. The internal connection layer 40b can connect the upper protruding portion 210b of the upper electrode 20b and the lower exposed portion 110b of the lower electrode 10b respectively located in two adjacent unit cell regions. The internal connection layer 40b can be directly connected in contact with the upper protruding portion 210b and the lower exposed portion 110b respectively located on two adjacent unit cell regions at both ends. As an example, the internal connection layer 40b may be a via structure located between the upper protruding portion 210b and the lower exposed portion 110b respectively located on two adjacent unit cell regions.

[0075] The dielectric layer 30b can be located between the lower electrode 10b and the upper electrode 20b. The dielectric layer 30b may not be on the lower exposed portion 110b.

[0076] The first external electrode 61b is connected to the lower electrode 10b on the unit cell region located at one end in the length direction (L). The first external electrode 61b can be located on the first surface of the substrate 2b. An insulating layer 50b can be located on the substrate 2b so that the lower electrode 10b, the dielectric layer 30b, and the upper electrode 20b are embedded therein. Then, the first external electrode 61b can be located such that at least a partial region is exposed outside the insulating layer 50b on the first surface of the substrate 2b. The first external electrode 61b can be connected to the lower exposed portion 110b of the lower electrode 10b located at one end in the length direction (L). The first external electrode 61b and the lower exposed portion 110b of the lower electrode 10b can be connected by the first external connection layer 46b. Both ends of the first external connection layer 46b can be directly in contact with and connected to the first external electrode 61b and the lower exposed portion 110b of the lower electrode 10b, respectively. As an example, the first external electrode 61b and the lower exposed portion 110b of the lower electrode 10b located at one end in the length direction (L) can face each other in the thickness direction (T). The first external connection layer 46b may be a via structure located between the first external electrode 61b and the lower exposed portion 110b of the lower electrode 10b.

[0077] The second external electrode 62b can be positioned at a distance from the first external electrode 61b along the length direction (L). The second external electrode 62b is connected to the lower electrode 10b on the unit cell region located at the other end in the length direction (L). The second external electrode 62b can be positioned on the first surface of the substrate 2b. The second external electrode 62b can be positioned such that at least a partial region is exposed outside the insulating layer 50b on the first surface of the substrate 2b. The second external electrode 62b can be connected to the lower electrode 10b positioned at the end on the opposite side of the first external electrode 61b along the length direction (L). That is, the lower electrode 10b positioned on the unit cell region located on the opposite side of the first external electrode 61b along the length direction (L) can have lower exposed portions 110b positioned on both sides. Thereby, one of the two lower exposed portions 110b can face the adjacent unit cell region, and the other one can face the end of the substrate 2b along the length direction (L). The second external electrode 62b and the lower electrode 10b positioned at the end on the opposite side of the first external electrode 61b along the length direction (L) can be connected by the second external connection layer 47b. Both ends of the second external connection layer 47b can be directly in contact with and connected to the second external electrode 62b and the lower exposed portion 110b, respectively. As an example, the second external electrode 62b and the lower exposed portion 110 of the lower electrode 10b located at the other end in the length direction (L) can face each other in the thickness direction (T). The second external connection layer 47b may be a via structure positioned between the second external electrode 62b and the lower exposed portion 110 of the lower electrode 10b.

[0078] The external electrodes 61b and 62b are the same as or similar to the external electrode 60 described above in FIG. 5 or the external electrode 60a described above in FIG. 6, and repeated description is omitted.

[0079] The capacitor 1b according to another embodiment has a structure in which a lower electrode 10b included in one of two unit capacitor cells (UCb) adjacent to each other along the unit cell connection direction (i.e., the first unit capacitor cell) and an upper electrode 20b included in the other unit capacitor cell (UCb) (i.e., the second unit capacitor cell) are connected via an internal connection layer 40b, and a plurality of unit capacitor cells (UCb) are connected to each other. One of two unit capacitor cells (UCb) adjacent to each other along the unit cell connection direction may have a lower exposed portion 110b, and the other may have an upper protruding portion 210b. At this time, the lower exposed portion 110b may be positioned to face one side in the unit cell connection direction, and the upper protruding portion 210b may be positioned to face the other side in the unit cell connection direction. Thereby, two unit capacitor cells (UCb) adjacent to each other along the unit cell connection direction can be connected to each other via the upper protruding portion 210b, the lower exposed portion 110b, and the internal connection layer 40b. That is, a plurality of unit capacitor cells (UCb) are connected to each other in series along the unit cell connection direction. And a first external electrode 61b can be connected to the lower electrode 10b of the unit capacitor cell (UCb) located at one end in the length direction (L). Also, a second external electrode 62b can be connected to the lower electrode 10b of the unit capacitor cell (UCb) located at the other end in the length direction (L). The lower electrode 10b connected to the first external electrode 61b becomes the first internal electrode. The lower electrode 10b connected to the second external electrode 62b and the upper electrode 20b connected thereto become the second internal electrode. And the upper electrode 20b and the lower electrode 10b located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40b become floating electrodes.

[0080] FIG. 8 is a longitudinal sectional view of a capacitor 1c according to another embodiment.

[0081] Referring to FIG. 8, the capacitor 1c according to another embodiment may include a substrate 2c, a lower electrode 10c, an upper electrode 20c, a dielectric layer 30c, a first external electrode 61c, and a second external electrode 62c.

[0082] An electrode embedding space 8c is formed on the substrate 2c. The region where the electrode embedding space 8c is formed can be partitioned into a plurality of unit cell regions.

[0083] The structure of the substrate 2c and the structure in which the region where the electrode embedding space 8c is formed is partitioned into a plurality of unit cell regions are the same as or similar to the structures described above with reference to FIGS. 1 to 4, and repeated description will be omitted.

[0084] The capacitor 1c according to another embodiment includes a plurality of unit capacitor cells (UCc). Each unit capacitor cell (UCc) is respectively located on a unit cell region. That is, one unit capacitor cell (UCc) is located on one unit cell region. Each unit capacitor cell (UCc) includes a lower electrode 10c, an upper electrode 20c, and a dielectric layer 30c located on the unit cell region.

[0085] A plurality of lower electrodes 10c are located on the substrate 2c. The lower electrode 10c can be located on the electrode embedding space 8c. That is, the lower electrode 10c can be located on the inner surface of the electrode embedding space 8c. Further, when a plurality of electrode embedding spaces 8c are located in one unit cell region, the lower electrode 10c is located in the section between the electrode embedding spaces 8c adjacent to each other on the first surface of the substrate 2c included in one unit cell region. Thereby, on one unit cell region, the region where the lower electrode 10c is located on the inner surface of the electrode embedding space 8c can be connected by the region located on the first surface of the substrate 2c. That is, on one unit cell region, one lower electrode 10c in which the respective regions are connected to each other can be located.

[0086] The lower electrodes 10c are not between adjacent unit cell regions. And an insulating layer 50c can be located between the lower electrodes 10c respectively located in adjacent unit cell regions. That is, one lower electrode 10c is located on each unit cell region, and the lower electrodes 10c located on different unit cell regions are separated from each other via the insulating layer 50c.

[0087] On the substrate 2c, a plurality of upper electrodes 20c are located. The upper electrode 20c can be located on the lower electrode 10c. The upper electrode 20c can be located on the electrode embedding space 8c. That is, the upper electrode 20c can be located on the inner side surface of the electrode embedding space 8c. Further, when a plurality of electrode embedding spaces 8c are located in one unit cell area, the upper electrode 20c is located in the section between the electrode embedding spaces 8c adjacent to each other on the first surface of the substrate 2c included in one unit cell area. Thereby, on one unit cell area, the area where the upper electrode 20c is located on the inner side surface of the electrode embedding space 8c can be connected by the area located on the first surface of the substrate 2c. That is, on one unit cell area, one upper electrode 20c in which the respective areas are connected to each other can be located.

[0088] The upper electrodes 20c are not between adjacent unit cell areas. And an insulating layer 50c can be located between the upper electrodes 20c respectively located in adjacent unit cell areas. That is, the upper electrodes 20c located on different unit cell areas are separated from each other via the insulating layer 50c.

[0089] The upper electrode 20c may not be on at least a partial area of the lower electrode 10c. Thereby, the lower electrode 10c can include a lower exposed portion 110c where there is no upper electrode 20c on its upper side. In one of two adjacent lower electrodes 10c along the unit cell connection direction, the lower exposed portion 110c can be located on one side in the unit cell connection direction. Also, in the area where the unit cell areas are adjacent, the lower exposed portions 110c of the lower electrodes 10c located on the respective unit cell areas can face the same direction along the unit cell connection direction. As an example, the lower exposed portion 110c can face one end in the length direction (L) of the substrate 2c along the unit cell connection direction. Thereby, the lower exposed portion 110c can be located in one direction in which two adjacent unit cell areas face each other along the unit cell connection direction.

[0090] The upper electrode 20c can include an upper protruding portion 210c that protrudes toward an adjacent unit cell region. The upper protruding portion 210c can be positioned on the opposite side of the direction in which the lower exposed portion 110c is located along the unit cell connection direction. Thereby, there is no lower electrode 10c positioned above the same unit cell region below the upper protruding portion 210c. And the upper protruding portion 210c can face the lower exposed portion 110c of the lower electrode 10c positioned on the adjacent unit cell region in the thickness direction (Tc). Thereby, the upper electrode 20c and the lower electrode 10c respectively positioned in two adjacent unit cell regions can be connected by the internal connection layer 40c. The internal connection layer 40c can connect the upper protruding portion 210c of the upper electrode 20c and the lower exposed portion 110c of the lower electrode 10c respectively positioned in two adjacent unit cell regions. The internal connection layer 40c can be directly connected in contact with the upper protruding portion 210c and the lower exposed portion 110c respectively positioned on two adjacent unit cell regions at both ends. As an example, the internal connection layer 40c may be a via structure positioned between the upper protruding portion 210c and the lower exposed portion 110c respectively positioned on two adjacent unit cell regions.

[0091] The dielectric layer 30c can be positioned between the lower electrode 10c and the upper electrode 20c. The dielectric layer 30c may not be on the lower exposed portion 110c.

[0092] The first external electrode 61c is connected to the upper electrode 20c on the unit cell region located at one end in the length direction (L). The first external electrode 61c can be located on the first surface of the substrate 2c. An insulating layer 50c can be located on the substrate 2c such that the lower electrode 10c, the dielectric layer 30c, and the upper electrode 20c are embedded therein. And the first external electrode 61c can be located such that at least a partial region is exposed outside the insulating layer 50c on the first surface of the substrate 2c. The first external electrode 61c can be connected to the upper electrode 20c located at one end in the length direction (L). The first external electrode 61c and the upper electrode 20c can be connected by the first external connection layer 46c. Both ends of the first external connection layer 46c can be directly in contact with and connected to the first external electrode 61c and the upper electrode 20c, respectively. As an example, the first external electrode 61c and the upper electrode 20c located at one end in the length direction (L) can face each other in the thickness direction (Tc). The first external connection layer 46c may be a via structure located between the first external electrode 61c and the upper electrode 20c.

[0093] The second external electrode 62c can be located at a distance from the first external electrode 61c along the length direction (L). The second external electrode 62c is connected to the upper electrode 20c on the unit cell region located at the other end in the length direction (L). The second external electrode 62c can be located on the first surface of the substrate 2c. The second external electrode 62c can be located such that at least a partial region is exposed outside the insulating layer 50c on the first surface of the substrate 2c. The second external electrode 62c can be connected to the upper electrode 20c located at the end on the opposite side of the first external electrode 61c along the length direction (L). The second external electrode 62c and the upper electrode 20c can be connected by the second external connection layer 47c. Both ends of the second external connection layer 47c can be directly in contact with and connected to the second external electrode 62c and the upper electrode 20c, respectively. As an example, the second external electrode 62c and the upper electrode 20c located at the other end in the length direction (L) can face each other in the thickness direction (T). The second external connection layer 47c may be a via structure located between the second external electrode 62c and the upper electrode 20c.

[0094] The external electrodes 61c and 62c are the same as or similar to the external electrode 60 described in FIG. 5 or the external electrode 60a described in FIG. 6, and repeated description thereof is omitted.

[0095] The capacitor 1c according to another embodiment has a structure in which a lower electrode 10c included in one unit capacitor cell (UCc) (i.e., the first unit capacitor cell) among two unit capacitor cells (UCc) adjacent to each other along the unit cell connection direction is connected to an upper electrode 20c included in the other unit capacitor cell (UCc) (i.e., the second unit capacitor cell) via an internal connection layer 40c, and a plurality of unit capacitor cells (UCc) are connected to each other. A lower exposed portion 110c can be located in one of the two unit capacitor cells (UCc) adjacent to each other along the unit cell connection direction, and an upper protruding portion 210c can be located in the other. At this time, the lower exposed portion 110c can be positioned to face one side in the unit cell connection direction, and the upper protruding portion 210c can be positioned to face the other side in the unit cell connection direction. Thereby, two unit capacitor cells (UCc) adjacent to each other along the unit cell connection direction can be connected via the upper protruding portion 210c, the lower exposed portion 110c, and the internal connection layer 40c. That is, a plurality of unit capacitor cells (UCc) are connected to each other in series along the unit cell connection direction. And a first external electrode 61c can be connected to the upper electrode 20c of the unit capacitor cell (UCc) located at one end in the length direction (L). Also, a second external electrode 62c can be connected to the upper electrode 20c of the unit capacitor cell (UCc) located at the other end in the length direction (L). The upper electrode 20c connected to the first external electrode 61c and the lower electrode 10c connected thereto become the first internal electrode. The upper electrode 20c connected to the second external electrode 62c becomes the second internal electrode. And the upper electrode 20c and the lower electrode 10c located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40c become floating electrodes.

[0096] According to at least one of the above-described embodiments, the first external electrode is connected to the lower electrode or the upper electrode of the unit capacitor cell located at one end in the length direction (L) by the first external connection layer, and the second external electrode can be connected to the lower electrode or the upper electrode of the unit capacitor cell located at the other end in the length direction (L) by the second external connection layer. At this time, the unit capacitor cell including the lower electrode or the upper electrode to which the first external electrode is connected can be called the first connection capacitor cell, and the unit capacitor cell including the lower electrode or the upper electrode to which the second external electrode is connected can be called the second connection capacitor cell.

[0097] FIG. 9 is a drawing showing the structure of the capacitor 1d according to another embodiment, and FIG. 10 is a plan view showing the positions of the internal connection layer 40d, the pad portions 48d, 49d, and the external electrodes 61d, 62d of the capacitor 1d in FIG. 9.

[0098] Referring to FIGS. 9 and 10, the capacitor 1d according to another embodiment may include a substrate 2d, a lower electrode 10d, an upper electrode 20d, a dielectric layer 30d, a first external electrode 61d, and a second external electrode 62d.

[0099] An electrode embedding space 8d is formed on the substrate 2d. The region where the electrode embedding space 8d is formed can be partitioned into a plurality of unit cell regions.

[0100] The structure of the substrate 2d and the structure in which the region where the electrode embedding space 8d is formed is partitioned into a plurality of unit cell regions are the same as or similar to the structures described above with reference to FIGS. 1 to 4, and repeated description is omitted.

[0101] The capacitor 1d according to another embodiment includes a plurality of unit capacitor cells (UCd). Each unit capacitor cell (UCd) is respectively located on a unit cell region. That is, one unit capacitor cell (UCd) is located on one unit cell region. Each unit capacitor cell (UCd) includes a lower electrode 10d, an upper electrode 20d, and a dielectric layer 30d located on the unit cell region.

[0102] On the substrate 2d, a plurality of lower electrodes 10d are located. The lower electrode 10d can be located on the electrode embedding space 8d. That is, the lower electrode 10d can be located on the inner surface of the electrode embedding space 8d. Further, when a plurality of electrode embedding spaces 8d are located in one unit cell area, the lower electrode 10d is located in the section between the electrode embedding spaces 8d adjacent to each other on the first surface of the substrate 2d included in one unit cell area. Thereby, on one unit cell area, the area where the lower electrode 10d is located on the inner surface of the electrode embedding space 8d can be connected by the area located on the first surface of the substrate 2d. That is, on one unit cell area, one lower electrode 10d in which respective areas are connected to each other can be located.

[0103] The lower electrodes 10d are not between adjacent unit cell areas. And an insulating layer 50d can be located between the lower electrodes 10d respectively located in adjacent unit cell areas. That is, on each unit cell area, one lower electrode 10d is located, and the lower electrodes 10d located on different unit cell areas are separated via the insulating layer 50d.

[0104] On the substrate 2d, a plurality of upper electrodes 20d are located. The upper electrode 20d can be located on the lower electrode 10d. The upper electrode 20d can be located on the electrode embedding space 8d. That is, the upper electrode 20d can be located on the inner surface of the electrode embedding space 8d. Further, when a plurality of electrode embedding spaces 8d are located in one unit cell area, the upper electrode 20d is located in the section between the electrode embedding spaces 8d adjacent to each other on the first surface of the substrate 2d included in one unit cell area. Thereby, on one unit cell area, the area where the upper electrode 20d is located on the inner surface of the electrode embedding space 8d can be connected by the area located on the first surface of the substrate 2d. That is, on one unit cell area, one upper electrode 20d in which respective areas are connected to each other can be located.

[0105] The upper electrode 20d is not located between adjacent unit cell regions. And an insulating layer 50d can be located between the upper electrodes 20d respectively positioned in adjacent unit cell regions. That is, the upper electrodes 20d located on different unit cell regions are separated via the insulating layer 50d.

[0106] The upper electrode 20d may not be located on at least a partial region of the lower electrode 10d. Thereby, the lower electrode 10d can include a lower exposed portion 110d where there is no upper electrode 20d on its upper side. Of the two adjacent lower electrodes 10d along the unit cell connection direction, a lower exposed portion 110d can be located on one side in the unit cell connection direction for one of them. Also, in a region where unit cell regions are adjacent, the lower exposed portions 110d of the lower electrodes 10d respectively positioned on the respective unit cell regions can face the same direction along the unit cell connection direction. As an example, the lower exposed portion 110d can face one end in the length direction (L) of the substrate 2d along the unit cell connection direction. Thereby, the lower exposed portion 110d can be located at one position in the direction in which two adjacent unit cell regions face each other along the unit cell connection direction.

[0107] The upper electrode 20d and the lower electrode 10d respectively positioned in two adjacent unit cell regions can be connected by an internal connection layer 40d. The internal connection layer 40d can include a first internal connection layer 41d, a second internal connection layer 42d, and a third internal connection layer 43d. The first internal connection layer 41d is connected to the lower electrode 10d among the upper electrode 20d and the lower electrode 10d respectively positioned in two adjacent unit cell regions. The first internal connection layer 41d has a via structure, and its lower end can be connected to the lower exposed portion 110d of the lower electrode 10d. The lower end of the first internal connection layer 41d can be in direct contact with the lower exposed portion 110d of the lower electrode 10d. One or a plurality of first internal connection layers 41d can be connected to one lower exposed portion 110d.

[0108] The second internal connection layer 42d is connected to the upper electrode 20d among the upper electrode 20d and the lower electrode 10d respectively positioned in two unit cell regions adjacent to each other. The second internal connection layer 42d has a via structure, and its lower end can be connected to the upper electrode 20d. The lower end of the second internal connection layer 42d can be in direct contact with the upper electrode 20d. One or more second internal connection layers 42d can be connected to one upper electrode 20d.

[0109] The third internal connection layer 43d connects the first internal connection layer 41d connected to one lower electrode 10d and the second internal connection layer 42d connected to the other upper electrode 20d among two unit cell regions adjacent to each other. The third internal connection layer 43d extends along the unit cell connection direction and can be positioned across two adjacent unit cell regions. As an example, the third internal connection layer 43d can have a plate-like structure.

[0110] The upper electrode 20d and the lower electrode 10d respectively positioned in two unit cell regions adjacent to each other can be connected to each other by a plurality of internal connection layers 40d arranged in parallel. The plurality of internal connection layers 40d can be spaced apart in a direction intersecting the unit cell connection direction.

[0111] The dielectric layer 30d can be positioned between the lower electrode 10d and the upper electrode 20d. The dielectric layer 30d may not be on the lower exposed portion 110d.

[0112] The first external electrode 61d is connected to the lower electrode 10d on the unit cell area located at one end in the length direction (L). The first external electrode 61d can be located on the first surface of the substrate 2d. An insulating layer 50d can be located on the substrate 2d so that the lower electrode 10d, the dielectric layer 30d, and the upper electrode 20d are embedded therein. Then, the first external electrode 61d can be located such that at least a partial region is exposed outside the insulating layer 50d on the first surface of the substrate 2d. The first external electrode 61d can be connected to the lower exposed portion 110d of the lower electrode 10d located at one end in the length direction (L). The first external electrode 61d and the lower exposed portion 110d of the lower electrode 10d can be connected by the first external connection layer 46d. As an example, the first external electrode 61d and the lower exposed portion 110d of the lower electrode 10d located at one end in the length direction (L) can face each other in the thickness direction (T). The first external connection layer 46d may be a via structure located between the first external electrode 61d and the lower exposed portion 110d of the lower electrode 10d. The lower end of the first external connection layer 46d can be directly in contact with and connected to the lower exposed portion 110d of the lower electrode 10d. The first external connection layer 46d can be connected to the first external electrode 61d through the first pad portion 48d. That is, the upper end of the first external connection layer 46d is connected to the first pad portion 48d, and the first external electrode 61d can be connected to the first pad portion 48d. The first pad portion 48d can have a plate-like structure. Thereby, when a plurality of the first external electrodes 61d are provided, the first external electrodes 61d can be connected to each other by the first pad portion 48d. One or a plurality of the first external connection layers 46d can be connected to one lower exposed portion 110d.

[0113] The second external electrode 62d can be positioned spaced apart from the first external electrode 61d along the length direction (L). The second external electrode 62d is connected to the upper electrode 20d on the unit cell region located at the other end in the length direction (L). The second external electrode 62d can be positioned on the first surface of the substrate 2d. The second external electrode 62d can be positioned such that at least a partial region is exposed outside the insulating layer 50d on the first surface of the substrate 2d. The second external electrode 62d can be connected to the upper electrode 20d positioned at the end on the opposite side of the first external electrode 61d along the length direction (L). The second external electrode 62d and the upper electrode 20d can be connected by the second external connection layer 47d. As an example, the second external electrode 62d and the upper electrode 20d positioned at the other end in the length direction (L) can face each other in the thickness direction (T). The second external connection layer 47d may be a via structure positioned between the second external electrode 62d and the upper electrode 20d. The lower end of the second external connection layer 47d can be directly in contact with and connected to the upper electrode 20d. The second external connection layer 47d can be connected to the second external electrode 62d through the second pad portion 49d. That is, the upper end of the second external connection layer 47d is connected to the second pad portion 49d, and the second external electrode 62d can be connected to the second pad portion 49d. The second pad portion 49d can have a plate-like structure. Thereby, when a plurality of second external electrodes 62d are provided, the second external electrodes 62d can be connected to each other by the second pad portion 49d. One or a plurality of second external connection layers 47d can be connected to one upper electrode 20d.

[0114] The external electrodes 61d, 62d are the same as or similar to the external electrode 60 described above in FIG. 5 or the external electrode 60a described above in FIG. 6, and repeated description thereof is omitted.

[0115] The capacitor 1d according to another embodiment has a structure in which a lower electrode 10d included in one of two unit capacitor cells (UCd) adjacent to each other along the unit cell connection direction (i.e., the first unit capacitor cell) and an upper electrode 20d included in the other unit capacitor cell (UCd) (i.e., the second unit capacitor cell) are connected via an internal connection layer 40d, and a plurality of unit capacitor cells (UCd) are connected to each other. A lower exposed portion 110d can be located in one of two unit capacitor cells (UCd) adjacent to each other along the unit cell connection direction. At this time, the lower exposed portion 110d can be positioned to face one side in the unit cell connection direction. Thereby, two unit capacitor cells (UCd) adjacent to each other along the unit cell connection direction can be connected via the lower exposed portion 110d, the internal connection layer 40d, and the upper electrode 20d. That is, a plurality of unit capacitor cells (UCd) are connected to each other in series along the unit cell connection direction. And a first external electrode 61d can be connected to the lower electrode 10d of the unit capacitor cell (UCd) located at one end in the length direction (L). Also, a second external electrode 62d can be connected to the upper electrode 20d of the unit capacitor cell (UCd) located at the other end in the length direction (L). The lower electrode 10d connected to the first external electrode 61d becomes the first internal electrode. The upper electrode 20d connected to the second external electrode 62d becomes the second internal electrode. And the upper electrode 20d and the lower electrode 10d located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40d become floating electrodes.

[0116] Also, as described above with reference to FIG. 7, a first external electrode 61d can be connected to the lower electrode 10d of the unit capacitor cell (UCd) located at one end in the length direction (L). Also, a second external electrode 62d can be connected to the lower electrode 10d of the unit capacitor cell (UCd) located at the other end in the length direction (L). The lower electrode 10d connected to the first external electrode 61d serves as the first internal electrode. The lower electrode 10d connected to the second external electrode 62d and the upper electrode 20d connected thereto serve as the second internal electrode. And the upper electrode 20d and the lower electrode 10d located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40d serve as the floating electrode. For this reason, the lower electrode 10d of the unit capacitor cell (UCd) located at the other end in the length direction (L) can have lower exposed portions 110d positioned on both sides. Thereby, one of the two lower exposed portions 110d can face the adjacent unit cell region, and the other can face the end of the substrate 2d along the length direction (L).

[0117] Also, as described above with reference to FIG. 8, a first external electrode 61d can be connected to the upper electrode 20d of the unit capacitor cell (UCd) located at one end in the length direction (L). Also, a second external electrode 62d can be connected to the upper electrode 20d of the unit capacitor cell (UCd) located at the other end in the length direction (L). The upper electrode 20d connected to the first external electrode 61d and the lower electrode 10d connected thereto serve as the first internal electrode. The upper electrode 20d connected to the second external electrode 62d serves as the second internal electrode. And the upper electrode 20d and the lower electrode 10d located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40d serve as the floating electrode.

[0118] At this time, the unit capacitor cell (UCd) including the lower electrode 10d or the upper electrode 30d to which the first external electrode 61d is connected and located at one end in the length direction (L) can be referred to as the first connection capacitor cell. And the unit capacitor cell (UCd) including the lower electrode 10d or the upper electrode 30d to which the second external electrode 61d is connected and located at the other end in the length direction (L) can be referred to as the second connection capacitor cell.

[0119] FIG. 11 is a drawing showing the capacitor 1e according to another embodiment, and FIG. 12 is a longitudinal sectional view taken along line B-B' of FIG. 11.

[0120] Referring to FIGS. 11 and 12, the capacitor 1e according to another embodiment may include a substrate 2e, a lower electrode 10e, an upper electrode 20e, a dielectric layer 30e, a first external electrode 61e, and a second external electrode 62e.

[0121] The substrate 2e may include a support layer 5e and a substrate insulating layer 6e. An electrode embedding space 8e is formed on the substrate 2e. The region where the electrode embedding space 8e is formed can be partitioned into a plurality of unit cell regions.

[0122] The structure of the substrate 2e and the structure in which the region where the electrode embedding space 8e is formed is partitioned into a plurality of unit cell regions are the same as or similar to the structures described above with reference to FIGS. 1 to 4, and repeated description will be omitted.

[0123] The capacitor 1e according to another embodiment includes a plurality of unit capacitor cells (UCe). Each unit capacitor cell (UCe) is respectively located on a unit cell region. That is, one unit capacitor cell (UCe) is located on one unit cell region. Each unit capacitor cell (UCe) includes a lower electrode 10e, an upper electrode 20e, and a dielectric layer 30e located on the unit cell region.

[0124] The structures of the lower electrode 10e, the upper electrode 20e, the dielectric layer 30e, and the insulating layer 50e are the same as or similar to those of the lower electrode 10d, the upper electrode 20d, the dielectric layer 30d, and the insulating layer 50d of the capacitor 1d described above with reference to FIGS. 9 and 10, and repeated description will be omitted.

[0125] The upper electrode 20e and the lower electrode 10e, which are respectively positioned in two unit cell regions adjacent to each other, can be connected by the internal connection layer 40e. The structure of the internal connection layer 40e is the same as or similar to the internal connection layer 40d of the capacitor 1d described above with reference to FIGS. 9 and 10, and repeated description thereof will be omitted.

[0126] The first external electrode 61e is connected to the lower electrode 10e on the unit cell region positioned at one end in the length direction (L). The first external electrode 61e can be positioned on the first surface of the substrate 2e. On the substrate 2e, the insulating layer 50e can be positioned so as to embed the lower electrode 10e, the dielectric layer 30e, and the upper electrode 20e. Then, the first external electrode 61e can be positioned such that at least a partial region is exposed outside the insulating layer 50e on the first surface of the substrate 2e. The first external electrode 61e can be connected to the lower exposed portion 110e of the lower electrode 10e positioned at one end in the length direction (L). The first external electrode 61e can be connected to the lower exposed portion 110e of the lower electrode 10e by the first external connection layer 41e, the first pad portion 42e, the first extended connection layer 43e, and the first extended pad portion 44e.

[0127] The first external connection layer 41e has a via structure, and its lower end can be directly connected in contact with the lower exposed portion 110e of the lower electrode 10e. One or more first external connection layers 41e can be connected to one lower exposed portion 110e. The first pad portion 42e can be directly connected in contact with the upper end of the first external connection layer 41e. The first pad portion 42e can have a plate-like structure. The first extended connection layer 43e has a via structure, and its lower end can be directly connected in contact with the first pad portion 42e. One or more first extended connection layers 43e can be connected to the first pad portion 42e. The first extended pad portion 44e can be directly connected in contact with the upper end of the first extended connection layer 43e. The first extended pad portion 44e can have a plate-like structure. At least a partial region of the first extended pad portion 44e can face the internal connection layer 40e in the thickness direction (T). The area of the first extended pad portion 44e may be larger than the area of one unit cell region. That is, the area of the first extended pad portion 44e may be larger than the area of one unit capacitor cell (UCe). The first external electrode 61e can be connected to the first extended pad portion 44e. The first external electrodes 61e are provided in plurality, and the plurality of first external electrodes 61e can be arranged to be spaced apart from each other along the width direction (W). Also, the plurality of first external electrodes 61e can be arranged to be spaced apart from each other along the length direction (L).

[0128] The second external electrode 62e is connected to the upper electrode 20e on the unit cell region located at the other end in the length direction (L). The second external electrode 62e can be located on the first surface of the substrate 2e. The second external electrode 62e can be located such that at least a partial region is exposed outside the insulating layer 50e on the first surface of the substrate 2e. The second external electrode 62e can be connected to the upper electrode 20e located at the other end in the length direction (L). The second external electrode 62e can be connected to the upper electrode 20e by the second external connection layer 45e, the second pad portion 46e, the second extended connection layer 47e, and the second extended pad portion 48e.

[0129] The second external connection layer 45e has a via structure, and its lower end can be directly in contact with and connected to the upper electrode 20e. One or more second external connection layers 45e can be connected to one upper electrode 20e. The second pad portion 46e can be directly in contact with and connected to the upper end of the second external connection layer 45e. The second pad portion 46e can have a plate-like structure. The second extended connection layer 47e has a via structure, and its lower end can be directly in contact with and connected to the second pad portion 46e. One or more second extended connection layers 47e can be connected to the second pad portion 46e. The second extended pad portion 48e can be directly in contact with and connected to the upper end of the second extended connection layer 47e. The second extended pad portion 48e can have a plate-like structure. At least a partial region of the second extended pad portion 48e can face the internal connection layer 40e in the thickness direction (T). The area of the second extended pad portion 48e may be larger than the area of one unit cell region. That is, the area of the second extended pad portion 48e may be larger than the area of one unit capacitor cell (UCe). The second external electrode 62e can be connected to the second extended pad portion 48e. A plurality of second external electrodes 62e are provided, and the plurality of second external electrodes 62e can be arranged to be spaced apart from each other along the width direction (W). Also, the plurality of second external electrodes 62e can be arranged to be spaced apart from each other along the length direction (L).

[0130] The external electrodes 61e, 62e are the same as or similar to the external electrode 60 described above with reference to FIG. 5 or the external electrode 60a described above with reference to FIG. 6, and repeated description thereof is omitted.

[0131] According to another embodiment, the capacitor 1e has a structure in which a lower electrode 10e included in one of two unit capacitor cells (UCe) adjacent to each other along the unit cell connection direction (i.e., the first unit capacitor cell) and an upper electrode 20e included in the other unit capacitor cell (UCe) (i.e., the second unit capacitor cell) are connected via an internal connection layer 40e, and a plurality of unit capacitor cells (UCe) are connected to each other. A lower exposed portion 110e can be located in one of two unit capacitor cells (UCe) adjacent to each other along the unit cell connection direction. At this time, the lower exposed portion 110e can be positioned to face one side in the unit cell connection direction. Thus, two unit capacitor cells (UCe) adjacent to each other along the unit cell connection direction can be connected via the lower exposed portion 110e, the internal connection layer 40e, and the upper electrode 20e. That is, a plurality of unit capacitor cells (UCe) are connected in series to each other along the unit cell connection direction. A first external electrode 61e can be connected to the lower electrode 10e of the unit capacitor cell (UCe) located at one end in the length direction (L). Also, a second external electrode 62e can be connected to the upper electrode 20e of the unit capacitor cell (UCe) located at the other end in the length direction (L). The lower electrode 10e connected to the first external electrode 61e serves as the first internal electrode. The upper electrode 20e connected to the second external electrode 62e serves as the second internal electrode. Then, the upper electrode 20e and the lower electrode 10e located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40e serve as floating electrodes.

[0132] Also, as described above with reference to FIG. 7, a first external electrode 61e can be connected to the lower electrode 10e of the unit capacitor cell (UCe) located at one end in the length direction (L). Further, a second external electrode 62e can be connected to the lower electrode 10e of the unit capacitor cell (UCe) located at the other end in the length direction (L). The lower electrode 10e connected to the first external electrode 61e serves as the first internal electrode. The lower electrode 10e connected to the second external electrode 62e and the upper electrode 20e connected thereto serve as the second internal electrode. Then, the upper electrode 20e and the lower electrode 10e located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40e serve as floating electrodes. For this reason, the lower electrode 10e of the unit capacitor cell (UCe) located at the other end in the length direction (L) can have lower exposed portions 110e positioned on both sides. As a result, one of the two lower exposed portions 110e can face the adjacent unit cell region, and the other can face the end of the substrate 2e along the length direction (L).

[0133] Also, as described above with reference to FIG. 8, a first external electrode 61e can be connected to the upper electrode 20e of the unit capacitor cell (UCe) located at one end in the length direction (L). Further, a second external electrode 62e can be connected to the upper electrode 20e of the unit capacitor cell (UCe) located at the other end in the length direction (L). The upper electrode 20e connected to the first external electrode 61e and the lower electrode 10e connected thereto serve as the first internal electrode. The upper electrode 20e connected to the second external electrode 62e serves as the second internal electrode. Then, the upper electrode 20e and the lower electrode 10e located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40e serve as floating electrodes.

[0134] At this time, the unit capacitor cell (UCe) including the lower electrode 10e or the upper electrode 30e located at one end in the length direction (L) to which the first external electrode 61e is connected can be referred to as the first connection capacitor cell. And the unit capacitor cell (UCe) including the lower electrode 10e or the upper electrode 30e located at the other end in the length direction (L) to which the second external electrode 61e is connected can be referred to as the second connection capacitor cell.

[0135] Figure 13 is a longitudinal sectional view of a capacitor 1f according to another embodiment.

[0136] Referring to FIG. 13, a capacitor 1f according to another embodiment may include a substrate 2f, a lower electrode 10f, an upper electrode 20f, a dielectric layer 30f, a first external electrode 61f, and a second external electrode 62f.

[0137] An electrode embedding space 8f is formed on the substrate 2f. The region where the electrode embedding space 8f is formed can be partitioned into a plurality of unit cell regions.

[0138] The structure of the substrate 2f and the structure in which the region where the electrode embedding space 8f is formed is partitioned into a plurality of unit cell regions are the same as or similar to the structures described above with reference to FIGS. 1 to 4, and repeated description will be omitted.

[0139] A capacitor 1f according to another embodiment includes a plurality of unit capacitor cells (UCf). Each unit capacitor cell (UCf) is respectively located on a unit cell region. That is, one unit capacitor cell (UCf) is located on one unit cell region. Each unit capacitor cell (UCf) includes a lower electrode 10f, an upper electrode 20f, and a dielectric layer 30f located on the unit cell region.

[0140] The structures of the lower electrode 10f, the upper electrode 20f, the dielectric layer 30f, and the insulating layer 50f are the same as or similar to those of the lower electrode 10d, the upper electrode 20d, the dielectric layer 30d, and the insulating layer 50d of the capacitor 1d described above with reference to FIGS. 9 and 10, and repeated description will be omitted.

[0141] The upper electrode 20f and the lower electrode 10f respectively located in two adjacent unit cell regions can be connected by an internal connection layer 40f. The structure of the internal connection layer 40g is the same as or similar to that of the internal connection layer 40d of the capacitor 1d described above with reference to FIGS. 9 and 10, and repeated description will be omitted.

[0142] The first external electrode 61f is connected to the lower electrode 10f on the unit cell area located at one end in the length direction (L). The first external electrode 61f can be located on the first surface of the substrate 2f. An insulating layer 50f can be located on the substrate 2f such that the lower electrode 10f, the dielectric layer 30f, and the upper electrode 20f are embedded therein. And the first external electrode 61f can be located such that at least a partial region is exposed outside the insulating layer 50f on the first surface of the substrate 2f. The first external electrode 61f can be connected to the lower exposed portion 110f of the lower electrode 10f located at one end in the length direction (L). The first external electrode 61f can be connected to the lower exposed portion 110f of the lower electrode 10f by means of the first external connection layer 41f and the first pad portion 44f.

[0143] The first external connection layer 41f has a via structure, and the lower end thereof can be directly in contact with and connected to the lower exposed portion 110f of the lower electrode 10f. One or a plurality of first external connection layers 41f can be connected to one lower exposed portion 110f. The first pad portion 44f can be directly in contact with and connected to the upper end of the first external connection layer 41f. The first pad portion 44f can have a plate-like structure. At least a partial region of the first pad portion 44f can face the internal connection layer 40f in the thickness direction (T). The area of the first pad portion 44f may be larger than the area of one unit cell area. That is, the area of the first pad portion 44f may be larger than the area of one unit capacitor cell (UCf). The first external electrode 61f can be connected to the first pad portion 44f. The first external electrodes 61f are provided in plurality, and the plurality of first external electrodes 61f can be arranged to be spaced apart from each other along the width direction (W). Also, the plurality of first external electrodes 61f can be arranged to be spaced apart from each other along the length direction (L).

[0144] The second external electrode 62f is connected to the upper electrode 20f on the unit cell region located at the other end in the length direction (L). The second external electrode 62f can be located on the first surface of the substrate 2f. The second external electrode 62f can be positioned such that at least a partial region is exposed outside the insulating layer 50f on the first surface of the substrate 2f. The second external electrode 62f can be connected to the upper electrode 20f located at the other end in the length direction (L). The second external electrode 62f can be connected to the upper electrode 20f by the second external connection layer 45f and the second pad portion 48f.

[0145] The second external connection layer 45f has a via structure, and the lower end can be directly in contact with and connected to the upper electrode 20f. One or a plurality of second external connection layers 45f can be connected to one upper electrode 20f. The second pad portion 48f can be directly in contact with and connected to the upper end of the second external connection layer 45f. The second pad portion 48f can have a plate-like structure. At least a partial region of the second pad portion 48f can face the internal connection layer 40f in the thickness direction (T). The area of the second pad portion 48f may be larger than the area of one unit cell region. That is, the area of the second pad portion 48f may be larger than the area of one unit capacitor cell (UCf). The second external electrode 62f can be connected to the second pad portion 48f. A plurality of second external electrodes 62f are provided, and the plurality of second external electrodes 62f can be arranged at intervals from each other along the width direction (W). Also, the plurality of second external electrodes 62f can be arranged at intervals from each other along the length direction (L).

[0146] The external electrodes 61f, 62f are the same as or similar to the external electrode 60 described above with reference to FIG. 5 or the external electrode 60a described above with reference to FIG. 6, and repeated description thereof is omitted.

[0147] According to another embodiment, the capacitor 1f has a structure in which a lower electrode 10f included in one of two unit capacitor cells (UCf) adjacent to each other along the unit cell connection direction (i.e., the first unit capacitor cell) and an upper electrode 20f included in the other unit capacitor cell (UCf) (i.e., the second unit capacitor cell) are connected via an internal connection layer 40f, and a plurality of unit capacitor cells (UCf) are connected to each other. A lower exposed portion 110f can be located in one of two unit capacitor cells (UCf) adjacent to each other along the unit cell connection direction. At this time, the lower exposed portion 110f can be located so as to face one side in the unit cell connection direction. Thereby, two unit capacitor cells (UCf) adjacent to each other along the unit cell connection direction can be connected via the lower exposed portion 110f, the internal connection layer 40f, and the upper electrode 20f. That is, a plurality of unit capacitor cells (UCf) are connected to each other in series along the unit cell connection direction. A first external electrode 61f can be connected to the lower electrode 10f of the unit capacitor cell (UCf) located at one end in the length direction (L). Also, a second external electrode 62f can be connected to the upper electrode 20f of the unit capacitor cell (UCf) located at the other end in the length direction (L). The lower electrode 10f connected to the first external electrode 61f becomes the first internal electrode. The upper electrode 20f connected to the second external electrode 62f becomes the second internal electrode. Then, the upper electrode 20f and the lower electrode 10f located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40f become floating electrodes.

[0148] Also, as described above with reference to FIG. 7, a first external electrode 61f can be connected to the lower electrode 10f of the unit capacitor cell (UCf) located at one end in the length direction (L). Also, a second external electrode 62f can be connected to the lower electrode 10f of the unit capacitor cell (UCf) located at the other end in the length direction (L). The lower electrode 10f connected to the first external electrode 61f serves as the first internal electrode. The lower electrode 10f connected to the second external electrode 62f and the upper electrode 20f connected thereto serve as the second internal electrode. And the upper electrode 20f and the lower electrode 10f located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40f serve as the floating electrode. For this reason, the lower electrode 10f of the unit capacitor cell (UCf) located at the other end in the length direction (L) can have lower exposed portions 110f positioned on both sides. Thereby, one of the two lower exposed portions 110f can face the adjacent unit cell region, and the other can face the end of the substrate 2f along the length direction (L).

[0149] Also, as described above with reference to FIG. 8, a first external electrode 61f can be connected to the upper electrode 20f of the unit capacitor cell (UCf) located at one end in the length direction (L). Also, a second external electrode 62f can be connected to the upper electrode 20f of the unit capacitor cell (UCf) located at the other end in the length direction (L). The upper electrode 20f connected to the first external electrode 61f and the lower electrode 10f connected thereto serve as the first internal electrode. The upper electrode 20f connected to the second external electrode 62f serves as the second internal electrode. And the upper electrode 20f and the lower electrode 10f located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40f serve as the floating electrode.

[0150] At this time, the unit capacitor cell (UCf) including the lower electrode 10f or the upper electrode 30f to which the first external electrode 61f is connected and located at one end in the length direction (L) can be called the first connection capacitor cell. And the unit capacitor cell (UCf) including the lower electrode 10f or the upper electrode 30f to which the second external electrode 61f is connected and located at the other end in the length direction (L) can be called the second connection capacitor cell.

[0151] FIG. 14 is a drawing showing a capacitor 1g according to another embodiment.

[0152] Referring to FIG. 14, a capacitor 1g according to another embodiment may include a substrate 2g, a lower electrode 10g, an upper electrode 20g, a dielectric layer 30g, a first external electrode 61g, and a second external electrode 62g.

[0153] An electrode embedding space 8g is formed on the substrate 2g. The region where the electrode embedding space 8g is formed can be partitioned into a plurality of unit cell regions.

[0154] The structure of the substrate 2g and the structure in which the region where the electrode embedding space 8g is formed is partitioned into a plurality of unit cell regions are the same as or similar to the structures described above with reference to FIGS. 1 to 4, and repeated description will be omitted.

[0155] A capacitor 1g according to another embodiment includes a plurality of unit capacitor cells (UCg). Each unit capacitor cell (UCg) is located on a unit cell region respectively. That is, one unit capacitor cell (UCg) is located on one unit cell region. Each unit capacitor cell (UCg) includes a lower electrode 10g, an upper electrode 20g, and a dielectric layer 30g located on the unit cell region.

[0156] The structures of the lower electrode 10g, the upper electrode 20g, the dielectric layer 30g, and the insulating layer 50g are the same as or similar to those of the lower electrode 10d, the upper electrode 20d, the dielectric layer 30d, and the insulating layer 50d of the capacitor 1d described above with reference to FIGS. 9 and 10, and repeated description will be omitted.

[0157] The upper electrode 20g and the lower electrode 10g located in two unit cell regions adjacent to each other can be connected by the internal connection layer 40g. The internal connection layer 40g can include a first internal connection layer 41g, a second internal connection layer 42g, and a third internal connection layer 43g. The structure of the internal connection layer 40g is the same as or similar to the internal connection layer 40d of the capacitor 1d described above with reference to FIGS. 9 and 10, and repeated description thereof will be omitted.

[0158] The first external electrode 61g is connected to the lower electrode 10g on the unit cell region located at one end in the length direction (L). The first external electrode 61g is connected to the lower electrode 10g by the first external connection layer 46g.

[0159] The second external electrode 62g can be located at a distance from the first external electrode 61g along the length direction (L). The second external electrode 62g is connected to the upper electrode 20g on the unit cell region located at the other end in the length direction (L). The second external electrode 62g is connected to the lower electrode 10g by the second external connection layer 47g.

[0160] The connection structure of the first external electrode 61g, the first external connection layer 46g, the second external electrode 62g, and the second external connection layer 47g is the same as or similar to the first external electrode 61, the first external connection layer 46, the second external electrode 62, and the second external connection layer 47 described above with reference to FIGS. 1 to 4, and repeated description thereof will be omitted.

[0161] The external electrodes 61g and 62g are the same as or similar to the external electrode 60 described above with reference to FIG. 5 or the external electrode 60a described above with reference to FIG. 6, and repeated description thereof will be omitted.

[0162] According to another embodiment, the capacitor 1g has a structure in which the lower electrode 10g included in one of two unit capacitor cells (UCg) adjacent to each other along the unit cell connection direction (i.e., the first unit capacitor cell) and the upper electrode 20g included in the other unit capacitor cell (UCg) (i.e., the second unit capacitor cell) are connected via the internal connection layer 40g, and a plurality of unit capacitor cells (UCg) are connected to each other. A lower exposed portion 110g can be located in one of two unit capacitor cells (UCg) adjacent to each other along the unit cell connection direction. At this time, the lower exposed portion 110g can be located so as to face one side in the unit cell connection direction. Thus, two unit capacitor cells (UCg) adjacent to each other along the unit cell connection direction can be connected to each other via the lower exposed portion 110g, the internal connection layer 40g, and the upper electrode 20g. That is, a plurality of unit capacitor cells (UCg) are connected in series to each other along the unit cell connection direction. The first external electrode 61g can be connected to the lower electrode 10g of the unit capacitor cell (UCg) located at one end in the length direction (L). The second external electrode 62g can be connected to the upper electrode 20g of the unit capacitor cell (UCg) located at the other end in the length direction (L). The lower electrode 10g connected to the first external electrode 61g becomes the first internal electrode. The upper electrode 20g connected to the second external electrode 62g becomes the second internal electrode. The upper electrode 20g and the lower electrode 10g located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40g become floating electrodes.

[0163] Also, as described above with reference to FIG. 7, a first external electrode 61g can be connected to the lower electrode 10g of the unit capacitor cell (UCg) located at one end in the length direction (L). Also, a second external electrode 62g can be connected to the lower electrode 10g of the unit capacitor cell (UCg) located at the other end in the length direction (L). The lower electrode 10g connected to the first external electrode 61g serves as the first internal electrode. The lower electrode 10g connected to the second external electrode 62g and the upper electrode 20g connected thereto serve as the second internal electrode. And the upper electrode 20g and the lower electrode 10g, which are located between the first internal electrode and the second internal electrode and are connected by the internal connection layer 40g, serve as floating electrodes. For this reason, the lower electrode 10g of the unit capacitor cell (UCg) located at the other end in the length direction (L) can have lower exposed portions 110g positioned on both sides. Thereby, one of the two lower exposed portions 110g can face the adjacent unit cell region, and the other can face the end of the substrate 2g along the length direction (L).

[0164] Also, as described above with reference to FIG. 8, a first external electrode 61g can be connected to the upper electrode 20g of the unit capacitor cell (UCg) located at one end in the length direction (L). Also, a second external electrode 62g can be connected to the upper electrode 20g of the unit capacitor cell (UCg) located at the other end in the length direction (L). The upper electrode 20g connected to the first external electrode 61g and the lower electrode 10g connected thereto serve as the first internal electrode. The upper electrode 20g connected to the second external electrode 62g serves as the second internal electrode. And the upper electrode 20g and the lower electrode 10g, which are located between the first internal electrode and the second internal electrode and are connected by the internal connection layer 40g, serve as floating electrodes.

[0165] At this time, the unit capacitor cell (UCg) including the lower electrode 10g or the upper electrode 30g to which the first external electrode 61g is connected and which is located at one end in the length direction (L) can be called the first connection capacitor cell. And the unit capacitor cell (UCg) including the lower electrode 10g or the upper electrode 30g to which the second external electrode 61g is connected and which is located at the other end in the length direction (L) can be called the second connection capacitor cell.

[0166] FIG. 15 is a drawing showing the capacitor 1h according to another embodiment.

[0167] Referring to FIG. 15, the capacitor 1h according to another embodiment can include a substrate 2h, a lower electrode 10h, an upper electrode 20h, a dielectric layer 30h, a first external electrode 61h, and a second external electrode 62h.

[0168] An electrode embedding space 8h is formed on the substrate 2h. The region where the electrode embedding space 8h is formed can be partitioned into a plurality of unit cell regions.

[0169] The structure of the substrate 2h and the structure in which the region where the electrode embedding space 8h is formed is partitioned into a plurality of unit cell regions are the same as or similar to the structures described above with reference to FIGS. 1 to 4, and repeated descriptions are omitted.

[0170] The capacitor 1h according to another embodiment includes a plurality of unit capacitor cells (UCh). Each unit capacitor cell (UCh) is located on a unit cell region respectively. That is, one unit capacitor cell (UCh) is located on one unit cell region. Each unit capacitor cell (UCh) includes a lower electrode 10h, an upper electrode 20h, and a dielectric layer 30h located on the unit cell region.

[0171] The structures of the lower electrode 10h, the upper electrode 20h, the dielectric layer 30h, and the insulating layer 50h are the same as or similar to those of the lower electrode 10, the upper electrode 20, the dielectric layer 30, and the insulating layer 50 of the capacitor 1 described above with reference to FIGS. 1 and 4, and repeated descriptions are omitted.

[0172] The upper electrode 20h and the lower electrode 10h respectively located in two adjacent unit cell regions can be connected by an internal connection layer 40h. The structure of the internal connection layer 40h is the same as or similar to that of the internal connection layer 40 of the capacitor 1 described above with reference to FIGS. 1 and 4, and repeated descriptions are omitted.

[0173] The first external electrode 61h is connected to the lower electrode 10h on the unit cell region located at one end in the length direction (L). The first external electrode 61h is connected to the lower electrode 10h by the first external connection layer 46h. A first pad portion 48h can be located between the first external connection layer 46h and the first external electrode 61h.

[0174] The second external electrode 62h can be located at a distance from the first external electrode 61h along the length direction (L). The second external electrode 62h is connected to the upper electrode 20h on the unit cell region located at the other end in the length direction (L). The second external electrode 62h is connected to the lower electrode 10h by the second external connection layer 47h. A second pad portion 49h can be located between the first external connection layer 46h and the first external electrode 61h.

[0175] The connection structures of the first external electrode 61h, the first external connection layer 46h, the second external electrode 62h, the second external connection layer 47h, the first pad portion 48h, and the second pad portion 49h are the same as or similar to those of the first external electrode 61d, the first external connection layer 46d, the second external electrode 62d, the second external connection layer 47d, the first pad portion 48d, and the second pad portion 49d described above with reference to FIGS. 9 and 10, and repeated description will be omitted.

[0176] Also, the first pad portion 48h and the second pad portion 49h are the same as or similar to the first pad portion 48f and the second pad portion 49f described above with reference to FIG. 13, and at least a partial region of the first pad portion 48h and the second pad portion 49h can be located in a region facing the internal connection layer 40h in the thickness direction (T). The first external electrode 61h and the second external electrode 62h are provided in plurality and can be arranged at intervals in the width direction (W) and the length direction (L).

[0177] The external electrodes 61h and 62h are the same as or similar to the external electrode 60 described above with reference to FIG. 5 or the external electrode 60a described above with reference to FIG. 6, and repeated description will be omitted.

[0178] According to another embodiment, the capacitor 1h has a structure in which a lower electrode 10h included in one of two unit capacitor cells (UCh) adjacent to each other along the unit cell connection direction (i.e., the first unit capacitor cell) and an upper electrode 20h included in the other unit capacitor cell (UCh) (i.e., the second unit capacitor cell) are connected via an internal connection layer 40h, and a plurality of unit capacitor cells (UCh) are connected to each other. A lower exposed portion 110h can be located in one of two unit capacitor cells (UCh) adjacent to each other along the unit cell connection direction, and an upper protruding portion 210h can be located in the other. At this time, the lower exposed portion 110h can be positioned to face one side in the unit cell connection direction, and the upper protruding portion 210h can be positioned to face the other side in the unit cell connection direction. Thereby, two unit capacitor cells (UCh) adjacent to each other along the unit cell connection direction can be connected to each other via the lower exposed portion 110h, the upper protruding portion 210h, and the internal connection layer 40h. That is, a plurality of unit capacitor cells (UCh) are connected to each other in series along the unit cell connection direction. And a first external electrode 61h can be connected to the lower electrode 10h of the unit capacitor cell (UCh) located at one end in the length direction (L). Also, a second external electrode 62h can be connected to the upper electrode 20h of the unit capacitor cell (UCh) located at the other end in the length direction (L). The lower electrode 10h connected to the first external electrode 61h becomes the first internal electrode. The upper electrode 20h connected to the second external electrode 62h becomes the second internal electrode. And the upper electrode 20h and the lower electrode 10h located between the first internal electrode and the second internal electrode and connected by the internal connection layer 40h become floating electrodes.

[0179] Also, as described above with reference to FIG. 7, a first external electrode 61h can be connected to the lower electrode 10h of the unit capacitor cell (UCh) located at one end in the length direction (L). Further, a second external electrode 62h can be connected to the lower electrode 10h of the unit capacitor cell (UCh) located at the other end in the length direction (L). The lower electrode 10h connected to the first external electrode 61h serves as the first internal electrode. The lower electrode 10h connected to the second external electrode 62h and the upper electrode 20h connected thereto serve as the second internal electrode. The upper electrode 20h and the lower electrode 10h positioned between the first internal electrode and the second internal electrode and connected by the internal connection layer 40h serve as the floating electrode. For this reason, the lower electrode 10h of the unit capacitor cell (UCh) located at the other end in the length direction (L) can have lower exposed portions 110h positioned on both sides. As a result, one of the two lower exposed portions 110h can face the adjacent unit cell area, and the other can face the end of the substrate 2h along the length direction (L).

[0180] Also, as described above with reference to FIG. 8, a first external electrode 61h can be connected to the upper electrode 20h of the unit capacitor cell (UCh) located at one end in the length direction (L). Further, a second external electrode 62h can be connected to the upper electrode 20h of the unit capacitor cell (UCh) located at the other end in the length direction (L). The upper electrode 20h connected to the first external electrode 61h and the lower electrode 10h connected thereto serve as the first internal electrode. The upper electrode 20h connected to the second external electrode 62h serves as the second internal electrode. The upper electrode 20h and the lower electrode 10h positioned between the first internal electrode and the second internal electrode and connected by the internal connection layer 40h serve as the floating electrode.

[0181] At this time, the unit capacitor cell (UCh) including the lower electrode 10h or the upper electrode 30h to which the first external electrode 61h is connected and which is located at one end in the length direction (L) can be called the first connection capacitor cell. And the unit capacitor cell (UCh) including the lower electrode 10h or the upper electrode 30h to which the second external electrode 61h is connected and which is located at the other end in the length direction (L) can be called the second connection capacitor cell.

[0182] FIG. 16 is a plan view of the capacitor 1i according to another embodiment.

[0183] Referring to FIG. 16, the external electrode 60i can have a plate-like structure. The external electrode 60i can include a first external electrode 61i and a second external electrode 62i. The first external electrode 61i can be positioned such that at least a partial region is exposed outside the insulating layer 50i on the first surface of the substrate. The second external electrode 62i can be positioned such that at least a partial region is exposed outside the insulating layer 50i on the first surface of the substrate.

[0184] In addition to the external electrode 60i, the structure of the capacitor 1i is the same as or similar to one of the capacitors 1 described in FIGS. 1 to 4, the capacitor 1b described in FIG. 7, the capacitor 1c described in FIG. 8, the capacitor 1d described in FIGS. 9 and 10, the capacitor 1e described in FIGS. 11 and 12, the capacitor 1f described in FIG. 13, the capacitor 1g described in FIG. 14, and the capacitor 1h described in FIG. 15, and repeated description thereof will be omitted.

[0185] FIG. 17 is a drawing showing the arrangement structure of unit cell regions (UCA1, UCA2) according to another embodiment.

[0186] Referring to FIG. 17, at least two or more unit cell regions (UCA1, UCA2) are arranged along the length direction (L). Also, at least two or more unit cell regions (UCA1, UCA2) can be arranged along the width direction (W). Also, there may be a plurality of unit cell connection directions (CD1, CD2). Also, one unit cell connection direction (CD1, CD2) can pass through each of the unit cell regions (UCA1, UCA2). The unit capacitor cells located on the unit cell regions (UCA1, UCA2) are connected to each other along the unit cell connection direction (CD1, CD2). Thereby, the regions connected along each unit cell connection direction (CD1, CD2) have a parallel structure. As an example, the unit cell regions (UCA1, UCA2) can include a first unit cell region (UCA1) and a second unit cell region (UCA2). The first unit cell region (UCA1) and the second unit cell region (UCA2) can be arranged along the width direction (W). And the unit cell connection directions (CD1, CD2) can include a first unit cell connection direction (CD1) and a second unit cell connection direction (CD1). The first unit cell connection direction (CD1) passes through a plurality of first unit cell regions (UCA1). That is, the first unit cell connection direction (CD1) passes through each of the plurality of first unit cell regions (UCA1) once. That is, the second unit cell connection direction (CD2) passes through each of the plurality of first unit cell regions (UCA2) once. Thereby, the unit capacitor cells located on the first unit cell region (UCA1) and connected in the first unit cell connection direction (CD1), and the unit capacitor cells located on the second unit cell region (UCA2) and connected in the second unit cell connection direction (CD2) have a parallel structure.

[0187] The structure of the unit capacitor cell, the structure in which the unit capacitor cells are connected, the structure in which the external electrodes are connected to the unit capacitor cells, and the structure of the external electrodes are the same as or similar to those described above with reference to FIGS. 1 to 16, and repeated description is omitted.

[0188] FIG. 18 is a cross-sectional view of a substrate 2j according to another embodiment.

[0189] Referring to FIG. 18, an electrode embedding space 8j is formed on the substrate 2j. As an example, the electrode embedding space 8j can be formed through an etching process on a silicon wafer. Thereby, the first and second surfaces of the substrate 2j may be made of silicon material. The structure of the electrode embedding space 8j is the same as or similar to the electrode embedding space 8 of the substrate 2 described above with reference to FIGS. 1 to 4, and repeated description is omitted.

[0190] On the substrate 2j, the structures described above with reference to FIGS. 1 to 17 can be located.

[0191] FIG. 19 is a drawing showing a substrate 2k according to another embodiment.

[0192] Referring to FIG. 19, the substrate 2k can be provided with an insulating material. A plurality of electrode embedding spaces 8k can be formed on the first surface of the substrate 2k. The electrode embedding space 8k may be a columnar space that enters from the first surface toward the second surface. As an example, the substrate 2k can be made of porous anodizing aluminum oxide (AAO), and the electrode embedding space 8k can be formed by fine pores formed in the anodized aluminum oxide. The aspect ratio of the fine pores may be 2000 to 3000. The substrate 2k can have a structure in which the lower side of the lower end of the fine pores is blocked.

[0193] On the substrate 2k, the structures described above with reference to FIGS. 1 to 17 can be located.

[0194] Although the embodiments of the present invention have been described in detail above, the scope of the rights of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention defined in the following claims also belong to the scope of the rights of the present invention.

Explanation of Reference Numerals

[0195] 2 Substrate 5 Support layer 6 Substrate insulating layer 8 Electrode Embedding Space 10 Lower Electrode 20 Upper Electrode 30 Dielectric Layer 40 Internal Connection Layer 46 First External Connection Layer 47 Second External Connection Layer 50 Insulation Layer 61 First External Electrode 62 Second External Electrode 110 Lower Exposed Portion 210 Upper Protrusion

Claims

1. A substrate; and A plurality of unit capacitor cells located on the substrate; A capacitor comprising: Each of the plurality of unit capacitor cells includes a lower electrode and an upper electrode located on the lower electrode, The lower electrode included in the first unit capacitor cell among the plurality of unit capacitor cells is connected to the upper electrode included in the second unit capacitor cell among the plurality of unit capacitor cells, a capacitor.

2. A first external electrode; and A second external electrode located at a distance in the length direction from the first external electrode; Further comprising: The first external electrode is connected to the lower electrode included in the first connection capacitor cell located at one end in the length direction among the plurality of unit capacitor cells, The second external electrode is connected to the upper electrode included in the second connection capacitor cell located at the other end in the length direction among the plurality of unit capacitor cells, the capacitor according to claim 1.

3. A first external connection layer connecting the first external electrode and the lower electrode included in the first connection capacitor cell; and A second external connection layer connecting the second external electrode and the upper electrode included in the second connection capacitor cell; Further comprising the capacitor according to claim 2.

4. A first pad portion located between the first external connection layer and the first external electrode; and A second pad portion located between the second external connection layer and the second external electrode; Further comprising the capacitor according to claim 3.

5. The first external electrode and the second external electrode have a bump structure, the capacitor according to claim 2.

6. The first external electrode and the second external electrode are provided in plurality, the capacitor according to claim 5.

7. A first external electrode; and A second external electrode located at a distance in the length direction from the first external electrode; Further comprising: The first external electrode is connected to the lower electrode included in the first connection capacitor cell located at one end in the length direction among the plurality of unit capacitor cells, The second external electrode is connected to the lower electrode included in the second connection capacitor cell located at the other end in the length direction among the plurality of unit capacitor cells, the capacitor according to claim 1.

8. A first external electrode; and A second external electrode located at a distance in the length direction from the first external electrode; Further comprising: The first external electrode is connected to the upper electrode included in the first connection capacitor cell located at one end in the length direction among the plurality of unit capacitor cells. The second external electrode is connected to the upper electrode included in the second connection capacitor cell located at the other end in the length direction among the plurality of unit capacitor cells. The capacitor according to claim 1. **Claim 9** The capacitor according to claim 1, further comprising an internal connection layer having a via structure and connecting the lower electrode included in the first unit capacitor cell and the upper electrode included in the second unit capacitor cell. **Claim 10** The lower electrode included in the first unit capacitor cell includes a lower exposed portion without the upper electrode on its upper side, and the upper electrode included in the second unit capacitor cell includes an upper protruding portion protruding toward the lower exposed portion. The capacitor according to claim 9, wherein the internal connection layer is located between the lower exposed portion and the upper protruding portion. **Claim 11** The internal connection layer A first internal connection layer connected to the lower electrode; A second internal connection layer connected to the upper electrode; and A third internal connection layer connecting the first internal connection layer and the second internal connection layer; The capacitor according to claim 9, comprising. **Claim 12** The capacitor according to claim 11, wherein the third internal connection layer has a plate-like structure. **Claim 13** A substrate; and A plurality of unit capacitor cells located on the substrate; A capacitor comprising Each of the plurality of unit capacitor cells includes a lower electrode and an upper electrode located on the lower electrode. The lower electrodes included in each of the plurality of unit capacitor cells are separated from each other. The upper electrodes included in each of the plurality of unit capacitor cells are separated from each other. The plurality of unit capacitor cells are connected to each other in series. The capacitor. **Claim 14** A plurality of electrode embedding spaces having a groove structure are formed in the substrate. The region where the plurality of electrode embedding spaces are formed is partitioned into a plurality of unit cell regions, and one of the plurality of unit capacitor cells is located on one of the plurality of unit cell regions. The capacitor according to claim 13. **Claim 15** The capacitor according to claim 14, wherein the plurality of unit capacitor cells are connected along a unit cell connection direction passing through each of the plurality of unit cell regions once. **Claim 16** The plurality of unit cell regions A plurality of first unit cell regions; and A plurality of second unit cell regions; comprising The plurality of unit capacitor cells located on the plurality of first unit cell regions are connected along a first unit cell connection direction passing through the plurality of first unit cell regions, The plurality of unit capacitor cells located on the plurality of second unit cell regions are connected along a second unit cell connection direction passing through the plurality of second unit cell regions. The capacitor according to claim 15.

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