Laminated type electronic component

Abstract

To provide a laminated type electronic component which improves capacity per unit volume, and sealability.SOLUTION: A laminated type electronic component includes a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 which are alternately arranged across the dielectric layer in a first direction, when a direction vertical to the first direction is a second direction, and a direction vertical to the first direction and the second direction is a third direction, external electrodes 130 and 140 which are arranged on surfaces facing the second direction of the body, wherein the external electrodes include electrode layers 131a, 131b, 141a and 141b which are connected to the internal electrodes, and contain Cu and an oxide containing Cu, and when in the electrode layer, a region positioned on the central part in the first direction of the body is represented by a center part, and regions which are arranged on both sides in the first direction of the center part, and have a projecting part in the second direction are represented by side parts, the content of the oxide containing Cu in the side parts is larger than the content of the oxide containing Cu in the center part.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-type capacitor that is mounted on printed circuit boards of various electronic products such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones, mobile phones, on-board chargers (OBCs) for electric vehicles, and circuits such as DC-DC converters, and plays a role in charging or discharging electricity.

[0003] Due to the advantages of being small in size while ensuring high capacitance and being easy to mount, multilayer ceramic capacitors can be used as components of various electronic devices. As various electronic devices such as computers and mobile devices are miniaturized and have increased output, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] In addition, when multilayer ceramic capacitors are used in circuits such as electric vehicles, the requirements for withstanding severe physical loads and ensuring the maximum capacitance in an appropriate size are increasing.

[0005] The external electrodes of multilayer ceramic capacitors can have a conductive resin layer structure in which a conductive metal filler is added to a polymer such as a conductive resin of an electrode layer mainly composed of a conductive metal, or can have a structure in which a plating layer is formed on an electrode layer mainly composed of a conductive metal.

[0006] In order to reduce the proportion of the external electrodes in the entire component, if the thickness of the electrode layer is formed thin without fine adjustment, there may be a problem that the plating solution easily penetrates during the formation process of the plating layer.

[0007] Therefore, even when a multilayer electronic component such as a multilayer ceramic capacitor is exposed to a harsh environment, it is necessary to improve the external electrode structure that enables thinning and can improve the hermeticity.

Summary of the Invention

Problems to be Solved by the Invention

[0008] One of several objects of the present invention is to improve the capacitance per unit volume of a multilayer electronic component.

[0009] One of several objects of the present invention is to improve the hermeticity of a multilayer electronic component.

[0010] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problems

[0011] A multilayer electronic component according to an embodiment of the present invention includes a main body including a dielectric layer and internal electrodes alternately arranged in a first direction with the dielectric layer interposed therebetween, and when a direction perpendicular to the first direction is a second direction and a direction perpendicular to the first direction and the second direction is a third direction, external electrodes respectively arranged on surfaces of the main body facing the second direction, the external electrodes being connected to the internal electrodes and including an electrode layer containing Cu and an oxide containing Cu, in the electrode layer, a region located on the central portion of the main body in the first direction is a center portion, and regions arranged on both sides of the center portion in the first direction and having a convex shape in the second direction are side portions, the content of the oxide containing Cu in the side portions can be larger than the content of the oxide containing Cu in the center portion.

Effects of the Invention

[0012] One of the effects of the present invention is to improve the capacitance per unit volume of the multilayer electronic component by adjusting the shape of the external electrode and thinning the external electrode.

[0013] One of the effects of the present invention is to improve the hermeticity of the multilayer electronic component by preventing an external substance such as a plating solution from damaging the electrode layer.

[0014] One of the effects of the present invention is to improve the capacitance per unit volume and the hermeticity of the multilayer electronic component by preventing an external substance such as a plating solution from damaging the electrode layer even when the external electrode is thinned.

[0015] However, the various beneficial advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

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Figure 8

DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shapes and sizes of elements in the drawings can be exaggerated for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0018] And, for the purpose of clearly explaining the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of each configuration shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. For components having the same function within the scope of the same idea, the same reference numerals are used for explanation. Furthermore, throughout the specification, when a part is said to "include" a certain component, this means that, unless otherwise stated to the contrary, it does not exclude other components but may further include other components.

[0019] In the drawings, the first direction can be defined as the stacking direction or the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0020] FIG. 1 schematically shows a perspective view of a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line I-I' of FIG. 1, FIG. 3 shows an enlarged view of the region where the first external electrode is disposed in FIG. 2, FIG. 4 is a cross-sectional view taken along the line II-II' of FIG. 1, FIG. 5 is an exploded perspective view showing the disassembled body according to an embodiment, and FIG. 8 is an image obtained by observing, with an optical microscope (OM, Optical Microscope), the region where the electrode layers are formed in the cross-sections in the first direction and the second direction after the electrode layers are formed in the multilayer electronic component according to an embodiment.

[0021] Hereinafter, with reference to FIGS. 1 to 5 and FIG. 8, a multilayer electronic component according to an embodiment of the present invention and various examples thereof will be described in detail.

[0022] A multilayer electronic component 100 according to an embodiment of the present invention includes a main body 110 including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged in a first direction with the dielectric layer 111 interposed therebetween, and external electrodes 130 and 140 respectively disposed on surfaces of the main body 110 facing each other in a second direction when a direction perpendicular to the first direction is defined as the second direction and a direction perpendicular to both the first direction and the second direction is defined as the third direction. The external electrodes 130 and 140 are connected to the internal electrodes 121 and 122 and include electrode layers 131 and 141 containing Cu and oxides containing Cu. In the electrode layers 131 and 141, when a region located on the central portion of the main body 110 in the first direction is defined as the center portion and regions disposed on both sides of the center portion in the first direction and having a convex shape in the second direction are defined as side portions, the content of the oxide containing Cu in the side portions may be larger than the content of the oxide containing Cu in the center portion.

[0023] The main body 110 may have the dielectric layer 111 and the internal electrodes 121 and 122 alternately laminated. Specifically, the internal electrodes 121 and 122 can be alternately arranged with the dielectric layer 111 interposed therebetween.

[0024] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 can be in the shape of a hexahedron or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a hexahedron shape with perfect straight lines, but can substantially have a hexahedron shape.

[0025] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4, and facing each other in a third direction.

[0026] By overlapping the margin regions where the internal electrodes 121 and 122 are not arranged on the dielectric layer 111, a step due to the thickness of the internal electrodes 121 and 122 is generated. The corner connecting the first surface to the third, fourth, and fifth surfaces and / or the corner connecting the second surface to the third, fourth, and fifth surfaces can have a form shrunk toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corner connecting the first surface 1 to the third, fourth, fifth, and sixth surfaces and / or the corner connecting the second surface 2 to the third, fourth, fifth, and sixth surfaces can have a form shrunk toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, in order to prevent chipping defects or the like, by performing a separate process to round the corners connecting the respective surfaces of the main body 110, the corner connecting the first surface to the third, fourth, fifth, and sixth surfaces and / or the corner connecting the second surface to the third, fourth, fifth, and sixth surfaces can have a rounded form.

[0027] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so as to be difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers does not particularly need to be limited and can be determined in consideration of the size of the multilayer electronic component. For example, 400 or more dielectric layers can be stacked to form the body.

[0028] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate-based (BaTiO3) powder can be used as the ceramic powder. More specifically, as the ceramic powder, barium titanate-based (BaTiO3) powder, CaZrO3-based constant dielectric powder, etc. can be used. More specifically, as the barium titanate-based (BaTiO3) powder, BaTiO3, (Ba 1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3(0 < y < 1) may be one or more of them, and the CaZrO3-based constant dielectric powder may be (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x < 1, 0 < y < 1).

[0029] Therefore, the dielectric layer 111 is BaTiO3, (Ba 1-x Ca x)TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3(0 < y < 1) and (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x < 1, 0 < y < 1) can include one or more of them.

[0030] The average thickness td of the dielectric layer 111 is not particularly limited.

[0031] When aiming for miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness td of the dielectric layer 111 may be 3 μm or more.

[0032] The average thickness td of the dielectric layer 111 can be measured by scanning an image of the cross-section (L-T cross-section) of the main body 110 in the third direction and the first direction with a scanning electron microscope (SEM).

[0033] For example, the average thickness td of the dielectric layer 111 is extracted from the dielectric layer scanned with a scanning electron microscope (SEM) of the length and the cross-section in the thickness direction (L-T) cut at the central part in the width direction of the main body 110. Among the five dielectric layers including two upper layers and two lower layers based on one dielectric layer at the point where the central line in the length direction of the main body and the central line in the thickness direction meet, with the point where the central line in the length direction of the main body and the central line in the thickness direction meet as the reference, after determining five points including two points on the left side and two points on the right side at equal intervals around one reference point, the thickness of each point is measured and the average value can be measured.

[0034] The main body 110 can include a capacitance forming portion Ac which is a region including a first internal electrode 121 and a second internal electrode 122 arranged to face each other with a dielectric layer 111 interposed therebetween. Specifically, the capacitance forming portion Ac can mean a region between an internal electrode arranged at one end in the first direction among the internal electrodes 121 and 122 and an internal electrode arranged at the other end in the first direction among the internal electrodes 121 and 122.

[0035] Since the capacitance forming portion Ac is a region where the first internal electrode 121 and the second internal electrode 122 are alternately arranged with the dielectric layer 111 interposed therebetween, it can play a role in forming capacitance.

[0036] On the other hand, the capacitance forming portion Ac can include a region where the first internal electrode 121 and the second internal electrode 122, which are directly involved in capacitance formation, overlap in the first direction, and length - margin portions can be formed on one side and the other side in the second direction of the region where the first internal electrode 121 and the second internal electrode 122 overlap in the first direction. The length - margin portions can play a role in imparting different polarities to the first internal electrode 121 and the second internal electrode 122, and can play a role in increasing the path of moisture penetration.

[0037] The main body 110 is arranged inside the main body 110, and can include a capacitance forming portion Ac in which a capacitance is formed including a first internal electrode 121 and a second internal electrode 122 arranged to face each other with a dielectric layer 111 interposed therebetween, and cover portions C1 and C2 formed on the upper and lower portions in the first direction of the capacitance forming portion Ac.

[0038] On the other hand, as shown in FIG. 5, the main body 110 can be formed by further arranging cover portions C1 and C2 on a laminate in which the first internal electrode 121 and the second internal electrode 122 are alternately arranged in the first direction with the dielectric layer 111 interposed therebetween.

[0039] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be exposed to the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0040] The first internal electrode 121 can be exposed through the third surface 3 at a distance from the fourth surface 4, and the second internal electrode 122 can be exposed through the fourth surface 4 at a distance from the third surface 3. A first external electrode 131 can be disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 can be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0041] That is, the first internal electrode 121 is connected to the first external electrode 131 without being connected to the second external electrode 132, and the second internal electrode 122 is connected to the second external electrode 132 without being connected to the first external electrode 131. Therefore, the first internal electrode 121 can be formed at a certain distance apart on the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance apart on the third surface 3. Also, the first internal electrode 121 and the second internal electrode 122 may be disposed at a distance from the fifth surface and the sixth surface of the main body 110.

[0042] The conductive metal included in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and their alloys, and the present invention is not limited thereto.

[0043] The average thickness te of the internal electrodes 121 and 122 is not particularly limited and may vary according to the purpose. In order to miniaturize the multilayer electronic component 100, the average thickness te of the internal electrodes 121 and 122 may be 0.35 μm or less, and in order to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness te of the internal electrodes 121 and 122 may be 3 μm or more.

[0044] The average thickness te of the internal electrodes 121 and 122 is extracted from an image obtained by scanning, with a scanning electron microscope (SEM), a cross-section in the length and thickness directions (L-T) of the body 110 cut at the central portion in the width direction of the body. Among the internal electrode layers, for a total of five internal electrode layers, namely two upper layers and two lower layers, with reference to the internal electrode layer at the point where the central line in the length direction of the body and the central line in the thickness direction of the body meet, after determining five points, i.e., two points on the left side and two points on the right side, at equal intervals around one reference point with the reference point as the center, the thickness at each point is measured and the average value can be measured.

[0045] Cover portions C1 and C2 can be arranged on the upper and lower surfaces of the capacitance forming portion Ac in the first direction.

[0046] The cover portions C1 and C2 can basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0047] The cover portions C1 and C2 can contain the same material as the dielectric layer 111. That is, the cover portions C1 and C2 can contain a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0048] On the other hand, the thickness of the cover portions C1 and C2 does not need to be particularly limited. For example, the thickness tc1 of the cover portions C1 and C2 can each be 20 μm or less.

[0049] The average thickness tc1 of the cover portions C1 and C2 can represent the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover portions C1 and C2 measured at five equally spaced points in the upper or lower part of the capacitance forming portion Ac.

[0050] Moreover, margin portions M1 and M2 can be arranged on the side surfaces of the capacitance forming portion Ac.

[0051] The margin portions M1 and M2 can include a first margin portion M1 disposed on the fifth surface 5 of the main body 110 and a second margin portion M2 disposed on the sixth surface 6. That is, the margin portions M1 and M2 may be disposed on both end surfaces in the width direction of the ceramic main body 110.

[0052] As shown in FIG. 3, the margin portions M1 and M2 can mean the regions between the interfaces of both ends of the first internal electrode 121 and the second internal electrode 122 and the main body 110 in the cross-section obtained by cutting the main body 110 in the width-thickness (W-T) direction.

[0053] The margin portions M1 and M2 can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0054] The margin portions M1 and M2 may be formed by applying a conductive paste to form internal electrodes except for the locations where the margin portions are formed on the ceramic green sheet.

[0055] On the other hand, the widths of the margin portions M1 and M2 do not need to be particularly limited. For example, the average widths of the margin portions M1 and M2 may each be 20 μm or less.

[0056] The average widths of the margin portions M1 and M2 can mean the average sizes in the third direction of the regions where the internal electrodes are separated from the fifth surface and the average sizes in the third direction of the regions where the internal electrodes are separated from the sixth surface, and can be the values obtained by averaging the sizes in the third direction of the margin portions M1 and M2 measured at five equally spaced points on the side surfaces of the capacitance forming portion Ac.

[0057] The external electrodes 130 and 140 can be respectively disposed on the third surface and the fourth surface 3 and 4 which are the surfaces facing each other in the second direction of the main body 110.

[0058] The external electrodes 130 and 140 are disposed on the surfaces 3 and 4 facing each other in the second direction of the main body 110 and can be connected to the internal electrodes 121 and 122.

[0059] More specifically, the first external electrode 130 can be disposed on the third surface 3 and connected to the first internal electrode 121, and the second external electrode 140 can be disposed on the fourth surface 4 and connected to the second internal electrode 122.

[0060] In this embodiment, the structure of the multilayer electronic component 100 having two external electrodes 130 and 140 is described. However, the number, shape, etc. of the external electrodes 130 and 140 can be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0061] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0062] For example, the multilayer electronic component 100 can have a size of 0201 (length × width, 0.2 mm × 0.1 mm) or less in order to simultaneously achieve miniaturization and high capacitance. In the case of a product where reliability in a high-temperature and high-pressure environment is important, it can have a size of 3216 (length × width, 3.2 mm × 1.6 mm) or more, but it is not limited thereto.

[0063] Here, the length of the multilayer electronic component 100 means the maximum size in the second direction of the multilayer electronic component 100, the thickness of the multilayer electronic component 100 means the maximum size in the first direction of the multilayer electronic component 100, and the width of the multilayer electronic component 100 can mean the maximum size in the third direction of the multilayer electronic component 100.

[0064] Hereinafter, the structures of the external electrodes 130 and 140 according to an embodiment of the present invention will be described in more detail.

[0065] The external electrodes 130 and 140 are connected to the internal electrodes 121 and 122 and can include electrode layers 131 and 141 containing Cu and oxides containing Cu.

[0066] Referring to FIGS. 1, 2, and 3, the electrode layers 131 and 141 may have a center portion located on the central portion of the main body 110 in the first direction, and side portions disposed on both sides of the center portion in the first direction and having a convex shape in the second direction. At this time, according to an embodiment of the present invention, the content of the oxide containing Cu in the side portion may be greater than the content of the oxide containing Cu in the center portion.

[0067] In the case of an electrode layer formed by applying a conventional Cu paste onto a main body and sintering it, due to surface tension, the center portion of the electrode layer located at the center of the main body may be formed thicker than other regions. Therefore, as a result of the increasing proportion of the external electrodes in the entire multilayer electronic component, it may become difficult to ensure a sufficient capacitance per unit volume of the multilayer electronic component.

[0068] Therefore, in an embodiment of the present invention, in the electrode layers 131 and 141, by forming side portions, which are regions having a convex shape in two directions, on both sides of the center portion in the first direction of the main body 110 in the first direction, the proportion of the external electrodes 130 and 140 in the entire multilayer electronic component 100 can be effectively reduced, and the capacitance per unit volume of the multilayer electronic component 100 can be improved. In particular, the side portions of the electrode layers 131 and 141 are regions adjacent to the cover portions C1 and C2 and the corners of the main body 110, and may be vulnerable to moisture penetration from the outside. However, according to an embodiment of the present invention, since the side portions, which are regions vulnerable to moisture penetration from the outside, are formed in a convex shape, the thickness of the side portions can be increased, and the thickness of the center portion, which is relatively less vulnerable to moisture penetration from the outside, can be reduced. Therefore, while effectively reducing the proportion of the external electrodes 130 and 140 in the entire multilayer electronic component 100, a decrease in moisture resistance reliability can be prevented.

[0069] On the other hand, the electrode layers 131 and 141 according to an embodiment of the present invention may include Cu and an oxide containing Cu. Cu can play a role in ensuring electrical connectivity with the conductive metal contained in the internal electrode layers 121 and 122.

[0070] The electrode layer formed by applying and sintering a Cu paste on the main body can contain the glass component contained in the Cu paste, and thus can be easily dissolved by an external plating solution. As a result, the plating solution easily penetrates into the electrode layer, which may cause deterioration of the characteristics of the multilayer electronic component.

[0071] On the other hand, according to an embodiment of the present invention, since the electrode layers 131 and 141 contain Cu and an oxide containing Cu, penetration of the plating solution into the electrode layers 131 and 141 or the inside of the main body 110 can be effectively suppressed. That is, the sealing performance of the multilayer electronic component 100 can be improved.

[0072] On the other hand, since the side portions of the electrode layers 131 and 141 are regions adjacent to the cover portions C1 and C2 and the corners of the main body 110 as compared with the center portion, there is a high possibility that defects exist in the fine structure due to sintering shrinkage. That is, the side portions of the electrode layers 131 and 141 may be more vulnerable to penetration of the external plating solution than the center portion. Therefore, in one embodiment of the present invention, in order to adjust the content of the oxide containing Cu in the side portion to be larger than the content of the oxide containing Cu in the center portion, while improving the sealing performance of the side portions of the electrode layers 131 and 141 that are relatively vulnerable to the plating solution, it is possible to suppress the excessive formation of the oxide containing Cu inside the electrode layers 131 and 141.

[0073] That is, in the multilayer electronic component 100 according to an embodiment of the present invention, in the electrode layers 131 and 141, when the region located on the central portion in the first direction of the main body 110 is defined as the center portion, and the regions arranged on both sides in the first direction of the center portion and having a convex shape in the second direction are defined as the side portions, by adjusting the content of the oxide containing Cu in the side portion to be larger than the content of the oxide containing Cu in the center portion, it is possible to improve the capacitance per unit volume and the sealing performance of the multilayer electronic component 100, and suppress a decrease in the electrical connectivity of the external electrodes 130 and 140.

[0074] On one hand, the method for forming the side portions, which are regions disposed on both sides of the center portions of the electrode layers 131 and 141 in the first direction and having a convex shape in the second direction, is not particularly limited. For example, the side portions and the center portions of the electrode layers 131 and 141 according to an embodiment can be formed by using a conductive paste obtained by mixing copper powder with a particle size of 500 nm or less, glass powder, and other organic substances including a dispersant. When using fine copper powder with a particle size of 500 nm or less, due to the low surface tension of the fine copper powder, the side portions of the electrode layer that are vulnerable to the penetration of the plating solution may be formed thick, and the center portions can be formed relatively thinner than the side portions. Thereby, the hermeticity of the multilayer electronic component 100 and the capacitance per unit volume can be improved simultaneously.

[0075] The method for measuring the content of the oxide containing Cu in the center portion and the content of the oxide containing Cu in the side portion is not particularly limited.

[0076] First, the content of the oxide containing Cu in the side portion can be measured by calculating the ratio of the at% of O to the at% of Cu in a region of 15 μm × 15 μm (horizontal × vertical) at the center of the portion where the maximum thickness of the electrode layers 131 and 141 is formed in the cross-section in the first and second directions polished to the center portion in the third direction of the multilayer electronic component 100 by SEM-EDS analysis (Scanning Electron Microscope-Energy Dispersive X-Ray Spectroscopy).

[0077] Also, the content of the oxide containing Cu in the center portion can be measured by calculating the ratio of the at% of O to the at% of Cu in a region of 15 μm × 15 μm (horizontal × vertical) at the center of the portion where the minimum thickness of the electrode layers 131 and 141 is formed in the cross-section in the first and second directions polished to the center portion in the third direction of the multilayer electronic component 100 by SEM-EDS analysis (Scanning Electron Microscope-Energy Dispersive X-Ray Spectroscopy).

[0078] In the electrode layers 131 and 141, when the electrode layers 131 and 141 disposed on the third surface 3 or the fourth surface 4 are divided into 16 equal parts in the first direction in the cross-sections in the first and second directions polished to the central portion of the multilayer electronic component 100 in the third direction, the region from approximately the 6 / 16 point to the 10 / 16 point can be defined as the center portion, and the region excluding the center portion can be defined as the side portion. However, the present invention is not limited thereto, and the formation regions of the center portion and the side portion may differ depending on the convex shape positions of the electrode layers 131 and 141.

[0079] In one embodiment, the electrode layers 131 and 141 can include a glass containing one or more of B, Ba, and Si. The glass can be included in the electrode layers 131 and 141 and play a role in improving the sintering characteristics. When the electrode layers 131 and 141 are sintered electrodes containing glass, the glass may be eroded by the plating layer formed on the electrode layers 131 and 141, and the electrode layers 131 and 141 may be damaged, which may cause deterioration of the characteristics of the multilayer electronic component 100. However, according to one embodiment of the present invention, since the electrode layers 131 and 141 contain Cu and an oxide containing Cu having acid resistance, the hermeticity of the multilayer electronic component 100 can be ensured.

[0080] In one embodiment, the electrode layers 131 and 141 mainly contain Cu and can contain an oxide containing Cu. Specifically, the total at% of Cu and O contained in the electrode layers 131 and 141 can exceed 80 at% with respect to all components. Here, all components contained in the electrode layers 131 and 141 can mean all of other components excluding Cu, O, Cu, and O.

[0081] In one embodiment, the electrode layers 131 and 141 can include a region where the at% ratio of Cu to O is 1.9 or more. When the electrode layers 131 and 141 include an oxide containing Cu, the at% of Cu with respect to O in the electrode layers 131 and 141 can have a value equal to or greater than a specific ratio. For example, when the electrode layers 131 and 141 include Cu2O as an oxide containing Cu, the electrode layers 131 and 141 can include a region where the at% ratio of Cu to O is 1.9 or more.

[0082] On the other hand, in the electrode layers 131 and 141, the area of the region where the at% ratio of Cu to O is 1.9 or more can be 1 / 2 or more with respect to the total area of the electrode layer. Thereby, the proportion of the oxide containing Cu in the entire electrode layers 131 and 141 can be improved, and the hermeticity of the multilayer electronic component 100 can be further improved.

[0083] Referring to FIGS. 2 and 3, the electrode layers 121 and 122 can include first electrode layers 131a and 141a and second electrode layers 131b and 141b.

[0084] Specifically, in one embodiment, the electrode layers 131 and 141 include first electrode layers 131a and 141a in contact with the internal electrodes 121 and 122, and second electrode layers 131b and 141b disposed on the first electrode layers 131a and 141a. The first electrode layers 131a and 141a contain Cu, and the second electrode layers 131b and 141b can contain an oxide containing Cu. In this case, since the first electrode layers 131a and 141a directly in contact with the internal electrodes 121 and 122 contain Cu, the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 130 and 140 can be improved. Since the second electrode layers 131b and 141b directly in contact with the plating layers 132 and 142 to be described later contain an oxide containing Cu, the hermeticity of the multilayer electronic component 100 can be improved.

[0085] In one embodiment, the first electrode layers 131a and 141a can be arranged to extend from the surfaces 3 and 4 facing the second direction of the main body 110 to the surfaces 1 and 2 facing the first direction of the main body 110. However, the present invention is not limited to the first electrode layers 131a and 141a extending only on the surfaces 1 and 2 facing the first direction of the main body 110, and the first electrode layers 131a and 141a can also extend and be arranged on the surfaces 5 and 6 facing the third direction of the main body 110. By extending and arranging on the surfaces 1 and 2 facing the first direction of the first electrode layers 131a and 141a or on the surfaces 5 and 6 facing the third direction of the main body 110, the mechanical strength of the multilayer electronic component 100 can be improved.

[0086] In one embodiment, the average thickness of the first electrode layers 131a and 141a may be 4 μm or more and 6 μm or less. As described above, since the first electrode layers 131a and 141a are in direct contact with the internal electrodes 121 and 122 and play a role in improving the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 130 and 140, it is preferably formed with a sufficient thickness. However, when the first electrode layers 131a and 141a are formed with an excessive thickness, the thickness of the entire electrode layers 131 and 141 increases excessively, so it may be difficult to improve the capacitance per unit volume of the multilayer electronic component 100. Therefore, the average thickness of the first electrode layers 131a and 141a can be adjusted to 4 μm or more and 6 μm or less, thereby ensuring the capacitance per unit volume of the multilayer electronic component 100 and ensuring the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 130 and 140.

[0087] As described above, since the first electrode layers 131a and 141a are in direct contact with the internal electrodes 121 and 122 and play a role in improving the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 130 and 140, it is preferable that the copper contained in the first electrode layers 131a and 141a is not substantially oxidized. That is, in one embodiment, the O content of the first electrode layers 131a and 141a may be 10 at% or less based on all the elements contained in the first electrode layers 131a and 141a.

[0088] As described above, since the first electrode layers 131a and 141a are in direct contact with the internal electrodes 121 and 122 and play a role in improving the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 130 and 140, it is preferable to densely form the Cu contained in the first electrode layers 131a and 141a. That is, in one embodiment, the area of Cu per unit area of the first electrode layers 131a and 141a may be larger than the area of Cu per unit area of the second electrode layers 131b and 141b. Thereby, by improving the density of Cu contained in the first electrode layers 131a and 141a, the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 130 and 140 can be improved.

[0089] In one embodiment, the ratio of the maximum thickness of the second electrode layers 131b and 141b to the maximum thickness of the electrode layers 131 and 141 may be 1 / 2 or more. That is, the second electrode layers 131b and 141b can be formed with a thickness of 1 / 2 or more with respect to the maximum thickness of the electrode layers 131 and 141 in the region where the maximum thickness of the electrode layers 131 and 141 is formed.

[0090] On the other hand, the electrode layers 131 and 141 can have the maximum thickness at the side portions of the electrode layers 131 and 141 described above. That is, the side portions of the electrode layers 131 and 141 having a convex shape in the second direction can be formed by the second electrode layers 131b and 141b.

[0091] Referring to FIG. 3, the maximum thickness of the second electrode layers 131b and 141b is represented by T2max, and the minimum thickness of the second electrode layers 131b and 141b is represented by T2min.

[0092] At this time, when T2max / T2min is less than 1.1, it becomes impossible to sufficiently thicken the side portion or sufficiently thin the center portion, and as a result, the effect of improving the capacitance per unit volume may be insufficient.

[0093] Also, when T2max / T2min exceeds 2.0, the bending of the second electrode layers 131b and 141b becomes excessive, and the plating property may deteriorate.

[0094] Therefore, in one embodiment, by making T2max / T2min satisfy 1.0 or more and 2.0 or less, it is possible to ensure the effect of improving the capacitance per unit volume of the multilayer electronic component 100 and suppress the problem of occurrence of a decrease in plating property.

[0095] The method for measuring the maximum thickness of the electrode layers 131 and 141, the average thickness of the first electrode layers 131a and 141a, the minimum thickness T2min and the maximum thickness T2max of the second electrode layers 131a and 131b is not particularly limited. For example, in the cross-sections in the first direction and the second direction polished to the central portion in the third direction of the multilayer electronic component 100, the regions where the electrode layers 131 and 141 are formed can be measured from an image observed through an optical microscope (OM, Optical Microscope), a scanning electron microscope (SEM, Scanning Electron Microscope), a transmission electron microscope (TEM, Transmission Electron Microscope), or the like.

[0096] Specifically, the maximum thickness of the electrode layers 131 and 141, the maximum thickness T2max and the minimum thickness T2min of the second electrode layers 131a and 131b can mean the size in the second direction of the region where the maximum or minimum thickness is formed in the electrode layers 131 and 141 and the second electrode layers 131a and 131b.

[0097] On the other hand, the average thickness of the first electrode layers 131a and 141a can mean a value obtained by dividing the regions of the first electrode layers 131a and 141a disposed on the capacitance forming portion Ac into five equal parts in the first direction, measuring the size in the second direction in each region, and then taking the average.

[0098] In one embodiment, the external electrodes 130 and 140 can further include plating layers 132 and 142 disposed on the electrode layers 131 and 141.

[0099] The plating layers 132 and 142 serve to improve the mounting characteristics. The types of the plating layers 132 and 142 are not particularly limited, and the plating layers 132 and 142 may include one or more of Ni, Sn, Pd, and their alloys, or may be formed of a plurality of layers.

[0100] More specific examples of the plating layers 132 and 142 are as follows. The plating layers 132 and 142 may be Ni plating layers or Sn plating layers, or may be in a form in which a Ni plating layer and an Sn plating layer are sequentially formed on the electrode layers 131 and 141, or may be in a form in which an Sn plating layer, a Ni plating layer, and an Sn plating layer are sequentially formed. Further, the plating layers 132 and 142 may include a plurality of Ni plating layers and / or a plurality of Sn plating layers. Also, the plating layer may be in a form in which a Ni plating layer and a Pd plating layer are sequentially formed on the electrode layer.

[0101] In one embodiment, the second electrode layers 131b and 141b may not be disposed on the surfaces 1 and 2 facing the first direction of the main body 110. Also, the second electrode layers 131b and 141b may not be disposed on the surfaces 5 and 6 facing the third direction of the main body 110. Thereby, the capacitance per unit volume of the stacked electronic component 100 can be further improved.

[0102] On the other hand, referring to FIG. 8, it can be confirmed that in the first electrode layer 131a, there is substantially no region where an oxide containing Cu (gray, dark-colored portion) is formed as compared with the second electrode layer 131b, and it can be confirmed that a large number of oxides containing Cu are formed in the second electrode layer 131b. That is, the first electrode layer 131a is a thin layer with a high density of Cu, and the second electrode layer 131b contains an oxide containing Cu, and it can be confirmed that the convex side portions of the electrode layer are formed. However, it should be noted that the description of FIG. 8 is only an example for helping the understanding of the present invention, and the present invention is not limited to the first electrode layer 131a and the second electrode layer 131b shown in FIG. 8.

[0103] FIG. 6 schematically shows a perspective view of a stacked electronic component according to an embodiment, and FIG. 7 is a cross-sectional view taken along line III-III' of FIG. 6.

[0104] Referring to FIGS. 6 and 7, the external electrodes 130' and 140' of the stacked electronic component 100' according to an embodiment are connected to the internal electrodes 121 and 122, and include electrode layers 131 and 141 containing Cu and oxides containing Cu.

[0105] The external electrodes 130' and 140' of the stacked electronic component 100' according to an embodiment may further include conductive resin layers 133 and 143 disposed on the electrode layers 131 and 141 and plating layers 132 and 142 disposed on the conductive resin layers 133 and 143. Thereby, even when the conductive resin layers 133 and 143 are formed on the external electrodes 130' and 140', by reducing the proportion of the external electrodes 130' and 140' in the stacked electronic component 100', the capacitance per unit volume of the stacked electronic component 100' can be improved.

[0106] As described above, the embodiments of the present invention have been described in detail, but the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and it can be said that these also belong to the scope of the present invention.

[0107] In addition, the expression "an embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-described one embodiment does not exclude being implemented in combination with the features of other embodiments. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood in relation to the description of the other embodiment unless there is a description contrary to or conflicting with that matter in the other embodiment.

[0108] The terms used in this disclosure are merely used to describe an embodiment and are not intended to limit this disclosure. At this time, singular expressions include plural expressions unless the context clearly indicates a different meaning.

Description of Reference Numerals

[0109] 100, 100': Multilayer electronic component 110: Body 111: Dielectric layer 121, 122: Internal electrode 130, 140: External electrode 131, 141: Electrode layer 132, 142: Plating layer 133, 143: Conductive resin layer C1, C2: Cover part Ac: Capacitance forming part M1, M2: Margin part

Claims

1. A main body including a dielectric layer and internal electrodes alternately arranged in a first direction with the dielectric layer interposed therebetween, External electrodes respectively arranged on surfaces of the main body facing each other in a second direction perpendicular to the first direction, where the first direction and a third direction perpendicular to both the first direction and the second direction are defined, The external electrodes are connected to the internal electrodes and include an electrode layer containing Cu and an oxide containing Cu, In the electrode layer, when a region located on the central portion of the main body in the first direction is defined as the center portion, and regions arranged on both sides of the center portion of the main body in the first direction and having a convex shape in the second direction are defined as side portions, A multilayer electronic component in which the content of the oxide containing Cu in the side portion is greater than the content of the oxide containing Cu in the center portion.

2. The multilayer electronic component according to claim 1, wherein the electrode layer includes a region where the ratio of at% of Cu to at% of O is 1.9 or more.

3. The multilayer electronic component according to claim 2, wherein the area of the region where the ratio of at% of Cu to at% of O is 1.9 or more in the electrode layer is 1 / 2 or more with respect to the total area of the electrode layer.

4. The electrode layer includes a first electrode layer in contact with the internal electrode and a second electrode layer arranged on the first electrode layer, The multilayer electronic component according to claim 1, wherein the first electrode layer contains Cu and the second electrode layer contains an oxide containing Cu.

5. The multilayer electronic component according to claim 4, wherein the first electrode layer extends and is arranged from the surface of the main body facing each other in the second direction to the surface of the main body facing each other in the first direction.

6. The multilayer electronic component according to claim 4, wherein the second electrode layer is not arranged on the surface of the main body facing each other in the first direction.

7. The multilayer electronic component according to claim 4, wherein the average thickness of the first electrode layer is 4 μm or more and 6 μm or less.

8. The multilayer electronic component according to claim 4, when the maximum thickness of the second electrode layer is T2max and the minimum thickness of the second electrode layer is T2min, T2max / T2min satisfies 1.0 or more and 2.0 or less.

9. The multilayer electronic component according to claim 4, wherein the ratio of the maximum thickness of the second electrode layer to the maximum thickness of the electrode layer is 1 / 2 or more.

10. The multilayer electronic component according to claim 4, wherein the content of O in the first electrode layer is 10 at% or less with respect to all elements contained in the first electrode layer.

11. The laminated electronic component according to claim 4, wherein the area of Cu per unit area of the first electrode layer is larger than the area of Cu per unit area of the second electrode layer.

12. The laminated electronic component according to any one of claims 1 to 11, wherein the external electrode further includes a plating layer disposed on the electrode layer.

13. The laminated electronic component according to any one of claims 1 to 11, wherein the external electrode further includes a conductive resin layer disposed on the electrode layer and a plating layer disposed on the conductive resin layer.

14. The laminated electronic component according to any one of claims 1 to 11, wherein the electrode layer includes a glass containing one or more of B, Ba, and Si.

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