Laminated type electronic component

Abstract

To provide a laminated type electronic component.SOLUTION: A laminated type electronic component includes: a body which includes a capacity formation part that includes a dielectric layer, and first and second internal electrodes alternately arranged across the dielectric layer in a first direction, and cover parts arranged on the upper part and the lower part in the first direction of the capacity formation part; and an external electrode arranged on the body, wherein the capacity formation part includes an outside region adjacent to the cover part, and a central region excluding the outside region, the average thickness of the first internal electrode included in the outside region is made thicker than the average thickness of the first internal electrode included in the central region, and the average thickness of the second internal electrode included in the outside region is made thicker than the average thickness of the second internal electrode included in the central region.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is attached to a printed circuit board of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Since the multilayer ceramic capacitor has the advantages of being small in size while ensuring high capacitance and being easy to mount, it can be used as a component of various electronic devices. In recent years, with the miniaturization and high performance of electronic devices, multilayer ceramic capacitors also tend to be miniaturized and have higher capacitance. Due to such a trend, the importance of ensuring the high reliability of multilayer ceramic capacitors has increased. In addition, for use in automotive electronic components, high reliability and high strength characteristics are required.

[0004] Generally, a multilayer ceramic capacitor is formed by laminating and pressing ceramic green sheets printed with internal electrode patterns and then sintering them to form a body. During the pressing process, the deformation stress on the internal electrode arranged on the outermost side in the lamination direction increases, and the internal electrode arranged on the outermost side in the lamination direction may have a reduced internal electrode connectivity or a reduced thickness. As a result, the connectivity between the internal electrode and the external electrode may decrease, and the flexural strength characteristics may deteriorate.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] One of the various objects of the present invention is to provide a laminated electronic component with excellent reliability.

[0007] One of the various objects of the present invention is to provide a laminated electronic component with excellent connectivity between internal electrodes and external electrodes.

[0008] One of the various objects of the present invention is to provide a laminated electronic component with improved capacitance.

[0009] However, the object of the present invention is not limited to the above content and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problems

[0010] A laminated electronic component according to an embodiment of the present invention includes a dielectric layer, a capacitance forming portion including first and second internal electrodes alternately arranged in a first direction with the dielectric layer interposed therebetween, a main body including cover portions arranged above and below the capacitance forming portion in the first direction, and an external electrode arranged on the main body. The capacitance forming portion includes an outer region adjacent to the cover portion and a central region excluding the outer region. The average thickness of the first internal electrode included in the outer region is thicker than the average thickness of the first internal electrode included in the central region, and the average thickness of the second internal electrode included in the outer region can be thicker than the average thickness of the second internal electrode included in the central region.

Effects of the Invention

[0011] One of the various effects of the present invention is to improve the reliability of the laminated electronic component by increasing the thickness of the internal electrode adjacent to the cover portion.

[0012] One of the various effects of the present invention is to improve the connectivity between the internal electrodes and the external electrodes.

[0013] One of the various effects of the present invention is to improve the capacitance of the multilayer electronic component.

[0014] One of the various effects of the present invention is to improve the flexural strength of the multilayer electronic component.

[0015] However, the diverse and beneficial advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Modes for Carrying Out the Invention

[0017] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to those having average knowledge in the relevant technical field. Therefore, the shapes and sizes of the elements in the drawings may be enlarged, reduced (or emphasized or simplified) for clearer explanation.

[0018] In order to clearly explain the present invention, parts not related to the description are omitted in the drawings, the thickness is enlarged to clearly show various layers and regions, and components having the same function within the scope of the same concept are described using the same reference numerals. Further, throughout the specification, the statement that a certain component "includes" means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0019] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction can be defined as the length (L) direction, and the third direction can be defined as the width (W) direction.

[0020] Multilayer electronic component FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention, FIG. 2 schematically shows a cross-sectional view taken along line I-I' of FIG. 1, FIG. 3 schematically shows a cross-sectional view taken along line II-II' of FIG. 1, FIG. 4 schematically shows the main body disassembled, and FIG. 5 is a view corresponding to FIG. 3 for explaining the thickness of the outer region and the central region.

[0021] Hereinafter, with reference to FIGS. 1 to 5, a stacked electronic component 100 according to an embodiment of the present invention will be described in detail. Further, as an example of the stacked electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described, but the present invention is not limited thereto, and it is also applicable to various stacked electronic components using a ceramic material, such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0022] According to an embodiment of the present invention, the multilayer electronic component 100 includes a capacitance forming portion Ac including a dielectric layer 111 and first and second internal electrodes 121 and 122 alternately arranged in a first direction with the dielectric layer interposed therebetween, a main body including cover portions 112 and 113 arranged above and below the capacitance forming portion in the first direction, and external electrodes 131 and 132 arranged on the main body. The capacitance forming portion includes outer regions Ac1 and Ac2 adjacent to the cover portions and a central region Ac0 excluding the outer regions. The average thickness teb of the first internal electrode 121b included in the outer region can be greater than the average thickness tea of the first internal electrode 121a included in the central region, and the average thickness teb' of the second internal electrode 122b included in the outer region can be greater than the average thickness tea' of the second internal electrode 122a included in the central region.

[0023] Generally, a multilayer ceramic capacitor is formed by laminating and pressing ceramic green sheets printed with internal electrode patterns and then sintering to form a main body. During the pressing process, the deformation stress on the internal electrode arranged on the outermost side in the lamination direction increases, and the internal electrode arranged on the outermost side in the lamination direction may have a reduced internal electrode connectivity or a reduced thickness, resulting in a possible reduction in the connectivity between the internal electrode and the external electrode.

[0024] According to an embodiment of the present invention, by increasing the thickness of the internal electrode adjacent to the cover portion, it is possible to prevent the internal electrode connectivity of the outermost internal electrode from decreasing or the thickness from becoming thin, and to improve the connectivity and flexural strength characteristics between the internal electrode and the external electrode.

[0025] Hereinafter, each configuration included in the multilayer electronic component 100 according to an embodiment of the present invention will be described.

[0026] The main body 110 can have the dielectric layer 111 and the internal electrodes 121 and 122 alternately laminated.

[0027] The specific shape of the main body 110 is not particularly limited. As shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 can have a substantially hexahedron shape, although it does not have a hexahedron shape with perfect straight lines.

[0028] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first and second surfaces 1 and 2 and also connected to the third and fourth surfaces 3 and 4 and facing each other in a third direction.

[0029] A margin region where the internal electrodes 121 and 122 are not disposed overlaps on the dielectric layer 111, resulting in a step due to the thickness of the internal electrodes 121 and 122. The corner connecting the first surface and the third to fifth surfaces and / or the corner connecting the second surface and the third to fifth surfaces can have a form shrunk toward the center of the main body 110 in the first direction when based on the first surface or the second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corner connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corner connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 can have a form shrunk toward the center of the main body 110 in the first direction when based on the first surface or the second surface. Alternatively, in order to prevent chipping defects or the like, the corners connecting the respective surfaces of the main body 110 are rounded by performing a separate process, so that the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces can have a rounded shape.

[0030] On the one hand, in order to suppress the step due to the internal electrodes 121 and 122, after cutting so that the internal electrodes are exposed on the fifth and sixth surfaces 5 and 6 of the main body after lamination, when forming the margin portions 114 and 115 by laminating a single dielectric layer or two or more dielectric layers in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac, the portions connecting the first surface to the fifth and sixth surfaces and the portions connecting the second surface to the fifth and sixth surfaces may not have a shrunk form.

[0031] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM). The number of laminated dielectric layers does not particularly need to be limited and can be determined in consideration of the size of the multilayer electronic component. For example, the main body can be formed by laminating 400 or more dielectric layers.

[0032] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to prepare a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, as the ceramic powder, barium titanate (BaTiO3)-based powder can be used. As a more specific example, the ceramic powder is one or more of BaTiO3, (Ba 1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3(0 < y < 1).

[0033] The average thickness td of the dielectric layer 111 does not particularly need to be limited, but for example, it can be 0.1 μm to 10 μm. Also, the average thickness td of the dielectric layer 111 can be arbitrarily set according to desired characteristics and applications.

[0034] Here, the average thickness td of the dielectric layer 111 means the size of the dielectric layer 111 in the first direction disposed between the internal electrodes 121 and 122. The average thickness of the dielectric layer 111 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the thickness can be measured at a number of points of one dielectric layer 111, for example, 30 points at equal intervals in the second direction, and the average value can be measured. The 30 points at the above equal intervals can be specified by the capacitance forming portion Ac described later. Also, when such measurement of the average value is extended to 10 dielectric layers 111, the average thickness of the dielectric layer 111 can be more generalized.

[0035] In one embodiment, when the average thickness of the dielectric layer included in the central region Ac0 is tda and the average thickness of the dielectric layers included in the outer regions Ac1 and Ac2 is tdb, 0.9 ≦ tdb / tda ≦ 1.1 can be satisfied. That is, unlike the internal electrodes, the average thickness td of the dielectric layer 111 can be substantially the same as the average thickness of the dielectric layer included in the central region Ac0 and the average thickness of the dielectric layers included in the outer regions Ac1 and Ac2.

[0036] The main body 110 can include a capacitance forming portion Ac in which a capacitance is formed, including the dielectric layer 111 and first internal electrodes 121 and second internal electrodes 122 alternately arranged in the first direction with the dielectric layer 111 interposed therebetween, and cover portions 112 and 113 formed on the upper and lower portions of the capacitance forming portion Ac in the first direction.

[0037] Also, the capacitance forming portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0038] The cover parts 112 and 113 can include an upper cover part 112 disposed at the upper part of the capacitance forming part Ac in the first direction and a lower cover part 113 disposed at the lower part of the capacitance forming part Ac in the first direction.

[0039] The upper cover part 112 and the lower cover part 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming part Ac, and basically can play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0040] The upper cover part 112 and the lower cover part 113 do not include internal electrodes and can include the same material as the dielectric layer 111. That is, the cover parts 112 and 113 can include the dielectric layer 111 and do not include the first and second internal electrodes 121 and 122. Also, the cover parts 112 and 113 can be composed of the dielectric layer 111 and do not include dummy electrodes. That is, according to an embodiment of the present invention, the flexural strength can be improved not by using dummy electrodes but by adjusting the thickness at each position of the internal electrodes, and a higher capacitance can be ensured compared to the case where dummy electrodes are arranged.

[0041] That is, the upper cover part 112 and the lower cover part 113 can include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0042] On the other hand, the thickness of the cover parts 112 and 113 does not need to be particularly limited. For example, the average thickness tc of the cover parts 112 and 113 can be 5 to 500 μm.

[0043] The average thickness tc of the cover parts 112 and 113 means the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover parts 112 and 113 measured at five equally spaced points at the upper or lower part of the capacitance forming part Ac.

[0044] In addition, margin portions 114 and 115 can be disposed on the side surfaces of the capacitance forming portion Ac.

[0045] The margin portions 114 and 115 can include a first margin portion 114 disposed on the fifth surface 5 of the main body 110 and a second margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114 and 115 can be disposed on both end surfaces in the width direction of the ceramic main body 110.

[0046] As shown in FIG. 3, the margin portions 114 and 115 can mean regions between both ends of the first and second internal electrodes 121 and 122 and the boundary surface of the main body 110 in a cross-section obtained by cutting the main body 110 in the width-thickness (W-T) direction.

[0047] Basically, the margin portions 114 and 115 can serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0048] The margin portions 114 and 115 can be formed by applying a conductive paste on a ceramic green sheet except for portions where the margin portions are to be formed to form internal electrodes.

[0049] In addition, in order to suppress steps due to the internal electrodes 121 and 122, after cutting so that the internal electrodes are exposed on the fifth and sixth surfaces 5 and 6 of the main body after lamination, a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac, and the margin portions 114 and 115 may be formed.

[0050] On the other hand, the width of the margin portions 114 and 115 does not particularly need to be limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 can be 5 to 300 μm.

[0051] The average widths of the margin portions 114 and 115 mean the average size wm in the third direction of the region where the internal electrodes are separated from the fifth surface and the average size in the third direction of the region where the internal electrodes are separated from the sixth surface, and can be the value obtained by averaging the sizes in the third direction of the margin portions 114 and 115 measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0052] Therefore, in one embodiment, the average sizes in the third direction of the regions where the internal electrodes 121 and 122 are separated from the fifth and sixth surfaces can be 5 to 300 μm respectively.

[0053] The internal electrodes 121 and 122 can include the first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be respectively exposed on the third and fourth surfaces 3 and 4 of the main body 110.

[0054] The first internal electrode 121 can be separated from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 can be arranged on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 can be arranged on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0055] That is, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. Also, the first and second internal electrodes 121 and 122 can be arranged separated from the fifth and sixth surfaces of the main body 110.

[0056] The conductive metal contained in the internal electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0057] The method for forming the internal electrodes 121 and 122 is not particularly limited. For example, the internal electrodes 121 and 122 can be formed by applying a conductive paste for internal electrodes containing a conductive metal on a ceramic green sheet and firing it. As a method for applying the conductive paste for internal electrodes, a screen printing method or a gravure printing method can be used, but the present invention is not limited thereto.

[0058] As another example, the internal electrodes 121 and 122 may be formed using a sputtering method, a vacuum evaporation method, and / or a chemical vapor deposition method.

[0059] According to an embodiment of the present invention, the capacitance forming portion Ac includes outer regions Ac1 and Ac2 adjacent to the cover portions 112 and 113, and a central region Ac0 excluding the outer regions. The average thickness teb of the first internal electrode 121b included in the outer regions Ac1 and Ac2 is thicker than the average thickness tea of the first internal electrode 121a included in the central region Ac0, and the average thickness teb' of the second internal electrode included in the outer regions Ac1 and Ac2 can be thicker than the average thickness tea' of the second internal electrode included in the central region.

[0060] During the crimping process, a large amount of deformation stress is applied to the internal electrodes disposed in the outer regions Ac1 and Ac2. Therefore, by increasing the thickness of the internal electrodes disposed in the outer regions Ac1 and Ac2, the resistance to deformation of the internal electrodes disposed in the outer regions Ac1 and Ac2 during the crimping process can be increased, and the thermal stability during the sintering process can be improved. Thereby, it is possible to prevent the internal electrode connectivity from decreasing or the thickness from becoming thin, and to improve the connectivity between the internal electrode and the external electrode. Also, the flexural strength characteristics can be improved without separately disposing a dummy electrode in the cover portion.

[0061] Also, the average thickness teb of the first internal electrode 121b included in the outer regions Ac1 and Ac2 can be greater than the average thickness tea of the second internal electrode 122a included in the central region Ac0, and the average thickness teb' of the second internal electrode 122b included in the outer regions Ac1 and Ac2 can be greater than the average thickness tea of the first internal electrode 121a included in the central region.

[0062] In one embodiment, when the average thickness of the first internal electrode included in the central region Ac0 is tea and the average thickness of the first internal electrode included in the outer regions Ac1 and Ac2 is teb, 1.6 ≦ teb / tea ≦ 2.0 can be satisfied. Thereby, the effect of improving the connectivity and the flexural strength characteristics between the internal electrode and the external electrode of the present invention can be made remarkable.

[0063] When teb / tea is less than 1.6, the effect of improving the connectivity and the flexural strength characteristics between the internal electrode and the external electrode may not be sufficient. When teb / tea exceeds 2, the thickness of the main body may become excessively thick, and the design stability may decrease.

[0064] The numerical values for each of tea and teb are not particularly limited. For example, tea can be 300 nm or more and 937.5 nm or less, and teb can be 480 nm or more and 1500 nm or less.

[0065] In one embodiment, when the average thickness of the second internal electrode included in the central region Ac0 is tea' and the average thickness of the second internal electrode included in the outer regions Ac1 and Ac2 is teb', 1.6 ≦ teb' / tea' ≦ 2.0 can be satisfied.

[0066] When teb' / tea' is less than 1.6, the effect of improving the connectivity and the flexural strength characteristics between the internal electrode and the external electrode may not be sufficient. When teb' / tea' exceeds 2, the thickness of the main body may become excessively thick, and the design stability may decrease.

[0067] On the one hand, the above tea and tea' can satisfy 0.9 ≤ tea / tea' ≤ 1.1. Also, teb and teb' can satisfy 0.9 ≤ teb / teb' ≤ 1.1.

[0068] That is, the first internal electrode 121a and the second internal electrode 122a included in the central region Ac0 can have substantially the same thickness excluding manufacturing errors and the like, and the first internal electrode 121b and the second internal electrode 122b included in the outer regions Ac1 and Ac2 can have substantially the same thickness excluding manufacturing errors and the like.

[0069] Here, the average thicknesses tea, teb, tea', and teb' of the internal electrodes can be measured by scanning the cross-sections of the main body 110 in the first direction and the second direction with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the thickness can be measured at a number of points of one internal electrode 121, 122, for example, 30 points at equal intervals in the second direction, and the average value can be measured. That is, the above tea can be a value measured by selecting one of the one or more first internal electrodes 121a arranged in the central region Ac0, and the above tea' can be a value measured by selecting one of the one or more second internal electrodes 122a arranged in the central region Ac0. Also, the above teb can be a value measured by selecting one of the one or more first internal electrodes 121b arranged in the outer regions Ac1 and Ac2, and the above teb' can be a value measured by selecting one of the one or more second internal electrodes 122b arranged in the outer regions Ac1 and Ac2.

[0070] In one embodiment, the cover portions 112 and 113 include an upper cover portion 112 disposed above the capacity forming portion in the first direction and a lower cover portion 113 disposed below the capacity forming portion in the first direction. The outer regions Ac1 and Ac2 include an upper outer region Ac1 adjacent to the upper cover portion and a lower outer region Ac2 adjacent to the lower cover portion. The upper outer region Ac1 includes one or more of the first and second internal electrodes, and the lower outer region Ac2 can include one or more of the first and second internal electrodes.

[0071] That is, the upper outer region Ac1 can include one or more pairs of thick internal electrodes 120b, and the lower outer region Ac2 can also include one or more pairs of thick internal electrodes 120b. Thereby, the effect of improving the connectivity and flexural strength characteristics between the internal electrode and the external electrode of the present invention can be made remarkable. Here, the pair of thick internal electrodes 120b means one first internal electrode 121b having an average thickness of tea and one second internal electrode 122b having an average thickness of tea'.

[0072] For example, when only a pair of thick internal electrodes 120b are arranged in the upper outer region Ac1 and no pair of thick internal electrodes 120b exist in the lower outer region Ac2, the deformation stress applied to the internal electrode can be further concentrated on the internal electrode disposed at the lowermost portion in the first direction. Therefore, the connectivity between the internal electrode and the external electrode may conversely decrease.

[0073] The upper outer region Ac1 and the lower outer region Ac2 can include one or more pairs of thick internal electrodes 120b, and the central region Ac0 can include one or more pairs of thin internal electrodes 120a.

[0074] In one embodiment, when the sum of the number of the first and second internal electrodes included in the central region Ac0 is Na and the sum of the number of the first and second internal electrodes included in the outer regions Ac1 and Ac2 is Nb, Nb / Na can be 0.04 or more. Thereby, the effect of improving the connectivity and flexural strength characteristics between the internal electrode and the external electrode of the present invention can be made remarkable.

[0075] When Nb / Na is less than 0.04, there may not be a sufficient effect of improving the connectivity and bending strength characteristics between the internal electrode and the external electrode.

[0076] The upper limit of Nb / Na does not particularly need to be limited, but in order to prevent the laminated electronic component from becoming excessively thick, Nb / Na can be 25 or less. If the laminated electronic component becomes excessively thick, there may be inferior mounting stability when mounted on a substrate.

[0077] In one embodiment, when the average thickness of the first internal electrode included in the central region Ac0 is tea and the average thickness of the first internal electrode included in the outer regions Ac1 and Ac2 is teb, 1.8 ≤ teb / tea ≤ 2.0 is satisfied, and when the sum of the number of the first and second internal electrodes included in the central region Ac0 is Na and the sum of the number of the first and second internal electrodes included in the outer regions Ac1 and Ac2 is Nb, Nb / Na can be 0.04 or more and 2.59 or less. Thereby, while ensuring the effect of improving the connectivity and bending strength characteristics between the internal electrode and the external electrode, mounting stability can be ensured.

[0078] In one embodiment, when the average thickness in the first direction of the outer regions Ac1 and Ac2 is tb and the average thickness in the first direction of the central region Ac0 is ta, ta / tb can be 0.03 or more. At this time, when the average thickness in the first direction of the upper outer region Ac1 is tb1 and the average thickness in the first direction of the lower outer region Ac2 is tb2, tb = tb1 + tb2.

[0079] In one embodiment, when the average thickness in the first direction of the upper outer region Ac1 is tb1 and the average thickness in the first direction of the lower outer region Ac2 is tb2, 0.9 ≤ tb1 / tb2 ≤ 1.1 can be satisfied. Thereby, the stress applied to the internal electrodes arranged in the upper outer region and the lower outer region can be uniformly dispersed, and the effect of further improving the connectivity and bending strength characteristics between the internal electrode and the external electrode of the present invention can be improved.

[0080] The external electrodes 131 and 132 can be arranged on the main body 110. The external electrodes 131 and 132 can be arranged on the third surface 3 and the fourth surface 4 of the main body 110.

[0081] The external electrodes 131 and 132 can be respectively arranged on the third and fourth surfaces 3 and 4 of the main body 110, and can include first and second external electrodes 131 and 132 respectively connected to the first and second internal electrodes 121 and 122.

[0082] In this embodiment, the structure of the multilayer electronic component 100 having two external electrodes 131 and 132 is described. However, the number, shape, etc. of the external electrodes 131 and 132 can vary according to the form of the internal electrodes 121 and 122 and other purposes.

[0083] On the other hand, the external electrodes 131 and 132 can be formed using any material as long as it has electrical conductivity such as metal. Specific materials can be determined in consideration of electrical characteristics, structural stability, etc., and furthermore, it can have a multilayer structure.

[0084] For example, the external electrodes 131 and 132 can include electrode layers 131a and 132a arranged on the main body 110, and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0085] As more specific examples of the electrode layers 131a and 132a, the electrode layers 131a and 132a may be fired electrodes including conductive metal and glass, or may be resin-based electrodes including conductive metal and resin.

[0086] Also, the electrode layers 131a and 132a can be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the electrode layers 131a and 132a may be formed by a method of transferring a sheet containing a conductive metal onto the main body, or may be formed by a method of transferring a sheet containing a conductive metal onto the fired electrode.

[0087] As the conductive metal contained in the electrode layers 131a and 132a, a material with excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys.

[0088] The plating layers 131b and 132b play a role in improving the mounting characteristics. The types of the plating layers 131b and 132b are not particularly limited, and they can be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and can be formed of multiple layers.

[0089] As a more specific example of the plating layers 131b and 132b, the plating layers 131b and 132b can be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and an Sn plating layer are sequentially formed on the electrode layers 131a and 132a, or may be in a form in which an Sn plating layer, a Ni plating layer, and an Sn plating layer are sequentially formed. Also, the plating layers 131b and 132b may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0090] (Example) After manufacturing a sample chip that satisfies Nb1 (the number of thick internal electrodes adjacent to the upper cover part), Nb2 (the number of thick internal electrodes adjacent to the lower cover part), and tea (the thickness of the thin internal electrode) / teb (the thickness of the thick internal electrode) in Table 1 below, the connectivity (contact property) and flexural strength between the internal and external electrodes were evaluated and are described in Table 1 below.

[0091] Regarding the connectivity between the internal and external electrodes, when it is less than 90% of the capacitance of Test No. 4 with the capacitance of Test No. 4 as the reference value of 100%, it is indicated as NG, and when it is 90% or more of the capacitance of Test No. 4, it is indicated as OK.

[0092] For the flexural strength, after preparing 30 sample chips for each test number, the sample chips were mounted on the substrate. While pressing the opposite side of the sample chip mounting surface up to a maximum of 6 mm, if the number of samples in which peel-off (where the external electrode is separated from the body) or crack (where the body cracks) occurred was 5 or less, it was indicated as OK; if it exceeded 5, it was indicated as NG.

[0093]

Table 1

[0094] For test number 1, since a thick internal electrode was not arranged in the area adjacent to the lower cover part, the flexural strength was inferior.

[0095] For test number 2, tea / teb was 1.4, and the connectivity between the internal and external electrodes was inferior.

[0096] For test numbers 3 to 6, since thick internal electrodes were arranged in the areas adjacent to the upper and lower cover parts, they were excellent in flexural strength and the connectivity between the internal and external electrodes.

[0097] As described above in detail about the embodiments of the present invention, the present invention is not limited by the above-described embodiments and the attached drawings, but is limited by the appended claims. Therefore, within the range not deviating from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the technical field, and it can be said that this also belongs to the scope of the present invention.

[0098] Also, the expression "an embodiment used in the present invention" does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented embodiment does not exclude the case where it is implemented in combination with the features of other embodiments. For example, even if a matter described in a specific embodiment is not described in other embodiments, it can be interpreted as an explanation related to other embodiments as long as there is no opposite explanation or conflicting explanation of that matter in other embodiments.

[0099] The terms used in the present invention are only described for the purpose of explaining an example and are not intended to limit the present invention. At this time, the singular expression includes the plural unless the context clearly indicates a different meaning.

Explanation of Reference Numerals

[0100] 100 Multilayer Electronic Component 110 Body 111 Dielectric Layer 112, 113 Cover Portion 114, 115 Margin Portion 121, 122 Internal Electrodes 131, 132 External Electrodes 131a, 132a Electrode Layers 131b, 132b Plating Layers

Claims

1. A main body including a dielectric layer, and a capacitance forming portion including first and second internal electrodes alternately arranged in a first direction with the dielectric layer therebetween, and cover portions disposed above and below the capacitance forming portion in the first direction, an external electrode disposed on the main body, wherein the capacitance forming portion includes an outer region adjacent to the cover portion and a central region excluding the outer region, wherein an average thickness of the first internal electrode included in the outer region is thicker than an average thickness of the first internal electrode included in the central region, and an average thickness of the second internal electrode included in the outer region is thicker than an average thickness of the second internal electrode included in the central region; a multilayer electronic component.

2. The multilayer electronic component according to claim 1, wherein when an average thickness of the first internal electrode included in the central region is tea and an average thickness of the first internal electrode included in the outer region is teb, 1.6 ≤ teb / tea ≤ 2.0 is satisfied.

3. The multilayer electronic component according to claim 2, wherein tea is 300 nm or more and 937.5 nm or less, and teb is 480 nm or more and 1500 nm or less.

4. The cover portion includes an upper cover portion disposed above the capacitance forming portion in the first direction and a lower cover portion disposed below the capacitance forming portion in the first direction, wherein the outer region includes an upper outer region adjacent to the upper cover portion and a lower outer region adjacent to the lower cover portion, wherein the upper outer region includes one or more of the first and second internal electrodes, and the lower outer region includes one or more of the first and second internal electrodes; the multilayer electronic component according to claim 1.

5. The multilayer electronic component according to claim 2, wherein when an average thickness of the second internal electrode included in the central region is tea' and an average thickness of the second internal electrode included in the outer region is teb', 1.6 ≤ teb' / tea' ≤ 2.0 is satisfied.

6. The multilayer electronic component according to claim 5, wherein tea and tea' satisfy 0.9 ≤ tea / tea' ≤ 1.1, and teb and teb' satisfy 0.9 ≤ teb / teb' ≤ 1.

1.

7. The multilayer electronic component according to claim 1, wherein when a sum of the number of the first and second internal electrodes included in the central region is Na and a sum of the number of the first and second internal electrodes included in the outer region is Nb, Nb / Na is 0.04 or more.

8. When the sum of the number of the first and second internal electrodes included in the central region is Na and the sum of the number of the first and second internal electrodes included in the outer region is Nb, Nb / Na is 0.04 or more and 25 or less. The multilayer electronic component according to claim 1.

9. When the average thickness of the first internal electrode included in the central region is tea and the average thickness of the first internal electrode included in the outer region is teb, 1.8 ≤ teb / tea ≤ 2.0 is satisfied. When the sum of the number of the first and second internal electrodes included in the central region is Na and the sum of the number of the first and second internal electrodes included in the outer region is Nb, Nb / Na is 0.04 or more and 2.59 or less. The multilayer electronic component according to claim 1.

10. The cover portion includes the dielectric layer and does not include the first and second internal electrodes. The multilayer electronic component according to claim 1.

11. The cover portion is composed of the dielectric layer. The multilayer electronic component according to claim 1.

12. The cover portion includes an upper cover portion disposed above the capacitance forming portion in the first direction and a lower cover portion disposed below the capacitance forming portion in the first direction. The outer region includes an upper outer region adjacent to the upper cover portion and a lower outer region adjacent to the lower cover portion. When the average thickness of the upper outer region in the first direction is tb1 and the average thickness of the lower outer region in the first direction is tb2, 0.9 ≤ tb1 / tb2 ≤ 1.1 is satisfied. The multilayer electronic component according to claim 1.

13. When the average thickness of the outer region in the first direction is tb and the average thickness of the central region in the first direction is ta, tb / ta is 0.03 or more. The multilayer electronic component according to claim 1.

14. When the average thickness of the dielectric layer included in the central region is tda and the average thickness of the dielectric layer included in the outer region is tdb, 0.9 ≤ tdb / tda ≤ 1.1 is satisfied. The multilayer electronic component according to claim 1.

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