Laminated type electronic component

Abstract

To provide a laminated type electronic component which improves a step, and improves moisture resistance reliability.SOLUTION: A laminated type electronic component includes a dielectric layer, and an internal electrode layer alternately arranged across the dielectric layer in a first direction, wherein the internal electrode layer includes a body including an internal electrode, and a dummy electrode arranged so as to be separated from the internal electrode, an external electrode connected to the internal electrode, and an insulation part which is arranged on the side face of the body and is arranged between the external electrodes, and the dummy electrode can overlap a part where the internal electrode is exposed.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one of multilayer electronic components, is a chip-shaped capacitor mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) and plasma display panel (PDP), computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small while ensuring high capacitance and easy to mount. As various electronic devices such as computers and mobile devices are miniaturized and have higher output, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] On the other hand, depending on the environment in which the MLCC is used, a multi-terminal MLCC rather than a general two-terminal MLCC may be used. Among them, a three-terminal MLCC has a structure in which signal patterns and ground patterns with different shapes are alternately laminated. At this time, in the case of the ground pattern, short-width external electrodes must be exposed on the side surface, and a step is generated by being alternately laminated with the signal pattern where the external electrodes are not exposed in the same direction, and delamination may occur due to a decrease in the density of the stepped portion during lamination and crimping. The delamination that occurs at this time may provide a moisture penetration path and induce a decrease in reliability, but in order to solve this, a structure that can minimize the step by changing the shape of dummy electrodes or lead portions is adopted.

Prior Art Documents

Patent Document

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] One of the various problems to be solved by the present invention is to provide a stacked electronic component with improved step.

[0007] One of the various problems to be solved by the present invention is to provide a stacked electronic component with improved moisture resistance reliability.

[0008] However, the various problems to be solved by the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Means for Solving the Problems

[0009] The multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, and first and second internal electrode layers alternately arranged in a first direction with the dielectric layer interposed therebetween. The multilayer electronic component includes first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction. The first internal electrode layer includes a first internal electrode exposed on the fifth and sixth surfaces, and a first dummy electrode arranged separately from the first internal electrode. The second internal electrode layer includes a second internal electrode exposed on the third and fourth surfaces, and a second dummy electrode arranged separately from the second internal electrode. The multilayer electronic component further includes a main body including first and second external electrodes respectively arranged on the third and fourth surfaces and connected to the second internal electrode, third and fourth external electrodes respectively arranged on the fifth and sixth surfaces and connected to the first internal electrode, first and second insulating portions respectively arranged on the fifth surface and spaced apart from each other in the second direction with the third external electrode interposed therebetween, and third and fourth insulating portions respectively arranged on the sixth surface and spaced apart from each other in the second direction with the fourth external electrode interposed therebetween. The first dummy electrode can overlap with an exposed portion of the second internal electrode in the first direction, and the second dummy electrode can overlap with an exposed portion of the first internal electrode in the first direction.

[0010] A multilayer electronic component according to another embodiment of the present invention includes a dielectric layer, and first and second internal electrode layers alternately arranged in a first direction with the dielectric layer interposed therebetween, and first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction. The first internal electrode layer includes a first internal electrode exposed on the fifth and sixth surfaces, and a first dummy electrode disposed apart from the first internal electrode. The second internal electrode layer includes a second internal electrode exposed on the third to sixth surfaces, and a second dummy electrode disposed apart from the second internal electrode. The multilayer electronic component further includes a main body including the above-described elements, a first external electrode disposed on the third, fifth, and sixth surfaces and connected to at least a part of the exposed second internal electrode, a second external electrode disposed on the fourth, fifth, and sixth surfaces and connected to the second internal electrode, a third external electrode disposed on the fifth surface and connected to the first internal electrode, and a fourth external electrode disposed on the sixth surface and connected to the first internal electrode. The first dummy electrode can overlap with the exposed portion of the second internal electrode in the first direction, and the second dummy electrode can overlap with the exposed portion of the first internal electrode in the first direction.

Advantages of the Invention

[0011] One of the various advantages of the present invention is that the step difference of the multilayer electronic component is improved.

[0012] One of the various advantages of the present invention is that the moisture resistance reliability of the multilayer electronic component is improved.

[0013] However, the various and significant advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of describing specific embodiments of the present invention.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3a

Figure 3b

Figure 4

Figure 5a

Figure 5b

Figure 6

Figure 7a

Figure 7b

Figure 8

Figure 9a

Figure 9b

Embodiments for Carrying Out the Invention

[0015] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0016] In addition, for the purpose of clearly explaining the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of the illustrated components are arbitrarily shown for the convenience of explanation. Therefore, the present invention is not necessarily limited by the illustration. Also, components having the same functions within the scope of the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0017] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0018] Multilayer electronic component FIG. 1 schematically shows a perspective view of a multilayer electronic component according to an embodiment of the present invention. FIG. 2 schematically shows a perspective view of the structure of the multilayer electronic component of FIG. 1 with external electrodes removed. FIGS. 3a and 3b schematically show an internal electrode layer of an embodiment of the present invention. FIG. 4 schematically shows a perspective view of a multilayer electronic component according to another embodiment of the present invention. FIGS. 5a and 5b schematically show an internal electrode layer of another embodiment of the present invention. FIG. 6 schematically shows a perspective view of a multilayer electronic component according to another embodiment of the present invention. FIGS. 7a and 7b schematically show an internal electrode layer of another embodiment of the present invention. FIG. 8 schematically shows a perspective view of a multilayer electronic component according to another embodiment of the present invention. FIGS. 9a and 9b schematically show an internal electrode layer of another embodiment of the present invention.

[0019] Hereinafter, with reference to FIGS. 1 to 9b, a multilayer electronic component according to an embodiment of the present invention will be described in detail. However, as an example of the multilayer electronic component, a multilayer ceramic capacitor will be described, but the present invention can also be applied to various electronic products using a dielectric composition, such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0020] A stacked electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111, and first and second internal electrode layers 121 and 122 alternately arranged in a first direction with the dielectric layer 111 interposed therebetween. The stacked electronic component 100 includes first and second surfaces 1 and 2 facing each other in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces 1, 2, 3, and 4 and facing each other in a third direction. The first internal electrode layer 121 includes a first internal electrode 121a exposed on the fifth and sixth surfaces 5 and 6, and a first dummy electrode 121b disposed apart from the first internal electrode 121a. The second internal electrode layer 122 includes a second internal electrode 122a exposed on the third and fourth surfaces 3 and 4, and a second dummy electrode 122b disposed apart from the second internal electrode 122a. The stacked electronic component 100 further includes a main body 110, first and second external electrodes 131 and 132 respectively disposed on the third and fourth surfaces 3 and 4 and connected to the second internal electrode 122a, third and fourth external electrodes 133 and 134 respectively disposed on the fifth and sixth surfaces 5 and 6 and connected to the first internal electrode 121a, first and second insulating portions 141 and 142 disposed on the fifth surface 5 and spaced apart from each other in the second direction with the third external electrode 133 interposed therebetween, and third and fourth insulating portions 143 and 144 disposed on the sixth surface 6 and spaced apart from each other in the second direction with the fourth external electrode 134 interposed therebetween. The first dummy electrode 121b can overlap an exposed portion of the second internal electrode 122a in the first direction, and the second dummy electrode 122b can overlap an exposed portion of the first internal electrode 121a in the first direction.

[0021] A multilayer electronic component 400 according to another embodiment of the present invention includes a dielectric layer 411, and first and second internal electrode layers 421 and 422 alternately arranged in a first direction with the dielectric layer 411 interposed therebetween. The multilayer electronic component 400 includes first and second surfaces 1 and 2 facing each other in the first direction, third and fourth surfaces 3 and 4 facing each other in a second direction and connected to the first and second surfaces 1 and 2, and fifth and sixth surfaces 5 and 6 facing each other in a third direction. The first internal electrode layer 421 includes a first internal electrode 421a exposed on the fifth and sixth surfaces 5 and 6, and a first dummy electrode 421b arranged at a distance from the first internal electrode 421a. The second internal electrode layer 422 includes a second internal electrode 422a exposed on the third to sixth surfaces 3, 4, 5, and 6, and a second dummy electrode 422b arranged at a distance from the second internal electrode 422a. The multilayer electronic component 400 further includes a main body 410, a first external electrode 431 arranged on the third, fifth, and sixth surfaces 3, 5, and 6 and connected to the second internal electrode 422a, a second external electrode 432 arranged on the fourth, fifth, and sixth surfaces 4, 5, and 6 and connected to the second internal electrode 422a, a third external electrode 433 arranged on the fifth surface 5 and connected to the first internal electrode 421a, and a fourth external electrode 434 arranged on the sixth surface 6 and connected to the first internal electrode 421a. The first dummy electrode 421b can overlap a portion of the second internal electrode 422a exposed in the first direction, and the second dummy electrode 422b can overlap a portion of the first internal electrode 421a exposed in the first direction.

[0022] Hereinafter, a multilayer electronic component 100 according to an embodiment of the present invention will be described. Unless otherwise specified, the configurations similar to those of the multilayer electronic component 100 according to an embodiment of the present invention can be similarly applied to the multilayer electronic components 200, 300, and 400 according to other embodiments of the present invention.

[0023] The main body 110 may have a dielectric layer 111 and internal electrode layers 121 and 122 alternately laminated.

[0024] More specifically, the main body 110 can be disposed inside the main body 110 and include a first internal electrode layer 121 and a second internal electrode layer 122 that are alternately arranged in the first direction with a dielectric layer 111 interposed therebetween.

[0025] There is no particular limitation on the specific shape of the main body 110. As shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic particles contained in the main body 110 during the firing process, the main body 110 is not a hexahedron with a perfect straight line, but can have a substantially hexahedron shape.

[0026] The main body 110 can have a first and a second surface 1, 2 facing each other in the first direction, a third and a fourth surface 3, 4 connected to the first and second surfaces 1, 2 and facing each other in the second direction, and a fifth and a sixth surface 5, 6 connected to the first to fourth surfaces 1, 2, 3, 4 and facing each other in the third direction.

[0027] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so that it is difficult to confirm without using a scanning electron microscope (SEM).

[0028] The raw material for forming the dielectric layer 111 is not limited as long as sufficient capacitance can be obtained. Generally, perovskite (ABO3) - based materials can be used. For example, barium titanate - based materials, lead - composite perovskite - based materials, or strontium titanate - based materials can be used. The barium titanate - based material can contain BaTiO3 - based ceramic particles. As examples of the ceramic particles, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) where Ca (calcium), Zr (zirconium), etc. are partially solid - solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y)O3(0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3(0 < y < 1), etc.

[0029] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to particles such as barium titanate (BaTiO3) as the raw material for forming the dielectric layer 111 according to the object of the present invention.

[0030] The thickness of the dielectric layer 111 does not need to be particularly limited.

[0031] To ensure the reliability of the multilayer electronic component 100 under a high voltage environment, the thickness of the dielectric layer 111 can be 10.0 μm or less. Also, to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the dielectric layer 111 can be 3.0 μm or less, and to more easily achieve ultra-miniaturization and high capacitance, the thickness of the dielectric layer 111 can be 1.0 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0032] Here, the thickness of the dielectric layer 111 can mean the thickness of the dielectric layer 111 disposed between the first and second internal electrodes 121a and 122a.

[0033] On the other hand, the thickness of the dielectric layer 111 can mean the size of the dielectric layer 111 in the first direction. Also, the thickness of the dielectric layer 111 can mean the average thickness of the dielectric layer 111 and can mean the average size of the dielectric layer 111 in the first direction.

[0034] The average size of the dielectric layer 111 in the first direction can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of one dielectric layer 111 in the first direction can mean the average value calculated by measuring the size in the first direction at 10 equally spaced points in the second direction for one dielectric layer 111 in the scanned image. The 10 equally spaced points can be specified in the capacitance forming section. Also, when such average value measurement is extended to 10 dielectric layers 111 to measure the average value, the average size of the dielectric layer 111 in the first direction can be further generalized.

[0035] The internal electrodes 121a and 122a can be alternately laminated with the dielectric layer 111.

[0036] The internal electrodes 121a and 122a can include a first internal electrode layer 121 and a second internal electrode layer 122, and the first and second internal electrode layers 121 and 122 can be alternately arranged in the first direction with the dielectric layer 111 constituting the main body 110 interposed therebetween.

[0037] More specifically, the first internal electrode layer 121 can include a first internal electrode 121a exposed on the fifth and sixth surfaces 5 and 6, and a first dummy electrode 121b arranged separately from the first internal electrode 121a, and the second internal electrode layer 122 can include a second internal electrode 122a exposed on the third and fourth surfaces 3 and 4, and a second dummy electrode 122b arranged separately from the second internal electrode 122a.

[0038] That is, the first internal electrode 121a is separated from the third and fourth surfaces 3 and 4, exposed on the fifth and sixth surfaces 5 and 6, and can be connected to the third and fourth external electrodes 133 and 134, and the first dummy electrode 121b is exposed on the third and fourth surfaces 3 and 4 and can be connected to the first and second external electrodes 131 and 132. However, it is not limited thereto, and the first dummy electrode can be further exposed through the fifth and sixth surfaces.

[0039] The second internal electrode 122a is separated from the fifth and sixth surfaces 5 and 6, exposed through the third and fourth surfaces 3 and 4, and can be connected to the first and second external electrodes 131 and 132. The second dummy electrode 122b can be exposed through the fifth and sixth surfaces 5 and 6 and connected to the third and fourth external electrodes 133 and 134.

[0040] That is, the first internal electrode 121a is not connected to the first and second external electrodes 131 and 132, but is connected to the third and fourth external electrodes 133 and 134. The second internal electrode 122a is not connected to the third and fourth external electrodes 133 and 134, but can be connected to the first and second external electrodes 131 and 132.

[0041] At this time, the first and second internal electrodes 121a and 122a can be electrically separated from each other by the dielectric layer 111 disposed in the middle in the first direction, and include main portions 121a-0 and 122a-0 that form a capacitance by overlapping in the first direction, and lead portions 121a-1, 121a-2, 122a-1, and 122a-2 that are exposed on any one surface of the main body without forming a capacitance.

[0042] However, the lead portion of the internal electrode exposed on any one surface of the main body is not limited to one, and can include a plurality of lead portions. This will be described more specifically below.

[0043] Also, the first dummy electrode 121b can overlap with the exposed portions 122a-1 and 122a-2 of the second internal electrode 122a in the first direction, and the second dummy electrode 122b can overlap with the exposed portions 121a-1 and 121a-2 of the first internal electrode 121a in the first direction.

[0044] When the dummy electrodes 121b and 122b overlap with the exposed portions of the internal electrodes 121a and 122a in the first direction, the step in the region where no capacitance is formed can be minimized, and the process operation during paste coating can be simplified, so the process speed can be improved.

[0045] On the one hand, the first and second internal electrodes 121a and 122a can each have a substantially constant size in the second direction and a substantially constant size in the third direction, or the regions 121a-1, 121a-2, 122a-1, and 122a of the first and second internal electrodes that are exposed through any one surface of the main body can each have a substantially constant size in the second direction and a substantially constant size in the third direction.

[0046] Here, the meaning that the size in the second direction is substantially constant can mean that the size in the second direction is 5% or less based on the average value of the maximum size and the minimum size in the second direction, and this can be similarly applied to the case where the size in the third direction is substantially constant.

[0047] On the other hand, the main body 110 can be formed by alternately laminating a first ceramic green sheet printed with the first internal electrode layer 121 and a second ceramic green sheet printed with the second internal electrode layer 122 and then firing them.

[0048] The materials for forming the internal electrode layers 121 and 122 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the internal electrodes 121a and 122a can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0049] Also, the internal electrode layers 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. As the printing method of the conductive paste for internal electrodes, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0050] On the other hand, the thicknesses of the internal electrode layers 121 and 122 do not need to be particularly limited.

[0051] In order to ensure the reliability of the multilayer electronic component 100 in a high-voltage environment, the thicknesses of the internal electrode layers 121 and 122 can be 3.0 μm or less. Further, in order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thicknesses of the internal electrode layers 121 and 122 can be 1.0 μm or less, and in order to more easily achieve ultra-miniaturization and high capacitance, the thicknesses of the internal electrodes 121a and 122a can be 0.6 μm or less, and more preferably 0.4 μm or less.

[0052] Here, the thicknesses of the internal electrode layers 121 and 122 can mean the sizes of the internal electrode layers 121 and 122 in the first direction. Note that the thicknesses of the internal electrode layers 121 and 122 can mean the average thicknesses of the internal electrode layers 121 and 122, and can mean the average sizes of the internal electrode layers 121 and 122 in the first direction.

[0053] The average size of the internal electrode layers 121 and 122 in the first direction can be measured by scanning an image of the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of one internal electrode layer in the first direction can be the average value calculated by measuring the sizes of one internal electrode layer in the first direction at 10 equally spaced points in the second direction in the scanned image. The 10 equally spaced points can be specified in the capacitance forming portion. Further, when such average value measurement is extended to 10 internal electrode layers to measure the average value, the average size of the internal electrode layers in the first direction can be further generalized.

[0054] On the other hand, in one embodiment of the present invention, when the average thickness of at least one of the plurality of dielectric layers 111 is td and the average thickness of at least one of the plurality of internal electrode layers 121 and 122 is te, 2 × te < td can be satisfied.

[0055] In other words, the average thickness td of one of the dielectric layers 111 can be greater than twice the average thickness te of one of the internal electrode layers 121, 122. Preferably, the average thickness td of the plurality of dielectric layers 111 can be greater than twice the average thickness te of the plurality of internal electrode layers 121, 122.

[0056] Generally, for high-voltage electrical components, the main issue is the reliability problem due to the decrease in breakdown voltage (BDV) under high-voltage environments.

[0057] Therefore, in order to prevent the decrease in breakdown voltage under high-voltage environments, by making the average thickness td of the dielectric layer 111 greater than twice the average thickness te of the internal electrode layers 121, 122, the thickness of the dielectric layer, which is the distance between the internal electrode layers, can be increased, and the characteristics of the breakdown voltage can be improved.

[0058] When the average thickness td of the dielectric layer 111 is less than or equal to twice the average thickness te of the internal electrode layers 121, 122, the average thickness of the dielectric layer, which is the distance between the internal electrode layers, becomes thin, the breakdown voltage may decrease, and there is a possibility of a short circuit occurring between the internal electrode layers.

[0059] On the other hand, the main body 110 can include a cover portion disposed on both end surfaces in the first direction of the capacitance forming portion.

[0060] Specifically, it can include a first cover portion disposed on one surface in the first direction of the capacitance forming portion and a second cover portion disposed on the other surface in the first direction of the capacitance forming portion. More specifically, it can include an upper cover portion disposed on the upper part in the first direction of the capacitance forming portion and a lower cover portion disposed on the lower part in the first direction of the capacitance forming portion.

[0061] The upper cover portion and the lower cover portion can be formed by laminating a single dielectric layer 111 or two or more dielectric layers 111 in the first direction on the upper and lower surfaces of the capacitance forming portion, and can basically play a role in preventing damage to the internal electrode layers 121 and 122 due to physical or chemical stress.

[0062] The upper cover portion and the lower cover portion do not include the internal electrode layers 121 and 122 and can contain the same material as the dielectric layer 111. That is, the upper cover portion and the lower cover portion can contain a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0063] On the other hand, the thickness of the cover portion does not need to be particularly limited.

[0064] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness of the cover portion can be 100 μm or less, preferably 30 μm or less, and more preferably 20 μm or less in the case of ultra-small products.

[0065] Here, the thickness of the cover portion can mean the size of the cover portion in the first direction. Note that the thickness of the cover portion can mean the average thickness of the cover portion and can mean the average size of the cover portion in the first direction.

[0066] The average size of the cover portion in the first direction can be measured by scanning an image of the cross-section of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, it can mean the average value calculated by measuring the size in the first direction at 10 equally spaced points in the second direction in an image of one scanned cover portion.

[0067] Note that the average size of the cover portion in the first direction measured by the above-described method can have substantially the same size as the average size of the cover portion in the first direction in the cross-section of the main body 110 in the first and third directions.

[0068] In one embodiment of the present invention, a structure in which the multilayer electronic component 100 has four external electrodes 131, 132, 133, and 134 is described. However, the number, shape, etc. of the external electrodes 131, 132, 133, and 134 can vary according to the form of the internal electrode layers 121, 122 and other purposes.

[0069] The external electrodes 131, 132, 133, and 134 are arranged on the main body 110 and can be connected to the internal electrode layers 121, 122.

[0070] More specifically, the external electrodes 131 and 132 are arranged on the third surface 3 of the main body 110 and are the first external electrode 131 connected to the second internal electrode 122a, arranged on the fourth surface 4 of the main body 110 and connected to the second internal electrode 122a, the second external electrode 132, arranged on the fifth surface 5 of the main body 110 and connected to the first internal electrode 121a, the third external electrode 133, and arranged on the sixth surface 6 of the main body 110 and connected to the first internal electrode 121a, the fourth external electrode 134.

[0071] Furthermore, the first and second external electrodes 131 and 132 can be arranged to extend to a part on the first and second surfaces 1 and 2 of the main body 110, or can be arranged to extend to a part on the fifth and sixth surfaces 5 and 6 of the main body 110. That is, the first external electrode 131 can be arranged on a part of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the main body 110 and on the third surface 3 of the main body 110, and the second external electrode 132 can be arranged on a part of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the main body 110 and on the fourth surface 4 of the main body 110.

[0072] The third and fourth external electrodes 133 and 134 can be arranged to extend to a part on the first and second surfaces 1 and 2 of the main body 110. That is, the third external electrode 133 can be arranged on a part of the first and second surfaces 1 and 2 of the main body 110 and on the fifth surface 5 of the main body 110, and the fourth external electrode 134 can be arranged on a part of the first and second surfaces 1 and 2 of the main body 110 and on the sixth surface 6 of the main body 110.

[0073] On the one hand, the external electrodes 131, 132, 133, and 134 can be formed of any material as long as it has electrical conductivity such as metal, and a specific material can be determined in consideration of electrical characteristics, structural stability, etc., and it can further have a multilayer structure.

[0074] For example, the external electrodes 131, 132, 133, and 134 can include an electrode layer disposed on the main body 110 and a plating layer disposed on the electrode layer.

[0075] To give a more specific example of the electrode layer, the electrode layer can include a first electrode layer which is a fired electrode containing a first conductive metal and glass, or a second electrode layer which is a resin-based electrode containing a second conductive metal and resin.

[0076] Here, the conductive metal contained in the first electrode layer can be referred to as the first conductive metal, and the conductive metal contained in the second electrode layer can be referred to as the second conductive metal. At this time, the first conductive metal and the second conductive metal can be the same as or different from each other. When containing a plurality of conductive metals, only a part can contain the same conductive metal, but it is not particularly limited thereto.

[0077] Also, the electrode layer can be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body 110.

[0078] Also, the electrode layer can be formed by a method of transferring a sheet containing a conductive metal onto the main body, or can be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode.

[0079] A material excellent in electrical conductivity can be used as the conductive metal contained in the electrode layer. For example, the conductive metal can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but is not particularly limited thereto.

[0080] The electrode layer can have a two-layer structure including a first electrode layer and a second electrode layer. Accordingly, the external electrodes 131, 132, 133, and 134 can include a first electrode layer including a first conductive metal and glass and a second electrode layer disposed on the first electrode layer and including a second conductive metal and resin.

[0081] The first electrode layer plays a role of improving the bonding property with the main body 110 by including glass, and the second electrode layer can play a role of improving the bending strength by including resin.

[0082] The first conductive metal included in the first electrode layer is not particularly limited as long as it is a material that can be electrically connected to the internal electrodes 121a and 122a for capacitance formation. For example, it can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0083] The first electrode layer can be formed by applying a conductive paste provided by adding glass frit to first conductive metal particles and then firing.

[0084] The second conductive metal included in the second electrode layer can play a role of being electrically connected to the first electrode layer.

[0085] The conductive metal included in the second electrode layer is not particularly limited as long as it is a material that can be electrically connected to the electrode layer, and can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0086] The second conductive metal contained in the second electrode layer can include one or more of spherical particles and flaky particles. That is, the second conductive metal can consist only of flaky particles, can consist only of spherical particles, or can be in a form in which flaky particles and spherical particles are mixed. Here, the spherical particles can include forms that are not completely spherical. For example, they can include forms in which the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) is 1.45 or less. The flaky particles mean particles having a flat and elongated form, and are not particularly limited. For example, the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) can be 1.95 or more. The lengths of the major axis and the minor axis of the above spherical particles and flaky particles can be measured from an image obtained by scanning cross-sections in the first and second directions cut at the central part in the third direction of the multilayer electronic component with a scanning electron microscope (SEM).

[0087] The resin contained in the second electrode layer can play a role in ensuring bondability and absorbing shock. The resin contained in the second electrode layer has bondability and shock absorbability, and is not particularly limited as long as it can be mixed with the second conductive metal particles to form a paste. For example, it can include an epoxy resin.

[0088] Also, the second electrode layer can include a plurality of second conductive metal particles, an intermetallic compound, and a resin. By including an intermetallic compound, the electrical connectivity with the first electrode layer can be further improved. The intermetallic compound can play a role in connecting a plurality of metal particles to improve electrical connectivity and can play a role in surrounding and connecting the plurality of metal particles to each other.

[0089] At this time, the intermetallic compound can contain a metal having a melting point lower than the curing temperature of the resin. That is, since the intermetallic compound contains a metal having a melting point lower than the curing temperature of the resin, the metal having a melting point lower than the curing temperature of the resin melts during the drying and curing processes, forms a part of the metal particles and an intermetallic compound, and comes to surround the metal particles. At this time, the intermetallic compound can preferably contain a low melting point metal of 300 °C or lower.

[0090] For example, it can contain Sn having a melting point of 213 to 220 °C. Sn melts during the drying and curing processes, and the molten Sn wets high melting point metal particles such as Ag, Ni, or Cu by capillary action, reacts with a part of the Ag, Ni, or Cu metal particles, and comes to form intermetallic compounds such as Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn. Ag, Ni, or Cu not involved in the reaction remains in the form of metal particles.

[0091] Therefore, the plurality of second conductive metal particles can contain one or more of Ag, Ni, and Cu, and the intermetallic compound can contain one or more of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

[0092] The plating layer can play a role in improving the mounting characteristics.

[0093] The type of the plating layer is not particularly limited, and it can be a single-layer plating layer 131c, 132c containing one or more of nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and alloys thereof, and can be formed of a plurality of layers.

[0094] To give a more specific example of the plating layer, the plating layer can be a Ni plating layer or a Sn plating layer, and can be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, and can be in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Also, the plating layer can contain a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0095] One embodiment of the present invention can include insulating portions 141, 142, 143, 144 disposed on the main body 110.

[0096] The insulating portions 141, 142, 143, 144 are connected to the internal electrode layers 121, 122 exposed on any one surface of the main body 110, and can preferably be disposed so as to cover the exposed internal electrode layers 121, 122.

[0097] More specifically, the insulating portions 141, 142, 143, 144 can include a first insulating portion 141 and a second insulating portion 142 that are spaced apart from each other in the second direction with the third external electrode 133 interposed therebetween on the fifth surface 5, and a third insulating portion 143 and a fourth insulating portion 144 that are spaced apart from each other in the second direction with the fourth external electrode 134 interposed therebetween on the sixth surface 6.

[0098] At this time, the first insulating portion 141 and the second insulating portion 142 can be connected to the lead portion 121a-1 of the first internal electrode exposed on the fifth surface 5 and the first dummy electrode 122b-1, and the third insulating portion 143 and the fourth insulating portion 144 can be connected to the lead portion 121a-2 of the first internal electrode exposed on the sixth surface 6 and the first dummy electrode 122b-2.

[0099] That is, the lead portion 121a-1 of the first internal electrode exposed on the fifth surface 5 and the first dummy electrode 122b-1 can be disposed and connected so as to be covered by the first insulating portion 141, the third external electrode 133, and the second insulating portion 142, and the lead portion 121a-2 of the first internal electrode exposed on the sixth surface 6 and the first dummy electrode 122b-2 can be disposed and connected so as to be covered by the third insulating portion 143, the fourth external electrode 134, and the fourth insulating portion 144.

[0100] The insulating portions 141, 142, 143, 144 are arranged to cover the internal electrode layers 121, 122 exposed on any one surface of the main body, so that moisture penetration from the outside can be suppressed and the moisture resistance reliability can be improved. Further, in order to minimize the mounting areas of the third and fourth external electrodes 133, 134, even if the sizes of the third and fourth external electrodes 133, 134 become smaller and the areas of the internal electrode layers 121, 122 exposed increase, they can be sufficiently covered by the insulating portions 141, 142, 143, 144, and the moisture resistance reliability can be excellent while minimizing the area of the pads to be mounted.

[0101] The size of the multilayer electronic component 100 does not particularly need to be limited.

[0102] However, in order to simultaneously achieve miniaturization and high capacity, since the thicknesses of the dielectric layer and the internal electrodes have to be reduced and the number of laminations has to be increased, the effects of the present invention can become more remarkable in the multilayer electronic component 100 having a size of 3216 (length × width: 3.2 mm × 1.6 mm) or less.

[0103] Hereinafter, the present invention will be described in more detail through various embodiments of the present invention, which is for helping a specific understanding of the present invention, and the scope of the present invention is not limited by the embodiments.

[0104] <First Embodiment> Hereinafter, a multilayer electronic component 100 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3b.

[0105] In the multilayer electronic component 100, it includes a dielectric layer 111, and first and second internal electrode layers 121 and 122 alternately arranged in the first direction with the dielectric layer 111 interposed therebetween. It includes first and second surfaces 1 and 2 facing each other in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces 1, 2, 3, and 4 and facing each other in the third direction. The first internal electrode layer 121 includes a first internal electrode 121a exposed on the fifth and sixth surfaces 5 and 6, and a first dummy electrode 121b arranged at a distance from the first internal electrode 121a. The second internal electrode layer 122 includes a second internal electrode 122a exposed on the third and fourth surfaces 3 and 4, and a second dummy electrode 122b arranged at a distance from the second internal electrode 122a. A main body 110, first and second external electrodes 131 and 132 respectively arranged on the third and fourth surfaces 3 and 4 and connected to the second internal electrode 122a, third and fourth external electrodes 133 and 134 respectively arranged on the fifth and sixth surfaces 5 and 6 and connected to the first internal electrode 121a, first and second insulating portions 141 and 142 arranged on the fifth surface 5 and spaced apart from each other in the second direction with the third external electrode 133 interposed therebetween, and third and fourth insulating portions 143 and 144 arranged on the sixth surface 6 and spaced apart from each other in the second direction with the fourth external electrode 134 interposed therebetween. The first dummy electrode 121b can overlap with the exposed portion of the second internal electrode 122a in the first direction, and the second dummy electrode 122b can overlap with the exposed portion of the first internal electrode 121a in the first direction.

[0106] More specifically, the first internal electrode 121a includes a first main portion 121a-0, and first lead portions 121a-1 and 121a-2 extending from the first main portion 121a-0. The first lead portions 121a-1 and 121a-2 include a first-1 lead portion 121a-1 that is exposed on the fifth surface 5 and at least a part of which is connected to the third external electrode 133, and a first-2 lead portion 121a-2 that is exposed on the sixth surface 6 and at least a part of which is connected to the fourth external electrode 134. The first dummy electrode 121b includes a first-1 dummy electrode 121b-1 that is exposed on the third surface 3, and a first-2 dummy electrode 121b-2 that is disposed at a distance from the first-1 dummy electrode 121b-1 and is exposed on the fourth surface 4. The second internal electrode 122a includes a second main portion 122a-0, and second lead portions 122a-1 and 122a-2 extending from the second main portion 122a-0. The second lead portions 122a-1 and 122a-2 include a second-1 lead portion 122a-1 that is exposed on the third surface 3 and is connected to the first external electrode 131, and a second-2 lead portion 122a-2 that is exposed on the fourth surface 4 and is connected to the second external electrode 132. The second dummy electrodes 122b-1 and 122b-2 include a second-1 dummy electrode 122b-1 that is exposed on the fifth surface 5, and a second-2 dummy electrode 122b-2 that is exposed on the sixth surface 6. The first-1 dummy electrode 121b-1 overlaps with the second-1 lead portion 122a-1 in the first direction, the first-2 dummy electrode 121b-2 overlaps with the second-2 lead portion 122a-2 in the first direction, the second-1 dummy electrode 122b-1 overlaps with the first-1 lead portion 121a-1 in the first direction, and the second-2 dummy electrode 122b-2 can overlap with the first-2 lead portion 121a-2 in the first direction.

[0107] At this time, at least a part of the first-1 lead portion 121a-1 can be further connected to the first and second insulating portions 141 and 142, and at least a part of the first-2 lead portion 121a-2 can be further connected to the third and fourth insulating portions 143 and 144.

[0108] <Second Embodiment> Hereinafter, with reference to FIGS. 4 to 5b, a laminated electronic component 200 according to another embodiment of the present invention will be described.

[0109] Among these, the same configurations and descriptions as those of the laminated electronic component 100 are omitted, but can be easily understood by an ordinary technician.

[0110] In the laminated electronic component 200, the first - 1 lead portions 221a - 1, 221a - 3, 221a - 5 are arranged separately from each other, and include a first - 1 - 1 lead portion 221a - 1 connected to the third external electrode 233, a first - 1 - 2 lead portion 221a - 3 connected to the first insulating portion 241, and a first - 1 - 3 lead portion 221a - 5 connected to the second insulating portion 242. The first - 2 lead portions 221a - 2, 221a - 4, 221a - 6 are arranged separately from each other, and include a first - 2 - 1 lead portion 221a - 2 connected to the fourth external electrode 234, a first - 2 - 2 lead portion 221a - 4 connected to the third insulating portion 243, and a first - 2 - 3 lead portion 221a - 6 connected to the fourth insulating portion 244. The second - 1 dummy electrodes 222b - 1, 222b - 3, 222b - 5 are arranged separately from each other, and include a second - 1 - 1 dummy electrode 222b - 1 overlapping the first - 1 - 1 lead portion 221a - 1 in the first direction, a second - 1 - 2 dummy electrode 222b - 3 overlapping the first - 1 - 2 lead portion 221a - 3 in the first direction, and a second - 1 - 3 dummy electrode 222b - 5 overlapping the first - 1 - 3 lead portion 221a - 5 in the first direction. The second - 2 dummy electrodes 222b - 2, 222b - 4, 222b - 6 are arranged separately from each other, and include a second - 2 - 1 dummy electrode 222b - 2 overlapping the first - 2 - 1 lead portion 221a - 2 in the first direction, a second - 2 - 2 dummy electrode 222b - 4 overlapping the first - 2 - 2 lead portion 221a - 4 in the first direction, and a second - 2 - 3 dummy electrode 222b - 6 overlapping the first - 2 - 3 lead portion 221a - 6 in the first direction.

[0111] <Third Embodiment> Hereinafter, with reference to FIGS. 6 to 7b, a laminated electronic component 300 according to another embodiment of the present invention will be described.

[0112] Among these, the same configurations and explanations as those of the stacked electronic components 100 and 200 are omitted, but can be easily understood by an ordinary technician.

[0113] In the stacked electronic component 300, the second lead portions 322a-1, 322a-2, 322a-3, 322a-4, 322a-5, 322a-6 further include the second-3 lead portions 322a-3, 322a-5 exposed on the fifth surface 5 and the second-4 lead portions 322a-4, 322a-6 exposed on the sixth surface 6. The second-3 lead portions 322a-3, 322a-5 are arranged apart from each other and include a second-3-1 lead portion 322a-3 connected to the first insulating portion 341 and a second-3-2 lead portion 322a-5 connected to the second insulating portion 342. The second-4 lead portions 322a-4, 322a-6 are arranged apart from each other and include a second-4-1 lead portion 322a-4 connected to the third insulating portion 343 and a second-4-2 lead portion 322a-6 connected to the fourth insulating portion 344. The first dummy electrode 321b further includes a first-3 dummy electrode 321b-3, 321b-5 exposed on the fifth surface 5 and a first-4 dummy electrode 321b-4, 321b-6 exposed on the sixth surface 6. The first-3 dummy electrodes 321b-3, 321b-5 are arranged apart from each other and include a first-3-1 dummy electrode 321b-3 overlapping with the second-3-1 lead portion 322a-3 in the first direction and a first-3-2 dummy electrode 321b-5 overlapping with the second-3-2 lead portion 322a-5 in the first direction. The first-4 dummy electrodes 321b-4, 321b-6 are arranged apart from each other and may include a first-4-1 dummy electrode 321b-4 overlapping with the second-4-1 lead portion 322a-4 in the first direction and a first-4-2 dummy electrode 321b-6 overlapping with the second-4-2 lead portion 322a-6 in the second direction.

[0114] <Fourth Embodiment> Hereinafter, a stacked electronic component 400 according to another embodiment of the present invention will be described with reference to FIGS. 8 to 9b.

[0115] A multilayer electronic component 400 according to another embodiment of the present invention can include the same configuration as the multilayer electronic components 100, 200, and 300, except that it does not include an insulating portion. Regarding the same configuration and description except for the insulating portion, they will be omitted, but it can be easily understood by an ordinary technician.

[0116] In the multilayer electronic component 400, it includes a dielectric layer 411, and first and second internal electrode layers 421 and 422 that are alternately arranged in a first direction with the dielectric layer 411 interposed therebetween. It includes first and second surfaces 1 and 2 that face each other in the first direction, third and fourth surfaces 3 and 4 that are connected to the first and second surfaces 1 and 2 and face each other in a second direction, and fifth and sixth surfaces 5 and 6 that are connected to the first to fourth surfaces 1, 2, 3, and 4 and face each other in a third direction. The first internal electrode layer 421 includes a first internal electrode 421a that is exposed on the fifth and sixth surfaces 5 and 6, and a first dummy electrode 421b that is arranged at a distance from the first internal electrode 421a. The second internal electrode layer 422 includes a second internal electrode 422a that is exposed on the third to sixth surfaces 3, 4, 5, and 6, and a second dummy electrode 422b that is arranged at a distance from the second internal electrode 422a. A main body 410, a first external electrode 431 that is arranged on the third, fifth, and sixth surfaces 3, 5, and 6 and is connected to the second internal electrode 422a, a second external electrode 432 that is arranged on the fourth, fifth, and sixth surfaces 4, 5, and 6 and is connected to the second internal electrode 422a, a third external electrode 433 that is arranged on the fifth surface 5 and is connected to the first internal electrode 421a, and a fourth external electrode 434 that is arranged on the sixth surface 6 and is connected to the first internal electrode 421a. The first dummy electrode 421b can overlap with the exposed portion of the second internal electrode 422a in the first direction, and the second dummy electrode 422b can overlap with the exposed portion of the first internal electrode 421a in the first direction.

[0117] At this time, the second lead portions 422a-1, 422a-2, 422a-3, 422a-4, 422a-5, 422a-6 further include the second-third lead portions 422a-3, 422a-5 exposed on the fifth surface 5 and the second-fourth lead portions 422a-4, 422a-6 exposed on the sixth surface 6. The second-third lead portions 422a-3, 422a-5 are arranged apart from each other and include a second-third-1 lead portion 422a-3 connected to the first external electrode 431 and a second-third-2 lead portion 422a-5 connected to the second external electrode 432. The second-fourth lead portions 422a-4, 422a-6 are arranged apart from each other and include a second-fourth-1 lead portion 422a-4 connected to the first external electrode 431 and a second-fourth-2 lead portion 422a-6 connected to the second external electrode 432. The first dummy electrode 421b further includes a first-third dummy electrode 421b-3, 421b-5 exposed on the fifth surface 5 and a first-fourth dummy electrode 421b-4, 421b-6 exposed on the sixth surface 6. The first-third dummy electrodes 421b-3, 421b-5 are arranged apart from each other and include a first-third-1 dummy electrode 421b-3 overlapping with the second-third-1 lead portion 422a-3 in the first direction and a first-third-2 dummy electrode 421b-5 overlapping with the second-third-2 lead portion 422a-5 in the first direction. The first-fourth dummy electrodes 421b-4, 421b-6 are arranged apart from each other and can include a first-fourth-1 dummy electrode 321b-4 overlapping with the second-fourth-1 lead portion 422a-4 in the first direction and a first-fourth-2 dummy electrode 421b-6 overlapping with the second-fourth-2 lead portion 422a-6 in the second direction.

[0118] As described above, various embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and this can also be said to belong to the scope of the present invention.

[0119] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the one embodiment presented above does not exclude being implemented in combination with the features of other embodiments. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as an explanation related to the other embodiment as long as there is no explanation contrary to or conflicting with that matter in the other embodiment.

[0120] The terms used in the present disclosure are merely used to explain one embodiment and are not intended to limit the present disclosure. At this time, the singular expression includes the plural expression unless the context clearly indicates otherwise.

Description of Reference Numerals

[0121] 100 Multilayer Electronic Component 110 Body 111 Dielectric Layer 112, 113 Cover Portion 114, 115 Side Margin Portion 121, 122 Internal Electrode Layer 121a, 122a Internal Electrode 121b, 122bDummy Electrode 131, 132 External Electrode 141, 142, 143, 144 Insulating Portion

Claims

1. A body including a dielectric layer, and first and second internal electrode layers alternately arranged in a first direction with the dielectric layer therebetween, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, wherein the first internal electrode layer includes a first internal electrode exposed on the fifth and sixth surfaces and a first dummy electrode disposed apart from the first internal electrode, and the second internal electrode layer includes a second internal electrode exposed on the third and fourth surfaces and a second dummy electrode disposed apart from the second internal electrode, first and second external electrodes respectively disposed on the third and fourth surfaces and connected to the second internal electrode, third and fourth external electrodes respectively disposed on the fifth and sixth surfaces and connected to the first internal electrode, first and second insulating portions respectively disposed on the fifth surface and spaced apart from each other in the second direction with the third external electrode therebetween, third and fourth insulating portions respectively disposed on the sixth surface and spaced apart from each other in the second direction with the fourth external electrode therebetween, wherein the first dummy electrode overlaps with an exposed portion of the second internal electrode in the first direction, and the second dummy electrode overlaps with an exposed portion of the first internal electrode in the first direction. A multilayer electronic component.

2. The multilayer electronic component according to claim 1, wherein the first to fourth insulating portions are connected to at least a part of an exposed portion of the first internal electrode.

3. The multilayer electronic component according to claim 1, wherein the first and second internal electrodes each have a substantially constant size in the second direction and a substantially constant size in the third direction.

4. The multilayer electronic component according to claim 1, wherein regions of the first and second internal electrodes exposed through any one surface of the body each have a substantially constant size in the second direction and a substantially constant size in the third direction.

5. The multilayer electronic component according to claim 2, wherein the first internal electrode is exposed on the fifth and sixth surfaces through a plurality of lead portions and is connected to the third and fourth external electrodes and the first to fourth insulating portions.

6. The multilayer electronic component according to claim 2, wherein the second internal electrode is further exposed on the fifth and sixth surfaces through a plurality of lead portions and is connected to the first to fourth insulating portions.

7. The first internal electrode includes a first main portion and a first lead portion extending from the first main portion. The first lead portion includes a first - 1 lead portion exposed on the fifth surface and at least partially connected to the third external electrode, and a first - 2 lead portion exposed on the sixth surface and at least partially connected to the fourth external electrode. The first dummy electrode includes a first - 1 dummy electrode exposed on the third surface and a first - 2 dummy electrode disposed apart from the first - 1 dummy electrode and exposed on the fourth surface. The second internal electrode includes a second main portion and a second lead portion extending from the second main portion. The second lead portion includes a second - 1 lead portion exposed on the third surface and connected to the first external electrode, and a second - 2 lead portion exposed on the fourth surface and connected to the second external electrode. The second dummy electrode includes a second - 1 dummy electrode exposed on the fifth surface and a second - 2 dummy electrode exposed on the sixth surface. The first - 1 dummy electrode overlaps with the second - 1 lead portion in the first direction, the first - 2 dummy electrode overlaps with the second - 2 lead portion in the first direction, the second - 1 dummy electrode overlaps with the first - 1 lead portion in the first direction, and the second - 2 dummy electrode overlaps with the first - 2 lead portion in the first direction. The multilayer electronic component according to claim 1.

8. At least a part of the first - 1 lead portion is further connected to the first and second insulating portions, and at least a part of the first - 2 lead portion is further connected to the third and fourth insulating portions. The multilayer electronic component according to claim 7.

9. The first - 1 lead portion includes a first - 1 - 1 lead portion disposed apart from each other and connected to the third external electrode, a first - 1 - 2 lead portion connected to the first insulating portion, and a first - 1 - 3 lead portion connected to the second insulating portion. The first - 2 lead portion includes a first - 2 - 1 lead portion disposed apart from each other and connected to the fourth external electrode, a first - 2 - 2 lead portion connected to the third insulating portion, and a first - 2 - 3 lead portion connected to the fourth insulating portion. The second - 1 dummy electrodes are arranged apart from each other, and include a second - 1 - 1 dummy electrode that overlaps with the first - 1 - 1 lead portion in the first direction, a second - 1 - 2 dummy electrode that overlaps with the first - 1 - 2 lead portion in the first direction, and a second - 1 - 3 dummy electrode that overlaps with the first - 1 - 3 lead portion in the first direction. The second - 2 dummy electrodes are arranged apart from each other, and include a second - 2 - 1 dummy electrode that overlaps with the first - 2 - 1 lead portion in the first direction, a second - 2 - 2 dummy electrode that overlaps with the first - 2 - 2 lead portion in the first direction, and a second - 2 - 3 dummy electrode that overlaps with the first - 2 - 3 lead portion in the first direction. The multilayer electronic component according to claim 8.

10. The second lead portion further includes a second - 3 lead portion exposed on the fifth surface and a second - 4 lead portion exposed on the sixth surface. The second - 3 lead portions are arranged apart from each other and include a second - 3 - 1 lead portion connected to the first insulating portion and a second - 3 - 2 lead portion connected to the second insulating portion. The second - 4 lead portions are arranged apart from each other and include a second - 4 - 1 lead portion connected to the third insulating portion and a second - 4 - 2 lead portion connected to the fourth insulating portion. The first dummy electrode further includes a first - 3 dummy electrode exposed on the fifth surface and a first - 4 dummy electrode exposed on the sixth surface. The first - 3 dummy electrodes are arranged apart from each other and include a first - 3 - 1 dummy electrode that overlaps with the second - 3 - 1 lead portion in the first direction and a first - 3 - 2 dummy electrode that overlaps with the second - 3 - 2 lead portion in the first direction. The first - 4 dummy electrodes are arranged apart from each other and include a first - 4 - 1 dummy electrode that overlaps with the second - 4 - 1 lead portion in the first direction and a first - 4 - 2 dummy electrode that overlaps with the second - 4 - 2 lead portion in the second direction. The multilayer electronic component according to claim 8.

11. A main body including a dielectric layer, and first and second internal electrode layers alternately arranged in a first direction with the dielectric layer therebetween, having first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, wherein the first internal electrode layer includes a first internal electrode exposed on the fifth and sixth surfaces and a first dummy electrode arranged at a distance from the first internal electrode, and the second internal electrode layer includes a second internal electrode exposed on the third to sixth surfaces and a second dummy electrode arranged at a distance from the second internal electrode, a first external electrode arranged on the third, fifth and sixth surfaces and connected to the second internal electrode, a second external electrode arranged on the fourth, fifth and sixth surfaces and connected to the second internal electrode, a third external electrode arranged on the fifth surface and connected to the first internal electrode, a fourth external electrode arranged on the sixth surface and connected to the first internal electrode, wherein the first dummy electrode overlaps in the first direction with an exposed portion of the second internal electrode, and the second dummy electrode overlaps in the first direction with an exposed portion of the first internal electrode, a stacked electronic component.

12. The second internal electrode includes a second main portion and a second lead portion extending from the second main portion, the second lead portion further includes a second-3 lead portion exposed on the fifth surface and a second-4 lead portion exposed on the sixth surface, the second-3 lead portions are arranged at a distance from each other and include a second-3-1 lead portion connected to the first external electrode and a second-3-2 lead portion connected to the second external electrode, the second-4 lead portions are arranged at a distance from each other and include a second-4-1 lead portion connected to the first external electrode and a second-4-2 lead portion connected to the second external electrode, The first dummy electrode further includes first to third dummy electrodes exposed on the fifth surface and first to fourth dummy electrodes on the sixth surface. The first to third dummy electrodes are arranged spaced apart from each other, and include a first to third - 1 dummy electrode overlapping the second - 3 - 1 lead portion in the first direction and a first to third - 2 dummy electrode overlapping the second - 3 - 2 lead portion in the first direction. The first to fourth dummy electrodes are arranged spaced apart from each other, and include a first to fourth - 1 dummy electrode overlapping the second - 4 - 1 lead portion in the first direction and a first to fourth - 2 dummy electrode overlapping the second - 4 - 2 lead portion in the second direction. The multilayer electronic component according to claim 11.

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