Laminated type electronic component

Abstract

To provide a laminated type electronic component.SOLUTION: A laminated type electronic component includes: a body which includes a capacity formation part that includes a dielectric layer and an internal electrode alternately arranged with the dielectric layer in a first direction, and cover parts arranged on both surfaces in the first direction of the capacity formation part, and has first and second surfaces facing each other in the first direction, third and fourth surfaces which are connected to the first and second surfaces and face each other in a second direction, and fifth and sixth surfaces which are connected to the first to fourth surfaces and face each other in a third direction; connection electrodes which are arranged on the third and fourth surfaces and are connected to the internal electrode; side margin parts which are arranged on the fifth and sixth surfaces and contain a resin; and external electrodes which are arranged on the connection electrodes and contain conductive metal and a resin.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is mounted on printed circuit boards of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Such a multilayer ceramic capacitor has the advantages of being small in size while ensuring high capacitance and being easy to mount, and thus can be used as a component of various electronic devices. With the miniaturization and high output of various electronic devices such as computers and mobile devices, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] In recent years, the industry's interest in automotive electrical components has been increasing, and for multilayer ceramic capacitors used in automobiles or infotainment systems, high reliability and high strength characteristics are required.

[0005] In the process of printing and laminating internal electrodes on a formed sheet, minute height differences accumulate between the portions where the internal electrodes are not printed and the printed portions, resulting in the formation of steps. In particular, in a general cutting method, which is a prior art having a margin in the width direction, the step in the margin portion in the width direction where the non-printed portions of the internal electrodes are continuously laminated is much more severe than the step in the length direction margin where the printed and non-printed portions of the internal electrodes are alternately laminated. Such steps cause the ends of each sheet to bend and generate stress, thereby leading to defects such as delamination where the layers peel off.

[0006] Therefore, in order to suppress the step in the margin in the width direction of a multilayer ceramic capacitor, by exposing the internal electrodes in the width direction of the main body, a design without a margin in the width direction maximizes the area of the internal electrodes in the width direction to eliminate the step. Moreover, after manufacturing such a chip, in the stage before firing, a method of laminating one or more ceramic green sheets in the width direction on the electrode exposed surface in the width direction of the chip is applied.

[0007] However, when the side margin portion is made of a ceramic material, cracks are likely to occur, and there is a risk of reduced reliability.

Summary of the Invention

Problems to be Solved by the Invention

[0008] One of the various objects of the present invention is to improve the reliability of multilayer electronic components.

[0009] One of the various objects of the present invention is to suppress cracks occurring in the side margin portion of multilayer electronic components.

[0010] However, the object of the present invention is not limited to the above content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Means for Solving the Problems

[0011] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, a capacitance forming portion including internal electrodes alternately arranged with the dielectric layer in a first direction, and cover portions arranged on both surfaces of the capacitance forming portion in the first direction. The multilayer electronic component includes a main body having a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and facing each other in a third direction, a connection electrode arranged on the third and fourth surfaces and connected to the internal electrode, a side margin portion arranged on the fifth and sixth surfaces and containing resin, and an external electrode arranged on the connection electrode and containing a conductive metal and resin. The side margin portion is arranged so as to cover both end portions of the connection electrode in the third direction, and the external electrode can be arranged so as to cover both end portions of the side margin portion in the second direction.

[0012] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, a capacitance forming portion including internal electrodes alternately arranged with the dielectric layer in a first direction, and cover portions arranged on both surfaces of the capacitance forming portion in the first direction. The multilayer electronic component includes a main body having a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and facing each other in a third direction, a connection electrode arranged on the third and fourth surfaces and connected to the internal electrode, a side margin portion arranged on the fifth and sixth surfaces and containing resin, and an external electrode arranged on the connection electrode and containing a conductive metal and resin. The side margin portion can be arranged at a distance from the third and fourth surfaces. [[Effect of the Invention]]

[0013] One of the various effects of the present invention is to improve the reliability of the multilayer electronic component.

[0014] One of the various effects of the present invention is to suppress cracks that may occur in the side margin portion by including resin in the side margin portion.

[0015] However, the diverse and beneficial advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Modes for Carrying Out the Invention

[0017] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to those having average knowledge in the technical field. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation.

[0018] In order to clearly explain the present invention, parts not related to the description are omitted in the drawings, the thickness is enlarged to clearly show various layers and regions, and components having the same function within the scope of the same concept are described using the same reference numerals. Further, throughout the specification, when a component is described as "including", it means that other components can be further included, rather than excluding other components, unless otherwise specified to the contrary.

[0019] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0020] Multilayer electronic component FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. FIG. 2 is a perspective view of the stacked electronic component of FIG. 1 shown excluding the external electrodes. FIG. 3 is a perspective view showing the main body of the stacked electronic component of FIG. 1. FIG. 4 is a cross-sectional view taken along line I-I' of FIG. 1. FIG. 5 is a cross-sectional view taken along line II-II' of FIG. 1. FIG. 6 is a cross-sectional view taken along line III-III' of FIG. 1.

[0021] Hereinafter, with reference to FIGS. 1 to 6, a stacked electronic component according to an embodiment of the present invention will be described in detail.

[0022] A multilayer electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111, a capacitance forming section Ac including internal electrodes 121 and 122 alternately arranged with the dielectric layer in a first direction, and cover sections 112 and 113 arranged on both surfaces of the capacitance forming section in the first direction. It has a main body 110 having a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first to fourth surfaces and facing each other in a third direction, connection electrodes 141 and 142 arranged on the third and fourth surfaces and connected to the internal electrodes, side margin sections 114 and 115 arranged on the fifth and sixth surfaces and containing resin, and external electrodes 131 and 132 arranged on the connection electrodes and containing a conductive metal and resin.

[0023] In the process of printing and laminating internal electrodes on a formed sheet, minute height differences between the unprinted portions and the printed portions of the internal electrodes accumulate, resulting in the occurrence of steps. In particular, in a general cutting method, which is a prior art having a margin in the width direction, the step in the width direction margin where the unprinted portions of the internal electrodes are continuously laminated is much more severe than the step in the length direction margin where the printed portions and non-printed portions of the internal electrodes are alternately laminated. Such steps cause the ends of each sheet to bend and generate stress, thereby causing defects such as delamination where the layers peel off.

[0024] Therefore, in order to suppress the step in the width direction margin of a multilayer ceramic capacitor, by exposing the internal electrodes in the width direction of the main body, a design without a width direction margin maximizes the area of the internal electrodes in the width direction to eliminate the step. After manufacturing such a chip, a method of laminating one or more ceramic green sheets in the width direction on the electrode exposed surface in the width direction of the chip is applied at a stage prior to firing.

[0025] However, when the side margin section is a ceramic material, cracks are likely to occur, and there is a risk of reduced reliability.

[0026] The dielectric layer has piezoelectricity and can be expanded in the stacking direction when a voltage is applied. Further, as the voltage applied to the multilayer electronic component increases, the characteristic of expanding in the stacking direction can become greater. Due to the mechanical stress generated by such a characteristic of the dielectric layer expanding, cracks may occur, and such cracks are referred to as electrostriction cracks. When the side margin portion is a ceramic material, a strong stress is applied to the side margin portion, and there is a possibility that a starting point of an electrostriction crack is generated. In particular, for a multilayer ceramic capacitor for high voltage applications that requires high voltage reliability, in order to ensure reliability, the dielectric layer is formed thick, so there is a risk that breakdown due to electrostriction cracks occurs at a voltage lower than the expected voltage due to forming the dielectric layer thick.

[0027] According to an embodiment of the present invention, by disposing side margin portions 114 and 115 containing resin on the fifth and sixth surfaces of the main body 110, cracks that may occur in the side margin portions 114 and 115 can be suppressed.

[0028] In one embodiment, the side margin portions 114 and 115 are disposed so as to cover both ends of the connecting electrodes 141 and 142 in the third direction, and the external electrodes 131 and 132 can be disposed so as to cover both ends of the side margin portions 114 and 115 in the second direction.

[0029] In one embodiment, the side margin portions 114'' and 115'' can be disposed at a distance from the third and fourth surfaces.

[0030] Hereinafter, each configuration included in the multilayer electronic component 100 according to an embodiment of the present invention will be described.

[0031] The main body 110 has a dielectric layer 111 and internal electrodes 121 and 122 alternately stacked.

[0032] The specific shape of the main body 110 is not particularly limited. As shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 can have a substantially hexahedron shape, although it does not have a hexahedron shape with perfect straight lines.

[0033] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first and second surfaces 1 and 2 and also connected to the third and fourth surfaces 3 and 4 and facing each other in a third direction.

[0034] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers does not particularly need to be limited and can be determined in consideration of the size of the multilayer electronic component. For example, 400 or more dielectric layers can be stacked to form the main body.

[0035] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to prepare a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, as the ceramic powder, barium titanate-based (BaTiO3) powder, normal dielectric powder based on CaZrO3, etc. can be used. As a more specific example, the barium titanate-based (BaTiO3) powder includes BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Cax )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3(0 < y < 1) can be one or more of them. The paraelectric powder based on CaZrO3 is (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x < 1, 0 < y < 1).

[0036] Therefore, the dielectric layer 111 can include one or more of BaTiO3, (Ba 1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3(0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x < 1, 0 < y < 1).

[0037] The main body 110 can include a capacitance forming portion Ac that is disposed inside the main body 110 and in which a capacitance is formed by including a first internal electrode 121 and a second internal electrode 122 that are disposed to face each other with the dielectric layer 111 interposed therebetween, and cover portions 112 and 113 formed on the upper and lower portions of the capacitance forming portion Ac in the first direction.

[0038] The capacitance forming portion Ac is a portion that contributes to the formation of the capacitance of the capacitor and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0039] The internal electrodes 121 and 122 can be alternately arranged with the dielectric layer 111.

[0040] The internal electrodes 121 and 122 can include the first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0041] Referring to FIG. 3, the first internal electrode 121 can be exposed through the third surface 3 at a distance from the fourth surface 4, and the second internal electrode 122 can be exposed through the fourth surface 4 at a distance from the third surface 3. Also, the first internal electrode 121 can be exposed through the third, fifth, and sixth surfaces 3, 5, and 6, and the second internal electrode 122 can be exposed through the fourth, fifth, and sixth surfaces 4, 5, and 6.

[0042] At this time, the first and second internal electrodes 121 and 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0043] The internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0044] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 do not need to be particularly limited.

[0045] However, the effect of suppressing cracks in the side margin portion according to the present invention can be more remarkable in a high-voltage multilayer ceramic capacitor, and the average thickness td of the dielectric layer 111 in a general high-voltage model can be 4 μm to 20 μm.

[0046] The average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited, but can be, for example, 0.4 μm to 2 μm.

[0047] In addition, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be arbitrarily set according to desired characteristics and applications. For example, in order to achieve miniaturization and high capacitance, in electronic components for small-sized IT, the average thickness td of the dielectric layer 111 can be 0.4 μm or less, and the average thickness te of the internal electrodes 121 and 122 can be 0.4 μm or less.

[0048] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 respectively represent the sizes of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average thickness td of the dielectric layer 111 can be measured by measuring the thicknesses at a number of points of one dielectric layer 111, for example, 30 points equally spaced in the second direction, and then measuring the average value. Also, the average thickness te of the internal electrodes 121 and 122 can be measured by measuring the thicknesses at a number of points of one internal electrode 121 or 122, for example, 30 points equally spaced in the second direction, and then measuring the average value. The 30 equally spaced points can be specified in the capacitance forming portion Ac. On the other hand, after such average value measurements are performed on 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively, and then the average value is measured, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be more generalized.

[0049] The cover portions 112 and 113 can be disposed on both sides of the capacitance forming portion Ac in the first direction.

[0050] The cover portions 112 and 113 can include a first cover portion 112 disposed above the capacitance forming portion Ac in the first direction and a second cover portion 113 disposed below the capacitance forming portion Ac in the first direction. The first cover portion 112 can be referred to as the upper cover portion, and the second cover portion 113 can be referred to as the lower cover portion.

[0051] The first cover portion 112 and the second cover portion 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can basically play a role of preventing damage to the internal electrodes due to physical or chemical stress.

[0052] The first cover portion 112 and the second cover portion 113 do not include internal electrodes and can include the same material as the dielectric layer 111.

[0053] That is, the upper cover portion 112 and the lower cover portion 113 can include a ceramic material, for example, can include a barium titanate (BaTiO3)-based ceramic material.

[0054] On the other hand, the thickness of the cover portions 112, 113 does not need to be particularly limited. However, since the effect of suppressing cracks in the side margin portion according to the present invention can be more remarkable in a multilayer ceramic capacitor for high voltage, the thickness tc of the cover portions 112, 113 can be 20 to 200 μm.

[0055] The average thickness tc of the cover portions 112, 113 means the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover portions 112, 113 measured at five equally spaced points above or below the capacitance forming portion Ac.

[0056] The side margin portions 114, 115 are disposed on the fifth and sixth surfaces of the main body 110 and can include a resin. Thereby, cracks that may occur in the side margin portions 114, 115 can be suppressed.

[0057] In one embodiment, the side margin portions 114, 115 can be disposed so as to cover both surfaces in the third direction of the capacitance forming portion Ac and the cover portions 112, 113. The side margin portions 114, 115 can include a first side margin portion 114 disposed on one surface in the third direction of the capacitance forming portion Ac and the cover portions 112, 113, and a second side margin portion 115 disposed on the other surface in the third direction.

[0058] The side margin portions 114 and 115 can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress. Also, since the side margin portions 114 and 115 are formed of resin, cracks that may occur in the side margin portions 114 and 115 can be suppressed.

[0059] On the other hand, the method of forming the side margin portions 114 and 115 is not particularly limited. For example, a ceramic green sheet and a ceramic green sheet printed with an internal electrode pattern are laminated and pressed, the main body 110 is formed through a sintering process, and then, after forming the connection electrodes 141 and 142 on both surfaces of the main body 110 in the second direction, a resin liquid phase is applied to both surfaces of the main body 110 in the third direction, or a solid-phase resin is joined to form the side margin portions 114 and 115. Then, the external electrodes 131 and 132 can be formed by applying an external electrode paste containing a conductive metal and a resin.

[0060] Referring to FIG. 7, an example of forming the side margin portion using a solid-phase resin will be described in more detail. After preparing a sheet 115a made of a solid-phase resin on a support base 300, the sixth surface 6 of the main body 110 on which the connection electrodes 141 and 142 are formed is pressed against the sheet 115a made of a solid-phase resin so that the sheet 115a adheres to the sixth surface 6 of the main body 110. Then, when the main body 110 is further lifted, the second side margin portion 115 can be formed on the sixth surface 6 of the main body 110. Then, by repeating the same process on the fifth surface of the main body 110, the first side margin portion 114 can be formed.

[0061] According to an embodiment of the present invention, since the side margin portions 114 and 115 contain resin, it is preferable to form the side margin portions 114 and 115 after the sintering process of the main body 110 and the firing process of the connection electrodes 141 and 142. Also, since the external electrodes 131 and 132 contain a conductive metal and a resin, it is preferable to form them by performing a curing heat treatment on the resin without a separate firing process.

[0062] In one embodiment, the resin contained in the side margin portions 114 and 115 can be one or more of an epoxy resin, a silicone resin, a fluororesin, an acrylic resin, and ethyl cellulose.

[0063] In one embodiment, the resin contained in the side margin portions 114 and 115 can be of the same type as the resin contained in the external electrodes. Thereby, the bonding force between the external electrodes 131 and 132 and the side margin portions 114 and 115 can be improved.

[0064] Also, the side margin portions 114 and 115 can consist essentially of resin.

[0065] In one embodiment, the side margin portions 114 and 115 can be arranged to be in contact with the internal electrodes 121 and 122 on the fifth and sixth surfaces 5 and 6.

[0066] Referring to FIG. 6, the average width Wm of the side margin portions 114 and 115 in the third direction does not need to be particularly limited. For example, Wm can be 50 μm or less, and for miniaturization and high capacitance, Wm can be 20 μm or less. Here, the width of the side margin portions 114 and 115 in the third direction can mean the size of the side margin portions 114 and 115 in the third direction.

[0067] The average width Wm of the side margin portions 114 and 115 in the third direction can be measured in the cross sections in the second and third directions cut at the center of the main body in the first direction. After measuring the sizes of the first side margin portion 114 in the third direction at five points having equal intervals in the second direction and averaging them, the average value can be taken as the average width Wm of the first side margin portion 114 in the third direction.

[0068] On one hand, the widths of the side margin portions 114 and 115 for each position in the first direction are substantially the same, and the deviation of the width can be within 5%. This is due to the fact that a sheet 115a made of a solid-phase resin is adhered to the side surface of the main body 110 to form the side margin portions 114 and 115.

[0069] The connection electrodes 141 and 142 can be arranged on the third surface 3 and the fourth surface 4 of the main body 110.

[0070] The connection electrodes 141 and 142 include a first connection electrode 141 arranged on the third surface of the main body 110 and a second connection electrode 142 arranged on the fourth surface of the main body 110. The internal electrodes 121 and 122 include a first internal electrode 121 in contact with the first connection electrode 141 and a second internal electrode 122 in contact with the second connection electrode 142. Both end portions of the first and second internal electrodes 121 and 122 in the third direction can be in contact with the side margin portions 114 and 115.

[0071] The connection electrodes 141 and 142 can be formed using any material as long as it has electrical conductivity such as metal. A specific material can be determined considering electrical characteristics, structural stability, etc.

[0072] In one embodiment, the connection electrodes 141 and 142 can include a conductive metal and glass. That is, the connection electrodes 141 and 142 can be fired electrodes including a conductive metal and glass. Thereby, the bonding force with the main body 110 can be improved, and the electrical connectivity with the external electrodes 131 and 132 can be improved.

[0073] For example, the connection electrodes 141 and 142 can be formed after dipping the main body in a paste containing a conductive metal and glass and then undergoing a firing process. Or, it can be formed after pressing a sheet containing a conductive metal and glass onto the main body and then undergoing a firing process.

[0074] As the conductive metal contained in the connection electrodes 141 and 142, a material with excellent electrical conductivity can be used, and it is not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0075] However, the connection electrodes 141 and 142 do not necessarily have to be sintered electrodes. In one embodiment, the connection electrodes 141 and 142 can be plating layers.

[0076] Also, the connection electrodes 141 and 142 may be formed by a sputtering method, an atomic layer deposition process, or the like.

[0077] Referring to FIG. 6, the average thickness ta of the connection electrodes 141 and 142 does not need to be particularly limited. For example, the average thickness ta of the connection electrodes 141 and 142 can be 5 to 100 μm.

[0078] The average thickness ta of the connection electrodes 141 and 142 can be measured in the cross-sections in the second and third directions cut at the center in the first direction of the main body. After measuring the sizes in the second direction of the first connection electrode 141 at five points having equal intervals in the third direction and averaging the values, the average value can be taken as the average thickness of the first connection electrode 141.

[0079] The external electrodes 131 and 132 are disposed on the connection electrodes 141 and 142 and can contain a conductive metal and a resin.

[0080] The conductive metal contained in the external electrodes 131 and 132 does not need to be particularly limited. For example, it can contain Cu, Ni, Sn, Pd, Pt, Au, Ag, Pb, and / or an alloy containing these, and more preferably, it can contain one or more of Cu, Ag, Sn, and alloys thereof.

[0081] When mounting the electronic component on the substrate, the external electrodes 131 and 132 can prevent cracks from occurring by absorbing the tensile stress generated in a mechanical or thermal environment, and can play a role in protecting the multilayer ceramic capacitor from the bending impact of the substrate.

[0082] The resin contained in the external electrodes 131 and 132 can include a thermosetting resin having electrical insulation properties.

[0083] At this time, the thermosetting resin can be, for example, an epoxy resin, and the present invention is not limited thereto. For example, it can be a resin having a small molecular weight and being liquid at room temperature among bisphenol A resin, glycol epoxy resin, novolak epoxy resin, or derivatives thereof.

[0084] Also, the resin contained in the external electrodes 131 and 132 can be one or more of a silicone resin, a fluororesin, an acrylic resin, and ethyl cellulose.

[0085] On the other hand, the external electrodes 131 and 132 can have a multilayer structure.

[0086] For example, the external electrodes 131 and 132 can be disposed on the connection electrodes 141 and 142, and can include a conductive resin layer containing a conductive metal and a resin, and a plating layer formed on the conductive resin layer.

[0087] The plating layer plays a role in improving the mounting characteristics. The type of the plating layer is not particularly limited, and it can be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, and can be formed of a plurality of layers.

[0088] As a more specific example of the plating layer, the plating layer can be a Ni plating layer or a Sn plating layer, and may be in a form where a Ni plating layer and a Sn plating layer are sequentially formed on the conductive resin layer, or may be in a form where a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Further, the plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0089] Referring to FIG. 6, the average thickness tb of the external electrodes 131 and 132 does not need to be particularly limited. For example, the average thickness tb of the external electrodes 131 and 132 can be 20 to 150 μm.

[0090] The average thickness tb of the external electrodes 131 and 132 can be measured in the cross-sections in the second and third directions cut at the center in the first direction of the main body. After measuring the sizes in the second direction of the first external electrode 131 at five equally spaced points in the third direction and averaging them, the average value can be taken as the average thickness of the first external electrode 131.

[0091] Referring to FIGS. 2 and 6, in one embodiment, the side margin portions are arranged to cover both ends in the third direction of the connection electrodes 141 and 142, and the external electrodes 131 and 132 can be arranged to cover both ends in the second direction of the side margin portions 114 and 115.

[0092] In one embodiment, the external electrodes 131 and 132 cover both ends in the second direction of the side margin portions 114 and 115 and can extend and be arranged on a part of the side margin portions 114 and 115 on the fifth and sixth surfaces and a part of the first and second surfaces 1 and 2.

[0093] In one embodiment, the side margin portions 114 and 115 can be disposed on the fifth and sixth surfaces and extend and be disposed on a part of the first and second surfaces 1 and 2. According to one embodiment of the present invention, after forming the connection electrodes 141 and 142, the side margin portions 114 and 115 are formed, and then the external electrodes 131 and 132 are formed. Therefore, the external electrodes 131 and 132 can be disposed on the side margin portions 114 and 115 on the first and second surfaces.

[0094] In one embodiment, referring to FIG. 8, the connection electrodes 141' and 142' can extend and be disposed on a part of the fifth and sixth surfaces of the main body. However, the first connection electrode 141' extends away from the second internal electrode 122 exposed on the fifth and sixth surfaces of the main body, and the second connection electrode 142' can extend away from the first internal electrode 121 exposed on the fifth and sixth surfaces of the main body.

[0095] According to one embodiment of the present invention, since the side margin portions 114' and 115' are formed after forming the connection electrodes 141' and 142', the side margin portions 114' and 115' can be disposed on the connection electrodes 141' and 142' on the fifth and sixth surfaces.

[0096] In one embodiment, the internal electrodes 121 and 122 include the first and second internal electrodes. The first internal electrode 121 is exposed on the third surface, separated from the fourth surface, and exposed on a part of the fifth and sixth surfaces. The second internal electrode 122 is exposed on the fourth surface, separated from the third surface, and exposed on a part of the fifth and sixth surfaces. The connection electrodes 141' and 142' include the first and second connection electrodes. The first connection electrode 141' is disposed on the third surface and extends and is disposed on a part of the region where the second internal electrode 122 is not exposed on the fifth and sixth surfaces. The second connection electrode 142' is disposed on the fourth surface and can extend and be disposed on a part of the region where the first internal electrode 121 is not exposed on the fifth and sixth surfaces.

[0097] Also, as shown in FIG. 9, the side margin portions 114'' and 115'' can be arranged at a distance from the third and fourth surfaces. However, the side margin portions 114'' and 115'' are arranged at a distance from the third and fourth surfaces, and can be arranged so as to cover the regions where all the first and second internal electrodes are exposed among the fifth and sixth surfaces. At this time, the connection electrodes 141'' and 142'' extend and are arranged on a part of the fifth and sixth surfaces of the main body. The first connection electrode 141'' extends at a distance from the second internal electrode 122 exposed on the fifth and sixth surfaces of the main body, and the second connection electrode 142'' can extend at a distance from the first internal electrode 121 exposed on the fifth and sixth surfaces of the main body.

[0098] Also, a part of the external electrodes 131 and 132 can be in contact with the fifth and sixth surfaces and arranged so as to cover the third-direction ends of the side margin portions 114'' and 115''. However, the first connection electrode 141'' extends at a distance from the second internal electrode 122 exposed on the fifth and sixth surfaces of the main body, and the second connection electrode 142'' can extend at a distance from the first internal electrode 121 exposed on the fifth and sixth surfaces of the main body.

[0099] In one embodiment, the internal electrodes 121 and 122 include the first and second internal electrodes. The first internal electrode 121 is exposed on the third surface, separated from the fourth surface, and exposed on a part of the fifth and sixth surfaces. The second internal electrode 122 is exposed on the fourth surface, separated from the third surface, and exposed on a part of the fifth and sixth surfaces. The connection electrodes 141'' and 142'' include the first and second connection electrodes. The first connection electrode 141'' is arranged on the third surface and extends and is arranged on a part of the region where the second internal electrode 122 is not exposed on the fifth and sixth surfaces. The second connection electrode 142'' is arranged on the fourth surface and can extend and be arranged on a part of the region where the first internal electrode 121 is not exposed on the fifth and sixth surfaces.

[0100] In one embodiment, the side margin portions 114'' and 115'' can be arranged at a distance from the first and second connection electrodes 141'' and 142''.

[0101] In one embodiment, the external electrodes 131 and 132 can be arranged so as to cover the space where the side margin portions 114'' and 115'' and the first and second connection electrodes 141'' and 142'' are separated from each other.

[0102] In one embodiment, the side margin portions 114'' and 115'' can be arranged so as to cover the ends of the first and second connection electrodes 141'' and 142'' on the fifth and sixth surfaces.

[0103] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change can be made by those having ordinary knowledge in the technical field within the scope not departing from the technical idea of the present invention described in the claims, and this can also be said to belong to the scope of the present invention.

[0104] In addition, the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude the case where it is implemented in combination with the features of other embodiments. For example, even if a matter described in a specific one embodiment is not described in other embodiments, it can be interpreted as an explanation related to other embodiments as long as there is no explanation contrary to that matter or no explanation conflicting with that matter in other embodiments.

[0105] The terms used in the present invention are only described for the purpose of explaining an example and are not intended to limit the present invention. At this time, the singular expression includes the plural unless the context clearly indicates a different meaning.

Explanation of Reference Numerals

[0106] 100 Multilayer electronic component 110 Body 111 Dielectric layer 112, 113 Cover portion 121 and 122 Internal electrodes 114 and 115 Side margin parts 141 and 142 Connecting electrodes 131 and 132 External electrodes

Claims

1. A capacitor forming portion including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, and cover portions arranged on both surfaces of the capacitor forming portion in the first direction, the main body having first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, a connection electrode arranged on the third and fourth surfaces and connected to the internal electrode, a side margin portion arranged on the fifth and sixth surfaces and containing resin, and an external electrode arranged on the connection electrode and containing a conductive metal and resin, wherein the side margin portion is arranged to cover both end portions of the connection electrode in the third direction, and the external electrode covers both end portions of the side margin portion in the second direction, a multilayer electronic component.

2. The multilayer electronic component according to Claim 1, wherein the connection electrode contains a conductive metal and glass.

3. The multilayer electronic component according to Claim 1, wherein the connection electrode is a plating layer.

4. The multilayer electronic component according to Claim 1, wherein the resin contained in the side margin portion is one or more of an epoxy resin, a silicone resin, a fluororesin, an acrylic resin, and ethyl cellulose.

5. The multilayer electronic component according to Claim 1, wherein the resin contained in the side margin portion is of the same type as the resin contained in the external electrode.

6. The multilayer electronic component according to Claim 1, wherein the external electrode extends and is arranged on a part of the side margin portion on the fifth and sixth surfaces and a part of the first and second surfaces.

7. The side margin portion extends to a part of the first and second surfaces, and the multilayer electronic component according to Claim 6, wherein the external electrode is arranged on the side margin portion on the first and second surfaces.

8. The multilayer electronic component according to Claim 1, wherein the side margin portion is arranged to be in contact with the internal electrode on the fifth and sixth surfaces.

9. The multilayer electronic component according to Claim 1, wherein the side margin portion is arranged to cover both surfaces of the capacitor forming portion and the cover portion in the third direction.

10. The connection electrode extends and is arranged on a part of the fifth and sixth surfaces, and the multilayer electronic component according to Claim 1, wherein the side margin portion is arranged on the connection electrode on the fifth and sixth surfaces.

11. A capacitor forming portion including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, and cover portions arranged on both surfaces of the capacitor forming portion in the first direction, the body having first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, A connection electrode disposed on the third and fourth surfaces and connected to the internal electrode, A side margin portion disposed on the fifth and sixth surfaces and containing resin, An external electrode disposed on the connection electrode and containing a conductive metal and resin, The side margin portion is disposed at a distance from the third and fourth surfaces, and is a multilayer electronic component.

12. The internal electrode includes first and second internal electrodes, The first internal electrode is exposed on the third surface, separated from the fourth surface, and exposed on a part of the fifth and sixth surfaces, The second internal electrode is exposed on the fourth surface, separated from the third surface, and exposed on a part of the fifth and sixth surfaces, The connection electrode includes first and second connection electrodes, The first connection electrode is disposed on the third surface and extends and is disposed on a part of the region where the second internal electrode is not exposed on the fifth and sixth surfaces, The second connection electrode is disposed on the fourth surface and extends and is disposed on a part of the region where the first internal electrode is not exposed on the fifth and sixth surfaces, according to the multilayer electronic component described in claim 11.

13. The side margin portion is disposed at a distance from the first and second connection electrodes, according to the multilayer electronic component described in claim 12.

14. The external electrode is disposed so as to cover the space where the side margin portion and the first and second connection electrodes are separated, according to the multilayer electronic component described in claim 13.

15. The side margin portion is disposed so as to cover the ends of the first and second connection electrodes on the fifth and sixth surfaces, according to the multilayer electronic component described in claim 12.

16. The connection electrode contains a conductive metal and glass, according to the multilayer electronic component described in claim 11.

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