Maintenance method

Abstract

To provide a laser device configured so that a bypass device is attachable thereto and detachable therefrom.SOLUTION: There is provided a bypass device 60 that is attachable to and detachable from a laser device outputting pulse laser light, and provided in the laser device 2A to form a bypass optical path bypassing a pulse width stretching device 50 extending a pulse width of incident pulse laser light, and comprises: a plurality of optical elements forming the bypass optical path; and a housing 65 housing the plurality of optical elements. Therein the plurality of optical elements each include: a first highly reflective mirror 61 reflecting the pulse laser light entering the pulse width stretching device outward from the pulse width stretching device to lead it to the bypass optical path; and a second highly reflective mirror 64 reflecting the pulse laser light reflected by the first highly reflective mirror and made incident through the bypass optical path to cause it to return to an emission optical path of the pulse width stretching device.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a bypass device, a laser device, and a method for manufacturing an electronic device.

Background Art

[0002] In recent years, in semiconductor exposure apparatuses, as semiconductor integrated circuits are miniaturized and highly integrated, improvement in resolution has been demanded. For this reason, the wavelength of light emitted from an exposure light source has been shortened. For example, as a gas laser device for exposure, a KrF excimer laser device that outputs laser light with a wavelength of about 248 nm and an ArF excimer laser device that outputs laser light with a wavelength of about 193 nm are used.

[0003] The spectral linewidth of the spontaneous emission light of a KrF excimer laser device and an ArF excimer laser device is as wide as 350 to 400 pm. Therefore, when a projection lens is configured with a material that transmits ultraviolet light such as KrF and ArF laser light, chromatic aberration may occur. As a result, the resolution may decrease. Therefore, it is necessary to narrow the spectral linewidth of the laser light output from the gas laser device to such an extent that chromatic aberration can be ignored. For this reason, a narrowbanding module (Line Narrowing Module: LNM) including a narrowbanding element (etalon, grating, etc.) may be provided in the laser resonator of the gas laser device in order to narrow the spectral linewidth. Hereinafter, a gas laser device whose spectral linewidth is narrowed is referred to as a narrowbanded gas laser device.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

[0005] A bypass device according to one aspect of the present disclosure is detachable from a laser device that outputs pulsed laser light, is provided within the laser device, and forms a bypass optical path that bypasses a pulse width extension device that extends the pulse width of the incident pulsed laser light. The bypass device includes a plurality of optical elements that form the bypass optical path and a housing that houses the plurality of optical elements. The plurality of optical elements include a first highly reflective mirror that reflects the pulsed laser light incident on the pulse width extension device outward of the pulse width extension device and guides it to the bypass optical path, and a second highly reflective mirror that reflects the pulsed laser light reflected by the first highly reflective mirror and incident through the bypass optical path and returns it to the output optical path of the pulse width extension device.

[0006] A laser device according to one aspect of the present disclosure includes a laser oscillator that outputs pulsed laser light and a pulse width extension device that extends the pulse width of the incident pulsed laser light, and is a laser device to which a bypass device that forms a bypass optical path for bypassing the pulse width extension device is detachably attached. The bypass device includes a plurality of optical elements that form the bypass optical path and a housing that houses the plurality of optical elements. The plurality of optical elements include a first highly reflective mirror that reflects the pulsed laser light incident on the pulse width extension device outward of the pulse width extension device and guides it to the bypass optical path, and a second highly reflective mirror that reflects the pulsed laser light reflected by the first highly reflective mirror and incident through the bypass optical path and returns it to the output optical path of the pulse width extension device.

[0007] A method for manufacturing an electronic device according to one aspect of the present disclosure includes a laser oscillator that outputs pulsed laser light, and a pulse width extension device that extends the pulse width of the incident pulsed laser light. Pulsed laser light output from a laser device to which a bypass device for forming a bypass optical path bypassing the pulse width extension device is detachably attached is output to an exposure device, and in order to manufacture an electronic device, the method includes exposing a photosensitive substrate with the pulsed laser light in the exposure device. The bypass device includes a plurality of optical elements that form a bypass optical path, and a housing that houses the plurality of optical elements. The plurality of optical elements include a first highly reflective mirror that guides the pulsed laser light to the bypass optical path by reflecting the pulsed laser light incident on the pulse width extension device outward of the pulse width extension device, and a second highly reflective mirror that reflects the pulsed laser light incident through the bypass optical path by reflecting the pulsed laser light reflected by the first highly reflective mirror, and returns the pulsed laser light to the emission optical path of the pulse width extension device.

Brief Description of the Drawings

[0008] Some embodiments of the present disclosure will be described below by way of example only with reference to the accompanying drawings.

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

[0009] <Content> 1. Comparative Example 1.1 Configuration 1.2 Operation 1.3 Problem 2. First Embodiment 2.1 Configuration 2.2 Operation 2.3 Effect 3. Second Embodiment 3.1 Configuration 3.2 Operation 3.3 Effect 4. Third Embodiment 4.1 Configuration 4.2 Operation 4.3 Effect 5. Modification Examples of Bypass Device 5.1 First Modification Example 5.2 Second Modification Example 5.3 Other Modification Examples 6. Manufacturing Method of Electronic Device

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments described below show some examples of the present disclosure and do not limit the content of the present disclosure. In addition, not all of the configurations and operations described in each embodiment are essential as the configurations and operations of the present disclosure. The same reference numerals are assigned to the same components, and duplicate descriptions are omitted.

[0011] 1. Comparative Example 1.1 Configuration FIG. 1 schematically shows a configuration example of a laser device 2 according to a comparative example. The comparative example of the present disclosure is a form recognized by the applicant as being known only to the applicant and is not a publicly known example recognized by the applicant.

[0012] In FIG. 1, the height direction of the laser device 2 is the V-axis direction, the length direction is the Z-axis direction, and the depth direction is the H-axis direction. The V-axis direction may be parallel to the gravitational direction, and the direction opposite to the gravitational direction is the “+V-axis direction”. Also, the emission direction of the pulsed laser light emitted from the laser device 2 is the “+Z-axis direction”. Further, the direction toward the front of the paper surface of FIG. 1 is the “+H-axis direction”.

[0013] The laser device 2 includes a master oscillator (MO) 10, an MO beam steering unit 20, a power oscillator (PO) 30, a PO beam steering unit 40, and an optical pulse stretcher (OPS) 50.

[0014] The master oscillator 10 includes a narrowbanding module (LNM) 11, a chamber 14, and an output coupler (OC) 17.

[0015] The LNM 11 includes a prism beam expander 12 and a grating 13 for narrowing the spectral linewidth. The prism beam expander 12 and the grating 13 are retrofitted so that the incident angle and the diffraction angle coincide.

[0016] The output coupler 17 is a reflection mirror with a reflectance in the range of 40% to 60%. The output coupler 17 and the LNM 11 are arranged to form an optical resonator.

[0017] The chamber 14 is arranged on the optical path of the optical resonator. The chamber 14 includes a pair of discharge electrodes 15a, 15b and two windows 16a, 16b through which the pulsed laser light passes. The chamber 14 houses an excimer laser gas inside. The excimer laser gas may include, for example, Ar gas or Kr gas as a rare gas, F2 gas as a halogen gas, and Ne gas as a buffer gas.

[0018] The MO beam steering unit 20 includes a high reflection mirror 21a and a high reflection mirror 21b. The high reflection mirror 21a and the high reflection mirror 21b are arranged such that the pulsed laser light output from the master oscillator 10 is incident on the power oscillator 30. The high reflection mirror in the present disclosure is, for example, a plane mirror in which a high reflection film is formed on the surface of a substrate formed of synthetic quartz or calcium fluoride (CaF2). The high reflection film is a dielectric multilayer film, for example, a film containing fluoride.

[0019] The power oscillator 30 includes a rear mirror 31, a chamber 32, and an output coupler 35. The rear mirror 31 and the output coupler 35 are arranged to form an optical resonator.

[0020] Chamber 32 is disposed on the optical path of the optical resonator. Chamber 32 may have the same configuration as chamber 14 of master oscillator 10. That is, chamber 32 includes a pair of discharge electrodes 33a, 33b and two windows 34a, 34b through which pulsed laser light passes. Chamber 32 houses an excimer laser gas therein.

[0021] Rear mirror 31 is a reflection mirror with a reflectivity in the range of 50% to 90%. Output coupling mirror 35 is a reflection mirror with a reflectivity in the range of 10% to 30%.

[0022] PO beam steering unit 40 includes a high reflection mirror 40a and a high reflection mirror 40b. High reflection mirror 40a and high reflection mirror 40b are arranged such that the pulsed laser light output from power oscillator 30 is incident on OPS50.

[0023] OPS50 includes a beam splitter 52 and four concave mirrors 54a to 54d. Beam splitter 52 is disposed on the optical path of the pulsed laser light output from PO beam steering unit 40. Beam splitter 52 is a reflection mirror that transmits a part of the incident pulsed laser light and reflects the other pulsed laser light. The reflectivity of beam splitter 52 is preferably in the range of 40% to 70%, and more preferably about 60%. Beam splitter 52 outputs the pulsed laser light transmitted through beam splitter 52 from laser device 2.

[0024] The four concave mirrors 54a to 54d constitute a delay optical path 56 for the pulsed laser light reflected from the first surface of beam splitter 52. The pulsed laser light reflected from the first surface of beam splitter 52 is reflected by the four concave mirrors 54a to 54d and arranged such that the beam is imaged again by beam splitter 52.

[0025] The four concave mirrors 54a to 54d may be concave mirrors having substantially the same focal length. The focal length f of each of the concave mirrors 54a to 54d may correspond to, for example, the distance from the beam splitter 52 to the concave mirror 54a.

[0026] The concave mirror 54a and the concave mirror 54b are arranged such that the pulsed laser light reflected by the first surface of the beam splitter 52 is reflected by the concave mirror 54a and then incident on the concave mirror 54b. The concave mirror 54a and the concave mirror 54b are arranged such that the pulsed laser light reflected by the first surface of the beam splitter 52 forms an image of the same magnification (1:1) as the first image on the first surface of the beam splitter 52.

[0027] The concave mirror 54c and the concave mirror 54d are arranged such that the pulsed laser light reflected by the concave mirror 54b is reflected by the concave mirror 54c and then incident on the concave mirror 54d. Further, the concave mirror 54d is arranged such that the pulsed laser light reflected by the concave mirror 54d is incident on the second surface on the opposite side of the first surface of the beam splitter 52. The concave mirror 54c and the concave mirror 54d are arranged such that the first image forms an image of 1:1 as the second image on the second surface of the beam splitter 52.

[0028] Note that the OPS 50 may include a beam splitter and two or more highly reflective mirrors.

[0029] 1.2 Operation When a discharge occurs in the chamber 14 of the master oscillator 10, the laser gas is excited, and pulsed laser light that has been narrowed by the optical resonator composed of the output coupling mirror 17 and the LNM 11 is output from the output coupling mirror 17. This pulsed laser light is incident as seed light on the rear mirror 31 of the power oscillator 30 by the MO beam steering unit 20.

[0030] Synchronously with the timing when the seed light transmitted through the rear mirror 31 is incident, a discharge occurs in the chamber 32. As a result, the laser gas is excited, the seed light is amplified by a Fabry - Perot type optical resonator composed of the output coupling mirror 35 and the rear mirror 31, and the amplified pulsed laser light is output from the output coupling mirror 35. The pulsed laser light output from the output coupling mirror 35 is incident on the OPS50 via the PO beam steering unit 40.

[0031] Part of the pulsed laser light incident on the OPS50 is transmitted through the beam splitter 52 and output, and part is reflected by the beam splitter 52. The pulsed laser light reflected by the beam splitter 52 circulates through the delay optical path 56 composed of the first to fourth concave mirrors 54a - 54d and is incident on the beam splitter 52 again. Then, part of the pulsed laser light incident on the beam splitter 52 is reflected and output from the OPS50. The pulsed laser light transmitted through the beam splitter 52 circulates through the delay optical path 56 again.

[0032] In this way, by repeatedly circulating the pulsed laser light through the delay optical path 56, pulsed laser light of 0 - round light, 1 - round light, 2 - round light, 3 - round light... is output from the OPS50. The light intensity of the pulsed laser light output from the OPS50 decreases as the number of circulations of the delay optical path 56 increases.

[0033] The pulsed laser light after the 1 - round light is delayed by an integer multiple of the delay time determined by the optical path length of the delay optical path 56 with respect to the pulsed laser light of the 0 - round light and is synthesized and output respectively. That is, the pulse waveforms of the pulsed laser light after the 1 - round light are sequentially superimposed on the pulse waveform of the pulsed laser light of the 0 - round light while being delayed by the delay time respectively. In this way, the pulse width of the pulsed laser light is extended by the OPS50.

[0034] By extending the pulse width of the pulsed laser light by OPS50, the coherence decreases. This suppresses the generation of speckle. Speckle is the bright and dark spots generated by interference when laser light is scattered by a random medium.

[0035] 1.3 Problems The laser device 2 according to the comparative example may have an abnormality in laser performance due to a defect or the like. Examples of the abnormality in laser performance include a decrease in the power of the pulsed laser light and a decrease in the beam characteristics of the pulsed laser light. The decrease in beam characteristics is, for example, an increase in beam divergence.

[0036] When an abnormality occurs in the laser performance, it may be considered to remove OPS50 to recheck the laser performance in order to identify the cause. This is to identify whether the cause is in the laser oscillator (master oscillator 10 or power oscillator 30) or in OPS50. For example, when the power of the pulsed laser light decreases, the possible causes include a decrease in the output of the laser oscillator or a decrease in the light transmittance of OPS50. If the laser performance does not improve even after removing OPS50, it can be determined that the cause is in the laser oscillator. Conversely, if the laser performance improves by removing OPS50, it can be determined that the cause is in OPS50.

[0037] However, the operation of removing OPS50 from the laser device 2 and reinstalling it in the laser device 2 may take, for example, more than half a day, and during that time, the factory production line may have to be stopped. Also, when reinstalling the once-removed OPS50 in the laser device 2, the optical axis that was adjusted before removal may not be reproduced. In this case, readjustment of the optical axis is required, which may further take time.

[0038] As described above, when an abnormality occurs in the laser performance, it is required to be able to identify the cause in a short time.

[0039] 2. First Embodiment 2.1 Configuration FIG. 2 schematically shows a configuration example of a laser device 2A according to the first embodiment of the present disclosure. Regarding the laser device 2A shown in FIG. 2, differences from the configuration of the laser device 2 according to the comparative example shown in FIG. 1 will be described. The laser device 2A according to the first embodiment is different from the configuration of the laser device 2 according to the comparative example in that the bypass device 60 is configured to be detachable.

[0040] The laser device 2A includes a master oscillator 10, an MO beam steering unit 20, a power oscillator 30, a PO beam steering unit 40, and an OPS 50. These elements may be the same as the configuration of the laser device 2 shown in FIG. 1. The master oscillator 10, or a combination of the master oscillator 10 and the power oscillator 30, is an example of the "laser oscillator" in the present disclosure. The OPS 50 is an example of the "pulse width extension device" in the present disclosure. The PO beam steering unit 40 is an example of the "beam steering device" in the present disclosure.

[0041] The bypass device 60 forms a bypass optical path that bypasses the delay optical path 56 included in the OPS 50. The bypass device 60 includes four highly reflective mirrors 61 to 64. The highly reflective mirrors 61 to 64 are an example of the "plurality of optical elements" in the present disclosure. The highly reflective mirror 61 is an example of the "first highly reflective mirror" in the present disclosure. The highly reflective mirror 64 is an example of the "second highly reflective mirror" in the present disclosure.

[0042] The highly reflective mirrors 61 to 64 are housed in a housing 65 and held at predetermined positions within the housing 65. The highly reflective mirrors 61 to 64 form a bypass optical path that bypasses the OPS 50.

[0043] In the laser device 2A, a space is secured on the light incident side and the light output side of the OPS 50 where a part of the bypass device 60 can be inserted. The housing 65 of the bypass device 60 is configured to be detachable from the laser device 2A. In FIG. 2, the position where the bypass device 60 is attached to the laser device 2A is shown by a broken line. The housing 65 is positioned and fixed with respect to the OPS 50 when attached to the laser device 2A. In FIG. 2, the solid line shows the state where the bypass device 60 is removed from the laser device 2A.

[0044] FIG. 3 shows a state where the bypass device 60 is attached to the laser device 2A. The high-reflection mirror 61 is arranged to reflect the pulsed laser light emitted from the PO beam steering unit 40 and make it incident on the high-reflection mirror 62 when the bypass device 60 is attached to the laser device 2A. For example, the high-reflection mirror 61 is arranged at an angle of 45° with respect to the incident optical axis of the OPS 50 and reflects the pulsed laser light traveling along the incident optical axis at a reflection angle of 45°.

[0045] The high-reflection mirror 62 and the high-reflection mirror 63 are arranged to guide the pulsed laser light reflected by the high-reflection mirror 61 to the high-reflection mirror 64. For example, the high-reflection mirror 62 is arranged to reflect the pulsed laser light incident from the high-reflection mirror 61 at a reflection angle of 45° and make it incident on the high-reflection mirror 63. The high-reflection mirror 63 is arranged to reflect the pulsed laser light incident from the high-reflection mirror 62 at a reflection angle of 45° and make it incident on the high-reflection mirror 64.

[0046] The high-reflection mirror 64 is arranged at an angle of 45° with respect to the output optical axis of the OPS 50 and reflects the pulsed laser light incident from the high-reflection mirror 63 at a reflection angle of 45° to return it to the output optical path of the OPS 50. That is, the high-reflection mirror 64 is arranged to emit the pulsed laser light that has traveled through the bypass optical path into the optical path of the pulsed laser light emitted from the OPS 50 when the bypass device 60 is not attached to the laser device 2A.

[0047] That is, the high-reflection mirrors 61 to 64 are arranged such that the angle formed by the incident light and the reflected light is 90°.

[0048] On the housing 65 of the bypass device 60, an optical incident window (not shown) for making the pulsed laser light emitted from the PO beam steering unit 40 enter the high-reflection mirror 61 is formed. Further, on the housing 65, an optical emission window (not shown) for emitting the pulsed laser light reflected by the high-reflection mirror 64 to the outside of the housing 65 is formed.

[0049] The high-reflection mirrors 61 to 64 may be arranged such that the angle formed by the incident light and the reflected light is an angle other than 90°. The high-reflection mirror 61 as the first high-reflection mirror may be arranged so as to guide the pulsed laser light to the bypass optical path by reflecting the pulsed laser light incident on the OPS50 outward of the OPS50. Further, the high-reflection mirror 64 as the second high-reflection mirror may be arranged so as to return the pulsed laser light to the emission optical path of the OPS50 by reflecting the pulsed laser light reflected by the high-reflection mirror 61 and incident through the bypass optical path.

[0050] 2.2 Operation When the bypass device 60 is not attached to the laser device 2A, the pulsed laser light emitted from the power oscillator 30 enters the OPS50 through the PO beam steering unit 40. The pulsed laser light incident on the OPS50 is emitted from the laser device 2A after the pulse width is extended by the delay optical path 56.

[0051] The bypass device 60 is attached to the laser device 2A, for example, during an investigation operation to identify the cause when an abnormality occurs in the laser performance of the pulsed laser light emitted from the laser device 2A. When the bypass device 60 is attached to the laser device 2A, the pulsed laser light emitted from the PO beam steering unit 40 and traveling along the incident optical axis of the OPS50 enters the bypass device 60, travels through the bypass optical path without passing through the OPS50, and is then output along the emission optical axis of the OPS50.

[0052] 2.3 Effects According to the laser device 2A and the bypass device 60 according to the first embodiment, by attaching the bypass device 60 to the laser device 2A, it is possible to bypass the OPS 50 and output pulsed laser light without removing the OPS 50 from the laser device 2A. Therefore, when an abnormality occurs in the laser performance of the laser device 2A, the cause can be easily identified by attaching and detaching the bypass device 60.

[0053] Since the attachment of the bypass device 60 does not change the mirror angle of the OPS 50 or the like arranged in the optical path, and the optical path returns to the original state when the bypass device 60 is removed, adjustment of the optical axis is not required. Therefore, the total working time for cause identification can be shortened.

[0054] Since the bypass device 60 can be easily attached to and detached from the laser device 2A, the pulse width of the pulsed laser light can be switched by attaching and detaching the bypass device 60. Also, since the output of the pulsed laser light decreases when passing through the OPS 50, when the bypass device 60 is attached to the laser device 2A, the pulse width of the pulsed laser light becomes shorter while the output increases. Therefore, it is possible to select whether to prioritize the pulse width or the output of the pulsed laser light by attaching and detaching the bypass device 60, and the practical performance of the laser device 2A can be expanded.

[0055] 3. Second Embodiment Next, the laser device 2B according to the second embodiment of the present disclosure will be described. In the following, the points different from the configuration of the laser device 2 according to the comparative example will be described.

[0056] 3.1 Configuration FIG. 4 is a top view schematically showing the configuration of the laser device 2B according to the second embodiment. FIG. 5 is a front view schematically showing the configuration of the laser device 2B. Note that the "front" with respect to the laser device 2B refers to the side of the outer peripheral surface of the laser device 2B where the exterior cover panel (not shown) for maintenance etc. of the laser device 2B opens widely. When the exterior cover panel of the laser device 2B is opened, the side where the internal arrangement structure as shown in FIG. 5 can be seen is the "front".

[0057] The laser device 2B includes a master oscillator 10, an MO beam steering unit 20, a power oscillator 30, and an OPS 50. These elements may be the same as the configuration of the laser device 2 shown in FIG. 1.

[0058] The laser device 2B includes a long optical pulse stretcher 100 (hereinafter referred to as "L-OPS 100") for generating a long optical path difference for extending the pulse width. The L-OPS 100 is arranged on the back surface of the laser device 2B. The "back surface" is the back side when viewed from the front of the laser device 2B and is the surface opposite to the front. The L-OPS 100 is an example of the "pulse width extension device" in the present disclosure.

[0059] Instead of the PO beam steering unit 40 shown in FIG. 1, the laser device 2B includes a PO beam steering unit 42. The PO beam steering unit 42 includes a high reflection mirror 44a, a high reflection mirror 44b, and a high reflection mirror 44c for optical interaction with the L-OPS 100.

[0060] The high reflection mirror 44a is arranged to reflect the pulsed laser light output from the power oscillator 30 and make it incident on the high reflection mirror 44b. The high reflection mirror 44b is arranged to reflect the pulsed laser light reflected by the high reflection mirror 44a and make it incident on the L-OPS 100. The high reflection mirror 44c is arranged to reflect the pulsed laser light output from the L-OPS 100 and make it incident on the OPS 50.

[0061] The L-OPS100 is composed of a plurality of concave mirrors, a plurality of highly reflective mirrors, and a plurality of beam splitters. In FIG. 4, only a plurality of concave mirrors 102 and one beam splitter 104 among the components of the L-OPS100 are shown. The beam splitter 104 is disposed at a position where the pulsed laser light reflected by the highly reflective mirror 44b of the PO beam steering unit 42 is incident. In the L-OPS100, a delay optical path 106 is formed by the above components. That is, the laser device 2B according to the second embodiment includes two pulse width extension devices, namely the OPS50 and the L-OPS100. Each of the OPS50 and the L-OPS100 may include a beam splitter and two or more highly reflective mirrors.

[0062] The laser device 2B is configured such that the bypass device 70 is detachable. The bypass device 70 includes two highly reflective mirrors 72 and 74. The highly reflective mirrors 72 and 74 are an example of the "plurality of optical elements" in the present disclosure. The highly reflective mirror 72 is an example of the "first highly reflective mirror" in the present disclosure. The highly reflective mirror 74 is an example of the "second highly reflective mirror" in the present disclosure.

[0063] The highly reflective mirrors 72 and 74 are housed in the housing 76 and held at a predetermined position within the housing 76. The highly reflective mirrors 72 and 74 form a bypass optical path that bypasses the L-OPS100.

[0064] In the laser device 2B, a space is secured between the L-OPS100 and the PO beam steering unit 42 into which the bypass device 70 can be inserted. The housing 76 of the bypass device 70 is configured to be detachable from the laser device 2B. In FIGS. 4 and 5, the position where the bypass device 70 is attached to the laser device 2B is indicated by a dashed line. The housing 76 is positioned and fixed to the PO beam steering unit 42 when attached to the laser device 2B. In FIGS. 4 and 5, the solid line indicates a state where the bypass device 70 is removed from the laser device 2B.

[0065] Figures 6 and 7 show the state in which the bypass device 70 is attached to the laser device 2B. The high-reflection mirror 72 is arranged to reflect the pulsed laser light emitted from the PO beam steering unit 42 and make it incident on the high-reflection mirror 74 when the bypass device 70 is attached to the laser device 2B. For example, the high-reflection mirror 72 forms an angle of 45° with respect to the incident optical axis of the L-OPS 100, and is arranged to reflect the pulsed laser light traveling along the incident optical axis at a reflection angle of 45°.

[0066] The high-reflection mirror 74 is arranged to reflect the pulsed laser light incident from the high-reflection mirror 72 and make it incident on the high-reflection mirror 44c of the PO beam steering unit 42. For example, the high-reflection mirror 74 forms an angle of 45° with respect to the emission optical axis of the L-OPS 100, and is arranged to reflect the pulsed laser light incident from the high-reflection mirror 72 at a reflection angle of 45° and return it to the emission optical path of the L-OPS 100. That is, the high-reflection mirror 74 is arranged to emit the pulsed laser light that has traveled through the bypass optical path onto the optical path of the pulsed laser light emitted from the L-OPS 100 when the bypass device 70 is not attached to the laser device 2B.

[0067] That is, the high-reflection mirrors 72 and 74 are arranged such that the angle between the incident light and the reflected light is 90°.

[0068] Figures 8 and 9 are perspective views schematically showing the configuration of the bypass device 70. Figure 8 shows the state in which the bypass device 70 is removed from the laser device 2B. Figure 9 shows the state in which the bypass device 70 is attached to the laser device 2B.

[0069] An optical incident window 78A for making the pulsed laser light emitted from the PO beam steering unit 42 incident on the high-reflection mirror 72 is formed in the housing 76 of the bypass device 70. Further, an optical emission window 78B for emitting the pulsed laser light reflected by the high-reflection mirror 74 to the outside of the housing 76 is formed in the housing 76.

[0070] The high-reflection mirrors 72 and 74 may be arranged such that the angle formed by the incident light and the reflected light is other than 90°. The high-reflection mirror 72 as the first high-reflection mirror may be arranged to direct the pulsed laser light incident on the L-OPS 100 outward of the L-OPS 100 by reflection, so as to guide the pulsed laser light to the bypass optical path. Further, the high-reflection mirror 74 as the second high-reflection mirror may be arranged to reflect the pulsed laser light that is reflected by the high-reflection mirror 72 and incident through the bypass optical path, so as to return the pulsed laser light to the emission optical path of the L-OPS 100.

[0071] 3.2 Operation When the bypass device 70 is not attached to the laser device 2B, the pulsed laser light emitted from the power oscillator 30 has its traveling direction changed by the high-reflection mirrors 44a and 44b of the PO beam steering unit 42. The pulsed laser light whose traveling direction has been changed by the high-reflection mirrors 44a and 44b is incident on the L-OPS 100 at the back of the laser device 2B.

[0072] The pulsed laser light incident on the L-OPS 100 has its pulse width extended by the delay optical path 106 and then returns to the PO beam steering unit 42. The pulsed laser light that has returned to the PO beam steering unit 42 has its traveling direction changed by the high-reflection mirror 44c and is incident on the OPS 50. The pulsed laser light incident on the OPS 50 has its pulse width further extended by the OPS 50 and is emitted from the laser device 2B.

[0073] The bypass device 70 is attached to the laser device 2B, for example, during an investigation work to identify the cause when an abnormality occurs in the laser performance of the pulsed laser light emitted from the laser device 2B. When the bypass device 70 is attached to the laser device 2B, the pulsed laser light that is emitted from the high-reflection mirror 44b of the PO beam steering unit 42 and travels along the incident optical axis of the L-OPS 100 enters the bypass device 70. The pulsed laser light that has entered the bypass device 70 travels through the bypass optical path without passing through the L-OPS 100, and then is output along the output optical axis of the L-OPS 100. The pulsed laser light output from the bypass device 70 returns to the PO beam steering unit 42. The pulsed laser light that has returned to the PO beam steering unit 42 has its traveling direction changed by the high-reflection mirror 44c and enters the OPS 50. The pulsed laser light that has entered the OPS 50 has its pulse width extended by the OPS 50 and is emitted from the laser device 2B.

[0074] 3.3 Effects According to the laser device 2B and the bypass device 70 according to the second embodiment, by attaching the bypass device 70 to the laser device 2B, it becomes possible to output pulsed laser light by bypassing the L-OPS 100 without removing the L-OPS 100 from the laser device 2B. Therefore, when an abnormality occurs in the laser performance of the laser device 2B, the cause can be easily identified by attaching and detaching the bypass device 70.

[0075] Due to the attachment of the bypass device 70, the angles of mirrors such as the L-OPS 100 arranged in the optical path do not change, and since the optical path returns to its original state by removing the bypass device 70, adjustment of the optical axis is not required. Therefore, the overall working time for cause identification can be shortened.

[0076] Similar to the first embodiment, since the bypass device 70 can be easily attached to and detached from the laser device 2B, it becomes possible to select whether to prioritize the pulse width or the output of the pulsed laser light by attaching and detaching the bypass device 70, and the practical performance of the laser device 2B can be expanded.

[0077] 4. Third Embodiment Next, a laser device 2C according to the third embodiment of the present disclosure will be described. In the following, differences from the configuration of the laser device 2B according to the second embodiment will be described.

[0078] 4.1 Configuration FIG. 10 is a top view schematically showing the configuration of the laser device 2C according to the third embodiment. FIG. 11 is a front view schematically showing the configuration of the laser device 2C. The laser device 2C is configured such that a bypass device 80 is detachable instead of the bypass device 70 of the second embodiment. The bypass device 80 is configured to be detachable from the front of the laser device 2C, that is, from the maintenance surface side. Other configurations of the laser device 2C are the same as those of the laser device 2B according to the second embodiment.

[0079] The bypass device 80 includes five high-reflection mirrors 81 to 85. The high-reflection mirrors 81 to 85 are an example of the "plurality of optical elements" in the present disclosure. The high-reflection mirror 81 is an example of the "first high-reflection mirror" in the present disclosure. The high-reflection mirror 85 is an example of the "second high-reflection mirror" in the present disclosure.

[0080] The high-reflection mirrors 81 to 85 are housed in a housing 86 and held at predetermined positions within the housing 86. The high-reflection mirrors 81 to 85 form a bypass optical path that bypasses the L-OPS 100.

[0081] A space is secured in the laser device 2C such that a part of the bypass device 80 can be inserted into the PO beam steering unit 42. The housing 86 of the bypass device 80 is configured to be detachable from the laser device 2C. In FIGS. 10 and 11, the position where the bypass device 80 is attached to the laser device 2C is shown by a broken line. The housing 86 is positioned and fixed with respect to the PO beam steering unit 42 when attached to the laser device 2C. In FIGS. 10 and 11, the solid line shows the state where the bypass device 80 is removed from the laser device 2C.

[0082] Figures 12 and 13 show a state where the bypass device 80 is attached to the laser device 2C. The high-reflection mirrors 81 to 84 are arranged at positions where the pulsed laser light reflected by the high-reflection mirror 44a of the PO beam steering unit 42 sequentially enters when the bypass device 80 is attached to the laser device 2C.

[0083] The high-reflection mirror 85 is arranged to reflect the pulsed laser light incident from the high-reflection mirror 84 and make it enter the OPS 50. That is, the high-reflection mirror 85 is arranged to output the pulsed laser light along the output optical axis of the PO beam steering unit 42.

[0084] Figures 14 and 15 are perspective views schematically showing the configuration of the bypass device 80. Figure 14 shows a state where the bypass device 80 is removed from the laser device 2C. Figure 15 shows a state where the bypass device 80 is attached to the laser device 2C.

[0085] An optical incident window 87A for making the pulsed laser light reflected by the high-reflection mirror 44a of the PO beam steering unit 42 enter the high-reflection mirror 81 is formed in the housing 86 of the bypass device 80. Also, an optical output window 87B for outputting the pulsed laser light reflected by the high-reflection mirror 85 to the outside of the housing 86 is formed in the housing 86.

[0086] As shown in FIG. 15, the high-reflection mirror 81 is arranged to reflect the pulsed laser light that is reflected by the high-reflection mirror 44a of the PO beam steering unit 42 and travels in the -V axis direction, and make it travel in the +H axis direction. The high-reflection mirror 82 is arranged to reflect the pulsed laser light traveling in the +H axis direction and make it travel in the +Z axis direction. The high-reflection mirror 83 is arranged to reflect the pulsed laser light traveling in the +Z axis direction and make it travel in the -V axis direction. The high-reflection mirror 84 is arranged to reflect the pulsed laser light traveling in the -V axis direction and make it travel in the -H axis direction. The high-reflection mirror 85 is arranged to reflect the pulsed laser light traveling in the -H axis direction and make it travel in the +Z axis direction. That is, the high-reflection mirrors 81 to 85 are each arranged such that the angle formed by the incident light and the reflected light is 90°.

[0087] The high-reflection mirrors 81 to 85 may each be arranged such that the angle formed by the incident light and the reflected light is an angle other than 90°. The high-reflection mirror 81 as the first high-reflection mirror may be arranged to direct the pulsed laser light incident on the L-OPS 100 outside the L-OPS 100 by reflection, so as to guide the pulsed laser light to the bypass optical path. Further, the high-reflection mirror 85 as the second high-reflection mirror may be arranged to reflect the pulsed laser light that is reflected by the high-reflection mirror 81 and incident through the bypass optical path, so as to return the pulsed laser light to the output optical path of the L-OPS 100. Note that the output optical path of the L-OPS 100 refers to the optical path from when the pulsed laser light is emitted from the L-OPS 100 until it is incident on the OPS 50.

[0088] 4.2 Operation When the bypass device 80 is not attached, the operation of the laser device 2C is the same as that of the laser device 2B according to the second embodiment. The pulsed laser light emitted from the power oscillator 30 has its traveling direction changed by the PO beam steering unit 42 and is incident on the L-OPS 100 at the back of the laser device 2C. The pulsed laser light incident on the L-OPS 100 has its pulse width extended by the L-OPS 100, then returns to the PO beam steering unit 42, and its traveling direction is changed by the PO beam steering unit 42 and is incident on the OPS 50. The pulsed laser light incident on the OPS 50 has its pulse width further extended by the OPS 50 and is emitted from the laser device 2C.

[0089] The bypass device 80 is attached to the laser device 2C, for example, during an investigation operation to identify the cause when an abnormality occurs in the laser performance of the pulsed laser light emitted from the laser device 2C. When the bypass device 80 is attached to the laser device 2C, the pulsed laser light emitted from the power oscillator 30 has its traveling direction changed by the high reflection mirror 44a of the PO beam steering unit 42 and then is incident on the bypass device 80. The pulsed laser light incident on the bypass device 80 travels through the bypass optical path without passing through the L-OPS 100 and is then output along the output optical axis of the PO beam steering unit 42. The pulsed laser light output from the bypass device 80 is incident on the OPS 50, and its pulse width is extended by the OPS 50 and is emitted from the laser device 2C.

[0090] 4.3 Effects According to the laser device 2C and the bypass device 80 according to the third embodiment, by attaching the bypass device 80 to the laser device 2C, it is possible to output pulsed laser light by bypassing the L-OPS 100 without removing the L-OPS 100 from the laser device 2C. In particular, the bypass device 80 according to the third embodiment is detachable from the front of the laser device 2C, that is, from the maintenance surface side, so the attachment operation is easy.

[0091] In addition, the laser device 2C and the bypass device 80 according to the third embodiment have the same effects as the laser device 2B and the bypass device 70 according to the second embodiment.

[0092] 5. Modification Example of Bypass Device Next, a modification example of the bypass device will be described. The bypass device according to the modification example enables adjustment of the optical axis of the bypass optical path.

[0093] 5.1 First Modification Example FIG. 16 schematically shows the configuration of a bypass device 60A according to a first modification example of the first embodiment. The bypass device 60A includes four highly reflective mirrors 61 to 64 for forming a bypass optical path, similarly to the bypass device 60 according to the first embodiment.

[0094] Among the highly reflective mirrors 61 to 64, the highly reflective mirror 62 is held by a holder 90A with a first actuator, and the highly reflective mirror 63 is held by a holder 90B with a second actuator. The holders 90A and 90B with the first and second actuators are housed in a housing 65 together with the highly reflective mirrors 61 to 64. The holders 90A and 90B with the first and second actuators are an example of the "optical axis adjustment mechanism" in the present disclosure. The highly reflective mirror 62 is an example of the "first optical element" in the present disclosure. The highly reflective mirror 63 is an example of the "second optical element" in the present disclosure.

[0095] The holders 90A and 90B with the first and second actuators are each composed of, for example, a holder, a PZT (lead zirconate titanate) actuator, and an automatic micrometer.

[0096] The holder 90A with the first actuator holds the highly reflective mirror 62 and changes the attitude angle of the highly reflective mirror 62 with respect to two orthogonal axes. For example, the holder 90A with the first actuator rotates the highly reflective mirror 62 around the H axis and around an axis parallel to the surface of the highly reflective mirror 62 and orthogonal to the H axis.

[0097] Similarly, the holder 90B with the second actuator holds the high-reflection mirror 63 and changes the attitude angle of the high-reflection mirror 63 with respect to two orthogonal axes. For example, the holder 90B with the second actuator rotates the high-reflection mirror 63 around the H axis and around an axis parallel to the surface of the high-reflection mirror 63 and orthogonal to the H axis. The holders 90A and 90B with the first and second actuators are controlled by a controller (not shown).

[0098] By changing the attitude angle of each of the high-reflection mirrors 62 and 63 with respect to two axes, the optical axis of the bypass optical path can be adjusted. Specifically, the traveling direction and position of the pulsed laser light traveling through the bypass optical path can be adjusted.

[0099] When the bypass device 60A is attached to the laser device 2A according to the first embodiment, there may be a deviation between the emission optical axis of the OPS 50 and the emission optical axis of the bypass device 60A. Even when such a deviation occurs, by controlling the holders 90A and 90B with the first and second actuators, the emission optical axis of the bypass device 60A can be made to coincide with the emission optical axis of the OPS 50.

[0100] Note that, not limited to the example shown in FIG. 16, any two of the high-reflection mirrors 61 to 64 may be held by the holders 90A and 90B with the first and second actuators.

[0101] 5.2 Second Modification FIG. 17 schematically shows the configuration of a bypass device 60B according to a second modification of the first embodiment. The bypass device 60B includes four high-reflection mirrors 61 to 64 and a transparent parallel plate substrate 66. The parallel plate substrate 66 is formed of, for example, synthetic quartz or calcium fluoride (CaF2). The high-reflection mirrors 61 to 64 and the parallel plate substrate 66 are an example of the "plurality of optical elements" in the present disclosure.

[0102] Of the high - reflection mirrors 61 to 64, the high - reflection mirror 62 is held by the holder 90C with the first actuator. The holder 90C with the first actuator has the same configuration as the holder 90A with the first actuator described in the first modification example, holds the high - reflection mirror 62, and changes the attitude angle of the high - reflection mirror 62 with respect to two orthogonal axes. The holders 90C and 90D with the first and second actuators are housed in the housing 65 together with the high - reflection mirrors 61 to 64 and the parallel - plate substrate 66. The holders 90C and 90D with the first and second actuators are an example of the "optical axis adjustment mechanism" in the present disclosure. Also, the high - reflection mirror 62 is an example of the "first optical element" in the present disclosure.

[0103] The parallel - plate substrate 66 is disposed in an inclined state on the optical path where the pulsed laser light reflected by the high - reflection mirror 62 travels toward the high - reflection mirror 63. The parallel - plate substrate 66 transmits the pulsed laser light incident from the high - reflection mirror 62 and makes it incident on the high - reflection mirror 63. The parallel - plate substrate 66 is an example of the "second optical element" in the present disclosure.

[0104] The parallel - plate substrate 66 is held by the holder 90D with the second actuator. The holder 90D with the second actuator has the same configuration as the holder 90A with the first actuator described in the first modification example, holds the parallel - plate substrate 66, and changes the attitude angle of the parallel - plate substrate 66 with respect to two orthogonal axes. For example, the holder 90D with the second actuator rotates the parallel - plate substrate 66 around the H - axis and around an axis parallel to the surface of the parallel - plate substrate 66 and orthogonal to the H - axis. The holders 90C and 90D with the first and second actuators are controlled by a controller (not shown).

[0105] By changing the attitude angles of the high - reflection mirror 62 and the parallel - plate substrate 66 with respect to two axes, the optical axis of the bypass optical path can be adjusted. Specifically, by changing the attitude angle of the high - reflection mirror 62, the traveling direction of the pulsed laser light traveling in the bypass optical path can be adjusted.

[0106] Also, by changing the attitude angle of the parallel flat plate substrate 66, the position of the pulsed laser light can be adjusted. The amount of change in position due to the pulsed laser light passing through the parallel flat plate substrate 66 depends on the incident angle on the parallel flat plate substrate 66, the thickness of the parallel flat plate substrate 66, and the refractive index of the parallel flat plate substrate 66. By changing the attitude angle of the parallel flat plate substrate 66, as the incident angle of the pulsed laser light on the parallel flat plate substrate 66 changes, the position of the pulsed laser light changes.

[0107] In the example shown in FIG. 17, the high-reflection mirror 62 is held by the holder 90C with the first actuator as the optical axis adjustment mechanism. However, any of the high-reflection mirrors 61 to 64 may be held by the holder 90C with the first actuator.

[0108] Also, in the example shown in FIG. 17, the parallel flat plate substrate 66 is disposed between the high-reflection mirror 62 and the high-reflection mirror 63. Instead of this, the parallel flat plate substrate 66 may be disposed between the high-reflection mirror 61 and the high-reflection mirror 62, or between the high-reflection mirror 63 and the high-reflection mirror 64. Further, the parallel flat plate substrate 66 may be disposed on the light incident side of the high-reflection mirror 61, or on the light emission side of the high-reflection mirror 64.

[0109] 5.3 Other Modification Examples Actuator-equipped holders as optical axis adjustment mechanisms may be provided for each of the high-reflection mirrors 72 and 74 included in the bypass device 70 according to the second embodiment. Also, an actuator-equipped holder may be provided for one of the high-reflection mirrors 72 and 74, and a parallel flat plate substrate held by the actuator-equipped holder may be disposed between the high-reflection mirror 72 and the high-reflection mirror 74. Further, a parallel flat plate substrate held by the actuator-equipped holder may be disposed on the light incident side of the high-reflection mirror 72, or on the light emission side of the high-reflection mirror 74. Furthermore, the light incident window 78A and the light emission window 78B are not essential and may simply be openings through which light passes.

[0110] Further, an actuator-equipped holder may be provided for any two high-reflection mirrors selected from the high-reflection mirrors 81 to 85 included in the bypass device 80 according to the third embodiment. Further, an actuator-equipped holder may be provided for one high-reflection mirror selected from the high-reflection mirrors 81 to 85, and a parallel flat plate substrate held by the actuator-equipped holder may be disposed between two high-reflection mirrors selected from the high-reflection mirrors 81 to 85. Further, a parallel flat plate substrate held by the actuator-equipped holder may be disposed on the light incident side of the high-reflection mirror 81 or on the light emission side of the high-reflection mirror 85. Furthermore, the light incident window 87A and the light emission window 87B are not essential and may simply be openings through which light passes.

[0111] Further, the actuator-equipped holder as the optical axis adjustment mechanism may be provided for three or more of the plurality of optical elements forming the bypass optical path. Further, two or more of the plurality of optical elements forming the bypass optical path are parallel flat plate substrates, and an actuator-equipped holder may be provided for each of the parallel flat plate substrates.

[0112] 6. Method for manufacturing an electronic device FIG. 18 schematically shows a configuration example of an exposure apparatus 200. The exposure apparatus 200 includes an illumination optical system 204 and a projection optical system 206. The illumination optical system 204 illuminates, for example, a reticle pattern of a reticle (not shown) disposed on a reticle stage RT with pulsed laser light incident from the laser device 2A according to the first embodiment. The projection optical system 206 reduces and projects the pulsed laser light that has passed through the reticle and forms an image on a workpiece (not shown) disposed on a workpiece table WT. The workpiece is a photosensitive substrate such as a semiconductor wafer coated with a photoresist.

[0113] The exposure apparatus 200 exposes a workpiece to pulsed laser light reflecting a reticle pattern by synchronously translating a reticle stage RT and a workpiece table WT. After transferring the reticle pattern to a semiconductor wafer through the exposure process as described above, a semiconductor device can be manufactured through a plurality of processes. The semiconductor device is an example of the "electronic device" in the present disclosure.

[0114] Further, a bypass device 60 may be attached to the laser device 2A that irradiates the exposure apparatus 200 with pulsed laser light, or the bypass device 60 may be removed. When exposing the wafer, it is possible to select whether to prioritize the pulse width or the output of the pulsed laser light by attaching or detaching the bypass device 60. Note that not only the laser device 2A but also the above-described laser device 2B or laser device 2C may be used.

[0115] The above description is intended to be illustrative rather than restrictive. Thus, it will be apparent to those skilled in the art that modifications can be made to each embodiment of the present disclosure without departing from the scope of the appended claims.

[0116] The terms used throughout this specification and the appended claims should be construed as "non-limiting" terms. For example, the terms "comprising" or "included" should be construed as not being limited to those described as being included. The term "having" should be construed as not being limited to those described as having. Also, the modifier "one" described in this specification and the appended claims should be construed to mean "at least one" or "one or more".

Claims

1. A bypass device that is detachable from a laser device that outputs pulsed laser light, forms a bypass optical path that bypasses a pulse width extension device provided in the laser device and extends the pulse width of the incident pulsed laser light, comprising: a plurality of optical elements that form the bypass optical path; a housing that houses the plurality of optical elements; and comprising; Among the plurality of optical elements, a first highly reflective mirror that reflects the pulsed laser light incident on the pulse width extension device outward of the pulse width extension device and guides it to the bypass optical path; a second highly reflective mirror that reflects the pulsed laser light reflected by the first highly reflective mirror and incident through the bypass optical path and returns it to the output optical path of the pulse width extension device; are included Bypass device.

2. The bypass device according to claim 1, further comprising: an optical axis adjustment mechanism for adjusting the optical axis of the bypass optical path Bypass device.

3. The bypass device according to claim 2, wherein: The optical axis adjustment mechanism includes a holder with a first actuator that holds a first optical element among the plurality of optical elements and changes the attitude angle, and a holder with a second actuator that holds a second optical element and changes the attitude angle Bypass device.

4. The bypass device according to claim 3, wherein: The first optical element and the second optical element are highly reflective mirrors Bypass device.

5. The bypass device according to claim 3, wherein: The first optical element is a highly reflective mirror, The second optical element is a transparent parallel plate substrate Bypass device.

6. The bypass device according to claim 1, wherein: The first highly reflective mirror reflects the pulsed laser light output from a beam steering device that changes the traveling direction of the incident pulsed laser light, The second highly reflective mirror outputs the pulsed laser light incident through the bypass optical path along the output optical axis of the pulse width extension device and returns it to the output optical path Bypass device.

7. The bypass device according to claim 1, wherein: The first highly reflective mirror reflects the pulsed laser light output from one of the highly reflective mirrors included in a beam steering device that changes the traveling direction of the incident pulsed laser light, The second highly reflective mirror outputs the pulsed laser light incident through the bypass optical path along the output optical axis of the pulse width extension device and returns it to the beam steering device Bypass device.

8. A bypass device according to claim 1, wherein the first high-reflection mirror reflects the pulsed laser light output from one of the high-reflection mirrors included in a beam steering device that changes the traveling direction of the incident pulsed laser light, and the second high-reflection mirror outputs the pulsed laser light incident through the bypass optical path along the output optical axis of the beam steering device and returns it to the output optical path. Bypass device.

9. A laser device comprising a laser oscillator that outputs pulsed laser light and a pulse width extension device that extends the pulse width of the incident pulsed laser light, and a bypass device that forms a bypass optical path for bypassing the pulse width extension device is detachably attached, wherein the bypass device includes a plurality of optical elements that form the bypass optical path, and a housing that houses the plurality of optical elements, and the plurality of optical elements include a first high-reflection mirror that reflects the pulsed laser light incident on the pulse width extension device outward of the pulse width extension device and guides it to the bypass optical path, and a second high-reflection mirror that reflects the pulsed laser light reflected by the first high-reflection mirror and incident through the bypass optical path and returns it to the output optical path of the pulse width extension device. are included Laser device.

10. Output the pulsed laser light output from a laser device comprising a laser oscillator that outputs pulsed laser light and a pulse width extension device that extends the pulse width of the incident pulsed laser light, and a bypass device that forms a bypass optical path for bypassing the pulse width extension device is detachably attached to an exposure device, A method for manufacturing an electronic device, which includes exposing a photosensitive substrate to the pulsed laser light in the exposure device in order to manufacture the electronic device, wherein the bypass device includes a plurality of optical elements that form the bypass optical path, and a housing that houses the plurality of optical elements, and the plurality of optical elements include a first high-reflection mirror that reflects the pulsed laser light incident on the pulse width extension device outward of the pulse width extension device and guides it to the bypass optical path, and a second high-reflection mirror that reflects the pulsed laser light reflected by the first high-reflection mirror and incident through the bypass optical path and returns it to the output optical path of the pulse width extension device. are included Method for manufacturing an electronic device.

Images