Printed circuit board, metal ceramic substrate as insert, and method for manufacturing such insert

Abstract

To provide a printed circuit board that meets strict requirements for heat dissipation and insulation capabilities of electronic components, while at the same time enabling manufacturing at a lower cost.SOLUTION: An insert comprises a metal ceramic substrate, electrical and / or electronic components, and a sealing portion. In addition to the electrical and / or electronic components, a component metallization portion 20 of the metal ceramic substrate, a ceramic element 30, and / or a rear face metallization portion 20' are surrounded by the sealing portion 10, and the ceramic element 30 protrudes from the component metallization portion 20 and / or the rear face metallization portion 20'. An insert connection portion 8 of the insert is formed on a component surface of the insert, and is connected to the electrical and / or electronic components within the sealing portion 10 via through-hole plating 9, 19 on the component surface facing a direction separating from the metal ceramic substrate.SELECTED DRAWING: Figure 6b

Description

Technical Field

[0001] The present invention relates to a printed circuit board, a metal ceramic substrate as an insert for such a printed circuit board, and a method for manufacturing such an insert.

Background Art

[0002] Printed circuit boards are well known from the prior art. Such printed circuit boards function as carriers for electrical circuits formed or constituted from conductive paths, electrical components, and / or connections. The electrical circuit is preferably formed on one component side of the printed circuit board. Such printed circuit boards, also known as PCBs (printed circuit boards), are usually manufactured from plastics, especially fiber-reinforced plastics, epoxy resins, and / or hard paper. The use of such materials has proven to be particularly cost-effective and easy to handle during the manufacturing process. However, these printed circuit board materials have a limited thermal conductivity, which has been found to be necessary for dissipating the heat generated from electrical components during operation. In addition, the insulation ability is limited. Therefore, as the performance of electronic components improves, printed circuit boards manufactured from ordinary materials are not suitable for permanently withstanding the stresses generated during operation and providing good insulation characteristics.

[0003] On the other hand, printed circuit boards configured as metal ceramic substrates are characterized by high insulation ability, and they typically have a high thermal conductivity compared to the thermal conductivity of the materials described above. However, the manufacture of metal ceramic substrates is more complex and costly than the manufacture of printed circuit boards made from plastics, epoxy resins, and / or hard paper.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Based on the prior art, an object of the present invention is to provide a printed circuit board that meets strict requirements for the heat dissipation and insulation capabilities of electronic components and can be manufactured at a lower cost at the same time.

Means for Solving the Problem

[0005] This problem is solved by the printed circuit board according to claim 1, the insert according to claim 9, and the method according to claim 10. Further embodiments can be found in the subsequent claims and description.

[0006] According to a first aspect of the present invention, there is provided a printed circuit board for electrical components and / or conductive paths, a substrate extending along a main extension plane, an insert integrated with the substrate, and it is intended to include The insert includes a metal ceramic substrate, electrical and / or electronic components, and a sealing portion surrounding at least the electrical and / or electronic components.

[0007] Compared with the printed circuit boards known from the prior art, according to the present invention, the substrate of the printed circuit board is not completely formed from one of the common materials such as plastic, cardboard, and / or epoxy resin, but only a part of the printed circuit board is intended to be formed from at least the insert described in the claims. Specifically, the metal ceramic substrate with the encapsulated components is embedded or inserted into the substrate of the printed circuit board, especially to provide a locally high thermal conductivity. This makes it possible, for example, to insert or embed the insert in the area of the printed circuit board where an increase in heat generation is expected. At the same time, most of the substrate can be manufactured from materials such as plastic, especially fiber-reinforced plastic, epoxy resin, or cardboard, which are cost-effective and easy to handle.

[0008] In particular, it can be seen that it is advantageous to immediately provide an electrical or electronic component that exhibits increased heat generation during operation in an environment adapted to the heat generation of each respective component in each case. This is advantageously achieved by the inserts described in the claims, and by the corresponding design of the metal-ceramic substrate, for example, with respect to the sizing of the component metallization and / or the backside metallization and / or the ceramic elements extending perpendicular to the main extension plane along the stacking direction, the respective heat generation emitted from the electrical component is taken into account. For example, the thickness of the component metallization of the metal-ceramic substrate can be adapted to the respective heat generation of the component in order to provide the fastest possible heat dissipation for each respective component. Each insert then only needs to be inserted into the substrate of the printed circuit board. An electrical coupling is provided between the component and the outside of the insert to supply power to the component and drive the component. Preferably, in each case, only a single component is intended for the insert, or the insert includes a plurality of components. Furthermore, those skilled in the art will understand that the component is not exposed on either side, i.e., on any outside, by the surrounding encapsulation of the component.

[0009] In addition, it is also possible to protect the electrical and electronic components from the outside by the encapsulation. In addition, the integration of the component into the substrate is simplified, and it is only necessary to realize the coupling between the insert surface connection, i.e., the connection on the insert, and the corresponding conductive path and / or connection on the printed circuit board. In addition, the component integrated into the encapsulation does not protrude from the outside of the printed circuit board, thereby further protecting the component from the environment of each respective printed circuit board.

[0010] Preferably, in particular, an insert having correspondingly contoured sidewalls that are form-fitted in the installed state is intended to cooperate with the substrate in a direction parallel to the stacking direction. In addition, it is conceivable that the form-fitting connection between the substrate and the insert is supported by an adhesive connection and / or a press-fit connection.

[0011] Furthermore, it is particularly intended that the proportion of one or more inserts in the proportion of the printed circuit board is less than 30%, more preferably less than 20%, and most preferably less than 10%. Furthermore, it is intended that the insert extends from the component side of the substrate of the printed circuit board to the back side of the substrate. In other words, the insert is substantially flush with the substrate in a direction perpendicular to the main extension plane on both sides, namely, the component side and the back side. The form-fitting connection between the substrate and the metal-ceramic substrate functioning as an insert particularly provides a permanent bond between the metal-ceramic substrate and the substrate, thereby preventing the insert from coming off the printed circuit board. Preferably, the form-fitting acts in both possible directions perpendicular to the main extension plane of the substrate. Furthermore, in addition to the insert, it is conceivable that a further insert is arranged on the substrate. It is also conceivable that the insert is flush with the substrate only on the component side and the back side of the metal-ceramic substrate is surrounded by the substrate. In other words, the metal-ceramic substrate or the insert is embedded or inserted into the recess of the substrate of the printed circuit board. Thereby, a form-fitting connection parallel to the main extension plane is also obtained.

[0012] In particular, it is intended that the metal-ceramic substrate and the substrate are configured such that their coefficients of thermal expansion are as similar as possible. In other words, the difference in the coefficients of thermal expansion between the insert and the substrate is kept as small as possible. For this purpose, for example, the corresponding thickness of the ceramic element is set in the metal-ceramic substrate. It is also conceivable that a stabilization layer is intended to adapt the thermo-mechanical expansion coefficient, or that several metal layers and / or different metallization parts (for example, the component metallization part and the back-side metallization part are made of different metals or materials) are used to provide the desired adaptation in a corresponding manner. In this way, it is possible to ensure that, as a result of the elongation occurring during operation, no significant mechanical stress that could cause, for example, cracks occurs between the substrate and the metal-ceramic substrate. Preferably, it is also conceivable that different ceramic elements are used for the metal-ceramic substrate.

[0013] In addition to the shape fit, it has proven to be advantageous if a material bond is achieved between the side surface of the insert and the substrate. According to a more preferred embodiment, in order to form a shape fit cooperation, the insert, preferably a metal-ceramic substrate and / or a sealing part, is contoured on a side surface that is not parallel to the main extension plane, and / or a ceramic element of the metal-ceramic substrate and / or a part of the insert projects in a direction parallel to the main extension plane on the opposite side of the component metallization part and / or the backside metallization part of the metal-ceramic substrate, is intended.

[0014] For example, it is intended that the side surfaces, in particular the side surfaces of the sealing part, the component metallization part, and / or the backside metallization part, are curved or bent in a concave and / or convex shape. Alternatively, it is also conceivable that the insert is formed in a stepped manner on its side wall or side surface. In particular, the substrate is intended to engage with the concave and / or convex parts on the side surface of the sealing part, the metallization part, and / or the backside metallization part so as to cause a shape fit in one direction or both directions perpendicular to the main extension plane. For example, it is conceivable that the outermost edge part of the sealing part or the component metallization part is stepped, especially stepped such that the opening area of the step is formed on the surface facing the component surface and / or the back surface. In the corresponding method, the component can be arranged on the component metallization part such that heat diffusion is completely covered by the component metallization part in consideration of the isotropic transfer of heat. Here, in any case, the part of the component metallization part that does not contribute to heat transfer is removed in an appropriate manner in this stepped path and replaced by the substrate. Preferably, the protruding part of the ceramic element is used to form a shape fit joint. In particular, this is a part known as a pull-back, which provides sufficient insulation between the component metallization part and the backside metallization part.

[0015] Preferably, the insert is intended to have a maximum spread in a plane dimensioned parallel to the main extension plane, having a value of from 1 mm to 200 mm, more preferably from 4 mm to 60 mm, and most preferably from 6 mm to 30 mm. This provides a relatively small-sized insert that can be used to locally increase the thermal conductivity within the printed circuit board as needed. In particular, a relatively large number of individual inserts can be provided from a master card. Such a master card is defined by the format immediately after connection of the component metallization part to the backside metallization part, which is carried out via an appropriate connection process.

[0016] In particular, the side surfaces are intended to be contoured so as to have a modulation depth or height having a value of from 1 μm to 200 μm, more preferably from 20 μm to 100 μm, and most preferably from 25 μm to 60 μm. In this connection, the modulation depth or height should be understood as the deviation measured in a direction parallel to the main extension plane from the intended cylindrical outer path assigned to the narrowest point of the metal-ceramic substrate (measured in a plane parallel to the main extension plane). The intended cylindrical outer path extends perpendicular to the main extension plane. Also, the modulation depth can also be caused by the component metallization part and / or the ceramic element protruding with respect to the backside metallization part in a direction parallel to the main extension plane. For example, it is also conceivable that the side surfaces in the region of the ceramic element have a contour oblique to the stacking direction (in other words, the upper and lower surfaces of the ceramic element have different diameters).

[0017] For example, the path of one or more sides in the region of the sealing part, the component metallization part, and / or the backside metallization part extends parallel to the lamination direction (i.e., the cross-section of the component metallization part and / or the backside metallization part is essentially constant in the region of the component metallization part or the backside metallization part when viewed in the lamination direction). In this case, the modulation depth is preferably realized by a ledge at the level of the ceramic element. In this case, the modulation depth can be generated by contour formation or modulation in the region of the ceramic element, and the contour formation in the lamination direction may be continuous over the thickness of the ceramic element, or discrete or steep at the height of the ceramic element.

[0018] Furthermore, it is conceivable that the insert has one or more ledges protruding in a direction parallel to the main extension plane with respect to the overall path of the outer periphery of the insert. This preferably nose-shaped ledge can advantageously produce an additional form fit in the circumferential direction along the outer periphery, thereby supporting a rotationally fixed arrangement within the matrix. Advantageously, it has been found that such a ledge is formed by cutting out the metal-ceramic substrate from the master card by means of laser light and / or water cutting.

[0019] According to a more preferred embodiment, it is intended that the insert has at least one insert surface connection part, and at least one insert surface connection part is formed on the component surface of the insert and is connected on the component surface facing away from the metal ceramic substrate to an electrical or electronic component, in particular to a component surface connection part on the electrical or electronic component, via through-hole plating. The connection part advantageously enables a sealed, in particular embedded, electrical or electronic component to be controlled and electrically supplied from the outside of the insert by means of conductive paths and / or insert surface connection parts. In this case, the through-hole plating penetrates the sealing part and thus forms a connection between the outside of the insert and the embedded or sealed electrical or electronic component. Thus, it is possible to provide a shortened through-hole plating that realizes an electrical connection with the outside of the insert by means of a corresponding electrical or electronic component having a component surface connection part on its upper surface. In particular, such an insert is intended to be advantageous when the insert integrated into the printed circuit board is flush with the component surface of the printed circuit board on the upper surface of the insert, i.e., on the insert surface facing away from the ceramic substrate. This provides a common plane for the conductive paths on the outside of the printed circuit board, and electrical or electronic components can be embedded inside the printed circuit board, in particular inside the insert, with respect to this component surface.

[0020] Preferably, it is intended that the metal ceramic substrate has a component metallization part, a ceramic element, and a back surface metallization part. In particular, it can be seen that the back surface metallization part is advantageous for counteracting the thermo-mechanical stresses that would otherwise be caused in the metal ceramic substrate due to the different coefficients of thermal expansion of the ceramic on one side and the metal on the other side. By arranging the component metallization part, the ceramic element, and the back surface metallization part symmetrically, it is possible to counteract the corresponding stress generation. This is found to be advantageous for the service life of the insert and thus also for the service life of the printed circuit board.

[0021] Preferably, the component metallization part is structured, and preferably, it is intended that the space between the two metal parts of the component metallization part is filled with the material of the sealing part. In this case, the two metal parts are electrically insulated from each other by the structuring. This enables each metal part to be used individually for different electrical components and their control. It is intended that further through-hole plating is formed for electrically coupling each metal part to the outside of the insert and / or the printed circuit board, and the through-hole plating extends from the outside of the sealing part, particularly from the component side of the printed circuit board, through the sealing part to the component metallization part.

[0022] Preferably, the sealing part is intended to surround the electrical and / or electronic component and at least a part of the metal ceramic substrate. For example, in addition to the electrical or electronic component, it is conceivable that the component metallization part, the ceramic element, and / or the backside metallization part are surrounded by the sealing part, particularly on the surface of the insert. In this way, advantageously, it is possible to provide side walls formed as much as possible by the material of the sealing part. This is found to be advantageous when enabling a simplified connection of the insert to the substrate. For example, it is conceivable that a more effective connection between the sealing part and the substrate than between the metal ceramic substrate and the substrate can be achieved by appropriate adhesion means. It is also conceivable to incorporate a corresponding contour formation into the side walls to support the form-fitting connection between the substrate and the insert. Furthermore, it is conceivable that the sealing part is configured to function as a buffer between the substrate and the metal ceramic substrate to compensate for the corresponding elongation of the substrate and / or the metal ceramic substrate. As a result, the service life of the insert and / or the printed circuit board can be improved.

[0023] Preferably, the side walls of the insert are modeled to form a contour. For example, the ceramic element protrudes in a direction parallel to the main extension plane with respect to the component metallization part and / or the backside metallization part. In this regard, the ceramic element may protrude, for example, from the sealing part or protrude with respect to the sealing part.

[0024] Preferably, the insert is intended to be placed within the sealing part and have further through-hole plating that couples the component metallization part of the metal-ceramic substrate to the insert surface connection part of the insert. Preferably, the dimensioned distance in the stacking direction between the component surface connection part and the insert surface connection part is intended to have a value of 100 μm to 500 μm. Thereby, advantageously, it becomes possible to realize the smallest possible distance between the component surface connection part and the insert surface connection part, which is beneficial for lossless communication of the electrical component with the outside of the insert, especially without loss due to parasitic inductance.

[0025] Furthermore, it is conceivable that the insert has rounded or rounded corners around it in a plane parallel to the main extension plane. This is found to be advantageous as it can cancel out the core effect.

[0026] Preferably, the insert includes a heat sink. Thereby, advantageously, it becomes possible to optimize or adapt the cooling behavior of the insert, especially in a given application field. For example, it is possible to increase the cooling efficiency in the region of the insert by means of a corresponding individually configured heat sink. In particular, it is possible to adapt to the material properties of the insert, that is, especially to the metal-ceramic substrate and the sealing part. Thereby, advantageously, sufficient heat dissipation is enabled, for example, to prevent the insert from tending to separate from the sealing part and the metal-ceramic substrate due to different coefficients of thermal expansion or from tending to generate stress here.

[0027] For example, the heat sink has at least one cooling channel and / or cooling fins and / or is directly connected to the ceramic element. For example, the cooling channel is a loop-shaped or U-shaped cooling channel integrated into the backside metallization. For this purpose, for example, several metal layers having corresponding recesses are stacked on top of each other and joined to each other by a subsequent bonding process, thereby enabling the realization of a complex cooling channel structure, which can be used in particular to provide the most uniform possible cooling efficiency on the upper surface of the insert. Alternatively, at least one cooling fin or several cooling fins may be connected to the lower surface of the insert in order to be cooled in this way by a common cooling medium, for example a coolant. It is conceivable that the cooling structure is flush with the cooling structure provided by the substrate. However, it is also conceivable that the heat sink of the insert protrudes and / or recedes with respect to the backside of the insert or protrudes and / or recedes with respect to the cooling structure of the substrate.

[0028] Preferably, it is intended that at least one wiring level is integrated into the encapsulation. Such a wiring level is particularly suitable for encapsulating at least two or more electrical or electronic components. This is because in this way, electrical contact between the individual components can be achieved via the wiring level. For example, in this case, a connection to an outer common through-hole plating can be provided via the wiring level, through which electrical contact can be made, for example, for the purpose of supplying power to different electrical components.

[0029] In particular, it is conceivable that a three-dimensional conductor track structure embedded in the encapsulation is realized by several wiring levels and through-hole plating or further through-hole plating. This enables the integration of a more complex circuit into the insert without the need to provide a complex encapsulation or wiring on the upper surface that would have to be connected accordingly after inserting the insert into the printed circuit board.

[0030] Preferably, it is intended that the substrate has a different material composition from the insert. In other words, the insert is in particular manufactured from a metal ceramic substrate encapsulated with a specific material, while the printed circuit board is preferably intended to be manufactured from materials commonly used for printed circuit boards that do not contain ceramics or, for example, epoxy resins or other fiber-reinforced plastics.

[0031] Preferably, it is intended that the encapsulation is manufactured from the substrate material and / or plastic, cardboard, and / or epoxy resin. By specifically adapting the encapsulation to the material of the substrate, it is advantageously possible to suppress or even avoid stresses that may occur between the encapsulation and the substrate. However, it may also be advantageous to ensure a specific press fit between the substrate and the encapsulation by adapting the material accordingly, thereby stabilizing and strengthening the fixing of the insert in the substrate.

[0032] Furthermore, more preferably, it is intended that the insert is configured to be insertable into a formed substrate. In other words, the substrate is manufactured integrally, and the insert can be inserted into the integrally manufactured insert. In this more preferred embodiment, the substrate is not constructed around the insert.

[0033] Preferably, it is intended that the encapsulation is manufactured by "compression molding", "transfer molding", or "pre-packaging" preferably with plastic, cardboard, and / or epoxy resin.

[0034] Another object of the present invention is an insert for a printed circuit board according to the present invention. All advantages and characteristics described with respect to the printed circuit board can equally be transferred to the insert and vice versa.

[0035] A further object of the present invention is a method for manufacturing a printed circuit board according to the present invention, wherein an insert and a substrate are provided, the insert is inserted into the substrate, and the insert and the substrate are joined to each other by an adhesive bond, a press fit, and / or a form fit method. All advantages and characteristics described with respect to the printed circuit board can equally be transferred to this method and vice versa.

[0036] Preferably, the insert is contoured to achieve a form fit connection between the insert and the substrate of the printed circuit board in the stacking direction. In particular, the contouring can be carried out, for example, by etching, by machining, for example by milling, by machining using a laser beam, and / or by a water jet.

[0037] Furthermore, it is intended that holes are provided in the sealing part in order to realize corresponding through-hole plating for connecting the outside of the insert to electrical or electronic components. Alternatively, it is conceivable that a space for subsequent through-hole plating is formed during the sealing part manufacturing process. For example, for this purpose, the corresponding shape of the mold, in particular the mold half, is designed in an injection molding or casting process, for example an injection molding process, in such a way that a corresponding free space is provided for subsequent through-hole plating. More preferably, displaceably mounted stamping elements are intended to be placed in the mold in order to ensure that these stamping elements are displaced before the cavity is filled and, in particular, are arranged on electrical or electronic components embedded in a metal-ceramic substrate. Thereby, advantageously, it is possible to prevent electrical and / or electronic components from being damaged due to slight displacement changes or position changes of the components bonded to the metal-ceramic substrate during the sealing part forming process.

[0038] The essential components of a metal-ceramic substrate are, more preferably, an insulating layer made entirely of ceramic and at least one metal layer bonded to the insulating layer. Insulating layers made of ceramic have proven to be particularly advantageous in power electronics due to their relatively high dielectric strength. By structuring the metal layer, conductive paths and / or connection areas for electrical components can be realized. Preferably, the component metallization part of the metal-ceramic substrate, which is intended as an insert, is not structured and is intended to form a closed surface. A prerequisite for providing such a metal-ceramic substrate is a permanent bond between the metal layer and the ceramic layer. In addition to the so-called direct metallurgical bonding process, i.e., the DCB or DAB process, bonding via an active soldering process, a thick-film coating process, diffusion bonding, and / or hot isostatic pressing is also conceivable.

[0039] Materials conceivable for the metal layer or the metallization part are copper, aluminum, molybdenum, tungsten, and / or their alloys such as CuZr, AlSi, or AlMgSi, and laminates such as CuW, CuMo, CuAl, and / or AlCu, or MMC (metal matrix composite) such as CuW, CuMo, or AlSiC (metal matrix composite). Furthermore, more preferably, the metal layer or the metallization part, especially as the component metallization part, is intended to be surface-modified on the manufactured metal-ceramic substrate. Conceivable surface modifications include, for example, noble metals, especially silver; and / or gold, or sealing by (electroless) nickel or ENIG (electroless nickel immersion gold) (so-called electroless nickel immersion gold), or edge sealing on the metallization part to suppress crack formation or expansion. For example, the metal of the component metallization part is also different from the metal of the backside metallization part.

[0040] Preferably, the ceramic element includes, as the ceramic material, Al2O3, Si3N4, AlN, HPSX ceramic (i.e., a ceramic having an Al2O3 matrix containing x percent by ratio of ZrO2, for example, Al2O3 having 9% ZrO2 = HPS9 or Al2O3 having 25% ZrO2 = HPS25), SiC, BeO, MgO, high-density MgO (>90% of the theoretical density), and TSZ (tetragonal stabilized zirconia). It is also conceivable that the ceramic element is configured as a composite ceramic or a hybrid ceramic. In this case, several ceramic layers with different material compositions are arranged on top of each other and joined to each other to form the ceramic element in order to combine various desired properties.

[0041] Preferably, the insert, particularly the metal-ceramic substrate, is intended to have a round contour or rounded corners on the main extension plane. The corresponding shape of the cross-section of the insert in a plane extending parallel to the main extension plane is found to be advantageous because it can particularly reduce the notch effect on the substrate of the printed circuit board as a result. Thereby, the service life of the printed circuit board having the insert can be extended.

[0042] Preferably, it is provided that the metal-ceramic substrate includes a ceramic element, and the component metallization part is bonded to the ceramic element. A backside metallization part is provided or formed on the side opposite to the component metallization part in the stacking direction extending perpendicular to the main extension plane. For example, a stabilization layer in the form of a further ceramic element is provided or formed, a metal intermediate layer is arranged between the ceramic element and the stabilization layer, and / or The component metallization part and / or the backside metallization part includes a first metal layer and / or a second metal layer, and the first metal layer and the second metal layer are arranged one on top of the other.

[0043] In particular, in order to adapt to the coefficient of thermal expansion of the substrate, it is possible to influence the coefficient of thermal expansion of the insert by means of the corresponding configuration of the metal-ceramic substrate. For example, it is conceivable to configure the stabilization layer from different materials or dimension the stabilization layer accordingly. The thickness of the ceramic element can also be used to optimize the thermo-mechanical expansion coefficient of the insert so that the mechanical stress between the substrate and the insert is reduced. Preferably, the first metal layer differs from the second metal layer with respect to the particle size, more preferably the particle size in the first metal layer is smaller than the particle size in the second metal layer, and / or most preferably the thickness of the first metal layer is thinner than that of the second metal layer. Furthermore, it is conceivable that the thickness of the component metallization part is different from the thickness of the backside metallization part. In this way, advantageously, it is possible to influence the height position of the ceramic element in the substrate of the printed circuit board, in particular to ensure that a ceramic element having an insulating effect is offset towards the backside within the substrate and arranged away from the component side, or vice versa.

[0044] In particular, it is intended that the insert is reinserted into the substrate and the insert and the substrate are joined to each other by means of an adhesive bond, a press fit, and / or a form fit.

Brief Description of the Drawings

[0045] Further advantages and features result from the following description of more preferred embodiments of the object according to the invention with reference to the accompanying drawings. Thereby, the individual features of the individual embodiments can be combined with each other within the scope of the invention.

[0046] This is shown below.

Figure 1

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Figure 5d

Figure 6a

Figure 6b

Figure 6c

Figure 6d

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Figure 8

Mode for Carrying Out the Invention

[0047] Figure 1 shows a printed circuit board 100 according to a first preferred embodiment of the present invention in a top view (above) and a cross-sectional view (below). Such a printed circuit board 100 functions in particular as a carrier for a circuit formed by electrical or electronic components 5, connection parts 7, and / or conductive paths 4. The electrical or electronic components 5, the conductive paths 4, and / or the connection parts 7, for example in the form of solder pads (pads) or solder lands, are preferably arranged or connected on the component side BS of the printed circuit board 100. For the particularly cost-effective production of such a printed circuit board 100, it has become an established practice to use plastic, in particular fiber-reinforced plastic, epoxy resin, and / or cardboard as the material for the substrate 2 that essentially extends along the main extension plane HSE and on whose component side BS the electronic components 5 are formed or mounted. Preferably, the electrical or electronic components 5 are power components. The conductive paths 4 can also be understood as electrical components 5.

[0048] Particularly with regard to the performance of the electrical components 5, it has become apparent that due to the continuous further development in the field of electronics, the materials used for the substrate 2 can no longer permanently withstand new challenges, particularly with regard to the heat generated during operation. This is due in particular to the fact that the materials mentioned for the substrate 2 of the printed circuit board 100 have a relatively low thermal conductivity, which means that the heat generated by the electrical components during operation cannot be dissipated to a sufficient extent.

[0049] On the other hand, a printed circuit board 100 configured as a metal-ceramic substrate can dissipate the generated heat to a sufficient extent because of its high thermal conductivity, particularly compared to a printed circuit board manufactured from the above-mentioned materials, i.e., a substrate 2 of plastic, in particular fiber-reinforced plastic, epoxy resin, and / or cardboard. However, it is more complex and costly to manufacture in terms of manufacturing technology.

[0050] In order to utilize the plus characteristics of the printed circuit board 100 made of plastic, epoxy resin, or hard paper, and the plus characteristics of the metal ceramic substrate, particularly its thermal conductivity, preferably, the printed circuit board 100 according to the embodiment shown in FIG. 1 extends along the main extension plane HSE and has a substrate 2 with an insert 1 integrated therein. The insert 1 is intended to include the metal ceramic substrate 15. Preferably, the insert 1 is intended to be arranged at a position in the printed circuit board 100 where an increase in heat generation is expected.

[0051] Preferably, it is intended that at least one insert 1, preferably several inserts 1, be integrated into the substrate 2 of the printed circuit board 100. The component surface BS of the insert 1 is preferably substantially flush with the component surface BS of the substrate 2, and / or the back surface RS of the insert 1 is flush with the back surface RS of the substrate 2. Further, preferably, the ratio of the volume of the insert 1 or the plurality of inserts 1 to the volume of the substrate 2 or the entire printed circuit board 100 is intended to be less than 30%, more preferably less than 20%, and even more preferably less than 10%. At such a low ratio, it has already been possible to effectively improve the thermal characteristics of the printed circuit board 100, and at the same time, it has been found that it is possible to work mainly with a material for the substrate 2 that is easier to process and less costly than the metal ceramic substrate 15.

[0052] Preferably, the insert 1 is, in particular, flush with the component surface BS and the back surface RS of the substrate 2 in the stacking direction S extending perpendicular to the main extension direction HSE, and is intended to cooperate with the substrate 2 in a form-fitting, press-fitting, and / or adhesive-bonding manner in a direction extending perpendicular to the main extension direction HSE. This enables or supports the reliable retention of the insert 1 in the printed circuit board 100. In particular, the bonding is intended to be both adhesive-bonding and form-fitting. Preferably, whether it is the material of the substrate 2 or one or several of the materials of the ceramic element 30, the material selection is intended to be made such that the difference in the coefficient of thermal expansion is kept as low as possible in order to prevent the thermal mechanical stress from causing cracks and / or damage to the printed circuit board 100 and / or the metal-ceramic substrate 15. Preferably, the coefficient of thermal expansion of the insert 1 does not deviate from that of the substrate 2 by more than 30%, more preferably by more than 15%, and most preferably by more than 10%. To select the insert in question, a person skilled in the art uses, for example, simulations for the respective compositions of the insert 1 and compares these with the values for the substrate 2.

[0053] In particular, the insert 1 is intended to comprise the metal-ceramic substrate 15 and the electrical and / or electronic component 5. In particular, the electrical and / or electronic component 5 is already bonded, for example soldered, as part of the insert 1 to the component metallization 20 of the metal-ceramic substrate 15. In addition to the metal-ceramic substrate 15 and the electrical and / or electronic component 5, the insert 1 further comprises a sealing part 10 that surrounds the electrical and / or electronic component 5 and preferably completely closes it with respect to the component surface BS, and thus surrounds it. In this way, the electrical and / or electronic component 5 that releases heat during operation can already be placed in an advantageous manner together with the metal-ceramic substrate 15 as the insert 1 into the substrate 2 of the printed circuit board 100. In this way, such electrical and / or electronic components 5 that release increased heat during operation can be immediately installed in the corresponding environment so that appropriate heat dissipation is ensured.

[0054] Preferably, for this purpose, the insert 1 is intended to have a side wall SW which is perpendicular to the main extension plane HSE and has an overall path connecting the component side BS and the back side RS of the insert to each other. Preferably, the side wall SW is contoured, for example, in a concave and / or convex shape so as to form a form-fitting connection in the assembled state with the substrate 2 of the printed circuit board 100.

[0055] Figures 2a to 2c show examples of more preferred embodiments of the insert 1 according to the present invention. In Figure 2a, the insert 1 is intended to surround the electrical and / or electronic component 5 with the sealing portion 10, that is, to surround the electrical and / or electronic component 5 on at least three different surfaces so that the component 5 is not exposed on any surface. In particular, the electrical and / or electronic component 5 is embedded in the sealing portion 10, and the sealing portion 10 is solid, that is, there are no cavities. In particular, it is the sealing portion 10 manufactured within the scope of a pressing, casting, or injection molding process. Such a sealing portion 10 is solid and can be manufactured relatively easily. Further, preferably, the insert surface connection portion 8 is intended to be outside the sealing portion 10, particularly on the outside facing the component surface BS in the installed state. Through these insert surface connection portions 8, for example, a connection or contact to another conductive path 4 or an external line can be made in the installed state. The insert surface connection portion 8 is preferably connected to the component surface connection portion 7 via the through-hole plating 9 of the sealing portion 10. In particular, these are the component surface connection portions 7 arranged on the upper surface, that is, the surface of the component 5 facing away from the metal-ceramic substrate 15. Further, preferably, the sealing portion 10 is intended to have a first thickness D1 along the stacking direction S, and the metal-ceramic substrate 15 is intended to have a second thickness D2. Preferably, the ratio of the first thickness D1 to the second thickness D2 has a value of 0.1 to 0.7, more preferably 0.15 to 0.4, and even more preferably 0.18 to 0.23. Further, more preferably, the sealing portion 10 is dimensioned such that the distance D between the component surface connection portion 7 and the insert surface connection portion 8 measured in the stacking direction S has a value of 100 μm to 500 μm. Thereby, advantageously, it becomes possible to realize a connection with as little electrical loss as possible between the external insert surface connection portion 8 and the sealed component surface connection portion 7 on the component 5.

[0056] Furthermore, most preferably, the metal ceramic substrate 15 is intended to have a component metallization portion 20, a ceramic element 30, and a backside metallization portion 20'. It is contemplated that a third thickness D3 of the component metallization portion 20 dimensioned in the stacking direction S is of the same magnitude as a fourth thickness D4 of the backside metallization portion 20' dimensioned in the stacking direction S. Thus, symmetry between the front and back surfaces of the metal ceramic substrate can be provided, thereby counteracting bending.

[0057] Furthermore, more preferably, the ceramic element 30 dimensioned in the stacking direction S is intended to have a fifth thickness D5 having a value of 0.07 mm to 0.4 mm, more preferably 0.15 to 0.4 mm, and most preferably 0.22 to 0.28 mm. By the insert 1 being insulated within the substrate 2, the substrate 2 also has a stabilizing effect on the insulating ceramic element 30, and as a result, the mechanical stability of the insert 1 in the installed state is improved. Thereby, for example, it also becomes possible to use a relatively thin ceramic element 30. Preferably, the third thickness D3 and / or the fourth thickness D4 have a value of 0.1 mm to 0.8 mm, more preferably 0.15 mm to 0.7 mm, and most preferably 0.3 to 0.7 mm. Also, it is contemplated that the third thickness D3 has a value greater than 1.3 mm, more preferably greater than 1.8 mm, and most preferably greater than 2 mm.

[0058] Furthermore, most preferably, in the embodiment of FIG. 2a, it is intended that a first extent A1 of the sealing portion 10 measured in a direction extending parallel to the main extension plane HSE is smaller than a second extent A2 of the metal ceramic substrate 15 measured parallel to the main extension plane HSE. As a result, the metal ceramic substrate 15 protrudes in the direction of the main extension plane HSE with respect to the outermost edge portion of the sealing portion 10.

[0059] In the exemplary embodiment of FIG. 2b, the insert 1 is intended to comprise, in addition to the electrical and / or electronic component 5, a second electrical and / or electronic component 5 connected in combination to the component metallization part 20, and the electrical and / or electronic components 5 are in electrical contact with each other via the component metallization part 20. Projecting the metal-ceramic substrate 1 in a direction parallel to the main extension plane HSE with respect to the outermost edge part of the sealing part 10 is particularly advantageous in that it enables direct contact of the component metallization part 20 coming especially from the component side BS. In this way, the component metallization part 20 can also be used to control the encapsulated or embedded component 5.

[0060] In the embodiment shown in FIG. 2c, it is intended that the component metallization part 20 is structured such that two metal parts 21 insulated from each other are realized within the metal-ceramic substrate 15. In this case, the space between the two metal parts 21 is filled with the material of the sealing part 10. For example, here, a conductive path 4 formed on the outside of the insert 1, especially on the outside of the insert 1 facing the component side BS, is further intended to cause an electrical coupling between the electrical component 5 of one metal part 21 and the metal part 21 of a further electrical component 5. In particular, it is intended that a further through-hole plating 19 is provided for connecting the insert surface connection part 8 to the component metallization part 20.

[0061] FIGS. 3a and 3b show further embodiments of the insert 1 according to the invention. Here, the inserts 1 in FIGS. 3a and 3b differ essentially from the insert in FIG. 2a only in that the metal-ceramic substrate 15 has a different configuration. In particular, in the embodiment of FIG. 3a, it is intended that a third spread A3 of the ceramic element along a direction parallel to the main extension plane HSE is larger than a fourth spread A4 of the component metallization part 20 and / or the backside metallization part 20'. In particular, in the embodiment of FIG. 3a, it is intended that the fourth spread A4 of the component metallization part 20 corresponds to the fourth spread A4 of the backside metallization part 20'. The ceramic element 30 protruding from the side wall SW, in particular the ceramic element 30 protruding with respect to the component metallization part 20 and / or the backside metallization part 20', forms a so-called pull-back that contributes to the electrical and / or electronic insulation between the component metallization part 20 and the backside metallization part 20'. In addition, the protruding part of the ceramic element 30 can be used to provide a part suitable for forming a form-fit connection between the substrate 2 of the printed circuit board 100 and the insert 1, thereby further improving the connection between the insert 1 and the printed circuit board 100 in the assembled state. In particular, by protruding with respect to the component metallization part 20 and the backside metallization part 20', it is thus possible to realize a form-fit that interacts in a direction substantially perpendicular to the main extension plane HSE in both the direction of the component side BS and the direction of the backside RS, i.e., on both sides.

[0062] In the exemplary embodiment shown in FIG. 3b, in contrast to the exemplary embodiment of FIG. 3a, the fourth spread A4 of the backside metallization portion 20' is intended to be larger than the fourth spread A4 of the component metallization portion 20 and larger than the third spread A3 of the ceramic element 30. In this way, the insert 1 that tapers from the backside RS towards the component side BS, particularly tapers stepwise, is realized. In particular, by appropriately dimensioning the fourth spread A4 of the component metallization portion 20 and the backside metallization portion 20' and the third spread A3 of the ceramic element 30, the outer shape of the metal-ceramic substrate 15 can be realized, and this outer shape can be used, for example, in the sense of a key-lock principle that only allows the appropriate insertion of the insert into the corresponding hole of the substrate 2 predetermined in a corresponding manner by the printed circuit board 100 or the substrate. Thereby, for example, it is possible to prevent the incorrect insert 1 from being inadvertently inserted into the printed circuit board 100.

[0063] Alternatively, it is conceivable that the fourth spread A4 of the backside metallization portion 20' is larger than the fourth spread A4 of the component metallization portion 20 and smaller than the third spread A3 of the ceramic element 30.

[0064] FIGS. 4a to 4c show further embodiments of the insert 1 according to the present invention. In particular, in the embodiments of FIGS. 4a to 4c, it is intended that the first spread A1 of the sealing portion 10 corresponds to the fourth spread A4 of the component metallization portion 20. Thus, in particular, it is intended that the sealing portion 10 is oriented to form a common plane with the side wall SW of the component metallization portion 10 on the outer periphery or side wall SW of the insert 1. In order to achieve electrical contact with the component metallization portion 20, most preferably, it is intended that a further through-hole plating 19 is provided to electrically couple the insert surface connection portion 8 to the component metallization portion 20. In the corresponding method, such a further through-hole plating 19 is also embedded in the sealing portion 10, and the further through-hole plating 19 extends from the outside of the sealing portion 10 to the component metallization portion 20.

[0065] The embodiment example of FIG. 4b is substantially different from the embodiment example of FIG. 4a in that the third spread A3 of the ceramic element 30 forming the pull-back is larger than the fourth spread A4 of the component metallization portion 20 and the back surface metallization portion 20'.

[0066] In the embodiment example of FIG. 4c, similar to the embodiment example of FIG. 3b, the fourth spread A4 of the back surface metallization portion 20' is larger than the third spread A3 of the ceramic element 30 and the fourth spread A4 of the component metallization portion 20.

[0067] Figures 5a to 5d show further embodiments of the insert 1 according to the present invention. In each of Figures 5a to 5d, it is intended that the sealing portion 10 is configured to also surround or enclose the component metallization portion 20. In other words, in the embodiments of Figures 5a to 5d, both the electrical and / or electronic component 5 and the component metallization portion 20 are embedded in the sealing portion 10, and in particular, the side wall SW of the component metallization portion 20 is also surrounded or enclosed by the sealing portion 10. This makes it possible to achieve additional insulation of the component metallization portion 20 with respect to the substrate 2 of the printed circuit board 100. In the exemplary embodiment shown in Figure 5a, it is intended that the fourth spread A4 of the back surface metallization portion 20' substantially corresponds to the fourth spread A4 of the component metallization portion 20.

[0068] In the exemplary embodiment shown in Figure 5b, thereby, the fourth spread A4 of the back surface metallization portion 20' is, on the other hand, intended to substantially correspond to the first spread A1 of the sealing portion 10 and / or the third spread A3 of the ceramic element 30. This ensures that the sealing portion 10, the ceramic element 30, and the back surface metallization portion 20 terminate together towards the side surface of the insert 1.

[0069] In Figure 5c, the fourth spread A4 of the back surface metallization portion 20' is larger than the first spread A1 of the sealing portion 10 and the third spread A3 of the ceramic element 30, thereby providing a corresponding protruding shape of the back surface metallization portion 20 with respect to the outermost periphery of the sealing portion 10 and the ceramic element 30.

[0070] In the exemplary embodiment of Figure 5d, it is further intended that in addition to the electrical component 5 and the component metallization portion 20, the ceramic element 30 is also surrounded or enclosed by the sealing portion 10. In particular, the side wall SW of the ceramic element 30 is surrounded and enclosed by the sealing portion 20. As a result, the ceramic element 30 is spaced apart from the substrate 2 of the printed circuit board 100 in the assembled state.

[0071] Furthermore, preferably, in the embodiment of FIG. 5d, the fourth spread A4 of the back surface metallization portion 20' substantially corresponds to the first spread A1 of the sealing portion 10, and it is provided that the fourth spread A4 of the component metallization portion 20 is smaller than the fourth spread A4 of the back surface metallization portion 20'.

[0072] FIGS. 6a to 6d show further embodiments of the insert 1 according to the present invention. Thereby, in the embodiments of FIGS. 6a to 6d, the sealing portion 10 is intended to surround the electrical and / or electronic component 5, the component metallization portion 20, and the back surface metallization portion 20'. In the embodiment example shown in FIG. 6a, the sealing portion 10 completely covers the side wall SW of the insert 1. This is found to be advantageous especially when the proper formation of the sealing portion 10 facilitates the bonding to the substrate 2, for example by a proper adhesive to the substrate 2. Further, in the embodiment example of FIG. 6a, it is intended that the third spread A3 of the ceramic element 30 corresponds to the fourth spread A4 of the component metallization portion 20 and the back surface metallization portion 20'. In particular, it is intended that the sealing portion 10 is configured such that the side walls SW of the electrical and / or electronic component 5, the component metallization portion 20, the ceramic element 30, and the back surface metallization portion 20' are sealed by the sealing portion 10.

[0073] The embodiment example of FIG. 6b differs from the embodiment example of FIG. 6a only in that the ceramic element 30 for forming a pull-back has a third spread A3 that is larger than the fourth spread A4 of the component metallization portion 20 and / or the back surface metallization portion 20', but smaller than the first spread A1 of the sealing portion.

[0074] In the exemplary embodiment of FIG. 6c, it is intended that the fourth spread A4 of the backside metallization portion 20' is larger than the third spread A3 of the ceramic element 30 and the fourth spread A4 of the component metallization portion 20. In the embodiments of FIGS. 6b and 6c, similarly, the electrical component 5, the component metallization portion 20, the ceramic element 30, and the backside metallization portion 20' are each surrounded by the sealing portion 10 at their sidewalls SW such that the sidewall SW of the insert 1 is formed only of the material of the sealing portion 10. In FIG. 6d, it is intended that the third spread A3 substantially corresponds to the first spread A1 of the sealing portion 10. In other words, the ceramic element 30 within the insert 1 extends up to the sidewall of the insert 1, where it is flush with the sealing portion 10 and preferably forms a part of the sidewall SW.

[0075] FIGS. 7a and 7b show a printed circuit board 100 according to a more preferred embodiment of the present invention. In particular, in FIG. 7a, it is intended that two inserts 1 are placed in the substrate 2 to form the printed circuit board 100. The printed circuit board 100, and in particular the substrate 2, may be provided with further conductor elements 27 integrated into the substrate 2 for lateral contact, for example, with the component metallization portion 20 and / or the backside metallization portion 20' of the insert 1.

[0076] Furthermore, in the installed state, it is conceivable that the conductive path 5 on the base body 2 of the printed circuit board 100 is connected to the insert surface connection portion 8 via, for example, the corresponding conductive path 4. Further, most preferably, it is intended that on the component surface BS and / or the back surface RS of the printed circuit board 100, the outside of the base body 2 is substantially flush with the outside of the sealing portion 10 and / or the back surface metallization portion 20'. Thereby, the outside of the insert 1 and the connection portion and / or the conductive path 4 on the base body 2 can be arranged on one plane. In other words, more preferably, in the printed circuit board 100, the electrical or electronic component 5 of the insert 1 is intended to be embedded inside the printed circuit board 100 with respect to the outside of the base body 2, that is, inside the insert 1. In other words, the electrical or electronic component 5 is offset inward with respect to the outside, particularly the component surface BS of the printed circuit board 100, and is integrated with the printed circuit board 100.

[0077] In the embodiment example of FIG. 7b, it is intended that an insert 1 having a structured component metallization portion 20 is provided. The metal portions 21 of the component metallization portion 20 of this insert 1 can be electronically coupled to each other via, for example, the conductive paths 4 on the base body 2 and / or on the insert 1.

[0078] Furthermore, the back surface metallization portion 20 may protrude from the base body 2 in order to ensure good thermal connection to the cooling element. FIG. 8 shows another example of an embodiment of the insert 1 according to the present invention. In particular, the embodiment example shown in FIG. 8 includes two further features, which can be integrated, individually or collectively, into any other embodiment protruding or listed above. This applies in particular to the different dimensions of the component metallization part 20 and the back surface metallization part 20' illustrated in the previous figures or to the different shapes of the sealing part 10. In particular, this embodiment example is characterized by the fact that the wiring plane 11 is integrated into the sealing part 10. Such a wiring level 11, arranged in particular within the sealing part 10, advantageously makes it possible to combine contacts to different components 5 and make them available at a common connection part outside the sealing part 10. For this purpose, the wiring level 11 extends, for example in the form of a metal layer, essentially parallel to the main extension plane HSE and in particular perpendicular and / or obliquely to the direction of spread of the through-hole plating 9 which is in contact with the upper surface of the component metallization part 20 and / or the electrical or electronic component 5. It is also conceivable that several wiring levels 11 are integrated within the sealing part 10 and they are, in particular, at different distances from the upper surface of the component metallization part 20.

[0079] In particular, it is advantageous to integrate the corresponding wiring level 11 into such a sealing part 10 which surrounds or covers at least two electrical components 5 with respect to each other. In particular, the electrical components 5 are in electrical contact with each other via the wiring level 11. In particular, the wiring level 11 is arranged between the upper surface of the sealing part 10 and the electronic component 5 and it is intended in particular that a direct electrical contact to the component surface connection part 7 is realized via the wiring level 11, in particular on the upper surface of the electronic component. This also advantageously makes it possible to provide a supply voltage to the various electrical components 5, for example via a common connection part outside the sealing part 10. In particular, it is conceivable that a three-dimensional conductor track structure is integrated into the sealing part 10 by means of the various wiring levels 11 and the through-hole plating 9 or a further through-hole plating 19.

[0080] A further feature of the embodiment example of FIG. 8, which can also be integrated into all other embodiments of the present invention, is the design of the back surface metallization portion 20' as the heat sink 40, or the formation of the heat sink 40 on the cooling side or the back surface RS of the insert 1. In this regard, in order for the coolant to penetrate the heat sink 40, thereby enabling heat dissipation from the component surface BS, the heat sink 40 can be unstructured and / or have at least one fin and / or be provided with cooling channels, particularly U-shaped cooling channels. In particular, in order to provide as uniform cooling as possible in the region of the insert 1, it is conceivable that a plurality of loop-shaped or U-shaped cooling channels are integrated into the heat sink 40. Preferably, the heat sink 40 of the insert 1 is configured separately from the heat sink 40 of the substrate 2 of the printed circuit board 100. Thereby, advantageously, it becomes possible to intend individual cooling for the insert 1, for example, to cope with a correspondingly increasing heat load. Alternatively, it is also conceivable that the heat sink 40 of the insert 1 is part of the heat sink of the entire printed circuit board 100, that is, particularly part of the heat sink of the substrate 2. In this case, the heat sink 40 of the insert 1 and the substrate 2 are in one plane and / or, in the assembled state, essentially seamlessly merge with each other at least on the cooling side or the back surface RS. Furthermore, the heat sink structure or the heat sink 40 in the region of the insert 1 and the heat sink structure or the heat sink 40 in the region of the substrate 2 can be different from each other or substantially similar and at least of the same type. Also, the heat sink 40 can be directly bonded to the ceramic element 30, that is, particularly by an active soldering process using hot isostatic pressing or by a direct metal bonding process, directly bonded to the ceramic element 30.

Explanation of Signs

[0081] 1 Insert 2 Substrate 4 Conductive Path 5 Component 7 Component Surface Connection 8 Insert surface connection part 9 Through-hole plating 10 Sealing part 11 Wiring level 15 Metal ceramic substrate 19 Through-hole plating 20 Component metallization part 20’ Back surface metallization part 21 Metal part 27 Conductor element 30 Ceramic element 40 Heat sink 100 Printed circuit board HSE Main extension surface A1 First spread A2 Second spread A3 Third spread A4 Fourth spread D1 First thickness D2 Second thickness D3 Third thickness D4 Fourth thickness D5 Fifth thickness D Distance S Lamination direction RS Back surface BS Component surface

Claims

1. A printed circuit board (100) for an electrical component (5) and / or a conductive path (4), comprising: a substrate (2) extending along a main extension plane (HSE); an insert (1) integrated with the substrate (2); The insert (1) comprises a metal-ceramic substrate (15), electrical and / or electronic components (5), and a sealing portion (10) surrounding at least the electrical and / or electronic components (5). In addition to the electrical and / or electronic components, the component metallization portion, ceramic elements, and / or backside metallization portion of the metal-ceramic substrate (15) are surrounded by the sealing portion on the surface of the insert, and the ceramic elements protrude with respect to the component metallization portion and / or the backside metallization portion. The insert (1) has at least one insert surface connection portion (8). At least one insert surface connection portion (8) is formed on the component surface (BS) of the insert (1) and faces away from the metal-ceramic substrate (15). On the component surface, it is connected to the electrical and / or electronic components (5) within the sealing portion (10) via through-hole plating (9), in particular to the component surface connection portion (7) on the electrical or electronic component (5). A printed circuit board (100).

2. In the printed circuit board (100) according to Claim 1, The metal-ceramic substrate (15) has a component metallization portion (20), ceramic elements (30), and preferably a backside metallization portion (20'). A printed circuit board (100).

3. In the printed circuit board (100) according to Claim 1 or 2, The component metallization portion (20) is structured. Preferably, the space between two metal portions (21) of the component metallization portion (20) is filled with material from the sealing portion (10). A printed circuit board (100).

4. In the printed circuit board (100) according to any one of Claims 1 to 3, The sealing portion (10) surrounds the electrical and / or electronic components (5) and at least a part of the metal-ceramic substrate (15). A printed circuit board (100).

5. In the printed circuit board (100) according to any one of Claims 1 to 4, ​ The side wall (SW) of the insert (1) is modeled to form a contour. For example, the ceramic element (30) protrudes in a direction parallel to the main extension plane (HSE) with respect to the component metallization part (20) and / or the backside metallization part (20') of the printed circuit board (100).

6. In the printed circuit board (100) according to any one of Claims 1 to 5, the insert (1) is placed within the encapsulation part (10) and includes yet another through-hole plating (19) that couples the component metallization part (20) of the metal-ceramic substrate (15) to the insert surface connection part (8) of the insert (1), the printed circuit board (100).

7. In the printed circuit board (100) according to Claim 1, the distance (D) dimensioned in the stacking direction (S) between the component surface connection part (7) and the insert surface connection part (8) has a value of 100 μm to 500 μm, the printed circuit board (100).

8. In the printed circuit board (100) according to any one of Claims 1 to 7, the insert (1) includes a heat sink (40), the printed circuit board (100).

9. In the printed circuit board (100) according to Claim 8, the heat sink (40) has at least one cooling channel and / or at least one cooling fin and / or is directly connected to the ceramic element (30), the printed circuit board (100).

10. In the printed circuit board (100) according to any one of Claims 1 to 9, at least one wiring level (11) is integrated into the encapsulation part (10), the printed circuit board (100).

11. In the printed circuit board (100) according to any one of Claims 1 to 10, the substrate (2) has a material composition different from that of the insert (1), the printed circuit board (100).

12. In the printed circuit board (100) according to any one of Claims 1 to 11, the encapsulation part (10) is the substrate (2) material and / or manufactured from plastic, cardboard, and / or epoxy resin, the printed circuit board (100).

13. An insert (1) for a printed circuit board (100) according to any one of Claims 1 to 12, wherein a metal-ceramic substrate (15), electrical and / or electronic components (5), A sealing portion (10) that surrounds at least electrical and / or electronic components (5), comprising: In addition to the electrical and / or electronic components, a component metallization portion, a ceramic element, and / or a back surface metallization portion of a metal ceramic substrate (15) are surrounded by the sealing portion on the surface of the insert, and the ceramic element protrudes with respect to the component metallization portion and / or the back surface metallization portion. An insert (1).

14. A method for manufacturing a printed circuit board (100) according to any one of Claims 1 to 12, wherein the insert (1) and the substrate (2) according to Claim 13 are provided, the insert (1) is inserted into the substrate (2), and the insert (1) and the substrate (2) are joined to each other by an adhesive bond, a press fit, and / or a form fit method.

Images