Transfer device

Abstract

To provide a transfer device which efficiently and surely implements transfer of an electronic component.SOLUTION: A transfer device comprises: a first rotary transfer section which moves a first holding section sucking and holding an electronic component along a circular orbit; a second rotary transfer section which moves a second holding section sucking and holding the electronic component along a circular orbit; and a position correction section which is provided between the first rotary transfer section and the second rotary transfer section on a transfer path of the electronic component and delivers the electronic component received from the first holding section to the second holding section after correcting a position. The position correction section includes: a sucking and holding section which includes a sucking face sucking and holding the electronic component and delivers the electronic component with the first holding section and the second holding section; a rotary transfer table which moves the sucking and holding section along a circular orbit; and a parallel driving section which moves the rotary transfer table in parallel and corrects a plane position of the electronic component sucked and held by the sucking and holding section. The sucking face of the sucking and holding section and a sucking face of the second holding section, which are opposed at a second delivery position, are parallel.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a conveying device for electronic components.

Background Art

[0002] After being manufactured, electronic components such as semiconductor elements are shipped through processes such as appearance inspection, electrical characteristic inspection, and marking processing. In these processes, the electronic components need to be in an appropriate posture, and the posture of the electronic components is corrected before performing the processing of each process.

[0003] For example, Patent Document 1 discloses an electronic component processing apparatus including a first rotation transfer unit having a first holding unit for holding an electronic component and moving the first holding unit along a first circular orbit, and a second rotation transfer unit having a second holding unit for holding an electronic component and moving the second holding unit along a second circular orbit passing through a transfer region where the electronic component can be transferred between the first holding unit and the second holding unit, and a position adjustment unit for adjusting the position of the second holding unit in the transfer region.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the technique described in Patent Document 1 above, the second rotation transfer unit moves the electronic component received from the first rotation transfer unit to the position of an intermediate processing unit that performs processing such as appearance inspection, and moves the electronic component processed by the intermediate processing unit to the transfer position to the first rotation transfer unit. Therefore, the position adjustment unit cannot adjust the position of the second holding unit while the intermediate processing unit is performing processing, and it is necessary to separately secure time for performing alignment processing at the time of transferring the electronic component.

[0006] In addition, the electronic component is conveyed by a holding unit that holds the electronic component by adsorption on an adsorption surface, such as an adsorption collet. In order to stably convey the electronic component without dropping it, it is important that the electronic component is held on the adsorption surface of the holding unit without tilting. For example, in the case of an electronic component with a relatively large size (for example, the length of the long side is about 5 to 10 mm), it is difficult for tilting with respect to the adsorption surface to occur in the first place. However, in the case of an electronic component with a relatively small size (for example, the length of the long side is about 0.5 to 1 mm), when the holding unit picks up the electronic component to be conveyed from the wafer sheet, the bump (electrode) of the electronic component may enter the suction hole of the adsorption surface, and the electronic component may tilt and be held on the adsorption surface.

[0007] Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a conveying device for electronic components capable of efficiently and reliably conveying electronic components.

Means for Solving the Problems

[0008] In order to solve the above problems, according to one aspect of the present invention, there is provided a first holding unit that holds an electronic component by adsorption on an adsorption surface, a first rotary conveyance unit that moves the first holding unit along a circular orbit, a second holding unit that holds an electronic component by adsorption on an adsorption surface, a second rotary conveyance unit that moves the second holding unit along a circular orbit, and a position correction unit that is provided between the first rotary conveyance unit and the second rotary conveyance unit on the conveyance path of the electronic component, corrects the position of the electronic component received from the first holding unit, and delivers it to the second holding unit. The position correction unit has an adsorption surface that adsorbs and holds the electronic component, an adsorption holding unit that performs the delivery of the electronic component with the first holding unit at a first delivery position and performs the delivery of the electronic component with the second holding unit at a second delivery position, a rotary conveyance table provided with the adsorption holding unit and moving the adsorption holding unit along a circular orbit centered on a rotation axis, and a parallel drive unit that moves the rotary conveyance table in parallel and corrects the planar position of the electronic component adsorbed and held by the adsorption holding unit. At the second delivery position, the adsorption surface of the opposing adsorption holding unit and the adsorption surface of the second holding unit are parallel, and a conveying device is provided.

[0009] The rotary transfer table intermittently moves at a predetermined rotation pitch while stopping at the first transfer position and the second transfer position, and the parallel drive unit may parallelly move the rotary transfer table during the rotation of the rotary transfer table to correct the planar position of the electronic component held by the adsorption holding unit.

[0010] In the operation of the transfer device, the timing of transferring the electronic component from the first holding unit to the adsorption holding unit at the first transfer position and the timing of transferring the electronic component from the adsorption holding unit to the second holding unit at the second transfer position may be made to coincide.

[0011] Alternatively, in the operation of the transfer device, the timing of transferring the electronic component from the first holding unit to the adsorption holding unit at the first transfer position and the timing of transferring the electronic component from the adsorption holding unit to the second holding unit at the second transfer position may be made different.

Effect of the Invention

[0012] As described above, according to the present invention, the transfer of electronic components can be carried out efficiently and reliably.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

[0014] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this specification and the drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

[0015] [1. Transfer Device] First, with reference to FIGS. 1 to 3, the configuration of a transfer device 1 according to an embodiment of the present invention will be described. FIG. 1 is a schematic diagram showing the configuration of the transfer device 1 according to this embodiment, where the upper side shows the state in plan view and the lower side shows the state in side view. FIG. 2 is a partial side view showing the state at the time of transferring the electronic component W by the first holding portion 110 and the adsorption holding portion 210. FIG. 3 is a side view showing the configuration of the position correction portion 20. In FIGS. 1 to 3, the X direction and the Y direction are horizontal directions, and the XY plane is also referred to as a horizontal plane. The Z direction is a vertical direction orthogonal to the X direction and the Y direction. The ZX plane is also referred to as a vertical plane.

[0016] The conveying device 1 according to this embodiment is a device that adsorbs and holds electronic components W one by one and conveys them along a conveying path. The electronic component W is a component used in an electrical product. For example, the electronic component W is a semiconductor element, a resistor, a capacitor, or the like. The semiconductor element may be an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), or may be a discrete semiconductor such as a transistor, a diode, an LED (Light Emitting Diode), a capacitor, and a thyristor.

[0017] As shown in FIG. 1, the conveying device 1 includes a first rotary conveying unit 11, a second rotary conveying unit 12, and a position correction unit 20. The first rotary conveying unit 11 and the second rotary conveying unit 12 are arranged in parallel along the X direction as shown in the upper side of FIG. 1, and rotate about rotation axes A1 and A2 parallel to the Y direction as shown in the lower side of FIG. 1. The position correction unit 20 is provided between the first rotary conveying unit 11 and the second rotary conveying unit 12 on the conveying path of the electronic component W as shown in the lower side of FIG. 1, and rotates about a rotation axis A0 parallel to the Z direction.

[0018] (First Rotary Conveying Unit) The first rotary conveying unit 11 has a first holding unit 110 that adsorbs and holds the electronic component W on an adsorption surface, and moves the first holding unit 110 along a circular orbit C1. As shown in the lower side of FIG. 1, the first rotary conveying unit 11 includes a rotating body 101 that rotates together with the rotation axis A1 about a rotation axis A1 parallel to the Y direction, and a plurality of first holding units 110 provided radially from the rotating body 101 in the ZX plane orthogonal to the Y direction.

[0019] The rotating body 101 is rotated by a driving unit (not shown) such as a motor. A plurality of first holding parts 110 are provided on the rotating body 101 at predetermined intervals along the circumferential direction of a virtual circle centered on the rotation axis A1. For example, in the first rotation transfer part 11 shown in FIG. 1, eight first holding parts 110 are provided on the rotating body 101 at equal intervals (that is, an installation interval of 45°). The driving unit rotates the rotating body 101 by the installation interval of the first holding parts 110 and intermittently moves it. The rotation angle at which the rotating body 101 intermittently moves is defined as the rotation pitch of the first rotation transfer part 11.

[0020] As shown in FIG. 2, each of the first holding parts 110 has an adsorption collet 111 and a forward and backward drive mechanism 112.

[0021] The adsorption collet 111 adsorbs and holds the electronic component W on the adsorption surface 111a at the tip. The adsorption collet 111 is a substantially conical member formed of, for example, rubber, resin, metal, etc. The adsorption surface 111a is a flat surface, and suction holes (not shown) communicating with the internal passage of the first holding part 110 are formed in the surface. The internal passage of the first holding part 110 communicates with the pneumatic circuit of a negative pressure generating device such as a vacuum pump or an ejector. By the negative pressure generating device generating a negative pressure in the pneumatic circuit, the adsorption collet 111 can hold the electronic component W on the adsorption surface 111a. Further, when the negative pressure generating device releases the suction force due to the negative pressure by vacuum breaking or atmospheric release, the adsorption collet 111 releases the electronic component W held on the adsorption surface 111a.

[0022] The forward and backward drive mechanism 112 is a drive mechanism that moves the adsorption collet 111 in the radial direction of a circle centered on the rotation axis A1 (hereinafter, also referred to as the "forward and backward direction"). The forward and backward drive mechanism 112 has a shaft 113, a connection member 114, and a coil spring 115.

[0023] The shaft 113 is a rod-shaped member extending in the advancing and retracting directions. The shaft 113 is connected to the rotating body 101 via the connecting member 114 on the side of the rotation axis A1 (hereinafter also referred to as the "inner side"). Further, the shaft 113 is provided with a suction collet 111 at the tip on the side opposite to the rotation axis A1 (hereinafter also referred to as the "outer side"). Inside the shaft 113, an internal passage communicating with the suction holes of the suction collet 111 is formed. The connecting member 114 is a member for fixing the advancing and retracting drive mechanism 112 to the rotating body 101. Inside the connecting member 114, a motor (not shown) for moving the shaft 113 in the advancing and retracting directions is provided. The coil spring 115 has its inner end fixed to the connecting member 114 and its outer end fixed to the outer surface of the shaft 113 with the shaft 113 inserted therethrough.

[0024] When the motor (not shown) of the advancing and retracting drive mechanism 112 is not driven and the suction collet 111 is in the most inward position as a reference, the advancing and retracting drive mechanism 112 drives the motor (not shown) to move the shaft 113 outward from the rotating body 101, thereby moving the suction collet 111 outward. Further, the advancing and retracting drive mechanism 112 stops driving the motor (not shown), and moves the shaft 113 that has moved outward inward by the compressive force of the coil spring 115, and moves the suction collet 111 to the reference position.

[0025] (Second Rotating Conveying Unit) The second rotating conveying unit 12 has a second holding unit 120 that adsorbs and holds the electronic component W on the adsorption surface, and moves the second holding unit 120 along the circular orbit C2. The second rotating conveying unit 12 may have the same configuration as the first rotating conveying unit 11.

[0026] As shown in the lower part of FIG. 1, the second rotary transfer unit 12 includes a rotating body 102 that rotates together with a rotation axis A2 about a rotation axis A2 parallel to the Y direction, and a plurality of second holding units 120 radially provided from the rotating body 102 in the ZX plane orthogonal to the Y direction. The plurality of second holding units 120 are provided on the rotating body 102 at predetermined intervals along the circumferential direction of a virtual circle centered on the rotation axis A2. For example, in the second rotary transfer unit 12 shown in FIG. 1, eight second holding units 120 are provided on the rotating body 102 at equal intervals (i.e., an installation interval of 45°). A drive unit such as a motor that rotates the rotating body 102 intermittently moves the rotating body 102 by the installation interval of the second holding units 120. The rotation angle at which the rotating body 102 moves intermittently is defined as the rotation pitch of the second rotary transfer unit 12.

[0027] The second holding unit 120 is configured in the same manner as the first holding unit 110 shown in FIG. 2, and each has a suction collet and a forward and backward drive mechanism. Since the second holding unit 120 has the same configuration as the first holding unit 110, detailed description thereof is omitted here. The second holding unit 120 moves the suction collet provided at the tip in the forward and backward direction by a forward and backward movement mechanism.

[0028] (Position correction unit) The position correction unit 20 is provided between the first rotary transfer unit 11 and the second rotary transfer unit 12 on the conveyance path of the electronic component W, corrects the position of the electronic component W received from the first holding unit 110, and delivers it to the second holding unit 120. As shown in FIGS. 1 and 3, the position correction unit 20 includes a suction holding unit 210 that transfers the first holding unit 110 and the second holding unit 120 with the electronic component W, a rotary transfer table 220, and a parallel drive unit 230 that translates the rotary transfer table 220.

[0029] The suction holding part 210 has a suction surface 211a for sucking and holding the electronic component W, performs the transfer of the electronic component W with the first holding part 110 at the first transfer position Q1, and performs the transfer of the electronic component W with the second holding part 120 at the second transfer position Q2. As shown in the upper part of FIG. 1, the suction holding parts 210 are provided at predetermined intervals along the circumferential direction of a virtual circle centered on the rotation axis A0 parallel to the Z direction on the upper surface 221a of the table 221 of the rotation transfer table 220 described later. For example, in the position correction part 20 shown in FIG. 1, 18 suction holding parts 210 are provided on the table 221 at equal intervals (that is, an installation interval of 20°). The suction holding part 210 moves along a circular orbit C0 centered on the rotation axis A0 as the rotation transfer table 220 rotates.

[0030] The suction holding part 210 is composed of, for example, a suction collet 211 and a fixing member 213 as shown in FIG. 2.

[0031] The suction collet 211 sucks and holds the electronic component W with the suction surface 211a at the tip. The suction collet 211 may be the same as the suction collet 111 of the first holding part 110 and the suction collet of the second holding part 120. That is, the suction collet 211 is a substantially conical member formed of, for example, rubber, resin, metal, etc. The suction surface 211a is a flat surface. The suction collet 211 is provided such that the suction surface 211a is orthogonal to the rotation axis A0.

[0032] Suction holes (not shown) communicating with the internal passage of the suction holding part 210 are formed in the plane of the suction surface 211a. The internal passage of the suction holding part 210 communicates with the pneumatic circuit of the negative pressure generator. By the negative pressure generator generating a negative pressure in the pneumatic circuit, the suction collet 211 can hold the electronic component W with the suction surface 211a. Further, when the negative pressure generator releases the suction force due to the negative pressure by vacuum breaking or atmospheric release, the suction collet 211 releases the electronic component W held by the suction surface 211a.

[0033] The fixing member 213 is a member for fixing the adsorption collet 211 to the upper surface 221a of the table 221 of the rotary transfer table 220. The adsorption collet 211 is provided on the surface of the fixing member 213 opposite to the surface in contact with the upper surface 221a of the table 221. An internal passage communicating with the suction holes of the adsorption collet 211 is formed inside the fixing member 213.

[0034] The rotary transfer table 220 moves the adsorption holding portion 210 along a circular orbit C0 centered on the rotation axis A0. As shown in FIG. 3, the rotary transfer table 220 includes a table 221 on which the adsorption holding portion 210 is provided, and a rotation drive portion 223 that rotates the table 221 about the rotation axis A0. The upper surface 221a of the table 221 is a flat surface and is orthogonal to the rotation axis A0. The rotation drive portion 223 is, for example, a motor or the like, and rotates the table 221 around the rotation axis A0 together with the rotation axis A0. The rotation drive portion 223 intermittently moves the table 221 at the installation interval of the adsorption holding portion 210. The rotation angle at which the table 221 intermittently moves is defined as the rotation pitch of the rotary transfer table 220.

[0035] The parallel drive portion 230 linearly moves the rotary transfer table 220 within the XY plane. As shown in FIG. 3, the parallel drive portion 230 includes a base 231 on which the rotary transfer table 220 is placed, a first drive mechanism 233 that moves the base 231 in the X direction, and a second drive mechanism 235 that moves the base 231 in the Y direction.

[0036] The rotation drive unit 223 of the rotary transfer table 220 is fixed to the base 231. The first drive mechanism 233 includes a pair of guides 233a parallel to the X direction fixed on the installation table B where the position correction unit 20 is installed, a slide portion 233b that moves in the X direction along the guides 233a, and a top plate 233c fixed on the slide portion 233b and moving in the X direction together with the slide portion 233b. The second drive mechanism 235 includes a pair of guides 235a parallel to the Y direction fixed on the top plate 233c of the first drive mechanism 233, and a slide portion 235b that moves in the Y direction along the guides 235a. The base 231 is fixed to the slide portion 235b of the second drive mechanism 235. The first drive mechanism 233 and the second drive mechanism 235 may each be configured as an electric actuator that moves the slide portions 233b and 235b by a motor (not shown).

[0037] The parallel drive unit 230 parallelly moves the rotary transfer table 220 placed on the base 231 within the XY plane by the first drive mechanism 233 and the second drive mechanism 235. Thereby, the planar position of the electronic component W adsorbed and held by the adsorption holding portion 210 of the rotary transfer table 220 is adjusted.

[0038] Further, the position correction unit 20 may have an imaging unit 250 that captures an image for confirming the position of the electronic component W to be conveyed. The imaging unit 250 is installed, for example, above the conveyance path of the electronic component W between the first delivery position Q1 and the second delivery position Q2 as shown in the upper part of FIG. 1 and FIG. 3. The imaging unit 250 may be a camera including an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. The image captured by the imaging unit 250 is output to the control unit 70 that controls the conveyance device 1. The control unit 70 controls the parallel drive unit 230 based on the image captured by the imaging unit 250, for example, to adjust the planar position of the electronic component W.

[0039] The conveying device 1 shown in Fig. 1 first adsorbs and holds each electronic component W attached to, for example, a wafer sheet S one by one by the first rotary conveying unit 11 and conveys it to the position correction unit 20. The first rotary conveying unit 11 rotates the rotating body 101 in one direction (for example, counterclockwise in the side view as shown in the lower side of Fig. 1), and adsorbs and holds one electronic component W from the wafer sheet S by the first holding unit 110 at the pickup position Q0.

[0040] For example, at the pickup position Q0, a protruding device 30 that protrudes the electronic component W attached to the wafer sheet S toward the first rotary conveying unit 11 is installed on the side opposite to the first rotary conveying unit 11 with respect to the wafer sheet S. The protruding device 30 includes a pin 35 that protrudes the electronic component W from the back surface of the wafer sheet S and a motor (not shown) that moves the pin 35 in the protruding direction. The protruding direction is a direction orthogonal to the adsorption surface 111a of the first holding unit 110 at the pickup position Q0. The wafer sheet S is also installed so as to be orthogonal to the protruding direction. In the conveying device 1 shown in Fig. 1, the protruding direction is the horizontal direction (X direction).

[0041] The protruding device 30 operates the pin 35 so as to protrude the electronic component W to be conveyed from the back surface side of the wafer sheet S toward the first holding unit 110 at the timing when the first holding unit 110 of the first rotary conveying unit 11 is positioned at the pickup position Q0. The first holding unit 110 adsorbs and holds the protruding electronic component W on the adsorption surface 111a. By making the adsorption surface 111a of the first holding unit 110 at the pickup position Q0 parallel to the wafer sheet S and protruding the electronic component W with the pin 35 from the direction orthogonal to these, the electronic component W can be adsorbed on the adsorption surface 111a of the first holding unit 110.

[0042] The first holding part 110 that holds the electronic component W moves within a vertical plane along a circular orbit C1 due to the rotation of the rotating body 101. The first holding part 110 that holds the electronic component W performs the transfer of the electronic component W with the suction holding part 210 of the position correction part 20 at the first transfer position Q1. At the first transfer position Q1, the suction surface 111a of the first holding part 110 and the suction surface 211a of the position correction part 20 are parallel. Thereby, the suction surface 211a of the position correction part 20 can hold the electronic component W received from the first holding part 110 in a correct posture without tilting it.

[0043] For the electronic component W attached to the wafer sheet S, the flat surface on the side opposite to the bump (electrode) is in contact with the wafer sheet S. Therefore, the first holding part 110 adsorbs and holds the surface on the bump side to the suction surface 111a, and the surface on the side opposite to the bump faces outward. Thus, when the first holding part 110 and the suction holding part 210 of the position correction part 20 perform the transfer of the electronic component W at the first transfer position Q1, the suction holding part 210 adsorbs and holds the flat surface on the side opposite to the bump of the electronic component W. For this reason, even when the size of the electronic component is small, the bump of the electronic component does not enter the suction hole of the suction surface 211a, and the posture of the electronic component W is corrected when it is held on the suction surface 211a of the suction holding part 210. When the suction surface 111a of the first holding part 110 adsorbs and holds the electronic component W at the pickup position Q0, even if the bump has entered the suction hole and the electronic component W has a tilt, at the first transfer position Q1, since the suction holding part 210 holds the flat surface on the side opposite to the bump of the electronic component W with the suction surface 211a, the generated tilt is corrected.

[0044] In this way, the electronic component W adsorbed and held on the suction surface 211a of the suction holding part 210 is in an appropriate posture without tilt. Since the posture of the electronic component W is corrected at the first transfer position Q1, at the second transfer position Q2, if the suction surface 211a of the suction holding part 210 and the suction surface of the second holding part 120 are parallel, the electronic component W can be transferred between them while maintaining the correct posture.

[0045] The adsorption and holding unit 210 that adsorbs and holds the electronic component W moves along the circular orbit C0 in the horizontal plane from the first delivery position Q1 to the second delivery position Q2 by the rotation of the table 221. The adsorption and holding unit 210 that holds the electronic component W performs the delivery of the electronic component W with the second holding unit 120 of the second rotary transfer unit 12 at the second delivery position Q2. At the second delivery position Q2, the adsorption surface of the second holding unit 120 and the adsorption surface 211a of the position correction unit 20 are parallel. Thereby, the adsorption surface of the second holding unit 120 can adsorb and hold the electronic component W in the correct posture from the adsorption surface 211a of the position correction unit 20 without tilting the electronic component W.

[0046] The second holding unit 120 that holds the electronic component W moves in the vertical plane along the circular orbit C2 by the rotation of the rotating body 102. The second holding unit 120 that holds the electronic component W conveys the electronic component W to a processing device that performs the next process and delivers the electronic component W to the processing device. For example, as shown in FIG. 1, after the second rotary transfer unit 12 further delivers the electronic component W to the third rotary transfer unit 13, the third rotary transfer unit 13 may convey the electronic component W to a taping unit 50 that accommodates a carrier tape (not shown).

[0047] As shown in the upper side of FIG. 1, the third rotary transfer unit 13 is arranged in parallel along the X direction together with the first rotary transfer unit 11 and the second rotary transfer unit 12, and rotates about a rotation axis A3 parallel to the Y direction as shown in the lower side of FIG. 1. The third rotary transfer unit 13 may be configured in the same manner as the first rotary transfer unit 11 and the second rotary transfer unit 12.

[0048] That is, as shown in the lower part of FIG. 1, the third rotary transfer unit 13 includes a rotating body 103 that rotates together with a rotation axis A3 about a rotation axis A3 parallel to the Y direction, and a plurality of third holding parts 130 radially provided from the rotating body 103 in the ZX plane orthogonal to the Y direction. The plurality of third holding parts 130 are provided on the rotating body 103 at predetermined intervals along the circumferential direction of a virtual circle centered on the rotation axis A3. The third holding part 130 is configured in the same manner as the first holding part 110 shown in FIG. 2, and each has a suction collet and a forward and backward drive mechanism. The third holding part 130 moves the suction collet provided at the tip in the forward and backward direction by a forward and backward movement mechanism.

[0049] As shown in the lower part of FIG. 1, the third rotary transfer unit 13 performs the transfer of the electronic component W with the second rotary transfer unit 12 at a third transfer position Q3 where the second holding part 120 and the third holding part 130 correspond in the X direction. At the third transfer position Q3, the suction surface of the second holding part 120 and the suction surface of the third holding part 130 are parallel. When the second holding part 120 holding the electronic component W is positioned at the third transfer position Q3, the second holding part 120 is moved outward to bring the electronic component W closer to the suction surface of the third holding part 130. The third holding part 130 sucks and holds the approaching electronic component W with the suction surface, and receives the electronic component W from the second holding part 120.

[0050] The third holding part 130 holding the electronic component W moves along the circular orbit C3 by the rotation of the rotating body 103 from the third transfer position Q3 to a supply position Q4 for supplying the electronic component W to the taping unit 50 within the vertical plane. The taping unit 50 is installed, for example, below the third rotary transfer unit 13. At the supply position Q4, the suction surface of the third holding part 130 and the taping unit 50 face each other in the vertical direction (Z direction). When the third holding part 130 holding the electronic component W is positioned at the supply position Q4, the adsorbed and held electronic component W is released. The released electronic component W is accommodated in a pocket (not shown) of a carrier tape within the taping unit 50.

[0051] The configuration of the transfer device 1 has been described above.

[0052] [2. Operation] The transfer device 1 synchronizes the operations of the first rotary transfer unit 11, the second rotary transfer unit 12, and the position correction unit 20 to transfer the electronic component W to be transferred. In the transfer device 1 according to the present embodiment, a position correction unit 20 for correcting the planar position of the electronic component W is provided between the first rotary transfer unit 11 and the second rotary transfer unit 12 on the transfer path of the electronic component W, so that the alignment process of the electronic component W is performed during the transfer process of the electronic component W. Thereby, the time required for the alignment process of the electronic component W is shortened. Hereinafter, the operation of the transfer device 1 will be described.

[0053] [2-1. Operation Pattern 1] First, based on FIG. 4, as an example of the operation pattern of the transfer device 1, the case where the transfer of the electronic component W at the first transfer position Q1 and the transfer of the electronic component W at the second transfer position Q2 are performed at the same timing (operation pattern 1) will be described. FIG. 4 is a timing chart showing the operation of the transfer device 1 in operation pattern 1.

[0054] In FIG. 4, as the operation of the first rotary transfer unit 11, a rotational movement operation and a forward / backward movement operation moving along the circular orbit C1 are shown, and as the operation of the second rotary transfer unit 12, a rotational movement operation and a forward / backward movement operation moving along the circular orbit C2 are shown. Also, as the operation of the position correction unit 20, a rotational movement operation for moving the suction holding unit 210 along the circular orbit C0 and a parallel movement operation of the parallel drive unit 230 are shown in FIG. 4. In FIG. 4, the horizontal axis represents time t, and the vertical axis represents the operation speed V. When the operation speed V is 0, the operation is stopped, and when it exceeds 0, it indicates that the operation is in progress. Note that the parallel movement operation of the position correction unit 20 collectively represents the position correction operation in the X direction and the position correction operation in the Y direction.

[0055] In operation pattern 1, the transfer device 1 operates by synchronizing the rotation pitch of the first rotary transfer unit 11, the rotation pitch of the second rotary transfer unit 12, and the rotation pitch of the rotary transfer table 220 of the position correction unit 20.

[0056] As shown in FIG. 4, when the first rotary transfer unit 11 rotates and moves the rotating body 101 to move the first holding unit 110 by one pitch, at the same timing, the rotary transfer table 220 of the position correction unit 20 is moved by one pitch, and the second holding unit 120 of the second rotary transfer unit 12 is also moved by one pitch. At this time, during the period from the start to the stop of the rotational movement operation of the position correction unit 20, a translational movement operation of the position correction unit 20 is performed.

[0057] In this translational movement operation, the planar position of the electronic component W transferred from the suction holding unit 210 of the position correction unit 20 to the second holding unit 120 at the second transfer position Q2 is corrected. The correction amounts in the X direction and the Y direction from the origin position of the electronic component W can be obtained, for example, by comparing the position of the electronic component W in the image captured by the imaging unit 250 with the position where the electronic component W appears when there is no deviation from the origin position. The control unit 70 calculates the correction amounts in the X direction and the Y direction from the origin position of the electronic component W, and during the period from the start to the stop of the rotational movement operation of the rotary transfer table 220 by the position correction unit 20, the rotary transfer table 220 is translated to correct the planar position of the electronic component W at the second transfer position Q2.

[0058] When the rotational movement operations of the first rotary transfer unit 11, the rotational movement operation of the second rotary transfer unit 12, and the rotational movement operation of the position correction unit 20 and the translational movement operation of the position correction unit 20 are completed, the electronic component W is transferred at the first transfer position Q1 and the second transfer position Q2.

[0059] In the forward and backward movement at the first transfer position Q1, first, the suction collet 111 of the first holding part 110 that holds the electronic component W by suction is brought close to the suction holding part 210 of the position correction part 20, and the electronic component W is held by suction on the suction collet 211 of the suction holding part 210. Then, the suction collet 111 releases the suction holding of the electronic component W and retracts to its original position. Similarly, in the forward and backward movement at the second transfer position Q2, first, the suction collet of the second holding part 120 is brought close to the suction holding part 210 of the position correction part 20, and the electronic component W held by suction by the suction holding part 210, whose planar position has been corrected by the translational movement of the position correction part 20, is held by suction. Then, the suction holding of the electronic component W by the suction holding part 210 is released, and the second holding part 120 that holds the electronic component W by suction by the suction collet retracts to its original position.

[0060] When the forward and backward movement of the first holding part 110 and the forward and backward movement of the second holding part 120 are completed, the position correction part 20 performs a translational movement. In this translational movement, the rotary transfer table 220 that has been moved to correct the planar position of the electronic component W delivered to the second holding part 120 at the second transfer position Q2 is moved to the origin position. Thereby, the rotary transfer table 220 is positioned at the initial position for correcting the planar position of the electronic component W to be delivered between the suction holding part 210 and the second holding part 120 at the second transfer position Q2 next. When such a translational movement is completed, the operation at one pitch is completed.

[0061] In this way, by performing the correction of the planar position of the electronic component W during the rotation pitch of the rotary transfer table 220 of the position correction part 20, the alignment process of the electronic component W can be efficiently carried out.

[0062] [2-2. Operation Pattern 2] Next, based on FIG. 5, as an example of the operation pattern of the transfer device 1, the case (operation pattern 2) where the transfer of the electronic component W at the first transfer position Q1 and the transfer of the electronic component W at the second transfer position Q2 are performed at different timings will be described. FIG. 5 is a timing chart showing the operation of the transfer device 1 in operation pattern 2.

[0063] Similar to FIG. 4, FIG. 5 also shows, as the operations of the first rotary transfer unit 11, a rotational movement operation and a forward / backward movement operation along the circular orbit C1, and shows, as the operations of the second rotary transfer unit 12, a rotational movement operation and a forward / backward movement operation along the circular orbit C2. Further, FIG. 5 shows, as the operations of the position correction unit 20, a rotational movement operation for moving the suction holding unit 210 along the circular orbit C0 and a parallel movement operation by the parallel drive unit 230.

[0064] In operation pattern 2, the transfer device 1 shifts the rotation pitch of the first rotary transfer unit 11, the rotation pitch of the second rotary transfer unit 12, by 1 / 2 pitch, and shifts the timing of the transfer of the electronic component W at the first transfer position Q1 and the timing of the transfer of the electronic component W at the second transfer position Q2. The rotary transfer table 220 of the position correction unit 20 operates in synchronization with the rotational movement operation of the first rotary transfer unit 11 and the rotational movement operation of the second rotary transfer unit 12, respectively.

[0065] As shown in FIG. 5, when the first rotary transfer unit 11 rotates and moves the rotating body 101 and moves the first holding unit 110 by one pitch, at the same timing, the rotary transfer table 220 of the position correction unit 20 is moved by one pitch. At this time, during the period from the start to the stop of the rotational movement operation of the position correction unit 20, the parallel movement operation of the position correction unit 20 is performed. In this parallel movement operation, the rotary transfer table 220 that has been moved to correct the planar position of the electronic component W delivered to the second holding unit 120 at the second transfer position Q2 at the previous timing is moved to the origin position. Thereby, the rotary transfer table 220 is positioned at an initial position for correcting the planar position of the electronic component W to be transferred between the suction holding unit 210 and the second holding unit 120 at the second transfer position Q2 next. The position correction unit 20 parallelly moves the rotary transfer table 220 to the origin position during the period from the start to the stop of the rotational movement operation of the rotary transfer table 220.

[0066] When the rotational movement operation of the first rotational transfer unit 11, the rotational movement operation of the position correction unit 20, and the translational movement operation of the position correction unit 20 are completed, the transfer of the electronic component W is performed at the first transfer position Q1. The advancing and retreating operation at the first transfer position Q1 is the same as the operation pattern 1. First, the suction collet 111 of the first holding unit 110 that sucks and holds the electronic component W is brought close to the suction holding unit 210 of the position correction unit 20, and the electronic component W is sucked and held by the suction collet 211 of the suction holding unit 210. Then, the suction collet 111 releases the suction holding of the electronic component W and retreats to its original position.

[0067] When the advancing and retreating operation of the first holding unit 110 is completed, the second rotational transfer unit 12 rotates and moves the rotating body 102 to move the second holding unit 120 by one pitch. At the same timing as the rotational movement operation of the second rotational transfer unit 12, the rotational transfer table 220 of the position correction unit 20 is moved by one pitch. At this time, during the period from the start to the stop of the rotational movement operation of the position correction unit 20, the translational movement operation of the position correction unit 20 is performed. In this translational movement operation, the planar position of the electronic component W transferred from the suction holding unit 210 to the second holding unit 120 at the second transfer position Q2 is corrected. Similar to the operation pattern 1, in such a translational movement operation, the control unit 70 calculates the correction amounts in the X direction and the Y direction from the origin position of the electronic component W using the image captured by the imaging unit 250, and during the period from the start to the stop of the rotational movement operation of the rotational transfer table 220 by the position correction unit 20, the rotational transfer table 220 is translated to correct the planar position of the electronic component W at the second transfer position Q2.

[0068] When the rotational movement operation of the second rotational transfer unit 12, the rotational movement operation of the position correction unit 20, and the translational movement operation of the position correction unit 20 are completed, the transfer of the electronic component W is performed at the second transfer position Q2. The advancing and retreating operation at the second transfer position Q2 is the same as the operation pattern 1. First, the suction collet of the second holding unit 120 is brought close to the suction holding unit 210 of the position correction unit 20, and the electronic component W held by suction by the suction holding unit 210 whose planar position has been corrected by the translational movement operation of the position correction unit 20 is held by suction. Then, the suction holding of the electronic component W by the suction holding unit 210 is released, and the second holding unit 120 that holds the electronic component W by suction with the suction collet retreats to the original position.

[0069] When the advancing and retreating operation of the second holding unit 120 is completed, the transfer of the electronic component W at the first transfer position Q1 and the transfer of the electronic component W at the second transfer position Q2 are each completed once. In operation pattern 2, the above operations are repeated.

[0070] In this way, also in operation pattern 2, by performing the correction of the planar position of the electronic component W during the rotational pitch of the rotational transfer table 220 of the position correction unit 20, the alignment process of the electronic component W can be efficiently performed. In operation pattern 2, by shifting the timing of the transfer of the electronic component W at the first transfer position Q1 and the timing of the transfer of the electronic component W at the second transfer position Q2, a translational movement operation is performed to translate the rotational transfer table 220 to the origin position during the rotational movement of the first rotational transfer unit 11. Thereby, the translational movement operation of the position correction unit 20 can be efficiently performed, and it becomes possible to speed up the transfer of the electronic component W by the transfer device 1.

[0071] [3. Modification Example] [3-1. Change in the Arrangement of Components] In the transfer device 1 according to the present invention, the arrangement of each component of the transfer device 1 including the first rotational transfer unit 11, the second rotational transfer unit 12, and the position correction unit 20 is not limited to the configuration shown in FIG. 1. For example, the transfer device 1 may be configured as shown in FIGS. 6 to 9.

[0072] (Modification Example 1) The transfer device 1 shown in FIG. 6 has a different arrangement of the third rotary transfer unit 13 compared to the configuration of the transfer device 1 shown in FIG. 1, and the third rotary transfer unit 13 is provided such that the rotation axis A3 is along the Z direction. The third rotary transfer unit 13 receives the electronic component W from the second holding unit 120 that holds the electronic component W at the third delivery position Q3 by the third holding unit 130, and transfers the electronic component W along the circular orbit C3. Then, the third holding unit 130 stores the transferred electronic component W in the wafer sheet S at the supply position Q4 facing the storage-side wafer sheet S, for example. In this way, the transfer device 1 may be configured by changing the orientation of the arrangement of the third rotary transfer unit 13.

[0073] (Modification Example 2) The transfer device 1 shown in FIG. 7 has a different arrangement of the first rotary transfer unit 11 compared to the configuration of the transfer device 1 shown in FIG. 1, and the first rotary transfer unit 11 is arranged in a state rotated 90° with respect to the rotation axis A0 of the position correction unit 20. The rotation axis A1 of the first rotary transfer unit 11 is parallel to the X direction. When looking at the transfer path of the electronic component W in a plan view of the transfer device 1 shown in FIG. 7, the electronic component W is moved along the Y direction by the first rotary transfer unit 11, then moved 270° in the horizontal plane (XY plane) by the position correction unit 20, and then moved along the X direction by the second rotary transfer unit 12. In this way, by changing the positions of the first rotary transfer unit 11 and the second rotary transfer unit 12 with respect to the rotation axis A0 of the position correction unit 20, the transfer direction of the electronic component W can be changed.

[0074] In the conveying device 1 shown in FIG. 7, the first rotary conveying unit 11 and the second rotary conveying unit 12 are arranged at an angle of 90° in a plan view. For this reason, when the suction holding portions 210 are provided on the rotary conveying table 220 at an installation interval of 20°, the timing of delivering the electronic component W at the first delivery position Q1 and the timing of delivering the electronic component W at the second delivery position Q2 cannot be made to coincide. In such a case, the conveying device 1 may operate with the timing of delivering the electronic component W at the first delivery position Q1 and the timing of delivering the electronic component W at the second delivery position Q2 shifted, as in the operation pattern 2 shown in FIG. 5.

[0075] (Modification 3) In the conveying device 1 shown in FIG. 1, the suction holding portion 210 of the position correcting portion 20 is arranged such that the suction surface 211a is always parallel to the horizontal plane (XY plane). However, the suction surface 211a only needs to be parallel to the suction surface of the opposing second holding portion 120 at the second delivery position Q2.

[0076] As described above, when the first holding portion 110 and the suction holding portion 210 of the position correcting portion 20 perform the delivery of the electronic component W at the first delivery position Q1, the suction holding portion 210 sucks and holds the surface of the electronic component W opposite to the bump. At this time, since the bump does not enter the suction hole of the suction surface 211a, the posture of the electronic component W is corrected when it is held on the suction surface 211a of the suction holding portion 210. That is, the electronic component W held on the suction surface 211a of the suction holding portion is in an appropriate posture without inclination. Therefore, if the suction surface 211a of the suction holding portion 210 and the suction surface of the second holding portion 120 are parallel at the second delivery position Q2, the electronic component W can be delivered between them while maintaining the correct posture.

[0077] For example, as shown in FIG. 8, the position correction unit 20 is installed at an angle of 45° with respect to the horizontal plane (XY plane). At the first transfer position Q1, the suction surface 111a of the first holding unit 110 and the suction surface 211a of the suction holding unit 210 are parallel in the horizontal direction. At the second transfer position Q2, the suction surface of the second holding unit 120 and the suction surface 211a of the suction holding unit 210 may be parallel in the vertical direction. In this case, when the electronic component W is held on the suction surface 211a of the suction holding unit 210 at the first transfer position Q1, the posture of the electronic component W is corrected. Then, the electronic component W moved by the rotation of the rotary transfer table 220 is suction-held on the suction surface of the second holding unit 120 at the second transfer position Q2. At the second transfer position Q2, since the suction surface of the second holding unit 120 and the suction surface 211a of the suction holding unit 210 are parallel, the electronic component W can be transferred while maintaining the correct posture of the electronic component W.

[0078] Also, for example, as shown in FIG. 9, the position correction unit 20 is installed at an angle of 45° with respect to the horizontal plane (XY plane). At the first transfer position Q1, the suction surface 111a of the first holding unit 110 and the suction surface 211a of the suction holding unit 210 are parallel in the vertical direction. At the second transfer position Q2, the suction surface of the second holding unit 120 and the suction surface 211a of the suction holding unit 210 may be parallel in the horizontal direction. Also in this case, when the electronic component W is held on the suction surface 211a of the suction holding unit 210 at the first transfer position Q1, the posture of the electronic component W is corrected. Then, the electronic component W moved by the rotation of the rotary transfer table 220 is suction-held on the suction surface of the second holding unit 120 at the second transfer position Q2. At the second transfer position Q2, since the suction surface of the second holding unit 120 and the suction surface 211a of the suction holding unit 210 are parallel, the electronic component W can be transferred while maintaining the correct posture of the electronic component W.

[0079] [3-2. Position Correction of Electronic Components in Rotary Transfer Unit] Further, in the conveying device 1 according to the present invention, instead of providing the position correction unit 20, a function of correcting the position of the electronic component W may be provided in the second rotary conveying unit 12 between the first rotary conveying unit 11 and the third rotary conveying unit 13. That is, the second rotary conveying unit 12 is caused to function as the position correction unit 20 in the above-described embodiment.

[0080] FIGS. 10 and 11 show a configuration example of the conveying device 1 when a position correction mechanism 300 for correcting the position of the electronic component W is provided in the second rotary conveying unit 12 as a modification of the conveying device 1 according to the present invention. FIG. 10 shows a plan view of the conveying device 1 from above and a side view of the conveying device 1 from below. FIG. 11 is a schematic view showing the second rotary conveying unit 12 and the position correction mechanism 300, and shows the state shown in the upper part of FIG. 10 as viewed from the X direction.

[0081] The conveying device 1 shown in FIG. 10 includes a first rotary conveying unit 11, a second rotary conveying unit 12, and a third rotary conveying unit 13. The first rotary conveying unit 11, the second rotary conveying unit 12, and the third rotary conveying unit 13 are arranged in parallel along the X direction as shown in the upper part of FIG. 10, and rotate about the rotation axes A1, A2, and A3 of the drive units 61, 62, and 63 parallel to the Y direction as shown in the lower part of FIG. 10. The configurations of the first rotary conveying unit 11, the second rotary conveying unit 12, and the third rotary conveying unit 13 are the same as those of the conveying device 1 in FIG. 1.

[0082] The second rotary conveying unit 12 in this modification includes a position correction mechanism 300 in order to correct the position of the electronic component W received from the first holding unit 110 of the first rotary conveying unit 11 and deliver it to the third holding unit 130 of the third rotary conveying unit 13. The position correction mechanism 300 is a mechanism for translating the second rotary conveying unit 12 in parallel. The parallel movement of the second rotary conveying unit 12 by the position correction mechanism 300 is performed in a plane parallel to the suction surface of the second holding unit 120 at the first delivery position Q1 where the electronic component W is delivered from the first holding unit 110 to the second holding unit 120, or at the second delivery position Q2 where the electronic component W is delivered from the second holding unit 120 to the third holding unit 130.

[0083] For example, in the transfer device 1 shown in FIG. 10, at the first delivery position Q1 and the second delivery position Q2, the adsorption surface of the second holding portion 120 is parallel to the YZ plane. Therefore, the position correction mechanism 300 shown in FIG. 11 includes a first drive portion 310 that moves the second rotary transfer portion 12 in the Y direction, which is a direction parallel to the rotation axis, and a second drive portion 320 that moves the second rotary transfer portion 12 in the Z direction, which is a direction perpendicular to the rotation axis.

[0084] Note that the second rotary transfer portion 12 is attached to the support base 305 on which the second rotary transfer portion 12 is installed via a motor support plate 62a, a bracket 72, and the position correction mechanism 300. The motor support plate 62a is fixed to a drive portion 62 such as a motor that rotates the rotating body 102, and moves in parallel with the YZ plane together with the second rotary transfer portion 12. The bracket 72 is an L-shaped member including a first surface 72a parallel to the XY plane and a second surface 72b parallel to the ZX plane. The bracket 72 moves in the Y direction together with the second rotary transfer portion 12.

[0085] The first drive portion 310 is fixed to the support base 305. The first drive portion 310 includes a motor 311, a ball screw 313, a pair of guides 315, and slide portions 317a and 317b. The motor 311 is fixed to the support base 305 using a motor bracket 312. The ball screw 313 converts the rotational motion of the motor 311 into a linear motion. The pair of guides 315 are fixed on the support base 305 in a state parallel to the Y direction. The slide portions 317a and 317b move in the Y direction along the pair of guides 315 by the linear motion of the ball screw 313.

[0086] The first surface 72a of the bracket 72 is fixed to the slide portions 317a and 317b. Therefore, the bracket 72 moves in the Y direction together with the slide portions 317a and 317b. As the bracket 72 moves in the Y direction, the second rotary transfer portion 12 supported by the bracket 72 via the motor support plate 62a and the second drive portion 320 described later also moves in the Y direction.

[0087] The second drive unit 320 is fixed to the bracket 72. The second drive unit 320 includes a motor 321, a ball screw 323, a pair of guides 325, and slide parts 327a and 327b. The motor 321 is fixed to the first surface 72a of the bracket 72 using a motor bracket 322. The ball screw 323 converts the rotational motion of the motor 321 into linear motion. The pair of guides 325 are fixed to the second surface 72b of the bracket 72 in a state parallel to the Z direction. The slide parts 327a and 327b move in the Z direction along the pair of guides 325 due to the linear motion of the ball screw 323.

[0088] A motor support plate 62a is fixed to the slide parts 327a and 327b and moves in the Z direction together with the slide parts 327a and 327b. Here, a through hole having a size through which the drive unit 62 can be inserted is provided in the second surface 72b of the bracket 72, and the drive unit 62 is not directly fixed to the bracket 72. Therefore, the motor support plate 62a can move relative to the bracket 72 in the Z direction together with the slide parts 327a and 327b. As the motor support plate 62a moves in the Z direction, the second rotation transfer unit 12 fixed to the motor support plate 62a also moves in the Z direction.

[0089] The position correction mechanism 300 translates the second rotation transfer unit 12 in the YZ plane by the first drive unit 310 and the second drive unit 320. Thereby, the planar position of the electronic component W adsorbed and held by the second holding unit 120 of the second drive unit 320 is adjusted. Note that an imaging unit (not shown) for imaging an image for confirming the position of the electronic component W to be conveyed may be provided in the conveyance path of the electronic component W between the first delivery position Q1 and the second delivery position Q2 in the second rotation transfer unit 12. Thereby, for example, a control unit (not shown) that controls the conveyance device 1 can control the position correction mechanism 300 based on the image captured by the imaging unit to adjust the planar position of the electronic component W.

[0090] The conveying device 1 shown in Fig. 10 first adsorbs and holds each of the electronic components W attached to, for example, a wafer sheet S one by one by a first rotary conveying unit 11, and conveys them to a second rotary conveying unit 12. The first rotary conveying unit 11 rotates a rotating body 101 in one direction (for example, counterclockwise in a side view as shown in the lower side of Fig. 10), and adsorbs and holds one electronic component W from the wafer sheet S by a first holding unit 110 at a pickup position Q0. The pickup of the electronic component W may be performed in the same manner as the conveying device 1 shown in Fig. 1, for example, by protruding the electronic component W attached to the wafer sheet S toward the first rotary conveying unit 11 side by a protruding device 30 and adsorbing it to the adsorption surface 111a of the first holding unit 110. In the conveying device 1 shown in Fig. 10, the protruding direction is the horizontal direction (X direction).

[0091] The first holding unit 110 holding the electronic component W moves in a vertical plane along a circular orbit C1 due to the rotation of the rotating body 101. The first holding unit 110 holding the electronic component W performs the transfer of the electronic component W with the second holding unit 120 of the second rotary conveying unit 12 at a first transfer position Q1. At the first transfer position Q1, the adsorption surface 111a of the first holding unit 110 and the adsorption surface 121a of the second holding unit 120 are parallel to each other. Thereby, the adsorption surface 121a of the second holding unit 120 can hold the electronic component W received from the first holding unit 110 in a correct posture without tilting it.

[0092] The electronic component W attached to the wafer sheet S has a flat surface on the side opposite to the bump (electrode) in contact with the wafer sheet S. Therefore, the first holding part 110 sucks and holds the surface on the bump side on the suction surface 111a, and the surface on the side opposite to the bump faces outward. Accordingly, when the first holding part 110 and the second holding part 120 transfer the electronic component W at the first transfer position Q1, the second holding part 120 sucks and holds the flat surface on the side opposite to the bump of the electronic component W. For this reason, even when the size of the electronic component is small, the bump of the electronic component does not enter the suction hole of the suction surface 121a, and the posture of the electronic component W is corrected when it is held on the suction surface 121a of the second holding part 120. When the suction surface 111a of the first holding part 110 sucks and holds the electronic component W at the pickup position Q0, even if the bump enters the suction hole and the electronic component W is tilted, at the first transfer position Q1, since the second holding part 120 holds the flat surface on the side opposite to the bump of the electronic component W on the suction surface 121a, the generated tilt is corrected.

[0093] In this way, the electronic component W sucked and held on the suction surface 121a of the second holding part 120 assumes an appropriate posture without tilt. Since the posture of the electronic component W is corrected at the first transfer position Q1, at the second transfer position Q2, if the suction surface 121a of the second holding part 120 and the suction surface 131a of the third holding part 130 are parallel, the electronic component W can be transferred between them while maintaining the correct posture.

[0094] The second holding part 120 holding the electronic component W moves along the circular orbit C2 in the vertical plane from the first transfer position Q1 to the second transfer position Q2 by the rotation of the rotating body 102. During the movement of the second holding part 120, the position correction mechanism 300 translates the second rotation transfer part 12 to correct the planar position of the electronic component W sucked and held by the second holding part 120. Then, the second holding part 120 holding the electronic component W transfers the electronic component W to the third holding part 130 of the third rotation transfer part 13 at the second transfer position Q2.

[0095] At the second delivery position Q2, the suction surface 121a of the second holding portion 120 and the suction surface 131a of the third holding portion 130 are parallel. Thus, the suction surface 131a of the third holding portion 130 can adsorb and hold the electronic component W in the correct posture without tilting the electronic component W from the suction surface 121a of the second holding portion 120. The third rotary transfer unit 13 conveys the electronic component W to, for example, a taping unit 50 that houses a carrier tape (not shown), and releases the electronic component W that was adsorbed and held at the supply position Q4.

[0096] In the transfer device 1 shown in FIGS. 10 and 11, the second rotary transfer unit 12 functions as the position correction unit 20 in the above-described embodiment, and in the second rotary transfer unit 12, the planar position of the electronic component W to be adsorbed and held is corrected by the position correction mechanism 300. Also with such a transfer device 1, similar to the transfer device 1 of the above-described embodiment, when the electronic component W is held on the suction surface 121a of the second holding portion 120 at the first delivery position Q1, the posture of the electronic component W is corrected. Then, the electronic component W moved by the rotation of the rotating body 102 of the second rotary transfer unit 12 is adsorbed and held on the suction surface 131a of the third holding portion 130 at the second delivery position Q2. Since the suction surface 121a of the second holding portion 120 and the suction surface 131a of the third holding portion 130 are parallel at the second delivery position Q2, the electronic component W can be delivered while maintaining the correct posture of the electronic component W.

[0097] [4. Summary] The configuration and operation of the transport device 1 according to an embodiment of the present invention have been described above. The transport device 1 according to this embodiment includes a position correction unit 20 that corrects the position of the electronic component W received from the first holding unit 110 and delivers it to the second holding unit 120 between the first rotary transport unit 11 and the second rotary transport unit 12 on the transport path of the electronic component W. The position correction unit 20 corrects the planar position of the electronic component W held by the suction holding unit 210 by moving the rotary transport table 220 in parallel by the parallel drive unit 230 during the rotation of the rotary transport table 220. Thereby, the alignment process of the electronic component W can be efficiently performed. Further, at the second delivery position Q2, the suction surface 211a of the opposing suction holding unit 210 and the suction surface of the second holding unit 120 are made parallel. Thereby, the electronic component W can be delivered in a state where the correct posture of the electronic component W corrected when the suction holding unit 210 sucks the electronic component W at the first delivery position Q1 is maintained.

[0098] As described above, the preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious that those having ordinary knowledge in the technical field to which the present invention pertains can conceive various modification examples or correction examples within the scope of the technical idea described in the claims, and these are also naturally understood to belong to the technical scope of the present invention.

[0099] For example, in the above embodiment, the transport device corrects the planar position of the electronic component to be transported, but the present invention is not limited to such an example. For example, the transport device may perform rotational correction in addition to correcting the planar position of the electronic component to be transported. The rotational correction of the electronic component can be performed by rotating the suction collet that sucks and holds the electronic component around an axis perpendicular to the suction surface. The rotational correction of the electronic component may be performed by any one of the first rotary transport unit, the second rotary transport unit, or the position correction unit.

Explanation of Reference Numerals

[0100] 1 Transport device 11 First rotary transport unit 12 Second Rotating Conveyor 13 Third Rotating Conveyor 20 Position Correction Unit 30 Protrusion Device 35 Pin 50 Taping Unit 70 Control Unit 101, 102, 103 Rotating Bodies 110 First Holding Unit 111 Suction Collet 111a, 121a, 131a Suction Surfaces 112 Retractable Driving Mechanism 113 Shaft 114 Connecting Member 120 Second Holding Unit 130 Third Holding Unit 210 Suction Holding Unit 211 Suction Collet 211a Suction Surface 213 Fixed Member 220 Rotating Conveyor Table 221 Table 223 Rotation Driving Unit 230 Parallel Driving Unit 231 Base 233 First Driving Mechanism 233a, 235a Guides 233b, 235b Slide Parts 233c Top Plate 235 Second Driving Mechanism 250 Imaging Unit Q0 Pickup Position Q1 First Delivery Position Q2 Second Delivery Position Q3 Third Delivery Position Q4 Supply Position S Wafer Sheet W Electronic Component

Claims

1. A first holding unit that adsorbs and holds an electronic component on an adsorption surface, and a first rotary transfer unit that moves the first holding unit along a circular orbit; A second holding unit that adsorbs and holds the electronic component on an adsorption surface, and a second rotary transfer unit that moves the second holding unit along a circular orbit; A position correction unit provided between the first rotary transfer unit and the second rotary transfer unit on the conveyance path of the electronic component, which corrects the position of the electronic component received from the first holding unit and delivers it to the second holding unit; Comprising: The position correction unit: An adsorption holding unit having an adsorption surface for adsorbing and holding the electronic component, performing the transfer of the electronic component between the first holding unit at the first transfer position, and performing the transfer of the electronic component between the second holding unit at the second transfer position; A rotary transfer table provided with the adsorption holding unit and moving the adsorption holding unit along a circular orbit centered on a rotation axis; A parallel drive unit that translates the rotary transfer table to correct the planar position of the electronic component adsorbed and held by the adsorption holding unit; Having: A transfer device, wherein at the second transfer position, the adsorption surface of the opposing adsorption holding unit and the adsorption surface of the second holding unit are parallel.

2. The rotary transfer table intermittently moves at a predetermined rotation pitch while stopping at the first transfer position and the second transfer position; The parallel drive unit translates the rotary transfer table during the rotation of the rotary transfer table to correct the planar position of the electronic component adsorbed and held by the adsorption holding unit. The transfer device according to claim 1.

3. The timing of delivering the electronic component from the first holding unit to the adsorption holding unit at the first transfer position and the timing of delivering the electronic component from the adsorption holding unit to the second holding unit at the second transfer position are the same. The transfer device according to claim 2.

4. The timing of delivering the electronic component from the first holding unit to the adsorption holding unit at the first transfer position and the timing of delivering the electronic component from the adsorption holding unit to the second holding unit at the second transfer position are different. The transfer device according to claim 2.

Images