Wiring board with built-in component and method for manufacturing the wiring board with built-in component

Abstract

To improve productivity of a wiring board with built-in component.SOLUTION: A wiring board with built-in component includes: a core substrate having an opening part; a plurality of electronic components inserted into the opening part in a state of being spaced apart from each other; a build-up part disposed on the core substrate and the electronic components; and a first resin part filling the opening part. The plurality of electronic components is connected to each other by a second resin part such that each height of the electronic components is different from each other, and each terminal surface of the electronic components is flush with each other.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a wiring board with built-in components and a method for manufacturing the wiring board with built-in components.

Background Art

[0002] Patent Document 1 discloses a wiring board including a core substrate having an opening, a plurality of electronic components arranged in the opening with a gap therebetween, and a build-up portion arranged on the core substrate and on the electronic components, wherein the gap is filled with resin.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a configuration where a plurality of electronic components are inserted into an opening, a large amount of a first resin for filling the opening is required.

Means for Solving the Problems

[0005] The wiring board with built-in components of the present disclosure is a wiring board with built-in components including a core substrate having an opening, a plurality of electronic components inserted into the inside of the opening in a spaced-apart state, a build-up portion arranged on the core substrate and on the electronic components, and a first resin portion for filling the opening, wherein the plurality of electronic components are connected by a second resin portion so that their heights are different from each other and their terminal surfaces are flush with each other.

[0006] The method for manufacturing a wiring board with built-in components according to the present disclosure includes preparing a plurality of electronic components having different heights, inserting the plurality of electronic components into the openings of the core substrate from the terminal surface side of each electronic component, filling the openings with a first resin portion, and laminating a build-up portion on the core substrate. The step of preparing the plurality of electronic components includes connecting the electronic components to each other with a second resin portion so that their terminal surfaces are flush with each other.

[0007] According to the wiring board with built-in components and the method for manufacturing the wiring board with built-in components of the present disclosure, since the space in the opening is occupied by the second resin portion that connects the electronic components, the amount of the first resin for filling the opening is reduced compared to a configuration in which a plurality of electronic components are individually inserted into the opening and the space between the electronic components is filled with the first resin portion.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Mode for Carrying Out the Invention

[0009] Next, embodiments of the present disclosure will be described in detail with reference to the drawings.

[0010] FIG. 1 is a cross-sectional view showing a part of the component-embedded wiring board 10 of an embodiment of the present disclosure (hereinafter referred to as "the present embodiment") cut out.

[0011] As shown in FIG. 1, the component-embedded wiring board 10 of the present embodiment includes a core substrate 20 having a first surface (upper surface or front side) 20F and a second surface (lower surface or back side) 20B opposite to the first surface, a build-up portion 22 formed on the first surface side of the core substrate 20, and a build-up portion 21 formed on the second surface side of the core substrate 20.

[0012] Here, the upper surface or front side means the upper surface in the drawing among the two surfaces constituting the core substrate 20, and the lower surface or back side means the lower surface in the drawing among the two surfaces constituting the core substrate 20. Further, in the following description, for convenience in the thickness direction of the component-embedded wiring board 10, the side far from the core insulating layer 70 is referred to as the upper side, the upward direction, or up, and the side close to the core insulating layer 70 is referred to as the lower side, the downward direction, or down for explanation.

[0013] The build-up portions 21 and 22 each have a plurality of laminated interlayer insulating layers 50, a plurality of conductor patterns (that is, lands) 81 and 82 formed between the plurality of interlayer insulating layers 50, and a plurality of via conductors 60 formed so as to penetrate the interlayer insulating layers 50. The interlayer insulating layer 50 is an example of an insulating layer.

[0014] And the core substrate 20 has a structure in which via conductors 60, through-hole conductors 36, conductor patterns 81 and 82, and an opening 27 are formed in a core insulating layer 70. That is, the core substrate 20 has the opening 27. As shown in FIG. 2, the core insulating layer 70 is composed of an insulating substrate 30 and resin layers 41 and 42 formed on a first surface and a second surface opposite to the first surface of the insulating substrate 30, respectively. The resin layers 41 and 42 are formed using a thermosetting resin sheet, for example, a prepreg. In the present embodiment, a reinforcing material 25 is included inside the insulating substrate 30 to ensure the strength of the entire core substrate 20, but the reinforcing material 25 may not be included inside the insulating substrate 30.

[0015] As shown in FIG. 1, the through-hole conductor 36 is formed by forming a metal plating film such as copper plating on the inner wall of a through-hole in the insulating substrate 30, filling the inside with resin, and then applying a cover plating to the end face.

[0016] And a plurality of conductor patterns 81 and 82, which are conductor layers, are formed on the resin layers 41 and 42, respectively. These plurality of conductor patterns 81 and 82 are formed by plating on the resin layer 42 formed on the first surface of the insulating substrate 30 and on the resin layer 41 formed on the second surface, respectively.

[0017] Via conductors 60 are formed on the upper surface side and the lower surface side of the through-hole conductor 36, respectively. These via conductors 60 are formed by filling through-holes formed in the resin layers 41 and 42 with plating, respectively.

[0018] And a part of the conductor pattern 81 and a part of the conductor pattern 82 are configured to be electrically connected via the via conductors 60, the through-hole conductors 36, and conductor patterns on both surfaces of the insulating substrate 30 (not shown).

[0019] As shown in FIGS. 1 and 3, the opening 27 penetrates through the core substrate 20 from the first surface (the surface on the upper surface side of the resin layer 42) 20F to the second surface (the surface on the lower surface side of the resin layer 41) 20B by the height H of the core substrate 20. A plurality of electronic components 90 are inserted inside the opening 27. The opening 27 is filled with a mold resin and an embedded resin in a state where a plurality of electronic components 90 are inserted, and the mold resin portion 44 and the embedded resin portion 46 are formed by solidifying each resin. The embedded resin portion 46 and the mold resin portion 44 are examples of a first resin portion and a second resin portion, respectively. The embedded resin portion 46 is formed of, for example, an epoxy resin as the embedded resin. The upper and lower surfaces (the first surface 20F and the second surface 20B) of the core substrate 20 are in contact with the interlayer insulating layers 50, respectively. The embedded resin portion 46 is the same resin as the interlayer insulating layers 50 of the build-up portions 21 and 22.

[0020] The plurality of electronic components 90 include at least a first component 92 and a second component 96. The plurality of electronic components 90 are, for example, passive components such as capacitors and inductors or semiconductor elements.

[0021] As shown in FIG. 4, the first component 92 has a box shape with a rectangular cross section, and has a bottom surface 92B and a top surface 92F that is located at a height of a first height H1 from the bottom surface 92B and is formed along the bottom surface 92B. The top surface 92F is the opposite surface of the bottom surface 92B. A pair of terminals 94 that protrude downward are arranged on the bottom surface 92B of the first component 92, but no terminals are arranged on the top surface 92F. The terminals 94 are arranged flush with the first surface 20F, and the terminals 94 are electrically connected to the via conductors 60.

[0022] The second component 96 is box-shaped with a rectangular cross-section, and has a bottom surface 96B and a top surface 96F that is located at a height of a second height H2 from the bottom surface 96B and is formed along the bottom surface 96B. In the present embodiment, the height of the second height H2 is higher than the first height, that is, the first component 92 and the second component 96 have different heights from each other. Also, the height of the second height H2 is lower than the height (thickness) H of the core substrate, that is, it is a height that fits inside the core substrate. Further, a pair of terminals 98 that protrude downward from the bottom surface 96B and a pair of terminals 99 that protrude upward from the top surface 96F are arranged on the second component 96. In the present embodiment, the terminal surface 98A of the terminal 98 is arranged to be flush with the first surface 20F, and the terminal 98 is electrically connected to the via conductor 60. Also, the terminal 99 is electrically connected to the via conductor 60 on the second surface 20B. In the present embodiment, the terminal surface 99A of the terminal 99 is arranged to be flush with the second surface 20B, but the terminal surface 99A does not have to be flush with the second surface 20B. However, even when the terminal surface 99A is not flush with the second surface 20B, those in which the second height H2 is greater than the height H of the core substrate 20 are not included.

[0023] As shown in FIG. 4, the first component 92 and the second component 96 are inserted into the opening 27 in a state where they are separated by a gap D in the left-right direction in the figure and are connected by a box-shaped mold resin portion 44. In the left-right direction in the figure, mold resin portions 44 are arranged on the left side of the first component 92 (the side opposite to the gap D with respect to the first component 92) and the right side of the second component 96 (the side opposite to the gap D with respect to the second component 96), respectively. That is, the left side of the first component 92 and the right side of the second component 96 are each covered with the mold resin portion 44. Although not shown, when viewed from the up-down direction, the mold resin portion 44 is formed so as to surround the first component 92 and the second component 96. The first component 92 and the second component 96 connected by the mold resin portion 44 are an example of a connected electronic component. Hereinafter, a plurality of electronic components 90 connected by the mold resin portion 44 are also simply referred to as "connected components 90".

[0024] Next, a method for manufacturing the component-embedded wiring board 10 of the present embodiment will be described.

[0025] (Preparation of a plurality of electronic components) First, prepare a plurality of electronic components 90 having different heights. Preparing a plurality of electronic components 90 includes connecting the electronic components 90 to each other by a molding resin portion 44 such that their terminal surfaces are flush with each other. Specifically, prepare a plurality of electronic components 90 in a state where the terminal surface 94A of the first component 92 and the terminal surface 98A of the second component 96 are flush with each other and are connected by the molding resin portion 44.

[0026] (Cavity formation) As shown in FIG. 3, form an opening 27 in the core substrate 20.

[0027] Next, as shown in FIG. 4, attach an adhesive tape T to the end face of the conductor pattern 82 of the core substrate 20 such that the adhesive surface faces the conductor pattern 82. Also, insert the connecting component 90 into the inside of the opening 27 from the terminal surface 94A side and the terminal surface 98A side, leaving a gap GP defined on both sides in the left - right direction in the figure. When inserting into the opening 27, insert the connecting component 90 so as to be flush with the adhesive surface of the adhesive tape T.

[0028] As shown in FIG. 5, embed an embedding resin in the gap GP. By solidifying the embedding resin to form an embedding resin portion 46, the connecting component 90 is fixed inside the opening 27. In the present embodiment, after forming the embedding resin portion 46 above the second surface 20B of the core substrate 20, polish the embedding resin portion 46 up to the second surface 20B (not shown).

[0029] (Lamination of build - up portions 21 and 20 on the core substrate 20) Next, peel the adhesive tape T from the core substrate 20 to which the connecting component 90 is fixed, and prepare a reversed core substrate 20 with its top and bottom reversed. Note that, unlike FIGS. 2 to 5, in FIG. 6, the vertical positions of the first surface 20F and the second surface 20B are reversed. As shown in FIG. 6, a single layer of the interlayer insulating layer 50 is laminated on the first surface 20F, the second surface 20B of the core substrate 20, and the second component 96. After lamination, the terminal surfaces 94A of the first component 92, and the terminal surfaces 98A, 99A of the second component 96 are electrically connected to the via conductors 60, respectively. Note that the via conductors 60 and the conductor patterns 81, 82 are integrally formed.

[0030] As described above, a plurality of interlayer insulating layers 50 are laminated according to the product specifications. Finally, the component-embedded wiring board 10 is manufactured together with the core substrate 20 as the build-up parts 21, 22.

[0031] (Offline operation of a plurality of electronic components 90) As shown in FIG. 7, before being inserted into the core substrate 20, a plurality of electronic components 90 are connected. In this embodiment, they are connected on a manufacturing line (offline) different from the manufacturing line of the core substrate 20, but these manufacturing lines may be the same.

[0032] As shown in FIG. 7(a), a plurality of first components 92 and a plurality of second components 96 included in the plurality of electronic components 90 are arranged on the upper surface SA of a sheet member S (a double-sided tape attached on a substrate or a wafer) formed in a sheet shape so that the terminal surfaces 94A, 98A are flush with each other. In this embodiment, one first component 92 and one second component 96 are separated from each other by a gap D (see FIG. 4), and the one second component 96 and another first component 92 are arranged in a state having a defined gap. That is, the first components 92 and the second components 96 are arranged alternately.

[0033] As shown in FIG. 7(b), a plurality of electronic components 90 arranged on the sheet member S are sealed as a first manufacturing unit U1 with a mold resin portion 44. The first manufacturing unit U1 is an example of a first unit. The first manufacturing unit U1 is determined by a dicing (individualization) position DL. For sealing the plurality of electronic components 90, a mold (not shown) is provided outside the plurality of electronic components 90, and the mold resin portion 44 is formed by pouring liquid mold resin into the inside of the mold. The amount of the mold resin poured into the mold (not shown) is set to such an extent that the first component 92 and the second component 96 are connected. In the present embodiment, the mold resin is poured into the mold (not shown) above the first height H1 of the first component 92 and below the second height H2 of the second component 96.

[0034] As shown in FIG. 7(c), the first manufacturing unit U1 is diced into a second manufacturing unit U2 which is a manufacturing unit smaller than the first manufacturing unit U1 at the dicing position DL. The second manufacturing unit U2 is an example of a second unit. By inserting the connected component 90 after dicing into the opening 27 of the core substrate 20, the connected component 90 is used for manufacturing the component-embedded wiring board 10. In the present embodiment, the sheet member S is peeled off from the connected component 90, and the connected component 90 is inserted into the opening 27, whereby it is used for manufacturing the component-embedded wiring board 10.

[0035] (Function and effect) The component-embedded wiring board 10 of the present embodiment includes a core substrate 20 having an opening 27, a plurality of electronic components 90 inserted inside the opening 27 in a state of being separated from each other, build-up portions 21 and 22 disposed on the core substrate 20 and on the electronic components 90, and an embedding resin portion 46 for filling the opening 27. The plurality of electronic components 90 have different heights from each other, and are connected by a mold resin portion 44 such that the terminal surfaces 94A and 98A of each other are flush. According to this configuration, since the space in the opening 27 is occupied by the mold resin portion 44 that connects the electronic components 90 to each other, compared with a configuration in which the plurality of electronic components 90 are individually inserted into the opening 27 and the space between the electronic components 90 is filled with the embedding resin portion 46, the amount of the embedding resin for filling the opening 27 is reduced.

[0036] Next, in the component-embedded wiring board 10 of the present embodiment, the plurality of electronic components 90 include a first component 92 having a first height H1 and a second component having a second height H2 higher than the first height H1. Terminals are not arranged on the top surface 92F, and terminals 99 are arranged on the top surface 96F. That is, the plurality of electronic components 90 include a first component 92 having a first height H1 from the bottom surface 92B to the top surface 92F and having no terminals arranged on the top surface 92F, and a second component 96 having a second height H2 from the bottom surface 96B to the top surface 96F, being higher than the first height H1 and having terminals 99 arranged on the top surface 96F. According to this configuration, poor connection between the core substrate 20 and the first component 92 having a lower height than the second component 96 is avoided.

[0037] And, in the component-embedded wiring board 10 of the present embodiment, the build-up portions 21, 22 have an interlayer insulating layer 50 on the core substrate 20 side. Since the embedded resin portion 46 is made of the same resin as the interlayer insulating layer 50, the interlayer insulation property is enhanced as compared with a configuration in which the embedded resin portion 46 is different from the resin of the interlayer insulating layer 50 in the build-up portions 21, 22.

[0038] Also, in the method for manufacturing the component-embedded wiring board 10 of the present embodiment, preparing a plurality of electronic components 90 having different heights, inserting the plurality of electronic components 90 into the openings 27 of the core substrate 20 from the terminal surfaces 94A of the first components 92 and the terminal surfaces 98A of the second components 96, filling the embedding resin portion 46 into the openings 27, and laminating the build-up portions 21 and 22 on the resin layers 41 and 42 of the core substrate 20. The method for manufacturing the component-embedded wiring board 10 includes connecting the first component 92 and the second component 96 with the mold resin portion 44 so that the terminal surfaces 94A and 98A of each other are flush. That is, as the plurality of electronic components 90, a connected component 90 connected with each other by the mold resin portion 44 is prepared so that the heights in the insertion direction are different and the terminal surfaces 94A and 98A of each other are flush. According to this manufacturing method, since the space in the opening 27 is occupied by the mold resin portion 44 that connects the electronic components 90 to each other, compared with a configuration in which the plurality of electronic components 90 are individually inserted into the opening 27 and the space between the electronic components 90 is filled with the embedding resin portion 46, the amount of the embedding resin that fills the opening 27 is reduced.

[0039] Also, in the method for manufacturing the component-embedded wiring board 10 of the present embodiment, the build-up portions 21 and 22 include having an interlayer insulating layer 50 on the core substrate 20 side, and the embedding resin portion 46 is formed of the same resin as the interlayer insulating layer 50. According to this configuration, the interlayer insulation property is enhanced compared with a configuration in which the embedding resin portion 46 is different from the resin of the interlayer insulating layer 50 in the build-up portions 21 and 22.

[0040] Furthermore, in the method for manufacturing the component-embedded wiring board 10 of the present embodiment, connecting a plurality of electronic components 90 with the mold resin portion 44 in the first manufacturing unit U1, and separating the plurality of electronic components 90 connected with the mold resin portion 44 in a second manufacturing unit U2 smaller than the first manufacturing unit U1. According to this manufacturing method, the plurality of electronic components 90 connected with the mold resin portion 44 are manufactured in the manufacturing unit 1 at once.

[0041] As described above, the present disclosure has been described in detail with respect to specific embodiments. However, it is obvious to those skilled in the art that the present disclosure is not limited to such embodiments, and the present disclosure can take various other embodiments within the scope of the present disclosure. For example, there are modification examples as follows, but not limited thereto.

[0042] (Modification example) (Presence or absence of terminals in a plurality of electronic components) In the first component 92, the configuration is such that no terminal is arranged on the top surface 92F, but it is not limited thereto. Terminals may be arranged on the top surface 92F of the first component 92. In the second component 96, the configuration is such that the terminal 99 is arranged on the top surface 96F, but it is not limited thereto. The configuration may be such that no terminal is arranged on the top surface 96F of the second component 96.

[0043] (Resin of the build-up portions 21, 22) The embedded resin portion 46 is assumed to be the same resin as the interlayer insulating layer 50 of the build-up portions 21, 22, but it is not limited thereto. The embedded resin portion 46 may be a resin different from the interlayer insulating layer 50 of the build-up portions 21, 22.

[0044] (First manufacturing unit U1) The plurality of electronic components 90 are assumed to be sealed as the first manufacturing unit U1 with the mold resin portion 44 and then diced, but it is not limited thereto. The first manufacturing unit U1 may be inserted as it is into the core substrate 20.

[0045] (Embedding with mold resin) Although the molded resin part 44 is shown as being poured into a mold (not shown) above the first height H1 of the first component 92 and below the second height H2 of the second component 96, it is not limited to this. The molded resin part 44 may be poured into a mold (not shown) below the first height H1 or above the second height H2. Also, although the molded resin part 44 is shown as being poured into a mold (not shown), it is not limited to this. Solid resin may be arranged around the plurality of electronic components 90 and the first component 92 and the second component 96 may be connected by heating. And although both the first component 92 and the second component 96 are box-shaped with a rectangular cross-section, it is not limited to this. They may have different sizes and shapes, and both are connected by the molded resin part 44.

Explanation of Reference Numerals

[0046] 10 Component-embedded Wiring Board 20 Core Substrate 21, 22 Build-up Part 27 Opening 30 Insulating Substrate 41, 42 Resin Layer 44 Molded Resin Part (An Example of the Second Resin Part) 46 Embedded Resin Part (An Example of the First Resin Part) 50 Interlayer Insulating Layer (An Example of the Insulating Layer) 60 Via Conductor 70 Core Insulating Layer 90 Plurality of Electronic Components (Connected Components) 92 First Component 92B Bottom Surface 92F Top Surface 94 Terminal 96 Second Component 96B Bottom Surface 96F Top Surface 98, 99 Terminals DL Dicing Position S Sheet Member U1 First Manufacturing Unit (An Example of the First Unit) U2 Second Manufacturing Unit (An Example of the Second Unit)

Claims

1. A core substrate having an opening, A plurality of electronic components inserted inside the opening in a spaced-apart manner from each other, A build-up portion disposed on the core substrate and on the electronic components, A first resin portion filling the opening, A component-embedded wiring board comprising: The plurality of electronic components are connected by a second resin portion such that they have different heights from each other and their terminal surfaces are flush with each other.

2. The component-embedded wiring board according to Claim 1, The plurality of electronic components include a first component having a first height and a second component having a second height higher than the first height, Terminals are not arranged on the surface opposite to the terminal surface of the first component, and terminals are arranged on the surface opposite to the terminal surface of the second component.

3. The component-embedded wiring board according to Claim 1, The build-up portion has an insulating layer on the core substrate side, The first resin portion is formed of the same resin as the insulating layer.

4. Preparing a plurality of electronic components having different heights from each other, Inserting the plurality of electronic components into the opening of the core substrate from the terminal surface side of each electronic component, Filling the opening with a first resin portion, Laminating a build-up portion on the core substrate, A method for manufacturing a component-embedded wiring board, comprising: Preparing the plurality of electronic components includes connecting the electronic components to each other by a second resin portion such that their terminal surfaces are flush with each other.

5. The method for manufacturing a component-embedded wiring board according to Claim 4, The build-up portion has an insulating layer on the core substrate side, The first resin portion is formed of the same resin as the insulating layer.

6. The method for manufacturing a component-embedded wiring board according to Claim 4, Connecting a plurality of electronic components with a second resin portion in a first unit, Separating the plurality of electronic components connected by the second resin portion into a second unit smaller than the first unit to obtain connected electronic components.

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