Power storage device and method of manufacturing power storage device

Abstract

To provide a power storage device capable of suppressing a decrease in cooling efficiency of a power storage module when a heat conductive material is provided between a cooler and the power storage module.SOLUTION: A power storage device 100 comprises: a power storage module 10; a heat conductive material 40 including a heat conductive layer 41 stacked on the power storage module 10 in a Z direction (stacking direction); and a cooler 30 stacked on the heat conductive layer 41 in the Z direction. The cooler 30 includes a contact surface 32 in contact with the heat conductive layer 41, and an outer surface 33 (second surface) opposite to the contact surface 32 (first surface). The cooler 30 is formed with a through-hole 31 that connects the contact surface 32 and the outer surface 33.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to an electricity storage device and a method for manufacturing an electricity storage device. [Background technology]

[0002] Japanese Patent Laid-Open Publication No. 2023-046670 (Patent Document 1) discloses an electricity storage device including a case that houses an electricity storage stack, a cooler, and a thermally conductive material disposed between the case and the cooler. The thermally conductive material is spread (expanded) by being sandwiched (pressurized) between the cooler and the electricity storage stack (case). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-046670 Summary of the Invention [Problem to be solved by the invention]

[0004] In the electricity storage device described in Patent Document 1, air pockets are generated in the heat conductive material located between the cooler and the electricity storage stack during manufacturing, reducing the cooling efficiency of the cooler for the electricity storage stack (electricity storage module).

[0005] The present disclosure has been made to solve the above-mentioned problems, and its purpose is to provide an energy storage device and a method for manufacturing an energy storage device that can suppress a decrease in the cooling efficiency of an energy storage module when a thermally conductive material is provided between a cooler and the energy storage module. [Means for solving the problem]

[0006] A power storage device according to a first aspect of the present disclosure includes a power storage module including a plurality of power storage cells, a thermally conductive material including a thermally conductive layer stacked on the power storage module in a stacking direction, and a cooler stacked on the thermally conductive layer in the stacking direction. The cooler includes a first surface in contact with the thermally conductive layer and a second surface opposite the first surface. A through hole is formed in the cooler, communicating between the first surface and the second surface.

[0007] In the energy storage device according to the first aspect of the present disclosure, as described above, the cooler is formed with a through-hole that communicates between the first surface and the second surface. This allows air trapped between the cooler and the energy storage module to be discharged through the through-hole when the heat conductive material (heat conductive layer) is pressurized by the cooler and the energy storage module. As a result, it is possible to prevent the pressurization from being hindered by air. This prevents deterioration of contact between the cooler and the heat conductive material (heat conductive layer) and between the energy storage module and the heat conductive material (heat conductive layer). As a result, it is possible to prevent a decrease in the cooling efficiency of the energy storage module by the cooler.

[0008] In the above-described energy storage device according to the first aspect, the thermally conductive material preferably includes a filling portion formed continuously with the thermally conductive layer and filling the through-hole. The filling portion is in contact with the inner peripheral surface of the through-hole. With this configuration, the contact area between the cooler and the thermally conductive material can be increased by the area of the inner peripheral surface with which the filling portion is in contact. As a result, a decrease in the cooling efficiency of the energy storage module by the cooler can be further suppressed.

[0009] In this case, the thermally conductive material preferably includes a protrusion formed continuously with the filling portion and protruding from the through hole toward the opposite side of the thermally conductive layer. The protrusion is in contact with the second surface. This configuration increases the contact area between the thermally conductive material and the cooler and prevents the cooler from being displaced in the direction of the through hole.

[0010] In the energy storage device according to the first aspect, the through-hole is preferably formed at a position overlapping with a center portion of the energy storage module in a direction intersecting the stacking direction. Here, air tends to accumulate in the center portion of the energy storage module in a direction intersecting the stacking direction. Therefore, with the above configuration, air can be effectively discharged through the through-hole.

[0011] In the energy storage device according to the first aspect, the through-hole is preferably formed at a position overlapping in the stacking direction with an end of the energy storage module in a direction intersecting the stacking direction. Here, the thermally conductive material is likely to peel off at the end of the energy storage module in the direction intersecting the stacking direction due to external vibrations, etc. Therefore, with the above configuration, deterioration of contact between the thermally conductive material and the energy storage module at the end of the energy storage module is suppressed, thereby effectively suppressing peeling of the thermally conductive material from the energy storage module.

[0012] In the energy storage device according to the first aspect, the energy storage cells are preferably arranged in an arrangement direction intersecting the stacking direction. The through-holes are formed at positions overlapping in the stacking direction with gaps between adjacent energy storage cells in the arrangement direction. With this configuration, air trapped between the energy storage cells can be easily discharged through the through-holes. As a result, deterioration of contact between the cooler and the thermally conductive material and between the energy storage module and the thermally conductive material can be further suppressed.

[0013] In this case, the width of the through-hole in the arrangement direction is preferably smaller than the width of each of the plurality of energy storage cells in the arrangement direction. This configuration allows for a larger contact area between the cooler and the thermally conductive material than when the width of the through-hole is equal to or greater than the width of the energy storage cells. Furthermore, compared to when the width of the through-hole is equal to or greater than the width of the energy storage cells, it is possible to prevent the amount of thermally conductive material (thermal conductive layer) between the energy storage module and the cooler from being excessively pushed out through the through-hole.

[0014] In the energy storage device in which the energy storage module includes a plurality of energy storage cells, the width of the through-hole in the arrangement direction is preferably greater than the distance between adjacent energy storage cells in the arrangement direction. This configuration allows air trapped between the cooler and the energy storage module to be more efficiently discharged through the through-hole compared to when the width of the through-hole is equal to or less than the distance. Furthermore, compared to when the width of the through-hole is equal to or less than the distance, it is possible to promote the thermally conductive material (thermally conductive layer) between the energy storage module and the cooler to be pushed out through the through-hole rather than into the gaps between the energy storage cells.

[0015] In this case, the through-holes are preferably formed to extend in the arrangement direction so as to straddle at least two of the plurality of energy storage cells. With this configuration, the gaps between the energy storage cells and the through-holes can be easily overlapped in the stacking direction.

[0016] A manufacturing method for a storage device according to a second aspect of the present disclosure includes a preparation step of preparing a cooler including a first surface and a second surface opposite the first surface, with at least one through hole formed therein connecting the first surface and the second surface; a coating step of applying a thermally conductive material to the first surface of the cooler and to at least one of a storage module including a plurality of storage cells; a stacking step of stacking the cooler and the storage module after the coating step so that the thermally conductive material contacts each of the first surfaces of the storage module and the cooler; and a pressing step of pressing one of the cooler and the storage module against the other of the cooler and the storage module after the stacking step.

[0017] In the manufacturing method for an energy storage device according to the second aspect of the present disclosure, as described above, one of the cooler having at least one through-hole formed therein communicating the first surface and the second surface and the energy storage module is pressed against the other of the cooler and the energy storage module. This allows the pressing step to be performed while air trapped between the cooler and the energy storage module is removed through the through-hole. As a result, it is possible to provide a manufacturing method for an energy storage device that can suppress a decrease in the cooling efficiency of the cooler for the energy storage module.

[0018] In the method for manufacturing an electricity storage device according to the second aspect, the at least one through hole preferably includes a plurality of through holes. The pressing step is a step of pressing a portion of a cooler provided between the plurality of through holes toward the electricity storage module. With this configuration, when the thermally conductive material is pushed out into the through hole in the pressing step, it is possible to prevent the thermally conductive material from adhering to a jig or the like used for pressing. [Effects of the Invention]

[0019] According to the present disclosure, when a thermally conductive material is provided between a cooler and a power storage module, it is possible to suppress a decrease in the cooling efficiency of the power storage module. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a perspective view illustrating a configuration of an electricity storage device according to an embodiment. [Figure 2] FIG. 1 is a perspective view illustrating a configuration of a storage cell according to an embodiment. [Figure 3] FIG. 2 is a plan view of a cooler according to an embodiment, as viewed from the Z1 side. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Figure 5] FIG. 4 is a cross-sectional view taken along line VV in FIG. [Figure 6] FIG. 3 is a flowchart showing a method for manufacturing an electricity storage device according to an embodiment. [Figure 7] 7 is a cross-sectional view showing the electricity storage module and the thermally conductive material after step S2 in FIG. 6 has been performed. [Figure 8] 7 is a cross-sectional view showing the power storage module, the thermally conductive material, and the cooler after step S3 in FIG. 6 has been performed. [Figure 9] 7 is a view of the pressing member and the cooler used in step S4 of FIG. 6, seen from the Z1 side. [Figure 10] FIG. 1 is a first diagram showing a cross section of an electricity storage device according to a modified example of an embodiment. [Figure 11] FIG. 2 is a second diagram showing a cross section of an electricity storage device according to a modified example of the embodiment. [Figure 12] FIG. 3 is a third diagram showing a cross section of an electricity storage device according to a modified example of the embodiment. [Figure 13] FIG. 7 is a diagram showing a modified example of step S2 in FIG. 6. [Figure 14] FIG. 7 is a diagram showing a modified example of step S4 in FIG. 6. [Figure 15] FIG. 4 is a cross-sectional view of an electricity storage device according to a modified example of the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated.

[0022] In this specification, the vertical direction is referred to as the Z direction. Specifically, the upper side of the extension direction is referred to as the Z1 direction, and the lower side is referred to as the Z2 direction. The X direction and the Y direction are each perpendicular to the Z direction (i.e., horizontal directions). The X direction is perpendicular to the Y direction. The X direction and the Z direction are examples of the "arrangement direction" and the "stacking direction" of the present disclosure, respectively.

[0023] <Configuration of the power storage device> FIG. 1 is a perspective view showing the configuration of a power storage device 100 according to this embodiment. The power storage device 100 is a device for storing electric power for driving, for example, an electric vehicle (not shown). The X direction shown in FIG. 1 is, for example, the front-to-rear direction of the electric vehicle. The Y direction is the left-to-right direction of the electric vehicle. The power storage device 100 may also be provided in an electrical device other than an electric vehicle (for example, a stationary power storage device).

[0024] The energy storage device 100 includes an energy storage module 10, a case 20, a cooler 30, and a thermally conductive material 40. Note that a plurality of energy storage modules 10 may be provided. For example, a plurality of energy storage modules 10 may be arranged side by side in the X direction.

[0025] FIG. 2 is a perspective view showing the structure of one of the plurality of storage cells 11 included in the energy storage module 10. The plurality of storage cells 11 have the same structure and orientation. Each of the plurality of storage cells 11 is formed to extend in the Y direction. Specifically, the storage cell 11 has a prismatic shape formed to extend in the Y direction. The plurality of storage cells 11 are also arranged (stacked) in the X direction (see FIG. 3).

[0026] The energy storage cell 11 has a length L1 in the Y direction. The energy storage cell 11 has a length L2 in the X direction. The length L1 is greater than the length L2. That is, the Y direction is the longitudinal direction of the energy storage cell 11. The energy storage cell 11 also has a height H in the Z direction. The height H is smaller than the length L1. The height H is greater than the length L2. Note that each of the multiple energy storage cells 11 may be arranged to extend in the X direction.

[0027] Referring again to FIG. 1 , the case 20 houses the energy storage module 10. The case 20 includes an upper case 21 and a lower case 22. The energy storage module 10 is housed in a space formed by assembling the upper case 21 to the lower case 22. The cooler 30 is also housed in the space. Note that the configuration of the case 20 is not limited to the example shown in FIG. 1 . For example, the energy storage module 10 may be disposed (housed) in a case that does not include an upper case.

[0028] The cooler 30 cools the power storage module 10. The cooler 30 is disposed above (on the Z1 side of) the power storage module 10. The cooler 30 is provided so as to cover the power storage module 10 from the Z1 side. Specifically, the cooler 30 is stacked in the Z direction on a thermally conductive layer 41 (described later) included in the thermally conductive material 40. The cooler 30 has a plate shape formed so as to extend along the XY plane. The cooler 30 has a flow path (not shown) formed therein through which a coolant flows.

[0029] FIG. 3 is a plan view of the cooler 30 as viewed from the Z1 side. As shown in FIG. 3, each of the plurality of energy storage cells 11 is covered from the Z1 side by the cooler 30. The cooler 30 has a plurality of (five in FIG. 3) through holes 31 formed therein. The through holes 31 are formed in the center and at each of the four corners of the cooler 30. The through holes 31 have a circular (perfect circle) shape as viewed from the Z1 side. Note that the arrangement positions and number of the through holes 31 in the cooler 30 are not limited to the above example. Details of the through holes 31 will be described later.

[0030] Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 1. The thermally conductive material 40 includes a thermally conductive layer 41 laminated on the power storage module 10 in the Z direction. The thermally conductive layer 41 is disposed on the end faces 11a on the Z1 side of the multiple power storage cells 11. The thermally conductive layer 41 is sandwiched between the power storage module 10 and the cooler 30 in the Z direction. That is, the thermally conductive layer 41 is in contact with both the power storage module 10 and the cooler 30.

[0031] The cooler 30 includes a contact surface 32 and an outer surface 33. The contact surface 32 is in contact with the thermally conductive layer 41. The outer surface 33 is the surface opposite to the contact surface 32. The contact surface 32 and the outer surface 33 are examples of the "first surface" and the "second surface" of the present disclosure, respectively.

[0032] Here, air may accumulate between the cooler and the power storage module. Therefore, during the manufacturing of the power storage device, the air may hinder the application of pressure to the thermally conductive layer by the cooler and the power storage module. In this case, contact between the cooler and the thermally conductive layer and contact between the power storage module and the thermally conductive layer may deteriorate. This reduces the cooling efficiency of the power storage module by the cooler.

[0033] Therefore, in this embodiment, the through hole 31 is formed so as to communicate between the contact surface 32 and the outer surface 33. In other words, the through hole 31 is provided so as to communicate (connect) the space on the contact surface 32 side with the space on the outer surface 33 side. This makes it possible to discharge air accumulated between the cooler 30 and the energy storage module 10 through the through hole 31 during manufacturing of the energy storage device 100.

[0034] The through holes 31 are holes (through holes) formed to extend in the Z direction. The through holes 31 extend in a direction perpendicular to the thermal conduction layer 41 and the cooler 30. The through holes 31 are formed to extend linearly in the Z direction. The width W1 of the through holes 31 in the X direction does not change depending on the position in the Z direction. In other words, the width W1 is constant regardless of the position in the Z direction. The width W1 is an example of the "width in the arrangement direction of the through holes" of the present disclosure.

[0035] The thermally conductive material 40 includes a filling portion 42. The filling portion 42 is a portion of the thermally conductive material 40 that fills the through-hole 31. The filling portion 42 is formed continuously with the thermally conductive layer 41. The filling portion 42 is a portion that is pushed out (escaped) from between the cooler 30 and the power storage module 10 into the through-hole 31 when the thermally conductive material 40 is pressurized between the cooler 30 and the power storage module 10.

[0036] The filling portion 42 is in contact with the inner peripheral surface 31a of the through hole 31. Specifically, the filling portion 42 completely fills the inside of the through hole 31. In other words, no space is left inside the through hole 31 where the thermally conductive material 40 is not provided.

[0037] The thermally conductive material 40 includes a protruding portion 43. The protruding portion 43 is a portion that protrudes from the through opening 31 toward the opposite side (Z1 side) from the thermally conductive layer 41. The protruding portion 43 is formed continuously with the filling portion 42. The protruding portion 43 is a portion of the thermally conductive material 40 that overflows (leaks) from the through opening 31 when the thermally conductive material 40 is pressurized and enters the through opening 31 as described above.

[0038] The protrusion 43 is in contact with the outer surface 33 of the cooler 30. The protrusion 43 has a contact surface 43a that is in contact with the outer surface 33. The contact surface 43a is formed, for example, so as to surround the through hole 31. In other words, the contact surface 43a has an annular shape.

[0039] The width W1 of the through opening 31 in the X direction is smaller than the width W2 of each of the plurality of energy storage cells 11 in the X direction. Furthermore, the width W1 is larger than the interval D between the energy storage cells 11 adjacent to each other in the X direction. For example, the width W1 may be twice or more the interval D. Furthermore, the width W1 may be 4 / 5 or less of the width W2. Note that the width of the through opening 31 refers to the hole size (diameter) of the through opening 31. Furthermore, the width W2 is an example of the "width of each of the plurality of energy storage cells in the arrangement direction" in the present disclosure.

[0040] The through hole 31 is formed at a position overlapping in the Z direction with a gap G between the energy storage cells 11 adjacent in the X direction. Specifically, the gap G is disposed at a position overlapping in the Z direction with the center of the through hole 31 in the X direction. Note that the above-mentioned distance D means the width of the gap G in the X direction.

[0041] The through hole 31 is formed to extend in the X direction so as to straddle two of the plurality of energy storage cells 11. Specifically, the through hole 31 is provided so as to straddle two energy storage cells 11 that are spaced apart by a gap G that overlaps the through hole 31 in the Z direction.

[0042] 3, the through hole 31 (through hole 31 in FIG. 4) disposed in the center of the cooler 30 is formed at a position overlapping in the Z direction with the central portion 10a of the power storage module 10. The central portion 10a is located at the center of the power storage module 10 in both the X and Y directions.

[0043] Furthermore, the through holes 31 arranged at the four corners of the cooler 30 are formed at positions that overlap in the Z direction with the ends (10b, 10c) of the power storage module 10 in the X direction. The end 10b is the end on the X1 side of the power storage module 10. The end 10c is the end on the X2 side of the power storage module 10.

[0044] Of the four through holes 31 arranged at the four corners of the cooler 30, the two through holes 31 on the X1 side are arranged at positions overlapping with the end portion 10b in the Z direction. One of the two through holes 31 on the X1 side is arranged at a position overlapping with the end portion 10d on the Y1 side of the power storage module 10 in the Z direction. The other of the two through holes 31 on the X1 side is arranged at a position overlapping with the end portion 10e on the Y2 side of the power storage module 10 in the Z direction.

[0045] Of the four through holes 31, the two on the X2 side are positioned to overlap with the end 10c in the Z direction. One of the two through holes 31 on the X2 side is also positioned to overlap with the end 10d of the energy storage module 10 in the Z direction. The other of the two through holes 31 on the X2 side is also positioned to overlap with the end 10e of the energy storage module 10 in the Z direction.

[0046] Fig. 5 is a cross-sectional view taken along line VV in Fig. 3. The configurations of the through hole 31 and the heat conductive material 40 in Fig. 5 are the same as those in Fig. 4, and therefore will not be described repeatedly.

[0047] <Method of manufacturing an electricity storage device> 6 to 9, a method for manufacturing the power storage device 100 will be described. Note that the method for manufacturing the power storage device 100 is not limited to the manufacturing flow shown in FIG.

[0048] In step S1, a step of preparing a cooler 30 is performed. Specifically, a cooler 30 is prepared, which includes a contact surface 32 and an outer surface 33, and has a plurality of through holes 31 formed therein that communicate between the contact surface 32 and the outer surface 33.

[0049] In step S2, a step of applying a thermally conductive material 40 to the energy storage module 10 is performed. Specifically, the thermally conductive material 40 is applied to each end face 11a (see FIG. 7) of the plurality of energy storage cells 11. Note that the thermally conductive material 40 may be applied to each energy storage cell 11 before the plurality of energy storage cells 11 are arranged in the X direction, or the thermally conductive material 40 may be applied to each energy storage cell 11 after the plurality of energy storage cells 11 are arranged in the X direction. Also, while FIG. 7 shows an example in which the thermally conductive materials 40 applied to the energy storage cells 11 are connected (integrated) to each other, the thermally conductive materials 40 of the energy storage cells 11 may be separated from each other at this point.

[0050] In step S3, a step of stacking the power storage module 10 and the cooler 30 is performed. Specifically, as shown in Fig. 8, the cooler 30 is placed (stacked) on the thermally conductive material 40 that has been stacked on the power storage module 10. This brings the thermally conductive material 40 into contact with the contact surfaces 32 of the power storage module 10 and the cooler 30, respectively.

[0051] In step S4, a process of pressing the cooler 30 toward the power storage module 10 is performed. This applies pressure to the thermally conductive material 40 between the cooler 30 and the power storage module 10. Specifically, as shown in Fig. 9, the cooler 30 is pressed toward the Z2 side by a plurality of pressing members 110 (four in Fig. 9) installed on the Z1 side of the cooler 30.

[0052] Each of the multiple pressing members 110 presses a portion 34 of the cooler 30 provided between the through holes 31. Specifically, each of the multiple pressing members 110 presses a portion 34 provided between the through hole 31 corresponding to the central portion 10a and the four through holes 31 corresponding to the end portions (10b to 10e). Note that the multiple pressing members 110 may simultaneously press the cooler 30 (portions 34) with an equal pressing force.

[0053] Furthermore, by pressurizing the thermally conductive material 40 in the pressing process of step S4, air is discharged from the through-holes 31 and the thermally conductive material 40 is pushed out to the through-holes 31. This forms the filled portions 42 and the protruding portions 43. That is, the thermally conductive material 40 is deformed so as to form the filled portions 42 and the protruding portions 43.

[0054] As described above, in this embodiment, the cooler 30 is formed with the through-holes 31 that communicate the contact surface 32 and the outer surface 33. This allows air trapped between the cooler 30 and the power storage module 10 to be discharged through the through-holes 31 when the thermally conductive material 40 is pressurized by the cooler 30 and the power storage module 10. As a result, it is possible to further improve the adhesion between the cooler 30 and the thermally conductive material 40 (thermal conduction layer 41) and between the cooler 30 and the power storage module 10, respectively. As a result, it is possible to improve the cooling efficiency of the power storage module 10 by the cooler 30.

[0055] Moreover, in this embodiment, the thermally conductive material 40 is formed continuously with the thermally conductive layer 41 and includes a filling portion 42 that fills the through hole 31. The filling portion 42 is in contact with the inner peripheral surface 31a of the through hole. This makes it possible to increase the contact area between the thermally conductive material 40 and the cooler 30 by the area of the inner peripheral surface 31a. Furthermore, because the filling portion 42, which is part of the thermally conductive material 40, fills the through hole 31, it is possible to prevent the cooler 30 from shifting in position.

[0056] Moreover, in this embodiment, the thermally conductive material 40 includes a protruding portion 43 that is formed continuously with the filling portion 42 and protrudes from the through hole 31 to the side opposite the thermally conductive layer 41. The protruding portion 43 is in contact with the outer surface 33. This makes it possible to increase the contact area between the thermally conductive material 40 and the cooler 30 by the contact area between the protruding portion 43 and the outer surface 33. Furthermore, because the protruding portion 43 is in contact with the outer surface 33, the contact portion between the protruding portion 43 and the outer surface 33 can prevent the cooler 30 from shifting in position.

[0057] In the above embodiment, an example has been described in which the thermally conductive material 40 includes the filling portion 42 and the protruding portion 43, but the present disclosure is not limited to this. The thermally conductive material does not have to include the filling portion 42 and the protruding portion 43. For example, in the example shown in FIG. 10 , the thermally conductive material 140 includes only the thermally conductive layer 41. In the example shown in FIG. 11 , the thermally conductive material 240 includes only the thermally conductive layer 141. A gap V is formed in the thermally conductive layer 141 at a position overlapping the through hole 31 in the Z direction. In the example shown in FIG. 12 , the thermally conductive material 340 includes only the thermally conductive layer 41 and the filling portion 42.

[0058] In the manufacturing method of the energy storage device 100 in the above embodiment, an example in which the heat conductive material 40 is applied to the energy storage module 10 has been described, but the present disclosure is not limited to this. As shown in step S12 of Fig. 13 , the heat conductive material 40 may be applied to the cooler 30 (contact surface 32).

[0059] In the manufacturing method of the energy storage device 100 in the above embodiment, an example has been shown in which the cooler 30 is pressed toward the energy storage module 10, but the present disclosure is not limited to this. As shown in step S14 of Fig. 14 , the energy storage module 10 may be pressed toward the cooler 30. Furthermore, the cooler 30 may be pressed toward the energy storage module 10, and the energy storage module 10 may be pressed toward the cooler 30.

[0060] In the above embodiment, an example has been shown in which the portions 34 between the through holes 31 are pressed by the pressing member 110, but the present disclosure is not limited to this. For example, the pressing member 110 may be installed so as to block the through holes 31.

[0061] In the above embodiment, an example has been shown in which the through hole 31 is formed to extend in the Z direction, but the present disclosure is not limited to this. For example, the through hole may extend in a direction inclined with respect to the Z direction. Furthermore, the through hole does not have to be formed in a straight line. For example, the through hole may be provided with a bent portion, a curved portion, or the like.

[0062] In the above embodiment, an example was shown in which the filling portion 42 contacted the inner circumferential surface 31a of the through hole 31, but the present disclosure is not limited to this. The filling portion that fills the through hole 31 may be separated from the inner circumferential surface 31a.

[0063] In the above embodiment, an example has been shown in which the through hole 31 is formed at a position overlapping with each of the central portion 10a and the end portions (10b to 10e) of the energy storage module 10 in the Z direction, but the present disclosure is not limited to this. The through hole 31 may be formed at a position overlapping with only one of the central portion 10a and the end portions (10b to 10e) in the Z direction. Furthermore, the through hole 31 may be formed at a position overlapping with some of the end portions 10b to 10e in the Z direction. The arrangement position of the through hole 31 relative to the energy storage module 10 is not limited to the above example.

[0064] In the above embodiment, an example has been shown in which the through hole 31 corresponding to the central portion 10a is formed at a position overlapping with the gap G between the energy storage cells 11 in the Z direction, but the present disclosure is not limited to this. For example, as shown in Fig. 15 , the through hole 31 corresponding to the central portion 10a may be formed at a position that does not overlap with the gap G in the Z direction but overlaps with only one energy storage cell 11 in the Z direction.

[0065] In the above embodiment, an example was shown in which the width W1 of the through-hole 31 in the X direction is smaller than the width W2 of the energy storage cell 11 in the X direction, but the present disclosure is not limited to this. The width W1 may be equal to or greater than the width W2.

[0066] In the above embodiment, an example has been shown in which the width W1 is larger than the interval D between the power storage cells 11, but the present disclosure is not limited to this. The width W1 may be equal to or smaller than the interval D.

[0067] In the above embodiment, an example has been shown in which the cooler 30 is formed with the through-holes 31 arranged so as to straddle two energy storage cells 11, but the present disclosure is not limited to this. The cooler may be formed with through-holes arranged so as to straddle three or more energy storage cells 11.

[0068] In the above embodiment, an example has been described in which the cooler 30 is pressed by the pressing member 110, but the present disclosure is not limited to this. For example, the thermally conductive material 40 may be pressurized by moving a table on which one of the power storage module 10 and the cooler 30 is placed to the other side of the power storage module 10 and the cooler 30.

[0069] In the above embodiment, an example has been described in which the cooler 30 is disposed above the power storage module 10, but the present disclosure is not limited to this. The cooler may also be disposed below or to the side of the power storage module 10.

[0070] In the above embodiment, an example was shown in which the X direction, the Y direction, and the Z direction are perpendicular to one another, but the present disclosure is not limited to this. At least two of the X direction, the Y direction, and the Z direction may intersect each other without being perpendicular to one another.

[0071] In the above embodiment, an example has been shown in which the through hole 31 has a perfect circular shape when viewed along the Z direction, but the present disclosure is not limited to this. The through hole may have a rectangular shape or an elongated hole shape when viewed along the Z direction.

[0072] The configurations (processing) of the above-described embodiment and the above-described modifications may be combined with each other.

[0073] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present disclosure is defined by the claims, not by the description of the above embodiments, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0074] 10 Energy storage module, 10a Central portion, 10b, 10c, 10d, 10e End portions, 11 Energy storage cell, 30 Cooler, 31 Through hole, 31a Inner peripheral surface, 32 Contact surface (first surface), 33 Outer surface (second surface), 40, 140, 240, 340 Thermal conductive material, 41, 141 Thermal conductive layer, 42 Filling portion, 43 Protrusion, 100 Energy storage device, D Spacing, G Gap, W1 Width (Width of through hole), W2 Width (Width of energy storage cell), X Direction (Arrangement direction), Z Direction (Stacking direction).

Claims

1. a power storage module including a plurality of power storage cells; a thermally conductive material including a thermally conductive layer stacked on the power storage module in a stacking direction; a cooler stacked on the thermally conductive layer in the stacking direction, the cooler includes a first surface in contact with the thermally conductive layer and a second surface opposite the first surface; The cooler has a through hole formed therein, the through hole communicating the first surface and the second surface.

2. the thermally conductive material is formed continuously with the thermally conductive layer and includes a filling portion filled in the through hole, The power storage device according to claim 1 , wherein the filling portion is in contact with an inner circumferential surface of the through hole.

3. the thermally conductive material is formed continuously with the filling portion and includes a protruding portion protruding from the through hole to a side opposite to the thermally conductive layer, The power storage device according to claim 2 , wherein the protrusion is in contact with the second surface.

4. 4. The energy storage device according to claim 1, wherein the through-hole is formed at a position overlapping in the stacking direction with a central portion of the energy storage module in a direction intersecting the stacking direction.

5. 4. The energy storage device according to claim 1, wherein the through-hole is formed at a position overlapping, in the stacking direction, with an end of the energy storage module in a direction intersecting the stacking direction.

6. the plurality of storage cells are arranged in an arrangement direction intersecting the stacking direction, 4. The energy storage device according to claim 1, wherein the through-hole is formed at a position overlapping in the stacking direction with a gap between adjacent energy storage cells in the arrangement direction.

7. The power storage device according to claim 6 , wherein a width of the through-hole in the arrangement direction is smaller than a width of each of the plurality of power storage cells in the arrangement direction.

8. The power storage device according to claim 6 , wherein a width of the through hole in the arrangement direction is larger than a distance between adjacent power storage cells in the arrangement direction.

9. The power storage device according to claim 8 , wherein the through-hole is formed to extend in the arrangement direction and to straddle at least two or more of the plurality of power storage cells.

10. a preparation step of preparing a cooler including a first surface and a second surface opposite to the first surface, the cooler having at least one through-hole formed therein that communicates between the first surface and the second surface; a coating step of applying a thermally conductive material to at least one of the first surface of the cooler and an energy storage module including a plurality of energy storage cells; a lamination step of laminating the cooler and the electric storage module such that the thermally conductive material contacts each of the first surfaces of the electric storage module and the cooler after the coating step; a pressing step of pressing one of the cooler and the power storage module against the other of the cooler and the power storage module after the stacking step.

11. the at least one through hole includes a plurality of through holes; The method for manufacturing an electricity storage device according to claim 10 , wherein the pressing step is a step of pressing a portion of the cooler provided between the plurality of through holes toward the electricity storage module.

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