Vacuum vapor deposition device, and vacuum vapor deposition method

Abstract

To improve production efficiency of vapor deposition processing.SOLUTION: A vacuum vapor deposition device 10 that conveys a conveyance tray T, a glass substrate G and a vapor deposition mask M in a vertical position and performs a vertical scanning film deposition comprises: a vapor deposition chamber 15 which deposits film on a face to be film-deposited of a glass substrate in forward and return paths; a turn-back chamber 17; a rotary chamber 13 having two rotary conveyance rails 13r1, 13r2; a first inversion chamber 12A and a second inversion chamber 12B which switch the conveyance tray between a horizontal position and a vertical position; and a robot chamber 11 having a conveyance robot 11h which conveys the glass substrate between itself and outside, where the first inversion chamber and the second inversion chamber have mask attaching / detaching mechanisms 12Am, 12Bm, platen mechanisms 12Ap, 12Bp, floating mechanisms 12Ar0, 12Br0 and substrate attaching / detaching mechanisms 12Ap3, 12Bp3.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a vacuum deposition apparatus and a vacuum deposition method. [Background technology]

[0002] Glass substrates are becoming larger in the manufacture of flat panel displays (FPDs) and the like. A vertical film formation method is known in which a glass substrate is placed on a transport tray and then transported through multiple chambers in a substantially vertical position to form a film on the glass substrate. Outside the film forming apparatus, the substrate is transported horizontally with the film-forming surface facing upward, and then the transport tray and glass substrate are changed in position to stand upright in the film forming apparatus, which is in a vacuum atmosphere.

[0003] Furthermore, when organic electroluminescence (OEL) is used as a light-emitting device for FPDs, it is necessary to prevent the glass substrate from being exposed to the atmospheric environment from the time it is inserted until it is removed in order to ensure its light-emitting properties. Furthermore, when forming a light-emitting device in which an organic EL material common to each pixel is formed, the manufacturing process can be simplified by using a method in which the glass substrate and the deposition mask are erected as a single unit and the substrate passes through a deposition area facing a fixed evaporation source at a predetermined speed. This deposition method will be referred to as moving deposition hereinafter. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 7262293 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, productivity of moving deposition in the deposition process has improved, shortening the deposition time. However, the rate of the deposition process is limited by a series of operations, such as attaching and detaching the glass substrate to and from the carrier tray and deposition mask, and changing the orientation of the glass substrate between the vertical and horizontal positions. Therefore, it is required to improve the efficiency of FPD manufacturing by shortening the time required to load and unload the glass substrate onto and from the carrier tray and the deposition mask, and to change the orientation of the glass substrate between the vertical position and the horizontal position.

[0006] The present invention has been made in view of the above circumstances, and aims to achieve the following objects. 1. To shorten the processing time of the process of carrying the glass substrate into and out of the deposition device, which is the rate-limiting step for the moving speed of the glass substrate in the moving film-forming process. 2. To shorten the processing time required for attaching and detaching the deposition mask and carrier tray and for changing the orientation of the glass substrate while maintaining a vacuum atmosphere. 3. To improve production efficiency in FPD manufacturing. [Means for solving the problem]

[0007] (1) A vacuum deposition apparatus according to one aspect of the present invention, A vacuum deposition apparatus for vertically moving film formation in which a deposition mask is combined with a glass substrate supported on a transport tray and the substrate is transported in front of a deposition source in a vertically upright position, a deposition chamber in which a plurality of the deposition sources are arranged along a substantially linear transport rail that transports the transport tray, and the two parallel transport rails form an outgoing path and a returning path, and a film is formed on a film-forming surface of the glass substrate on the outgoing path and the returning path along which the transport tray is transported by a transport rail drive unit; a turnback chamber connected to one end of the deposition chamber and configured to rotate and transfer the transport tray about a vertical axis from the outgoing transport rail to the return transport rail; a rotary chamber connected to the other end of the deposition chamber opposite the turnback chamber, the rotary chamber having two parallel rotary conveyor rails and a rotary conveyor rail drive unit for feeding the conveyor tray onto the conveyor rail on the outward path and receiving the conveyor tray from the conveyor rail on the return path to rotate and transfer the conveyor tray around a vertical axis; a first reversing chamber connected to the rotary chamber, the first reversing chamber having a transport reversing rail and a transport reversing rail drive unit connectable to the rotary transport rail on an extension of the transport rail of the deposition chamber, and configured to tilt the transport tray to switch between a horizontal position and a vertical position; a second reversing chamber connected to the rotary chamber, the second reversing chamber having a transport reversing rail connectable to the rotary transport rail on a line intersecting the transport rail of the deposition chamber, and a transport reversing rail drive unit, for tilting the transport tray to switch between a horizontal position and a vertical position; a robot chamber having a transfer robot connected to the first reversing chamber and the second reversing chamber, which transfers the glass substrate in a horizontal position with the film-forming surface facing upward between the robot chamber and the outside; Equipped with The first inversion chamber and the second inversion chamber are a mask attaching / detaching mechanism and a mask attaching / detaching mechanism driving unit that attach and detach the deposition mask to and from the glass substrate; a platen mechanism and a platen mechanism drive unit that tilt the carrier tray and the glass substrate between a horizontal position and a vertical position; a floating mechanism and a floating mechanism drive unit that tilt the carrier tray and the glass substrate from the carrier reversal rail by the platen mechanism; a substrate loading / unloading mechanism and a substrate loading / unloading mechanism drive unit for loading / unloading the glass substrate in a horizontal position from / to the transport tray; having This solved the above problem. (2) The vacuum deposition apparatus of the present invention, in the above (1), the mask attaching / detaching mechanism causes the detached deposition mask to wait in the vicinity of the transport reversing rail. It is possible. (3) The vacuum deposition apparatus of the present invention, in the above (1), The first reversing chamber and the second reversing chamber alternately send the transport tray to the rotating chamber. It is possible. (4) The vacuum deposition apparatus of the present invention, in the above (1), The robot chamber is connected to other processing equipment while maintaining a sealed state. It is possible. (5) The vacuum deposition apparatus of the present invention, in the above (1), a buffer chamber is provided between the rotation chamber and the deposition chamber, the buffer chamber adjusting the interval between the transport trays to be sent to the moving deposition process in the deposition chamber; It is possible. (6) The vacuum deposition apparatus of the present invention, in the above (1), controlling the transport rail drive unit, the rotational transfer of the transport tray in the turnback chamber, the rotary transport rail drive unit, the transport reversal rail drive unit between the first reversal chamber and the second reversal chamber, the mask mounting / removing mechanism drive unit, the platen mechanism drive unit, the floating mechanism drive unit, the substrate mounting / removing mechanism drive unit, and the transport robot, A control unit is provided for performing deposition processing on the glass substrate at a predetermined distance in the deposition chamber. It is possible. (7) The vacuum deposition apparatus of the present invention, in the above (1), The first inversion chamber and the second inversion chamber are the mask attaching / detaching mechanism and the platen mechanism are disposed on both sides of the transport / reversal rail; It is possible. (8) The vacuum deposition apparatus of the present invention, in the above (1), The rotation chamber rotates less than one revolution around the vertical axis when rotating and transferring the transport tray. It is possible. (9) A vacuum deposition method according to another aspect of the present invention includes, in the vacuum deposition apparatus according to any one of (1) to (8) above, The glass substrate moves at a constant speed in the deposition chamber. The glass substrate in the deposition chamber is moved a minimum distance before and after the deposition chamber. It is possible. (10) A vacuum deposition method according to another aspect of the present invention includes, in the vacuum deposition apparatus according to any one of (1) to (8) above, The two rotary conveyor rails of the rotating chamber simultaneously carry out the glass substrate before deposition and the glass substrate after deposition into and out of the deposition chamber. It is possible. (11) Another aspect of the present invention is a vacuum deposition method according to the above (10), comprising: The glass substrate is transferred between the rotation chamber and the deposition chamber by: The operation of carrying the glass substrate from the robot chamber into the first inversion chamber or the operation of carrying the glass substrate from the robot chamber into the second inversion chamber is performed simultaneously. It is possible. (12) Another aspect of the present invention is a vacuum deposition method according to the above (11), comprising: The glass substrate is transported from the robot chamber to the first inversion chamber, and the upright movement from the horizontal position to the vertical position is performed by: The rotating conveying rail on which the glass substrate after deposition is placed is rotated in a direction to send the glass substrate to the second reversing chamber, The glass substrate is transported from the robot chamber to the second inversion chamber, and the upright movement from the horizontal position to the vertical position is performed by: The rotating conveying rail on which the glass substrate after deposition is placed is rotated in a direction to send the glass substrate to the first reversing chamber. It is possible. (13) Another aspect of the present invention is a vacuum deposition method according to the above (12), comprising: The operation of mounting the deposition mask on the glass substrate in the vertical position in the first reversing chamber is This is carried out simultaneously with the transport operation of the glass substrate after deposition from the rotation chamber to the second reversing chamber, The operation of mounting the deposition mask on the glass substrate in the vertical position in the second reversing chamber is This is carried out simultaneously with the transport operation of the glass substrate after deposition from the rotation chamber to the first reversing chamber. It is possible. (14) Another aspect of the present invention is a vacuum deposition method according to the above (13), comprising: The tilting operation of the glass substrate carried in from the rotation chamber from a vertical position to a horizontal position in the first reversing chamber is This is carried out simultaneously with the transport operation from the second reversing chamber to the rotation chamber, The tilting operation of the glass substrate carried in from the rotation chamber from a vertical position to a horizontal position in the second reversing chamber is performed by: This is performed simultaneously with the transport operation from the first reversing chamber to the rotation chamber. It is possible.

[0008] (1) A vacuum deposition apparatus according to one aspect of the present invention, A vacuum deposition apparatus for vertically moving film formation in which a deposition mask is combined with a glass substrate supported on a transport tray and the substrate is transported in front of a deposition source in a vertically upright position, a deposition chamber in which a plurality of the deposition sources are arranged along a substantially linear transport rail that transports the transport tray, and the two parallel transport rails form an outgoing path and a returning path, and a film is formed on a film-forming surface of the glass substrate on the outgoing path and the returning path along which the transport tray is transported by a transport rail drive unit; a turnback chamber connected to one end of the deposition chamber and configured to rotate and transfer the transport tray about a vertical axis from the outgoing transport rail to the return transport rail; a rotary chamber connected to the other end of the deposition chamber opposite the turnback chamber, the rotary chamber having two parallel rotary conveyor rails and a rotary conveyor rail drive unit for feeding the conveyor tray onto the conveyor rail on the outward path and receiving the conveyor tray from the conveyor rail on the return path to rotate and transfer the conveyor tray around a vertical axis; a first reversing chamber connected to the rotary chamber, the first reversing chamber having a transport reversing rail and a transport reversing rail drive unit connectable to the rotary transport rail on an extension of the transport rail of the deposition chamber, and configured to tilt the transport tray to switch between a horizontal position and a vertical position; a second reversing chamber connected to the rotary chamber, the second reversing chamber having a transport reversing rail connectable to the rotary transport rail on a line intersecting the transport rail of the deposition chamber, and a transport reversing rail drive unit, for tilting the transport tray to switch between a horizontal position and a vertical position; a robot chamber having a transfer robot connected to the first reversing chamber and the second reversing chamber, which transfers the glass substrate in a horizontal position with the film-forming surface facing upward between the robot chamber and the outside; Equipped with The first inversion chamber and the second inversion chamber are a mask attaching / detaching mechanism and a mask attaching / detaching mechanism driving unit that attach and detach the deposition mask to and from the glass substrate; a platen mechanism and a platen mechanism drive unit that tilt the carrier tray and the glass substrate between a horizontal position and a vertical position; a floating mechanism and a floating mechanism drive unit that tilt the carrier tray and the glass substrate from the carrier reversal rail by the platen mechanism; a substrate loading / unloading mechanism and a substrate loading / unloading mechanism drive unit for loading / unloading the glass substrate in a horizontal position from / to the transport tray; having This solved the above problem.

[0009] In the above configuration, the glass substrates can be transported into the vacuum deposition device one after another at a speed required for continuous film deposition (evaporation) processing on the multiple glass substrates moving along the transport rail in the deposition chamber, and the glass substrates after deposition processing can be transported out one after another at a required speed without delay, thereby shortening the time required to transport the glass substrates before and after deposition processing.

[0010] In the deposition chamber, the number of glass substrates processed per unit time, i.e., productivity, can be improved by increasing the glass substrate transport speed or the number of evaporation sources, since moving deposition is performed. Meanwhile, the transport of glass substrates between the outside of the apparatus and the deposition chamber via the rotation chamber, reversal chamber, and robot chamber before and after deposition processing inevitably involves changing the orientation of the glass substrate between horizontal and vertical positions and attaching and detaching the deposition mask. Therefore, by determining the order and timing of operations in the two reversal chambers, rotation chamber, and robot chamber, the time required to transport the glass substrate before and after deposition processing does not limit the rate at which glass substrates can be vapor-deposited per unit time.

[0011] In particular, the movement of the glass substrate in a direction intersecting the conveying direction on the conveying rail, called a traverse, is limited to vertical and horizontal posture changes, so that the time required to convey the glass substrate can be further reduced. This will contribute to further productivity improvements in the production of organic EL FPDs using vapor deposition.

[0012] (2) The vacuum deposition apparatus of the present invention, in the above (1), the mask attaching / detaching mechanism causes the detached deposition mask to wait in the vicinity of the transport reversing rail. It is possible.

[0013] In the above configuration, by waiting the deposition mask detached from the glass substrate near the transport reversal rail, the time required to detach the deposition mask can be shortened in preparation for changing the position of the transport tray and the glass substrate from a vertical position to a horizontal position using the platen mechanism.

[0014] In addition, in the above configuration, by attaching the deposition mask waiting near the transport reversal rail from the glass substrate, it is possible to shorten the time required to attach the deposition mask to the transport tray and glass substrate whose orientation has been changed from a horizontal position to a vertical position by the platen mechanism. Furthermore, it is possible to quickly perform the processing of the floating mechanism that is performed after the deposition mask is attached and detached.

[0015] (3) The vacuum deposition apparatus of the present invention, in the above (1), The first reversing chamber and the second reversing chamber alternately send the transport tray to the rotating chamber. It is possible.

[0016] In the above configuration, while a glass substrate is being sent from one of the two reversing chambers to the rotating chamber, the posture of the glass substrate is changed in the other reversing chamber, thereby shortening the time required to transport the glass substrate in the vacuum deposition apparatus.

[0017] (4) The vacuum deposition apparatus of the present invention, in the above (1), The robot chamber is connected to other processing equipment while maintaining a sealed state. It is possible.

[0018] In the above configuration, the two inversion chambers and the robot chamber can each be sealed and opened using a door valve or the like, and the robot chamber can be sealed and opened from the outside of the vacuum deposition apparatus using a door valve or the like, so that glass substrates can be transferred to and from other processing apparatuses connected to the outside of the vacuum deposition apparatus while maintaining a sealed state. This allows the deposition process and other processes to be performed sequentially while maintaining a controlled atmosphere such as a vacuum atmosphere, etc. Here, examples of other processes include plasma processes such as sputtering and etching, and CVD processes.

[0019] (5) The vacuum deposition apparatus of the present invention, in the above (1), a buffer chamber is provided between the rotation chamber and the deposition chamber, the buffer chamber adjusting the interval between the transport trays to be sent to the moving deposition process in the deposition chamber; It is possible.

[0020] In the above configuration, the moving speed of the glass substrate transported from the rotation chamber in the buffer chamber is matched to the moving speed of the glass substrate being moved in the deposition chamber to be formed on it. Furthermore, the moving speed of the glass substrate being transported to the rotation chamber in the buffer chamber is adjusted relative to the moving speed of the glass substrate being moved in the deposition chamber to be formed on it, so that it matches the moving speed of the glass substrate being transported from the rotation chamber. This makes it possible to simultaneously transport the glass substrate into and out of the deposition region of the deposition chamber. This allows all glass substrates moving in the deposition chamber to be deposited at a constant speed as much as possible, thereby making it possible to make the thickness of the organic material film formed on the glass substrates constant.

[0021] Furthermore, the distance between adjacent glass substrates can be reduced as much as possible when moving the glass substrates in the deposition chamber to form a film, thereby improving deposition efficiency and productivity. Furthermore, it is possible to easily set the number of glass substrates to be taken in and out of the vacuum deposition apparatus per unit time in accordance with the number of glass substrates to be moved and deposited in the deposition chamber per unit time. In the buffer chamber, the length of the transport rail in the section where the interval is adjusted is preferably at least twice the length of the transport tray in the transport direction.

[0022] (6) The vacuum deposition apparatus of the present invention, in the above (1), controlling the transport rail drive unit, the rotational transfer of the transport tray in the turnback chamber, the rotary transport rail drive unit, the transport reversal rail drive unit between the first reversal chamber and the second reversal chamber, the mask mounting / removing mechanism drive unit, the platen mechanism drive unit, the floating mechanism drive unit, the substrate mounting / removing mechanism drive unit, and the transport robot, A control unit is provided for performing deposition processing on the glass substrate at a predetermined distance in the deposition chamber. It is possible.

[0023] In the above configuration, the number of glass substrates that are moved and deposited in the deposition chamber per unit time can be set to the same number as the number of glass substrates that are taken in and out of the vacuum deposition apparatus per unit time. It is possible to improve production efficiency by adjusting the movement of the glass substrates throughout the entire vacuum deposition apparatus.

[0024] (7) The vacuum deposition apparatus of the present invention, in the above (1), The first inversion chamber and the second inversion chamber are the mask attaching / detaching mechanism and the platen mechanism are disposed on both sides of the transport / reversal rail; It is possible.

[0025] In the above configuration, the glass substrate, carrier tray, and deposition mask transported from the rotating chamber are stopped at a predetermined position on the transport reversal rail, and the deposition mask is removed by the mask attaching / detaching mechanism. Next, the floating mechanism performs a floating operation to move the glass substrate and carrier tray from the transport reversal rail to a state in which they can be tilted by the platen mechanism. Furthermore, the platen mechanism tilts the glass substrate and carrier tray from a vertical position to a horizontal position. Next, the substrate attaching / detaching mechanism removes the glass substrate from the carrier tray. The glass substrate is then sent to the robot chamber by the transport robot.

[0026] At this time, the direction in which the deposition mask is detached from the glass substrate and the direction in which the platen mechanism tilts the mask from the vertical position to the horizontal position relative to the transport tray are perpendicular to the transport direction of the glass substrate on the transport reversal rail. At the same time, the direction in which the deposition mask is detached from the glass substrate and the direction in which the platen mechanism tilts the mask from the vertical position to the horizontal position relative to the transport tray are opposite to each other.

[0027] Similarly, a glass substrate delivered from the robot chamber by a transfer robot is placed on a transfer tray supported by a horizontal platen mechanism together with the substrate loading / unloading mechanism. Furthermore, the platen mechanism lifts the glass substrate and transfer tray from a horizontal position to a vertical position. Next, a floating mechanism performs a floating operation (anti-floating operation) that changes the glass substrate and transfer tray from a tiltable state by the platen mechanism to a state where they can be transported by the transfer reversal rail. A deposition mask is attached to the vertically positioned glass substrate by the mask loading / unloading mechanism. The glass substrate, transfer tray, and deposition mask are transported to the rotation chamber by the transfer reversal rail. This makes it possible to efficiently perform the deposition mask removal operation, the carrier tray floating operation, and the carrier tray tilting operation consecutively while shortening the total time.

[0028] (8) The vacuum deposition apparatus of the present invention, in the above (1), The rotation chamber rotates less than one revolution around the vertical axis when rotating and transferring the transport tray. It is possible.

[0029] In the above configuration, the rotational movement in the rotation chamber is minimized to shorten the operation time and improve productivity. At the same time, the length of the cables and other components required for the rotating components is minimized to reduce component costs.

[0030] (9) A vacuum deposition method according to another aspect of the present invention includes, in the vacuum deposition apparatus according to any one of (1) to (8) above, The glass substrate moves at a constant speed in the deposition chamber. The glass substrate in the deposition chamber is moved a minimum distance before and after the deposition chamber. It is possible.

[0031] In the above-described configuration, by moving all glass substrates in the deposition chamber at a constant speed as much as possible, the thickness of the organic material film formed on the glass substrate can be made constant. Furthermore, by narrowing the gap between adjacent glass substrates in the front and rear as much as possible when moving the glass substrates in the deposition chamber and forming a film thereon, the deposition efficiency can be improved, and productivity can be improved. This makes it possible to easily set the number of glass substrates to be taken in and out of the vacuum deposition apparatus per unit time in accordance with the number of glass substrates to be moved and deposited in the deposition chamber per unit time.

[0032] (10) A vacuum deposition method according to another aspect of the present invention includes, in the vacuum deposition apparatus according to any one of (1) to (8) above, The two rotary conveyor rails of the rotating chamber simultaneously carry out the glass substrate before deposition and the glass substrate after deposition into and out of the deposition chamber. It is possible.

[0033] In the above configuration, the number of glass substrates processed in the deposition chamber can be kept constant by simultaneously carrying out the unloading and loading into the deposition chamber, which enables FPD manufacturing without reducing the efficiency of the deposition process by moving deposition in the deposition chamber.

[0034] Furthermore, by simultaneously transporting the glass substrate from the deposition chamber to the rotating chamber, it is possible to efficiently transport the glass substrate after processing out of the apparatus and transport the unprocessed glass substrate into the apparatus without reducing the efficiency of the deposition process by moving film formation in the deposition chamber.

[0035] (11) Another aspect of the present invention is a vacuum deposition method according to the above (10), comprising: The glass substrate is transferred between the rotation chamber and the deposition chamber by: The operation of carrying the glass substrate from the robot chamber into the first inversion chamber or the operation of carrying the glass substrate from the robot chamber into the second inversion chamber is performed simultaneously. It is possible.

[0036] In the above configuration, glass substrates are transported from the robot chamber to one of the two reversal chambers simultaneously with the transport of glass substrates from the rotation chamber to the deposition chamber, thereby enabling efficient transport of glass substrates from outside the apparatus and reducing the time required.

[0037] Furthermore, by transporting the glass substrate in and out of the rotation chamber to the deposition chamber, only the processed glass substrate remains in the rotation chamber, and the unprocessed glass substrate can be continuously transported from the reversal chamber to the rotation chamber. This enables efficient transport of glass substrates from outside the apparatus and efficient transport of glass substrates to and from the apparatus, thereby reducing processing time.

[0038] (12) Another aspect of the present invention is a vacuum deposition method according to the above (11), comprising: The glass substrate is transported from the robot chamber to the first inversion chamber, and the upright movement from the horizontal position to the vertical position is performed by: The rotating conveying rail on which the glass substrate after deposition is placed is rotated in a direction to send the glass substrate to the second reversing chamber, The glass substrate is transported from the robot chamber to the second inversion chamber, and the upright movement from the horizontal position to the vertical position is performed by: The rotating conveying rail on which the glass substrate after deposition is placed is rotated in a direction to send the glass substrate to the first reversing chamber. It is possible.

[0039] In the above configuration, a deposition mask needs to be attached to an unprocessed glass substrate that has been changed in position from a horizontal position to a vertical position in one of the reversing chambers. Therefore, by simultaneously performing a rotation operation to send the processed glass substrate in the rotation chamber to the other reversing chamber during this position change operation, it is possible to efficiently carry in and out the glass substrate from outside the apparatus, thereby reducing the time required.

[0040] (13) Another aspect of the present invention is a vacuum deposition method according to the above (12), comprising: The operation of mounting the deposition mask on the glass substrate in the vertical position in the first reversing chamber is This is carried out simultaneously with the transport operation of the glass substrate after deposition from the rotation chamber to the second reversing chamber, The operation of mounting the deposition mask on the glass substrate in the vertical position in the second reversing chamber is This is carried out simultaneously with the transport operation of the glass substrate after deposition from the rotation chamber to the first reversing chamber. It is possible.

[0041] In the above configuration, while a deposition mask is being attached to an unprocessed glass substrate in one reversing chamber, the processed glass substrate in the rotating chamber is discharged to the other reversing chamber, and by keeping the unprocessed glass substrate in the rotating chamber in the next process, it is possible to simultaneously carry the glass substrate in and out of the deposition chamber to the rotating chamber. This makes it possible to efficiently carry the glass substrate in and out of the apparatus, thereby reducing the time required.

[0042] (14) Another aspect of the present invention is a vacuum deposition method according to the above (13), comprising: The tilting operation of the glass substrate carried from the rotation chamber to the first reversing chamber from the vertical position to the horizontal position is performed by: This is carried out simultaneously with the transport operation from the second reversing chamber to the rotation chamber, The tilting operation of the glass substrate carried from the rotation chamber to the second reversing chamber from the vertical position to the horizontal position is performed by: This is performed simultaneously with the transport operation from the first reversing chamber to the rotation chamber. It is possible.

[0043] In the above configuration, after the orientation of the processed glass substrate in one reversing chamber is changed from vertical to horizontal, a new unprocessed glass substrate is carried in from outside the apparatus. Therefore, during this orientation change operation, the unprocessed glass substrate in the other reversing chamber is simultaneously sent to the rotation chamber, thereby preparing the other reversing chamber for the next processed substrate to be carried out. This makes it possible to efficiently carry in and out glass substrates from outside the apparatus, thereby reducing the time required.

[0044] The following is a brief summary of the loading and unloading operations for the glass substrate in the vacuum deposition apparatus of the present invention.

[0045] · Unprocessed glass substrates are carried in a horizontal position into the robot chamber from outside the equipment. Then, they are carried from the robot chamber into the first reversal chamber and attached to a transfer tray. In the first reversal chamber, the orientation of the unprocessed glass substrate and transfer tray is changed from horizontal to vertical. A deposition mask is attached to the unprocessed substrate in the first reversal chamber. The unprocessed glass substrate is carried out from the first reversal chamber to the rotation chamber. The unprocessed glass substrate is carried out from the rotation chamber to the deposition chamber.

[0046] - Processed glass substrates are transported from the deposition chamber to the rotation chamber. - Processed glass substrates are transported from the rotation chamber to the first reversal chamber. - The deposition mask is removed from the processed substrate in the first reversal chamber. - The position of the processed glass substrate and transfer tray is changed from vertical to horizontal in the first reversal chamber. - Processed glass substrates are removed from the transfer tray in the first reversal chamber. - Processed glass substrates are transported from the first reversal chamber to the robot chamber. - Processed glass substrates are transported from the robot chamber to the outside of the equipment in a horizontal position.

[0047] · Unprocessed glass substrates are carried in a horizontal position into the robot chamber from outside the equipment. Then, they are carried from the robot chamber into the second reversal chamber and attached to a transfer tray. In the second reversal chamber, the orientation of the unprocessed glass substrate and transfer tray is changed from horizontal to vertical. A deposition mask is attached to the unprocessed substrate in the second reversal chamber. The unprocessed glass substrate is carried out from the second reversal chamber to the rotation chamber. The unprocessed glass substrate is carried out from the rotation chamber to the deposition chamber.

[0048] - Processed glass substrates are transported from the deposition chamber to the rotation chamber. - Processed glass substrates are transported from the rotation chamber to the second inversion chamber. - The deposition mask is removed from the processed substrate in the second inversion chamber. - The position of the processed glass substrate and transfer tray is changed from vertical to horizontal in the second inversion chamber. - Processed glass substrates are removed from the transfer tray in the second inversion chamber. - Processed glass substrates are transported from the second inversion chamber to the robot chamber. - Processed glass substrates are transported from the robot chamber to the outside of the equipment in a horizontal position.

[0049] The timing of operations performed on glass substrates in the rotation chamber and two reversal chambers of the present invention will be briefly summarized below. Note that for each action, "performing simultaneously" means that there is an overlap in time between the start and end of the action, and does not necessarily mean that two actions start at the same time or that two actions end at the same time.

[0050] - Unprocessed glass substrates are transported from the robot chamber to the first reversal chamber and placed on the carrier tray. Processed glass substrates and unprocessed glass substrates are transported in and out of the evaporation chamber in the rotation chamber. The second reversal chamber is empty. - Standing up of unprocessed glass substrates in the first reversing chamber. Rotation in the rotating chamber to prepare for transporting processed glass substrates to the second reversing chamber. The second reversing chamber is empty.

[0051] Mounting a deposition mask on an unprocessed glass substrate in the first reversing chamber. Transporting processed glass substrates from the rotation chamber to the second reversing chamber. -Anti-floating operation of the transport reversal rail in preparation for removing the transport tray, unprocessed glass substrate, and deposition mask from the first reversal chamber. Rotation operation in the rotation chamber to prepare for loading from the first reversal chamber. Floating operation of the transport reversal rail in preparation for removing the deposition mask and tilting the transport tray and processed glass substrate from the second reversal chamber.

[0052] -Anti-floating operation of the transport reversal rail in preparation for removal of the transport tray, unprocessed glass substrate, and deposition mask in the first reversal chamber. Detachment of the deposition mask from the processed glass substrate in the second reversal chamber. -Transportation of unprocessed glass substrates from the first reversing chamber to the rotation chamber. -Tilting of processed glass substrates in the second reversing chamber.

[0053] The first reversal chamber is empty. The rotation chamber is not operating. After processing in the second reversal chamber, the glass substrate is removed from the carrier tray and transported to the robot chamber. The first reversal chamber is empty. In the rotation chamber, processed and unprocessed glass substrates are transported between the deposition chamber and the chamber. In the second reversal chamber, unprocessed glass substrates are transported from the robot chamber and placed on the carrier tray.

[0054] The first reversal chamber is empty. The rotating chamber rotates to prepare for the removal of processed glass substrates from the first reversal chamber. The unprocessed glass substrates are raised in the second reversal chamber. -Transportation of processed glass substrates from the rotation chamber to the first reversal chamber. Mounting of deposition masks on unprocessed glass substrates in the second reversal chamber.

[0055] Floating operation of the transport reversal rail in preparation for tilting the transport tray and processed glass substrate in the first reversal chamber. Rotation operation in the rotation chamber in preparation for loading from the second reversal chamber. Anti-floating operation of the transport reversal rail in preparation for unloading the transport tray, unprocessed glass substrate, and deposition mask together from the second reversal chamber. Deposition mask removal operation in the first reversal chamber. The rotation chamber does not operate. Anti-floating operation of the transport reversal rail in preparation for removal of the transport tray, unprocessed glass substrate, and deposition mask from the second reversal chamber.

[0056] -Tilting of processed glass substrates in the first reversing chamber. Transport of unprocessed glass substrates from the second reversing chamber to the rotation chamber. After processing in the first reversal chamber, the glass substrate is removed from the carrier tray and transported to the robot chamber. The rotation chamber rotates to prepare for entry and exit from the deposition chamber. The second reversal chamber is empty.

[0057] - Unprocessed glass substrates are carried in from the robot chamber and placed on the carrier tray in the first reversal chamber. Processed and unprocessed glass substrates are transported in and out of the evaporation chamber in the rotation chamber. The second reversal chamber is empty (returned to normal). [Effects of the Invention]

[0058] According to the present invention, it is possible to achieve the effect of enabling continuous operation of FPD manufacturing by continuously transferring in and out of the deposition process and pre- and post-processes from the film formation section of the deposition chamber including the rotation chamber and the robot chamber without being limited by the operating time of one reversal chamber. [Brief explanation of the drawings]

[0059] [Figure 1]1 is a schematic top view showing a first embodiment of a vacuum deposition apparatus according to the present invention. [Figure 2] 1 is a schematic perspective view showing a mask attaching / detaching mechanism, a platen mechanism, and a floating mechanism in a first embodiment of a vacuum deposition apparatus according to the present invention. [Figure 3] 1 is a schematic perspective view showing a mask attaching / detaching mechanism, a platen mechanism, and a floating mechanism in a first embodiment of a vacuum deposition apparatus according to the present invention. [Figure 4] 1 is a schematic perspective view showing a mask attaching / detaching mechanism, a platen mechanism, and a floating mechanism in a first embodiment of a vacuum deposition apparatus according to the present invention. [Figure 5] FIG. 2 is a diagram showing the operation and timing of a vacuum vapor deposition method in the first embodiment of the vacuum vapor deposition device according to the present invention. [Figure 6] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 7] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 8] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 9] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 10] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 11] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 12] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 13] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 14] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 15]1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 16] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 17] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 18] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 19] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 20] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 21] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 22] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 23] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 24] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 25] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 26] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 27] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 28] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 29] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 30] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 31] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. [Figure 32] 1 is a perspective view showing the operation of a vacuum evaporation apparatus in a first embodiment of a vacuum evaporation method according to the present invention. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0060] A first embodiment of a vacuum deposition apparatus and a vacuum deposition method according to the present invention will be described below with reference to the drawings. 1 is a schematic top view showing a vacuum deposition apparatus according to the present embodiment, in which reference numeral 10 denotes the vacuum deposition apparatus. Hereinafter, two directions that are orthogonal to each other in the horizontal direction will be referred to as the first direction (X direction) and the second direction (Y direction). The position where the processing surface (film formation surface) of the glass substrate G faces the X direction or the Y direction will be referred to as the first position, for example, the longitudinal position or vertical position. The position where the processing surface of the glass substrate G faces the vertical direction (Z direction) formed by the intersection of the X direction and the Y direction will be referred to as the second position, for example, the horizontal position or lateral position.

[0061] As shown in FIG. 1, the vacuum deposition apparatus 10 according to this embodiment includes a robot chamber 11, a first reversing chamber 12A, a second reversing chamber 12B, a rotation chamber 13, a buffer chamber 14, a deposition chamber 15, a buffer chamber 16, a turnback chamber 17, and a control unit 18.

[0062] The vacuum deposition apparatus 10 can maintain a vacuum atmosphere inside and can be sealed. The vacuum deposition device 10 sequentially transports a plurality of glass substrates G according to a timing to be described later, and performs a deposition process (film formation process) on the glass substrates G while moving the glass substrates G in a vertical position in the X direction in a deposition chamber 15. Vapor deposition chamber 15 has a transport rail 15r extending in the X direction. Transport rail 15r has an outgoing transport rail (transport rail) 15r1 and a returning transport rail (transport rail) 15r2 that are parallel to each other. Outgoing transport rail 15r1 and returning transport rail 15r2 are spaced apart in the Y direction.

[0063] The glass substrate G is loaded onto a transport tray T and is handled as a substrate transport tray TG whose posture can be changed as a whole. The substrate transport tray TG is loaded with a deposition mask M and is handled as a substrate mask transport tray TGM which can be transported as a whole. The substrate mask transport tray TGM before the deposition process is handled as an unprocessed substrate mask transport tray TGMb. The substrate mask transport tray TGM after the deposition process is handled as a processed substrate mask transport tray TGMa. Hereinafter, the names of the glass substrate G, the carrier tray T, and the deposition mask M will be changed as appropriate depending on the state in which they are handled.

[0064] The robot chamber 11 is connected to an external pre- or post-processing device BA10. The robot chamber 11 and the pre- or post-processing device BA10 can exchange glass substrates G while maintaining a sealed, predetermined atmosphere. The sealed, predetermined atmosphere means a vacuum, reduced pressure atmosphere, an inert gas atmosphere, or another predetermined atmosphere. The space between the robot chamber 11 and the pre- or post-processing device BA10 can be switched between open and sealed states by an opening / closing mechanism such as a door valve. The pre- and post-processing equipment BA10 performs pre- and post-processing of the vapor deposition process, such as sputtering of the glass substrate G, plasma processing such as etching, and CVD processing.

[0065] The robot chamber 11 is connected to a first reversing chamber 12A and a second reversing chamber 12B. The space between the robot chamber 11 and the first reversing chamber 12A can be switched between open and closed by a door valve or the like. The space between the robot chamber 11 and the second reversing chamber 12B can be switched between open and closed by a door valve or the like. The robot chamber 11 and the first reversing chamber 12A are sealed so that a glass substrate G can be transported between them. The robot chamber 11 and the second reversing chamber 12B are sealed so that a glass substrate G can be transported between them.

[0066] The robot chamber 11 includes a transfer robot 11h and a gas atmosphere setting mechanism 11g. The transfer robot 11h transfers the glass substrate G in a horizontal position between the robot chamber 11 and the first reversing chamber 12A and the second reversing chamber 12B. The transfer robot 11h is driven by a transfer robot drive unit 11h0. The transfer robot 11h transfers the glass substrate G with the surface to be processed facing upward in the Z direction. The transfer robot 11h transfers the glass substrate G in a horizontal position by contacting the surface opposite to the surface to be processed. The transfer robot 11h is extendable from the robot chamber 11 to the inside of the first reversing chamber 12A or the second reversing chamber 12B.

[0067] The gas atmosphere setting mechanism 11g sets a predetermined state of the atmosphere inside the robot chamber 11. The gas atmosphere setting mechanism 11g may include a pump as a pressure reducing mechanism, a gas supply mechanism for supplying a predetermined gas such as an inert gas, and the like.

[0068] The first reversing chamber 12A is disposed adjacent to the robot chamber 11 in the Y direction. The second reversing chamber 12B is disposed adjacent to the robot chamber 11 in the X direction. The first reversing chamber 12A has a transport reversing rail 12Ar. The transport reversing rail 12Ar is linear and extends in the X direction. The transport reversing rail 12Ar is arranged on the same straight line as an extension of the outgoing transport rail 15r1 of the deposition chamber 15. Second reversing chamber 12B has a transport reversing rail 12Br. Transport reversing rail 12Br is linear and extends in the Y direction. Transport reversing rail 12Br is arranged on a straight line that intersects with outgoing transport rail 15r1 of deposition chamber 15 at an angle of 90°.

[0069] Fig. 2 is a schematic perspective view showing the configuration of a first reversing chamber of a vacuum deposition apparatus according to this embodiment. Fig. 3 is a schematic perspective view showing the configuration of a first reversing chamber of a vacuum deposition apparatus according to this embodiment. Fig. 4 is a schematic perspective view showing the configuration of a first reversing chamber of a vacuum deposition apparatus according to this embodiment. The first reversing chamber 12A and the second reversing chamber 12B have substantially the same internal configuration, except that their orientations differ by 90°. Therefore, the reference numeral 12A in the first reversing chamber 12A below will be read as the reference numeral 12B, and a description of the second reversing chamber 12B will be omitted.

[0070] The first reversing chamber 12A has a transport reversing rail 12Ar, a mask attaching / detaching mechanism 12Am, a platen mechanism 12Ap, floating mechanisms 12Aru0 and 12Ard0, a substrate attaching / detaching mechanism 12Ap3, and a gas atmosphere setting mechanism 12Ag.

[0071] The transport reversing rail 12Ar is driven by a transport reversing rail drive unit 12Ar0, and is capable of transporting the glass substrate G and the transport tray T in the X direction. The transport reversing rail 12Ar is disposed inside the first reversing chamber 12A at a position spaced apart from the robot chamber 11 in the Y direction.

[0072] As shown in FIGS. 2 to 4, the conveyor reversing rail 12Ar has an upper conveyor reversing rail 12Aru and a lower conveyor reversing rail 12Ard. The upper conveyor reversing rail 12Aru and the lower conveyor reversing rail 12Ard are arranged spaced apart in the Z direction. The upper conveyor reversing rail 12Aru and the lower conveyor reversing rail 12Ard both extend in the Y direction. The upper conveyor reversing rail 12Aru and the lower conveyor reversing rail 12Ard are parallel to each other.

[0073] The upper transport reversing rail 12Aru and the lower transport reversing rail 12Ard form a pair and respectively support the upper and lower ends of the transport tray T. The upper transport reversing rail 12Aru and the lower transport reversing rail 12Ard are disposed at approximately the same position when viewed in the Z direction. When the glass substrate G is supported and transported at a slight incline, the upper transport reversing rail 12Aru and the lower transport reversing rail 12Ard are positioned slightly offset in the Y direction when viewed in the Z direction so that the surface to be processed faces upward. In this case, the upper transport reversing rail 12Aru is closer to the robot chamber 11 than the lower transport reversing rail 12Ard when viewed in the Z direction.

[0074] The upper conveying reversing rail 12Aru is driven by the upper conveying reversing rail drive unit 12Aru0, and the conveying tray T can be moved by the platen mechanism 12Ap to a state in which it can be tilted and raised. In this case, the upper conveying reversing rail 12Aru is separated in the Z direction from the lower conveying reversing rail 12Ard. The upper conveying reversing rail drive unit 12Aru0 constitutes a floating mechanism drive unit. The upper conveying reversing rail 12Aru constitutes a floating mechanism.

[0075] The lower transport reversing rail 12Ard can transport the transport tray T in the X direction by the lower transport reversing rail drive unit 12Ard0. The lower transport reversing rail 12Ard can also move the transport tray T to a state where it can be tilted and stood up by the platen mechanism 12Ap by the lower transport reversing rail drive unit 12Ard0. The lower transport reversing rail 12Ard constitutes a floating mechanism. The lower transport reversing rail drive unit 12Ard0 constitutes a floating mechanism drive unit. The upper transport reversing rail drive unit 12Aru0 and the lower transport reversing rail drive unit 12Ard0 constitute a transport reversing rail drive unit 12Ar0.

[0076] The floating mechanism is driven by a floating mechanism drive unit, and tilts the transport tray T and the glass substrate G from the transport reversing rail 12Ar by the platen mechanism 12Ap. The transport reversing rail 12Ar constitutes the floating mechanism. The transport reversing rail drive unit 12Ar0 constitutes the floating mechanism drive unit.

[0077] The transport reversing rail 12Ar is adjacent to the platen mechanism 12Ap. The platen mechanism 12Ap is disposed inside the first reversing chamber 12A closer to the robot chamber 11 in the Y direction than the transport reversing rail 12Ar. The platen mechanism 12Ap is adjacent to the transport reversing rail 12Ar in the Y direction. The platen mechanism 12Ap includes a platen portion 12Ap1, a platen shaft 12Ap2, a platen support pin portion 12Ap3, and a platen mechanism drive portion 12Ap0.

[0078] The platen mechanism 12Ap is driven by a platen mechanism drive unit 12Ap0 to tilt and stand the transport tray T and the glass substrate G between a horizontal position and a vertical position. When the transport tray T supported by the platen mechanism 12Ap is in a vertical position, this is referred to as the platen mechanism 12Ap being in a vertical position. When the transport tray T supported by the platen mechanism 12Ap is in a horizontal position, this is referred to as the platen mechanism 12Ap being in a horizontal position.

[0079] The platen portion 12Ap1 supports the transport tray T and the glass substrate G placed thereon. The platen portion 12Ap1 tilts and stands between a horizontal position and a vertical position by a platen shaft 12Ap2 having a rotation axis along the X direction. When in the horizontal position, the platen portion 12Ap1 supports the transport tray T and the glass substrate G in the horizontal position (see FIG. 4). When in the vertical position, the platen portion 12Ap1 supports the transport tray T and the glass substrate G in the vertical position (see FIG. 2). The rotation of the platen portion 12Ap1 around the platen shaft 12Ap2 changes the orientation of the transport tray T and the glass substrate G between the horizontal position and the vertical position.

[0080] When the platen unit 12Ap1 is in the horizontal position (see FIG. 4), the platen shaft 12Ap2 is located farther away from the robot chamber 11 in the Y direction than the platen unit 12Ap1. When the platen unit 12Ap1 is in the vertical position (see FIGS. 2 and 3), the platen unit 12Ap1 is located at a position where the glass substrate G and the transport tray T can be placed on the lower transport reversing rail 12Ard. When the platen unit 12Ap1 is in the vertical position, the platen unit 12Ap1 is closer to the lower transport reversing rail 12Ard than when it is in the horizontal position.

[0081] The platen portion 12Ap1 includes a platen support pin portion 12Ap3. The platen support pin portion 12Ap3 supports the glass substrate G so that it can be transported by the transport robot 11h when the platen portion 12Ap1 is in the horizontal position and has the transport tray T placed thereon. The platen support pin portion 12Ap3 lifts the glass substrate G from the transport tray T in the Z direction to position the transport tray T and the glass substrate G apart from each other. This allows the transport robot 11h to enter between the transport tray T and the glass substrate G.

[0082] The platen support pin portion 12Ap3 also receives and supports the glass substrate G transported from the robot chamber 11 by the transport robot 11h. The platen support pin portion 12Ap3 also places the glass substrate G on the transport tray T. The platen support pin portion 12Ap3 constitutes a substrate mounting / removal mechanism. The transport robot 11h constitutes the substrate mounting / removal mechanism. The platen support pin portion 12Ap3 is driven by a substrate mounting / removal mechanism drive portion.

[0083] The mask attaching / detaching mechanism 12Am is driven by a mask attaching / detaching mechanism driving unit 12Am0 to attach / detach the deposition mask M to / from the glass substrate G. At this time, the deposition mask M is attached / detached to / from the transport tray T and the glass substrate G, which are in a vertical position. The transport tray T and the glass substrate G are placed on the lower transport reversing rail 12Ard. The mask attaching / detaching mechanism 12Am can attach and detach the deposition mask M so as not to come into contact with the glass substrate G.

[0084] The mask attaching / detaching mechanism 12Am detaches the deposition mask M from the transport tray T and the glass substrate G in the Y direction (see FIG. 3). The mask attaching / detaching mechanism 12Am holds the deposition mask M detached from the glass substrate G in a state where it is spaced apart from the transport tray T in the Y direction. The mask attaching / detaching mechanism 12Am keeps the deposition mask M on standby in a vertical position. The mask attaching / detaching mechanism 12Am approaches the deposition mask M held at a position spaced apart in the Y direction to the glass substrate G in the Y direction and attaches it (see FIG. 2). After attaching the deposition mask M to the glass substrate G, the mask attaching / detaching mechanism 12Am moves in the Y direction from the lower transport reversing rail 12Ard and the transport tray T and waits in a state spaced apart from the lower transport reversing rail 12Ard and the transport tray T.

[0085] The gas atmosphere setting mechanism 12Ag (see FIG. 1) has the same configuration as the gas atmosphere setting mechanism 11g. The gas atmosphere setting mechanism 12Ag sets the atmosphere inside the first reversing chamber 12A to a predetermined state. The gas atmosphere setting mechanism 12Ag may include a pump as a pressure reducing mechanism, a gas supply mechanism for supplying a predetermined gas such as an inert gas, and the like.

[0086] As shown in FIG. 1 , the rotation chamber 13 is connected to the first reversing chamber 12A, the second reversing chamber 12B, and the buffer chamber 14. The first reversing chamber 12A and the buffer chamber 14 are connected to both sides of the rotation chamber 13 in the X direction. The second reversing chamber 12B is connected to the rotation chamber 13 in the Y direction. The rotation chamber 13 and the first reversing chamber 12A are sealed so that a vacuum atmosphere or the like can be maintained and the glass substrate G can be transported. The rotation chamber 13 and the second reversing chamber 12B are sealed so that a vacuum atmosphere or the like can be maintained and the glass substrate G can be transported. The rotation chamber 13 and the buffer chamber 14 are sealed so that a vacuum atmosphere or the like can be maintained and the glass substrate G can be transported.

[0087] The rotary chamber 13 has two rotary conveyor rails 13r1 and 13r2, a rotary conveyor rail drive unit 13r0, and a gas atmosphere setting mechanism 13g.

[0088] The rotating conveyor rails 13r1 and 13r2 are arranged parallel to and spaced apart from each other. The rotating conveyor rails 13r1 and 13r2 can rotate around the Z axis while maintaining their parallel orientation. The rotation centers of the two rotating conveyor rails 13r1 and 13r2 are located at the center of their respective lengths and at the center of their respective widths. The rotating conveyor rails 13r1 and 13r2 are rotated by the rotating conveyor rail drive unit 13r0. The rotary conveyor rails 13r1 and 13r2 are driven by a rotary conveyor rail drive unit 13r0 to carry the conveyance tray T in and out.

[0089] Like the transport reversing rail 12Ar, both the rotary transport rail 13r1 and the rotary transport rail 13r2 have upper and lower rails corresponding to the upper transport reversing rail 12Aru and the lower transport reversing rail 12Ard. Unlike the transport reversing rail 12Ar, the rotary transport rail 13r1 and the rotary transport rail 13r2 do not need to float the transport tray T. Therefore, the upper rails of the rotary transport rail 13r1 and the rotary transport rail 13r2 do not need to move up and down.

[0090] When the rotating conveying rails 13r1 and 13r2 are in a rotational position along the X direction, the separation distance in the Y direction between the rotating conveying rails 13r1 and 13r2 is the same as the separation distance in the Y direction between the outbound conveying rails 15r1 and the inbound conveying rails 15r2.

[0091] When rotary conveyor rail 13r1 and rotary conveyor rail 13r2 are in a rotational position along the X direction, outgoing conveyor rail 15r1 and rotary conveyor rail 13r1 of deposition chamber 15 are both on the same straight line. A conveyance tray T can be conveyed between outgoing conveyor rail 15r1 and rotary conveyor rail 13r1. In this case, rotary conveyor rail 13r2 is on the same straight line as incoming conveyor rail 15r2. A conveyance tray T can be conveyed between rotary conveyor rail 13r2 and incoming conveyor rail 15r2.

[0092] Alternatively, when rotary conveyor rail 13r1 and rotary conveyor rail 13r2 are in a rotated position along the X direction, return conveyor rail 15r2 and rotary conveyor rail 13r1 of deposition chamber 15 are both on the same straight line. A conveyance tray T can be conveyed between return conveyor rail 15r2 and rotary conveyor rail 13r1. In this case, rotary conveyor rail 13r2 is on the same straight line as outward conveyor rail 15r1. A conveyance tray T can be conveyed between rotary conveyor rail 13r2 and outward conveyor rail 15r1.

[0093] When the rotary conveying rail 13r1 and the rotary conveying rail 13r2 are in a rotational position along the Y direction, the conveying reversal rail 12Br of the second reversing chamber 12B and either the rotary conveying rail 13r1 or the rotary conveying rail 13r2 are all on the same straight line. When the transport reversing rail 12Br and the rotary transport rail 13r1 are on the same straight line, the transport tray T can be transported between the transport reversing rail 12Br and the rotary transport rail 13r1. In this case, the rotary transport rail 13r2 is separated from the transport reversing rail 12Br. The transport tray T cannot be transported between the transport reversing rail 12Br and the rotary transport rail 13r2.

[0094] When the transport reversing rail 12Br and the rotary transport rail 13r2 are on the same straight line, the transport tray T can be transported between the transport reversing rail 12Br and the rotary transport rail 13r2. In this case, the rotary transport rail 13r1 is separated from the transport reversing rail 12Br. The transport tray T cannot be transported between the transport reversing rail 12Br and the rotary transport rail 13r1.

[0095] The rotating chamber 13 sends the transport tray T from either the rotary transport rail 13r1 or the rotary transport rail 13r2 to the outbound transport rail 15r1. The rotating chamber 13 also receives the transport tray T from the return transport rail 15r2 onto either the rotary transport rail 13r1 or the rotary transport rail 13r2. The rotating chamber 13 rotates and transfers the transport tray T around the Z axis. The transfer of the transfer trays T in the rotary chamber 13 may be performed simultaneously using the two rotary transfer rails 13r1 and 13r2, or may be performed using only one of the rotary transfer rails 13r1 and 13r2.

[0096] When rotating and transferring the transport tray T in the rotating chamber 13, the rotation direction of the rotating transport rails 13r1 and 13r2 may be either clockwise or counterclockwise and can be selected appropriately. Furthermore, during steady-state operation of the rotating chamber 13, when rotating and transferring the transport tray T, the rotating transport rails 13r1 and 13r2 do not rotate more than 360° in the same direction in one operation. In other words, when rotating and transferring the transport tray T, the rotating chamber 13 performs an operation less than one rotation around the vertical axis. Note that the rotating chamber 13 is configured to be able to rotate more than 360°.

[0097] In addition, angle detection sensors for detecting the rotation direction of rotary conveyor rails 13r1 and 13r2 are provided on upper rotary conveyor rails 13r1u and 13r2u in rotary chamber 13. The angle detection sensors are connected to control unit 18. Continuous steady-state operation of 360° or more as the operation of rotary chamber 13 is not preferable because it takes time for the rotation operation and an unnecessary length of cable is required to supply electricity to the rotating part.

[0098] The gas atmosphere setting mechanism 13g has the same configuration as the gas atmosphere setting mechanism 11g. The gas atmosphere setting mechanism 13g sets a predetermined state of the atmosphere inside the rotation chamber 13. The gas atmosphere setting mechanism 13g may include a pump as a pressure reducing mechanism, a gas supply mechanism for supplying a predetermined gas such as an inert gas, and the like.

[0099] The buffer chamber 14 is located between the rotation chamber 13 and the deposition chamber 15. The buffer chamber 14 is connected to the rotation chamber 13 and the deposition chamber 15. The buffer chamber 14 is connected to the rotation chamber 13 and the deposition chamber 15 on both sides in the X direction. The buffer chamber 14 is connected to the end of the deposition chamber 15 in the X direction.

[0100] The buffer chamber 14 has two conveying rails, 14r1 and 14r2. Both conveying rails 14r1 and 14r2 extend in the X direction. The conveying rails 14r1 and 14r2 are arranged parallel to and spaced apart from each other. The distance between the conveying rails 14r1 and 14r2 in the Y direction is the same as the distance between the outgoing conveying rail 15r1 and the returning conveying rail 15r2 in the Y direction.

[0101] The transport rail 14r1 is connected to the outgoing transport rail 15r1. The transport rail 14r1 is driven together with the outgoing transport rail 15r1 by the transport rail drive unit 15r0. The transport rail 14r1 transports the transport trays T in a vertical position from the turn chamber 13 to the outgoing transport rail 15r1. When transporting the transport trays T from the turn chamber 13, the transport rail 14r1 adjusts the interval between the transport trays T sent to the outgoing transport rail 15r1 to a predetermined value.

[0102] Here, the spacing between the transport trays T includes making the separation distance between the front and rear transport trays T the same value, and making the transport speed of the transport trays T sent to the outgoing transport rail 15r1 the same value. Furthermore, the spacing between the transport trays T includes changing the movement speed of the transport tray T being transported from the turn chamber 13 to the outgoing transport rail 15r1 to make it the same as the transport speed of the transport tray T sent to the return transport rail 15r2. At this time, the transport timing of the two transport trays T entering and leaving the turn chamber 13 is adjusted so that they can rotate simultaneously in the turn chamber 13. Therefore, it is preferable that the length of the transport rail 14r1 in the X direction is greater than approximately twice the length of the transport tray T in the transport direction.

[0103] The transport rail 14r2 is connected to the return transport rail 15r2. The transport rail 14r2 is driven together with the return transport rail 15r2 by the transport rail drive unit 15r0. The transport rail 14r2 transports the transport trays T in a vertical position from the return transport rail 15r2 to the turn chamber 13. When transporting the transport trays T from the return transport rail 15r2, the transport rail 14r2 adjusts the interval between the transport trays T sent to the turn chamber 13 to a predetermined value. Here, the interval between the transport trays T includes changing the movement speed of the transport trays T transported from the return transport rail 15r2 to be the same as the transport speed of the transport trays T sent from the turn chamber 13 to the outgoing transport rail 15r1. Therefore, it is preferable that the length of the transport rail 14r2 in the X direction is greater than approximately twice the length of the transport tray T in the transport direction.

[0104] Like the transport reversing rail 12Ar, both the transport rails 14r1 and 14r2 have upper and lower rails corresponding to the upper transport reversing rail 12Aru and the lower transport reversing rail 12Ard. Unlike the transport reversing rail 12Ar, the transport rails 14r1 and 14r2 do not need to float the transport tray T. Therefore, the upper rails of the transport rails 14r1 and 14r2 do not need to move up and down.

[0105] The deposition chamber 15 is located between the buffer chamber 14 and the buffer chamber 16. The deposition chamber 15 is connected to the buffer chamber 14 and the buffer chamber 16. The deposition chamber 15 is connected to the buffer chamber 14 and the buffer chamber 16 on both sides in the X direction. The deposition chamber 15 performs a deposition process (film formation process) on the glass substrate G while moving the glass substrate G in a vertical position in the X direction. The deposition chamber 15 includes an outgoing transport rail 15r1, a return transport rail 15r2, a transport rail drive unit 15r0, a plurality of deposition sources 15v, and a gas atmosphere setting mechanism 15g.

[0106] The outgoing transport rail 15r1 and the return transport rail 15r2 extend in the X direction. The outgoing transport rail 15r1 and the return transport rail 15r2 are parallel to each other. The outgoing transport rail 15r1 and the return transport rail 15r2 are spaced apart in the Y direction. The distance between the outgoing transport rail 15r1 and the return transport rail 15r2 in the Y direction is the same as the distance between the rotating transport rail 13r1 and the rotating transport rail 13r2 in the Y direction when the rotating transport rail 13r1 and the rotating transport rail 13r2 are in a rotational position along the X direction. The outgoing transport rails 15r1 and the returning transport rails 15r2 are driven by a transport rail drive unit 15r0 to transport the transport trays T. The outgoing transport rails 15r1 and the returning transport rails 15r2 transport the transport trays T in opposite directions in the X direction.

[0107] Like the transport reversing rail 12Ar, both the outgoing transport rail 15r1 and the return transport rail 15r2 have upper and lower rails corresponding to the upper transport reversing rail 12Aru and the lower transport reversing rail 12Ard. Unlike the transport reversing rail 12Ar, the outgoing transport rail 15r1 and the return transport rail 15r2 do not need to float the transport tray T. Therefore, the upper rails of the outgoing transport rail 15r1 and the return transport rail 15r2 do not need to move up and down.

[0108] A plurality of vapor deposition sources 15v are arranged on the outgoing transport rail 15r1 on the opposite side of the incoming transport rail 15r2 in the Y direction. The multiple evaporation sources 15v are aligned in the X direction along the outgoing transport rail 15r1. The evaporation sources 15v form films by evaporation on the glass substrate G moving on the outgoing transport rail 15r1. All of the multiple evaporation sources 15v are located close to the outgoing transport rail 15r1 in the Y direction. The multiple evaporation sources 15v have slits extending in the Z direction at positions facing the outgoing transport rail 15r1, and spray evaporation material.

[0109] A plurality of vapor deposition sources 15v are arranged on the return transport rail 15r2 on the opposite side of the return transport rail 15r2 from the forward transport rail 15r1 in the Y direction. The multiple evaporation sources 15v are aligned in the X direction along the return transport rail 15r2. The evaporation sources 15v form films by evaporation on the glass substrate G moving on the return transport rail 15r2. All of the multiple evaporation sources 15v are located close to the return transport rail 15r2 in the Y direction. Each of the multiple evaporation sources 15v has a slit extending in the Z direction at a position facing the return transport rail 15r2, and ejects an evaporation material.

[0110] The gas atmosphere setting mechanism 15g has the same configuration as the gas atmosphere setting mechanism 11g. The gas atmosphere setting mechanism 15g sets the internal atmosphere of the deposition chamber 15, the buffer chamber 14, and the buffer chamber 16 to a predetermined state. The gas atmosphere setting mechanism 15g may include a pump as a pressure reducing mechanism, a gas supply mechanism for supplying a predetermined gas such as an inert gas, and the like.

[0111] The buffer chamber 16 is connected to the deposition chamber 15 and the turnback chamber 17. The buffer chamber 16 is located between the deposition chamber 15 and the turnback chamber 17. The buffer chamber 16 is connected to the deposition chamber 15 and the turnback chamber 17 on both sides in the X direction. The buffer chamber 16 is connected to the end of the deposition chamber 15 opposite to the buffer chamber 14 in the X direction. The buffer chamber 16 has two conveying rails, 16r1 and 16r2. The buffer chamber 16 has the same configuration as the buffer chamber 14, and therefore a description thereof will be omitted.

[0112] The turnback chamber 17 is connected to the buffer chamber 16. The turnback chamber 17 is adjacent to the buffer chamber 16 in the X direction. The turnback chamber 17 is connected to the buffer chamber 16 on the opposite side to the deposition chamber 15 in the X direction. The turnback chamber 17 turns back the transport tray T transported from the outgoing transport rail 15r1 of the deposition chamber 15 onto the incoming transport rail 15r2 and transports it.

[0113] The turnback chamber 17 has two turnback rails 17r1 and 17r2, a turnback rail drive unit 17r0, and a gas atmosphere setting mechanism 17g. The turnback rails 17r1 and 17r2 correspond to the rotary conveyor rails 13r1 and 13r2. The turnback rail drive unit 17r0 corresponds to the rotary conveyor rail drive unit 13r0. The gas atmosphere setting mechanism 17g corresponds to the gas atmosphere setting mechanism 13g. The turnback chamber 17 has a similar configuration to the rotating chamber 13, so a description thereof will be omitted. In the turnback chamber 17, as in the rotating chamber 13, the transport tray T can be rotated and transported.

[0114] The control unit 18 is connected to the opening / closing mechanism of the robot chamber 11, the transport robot drive unit 11h0, the gas atmosphere setting mechanism 11g, the transport reversal rail drive unit 12Ar0, the mask mounting / detaching mechanism drive unit 12Am0, the platen mechanism drive unit 12Ap0, the floating mechanism drive unit, the substrate mounting / detaching mechanism drive unit, the gas atmosphere setting mechanism 12Ag, the rotary transport rail drive unit 13r0, the gas atmosphere setting mechanism 13g, the transport rail drive unit 15r0, the evaporation source 15v, the gas atmosphere setting mechanism 15g, the turnback rail drive unit 17r0, and the gas atmosphere setting mechanism 17g. The control unit 18 controls each of the connected drive units.

[0115] The vacuum deposition method in the vacuum deposition apparatus 10 of the present invention will be described below.

[0116] Fig. 5 is a diagram showing the operation and timing of the vacuum deposition method in this embodiment. Figs. 6 to 32 are perspective views showing the operation of a vacuum deposition apparatus in a first embodiment of the vacuum deposition method in this embodiment. 5, the broken line indicates the movement of the glass substrate G in the vertical direction, and the horizontal direction roughly indicates the passage of time. In Fig. 5, the movement operation shown in the vertical direction is mainly shown, and the operation timings shown at timings T000 to T026 mainly indicate the simultaneity between operations.

[0117] As shown in FIG. 5, the loading and unloading operations associated with the deposition process on a glass substrate G in the vacuum deposition apparatus 10 of this embodiment involve loading an unprocessed glass substrate G in a horizontal position from outside the apparatus, changing its orientation to a vertical position, moving it in the vertical position in the deposition chamber 15 to form a film, and then changing the orientation of the processed glass substrate G to a horizontal position and unloading it from the apparatus. At this time, the positions of the plurality of glass substrates G are changed alternately between the first reversing chamber 12A and the second reversing chamber 12B.

[0118] First, the processing flow for one glass substrate G will be described. The glass substrate G, which has undergone pre-processing, is carried into the robot chamber 11 from the pre- or post-processing device BA10. At this time, the glass substrate G is carried into the robot chamber 11 in a horizontal position with the surface to be processed aligned along the X and Y directions and with the surface to be processed facing upward in the Z direction. The glass substrate G is carried into the robot chamber 11 while being supported by the transfer robot 11h on the back side of the surface to be processed.

[0119] The robot chamber 11 and the pre- and post-processing device BA10 are in communication while the glass substrate G is being transported. During this time, the robot chamber 11 and the pre- and post-processing device BA10 are kept sealed from the outside. During this time, the gas atmosphere setting mechanism 11g maintains the atmosphere in the robot chamber 11. The robot chamber 11 and the pre- and post-processing device BA10 are in a vacuum atmosphere or an atmosphere in which moisture has been removed by filling them with an inert gas or the like. The pre- and post-processing device BA10 maintains an atmosphere similar to that of the robot chamber 11. The robot chamber 11 and the first reversing chamber 12A, and the robot chamber 11 and the second reversing chamber 12B are both closed.

[0120] When the glass substrate G is carried into the robot chamber 11, the door valve or the like of the robot chamber 11 is closed to isolate it from the pre- and post-processing device BA 10 and to seal it. The robot chamber 11 and the first reversing chamber 12A, and the robot chamber 11 and the second reversing chamber 12B are both isolated from each other.

[0121] After the glass substrate G has been carried into the robot chamber 11, the robot chamber 11 and the first reversing chamber 12A are communicated with each other by opening a door valve or the like. In the first reversing chamber 12A, the platen portion 12Ap1 is on standby in a horizontal position. A transport tray T is placed on the platen portion 12Ap1. In the platen portion 12Ap1, the platen support pin portion 12Ap3 is on standby in a raised position.

[0122] In this state, the unprocessed glass substrate G before the deposition process is carried in the horizontal position from the robot chamber 11 into the first reversal chamber 12A by the transfer robot 11h. The glass substrate G is placed on the platen support pin portion 12Ap3 by the transport robot 11h. The platen support pin portion 12Ap3 descends while supporting the glass substrate G. The glass substrate G is placed on the transport tray T. The glass substrate G is aligned with respect to the transport tray T. Thereafter, the glass substrate G is attached to the transport tray T and is treated as a substrate transport tray TG whose posture can be changed as a whole.

[0123] After the transfer robot 11h retreats to the robot chamber 11, the first reversing chamber 12A is sealed off from the robot chamber 11 by closing the door valve or the like. The position of the platen unit 12Ap1 is changed in the first reversal chamber 12A. With the substrate transport tray TG placed thereon, the platen unit 12Ap1 is raised from the horizontal position to the vertical position by the platen mechanism drive unit 12Ap0. The substrate transport tray TG is now in the vertical position.

[0124] In the first reversal chamber 12A, a deposition mask M is placed on standby by a mask attaching / detaching mechanism 12Am. The mask attaching / detaching mechanism 12Am is driven by a mask attaching / detaching mechanism driving unit 12Am0 to attach the deposition mask M to the substrate transport tray TG. At this time, the mask attaching / detaching mechanism 12Am aligns the deposition mask M with respect to the substrate transport tray TG. The substrate transport tray TG, with the deposition mask M attached, is treated as an unprocessed substrate mask transport tray TGMb that can be transported as a whole.

[0125] The unprocessed substrate / mask transport tray TGMb is lowered by the floating mechanism drive unit and placed on the lower transport / reverse rail 12Ard, with the lower end of the unprocessed substrate / mask transport tray TGMb supported by the lower transport / reverse rail 12Ard. Next, the upper transport reversing rail 12Aru is lowered by the floating mechanism drive unit to support the upper part of the unprocessed substrate mask transport tray TGMb, thereby making the unprocessed substrate mask transport tray TGMb ready for transport.

[0126] The rotation chamber 13 is set at a rotation position such that the rotary transport rail 13r1 and the transport reversal rail 12Ar are aligned in a straight line, and waits for the unprocessed substrate mask transport tray TGMb to be carried in. The transport reversing rail 12Ar is driven by the transport reversing rail drive unit 12Ar0 to transport the unprocessed substrate mask transport tray TGMb out to the rotation chamber 13. At the same time, the rotating transport rail 13r1 is driven by the rotating transport rail drive unit 13r0 to transport the unprocessed substrate mask transport tray TGMb in.

[0127] The rotary conveyor rail drive unit 13r0 rotates the rotary conveyor rail 13r1 so that the angle of rotation is as small as possible. In this embodiment, the rotation angle of the rotary conveyor rail 13r1 is preferably approximately 90° or 180°, and can also be 270°. The rotation direction of the rotary conveyor rail 13r1 is usually selected so that the rotation angle does not exceed 360°. Note that an unprocessed substrate mask transport tray TGMb may be transported onto the rotary conveyor rail 13r2.

[0128] Subsequently, the unprocessed substrate mask transport tray TGMb is sent out from the rotary transport rail 13r1 to the transport rail 14r1 of the buffer chamber 14. In the buffer chamber 14, the transport rails 14r1 driven by the transport rail drive unit 15r0 adjust the transport speed and transport position of the unprocessed substrate mask transport tray TGMb so that the interval is set to the interval set for the deposition process.

[0129] The unprocessed substrate mask transport tray TGMb is transported from the transport rail 14r1 to the outgoing transport rail 15r1 of the deposition chamber 15. In the deposition chamber 15, an deposition process (film formation process) is performed on glass substrates G while moving an unprocessed substrate mask transport tray TGMb in the X direction. The unprocessed substrate mask transport tray TGMb is transported by an outgoing transport rail 15r1 in front of a plurality of deposition sources 15v that eject deposition materials. The connection position between the outgoing transport rail 15r1 and the transport rail 16r1 is called a substrate mask transport tray TGM because it is not unprocessed.

[0130] The substrate mask transport tray TGM is transported from the outgoing transport rail 15r1 to the transport rail 16r1 of the buffer chamber 16. In the buffer chamber 16, the transport rail 16r1 driven by the transport rail drive unit 15r0 adjusts the transport speed and transport position of the substrate mask transport tray TGM so that the turnback operation in the turnback chamber 17 can be performed in accordance with the spacing set for the deposition process on the return transport rail 15r2.

[0131] The turnback chamber 17 sets a rotation position so that the turnback rail 17r1 and the transport rail 16r1 are aligned in a straight line, and waits for the substrate mask transport tray TGM to be carried in. The substrate mask transport tray TGM is transported from the transport rail 16r1 to the turnback rail 17r1 of the turnback chamber 17.

[0132] The substrate mask transport tray TGM is placed in a vertical position on the turnback rail 17r1. In this state, the turnback rail 17r1 is driven by the turnback rail drive unit 17r0 and rotates so that the turnback rail 17r1 and the transport rail 16r2 are aligned in a straight line. At this time, the turnback rail drive unit 17r0 rotates the turnback rail 17r1 so that the angle of rotation is as small as possible.

[0133] The substrate mask transport tray TGM is transported from the turnback rail 17r1 to the transport rail 16r2 of the buffer chamber 16. In the buffer chamber 16, the transport rail 16r2 driven by the transport rail drive unit 15r0 adjusts the transport speed and transport position of the substrate mask transport tray TGM so that the interval is set to the interval set for the deposition process.

[0134] The substrate mask transport tray TGM is transported from the transport rail 16r2 to the return transport rail 15r2 of the deposition chamber 15. The substrate mask transport tray TGM is transported by the return transport rail 15r2 in the opposite direction to the transport direction by the return transport rail 15r1. In the deposition chamber 15, deposition processing is performed on the glass substrate G on the substrate mask transport tray TGM, just as on the outbound route. At the connection point between the return transport rail 15r2 and the transport rail 14r2, processing has been completed, so the substrate mask transport tray is referred to as the processed substrate mask transport tray TGMa.

[0135] The processed substrate mask transport tray TGMa is transported from the return transport rail 15r2 to the transport rail 14r2 of the buffer chamber 14. In the buffer chamber 14, the transport rail 14r2 driven by the transport rail drive unit 15r0 adjusts the transport speed and transport position of the processed substrate mask transport tray TGMa so that it can perform rotation in the rotation chamber 13 from the interval set in the deposition process on the return transport rail 15r2.

[0136] The rotation chamber 13 is set at a rotation position so that the rotary transport rail 13r2 and the transport rail 14r2 are aligned in a straight line, and waits for the post-processing substrate mask transport tray TGMa to be carried in. The transport rail 14r2 is driven by the transport rail drive unit 15r0 to transport the processed substrate mask transport tray TGMa out to the rotation chamber 13. At the same time, the rotary transport rail 13r2 is driven by the rotary transport rail drive unit 13r0 to transport the processed substrate mask transport tray TGMa in. The processed substrate mask transport tray TGMa is transported into the rotation chamber 13. The processed substrate mask transport tray TGMa is placed in a vertical position on the rotary transport rail 13r2. Note that the processed substrate mask transport tray TGMa may also be transported onto the rotary transport rail 13r1.

[0137] The rotary conveyor rail 13r2 is driven by the rotary conveyor rail drive unit 13r0, and rotates so as to be aligned with the conveyor reversal rail 12Br, thereby setting the rotation position. Subsequently, the processed substrate mask transport tray TGMa is sent out from the rotary transport rail 13r2 to the transport reversal rail 12Br of the second reversal chamber 12B. The processed substrate mask transport tray TGMa is stopped at a position corresponding to the platen portion 12Bp1 of the transport reversal rail 12Br.

[0138] In the second reversing chamber 12B, the platen portion 12Bp1 is in a vertical position and is on standby. In the second reversing chamber 12B, the mask attaching / detaching mechanism 12Bm is on standby. The door valve between the second reversing chamber 12B and the robot chamber 11 is closed. The upper transport reversing rail 12Bru is raised by the floating mechanism drive unit to release support from the upper part of the processed substrate mask transport tray TGMa. Furthermore, the processed substrate mask transport tray TGMa is floated from the lower transport reversing rail 12Brd by the floating mechanism drive unit, and becomes capable of tilting.

[0139] The mask attaching / detaching mechanism 12Bm is driven by a mask attaching / detaching mechanism driving unit 12Bm0 to detach the deposition mask M from the substrate transport tray TG. At this time, the mask attaching / detaching mechanism 12Bm separates the deposition mask M from the substrate transport tray TG in the Y direction. The deposition mask M is held at a standby position by the mask attaching / detaching mechanism 12Bm. The substrate transport tray TG from which the deposition mask M has been detached is supported by the platen portion 12Bp1 by the floating mechanism drive unit and is in a state where it can be tilted.

[0140] In the second reversing chamber 12B, the position is changed. The platen portion 12Bp1, with the substrate transport tray TG placed thereon, is raised from the vertical position to the horizontal position by the platen mechanism drive portion 12Bp0. The substrate transport tray TG is now in the horizontal position. The platen support pin portion 12Bp3 rises to support the glass substrate G. Furthermore, the platen support pin portion 12Bp3 rises to separate the glass substrate G from the transport tray T. The transport tray T remains placed on the platen portion 12Bp1.

[0141] The second reversing chamber 12B is connected to the robot chamber 11 by opening a door valve or the like between the second reversing chamber 12B and the robot chamber 11. Next, the transfer robot 11h enters the second reversing chamber 12B. The transfer robot 11h enters between the glass substrate G and the transfer tray T and moves the glass substrate G away from the platen support pin portion 12Bp3. The transfer robot 11h supports the glass substrate G. The transfer robot 11h transfers the glass substrate G from the second reversing chamber 12B to the robot chamber 11. When the glass substrate G is transferred into the robot chamber 11, the door valve or the like of the robot chamber 11 is closed to isolate and seal the robot chamber 11 from the second reversing chamber 12B.

[0142] When the glass substrate G is carried into the robot chamber 11, the door valve or the like of the robot chamber 11 is opened to communicate with the pre- and post-processing equipment BA10. The transfer robot 11h carries the glass substrate G after the deposition process out of the robot chamber 11 in a horizontal position to the pre- and post-processing equipment BA10.

[0143] This completes the processing for one glass substrate G.

[0144] In the above-described processing flow, the unprocessed glass substrate G is transported to the deposition chamber 15 via the first reversing chamber 12A, but the unprocessed glass substrate G may be transported to the deposition chamber 15 via the second reversing chamber 12B. In this case, a rotation operation in the rotation chamber 13 is added. In the above-described processing flow, the processed glass substrate G is transported to the robot chamber 11 via the second inversion chamber 12B, but the processed glass substrate G may be transported to the robot chamber 11 via the first inversion chamber 12A. In this case, the rotation operation in the rotation chamber 13 may be omitted.

[0145] Next, the timing of each operation on the glass substrate G will be described.

[0146] In the deposition chamber 15, a plurality of substrate mask transport trays TGM are moving, and deposition processing is continuously performed on these glass substrates G. Timings T001 to T026 shown in the following Figures 6 to 32 correspond to the respective timings T001 to T026 shown in Figure 5. Note that all of the timings T001 to T026 indicate a state in which continuous operations with a time width occur simultaneously, and do not indicate the precise time itself.

[0147] 6, in the first reversing chamber 12A, the transport tray T is placed on the platen portion 12Ap1 in the horizontal position. The platen support pin portion 12Ap3 is in an elevated position. The mask attaching / detaching mechanism 12Am is in a standby state in which the deposition mask M is held in a state spaced apart from the transport tray T in the Y direction. The door valve between the robot chamber 11 and the mask attaching / detaching mechanism 12Am is open. In the robot chamber 11, the transfer robot 11h carries out the unprocessed glass substrate G into the first reversing chamber 12A.

[0148] At this time, in the rotating chamber 13, the operation of carrying in the processed substrate mask transport tray TGMa from the buffer chamber 14 and the operation of carrying out the unprocessed substrate mask transport tray TGMb to the buffer chamber 14 are performed simultaneously. The rotary transport rails 13r1 and 13r2 are in rotational positions along the X direction. As shown in Fig. 6, the unprocessed substrate mask transport tray TGMb is placed on the rotary transport rail 13r1, and the processed substrate mask transport tray TGMa is moving toward the rotary transport rail 13r2.

[0149] In the second reversing chamber 12B, there are no transport trays T, glass substrates G, or deposition masks M. The upper transport reversing rail 12Bru is in a transportable position by the floating mechanism drive unit. The door valve between the second reversing chamber 12B and the robot chamber 11 is closed.

[0150] 7, in the first reversing chamber 12A, the transfer robot 11h performs an operation of moving the unprocessed glass substrate G in the X direction toward a position above the platen portion 12Ap1. The mask attaching / detaching mechanism 12Am holds the deposition mask M at a standby position.

[0151] At this time, in the rotating chamber 13, the operation of carrying in the processed substrate mask transport tray TGMa from the buffer chamber 14 to the rotary transport rail 13r2 and the operation of carrying out the unprocessed substrate mask transport tray TGMb from the rotary transport rail 13r1 to the buffer chamber 14 continue to be performed simultaneously. As shown in Figure 7, the unprocessed substrate mask transport tray TGMb has started to move from the rotary transport rail 13r1, and the processed substrate mask transport tray TGMa is moving toward the rotary transport rail 13r2. In the second reversing chamber, there are no transport trays T, glass substrates G, or deposition masks M. The upper transport reversing rail 12Bru maintains the transportable position.

[0152] 8, in the first reversing chamber 12A, the transfer robot 11h performs an operation of placing the unprocessed glass substrate G on the raised platen support pin portion 12Ap3. The mask attaching / detaching mechanism 12Am holds the deposition mask M at a standby position.

[0153] At this time, in the rotating chamber 13, the operation of loading the processed substrate mask transport tray TGMa from the buffer chamber 14 onto the rotary transport rail 13r2 and the operation of unprocessed substrate mask transport tray TGMb from the rotary transport rail 13r1 to the buffer chamber 14 are carried out simultaneously. As shown in Fig. 8, the unprocessed substrate mask transport tray TGMb has moved from the rotary transport rail 13r1, and the processed substrate mask transport tray TGMa has moved to the rotary transport rail 13r2, so that the unprocessed substrate mask transport tray TGMb and the processed substrate mask transport tray TGMa pass each other.

[0154] In the second reversing chamber 12B, there are no transport trays T, glass substrates G, or deposition masks M. The upper transport reversing rails 12Bru maintain the transport-enabled position.

[0155] 9, in the first reversing chamber 12A, the transfer robot 11h performs an operation of retreating from between the unprocessed glass substrate G and the platen portion 12Ap1. The raised platen support pin portion 12Ap3 supports the glass substrate G. The mask attaching / detaching mechanism 12Am holds the deposition mask M at a standby position.

[0156] At this time, in the rotary chamber 13, the operation of loading the processed substrate mask transport tray TGMa onto the rotary transport rail 13r2 and the operation of unprocessed substrate mask transport tray TGMb from the rotary transport rail 13r1 to the buffer chamber 14 are simultaneously carried out. In the second reversing chamber 12B, there are no transport trays T, glass substrates G, or deposition masks M. The upper transport reversing rails 12Bru maintain the transport-enabled position.

[0157] Next, at timing T004 shown in FIG. 10, in the robot chamber 11, the transfer robot 11h has completed the retreat operation from the first reversing chamber 12A. In the first reversing chamber 12A, the glass substrate G moves closer to the transport tray T as the platen support pin portion 12Ap3 moves downward. The mask attaching / detaching mechanism 12Am holds the deposition mask M at a standby position.

[0158] At this time, in the rotary chamber 13, the operation of loading the processed substrate mask transport tray TGMa onto the rotary transport rail 13r2 and the operation of unprocessed substrate mask transport tray TGMb from the rotary transport rail 13r1 to the buffer chamber 14 are carried out simultaneously. As shown in Fig. 10, the unprocessed substrate mask transport tray TGMb is separated from the rotary transport rail 13r1, and the processed substrate mask transport tray TGMa is stopped on the rotary transport rail 13r2. In the second reversing chamber 12B, there are no transport trays T, glass substrates G, or deposition masks M. The upper transport reversing rails 12Bru maintain the transport-enabled position.

[0159] 11, the transfer robot 11h is in a standby state in the robot chamber 11. The door valve between the transfer robot 11h and the first reversal chamber 12A is closed. In the first reversing chamber 12A, the glass substrate G is placed on a transport tray T. The glass substrate G is aligned with respect to the transport tray T. The glass substrate G is attached to the transport tray T and is treated as a substrate transport tray TG. The mask attaching / detaching mechanism 12Am holds the deposition mask M at a standby position.

[0160] At this time, the operation of loading the processed substrate mask transport tray TGMa onto the rotary transport rail 13r2 and the operation of unprocessed substrate mask transport tray TGMb from the rotary transport rail 13r1 to the buffer chamber 14 have been completed in the rotary chamber 13. As shown in Fig. 11, only the processed substrate mask transport tray TGMa is placed on the rotary transport rail 13r2. The space above the rotary transport rail 13r1 is empty. In the second reversing chamber 12B, there are no transport trays T, glass substrates G, or deposition masks M. The upper transport reversing rails 12Bru maintain the transport-enabled position.

[0161] 12, the platen portion 12Ap1 in the first reversing chamber 12A performs an upright movement. This upright movement changes the posture of the unprocessed substrate transport tray TG to a vertical position. The mask attaching / detaching mechanism 12Am holds the deposition mask M in a standby position. The door valve between the chamber and the robot chamber 11 is closed.

[0162] At this time, the rotary transport rail drive unit 13r0 rotates the rotary transport rail 13r2 on which the processed substrate mask transport tray TGMa is placed and the empty rotary transport rail 13r in the rotation chamber 13. The rotary transport rail 13r2 rotates toward a rotation position where transport is possible, connected to the transport reversal rail 12Br in the same Y direction. In the second reversing chamber 12B, there are no transport trays T, glass substrates G, or deposition masks M. The upper transport reversing rails 12Bru maintain their lowered positions.

[0163] 13, in the first reversing chamber 12A, the platen portion 12Ap1 completes the standing operation. The unprocessed substrate transport tray TG is in the vertical position. The mask attaching / detaching mechanism 12Am holds the deposition mask M at the standby position. The door valve between the robot chamber 11 and the first reversing chamber 12A is closed.

[0164] At this time, in the rotation chamber 13, the rotary transport rail 13r2 on which the processed substrate mask transport tray TGMa is placed is in a rotation position where it can be transported in the same Y direction as the transport reversal rail 12Br. In the second reversing chamber 12B, there are no transport trays T, glass substrates G, or deposition masks M. The upper transport reversing rails 12Bru maintain the transport-enabled position.

[0165] 14, in the first reversing chamber 12A, the mask attaching / detaching mechanism 12Am performs an operation of attaching the deposition mask M to the substrate transport tray TG in the vertical position. The mask attaching / detaching mechanism 12Am moves the deposition mask M in the Y direction to bring it close to the substrate transport tray TG. The mask attaching / detaching mechanism 12Am aligns the deposition mask M with respect to the substrate transport tray TG. The door valve between the robot chamber 11 and the mask attaching / detaching mechanism 12Am is closed.

[0166] At this time, the processed substrate mask transport tray TGMa is transported from the rotary transport rail 13r2 toward the transport reversal rail 12Br in the rotation chamber 13. The rotation chamber 13 becomes empty. The deposition mask M and the processed substrate mask transport tray TGMa move simultaneously in the same Y direction. In the second reversing chamber 12B, the transport reversing rails 12Br carry in the processed substrate mask transport tray TGMa, and the upper transport reversing rails 12Bru maintain a transportable position.

[0167] 15, in the first reversing chamber 12A, the substrate transport tray TG on which the mounting operation of the deposition mask M has been completed is treated as the substrate mask transport tray TGM. The floating drive unit floats the upper transport reversing rail 12Aru. The door valve between the robot chamber 11 and the substrate transport tray TG is closed.

[0168] At this time, in the rotation chamber 13, the rotary conveyor rails 13r1 and 13r2, which do not have an object to be conveyed, rotate in preparation for moving toward a position along the X direction. At this time, since neither the rotary conveyor rails 13r1 nor the rotary conveyor rails 13r2 has a substrate mask conveyor tray TGM placed thereon, the rotation direction is selected so that the rotation angle becomes small.

[0169] In the second reversing chamber 12B, the floating drive unit floats the upper transport reversing rail 12Bru to the retracted position, and the floating drive unit floats the processed substrate / mask transport tray TGMa from the transportable position relative to the lower transport reversing rail 12Brd to the support position of the platen unit 12Bp1.

[0170] Next, at timing T010 shown in Fig. 16, in the first reversing chamber 12A, the floating drive unit continues to float the upper transport reversing rail 12Aru to a transportable position. The floating drive unit floats the unprocessed substrate mask transport tray TGMb to a transportable state. The door valve between the robot chamber 11 and the first reversing chamber 12A is closed.

[0171] At this time, in the rotation chamber 13, the rotary conveyor rails 13r1 and 13r2 have completed the preparatory rotation operation and are both in rotation positions along the X direction. In the second reversing chamber 12B, the mask attaching / detaching mechanism 12Bm detaches the deposition mask M from the processed substrate mask transport tray TGMa. After this detaching operation is completed, the processed substrate mask transport tray TGMa is treated as the processed substrate transport tray TGa. The mask attaching / detaching mechanism 12Bm holds the deposition mask M at a standby position.

[0172] 17, in the first reversing chamber 12A, the transport reversing rail 12Ar transports the unprocessed substrate mask transport tray TGMb toward the rotation chamber 13. The door valve between the robot chamber 11 and the first reversing chamber 12A is closed.

[0173] At this time, the rotary transport rail 13r2 is connected to the transport reversal rail 12Ar in the same X direction in the rotary chamber 13. The rotary transport rail 13r2 carries in the unprocessed substrate mask transport tray TGMb. In the second reversing chamber 12B, the platen portion 12Bp1 tilts. This tilting operation changes the posture of the processed substrate transport tray TGa from a vertical position to a horizontal position. The mask attaching / detaching mechanism 12Bm holds the deposition mask M at a standby position.

[0174] 18, in the first reversing chamber 12A, the transport reversing rail 12Ar continues to transport the unprocessed substrate mask transport tray TGMb toward the rotation chamber 13. The door valve between the robot chamber 11 and the first reversing chamber 12A is closed.

[0175] At this time, in the rotation chamber 13, the rotary transport rail 13r2 continues to carry in the unprocessed substrate mask transport tray TGMb from the transport reversal rail 12Ar. In the second reversing chamber 12B, the processed substrate transport tray TGa continues to tilt from the vertical position to the horizontal position. The mask attaching / detaching mechanism 12Bm holds the deposition mask M at the standby position.

[0176] 19, the transfer robot 11h is in a standby state in the robot chamber 11. The door valve between the robot chamber 11 and the second reversing chamber 12B is opened. The robot chamber 11 communicates with the second reversing chamber 12B. In the first reversing chamber 12A, the unprocessed substrate mask transport tray TGMb has been transported out toward the rotation chamber 13. The door valve between the first reversing chamber 12A and the robot chamber 11 is closed.

[0177] At this time, in the rotary chamber 13, the unprocessed substrate mask transport tray TGMb that has been carried in stops relative to the rotary transport rail 13r2. In the second reversing chamber 12B, the platen support pin portion 12Bp3 moves up. The platen support pin portion 12Bp3 separates the glass substrate G from the processed substrate transport tray TGa, which is in the horizontal position after the tilting operation is completed. The processed substrate transport tray TGa is separated into the transport tray T and the processed glass substrate Ga. The transport tray T remains on the platen portion 12Bp1.

[0178] Next, at timing T014 shown in FIG. 20, in the robot chamber 11, the transport robot 11h extends to the second reversing chamber 12B. The transport robot 11h supports the processed glass substrate G. The transport robot 11h transports the processed glass substrate Ga from the second reversing chamber 12B toward the robot chamber 11. Thereafter, the door valve between the robot chamber 11 and the second reversing chamber 12B is closed. Furthermore, the door valve between the robot chamber 11 and the pre- or post-process device BA10 is opened. The transport robot 11h transports the processed glass substrate Ga from the robot chamber 11 toward the pre- or post-process device BA10.

[0179] In the first reversing chamber 12A, there are no transfer trays T, glass substrates G, or deposition masks M. The upper transfer reversing rail 12Aru maintains the transfer-enabling position. The door valve between the first reversing chamber 12A and the robot chamber 11 is closed. At this time, the unprocessed substrate mask transport tray TGMb is placed on the rotary transport rail 13r2 in the rotary chamber 13. The rotary transport rail 13r1 is empty. In the second reversing chamber 12B, the platen support pin portion 12Bp3 is in the raised position. The mask attaching / detaching mechanism 12Bm holds the deposition mask M at the standby position. The door valve between the second reversing chamber 12B and the robot chamber 11 is closed after the processed glass substrate Ga is carried out.

[0180] Next, at timing T015 shown in FIG. 21, in the robot chamber 11, the transfer robot 11h carries in the unprocessed glass substrate G in a horizontal position from the pre- or post-processing device BA10. In the first reversing chamber 12A, there are no transfer trays T, glass substrates G, or deposition masks M. The upper transfer reversing rail 12Aru maintains the transfer-enabling position. The door valve between the first reversing chamber 12A and the robot chamber 11 is closed.

[0181] At this time, the unprocessed substrate mask transport tray TGMb is placed on the rotary transport rail 13r2 in the rotary chamber 13. The rotary transport rail 13r1 is empty. In the second reversing chamber 12B, the platen support pin portion 12Bp3 is in the raised position. The mask attaching / detaching mechanism 12Bm holds the deposition mask M in the standby position. The door valve between the second reversing chamber 12B and the robot chamber 11 is closed.

[0182] Next, at timing T016 shown in FIG. 22, in the robot chamber 11, the transfer robot 11h carries the unprocessed glass substrate G from the robot chamber 11 into the second reversing chamber 12B in a horizontal position. In the first reversing chamber 12A, there are no transfer trays T, glass substrates G, or deposition masks M. The upper transfer reversing rail 12Aru maintains the transfer-enabling position. The door valve between the first reversing chamber 12A and the robot chamber 11 is closed.

[0183] At this time, in the rotary chamber 13, the rotary transport rail 13r2 starts the operation of transporting the unprocessed substrate mask transport tray TGMb out to the buffer chamber 14. The rotary transport rail 13r1 starts the operation of transporting the processed substrate mask transport tray TGMa in from the buffer chamber 14. In the second reversing chamber 12B, the platen support pin portion 12Bp3 is in the raised position. The mask attaching / detaching mechanism 12Bm holds the deposition mask M at the standby position.

[0184] Next, at timing T017 shown in FIG. 23, in the robot chamber 11, the transfer robot 11h is retreating from the second reversing chamber 12B. In the first reversing chamber 12A, there are no transfer trays T, glass substrates G, or deposition masks M. The upper transfer reversing rail 12Aru maintains the transfer-enabling position. The door valve between the first reversing chamber 12A and the robot chamber 11 is closed.

[0185] At this time, in the rotary chamber 13, the rotary transport rail 13r2 is transporting the unprocessed substrate mask transport tray TGMb out to the buffer chamber 14. The rotary transport rail 13r1 is transporting the processed substrate mask transport tray TGMa in from the buffer chamber 14. In the second reversing chamber 12B, the platen support pin portion 12Bp3 supports the unprocessed glass substrate G at the raised position. The unprocessed glass substrate G is aligned with respect to the transport tray T. The unprocessed glass substrate G is attached to the transport tray T and treated as an unprocessed substrate transport tray TG. The mask attaching / detaching mechanism 12Bm holds the deposition mask M at a standby position.

[0186] 24, the transfer robot 11h is in a standby state in the robot chamber 11. The door valve between the transfer robot 11h and the second reversing chamber 12B is closed. In the first reversing chamber 12A, there are no transfer trays T, glass substrates G, or deposition masks M. The upper transfer reversing rail 12Aru maintains the transfer-enabling position. The door valve between the first reversing chamber 12A and the robot chamber 11 is closed.

[0187] At this time, in the rotating chamber 13, the unprocessed substrate mask transport tray TGMb has been transported out to the buffer chamber 14. The rotary transport rail 13r1 has completed transporting the processed substrate mask transport tray TGMa. The processed substrate mask transport tray TGMa stops. Thereafter, the rotary transport rail 13r1 carrying the processed substrate mask transport tray TGMa rotates together with the empty rotary transport rail 13r2. The rotary transport rail 13r1 rotates toward a rotation position where it is connected to the transport reversal rail 12Ar in the same X direction and can be transported. In the second reversing chamber 12B, the door valve between the second reversing chamber 12B and the robot chamber 11 is closed. After that, the platen portion 12Bp1 performs an upright movement. By this upright movement, the posture of the unprocessed substrate transport tray TG is changed to a vertical position. The mask attaching / detaching mechanism 12Bm holds the deposition mask M at a standby position.

[0188] Next, at timing T019 shown in Fig. 25, the transport reversing rail 12Ar waits in a transportable state in the first reversing chamber 12A, and the door valve between the first reversing chamber 12A and the robot chamber 11 is closed.

[0189] At this time, in the rotation chamber 13, the rotary transport rail 13r1 is in a rotation position where it can be transported in the same X direction as the transport reversal rail 12Ar, and is waiting for the unloading operation of the processed substrate mask transport tray TGMa. In the second reversing chamber 12B, the platen portion 12Bp1 has completed the standing operation. With this standing operation, the unprocessed substrate transport tray TG, which is in the vertical position, is waiting for the attachment of the deposition mask M. The mask attaching / detaching mechanism 12Bm holds the deposition mask M at the standby position.

[0190] 26, in the first reversing chamber 12A, the transport reversing rails 12Ar carry in the processed substrate mask transport tray TGMa from the rotation chamber 13. The upper transport reversing rails 12Aru maintain the transportable position. At this time, the processed substrate mask transport tray TGMa is transported from the rotary transport rail 13r1 toward the transport reversal rail 12Ar in the rotation chamber 13. The rotation chamber 13 becomes empty.

[0191] In the second reversing chamber 12B, the mask attaching / detaching mechanism 12Bm attaches a deposition mask M to a substrate transport tray TG in a vertical position. The mask attaching / detaching mechanism 12Bm moves the deposition mask M in the X direction to bring it close to the unprocessed substrate transport tray TG. The mask attaching / detaching mechanism 12Bm aligns the deposition mask M with respect to the substrate transport tray TG. The door valve between the robot chamber 11 and the mask attaching / detaching mechanism 12Bm is closed. The deposition mask M and the processed substrate mask transport tray TGMa move simultaneously in the same X direction.

[0192] 27, in the first reversing chamber 12A, the floating drive unit floats the upper transport reversing rail 12Aru to the retracted position. The floating drive unit floats the processed substrate mask transport tray TGMa from the transportable position relative to the lower transport reversing rail 12Ard to the support position of the platen unit 12Ap1.

[0193] At this time, in the rotating chamber 13, the rotary conveyor rails 13r1 and 13r2 without any objects to be conveyed rotate in preparation for moving toward positions along the Y direction. In the second reversing chamber 12B, the substrate transport tray TG on which the deposition mask M has been mounted is treated as an unprocessed substrate mask transport tray TGMb. The floating drive unit floats the upper transport reversing rail 12Bru to a transportable position. The floating drive unit floats the unprocessed substrate mask transport tray TGMb to a transportable state. The door valve between the robot chamber 11 and the second reversing chamber 12B is closed.

[0194] Next, at timing T022 shown in FIG. 28, in the first reversing chamber 12A, the mask attaching / detaching mechanism 12Am performs an operation to detach the deposition mask M from the processed substrate mask transport tray TGMa. When this detaching operation is completed, the processed substrate mask transport tray TGMa is treated as the processed substrate transport tray TGa. The mask attaching / detaching mechanism 12Am holds the deposition mask M at a standby position. Furthermore, in the first reversing chamber 12A, the platen portion 12Ap1 starts a tilting operation. This tilting operation changes the posture of the processed substrate transport tray TGa from the vertical position to the horizontal position.

[0195] At this time, in the rotation chamber 13, the rotary transport rail 13r1 is stopped at a rotation position aligned in the same Y direction as the transport reversing rail 12Br. The rotary transport rail 13r1 carries in the unprocessed substrate mask transport tray TGMb from the transport reversing rail 12Br. In the second reversing chamber 12B, the transport reversing rail 12Br starts to transport the unprocessed substrate mask transport tray TGMb toward the rotation chamber 13. The door valve between the second reversing chamber 12B and the robot chamber 11 is closed.

[0196] 29, the platen portion 12Ap1 continues to tilt in the first reversing chamber 12A. The mask attaching / detaching mechanism 12Am holds the deposition mask M at the standby position.

[0197] At this time, in the rotary chamber 13, the rotary transport rail 13r1 continues to carry in the unprocessed substrate mask transport tray TGMb from the transport reversal rail 12Br. In the second reversing chamber 12B, the transport reversing rail 12Br continues to transport the unprocessed substrate mask transport tray TGMb toward the rotation chamber 13. The door valve between the robot chamber 11 and the second reversing chamber 12B is closed.

[0198] Next, at timing T024 shown in Figure 30, the processed substrate transport tray TGa completes its tilting operation to the horizontal position in the first reversing chamber 12A. Thereafter, the platen support pin portion 12Ap3 moves upward in the first reversing chamber 12A. The platen support pin portion 12Ap3 separates the glass substrate G from the processed substrate transport tray TGa in the horizontal position after completing the tilting operation. The processed substrate transport tray TGa is separated into the transport tray T and the processed glass substrate Ga. The transport tray T remains in the platen portion 12Ap1.

[0199] The transfer robot 11h is on standby in the robot chamber 11. The door valve between the robot chamber 11 and the first reversal chamber 12A is closed. At this time, the unprocessed substrate mask transport tray TGMb that has been loaded stops relative to the rotary transport rail 13r1 in the rotation chamber 13. Thereafter, the rotary transport rail 13r1 carrying the unprocessed substrate mask transport tray TGMb rotates together with the empty rotary transport rail 13r2. The rotary transport rail 13r1 rotates in the same X direction as the transport rail 14r toward a rotation position where the unprocessed substrate mask transport tray TGMb can be unloaded.

[0200] In the second reversing chamber 12B, the transport reversing rail 12Br completes transporting the unprocessed substrate / mask transport tray TGMb toward the rotation chamber 13. The upper transport reversing rail 12Bru maintains a transportable position. The door valve between the robot chamber 11 and the second reversing chamber 12B is closed. There are no transport trays T, glass substrates G, or deposition masks M in the second reversing chamber 12B.

[0201] Next, at timing T025 shown in FIG. 31 , the door valve between the robot chamber 11 and the first reversing chamber 12A is opened. The transport robot 11h extends into the first reversing chamber 12A. The transport robot 11h carries the processed glass substrate Ga from the first reversing chamber 12A into the robot chamber 11. Thereafter, the door valve between the robot chamber 11 and the first reversing chamber 12A is closed. Furthermore, the door valve between the robot chamber 11 and the pre- or post-process device BA10 is opened. The transport robot 11h carries the processed glass substrate Ga out of the robot chamber 11 toward the pre- or post-process device BA10.

[0202] In the first reversing chamber 12A, the platen support pin portion 12Bp3 is in the raised position. The mask attaching / detaching mechanism 12Bm holds the deposition mask M at the standby position. The door valve between the first reversing chamber 12A and the robot chamber 11 is closed after the processed glass substrate Ga is carried out.

[0203] At this time, the unprocessed substrate mask transport tray TGMb is placed on the rotary transport rail 13r1 in the rotary chamber 13. The rotary transport rail 13r2 is empty. In the second reversing chamber 12B, there are no transport trays T, glass substrates G, or deposition masks M. The upper transport reversing rail 12Bru maintains the transportable position. The door valve between the second reversing chamber 12B and the robot chamber 11 is closed.

[0204] Next, at timing T026 shown in FIG. 32, in the robot chamber 11, the transfer robot 11h carries in the unprocessed glass substrate G in a horizontal position from the pre- or post-processing device BA10. In the first reversing chamber 12A, the platen support pin portion 12Ap3 is in the raised position. The mask attaching / detaching mechanism 12Am holds the deposition mask M in the standby position. The door valve between the first reversing chamber 12A and the robot chamber 11 is closed.

[0205] At this time, in the rotary chamber 13, the rotary transport rail 13r1 starts the operation of transporting the unprocessed substrate mask transport tray TGMb out to the buffer chamber 14. The rotary transport rail 13r2 starts the operation of transporting the processed substrate mask transport tray TGMa in from the buffer chamber 14. In the second reversing chamber 12B, there are no transport trays T, glass substrates G, or deposition masks M. The upper transport reversing rail 12Bru maintains the transportable position. The door valve between the second reversing chamber 12B and the robot chamber 11 is closed.

[0206] Thereafter, the door valve between the first reversing chamber 12A and the robot chamber 11 is opened, and the process returns to timing T000 shown in FIG. 6, and the above operations are repeated.

[0207] In this embodiment, as described above, the control unit 18 controls each component of the vacuum deposition apparatus 10 to perform predetermined operations at the same time, thereby minimizing the time required for loading and unloading, thereby improving the overall efficiency of the deposition process on the glass substrate G. In particular, by alternately loading and unloading the glass substrate G using the first reversing chamber 12A and the second reversing chamber 12B, the time required for loading and unloading is reduced, thereby improving the FPD manufacturing efficiency without affecting the moving film formation in the deposition chamber 15. Furthermore, this time reduction is due to the elimination of movement of the transport tray in a direction perpendicular to the transport direction, i.e., movement in the so-called traverse direction. At the same time, this time reduction is due to the reduction in the number of components that move when changing the orientation of the glass substrate G between the vertical and horizontal positions.

[0208] Furthermore, since all of these glass substrate G movements can be performed in a sealed, controlled atmosphere, it is possible to reduce the effects of particles and the like in FPD manufacturing, thereby further improving the production yield. Furthermore, the number of parts in the vacuum deposition apparatus 10 can be reduced, making it more compact and space-saving.

[0209] In this embodiment, the rotation chamber 13 and the turnback chamber 17 are disposed at both ends of the deposition chamber 15 in the X direction, but instead of the turnback chamber 17, a configuration similar to the rotation chamber 13 can be disposed on the right side of Fig. 1. In this case, two reversal chambers and a robot chamber are similarly connected to the rotation chamber on the right side.

[0210] In this configuration, glass substrates can be loaded and unloaded from the left and right robot chambers in the same way. In this case, glass substrates coming from the right and glass substrates coming from the left can be transported alternately on the transport rails 15r1 and 15r2. Then, the glass substrate coming from the right can be turned back in the left rotation chamber, and the glass substrate coming from the left can be turned back in the right rotation chamber. This further improves the efficiency of the vapor deposition process. Furthermore, it is also possible to increase the number of vapor deposition sources installed in the vapor deposition chamber.

[0211] Furthermore, in the present invention, it is possible to individually select and combine the individual configurations in the above-described embodiments. In particular, it is possible to select and combine operations that are performed at the same timing and perform them simultaneously. Also, the buffer chamber 14 may not be provided, and the buffer chamber 16 may not be provided. [Explanation of symbols]

[0212] 10...Vacuum deposition equipment 11...Robot Room 11h...Transport robot 12A...First reversal chamber 12Am, 12Bm...Mask attachment / detachment mechanism 12Ap,12Bp…platen mechanism 12Ap1, 12Bp1...Platen section 12Ap3, 12Bp3...Platen support pin section 12Ar, 12Br...Transport reversal rail 12Ar0, 12Br0...Floating mechanism 12B...Second reversal chamber 13...Rotation chamber 13r1, 13r2...Rotating conveyor rails 14,16...Buffer chamber 15...Deposition chamber 15r1, 15r2...Transport rail 17...Turnback room 17r1, 17r2...Turnback rail 18...Control unit G, Ga...Glass substrate M: evaporation mask T...Transport tray TG: Substrate transport tray TGa: Post-processing substrate transport tray TGM: Substrate mask transport tray TGMa...Processed substrate mask transport tray TGMb...Unprocessed substrate mask transport tray

Claims

1. A vacuum deposition apparatus for vertically moving film formation in which a deposition mask is combined with a glass substrate supported on a transport tray and the substrate is transported in front of a deposition source in a vertically upright position, a deposition chamber in which a plurality of the deposition sources are arranged along a substantially linear transport rail that transports the transport tray, and the two parallel transport rails form an outgoing path and a returning path, and a film is formed on a film-forming surface of the glass substrate on the outgoing path and the returning path along which the transport tray is transported by a transport rail drive unit; a turnback chamber connected to one end of the deposition chamber and configured to rotate and transfer the transport tray about a vertical axis from the outgoing transport rail to the return transport rail; a rotary chamber connected to the other end of the deposition chamber opposite the turnback chamber, the rotary chamber having two parallel rotary conveyor rails and a rotary conveyor rail drive unit for feeding the conveyor tray onto the conveyor rail on the outward path and receiving the conveyor tray from the conveyor rail on the return path to rotate and transfer the conveyor tray about a vertical axis; a first reversing chamber connected to the rotary chamber, the first reversing chamber having a transport reversing rail and a transport reversing rail drive unit connectable to the rotary transport rail on an extension of the transport rail of the deposition chamber, and configured to tilt the transport tray to switch between a horizontal position and a vertical position; a second reversing chamber connected to the rotary chamber, the second reversing chamber having a transport reversing rail connectable to the rotary transport rail on a line intersecting the transport rail of the deposition chamber, and a transport reversing rail drive unit, for tilting the transport tray to switch between a horizontal position and a vertical position; a robot chamber having a transfer robot connected to the first reversing chamber and the second reversing chamber, which transfers the glass substrate in a horizontal position with the film-forming surface facing upward between the robot chamber and an outside; Equipped with The first reversing chamber and the second reversing chamber are a mask attaching / detaching mechanism and a mask attaching / detaching mechanism driving unit that attach and detach the deposition mask to and from the glass substrate; a platen mechanism and a platen mechanism drive unit that tilt the carrier tray and the glass substrate between a horizontal position and a vertical position; a floating mechanism and a floating mechanism drive unit that tilt the carrier tray and the glass substrate from the carrier reversal rail by the platen mechanism; a substrate loading / unloading mechanism and a substrate loading / unloading mechanism drive unit for loading / unloading the glass substrate in a horizontal position from / to the transport tray; having A vacuum deposition apparatus characterized by:

2. the mask attaching / detaching mechanism causes the detached deposition mask to wait in the vicinity of the transport reversing rail.

2. The vacuum deposition apparatus according to claim 1.

3. The first reversing chamber and the second reversing chamber alternately send the transport tray to the rotating chamber.

2. The vacuum deposition apparatus according to claim 1, wherein the vacuum deposition apparatus is a vacuum deposition apparatus.

4. The robot chamber is connected to other processing equipment while maintaining a sealed state.

2. The vacuum deposition apparatus according to claim 1.

5. a buffer chamber is provided between the rotation chamber and the deposition chamber, the buffer chamber adjusting the interval between the transport trays to be sent to the moving deposition process in the deposition chamber; 2. The vacuum deposition apparatus according to claim 1.

6. controlling the transport rail drive unit, the rotational transfer of the transport tray in the turnback chamber, the rotary transport rail drive unit, the transport reversal rail drive unit between the first reversal chamber and the second reversal chamber, the mask mounting / removing mechanism drive unit, the platen mechanism drive unit, the floating mechanism drive unit, the substrate mounting / removing mechanism drive unit, and the transport robot, a control unit for performing deposition processing on the glass substrate at predetermined intervals in the deposition chamber; 2. The vacuum deposition apparatus according to claim 1.

7. The first inversion chamber and the second inversion chamber are the mask attaching / detaching mechanism and the platen mechanism are disposed on both sides of the transport / reversal rail; 2. The vacuum deposition apparatus according to claim 1.

8. The rotation chamber rotates less than one revolution around the vertical axis when rotating and transferring the transport tray.

2. The vacuum deposition apparatus according to claim 1.

9. The vacuum deposition apparatus according to any one of claims 1 to 8, The glass substrate moves at a constant speed in the deposition chamber. The glass substrate in the deposition chamber is moved a minimum distance before and after the deposition chamber. A vacuum deposition method characterized by:

10. The vacuum deposition apparatus according to any one of claims 1 to 8, the glass substrate before deposition is sent out and the glass substrate after deposition is received by the two rotary conveyor rails of the rotary chamber, and the glass substrate is simultaneously put into and taken out from the deposition chamber; A vacuum deposition method characterized by:

11. The glass substrate is transferred between the rotation chamber and the deposition chamber by: The operation of carrying the glass substrate from the robot chamber into the first reversing chamber or the operation of carrying the glass substrate from the robot chamber into the second reversing chamber is performed simultaneously.

11. The vacuum deposition method according to claim 10.

12. The glass substrate is transported from the robot chamber to the first reversing chamber by performing an upright movement from a horizontal position to a vertical position, The rotating conveying rail on which the glass substrate after deposition is placed is rotated in a direction to send the glass substrate to the second reversing chamber, The glass substrate is transported from the robot chamber to the second reversing chamber by an upright movement from a horizontal position to a vertical position, The rotation of the rotary conveyor rail carrying the glass substrate after deposition is performed in a direction to convey the glass substrate to the first reversing chamber.

12. The vacuum deposition method according to claim 11.

13. The operation of mounting the deposition mask on the glass substrate in the vertical position in the first reversing chamber includes: The deposition is carried out simultaneously with the transport operation of the glass substrate from the rotation chamber to the second reversing chamber, The operation of mounting the deposition mask on the glass substrate in the vertical position in the second reversing chamber includes: The deposition is carried out simultaneously with the transport operation of the glass substrate from the rotation chamber to the first reversing chamber.

13. The vacuum deposition method according to claim 12.

14. The tilting operation of the glass substrate carried in from the rotation chamber from a vertical position to a horizontal position in the first reversing chamber is performed by: This is carried out simultaneously with the transport operation from the second reversing chamber to the rotating chamber, The tilting operation of the glass substrate carried in from the rotation chamber from a vertical position to a horizontal position in the second reversing chamber is performed by: This is performed simultaneously with the transport operation from the first reversing chamber to the rotating chamber.

14. The vacuum deposition method according to claim 13.

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