Three-dimensionally patternable thermal interface

Abstract

To provide a thermal interface material which exhibits an acceptable mechanical modulus and dielectric strength, while optimizing heat transfer performance, in thin bond line applications.SOLUTION: In an electronic package 80 equipped with an electronic component 60 having a first heat surface 14a and generating heat and a heat sink 70 having a second heat surface 14b, a three-dimensional geometry of a thermal interface 50 body may be customized to substantially fill an irregular gap G along a thermal dissipation pathway in an electronic package. The thermal interface body is fabricated through an additive deposition process. Sequential patterns of thermal interface material are coherently connected to other deposited patterns of thermal interface material.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates generally to thermal interfaces, and more particularly to a customizable thermal interface body for substantially filling a gap between an electronic component and a heat sink, the thermal interface body being formed by additive deposition to achieve a customizable shape. [Background technology]

[0002] Thermally transparent materials are widely used, for example, as interfaces between heat-generating electronic components and heat sinks, allowing the transfer of excess thermal energy from the electronic component to the thermally coupled heat sink. Numerous designs and materials have been implemented for such thermal interfaces, with best performance achieved when gaps between the thermal interface and each heat transfer surface are substantially avoided. Therefore, it is preferable for the thermal interface material to conform to the somewhat uneven heat transfer surfaces of each component.

[0003] Examples of conformable thermal interface materials include silicone polymers that form a matrix filled with thermally conductive particles such as aluminum oxide or boron nitride. These materials are typically flexible enough to conform to the irregularities of the interface surface, whether at room temperature or elevated temperatures. Silicone greases or waxes tend to lack shape stability, especially at high operating temperatures, and can bleed out of the interface location over time. To address this issue, some interface materials are packaged as films, sheets, tapes, or pads that require special installation techniques and tooling. These forms of thermal interface materials often exhibit relatively high bulk modulus values, which hinder comprehensive conformability.

[0004] Some thermal interface materials are dispensed in a low-viscosity state and then cured to a high-viscosity state. While these foam-in-place materials overcome some of the challenges of other thermal interface material forms, they still have their own limitations. For example, achieving relatively thin bondlines, such as those less than 100 micrometers, has proven difficult with conventional thermal interface materials. A bondline in an assembly refers to the gap between thermal surfaces where a thermal interface is desired to mitigate the thermal barrier between the surfaces. Three-dimensional pre-cured thermal interface structures, such as tapes, pads, and films, typically lack sufficient robustness and ease of handling at thicknesses less than 100 micrometers. Traditionally, viscous gap fillers have been limited by the high assembly forces required to attach to thin bondlines. Traditional grease-like materials have long-term reliability issues and do not exhibit acceptable mechanical modulus and dielectric strength for use as dielectric coatings in thin bondline applications.

[0005] Another challenge presented by thin bondlines is the relatively large impact that thermal surface undulations have on the effectiveness of thermal interface materials. Surface irregularities and undulations, which may represent only a small portion of the overall thermal path between the thermal surfaces of a larger bondline system, can dramatically affect the expected thermal performance in thin bondline applications. Therefore, it would be desirable to customize thermal interface materials for irregular shapes that more closely mate with each thermal surface along the heat dissipation path. Form-in-place thermal interface materials with low dispensing viscosity allow the formulation to penetrate thin gaps before curing. Customizing the three-dimensional shape of thermal interface materials with form-in-place compositions can optimize heat transfer performance. Summary of the Invention [Means for solving the problem]

[0006] With the present invention, patternable thermal interface bodies may be constructed to more closely match the shape of gaps between thermal surfaces, such as between electronic components and heat sinks. Patternable thermal interface bodies may be constructed with a variety of dispensing devices programmed to apply flowable thermal interface materials in an additive process.

[0007] A method for forming a thermal interface body includes applying a first curable resin precursor to a surface in a first pattern of multiple discrete volumes, the first curable resin precursor comprising a silicone and exhibiting a first initial viscosity and a thermal conductivity of at least 0.2 W / m·K. The method further includes applying at least one of the first curable resin precursor and a second material in a second pattern of discrete volumes in contact with the first pattern. The second material may comprise a second curable resin precursor exhibiting a second initial viscosity different from the first initial viscosity and a thermal conductivity of at least 0.2 W / m·K.

[0008] To achieve a desired thermal conductivity, at least the first curable resin precursor may include thermally conductive particles at a first loading concentration. In some embodiments, the second curable resin precursor may also include thermally conductive particles at a second loading concentration. The first loading concentration of the thermally conductive particles may be different from the second loading concentration. Each of the first curable resin precursor and the second curable resin precursor may include thermally conductive particles having different particle size ranges. The maximum particle size may be at least 1.3 times the minimum particle size.

[0009] The method for forming a thermal interface body may further include curing one or more of the first curable resin precursor and the second curable resin precursor to a cured viscosity different from their respective initial viscosities. The cured viscosity may be substantially greater than their respective initial viscosities. At least the first curable resin precursor may include a solvent, a reaction catalyst, and a reaction inhibitor effective to chemically interfere with the reaction catalyst, the reaction inhibitor exhibiting a lower vapor pressure than the solvent. In one example, the first curable resin precursor and the second curable resin precursor each include a vinyl-containing silicone polymer and a hydride-containing silicone polymer. The first curable resin precursor may include an excess of one of the vinyl-containing silicone polymer and the hydride-containing silicone polymer, and the second curable resin precursor includes an excess of the other of the vinyl-containing silicone polymer and the hydride-containing silicone polymer.

[0010] A method for forming a thermal interface body may include dispensing a first curable resin precursor in a first pattern of a plurality of discrete volumes on a surface, and dispensing at least one of the first curable resin precursor and a second material in a second pattern of a plurality of discrete volumes on the surface and at least one of the first pattern of discrete volumes. Following dispensing, the method includes curing the first curable resin precursor to adjust its viscosity. The thermal interface body may exhibit a thermal conductivity of at least 0.2 W / m·K.

[0011] A method for filling a gap between an electronic component and a heat sink includes providing a dispenser communicably linked to a processor and specifying, as input parameters, first width, second width, and thickness dimensions of the gap. The input parameters are provided to the processor, and the dispenser incrementally applies a first layer of a first curable resin precursor to a surface associated with at least one of the electronic component and the heat sink based on the input parameters. The first layer preferably exhibits a thermal conductivity of at least 0.2 W / m·K. The dispenser then incrementally applies a second layer of the first curable resin precursor or a second composition in contact with the first layer. The first layer may include a first pattern of multiple discrete volumes of the first curable resin precursor, and the second layer may include a second pattern of multiple discrete volumes.

[0012] The method includes additively constructing a thermal interface body from at least the first pattern and the second pattern to have a first width, a second width, and a thickness dimension, where the thickness dimension can be non-uniform. In some embodiments, the thickness dimension can be less than 100 micrometers across the gap.

[0013] The second layer applied by this method may differ from the first layer by at least one of the following dimensions: thermally conductive particle loading concentration, cure viscosity, initial pre-cure viscosity, average thermally conductive particle size, distribution of thermally conductive particle sizes, cure rate, and thickness.

[0014] The electronic package of the present invention includes an electronic component, a heat sink, and a thermal interface body interposed between and in thermal contact with the electronic component and the heat sink. The thermal interface body is formed from multiple deposited layers, each layer being deposited as an arrangement of multiple discrete volumes of a curable resin precursor and subsequently cured. The thermal interface body exhibits a thermal conductivity of at least 0.2 W / m·K. In some embodiments, the first composition of the first layer is different from the second composition of the second layer of the thermal interface body. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic diagram of a system for forming a thermal interface body according to the present invention. [Figure 2] FIG. 2 is an enlarged cross-sectional view of a thermal surface of an electronic component or heat sink. [Figure 3] FIG. 3 is an enlarged cross-sectional view of a thermal interface body of the present invention having a shape that conforms to a thermal surface. [Figure 4] FIG. 4 is a cross-sectional view of an electronic package of the present invention. [Figure 5] FIG. 5 shows an example of an additive deposition process. [Figure 6] FIG. 6 shows an example of an additive deposition process. [Figure 7] FIG. 7 shows an example of an additive deposition process. [Figure 8] FIG. 8 shows an example of an additive deposition process. [Figure 9] FIG. 8 shows an example of an additive deposition process. [Figure 10] FIG. 10 shows an example of an additive deposition process. DETAILED DESCRIPTION OF THE INVENTION

[0016] The above-listed objects and advantages, together with other objects, features, and advancements represented by the present invention, are presented herein with respect to the detailed embodiments described with reference to the accompanying drawings. Other embodiments and aspects of the present invention will be recognized as being within the purview of those skilled in the art.

[0017] FIG. 1 provides a schematic diagram of an additive deposition system 10, including a dispenser head 12 supplied with material 20 from a reservoir 16 to be deposited on a surface 14. The material 20 is dispensed from an opening 18 in the dispenser head 12. A controller 22 may include a processor 24 and a signal generator 26 and may be programmed to control the dispenser head 12 in dispensing one or more materials 20 in a predetermined pattern on the surface 14. The controller 22 may be programmed to create a three-dimensional thermal interface body through an additive deposition process, and one or more dispenser heads 12 may be controlled to cooperatively each dispense one or more materials 20 to additively build the three-dimensional thermal interface body. It should be understood, therefore, that the dispenser head 12 may represent one or more of an array of individual dispenser heads forming part of the additive deposition system 10, and that the dispenser head 12 and one or more of the surfaces 14 may be movable relative to one another to achieve deposition of the material 20 in a predetermined pattern supported by the surface 14.

[0018] The additive deposition system 10 may include one or more of a variety of deposition devices capable of additive deposition processes. Examples of useful dispensers include nozzle printers, drop dispensers, line dispensers, metered spray heads, venturi printers, and the like.

[0019] The additive deposition system 10 may further include a curing system 30 for providing input for curing the curable material 20. Examples of curing systems include a heating means such as an oven or infrared lamp, an ultraviolet radiation source such as an ultraviolet lamp, a source of a chemical curing agent for application to the material 20, and / or other known means for curing the curable material 20. For purposes of this specification, the term "curing" refers to the change in properties of a resin by a chemical reaction, including condensation or addition, with or without pressure.

[0020] The additive deposition system 10 may be adapted to dispense one or more materials 20 via one or more dispenser heads 12. In some embodiments, a single dispenser head 12 may be adapted to dispense multiple individual materials 20 simultaneously or sequentially. In other embodiments, the additive deposition system 10 may include multiple dispenser heads 12, which may be adapted to dispense a single material 20 simultaneously or sequentially, or multiple materials 20 simultaneously or sequentially.

[0021] The additive deposition system 10 may use one or more materials 20 in an additive deposition process to form a thermal interface body. The material 20 may be a thermoplastic or thermoset polymer and may be selected from a variety of polymers, such as silicones, fluorosilicones, acrylics, thermoplastic elastomers, epoxies, polyesters, polyolefins, polyetheretherketones, polyamides, nylons, polyimides, polyurethanes, and combinations thereof. Silicone resins, such as polysiloxanes / polyorganosiloxanes, have properties of compatibility and other characteristics useful in the thermal interface bodies of the present invention. In some embodiments, the material 20 may be dispensed from the dispenser head 12 in a curable state, and the base polymer resin may be crosslinked or further crosslinked. The crosslinking activity may be initiated spontaneously or upon effective exposure to a curing agent. For purposes of this specification, a "curable resin precursor" includes a dispensable material that may undergo further polymerization, crosslinking, vulcanization, hardening, drying, or other chemical or physical change from its pre-dispensed state. Such materials may be referred to as foam-in-place, where the dispensed material hardens after placement on the thermal path surface. It is contemplated that a combination of foam-in-place and pre-cured materials may be used in the present invention. In some embodiments, each of the materials 20 contributes to the foam-in-place composition and structure. It should be understood that the term "resin" as used herein is intended to include resins, oligomers, prepolymers, elastomers, and other polymers.

[0022] The thermal interface body of the present invention is preferably thermally conductive, exhibiting a thermal conductivity of at least 0.2 W / m·K. Because the thermal conductivity of compatible polymers is relatively low, thermally conductive fillers may be added to the polymer matrix. The thermal conductivity of a filled thermal interface material depends on various factors, including the thermal conductivity of the filler and the filler loading concentration in the polymer matrix, which may be affected by the filler particle size and distribution. The thermally conductive filler may comprise particles of a uniform particle size or particles having a range of particle sizes. The thermally conductive particles may be electrically insulating to maintain electrical resistance properties for the thermal interface body. Examples of electrically insulating, thermally conductive particles suitable for use in the present invention include boron nitride, aluminum oxide, aluminum nitride, magnesium oxide, zinc oxide, silicon carbide, beryllium oxide, aluminum trihydrate, and combinations thereof. In some embodiments, the thermal interface body may preferably shield against electromagnetic interference (EMI), and therefore, electrically and thermally conductive particulate fillers may be used. Examples of conductive particulate fillers include metals such as aluminum, copper, gold, nickel, silver, and combinations thereof. The shape of the thermally conductive filler particles is not particularly limited and may include a single thermally conductive filler or a combination of two or more thermally conductive fillers that differ in at least one property, such as particle shape, average particle size, particle size distribution, and filler type. Particle type, particle size, particle size distribution, loading concentration, and blending can affect thermal transfer, EMI shielding, and viscosity properties.

[0023] Additional fillers and additives, including plasticizers, pigments, surfactants, stabilizers, oxidizers, flame retardants, and spacers, may be included in material 20 to benefit certain chemical and / or physical properties.

[0024] Applicant has determined that the surface of a component to which the thermal interface body is applied may typically be somewhat non-planar and may exhibit peaks and valleys that may deviate from the base plane by 100 micrometers or more. Typical material roughness of a surface may exhibit further variations in the range of approximately 5 to 25 micrometers. Figure 2 shows a hypothetical close-up of a surface 14 of, for example, an electronic component or heat sink. A first variation dimension "a" is defined between the base plane 15 of the surface 14 and the primary peaks 40, and a second variation dimension "b" is defined between the base plane 15 and the primary valleys 42 of the surface 14. Each of the first variation dimension "a" and the second variation dimension "b" may be up to 100 micrometers in some embodiments, and may even be greater in some cases. Furthermore, the roughness 44 on the surface 14 may include secondary peaks 46 and secondary valleys 48. The surface roughness 44 may exhibit variations of up to 25 micrometers or more. To optimize heat transfer from the surface 14 to the thermal interface body, it is desirable to apply a thermal interface body that conforms as closely as possible to the surface 14, including adapting to deviations therein. Figure 3 schematically illustrates a desirable thermal interface body 50 that closely conforms to the surface 14. The additively constructed thermal interface body 50 may be formed into a three-dimensional shape that allows for enhanced conformance to an uneven surface 14.

[0025] FIG. 4 illustrates an exemplary electronic package 80 including a heat-generating electronic component 60 having a first thermal surface 14a and a heat sink 70 having a second thermal surface 14b. A thermal interface body 50 is interposed between and in thermal contact with the first and second thermal surfaces 14a, 14b. The thermal interface body 50 may have an irregular shape to best conform to the contoured and rough first and second thermal surfaces 14a, 14b. The thermal interface body 50 may exhibit an irregular shape at the operating temperature of the electronic component 60 and at temperatures below such operating temperature, including room temperature. In some embodiments, the thermal interface body 50 may be formed in place with an irregular shape that substantially fills the gap between the electronic component 60 and the heat sink 70. Such irregular shapes may be custom fabricated by the additive deposition process of the present invention.

[0026] The gap "G" between the electronic component 60 and the heat sink 70 may be defined by various methods, including three-dimensional optical surface profiling. Information from such measurements, such as width and thickness dimensions, may be provided as input parameters to the controller 22. The controller 22 may be programmed to read the input parameters to generate control output instructions for driving the additive deposition system 10 in a manner that additively builds the thermal interface body 50 in the three-dimensional shape of the gap "G."

[0027] The three-dimensional shape of the thermal interface body may be customized by additively applying thermal interface material in multiple application passes. The thermal interface material applied in any given pass of one or more dispenser heads 12 may be identical, similar, or dissimilar in physical and / or chemical properties. The thermal interface material dispensed in each pass can preferably bond to the thermal interface material dispensed in another pass, so that a coherent thermal interface body 50 may ultimately be constructed by an additive deposition process. Differences between the thermal interface materials applied in different passes of the additive deposition process may include average thermally conductive particle size, thermally conductive particle size distribution, thermally conductive particle loading concentration, cure viscosity, pre-cure viscosity, cure rate, thickness, and composition of excess and limiting reactants. Other chemical and physical differences between the thermal interface material deposits of a given thermal interface body 50 are also contemplated by the present invention.

[0028] The customizable structure of the thermal interface body 50 may also be controlled by dispensing a specified amount in a predetermined pattern, where at least a portion of a first pattern of multiple discrete volumes of thermal interface material may contact at least a portion of a second pattern of deposited thermal interface material, which may be the same, similar, or dissimilar to the thermal interface material deposited in the first pattern of discrete volumes. In some embodiments, the deposited thermal interface material 20 may exhibit predetermined rheological parameters to best address flow requirements in additively building the thermal interface body 50. [Example]

[0029] The following examples represent specific additive deposition techniques for constructing customized shaped thermal interface bodies, however, it is contemplated that many other additive deposition techniques may be utilized within the scope of the present invention.

[0030] Example 1 The first and second curable resin precursors may have different pre-cure viscosities to control the curing and flow patterns. A lower viscosity resin precursor can wet the surface 14, while a higher viscosity resin helps hold the deposited thermal interface material in place before curing. Figure 5 illustrates a multi-pass deposition approach using a first curable resin precursor applied to a surface in a first pattern of multiple discrete volumes, which wet the surface and consolidate into a tacky layer before applying a second curable resin precursor to contact the first pattern. In some embodiments, the second pass may be performed by a second dispenser head, which may alternatively dispense a cured material into contact with the first curable resin precursor. Alternatively, at least a portion of the first curable resin precursor may be cured prior to the second pass applying the second material.

[0031] Example 2 The first and second curable resin precursors may be applied in multiple passes with one or more dispenser heads, with the first and second curable resin precursors exhibiting at least different cured Young's modulus values. Figure 6 illustrates an example of an additive deposition process in which a first material is dispensed onto a surface in a first pattern of multiple discrete volumes, followed by a second material being applied in a second pattern of discrete volumes in contact with the first material. The first and second materials may be cured before or after deposition. The illustrated embodiment shows a curable resin precursor dispensed in a curable state and cured after deposition. The first material may be cured by additively depositing the second material in contact with the first material before or after the second pass. In some embodiments, the first material exhibits a relatively low Young's modulus and the second material exhibits a relatively high Young's modulus, with the first material forming a first compressible layer that can easily conform to the heat transfer surface, and the second layer forming a durable shell over the first layer.

[0032] Example 3 The first and second materials are dispensed in a pattern of multiple discrete volumes, the first and second materials having different thermally conductive particle size distributions. A material with a relatively larger particle size distribution may be applied in the first pattern of discrete volumes to better fill primary valleys on the applicable surface. Optimization of filler packing may be performed to meet thermal conductivity requirements.

[0033] Example 4 7 illustrates the application of multiple thermal interface materials with different thermally conductive filler loading concentrations. In some embodiments, this approach may involve applying a first curable resin precursor and a second curable resin precursor in separate patterns in an additive deposition process.

[0034] Example 5 The first and second curable resin precursors may have various resin compositions with different physical properties, such as adhesion, Young's modulus, and dispensing viscosity. Figure 8 illustrates a first curable resin material deposited on a surface in a first pattern of multiple discrete volumes, followed by a second curable resin precursor applied in a second pattern of discrete volumes in contact with the first material. The first curable resin precursor may be cured before or after applying the second pattern to contact the first material. Similarly, the second curable resin precursor may be applied to contact the first material before or after curing. The illustrated embodiment illustrates a method in which the first and second curable resin precursors are cured after applying the second pattern of discrete volumes to contact the first material.

[0035] Example 6 The thermal interface material may be applied in a sequential pattern of multiple discrete volumes with one or more dispenser heads, with dispensing parameters for and / or during each dispensing pass being different. Possible differences include the speed of the dispenser head, the rate at which the volume is dispensed through the dispenser head's dispensing opening, and differences in material viscosity, which affect the deposition rate. Figure 9 shows an example of an additive deposition process using one or more dispenser heads with different speeds used in the additive deposition process.

[0036] Example 7 Two dispenser heads may be used to dispense the thermally conductive material along substantially mutually perpendicular planes. Figure 10 illustrates the application of a first pattern and a second pattern of multiple discrete volumes along substantially mutually perpendicular planes.

[0037] It should be understood that various patterns may be used to suit a particular application. For example, the topography of a particular surface 14 may be studied through known metrology processes, such as three-dimensional optical scanning, and the appropriate thermal interface body shape may then be mapped. Formation of the thermal interface body may require one or more passes of a dispenser head, including one or more layers of thermal interface material additively deposited in contact with one or more patterns of thermal interface material. It should further be understood that individual patterns or sets of patterns need not occupy similar areas, volumes, or shapes. Instead, a particular pattern of thermal interface material may be applied to selected regions of the thermal interface body. It is also possible to cure only a portion of an applied pattern of thermal interface material before or after applying another pattern of thermal interface material.

[0038] Although the present invention has been described in considerable detail herein to provide those skilled in the art with the necessary information to apply the novel principles, and to make and use the embodiments of the invention as needed, it will be understood that various modifications can be made without departing from the scope of the invention itself. [Explanation of symbols]

[0039] 10 Additive Deposition System 12 Dispenser Head 14 Surface 14a 1st thermal surface 14b 2nd thermal surface 15 Base Plane 16 reservoir 18 Opening 20 materials 22 Controller 24 processors 26 Signal Generator 30 Hardening System 40 Primary mountain 42 Primary Valley 44 Surface roughness 46 Secondary Mountain 48 Secondary Valley 50 Thermal interface unit 60 Electronic Components 70 Heat sink 80 Electronic Package G Gap a First deviation dimension b Second deviation dimension

Claims

1. applying a first material to a surface in a first pattern of a plurality of discrete volumes, the first material comprising a first curable resin precursor, the first curable resin precursor comprising a silicone and exhibiting a first initial viscosity and a thermal conductivity of at least 0.2 W / m·K; and applying at least one of the first curable resin precursor and a second material in a second pattern of discrete volumes in contact with the first material, the second material exhibiting a second viscosity different from the first viscosity and a thermal conductivity of at least 0.2 W / m K; 1. A method for forming a thermal interface body, comprising:

2. The method of claim 1 , wherein the applying is performed with an additively patternable dispenser.

3. 10. The method of claim 1, wherein the first curable resin precursor comprises a first loading concentration of thermally conductive particles and the second material comprises a second loading concentration of thermally conductive particles, the first loading concentration being different from the second loading concentration.

4. 4. The method of claim 3, wherein the first curable resin precursor comprises thermally conductive particles having a range of different particle sizes, the largest particle size being at least 1.3 times larger than the smallest particle size.

5. The method of claim 1 , comprising applying at least the first pattern or the second pattern in spaced-apart discrete volumes.

6. The method of claim 5 , wherein at least a portion of the separate volumes are combined after application.

7. The method of claim 1 , wherein the second material comprises silicone.

8. The method of claim 1 , comprising curing the first curable resin precursor to a cured viscosity substantially higher than the first initial viscosity.

9. 9. The method of claim 8, wherein the first initial viscosity is less than 200,000 cP.

10. The method of claim 9 , comprising curing the second material to a second cured viscosity coefficient substantially greater than the second initial viscosity.

11. 11. The method of claim 10, wherein the second initial viscosity is less than 200,000 cP.

12. 10. The method of claim 1, wherein the first curable resin precursor comprises a solvent, a reaction catalyst, and a reaction inhibitor effective to chemically interfere with the reaction catalyst, the reaction inhibitor having a lower vapor pressure than the solvent, and the second material comprises a second curable resin precursor.

13. 13. The method of claim 12, wherein the first and second curable resin precursors comprise a vinyl-containing silicone polymer and a hydride-containing silicone polymer, respectively.

14. 14. The method of claim 13, wherein the first curable resin precursor comprises an excess of one of a vinyl-containing silicone polymer and a hydride-containing silicone polymer, and the second curable resin precursor comprises an excess of the other of a vinyl-containing silicone polymer and a hydride-containing silicone polymer.

15. The method of claim 12 , comprising removing at least 80% of the solvent in the first curable resin precursor of the first pattern before printing the second pattern.

16. The method of claim 1 , wherein the surface is a heat dissipation surface of an electronic component.

17. The method of claim 16 , wherein the electronic component is a pluggable optical module.

18. dispensing a first curable resin precursor onto a surface in a first pattern of a plurality of discrete volumes; dispensing at least one of the first curable resin precursor and the second curable resin precursor in a second pattern of a plurality of discrete volumes onto at least one of the surface and the first pattern of discrete volumes; After dispensing, curing the first curable resin precursor to adjust the viscosity; 1. A method for forming a thermal interface body, comprising: The method of claim 1, wherein the thermal interface body exhibits a thermal conductivity of at least 0.2 W / m·K.

19. Before curing by crosslinking, the first curable resin precursor is dried to reduce its viscosity to at least 10 ６ 20. The method of claim 18, comprising increasing the saturation of the blood to 1000 cP.

20. providing a dispenser communicatively linked to a processor; defining input parameters including one or more of a first width, a second width, and a thickness dimension of the gap; providing the input parameters to the processor; and Based on the input parameters, (i) a first layer of a first curable resin precursor on a surface associated with at least one of the electronic component and the heat sink, the first layer having a thermal conductivity of at least 0.2 W / m·K; and (ii) a second layer of the first curable resin precursor or second composition in contact with the first layer, additionally applying with said dispenser; 1. A method for filling a gap between an electronic component and a heat sink, comprising:

21. 21. The method of claim 20, wherein the first layer comprises a first pattern of a plurality of discrete volumes of the first curable resin precursor.

22. 22. The method of claim 21, wherein the second layer comprises a second pattern of a plurality of discrete volumes.

23. 23. The method of claim 22, wherein the second composition comprises a second curable resin precursor having a thermal conductivity of at least 0.2 W / m·K.

24. 21. The method of claim 20, wherein the dispenser is an additively patternable dispenser.

25. 21. The method of claim 20, comprising additively constructing a thermal interface body having dimensions of the first width, the second width, and the thickness from at least the first pattern and the second pattern.

26. 26. The method of claim 25, wherein the thickness dimension is non-uniform.

27. 27. The method of claim 26, wherein the thickness dimension is less than 100 micrometers across the gap.

28. 26. The method of claim 25, wherein the thermal interface body has a thermal conductivity of at least 0.2 W / m·K.

29. 21. The method of claim 20, wherein each of the first and second layers comprises thermally conductive particles.

30. 30. The method of claim 29, wherein each of the first and second layers exhibits an initial pre-cure viscosity and a cured viscosity that is greater than the pre-cure viscosity.

31. 31. The method of claim 30, wherein the second layer differs from the first layer by at least one of thermally conductive particle loading level, cure viscosity, initial pre-cure viscosity, average thermally conductive particle size, thermally conductive particle size distribution, cure rate, and thickness dimension.

32. 21. The method of claim 20, comprising defining the first width, the second width, and the thickness dimensions using optical surface profiling.

33. Electronic components, a heat sink, and a thermal interface body inserted between the electronic component and the heat sink to be in thermal contact with the electronic component; 1. An electronic package comprising: the thermal interface body is formed from a plurality of dispensed layers, each layer being dispensed as an array of multiple individual volumes of a curable resin precursor and subsequently cured; The electronic package, wherein the thermal interface body exhibits a thermal conductivity of at least 0.2 W / m·K.

34. 34. The electronic package of claim 33, wherein at least one of the layers comprises a silicone matrix and thermally conductive particles dispersed therein.

35. 35. The electronic package of claim 34, wherein the first composition of the first printed layer is different from the second composition of the second layer.

36. 36. The electronic package of claim 35, wherein the first composition exhibits a higher Young's modulus than the second composition.

37. 34. The electronic package of claim 33, wherein the electronic component comprises a battery.

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