Cleaning device, processing system, and cleaning method

Abstract

To provide a new workpiece cleaning technique capable of cleaning a holding surface side.SOLUTION: A cleaning unit 8 includes: a holding surface 84 smaller than a workpiece 10 that holds a surface 12 that is a first surface of the workpiece 10; a rotation mechanism 82 that supports and rotates the holding surface 84; a protrusion 85 that is disposed closer to a rotation mechanism 82 side than the holding surface 84 and being formed to protrude outward from the holding surface 84; and a nozzle 87 that supplies a cleaning fluid 201 toward the protrusion 85. The cleaning unit 8 cleans an outer edge of the surface 12 of the workpiece 10 with the cleaning fluid 201 supplied from the nozzle 87 that enters between the protrusion 85 and the surface 12 of the workpiece 10 exposed from the holding surface 84.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a cleaning apparatus, a processing system including the same, and a cleaning method. [Background technology]

[0002] Conventionally, there have been known cleaning devices that clean workpieces that have been processed, coated with a protective film, etc. As described in Patent Documents 1 and 2, for example, a typical cleaning device is configured to hold one surface of the workpiece on a holding table and supply a cleaning fluid to the other exposed surface to clean it.

[0003] However, in the vicinity of the outer edge of the workpiece, contamination often adheres to the side held by the holding table during pre-cleaning and cleaning processes. Technologies related to such technical issues are described, for example, in Patent Documents 3 and 4. Patent Document 3 describes a configuration in which a fluid is supplied toward the outer edge of the workpiece from a nozzle provided below the holding surface. Furthermore, Patent Document 4 describes a configuration in which a fluid is supplied toward the back surface of the workpiece from a nozzle provided below the holding surface. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-038991 [Patent Document 2] Japanese Patent Application Laid-Open No. 2007-201178 [Patent Document 3] Japanese Patent Application Laid-Open No. 2013-125872 [Patent Document 4] Japanese Patent Application Laid-Open No. 2012-064872 Summary of the Invention [Problem to be solved by the invention]

[0005] The above-described configuration in which the nozzle is provided below the holding surface in the cleaning device is subject to structural restrictions due to the limited space in the cleaning device, and is not necessarily easy to design.

[0006] The present invention has been made in view of the above points, and aims to provide a new workpiece washing technique that enables washing of the holding surface side. [Means for solving the problem]

[0007] A cleaning device according to one embodiment of the present invention comprises a holding surface smaller than the workpiece that holds a first surface of the workpiece, a rotation mechanism that supports and rotates the holding surface, a protrusion that is positioned closer to the rotation mechanism than the holding surface and protrudes outward from the holding surface, and a nozzle that supplies cleaning fluid toward the protrusion, and the cleaning fluid supplied from the nozzle penetrates between the protrusion and the first surface of the workpiece exposed from the holding surface to clean the outer edge of the first surface of the workpiece.

[0008] A processing system according to one embodiment of the present invention comprises the cleaning device described in the above embodiment, a coating unit having a second holding surface that is smaller than the workpiece and holds the first surface of the workpiece, the coating unit supplying a coating agent to the second surface of the workpiece held on the second holding surface and coating the second surface of the workpiece, and a processing unit that processes the workpiece whose second surface has been coated by the coating unit, wherein the cleaning device cleans the workpiece after it has been processed in the processing unit, and the holding surface of the cleaning device is smaller than the second holding surface of the coating unit.

[0009] A cleaning method according to one embodiment of the present invention is a method for cleaning a workpiece using the cleaning device described in claim 1, and includes a holding step for holding the first surface of the workpiece on the holding surface, and an outer edge cleaning step for supplying the cleaning fluid from the nozzle to the protrusion to clean the outer edge of the first surface of the workpiece exposed from the holding surface. [Effects of the Invention]

[0010] According to the present invention, a new workpiece washing technique that allows washing of the holding surface side can be provided. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a perspective view of a laser processing apparatus according to an embodiment. [Figure 2] FIG. 2 is a diagram illustrating the configuration of a covering unit. [Figure 3] 10A and 10B are diagrams illustrating the configuration of an edge clamp type transport unit. [Figure 4] 10A and 10B are diagrams illustrating surface cleaning by a cleaning unit. [Figure 5] 10A and 10B are diagrams illustrating rear surface cleaning by a cleaning unit. [Figure 6] 10A and 10B are diagrams illustrating an example of movement of a nozzle in a cleaning unit. [Figure 7] 10A and 10B are diagrams illustrating a modified example of back surface cleaning by the cleaning unit. DETAILED DESCRIPTION OF THE INVENTION

[0012] Fig. 1 is a perspective view of a laser processing apparatus 1 according to one embodiment. Fig. 2 is a diagram illustrating the configuration of a coating unit 7 provided in the laser processing apparatus 1. Fig. 3 is a diagram illustrating the configuration of an edge clamp type transport unit 17 provided in the laser processing apparatus 1. The laser processing apparatus 1 will be described below with reference to Figs. 1 to 3.

[0013] The laser processing device 1 shown in Figure 1 is a processing system that processes a workpiece 10. The laser processing device 1 processes the workpiece 10 taken out of a cassette 9 with a laser unit 4 and stores the processed workpiece 10 in the cassette 9. Note that the X-axis and Y-axis directions shown in Figure 1 are horizontal directions, and the X-axis and Y-axis directions are perpendicular to each other. The Z-axis direction is vertical.

[0014] The workpiece 10 to be processed by the laser processing device 1 is a disk-shaped wafer made of a material such as silicon, sapphire, or gallium, and is a wafer on which electronic devices are formed in areas partitioned by a plurality of planned dividing lines formed in a grid pattern.

[0015] The type, material, and shape of the workpiece 10 are not particularly limited. For example, the workpiece 10 may be a rectangular package substrate. Furthermore, the workpiece 10 is not limited to a wafer or package substrate on which an electronic device is formed, but may also be a wafer before a device is formed, or any other substrate or plate material.

[0016] As shown in FIG. 1, the laser processing apparatus 1 includes a substantially rectangular parallelepiped housing 2, a chuck table 3, a laser unit 4, an imaging unit 5, a display 6, a coating unit 7, a cleaning unit 8, a lifting stage 13, a temporary placement table 15, a plurality of transport units (transport unit 14, transport unit 16, transport unit 17), and a control unit 20.

[0017] The chuck table 3 is a table that holds the workpiece 10 and is used when the workpiece 10 is processed by the laser unit 4. The chuck table 3 includes a support base 31 and a suction chuck 32 fixed to the support base 31. The support base 31 is configured to be rotatable about a rotation axis in the Z-axis direction by a rotation mechanism (not shown). The suction chuck 32 is made of a porous material such as porous ceramics, and has a suction holding surface that holds the workpiece 10 by suction.

[0018] The chuck table 3 has a flow path formed from a suction source (not shown) to the underside of the suction chuck 32. By operating the suction source, the chuck table 3 can apply a suction force to the suction holding surface via the suction chuck 32. The chuck table 3 holds the workpiece 10 by sucking the workpiece 10 placed on the suction holding surface.

[0019] The chuck table 3 freely changes the orientation of the workpiece 10 by rotating the support base 31 using a rotation mechanism. Furthermore, the chuck table 3 moves in the X-axis direction and the Y-axis direction using a movement mechanism (not shown). Specifically, by moving in the X-axis direction, the chuck table 3 moves back and forth between at least a carry-in / out position for transferring the workpiece 10 to and from the transport unit 17, an imaging position for imaging the workpiece 10 with the imaging unit 5, and a processing position for processing the workpiece 10 with the laser unit 4. Furthermore, by moving in the Y-axis direction, the chuck table 3 moves the position on the workpiece 10 where the laser light is irradiated in the Y-axis direction.

[0020] 1 shows a circular suction chuck 32, but the shape of the suction chuck of the chuck table 3 is not limited to a circular shape. For example, a rectangular suction chuck may also be used.

[0021] The laser unit 4 is an example of a processing unit that processes the workpiece 10. The laser unit 4 includes a casing 41 and a condenser 42, and processes the workpiece 10 by condensing laser light from a pulse laser oscillator (not shown) housed in the casing 41 with the condenser 42 and irradiating the workpiece 10 held on the chuck table 3 with the laser light. The laser unit 4 forms a cutting groove along a planned dividing line of the workpiece 10, for example.

[0022] The imaging unit 5 is a unit that captures an image of the workpiece 10. The imaging unit 5 is equipped with an imaging optical system and an imaging element. An image signal of the workpiece 10 captured by the imaging unit 5 is sent to the control unit 20. The control unit 20 processes the image signal sent from the imaging unit 5 to generate image data. The control unit 20 controls the operation of the laser processing apparatus 1 by referring to the image information in the image data. For example, the control unit 20 may adjust the relative positional relationship between the workpiece 10 and the laser unit 4 based on the image information acquired before laser processing so that the laser light is irradiated onto the planned division line.

[0023] The display 6 is a display device such as a liquid crystal display, and displays any information to provide to the operator of the laser processing device 1. For example, the display 6 may display an image of the workpiece 10 captured by the imaging unit 5, allowing the operator to check the state of the workpiece 10 before or after processing.

[0024] The coating unit 7 is a unit that coats the workpiece 10 with a protective film. As shown in FIG. 2, the coating unit 7 includes, within a main body 71, a spinner table 73 having a holding surface 74 that holds the surface 12 of the workpiece 10, a nozzle 76 that supplies liquid resin 101, which is a coating agent, to the workpiece 10 held on the spinner table 73, and a rotation mechanism (rotation mechanism 72, rotation mechanism 75). The spinner table 73 and the nozzle 76 are configured to be freely rotatable by the rotation mechanism 72 and the rotation mechanism 75, respectively. The holding surface 74 is a suction holding surface that suction-holds the workpiece 10 using negative pressure generated by the suction action of a suction source (not shown).

[0025] The coating unit 7 supplies liquid resin 101 by dropping it from a nozzle 76 onto the upper surface (surface 11) of the workpiece 10 while rotating the workpiece 10 held by a spinner table 73 with a rotation mechanism 72. The liquid resin 101 dropped onto the upper surface (surface 11) of the workpiece 10 spreads over the upper surface (surface 11) of the workpiece 10 due to centrifugal force, thereby forming a protective film 100 that covers the workpiece 10.

[0026] The liquid resin 101 supplied by the coating unit 7 is a water-soluble resin, and the protective film 100 is formed by hardening the liquid resin 101. That is, the coating unit 7 supplies the liquid resin 101 to the upper surface (surface 11) of the workpiece 10 held on the holding surface 74, and coats the upper surface (surface 11) of the workpiece 10. Furthermore, the holding surface 74 of the spinner table 73 has a smaller diameter (diameter DA) than the workpiece 10. Therefore, in the coating unit 7, the workpiece 10 is held on the spinner table 73 with a portion of the workpiece 10 extending beyond the holding surface of the spinner table 73.

[0027] The cleaning unit 8 is a cleaning device that cleans the workpiece 10. The cleaning unit 8 includes a spinner table that holds the workpiece 10 and a nozzle that supplies cleaning fluid to the workpiece 10 held on the spinner table. The cleaning unit 8 cleans the workpiece 10 by supplying cleaning fluid from the nozzle to the workpiece 10 while rotating the workpiece 10 held on the spinner table. The cleaning unit 8 is configured to be able to clean the outer edge of the back surface of the workpiece 10. This will be described in detail later.

[0028] The cleaning fluid supplied from the cleaning unit 8 is not particularly limited, but may be, for example, water. The cleaning fluid may be a mixture of two fluids, water and air. Furthermore, the cleaning unit 8 may be provided with a nozzle for supplying air in addition to a nozzle for supplying the cleaning fluid. The cleaning unit 8 may supply air to the cleaned workpiece 10 to promote drying of the workpiece 10 after cleaning.

[0029] The cassette 9 has a plurality of storage sections in the Z-axis direction for storing the workpieces 10. The cassette 9 has an opening for loading and unloading the workpieces 10 into the storage sections, and is placed on the lifting stage 13 with the opening facing the transport unit 14 described below. In the laser processing apparatus 1, the lifting stage 13 is raised and lowered to move the cassette 9 in the Z-axis direction relative to the transport unit 14, thereby allowing any workpiece 10 stored in the cassette 9 to be loaded or unloaded by the transport unit 14.

[0030] The temporary placement table 15 is a temporary placement section on which the workpiece 10 to be carried in or out of the cassette 9 is temporarily placed, and is provided with a pair of guide rails arranged along the Y-axis direction. The distance between the pair of guide rails can be adjusted by an adjustment mechanism (not shown), and when the workpiece 10 is placed, the distance is adjusted according to the size (diameter, size) of the workpiece 10.

[0031] The transport unit 14 is a unit that transports the workpiece 10 within the laser processing device 1. The transport unit 14 has a clamping section that clamps one end of the workpiece 10, and is configured to transport the workpiece 10 between the cassette 9 and the temporary placement table 15 by moving the clamping section with the workpiece 10 clamped.

[0032] The transport unit 16 is a unit that transports the workpiece 10 within the laser processing apparatus 1. The transport unit 16 has a transport arm 161 and a shaft 162 that rotates the transport arm 161. The transport arm 161 is provided with a pair of clamps 163 that clamp both ends of the workpiece 10, for example, as shown in FIG. 3. With the workpiece 10 clamped by the pair of clamps 163, the transport unit 16 rotates the shaft 162 to move the transport arm 161, thereby transporting the workpiece 10 from the temporary placement table 15 to the coating unit 7 and from the cleaning unit 8 to the temporary placement table 15.

[0033] The transport unit 17 is a unit that transports the workpiece 10 within the laser processing apparatus 1. The transport unit 17 has a transport arm 171 and a shaft 172 that rotates the transport arm 171. The transport arm 171 is provided with a suction pad that holds the workpiece 10 by suction. The transport unit 17 transports the workpiece 10 from the coating unit 7 to the chuck table 3, and from the chuck table 3 to the cleaning unit 8, by rotating the shaft 172 and moving the transport arm 171 while the workpiece 10 is held by suction on the suction pad.

[0034] The control unit 20 controls each part of the laser processing apparatus 1 to cause the laser processing apparatus 1 to perform processing operations, cleaning operations, etc. The control unit 20 is a computer having an arithmetic processing device such as a CPU (Central Processing Unit), a storage device such as a ROM (Read Only Memory) or RAM (Random Access Memory), and an input / output interface connected to each part of the laser processing apparatus 1. The arithmetic processing device of the control unit 20 performs arithmetic processing in accordance with a program stored in the storage device, and outputs control signals for controlling the laser processing apparatus 1 to each part of the laser processing apparatus 1 via the input / output interface. In addition, signals detected in each part of the laser processing apparatus 1 are input to the control unit 20 via the input / output interface.

[0035] In the laser processing apparatus 1 configured as described above, to prevent debris generated during laser processing from adhering to the device surface of the workpiece 10, the coating unit 7 coats the workpiece 10 with a protective film 100, and then the laser unit 4 forms a cutting groove in the workpiece 10. Thereafter, the laser processing apparatus 1 cleans the workpiece 10 processed by the laser unit 4 in the cleaning unit 8, removing the debris along with the protective film. That is, in the laser processing apparatus 1, the laser unit 4 processes the workpiece 10 whose surface 11 has been coated by the coating unit 7, and the cleaning unit 8 cleans the workpiece 10 after it has been processed by the laser unit 4.

[0036] More specifically, in the laser processing apparatus 1, first, the transport unit 14 takes out the workpiece 10 from the cassette 9 and places it on the temporary placement table 15. The workpiece 10 placed on the temporary placement table 15 is transported by the transport unit 16 to the coating unit 7. In the coating unit 7, the workpiece 10 is coated with a protective film 100, and then the workpiece 10 is transported by the transport unit 17 to the chuck table 3. After receiving the workpiece 10 from the transport unit 17, the chuck table 3 moves the workpiece 10 to directly below the laser unit 4.

[0037] The workpiece 10, which has been moved to a position directly below the laser unit 4, is machined by the laser unit 4. The machined workpiece 10 is again moved by the chuck table 3 to the loading / unloading position, and is transported from the loading / unloading position to the cleaning unit 8 by the transport unit 17. In the cleaning unit 8, the workpiece 10 is cleaned with cleaning fluid. After cleaning, the workpiece 10 is transported by the transport unit 16 to the temporary storage table 15, and then stored in the cassette 9 by the transport unit 14.

[0038] Incidentally, when an edge-clamp type transport unit 16 as shown in FIG. 3 is used, it is desirable that the diameters of the source and destination tables be smaller than the diameter of the workpiece 10. This is because if the diameter of the table is larger than the diameter of the workpiece 10, it is difficult to clamp the edge of the workpiece 10 while it is held on the table. Also, for tables that rotate at relatively high speeds, such as spinner tables, a small diameter is desirable to keep the moment of inertia low. For these reasons, tables with a diameter smaller than the workpiece 10 are often used in processing devices. Even in the laser processing device 1, the coating unit 7 and cleaning unit 8 have tables (spinner table 73, spinner table 83) with a diameter smaller than the workpiece 10.

[0039] However, when a table with a small diameter is used, the back surface of the workpiece 10 is easily soiled. This is because when the workpiece 10 is held by the holding surface, part of the workpiece 10 protrudes from the table, and in addition to the front surface of the workpiece 10, part of the back surface (the surface held by the holding surface) is exposed.

[0040] Here, the back surface refers to the surface of the workpiece 10 that is held by the holding surface of the table, and in the example shown in Fig. 2, it is surface 12 that is held by holding surface 74. The front surface refers to the surface of the workpiece 10 that is opposite to the surface that is held by the holding surface, and in the example shown in Fig. 2, it is surface 11 that is the surface opposite to surface 12 that is held by holding surface 74.

[0041] 2, if the diameter of the spinner table 73 of the coating unit 7 is smaller than that of the workpiece 10, the liquid resin 101 that spreads on the surface 11 will reach the surface 12 via the outer periphery. As a result, the protective film 100 will be formed not only on the surface (surface 11) of the workpiece 10, but also on the outer periphery and back surface (surface 12) of the workpiece 10.

[0042] In consideration of this situation, the cleaning unit 8 of the laser processing apparatus 1 has a function of cleaning the back surface of the workpiece 10 to remove dirt adhering to the back surface and the protective film 100 formed on the back surface. FIG. 4 is a diagram illustrating front surface cleaning by the cleaning unit. FIG. 5 is a diagram illustrating back surface cleaning by the cleaning unit. FIG. 6 is a diagram illustrating an example of nozzle movement in the cleaning unit. The cleaning unit 8 will be described in detail below with reference to FIGS. 4 to 6.

[0043] 4 and 5, the cleaning unit 8 includes a main body 81 equipped with a rotation mechanism 82, a spinner table 83, a rotation mechanism 86, and a nozzle 87. The rotation mechanism 82 rotates the spinner table 83 and supports and rotates the holding surface 84. The rotation mechanism 86 rotates the nozzle 87.

[0044] The spinner table 83 has a holding surface 84 that holds a surface 12 of the workpiece 10, and a protrusion 85 that is arranged closer to the rotation mechanism 82 than the holding surface 84. Note that the surface 12 is an example of a first surface of the workpiece 10. The holding surface 84 is smaller than the workpiece 10 and also smaller than the holding surface 74 (second holding surface) of the spinner table 73 of the coating unit 7. More specifically, the diameter DB of the holding surface 84 is smaller than the diameter of the workpiece 10 and smaller than the diameter DA of the holding surface 74 of the spinner table 73.

[0045] The protrusion 85 is formed to protrude outward from the holding surface 84. More specifically, the protrusion 85 has a flange structure that protrudes from the side surface of the spinner table 83, which has a holding surface 84 smaller than the workpiece 10, toward the outside of the workpiece 10, and protrudes beyond the outside of the workpiece 10. The nozzle 87 supplies the cleaning fluid 201 to the workpiece 10.

[0046] 4 and 5, in the cleaning unit 8 configured as above, when the workpiece 10 is held on the holding surface 84, a recess is formed between the workpiece 10 and the protruding portion 85 by the side surface of the spinner table 83, the upper surface of the protruding portion 85, and the surface 12 of the workpiece 10 that protrudes from the holding surface 84. The cleaning unit 8 uses this recess to clean the back surface (surface 12) of the workpiece 10.

[0047] When cleaning the surface 11 of the workpiece 10, the cleaning unit 8 positions the nozzle 87 above the workpiece 10 being rotated by the rotation mechanism 82, as shown in Fig. 4. Then, the cleaning unit 8 supplies cleaning fluid 201 from the tip 871 of the nozzle 87 toward the surface 11 of the workpiece 10. More specifically, as shown by arrow AA in Fig. 6, the cleaning unit 8 cleans the surface 11 of the workpiece 10 by supplying the cleaning fluid 201 toward the surface 11 of the rotating workpiece 10 while moving the tip 871 of the nozzle 87 back and forth between the center and the outer edge of the workpiece 10 using the rotation mechanism 86.

[0048] On the other hand, when cleaning the surface 12 of the workpiece 10, the cleaning unit 8 positions the nozzle 87 above the protrusion 85 of the spinner table 83 by the rotation mechanism 86, as shown in Fig. 5. More specifically, to prevent the workpiece 10 from interfering with the supply of cleaning fluid 201 to the protrusion 85, the tip 871 is positioned outside the workpiece 10 and above the protrusion 85, as indicated by arrow AB in Fig. 6. Thereafter, the cleaning unit 8 supplies cleaning fluid 201 from the tip 871 of the nozzle 87 toward the protrusion 85.

[0049] 5, the cleaning fluid 201 is supplied, so that the cleaning fluid 201 penetrates into the recess (i.e., between the protrusion 85 and the surface 12 of the workpiece 10 exposed from the holding surface 84). When the cleaning fluid 201 is supplied at a sufficient flow rate, the workpiece 10 and the protrusion 85 rotate relative to the nozzle 87 with the recess filled with the cleaning fluid 201, as shown in FIG. 5, and the cleaning fluid 201 that has penetrated into the recess cleans the outer edge of the surface 12 exposed from the holding surface 84. Furthermore, depending on the flow rate of the cleaning fluid 201, the outer peripheral surface of the workpiece 10 (the edge portion connecting the surface 11 and the surface 12) may also be cleaned.

[0050] In this specification, the outer edge (or outer edge portion) of a surface refers to a portion different from the center of the surface, a peripheral portion of the surface that has a certain width and includes the contour line of the surface. Therefore, if a surface is circular, such as surface 12, the outer edge (or outer edge portion) of the surface has a ring shape with a certain width. Also, in this specification, the outer edge (or outer edge portion) of a plate-like member such as workpiece 10 includes the outer edge of the flat surface of the plate-like member and the outer peripheral surface connecting the flat surfaces of the plate-like member. Therefore, in the case of workpiece 10, for example, the outer edge of surface 11, the outer edge of surface 12, and the outer peripheral surface connecting surfaces 11 and 12 each correspond to the outer edge of workpiece 10.

[0051] As described above, the cleaning method performed by the cleaning unit 8 includes a holding step in which the surface 12 of the workpiece 10 is held on the holding surface 84, and an outer edge cleaning step in which cleaning fluid is supplied from the nozzle 87 to the protrusion 85 to clean the outer edge of the surface 12 of the workpiece 10 exposed from the holding surface 84. Furthermore, according to the cleaning unit 8 and its cleaning method, the back surface of the workpiece 10 (the surface on the holding surface side) can also be cleaned using the nozzle 87 that is used to clean the front surface of the workpiece 10. Therefore, it is possible to clean the back surface without adding a new nozzle as in the prior art, and it is possible to clean the back surface while avoiding excessive design changes and complexities in the device structure.

[0052] Furthermore, by utilizing the existing cleaning unit configuration of a holding surface 84 that is smaller than the workpiece 10, the cleaning unit 8 is able to clean the back surface simply by providing a protrusion 85 on the spinner table 83. Therefore, a cleaning unit 8 that is capable of cleaning the back surface can be realized without requiring major design changes.

[0053] Furthermore, the cleaning unit 8 is configured so that the diameter DB of the holding surface 84 is smaller than the diameter DA of the holding surface 74 of the covering unit 7. This allows the entire protective film 100 formed around the rear surface by the covering unit 7 to be exposed in the cleaning unit 8. Therefore, the protective film 100 can be removed without omission by the cleaning unit 8.

[0054] It is desirable that the difference between the diameter DB of holding surface 84 and the diameter DA of holding surface 74 be sufficiently larger than the positioning error allowed by the transport unit, and that the diameter DB of holding surface 84 be smaller than the diameter DA of holding surface 74 by at least twice the positioning error. For example, if a positioning error of approximately 2 mm to 3 mm is allowed, it is sufficient that the diameter DB of holding surface 84 be at least 6 mm smaller than the diameter DA of holding surface 74. By making the diameter DB of holding surface 84 smaller than the diameter DA of holding surface 74 by at least twice the positioning error, it is possible to remove all of the protective film 100 on the back surface even if an error occurs within the range of the positioning error during transport.

[0055] The embodiments of the present invention are not limited to the above-described embodiments, and may be variously modified, substituted, or altered without departing from the spirit and scope of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of the present invention.

[0056] In the above-described embodiment, an example has been shown in which the recess is filled with the cleaning fluid 201, but the recess does not necessarily have to be filled with the cleaning fluid 201. It is sufficient if the cleaning fluid 201 can remove dirt and the protective film 100 by contacting the surface 12. Therefore, for example, as shown in FIG. 7 , the cleaning fluid 201 may bounce off the protrusion 85 and hit the surface 12, thereby removing dirt and the like from the surface 12.

[0057] In the above-described embodiment, the protrusion 85 extends horizontally from the side surface of the spinner table 83. However, the shape of the protrusion 85 is not limited to this example. The protrusion 85 may have any shape that allows the cleaning fluid 201 to easily penetrate between the protrusion 85 and the surface 12. For example, the protrusion 85 may be formed with an inclination such that the tip side of the protrusion 85 is higher, or a rib (standing portion) may be provided at the tip of the protrusion 85, so that the cleaning fluid 201 can easily accumulate between the protrusion 85 and the surface 12.

[0058] In the above-described embodiment, an example was shown in which the shape of the holding surface 84 was circular, but the shape of the holding surface 84 is not limited to circular. The holding surface 84 only needs to be smaller than the workpiece 10 so that a portion of the workpiece 10 held on the holding surface 84 can protrude from the holding surface 84. This leaves a portion of the surface held by the workpiece 10 exposed, making it possible to clean it in the cleaning unit 8.

[0059] In the above-described embodiment, an example has been shown in which the front surface (surface 11) and back surface (surface 12) of the workpiece 10 are cleaned using the same nozzle, but multiple cleaning nozzles may be provided and the front surface and back surface of the workpiece 10 may be cleaned using separate cleaning nozzles. Cleaning the front surface and back surface with separate nozzles makes it possible to clean the front surface and back surface in parallel.

[0060] In the above-described embodiment, an example was shown in which the holding surface 84 faces vertically upward, but the orientation of the holding surface 84 is not particularly limited as long as the protrusion 85 is disposed so as to face the surface 12 exposed from the holding surface 84. For example, the holding surface 84 may face vertically downward or horizontally.

[0061] In the above-described embodiment, the laser unit 4 is exemplified as a processing unit, but the processing unit is not limited to the laser unit 4. The processing unit may be any processing unit such as a cutting unit, a grinding unit, or a polishing unit.

[0062] In the above-described embodiment, a laser processing apparatus 1 having a laser unit 4, a coating unit 7, and a cleaning unit 8 in a single housing is exemplified, but a processing system for processing a workpiece 10 may also include these units distributed as separate devices. [Industrial Applicability]

[0063] As described above, the cleaning device, processing system, and cleaning method of the present invention can clean the back surface of the workpiece 10. This makes it possible to remove dirt and the like that cannot be removed by cleaning only the front surface, which is useful. [Explanation of symbols]

[0064] 1: Laser processing equipment 3: Chuck table 4: Laser unit 7: Covering unit 8: Cleaning unit 10: Work 11, 12: Surface 16: Transport unit 72, 75, 82, 86: Rotation mechanism 73, 83: Spinner table 74, 84: Holding surface 76, 87: Nozzle 85:Protrusion 100: Protective film 101: Liquid resin 161:Transport arm 163: Clamp 201: Cleaning fluid

Claims

1. A cleaning device comprising: a holding surface that is smaller than the workpiece and that holds a first surface of the workpiece; a rotation mechanism that supports and rotates the holding surface; a protrusion disposed on the rotation mechanism side of the holding surface and protruding outward from the holding surface; a nozzle for supplying a cleaning fluid toward the protrusion, The outer edge of the first surface of the workpiece is cleaned by the cleaning fluid supplied from the nozzle that penetrates between the protrusion and the first surface of the workpiece exposed from the holding surface. A cleaning device characterized by:

2. The cleaning device according to claim 1 ; a coating unit having a second holding surface that is smaller than the workpiece and holds the first surface of the workpiece, the coating unit supplying a coating agent to the second surface of the workpiece held on the second holding surface to coat the second surface of the workpiece; a processing unit that processes the workpiece having the second surface coated by the coating unit, The cleaning device cleans the workpiece after it has been processed in the processing unit, The holding surface of the cleaning device is smaller than the second holding surface of the coating unit. A processing system comprising:

3. A method for cleaning a workpiece using the cleaning device according to claim 1, a holding step of holding the first surface of the workpiece on the holding surface; an outer edge cleaning step of supplying the cleaning fluid from the nozzle to the protrusion to clean the outer edge of the first surface of the workpiece exposed from the holding surface. A cleaning method characterized by:

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