Method for manufacturing electronic unit, substrate and electronic unit

Abstract

To enable positioning of a substrate relative to a housing without reducing the mounting area for electronic components in an electronic unit having the substrate and the housing.SOLUTION: In a method for manufacturing an electronic unit, a substrate 4 has a substrate body 4a capable of mounting electronic components 5 and a positioning portion 4b connected to the outer edge 4a1 of the substrate body 4a, and by attaching the positioning portion 4b to a mounting portion 3d of a housing 3, the substrate 4 is positioned relative to the housing 3.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing an electronic unit, a substrate, and an electronic unit. [Background technology]

[0002] For example, Patent Document 1 discloses a COF substrate in which a substrate attachment portion is integrally connected to a substrate main body. In the COF substrate disclosed in Patent Document 1, the substrate attachment portion has a lead wiring portion and a disposable substrate. Reference holes for positioning are drilled in the disposable substrate. In Patent Document 1, the COF substrate is positioned on a component mounting stage via the reference holes in the disposable substrate, and after electronic components are mounted, the COF substrate is positioned on a substrate punching stage via the reference holes, and the disposable substrate is punched out, thereby manufacturing the COF substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-261497 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, an electronic unit such as an ECU (Electronic Control Unit) installed in a vehicle includes a substrate on which electronic components are mounted and a housing to which the substrate is fixed. Such a substrate is provided with a plurality of positioning holes for positioning, and when assembling the electronic unit, positioning pins provided on the housing are inserted into the positioning holes in the substrate. This positions the substrate relative to the housing. The substrate is then fixed to the housing with screws or the like. However, providing positioning holes in the substrate reduces the mounting area for electronic components. For example, even when a throwaway substrate is provided on the substrate as in Patent Document 1, the mounting area for electronic components is reduced by the amount of the throwaway substrate.

[0005] The present invention has been made in consideration of the above-mentioned problems, and aims to make it possible to position the board relative to the housing in an electronic unit having a board and a housing without reducing the mounting area of the electronic components. [Means for solving the problem]

[0006] The present invention employs the following configuration as a means for solving the above problems.

[0007] A first aspect of the present invention is a method for manufacturing an electronic unit having a substrate on which electronic components can be mounted and a housing to which the substrate is fixed, and includes a substrate formation process for forming the substrate having a substrate main body on which the electronic components can be mounted and a positioning piece connected to the outer edge of the substrate main body, a housing formation process for forming the housing having an attachment portion to which the positioning piece is attached, which positions the substrate, a substrate placement process for positioning the substrate relative to the housing by attaching the positioning piece to the attachment portion, and a fixing process for fixing the substrate positioned in the substrate placement process to the housing.

[0008] A second aspect of the present invention employs a configuration in which a substrate is fixed to a housing of an electronic unit and has a substrate body on which electronic components can be mounted, and a positioning piece that is formed and connected to the outer edge of the substrate body and that can be attached to an attachment portion of the housing to position the substrate relative to the housing.

[0009] A third aspect of the present invention is an electronic unit that employs a configuration including the substrate of the second aspect of the present invention and a housing to which the substrate is fixed. [Effects of the Invention]

[0010] In the present invention, a positioning piece is provided on the board, separate from the board body on which electronic components can be mounted. Furthermore, the board is positioned relative to the housing by attaching this positioning piece to a mounting portion of the housing. Therefore, the present invention allows the board to be positioned relative to the housing without reducing the mounting area for electronic components. In other words, the present invention allows the board to be positioned relative to the housing in an electronic unit having a board and a housing without reducing the mounting area for electronic components. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic top view showing a schematic configuration of an electronic unit according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a schematic top view of an electronic board unit included in the electronic unit according to the first embodiment of the present invention. [Figure 3] 1 is a schematic top view of a housing provided in an electronic unit according to a first embodiment of the present invention. [Figure 4] 5 is a flowchart illustrating a method for manufacturing an electronic unit according to the first embodiment of the present invention. [Figure 5] FIG. 10 is a schematic top view of an electronic board unit included in an electronic unit according to a second embodiment of the present invention. [Figure 6] FIG. 10 is a schematic top view of a housing provided in an electronic unit according to a second embodiment of the present invention. [Figure 7] FIG. 11 is a schematic top view of an electronic board unit included in an electronic unit according to a third embodiment of the present invention. [Figure 8] FIG. 11 is a schematic top view of a housing provided in an electronic unit according to a third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing an electronic unit, a substrate, and an electronic unit according to the present invention will be described below with reference to the drawings.

[0013] (First embodiment) 1 is a schematic top view showing the general configuration of an electronic unit 1 of this embodiment. The electronic unit 1 of this embodiment is used, for example, as an ECU mounted on a vehicle to control a vehicle system.

[0014] However, the electronic unit 1 of this embodiment can also be applied to electronic units other than ECUs. Specifically, the electronic unit 1 of this embodiment can be applied to an electronic unit including a board on which electronic components are mounted and a housing to which the board is fixed.

[0015] The installation orientation of the electronic unit 1 of this embodiment is not particularly limited. However, for convenience of explanation, as shown in Fig. 1, a direction parallel to the plane of Fig. 1 will be referred to as the left-right direction. Furthermore, a direction parallel to the plane of Fig. 1 and perpendicular to the left-right direction will be referred to as the front-back direction. Furthermore, a direction perpendicular to the left-right direction and the front-back direction will be referred to as the up-down direction.

[0016] As shown in Fig. 1, the electronic unit 1 of this embodiment includes an electronic board unit 2 and a housing 3. Fig. 2 is a schematic top view of the electronic board unit 2. As shown in this figure, the electronic board unit 2 of this embodiment includes a single board 4 and multiple electronic components 5.

[0017] The substrate 4 has a substrate body 4a and a positioning piece 4b. The substrate body 4a is made of a printed wiring board, and electronic components 5 can be mounted on both the front and back surfaces. The substrate body 4a is formed in a rectangular shape with its long axis extending in the left-right direction, and has an outer edge 4a1 made up of four sides.

[0018] The positioning piece 4b is connected to the outer edge 4a1 of the substrate body 4a. In this embodiment, the positioning piece 4b is provided on only one long side of the four sides of the substrate body 4a. The positioning piece 4b is formed in a substantially U-shape when viewed from above, and has two protruding portions 4b1 protruding from the outer edge 4a1 and a connecting portion 4b2 connecting these protruding portions 4b1 together.

[0019] Such positioning pieces 4b may be cut off after the substrate 4 is fixed to the housing 3. FIG. 1 shows a state in which the positioning pieces 4b of the substrate 4 are separated from the substrate main body 4a. That is, in the electronic unit 1 of this embodiment shown in FIG. 1, the positioning pieces 4b have been removed. However, it is also possible to complete the electronic unit 1 with all or part of the positioning pieces 4b remaining.

[0020] Such a positioning piece 4b forms a slit 6 that passes through the electronic board unit 2 in the vertical direction. As shown in Fig. 2, the slit 6 is formed in a rectangular shape so as to extend linearly in the left-right direction.

[0021] The slit 6 is an opening into which an attachment portion 3d (described later) of the housing 3 is inserted from below. By inserting the attachment portion 3d into the slit 6, the positioning piece 4b is attached to the attachment portion 3d.

[0022] Such a substrate 4 is formed in a state where it is connected to a substrate 4 provided in another electronic unit 1. In such a case, a connection portion that can be removed by post-processing is formed between the substrates 4.

[0023] Such a connecting portion is not a portion where an electronic component is mounted, and is generally cut off and discarded in post-processing. For example, the positioning piece 4b can be formed by leaving a part of such a connecting portion.

[0024] A plurality of electronic components 5 are mounted on the upper surface of the substrate body 4a of the substrate 4. Note that the electronic components 5 shown in Figures 1 and 2 are only a portion of the electronic components 5, and in reality, a larger number of electronic components 5 can be mounted. Furthermore, although not shown in Figures 1 and 2, electronic components 5 can also be mounted on the lower surface of the substrate body 4a.

[0025] In this embodiment, some of the multiple electronic components 5 are mounted on the board main body 4a so as to be exposed horizontally through openings 3c (described later) of the housing 3. The electronic components 5 exposed through the openings 3c are, for example, connector units to be connected to external devices.

[0026] The housing 3 is a case that houses the electronic board unit 2 and is made of, for example, metal or resin. The housing 3 includes, for example, a cover member that covers the electronic board unit 2 from above. Note that the cover member is omitted in FIG. 1.

[0027] Fig. 3 is a schematic top view of the housing 3. Note that the above-mentioned cover member is also omitted in Fig. 3. As shown in Fig. 3, the housing 3 has a base 3a that supports the electronic board unit 2 from below, and a surrounding wall 3b that surrounds the electronic board unit 2 from the sides.

[0028] The base 3a has, for example, a boss (not shown), and the electronic board unit 2 is fastened to the base 3a with a screw (not shown). The electronic board unit 2 is fixed to the housing 3 by being fastened with the screw in this manner.

[0029] The surrounding wall portion 3b is provided with openings 3c that expose some of the electronic components 5. These openings 3c are provided so as to penetrate the surrounding wall portion 3b in the horizontal direction (left-right or front-rear direction).

[0030] In this embodiment, the housing 3 is formed in a rectangular shape when viewed from above and has four sides. Two of these four sides are provided with two openings 3c on each side. In this embodiment, a part of the surrounding wall 3b located between the two openings 3c on one side (long side) is used as an attachment part 3d to which the positioning piece 4b is attached.

[0031] Such mounting portion 3d is a protrusion provided so as to protrude upward from the base portion 3a, and is formed to a size that allows it to be inserted into the slit 6. Furthermore, the mounting portion 3d is formed in a rectangular shape with its long axis extending in the left-right direction when viewed from above (i.e., from the direction of insertion into the slit 6). That is, in this embodiment, the electronic board unit 2 is positioned relative to the housing 3 in the front-rear and left-right directions by inserting the rectangular mounting portion 3d into the rectangular slit 6.

[0032] Next, a method for manufacturing the electronic unit 1 of this embodiment will be outlined with reference to FIG.

[0033] Fig. 4 is a flowchart for explaining a method for manufacturing the electronic unit 1 of this embodiment. As shown in Fig. 4, the method for manufacturing the electronic unit 1 of this embodiment includes a substrate forming step S1, an electronic substrate unit forming step S2, a housing forming step S3, a substrate arranging step S4, a fixing step S5, a cutting step S6, and a sealing step S7.

[0034] The substrate forming step S1 is a step of forming the substrate 4. That is, the substrate forming step S1 forms the substrate 4 having a substrate body 4a on which electronic components 5 can be mounted and a positioning piece 4b connected to an outer edge 4a1 of the substrate body 4a.

[0035] For example, in the substrate forming step S1, a plurality of substrates 4 are formed in a state in which they are connected to each other via connecting portions as described above. Thereafter, the plurality of substrates 4 are divided into single substrates 4 so that a part of the connecting portions becomes the positioning pieces 4b. Note that if the connecting portions do not already have holes that can be used as slits 6, the slits 6 may be formed by post-processing.

[0036] The electronic board unit formation process S2 is a process of mounting electronic components 5 on the substrate 4 to form the electronic board unit 2. Here, the electronic components 5 are placed on the substrate body 4a of the substrate 4, and the electronic components 5 are joined to the substrate body 4a by reflow or the like.

[0037] In addition, when the electronic components 5 are mounted only on the upper surface of the substrate 4, the electronic substrate unit forming step S2 can be performed after any of the substrate placement step S4, the fixing step S5, and the cutting step S6.

[0038] The housing formation step S3 is a step of forming the housing 3. That is, in this housing formation step S3, the housing 3 is formed having an attachment portion 3d to which a positioning piece 4b is attached, thereby positioning the substrate 4. If the housing 3 is made of metal, the housing 3 is formed by, for example, die casting. If the housing 3 is made of resin, the housing 3 is formed by, for example, injection molding.

[0039] The housing forming step S3 may be performed in parallel with the substrate forming step S1 or the electronic substrate unit forming step S2, or may be performed before the substrate forming step S1 or the electronic substrate unit forming step S2.

[0040] The board placement process S4 is a process of positioning the board 4 (i.e., the electronic board unit 2 in this embodiment) relative to the housing 3. Here, the board 4 is positioned relative to the housing 3 by attaching the positioning pieces 4b of the board 4 to the mounting portions 3d of the housing 3. The positioning pieces 4b are attached to the mounting portions 3d by inserting the mounting portions 3d into the slits 6. This board placement process S4 prevents the board 4 from moving in the front-to-back and left-to-right directions relative to the housing 3.

[0041] The fixing step S5 is a step of fixing the substrate 4, which has been positioned relative to the housing 3 in the substrate placement step S4, to the housing 3. Here, the substrate 4 is fastened to the housing 3 using, for example, screws (not shown).

[0042] The cutting step S6 is a step of cutting off the positioning pieces 4b from the substrate 4 fixed to the housing 3. By fixing the substrate 4 to the housing 3, it is no longer necessary to position the substrate 4 with respect to the housing 3 using the positioning pieces 4b. Therefore, by cutting off the positioning pieces 4b, it is possible to reduce the size and weight of the substrate 4. Note that if it is not necessary to cut off the positioning pieces 4b, the cutting step S6 is omitted.

[0043] The sealing step S7 is a step of sealing the electronic board unit 2 inside the housing 3, for example, by attaching a cover member. For example, the cover member is fastened to the surrounding wall portion 3b of the housing 3 from above with screws or the like (not shown).

[0044] In the manufacturing method of the electronic unit 1 of this embodiment as described above, the electronic unit 1 has a substrate 4 and a housing 3. Electronic components 5 can be mounted on the substrate 4. The substrate 4 is fixed to the housing 3. The manufacturing method of the electronic unit 1 also has a substrate forming step S1, a housing forming step S3, a substrate placement step S4, and a fixing step S5. The substrate forming step S1 is a step of forming a substrate 4 having a substrate main body 4a on which electronic components 5 can be mounted and positioning pieces 4b connected to the outer edge 4a1 of the substrate main body 4a. The substrate placement step S4 is a step of positioning the substrate 4 relative to the housing 3 by attaching the positioning pieces 4b to the attachment portions 3d. The fixing step S5 is a step of fixing the substrate 4 positioned in the substrate placement step S4 to the housing 3.

[0045] In the electronic unit 1 of this embodiment, a positioning piece 4b is provided in addition to a board main body 4a on which electronic components 5 can be mounted. The board 4 is positioned relative to the housing 3 by attaching this positioning piece 4b to an attachment portion 3d of the housing 3. Therefore, the manufacturing method of the electronic unit 1 of this embodiment can position the board 4 relative to the housing 3 without reducing the mounting area for the electronic components 5.

[0046] The manufacturing method of the electronic unit 1 of this embodiment also includes a cutting step S6, which is a step of cutting off the positioning piece 4b from the board body 4a of the board 4 fixed to the housing 3 in the fixing step S5.

[0047] According to the manufacturing method of the electronic unit 1 of this embodiment, the positioning piece 4b can be removed from the completed electronic unit 1. Therefore, the manufacturing method of the electronic unit 1 of this embodiment makes it possible to reduce the size and weight of the electronic unit 1.

[0048] In the manufacturing method of the electronic unit 1 of this embodiment, the positioning piece 4b forms a rectangular slit 6. The attachment portion 3d is a protrusion that can be inserted into the slit 6 and is rectangular when viewed from the insertion direction. In the board placement step S4, the attachment portion 3d is inserted into the slit 6, thereby attaching the positioning piece 4b to the attachment portion 3d.

[0049] According to the manufacturing method of the electronic unit 1 of this embodiment, the substrate 4 is positioned relative to the housing 3 by inserting the rectangular mounting portion 3d into the rectangular slit 6. Therefore, according to the manufacturing method of the electronic unit 1 of this embodiment, it is possible to prevent the positioned substrate 4 from moving in the front-to-back and left-to-right directions relative to the housing 3.

[0050] Furthermore, in the method for manufacturing the electronic unit 1 of this embodiment, in the board placement step S4, the board 4 having the electronic components 5 mounted on the board body 4a is positioned relative to the housing 3. In this manner, the method for manufacturing the electronic unit 1 of this embodiment makes it possible to mount the electronic components 5 on the board 4 in a state in which the board 4 is detached from the housing 3. Therefore, the mounting operation of the electronic components 5 can be performed without being affected by the housing 3.

[0051] In the manufacturing method of the electronic unit 1 of this embodiment, the substrate body 4a is formed in a rectangular shape. Furthermore, the substrate body 4a has four sides, and the positioning piece 4b is provided on only one side.

[0052] According to the electronic unit 1 of this embodiment, the board 4 can be positioned with respect to the housing 3 by one positioning piece 4b. Therefore, the board 4 before positioning can be made smaller and lighter than when the board 4 has multiple positioning pieces 4b.

[0053] The board 4 included in the electronic unit 1 of this embodiment is fixed to the housing 3 of the electronic unit 1. The board 4 has a board main body 4a and a positioning piece 4b. An electronic component 5 can be mounted on the board main body 4a. The positioning piece 4b is formed and connected to an outer edge 4a1 of the board main body 4a, and can be attached to an attachment portion 3d of the housing 3 to position the board 4 with respect to the housing 3.

[0054] The board 4 included in the electronic unit 1 of this embodiment is provided with a positioning piece 4b in addition to a board main body 4a on which electronic components 5 can be mounted. With such a board 4, the board can be positioned relative to the housing 3 by attaching the positioning piece 4b to the mounting portion 3d of the housing 3. Therefore, the board 4 included in the electronic unit 1 of this embodiment can be positioned relative to the housing 3 without reducing the mounting area for the electronic components 5.

[0055] The electronic unit 1 of this embodiment also includes a substrate 4 and a housing 3 to which the substrate 4 is fixed. The electronic unit 1 of this embodiment includes a substrate 4 with a large mounting area for electronic components 5, and can accommodate many electronic components 5.

[0056] Furthermore, in the electronic unit 1 of this embodiment, the positioning piece 4b of the substrate 4 is cut out from the substrate body 4a. According to such an electronic unit 1 of this embodiment, the completed electronic unit 1 can be made smaller and lighter.

[0057] (Second embodiment) Next, a second embodiment of the present invention will be described with reference to Figures 5 and 6. In the description of this embodiment, the description of the same parts as those in the first embodiment will be omitted or simplified.

[0058] 5 is a schematic top view of an electronic board unit 2A included in the electronic unit of this embodiment. As shown in this figure, the electronic board unit 2A of this embodiment has a board 4 equipped with two positioning pieces 4b. In other words, the electronic board unit 2A of this embodiment is provided with multiple positioning pieces 4b.

[0059] One of the two positioning pieces 4b is connected to one of the long sides of the rectangular board main body 4a. The other of the two positioning pieces 4b is connected to a different long side from the one positioning piece 4b. Each of these positioning pieces 4b forms a slit 6. In other words, in this embodiment, the board 4 of the electronic board unit 2A has two slits 6.

[0060] 6 is a schematic top view of the housing 3A of the electronic unit of this embodiment. As shown in this figure, the housing 3 has mounting portions 3d corresponding to each of the positioning pieces 4b. That is, in this embodiment, the housing 3 has two mounting portions 3d.

[0061] In the electronic unit of this embodiment, the substrate 4 is positioned relative to the housing 3A by attaching the positioning pieces 4b to the mounting portions 3d. This allows the substrate 4 to be positioned relative to the housing 3A without reducing the mounting area for the electronic components 5.

[0062] Furthermore, according to the electronic unit of this embodiment, the two positioning pieces 4b position the board 4 relative to the housing 3. Therefore, when the board 4 attempts to move relative to the housing 3, the load on each of the positioning pieces 4b can be distributed.

[0063] (Third embodiment) Next, a third embodiment of the present invention will be described with reference to Figures 7 and 8. In the description of this embodiment, the description of the same parts as those in the first embodiment will be omitted or simplified.

[0064] 7 is a schematic top view of an electronic board unit 2B included in the electronic unit of this embodiment. As shown in this figure, the electronic board unit 2B of this embodiment has a positioning piece 4b that is provided with a plurality of circular openings 4c.

[0065] 8 is a schematic top view of the housing 3B of the electronic unit of this embodiment. As shown in this figure, the housing 3B has a pin-shaped attachment portion 3e that is inserted into the opening 4c of the positioning piece 4b.

[0066] In this embodiment, the pin-shaped attachment portions 3e are inserted into the openings 4c, thereby positioning the board 4 relative to the housing 3B. Therefore, also in this embodiment, the board 4 can be positioned relative to the housing 3B without reducing the mounting area of the electronic components 5.

[0067] While the preferred embodiments of the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to the above-described embodiments. The shapes and combinations of the components shown in the above-described embodiments are merely examples, and various modifications can be made based on design requirements, etc., without departing from the spirit of the present invention.

[0068] The above embodiment can also be described as follows, for example:

[0069] (Appendix 1) 1. A method for manufacturing an electronic unit having a substrate on which electronic components can be mounted and a housing to which the substrate is fixed, comprising: a substrate forming step of forming the substrate having a substrate body on which the electronic component can be mounted and a positioning piece connected to an outer edge of the substrate body; a housing forming step of forming the housing having an attachment portion that positions the board by attaching the positioning piece; a board positioning step of positioning the board relative to the housing by attaching the positioning piece to the attachment portion; a fixing step of fixing the substrate positioned in the substrate placement step to the housing; have A method for manufacturing an electronic unit comprising:

[0070] (Appendix 2) 2. The method for manufacturing an electronic unit according to claim 1, further comprising a cutting step of cutting off the positioning piece from the substrate body of the substrate fixed to the housing in the fixing step.

[0071] (Appendix 3) The positioning piece forms a rectangular slit, the attachment portion is a protrusion that can be inserted into the slit and has a rectangular shape when viewed from the insertion direction, In the substrate placement step, the mounting portion is inserted into the slit to mount the positioning piece to the mounting portion. 3. A method for manufacturing an electronic unit according to claim 1 or 2.

[0072] (Appendix 4) 4. The method for manufacturing an electronic unit according to any one of claims 1 to 3, wherein in the substrate placement step, the substrate on which the electronic components are mounted on the substrate body is positioned relative to the housing.

[0073] (Appendix 5) The substrate body is formed in a rectangular shape, The positioning piece is provided on only one of the four sides of the substrate body. 5. A method for manufacturing an electronic unit according to any one of claims 1 to 4.

[0074] (Appendix 6) A substrate fixed to a housing of an electronic unit, a substrate body on which electronic components can be mounted; a positioning piece that is formed to be connected to the outer edge of the substrate body and that can be attached to an attachment part of the housing to position the substrate with respect to the housing; A substrate comprising:

[0075] (Appendix 7) 7. An electronic unit comprising: the substrate according to claim 6; and a housing to which the substrate is fixed.

[0076] (Appendix 8) 8. The electronic unit according to claim 7, wherein the positioning piece of the substrate is cut out from the substrate body. [Explanation of symbols]

[0077] 1...electronic unit, 2...electronic board unit, 2A...electronic board unit, 2B...electronic board unit, 3...casing, 3a...base, 3A...casing, 3b...enclosure wall, 3B...casing, 3c...opening, 3d...mounting portion, 3e...mounting portion, 4...board, 4a...board body, 4a1...outer edge, 4b...positioning piece, 4b1...protrusion, 4b2...connection portion, 4c...opening, 5...electronic component, 6...slit

Claims

1. 1. A method for manufacturing an electronic unit having a substrate on which electronic components can be mounted and a housing to which the substrate is fixed, comprising: a substrate forming step of forming the substrate having a substrate body on which the electronic component can be mounted and a positioning piece connected to an outer edge of the substrate body; a housing forming step of forming the housing having an attachment portion that positions the board by attaching the positioning piece; a board positioning step of positioning the board relative to the housing by attaching the positioning piece to the attachment portion; a fixing step of fixing the substrate positioned in the substrate placement step to the housing; have A method for manufacturing an electronic unit comprising:

2. 2. The method for manufacturing an electronic unit according to claim 1, further comprising a cutting step of cutting off the positioning piece from the substrate body of the substrate fixed to the housing in the fixing step.

3. The positioning piece forms a rectangular slit, the attachment portion is a protrusion that can be inserted into the slit and has a rectangular shape when viewed from the insertion direction, In the substrate placement step, the mounting portion is inserted into the slit to mount the positioning piece to the mounting portion.

3. The method for manufacturing an electronic unit according to claim 1 or 2.

4. 3. The method for manufacturing an electronic unit according to claim 1, wherein the substrate mounting step positions the substrate, on which the electronic components are mounted, relative to the housing.

5. The substrate body is formed in a rectangular shape, The positioning piece is provided on only one of the four sides of the substrate body.

3. The method for manufacturing an electronic unit according to claim 1 or 2.

6. A substrate fixed to a housing of an electronic unit, a substrate body on which electronic components can be mounted; a positioning piece that is formed to be connected to the outer edge of the substrate body and that can be attached to an attachment part of the housing to position the substrate with respect to the housing; A substrate comprising:

7. An electronic unit comprising: the substrate according to claim 6; and a housing to which the substrate is fixed.

8. 8. The electronic unit according to claim 7, wherein the positioning piece of the substrate is cut out from the substrate body.

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