Substrate transport device and substrate processing device

Abstract

To provide a substrate transport device that can narrow the arrangement pitch of substrates and perform efficient substrate processing.SOLUTION: When a pusher mechanism 25 combines an initial substrate group with a first substrate W1, an HVC attitude conversion unit 23 according to the present invention moves a flat plate 233, which is at a first position where the horizontally oriented substrate W can abut, to a second position where it is retracted from the gap in the first substrate group. A transfer block 5 according to the present invention is configured to insert the substrate W of the first substrate group into the gap in the substrate W of a second substrate group.SELECTED DRAWING: Figure 11E

Description

[Technical Field]

[0001] The present invention relates to a substrate transport device and a substrate processing device for transporting substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks. [Background technology]

[0002] Patent document 1 describes a substrate processing apparatus that takes out the same number of substrates from each of two carriers, forms a first group of substrates and a second group of substrates, and inserts the second group of substrates into the gaps between the substrates in the first group of substrates, thereby converting the pitch to 1 / 2 and forming a group of substrates with twice the number of substrates, which are then processed all at once. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 5-175179 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, there has been a demand for greater efficiency in substrate processing equipment. To increase the number of substrates processed at one time in batch processing, the substrate arrangement pitch must be narrower. This poses a problem when it comes to substrate orientation. In other words, for batch processing, arranging substrates face-to-face to generate batch lots is more suitable from the perspective of preventing contamination of device surfaces. Conventional equipment arranges substrates face-to-face by combining a substrate array obtained from a first carrier with a substrate array obtained from a second carrier, rotated halfway. Therefore, conventional equipment can only achieve a half-width substrate arrangement pitch on the carrier. Arranging substrates face-to-face while further reducing the pitch would require a new, novel device. Furthermore, attempting to reduce the pitch risks damaging the substrates when combining the two substrate arrays.

[0005] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate transport device and a substrate processing device that can narrow the substrate arrangement pitch and efficiently process substrates without damaging the substrates. [Means for solving the problem]

[0006] In order to solve the above problems, the present invention has the following configuration. That is, the present invention provides a handling mechanism for acquiring a group of substrates from a carrier that stores horizontally oriented substrates arranged in a vertical direction; a position conversion mechanism including a pair of placement rods on which flat plates for placing the ends of the substrate delivered by the handling mechanism are arranged at a predetermined pitch in the vertical direction, a pair of clamping rods on which grooves for clamping the substrate in a vertical position are arranged at the predetermined pitch in the vertical direction, a support member on which the placement rods and the clamping rods are erected, and a base for supporting the support member in an invertible manner; a substrate holding mechanism that combines a first group of substrates in a vertical position held by the position change mechanism with the clamping rods and a second group of substrates in a vertical position delivered in advance from the position change mechanism, and arranges the substrates in a horizontal direction at an arrangement pitch narrower than the predetermined pitch; The posture conversion mechanism includes a moving mechanism that moves the flat plate, which is at a first position where a horizontally oriented substrate can abut, to a second position where it is retracted from the gap in the first substrate group when the substrate holding mechanism combines the first substrate group and the second substrate group.

[0007] [Actions and Effects] According to the above-described configuration, the posture conversion mechanism includes a moving mechanism that moves a flat plate, which is in a first position where a horizontally oriented substrate can abut, from the gap in the first substrate group to a retracted second position when the substrate holding mechanism combines the first substrate group and the second substrate group. The substrate transport device of the present invention is configured to insert substrates from the first substrate group into gaps between substrates from the second substrate group. When the first substrate group is combined with the second substrate group, the first substrate group is clamped by the clamping rods of the posture conversion mechanism, and the loading rod does not contribute to supporting the substrates. Rather, because the flat plate of the loading rod is located in the space where the substrates from the second substrate group are inserted, there is even a possibility that the flat plate and the second substrate group may collide when the first substrate group and the second substrate group are combined. According to the present invention, when the first substrate group and the second substrate group are combined, the flat plate is retracted from the gap in the first substrate group, so that when the substrate groups are combined, the flat plate of the mounting rod does not come into contact with the substrate and cause damage to the substrate.

[0008] In addition, in the above-mentioned configuration, the mounting rod has a surface on which the flat plate is arranged and a surface on which the flat plate is not arranged, The moving mechanism is preferably a rotating mechanism that rotates the placing rod around a central axis that is parallel to the arrangement direction of the flat plates.

[0009] [Operation and Effect] According to the above-mentioned configuration, the mounting rod has a surface on which the flat plates are arranged and a surface on which the flat plates are not arranged, and the movement mechanism is a rotation mechanism that rotates the mounting rod around a central axis parallel to the arrangement direction of the flat plates. With this configuration, the flat plates can be reliably retracted.

[0010] In addition, in the above-mentioned configuration, the mounting rod has, as surfaces on which the flat plates are arranged, a surface for an outgoing path on which a first flat plate is arranged and a surface for a returning path on which a second flat plate is arranged; It is preferable that when transporting a substrate from the handling mechanism to the substrate holding mechanism, the rotation mechanism rotates the placement rod so that the outward surface faces the substrate, and when transporting a substrate from the substrate holding mechanism to the handling mechanism, the rotation mechanism rotates the placement rod so that the return surface faces the substrate.

[0011] [Actions and Effects] According to the above-described configuration, the mounting rod has, as surfaces on which flat plates are arranged, a surface for the outward movement on which the first flat plate is arranged and a surface for the return movement on which the second flat plate is arranged, and the rotation mechanism rotates the mounting rod so that the surface for the outward movement faces the substrate when transporting the substrate from the handling mechanism to the substrate holding mechanism. On the other hand, when transporting the substrate from the substrate holding mechanism to the handling mechanism, the rotation mechanism rotates the mounting rod so that the surface for the return movement faces the substrate. In this way, the present invention can prevent contamination of the substrate through the flat plates of the mounting rod by distinguishing between the flat plates of the mounting rod used on the outward movement and the flat plates of the mounting rod used on the return movement.

[0012] In addition, in the above-mentioned configuration, the flat plates are arranged on the mounting rod at a pitch twice the pitch of the substrates on the carrier; the grooves are arranged on the clamping rod at a pitch twice the pitch of the substrates on the carrier; The arrangement pitch of the substrates in the substrate holding mechanism is preferably 1 / 3 times the arrangement pitch of the substrates in the carrier.

[0013] [Actions and Effects] According to the above-mentioned configuration, the flat plates are arranged on the mounting rod at a pitch twice the arrangement pitch of the substrates on the carrier, the grooves are arranged on the clamping rod at a pitch twice the arrangement pitch of the substrates on the carrier, and the arrangement pitch of the substrates on the substrate holding mechanism is 1 / 3 times the arrangement pitch of the substrates on the carrier. With this configuration, by repeating the substrate transport six times in the substrate holding mechanism, the arrangement pitch of the substrates can be reliably made 1 / 3 of the arrangement pitch of the substrates on the carrier.

[0014] In addition, in the above-mentioned configuration, It is preferable that the substrate holding mechanism is capable of rotating the array of the held substrates by half a turn around a vertical axis.

[0015] [Operations and Effects] According to the above-described configuration, the substrate holding mechanism can rotate the arrangement of the held substrates a half-turn around the vertical axis. In this way, the substrate holding mechanism can perform batch assembly while changing the orientation of the substrates, so that the substrates can be arranged face-to-face in the final batch lot.

[0016] In addition, in the above-mentioned configuration, the flat plates are arranged on the mounting rod at the same pitch as the substrates on the carrier; the grooves are arranged in the clamping rod at the same pitch as the substrates in the carrier; It is preferable that the substrate holding mechanism divides the substrates into a first set and a second set so that two opposing substrates in the arrangement of the held substrates are in different sets, and is capable of rotating the substrates in the second set half a turn around a vertical axis.

[0017] [Operations and Effects] In the above-described configuration, the placement rod has flat plates arranged at the same pitch as the substrates on the carrier, the clamping rod has grooves arranged at the same pitch as the substrates on the carrier, and the substrate holding mechanism divides the substrates into a first group and a second group so that two opposing substrates are in different groups in the arrangement of the held substrates, and can rotate the substrates in the second group halfway around a vertical axis. With this configuration, the substrates can be arranged face-to-face in the final batch lot.

[0018] In addition, in the above-mentioned configuration, The arrangement pitch of the substrates in the substrate holding mechanism is preferably 1 / 3 times the arrangement pitch of the substrates in the carrier.

[0019] [Operations and Effects] According to the above-mentioned configuration, the arrangement pitch of the substrates in the substrate holding mechanism is 1 / 3 times the arrangement pitch of the substrates in the carrier. With this configuration, the arrangement pitch of the final batch lot can be 1 / 3 of the arrangement pitch of the substrates in the carrier.

[0020] Furthermore, according to the present invention, it is possible to provide a substrate processing apparatus including an immersion tank in which a substrate held by a substrate holding mechanism is immersed in a processing liquid. [Effects of the Invention]

[0021] According to the present invention, it is possible to provide a substrate transport device and a substrate processing device that can narrow the substrate arrangement pitch and efficiently process substrates without damaging the substrates. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 is a plan view illustrating an overall configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a schematic diagram illustrating the configuration of a carrier according to the first embodiment. [Figure 3] 3 is a perspective view illustrating each part constituting a transfer block according to the first embodiment. FIG. [Figure 4] 3 is a comparison diagram between the configuration of the carrier according to the first embodiment and the configuration of the handling robot. FIG. [Figure 5] FIG. 2 is a perspective view illustrating the configuration of an HVC attitude conversion unit according to the first embodiment. [Figure 6] FIG. 2 is a plan view illustrating the configuration of each rod according to the first embodiment. [Figure 7] FIG. 2 is a plan view illustrating the configuration of each rod according to the first embodiment. [Figure 8] 3 is a cross-sectional view illustrating a groove provided in a clamping rod according to the first embodiment. FIG. [Figure 9] FIG. 2 is a schematic diagram illustrating a pusher according to the first embodiment. [Figure 10] FIG. 2 is a schematic diagram illustrating a pusher according to the first embodiment. [Figure 11A] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 11B] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 11C] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 11D] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 11E] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 12A] FIG. 4 is a perspective view illustrating the operation of the flat plate according to the first embodiment. [Figure 12B] 4 is a perspective view illustrating the operation of the flat plate according to the first embodiment. FIG. [Figure 12C] 4 is a perspective view illustrating the operation of the flat plate according to the first embodiment. FIG. [Figure 13] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 14] 5A to 5C are schematic diagrams illustrating the operation of the flat plate according to the first embodiment. [Figure 15A] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 15B] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 15C] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 15D] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 15E] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 15F] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 15G] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 15H] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 15I] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 15J] FIG. 2 is a schematic diagram illustrating a batch set according to Example 1. [Figure 16] FIG. 2 is a schematic diagram illustrating the orientation of a substrate according to the first embodiment. [Figure 17] 1 is a flowchart illustrating the flow of a substrate according to the first embodiment. [Figure 18] 1 is a flowchart illustrating the flow of a substrate according to the first embodiment. [Figure 19] 3 is a comparison diagram between the configuration of the carrier according to the first embodiment and the configuration of the handling robot. FIG. [Figure 20] FIG. 2 is a perspective view illustrating the configuration of an HVC attitude conversion unit according to the first embodiment. [Figure 21] FIG. 2 is a plan view illustrating the configuration of a mounting rod according to the first embodiment. [Figure 22A] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 22B] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 22C] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 22D] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 22E] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 22F] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 22G] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 22H] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 22I] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 22J] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 23] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 24] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 25] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 26A] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 26B] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 26C] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 26D] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 26E] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 26F] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 26G] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 26H] FIG. 10 is a schematic diagram illustrating a batch set according to Example 2. [Figure 27] FIG. 10 is a schematic diagram illustrating the orientation of a substrate according to Example 2. [Figure 28] 10 is a flowchart illustrating the flow of a substrate according to the second embodiment. [Figure 29] FIG. 10 is a perspective view illustrating a modified example of the present invention. [Figure 30] FIG. 10 is a perspective view illustrating a modified example of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0023] An embodiment of the present invention will be described below with reference to the drawings. In the substrate processing apparatus of the embodiment, substrates arranged at a 10 mm pitch are converted to a 1 / 3 pitch (10 / 3 mm) to form a batch lot. The formed batch lot is subjected to various substrate treatments, such as chemical immersion treatment, all at once, i.e., batch treatment. By performing substrate treatment with a narrower substrate arrangement pitch in this way, less chemical solution is required, thereby reducing running costs and enabling environmentally friendly substrate treatment.

[0024] The substrate processed by the substrate processing apparatus of this embodiment has an orientation defined by a front surface and a back surface. The front surface of the substrate is the device surface on which film formation processing and exposure processing are performed. The back surface is the surface opposite the device surface. When the substrate is held in a horizontal position, the front surface of the substrate faces upward. [Example]

[0025] 1. Overall structure The substrate processing apparatus 1 according to the present invention is configured to perform batch processing. The substrate processing apparatus 1 has a housing 1A that houses each block. The housing 1A has a substantially rectangular shape in a plan view. The housing 1A houses a stocker block 3, a transfer block 5, and a processing block 6, which are arranged horizontally from one end side. A load port 9 is provided to protrude from the wall surface at one end side of the housing 1A.

[0026] For convenience, in this specification, the direction in which the stocker block 3, transfer block 5, and processing block 6 in the substrate processing apparatus 1 are arranged is referred to as the "front-rear direction X." The front-rear direction X extends horizontally. Within the front-rear direction X, the direction from the transfer block 5 toward the stocker block 3 in the substrate processing apparatus 1 is referred to as the "front." The direction opposite the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." For convenience, one direction of the "width direction Y" is referred to as the "right" and the other direction is referred to as the "left." For convenience, the direction perpendicular to the front-rear direction X and the width direction Y (height direction) is referred to as the "vertical direction Z." In each figure, for reference, the terms front, back, right, left, top, and bottom are indicated as appropriate.

[0027] 2. Stocker Block 1, the stocker block 3 is provided with a load port 9, which is an entrance through which a carrier C, which stores multiple substrates W in a horizontal position and at predetermined intervals in the vertical direction, is introduced into the block. The load port 9 protrudes from the outer wall of the stocker block 3, which extends in the width direction (Y direction).

[0028] A plurality of substrates W (for example, 25 substrates) are stacked and stored horizontally at regular intervals in one carrier C. The carrier C storing unprocessed substrates W to be carried into the substrate processing apparatus 1 is first placed on the load port 9.

[0029] FIG. 2 illustrates the configuration of a carrier C. The carrier C has a plurality of horizontally extending slots S formed therein, which hold substrates W with their surfaces spaced apart. The slots S are arranged vertically at a specific pitch (e.g., 10 mm), and each slot S accommodates a substrate W. Twenty-five slots S are provided in one carrier C. Therefore, 25 substrates W are arranged vertically at the specific pitch in the carrier C. A mounting plate 7 is located at a position that separates each slot S, and supports both ends of the substrate W together with its paired mounting plate 7. Therefore, one mounting plate 7 is provided on each side of the carrier C and on a surface parallel to that side. An example of a carrier C is a sealed FOUP (Front Opening Unify Pod). In the present invention, an open container may be used as the carrier C.

[0030] The internal structure of the stocker block 3 will now be described. The stocker block 3 is equipped with a transport storage unit ACB that stocks and manages carriers C. The transport storage unit ACB is equipped with a carrier transport mechanism 11 that transports the carriers C and shelves 13 on which the carriers C are placed. The stocker block 3 can stock one or more carriers C.

[0031] The stocker block 3 has a plurality of shelves 13 on which carriers C are placed. The shelves 13 are provided on a partition wall separating the stocker block 3 and the transfer block 5. The shelves 13 include a stock shelf 13b on which carriers C are simply placed temporarily, and a carrier placement shelf 13a which is accessed by the first handling robot HTR of the transfer block 5 and is used to remove substrates.

[0032] The carrier mounting shelf 13a is configured to be able to mount a carrier C. The carrier mounting shelf 13a is configured to mount a carrier C from which a substrate W is to be removed. In this embodiment, one carrier mounting shelf 13a is provided, but multiple carrier mounting shelves 13a may be provided. The carrier transport mechanism 11 takes in a carrier C storing an unprocessed substrate W from the load port 9 and places it on the carrier mounting shelf 13a for substrate removal. At this time, the carrier transport mechanism 11 can also temporarily place the carrier C on a stock shelf 13b before placing it on the carrier mounting shelf 13a. The stocker block 3 has one or more carrier mounting shelves 13a.

[0033] The carrier mounting shelf 13a is also configured to mount empty carriers C for storing processed substrates W. The processed substrates W are stored in carriers C waiting on the carrier mounting shelf 13a. The carrier transport mechanism 11 retrieves the carriers C storing the processed substrates W from the carrier mounting shelf 13a and transports them to the load port 9. When transporting the carriers C to the load port 9, the carrier transport mechanism 11 may temporarily store the carriers C on the stock shelf 13b.

[0034] 3. Transfer block The transfer block 5 is adjacent to the carrier mounting shelf 13a. The transfer block 5 is disposed adjacent to the rear of the stocker block 3. The transfer block 5 includes a handling robot HTR that can access a carrier C placed on the carrier mounting shelf 13a for substrate removal, an HVC position conversion unit 23 that converts the position of multiple substrates W collectively from a horizontal position to a vertical position, and a pusher mechanism 25. The HVC position conversion unit 23 converts multiple substrates W collectively from a horizontal position to a vertical position. Furthermore, the transfer block 5 is provided with a substrate transfer position PP for transferring multiple substrates W to the forward / backward transfer mechanism WTR provided in the batch transfer region R2. The handling robot HTR corresponds to the handling mechanism of the present invention. The handling robot HTR is configured to retrieve a group of substrates from a carrier C that stores horizontally oriented substrates arranged vertically.

[0035] As shown in FIG. 3, the handling robot HTR, HVC posture conversion unit 23, and pusher mechanism 25 are arranged in this order in the Y direction. The handling robot HTR has a hand 211 that can hold a substrate W in a horizontal posture. Each hand 211 can hold a single substrate W. The handling robot HTR has hands 211 arranged in the vertical direction. The handling robot HTR can transport multiple substrates W at once by holding a substrate with each hand 211. The movement support mechanism 213 is a mechanism that constitutes the handling robot HTR, and is configured to rotate the hand 211 around a vertical axis, raise and lower the hand 211, move the hand 211 forward and backward in the forward and backward direction X, and move the hand 211 laterally in the left and right direction Y.

[0036] FIG. 4 shows how the handling robot HTR receives a substrate W from a carrier C using a hand 211. As shown in FIG. 4, the hands 211 are arranged vertically at a pitch twice the pitch of the slots S in the carrier C. That is, the hands 211 are arranged at a pitch of 20 mm. The handling robot HTR cannot transport all of the substrates W arranged at 10 mm intervals in the carrier C at once. The handling robot HTR is configured to extract every other substrate W from the 10 mm pitch, thereby generating a group of substrates arranged at 20 mm intervals. Since the surfaces of the substrates W stored in the carrier C all face upward, the substrates W extracted by the handling robot HTR all face upward. Each hand 211 is provided with a guide 214 that abuts the peripheral edge of the substrate. The guides 214 are provided at the tip and base ends of a pair of blades that make up the hand 211. Therefore, the hand 211 is provided with four guides 214.

[0037] The handling robot HTR has 13 hands 211. The handling robot HTR uses these hands to transport 25 substrates stored in a carrier C in two trips. The handling robot HTR can first transport 12 substrates W and then transport 13 substrates W. Similarly, the handling robot HTR can first transport 13 substrates W and then transport 12 substrates W.

[0038] The HVC posture conversion unit 23 shown in Fig. 3 is configured to convert a substrate W taken out of a carrier C by a handling robot HTR from a horizontal posture to a vertical posture. The HVC posture conversion unit 23 includes a pair of placement rods 231 on which flat plates 233, on which edges of the substrate W delivered by the handling robot HTR are placed, are arranged vertically at 20 mm pitches. The HVC posture conversion unit 23 also includes a pair of clamping rods 232 on which V-grooves 234b (described below) for clamping a substrate W in a vertical posture are arranged vertically at 20 mm pitches. The HVC posture conversion unit 23 corresponds to the posture conversion mechanism of the present invention.

[0039] The HVC attitude conversion unit 23 includes a pair of mounting rods 231 and a pair of clamping rods 232 that extend in the vertical direction (Z direction). The support base 237 has a support surface that extends in the XY plane and supports the mounting rods 231 and clamping rods 232. The support base 237 is configured to allow the mounting rods 231 and clamping rods 232 to stand upright. The support base 237 corresponds to the support member of the present invention. The rotation drive mechanism 239 is configured to rotate the mounting rods 231 and clamping rods 232 together with the support base 237 by 90°. This rotation causes the mounting rods 231 and clamping rods 232 to extend in the left-right direction (Y direction). The base 2310 is configured to support the support base 237 so that it can stand upright.

[0040] The mounting rod 231 is provided with a rod driving mechanism 235 that rotates around a rotation axis along the extension direction of the mounting rod 231. The pair of rod driving mechanisms 235 allows the pair of mounting rods 231 to rotate synchronously. The rod driving mechanism 235 also allows the mounting rod 231 to extend and retract. A specific example of when the mounting rod 231 is driven by the rod driving mechanism 235 will be described later.

[0041] The clamping rods 232 are provided with rod rotation mechanisms 236 that rotate around a rotation axis along the direction in which the clamping rods 232 extend. The pair of rod rotation mechanisms 236 allows the pair of clamping rods 232 to rotate synchronously.

[0042] FIG. 5 illustrates the flat plate 233 of the mounting rod 231. The flat plates 233 are arranged on the mounting rod 231 at 20 mm intervals in the extension direction of the mounting rod 231. Each flat plate 233 is a plate extending in a plane perpendicular to the arrangement direction of the flat plates 233, and the substrate W is supported by the mounting rod 231 when an end of the substrate W rests on the upper surface of the flat plate 233. Note that since the entire substrate W cannot be held by holding only one end of the substrate W, two mounting rods 231 are provided in the HVC attitude conversion unit 23. One end of the substrate W is held by the flat plate 233 of one mounting rod 231, and the other end of the substrate W is held by the flat plate 233 of the other mounting rod 231. The one end and the other end are spaced apart by the diameter of the substrate W. Therefore, the pair of mounting rods 231 are spaced apart by the diameter of the substrate W, as shown in FIG. 6. In this way, the substrate W held by the flat plate 233 does not rise up from the flat plate 233. This is because the weight of the substrate W is applied symmetrically to the left and right of the flat plate 233, so that the weight of the substrate W on the flat plate 233 is kept balanced on the left and right. In addition, the pair of mounting rods 231 are parallel to each other.

[0043] 5 illustrates the clamping plates 234 of the clamping rods 232. The clamping plates 234 have arcuate sides 234a that follow the curve of the substrate W, and V-grooves 234b are provided on the arcuate sides 234a for clamping the substrate W. Because the substrate W has a shape that follows the curve of the arcuate sides 234a, the substrate W is clamped in the V-grooves 234b of the arcuate sides 234a. The clamping plates 234 are arranged on the clamping rods 232 at 20 mm intervals in the direction in which the clamping rods 232 extend. Each clamping plate 234 is a plate that extends in a plane perpendicular to the arrangement direction of the clamping plates 234, and the substrate W is clamped by the clamping rods 232 when a portion of the substrate W is clamped in the V-groove 234b of the arcuate sides 234a.

[0044] Note that, because clamping only a portion of the substrate W does not achieve clamping of the entire substrate W, the HVC posture conversion unit 23 is provided with two clamping rods 232. The clamping plates 234 of one of the clamping rods 232 clamp a portion of the substrate W, and the clamping plates 234 of the other clamping rod 232 clamp a portion of the substrate W. The pair of clamping rods 232 are spaced apart by a distance shorter than the diameter of the substrate W. Because the pair of clamping rods 232 are configured to clamp the substrate W in a vertical posture, they only need to be configured to clamp the lower edge of the substrate W, and do not need to be spaced apart by the diameter of the substrate W as with the placement rod 231. However, as shown in FIG. 7 , the clamping rods 232 are positioned offset from the bottom of the substrate W in a vertical posture, and therefore two rods are required: one that clamps a portion of the substrate W on the right side as viewed from the bottom, and the other that clamps a portion of the substrate W on the left side as viewed from the bottom. 8, the two clamping rods 232 clamp the substrate W from both sides by means of the V-shaped grooves 234b of the clamping plates 234. The pair of clamping rods 232 are parallel to each other.

[0045] 3 includes a pusher 251 that can arrange a vertically oriented substrate W in the horizontal direction. The pusher 251 is a half-pipe type that follows the curve of the bottom of the substrate W. In the initial state, the pusher 251 has a U-shaped groove 251a that forms the half-pipe extending in the left-right direction Y. In this state, the pusher 251 can receive the substrate W from the HVC attitude conversion unit 23.

[0046] Fig. 9 is a cross-sectional view illustrating the configuration of the pusher 251. The pusher 251 has a plurality of V-shaped clamping grooves 252. The clamping grooves 252 are arranged in the extension direction of the U-grooves described in Fig. 7. The arrangement pitch of the clamping grooves 252 is 10 / 3 mm. Each of the clamping grooves 252 clamps one substrate W as shown in Fig. 9.

[0047] Figure 10 explains the relationship between the pair of clamping rods 232 and the pusher 251. Unlike the state in Figure 3, the pair of clamping rods 232 in Figure 10 are tilted 90 degrees together with the support base 237 by the rotation drive mechanism 239. Therefore, the clamping rods 232 in Figure 10 extend in the horizontal direction. As can be seen from Figure 10, the pusher 251 is located at a position where it is sandwiched between the pair of clamping rods 232 in the front-rear direction X. Therefore, the pair of clamping rods 232 and the pusher 251 do not interfere with each other and can cooperate to clamp the substrate W in a vertical position.

[0048] 3 can rotate the pusher 251 by at least 180°. The pusher rotation mechanism 253 can rotate the pusher 251 from its initial state to face the pusher 251 in the opposite direction, and can also rotate the pusher 251 facing the opposite direction to return the pusher 251 to its initial state. By rotating the pusher 251 half a turn, the array of substrates W held by the pusher 251 can be rotated half a turn around the vertical axis.

[0049] The pusher shift mechanism 254 can move the pusher 251 in the initial state back and forth in the left-right direction Y. The pusher shift mechanism 254 can move the pusher 251 closer to the HVC attitude changing unit 23, and can also move the pusher 251 closer to the advancing and retreating transport mechanism WTR.

[0050] The pusher lifting mechanism 255 can lift the pusher 251 from the initial position to the sky position. The pusher lifting mechanism 255 can also return the pusher 251 from the sky position to the initial position.

[0051] 4. Pitch change in transfer block In the substrate processing apparatus of this embodiment, the arrangement pitch of substrates W can be changed in the transfer block 5, and this point will be explained below. The substrates W arranged at a 10 mm pitch in the carrier C are temporarily arranged at a 20 mm pitch in the transfer block 5, and then rearranged to a 10 / 3 mm pitch. This configuration will be explained in detail below.

[0052] 11A compares the substrate arrangement pitch in each configuration. In carrier C, the mounting plates 7 that make up each slot S are arranged at a pitch of 10 mm. The mounting plates 7 are not only arranged vertically on one side of carrier C, but also arranged vertically on the other side of carrier C. The carrier C holds the substrate W by placing both ends of the substrate W on a pair of mounting plates 7 facing each other.

[0053] Meanwhile, flat plates 233 are arranged at a pitch of 20 mm on the mounting rods 231 of the HVC attitude conversion unit 23. Therefore, if the arrangement pitch of the mounting plates 7 of the carrier C is A, the arrangement pitch of the flat plates 233 is 2A. In other words, the pair of mounting rods 231 can only hold 13 substrates W, approximately half of the 25 substrates stored in the carrier C, at one time.

[0054] Similarly, clamping plates 234 are arranged at 20 mm pitches on clamping rods 232 in the HVC attitude conversion unit 23. Therefore, if the arrangement pitch of the mounting plates 7 of carrier C is A, the arrangement pitch of the clamping plates 234 is 2A. In other words, the pair of clamping rods 232 can only hold 13 substrates W, approximately half of the 25 substrates stored in carrier C, at one time.

[0055] Figure 11B shows a simplified view of 25 substrates W arranged on a carrier C. Since three separate carriers C will appear in the following description, the carrier C in Figure 11B will be referred to as the first carrier C1. The first carrier C1 has 25 substrates W arranged at a pitch of 10 mm.

[0056] 11C shows the state when some of the substrates W stored in the first carrier C1 are transferred to the HVC posture conversion unit 23 by the handling robot HTR. The handling robot HTR has hands 211 arranged vertically at 20 mm intervals. Therefore, the handling robot HTR can only hold about half of the substrates W in the first carrier C1 at a time. The handling robot HTR removes every other substrate W from the first carrier C1 and transfers them to the HVC posture conversion unit 23. Then, as shown in FIG. 6, both ends of the substrates W are supported by a pair of mounting rods 231.

[0057] At this time, the peripheral edge of the substrate W is in contact with each of the clamping plates 234 of the pair of clamping rods 232. More specifically, the peripheral edge of the substrate W is sandwiched between the V-grooves of the clamping plates 234. Therefore, even if the support base 237 is rotated 90° in this state, the substrate W is sandwiched between the V-grooves 234b of the clamping plates 234, and therefore the substrate W will not slip off the HVC attitude conversion unit 23.

[0058] 11C also shows how the placement rod 231 supports the substrate W with the flat plate 233. Similarly, FIG. 11C shows how the clamping rod 232 clamps the substrate W with the clamping plate 234.

[0059] FIG. 11D shows a state when the rotation drive mechanism 239 in the HVC attitude conversion unit 23 is operated. This operation rotates the support base 237 by 90°, and the mounting rod 231 and the clamping rod 232 extend horizontally. The load of the substrate W is then transferred from the mounting rod 231 to the clamping rod 232, and the flat plate 233 of the mounting rod 231 is now only in contact with the substrate W. FIG. 11D shows a state when the mounting rod 231 is contracted by the rod drive mechanism 235. When the mounting rod 231 contracts (slightly displaces and moves so as to sink into the support base 237), the flat plate 233 moves away from the substrate W. Even with this operation, the substrate W is supported by the clamping rod 232, and therefore does not move along with the movement of the flat plate 233. The manner in which the flat plate 233 moves due to the contraction of the mounting rod 231 can be understood by referring to FIGS. 12A and 12B.

[0060] By moving the flat plate 233 away from the substrate W, even if the substrate W held by the holding rods 232 is lifted by the pusher 251, the flat plate 233 will not damage the rear surface of the substrate W.

[0061] 11E shows the state when the loading rod 231 is subsequently rotated 90° by the rod driving mechanism 235. The flat plate 233 on the loading rod 231 faces upward due to the rotation of the loading rod 231. The movement of the flat plate 233 is performed above the pusher 251. The loading rod 231 approaches the pusher 251 together with the substrate W clamped by the clamping rods 232, but at that time, the flat plate 233 does not collide with the substrate W held by the pusher 251. The state in which the flat plate 233 retracts from the substrate W due to the rotation of the loading rod 231 can be understood with reference to FIGS. 12B and 12C. The mounting rod 231 has an arrangement surface SF1 on which the flat plates 233 are arranged and a plane SF2 on which the flat plates 233 are not arranged, and the rod driving mechanism 235 rotates the mounting rod 231 around a central axis parallel to the arrangement direction of the flat plates 233 (the extension direction of the mounting rod 231).

[0062] In this way, when the pusher mechanism 25 performs batch assembly, the HVC attitude conversion unit 23 moves the flat plate 233, which is at the contact position POS1 where the horizontally oriented substrate W can come into contact, to the retracted position POS2 where it is retracted from the gap between the substrates W (see FIGS. 12A and 12C). Note that the pusher 251 in FIG. 11E does not clamp the substrate W, so the rotational operation of the flat plate 233 can be omitted.

[0063] 13 shows the state when the pusher 251 is subsequently raised. Then, the bottom of the substrate W held by the clamping rod 232 fits into the clamping groove 252 of the pusher 251. If the pusher 251 is raised further in this state, the substrate W will be removed from the clamping plates 234 of the clamping rod 232. In this way, the substrate W is transferred from the HVC attitude conversion unit 23 to the pusher mechanism 25.

[0064] Thereafter, the pusher 251 rises to an upper position UR set above the mounting rod 231. The pusher 251, which is positioned at the upper position UR, does not collide with the mounting rod 231, which is returned to its upright state. FIG. 13 also illustrates how the rotation drive mechanism 239 moves the mounting rod 231 and the clamping rod 232 to the virtual position IR indicated by the dashed lines. At this time, the mounting rod 231 rotates in the reverse direction and returns to the state described in FIG. 12B. Furthermore, the contracted mounting rod 231 returns to its original extended state described in FIG. 12A. FIG. 14 can be referred to in order to understand the reverse rotation and extension operations of the mounting rod 231.

[0065] FIG. 14(a) shows the state when the mounting rod 231 is raised from the state shown in FIG. 13. In this state, the flat plate 233 is located at the retracted position POS2. In this state, the substrate W cannot be placed on the mounting rod 231. Therefore, as shown in FIG. 14(b), the mounting rod 231 is rotated. In this way, the mounting rod 231 faces the space where the substrate W is located. However, in this state, the position of the mounting rod 231 is too low, and the substrate W cannot be placed on the mounting rod 231. Therefore, as shown in FIG. 14(c), the mounting rod 231 is extended. In this way, the flat plate 233 of the mounting rod 231 rises to the height of the clamping plate 234 of the clamping rod 232. In this state, the flat plate 233 is located at the abutting position POS1. When the substrate W is placed on the flat plate 233 in this state, the edge of the substrate W is clamped by the clamping plates 234, which are at the same height as the flat plate 233, and the HVC attitude conversion unit 23 can acquire the expected substrate W. With the above operations, the HVC attitude conversion unit 23 is ready to receive the substrate W.

[0066] In this way, the substrates W arranged at 20 mm pitches are handed over from the HVC attitude conversion unit 23 to the pusher mechanism 25. At this time, the clamping grooves 252 in the pusher 251 include grooves that clamp substrates W and empty grooves that do not clamp substrates W. The grooves that clamp substrates W are spaced apart by six times the arrangement pitch of the clamping grooves 252. This is because the arrangement pitch of the clamping grooves 252 is 10 / 3 mm. The arrangement pitch of the substrates W, 20 mm, is exactly six times the arrangement pitch of the clamping grooves 252. For convenience of explanation, the substrates W arranged on the pusher 251 at this time will be referred to as the initial substrate group, or simply as initial substrates W0.

[0067] FIG. 15A shows the state when the pusher 251, which has subsequently descended and returned to its initial position, is rotated halfway by the pusher rotation mechanism 253. This left-facing pusher 251 is called the L state. In contrast, the pusher 251 in FIG. 13 is in the R state, facing right. The half rotation in FIG. 15A is called the first half rotation r1. FIG. 15A also illustrates, using dashed lines, how the substrates W remaining on the first carrier C1, arranged at 20 mm pitches, are transported to the HVC attitude conversion unit 23. This transport is achieved by a handling robot HTR having hands 211 arranged at 20 mm pitches.

[0068] 15B shows the state when the substrate W held by the HVC attitude conversion unit 23 is subsequently handed over to the pusher 251. At that time, the tilting of the mounting rod 231 and the clamping rod 232 and the contraction of the mounting rod 231 are performed as described in FIG. 11D, but these have already been described in detail. Similarly, FIG. 15B also omits the rotation of the mounting rod 231 described in FIG. 11E, the fitting of the substrate W into the pusher 251, the lifting and lowering of the pusher 251, the raising operation of the mounting rod 231 and the clamping rod 232, the extension operation of the mounting rod 231, and the reverse rotation operation of the mounting rod 231, all of which are described in FIG.

[0069] As can be seen from FIG. 15B, even in this case, the substrates W arranged at a pitch of 20 mm are still handed over to the pusher 251 without changing the pitch. When the substrates W are handed over from the HVC attitude changing unit 23 to the pusher mechanism 25, they are handed over to one of the clamping grooves 252 of the pusher 251. Of the clamping grooves 252, those in which the initial group of substrates is already fitted cannot clamp any more substrates W. Therefore, the substrate W held by the HVC attitude changing unit 23 is transported to a position shifted by one pitch in the arrangement of the clamping grooves 252 from the initial group of substrates, and is fitted into the clamping groove 252 at that position. Such alignment of the substrates W and the pusher 251 is achieved by the pusher shift mechanism 254.

[0070] In this way, the substrates W arranged at 20 mm pitches are handed over from the HVC attitude conversion unit 23 to the pusher mechanism 25. At this time, the pusher 251 has alternating regions where two consecutive clamping grooves 252 for clamping the substrates W are arranged and regions where four consecutive empty grooves are not arranged for clamping the substrates W. For convenience of explanation, the substrates W newly arranged on the pusher 251 in FIG. 15B will be referred to as the first arrangement, or simply as the first substrates W1.

[0071] In this way, the pusher mechanism 25 combines the first substrate W1 in a vertical position held by the HVC posture conversion unit 23 with the clamping rod 232 and the initial substrate W0 in a vertical position that has been delivered in advance from the HVC posture conversion unit 23, and arranges the substrates W in the left-right direction Y at an arrangement pitch narrower than 10 mm.

[0072] FIG. 15C shows the state when the pusher 251 is then rotated half a turn by the pusher rotation mechanism 253. At this time, the pusher 251 is in the R state. The half turn in FIG. 15C is called the second half rotation r2. FIG. 15A also illustrates, using dashed lines, how the substrate W is transported from the second carrier C2 to the HVC posture conversion unit 23. The second carrier C2 is a new carrier transported to the carrier mounting shelf 13a by the carrier transport mechanism 11 in place of the empty first carrier C1. The second carrier C2 stores 25 substrates W arranged at 10 mm pitches. The substrates W arranged at 20 mm pitches are removed from the second carrier C2 and transported to the HVC posture conversion unit 23. This transport is achieved by a handling robot HTR having hands 211 arranged at 20 mm pitches.

[0073] Fig. 15D shows the state when the substrate W held by the HVC attitude conversion unit 23 is subsequently handed over to the pusher 251. Specific operations performed at this time, such as tilting of the placement rod 231 and the clamping rod 232, which are described in Fig. 11D, are omitted, as in Fig. 15B.

[0074] 15D, even in this case, the substrates W arranged at a pitch of 20 mm are passed to the pusher 251 without changing the pitch. Of the clamping grooves 252 of the pusher 251, those in which the substrates W of the initial substrate group, the first array, are already fitted cannot clamp any more substrates W. Therefore, the substrates W held by the HVC attitude conversion unit 23 are transported to a position shifted by one pitch in the arrangement of the clamping grooves 252 from the substrates W of the first array, and are fitted into the clamping grooves 252 at that position. Such alignment of the substrates W and the pusher 251 is achieved by the pusher shift mechanism 254.

[0075] In this way, the substrates W arranged at 20 mm pitches are handed over from the HVC attitude conversion unit 23 to the pusher mechanism 25. At this time, the pusher 251 has alternating regions where three consecutive clamping grooves 252 for clamping substrates W are arranged and regions where three consecutive empty grooves are not arranged for clamping substrates W. For convenience of explanation, the substrates W newly arranged on the pusher 251 in FIG. 15D are referred to as the second arrangement, or simply as the second substrates W2.

[0076] In this way, the pusher mechanism 25 combines the second substrate W2 in a vertical position held by the HVC posture conversion unit 23 with the initial substrate W0 and first substrate W1 in a vertical position that have been passed in advance from the HVC posture conversion unit 23, and arranges the substrates W in the left-right direction Y at an arrangement pitch narrower than a 10 mm pitch.

[0077] FIG. 15E shows the state when the pusher 251 is then rotated half a turn by the pusher rotation mechanism 253. At this time, the pusher 251 is in the L state. The half turn in FIG. 15E is called the third half turn r3. FIG. 15E also illustrates, by means of dashed lines, how the substrates W remaining on the second carrier C2 are transported to the HVC attitude conversion unit 23. The substrates W remaining on the second carrier C2 are arranged at a pitch of 20 mm. This transport is achieved by a handling robot HTR having hands 211 arranged at a pitch of 20 mm.

[0078] 15F shows the state when the substrate W held by the HVC attitude conversion unit 23 is subsequently handed over to the pusher 251. Specific operations performed at this time, such as tilting of the placement rod 231 and the clamping rod 232, which are described in FIG. 11D, are omitted, as in FIG. 15B.

[0079] As can be seen by referring to Figure 15F, even in this case, the substrates W arranged at a pitch of 20 mm are passed to the pusher 251 without changing the pitch. Of the clamping grooves 252 of the pusher 251, those that already have substrates W from the initial substrate group, the first array, and the second array fitted in them cannot clamp any more substrates W. Therefore, the substrates W held by the HVC attitude conversion unit 23 are transported to a position shifted by one pitch in the arrangement of the clamping grooves 252 from the substrates W in the second array, and are fitted into the clamping grooves 252 at that position. Such alignment of the substrates W and the pusher 251 is achieved by the pusher shift mechanism 254.

[0080] In this way, the substrates W arranged at 20 mm pitches are handed over from the HVC attitude conversion unit 23 to the pusher mechanism 25. At this time, the pusher 251 has alternating regions where four consecutive clamping grooves 252 for clamping substrates W are arranged and regions where two consecutive empty grooves are not arranged for clamping substrates W. For convenience of explanation, the substrates W newly arranged on the pusher 251 in Figure 15F will be referred to as the third arrangement, or simply as the third substrates W3.

[0081] In this way, the pusher mechanism 25 combines the third substrate W3 in a vertical position held by the HVC posture conversion unit 23 with the initial substrate W0, first substrate W1, and second substrate W2 in a vertical position that have been passed in advance from the HVC posture conversion unit 23, and arranges the substrates W in the left-right direction Y at an arrangement pitch narrower than a 10 mm pitch.

[0082] FIG. 15G shows the state when the pusher 251 is subsequently rotated half a turn by the pusher rotation mechanism 253. At this time, the pusher 251 is in the R state. The half turn in FIG. 15G is called the fourth half turn r4. FIG. 15G also illustrates, with dashed lines, how the substrate W is transported from the third carrier C3 to the HVC posture conversion unit 23. The third carrier C3 is a new carrier that has been transported to the carrier mounting shelf 13a by the carrier transport mechanism 11 in place of the empty second carrier C2. The third carrier C3 stores 25 substrates W arranged at 10 mm pitches. The substrates W arranged at 20 mm pitches are removed from the third carrier C3 and transported to the HVC posture conversion unit 23. This transport is achieved by a handling robot HTR having hands 211 arranged at 20 mm pitches.

[0083] 15H shows the state when the substrate W held by the HVC attitude conversion unit 23 is subsequently handed over to the pusher 251. Specific operations performed at this time, such as tilting of the placement rod 231 and the clamping rod 232, which are described in FIG. 11D, are omitted, as in FIG. 15B.

[0084] As can be seen from Figure 15H, even in this case, the substrates W arranged at a pitch of 20 mm are passed to the pusher 251 without changing the pitch. Of the clamping grooves 252 of the pusher 251, those that already have substrates W from the initial substrate group, first array, second array, and third array fitted in them cannot clamp any more substrates W. Therefore, the substrates W held by the HVC attitude conversion unit 23 are transported to a position shifted by one pitch in the arrangement of the clamping grooves 252 from the substrates W in the third array, and are fitted into the clamping grooves 252 at that position. This alignment of the substrates W and the pusher 251 is achieved by the pusher shift mechanism 254.

[0085] In this way, the substrates W arranged at 20 mm pitches are handed over from the HVC attitude conversion unit 23 to the pusher mechanism 25. At this time, the clamping grooves 252 in the pusher 251 include grooves that clamp the substrates W and empty grooves that do not clamp the substrates W. The empty grooves are spaced apart by six times the arrangement pitch of the clamping grooves 252. For convenience of explanation, the substrates W newly arranged on the pusher 251 in Figure 15H will be referred to as the fourth arrangement, or simply as the fourth substrate W4.

[0086] In this way, the pusher mechanism 25 combines the fourth substrate W4 in a vertical position held by the HVC posture conversion unit 23 with the initial substrate W0, first substrate W1, second substrate W2, and third substrate W3 in a vertical position that have been passed in advance from the HVC posture conversion unit 23, and arranges the substrates W in the left-right direction Y at an arrangement pitch narrower than 10 mm.

[0087] FIG. 15I shows the state when the pusher 251 is then rotated half a turn by the pusher rotation mechanism 253. At this time, the pusher 251 is in the L state. The half turn in FIG. 15I is called the fifth half turn r5. FIG. 15I also illustrates, by means of dashed lines, how the substrates W remaining on the third carrier C3 are transported to the HVC attitude conversion unit 23. The substrates W remaining on the third carrier C3 are arranged at a pitch of 20 mm. This transport is achieved by a handling robot HTR having hands 211 arranged at a pitch of 20 mm.

[0088] Fig. 15J shows the state when the substrate W held by the HVC attitude conversion unit 23 is subsequently handed over to the pusher 251. Specific operations performed at this time, such as tilting of the placement rod 231 and the clamping rod 232, which are described in Fig. 11D, are omitted, as in Fig. 15B.

[0089] As can be seen from Figure 15J, even in this case, the substrates W arranged at a pitch of 20 mm are passed to the pusher 251 without changing the pitch. Of the clamping grooves 252 of the pusher 251, those that already have substrates W from the initial substrate group, first array, second array, third array, and fourth array fitted in them cannot clamp any more substrates W. Therefore, the substrates W held by the HVC attitude conversion unit 23 are transported to a position shifted by one pitch in the arrangement of the clamping grooves 252 from the substrates W in the fourth array, and are fitted into the clamping grooves 252 at that position. Such alignment of the substrates W and the pusher 251 is achieved by the pusher shift mechanism 254.

[0090] In this way, the substrates W arranged at 20 mm pitches are handed over from the HVC attitude conversion unit 23 to the pusher mechanism 25. At this time, all of the clamping grooves 252 in the pusher 251 are clamping a substrate W. For convenience of explanation, the substrate W newly arranged on the pusher 251 in FIG. 15J is referred to as the fifth arrangement, or simply as the fifth substrate W5.

[0091] In this way, the pusher mechanism 25 combines the fifth substrate W5 in a vertical position held by the HVC posture conversion unit 23 with the initial substrate W0, first substrate W1, second substrate W2, third substrate W3, and fourth substrate W4 in a vertical position that have been passed in advance from the HVC posture conversion unit 23, and arranges the substrates W in the left-right direction Y at an arrangement pitch narrower than a 10 mm pitch.

[0092] In this way, 75 substrates W are arranged at a pitch of 10 / 3 mm on the pusher 251. The array of substrates thus generated is called a batch lot BL.

[0093] 5. Batch lot consisting of transfer blocks 16 explains the orientation of substrates W in a batch lot BL. The batch lot BL is arranged in the following order at a 10 / 3 mm pitch: initial substrate W0 originating from the first carrier C1, first substrate W1 originating from the first carrier C1, second substrate W2 originating from the second carrier C2, third substrate W3 originating from the second carrier C2, fourth substrate W4 originating from the third carrier C3, and fifth substrate W5 originating from the third carrier C3. Of these, the initial substrate W0, second substrate W2, and fourth substrate W4 are received from the HVC attitude conversion unit 23 by the pusher 251 in the R position facing right, so the orientations of these substrates W are aligned in one direction. On the other hand, the first substrate W1, third substrate W3, and fifth substrate W5 are received from the HVC attitude conversion unit 23 by the pusher 251 in the L position facing left, so the orientations of these substrates are aligned in the opposite direction.

[0094] That is, the device surface of the first substrate W1 faces the front surface of the initial substrate W0, the back surface of the second substrate W2 faces the back surface of the first substrate W1, the device surface of the third substrate W3 faces the device surface of the second substrate W2, the back surface of the fourth substrate W4 faces the back surface of the third substrate W3, the device surface of the fifth substrate W5 faces the device surface of the fourth substrate W4, and the back surface of the fifth substrate W5 faces the back surface of the initial substrate W0. In this way, the batch lot BL completed by the pusher 251 is made up of substrates W arranged face-to-face.

[0095] In this example, by transferring the substrates W while rotating the pusher 251, the substrates W can be arranged face-to-face based on the initial substrate W0, the first substrate W1, the second substrate W2, the third substrate W3, the fourth substrate W4, and the fifth substrate W5, all of which are aligned in one direction, to generate a batch lot BL.

[0096] Next, the relationship between the clamping grooves 252 of the pusher 251 and the substrates W will be described. There are six positions at which the clamping grooves 252 are provided: a reference position P where the initial substrate W0 is located, a first position P1 where the first substrate W1 is located, a second position P2 where the second substrate W2 is located, a third position P3 where the third substrate W3 is located, a fourth position P4 where the fourth substrate W4 is located, and a fifth position P5 where the fifth substrate W5 is located. The reference positions P are arranged at a 20 mm pitch on the pusher 251, and the first position P1, second position P2, third position P3, fourth position P4, and fifth position P5 divide the 20 mm between the reference positions P into six. Specifically, the 20 mm between the reference positions P is divided into six equal parts by the first position P1, second position P2, third position P3, fourth position P4, and fifth position P5. Therefore, the distance from the reference position P to the first position P1 is 10 / 3 mm, which is 1 / 3 of 10 mm, the arrangement pitch of the substrates W on the carrier C. Similarly, the distance from the first position P1 to the second position P2, the distance from the second position P2 to the third position P3, the distance from the third position P3 to the fourth position P4, the distance from the fourth position P4 to the fifth position P5, and the distance from the fifth position P5 to the reference position P are all 10 / 3 mm.

[0097] At the reference position P, a substrate W facing in one direction is located, at the first position P1, a substrate W facing in the opposite direction is located, at the second position P2, a substrate W facing in one direction is located, at the third position P3, a substrate W facing in the opposite direction is located, at the fourth position P4, a substrate W facing in one direction is located, and at the fifth position P5, a substrate W facing in the opposite direction is located.

[0098] 6. Batch lot retention in transfer block The transfer block 5 has two portions capable of holding a batch lot BL. One of these portions is a pusher 251. The pusher 251 can move back and forth between an initial position where the substrate W can be transferred to and from the HVC attitude conversion unit 23, and a transfer position PP where the batch lot BL can be transferred to the forward / backward transfer mechanism WTR. This reciprocating movement is achieved by a pusher shift mechanism 254.

[0099] The transfer block 5 has a lot support section 33 as a section capable of holding batch lots BL, separate from the pusher 251. This lot support section 33 serves as a batch lot holding section for temporarily evacuating batch lots BL when a congestion of batch lots BL occurs between the transfer block 5 and the processing block 6.

[0100] 7. Processing Block The following describes the configuration of the processing block 6 described in Figure 1. The processing block 6 is adjacent to the transfer block 5. The processing block 6 performs batch processing on the above-mentioned batch lots BL. The processing block 6 is divided into a batch processing area R1, which is arranged in the width direction (Y direction), and a batch transport area R2. Each area extends in the front-to-rear direction (X direction). In detail, the batch processing area R1 is located inside the processing block 6. The batch transport area R2 is adjacent to the batch processing area R1 and is located at the leftmost side of the processing block 6.

[0101] The batch processing area R1 in the processing block 6 is a rectangular area extending in the front-to-rear direction (X direction). One end (front side) of the batch processing area R1 is adjacent to the transfer block 5. The other end (rear side) of the batch processing area R1 extends in a direction away from the transfer block 5. When transporting a batch lot BL from the transfer block 5 to the processing block 6, the forward / backward transport mechanism WTR provided in the processing block 6 is used.

[0102] The advancing / retreating transport mechanism WTR transports multiple substrates W in a vertical position all at once between the transfer block 5, the batch processing units BPU1 to BPU6, and the batch drying chamber DC. The advancing / retreating transport mechanism WTR can hold a batch lot BL made up of substrates W arranged at a pitch of 10 / 3 mm.

[0103] The batch processing region R1 is equipped with a batch processing section that performs batch processing. Specifically, the batch processing region R1 includes a batch drying chamber DC that dries multiple substrates W in a batch, and multiple batch processing units BPU1 to BPU6 that immerse multiple substrates W in a batch, arranged in the direction in which the batch processing region R1 extends. The batch processing units BPU1 to BPU6 immerse multiple substrates W in a batch. The arrangement of the batch drying chamber DC and the batch processing units BPU1 to BPU6 will be described in detail below. The batch drying chamber DC is adjacent to the transfer block 5 from the rear. The first batch processing unit BPU1 is adjacent to the batch drying chamber DC from the rear. The second batch processing unit BPU2 is adjacent to the first batch processing unit BPU1 from the rear. The third batch processing unit BPU3 is adjacent to the second batch processing unit BPU2 from the rear. The fourth batch processing unit BPU4 is adjacent to the third batch processing unit BPU3 from the rear. The fifth batch processing unit BPU5 is adjacent to the rear of the fourth batch processing unit BPU4. The sixth batch processing unit BPU6 is adjacent to the rear of the fifth batch processing unit BPU5. Therefore, the batch drying chamber DC, first batch processing unit BPU1, second batch processing unit BPU2, third batch processing unit BPU3, fourth batch processing unit BPU4, fifth batch processing unit BPU5, and sixth batch processing unit BPU6 are arranged in this order so as to be farther away from the transfer block 5.

[0104] The batch processing units BPU1 to BPU6 each have a batch processing tank capable of holding a liquid. The batch processing tank is a liquid tank that holds a chemical liquid or pure water. The chemical liquid is an acidic aqueous solution, for example, a phosphoric acid aqueous solution. In this specification, the chemical liquid and pure water are collectively referred to as the processing liquid. The batch processing tanks that hold the chemical liquid are referred to as batch chemical processing tanks CHB2 to CHB6, and the batch processing tank that holds pure water is referred to as the batch rinse processing tank ONB.

[0105] Specifically, the second batch processing unit BPU2 includes a batch chemical processing bath CHB2 that performs chemical processing on the batch lots BL collectively, and a lifter LF2 that raises and lowers the batch lots BL between a substrate transfer position and a chemical processing position (see FIG. 2). The substrate transfer position is a position set above the batch chemical processing bath CHB2 that is accessible by the forward / backward transfer mechanism WTR, and the chemical processing position is a position set within the batch chemical processing bath CHB2 where the batch lots BL can be immersed in the chemical. The batch chemical processing bath CHB2 performs acid processing on the batch lots BL. The acid processing may be phosphoric acid processing, but other acids may also be used. The phosphoric acid processing is performed by etching the multiple substrates W that make up the batch lot BL. The etching processing, for example, chemically etches the nitride film on the surfaces of the substrates W.

[0106] The lifter LF2 can hold a batch lot BL consisting of substrates W arranged at a pitch of 10 / 3 mm. Like the lifter LF2, the lifters provided in the other processing tanks can also hold this batch lot BL. The batch drying chamber DC can store this batch lot BL.

[0107] The batch chemical processing bath CHB2 contains an acid solution such as a phosphoric acid solution. A lifter LF2 is attached to the batch chemical processing bath CHB2 to move the batch lots BL up and down. The lifter LF2 moves up and down in the vertical direction (Z direction). Specifically, the lifter LF2 moves up and down between a processing position inside the batch chemical processing bath CHB2 and a transfer position above the batch chemical processing bath CHB2. The lifter LF2 holds the batch lots BL, each of which is made up of substrates W in a vertical position. At the transfer position, the lifter LF2 transfers the batch lots BL to and from the forward / backward transport mechanism WTR. When the lifter LF2 moves down from the transfer position to the processing position while holding the batch lots BL, the entire substrates W are below the surface of the chemical solution. When the lifter LF2 moves up from the processing position to the transfer position while holding the batch lots BL, the entire substrates W are above the surface of the chemical solution. The lifter LF2 can immerse the batch lots BL en masse in the batch processing bath. At this time, the lifter LF2 descends from the delivery position to the processing position.

[0108] Specifically, the third batch processing unit BPU3 includes a batch chemical processing tank CHB3 and a lifter LF3 that raises and lowers the batch lot BL between the substrate transfer position and the chemical processing position. The batch chemical processing tank CHB3 has the same configuration as the batch chemical processing tank CHB2 described above. That is, the batch chemical processing tank CHB3 contains the above-described chemical liquid and is equipped with a lifter LF3. The batch chemical processing tank CHB3 performs the same processing on the batch lot BL as the batch chemical processing tank CHB2. The substrate processing apparatus 1 of this example includes multiple processing tanks capable of performing the same chemical processing. This is because phosphoric acid processing takes longer than other processes. Phosphoric acid processing takes a longer time (e.g., 60 minutes). Therefore, the apparatus of this example is designed to perform acid processing in parallel using multiple batch chemical processing tanks.

[0109] The fourth batch processing unit BPU4 to the sixth batch processing unit BPU6 have the same configuration as the second batch processing unit BPU2 and the third batch processing unit BPU3. Specifically, the fourth batch processing unit BPU4 includes a batch chemical processing bath CHB4 and a lifter LF4 that raises and lowers the batch lot BL between the substrate transfer position and the chemical processing position. Similarly, the fifth batch processing unit BPU5 includes a batch chemical processing bath CHB5 and a lifter LF5 that raises and lowers the batch lot BL between the substrate transfer position and the chemical processing position. The sixth batch processing unit BPU6 includes a batch chemical processing bath CHB6 and a lifter LF6 that raises and lowers the batch lot BL between the substrate transfer position and the chemical processing position. Therefore, the batch lot BL is acid-treated in one of the batch chemical processing baths CHB2 to CHB6. Performing chemical processing in parallel using five processing units in this manner increases the throughput of the apparatus.

[0110] Specifically, the first batch processing unit BPU1 includes a batch rinse processing bath ONB containing a rinse liquid and a lifter LF1 for raising and lowering the batch lot BL between a substrate transfer position and a rinse position. The substrate transfer position is a position above the batch rinse processing bath ONB accessible by the forward / backward transport mechanism WTR, and the rinse position is a position within the batch rinse processing bath ONB where the batch lot BL can be immersed in the rinse liquid. The batch rinse processing bath ONB has a configuration similar to the batch chemical processing bath CHB2 described above. That is, the batch rinse processing bath ONB contains a rinse liquid and is equipped with a lifter LF1. Unlike the other processing baths, the batch rinse processing bath ONB contains pure water and is provided for the purpose of cleaning the chemical liquid adhering to multiple substrates W. In the batch rinse processing bath ONB, the cleaning process is completed when the resistivity of the pure water in the bath increases to a predetermined value.

[0111] As described above, the batch rinse treatment tank ONB in ​​this embodiment is located closer to the transfer block 5 than the batch chemical treatment tanks CHB2 to CHB6. This configuration allows the mechanisms constituting the transfer block 5 to be separated as far as possible from the batch chemical treatment tanks CHB2 to CHB6, preventing the pusher mechanism 25 and other components from being adversely affected by acids such as phosphoric acid. Furthermore, by locating the transfer block 5 and the batch drying chamber DC close to each other, the batch lot BL that has undergone rinsing treatment is transported a short distance and immediately returned to the transfer block 5.

[0112] 8. Bulk transport area in processing block The batch transfer area R2 in the processing block 6 is a rectangular area extending in the front-to-rear direction (X direction). The batch transfer area R2 is provided along the outer edge of the batch processing area R1, with one end extending to the transfer block 5 and the other end extending in a direction away from the transfer block 5.

[0113] The batch transfer region R2 is provided with an advancing / retreating transfer mechanism WTR that transfers multiple substrates W in a batch. The advancing / retreating transfer mechanism WTR transfers multiple substrates W (specifically, batch lots BL) in a batch between a substrate transfer position PP defined in the transfer block 5, the lot support section 33, the batch drying chamber DC, and each of the batch processing units BPU1 to BPU6. The advancing / retreating transfer mechanism WTR is configured to be able to reciprocate in the front-to-rear direction (X direction) across the transfer block 5 and processing block 6. The advancing / retreating transfer mechanism WTR can enter the batch transfer region R2 in the processing block 6 as well as the substrate transfer position PP and the lot support section 33 in the transfer block 5.

[0114] The advancing / retracting transport mechanism WTR is equipped with a pair of chucks 29 that transports the batch lot BL. The pair of chucks 29 can be switched between a closed state in which they are close to each other and an open state in which they are separated from each other. The chucks 29 are members extending in the Y direction and have grooves for gripping substrates W arranged at a pitch of 10 / 3 mm. When the pair of chucks 29 is in the closed state, it receives the multiple substrates W that make up the batch lot BL. When the pair of chucks 29 is in the open state, it transfers the multiple substrates W that make up the batch lot BL to another member (such as the lifter LF1). The advancing / retracting transport mechanism WTR transfers the batch lot BL between the substrate transfer position PP in the transfer block 5 and the lot support part 33. In addition, the advancing / retracting transport mechanism WTR transfers the batch lot BL between the lifters LF1 to LF6 that belong to the batch processing units BPU1 to BPU6 in the processing block 6 and the batch drying chamber DC.

[0115] The batch transfer region R2 is provided with guide rails 31 extending in the X direction to guide the advancing and retreating transfer mechanism WTR. The advancing and retreating transfer mechanism WTR is capable of advancing and retreating in the X direction along the guide rails 31. Therefore, the guide rails 31 extend from the processing block 6 to the transfer block 5. More specifically, the guide rails 31 face the substrate transfer position PP in the transfer block 5 from the Y direction, and face the sixth batch processing unit BPU6 in the processing block 6 from the Y direction. In addition to these, the guide rails 31 face the lot support part 33 in the transfer block 5, and the batch drying chamber DC and the first batch processing unit BPU1 to the sixth batch processing unit BPU6 in the processing block 6 from the Y direction.

[0116] 9. Other configurations in the processing block The batch drying chamber DC is located between the first batch processing unit BPU1 and the transfer block 5. The batch drying chamber DC has a drying chamber that accommodates a batch lot BL, which is an array of vertically oriented substrates W. The drying chamber has an inert gas supply nozzle that supplies an inert gas into the chamber and a vapor supply nozzle that supplies an organic solvent vapor into the tank. The batch drying chamber DC first supplies an inert gas to the batch lot BL supported in the chamber, replacing the atmosphere in the chamber with the inert gas. Then, pressure reduction within the chamber begins. While the chamber is under reduced pressure, organic solvent vapor is supplied into the chamber. The organic solvent is discharged outside the chamber, along with moisture adhering to the substrates W. In this way, the batch drying chamber DC dries the batch lot BL. The inert gas may be, for example, nitrogen, and the organic solvent may be, for example, IPA (isopropyl alcohol).

[0117] In the substrate processing apparatus 1, the carrier mounting shelf 13a, the batch drying chamber DC, and the batch processing units BPU1 to BPU6 are arranged in the front-to-rear direction. That is, the carrier mounting shelf 13a is arranged in the front, and the batch drying chamber DC is arranged behind it. The batch processing units BPU1 to BPU6 are arranged further behind it. In the substrate processing apparatus 1 of this embodiment, the internal layout of the apparatus is optimized to reduce the travel distance of the advancing and retracting transport mechanism WTR.

[0118] 10. Control Unit For the control unit 131 of the substrate processing apparatus 1, refer to FIG. 1. Although not shown in FIG. 1, the control unit 131 is provided with a corresponding storage unit. The control unit 131 is configured, for example, by a CPU (Central Processing Unit). The specific configuration of the control unit is not limited, and for example, each control unit may be configured by a single processor, or each control unit may be configured by an individual processor.

[0119] The control unit 131 controls, for example, the carrier transport mechanism 11, the handling robot HTR, the HVC attitude conversion unit 23, the pusher mechanism 25, the forward / backward transport mechanism WTR, the batch processing units BPU1 to BPU6, and the batch drying chamber DC.

[0120] The storage unit stores programs and parameters related to control. The storage unit may be configured as a single device, or may be configured as individual devices corresponding to each control unit. Furthermore, the substrate processing system of this embodiment does not have any particular limitations on the configuration of the device that realizes the storage unit.

[0121] 11. Substrate processing flow Hereinafter, the flow of substrate processing in this example will be described with reference to the flowcharts of FIGS.

[0122] Step S10: The handling robot HTR extracts every other initial substrate W0 from the first carrier C1. The extracted initial substrates W0 are arranged at a pitch of 20 mm. The initial substrate W0 is changed in position from a horizontal position to a vertical position. The initial substrate W0 in the vertical position is picked up by the pusher 251.

[0123] Step S11: The remaining first substrates W1 are pulled out from the first carrier C1 by the handling robot HTR. The first substrates W1 are also arranged at a pitch of 20 mm. The first substrates W1 are taken by the HVC attitude conversion unit 23.

[0124] Step S12: Pusher 251 holding the initial substrate group in a vertical position is rotated halfway, so that the initial substrate group faces in one direction.

[0125] Step S13: In the pusher 251, batch assembly of the initial substrate W0 and the first substrate W1 is carried out. A first array, in which first substrates W1 facing in opposite directions are arranged at intervals of 20 mm, is combined with the initial substrate group, and the first substrate W1 is positioned at a first position P1 of the pusher 251. As a result, the initial substrate W0 and the first substrate W1 are lined up at an interval of 10 / 3 mm with their device surfaces facing each other. Step S13 corresponds to the first assembly process of the present invention.

[0126] Step S14: The handling robot HTR pulls out every other second substrate W2 from the second carrier C2. The pulled-out second substrates W2 are arranged at a pitch of 20 mm. The second substrates W2 are taken by the HVC attitude conversion unit 23.

[0127] Step S15: The pusher 251 holding the initial substrate W0 and the first substrate W1 is rotated halfway.

[0128] Step S16: In the pusher 251, the substrate array consisting of the initial substrate W0 and the first substrate W1 is batch-assembled with the second substrate W2. A second array in which the second substrates W2 facing one direction are arranged at intervals of 20 mm is combined with the substrate array in the pusher 251, and the second substrate W2 is positioned at a second position P2 of the pusher 251. As a result, the first substrate W1 and the second substrate W2 are lined up at an interval of 10 / 3 mm with their back surfaces facing each other.

[0129] Step S17: The remaining third substrates W3 are pulled out from the second carrier C2 by the handling robot HTR. The third substrates W3 are arranged at a pitch of 20 mm. The third substrates W3 are taken by the HVC attitude conversion unit 23.

[0130] Step S18: The pusher 251 holding the initial substrate W0, the first substrate W1, and the second substrate W2 is rotated halfway.

[0131] Step S19: In the pusher 251, a batch of the substrate array consisting of the initial substrate W0, first substrate W1, and second substrate W2 is assembled with the third substrate W3. A third array of third substrates W3 facing in opposite directions, arranged at intervals of 20 mm, is combined with the substrate array in the pusher 251, and the third substrate W3 is positioned at a third position P3 of the pusher 251. As a result, the second substrate W2 and the third substrate W3 are lined up at an interval of 10.3 mm with their device surfaces facing each other.

[0132] Step S20: The handling robot HTR pulls out every other fourth substrate W4 from the third carrier C3. The pulled-out fourth substrates W4 are arranged at a pitch of 20 mm. The fourth substrates W4 are taken by the HVC attitude conversion unit 23.

[0133] Step S21: The pusher 251 holding the initial substrate W0, the first substrate W1, the second substrate W2, and the third substrate W3 is rotated halfway.

[0134] Step S22: In the pusher 251, a batch of a substrate array consisting of the initial substrate W0, first substrate W1, second substrate W2, and third substrate W3 is assembled with a fourth substrate W4. A fourth array of fourth substrates W4 facing one direction and arranged at intervals of 20 mm is combined with the substrate array in the pusher 251, and the fourth substrate W4 is positioned at a fourth position P4 of the pusher 251. As a result, the third substrate W2 and the fourth substrate W4 are lined up at an interval of 10.3 mm with their back surfaces facing each other.

[0135] Step S23: The remaining fifth substrate W5 is pulled out from the third carrier C3 by the handling robot HTR. The fifth substrate W5 is arranged at a pitch of 20 mm. The fifth substrate W5 is taken by the HVC attitude conversion unit 23.

[0136] Step S24: The pusher 251 holding the initial substrate W0, the first substrate W1, the second substrate W2, the third substrate W3, and the fourth substrate W4 is rotated halfway.

[0137] Step S25: In the pusher 251, a batch of a substrate array consisting of the initial substrate W0, the first substrate W1, the second substrate W2, the third substrate W3, and the fourth substrate W4 is assembled with a fifth substrate W5. The fifth array, in which the fifth substrates W5 facing in opposite directions are arranged at intervals of 20 mm, is combined with the substrate array in the pusher 251, and the fifth substrate W5 is positioned at a fifth position P5 of the pusher 251. As a result, the fourth substrate W4 and the fifth substrate W5 are lined up at an interval of 10.3 mm with their device surfaces facing each other.

[0138] Step S31: The generated batch lot BL is transported from the transfer block 5 to the processing block 6 by the forward / backward transport mechanism WTR.

[0139] Step S32: The batch lot BL is subjected to chemical treatment.

[0140] Step S33: The batch lot BL is subjected to a rinse process.

[0141] Step S34: The batch lot BL is subjected to a drying process.

[0142] In this way, substrate processing is realized in batch lot units.

[0143] 18 shows a flowchart when a batch lot BL for which substrate processing has been completed is returned to a carrier C. The operation of returning substrates W is basically the same as the method described above, but with time reversed.

[0144] Step S41: The batch lot BL after the substrate processing is transported from the processing block 6 to the transfer block 5 by the forward / backward transport mechanism WTR.

[0145] Step S42: After acquiring the batch lot BL, the pusher 251 rotates half a turn. This operation causes the fifth substrate W5, which had been facing in the opposite direction, to face in one direction.

[0146] Step S43: The HVC attitude conversion unit 23 receives the fifth substrate W5 from the batch lot BL on the pusher 251, and the batch lot BL is disassembled.

[0147] Step S44: The fifth substrate W5 has its posture changed by the HVC posture changing unit 23, and is then returned to the third carrier C3 by the handling robot HTR.

[0148] Step S45: The pusher 251 rotates half a turn. This operation causes the fourth substrate W4, which had been facing in the opposite direction, to face in one direction.

[0149] Step S46: The HVC attitude conversion unit 23 receives the fourth substrate W4 from the batch lot BL on the pusher 251, and the batch lot BL is disassembled.

[0150] Step S47: The fourth substrate W4 has its posture changed by the HVC posture changing unit 23, and is then returned to the third carrier C3 by the handling robot HTR.

[0151] Step S48: The pusher 251 rotates half a turn. This operation causes the third substrate W3, which had been facing in the opposite direction, to face in one direction.

[0152] Step S49: The HVC attitude conversion unit 23 receives the third substrate W3 from the batch lot BL on the pusher 251, and the batch lot BL is disassembled.

[0153] Step S50: The third substrate W3 has its posture changed by the HVC posture changing unit 23, and is then returned to the second carrier C2 by the handling robot HTR.

[0154] Step S51: The pusher 251 rotates half a turn. This operation causes the second substrate W2, which had been facing in the opposite direction, to face in one direction.

[0155] Step S52: The HVC attitude changing unit 23 receives the second substrate W2 from the batch lot BL on the pusher 251, and the batch lot BL is disassembled.

[0156] Step S53: The second substrate W2 has its posture changed by the HVC posture changing unit 23, and is then returned to the second carrier C2 by the handling robot HTR.

[0157] Step S54: The pusher 251 rotates half a turn. This operation causes the first substrate W1, which had been facing in the opposite direction, to face in one direction.

[0158] Step S55: The HVC attitude conversion unit 23 receives the first substrate W1 from the batch lot BL on the pusher 251, and dismantles the batch lot BL.

[0159] Step S56: The first substrate W1 has its posture changed by the HVC posture changing unit 23, and is then returned to the first carrier C1 by the handling robot HTR.

[0160] Step S57: The pusher 251 rotates half a turn. This operation causes the substrate W0, which was originally facing in the opposite direction, to face in one direction.

[0161] Step S58: The HVC attitude changing unit 23 receives the initial substrate W0 from the batch lot BL in the pusher 251. After the attitude of the initial substrate W0 is changed by the HVC attitude changing unit 23, it is returned to the first carrier C1 by the handling robot HTR.

[0162] 12.Effect of this example According to the above-described configuration, the HVC attitude conversion unit 23 includes a rod drive mechanism 235 that moves the flat plate 233, which is in a first position where the horizontally oriented substrate W can abut, from the gap in the first substrate group to a retracted second position when the pusher mechanism 25 combines the first and second substrate groups. The transfer block 5 of the present invention is configured to insert the substrates W of the first substrate group into the gap in the substrates W of the second substrate group. When the first substrate group is combined with the second substrate group, the first substrate group is clamped by the clamping rods 232 of the HVC attitude conversion unit 23, and the loading rods 231 do not contribute to supporting the substrates W. In fact, because the flat plate 233 of the loading rod 231 is located in the space where the substrates W of the second substrate group are inserted, there is even a possibility that the flat plate 233 will collide with the second substrate group when the first substrate group and the second substrate group are combined. According to the present invention, when the first substrate group and the second substrate group are combined, the flat plate 233 is retracted from the gap in the first substrate group, so that the flat plate 233 of the mounting rod 231 does not get in the way when the substrate groups are combined.

[0163] According to the above-described configuration, the mounting rod 231 has a surface on which the flat plates 233 are arranged and a surface on which the flat plates 233 are not arranged, and the rod driving mechanism 235 is a rotation mechanism that rotates the mounting rod 231 around a central axis that is parallel to the arrangement direction of the flat plates 233. With this configuration, the flat plates 233 can be reliably retracted.

[0164] According to the above-described configuration, the flat plates 233 are arranged on the placing rod 231 at a pitch twice the arrangement pitch of the substrates W in the carrier C, the grooves are arranged on the clamping rod 232 at a pitch twice the arrangement pitch of the substrates W in the carrier C, and the arrangement pitch of the substrates W in the pusher mechanism 25 is 1 / 3 times the arrangement pitch of the substrates W in the carrier C. With this configuration, by repeating the transport of the substrates W six times in the pusher mechanism 25, the arrangement pitch of the substrates W can be reliably set to 1 / 3 of the arrangement pitch of the substrates W in the carrier C.

[0165] According to the above-described configuration, the pusher mechanism 25 can rotate the arrangement of the held substrates W by a half turn around the vertical axis. In this way, the pusher mechanism 25 can perform batch assembly while changing the orientation of the substrates W, so that the substrates W can be arranged face-to-face in the final batch lot. [Example]

[0166] Next, a description will be given of a substrate transport device (transfer block 5) according to Example 2. The overall configuration of the transfer block 5 according to Example 2 is the same as that of the transfer block 5 according to Example 1, but is mainly characterized by the configurations of the placement rod 231 and the clamping rod 233 in the HVC attitude conversion unit 23.

[0167] 13. Stocker block operation FIG. 19 shows how the handling robot HTR receives a substrate W from a carrier C using a hand 211. As shown in FIG. 19, the hands 211 are arranged vertically at the arrangement pitch of the slots S provided in the carrier C. That is, the hands 211 are arranged at a pitch of 10 mm. 10 mm corresponds to the predetermined interval in the present invention and is represented by the arrangement pitch Da in each drawing. The handling robot HTR transports all of the substrates W arranged at 10 mm intervals in the carrier C at once. Since the surfaces of the substrates W stored in the carrier C all face upward, the substrates W removed by the handling robot HTR all face upward. Each hand 211 is provided with a guide 214 that abuts the peripheral edge of the substrate. The guides are provided at the tip and base ends of a pair of blades that make up the hand 211. Therefore, the hand 211 is provided with four guides 214.

[0168] The handling robot HTR has 25 hands 211. The handling robot HTR uses these hands to transport 25 substrates stored in the carrier C all at once.

[0169] 20 explains the flat plates 233 and flat plates 241 of the mounting rod 231. The flat plates 233 are arranged on the mounting rod 231 at 10 mm intervals in the extension direction of the mounting rod 231. Each flat plate 233 is a plate that extends in a plane perpendicular to the arrangement direction of the flat plates 233, and the substrate W is supported by the mounting rod 231 when an end of the substrate W rests on the upper surface of the flat plate 233.

[0170] The flat plates 241 are arranged on the mounting rod 231 at a pitch of 20 / 3 mm in the extension direction of the mounting rod 231. The 20 / 3 mm pitch is called the arrangement pitch Db. The flat plates 241 are plates that extend in a plane perpendicular to the arrangement direction of the flat plates 233. Like the flat plates 233, the flat plates 241 support the substrate W on the mounting rod 231 by placing an end of the substrate W on the upper surface of the flat plates 233. The HVC attitude conversion unit 23 is provided with two mounting rods 231. The flat plate 241 of one mounting rod 231 holds one end of the substrate W, and the flat plate 241 of the other mounting rod 231 holds the other end of the substrate W.

[0171] As described above, the mounting rod 231 has one surface on which the flat plates 233 are arranged and the other surface on which the flat plates 241 are arranged. The mounting rod 231 can rotate about a rotation axis along the extending direction, and can switch the surface facing the substrate W between the one surface corresponding to the flat plates 233 and the other surface corresponding to the flat plates 241. In the initial state of the mounting rod 231, as shown in FIG. 20 , the one surface corresponding to the flat plates 233 faces the substrate W. Therefore, the HVC attitude conversion unit 23 in the initial state holds the substrate W with the flat plates 233.

[0172] 20 illustrates the clamping plates 234 and 230 of the clamping rod 232. The clamping plates 234 have arcuate sides 234a that follow the curve of the substrate W, and the arcuate sides 234a are provided with V-grooves 234b for clamping the substrate W. Because the substrate W has a shape that follows the curve of the arcuate sides 234a, the substrate W is clamped in the V-grooves 234b of the arcuate sides 234a. The clamping plates 234 are arranged on the clamping rod 232 at 10 mm intervals in the direction in which the clamping rod 232 extends. Each clamping plate 234 is a plate that extends in a plane perpendicular to the arrangement direction of the clamping plates 234, and the substrate W is clamped by the clamping rod 232 when a portion of the substrate W is clamped in the V-groove 234b of the arcuate sides 234a.

[0173] The clamping plates 230 are arranged on the clamping rods 232 at a pitch of 20 / 3 mm in the direction in which the clamping rods 232 extend. The clamping plates 230 are plates that extend in a plane perpendicular to the arrangement direction of the clamping plates 230. Like the clamping plates 234, the clamping plates 230 have arc-shaped sides 230a that follow the curve of the substrate W, and the arc-shaped sides 230a are provided with V-shaped grooves 230b for clamping the substrate W.

[0174] As such, the clamping rod 232 has one surface on which the clamping plates 234 are arranged and the other surface on which the clamping plates 230 are arranged. The clamping plates 234 can rotate about a rotation axis along the extension direction, and the surface facing the substrate W can be switched between the one surface corresponding to the clamping plates 234 and the other surface corresponding to the clamping plates 230. In the initial state of the clamping rod 232, as shown in Fig. 20, the one surface corresponding to the clamping plates 234 faces the substrate W. Therefore, the HVC attitude conversion unit 23 in the initial state holds the substrate W with the clamping plates 234.

[0175] 21 explains the arrangement pitch of the flat plates 233 and flat plates 241 of the mounting rod 231. The arrangement pitch Da of the flat plates 233 is 10 mm, and the arrangement pitch Db of the flat plates 241 is 20 / 3 mm. Therefore, one flat plate 233 is located between a pair of flat plates 233 that are spaced apart by a width of 20 mm in the extension direction of the mounting rod 231. On the other hand, two flat plates 241 are located between a pair of flat plates 241 that are spaced apart by a width of 20 mm in the extension direction of the mounting rod 231.

[0176] 21 also illustrates the arrangement pitch of the clamping plates 234 and clamping plates 230 of the clamping rod 232. The arrangement pitch Da of the clamping plates 234 is 10 mm, and the arrangement pitch Db of the clamping plates 230 is 20 / 3 mm. Therefore, one clamping plate 234 is located between a pair of clamping plates 234 that are spaced apart by a width of 20 mm in the extension direction of the clamping rod 232. On the other hand, two clamping plates 230 are located between a pair of clamping plates 230 that are spaced apart by a width of 20 mm in the extension direction of the clamping rod 232.

[0177] 22A compares the arrangement pitch of the substrates in each configuration. In the carrier C, the mounting plates 7 that form each slot S are arranged at a pitch of 10 mm. These mounting plates 7 have the same configuration as the flat plates 233 of the mounting rod 231. Therefore, the mounting plates 7 are not only arranged vertically on one surface of the carrier C, but also arranged vertically on the other surface of the carrier C. The carrier C holds the substrates W by placing both ends of the substrates W on a pair of mounting plates 7 facing each other.

[0178] Flat plates 233 are arranged at 10 mm pitches on the mounting rod 231 in the HVC posture conversion part 23. Therefore, the 25 substrates W held by the carrier C are transported all at once to the HVC posture conversion part 23. This transport is achieved by the handling robot HTR.

[0179] Figure 22B shows a simplified view of 25 substrates W arranged on a carrier C. Since three separate carriers C will appear in the following description, the carrier C in Figure 22B will be referred to as the first carrier C1. The first carrier C1 has 25 substrates W arranged at a pitch of 10 mm.

[0180] FIG. 22C shows the state when the substrate W stored in the first carrier C1 is handed over to the HVC attitude conversion unit 23 by the handling robot HTR.

[0181] At this time, the peripheral edge of the substrate W is in contact with each of the clamping plates 234 of the pair of clamping rods 232. More specifically, the peripheral edge of the substrate W is sandwiched between the V-grooves of the clamping plates 234. Therefore, even if the support base 237 is rotated 90° in this state, the substrate W is sandwiched between the V-grooves 234b of the clamping plates 234, and therefore the substrate W will not slip off the HVC attitude conversion unit 23.

[0182] 22C also shows how the placement rod 231 supports the substrate W with the flat plate 233. Similarly, FIG. 22C shows how the clamping rod 232 clamps the substrate W with the clamping plate 234.

[0183] FIG. 22D shows a state when the rotation drive mechanism 239 in the HVC attitude conversion unit 23 is operated. This operation rotates the support base 237 by 90°, and the mounting rod 231 and the clamping rod 232 extend horizontally. The load of the substrate W is then transferred from the mounting rod 231 to the clamping rod 232, and the flat plate 233 of the mounting rod 231 is now only in contact with the substrate W. FIG. 22D shows a state when the mounting rod 231 is contracted by the rod drive mechanism 235. When the mounting rod 231 contracts, the flat plate 233 moves away from the substrate W. Even with this operation, the substrate W is supported by the clamping rod 232, and therefore the substrate W does not move in conjunction with the movement of the flat plate 233.

[0184] By moving the flat plate 233 away from the substrate W, even if the substrate W held by the holding rods 232 is lifted by the pusher 251, the flat plate 233 will not damage the rear surface of the substrate W.

[0185] FIG. 22E shows a state where the mounting rod 231 is subsequently rotated 90° by the rod driving mechanism 235. The flat plate 233 on the mounting rod 231 faces upward due to the rotation of the mounting rod 231. The operation of the mounting rod 231 at this time is the same as in Example 1. Specifically, FIGS. 12B and 12C can be seen. The movement of the flat plate 233 is performed above the pusher 251. The mounting rod 231 approaches the pusher 251 together with the substrate W clamped by the clamping rods 232, but at this time, the flat plate 233 does not collide with the substrate W held by the pusher 251. Note that the pusher 251 in FIG. 22E does not clamp the substrate W, so the rotation of the flat plate 233 can be omitted.

[0186] 22F shows the state when the pusher 251 is subsequently raised. Then, the bottom of the substrate W held by the clamping rod 232 fits into the clamping groove 252 of the pusher 251. If the pusher 251 is raised further in this state, the substrate W will be removed from the clamping plates 234 of the clamping rod 232. In this way, the substrate W is transferred from the HVC attitude conversion unit 23 to the pusher mechanism 25.

[0187] Thereafter, the pusher 251 rises to an upper position UR set above the mounting rod 231. The pusher 251, which is positioned at the upper position UR, does not collide with the mounting rod 231, which is returned to the upright state. FIG. 22F also illustrates how the rotation drive mechanism 239 moves the mounting rod 231 and the clamping rod 232 to the virtual position IR indicated by the dashed lines. At this time, the contracted mounting rod 231 returns to its original extended state. Furthermore, the mounting rod 231 rotates in the reverse direction to return to the original state described in FIG. 22C.

[0188] In this way, the substrates W arranged at 10 mm pitches are handed over from the HVC attitude conversion unit 23 to the pusher mechanism 25. At this time, the clamping grooves 252 in the pusher 251 include grooves that clamp the substrates W and empty grooves that do not clamp the substrates W. The grooves that clamp the substrates W are spaced apart by three times the arrangement pitch of the clamping grooves 252. This is because the arrangement pitch of the clamping grooves 252 is 10 / 3 mm. The arrangement pitch of the substrates W, 10 mm, is exactly three times the arrangement pitch of the clamping grooves 252. For convenience of explanation, the substrates W arranged on the pusher 251 at this time will be referred to as the initial substrate group. The initial substrate group consists of substrates facing in one direction arranged at intervals of 10 mm.

[0189] 22G illustrates, by dashed lines, how the substrate W (first substrate) is transported from the second carrier C2 to the HVC attitude conversion unit 23. The second carrier C2 is a new carrier that has been transported to the carrier mounting shelf 13a by the carrier transport mechanism 11 to replace the empty first carrier C1. In the first process, the horizontally oriented substrates W are retrieved all at once from the second carrier C2 that stores the first substrates, which are arranged at intervals of 10 mm in the vertical direction Z.

[0190] 22H shows the state when the substrate W held by the HVC attitude conversion unit 23 is subsequently handed over to the pusher 251. Of the clamping grooves 252 in the pusher 251, the clamping groove 252 into which the substrate W associated with the first carrier C1 is already fitted cannot clamp any more substrate W. Therefore, the substrate W held by the HVC attitude conversion unit 23 is transported to a position shifted by one pitch in the arrangement of the clamping grooves 252 from the substrate W associated with the first carrier C1, and is fitted into the clamping groove 252 at that position. Such alignment of the substrate W and the pusher 251 is achieved by the pusher shift mechanism 254.

[0191] At this time, the tilting of the mounting rod 231 and the clamping rod 232 and the contraction of the mounting rod 231 are performed as described in Fig. 22D, but the specifics have already been described. The tilting operation of the clamping rod 232 converts the posture of each substrate W collectively from a horizontal posture to a vertical posture. Similarly, Fig. 22H also omits the rotation of the mounting rod 231 described in Fig. 22E, the insertion of the substrate W into the pusher 251, the lifting and lowering of the pusher 251, the raising operation of the mounting rod 231 and the clamping rod 232, the extension operation of the mounting rod 231, and the reverse rotation operation of the mounting rod 231, all of which are described in Fig. 22F.

[0192] In this way, the substrate W on the second carrier C2 is transferred from the HVC attitude conversion unit 23 to the pusher mechanism 25. At this time, the pusher 251 has alternating regions where two consecutive clamping grooves 252 for clamping the substrate W are located and regions where empty grooves that do not clamp the substrate W are located. In other words, the first substrates are positioned at a predetermined position (first position P1) on the pusher 251 by combining a first array formed by first substrates oriented in one direction and arranged at intervals of 10 mm with the initial substrate group. For the first position P1, see Figure 23.

[0193] In this way, the pusher mechanism 25 combines the substrate W associated with the second carrier C2 in a vertical position held by the HVC posture conversion unit 23 using the clamping rod 232 with the substrate W associated with the first carrier C1 in a vertical position that has been delivered in advance from the HVC posture conversion unit 23, and arranges the substrate W in the left-right direction Y at an arrangement pitch narrower than 10 mm.

[0194] 22I illustrates, by means of dashed lines, how substrates W (second substrates) are transported from the third carrier C3 to the HVC attitude conversion unit 23. The third carrier C3 is a new carrier that has been transported to the carrier mounting shelf 13a by the carrier transport mechanism 11 in place of the empty second carrier C2. In the first step, the horizontally oriented substrates W are retrieved all at once from the third carrier C3, which stores second substrates arranged at intervals of 10 mm in the vertical direction Z.

[0195] 22J shows the state when the substrate W held by the HVC attitude conversion unit 23 is subsequently handed over to the pusher 251. Of the clamping grooves 252 in the pusher 251, those in which the substrate W associated with the first carrier C1 and the second carrier C2 are already fitted cannot clamp any more substrates W. Therefore, the substrate W held by the HVC attitude conversion unit 23 is transported to a position shifted by one pitch in the arrangement of the clamping grooves 252 from the substrate W associated with the second carrier C2, and is fitted into the clamping groove 252 at that position. Such alignment of the substrate W and the pusher 251 is achieved by the pusher shift mechanism 254.

[0196] At this time, the tilting of the mounting rod 231 and the clamping rod 232 and the contraction of the mounting rod 231 are performed as described in Fig. 22D, but the specifics have already been described. The tilting operation of the clamping rod 232 converts the posture of each substrate W collectively from a horizontal posture to a vertical posture. Similarly, Fig. 22H also omits the rotation of the mounting rod 231 described in Fig. 22E, the insertion of the substrate W into the pusher 251, the lifting and lowering of the pusher 251, the raising operation of the mounting rod 231 and the clamping rod 232, the extension operation of the mounting rod 231, and the reverse rotation operation of the mounting rod 231, all of which are described in Fig. 22F.

[0197] In this way, the substrates W on the third carrier C3 are transferred from the HVC attitude conversion unit 23 to the pusher mechanism 25. At this time, the clamping grooves 252 of the pusher 251 are all clamping the substrates W. In this way, 75 substrates W are arranged on the pusher 251 at a pitch of 10 / 3 mm.

[0198] In this way, the pusher mechanism 25 combines the substrate W associated with the third carrier C3 in a vertical position held by the HVC posture conversion unit 23 using the clamping rod 232 with the substrate W associated with the first carrier C1 in a vertical position and the substrate W associated with the second carrier C2 that have been previously transferred from the HVC posture conversion unit 23, and arranges the substrates W in the left-right direction Y at an arrangement pitch narrower than 10 mm.

[0199] The array of substrates generated in this manner is called a temporary batch lot TL. Given that the substrates W held on carrier C were arranged at a pitch of 10 mm, the arrangement pitch of the substrates W on carrier C is converted from 10 mm to 10 / 3 mm in transfer block 5. In other words, by combining the second array, in which second substrates oriented in one direction are arranged at intervals of 10 mm, with the initial group of substrates, the second substrates are positioned at a predetermined position (second position P2) on pusher 251. For the second position P2, see Figure 23.

[0200] 23 illustrates a temporary batch lot TL. In the temporary batch lot TL, substrates W originating from the third carrier C3, substrates W originating from the second carrier C2, and substrates originating from the first carrier C1 are repeatedly arranged in this order at a pitch of 10 / 3 mm. All of these substrates W face in one direction. Therefore, the temporary batch lot TL is composed of substrates W arranged face-to-back.

[0201] Next, the relationship between the clamping groove 252 of the pusher 251 and the substrate W will be described. There are three positions at which the clamping groove 252 is provided: a reference position P at which the substrate W associated with the first carrier C1 is positioned; a first position P1 at which the substrate W associated with the second carrier C2 is positioned; and a second position P2 at which the substrate W associated with the third carrier C3 is positioned. The reference positions P are arranged at a pitch of 10 mm on the pusher 251, and the first position P1 and the second position P2 divide the 10 mm between the reference positions P into thirds. Specifically, the 10 mm between the reference positions P is divided into thirds by the first position P1 and the second position P2. Therefore, the distance from the first position P1 to the second position P2 is 1 / 3 of the arrangement pitch of the substrates W stored in the carrier C.

[0202] 14.Rearrangement of temporary batch lots In the temporary batch lot TL configured in this manner, the orientation of the arranged substrates W is constant. This arrangement is not optimal for batch chemical processing. The transfer block 5 of this embodiment can convert the arrangement of the substrates W from face-to-back to face-to-face by performing disassembly and rearrangement operations on the temporary batch lot TL.

[0203] 24 shows the state when the pusher 251 in the state of FIG. 22J has risen to the upper position UR set above the mounting rod 231. In this way, when changing the arrangement mode of the substrates W held by the pusher 251, the pusher 251 is accompanied by an upward movement. This is because changing the arrangement mode requires that some of the substrates W held by the pusher 251 be handed over to the HVC attitude conversion unit 23.

[0204] Figure 24 also shows how the clamping rods 232 in an upright state make a half rotation around a rotation axis parallel to their extension direction. Before the half rotation, the clamping rods 232 were configured to clamp the substrate W between the clamping plates 234, but after the half rotation, the clamping rods 232 clamp the substrate W between the clamping plates 230. Figure 25 explains how the arrangement pitch of the clamping plates is changed by the rotation of the clamping rods 232. Before the half rotation, the clamping rods 232 can collectively clamp the substrates W arranged at a 10 mm pitch, as shown in (a). After the half rotation, the clamping rods 232 can collectively clamp the substrates W arranged at a 20 / 3 mm pitch, as shown in (b).

[0205] However, since the clamping rod 232 cooperates with the pair of clamping rods 232 to clamp the substrate W, the half-rotation operation is performed by the pair of clamping rods 232. Before the half-rotation, the pair of clamping rods 232 had their clamping plates 234 facing each other, but after the half-rotation, the pair of clamping rods 232 have their clamping plates 230 facing each other.

[0206] 26A illustrates how the HVC attitude conversion unit 23 then operates to rotate the upright placement rod 231 and clamp rod 232 by 90°. This operation makes the HVC attitude conversion unit 23 ready to receive the substrate W from the pusher 251.

[0207] 26B (a) shows the state in which the pusher 251 in the upper position has begun to descend to transfer the substrates W to the HVC attitude conversion unit 23. As can be seen from this figure, the arrangement pitch of the clamping plates 230 is longer than the arrangement pitch of the substrates W in the temporary batch lot TL. Therefore, the number of clamping plates 230 is fewer than the number of substrates W in the temporary batch lot TL.

[0208] FIG. 26B shows the state when the temporary batch lot TL held by the pusher 251 in (b) is handed over to the clamping rod 232. The clamping rod 232 cannot clamp all of the substrates W of the temporary batch lot TL because the number of clamping plates 230 is fewer than the number of substrates W in the temporary batch lot TL. As a result, half of the substrates W making up the temporary batch lot TL are clamped by the corresponding clamping plates 230, and the remaining half are not clamped by any clamping plates 230 and remain held by the pusher 251. FIG. 26C illustrates how the substrates W clamped by the clamping plates 230 and the substrates W still held by the pusher 251 are arranged alternately.

[0209] The pusher 251 continues to descend even after the substrate W is transferred to the clamping rod 232 .

[0210] 26C shows the state after the pusher 251 has passed through the clamping rod 232. In this way, the temporary batch lot TL is separated into a first set of substrates W1 arranged at a pitch of 20 / 3 mm and a second set of substrates W2 also arranged at a pitch of 20 / 3 mm. If the first set of substrates W1 is referred to as the first set and the second set of substrates W2 is referred to as the second set, the temporary batch lot TL is divided into the first set and the second set. The first set of substrates is clamped by the clamping rod 232, and the second set of substrates is held by the pusher 251.

[0211] 26C explains the rotation of the mounting rod 231 around the left-right axis. When inserting a flat plate into a gap in the first group of substrates W1, the arrangement pitch of the first group of substrates W1 and the arrangement pitch of the flat plate must match. The arrangement pitch of the first group of substrates W1 is 20 / 3 mm, and the arrangement pitch of the flat plate 233 described in FIG. 20 is 10 mm. Therefore, when attempting to position the flat plate 233 in a gap in the first group of substrates W1, the arrangement pitches do not match, and the first group of substrates W1 and the flat plate 233 will collide.

[0212] In anticipation of such a situation, the mounting rod 231 of this example has an arrangement in which the flat plates 241 are arranged at a pitch of 20 / 3 mm. When the mounting rod 231 is rotated to position the flat plates 241 in the gaps of the first set of substrates W1, the first set of substrates W1 and the flat plates 241 will not collide with each other because the arrangement pitches are the same.

[0213] This rotation operation is performed with the mounting rod 231 in a contracted state. If the same operation were performed on the extended mounting rod 231, the flat plate 241 would collide with the first group of substrates W1. This is because the position in the left-right direction Y of the flat plate 241 placed on the extended mounting rod 231 coincides with the position in the left-right direction Y of the first group of substrates W1 clamped by the clamping rods 232. Therefore, when inserting the flat plate 241 into the gaps in the first group of substrates W1, it is necessary to shift the flat plate 241 in the left-right direction Y relative to the first group of substrates W1.

[0214] When the mounting rod 231 rotates and the flat plate 241 is inserted into the gap between the first set of substrates W1, the mounting rod 231 is now extended. In this way, the flat plate 241 comes into contact with the rear surface of the first set of substrates W1, and the substrates W are securely held by the mounting rod 231 even when the mounting rod 231 is in the upright position.

[0215] 26D shows the state when the HVC attitude conversion unit 23 is activated and the mounting rods 231 are in an upright position. At this time, the clamping rods 232 only clamp the ends of the first set of substrates W1, and therefore cannot hold the first set of substrates W1 in a horizontal position by themselves. In this regard, the flat plates 241 of the mounting rods 231 can hold the center of the first set of substrates W1, so even if the clamping rods 232 are in an upright position, the first set of substrates W1 in a horizontal position is reliably held by the pair of mounting rods 231.

[0216] 26D shows the state in which the pusher 251 rises. The mounting rod 231 and the clamping rod 232 in the HVC attitude conversion unit 23 have already rotated 90° and are retracted from the pusher 251. Therefore, even if the pusher 251 rises, it will not collide with the clamping rod 232 or the mounting rod 231.

[0217] 26E shows the pusher 251 making a half rotation in a position above the HVC attitude conversion unit 23. The pusher 251 rotates around a vertical axis due to the operation of the pusher rotation mechanism 253. By performing this operation, the second set of substrates W2, which were facing in one direction, all now face in the opposite direction.

[0218] 26F shows the state in which the pusher 251 is lowered after the half-rotation operation. The pusher 251 passes through the arrangement of the first set of substrates W1 and stops at a position below the first set of substrates W1.

[0219] Figure 26G illustrates how the HVC position conversion unit 23 then operates, causing the placement rod 231 and clamping rod 232, which were in an upright position, to rotate 90 degrees. This action prepares the HVC position conversion unit 23 to deliver the first set of substrates W1 to the pusher 251. Note that before the state shown in Figure 26G is reached, the placement rod 231 contracts and rotates as described in Figures 22D and 22E, causing the clamping plate 230 to retract from the gap in the first set of substrates W1. By performing this action in advance, the clamping plate 230 will not collide with the pusher 251 emerging from below or with the second set of substrates W2 it supports.

[0220] FIG. 26G also shows the state when the pusher 251 starts to rise after the placing rod 231 and the clamping rod 232 have tilted.

[0221] 26H (a) shows the state when the pusher 251 receives the first set of substrates W1 from the clamping rod 232. At this time, the pusher 251 produces a batch lot BL in which the first set of substrates W1 facing in one direction and the second set of substrates W2 facing in the opposite direction are alternately arranged.

[0222] The pusher 251 continues to rise even after it has acquired the first set of substrates W1 from the clamping rods 232.

[0223] 26H shows the state after the pusher 251 has removed the first set of substrates W1 from the clamping rods 232. In this way, the batch lot BL of this example is produced.

[0224] The batch lot BL is generated according to the following procedure. First, the substrates W constituting the temporary batch lot TL are divided into a first group and a second group so that two opposing substrates W are in different pairs. The first group and the second group are then moved relatively in a direction (vertical direction Z) perpendicular to the substrate arrangement direction (left-right direction Y), thereby dismantling the temporary batch lot TL. The second group of substrates W2 is then rotated half a turn. As a result, the second group of substrates W2 faces in the opposite direction from its original direction. Finally, the first group of substrates W1 and the second group of substrates W2 are combined, and the first group of substrates W1 facing in one direction and the second group of substrates W2 facing in the opposite direction are alternately arranged. This face-to-face arrangement of substrates W constitutes the batch lot BL.

[0225] The number of substrates W constituting the batch lot BL is 75, which is the same as the number of substrates W related to the temporary batch lot TL. Therefore, the number of substrates constituting the batch lot BL is three times that of the initial group of substrates.

[0226] 27 illustrates a batch lot BL. In the batch lot BL, a first set of substrates W1 facing in one direction and a second set of substrates W2 facing in the opposite direction are repeatedly arranged at a pitch of 10 / 3 mm. Therefore, the batch lot BL is composed of substrates W arranged face-to-face.

[0227] 15. Substrate processing flow Hereinafter, the flow of substrate processing in this example will be described with reference to the flowchart in FIG.

[0228] Step T11: The substrates W arranged at 10 mm pitches and transferred by the handling robot HTR from the first carrier C1 are picked up by the pusher 251 after their orientations are changed.

[0229] Step T12: The handling robot HTR acquires the substrate W from the second carrier C2 and passes it to the HVC attitude conversion unit .

[0230] Step T13: The substrates W arranged at 10 mm pitches retrieved from the second carrier C2 are transferred to the pusher 251 after their orientation is changed. Since the substrates W associated with the first carrier C1 are already arranged on the pusher 251, the substrates W associated with the first carrier C1 and the substrates W associated with the second carrier C2 are batch assembled in the pusher 251. Step T13 corresponds to the first assembly process of the present invention. The second process described above is executed between step T12 and step T13.

[0231] Step T14: The handling robot HTR acquires the substrate W from the third carrier C3 and transfers it to the HVC attitude conversion unit 23.

[0232] Step T15: The substrates W arranged at 10 mm pitches retrieved from the third carrier C3 are transferred to the pusher 251 after their orientation is changed. Since the pusher 251 already has the substrates W associated with the first carrier C1 and the substrates W associated with the second carrier C2 arranged therein, the substrate rows associated with the first carrier C1 and the second carrier C2 and the substrates W associated with the third carrier C3 are assembled into a batch in the pusher 251. In this way, a provisional batch lot TL is generated. Step T15 corresponds to the second assembly process of the present invention. The second process described above is carried out between step T14 and step T15.

[0233] Step T16: The substrates W constituting the temporary batch lot TL are divided into a first group and a second group. The pusher 251 holding the temporary batch lot TL transfers the first group of substrates W1 relating to the first group to the clamping rod 232 and separates it from the second group of substrates W2 relating to the second group.

[0234] Step T17: The second set of substrates W2 is rotated halfway, so that the second set of substrates W2, which had been facing in one direction, now faces in the opposite direction.

[0235] Step T18: The pusher 251 moves up and down to retrieve the first set of substrates W1 from the clamping rod 232. The pusher 251 has clamping grooves 252 for clamping the second set of substrates W2 and empty clamping grooves 252 arranged alternately. Once each of the first set of substrates W1 is inserted into the corresponding empty clamping groove 252, the production of the batch lot BL is completed.

[0236] Step T19: The generated batch lot BL is transported from the transfer block 5 to the processing block 6 by the forward / backward transport mechanism WTR.

[0237] Step T20: The batch lot BL is subjected to chemical treatment.

[0238] Step T21: The batch lot BL is subjected to a rinse process.

[0239] Step T22: The batch lot BL is subjected to a drying process.

[0240] In this way, substrate processing is realized in batch lot units.

[0241] Step T23: The batch lot BL for which the substrate processing has been performed is transported from the processing block 6 to the transfer block 5 by the forward / backward transport mechanism WTR.

[0242] Step T24: The pusher 251 transfers the first set of substrates W1 to the clamping rod 232 while holding the second set of substrates W2.

[0243] Step T25: The second set of substrates W2 is rotated halfway, so that the second set of substrates W2, which had been facing in the opposite direction, now faces in one direction.

[0244] Step T26: The pusher 251 obtains the first set of substrates W1 from the clamping rod 232. The pusher 251 has clamping grooves 252 for clamping the second set of substrates W2 and empty clamping grooves 252 arranged alternately. By inserting each of the first set of substrates W1 into the corresponding empty clamping groove 252, the generation of the temporary batch lot TL is completed.

[0245] Step T27: The substrates W related to the third carrier C3 are arranged at 10 mm pitches on the pusher 251. The pusher 251 moves up and down to transfer the substrates W related to the third carrier C3 to the clamping rod 232. In this way, the temporary batch lot TL is disassembled.

[0246] Step T28: The substrate W handed over to the clamping rod 232 is returned to the third carrier C3 by the handling robot HTR after its orientation is changed.

[0247] Step T29: The substrates W associated with the second carrier C2 are arranged at 10 mm pitches on the pusher 251. The pusher 251 moves up and down to transfer the substrates W associated with the second carrier C2 to the clamping rod 232. In this manner, the disassembly of the temporary batch lot TL proceeds.

[0248] Step T30: The substrate W handed over to the clamping rod 232 is returned to the second carrier C2 by the handling robot HTR after its posture is changed.

[0249] Step T31: The substrates W associated with the first carrier C1 are arranged at 10 mm pitches on the pusher 251. The pusher 251 moves up and down to deliver the substrates W associated with the first carrier C1 to the clamping rod 232. The delivered substrates W are then returned to the first carrier C1 by the handling robot HTR after their orientation is changed.

[0250] 16.Effect of this example In the above-described configuration, the flat plates 233 are arranged on the placement rod 231 at the same arrangement pitch of the substrates W in the carrier C, the clamping rod 232 has grooves arranged at the same arrangement pitch of the substrates W in the carrier C, and the pusher mechanism 25 divides the substrates W into a first group and a second group so that two opposing substrates W in the arrangement of the held substrates W are in different groups, and can rotate the substrates W in the second group a half turn around the vertical axis. With this configuration, the substrates W can be arranged face-to-face in the batch lot that is finally produced.

[0251] According to the above-described configuration, the arrangement pitch of the substrates W in the pusher mechanism 25 is 1 / 3 times the arrangement pitch of the substrates W in the carrier C, and the pusher mechanism 25 holds the second set of substrates W at a pitch that is 2 / 3 times the arrangement pitch of the substrates W in the carrier C. With this configuration, the arrangement pitch of the batch lot that is ultimately produced can be 1 / 3 of the arrangement pitch of the substrates W in the carrier C.

[0252] 17. Variations The present invention is not limited to the configuration of the above-described embodiment, but can be modified as follows.

[0253] <Variation 1> Although the HVC attitude change unit 23 in the first embodiment had a mounting rod 231 with one row of flat plates 233 arranged at 20 mm intervals, the present invention is not limited to this configuration. As shown in Fig. 29, the HVC attitude change unit 23 may be provided with a mounting rod 231 with another similar array of flat plates 233. As shown in Fig. 29, the mounting rod 231 has two arrays of flat plates 233, and the relationship between the arrays is such that one is behind the other.

[0254] According to the above-described configuration, the mounting rod 231 has, as surfaces on which the flat plates 233 are arranged, an outward surface F1 on which the first flat plate 233 is arranged and a return surface F2 on which the second flat plate 233 is arranged, and when transporting the substrate W from the handling robot HTR to the pusher mechanism 25, the rod driving mechanism 235 rotates the mounting rod 231 so that the outward surface F1 faces the substrate W. On the other hand, when transporting the substrate W from the pusher mechanism 25 to the handling robot HTR, the rod driving mechanism 235 rotates the mounting rod 231 so that the return surface F2 faces the substrate W. In this manner, the present invention can prevent contamination of the substrate via the flat plates of the mounting rod by distinguishing between the flat plates of the mounting rod used in the outward path and the flat plates of the mounting rod used in the return path.

[0255] <Variation 2> The configuration in Modification 1 in which the flat plates 233 are selectively used for the outbound and inbound journeys can also be applied to the transfer block 5 according to Example 2. The HVC attitude conversion unit 23 in Example 2 had a mounting rod 231 having one row of flat plates 233 arranged at 10 mm intervals and another row of flat plates 233 arranged at 20 / 2 mm intervals, but the present invention is not limited to this configuration. As shown in Figure 30, the HVC attitude conversion unit 23 may be provided with a mounting rod 231 having another pair of similar arrays of flat plates 233.

[0256] FIG. 30 illustrates a mounting rod 231 according to this modification. On the front side of the mounting rod 231 shown in FIG. 30(a), two arrays of flat plates 233 and one array of flat plates 241 are visible. On the other hand, on the back side of the mounting rod 231 shown in FIG. 30(b), one array of flat plates 233 is visible. A rod driving mechanism 235 appropriately rotates the mounting rod 231 to realize batch assembly and batch disassembly according to Example 2. The mounting rod 231, which is a hexagonal prism, has a side that does not have the flat plates 233 and 241. Therefore, when the flat plates 233 and 241 need to be retracted from the substrate W, this side faces the substrate W. This modification achieves the same effects as Modification 1.

[0257] <Variation 3> Although the mounting rod 231 in Example 1 rotates to move the flat plate 233 toward and away from the substrate W, the present invention is not limited to this configuration. The position of the flat plate 231 relative to the substrate W may be changed by moving the pair of mounting rods 231 toward and away from each other. When the pair of mounting rods 231 are moved away from the substrate W, the flat plate 231 moves away from the substrate W and retreats from the gap in the first substrate group. When the pair of mounting rods 231 are moved toward each other from this state, the flat plate 233 returns to a position where the substrate W can be placed. The rod driving mechanism 235 realizes this movement of the mounting rods 231.

[0258] <Variation 4> The mounting rod 231 in Example 1 rotates to move the flat plate 233 toward and away from the substrate W, but the present invention is not limited to this configuration. The flat plate 233 may be configured to be retractable from the main body of the mounting rod 231, so that the flat plate 233 approaches and moves away from the substrate W. When the flat plate 233 is fitted into the main body of the mounting rod 231, the flat plate 233 moves away from the substrate W and retreats from the gap in the first substrate group. When the flat plate 233 is made to emerge from the main body of the mounting rod 231 from this state, the flat plate 233 returns to a position where the substrate W can be placed. The rod drive mechanism 235 realizes this movement of the flat plate 233. [Explanation of symbols]

[0259] 1. Substrate processing equipment 1A housing 3 Stocker Block 5 Transfer block 6 Processing Blocks 7. Mounting plate 9 Loading Port 11 Carrier transport mechanism 13 Shelves 13a Carrier placement shelf 13b Shelf 23 HVC attitude change unit 25 Pusher mechanism 29 Zipper 31 Guide rail 33 Rod support 131 Control Unit 211 hands 213 Moving support mechanism 214 Guide 230 Holding plate 231 Mounting rod 232 Clamping rod 233 Flat plate 234 Holding plate 234a Arc edge 234b V groove 235 Rod drive mechanism 236 Rod rotation mechanism 237 Support stand 239 Rotational Drive Mechanism 241 Flat plate 251 Pusher 251a U groove 252 Holding groove 253 Pusher rotation mechanism 254 Pusher shift mechanism 255 Pusher lifting mechanism ACB transport storage area BL batch lot BPU1 Batch Processing Unit BPU2 Batch Processing Unit BPU3 Batch Processing Unit BPU4 Batch Processing Unit BPU5 Batch Processing Unit BPU6 Batch Processing Unit C Carrier C1 First Carrier C2 Second Carrier C3 Third Carrier CHB2 batch chemical treatment tank CHB3 batch chemical treatment tank CHB4 batch chemical treatment tank CHB5 batch chemical treatment tank CHB6 batch chemical treatment tank DC Batch Drying Chamber F1 side F2 side HTR Handling Robot IR Virtual Position LF1 Lifter LF2 Lifter LF3 Lifter LF4 Lifter LF5 Lifter LF6 Lifter ONB batch rinse processing tank P reference position P1 1st position P2 2nd position P3 3rd position P4 4th position P5 5th position POS1 Contact position POS2 Evacuation position PP handover position R1 Batch Processing Area R2 Bulk transport area S slot SF1 array surface SF2 plane TL temporary batch lot UR sky position W substrate W1 First set of board W2 2nd set board W3 3rd board W4 4th board W5 5th board WTR forward / backward transfer mechanism

Claims

1. a handling mechanism for retrieving a group of substrates from a carrier that stores horizontally oriented substrates arranged vertically; a position conversion mechanism including a pair of placement rods on which flat plates for placing the ends of the substrate delivered by the handling mechanism are arranged at a predetermined pitch in the vertical direction, a pair of clamping rods on which grooves for clamping the substrate in a vertical position are arranged at the predetermined pitch in the vertical direction, a support member on which the placement rods and the clamping rods are erected, and a base for supporting the support member in an invertible manner; a substrate holding mechanism that combines a first group of substrates in a vertical position held by the position change mechanism with the clamping rods and a second group of substrates in a vertical position delivered in advance from the position change mechanism, and arranges the substrates in a horizontal direction at an arrangement pitch narrower than the predetermined pitch; The posture conversion mechanism includes a movement mechanism that moves the flat plate, which is in a first position where a horizontally oriented substrate can come into contact with the flat plate, from a gap in the first substrate group to a second position where the flat plate is retracted when the substrate holding mechanism combines the first substrate group with the second substrate group. A substrate transport device characterized by:

2. 2. The substrate transport device according to claim 1, the mounting rod has a surface on which the flat plate is arranged and a surface on which the flat plate is not arranged, The moving mechanism is a rotation mechanism that rotates the placement rod around a central axis that is parallel to the arrangement direction of the flat plates. A substrate transport device characterized by:

3. 3. The substrate transport device according to claim 2, the mounting rod has, as surfaces on which the flat plates are arranged, a surface for an outgoing path on which a first flat plate is arranged and a surface for a returning path on which a second flat plate is arranged; The rotation mechanism rotates the placing rod so that the outward surface faces the substrate when transporting the substrate from the handling mechanism to the substrate holding mechanism, and rotates the placing rod so that the return surface faces the substrate when transporting the substrate from the substrate holding mechanism to the handling mechanism. A substrate transport device characterized by:

4. 2. The substrate transport device according to claim 1, the flat plates are arranged on the mounting rod at a pitch twice the pitch of the substrates on the carrier; the grooves are arranged on the clamping rod at a pitch twice the pitch of the substrates on the carrier; The arrangement pitch of the substrates in the substrate holding mechanism is 1 / 3 of the arrangement pitch of the substrates in the carrier. A substrate transport device characterized by:

5. 2. The substrate transport device according to claim 1, The substrate holding mechanism is capable of rotating the array of held substrates halfway around a vertical axis. A substrate transport device characterized by:

6. 2. The substrate transport device according to claim 1, the flat plates are arranged on the mounting rod at the same pitch as the substrates on the carrier; the grooves are arranged in the clamping rod at the same pitch as the substrates in the carrier; The substrate holding mechanism is capable of dividing the substrates into a first set and a second set so that two opposing substrates in an arrangement of the held substrates are in different sets, and rotating the substrates in the second set by a half-turn around a vertical axis. A substrate transport device characterized by:

7. 7. The substrate transport device according to claim 6, The arrangement pitch of the substrates in the substrate holding mechanism is 1 / 3 of the arrangement pitch of the substrates in the carrier. A substrate transport device characterized by:

8. A substrate processing apparatus comprising the substrate transfer device according to claim 1, an immersion tank for immersing the substrate held by the substrate holding mechanism in a processing liquid; A substrate processing apparatus characterized by:

Images