Substrate processing device

Abstract

To provide a substrate processing device capable of efficiently processing a substrate.SOLUTION: A posture conversion mechanism 19 comprises a pair of horizontal holding parts 37, at which shelves 37A are aligned at a reference pitch, and a pair of vertical holding parts 39, at which holding members 39A are aligned at the reference pitch. A pusher mechanism 21 holds the plural substrates W aligned at an unequal pitch in combination with a second substrate group W2 at a vertical posture held by the pair of the vertical holding parts 39 and a first substrate group W1 at the vertical posture pre-delivered by the pair of the vertical holding parts 30. The holding member 39 A has a holding groove 39C formed along a peripheral edge Wa of the substrate W at the vertical posture. The holding member 39A is provided with a holding groove 39C at a position displaced from a center 39Ba in a width direction along an alignment direction W held at the vertical posture to a side on which a first interval TN1 is arranged when combining the first substrate group W1 with the second substrate group W2.SELECTED DRAWING: Figure 25

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for processing substrates. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of the FPD include liquid crystal display devices and organic EL (electroluminescence) display devices. [Background technology]

[0002] Conventionally, there is known a substrate processing apparatus that immerses multiple substrates in a processing solution and processes them all at once. This substrate processing apparatus includes a position change mechanism and a pusher (see, for example, Patent Document 1). The position change mechanism changes the position of the substrates between a horizontal position and a vertical position. The pusher can transfer multiple substrates in a vertical position to and from the position change mechanism by vertical movement of a lifting and lowering holder.

[0003] After 25 substrates are transferred from the position change mechanism to the lifting support, the lifting support rotates 180 degrees around its vertical axis. The 180-degree rotation moves the 25 held substrates by a half-pitch. In this state, another 25 substrates are transferred from the position change mechanism to the lifting support. The later 25 substrates are combined with the earlier 25 to form a group of 50 substrates on the lifting support. At this time, two adjacent substrates are positioned face-to-face, with their front surfaces (or back surfaces) facing each other. Batch processing of substrates in a face-to-face position prevents contamination of the device surfaces of the substrates. Furthermore, the 50 substrates held by the lifting support are aligned at a half-pitch, half the substrate holding pitch within the carrier. Batch processing of substrates aligned at a half-pitch reduces the amount of processing solution used. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-93230 Summary of the Invention [Problem to be solved by the invention]

[0005] In order to further reduce the amount of processing liquids (chemicals and cleaning liquids) used in a substrate processing apparatus, there is a demand for aligning multiple substrates at a narrower pitch than half pitch and processing multiple substrates aligned at this narrow pitch all at once.

[0006] In such a case, the group of substrates held by the attitude conversion mechanism must be placed between the substrates of the group of substrates previously held by the pitch conversion mechanism at intervals corresponding to the narrow pitch. Therefore, the clearance between the guides that hold the substrates and the substrates held by the pitch conversion mechanism becomes narrower than in the past. This means that the guides that hold the substrates and that make up the attitude conversion mechanism may interfere with the substrates previously held by the pitch conversion mechanism. When such interference occurs, the substrates cannot be processed efficiently.

[0007] Consideration has been given to making the guide even thinner. However, the guide is already sufficiently thin. Therefore, if the guide is made even thinner, it becomes difficult to ensure the dimensional accuracy of the guide. The possibility of the above-mentioned interference still remains.

[0008] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of processing substrates efficiently. [Means for solving the problem]

[0009] In order to achieve the above object, the present invention has the following configuration. That is, the substrate processing apparatus according to the present invention comprises: In a substrate processing apparatus for processing a substrate, a first mechanism having a holder for holding substrates aligned at equal intervals in a vertical position; a second mechanism that combines a second substrate group held by the first mechanism with a first substrate group delivered in advance from the first mechanism to hold a plurality of substrates aligned at an irregular pitch where first intervals and second intervals wider than the first intervals are alternately repeated; a pitch conversion unit that receives the plurality of substrates aligned at the uneven pitch from the second mechanism and aligns the plurality of substrates aligned at the uneven pitch at a narrow pitch in which the first interval is repeated; a substrate processing section that collectively processes the plurality of substrates aligned at the narrow pitch; a main transport mechanism that transports the plurality of substrates aligned at the narrow pitch to the substrate processing section, The holding member is a holding groove formed along the peripheral edge of the substrate; The holding groove is provided at a position shifted from the center in the width direction along the alignment direction of the substrates toward the side where the first gap is formed when the first substrate group and the second substrate group are combined.

[0010] According to the substrate processing apparatus of the present invention, vertically aligned substrates arranged at equal intervals are aligned at a narrow pitch through a first mechanism, a second mechanism, and a pitch conversion unit. The narrowly aligned substrates are processed in batches by a substrate processing unit. This reduces the amount of processing liquid (chemical and cleaning liquid) used by the substrate processing apparatus. The second mechanism combines a second substrate group held by a holding unit of the first mechanism with a first substrate group previously delivered from the first mechanism, thereby holding multiple substrates aligned at an unequal pitch in which a first interval and a second interval wider than the first interval alternate. When combining substrates at the first interval, there is a concern that the substrates of the second substrate group held by the holding unit of the first mechanism or the holding unit may interfere with the substrates of the first substrate group held by the second mechanism. Therefore, the holding unit has a holding groove at a position shifted from the center of the width direction along the substrate alignment direction toward the side where the first interval is formed when the first substrate group and the second substrate group are combined. This makes it possible to reduce interference between the substrates of the first substrate group held by the holding portion of the first mechanism or the substrates of the second substrate group held by the second mechanism, even at locations where they are combined at the first interval, thereby providing a substrate processing apparatus that can process substrates efficiently.

[0011] In addition, in the substrate processing apparatus according to the present invention, the first mechanism is a posture conversion mechanism that includes a pair of horizontal holding units in which shelves for placing edges of horizontally oriented substrates are arranged at the same pitch, and a pair of vertical holding units in which holding members for holding vertically oriented substrates are arranged at the same pitch, and that converts the postures of a plurality of substrates between a vertical posture and a horizontal posture by rotationally displacing the pair of horizontal holding units and the pair of vertical holding units; the second mechanism is a pusher mechanism having the pusher member that combines the second group of substrates in the vertical position held by the pair of vertical holding parts with the first group of substrates in the vertical position that have been passed in advance from the pair of vertical holding parts, and holds the plurality of substrates aligned at the uneven pitch; The holding member is The holding groove is formed along the peripheral edge of the substrate in the vertical position, The holding groove is provided at a position shifted from the center in the width direction along the alignment direction of the substrates held in the vertical posture to a side where the first gap is disposed when the first substrate group and the second substrate group are combined. It is preferable to have the above configuration (claim 2). This makes it possible to reduce interference between the substrates of the second substrate group held by the pair of vertical holding parts and the substrates of the first substrate group held by the pusher member when the substrates of the second substrate group held by the pair of vertical holding parts are combined at the first interval with the substrates of the first substrate group that have been passed from the pair of vertical holding parts to the pusher member in advance. Therefore, it is possible to provide a substrate processing apparatus that can process substrates efficiently.

[0012] In addition, in the substrate processing apparatus according to the present invention, The holding member is the deepest part of the holding groove is located at a position shifted from the center in the width direction toward the side where the first gap is formed when the first substrate group and the second substrate group are combined. It is preferable (claim 3). This allows the substrate to be held at the deepest part of the holding groove at a position shifted toward the side where the first gap is formed when the first substrate group and the second substrate group are combined. Therefore, even at a location where the first gap is formed, interference between the holding member of the first mechanism holding the substrate and the substrate held by the second mechanism can be reduced. Therefore, it is possible to provide a substrate processing apparatus that can process substrates efficiently.

[0013] In addition, in the substrate processing apparatus according to the present invention, The holding member is a first holding wall portion that holds one end of a peripheral edge portion of the substrate that is inserted into the holding groove; a second holding wall portion that holds the other end of the peripheral edge portion of the substrate that is inserted into the holding groove, The first holding wall portion and the second holding wall portion have different thicknesses in the width direction at the same groove depth position. It is preferable (claim 4). To reduce interference between the holding members of a pair of vertical holding members or the substrates of the second substrate group held by the holding members and the substrates of the first substrate group held by the pusher member, it is conceivable to make both the first holding wall portion and the second holding wall portion the same size but thin in the width direction. However, if both holding wall portions are the same size but thin in the width direction, the rigidity of the holding member decreases on both sides of the first holding wall portion and the second holding wall portion. As a result, the holding member is prone to deformation, making it difficult to maintain the dimensional accuracy of the holding member. In the present invention, the first holding wall portion and the second holding wall portion constituting the holding member have different widthwise thicknesses at the same groove depth position. This prevents the rigidity of the holding member from decreasing at both the first holding wall portion and the second holding wall portion. As a result, the holding member is less prone to deformation, making it easier to maintain the dimensional accuracy of the holding member.

[0014] In addition, in the substrate processing apparatus according to the present invention, a thickness in the width direction of the first retaining wall portion is thinner than a thickness in the width direction of the second retaining wall portion located at the same groove depth; the first holding wall portion is provided on a side where the first gap is disposed when the first substrate group and the second substrate group are combined; The second holding wall portion is provided on the side where the second gap is disposed when the first substrate group and the second substrate group are combined. It is preferable (claim 5). In the present invention, the thickness of the first retaining wall portion on the side where the first gap is disposed is thinner than the thickness of the second retaining wall portion, and the thickness of the second retaining wall portion on the side where the second gap is disposed is thicker than the thickness of the first retaining wall portion. This prevents a decrease in the rigidity of the retaining member in both the first retaining wall portion and the second retaining wall portion. As a result, the retaining member is less likely to deform, making it easier to maintain the dimensional accuracy of the retaining member. Furthermore, because the thickness of the first retaining wall portion is thin even at the location where the first gap is assembled, interference is less likely to occur between the retaining portion of the first mechanism or the substrates of the first substrate group held by the retaining portion and the substrates of the second substrate group held by the second mechanism.

[0015] In addition, in the substrate processing apparatus according to the present invention, The holding member is The thickness in the width direction from the deepest portion of the holding groove to the outer surface of the first holding wall portion is thinner than the thickness in the width direction from the deepest portion of the holding groove to the outer surface of the second holding wall portion. It is preferable to have a thickness of 1 / 4" between the first and second mechanism members and the second mechanism (claim 6). This ensures the rigidity of the holding member from the deepest part of the holding groove to the top surface of the holding groove. Also, since the thickness of the first holding wall portion from the deepest part of the holding groove to the top surface of the holding groove is thin, interference between the holding portion of the first mechanism or the substrates of the first substrate group held by the holding portion and the substrates of the second substrate group held by the second mechanism is less likely to occur.

[0016] In addition, in the substrate processing apparatus according to the present invention, The holding member is a thickness in the width direction from the deepest portion of the holding groove to the outer surface of the first holding wall portion is the same as a thickness in the width direction from the deepest portion of the holding groove to the outer surface of the second holding wall portion, The thickness in the width direction from a depth position shallower than the deepest part to the outer surface of the first holding wall portion is different from the thickness in the width direction from the same depth position to the outer surface of the second holding wall portion. It is preferable (claim 7). This reduces the thickness of the first holding wall portion at a depth shallower than the deepest part of the holding groove, making it possible to reduce interference between the holding portion of the first mechanism or the substrates of the first substrate group held by the holding portion and the substrates of the second substrate group held by the second mechanism.

[0017] In addition, in the substrate processing apparatus according to the present invention, The holding member is a thickness in the width direction from the deepest portion of the holding groove to the outer surface of the first holding wall portion is the same as a thickness in the width direction from the deepest portion of the holding groove to the outer surface of the second holding wall portion, The thickness in the width direction from a depth position shallower than the deepest part to the outer surface of the first holding wall portion is thinner than the thickness in the width direction from the same depth position to the outer surface of the second holding wall portion. It is preferable (claim 8). This ensures the rigidity of the holding member at a depth shallower than the deepest part of the holding groove. Also, because the thickness of the first holding wall portion is thinner at a depth shallower than the deepest part of the holding groove, interference between the holding portion of the first mechanism or the substrates of the first substrate group held by the holding portion and the substrates of the second substrate group held by the second mechanism can be reduced.

[0018] In addition, in the substrate processing apparatus according to the present invention, The holding member is When the holding member is cut in a width direction along the alignment direction of the substrates, the first holding wall portion and the second holding wall portion have a cross-sectional shape that is asymmetric with respect to a center line passing through the deepest part of the holding groove. This is preferable (claim 9). This ensures the rigidity of the holding member.

[0019] In addition, in the substrate processing apparatus according to the present invention, The holding member is The cross-sectional shape of the first retaining wall portion is a shape in which the length in the width direction from a depth position shallower than the deepest part to an outer surface of the first retaining wall portion is shorter than the length in the width direction from the same depth position to the outer surface of the second retaining wall portion. It is preferable (claim 10). This reduces the thickness of the first holding wall portion at a depth position shallower than the deepest part of the holding groove, making it possible to reduce interference between the holding portion of the first mechanism or the substrates of the first substrate group held by the holding portion and the substrates of the second substrate group held by the second mechanism.

[0020] In addition, in the substrate processing apparatus according to the present invention, The holding member is The mounting member is provided on the side where the second gap is formed when the first substrate group and the second substrate group are combined. It is preferable (claim 11). As a result, the mounting member is provided on the side where the second gap is disposed when the first substrate group and the second substrate group are combined, and therefore is less likely to interfere with the substrates held by the pusher mechanism when the first substrate group and the second substrate group are combined. [Effects of the Invention]

[0021] According to the substrate processing apparatus of the present invention, the holding member has a holding groove at a position shifted from the center in the width direction along the substrate arrangement direction toward the side where the first gap is formed when the first substrate group and the second substrate group are combined, making it possible to reduce interference between the holding section of the first mechanism or the substrates of the second substrate group held by the holding section and the substrates of the first substrate group held by the second mechanism, thereby providing a substrate processing apparatus that can process substrates efficiently. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a plan view showing the configuration of a transfer block and its surroundings. [Figure 3] FIG. 2 is a side view showing the substrate handling mechanism. [Figure 4] FIG. [Figure 5] 5 is a cross-sectional view of the attitude changing mechanism shown in FIG. 4 taken along line yy. [Figure 6] 6(a) is a side view of a pair of horizontal holding parts and a pair of vertical holding parts in a horizontal position, and FIG. 6(b) is a cross-sectional view of the holding member shown in FIG. 5 taken along line y1-y1. [Figure 7] FIG. 2 is a plan view of a pair of horizontal holding parts and a pair of vertical holding parts in a vertical position. [Figure 8] FIG. 10 is a side view showing the pusher mechanism. [Figure 9] FIG. 4 is a side view showing a vertical cross section of the pusher member. [Figure 10] 3 is a side view showing the delivery mechanism, two pitch conversion units, etc., as seen in the direction of arrow AA in FIG. 2. [Figure 11] FIG. 2 is a plan view mainly showing a carry-in mechanism and a carry-out mechanism. [Figure 12] FIG. [Figure 13]10 is a side view showing a schematic configuration of a pitch conversion unit that holds a plurality of substrates aligned at unequal pitches. FIG. [Figure 14] 10 is a side view showing a schematic configuration of a pitch conversion unit that holds a plurality of substrates aligned at a narrow pitch. FIG. [Figure 15] 10 is a bottom view mainly showing the expansion and contraction mechanism of the pitch conversion unit that holds a plurality of substrates aligned at unequal pitches. FIG. [Figure 16] 10 is a bottom view mainly showing the expansion and contraction mechanism of the pitch conversion unit that holds a plurality of substrates aligned at a narrow pitch. FIG. [Figure 17] 10 is a flowchart illustrating the first half of the operation of the substrate processing apparatus. [Figure 18] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 19] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 20] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 21] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 22] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 23] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 24] FIG. 1A is a side view illustrating a characteristic portion of the operation of the substrate processing apparatus, and FIG. 1B is a side view illustrating the operation of a conventional substrate processing apparatus. [Figure 25] FIG. 25 is a top view of the attitude change unit and the pusher mechanism that perform the operation shown in FIG. 24(a). [Figure 26] FIG. 25 is a top view of a conventional attitude change unit and pusher mechanism that perform the operation shown in FIG. 24(b). [Figure 27] 26(a) is a cross-sectional view of the vertical holding portion shown in FIG. 25 taken along line y2-y2, and FIG. 26(b) is a cross-sectional view of the conventional vertical holding portion shown in FIG. 26 taken along line y3-y3. [Figure 28]FIG. 27(b) is an enlarged view of the holding member surrounded by the two-dot chain line in FIG. 27(a). [Figure 29] 10 is a flowchart illustrating a second half of the operation of the substrate processing apparatus. [Figure 30] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 31] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 32] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 33] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 34] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 35] 10(a) to 10(d) are cross-sectional views showing holding members according to modified examples. [Figure 36] 10(a) and 10(b) are cross-sectional views showing a holding member according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0023] The present invention will be described below with reference to various examples. [Example]

[0024] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to the first embodiment. Fig. 2 is a plan view showing a transfer block 5 and its surrounding configuration.

[0025] For convenience, in this specification, the direction in which the transfer block 5 and the processing block 7 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, for example, the direction from the processing block 7 toward the transfer block 5 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." The vertical direction Z is expressed as "up" and "down." In each figure, for reference, front, back, right, left, top, and bottom are indicated as appropriate.

[0026] <1. Configuration of the substrate processing apparatus> Referring to Figure 1, the substrate processing apparatus 1 processes substrates W. The substrate processing apparatus 1 is a batch-type substrate processing apparatus that processes a plurality of substrates W (e.g., 50, 75, or 100) at once. The substrate processing apparatus 1 performs, for example, chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing apparatus 1 includes a stocker 2, a loading shelf 3, a transfer block 5, a processing block 7, and a batch substrate transport area 8.

[0027] <1-1. Stocker> The stocker 2 accommodates at least one carrier C. The stocker 2 is adjacent to the front of the transfer block 5. The carrier C stores multiple (e.g., 25) substrates W in a horizontal position with a predetermined interval (e.g., 10 mm) between them. In other words, the carrier C stores N (e.g., 25) substrates W aligned at a standard pitch in a horizontal position. Note that "N" in the N substrates W is a natural number greater than or equal to 2. Note that the standard pitch is a repeated standard interval TN9 (e.g., 10 mm (millimeters)). In other words, when the standard interval TN9 is 10 mm, the standard pitch is 10 mm. The N substrates W in the carrier C are aligned in the vertical direction Z or the thickness direction of each substrate W. For example, a FOUP (Front Opening Unify Pod) is used as the carrier C, but is not limited to this.

[0028] The stocker 2 is equipped with a plurality of (for example, two) load ports 9. The two load ports 9 are arranged in the width direction Y. In this embodiment, the two load ports 9 are used to load and unload carriers C. The stocker 2 also is equipped with at least one storage shelf 11 and a carrier transport robot 13. The carriers C are placed on the storage shelf 11.

[0029] The carrier transport robot 13 transports the carrier C between the two load ports 9, the storage shelf 11, and the loading shelf 3. The carrier transport robot 13 is equipped with a gripping unit 15 that grips a protrusion provided on the top surface of the carrier C, for example. The carrier transport robot 13 can move the gripping unit 15 in the horizontal direction (front-back direction X and width direction Y) and the vertical direction Z. The carrier transport robot 13 is driven by one or more electric motors.

[0030] The loading shelf 3 is arranged in the area of the stocker 2. The loading shelf 3 is adjacent to the front of the transfer block 5. On the loading shelf 3, the carrier C is placed.

[0031] <1-2. Transfer block> 1 and 2, the transfer block 5 includes a substrate handling mechanism (robot) HTR, a posture conversion mechanism 19, a pusher mechanism 21, a delivery mechanism 23, and two pitch conversion units 25 and 26.

[0032] The substrate handling mechanism HTR is disposed behind the loading shelf 3. The substrate handling mechanism HTR transports a plurality of (e.g., 25) substrates W in a horizontal position between a carrier C placed on the loading shelf 3 and the position conversion mechanism 19. As shown in FIG. 3, the substrate handling mechanism HTR is equipped with a plurality of (e.g., 25 or 13) hands 27. Each hand 27 holds one substrate W. The plurality of 25 hands 27 are arranged at a reference pitch in the vertical direction Z. Therefore, for example, 25 substrates W held by the 25 hands 27 are aligned at the reference pitch. The reference pitch is a repeating reference interval TN9 (e.g., 10 mm).

[0033] 3 and other figures, for convenience of illustration, the substrate handling mechanism HTR is shown to have five hands 27. A pair of horizontal holding parts 37 and a pair of vertical holding parts 39, which will be described later, are each shown to hold five substrates W. A pusher member 55, which will be described later, is shown to support ten substrates W.

[0034] The substrate handling mechanism HTR further includes a hand support unit 29, an advancing / retreating unit 31, and an elevation / rotation unit 33. The hand support unit 29 supports the multiple hands 27. The advancing / retreating unit 31 moves the multiple hands 27 forward and backward via the hand support unit 29. The elevation / rotation unit 33 rotates the advancing / retreating unit 31 about a vertical axis AX1 to change the orientation of the hands 27. The elevation / rotation unit 33 is fixed to the floor surface. The advancing / retreating unit 31 and the elevation / rotation unit 33 each include an electric motor. The substrate handling mechanism HTR may also include a movable hand (not shown) for transporting only one substrate W, separate from the hand 27.

[0035] The attitude conversion mechanism 19 converts a plurality of (e.g., 25) substrates W between a horizontal attitude and a vertical attitude. The attitude conversion mechanism 19 is disposed to the left of the substrate handling mechanism HTR. As shown in FIG. 4 , the attitude conversion mechanism 19 includes a support base 35, a pair of horizontal holding units 37, a pair of vertical holding units 39, and a rotation drive unit 41.

[0036] The support base 35 is supported rotatably about a horizontal axis AX2 extending in the front-rear direction X. A pair of horizontal holding parts 37 and a pair of vertical holding parts 39 are provided to extend perpendicularly from the support surface 35A. When the plurality of substrates W are in a horizontal position, the pair of horizontal holding parts 37 hold the plurality of substrates W. In other words, when the plurality of substrates W are in a horizontal position, the plurality of substrates W are placed on the pair of horizontal holding parts 37. When the plurality of substrates W are in a vertical position, the pair of vertical holding parts 39 hold the plurality of substrates W.

[0037] The pair of horizontal holding parts 37 and the pair of vertical holding parts 39 are both arranged in the front-rear direction X (see FIG. 2). Furthermore, when the pair of horizontal holding parts 37 hold multiple substrates W in a horizontal position, the pair of vertical holding parts 39 are arranged closer to the pusher mechanism 21 than the pair of horizontal holding parts 37. The pair of horizontal holding parts 37 have multiple pairs (e.g., 25 pairs, 38 pairs, 50 pairs) of shelves 37A arranged at a standard pitch in the direction DR1 in which the pair of horizontal holding parts 37 extend. The pair of vertical holding parts 39 have multiple pairs (e.g., 25 pairs, 38 pairs, 50 pairs) of holding members 39A arranged at a standard pitch in the direction DR1 in which the pair of vertical holding parts 39 extend. The holding members 39A have holding grooves 39C, which will be described later. The direction DR1 in which the pair of horizontal holding parts 37 and the pair of vertical holding parts 39 extend is the same as the direction in which the substrates W are arranged.

[0038] The position conversion mechanism 19 also includes an axial movement unit 51 and a storage movement unit 53. The axial movement unit 51 moves the pair of horizontal holding units 37 by a preset small distance in the direction DR1 in which the pair of horizontal holding units 37 extend. The storage movement unit 53 moves the pair of vertical holding units 39 toward or away from the pair of horizontal holding units 37. For example, when the pair of horizontal holding units 37 hold multiple substrates W in horizontal positions, the storage movement unit 53 can move the pair of vertical holding units 39 in the width direction Y. The rotation drive unit 41 converts the position of the support base 35 between a vertical support position and a horizontal support position. In other words, the position conversion mechanism 19 converts the position of the pair of horizontal holding units 37 and the pair of vertical holding units 39 between the vertical support position and the horizontal support position. As a result, the posture changing mechanism 19 changes the posture of the plurality of substrates W held by the pair of horizontal holding parts 37 and the pair of vertical holding parts 39 between the horizontal posture and the vertical posture.

[0039] The rotation drive unit 41 includes, for example, an electric motor. The axial movement unit 51 and the housing movement unit 53 each include an air cylinder or an electric actuator. The electric actuator includes an electric motor.

[0040] Please refer to Figures 5, 6, and 7. Figure 5 is a cross-sectional view of the posture conversion mechanism 19 shown in Figure 4 taken along line yy. Figure 6(a) is a side view of the pair of horizontal holding parts 37 and the pair of vertical holding parts 39 in the horizontal posture, and (b) is a cross-sectional view of the holding member 39A shown in Figure 5 taken along line y1-y1. Figure 7 is a view showing the shelf 37A and holding member 39A in the vertical posture.

[0041] As shown in FIG. 5, the shelf 37A is formed from the portion indicated by the dashed line to the boundary with the hatching indicated by diagonal lines slanting downward to the right. The holding member 39A has a holding groove forming portion 39D that forms a holding groove 39C in the area from the portion indicated by the dashed line to the area overlapping with the substrate W. The portion indicated by the dashed line is the deepest portion 39Ca of the holding groove 39C. The holding member 39A has a holding groove support portion 39E that supports the holding groove forming portion 39D from the deepest portion 39Ca to the boundary with the hatching indicated by diagonal lines slanting downward to the left. The holding member 39A has a vertical holder 39F that supports the holding groove support portion 39E in the area indicated by the hatching indicated by diagonal lines slanting downward to the left. In other words, the holding member 39A extends in the front-rear direction X from the vertical holder 39F.

[0042] 6(a), the substrate W is placed on a placement surface 37B of a shelf 37A. A holding groove 39C is formed in the holding member 39A. Furthermore, the substrate W placed on the placement surface 37B is inserted into the holding groove 39C.

[0043] As shown in FIG. 6(b), an example of the holding groove 39C is a groove with a V-shaped cross section. Hereinafter, the holding groove 39C will also be referred to as a V-shaped groove. The holding groove 39C has two inclined surfaces 39C3. Of the two inclined surfaces 39C3, the upper one will be referred to as the first inclined surface 39C3a, and the lower one will be referred to as the second inclined surface 39C3b. The holding member 39A is the hatched area. The side of the holding member 39A facing the substrate W, separated by the two-dot chain line z1, will be referred to as the holding groove forming portion 39D, and the opposite side will be referred to as the holding groove support portion 39E.

[0044] Specifically, the holding groove 39C is formed so as to follow the peripheral edge Wa of the horizontally oriented substrate W. Specifically, the holding groove 39C contacts the peripheral edge Wa of the vertically oriented substrate W at two locations, above and below.

[0045] The holding groove 39C is provided at a position shifted upward from the center 39Ba in the width direction along the arrangement direction of the substrates W, i.e., the direction DR1 in which the pair of horizontal holding members 37 and the pair of vertical holding members 39 extend. The direction DR1 in which the pair of horizontal holding members 37 and the pair of vertical holding members 39 extend, the direction along the arrangement direction of the vertically oriented substrates W held by the pair of vertical holding members 39, and the width direction of the holding member 39A are the same direction. The symbol DR1 is also used for the arrangement direction of the vertically oriented substrates W. For example, the entire holding groove 39C is located above the center 39Ba. The placement surface 37B is located within the vertical width of the holding groove 39C.

[0046] The holding groove 49C has a deepest portion 39Ca located at the rear side (the rear side of the paper) when viewed from the substrate handling mechanism HTR side. The deepest portion 39Ca is provided at a position shifted upward from the center 39Ba. The deepest portion 39Ca is located above the placement surface 37B.

[0047] The vertical width of the holding groove 39C is greater than the vertical width of the substrate W (the thickness of the substrate W). When viewed from the substrate handling mechanism HTR side, the holding groove 39C overlaps with the shelf 37A. For example, parts of both ends of the holding groove 39C in the front-rear direction x overlap with the horizontal holding part 37. Specifically, the end of the second inclined surface 39C3b of the holding groove 39C, which is below the deepest part 39Ca, overlaps with the end of the shelf 37A. The first inclined surface 39C3a of the holding groove 39C, which is above the deepest part 39Ca, does not overlap with the shelf 37A.

[0048] The holding groove 39C and the shelf 37A may be spaced apart in the horizontal direction so that they do not overlap when viewed from the substrate handling mechanism HTR side.

[0049] As shown in FIG. 7, when shelf 37A and holding member 39A are in a vertical position, shelf 37A is located to the right of substrate W (toward position conversion mechanism 19). This substrate W is the substrate W that was placed on shelf 37A when shelf 37A was in a horizontal position. As will be described later, after shelf 37A assumes a vertical position, it moves away from substrate W to the right. In other words, shelf 37A in a vertical position does not directly hold substrate W. Note that shelf 37A may also play a role in supporting substrate W that is tilted from the vertical position.

[0050] 1 and 2, the pusher mechanism 21 is disposed to the left of the attitude conversion mechanism 19. As shown in FIG. 8, the pusher mechanism 21 includes a pusher member 55, a rotating shaft 57, a pusher rotating unit 59, a pusher horizontal moving unit 61, a lifting platform 63, and a pusher lifting unit 65.

[0051] 9, the pusher member 55 holds, in a vertical position, a plurality of substrates W (e.g., 50, 75, or 100) aligned at irregular intervals in which a first interval TN1 (e.g., 3.333 mm) and a second interval TN2 (e.g., 6.666 mm) are alternately repeated. The second interval TN2 is wider than the first interval TN1 (second interval TN2 > first interval TN1). The first interval TN1 is also called the narrow interval, and the second interval TN2 is also called the wide interval.

[0052] 9, the pusher member 55 has a plurality of (e.g., 50, 75, or 100) vertical holding grooves 67 for holding a plurality of substrates W in a vertical position. The plurality of vertical holding grooves 67 are arranged, for example, at an unequal pitch in which a first interval TN1 and a second interval TN2 are alternately repeated. The sum of the first interval TN1 (e.g., 3.333 mm) and the second interval TN2 (e.g., 6.666 mm) is a reference interval TN9 (e.g., 10 mm).

[0053] See Figure 8. The lower surface of the pusher member 55 is connected to the upper end of the rotating shaft 57. The pusher rotation unit 59 rotates the pusher member 55 and the rotating shaft 57 about a vertical axis AX3 that passes through the rotating shaft 57. As a result, the multiple substrates W that the pusher member 55 supports in a vertical position are rotated about the vertical axis AX3. The pusher rotation unit 59 includes, for example, an electric motor. The pusher rotation unit 59 is provided below the pusher member 55. The pusher rotation unit 59 is also attached to the upper surface of the lifting platform 63 via a pusher horizontal movement unit 61.

[0054] The pusher horizontal movement unit 61 includes two guide rails 61A each extending in the width direction Y, a slider 61B, and an electric motor (not shown). The two guide rails 61A are provided on the upper surface of the lifting platform 63. The slider 61B moves in the width direction Y along the two guide rails 61A. The slider 61B is driven by the electric motor. The pusher lifting unit 65 raises and lowers the lifting platform 63 in the vertical direction Z. This raises and lowers the pusher member 55. The pusher lifting unit 65 includes, for example, an electric actuator.

[0055] 2, the two pitch conversion units 25, 26 are arranged to the left of the pusher mechanism 21. Furthermore, if the two pitch conversion units 25, 26 were arranged in the vertical direction Z, the substrate processing apparatus 1 would become unnecessarily tall. In contrast, the two pitch conversion units 25, 26 are arranged in the front-rear direction X. That is, the first pitch conversion unit 25 is arranged behind the second pitch conversion unit 26 in a plan view. This prevents the substrate processing apparatus 1 from becoming unnecessarily tall. The delivery mechanism 23 transports a plurality of substrates W aligned at unequal pitches, for example, between the pusher member 55 and the two pitch conversion units 25, 26.

[0056] Please refer to Figures 2 and 10. Figure 10 is a side view showing the transfer mechanism 23 and the two pitch conversion units 25, 26, etc., as viewed in the direction of arrow AA in Figure 2. The transfer mechanism 23 includes a carry-in mechanism 71, an intermediary mechanism 73, and an unloading mechanism 75. The carry-in mechanism 71 transports multiple substrates W aligned at an uneven pitch from the pusher member 55 to the first pitch conversion unit 25. The intermediary mechanism 73 transports multiple substrates W aligned at a narrow pitch from the first pitch conversion unit 25 to the first transfer position P1. The unloading mechanism 75 transports multiple substrates W aligned at an uneven pitch from the second pitch conversion unit 26 to the pusher member 55. The carry-in mechanism 71, the intermediary mechanism 73, and the unloading mechanism 75 include chucks 77, 78, and 79, respectively.

[0057] As shown in FIG. 10 , the carry-in mechanism 71 is disposed at a carry-in height position H1. The carry-in mechanism 71 is disposed, for example, to the side of the lifting unit 141 of the second pitch conversion unit 26. The chuck 78 of the intermediary mechanism 73 is provided at a position above the first pitch conversion unit 25. The chuck 78 of the intermediary mechanism 73 is disposed between the carry-in height position H1 and the first transfer position P1. The first transfer position P1 is higher than the carry-in height H1 and the transfer position H2. The transfer mechanism 75 is disposed at a transfer position H2 that is higher than the carry-in height position H1. The carry-in mechanism 71 and the transfer mechanism 75 are each configured so that the plurality of substrates W held by the transfer mechanism 75 and the plurality of other substrates W held by the carry-in mechanism 71 and the transfer mechanism 75 do not interfere with each other.

[0058] 11 is a plan view mainly showing the load mechanism 71 and the unload mechanism 75. The load mechanism 71 is disposed behind the unload mechanism 75. That is, the load mechanism 71 is disposed on the processing block 7 side, and the unload mechanism 75 is disposed on the stocker 2 side. The load mechanism 71 includes a chuck 77, an opening / closing unit 81, a front-rear direction moving unit 83, and a width direction moving unit 85.

[0059] The chuck 77 holds a plurality of substrates W aligned at an irregular pitch in a vertical position. The chuck 77 includes a pair of chuck members 77A, 77B each extending in the width direction Y. Each pair of chuck members 77A, 77B includes a plurality of pairs (e.g., 50 pairs, 75 pairs, 100 pairs) of holding grooves 87, 88 arranged at an irregular pitch. The irregular pitch is formed by alternating first intervals TN1 (e.g., 3.333 mm) and second intervals TN2 (e.g., 6.666 mm). The first chuck member 77A is provided with a plurality of holding grooves 87 arranged at an irregular pitch. The second chuck member 77B is provided with a plurality of holding grooves 88 arranged at an irregular pitch.

[0060] The opening / closing unit 81 supports the two chuck members 77A, 77B so that they can move in the front-to-rear direction X. The opening / closing unit 81 also opens and closes the two chuck members 77A, 77B in the front-to-rear direction X. Specifically, the opening / closing unit 81 moves the two chuck members 77A, 77B closer to or farther apart. When the opening / closing unit 81 closes the chuck 77, the chuck 77 can hold multiple substrates W in a vertical position. On the other hand, when the opening / closing unit 81 opens the chuck 77, the chuck 77 can pass multiple substrates W in a vertical position between the two chucks 77A, 77B in the vertical direction Z. The opening / closing unit 81 includes an air cylinder or an electric actuator that drives the two chuck members 77A, 77B.

[0061] The front-rear direction moving unit 83 is disposed closer to the two pitch conversion units 25, 26 than the width direction moving unit 85. The front-rear direction moving unit 83 moves the chuck 77 and the opening / closing unit 81 horizontally in the front-rear direction X. The width direction moving unit 85 moves the chuck 77, the opening / closing unit 81, and the front-rear direction moving unit 83 horizontally in the width direction Y. That is, the front-rear direction moving unit 83 and the width direction moving unit 85 can move the chuck 77 in the front-rear direction X and the width direction Y (two-dimensional directions). The front-rear direction moving unit 83 includes, for example, an air cylinder or an electric actuator. The width direction moving unit 85 includes an electric actuator.

[0062] The discharge mechanism 75 includes a chuck 79, an opening / closing unit 89, a front-rear moving unit 91, and a width-direction moving unit 93. The chuck 79 is configured similarly to the chuck 77. Specifically, the chuck 79 includes a pair of chuck members 79A and 79B each extending in the width direction Y. The pair of chuck members 79A and 79 has multiple pairs of holding grooves 95, 96 (for example, 50 pairs, 75 pairs, 100 pairs) arranged at unequal pitches. The front-rear direction moving unit 91 is arranged closer to the two pitch changing units 25, 26 than the width direction moving unit 93. Otherwise, the opening / closing unit 89, the front-rear direction moving unit 91, and the width direction moving unit 93 are configured in the same manner as the opening / closing unit 81, the front-rear direction moving unit 83, and the width direction moving unit 85, respectively.

[0063] FIG. 12 is a plan view mainly showing the intermediary mechanism 73. The intermediary mechanism 73 includes a chuck 78, an opening / closing unit 101, an arm 103, and an elevating unit 105. The chuck 78 includes a pair of chuck members 78A and 78B each extending in the width direction Y. The pair of chuck members 78A and 78B includes multiple pairs (e.g., 50 pairs, 75 pairs, or 100 pairs) of holding grooves 107 and 108 arranged at a narrow pitch (e.g., 3.333 mm pitch (⅓ pitch)). Specifically, the first chuck member 78A is provided with a plurality of holding grooves 107 arranged at a narrow pitch in the width direction Y. Furthermore, the second chuck member 78B is provided with a plurality of holding grooves 108 arranged at a narrow pitch.

[0064] The opening / closing unit 101 is provided to the right of the chuck 78 (on the pusher mechanism 21 side). Otherwise, the opening / closing unit 101 is configured similarly to the opening / closing unit 81. To be more specific, the opening / closing unit 101 supports a pair of chuck members 78A, 78B so that they can move in the front-to-rear direction X. The opening / closing unit 101 also opens and closes the pair of chuck members 78A, 78B in the front-to-rear direction X. When the opening / closing unit 101 closes the chuck 78, the chuck 78 can hold multiple substrates W aligned at a narrow pitch in a vertical position. On the other hand, when the opening / closing unit 101 opens the chuck 78, the chuck 78 can pass multiple substrates W in a vertical position between the two chuck members 78A, 78B in the vertical direction Z.

[0065] The opening / closing unit 101 is attached to the lifting unit 105 via an arm 103 so that it can be raised and lowered. The lifting unit 105 raises and lowers the chuck 78 and the opening / closing unit 101 in the vertical direction Z. The lifting unit 105 includes, for example, an electric actuator. This enables the intermediary mechanism 73 to receive the multiple substrates W in a vertical position aligned at a narrow pitch from the first pitch conversion unit 25, and move the multiple substrates W to the first transfer position P1 (see FIG. 10) in order to transfer the multiple substrates W to the main transport mechanism WTR.

[0066] The transfer block 5 has two transport paths for transporting multiple substrates W between the pusher member 55 (pusher mechanism 21) and the main transport mechanism WTR. Specifically, the first transport path is a path that passes through the carry-in mechanism 71, the first pitch conversion unit 25, and the intermediate mechanism 73. The second transport path is a path that passes through the second pitch conversion unit 26 and the carry-out mechanism 75. For example, when 50 substrates W are held by the intermediate mechanism 73, the carry-out mechanism 75 can transport 50 substrates W that have been treated in the chemical treatment tank BT1 or the like to the pusher member 55. This allows for smooth transport of the 50 substrates W (group of treated substrates).

[0067] See Figures 10 and 13 to 16. Each of the two pitch conversion units 25, 26 converts the pitch of the multiple substrates W between an irregular pitch and a narrow pitch. The irregular pitch is a repeating alternation of a first interval TN1 (e.g., 3.333 mm) and a second interval TN2 (e.g., 6.666 mm) that is wider than the first interval TN1. The narrow pitch is a repeating alternation of the first interval TN1.

[0068] The first pitch conversion unit 25 aligns the multiple substrates W aligned at an uneven pitch at a narrow pitch. That is, the first pitch conversion unit 25 converts the pitch of the multiple substrates W before they are processed in the processing block 7 to a narrow pitch. In contrast, the second pitch conversion unit 26 aligns the multiple substrates W aligned at a narrow pitch at an uneven pitch. That is, the second pitch conversion unit 26 converts the pitch of the multiple substrates W after they have been processed in the processing block 7 to an uneven pitch.

[0069] Each of the two pitch changers 25 and 26 includes a pitch change main body 111. The pitch change main body 111 includes a plurality of (for example, 25, 38, or 50) holding members 113 (113A to 113E) and a moving section 115.

[0070] The plurality of holding members 113 hold the plurality of substrates W aligned at unequal pitches in a vertical position. Each of the plurality of holding members 113 has two holding grooves 117 that hold two of the plurality of substrates W at a first interval TN1 (e.g., 3.333 mm). The two holding grooves 117 are separated by the first interval TN1. The two holding grooves 117 of each holding member 113 are arranged in the width direction Y. For example, if the pitch conversion unit 25 has 25 holding members 113, the 25 holding members 113 can hold 50 substrates W. Note that in Figures 13 to 16, for convenience of illustration, each of the two pitch conversion units 25, 26 is assumed to have five holding members 113.

[0071] The moving unit 115 moves the plurality of holding members 113 in the alignment direction (width direction Y) of the plurality of substrates W so as to change between an uneven pitch state in which the plurality of substrates W are aligned at uneven pitches and a narrow pitch state in which the plurality of substrates W are aligned at narrow pitches. The moving unit 115 includes a base member 119, two guide rails 121, an extension / contraction mechanism 123, a drive unit 125, and a connection unit 127.

[0072] The two guide rails 121 support the multiple holding members 113 so that they can move in the alignment direction (width direction Y). Each of the two guide rails 121 extends in the width direction Y. The two guide rails 121 are attached to the upper surface of the base member 119. Note that a central holding member 113C of the multiple holding members 113 is fixed to the base member 119 by, for example, a screw SW. In other words, the central holding member 113C does not move in the width direction Y. Note that the number of guide rails 121 is not limited to two, and may be one, or three or more. In other words, it is sufficient for the moving unit 115 to be equipped with one or more guide rails 121.

[0073] The extension mechanism 123 extends and retracts the plurality of holding members 113 in the alignment direction (width direction Y). The extension mechanism 123 is connected to each holding member 113. The extension mechanism 123 is configured, for example, as a link mechanism. Specifically, the extension mechanism 123 is configured, for example, as a lazy tongs type, a zigzag line type, or a type similar thereto. The extension mechanism 123 includes, for example, a plurality of link members 129 (five in FIG. 13, etc.), a plurality of pins 131 (five in FIG. 13, etc.), and a plurality of joints 133 (four in FIG. 13, etc.). In FIGS. 15 and 13, for example, five pins 131 are provided on the bottom surfaces of the five holding members 113. The five link members 129 are respectively attached to the five pins 131 so as to be rotatable around a vertical axis. The five pins 131 are located at the centers of the five link members 129. Each of the four joints 133 connects the ends of two adjacent link members 129 .

[0074] For example, a first end of link member 129B is connected to a second end of link member 129A at joint 133A, and a second end of link member 129B is connected to a first end of link member 129C at joint 133B.

[0075] The drive unit 125 drives the extension / retraction mechanism 123. The drive unit 125 is attached to the lower surface of the base member 119. The drive unit 125 extends and retracts a rod 125A extending in the width direction Y. The drive unit 125 includes an air cylinder or an electric actuator. The connection unit 127 connects the end holding member 113E of the multiple holding members 113 to the tip of the rod 125A of the drive unit 125. The connection unit 127 is passed through an opening 119A of the base member 119.

[0076] 13 and 15, for example, when the rod 125A of the drive unit 125 is extended, the end holding member 113E is moved away from the central holding member 113C, and the extension mechanism 123 moves the other three holding members 113A, 113B, and 113D away from the central holding member 113C. This allows the multiple substrates W to be aligned at an uneven pitch. Also, in FIGS. 14 and 16, for example, when the rod of the drive unit 125 is retracted, the end holding member 113E approaches the central holding member 113C, and the extension mechanism 123 moves the other three holding members 113A, 113B, and 113D toward the central holding member 113C. This allows the multiple substrates W to be aligned at a narrow pitch (first interval TN1).

[0077] 10, each of the pitch conversion units 25 and 26 includes an elevator unit 141. The elevator unit 141 raises and lowers the pitch conversion main body 111 (the multiple holding members 113 and the moving unit 115). The elevator unit 141 includes an air cylinder or an electric actuator.

[0078] The lifting / lowering unit 141 of the first pitch conversion unit 25 raises and lowers the plurality of holding members 113 between an upper position higher than (the upper surface of) the chuck 77 of the carry-in mechanism 71 and a lower position lower than the chuck 77. The lifting / lowering unit 141 of the second pitch conversion unit 26 raises and lowers the plurality of holding members 113 between an upper position higher than (the upper surface of) the chuck 79 of the carry-out mechanism 75 and a lower position lower than the chuck 79.

[0079] <1-3. Processing Block> Referring to Figure 1, the processing block 7 includes a plurality of (for example, four) batch processing tanks BT1 to BT4 and a drying section 143. The four batch processing tanks BT1 to BT4 and the drying section 143 are arranged in the front-rear direction X along which the substrate processing apparatus 1 extends. Each of the four batch processing tanks BT1 to BT4 immerses and processes a plurality of substrates W (for example, 50, 75, or 100 substrates W) at once. Each of the four batch processing tanks BT1 to BT4 stores a processing liquid (for example, a chemical liquid or pure water) in which the plurality of substrates W are immersed.

[0080] The four batch processing tanks BT1 to BT4 are, for example, composed of two chemical processing tanks BT1 and BT3 and two cleaning processing tanks BT2 and BT4. The chemical processing tank BT1 and the cleaning processing tank BT2 form one set, and the chemical processing tank BT3 and the cleaning processing tank BT4 form another set. Note that the combination of chemical processing tanks and cleaning processing tanks is not limited to this example. Furthermore, the number of batch processing tanks is not limited to four, and may be one or more.

[0081] Each of the two chemical treatment tanks BT1 and BT3 performs an etching process using a chemical solution. The chemical solution may be, for example, a phosphoric acid solution, but is not limited to, a phosphoric acid solution. The chemical solution is heated to a preset temperature. A chemical solution jetting pipe (not shown) is provided at the bottom of the inside of each of the chemical treatment tanks BT1 and BT3. Each of the chemical treatment tanks BT1 and BT3 stores the chemical solution supplied from the chemical solution jetting pipe.

[0082] Each of the two cleaning processing tanks BT2 and BT4 performs a cleaning process in which chemical solutions adhering to multiple substrates W are washed away with a cleaning liquid (rinse liquid). Pure water such as deionized water (DIW) is used as the cleaning liquid. Each of the cleaning processing tanks BT2 and BT4 stores pure water supplied from a pure water jet pipe (not shown).

[0083] The processing block 7 includes a lifter LF1 as a dedicated transport mechanism for transferring substrates W that have been chemically processed in the chemical processing tank BT1 to the cleaning processing tank BT2, and a lifter LF2 for transferring substrates W that have been chemically processed in the chemical processing tank BT3 to the cleaning processing tank BT4. Each of the two lifters LF1 and LF2 includes a substrate holding section that holds, in a vertical position, multiple substrates W aligned at narrow pitches in the width direction Y, a lifting section that raises and lowers the substrate holding section, and a horizontal moving section that moves the substrate holding section in the front-to-rear direction X.

[0084] The drying unit 143 includes a substrate holding mechanism that holds, in a vertical position, a plurality of substrates W (e.g., 50, 75, or 100 substrates W) aligned at a narrow pitch in the width direction Y, and a processing chamber that accommodates the plurality of substrates W held by the substrate holding mechanism. The drying unit 143 dries the substrates W by supplying an organic solvent (e.g., isopropyl alcohol) to the substrates W in a reduced pressure atmosphere or by shaking off liquid components on the surfaces of the substrates W by centrifugal force.

[0085] <1-4. Batch substrate transport area> The batch substrate transport area 8 is disposed behind the stocker 2 and adjacent to the transfer block 5 and the processing block 7 on the left side. The batch substrate transport area 8 extends in the front-to-rear direction X. The batch substrate transport area 8 is equipped with a main transport mechanism WTR (main transport robot). The main transport mechanism WTR transports a plurality of substrates W (e.g., 50, 75, or 100) in a vertical position aligned at a narrow pitch in the width direction Y in the front-to-rear direction X. The main transport mechanism WTR also transports the plurality of substrates W between the first transfer position P1, the second transfer position P2, the plurality of batch processing baths BT1 to BT4 (e.g., four), and the drying section 143.

[0086] The main transport mechanism WTR includes a chuck 145, a chuck lifting unit (not shown), a chuck horizontal moving unit (not shown), and guide rails 147. The chuck 145 holds, in a vertical position, a plurality of substrates W aligned at a narrow pitch in the width direction Y. The chuck 145 includes a pair of chuck members 145A, 145B each extending in the width direction Y. Each pair of chuck members 145A, 145B includes multiple pairs (e.g., 50 pairs, 75 pairs, or 100 pairs) of holding grooves arranged at a narrow pitch in the width direction Y. The pair of chuck members 145A, 145B is opened and closed by a chuck opening / closing unit (not shown).

[0087] The chuck 145 is movable in the front-rear direction X along the guide rail 147. The chuck 145 is moved in the front-rear direction X by a chuck horizontal movement unit. The chuck 145 is raised and lowered in the vertical direction Z by a chuck lifting unit. The chuck horizontal movement unit and the chuck lifting unit include, for example, an electric actuator. The chuck opening / closing unit includes, for example, an air cylinder or an electric actuator.

[0088] The processing block 7 is provided with a vc that transports a plurality of substrates aligned at a narrow pitch to the processing block 7.

[0089] <1-5. Control Unit> The substrate processing apparatus 1 includes a control unit 151 (see FIG. 1) and a storage unit (not shown). The control unit 151 controls each component of the substrate processing apparatus 1. The control unit 151 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing apparatus 1.

[0090] <2. Operation of the substrate processing device> Next, the operation of the substrate processing apparatus 1 will be described with reference to the flowcharts of Figures 17 and 29. First, the first half of the operation from transporting the carriers C to the load port 9 to the drying process will be described with reference to Figure 17. In this embodiment, the substrate processing apparatus 1 processes 50 substrates W taken out from two carriers C in a batch.

[0091] In Figure 18(a) and other figures, the symbol TA indicates the surface (device surface or main surface) of the substrate W (W1, W2). The back surface of the substrate W is the surface opposite to the front surface of the substrate W. The device surface is the surface on which devices are formed or the surface on which devices are in the process of being formed. In Figure 18(a) and other figures, for convenience of illustration, the 25 substrates W1 are shown as five substrates W1, and the 25 substrates W2 are shown as five substrates W2.

[0092] [Step S01] Vertical position change of the first substrate group Referring to FIG. 1, an external transfer robot (not shown) sequentially transfers two carriers C to the load port 9. The carrier transfer robot 13 of the stocker 2 transfers the first carrier C from the load port 9 to the loading shelf 3. The first carrier C stores, for example, 25 substrates W1 (first substrate group) aligned at a reference pitch (for example, 10 mm pitch) at which the reference interval TN9 is repeated. The substrate handling mechanism HTR of the transfer block 5 uses, for example, 25 hands 27 to remove the 25 substrates W1 in a horizontal position from the first carrier C placed on the loading shelf 3. The substrate handling mechanism HTR then transfers the removed 25 substrates W1 to the posture conversion mechanism 19. The carrier transfer robot 13 then moves the empty first carrier C from which the 25 substrates W1 have been removed from the loading shelf 3 to the storage shelf 11.

[0093] See Figure 18(a). The attitude conversion mechanism 19 receives 25 substrates W1 aligned at the reference pitch from the substrate handling mechanism HTR. In the attitude conversion mechanism 19, the 25 substrates W1 are held (placed) on the 25 pairs of shelves 37A of the pair of horizontal holding parts 37. See Figure 18(b). Thereafter, the storage movement part 53 (see Figure 4) of the attitude conversion mechanism 19 brings the pair of vertical holding parts 39 closer to the pair of horizontal holding parts 37. As a result, the peripheral edges of the 25 substrates W1 are stored and held in the 25 pairs of holding grooves 39C of the pair of vertical holding parts 39.

[0094] 18(c). Then, the posture conversion mechanism 19 converts the 25 substrates W1 (first substrate group) held at the reference pitch from a horizontal posture to a vertical posture all at once. Specifically, the rotation drive unit 41 of the posture conversion mechanism 19 converts the 25 substrates W1 held by the pair of horizontal holding units 37 and the pair of vertical holding units 39 from a horizontal posture to a vertical posture. Then, the axial movement unit 51 (see FIG. 4) of the posture conversion mechanism 19 moves the pair of horizontal holding units 37 in a direction in which the pair of horizontal holding units 37 approaches the support surface 35A so that the 25 pairs of shelves 37A of the pair of horizontal holding units 37 move away from the 25 substrates W1 in the vertical posture.

[0095] [Step S02] Receiving the first group of substrates by the pusher member See Figure 19(a). Thereafter, the pusher lifting section 65 of the pusher mechanism 21 (see Figure 8) raises the pusher member 55 to a position higher than the pair of horizontal holding sections 37 and the pair of vertical holding sections 39. As a result, the pusher member 55 receives the 25 substrates W1 (first substrate group) that have been converted to a vertical position. The pusher member 55 also holds the 25 substrates W1 aligned at the standard pitch in a vertical position. The 50 vertical holding grooves 67 are arranged at unequal pitches.

[0096] [Step S03] Movement of the first substrate group at the first interval 19(b). The pusher mechanism 21 moves the 25 substrates W1 held by the pusher members 55 at a first interval TN1 (3.333 mm) in the alignment direction of the 25 substrates W1. Specifically, the pusher rotation unit 59 (see FIG. 8) of the pusher mechanism 21 rotates the pusher members 55 by 180 degrees about the vertical axis AX3. As a result, the 25 substrates W1 held by the pusher members 55 are moved to the left at the first interval TN1. Note that this movement at the first interval TN1 may be achieved by rotating the pusher members 55 by 180 degrees using the pusher rotation unit 59 and moving the pusher members 55 in the width direction Y using the pusher horizontal movement unit 61 (see FIG. 8).

[0097] Additionally, the attitude conversion mechanism 19 rotates the pair of horizontal holding parts 37, etc. by 90 degrees around the horizontal axis AX2. This raises the pair of horizontal holding parts 37, etc. The axial movement part 51 (see FIG. 4) of the attitude conversion mechanism 19 moves the pair of horizontal holding parts 37 in a direction away from the support surface 35A. Additionally, the accommodation movement part 53 (see FIG. 4) of the attitude conversion mechanism 19 moves the pair of vertical holding parts 39 away from the pair of horizontal holding parts 37.

[0098] [Step S04] Vertical position change of second substrate group The carrier transport robot 13 shown in FIG. 1 transports a second carrier C from the load port 9 to the loading shelf 3. The second carrier C stores, for example, 25 substrates W2 aligned at a standard pitch (10 mm pitch) like the first carrier C. The substrate handling mechanism HTR uses the 25 hands 27 to remove the 25 substrates W2 in a horizontal position from the second carrier C placed on the loading shelf 3. The substrate handling mechanism HTR then transports the removed 25 substrates W2 to the position conversion mechanism 19. The carrier transport robot 13 then moves the empty second carrier C from which the 25 substrates W2 have been removed to the storage shelf 11.

[0099] See Figure 19(c). The attitude conversion mechanism 19 receives 25 substrates W2 aligned at the reference pitch from the substrate handling mechanism HTR. In the attitude conversion mechanism 19, the 25 substrates W2 are held on 25 pairs of shelves 37A of a pair of horizontal holding units 37. See Figure 20(a). Thereafter, the storage transfer unit 53 (see Figure 4) of the attitude conversion mechanism 19 moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37.

[0100] 20(b). Then, the posture conversion mechanism 19 converts the 25 substrates W2 (second substrate group) held at the reference pitch collectively from a horizontal posture to a vertical posture. Then, the axial movement unit 51 (see FIG. 4) of the posture conversion mechanism 19 moves the pair of horizontal holding units 37 in a direction in which the pair of horizontal holding units 37 approaches the support surface 35A so that the 25 pairs of shelves 37A of the pair of horizontal holding units 37 move away from the 25 substrates W1 in the vertical posture.

[0101] [Step S05] Receiving the second group of substrates by the pusher member See Figure 20(c). Thereafter, the pusher lifting unit 65 (see Figure 8) of the pusher mechanism 21 raises the pusher member 55 to a position higher than the pair of horizontal holding units 37 and the pair of vertical holding units 39. As a result, the pusher member 55 receives the 25 substrates W2 (second substrate group) that have been converted to a vertical position. The pusher member 55 also holds 50 substrates W (W1, W2) aligned at an uneven pitch. The 50 substrates W are formed by alternating between 25 substrates W1 and 25 substrates W2.

[0102] The process of lifting the pusher member 55 in FIGS. 20(b) and 20(c) will be described in more detail later with reference to FIGS. 24 to 28.

[0103] [Step S06] Transporting the group of processed substrates to the pitch conversion unit by the loading mechanism Thereafter, the carry-in mechanism 71 transports the 50 substrates W (group of substrates to be processed) aligned at irregular pitches from the pusher member 55 to the first pitch conversion unit 25. This operation will be described in detail with reference to FIG. 21(a). First, the posture conversion mechanism 19 rotates the pair of horizontal holding units 37, etc. by 90 degrees around the horizontal axis AX2. This raises the pair of horizontal holding units 37, etc.

[0104] 21(b). Then, the carry-in mechanism 71 horizontally moves the chuck 77 from a position above the first pitch conversion unit 25 to a position below the pusher member 55. The chuck 77 is in a closed state where it can hold 50 substrates W. Then, the pusher mechanism 21 lowers the pusher member 55, which holds the 50 substrates W in a vertical position. When the pusher member 55 passes between the pair of chuck members 77A, 77B of the chuck 77, the 50 substrates W are transferred from the pusher member 55 to the chuck 77. The chuck 77 holds the 50 substrates W, aligned at an uneven pitch, in a vertical position.

[0105] See Figure 22(a). Then, the carry-in mechanism 71 moves the chuck 77 from a position above the pusher member 55 to a position above the first pitch conversion unit 25. See Figure 22(b). Then, the lifting unit 141 (see Figure 10) of the first pitch conversion unit 25 lifts the pitch conversion main body 111 including the 25 holding members 113. As a result, the first pitch conversion unit 25 receives the 50 substrates W from the carry-in mechanism 71.

[0106] [Step S07] Pitch conversion of the processed substrate group from unequal pitch to narrow pitch See Figure 23(a). Thereafter, the first pitch conversion unit 25 converts the pitch of the 50 substrates W from the uneven pitch to a narrow pitch (3.333 mm). In other words, the first pitch conversion unit 25 aligns the 50 substrates W aligned at the uneven pitch at a narrow pitch. This operation will be described in detail.

[0107] Each of the 25 holding members 113 of the first pitch conversion unit 25 has two holding grooves 117 spaced apart by a first interval (3.333 mm). The first pitch conversion unit 25 uses the two holding grooves 117 of each of the 25 holding members 113 to hold two of the 50 substrates W, W1 and W2, while using the 25 holding members 113 to hold the 50 substrates W aligned at an uneven pitch.

[0108] Furthermore, the moving unit 115 (see FIG. 13) of the first pitch conversion unit 25 moves the 25 holding members 113 in the alignment direction (Y direction) of the 50 substrates W so as to change the uneven pitch state in which the 50 substrates W are aligned at uneven pitches to a narrow pitch state in which the 50 substrates W are aligned at narrow pitches. Note that the intermediary mechanism 73 keeps the chucks 78 in an open state.

[0109] [Step S08] Transporting the group of substrates to the first transfer position by the intermediary mechanism 23(b). Thereafter, the intermediary mechanism 73 lowers the chucks 78 as indicated by the dashed lines in order to receive the 50 substrates W aligned at a narrow pitch held by the first pitch conversion unit 25. The intermediary mechanism 73 then closes the chucks 78, thereby enabling the chucks 78 to hold 50 substrates W.

[0110] Thereafter, the intermediary mechanism 73 raises the chucks 78 to the first transfer position P1. This allows the intermediary mechanism 73 to receive the 50 substrates W from the first pitch conversion unit 25 and deliver the 50 substrates W to the main transport mechanism WTR. The chucks 78 hold the 50 substrates W aligned at a narrow pitch in a vertical position.

[0111] [Step S09] Substrate processing and drying processing Thereafter, the main transport mechanism WTR uses chucks 145 to receive the 50 substrates W from the intermediate mechanism 73 and transports the 50 substrates W to one of the two chemical liquid treatment tanks BT1, BT3. For example, when the main transport mechanism WTR transports the 50 substrates W to the chemical liquid treatment tank BT1, the lifter LF1 receives the 50 substrates W, aligned at a narrow pitch, from the main transport mechanism WTR at a position above the chemical liquid treatment tank BT1. The lifter LF1 then lowers the 50 substrates W, thereby immersing the 50 substrates W in the chemical liquid stored in the chemical liquid treatment tank BT1. As a result, the 50 substrates W are chemically treated all at once.

[0112] Furthermore, after a preset chemical treatment time has elapsed, the lifter LF1 raises the 50 substrates W, thereby lifting them out of the chemical solution in the chemical treatment tank BT1. The lifter LF1 then horizontally moves the 50 substrates W from a position above the chemical treatment tank BT1 to a position above the cleaning treatment tank BT2. The lifter LF1 then lowers the 50 substrates W, thereby immersing the 50 substrates W in the pure water stored in the cleaning treatment tank BT2. In this way, the 50 substrates W are cleaned all at once. After a preset cleaning treatment time has elapsed, the lifter LF1 lifts the 50 substrates W out of the pure water in the cleaning treatment tank BT2.

[0113] When the main transport mechanism WTR transports 50 substrates W to the chemical treatment tank BT3, the lifter LF2 receives the 50 substrates W from the main transport mechanism WTR. The lifter LF2 then transports the 50 substrates W to the chemical treatment tank BT3 and the cleaning treatment tank BT4 in that order.

[0114] The main transport mechanism WTR uses the chuck 145 to receive the 50 substrates W from one of the two lifters LF1, LF2, and transports the 50 substrates W to the drying section 143. The drying section 143 dries the 50 substrates W. Thereafter, the main transport mechanism WTR receives the dried 50 substrates W from the drying section 143.

[0115] 24 to 28, the process of raising the pusher member 55 relative to the pair of horizontal holding portions 37 and the pair of vertical holding portions 39 in the above-mentioned Figures 20(b) to 20(c) to combine the substrates W of the second substrate group W1 held by the pair of vertical holding portions 39 and the substrates W of the first substrate group W1 held by the pusher member 55 at the first distance TN1 will be described in more detail.

[0116] FIG. 24(a) is a side view illustrating a characteristic portion of the operation of the substrate processing apparatus 1, and FIG. 24(b) is a side view illustrating the operation of a conventional substrate processing apparatus. FIG. 25 is a top view of the attitude change unit and pusher mechanism that perform the operation shown in FIG. 24(a). FIG. 26 is a top view of the attitude change unit and pusher mechanism that perform the operation shown in FIG. 24(b). FIG. 27(a) is a cross-sectional view of the vertical holding unit 39 shown in FIG. 25 taken along line y2-y2, and FIG. 27(b) is a cross-sectional view of the conventional vertical holding unit 390 shown in FIG. 26 taken along line y3-y3. FIG. 28 is an enlarged view of the holding member 39A surrounded by the two-dot chain line in FIG. 27(a).

[0117] 20(b) rises, as shown in FIG. 24(a), the leading ends of the 25 substrates W (W1) held by the pusher member 55 are inserted into the pair of vertical holders 39 holding the 25 substrates W (W2). Specifically, the substrates W (W1) are inserted between the holders 39A, 39A. At both ends of the pair of vertical holders 39 in the Y direction, the substrates W (W1) are inserted between the inner walls of the pair of vertical holders 39 and the holders 39A. The first substrate group W1 and the second substrate group W2 need to be held by the pusher members at unequal pitches. Therefore, the 25 substrates W (W1) held by the pusher member 55 are inserted into positions close to the pair of vertical holders 39 holding the 25 substrates W (W2).

[0118] As shown in FIG. 25, the holding member 39A has a holding groove 39C located at a position offset from a widthwise center 39Ba along the arrangement direction of the substrates W toward the side where the first distance TN1 is formed when the first substrate group W1 and the second substrate group W2 are combined. Specifically, a deepest portion 39Ca of the holding groove 39C is located at a position offset from the widthwise center 39Ba of the holding member 39A toward the first distance TN1. As shown in FIG. 27, which will be described later, the holding member 39A has an outer surface 39C1s extending downward from an outer edge 390C1a. At a location where the substrate W (W1) held by the pusher member 55 and the substrate W (W2) held by the holding member 39A are arranged at the first distance TN1, a clearance c1 between the outer surface 39C1s of the holding member 39A and the substrate W1 held by the pusher member 55 is sufficiently wider than that of a conventional configuration, which will be described later. Clearance c1 is the width of the gap between outer surface 39C1s of holding member 39A and substrate W1 held by pusher member 55. This makes it difficult for substrate W1 to collide with outer surface 39C1s of holding member 39A when substrate W1 held by pusher member 55 attempts to pass beside holding member 39A at first distance TN1 from substrate W2 held by holding member 39A.

[0119] In contrast, in a conventional holding member 390A, as shown in FIGS. 24(b) and 26, a holding groove 370C is provided at a widthwise center 390Ba of the holding member 390A. Specifically, a deepest portion 390Ca of the holding groove 370C is provided at a widthwise center 390Ba of the holding member 390A. At a location where the substrate W (W1) held by the pusher member 55 and the substrate W (W2) held by the holding member 390A are arranged at the first distance TN1, a clearance c10 between an outer surface 390C1s of the holding member 390A holding the substrate W2 and the substrate W1 held by the pusher member 55 becomes very narrow. Therefore, when the substrate W1 held by the pusher member 55 attempts to pass beside the holding member 390A at the first distance TN1 from the substrate W2 held by the holding member 390A, there is a risk that the substrate W2 will collide with the outer surface 390C1s of the holding member 390A.

[0120] The holding member 39A will now be described in more detail.

[0121] 27(a) and 28, the holding groove forming portion 39D is provided with a first holding wall portion 39C1 above the two-dot chain line z1 that contacts one end Wa1 of the peripheral edge portion Wa of the substrate W inserted into the holding groove 39C, and a second holding wall portion 39C2 that contacts the other end Wa2 of the peripheral edge portion Wa of the substrate W inserted into the holding groove 39C. The first holding wall portion 39C1 is on the first distance TN1 side of the holding groove forming portion 39D. The second holding wall portion 39C2 is on the second distance TN2 side of the holding groove forming portion 39D. The first holding wall portions 39C1 and second holding wall portions 39C2 are provided in the same number as the holding grooves 39C.

[0122] The widthwise thickness of the first retaining wall 39C1 refers to the thickness in the widthwise direction along the alignment direction DR1 of the substrate W (left-right direction y in the drawing). The widthwise thickness t1 of the first retaining wall 39C1 is thinner than the widthwise thickness t2 of the second retaining wall 39C2 located at the same groove depth. A retaining groove 39C is formed by the inner surfaces of the first retaining wall 39C1 and the second retaining wall 39C2. The deepest part 39Ca of the retaining groove 39C is the deepest part 39Ca of the first retaining wall 39C1 and the second retaining wall 39C2. The widthwise thickness t3 from the deepest part 39Ca of the first retaining wall 39C1 to the outer surface 39C1s of the first retaining wall 39C1 is thinner than the widthwise thickness t4 from the deepest part 39Ca of the second retaining wall 39C2 to the outer surface 39C2s of the second retaining wall 39C2. As a result, the substrate W2 held in the holding groove 39C (the center line z2 of the substrate W2) is significantly biased toward the side where the first distance TN1 is provided from the center 39Ba in the width direction of the holding member 39A. In other words, the substrate W1 separated by the distance TN1 from the substrate W2 held in the holding groove 39C is significantly separated from the outer surface 39C1s of the first holding wall portion 39C1. Therefore, the clearance C1 is wider than the conventional clearance C10.

[0123] In contrast, in the conventional holding member 390A, as shown in FIG. 27(b), the widthwise thickness t10 of the first holding wall 390C1 is the same as the widthwise thickness t20 of the second holding wall 390C2 located at the same groove depth. Furthermore, the widthwise thickness t30 from the deepest portion 390Ca of the first holding wall 390C1 to the outer surface 390C1s of the first holding wall 390C1 is the same as the widthwise thickness t40 from the deepest portion 390Ca of the second holding wall 390C2 to the outer surface 390C2s of the second holding wall 390C2. Therefore, the substrate W2 held in the holding groove 390C (the center line z2 of the substrate W2) is located at the widthwise center 390Ba of the holding member 390A. That is, the substrate W1, which is separated by the distance TN1 from the substrate W2 held in the holding groove 390C, is closer to the outer surface 390C1s of the first holding wall portion 390C1. Therefore, the conventional clearance C10 is narrower than the clearance C1 of the present invention.

[0124] The cross-sectional shapes of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are asymmetric with respect to a center line z3 that passes through the deepest portion 39Ca of the retaining groove 39C. The center line z3 is located on the side of the widthwise center 39Ba of the retaining member 39A where the first gap TN1 is provided. In contrast, in the conventional retaining member 390A, the cross-sectional shapes of the first retaining wall portion 390C1 and the second retaining wall portion 390C2 are symmetric with respect to a center line z30 that passes through the deepest portion 390Ca located at the center of the retaining groove 390C. The center line z30 passes through the center of the retaining groove 390C and the widthwise center 390Ba of the retaining member 390A. In the present invention, when the clearance C1 is narrowed, the first retaining wall portion 39C1 and the second retaining wall portion 39C2 do not become uniformly thin, thereby ensuring the rigidity of the retaining member 39A.

[0125] The holding groove forming portion 39D is formed so that its widthwise thickness is approximately constant from the base end to the tip end. The first holding wall portion 39C1 and the second holding wall portion 39C2 are formed so that, within the approximately constant width, the first holding wall portion 39C1 is thin and the second holding wall portion 39C2 is thick. The holding groove forming portion 39D has the first holding wall portion 39C1 which is thin on one side and the second holding wall portion 39C2 which is thick on the other side, ensuring the required rigidity as a whole.

[0126] The widthwise thickness of the retaining groove support portion 39E is thicker than the thickness t3 of the first retaining wall portion 39C1. The widthwise thickness of the retaining groove support portion 39E is thicker than the thickness t4 of the second retaining wall portion 39C2. The widthwise thickness of the retaining groove support portion 39E is equal to the thickness from the outer surface 39C1s of the first retaining wall portion 39C1 to the outer surface 39C2s of the second retaining wall portion 39C2. The rigidity of the retaining member 39A increases toward the retaining groove support portion 39E.

[0127] The holding member 39A is made of a fluororesin such as PTFE (polytetrafluoroethylene). Fluororesin has excellent heat resistance and chemical resistance. Fluororesin is softer than metal. Therefore, the holding member 39A made of fluororesin is less likely to damage the substrate W when a horizontally oriented substrate W is placed on it or when a vertically oriented substrate W is held on it. However, because fluororesin is soft among synthetic resins, it is more susceptible to deformation than hard synthetic resins.

[0128] Retaining groove forming member 39D (i.e., first retaining wall portion 39C1, second retaining wall portion 39C2, and retaining groove support portion 39E) are molded integrally. Retaining groove support portion 39E is molded integrally with vertical retainer 39F. Fluororesin has a tendency to deform easily, so if first retaining wall portion 39C1 is made thin, retaining member 39A becomes more likely to deform. By arranging thick second retaining wall portion 39C2 on the opposite side of thin first retaining wall portion 39C1 as in the present invention, the rigidity of retaining member 39A can be increased, making retaining member 39A less likely to deform. Note that retaining groove support portion 39E may also be configured to be joined to vertical retainer 39F by joining means such as adhesive or screws.

[0129] Next, with reference to FIG. 29, the latter half of the operation from the drying process to the transfer of the carrier C from the load port 9 will be described.

[0130] [Step S11] The main transport mechanism transports the group of substrates to the second transfer position. 2 and 30(a), the main transport mechanism WTR transports 50 substrates W in a vertical position that have been collectively processed in the chemical processing tank BT1 or the like and aligned at a narrow pitch, to a position above the second pitch conversion unit 26. In other words, the main transport mechanism WTR transports the 50 substrates W that have been dried in the drying unit 143 to a position above the second pitch conversion unit 26.

[0131] Thereafter, the main transport mechanism WTR lowers the 50 substrates W held by the chucks 145 to the transfer position P2. As a result, the main transport mechanism WTR transports the 50 substrates W in a vertical position and aligned at a narrow pitch to the second pitch conversion unit 26. The second pitch conversion unit 26 also receives the 50 substrates W in a vertical position and aligned at a narrow pitch from the main transport mechanism WTR. When receiving the 50 substrates W, the second pitch conversion unit 26 moves the 25 holding members 113 so that the 50 holding grooves 117 are arranged at a narrow pitch.

[0132] [Step S12] Changing the pitch of the processed substrate group from a narrow pitch to an unequal pitch See Figure 30(b). Thereafter, the second pitch conversion unit 26 converts the pitch of the 50 substrates W from the narrow pitch to an uneven pitch. This operation will be described in detail. The second pitch conversion unit 26 holds the 50 substrates W aligned at the narrow pitch using the 25 holding members 113, while holding two substrates W at the first interval TN1 using two holding grooves 117 separated by a first interval TN1 that each of the 25 holding members 113 has. The moving unit 115 (see Figure 13) moves the 25 holding members 113 in the alignment direction of the 50 substrates W (width direction Y) so as to change from the narrow pitch state to the uneven pitch state.

[0133] [Step S13] Transporting the group of substrates to be processed to the pusher member by the unloading mechanism See Figure 31(a). Thereafter, the unloading mechanism 75 of the delivery mechanism 23 transports the 50 substrates W aligned at an uneven pitch in a vertical position from the second pitch conversion unit 26 to the pusher member 55. This operation will be described in detail. The chuck 79 of the unloading mechanism 75 is in a closed state. First, the lifting unit 141 (see Figure 10) of the second pitch conversion unit 26 lowers the pitch conversion main body 111 including the 25 holding members 113. During this lowering, the unloading mechanism 75 uses the chuck 79 to receive and hold the 50 substrates W aligned at an uneven pitch in a vertical position.

[0134] 31(b). Thereafter, the carry-out mechanism 75 transports the 50 substrates W held by the chucks 79 from a position above the second pitch conversion unit 26 to a position above the pusher members 55. Thereafter, the pusher mechanism 21 raises the pusher members 55 to a position higher than the chucks 79. During this raising, the pusher mechanism 21 uses the pusher members 55 to receive and hold the 50 substrates W from the chucks 79 of the carry-out mechanism 75. The pusher members 55 hold the 50 substrates W aligned at an uneven pitch in a vertical position.

[0135] [Step S14] Receipt of the second group of substrates by the attitude change unit 32(a). Then, the unloading mechanism 75 moves the chuck 79 to a position above the second pitch conversion unit 26. Then, the rotation drive unit 41 of the attitude conversion mechanism 19 rotates the pair of horizontal holding units 37 and the like by 90 degrees about the horizontal axis AX2 so that the pair of vertical holding units 39 can receive the 25 substrates W2 (second substrate group). This causes the pair of horizontal holding units 37 and the pair of vertical holding units 39 to fall down. Furthermore, the axial movement unit 51 moves the pair of horizontal holding units 37 closer to the support surface 35A, and the accommodation movement unit 53 moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37.

[0136] See Figure 32(b). The pusher mechanism 21 then lowers the pusher member 55 from the position above the pair of vertical holders 39 to a position below them. During this lowering, the posture conversion mechanism 19 uses the pair of horizontal holders 37 and the pair of vertical holders 39 to receive 25 substrates W2 (second substrate group) of the 50 substrates W (processing substrate group) from the pusher member 55. The pair of vertical holders 39 hold the 25 substrates W2 aligned at the reference pitch (10 mm pitch). The axial movement unit 51 then moves the pair of horizontal holders 37 away from the support surface 35A. As a result, the 25 pairs of shelves 37A of the pair of horizontal holders 37 each come into contact with the backsides of the 25 substrates W2.

[0137] 32(a), the moving unit 115 of the second pitch conversion unit 26 moves the 25 (24) holding members 113 so that the 50 holding grooves 117 are arranged at a narrow pitch. As shown in FIG. 32(b), the lifting unit 141 of the second pitch conversion unit 26 lifts the pitch conversion main body 111 including the 25 holding members 113 so that the 50 holding grooves 117 are arranged at a position higher than the chuck 79.

[0138] [Step S15] Change the vertical position of the second group of substrates See Figure 33(a). The attitude changing mechanism 19 rotates the pair of horizontal holding parts 37 etc. by 90 degrees around the horizontal axis AX2, thereby changing the attitude of the 25 substrates W2 from a vertical attitude to a horizontal attitude. Thereafter, the storage transfer section 53 moves the pair of vertical holding sections 39 away from the pair of horizontal holding sections 37. As a result, the peripheral edges of the 25 substrates W2 are removed from the 25 pairs of holding grooves 39C of the pair of vertical holding sections 39.

[0139] The carrier transport robot 13 shown in FIG. 1 transports an empty second carrier C from the storage shelf 11 to the loading shelf 3. The substrate handling mechanism HTR takes out, from the loading shelf 3, the 25 substrates W2 that have been converted to a horizontal position by the loading shelf 3 (see FIG. 33(b)). The substrate handling mechanism HTR then transports the 25 substrates W2 into the second carrier C placed on the loading shelf 3. The carrier transport robot 13 then transports the second carrier C containing the 25 processed substrates W2 from the loading shelf 3 to the load port 9.

[0140] [Step S16] Move the first substrate group at the first interval See Figure 33(b). After the attitude changing mechanism 19 changes the attitude of the 25 substrates W2 to a horizontal attitude, the pusher mechanism 21 raises the pusher members 55 that hold the 25 substrates W1 (first substrate group).

[0141] Furthermore, the pusher mechanism 21 moves the 25 substrates W1 held by the pusher members 55 at a first interval TN1 (3.333 mm) in the alignment direction of the 25 substrates W1. Specifically, the pusher rotation unit 59 (see FIG. 8) of the pusher mechanism 21 rotates the pusher members 55 by 180 degrees about the vertical axis AX3. As a result, the 25 substrates W1 held by the pusher members 55 are moved to the right at the first interval TN1. Note that this movement at the first interval TN1 may be achieved by rotating the pusher members 55 by 180 degrees using the pusher rotation unit 59 and moving the pusher members 55 in the width direction Y using the pusher horizontal movement unit 61 (see FIG. 8).

[0142] [Step S17] Receipt of the first group of substrates by the attitude change unit 33(c), the attitude conversion mechanism 19 causes the pair of horizontal holding units 37 and the pair of vertical holding units 39 to be in a tilted state. The axial movement unit 51 also moves the pair of horizontal holding units 37 closer to the support surface 35A, and the storage movement unit 53 moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37.

[0143] 34(a). Then, the pusher mechanism 21 lowers the pusher member 55 from the position above the pair of vertical holding units 39 to the position below them. During this lowering, the posture conversion mechanism 19 receives the remaining 25 substrates W1 from the pusher member 55 using the pair of horizontal holding units 37 and the pair of vertical holding units 39. The pair of vertical holding units 39 hold the 25 substrates W1 aligned at a reference pitch (for example, 10 mm pitch). Then, the axial moving unit 51 brings the 25 pairs of shelves 37A of the pair of horizontal holding units 37 into contact with the backsides of the 25 substrates W1, respectively.

[0144] [Step S18] Change the vertical position of the first substrate group See Figure 34(b). The attitude conversion mechanism 19 rotates the pair of horizontal holding parts 37, etc. by 90 degrees around the horizontal axis AX2. As a result, the attitude conversion mechanism 19 converts the 25 substrates W1 from a vertical attitude to a horizontal attitude. See Figure 34(c). Thereafter, the storage transfer part 53 moves the pair of vertical holding parts 39 away from the pair of horizontal holding parts 37.

[0145] The carrier transport robot 13 shown in FIG. 1 transports an empty first carrier C from the storage shelf 11 to the loading shelf 3. The substrate handling mechanism HTR takes out, from the loading shelf 3, the 25 substrates W1 that have been converted to a horizontal position by the loading shelf 3 (see FIG. 34(c)). The substrate handling mechanism HTR then transports the 25 substrates W1 into the first carrier C placed on the loading shelf 3. The carrier transport robot 13 then transports the first carrier C containing the 25 processed substrates W1 from the loading shelf 3 to the load port 9. An external transport robot (not shown) then transports the two carriers C in sequence from the load port 9 to their next destination.

[0146] The "reference pitch" described above corresponds to the "uniform pitch" of the present invention. The "holding member 39A" described above corresponds to the "holding member" of the present invention. The "posture conversion mechanism 19" described above corresponds to the "first mechanism" of the present invention. The "pusher mechanism 21" described above corresponds to the "second mechanism" of the present invention.

[0147] According to this embodiment, the posture conversion mechanism 19 has a pair of vertical holders 39 that hold substrates W in a vertical posture aligned at a reference pitch. The pusher mechanism 21 combines the second substrate group W2 held by the posture conversion mechanism 19 with the first substrate group W1 previously delivered from the posture conversion mechanism 19 to hold multiple substrates W aligned at an irregular pitch where a first interval TN1 and a second interval TN2 wider than the first interval TN1 are alternately repeated. The pitch conversion unit 25 receives the multiple substrates W aligned at an irregular pitch from the pusher mechanism 21 and aligns the multiple substrates W aligned at an irregular pitch at a narrow pitch where the first interval TN1 is repeated. The processing block 7 processes the multiple substrates aligned at the narrow pitch collectively. The main transport mechanism WTR transports the multiple substrates aligned at the narrow pitch to the processing block 7. The pair of vertical holding parts 39 has holding grooves 39C formed in each holding member 39A so as to follow the peripheral edge Wa of the substrates W. The pair of vertical holding parts 39 has holding grooves 39C provided at positions shifted from the center of the width direction of each holding member 39A along the alignment direction of the substrates W toward the side where the first distance TN is located when the first substrate group W1 and the second substrate group W2 are combined.

[0148] As described above, the substrates W in a vertical position aligned at the reference pitch are aligned at a narrow pitch via the position conversion mechanism 19, the pusher mechanism 21, and the pitch conversion unit 25. The processing block 7 processes a plurality of substrates aligned at a narrow pitch at once. This reduces the amount of processing liquid (chemical liquid and cleaning liquid) used in the processing block 7. The pusher mechanism 21 combines the second substrate group W2 held by the position conversion mechanism 19 with the first substrate group W1 delivered in advance from the position conversion mechanism 19, and holds the plurality of substrates W aligned at an uneven pitch in which a first interval TN1 and a second interval TN2 wider than the first interval TN1 are alternately repeated. When this combination is performed, there is a concern that interference may occur between the holding member 39A or the substrates W of the second substrate group W2 held by the holding member 39A and the substrates W of the first substrate group W1 held by the pusher member 55 at the location where they are combined at the first interval TN1. Therefore, the pair of vertical holding members 39 have holding grooves 39C at positions shifted from the widthwise center of the holding member 39A along the alignment direction of the substrates W toward the side where the first distance TN1 is formed when the first substrate group W1 and the second substrate group W2 are combined. This makes it less likely that interference will occur between the holding member 39A or the substrates W of the second substrate group W2 held by the holding member 39A and the substrates W of the first substrate group W1 held by the pusher member 55, even at locations where they are combined at the first distance TN1. Therefore, it is possible to provide a substrate processing apparatus 1 that can efficiently process substrates W.

[0149] The position conversion mechanism 19 also includes a pair of horizontal holders 37 on which shelves 37A for placing the ends of horizontally oriented substrates W are arranged at a reference pitch, and a pair of vertical holders 39 on which holding members 39A for holding vertically oriented substrates W are arranged at a reference pitch. The position conversion mechanism 19 converts the position of the plurality of substrates W between a vertical position and a horizontal position by rotationally displacing the pair of horizontal holders 37 and the pair of vertical holders 39. The pusher mechanism 21 includes a pusher member 55 that holds the plurality of substrates W aligned at an irregular pitch by combining the second substrate group W2 in a vertical position held by the pair of vertical holders 39 with the first substrate group W1 in a vertical position that has been delivered in advance from the pair of vertical holders 30. The holding members 39A have holding grooves 39C formed along the peripheral edges Wa of the vertically oriented substrates W. The holding member 39A has holding grooves 39C at positions shifted from the center in the width direction along the alignment direction DR1 of the substrates W held in a vertical position toward the side where the first distance TN1 is formed when the first substrate group W1 and the second substrate group W2 are combined. This makes it possible to reduce interference between the holding member 39A or the substrates W of the second substrate group W2 held by the holding member 39A and the substrates W of the first substrate group W1 held by the pusher member 55 when the substrates W of the second substrate group W2 held by the pair of vertical holding parts 39 are combined at the first distance TN1 with the substrates W of the first substrate group W1 that have been passed from the pair of vertical holding parts 39 to the pusher member 55 in advance. Therefore, it is possible to provide a substrate processing apparatus 1 that can efficiently process substrates W.

[0150] Furthermore, the deepest portion 39Ca of the holding groove 39C of the holding member 39A is located at a position shifted from the center in the width direction toward the side where the first distance TN1 is formed when the first substrate group W1 and the second substrate group W2 are combined. This allows the deepest portion 39Ca of the holding groove 39C to hold the substrate W at a position shifted toward the side where the first distance TN1 is formed when the first substrate group W1 and the second substrate group W2 are combined. Therefore, even at a location where the first distance TN1 is formed between the first substrate group W1 and the second substrate group W2, interference between the holding member 39 of the posture conversion mechanism 19 holding the substrate W2 and the substrate held by the second mechanism can be reduced. This makes it possible to provide a substrate processing apparatus 1 that can efficiently process substrates W.

[0151] The holding member 39A also includes a first holding wall 39C1 that holds one end of the peripheral edge Wa of the substrate W inserted into the holding groove 39C, and a second holding wall 39D that holds the other end of the peripheral edge Wa of the substrate W inserted into the holding groove 39C. The first holding wall 39C1 and the second holding wall 39C2 have different widthwise thicknesses at the same groove depth. In order to reduce interference between the holding members 39A of the pair of vertical holding units 39 or the substrates W of the second substrate group W2 held by the holding members 39A, and the substrates W of the first substrate group W1 held by the pusher member 55, it is conceivable to make both the first holding wall 39C1 and the second holding wall 39C2 have the same dimensions but a thinner widthwise thickness. However, if both retaining walls were made thinner in the width direction while maintaining the same dimensions, the rigidity of retaining member 39A would decrease on both sides of first retaining wall 39C1 and second retaining wall 39C2. This would make retaining member 39A more susceptible to deformation, making it difficult to maintain the dimensional accuracy of retaining member 39A. In the present invention, first retaining wall 39C1 and second retaining wall 39C2 constituting retaining member 39A have different widthwise thicknesses at the same groove depth. This prevents the rigidity of retaining member 39A from decreasing in both first retaining wall 39C1 and second retaining wall 39C2. As a result, the retaining member is less likely to deform, making it easier to maintain the dimensional accuracy of the retaining member W material.

[0152] Furthermore, the widthwise thickness t1 of the first retaining wall portion 39C1 is thinner than the widthwise thickness t2 of the second retaining wall portion 39C2 located at the same groove depth. The first retaining wall portion 39C1 is provided on the side where the first distance TN1 is formed when the first substrate group W1 and the second substrate group W2 are combined. The second retaining wall portion 39C2 is provided on the side where the second distance TN2 is formed when the first substrate group W1 and the second substrate group W2 are combined. This prevents a decrease in the rigidity of the retaining member 39 from both the first retaining wall portion 39C1 and the second retaining wall portion 39C. As a result, the retaining member is less likely to deform, making it easier to maintain the dimensional accuracy of the retaining member W material. Furthermore, even at the point where they are combined at the first distance TN1, the thickness t1 of the first holding wall portion 39C1 is thin, making it less likely that interference will occur between the holding member 39A or the substrate W of the second substrate group W2 held by the holding member 39A and the substrate W of the first substrate group W1 held by the pusher member 55.

[0153] Furthermore, a widthwise thickness t3 from the deepest portion 39Ca of the holding groove 39C to the outer surface 39C1s of the first holding wall portion 39C1 is thinner than a widthwise thickness t4 from the deepest portion 39Ca of the holding groove 39C to the outer surface 39C2 of the second holding wall portion 39C2. This ensures the rigidity of the holding member 39A from the deepest portion 39Ca of the holding groove 39C to the upper surface of the holding groove 39C. Furthermore, because the thicknesses t1 and t3 of the first holding wall portion 39C1 from the deepest portion 39Ca of the holding groove 39C to the upper surface of the holding groove 39C are thin, interference between the holding member 39A or the substrates W of the second substrate group W2 held by the holding member 39A and the substrates W of the first substrate group W1 held by the pusher member 55 is less likely to occur.

[0154] Furthermore, when the holding member 39A is cut in the width direction along the alignment direction DR1 of the substrates W, the cross-sectional shape of the first holding wall portion 39C1 and the second holding wall portion 39C2 is asymmetric with respect to the center line z3 passing through the deepest portion 39Ca of the holding groove 39C. The cross-sectional shape of the first holding wall portion 39C1 is generally a right-angled triangle. The cross-sectional shape of the second holding wall portion 39C2 is generally a trapezoid. This ensures the rigidity of the holding member 39A compared to a configuration in which the first holding wall portion 39C1 and the second holding wall portion 39C2 have the same cross-sectional shape and are made thinner.

[0155] Furthermore, the cross-sectional shape of the first holding wall portion 39C1 of the holding member 39A is such that the widthwise length t1 from a depth position shallower than the deepest portion 39Ca to the outer surface 39C1s of the first holding wall portion 39C1 is shorter than the widthwise length t2 from the same depth position to the outer surface 39C2s of the second holding wall portion 39C2. This reduces the thickness of the first holding wall portion 39C1 at a depth position shallower than the deepest portion 39Ca of the holding groove 39C, making it possible to reduce interference between the holding member 39A or the substrates W of the second substrate group W2 held by the holding member 39A and the substrates W of the first substrate group W1 held by the pusher member 55.

[0156] Furthermore, shelf 37A is provided on the side where second distance TN2 is located when first substrate group W1 and second substrate group W2 are combined. As a result, shelf 37A is provided on the side where second distance TN2 is located when first substrate group W1 and second substrate group W2 are combined, and is therefore less likely to interfere with the substrates held by pusher mechanism 21 when first substrate group W1 and second substrate group W2 are combined.

[0157] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0158] (1) In the first embodiment described above, not only the deepest portion 39Ca of the holding groove 39C but also the entire holding groove 39C was located on the side of the widthwise center 39Ba along the alignment direction DR1 of the substrates W, where the first distance TN1 is located when the first substrate group W1 and the second substrate group W2 are combined. However, the location of the holding groove 39C is not limited to this. That is, as shown in FIG. 35(a), it is sufficient that the deepest portion 39Ca of the holding groove 39C is located closer to the first distance TN1 than the widthwise center 39Ba along the alignment direction DR1 of the substrates W. The holding groove 39C may extend further toward the second distance TN2 than the widthwise center 39Ba. Furthermore, the holding groove 39C may be formed across the entire width of the holding member 39A. For example, the holding groove 39C shown in FIG. 35(b) is formed across the entire width of the holding member 39A. The cross-sectional shapes of the first holding wall portion 39C1 and the second holding wall portion 39C2 are asymmetrical with respect to a center line z3 passing through the deepest portion 39Ca of the holding groove 39C.

[0159] (2) In the first embodiment described above, the retaining groove 39C is a V-shaped groove, but the shape of the retaining groove 39C is not limited to this. The bottom of the retaining groove 39C2, i.e., the deepest portion 39Ca, may be flat. As shown in FIG. 35(c), the deepest portion 39Ca of the retaining groove 39C2 may be curved. The retaining groove 39C may not be provided with the inclined surface 39B. For example, as shown in FIG. 35(d), the deepest portion 39Ca is flat, and the groove is formed perpendicular to the deepest portion 39Ca. The bottom of the retaining groove 39C may be formed in multiple steps. The cross-sectional shapes of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 are asymmetric with respect to the center line z3 passing through the deepest portion 39Ca of the retaining groove 39C. In FIG. 35(d), the deepest part 39Ca of the holding groove 39C is the center in the width direction along the arrangement direction of the substrates W in the flat deepest part 39Ca.

[0160] (3) In the first embodiment described above, the holding groove 39C is offset toward the side where the first distance TN1 is provided from the center 39Ba of the width direction of the holding member 39A along the substrate W arrangement direction DR1. However, the position of the holding groove 39C on the holding member 39A is not limited to this. For example, in the holding groove 39C shown in FIG. 36(a), the deepest portion 39Ca is located at the center 39Ba of the width direction of the holding member 39A. However, the holding groove 39C as a whole is offset toward the side where the first distance TN1 is provided on the holding member 39A. Therefore, the first holding wall portion 39C1 and the second holding wall portion 39C2 have asymmetric shapes with respect to the center line z3 passing through the deepest portion 39Ca of the holding groove 39C. Note that in FIG. 36, the center line z3 passes through the center 39Ba of the holding member 39A. The cross-sectional shapes of the first holding wall portion 39C1 and the second holding wall portion 39C2 are generally trapezoidal. The second holding wall portion 39C2 protrudes toward the center 39Ba more than the first holding wall portion 39C1. In other words, the substrate W2 protrudes toward the first holding wall portion 39C1. The first holding wall portion 39C1 and the second holding wall portion 39C2 have the same thickness (t3, t4) at the depth position of the innermost portion 39Ca. However, the first holding wall portion 39C1 and the second holding wall portion 39C2 have different thicknesses (t1, t2) at depth positions shallower than the innermost portion 39Ca. The cross-sectional shapes of the first holding wall portion 39C1 and the second holding wall portion 39C2 have different widthwise lengths (t1, t2) at depth positions shallower than the innermost portion 39Ca.

[0161] 36(b), the innermost portion 39Ca of the holding groove 39C is located at the widthwise center 39Ba of the holding member 39A. However, the second holding wall portion 39C2 of the holding groove 39C bulges outward slightly. Therefore, the first holding wall portion 39C1 and the second holding wall portion 39C2 are asymmetrical with respect to the center line z3 passing through the innermost portion 39Ca of the holding groove 39C. The cross-sectional shape of the first holding wall portion 39C1 is roughly a right-angled triangle. The cross-sectional shape of the second holding wall portion 39C2 is a quarter circle. The second holding wall portion 39C2 protrudes toward the center 39Ba more than the first holding wall portion 39C1. In other words, the substrate W2 protrudes toward the first holding wall portion 39C1. The first retaining wall portion 39C1 and the second retaining wall portion 39C2 have the same thickness (t3, t4) at the depth position of the innermost portion 39Ca. However, because the first retaining wall portion 39C1 and the second retaining wall portion 39C2 have asymmetric shapes, the thicknesses (t1, t2) are different at depth positions shallower than the innermost portion 39Ca. The cross-sectional shapes of the first retaining wall portion 39C1 and the second retaining wall portion 39C2 have different widthwise lengths (t1, t2) at depth positions shallower than the innermost portion 39Ca.

[0162] As described above, the widthwise thickness t3 of the retaining member 39A from the deepest portion 39Ca of the retaining groove 39C to the outer surface 39C1s of the first retaining wall 39C1 is the same as the widthwise thickness t4 from the deepest portion 39Ca of the retaining groove 39C to the outer surface 39C2s of the second retaining wall 39C2. However, the widthwise thickness t1 of the retaining member 39A from a depth position shallower than the deepest portion 39Ca to the outer surface 39C1s of the first retaining wall 39C1 is different from the widthwise thickness t2 from the same depth position to the outer surface 39C2s of the second retaining wall 39C2. This results in a thinner thickness of the first retaining wall 39C1 at a depth position shallower than the deepest portion 39Ca of the retaining groove 39C than in a configuration in which the thicknesses of the first retaining wall 39C1 and the second retaining wall 39C2 are the same. Therefore, interference between the holding members 39A or the substrates W of the second substrate group W2 held by the holding members 39A and the substrates W of the first substrate group W1 held by the pusher members 55 can be made less likely to occur.

[0163] Furthermore, the widthwise thickness t1 of the holding member 39A from a depth position shallower than the deepest portion 39Ca to the outer surface 39C1s of the first holding wall portion 39C1 is thinner than the widthwise thickness t2 from the same depth position to the outer surface 39C2s of the second holding wall portion 39C2. This ensures the rigidity of the holding member 39A at a depth position shallower than the deepest portion 39Ca of the holding groove 39C. Furthermore, because the thickness of the first holding wall portion 39C1 is thinner at a depth position shallower than the deepest portion 39Ca of the holding groove 39C, interference between the holding member 39A or the substrates W of the second substrate group W2 held by the holding member 39A and the substrates W of the first substrate group W1 held by the pusher member 55 is less likely to occur.

[0164] (4) In the above-described first embodiment, the attitude conversion mechanism 19 was described as an example of the "first mechanism" of the present invention, but any mechanism having a holding part that holds substrates in a vertical position aligned at an equal pitch may be used instead of the attitude conversion mechanism 19 as in the first embodiment. Also, in the above-described first embodiment, the pusher mechanism 21 was described as an example of the "second mechanism" of the present invention, but any mechanism that combines a second substrate group held by the first mechanism with a first substrate group delivered in advance from the first mechanism and holds a plurality of substrates aligned at an unequal pitch in which first intervals and second intervals wider than the first intervals are alternately repeated may be used instead of the pusher mechanism 21 as in the first embodiment. [Explanation of symbols]

[0165] c1 clearance t1~t4 thickness TN1 1st interval TN2 Second interval W: Substrate W1: First board group W2: Second board group 1... Substrate processing equipment 19... Posture conversion mechanism 21 ... Pusher mechanism 25,26 ... Pitch conversion section 37 … Horizontal holding part 37A … shelf 39 ... Vertical holding part 39Ba ... Center in width direction 39C … Retaining groove 39Ca... deepest part 39C1 … First retaining wall part 39C1a … Outer edge 39C1s…Outer surface 39C2…Second retaining wall part 39C2a … Outer edge 39C2s … Outer surface 55 ... Pusher member BT1~BT4 ... Chemical treatment tank WTR: Main transport mechanism

Claims

1. In a substrate processing apparatus for processing a substrate, a first mechanism having a holder for holding substrates aligned at equal intervals in a vertical position; a second mechanism that combines a second substrate group held by the first mechanism with a first substrate group delivered in advance from the first mechanism to hold a plurality of substrates aligned at an irregular pitch in which first intervals and second intervals wider than the first intervals are alternately repeated; a pitch conversion unit that receives the plurality of substrates aligned at the uneven pitch from the second mechanism and aligns the plurality of substrates aligned at the uneven pitch at a narrow pitch in which the first interval is repeated; a substrate processing section that collectively processes the plurality of substrates aligned at the narrow pitch; a main transport mechanism that transports the plurality of substrates aligned at the narrow pitch to the substrate processing section, The holding portion is a holding groove formed along the peripheral edge of the substrate; The holding groove is provided at a position shifted from the center in the width direction along the alignment direction of the substrates toward the side where the first gap is formed when the first substrate group and the second substrate group are combined. A substrate processing apparatus characterized by:

2. 2. The substrate processing apparatus according to claim 1, the first mechanism is a posture conversion mechanism that includes a pair of horizontal holding units in which shelves for placing ends of horizontally oriented substrates are arranged at the same pitch, and a pair of vertical holding units in which holding members for holding vertically oriented substrates are arranged at the same pitch, and that converts the postures of a plurality of substrates between a vertical posture and a horizontal posture by rotationally displacing the pair of horizontal holding units and the pair of vertical holding units; the second mechanism is a pusher mechanism having the pusher member that combines the second group of substrates in the vertical position held by the pair of vertical holding parts with the first group of substrates in the vertical position that have been passed in advance from the pair of vertical holding parts, and holds the plurality of substrates aligned at the uneven pitch; The holding member is The holding groove is formed along the peripheral edge of the substrate in the vertical position, The holding groove is provided at a position shifted from the center in the width direction along the alignment direction of the substrates held in the vertical attitude toward a side where the first gap is disposed when the first substrate group and the second substrate group are combined. A substrate processing apparatus characterized by:

3. 3. The substrate processing apparatus according to claim 1, The holding member is the deepest part of the holding groove is located at a position shifted from the center in the width direction toward a side where the first gap is formed when the first substrate group and the second substrate group are combined; A substrate processing apparatus characterized by:

4. 4. The substrate processing apparatus according to claim 1, The holding member is a first holding wall portion that holds one end of a peripheral edge portion of the substrate that is inserted into the holding groove; a second holding wall portion that holds the other end of the peripheral edge portion of the substrate that is inserted into the holding groove, The first holding wall portion and the second holding wall portion have different thicknesses in the width direction at the same groove depth position. A substrate processing apparatus characterized by:

5. 5. The substrate processing apparatus according to claim 4, a thickness in the width direction of the first retaining wall portion is thinner than a thickness in the width direction of the second retaining wall portion located at the same groove depth; the first holding wall portion is provided on a side where the first gap is disposed when the first substrate group and the second substrate group are combined; The second holding wall portion is provided on the side where the second gap is disposed when the first substrate group and the second substrate group are combined. A substrate processing apparatus characterized by:

6. 6. The substrate processing apparatus according to claim 5, The holding member is The thickness in the width direction from the deepest portion of the holding groove to the outer surface of the first holding wall portion is thinner than the thickness in the width direction from the deepest portion of the holding groove to the outer surface of the second holding wall portion. A substrate processing apparatus characterized by:

7. 5. The substrate processing apparatus according to claim 4, The holding member is a thickness in the width direction from the deepest portion of the holding groove to the outer surface of the first holding wall portion is the same as a thickness in the width direction from the deepest portion of the holding groove to the outer surface of the second holding wall portion, The thickness in the width direction from a depth position shallower than the deepest part to the outer surface of the first holding wall portion is different from the thickness in the width direction from the same depth position to the outer surface of the second holding wall portion. A substrate processing apparatus characterized by:

8. 5. The substrate processing apparatus according to claim 4, The holding member is a thickness in the width direction from the deepest portion of the holding groove to the outer surface of the first holding wall portion is the same as a thickness in the width direction from the deepest portion of the holding groove to the outer surface of the second holding wall portion, The thickness in the width direction from a depth position shallower than the deepest part to the outer surface of the first holding wall portion is thinner than the thickness in the width direction from the same depth position to the outer surface of the second holding wall portion. A substrate processing apparatus characterized by:

9. 5. The substrate processing apparatus according to claim 4, The holding member is When the holding member is cut in a width direction along the alignment direction of the substrates, the first holding wall portion and the second holding wall portion have a cross-sectional shape that is asymmetric with respect to a center line passing through the deepest part of the holding groove. A substrate processing apparatus characterized by:

10. 5. The substrate processing apparatus according to claim 4, The holding member is The cross-sectional shape of the first retaining wall portion is a shape in which the length in the width direction from a depth position shallower than the deepest part to an outer surface of the first retaining wall portion is shorter than the length in the width direction from the same depth position to the outer surface of the second retaining wall portion. A substrate processing apparatus characterized by:

11. 11. The substrate processing apparatus according to claim 1, The mounting member is provided on a side where the second gap is formed when the first substrate group and the second substrate group are combined. A substrate processing apparatus characterized by:

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