Substrate processing apparatus

Abstract

To provide a substrate processing apparatus that can efficiently process a substrate.SOLUTION: A posture conversion unit 19 converts the posture of a substrate group arranged at a reference pitch from a horizontal holding posture to a vertical holding posture. A pusher mechanism 21 combines substrates W2 (second substrate group) held by the posture conversion unit 19 and substrates W1 (first substrate group) delivered in advance from the posture conversion unit 19 to hold a plurality of substrates arranged at an unequal pitch narrower than the reference pitch. A first pitch conversion unit 25 receives the plurality of substrates arranged at the unequal pitch, and arranges the plurality of substrates arranged at the unequal pitch at a narrow pitch narrower than the reference pitch. A processing block 7 collectively processes the plurality of substrates arranged at the narrow pitch. A main conveyance mechanism WTR collectively conveys the plurality of substrates arranged at the narrow pitch to the processing block 7. The first pitch conversion unit 25 and a second pitch conversion unit 26 are arranged on a side of the pusher mechanism 21 facing the main conveyance mechanism WTR.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for processing substrates. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of the FPD include liquid crystal display devices and organic EL (electroluminescence) display devices. [Background technology]

[0002] Conventionally, there is known a substrate processing apparatus that processes multiple vertically oriented substrates by immersing them all at once in a processing solution. This substrate processing apparatus includes a position change mechanism and a pusher (see, for example, Patent Document 1). The position change mechanism changes the position of the substrates between a horizontal position and a vertical position. The pusher can transfer multiple vertically oriented substrates to and from the position change mechanism by vertical movement of a lifting and lowering holder.

[0003] The pusher combines a group of substrates held by the attitude change mechanism with a group of substrates previously delivered from the attitude change mechanism, and holds the multiple substrates in the lifting and holding unit. The combination of substrate groups performed in the lifting and holding unit is a type of pitch conversion. The multiple substrates held in the lifting and holding unit are aligned, for example, at a half pitch, which is half the substrate holding pitch in the carrier. By processing the substrates aligned at a half pitch in a batch, the amount of processing liquid used can be reduced. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-93230 Summary of the Invention [Problem to be solved by the invention]

[0005] In order to further reduce the amount of processing liquids (chemicals and cleaning liquids) used in a substrate processing apparatus, there is a demand for aligning multiple substrates at a narrower pitch than half pitch and processing multiple substrates aligned at this narrow pitch all at once.

[0006] In such cases, it is necessary to combine the group of substrates held by the position change mechanism with the group of substrates previously delivered from the position change mechanism, hold the multiple substrates in the lifting and lowering holder, and then perform pitch change. This further increases the time required for pitch change. Therefore, the conventional device has the problem of being unable to process substrates efficiently.

[0007] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of processing substrates efficiently. [Means for solving the problem]

[0008] In order to achieve the above object, the present invention has the following configuration. That is, the substrate processing apparatus according to the present invention comprises: A substrate processing apparatus for processing a substrate, a posture change mechanism that changes the posture of a substrate in a horizontal posture between a horizontal holding posture in which a group of substrates aligned at equal pitches in the vertical direction is held, and a vertical holding posture in which a substrate in a vertical posture is held in which the group of substrates aligned at equal pitches in the horizontal direction is held; a pusher mechanism having a pusher member that combines the second group of substrates in the vertically held position held by the position change mechanism with the first group of substrates in the vertically held position that have been delivered in advance from the position change mechanism, and holds a plurality of substrates aligned at intervals narrower than the equal pitch; a pitch conversion unit that receives the plurality of substrates aligned at the narrow intervals and aligns the plurality of substrates aligned at the narrow intervals at a narrow pitch that is narrower than the uniform pitch; a substrate processing section that collectively processes the plurality of substrates aligned at the narrow pitch; a main transport mechanism that transports the plurality of substrates aligned at the narrow pitch all at once to the substrate processing section, The pitch conversion unit is disposed on the main transport mechanism side of the pusher mechanism.

[0009] In the substrate processing apparatus according to the present invention, the pusher mechanism holds a plurality of substrates aligned at narrower intervals than the regular pitch by combining a second group of substrates held in a vertically held position by the position conversion mechanism with a first group of substrates previously delivered from the position conversion mechanism in a vertically held position. The process of creating a plurality of substrates aligned at narrower intervals from the group of substrates aligned at regular pitches is called first-stage pitch conversion. The pitch conversion unit receives the narrowly aligned substrates and aligns the narrowly aligned substrates at a pitch narrower than the regular pitch. The process of creating a plurality of substrates aligned at a narrow pitch from the narrowly aligned substrates is called second-stage pitch conversion. In the present invention, the second-stage pitch conversion is not performed by the pusher mechanism but by a pitch conversion unit located on the main transport mechanism side of the pusher mechanism. In other words, the second-stage pitch conversion is performed at a position that does not reduce throughput. This allows for efficient substrate processing.

[0010] In addition, in the substrate processing apparatus according to the present invention, the plurality of substrates aligned at narrow intervals are a plurality of substrates aligned at an unequal pitch in which a first interval narrower than the equal pitch and a second interval narrower than the equal pitch and wider than the first interval are alternately repeated, the equal pitch is equal to the sum of the first interval and the second interval, The plurality of substrates aligned at the narrow pitch are a plurality of substrates aligned at the first interval repeatedly. It is preferable to perform the second-stage pitch shift slowly, since it narrows the second interval of the unequal pitch created by the first-stage pitch shift until it becomes the first interval. Therefore, the second-stage pitch shift can be performed slowly at a position that does not reduce the throughput of the first-stage pitch shift.

[0011] In addition, in the substrate processing apparatus according to the present invention, the plurality of substrates aligned at narrow intervals are the plurality of substrates aligned at a first narrow pitch that is narrower than the uniform pitch, The plurality of substrates aligned at the narrow pitch are the plurality of substrates aligned at a second narrow pitch that is narrower than the first narrow pitch. It is preferable to have the second stage pitch conversion be performed slowly because it narrows the first narrow pitch created by the first stage pitch conversion to the second narrow pitch. However, the second stage pitch conversion is performed at a position that does not reduce throughput. Therefore, substrates can be processed efficiently.

[0012] In addition, in the substrate processing apparatus according to the present invention, The substrate processing apparatus includes: a lateral movement mechanism that moves a lateral movement holding unit that collectively holds the plurality of substrates aligned at the narrow intervals received from the pusher member along a lateral movement path between a substrate transfer position and a substrate delivery position, the substrate transfer position is a position where the plurality of substrates aligned at the narrow intervals are collectively transferred between the pusher member and the lateral holding part, the substrate transfer position is a position where the plurality of substrates aligned at the narrow pitch are transferred collectively between the pitch conversion unit and the main transport device, the pitch conversion unit moves up and down at the substrate transfer position to transfer the plurality of substrates aligned at the narrow intervals between the pitch conversion unit and the lateral holding unit; The pitch conversion unit is disposed at the substrate transfer position. It is preferable to set the pitch conversion unit that performs the second-stage pitch conversion at a position away from the pusher mechanism that performs the first-stage pitch conversion. In other words, the second-stage pitch conversion is performed at a position that does not reduce the throughput of the first-stage pitch conversion. Therefore, substrates can be processed efficiently.

[0013] In addition, in the substrate processing apparatus according to the present invention, The pitch change section is disposed below the lateral path. It is preferable (claim 5). This allows the work at the traverse holding section and the work at the pitch changing section to be carried out simultaneously, partially simultaneously, or at approximately the same time.

[0014] In addition, in the substrate processing apparatus according to the present invention, The substrate processing apparatus includes: a lateral movement mechanism that moves a lateral movement holding unit that collectively holds the plurality of substrates aligned at narrow intervals and received from the pusher member laterally along a lateral movement path between a substrate transfer position and a substrate delivery position; an intermediate mechanism that raises and lowers an intermediate holding unit that collectively holds the plurality of substrates aligned at the narrow pitch at the substrate transfer position, the substrate transfer position is a position where the plurality of substrates aligned at the narrow intervals are collectively transferred between the pusher member and the lateral holding part, the substrate transfer position is a position where the plurality of substrates aligned at the narrow pitch are transferred collectively between the intermediary holder and the main transport device, the pitch conversion unit moves up and down at the substrate transfer position to transfer the plurality of substrates aligned at the narrow intervals between the pitch conversion unit and the lateral holding unit; the intermediary holding unit moves up and down at the substrate transfer position to transfer the plurality of substrates aligned at the narrow pitch between the intermediary holding unit and the pitch converting unit; The pitch conversion unit is disposed at the substrate transfer position. It is preferable to set the pitch conversion unit that performs the second-stage pitch conversion apart from the pusher mechanism that performs the first-stage pitch conversion (claim 6). In other words, the second-stage pitch conversion is performed at a position that does not reduce the throughput of the first-stage pitch conversion. Therefore, substrates can be processed efficiently.

[0015] In addition, in the substrate processing apparatus according to the present invention, The pitch conversion portion is disposed at a position lower than the intermediate holding portion. It is preferable (claim 7). This allows the work at the pitch conversion section and the work at the intermediary holding section to be carried out simultaneously, partially simultaneously, or at approximately the same time.

[0016] In addition, in the substrate processing apparatus according to the present invention, The pitch change section is disposed below the lateral path. It is preferable (claim 8). This allows the work at the traverse holding section, the work at the pitch changing section, and the work at the intermediary holding section to be carried out simultaneously, partially simultaneously, or at approximately the same time.

[0017] In addition, in the substrate processing apparatus according to the present invention, The substrate processing apparatus includes: a first traverse mechanism that traverses a first traverse holding unit that collectively holds the plurality of substrates aligned at narrow intervals and received from the pusher member, along a first traverse path; a second lateral movement mechanism that moves a second lateral movement holding unit that collectively holds the plurality of substrates aligned at narrow intervals to be passed to the pusher member, along a second lateral movement path; The pitch conversion unit a first pitch conversion unit that receives the plurality of substrates aligned at the narrow intervals and aligns the plurality of substrates aligned at the narrow intervals at the narrow pitch; a second pitch conversion unit that receives the plurality of substrates aligned at the narrow pitch and aligns the plurality of substrates aligned at the narrow pitch at the narrow intervals. It is preferable (claim 9). The two-stage pitch conversion is performed separately in the pusher mechanism and the pitch conversion unit. Furthermore, pitch conversion is performed separately in the first pitch conversion unit and the second pitch conversion unit depending on whether the processing in the substrate processing unit is before or after. Therefore, throughput is not reduced. Therefore, substrates can be processed efficiently.

[0018] In addition, in the substrate processing apparatus according to the present invention, the first lateral path is a path between a substrate transfer position and a substrate loading position, the second lateral path is a path between a substrate unloading position and a substrate transfer position, the first traverse path and the second traverse path are provided at positions separated in a lateral direction, the first pitch conversion unit is disposed at the substrate loading position, The second pitch conversion unit is disposed at the substrate unloading position. It is preferable (claim 10). The first lateral path and the second lateral path are provided at positions separated in the lateral direction. Therefore, the height of the substrate processing apparatus is reduced. The first pitch conversion unit and the second pitch conversion unit perform pitch conversion at positions separated in the lateral direction. Therefore, the first pitch conversion unit and the second pitch conversion unit do not interfere with each other, and therefore the respective pitch conversions can be performed simultaneously, partially simultaneously, or at similar timings. Therefore, throughput can be improved. As a result, substrates can be processed efficiently.

[0019] In addition, in the substrate processing apparatus according to the present invention, The first pitch conversion unit The first lateral holding unit receives the plurality of substrates aligned at the narrow intervals from the first lateral holding unit, and carries the plurality of substrates aligned at the narrow pitch into the main transport mechanism. It is preferable (claim 11). This allows the substrate to be efficiently carried in between the first lateral holding section, the first pitch changing section, and the main transport mechanism.

[0020] In addition, in the substrate processing apparatus according to the present invention, an intermediate mechanism that raises an intermediate holding unit that collectively holds the plurality of substrates aligned at the narrow pitch at the substrate loading position; the substrate transfer position is a position where the plurality of substrates aligned at narrow intervals are collectively carried from the pusher member to the first lateral holding unit, the substrate loading position is a position where the plurality of substrates aligned at the narrow pitch are loaded collectively from the intermediary holding unit into the main transport mechanism, the first pitch conversion unit rises at the substrate loading position to load the plurality of substrates aligned at the narrow intervals from the first lateral holding unit; the intermediary holding unit is raised at the substrate loading position to load the plurality of substrates aligned at the narrow pitch from the pitch changing unit, The first pitch conversion unit is disposed at the substrate loading position. It is preferable (claim 12). This allows pitch conversion by the first pitch conversion unit to be performed efficiently during the substrate loading process carried out between the first lateral holding unit, the first pitch conversion unit, the intermediary holding unit, and the main transport mechanism.

[0021] In addition, in the substrate processing apparatus according to the present invention, The first pitch conversion portion is disposed below the intermediate holding portion. It is preferable (claim 13). This allows the work at the first pitch change portion and the work at the intermediary holding portion to be carried out simultaneously, partially simultaneously, or at approximately the same timing.

[0022] In addition, in the substrate processing apparatus according to the present invention, The first pitch change section is disposed below the first traverse path. It is preferable (claim 14). This allows the work at the first traverse holding section, the work at the first pitch change section, and the work at the intermediary holding section to be carried out simultaneously, partially simultaneously, or at nearly the same timing.

[0023] In addition, in the substrate processing apparatus according to the present invention, The second pitch conversion unit receiving the plurality of substrates aligned at the narrow pitch from the main transport mechanism and carrying out the plurality of substrates aligned at the narrow pitch to the second lateral holding unit; The substrate is disposed at the substrate unloading position. It is preferable (claim 15). This allows the second pitch conversion section to efficiently convert the pitch during the substrate unloading process.

[0024] In addition, in the substrate processing apparatus according to the present invention, The second pitch change section is disposed below the second traverse path. It is preferable (claim 16). This allows the work at the second pitch change section and the work at the second traverse holding section to be carried out simultaneously, partially simultaneously, or at approximately the same timing.

[0025] In addition, in the substrate processing apparatus according to the present invention, The second pitch change portion is disposed above the first pitch change portion. It is preferable (claim 17). This makes it possible to carry out the work at the first pitch change section and the work at the second pitch change section simultaneously, partially simultaneously, or at approximately the same time.

[0026] In addition, in the substrate processing apparatus according to the present invention, The second pitch change portion is disposed above the intermediate holding portion. It is preferable (claim 18). This allows the work at the first pitch change section, the work at the intermediary holding section, and the work at the second pitch change section to be carried out simultaneously, partially simultaneously, or at nearly the same time.

[0027] In addition, in the substrate processing apparatus according to the present invention, the first traverse path and the second traverse path intersect at a predetermined angle, the pusher mechanism is disposed at the intersection at the predetermined angle; The first pitch change portion and the second pitch change portion are spaced apart at the predetermined angle. It is preferable (claim 19). This allows the first pitch change portion and the second pitch change portion to be separated at a position where they are less likely to interfere with each other.

[0028] In addition, in the substrate processing apparatus according to the present invention, The substrate processing apparatus includes: a lateral movement mechanism that moves a lateral movement holding unit that collectively holds the plurality of substrates aligned at the narrow intervals received from the pusher member along a lateral movement path between a substrate transfer position and a substrate delivery position, The pitch change unit is provided in the traverse mechanism. It is preferable (claim 20). This makes it possible to reduce the height of the substrate processing apparatus by the amount that the pitch conversion section is integrated with the traversing mechanism.

[0029] In addition, in the substrate processing apparatus according to the present invention, the first pitch conversion unit is provided in the first traverse mechanism, The second pitch conversion unit is provided in the second traverse mechanism. It is preferable (claim 21). With this, the height of the substrate processing apparatus can be reduced by the amount that the first pitch conversion unit is integrated with the first traverse mechanism and the second pitch conversion unit is integrated with the second traverse mechanism. [Effects of the Invention]

[0030] According to the substrate processing apparatus of the present invention, other processing can be performed before or after the processing in the substrate processing section while performing pitch conversion, thereby enabling substrates to be processed efficiently. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a plan view showing the configuration of a transfer block and its surroundings. [Figure 3] FIG. 2 is a side view showing the substrate handling mechanism. [Figure 4] FIG. [Figure 5] FIG. 10 is a side view showing the pusher mechanism. [Figure 6] FIG. 4 is a side view showing a vertical cross section of the pusher member. [Figure 7]3 is a side view showing the delivery mechanism, two pitch conversion units, etc., as seen in the direction of arrow AA in FIG. 2. [Figure 8] FIG. 2 is a plan view mainly showing a carry-in mechanism and a carry-out mechanism. [Figure 9] FIG. [Figure 10] 10 is a side view showing a schematic configuration of a pitch conversion unit that holds a plurality of substrates aligned at unequal pitches. FIG. [Figure 11] 10 is a side view showing a schematic configuration of a pitch conversion unit that holds a plurality of substrates aligned at a narrow pitch. FIG. [Figure 12] 10 is a bottom view mainly showing the expansion and contraction mechanism of the pitch conversion unit that holds a plurality of substrates aligned at unequal pitches. FIG. [Figure 13] 10 is a bottom view mainly showing the expansion and contraction mechanism of the pitch conversion unit that holds a plurality of substrates aligned at a narrow pitch. FIG. [Figure 14] 10 is a flowchart illustrating the first half of the operation of the substrate processing apparatus. [Figure 15] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 16] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 17] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 18] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 19] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 20] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 21] 10 is a flowchart illustrating a second half of the operation of the substrate processing apparatus. [Figure 22] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 23] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 24] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 25] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 26] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 27] FIG. 10 is a plan view showing the configuration of a transfer block and its surroundings according to a second embodiment. [Figure 28] 28 is a side view showing the delivery mechanism, two pitch conversion units, etc., when viewed in the direction of arrow AA in FIG. 27. [Figure 29] FIG. 10 is a plan view showing the configuration of a transfer block and its surroundings according to a third embodiment. [Figure 30] 30 is a side view showing the delivery mechanism, two pitch conversion units, etc., as seen in the direction of arrow AA in FIG. 29. [Figure 31] FIG. 10 is a plan view showing the configuration of a transfer block and its surroundings according to a fourth embodiment. [Figure 32] 32 is a side view showing the delivery mechanism, two pitch conversion units, etc., as seen in the direction of arrow AA in FIG. 31. FIG. [Figure 33] FIG. 10 is a plan view showing the configuration of a transfer block and its surroundings according to a fifth embodiment. [Figure 34] 10 is a side view showing the extension and contraction mechanisms of the pitch conversion parts provided on the pair of chuck members of the carry-in mechanism and the pair of chuck members of the carry-out mechanism. FIG. [Figure 35] 10 is a side view showing the extension and contraction mechanisms of the pitch conversion parts provided on the pair of chuck members of the carry-in mechanism and the pair of chuck members of the carry-out mechanism. FIG. Example 1

[0032] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to the first embodiment. Fig. 2 is a plan view showing a transfer block 5 and its surrounding configuration.

[0033] For convenience, in this specification, the direction in which the transfer block 5 and the processing block 7 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, for example, the direction from the processing block 7 toward the transfer block 5 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, back, right, left, top, and bottom are indicated as appropriate.

[0034] <1. Configuration of the substrate processing apparatus> Referring to Figure 1, the substrate processing apparatus 1 processes substrates W. The substrate processing apparatus 1 is a batch-type substrate processing apparatus that processes a plurality of substrates W (e.g., 50, 75, or 100) at once. The substrate processing apparatus 1 performs, for example, chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing apparatus 1 includes a stocker 2, a loading shelf 3, a transfer block 5, a processing block 7, and a batch substrate transport area 8.

[0035] <1-1. Stocker> The stocker 2 accommodates at least one carrier C. The stocker 2 is adjacent to the front of the transfer block 5. The carrier C stores multiple (e.g., 25) substrates W in a horizontal position with a predetermined interval (e.g., 10 mm) between them. In other words, the carrier C stores N (e.g., 25) substrates W aligned at a standard pitch in a horizontal position. N is a natural number equal to or greater than 2. The standard pitch is a repeated standard interval TN9 (e.g., 10 mm (millimeters)). In other words, when the standard interval TN9 is 10 mm, the standard pitch is 10 mm. The N substrates W in the carrier C are aligned in the vertical direction Z or the thickness direction of each substrate W. For example, a FOUP (Front Opening Unify Pod) is used as the carrier C, but is not limited to this.

[0036] The stocker 2 is equipped with a plurality of (for example, two) load ports 9. The two load ports 9 are arranged in the width direction Y. In this embodiment, the two load ports 9 are used to load and unload carriers C. The stocker 2 also is equipped with at least one storage shelf 11 and a carrier transport robot 13. The carriers C are placed on the storage shelf 11.

[0037] The carrier transport robot 13 transports the carrier C between the two load ports 9, the storage shelf 11, and the loading shelf 3. The carrier transport robot 13 is equipped with a gripping unit 15 that grips a protrusion provided on the top surface of the carrier C, for example. The carrier transport robot 13 can move the gripping unit 15 in the horizontal direction (front-back direction X and width direction Y) and the vertical direction Z. The carrier transport robot 13 is driven by one or more electric motors.

[0038] The loading shelf 3 is arranged in the area of ​​the stocker 2. The loading shelf 3 is adjacent to the front of the transfer block 5. On the loading shelf 3, the carrier C is placed.

[0039] <1-2. Transfer block> 1 and 2, the transfer block 5 includes a substrate handling mechanism (robot) HTR, a posture conversion unit 19, a pusher mechanism 21, a delivery mechanism 23, and two pitch conversion units 25 and 26.

[0040] The substrate handling mechanism HTR is disposed behind the loading shelf 3. The substrate handling mechanism HTR transports a plurality of (e.g., 25) substrates W in a horizontal position between a carrier C placed on the loading shelf 3 and the position conversion unit 19. As shown in FIG. 3, the substrate handling mechanism HTR is equipped with a plurality of (e.g., 25 or 13) hands 27. Each hand 27 holds one substrate W. The plurality of 25 hands 27 are arranged at a reference pitch in the vertical direction Z. Therefore, for example, 25 substrates W held by the 25 hands 27 are aligned at the reference pitch. The reference pitch is a repeating reference interval TN9 (e.g., 10 mm).

[0041] 3 and other figures, for convenience of illustration, the substrate handling mechanism HTR is shown to have five hands 27. A pair of horizontal holding parts 37 and a pair of vertical holding parts 39, which will be described later, are each shown to hold five substrates W. A pusher member 55, which will be described later, is shown to support ten substrates W.

[0042] The substrate handling mechanism HTR further includes a hand support unit 29, an advancing / retreating unit 31, and an elevation / rotation unit 33. The hand support unit 29 supports the multiple hands 27. The advancing / retreating unit 31 moves the multiple hands 27 forward and backward via the hand support unit 29. The elevation / rotation unit 33 rotates the advancing / retreating unit 31 about a vertical axis AX1 to change the orientation of the hands 27. The elevation / rotation unit 33 is fixed to the floor surface. The advancing / retreating unit 31 and the elevation / rotation unit 33 each include an electric motor. The substrate handling mechanism HTR may also include a movable hand (not shown) for transporting only one substrate W, separate from the hand 27.

[0043] The attitude conversion unit 19 converts a plurality of (e.g., 25) substrates W between a horizontal attitude and a vertical attitude. The attitude conversion unit 19 is disposed to the left of the substrate handling mechanism HTR. As shown in FIG. 4 , the attitude conversion unit 19 includes a support base 35, a pair of horizontal holding units 37, a pair of vertical holding units 39, and a rotation drive unit 41.

[0044] The support base 35 is supported rotatably about a horizontal axis AX2 extending in the front-rear direction X. A pair of horizontal holding parts 37 and a pair of vertical holding parts 39 are provided to extend perpendicularly from the support surface 35A. When the plurality of substrates W are in a horizontal position, the pair of horizontal holding parts 37 hold the plurality of substrates W. In other words, when the plurality of substrates W are in a horizontal position, the plurality of substrates W are placed on the pair of horizontal holding parts 37. When the plurality of substrates W are in a vertical position, the pair of vertical holding parts 39 hold the plurality of substrates W.

[0045] The pair of horizontal holding parts 37 and the pair of vertical holding parts 39 are both arranged in the front-rear direction X (see FIG. 2). Furthermore, when the pair of horizontal holding parts 37 hold multiple substrates W in a horizontal position, the pair of vertical holding parts 39 are arranged closer to the pusher mechanism 21 than the pair of horizontal holding parts 37. The pair of horizontal holding parts 37 have multiple pairs (e.g., 25 pairs, 38 pairs, 50 pairs) of shelves 37A arranged at a standard pitch in the direction DR1 in which the pair of horizontal holding parts 37 extend. The pair of vertical holding parts 39 have multiple pairs (e.g., 25 pairs, 38 pairs, 50 pairs) of holding grooves 39A arranged at a standard pitch in the direction DR1 in which the pair of vertical holding parts 39 extend.

[0046] The posture conversion unit 19 also includes an axial movement unit 51 and a storage movement unit 53. The axial movement unit 51 moves the pair of horizontal holding units 37 a preset small distance in the direction DR1 in which the pair of horizontal holding units 37 extend. The storage movement unit 53 moves the pair of vertical holding units 39 toward or away from the pair of horizontal holding units 37. For example, when the pair of horizontal holding units 37 hold multiple substrates W in a horizontal posture, the storage movement unit 53 can move the pair of vertical holding units 39 in the width direction Y. The rotation drive unit 41 converts the multiple substrates W held by the pair of horizontal holding units 37 and the pair of vertical holding units 39 between a horizontal posture and a vertical posture.

[0047] The rotation drive unit 41 includes, for example, an electric motor. The axial movement unit 51 and the housing movement unit 53 each include an air cylinder or an electric actuator. The electric actuator includes an electric motor.

[0048] The pusher mechanism 21 is disposed to the left of the position conversion unit 19. As shown in FIG. 5 , the pusher mechanism 21 includes a pusher member 55, a rotating shaft 57, a pusher rotating unit 59, a pusher horizontal moving unit 61, a lifting platform 63, and a pusher lifting unit 65.

[0049] The pusher member 55 holds a plurality of substrates W arranged at narrower intervals than a reference pitch in which the reference interval TN9 is repeated. For example, as shown in Fig. 6, the pusher member 55 holds, in a vertical position, a plurality of substrates W (e.g., 50, 75, 100) arranged at an irregular pitch in which a first interval TN1 (e.g., 3.333 mm) and a second interval TN2 (e.g., 6.666 mm) are alternately repeated. As shown in Fig. 6, the pusher member 55 holds, in a vertical position, a plurality of substrates W (e.g., 50, 75, 100) arranged at an irregular pitch in which a first interval TN1 (e.g., 3.333 mm) and a second interval TN2 (e.g., 6.666 mm) are alternately repeated. The second interval TN2 is wider than the first interval TN1 (second interval TN2>first interval TN1). The first interval TN1 is also called a narrow interval, and the second interval TN2 is also called a wide interval.

[0050] 6, the pusher member 55 has a plurality of (e.g., 50, 75, or 100) vertical holding grooves 67 for holding a plurality of substrates W in a vertical position. The plurality of vertical holding grooves 67 are arranged, for example, at an unequal pitch in which a first interval TN1 and a second interval TN2 are alternately repeated. The sum of the first interval TN1 (e.g., 3.333 mm) and the second interval TN2 (e.g., 6.666 mm) is a reference interval TN9 (e.g., 10 mm).

[0051] See Figure 5. The lower surface of the pusher member 55 is connected to the upper end of the rotating shaft 57. The pusher rotation unit 59 rotates the pusher member 55 and the rotating shaft 57 about a vertical axis AX3 that passes through the rotating shaft 57. As a result, the multiple substrates W that the pusher member 55 supports in a vertical position are rotated about the vertical axis AX3. The pusher rotation unit 59 includes, for example, an electric motor. The pusher rotation unit 59 is provided below the pusher member 55. The pusher rotation unit 59 is also attached to the upper surface of the lifting platform 63 via a pusher horizontal movement unit 61.

[0052] The pusher horizontal movement unit 61 includes two guide rails 61A each extending in the width direction Y, a slider 61B, and an electric motor (not shown). The two guide rails 61A are provided on the upper surface of the lifting platform 63. The slider 61B moves in the width direction Y along the two guide rails 61A. The slider 61B is driven by the electric motor. The pusher lifting unit 65 raises and lowers the lifting platform 63 in the vertical direction Z. This raises and lowers the pusher member 55. The pusher lifting unit 65 includes, for example, an electric actuator.

[0053] 2, the two pitch conversion units 25, 26 are arranged on the main transport mechanism WTR side of the pusher mechanism 21, i.e., to the left of the pusher mechanism 21. Furthermore, if the two pitch conversion units 25, 26 were arranged in the vertical direction Z, the substrate processing apparatus 1 would become unnecessarily tall. In contrast, the two pitch conversion units 25, 26 are arranged in the front-rear direction X. That is, the first pitch conversion unit 25 is arranged behind the second pitch conversion unit 26 in a plan view. This prevents the substrate processing apparatus 1 from becoming unnecessarily tall. The delivery mechanism 23 transports a plurality of substrates W aligned at unequal pitches, for example, between the pusher member 55 and the two pitch conversion units 25, 26.

[0054] The first pitch conversion unit 25 and the second pitch conversion unit 26 are disposed at a predetermined angle α around the substrate transfer position Po of the pusher mechanism 21. That is, the first pitch conversion unit 25 is located at a substrate carry-in position Pin, which is located at a predetermined angle α from the second pitch conversion unit 26. The second pitch conversion unit 26 is located at a substrate unloading position Pout, which is located at a predetermined angle α from the first pitch conversion unit 25. Furthermore, a first lateral path Rin along which the first pitch conversion unit 25 laterally moves and a second lateral path Rout along which the second pitch conversion unit 26 laterally moves intersect at a predetermined angle α. The pusher mechanism 21 is disposed at a location where the paths intersect at the predetermined angle α. In this way, the first pitch conversion unit 25 and the second pitch conversion unit 26 are spaced apart at a position that makes it less likely for them to interfere with each other. The substrate transfer position Po, the substrate carry-in position Pin, and the second lateral path Rout are positions when the transfer block 5 is viewed in plan as shown in FIG. 2.

[0055] Please refer to Figures 2 and 7. Figure 7 is a side view showing the transfer mechanism 23 and the two pitch conversion units 25, 26, etc., as viewed in the direction of arrow AA in Figure 2. The transfer mechanism 23 includes a carry-in mechanism 71, an intermediary mechanism 73, and an unloading mechanism 75. The carry-in mechanism 71 transports multiple substrates W aligned at an uneven pitch from the pusher member 55 to the first pitch conversion unit 25. The intermediary mechanism 73 transports multiple substrates W aligned at a narrow pitch from the first pitch conversion unit 25 to the first transfer position P1. The unloading mechanism 75 transports multiple substrates W aligned at an uneven pitch from the second pitch conversion unit 26 to the pusher member 55. The carry-in mechanism 71, the intermediary mechanism 73, and the unloading mechanism 75 include chucks 77, 78, and 79, respectively.

[0056] As shown in FIG. 7, the carry-in mechanism 71 is disposed at a carry-in height H1 at the substrate carry-in position Pin. At the substrate carry-in position Pin, the carry-in mechanism 71 is disposed, for example, to the side of the lifting unit 141 of the second pitch conversion unit 26. At the substrate carry-in position Pin, the chuck 78 of the intermediary mechanism 73 is provided at a position above the first pitch conversion unit 25. At the substrate carry-in position Pin, the chuck 78 of the intermediary mechanism 73 is disposed between the carry-in height H1 and the first transfer position P1. At the substrate carry-in position Pin, the first transfer position P1 is higher than the carry-in height H1 and the unloading height H2. At the substrate unloading position Pout, the unloading mechanism 75 is disposed at an unloading height H2 higher than the carry-in height H1. The carry-in mechanism 71 and the carry-out mechanism 75 are each configured so that the carry-out mechanism 75 and the multiple substrates W held by the carry-out mechanism 75 do not interfere with the carry-in mechanism 71 and the multiple other substrates W held by the carry-in mechanism 71. The substrate carry-in position Pin and the substrate carry-out position Pout are provided at positions sufficiently separated in the front-rear direction X. As shown in Figure 7, the substrate carry-in position Pin may be indicated by a two-dot chain line extending in the vertical direction Z. The substrate carry-out position Pout may also be indicated by a one-dot chain line extending in the vertical direction Z.

[0057] 8 is a plan view mainly showing the load mechanism 71 and the unload mechanism 75. The load mechanism 71 is disposed at a substrate load position Pin, which is behind the unload mechanism 75. The unload mechanism 75 is disposed at a substrate unload position Pout, which is ahead of the load mechanism 71. That is, the load mechanism 71 is disposed at the substrate load position Pin closer to the processing block 7, and the unload mechanism 75 is disposed at the substrate unload position Pout closer to the stocker 2. The load mechanism 71 includes a chuck 77, an opening / closing unit 81, a front-rear moving unit 83, and a width-direction moving unit 85.

[0058] The chuck 77 holds a plurality of substrates W aligned at an irregular pitch in a vertical position. The chuck 77 has a pair of chuck members 77A, 77B each extending in the width direction Y. Each pair of chuck members 77A, 77B has a plurality of pairs (e.g., 50 pairs, 75 pairs, 100 pairs) of holding grooves 87, 88 arranged at an irregular pitch. The irregular pitches are formed by alternating first intervals TN1 (e.g., 3.333 mm) and second intervals TN2 (e.g., 6.666 mm). The first chuck member 77A has a plurality of holding grooves 87 arranged at an irregular pitch. The second chuck member 77B has a plurality of holding grooves 88 arranged at an irregular pitch.

[0059] The opening / closing unit 81 supports the two chuck members 77A, 77B so that they can move in the front-to-rear direction X. The opening / closing unit 81 also opens and closes the two chuck members 77A, 77B in the front-to-rear direction X. Specifically, the opening / closing unit 81 moves the two chuck members 77A, 77B closer to or farther apart. When the opening / closing unit 81 closes the chuck 77, the chuck 77 can hold multiple substrates W in a vertical position. On the other hand, when the opening / closing unit 81 opens the chuck 77, the chuck 77 can pass multiple substrates W in a vertical position between the two chucks 77A, 77B in the vertical direction Z. The opening / closing unit 81 includes an air cylinder or an electric actuator that drives the two chuck members 77A, 77B.

[0060] The front-rear direction moving unit 83 is disposed closer to the two pitch changing units 25 and 26 than the width direction moving unit 85. The front-rear direction moving unit 83 horizontally moves the chuck 77 and the opening / closing unit 81 in the front-rear direction X. The width direction moving unit 85 horizontally moves the chuck 77, the opening / closing unit 81, and the front-rear direction moving unit 83 in the width direction Y. That is, the front-rear direction moving unit 83 and the width direction moving unit 85 can move the chuck 77 in the front-rear direction X and the width direction Y (two-dimensional directions). This allows the loading mechanism 71 to move the chuck 77 between a substrate transfer position Po and a substrate transfer position (substrate load position Pin and substrate unload position Pout) described below. Simultaneous movement in the front-rear direction X and the width direction Y realizes movement in a diagonal direction such as the first lateral path Rin and the second lateral path Rout described above. The front-rear direction moving unit 83 includes, for example, an air cylinder or an electric actuator. The width direction moving unit 85 includes an electric actuator.

[0061] The discharge mechanism 75 includes a chuck 79, an opening / closing unit 89, a front-rear direction moving unit 91, and a width direction moving unit 93. The chuck 79 has the same configuration as the chuck 77. Specifically, the chuck 79 includes a pair of chuck members 79A and 79B each extending in the width direction Y. The pair of chuck members 79A and 79 includes multiple pairs (e.g., 50 pairs, 75 pairs, or 100 pairs) of holding grooves 95 and 96 arranged at unequal pitches. The front-rear direction moving unit 91 is disposed closer to the two pitch change units 25 and 26 than the width direction moving unit 93. Otherwise, the opening / closing unit 89, the front-rear direction moving unit 91, and the width direction moving unit 93 have the same configuration as the opening / closing unit 81, the front-rear direction moving unit 83, and the width direction moving unit 85, respectively.

[0062] FIG. 9 is a plan view mainly showing the intermediary mechanism 73. The intermediary mechanism 73 is disposed at the same substrate loading position Pin as the loading mechanism 71. The intermediary mechanism 73 includes a chuck 78, an opening / closing unit 101, an arm 103, and an elevating unit 105. The chuck 78 includes a pair of chuck members 78A and 78B each extending in the width direction Y. The pair of chuck members 78A and 78B includes multiple pairs (e.g., 50 pairs, 75 pairs, or 100 pairs) of holding grooves 107 and 108 arranged at a narrow pitch (e.g., 3.333 mm pitch (⅓ pitch)). Specifically, the first chuck member 78A is provided with multiple holding grooves 107 arranged at a narrow pitch in the width direction Y. The second chuck member 78B is provided with multiple holding grooves 108 arranged at a narrow pitch.

[0063] The opening / closing unit 101 is provided to the right of the chuck 78 (on the pusher mechanism 21 side). Otherwise, the opening / closing unit 101 is configured similarly to the opening / closing unit 81. To be more specific, the opening / closing unit 101 supports a pair of chuck members 78A, 78B so that they can move in the front-to-rear direction X. The opening / closing unit 101 also opens and closes the pair of chuck members 78A, 78B in the front-to-rear direction X. When the opening / closing unit 101 closes the chuck 78, the chuck 78 can hold multiple substrates W aligned at a narrow pitch in a vertical position. On the other hand, when the opening / closing unit 101 opens the chuck 78, the chuck 78 can pass multiple substrates W in a vertical position between the two chuck members 78A, 78B in the vertical direction Z.

[0064] The opening / closing unit 101 is attached to the lifting unit 105 via an arm 103 so that it can be raised and lowered. The lifting unit 105 raises and lowers the chuck 78 and the opening / closing unit 101 in the vertical direction Z. The lifting unit 105 includes, for example, an electric actuator. This enables the intermediary mechanism 73 to receive the multiple substrates W in a vertical position aligned at a narrow pitch from the first pitch conversion unit 25, and move the multiple substrates W to the first transfer position P1 (see FIG. 7) in order to transfer the multiple substrates W to the main transport mechanism WTR.

[0065] The transfer block 5 has two transport paths for transporting multiple substrates W between the pusher member 55 (pusher mechanism 21) and the main transport mechanism WTR. Specifically, the first transport path is a path that passes through the carry-in mechanism 71, the first pitch conversion unit 25, and the intermediate mechanism 73. The second transport path is a path that passes through the second pitch conversion unit 26 and the carry-out mechanism 75. For example, when 50 substrates W are held by the intermediate mechanism 73, the carry-out mechanism 75 can transport 50 substrates W that have been treated in the chemical treatment tank BT1 or the like to the pusher member 55. This allows for smooth transport of the 50 substrates W (group of treated substrates).

[0066] <1-2-1. Pitch conversion section> See Figures 7 and 10 to 13. Each of the two pitch conversion units 25, 26 converts the pitch of the multiple substrates W between an irregular pitch and a narrow pitch. The irregular pitch is a situation in which a first interval TN1 (e.g., 3.333 mm) and a second interval TN2 (e.g., 6.666 mm) wider than the first interval TN1 are alternately repeated. The narrow pitch is a situation in which the first interval TN1 is repeated.

[0067] The first pitch conversion unit 25 aligns the multiple substrates W aligned at an uneven pitch at a narrow pitch. That is, the first pitch conversion unit 25 converts the pitch of the multiple substrates W before they are processed in the processing block 7 to a narrow pitch. In contrast, the second pitch conversion unit 26 aligns the multiple substrates W aligned at a narrow pitch at an uneven pitch. That is, the second pitch conversion unit 26 converts the pitch of the multiple substrates W after they have been processed in the processing block 7 to an uneven pitch.

[0068] Each of the two pitch changers 25 and 26 includes a pitch change main body 111. The pitch change main body 111 includes a plurality of (for example, 25, 38, or 50) holding members 113 (113A to 113E) and a moving section 115.

[0069] The plurality of holding members 113 hold the plurality of substrates W aligned at unequal pitches in a vertical position. Each of the plurality of holding members 113 has two holding grooves 117 that hold two of the plurality of substrates W at a first interval TN1 (e.g., 3.333 mm). The two holding grooves 117 are separated by the first interval TN1. The two holding grooves 117 of each holding member 113 are arranged in the width direction Y. For example, if the pitch conversion unit 25 has 25 holding members 113, the 25 holding members 113 can hold 50 substrates W. Note that in Figures 10 to 13, for convenience of illustration, each of the two pitch conversion units 25, 26 is shown to have five holding members 113.

[0070] The moving unit 115 moves the plurality of holding members 113 in the alignment direction (width direction Y) of the plurality of substrates W so as to change between an uneven pitch state in which the plurality of substrates W are aligned at uneven pitches and a narrow pitch state in which the plurality of substrates W are aligned at narrow pitches. The moving unit 115 includes a base member 119, two guide rails 121, an extension / contraction mechanism 123, a drive unit 125, and a connection unit 127.

[0071] The two guide rails 121 support the multiple holding members 113 so that they can move in the alignment direction (width direction Y). Each of the two guide rails 121 extends in the width direction Y. The two guide rails 121 are attached to the upper surface of the base member 119. Note that a central holding member 113C of the multiple holding members 113 is fixed to the base member 119 by, for example, a screw SW. In other words, the central holding member 113C does not move in the width direction Y. Note that the number of guide rails 121 is not limited to two, and may be one, or three or more. In other words, it is sufficient for the moving unit 115 to be equipped with one or more guide rails 121.

[0072] The extension mechanism 123 extends and retracts the plurality of holding members 113 in the alignment direction (width direction Y). The extension mechanism 123 is connected to each holding member 113. The extension mechanism 123 is configured, for example, as a link mechanism. Specifically, the extension mechanism 123 is configured, for example, as a lazy tongs type, a zigzag line type, or a type similar thereto. The extension mechanism 123 includes, for example, a plurality of link members 129 (five in FIG. 10, etc.), a plurality of pins 131 (five in FIG. 10, etc.), and a plurality of joints 133 (four in FIG. 10, etc.). In FIGS. 12 and 13, for example, five pins 131 are provided on the bottom surfaces of the five holding members 113. The five link members 129 are respectively attached to the five pins 131 so as to be rotatable about a vertical axis. The five pins 131 are located at the centers of the five link members 129. Each of the four joints 133 connects the ends of two adjacent link members 129 .

[0073] For example, a first end of link member 129B is connected to a second end of link member 129A at joint 133A, and a second end of link member 129B is connected to a first end of link member 129C at joint 133B.

[0074] The drive unit 125 drives the extension / retraction mechanism 123. The drive unit 125 is attached to the lower surface of the base member 119. The drive unit 125 extends and retracts a rod 125A extending in the width direction Y. The drive unit 125 includes an air cylinder or an electric actuator. The connection unit 127 connects the end holding member 113E of the multiple holding members 113 to the tip of the rod 125A of the drive unit 125. The connection unit 127 is passed through an opening 119A of the base member 119.

[0075] 10 and 12, for example, when the rod 125A of the driving unit 125 is extended, the end holding member 113E is moved away from the central holding member 113C, and the extension mechanism 123 moves the other three holding members 113A, 113B, and 113D away from the central holding member 113C. This allows the multiple substrates W to be aligned at an uneven pitch. Also, in FIGS. 11 and 13, for example, when the rod of the driving unit 125 is retracted, the end holding member 113E approaches the central holding member 113C, and the extension mechanism 123 moves the other three holding members 113A, 113B, and 113D toward the central holding member 113C. This allows the multiple substrates W to be aligned at a narrow pitch (first interval TN1).

[0076] 7, each of the pitch conversion units 25 and 26 includes an elevator unit 141. The elevator unit 141 raises and lowers the pitch conversion main body 111 (the multiple holding members 113 and the moving unit 115). The elevator unit 141 includes an air cylinder or an electric actuator.

[0077] The lifting / lowering unit 141 of the first pitch conversion unit 25 raises and lowers the plurality of holding members 113 between an upper position higher than (the upper surface of) the chuck 77 of the carry-in mechanism 71 and a lower position lower than the chuck 77. The lifting / lowering unit 141 of the second pitch conversion unit 26 raises and lowers the plurality of holding members 113 between an upper position higher than (the upper surface of) the chuck 79 of the carry-out mechanism 75 and a lower position lower than the chuck 79.

[0078] <1-3. Processing Block> Referring to FIG. 1, the processing block 7 includes a plurality of (for example, four) batch processing tanks BT1 to BT4 and a drying section 143. The four batch processing tanks BT1 to BT4 and the drying section 143 are arranged in the front-rear direction X along which the substrate processing apparatus 1 extends. Each of the four batch processing tanks BT1 to BT4 immerses and processes a plurality of substrates W (for example, 50, 75, or 100 substrates W) at once. Each of the four batch processing tanks BT1 to BT4 stores a processing liquid (for example, a chemical liquid or pure water) in which the plurality of substrates W are immersed. The processing block 7 corresponds to the "substrate processing section" of the present invention.

[0079] The four batch processing tanks BT1 to BT4 are, for example, composed of two chemical processing tanks BT1 and BT3 and two cleaning processing tanks BT2 and BT4. The chemical processing tank BT1 and the cleaning processing tank BT2 form one set, and the chemical processing tank BT3 and the cleaning processing tank BT4 form another set. Note that the combination of chemical processing tanks and cleaning processing tanks is not limited to this example. Furthermore, the number of batch processing tanks is not limited to four, and may be one or more.

[0080] Each of the two chemical treatment tanks BT1 and BT3 performs an etching process using a chemical solution. The chemical solution may be, for example, a phosphoric acid solution, but is not limited to, a phosphoric acid solution. The chemical solution is heated to a preset temperature. A chemical solution jetting pipe (not shown) is provided at the bottom of the inside of each of the chemical treatment tanks BT1 and BT3. Each of the chemical treatment tanks BT1 and BT3 stores the chemical solution supplied from the chemical solution jetting pipe.

[0081] Each of the two cleaning processing tanks BT2 and BT4 performs a cleaning process in which chemical solutions adhering to multiple substrates W are washed away with a cleaning liquid (rinse liquid). Pure water such as deionized water (DIW) is used as the cleaning liquid. Each of the cleaning processing tanks BT2 and BT4 stores pure water supplied from a pure water jet pipe (not shown).

[0082] The processing block 7 includes a lifter LF1 as a dedicated transport mechanism for transferring substrates W that have been chemically processed in the chemical processing tank BT1 to the cleaning processing tank BT2, and a lifter LF2 for transferring substrates W that have been chemically processed in the chemical processing tank BT3 to the cleaning processing tank BT4. Each of the two lifters LF1 and LF2 includes a substrate holding section that holds, in a vertical position, multiple substrates W aligned at narrow pitches in the width direction Y, a lifting section that raises and lowers the substrate holding section, and a horizontal moving section that moves the substrate holding section in the front-to-rear direction X.

[0083] The drying unit 143 includes a substrate holding mechanism that holds, in a vertical position, a plurality of substrates W (e.g., 50, 75, or 100 substrates W) aligned at a narrow pitch in the width direction Y, and a processing chamber that accommodates the plurality of substrates W held by the substrate holding mechanism. The drying unit 143 dries the substrates W by supplying an organic solvent (e.g., isopropyl alcohol) to the substrates W in a reduced pressure atmosphere or by shaking off liquid components on the surfaces of the substrates W by centrifugal force.

[0084] <1-4. Batch substrate transport area> The batch substrate transport area 8 is disposed behind the stocker 2 and adjacent to the transfer block 5 and the processing block 7 on the left side. The batch substrate transport area 8 extends in the front-to-rear direction X. The batch substrate transport area 8 is equipped with a main transport mechanism WTR (main transport robot). The main transport mechanism WTR transports a plurality of substrates W (e.g., 50, 75, or 100) in a vertical position aligned at a narrow pitch in the width direction Y in the front-to-rear direction X. The main transport mechanism WTR also transports the plurality of substrates W between the first transfer position P1, the second transfer position P2, the plurality of batch processing baths BT1 to BT4 (e.g., four), and the drying section 143.

[0085] The main transport mechanism WTR includes a chuck 145, a chuck lifting unit (not shown), a chuck horizontal moving unit (not shown), and guide rails 147. The chuck 145 holds, in a vertical position, a plurality of substrates W aligned at a narrow pitch in the width direction Y. The chuck 145 includes a pair of chuck members 145A, 145B each extending in the width direction Y. Each pair of chuck members 145A, 145B includes multiple pairs (e.g., 50 pairs, 75 pairs, or 100 pairs) of holding grooves arranged at a narrow pitch in the width direction Y. The pair of chuck members 145A, 145B is opened and closed by a chuck opening / closing unit (not shown).

[0086] The chuck 145 is movable in the front-rear direction X along the guide rail 147. The chuck 145 is moved in the front-rear direction X by a chuck horizontal movement unit. The chuck 145 is raised and lowered in the vertical direction Z by a chuck lifting unit. The chuck horizontal movement unit and the chuck lifting unit include, for example, an electric actuator. The chuck opening / closing unit includes, for example, an air cylinder or an electric actuator.

[0087] <1-5. Control Unit> The substrate processing apparatus 1 includes a control unit 151 (see FIG. 1) and a storage unit (not shown). The control unit 151 controls each component of the substrate processing apparatus 1. The control unit 151 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing apparatus 1.

[0088] <2. Operation of the substrate processing device> Next, the operation of the substrate processing apparatus 1 will be described with reference to the flowcharts of Figures 14 and 21. First, the first half of the operation from transporting the carriers C to the load port 9 to the drying process will be described with reference to Figure 14. In this embodiment, the substrate processing apparatus 1 processes 50 substrates W taken out from two carriers C in a batch.

[0089] In Figure 15(a) and other figures, the symbol TA indicates the surface (device surface or main surface) of the substrate W (W1, W2). The back surface of the substrate W is the surface opposite to the front surface of the substrate W. The device surface is the surface on which devices are formed or the surface on which devices are in the process of being formed. In Figure 15(a) and other figures, for convenience of illustration, the 25 substrates W1 are represented by five substrates W1, and the 25 substrates W2 are represented by five substrates W2.

[0090] [Step S01] Vertical position change of the first substrate group Referring to FIG. 1, an external transfer robot (not shown) sequentially transfers two carriers C to the load port 9. The carrier transfer robot 13 of the stocker 2 transfers the first carrier C from the load port 9 to the loading shelf 3. The first carrier C stores, for example, 25 substrates W1 (first substrate group) aligned at a reference pitch (for example, 10 mm pitch) at which the reference interval TN9 is repeated. The substrate handling mechanism HTR of the transfer block 5 uses, for example, 25 hands 27 to remove the 25 substrates W1 in a horizontal position from the first carrier C placed on the loading shelf 3. The substrate handling mechanism HTR then transfers the removed 25 substrates W1 to the position conversion unit 19. The carrier transfer robot 13 then moves the empty first carrier C from which the 25 substrates W1 have been removed from the loading shelf 3 to the storage shelf 11.

[0091] See Figure 15(a). The attitude changing unit 19 receives 25 substrates W1 aligned at the reference pitch from the substrate handling mechanism HTR. In the attitude changing unit 19, the 25 substrates W1 are held (placed) on the 25 pairs of shelves 37A of the pair of horizontal holding units 37. See Figure 15(b). Thereafter, the storing / moving unit 53 (see Figure 4) of the attitude changing unit 19 moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37. As a result, the peripheral edges of the 25 substrates W1 are stored and held in the 25 pairs of holding grooves 39A of the pair of vertical holding units 39.

[0092] 15(c). Then, the attitude changing unit 19 collectively changes the 25 substrates W1 (first substrate group) held at the reference pitch from a horizontal attitude to a vertical attitude. Specifically, the rotation drive unit 41 of the attitude changing unit 19 changes the 25 substrates W1 held by the pair of horizontal holding units 37 and the pair of vertical holding units 39 from a horizontal attitude to a vertical attitude. Then, the axial movement unit 51 (see FIG. 4) of the attitude changing unit 19 moves the pair of horizontal holding units 37 in a direction in which the pair of horizontal holding units 37 approaches the support surface 35A so that the 25 pairs of shelves 37A of the pair of horizontal holding units 37 move away from the 25 substrates W1 in the vertical attitude.

[0093] [Step S02] Receiving the first group of substrates by the pusher member See Figure 16(a). Thereafter, the pusher lifting section 65 of the pusher mechanism 21 (see Figure 5) raises the pusher member 55 to a position higher than the pair of horizontal holding sections 37 and the pair of vertical holding sections 39. As a result, the pusher member 55 receives the 25 substrates W1 (first substrate group) that have been converted to a vertical position. The pusher member 55 also holds the 25 substrates W1 aligned at the standard pitch in a vertical position. The 50 vertical holding grooves 67 are arranged at unequal pitches.

[0094] [Step S03] Movement of the first substrate group at the first interval 16(b). The pusher mechanism 21 moves the 25 substrates W1 held by the pusher members 55 at a first interval TN1 (3.333 mm) in the alignment direction of the 25 substrates W1. Specifically, the pusher rotation unit 59 (see FIG. 5) of the pusher mechanism 21 rotates the pusher members 55 by 180 degrees about the vertical axis AX3. As a result, the 25 substrates W1 held by the pusher members 55 are moved to the left at the first interval TN1. Note that this movement at the first interval TN1 may be achieved by rotating the pusher members 55 by 180 degrees using the pusher rotation unit 59 and moving the pusher members 55 in the width direction Y using the pusher horizontal movement unit 61 (see FIG. 5).

[0095] Additionally, the attitude change unit 19 rotates the pair of horizontal holding units 37, etc. by 90 degrees around the horizontal axis AX2. This raises the pair of horizontal holding units 37, etc. The axial movement unit 51 (see FIG. 4) of the attitude change unit 19 moves the pair of horizontal holding units 37 in a direction away from the support surface 35A. Additionally, the storage movement unit 53 (see FIG. 4) of the attitude change unit 19 moves the pair of vertical holding units 39 away from the pair of horizontal holding units 37.

[0096] [Step S04] Vertical position change of second substrate group The carrier transport robot 13 shown in FIG. 1 transports a second carrier C from the load port 9 to the loading shelf 3. The second carrier C stores, for example, 25 substrates W2 aligned at a standard pitch (10 mm pitch) like the first carrier C. The substrate handling mechanism HTR uses the 25 hands 27 to remove the 25 substrates W2 in a horizontal position from the second carrier C placed on the loading shelf 3. The substrate handling mechanism HTR then transports the removed 25 substrates W2 to the position conversion unit 19. The carrier transport robot 13 then moves the empty second carrier C from which the 25 substrates W2 have been removed to the storage shelf 11.

[0097] See Figure 16(c). The attitude changing unit 19 receives 25 substrates W2 aligned at the reference pitch from the substrate handling mechanism HTR. In the attitude changing unit 19, the 25 substrates W2 are held on 25 pairs of shelves 37A of a pair of horizontal holding units 37. See Figure 17(a). Thereafter, the storage transfer unit 53 (see Figure 4) of the attitude changing unit 19 moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37.

[0098] 17(b). Thereafter, the attitude changing unit 19 collectively changes the 25 substrates W2 (second substrate group) held at the reference pitch from a horizontal attitude to a vertical attitude. Thereafter, the axial movement unit 51 (see FIG. 4) of the attitude changing unit 19 moves the pair of horizontal holding units 37 in a direction in which the pair of horizontal holding units 37 approaches the support surface 35A so that the 25 pairs of shelves 37A of the pair of horizontal holding units 37 move away from the 25 substrates W1 in the vertical attitude.

[0099] [Step S05] Receiving the second group of substrates by the pusher member See Figure 17(c). Thereafter, the pusher lifting unit 65 (see Figure 5) of the pusher mechanism 21 raises the pusher member 55 to a position higher than the pair of horizontal holding units 37 and the pair of vertical holding units 39. As a result, the pusher member 55 receives the 25 substrates W2 (second substrate group) that have been converted to a vertical position. The pusher member 55 also holds 50 substrates W (W1, W2) aligned at an uneven pitch. The 50 substrates W are formed by alternatingly arranging 25 substrates W1 and 25 substrates W2.

[0100] 17(b) and 17(c), the surfaces (device surfaces or main surfaces) of the 25 substrates W1 face a predetermined direction (to the right). In contrast, the surfaces of the 25 substrates W2 face the opposite direction (to the left). In other words, the 50 substrates W are arranged face-to-face.

[0101] [Step S06] Transporting the group of processed substrates to the pitch conversion unit by the loading mechanism Thereafter, the carry-in mechanism 71 transports the 50 substrates W (group of substrates to be processed) aligned at an irregular pitch from the pusher member 55 to the first pitch conversion unit 25. This operation will be described in detail with reference to FIG. 18(a). First, the attitude conversion unit 19 rotates the pair of horizontal holding units 37, etc. by 90 degrees around the horizontal axis AX2. This raises the pair of horizontal holding units 37, etc.

[0102] 18(b). Then, the carry-in mechanism 71 horizontally moves the chuck 77 from a position above the first pitch conversion unit 25 to a position below the pusher member 55. That is, the carry-in mechanism 71 moves the chuck 77, which is not holding a substrate W, laterally along the first lateral movement path Rin from the substrate carry-in position Pin to the substrate transfer position Po. Before the lateral movement, the first pitch conversion unit 25 is located below the first lateral movement path Rin. The first pitch conversion unit 25 is located at the substrate carry-in position Pin. The first pitch conversion unit 25 is located below the chuck 77. The pusher member 55 is also located at the substrate transfer position Po. The chuck 77 is in a closed state in which it can hold 50 substrates W. Then, the pusher mechanism 21 lowers the pusher member 55, which holds the 50 substrates W in a vertical position. When the pusher member 55 passes between the pair of chuck members 77A, 77B of the chuck 77, the 50 substrates W are transferred from the pusher member 55 to the chuck 77. The chuck 77 holds the 50 substrates W aligned at an irregular pitch in a vertical position.

[0103] See Figure 19(a). Thereafter, the carry-in mechanism 71 moves the chuck 77 from a position above the pusher member 55 to a position above the first pitch conversion unit 25. That is, the carry-in mechanism 71 moves the chuck 77 holding 50 substrates W laterally along the first lateral movement path Rin from the substrate transfer position Po to the substrate carry-in position Pin. After the lateral movement, the first pitch conversion unit 25 is located below the first lateral movement path Rin. The first pitch conversion unit 25 is located at the substrate carry-in position Pin. The first pitch conversion unit 25 is located below the chuck 77. The pusher member 55 is also located at the substrate transfer position Po. The substrate carry-in position is above the first pitch conversion unit 25. See Figure 19(b). Thereafter, the lifting section 141 (see FIG. 7) of the first pitch conversion section 25 lifts the pitch conversion main body 111 including the 25 holding members 113. As a result, the first pitch conversion section 25 receives the 50 substrates W from the carry-in mechanism 71.

[0104] [Step S07] Pitch conversion of the processed substrate group from unequal pitch to narrow pitch See Figure 20(a). Thereafter, the first pitch conversion unit 25 converts the pitch of the 50 substrates W from the uneven pitch to a narrow pitch (3.333 mm). In other words, the first pitch conversion unit 25 aligns the 50 substrates W aligned at the uneven pitch at a narrow pitch. This operation will be described in detail.

[0105] Each of the 25 holding members 113 of the first pitch conversion unit 25 has two holding grooves 117 spaced apart by a first interval (3.333 mm). The first pitch conversion unit 25 uses the two holding grooves 117 of each of the 25 holding members 113 to hold two of the 50 substrates W, W1 and W2, while using the 25 holding members 113 to hold the 50 substrates W aligned at an uneven pitch.

[0106] Furthermore, the moving unit 115 (see FIG. 10) of the first pitch conversion unit 25 moves the 25 holding members 113 in the alignment direction (Y direction) of the 50 substrates W so as to change the uneven pitch state in which the 50 substrates W are aligned at uneven pitches to a narrow pitch state in which the 50 substrates W are aligned at narrow pitches. Note that the intermediary mechanism 73 keeps the chucks 78 in an open state.

[0107] [Step S08] Transporting the group of substrates to the first transfer position by the intermediary mechanism 20(b). Thereafter, the intermediary mechanism 73 lowers the chucks 78 as indicated by the dashed lines in order to receive the 50 substrates W aligned at a narrow pitch held by the first pitch conversion unit 25. The intermediary mechanism 73 then closes the chucks 78, thereby enabling the chucks 78 to hold 50 substrates W.

[0108] Thereafter, the intermediary mechanism 73 raises the chucks 78 to the first transfer position P1. This allows the intermediary mechanism 73 to receive the 50 substrates W from the first pitch conversion unit 25 and deliver the 50 substrates W to the main transport mechanism WTR. The chucks 78 hold the 50 substrates W aligned at a narrow pitch in a vertical position.

[0109] [Step S09] Substrate processing and drying processing Thereafter, the main transport mechanism WTR uses chucks 145 to receive the 50 substrates W from the intermediate mechanism 73 and transports the 50 substrates W to one of the two chemical liquid treatment tanks BT1, BT3. For example, when the main transport mechanism WTR transports the 50 substrates W to the chemical liquid treatment tank BT1, the lifter LF1 receives the 50 substrates W, aligned at a narrow pitch, from the main transport mechanism WTR at a position above the chemical liquid treatment tank BT1. The lifter LF1 then lowers the 50 substrates W, thereby immersing the 50 substrates W in the chemical liquid stored in the chemical liquid treatment tank BT1. As a result, the 50 substrates W are chemically treated all at once.

[0110] Furthermore, after a preset chemical treatment time has elapsed, the lifter LF1 raises the 50 substrates W, thereby lifting them out of the chemical solution in the chemical treatment tank BT1. The lifter LF1 then horizontally moves the 50 substrates W from a position above the chemical treatment tank BT1 to a position above the cleaning treatment tank BT2. The lifter LF1 then lowers the 50 substrates W, thereby immersing the 50 substrates W in the pure water stored in the cleaning treatment tank BT2. In this way, the 50 substrates W are cleaned all at once. After a preset cleaning treatment time has elapsed, the lifter LF1 lifts the 50 substrates W out of the pure water in the cleaning treatment tank BT2.

[0111] When the main transport mechanism WTR transports 50 substrates W to the chemical treatment tank BT3, the lifter LF2 receives the 50 substrates W from the main transport mechanism WTR. The lifter LF2 then transports the 50 substrates W to the chemical treatment tank BT3 and the cleaning treatment tank BT4 in that order.

[0112] The main transport mechanism WTR uses the chuck 145 to receive the 50 substrates W from one of the two lifters LF1, LF2, and transports the 50 substrates W to the drying section 143. The drying section 143 dries the 50 substrates W. Thereafter, the main transport mechanism WTR receives the dried 50 substrates W from the drying section 143.

[0113] Next, with reference to FIG. 21, the latter half of the operation from the drying process to the transfer of the carrier C from the load port 9 will be described.

[0114] [Step S11] The main transport mechanism transports the group of substrates to the second transfer position. 2 and 22(a), the main transport mechanism WTR transports 50 substrates W in a vertical position that have been collectively processed in the chemical processing tank BT1 or the like and aligned at a narrow pitch, to a position above the second pitch conversion unit 26. In other words, the main transport mechanism WTR transports the 50 substrates W that have been dried in the drying unit 143 to a position above the second pitch conversion unit 26.

[0115] Thereafter, the main transport mechanism WTR lowers the 50 substrates W held by the chucks 145 to the transfer position P2. As a result, the main transport mechanism WTR transports the 50 substrates W in a vertical position and aligned at a narrow pitch to the second pitch conversion unit 26. The second pitch conversion unit 26 also receives the 50 substrates W in a vertical position and aligned at a narrow pitch from the main transport mechanism WTR. When receiving the 50 substrates W, the second pitch conversion unit 26 moves the 25 holding members 113 so that the 50 holding grooves 117 are arranged at a narrow pitch.

[0116] [Step S12] Changing the pitch of the processed substrate group from a narrow pitch to an unequal pitch See Figure 22(b). Thereafter, the second pitch conversion unit 26 converts the pitch of the 50 substrates W from the narrow pitch to an uneven pitch. This operation will be described in detail. The second pitch conversion unit 26 holds the 50 substrates W aligned at the narrow pitch using the 25 holding members 113, while holding two substrates W at the first interval TN1 using two holding grooves 117 separated by a first interval TN1 that each of the 25 holding members 113 has. The movement unit 115 (see Figure 10) moves the 25 holding members 113 in the alignment direction of the 50 substrates W (width direction Y) so as to change from the narrow pitch state to the uneven pitch state.

[0117] [Step S13] Transporting the group of substrates to be processed to the pusher member by the unloading mechanism See Figure 23(a). Thereafter, the unloading mechanism 75 of the delivery mechanism 23 transports the 50 substrates W aligned at an uneven pitch in a vertical position from the second pitch conversion unit 26 to the pusher member 55. This operation will be described in detail. The chuck 79 of the unloading mechanism 75 is in a closed state. First, the lifting unit 141 (see Figure 7) of the second pitch conversion unit 26 lowers the pitch conversion main body 111 including the 25 holding members 113. During this lowering, the unloading mechanism 75 uses the chuck 79 to receive and hold the 50 substrates W aligned at an uneven pitch in a vertical position.

[0118] 23(b). Thereafter, the unloading mechanism 75 transports the 50 substrates W held by the chucks 79 from a position above the second pitch conversion unit 26 to a position above the pusher members 55. That is, the unloading mechanism 75 moves the chucks 79 holding the 50 substrates W laterally along the second lateral movement path Rout from the substrate unloading position Pout to the substrate transfer position Po. Before the chucks 79 move laterally, the second pitch conversion unit 26 is located below the second lateral movement path Rout. The second pitch conversion unit 26 is located at the substrate unloading position Pout. The second pitch conversion unit 26 is located below the chucks 79. The pusher members 55 are located at the substrate transfer position Po. Thereafter, the pusher mechanism 21 raises the pusher members 55 to a position higher than the chucks 79. During this upward movement, the pusher mechanism 21 uses the pusher members 55 to receive and hold the 50 substrates W from the chucks 79 of the carry-out mechanism 75. The pusher members 55 hold the 50 substrates W aligned at an uneven pitch in a vertical position.

[0119] [Step S14] Receipt of the second group of substrates by the attitude change unit 24(a). Thereafter, the unloading mechanism 75 moves the chuck 79 to a position above the second pitch conversion unit 26. That is, the unloading mechanism 75 moves the chuck 79, which is not holding a substrate W, laterally along the second lateral movement path Rout from the substrate unloading position Pout to the substrate transfer position Po. After the chuck 79 has moved laterally, the second pitch conversion unit 26 is positioned below the second lateral movement path Rout. The second pitch conversion unit 26 is positioned at the substrate unloading position Pout. The second pitch conversion unit 26 is positioned below the chuck 79. The pusher member 55 is also positioned at the substrate transfer position Po. Thereafter, the rotation drive unit 41 of the attitude conversion unit 19 rotates the pair of horizontal holding units 37, etc. by 90 degrees about the horizontal axis AX2 so that the pair of vertical holding units 39 receive the 25 substrates W2 (second substrate group). As a result, the pair of horizontal holding portions 37 and the pair of vertical holding portions 39 are in a tilted state. In addition, the axial moving portion 51 moves the pair of horizontal holding portions 37 closer to the support surface 35A, and the storing moving portion 53 moves the pair of vertical holding portions 39 closer to the pair of horizontal holding portions 37.

[0120] See Figure 24(b). The pusher mechanism 21 then lowers the pusher member 55 from the position above the pair of vertical holders 39 to a position below them. During this lowering, the posture conversion unit 19 uses the pair of horizontal holders 37 and the pair of vertical holders 39 to receive 25 substrates W2 (second substrate group) of the 50 substrates W (processing substrate group) from the pusher member 55. The pair of vertical holders 39 hold the 25 substrates W2 aligned at the reference pitch (10 mm pitch). The axial movement unit 51 then moves the pair of horizontal holders 37 away from the support surface 35A. As a result, the 25 pairs of shelves 37A of the pair of horizontal holders 37 each come into contact with the backsides of the 25 substrates W2.

[0121] 24(a), the moving unit 115 of the second pitch conversion unit 26 moves the 25 (24) holding members 113 so that the 50 holding grooves 117 are arranged at a narrow pitch. As shown in FIG. 24(b), the lifting unit 141 of the second pitch conversion unit 26 lifts the pitch conversion main body 111 including the 25 holding members 113 so that the 50 holding grooves 117 are arranged at a position higher than the chuck 79.

[0122] [Step S15] Change the vertical position of the second group of substrates See Figure 25(a). The attitude changing unit 19 rotates the pair of horizontal holding units 37, etc. by 90 degrees around the horizontal axis AX2, thereby changing the attitude of the 25 substrates W2 from a vertical attitude to a horizontal attitude. Thereafter, the storage transfer section 53 moves the pair of vertical holding sections 39 away from the pair of horizontal holding sections 37. As a result, the peripheral edges of the 25 substrates W2 are removed from the 25 pairs of holding grooves 39A of the pair of vertical holding sections 39.

[0123] The carrier transport robot 13 shown in FIG. 1 transports an empty second carrier C from the storage shelf 11 to the loading shelf 3. The substrate handling mechanism HTR takes out, from the loading shelf 3, the 25 substrates W2 that have been converted to a horizontal position by the loading shelf 3 (see FIG. 25(b)). The substrate handling mechanism HTR then transports the 25 substrates W2 into the second carrier C placed on the loading shelf 3. The carrier transport robot 13 then transports the second carrier C containing the 25 processed substrates W2 from the loading shelf 3 to the load port 9.

[0124] [Step S16] Move the first substrate group at the first interval See Figure 25(b). After the attitude changing unit 19 changes the attitude of the 25 substrates W2 to a horizontal attitude, the pusher mechanism 21 raises the pusher members 55 that hold the 25 substrates W1 (first substrate group).

[0125] Furthermore, the pusher mechanism 21 moves the 25 substrates W1 held by the pusher members 55 at a first interval TN1 (3.333 mm) in the alignment direction of the 25 substrates W1. Specifically, the pusher rotation unit 59 (see FIG. 5) of the pusher mechanism 21 rotates the pusher members 55 by 180 degrees about the vertical axis AX3. As a result, the 25 substrates W1 held by the pusher members 55 are moved to the right at the first interval TN1. Note that this movement at the first interval TN1 may be achieved by rotating the pusher members 55 by 180 degrees using the pusher rotation unit 59 and moving the pusher members 55 in the width direction Y using the pusher horizontal movement unit 61 (see FIG. 5).

[0126] [Step S17] Receipt of the first group of substrates by the attitude change unit 25(c), the attitude conversion unit 19 causes the pair of horizontal holding units 37 and the pair of vertical holding units 39 to lie down. The axial movement unit 51 also moves the pair of horizontal holding units 37 closer to the support surface 35A, and the storage movement unit 53 moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37.

[0127] 26(a). Then, the pusher mechanism 21 lowers the pusher member 55 from a position above the pair of vertical holding units 39 to a position below them. During this lowering, the posture conversion unit 19 receives the remaining 25 substrates W1 from the pusher member 55 using the pair of horizontal holding units 37 and the pair of vertical holding units 39. The pair of vertical holding units 39 hold the 25 substrates W1 aligned at a reference pitch (for example, 10 mm pitch). Then, the axial movement unit 51 brings the 25 pairs of shelves 37A of the pair of horizontal holding units 37 into contact with the backsides of the 25 substrates W1, respectively.

[0128] [Step S18] Change the vertical position of the first substrate group See Figure 26(b). The attitude changing unit 19 rotates the pair of horizontal holding units 37, etc. by 90 degrees around the horizontal axis AX2. As a result, the attitude changing unit 19 changes the 25 substrates W1 from a vertical attitude to a horizontal attitude. See Figure 26(c). Thereafter, the storage transfer unit 53 moves the pair of vertical holding units 39 away from the pair of horizontal holding units 37.

[0129] The carrier transport robot 13 shown in FIG. 1 transports an empty first carrier C from the storage shelf 11 to the loading shelf 3. The substrate handling mechanism HTR removes from the loading shelf 3 the 25 substrates W1 that have been converted to a horizontal position by the loading shelf 3 (see FIG. 26(c)). The substrate handling mechanism HTR then transports the 25 substrates W1 into the first carrier C placed on the loading shelf 3. The carrier transport robot 13 then transports the first carrier C containing the 25 processed substrates W1 from the loading shelf 3 to the load port 9. An external transport robot (not shown) then transports the two carriers C in sequence from the load port 9 to their next destination.

[0130] The above-mentioned chuck 77 corresponds to the "first traversing holding portion" of the present invention. The above-mentioned carry-in mechanism 71 corresponds to the "first traversing mechanism" of the present invention. The above-mentioned chuck 79 corresponds to the "second traversing holding portion" of the present invention. The above-mentioned carry-out mechanism 75 corresponds to the "second traversing mechanism" of the present invention. The above-mentioned chuck 78 corresponds to the "intermediary holding portion" of the present invention.

[0131] According to the first embodiment, the attitude conversion unit 19 converts the attitude of the substrates between a horizontal holding attitude, in which horizontally oriented substrates are held in a group of substrates aligned vertically at a reference pitch, and a vertical holding attitude, in which vertically oriented substrates are held in a group of substrates aligned horizontally at a reference pitch. The pusher mechanism 21 has a pusher member 55 that combines substrates W2 (second substrate group) in a vertical holding attitude held by the attitude conversion unit 19 with substrates W1 (first substrate group) in a vertical holding attitude previously delivered from the attitude conversion unit 19, thereby holding multiple substrates aligned at an uneven pitch narrower than the reference pitch. The first pitch conversion unit 25 receives multiple substrates aligned at an uneven pitch and aligns the multiple substrates aligned at an uneven pitch at a narrow pitch narrower than the reference pitch. The processing block 7 processes multiple substrates aligned at a narrow pitch collectively. The main transport mechanism WTR transports multiple substrates aligned at a narrow pitch collectively to the processing block 7. The first pitch conversion unit 25 and the second pitch conversion unit 26 are disposed on the main transport mechanism WTR side of the pusher mechanism 21 (on the left in the left-right direction Y).

[0132] In this way, the pusher mechanism 21 combines substrates W2 (second substrate group) held in a vertically held position by the position changer 19 with substrates W1 (first substrate group) previously delivered from the position changer 19 in a vertically held position, thereby holding multiple substrates aligned at an uneven pitch that is narrower than the reference pitch. The process of creating multiple substrates aligned at an uneven pitch from the substrate group aligned at the reference pitch is called first-stage pitch conversion. The first pitch conversion unit 25 receives the multiple substrates aligned at an uneven pitch and aligns the multiple substrates aligned at an uneven pitch at a narrower pitch that is narrower than the reference pitch. The process of creating multiple substrates aligned at a narrower pitch from the multiple substrates aligned at an uneven pitch is called second-stage pitch conversion. In the present invention, the second-stage pitch conversion is not performed by the pusher mechanism 21, but by the first pitch conversion unit 25 located on the main transport mechanism WTR side of the pusher mechanism 21. In other words, the second-stage pitch conversion is performed at a position that does not reduce the throughput of the second-stage pitch conversion. Therefore, the substrate W can be processed efficiently.

[0133] Furthermore, the multiple substrates aligned at an uneven pitch are multiple substrates W aligned at an uneven pitch in which a first interval TN1 narrower than the reference pitch and a second interval TN2 narrower than the reference pitch and wider than the first interval TN1 are alternately repeated. The uniform pitch is equal to the sum of the first interval TN1 and the second interval TN2. The multiple substrates W aligned at a narrow pitch are multiple substrates W aligned by repeating the first interval TN1. In this way, the second-stage pitch conversion is performed slowly, as it narrows the second interval TN2, which is an uneven pitch created by the first-stage pitch conversion, until it becomes the first interval TN1. Therefore, the second-stage pitch conversion can be performed slowly at a position that does not reduce the throughput of the first-stage pitch conversion.

[0134] Furthermore, the carry-in mechanism 71 moves a chuck 77, which collectively holds the plurality of substrates W aligned at an uneven pitch and which has been received from the pusher member 55, laterally along the first lateral path. The carry-out mechanism 75 moves a chuck 79, which collectively holds the plurality of substrates W aligned at an uneven pitch and which will be passed to the pusher member 55, laterally along the second lateral path. The first pitch conversion unit 25 receives the plurality of substrates W aligned at an uneven pitch and aligns the plurality of substrates W aligned at an uneven pitch at a narrow pitch. The second pitch conversion unit 26 receives the plurality of substrates W aligned at a narrow pitch and aligns the plurality of substrates W aligned at a narrow pitch at an uneven pitch. In this way, the two-stage pitch conversion is performed separately by the pusher mechanism 21 and the first and second pitch conversion units 25 and 26. Furthermore, pitch conversion is performed separately in first pitch conversion unit 25 and second pitch conversion unit 26 depending on whether the processing in processing block 7 is performed or not. This prevents a decrease in the throughput of the second-stage pitch conversion. This allows substrates to be processed efficiently.

[0135] The intermediary mechanism 73 also raises the chuck 78, which collectively holds the plurality of substrates W aligned at a narrow pitch, at the substrate loading position. The substrate transfer position is a position where the plurality of substrates W aligned at an irregular pitch are loaded collectively from the pusher member 55 to the chuck 78. The substrate loading position is a position where the plurality of substrates W aligned at a narrow pitch are loaded collectively from the chuck 78 to the main transport mechanism WTR. The first pitch conversion unit 25 is raised at the substrate loading position to load the plurality of substrates W aligned at an irregular pitch from the chuck 77. The chuck 78 is raised at the substrate loading position Pin to load the plurality of substrates W aligned at a narrow pitch from the first pitch conversion unit 25. The first pitch conversion unit 25 is disposed at the substrate loading position Pin. This allows pitch conversion by the first pitch conversion unit 25 to be performed efficiently during the substrate loading process performed between the chuck 77, the first pitch conversion unit 25, the chuck 78 and the main transport mechanism WTR.

[0136] Furthermore, the first pitch changer 25 is disposed below the chuck 78. This allows the work at the first pitch changer 25 and the work at the chuck 78 to be performed simultaneously, partially simultaneously, or at similar times.

[0137] In addition, the first pitch change unit 25 is disposed below the first lateral path Pin. This allows the work at the chuck 77, the work at the first pitch change unit 25, and the work at the chuck 78 to be performed simultaneously, partially simultaneously, or at similar times.

[0138] Furthermore, the second pitch conversion unit 26 receives a plurality of substrates W aligned at a narrow pitch from the main transport mechanism WTR, and unloads the plurality of substrates W aligned at an unequal pitch onto the chuck 79. The second pitch conversion unit 26 is disposed at the substrate unloading position Pout. This allows the second pitch conversion unit 26 to efficiently perform pitch conversion during the substrate unloading process.

[0139] In addition, the second pitch change unit 26 is disposed below the second lateral path Pout. This allows the work at the second pitch change unit 26 and the work at the chuck 79 to be performed simultaneously, partially simultaneously, or at similar times.

[0140] In addition, second pitch shifting section 26 is disposed above first pitch shifting section 25. This allows operations in first pitch shifting section 25 and second pitch shifting section 26 to be performed simultaneously, partially simultaneously, or at similar timings.

[0141] In addition, the second pitch conversion unit 26 is disposed above the chuck 78. This allows the work at the first pitch conversion unit 25, the work at the chuck 79, and the work at the second pitch conversion unit to be performed simultaneously, partially simultaneously, or at similar times.

[0142] The first lateral path Pin and the second lateral path Pout intersect at a predetermined angle α, the pusher mechanism 21 is disposed at the point (Po) where they intersect at the predetermined angle α, and the first pitch conversion unit 25 and the second pitch conversion unit 26 are disposed at a predetermined angle apart. This allows the first pitch conversion unit 25 and the second pitch conversion unit 26 to be separated at positions (substrate carry-in position Pin, substrate carry-out position Pout) where they are less likely to interfere with each other. Example 2

[0143] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that the description overlapping with the first embodiment will be omitted.

[0144] Fig. 27 is a plan view showing the configuration of the transfer block 5 and its surroundings according to Example 2. Fig. 28 is a side view showing the delivery mechanism 23 and the two pitch conversion units 25, 26, etc. when viewed in the direction of arrow AA in Fig. 27.

[0145] The substrate processing apparatus 1 according to the second embodiment differs from the substrate processing apparatus 1 according to the first embodiment in that it does not include an intermediary mechanism 73.

[0146] That is, the main transport mechanism WTR receives the 50 substrates W aligned at a narrow pitch held by the first pitch conversion unit 25 without the intermediary mechanism 73. For example, the main transport mechanism WTR descends to the height at which the first pitch conversion unit 25 performed the pitch conversion (first transfer position P1A in this example). The first pitch conversion unit 25 carries the 50 substrates aligned at a narrow pitch into the main transport mechanism WTR at the height at which the pitch conversion was performed. Note that the first transfer position P1A may be higher than the position shown in this example, as long as the first pitch conversion unit 25 can rise to a position higher than the height at which the pitch conversion was performed.

[0147] According to the second embodiment, the first pitch conversion unit 25 receives a plurality of substrates W aligned at an irregular pitch from the chuck 77 and transports the plurality of substrates W aligned at a narrow pitch into the main transport mechanism WTR. This allows the substrates W to be efficiently transported between the chuck 77, the first pitch conversion unit 25, and the main transport mechanism WTR. Example 3

[0148] Next, a third embodiment of the present invention will be described with reference to the drawings. Note that the description overlapping with the first and second embodiments will be omitted.

[0149] Fig. 29 is a plan view showing the configuration of the transfer block 5 and its surroundings according to Example 3. Fig. 28 is a side view showing the delivery mechanism 23A, one pitch conversion unit 25A, etc. when viewed in the direction of arrow AA in Fig. 30.

[0150] The substrate processing apparatus 1 according to the first embodiment includes a transfer mechanism 23 having two pitch conversion units 25 and 26. In contrast, the substrate processing apparatus 1 according to the third embodiment includes a transfer mechanism 23A having one pitch conversion unit 25A.

[0151] That is, the transfer mechanism 23A includes a load / unload mechanism 71A and an intermediary mechanism 73A. The load / unload mechanism 71A loads multiple substrates W aligned at an uneven pitch from the pusher member 55 to the pitch conversion unit 25A, and unloads the multiple substrates W aligned at an uneven pitch from the pitch conversion unit 25A to the pusher member 55. The intermediary mechanism 73A loads multiple substrates W aligned at a narrow pitch from the pitch conversion unit 25A to the transfer position P1B, and unloads the multiple substrates W aligned at a narrow pitch from the transfer position P1B to the pitch conversion unit 25A.

[0152] The loading / unloading mechanism 71A is disposed at a loading height position H1 and a loading height position H3. The loading height position H1 and the loading height position H3 are at the same height.

[0153] The loading / unloading mechanism 71A includes a chuck 77, an opening / closing unit 81, a front-rear direction moving unit 83, and a width direction moving unit 85. The chuck 77, the opening / closing unit 81, the front-rear direction moving unit 83, and the width direction moving unit 85 are used for both loading and unloading a plurality of substrates W aligned at irregular intervals.

[0154] The intermediary mechanism 73A includes a chuck 78, an opening / closing unit 101, an arm 103, and an elevating unit 105. The chuck 78, the opening / closing unit 101, the arm 103, and the elevating unit 105 are used for both loading and unloading a plurality of substrates W aligned at a narrow pitch. Note that the intermediary mechanism 73A may be used only for loading the substrates W.

[0155] The pitch conversion unit 25A is used both to convert a plurality of substrates W aligned at an uneven pitch into a plurality of substrates W aligned at a narrow pitch, and to convert a plurality of substrates W aligned at a narrow pitch into a plurality of substrates W aligned at an uneven pitch.

[0156] The above-mentioned chuck 77 corresponds to the "traversing holding portion" of the present invention. The above-mentioned traversing mechanism 71A corresponds to the "traversing mechanism" of the present invention. The above-mentioned chuck 78 corresponds to the "intermediate holding portion" of the present invention.

[0157] In the substrate processing apparatus 1 according to the third embodiment, the lateral transport mechanism 71A moves the chuck 77, which collectively holds the plurality of substrates W aligned at irregular intervals received from the pusher member 55, laterally along the lateral paths Rin, Rout between the substrate transfer position Po and the substrate transfer positions Pin, Pout. The intermediary mechanism 73A raises and lowers the chuck 78, which collectively holds the plurality of substrates W aligned at narrow intervals, at the substrate transfer positions Pin, Pout. The substrate transfer position Po is a position where the plurality of substrates W aligned at irregular intervals are collectively transferred between the pusher member 55 and the chuck 77. The substrate transfer positions Pin, Pout are positions where the plurality of substrates W aligned at narrow intervals are collectively transferred between the chuck 78 and the main transport device WTR. The pitch conversion unit 25A moves up and down at the substrate transfer positions Pin, Pout to transfer multiple substrates W aligned at an uneven pitch between it and the chuck 77. The chuck 77 moves up and down at the substrate transfer positions Pin, Pout to transfer multiple substrates W aligned at a narrow pitch between it and the pitch conversion unit 25A. The pitch conversion unit 25A is disposed at the substrate transfer positions Pin, Pout. This allows the position of the pitch conversion unit 25 that performs the second-stage pitch conversion to be separated from the pusher mechanism 21 that performs the first-stage pitch conversion. In other words, the second-stage pitch conversion is performed at a position that does not reduce the throughput of the first-stage pitch conversion. Therefore, the substrates W can be processed efficiently.

[0158] The pitch change portion 25A is disposed below the chuck 78. This allows the work at the pitch changing portion 25A and the work at the chuck 78 to be performed simultaneously, partially simultaneously, or at approximately the same timing.

[0159] In addition, pitch conversion unit 25A is disposed below the lateral path, which allows the work at chuck 77, the work at pitch conversion unit 25A, and the work at chuck 78 to be performed simultaneously, partially simultaneously, or at similar times. Example 4

[0160] Next, a fourth embodiment of the present invention will be described with reference to the drawings. Note that the description overlapping with the first to third embodiments will be omitted.

[0161] Fig. 31 is a plan view showing the configuration of a transfer block and its surroundings according to Example 4. Fig. 32 is a side view showing the delivery mechanism, two pitch conversion units, etc. when viewed in the direction of arrow AA in Fig. 31.

[0162] The substrate processing apparatus 1 according to the fourth embodiment includes a transfer mechanism 23A having one pitch conversion unit 25A, similar to the substrate processing apparatus 1 according to the third embodiment. The substrate processing apparatus 1 according to the fourth embodiment differs from the substrate processing apparatus 1 according to the third embodiment in that it does not include an intermediary mechanism 73A.

[0163] That is, the main transport mechanism WTR receives the 50 substrates W aligned at a narrow pitch held by the pitch conversion unit 25A without going through the intermediary mechanism 73A. For example, the main transport mechanism WTR descends to the height at which the pitch conversion unit 25A performed the pitch conversion (first transfer position P1A in this example). The pitch conversion unit 25A loads the 50 substrates aligned at a narrow pitch into the main transport mechanism WTR at the height at which the pitch conversion was performed.

[0164] In the substrate processing apparatus 1 according to the fourth embodiment, the loading / unloading mechanism 71A moves the chuck 77, which collectively holds the plurality of substrates W aligned at irregular pitches received from the pusher member 55, laterally along the lateral paths Rin, Rout between the substrate transfer position Po and the substrate transfer positions Pin, Pout. The substrate transfer position Po is a position where the plurality of substrates W aligned at irregular pitches are collectively transferred between the pusher member 55 and the chuck 77. The substrate transfer positions Pin, Pout are positions where the plurality of substrates aligned at narrow pitches are collectively transferred between the pitch conversion unit 25A and the main transport device WTR. The pitch conversion unit 25A moves up and down at the substrate transfer positions Pin, Pout to transfer the plurality of substrates W aligned at irregular pitches to and from the chuck 77. The pitch conversion unit 25A is disposed at the substrate transfer positions Pin, Pout. This allows the position of pitch conversion unit 25A, which performs the second-stage pitch conversion, to be separated from pusher mechanism 21, which performs the first-stage pitch conversion. In other words, the second-stage pitch conversion is performed at a position that does not reduce the throughput of the first-stage pitch conversion. Therefore, substrates can be processed efficiently.

[0165] In addition, the pitch conversion unit 25A is disposed below the lateral paths Rin and Rout, which allows the work at the chuck 77 and the work at the pitch conversion unit 25A to be performed simultaneously, partially simultaneously, or at similar times. Example 5

[0166] Next, a fifth embodiment of the present invention will be described with reference to the drawings. Note that the description overlapping with the first to fourth embodiments will be omitted.

[0167] Fig. 33 is a plan view showing the configuration of a transfer block 5 and its surroundings according to Example 5. Fig. 34 is a side view showing the extension and contraction mechanisms of pitch conversion units 25 and 26 provided on a pair of chuck members 77C and 77D of the carry-in mechanism 71 and a pair of chucks 79C and 79D of the carry-out mechanism 75. Fig. 34 is a side view showing the extension and contraction mechanisms of pitch conversion units 25 and 26 provided on a pair of chuck members 77C and 77D of the carry-in mechanism 71 and a pair of chucks 79C and 79D of the carry-out mechanism 75.

[0168] In the fifth embodiment, the first pitch conversion unit 25 is attached integrally to the pair of chuck members 77C, 77D of the carry-in mechanism 71. The second pitch conversion unit 26 is attached to the pair of chucks 79C, 79D of the carry-out mechanism 75. Specifically, the first pitch conversion unit 25 is attached integrally to the side surfaces of the pair of chuck members 77C, 77D of the carry-in mechanism 71. The second pitch conversion unit 26 is attached to the side surfaces of the pair of chucks 79C, 79D of the carry-out mechanism 75.

[0169] The expandable structures of the first pitch shifter 25 and the second pitch shifter 26 are the same as those in Example 1. In Example 1, the pitch shifters 25 and 26 are arranged horizontally, but in Example 5, the pitch shifters 25 and 26 are arranged vertically.

[0170] The holding grooves 113 of the load-in mechanism 71 are attached to the upper sides of the pair of chuck members 77C, 77D, respectively. The holding grooves 113 of the unload-out mechanism 75 are attached to the upper sides of the pair of chucks 79C, 79D, respectively. As a result, in the load-in mechanism 71, the substrate W is held on the upper sides of the pair of chuck members 77C, 77D, respectively. In the unload-out mechanism 75, the substrate W is held on the upper sides of the pair of chucks 79C, 79D, respectively.

[0171] According to the fifth embodiment, the first pitch conversion unit 25 is provided in the carry-in mechanism 71, and the second pitch conversion unit 26 is provided in the carry-out mechanism 75. As a result, the height of the substrate processing apparatus 1 can be reduced by the amount that the first pitch conversion unit 25 is integrated with the carry-in mechanism 71 and the second pitch conversion unit 26 is integrated with the carry-out mechanism 75.

[0172] The present invention can also be applied to a substrate processing apparatus 1 in which the carry-in mechanism 71 and the carry-out mechanism 75 are arranged one above the other. This is because the first pitch conversion unit 25 is integrated with the carry-in mechanism 71 and the second pitch conversion unit 26 is integrated with the carry-out mechanism 75, thereby reducing the height of the substrate processing apparatus 1.

[0173] This example can also be applied to a substrate processing apparatus 1 in which the carry-in mechanism 71 and the carry-out mechanism 75 are used as one mechanism (carry-in / carry-out mechanism 71A).

[0174] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0175] (1) In the above-described embodiment, when the reference interval TN9 is, for example, 10 mm, the first interval TN1 is, for example, 3.333 mm, and the second interval TN2 is, for example, 6.666 mm. In this case, the first interval TN1 is equal to half the second interval TN2. In this regard, the first interval TN1 may be smaller than half the second interval TN2. For example, when the reference interval TN9 is, for example, 10 mm, the first interval TN1 may be 3 mm, and the second interval TN2 may be 7 mm. Alternatively, the first interval TN1 may be 2.5 mm, and the second interval TN2 may be 7.5 mm. Preferably, the second interval TN2 is two to three times the first interval TN1.

[0176] For example, the two retaining grooves 117 of each retaining member 113 may be configured to be spaced apart by a first distance TN1 (e.g., 3 mm) that is less than half the second distance TN2 (e.g., 7 mm) and greater than 0 (zero) mm. Alternatively, the two retaining grooves 117 of each retaining member 113 may be configured to be spaced apart by a first distance TN1 (e.g., 3 mm) that is greater than or equal to one-third and less than one-half the second distance TN2 (e.g., 7 mm). Alternatively, the two retaining grooves 117 of each retaining member 113 may be configured to be spaced apart by a first distance TN1 (e.g., 3.333 mm) that is half the second distance TN2 (e.g., 6.666 mm).

[0177] (2) In the above-described embodiments and modified example (1), when the reference interval TN9 is, for example, 10 mm, the first interval TN1 is, for example, 3.333 mm, and the second interval TN2 is, for example, 6.666 mm. In this regard, the first interval TN1 may be larger than 1 / 3 the reference interval TN9 (for example, 3.333 mm) and smaller than 1 / 2 the reference interval TN9 (for example, 5 mm).

[0178] (3) In the above-described embodiment, the pitch conversion units 25 and 26 have two holding grooves 117 provided in one holding member 113. However, one holding groove 117 may be provided for each holding member 113. In such a configuration, a two-stage pitch conversion different from that in the above-described embodiment can be adopted. That is, the pusher mechanism 21 combines the substrates W1 of the first substrate group with the substrates W2 of the second substrate group to produce a plurality of substrates W aligned at a first narrow pitch that is narrower than the reference pitch. The first pitch conversion unit 25 converts the plurality of substrates W aligned at the first narrow pitch into a plurality of substrates W aligned at a second narrow pitch that is narrower than the first narrow pitch. Because the first pitch conversion unit 25 has one holding groove 117 provided for each holding member 113, it can convert the first narrow pitch to the second narrow pitch.

[0179] According to this example, the multiple substrates W aligned at narrow intervals are multiple substrates W aligned at a first narrow pitch that is narrower than the reference pitch. The multiple substrates W aligned at a narrow pitch are multiple substrates W aligned at a second narrow pitch that is narrower than the first narrow pitch. In this way, the second-stage pitch conversion is performed slowly because it narrows the first narrow pitch created by the first-stage pitch conversion to the second narrow pitch. The second-stage pitch conversion is performed at a position that does not reduce throughput. Therefore, substrates can be processed efficiently.

[0180] (4) In each of the above-described embodiments and modifications, the carry-in mechanism 71 is provided behind the carry-out mechanism 75. However, the carry-in mechanism 71 may be provided in front of the carry-out mechanism 75. That is, the positions of the carry-in mechanism 71 and the carry-out mechanism 75 may be reversed. In this case, the carry-in mechanism 71 transports multiple substrates W from the pusher member 55 to the second pitch conversion unit 26, and the carry-out mechanism 73 transports multiple substrates W from the first pitch conversion unit 25 to the pusher member 55.

[0181] (5) In the above-described embodiments and modifications, the intermediary mechanism 73 transports multiple substrates W aligned at a narrow pitch from the first pitch conversion unit 25 to the main transport mechanism WTR. However, the intermediary mechanism 73 may transport multiple substrates W aligned at a narrow pitch from the main transport mechanism WTR to the second pitch conversion unit 26.

[0182] (6) In the above-described embodiments and modifications, the chuck 77 (a pair of chuck members 77A, 77B) of the carry-in mechanism 71 is opened and closed by the opening / closing unit 81. In this regard, the chuck 77 does not have to be configured to be opened and closed.

[0183] (7) In the above-described embodiments and modifications, the chuck 79 (a pair of chuck members 79A, 79B) of the carry-out mechanism 75 is opened and closed by the opening / closing unit 89. In this regard, the chuck 79 does not have to be configured to be opened and closed. [Explanation of symbols]

[0184] 1... Substrate processing equipment 7 ... Processing block 19 ... Posture conversion unit 21 ... Pusher mechanism 25 ... First pitch shifter 26 ... Second pitch shifter WTR: Main transport mechanism

Claims

1. A substrate processing apparatus for processing a substrate, a posture changing mechanism that changes the posture of a substrate between a horizontally oriented substrate and a horizontally held posture that holds a group of substrates aligned at equal pitches in the vertical direction, and a vertically held posture that holds a group of substrates aligned at equal pitches in the horizontal direction; a pusher mechanism having a pusher member that combines the second group of substrates in the vertically held position held by the position change mechanism with the first group of substrates in the vertically held position delivered in advance from the position change mechanism, and holds a plurality of substrates aligned at intervals narrower than the equal pitch; a pitch conversion unit that receives the plurality of substrates aligned at the narrow intervals and aligns the plurality of substrates aligned at the narrow intervals at a narrow pitch that is narrower than the uniform pitch; a substrate processing section that collectively processes the plurality of substrates aligned at the narrow pitch; a main transport mechanism that transports the plurality of substrates aligned at the narrow pitch all at once to the substrate processing section, The pitch conversion unit is disposed on the main transport mechanism side of the pusher mechanism. A substrate processing apparatus characterized by:

2. 2. The substrate processing apparatus according to claim 1, the plurality of substrates aligned at narrow intervals are a plurality of substrates aligned at an unequal pitch in which first intervals narrower than the equal pitch and second intervals narrower than the equal pitch and wider than the first intervals are alternately repeated, the equal pitch is equal to the sum of the first interval and the second interval, The plurality of substrates aligned at the narrow pitch are a plurality of substrates aligned at the first interval repeatedly. A substrate processing apparatus characterized by:

3. 2. The substrate processing apparatus according to claim 1, the plurality of substrates aligned at the narrow intervals are the plurality of substrates aligned at a first narrow pitch that is narrower than the uniform pitch, The plurality of substrates aligned at the narrow pitch are the plurality of substrates aligned at a second narrow pitch that is narrower than the first narrow pitch. A substrate processing apparatus characterized by:

4. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus includes: a lateral movement mechanism that moves a lateral movement holding unit that collectively holds the plurality of substrates aligned at the narrow intervals received from the pusher member along a lateral movement path between a substrate transfer position and a substrate delivery position, the substrate transfer position is a position where the plurality of substrates aligned at the narrow intervals are collectively transferred between the pusher member and the lateral holding part, the substrate transfer position is a position where the plurality of substrates aligned at the narrow pitch are transferred collectively between the pitch conversion unit and the main transport device, the pitch conversion unit moves up and down at the substrate transfer position to transfer the plurality of substrates aligned at the narrow intervals between the pitch conversion unit and the lateral holding unit; The pitch conversion unit is disposed at the substrate transfer position. A substrate processing apparatus characterized by:

5. 5. The substrate processing apparatus according to claim 4, The pitch change section is disposed below the lateral path. A substrate processing apparatus characterized by:

6. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus includes: a lateral movement mechanism that moves a lateral movement holding unit that collectively holds the plurality of substrates aligned at narrow intervals and received from the pusher member laterally along a lateral movement path between a substrate transfer position and a substrate delivery position; an intermediate mechanism that raises and lowers an intermediate holding unit that collectively holds the plurality of substrates aligned at the narrow pitch at the substrate transfer position, the substrate transfer position is a position where the plurality of substrates aligned at the narrow intervals are collectively transferred between the pusher member and the lateral holding part, the substrate transfer position is a position where the plurality of substrates aligned at the narrow pitch are transferred collectively between the intermediary holder and the main transport device, the pitch conversion unit moves up and down at the substrate transfer position to transfer the plurality of substrates aligned at the narrow intervals between the pitch conversion unit and the lateral holding unit; the intermediary holding unit moves up and down at the substrate transfer position to transfer the plurality of substrates aligned at the narrow pitch between the intermediary holding unit and the pitch converting unit; The pitch conversion unit is disposed at the substrate transfer position. A substrate processing apparatus characterized by:

7. 7. The substrate processing apparatus according to claim 6, The pitch conversion portion is disposed at a position lower than the intermediate holding portion. A substrate processing apparatus characterized by:

8. 7. The substrate processing apparatus according to claim 6, The pitch change section is disposed below the lateral path. A substrate processing apparatus characterized by:

9. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus includes: a first traverse mechanism that traverses a first traverse holding unit that collectively holds the plurality of substrates aligned at narrow intervals and received from the pusher member, along a first traverse path; a second lateral movement mechanism that moves a second lateral movement holding unit that collectively holds the plurality of substrates aligned at narrow intervals to be passed to the pusher member, along a second lateral movement path; The pitch conversion unit a first pitch conversion unit that receives the plurality of substrates aligned at the narrow intervals and aligns the plurality of substrates aligned at the narrow intervals at the narrow pitch; a second pitch conversion unit that receives the plurality of substrates aligned at the narrow pitch and aligns the plurality of substrates aligned at the narrow pitch at the narrow intervals. A substrate processing apparatus characterized by:

10. 10. The substrate processing apparatus according to claim 9, the first lateral path is a path between a substrate transfer position and a substrate loading position, the second lateral path is a path between a substrate unloading position and a substrate transfer position, the first traverse path and the second traverse path are provided at positions separated in a lateral direction, the first pitch conversion unit is disposed at the substrate loading position, The second pitch conversion unit is disposed at the substrate unloading position. A substrate processing apparatus characterized by:

11. 11. The substrate processing apparatus according to claim 10, The first pitch conversion unit The first lateral holding unit receives the plurality of substrates aligned at the narrow intervals from the first lateral holding unit, and carries the plurality of substrates aligned at the narrow pitch into the main transport mechanism. A substrate processing apparatus characterized by:

12. 11. The substrate processing apparatus according to claim 10, an intermediate mechanism that raises an intermediate holding unit that collectively holds the plurality of substrates aligned at the narrow pitch at the substrate loading position; the substrate transfer position is a position where the plurality of substrates aligned at a narrow interval are collectively carried from the pusher member to the first lateral holding unit, the substrate loading position is a position where the plurality of substrates aligned at the narrow pitch are loaded collectively from the intermediary holding unit into the main transport mechanism, the first pitch conversion unit rises at the substrate loading position to load the plurality of substrates aligned at the narrow intervals from the first lateral holding unit; the intermediary holding unit is raised at the substrate loading position to load the plurality of substrates aligned at the narrow pitch from the pitch changing unit, The first pitch conversion unit is disposed at the substrate loading position. A substrate processing apparatus characterized by:

13. 13. The substrate processing apparatus according to claim 12, The first pitch change portion is disposed below the intermediate holding portion. A substrate processing apparatus characterized by:

14. 14. The substrate processing apparatus according to claim 13, The first pitch change section is disposed below the first traverse path. A substrate processing apparatus characterized by:

15. 11. The substrate processing apparatus according to claim 10, The second pitch conversion unit receiving the plurality of substrates aligned at the narrow pitch from the main transport mechanism and carrying out the plurality of substrates aligned at the narrow pitch to the second lateral holding unit; The substrate is disposed at the substrate unloading position. A substrate processing apparatus characterized by:

16. 16. The substrate processing apparatus according to claim 15, The second pitch change section is disposed below the second traverse path. A substrate processing apparatus characterized by:

17. 10. The substrate processing apparatus according to claim 9, The second pitch change section is disposed above the first pitch change section. A substrate processing apparatus characterized by:

18. 11. The substrate processing apparatus according to claim 10, The second pitch change portion is disposed above the intermediate holding portion. A substrate processing apparatus characterized by:

19. 10. The substrate processing apparatus according to claim 9, the first traverse path and the second traverse path intersect at a predetermined angle, the pusher mechanism is disposed at the intersection at the predetermined angle; The first pitch change portion and the second pitch change portion are spaced apart by the predetermined angle. A substrate processing apparatus characterized by:

20. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus includes: a lateral movement mechanism that moves a lateral movement holding unit that collectively holds the plurality of substrates aligned at the narrow intervals received from the pusher member along a lateral movement path between a substrate transfer position and a substrate delivery position, The pitch change unit is provided in the traverse mechanism. A substrate processing apparatus characterized by:

21. 10. The substrate processing apparatus according to claim 9, the first pitch conversion unit is provided in the first traverse mechanism, The second pitch change unit is provided in the second traverse mechanism. A substrate processing apparatus characterized by:

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