Transfer jig and method for manufacturing electronic component

Abstract

To reduce environmental impact.SOLUTION: A feeding jig 100 has a main surface 101 on which a plurality of recesses 102 are formed, each of which receives an electronic component element. Each of the recesses 102 has a side surface 103 and a bottom surface 104. The bottom surface 104 has a lower hardness than the side surface 102. The feeding jig 100 is configured such that, by narrowing the opening area of each of the recesses 102, the electronic component element placed in each of the recesses 102 can be clamped while positioned on the bottom surface 104.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a transfer jig and a method for manufacturing an electronic component. [Background technology]

[0002] Japanese Patent Laid-Open Publication No. 2007-266208 (Patent Document 1) is a prior art document disclosing a method and apparatus for forming external electrodes on chip-type electronic components. In the method and apparatus for forming external electrodes described in Patent Document 1, the chip-type element is attached to an adhesive material containing a plastically deformable thermally foamable adhesive, and the adhesive material is heated to contactlessly peel the chip-type element from the adhesive material without applying an external force to the chip-type element. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-266208 Summary of the Invention [Problem to be solved by the invention]

[0004] Adhesives containing thermally foamable adhesives cannot be reused once they have been used, and there is room for reducing the environmental impact.

[0005] The present invention has been made in consideration of the above problems, and has as its object to provide a transfer jig and a method for manufacturing electronic components that can reduce the environmental impact. [Means for solving the problem]

[0006] The feeding jig according to the present invention is a feeding jig having a main surface that is open and has a plurality of recesses into which an electronic component element is fed. Each of the recesses has a side surface and a bottom surface. The bottom surface has a lower hardness than the side surface. The feeding jig is configured so that the opening area of ​​each of the recesses is narrowed so that the electronic component element fed into each of the recesses can be clamped while positioned on the bottom surface. [Effects of the Invention]

[0007] According to the present invention, it is possible to reduce the environmental load. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a flow chart showing a method for manufacturing an electronic component. [Figure 2] 1 is a cross-sectional view showing a first state of a transferring jig according to an embodiment of the present invention. [Figure 3] 1 is a cross-sectional view showing a state in which a guide plate is attached to a transfer jig according to an embodiment of the present invention. FIG. [Figure 4] 1 is a cross-sectional view showing a state in which an element body of an electronic component is being inserted into a insertion jig according to an embodiment of the present invention. [Figure 5] 1 is a cross-sectional view showing a state in which an element body of an electronic component that has been transferred into a transfer jig according to an embodiment of the present invention is being clamped. [Figure 6] 1 is a cross-sectional view showing a state in which a part of a functional member is attached to an element body of an electronic component that has been inserted into a inserting jig according to an embodiment of the present invention. FIG. [Figure 7] 10 is a cross-sectional view showing a state in which an electronic component element clamped in a transfer jig according to an embodiment of the present invention is being transferred to another transfer jig. FIG. [Figure 8] FIG. 10 is a cross-sectional view showing a state in which the Shore A hardness of the bottom surface portion is being measured. DETAILED DESCRIPTION OF THE INVENTION

[0009] A method for manufacturing a transfer jig and an electronic component according to one embodiment of the present invention will be described below with reference to the drawings. In the following description of the embodiment, the same or corresponding parts in the drawings will be given the same reference numerals, and their description will not be repeated.

[0010] Fig. 1 is a flow diagram showing a method for manufacturing an electronic component. In the following explanation of the method for manufacturing an electronic component, a method for manufacturing a multilayer ceramic capacitor will be described, but the electronic component is not limited to a multilayer ceramic capacitor and may be a multilayer ceramic coil or the like, as long as it is an electronic component made from chips.

[0011] As shown in FIG. 1, when manufacturing a multilayer ceramic capacitor, a ceramic dielectric slurry is first prepared (step S1). Specifically, ceramic dielectric powder, additive powder, binder resin, and dissolving solution are dispersed and mixed to prepare the ceramic dielectric slurry. The ceramic dielectric powder is, for example, dielectric particles with a perovskite structure such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The additive powder is, for example, composed of at least one of a Si compound, a Mg compound, a Mn compound, an Fe compound, a Cr compound, a Ni compound, and a Co compound. The binder resin may be a polyurethane resin, a urea resin, a melamine resin, an epoxy resin, a vinyl acetate resin, an acrylic resin, or an aqueous polymer such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB). These may be used alone or in combination. The ceramic dielectric slurry may be either solvent-based or water-based. When the ceramic dielectric slurry is a water-based paint, the ceramic dielectric slurry is prepared by mixing a water-soluble binder, a dispersant, etc. with a dielectric raw material dissolved in water.

[0012] Next, a ceramic dielectric sheet is formed (step S2). Specifically, the ceramic dielectric slurry is formed into a sheet shape on a carrier film using a die coater, gravure coater, microgravure coater, or the like, and then dried to form the ceramic dielectric sheet. From the viewpoint of miniaturization and high capacitance of the multilayer ceramic capacitor, the thickness of the ceramic dielectric sheet is preferably 0.2 μm or more and 10 μm or less.

[0013] Next, a mother sheet is formed (step S3). Specifically, a conductive paste is applied to a ceramic dielectric sheet in a predetermined pattern, thereby forming a mother sheet having a predetermined internal electrode pattern on the ceramic dielectric sheet. The conductive paste contains Ni powder, a solvent, a dispersant, a binder, etc., and is prepared to have a constant viscosity. Methods for applying the conductive paste include screen printing, inkjet printing, and gravure printing. From the viewpoint of miniaturization and high capacity of the multilayer ceramic capacitor, the thickness of the internal electrode pattern is preferably 0.2 μm or more and 10 μm or less. In addition to mother sheets having internal electrode patterns, ceramic dielectric sheets that have not undergone step S3 can also be prepared as mother sheets.

[0014] Next, a plurality of mother sheets are stacked (step S4). Specifically, a predetermined number of mother sheets, each consisting of only ceramic dielectric sheets and without an internal electrode pattern, are stacked to a thickness of, for example, 0.5 μm or more and 5 μm or less. A predetermined number of mother sheets, each having an internal electrode pattern, are stacked on top of these. The number of stacked mother sheets each having an internal electrode pattern is, for example, 5 to 1500. A predetermined number of mother sheets, each consisting of only ceramic dielectric sheets and without an internal electrode pattern, are stacked on top of these to a thickness of, for example, 0.5 μm or more and 10 μm or less. This forms a mother sheet group.

[0015] Next, the mother sheet group is pressed together to form a dielectric block (step S5). Specifically, the mother sheet group is pressed in the stacking direction using an isostatic press or a rigid press to form the dielectric block. At this time, the ceramic dielectric sheets are pressed at a predetermined temperature, so that the ceramic dielectric sheets adhere to each other. Furthermore, by arranging and pressing a ceramic dielectric sheet of a certain thickness as the outermost layer in the stacking direction, it is possible to protect the dielectric sheet on which the internal electrode pattern is formed.

[0016] Next, the dielectric block is divided to form element bodies (step S6). Specifically, the dielectric block is divided into a matrix by press-cutting, dicing, or laser cutting, and is separated into a plurality of element bodies. Internal electrodes are exposed on the side surfaces of each of the plurality of element bodies.

[0017] Next, the element body is clamped by a transfer jig (step S7). Here, the configuration of the transfer jig according to one embodiment of the present invention will be described.

[0018] Fig. 2 is a cross-sectional view showing a first state of a transferring jig according to one embodiment of the present invention. As shown in Fig. 2, a plurality of recesses 102 are formed in transferring jig 100 according to one embodiment of the present invention. Each of the plurality of recesses 102 is open to main surface 101 of transferring jig 100. The plurality of recesses 102 are formed in a matrix on main surface 101, for example, in a range of 100 to 1000. An element body of an electronic component is transferred into each of the plurality of recesses 102. Fig. 2 illustrates a first state in which the opening area of ​​each of the plurality of recesses 102 is not narrowed.

[0019] Each of the plurality of recesses 102 has a side surface 103 and a bottom surface 104. When viewed from a direction perpendicular to the main surface 101, each of the plurality of recesses 102 has a square shape with a side length of 0.2 mm or more and 1.0 mm or less. However, each of the plurality of recesses 102 may have a rectangular shape when viewed from a direction perpendicular to the main surface 101. The hardness of the bottom surface 104 is lower than the hardness of the side surface 103. The hardness of the side surface 103 is the highest among the hardness of the side surface 112, the peripheral surface 122, and the peripheral surface 132, which will be described later. The transferring jig 100 is configured so that, by narrowing the opening area of ​​each of the plurality of recesses 102, the electronic component element transferred into each of the plurality of recesses 102 can be clamped while positioned on the bottom surface 104.

[0020] In this embodiment, the transferring jig 100 includes a bottom plate 110, a movable plate 120, and an upper plate 130. A plurality of recesses 111 are formed in the bottom plate 110. Each of the plurality of recesses 111 has a side surface portion 112 and a bottom surface portion 113. The side surface portion 112 of the recess 111 forms a part of the side surface portion 103 of the recess 102. The bottom plate 110 is made of a rigid body such as metal.

[0021] An elastic body 115 is disposed on the bottom surface 113 of each of the plurality of recesses 111. The elastic body 115 constitutes the bottom surface 104. The elastic body 115 may be disposed on the entire bottom surface 113, or may be disposed on only a portion of the bottom surface 113. The elastic body 115 is formed, for example, from a PET (Polyethylene terephthalate) film. The thickness of the elastic body 115 is, for example, not less than 0.1 mm and not more than 0.5 mm.

[0022] Movable plate 120 is disposed on bottom plate 110. Movable plate 120 can change the opening area of ​​each of multiple recesses 102 by moving in a direction along main surface 101. In this embodiment, movable plate 120 is configured to be movable in the left-right direction in FIG. 2. The electronic component manufacturing apparatus according to this embodiment includes a movement mechanism that moves movable plate 120 in the left-right direction in FIG. 2.

[0023] The movable plate 120 is formed with a plurality of through holes 121 that respectively constitute a portion of each of the plurality of recesses 102 in a first state in which the opening area of ​​each of the plurality of recesses 102 is not narrowed. Each of the plurality of through holes 121 is surrounded by a peripheral surface portion 122. As shown in FIG. 2 , the peripheral surface portion 122 constitutes a portion of the side surface portion 103 of the recess 102 in the first state.

[0024] Movable plate 120 is made of a rigid body such as metal. However, movable plate 120 may also be made of resin. If movable plate 120 is made of resin, when the element of the electronic component is sandwiched between side surface portion 103 and peripheral surface portion 122 in the second state as described below, the elasticity of the resin can increase the holding force of the element.

[0025] The upper plate 130 is disposed on the movable plate 120. The upper plate 130 is fixed to the bottom plate 110 by a connecting portion (not shown) so as to face the bottom plate 110 with a fixed distance therebetween. In this embodiment, the upper plate 130 is formed of a member separate from the bottom plate 110, but the upper plate 130 and the bottom plate 110 may be formed of a single member.

[0026] A plurality of through holes 131 are formed in the upper plate 130, each constituting a part of one of the plurality of recesses 102. Each of the plurality of through holes 131 is surrounded by a peripheral surface portion 132. As shown in FIG. 2, the peripheral surface portion 132 constitutes a part of the side surface portion 103 of the recess 102. The upper plate 130 is made of a rigid body such as metal.

[0027] FIG. 3 is a cross-sectional view showing a state in which a lead-in plate is attached to a transfer jig according to one embodiment of the present invention. As shown in FIG. 3, a lead-in plate 140 is detachably attached to a transfer jig 100 according to one embodiment of the present invention. The lead-in plate 140 is attached to the upper plate 130. The lead-in plate 140 has a plurality of through holes 141 formed at positions corresponding to the plurality of recesses 102. Each of the plurality of through holes 141 is surrounded by a peripheral surface portion 142. The peripheral surface portion 142 is tapered so that the opening area of ​​the through holes 141 increases with increasing distance from the upper plate 130. It is preferable that the peripheral surface portion 142 is continuous with the peripheral surface portion 132. The lead-in plate 140 is made of a rigid body such as metal. Note that the lead-in plate 140 does not necessarily have to be attached to the transfer jig 100. In this case, each of the plurality of peripheral surface portions 132 of the upper plate 130 may have a portion formed in a tapered shape so that the opening area of ​​the through-hole 131 increases with increasing distance from the movable plate 120 .

[0028] Figure 4 is a cross-sectional view showing the state in which electronic component elements 10 are being transferred into a transfer jig according to one embodiment of the present invention. As shown in Figure 4, a plurality of electronic component elements 10 are placed on a guide plate 140, and the transfer jig 100 is vibrated to transfer the electronic component elements 10 into each of a plurality of recesses 102. The plurality of electronic component elements 10 have a rectangular parallelepiped shape.

[0029] The dimensions of the base body 10 of the multiple electronic components are, for example, 1.34 mm in length, 0.75 mm in width, and 0.75 mm in thickness, 0.8 mm in length, 0.45 mm in width, and 0.45 mm in thickness, 0.52 mm in length, 0.3 mm in width, and 0.3 mm in thickness, or 0.26 mm in length, 0.15 mm in width, and 0.15 mm in thickness, with tolerances taken into account.

[0030] The depth D1 of each of the plurality of recesses 102 is smaller than the dimension T from one surface of the electronic component body 10 to the bottom surface 104, and for example, the dimension of the depth D1 is 70% to 85% of the dimension T.

[0031] The dimension of depth D2 from the surface of introduction plate 140 to bottom surface 104 is greater than dimension T from one surface of electronic component body 10 to bottom surface 104. This makes it possible to prevent electronic component bodies 10 that have been placed in the multiple recesses 102 from protruding from the surface of introduction plate 140, and therefore to prevent electronic component bodies 10 that have been placed in the multiple recesses 102 from interfering with the placement of electronic component bodies 10 that have not yet been placed into the recesses 102.

[0032] The tapered shape of peripheral surface 142 of lead-in plate 140 makes it easier to transfer electronic component elements 10 into each of the plurality of recesses 102. The filling rate, which is the ratio of the number of recesses 102 into which electronic component elements 10 have been transferred to the total number of recesses 102, is preferably 90% or more. After the filling rate reaches 90% or more, the plurality of electronic component elements 10 that have not yet been transferred are removed from the surface of lead-in plate 140. Lead-in plate 140 is then removed from transfer jig 100.

[0033] 5 is a cross-sectional view showing a state in which an electronic component element fed into a feeding jig according to one embodiment of the present invention is clamped. As shown in FIG. 5, movable plate 120 is moved in the direction of the arrow, and in a second state in which movable plate 120 narrows the opening area of ​​each of multiple recesses 102, electronic component element 10 fed into each of multiple recesses 102 is clamped between side surface portion 103 and peripheral surface portion 122 while positioned on bottom surface portion 104. In this embodiment, electronic component element 10 is clamped between side surface portion 112, peripheral surface portion 132, and peripheral surface portion 122. However, if upper plate 130 is not provided, electronic component element 10 is clamped between side surface portion 112 and peripheral surface portion 122.

[0034] By clamping the electronic component body 10 that is placed in each of the multiple recesses 102 and positioned on the bottom surface 104 of the multiple recesses 102, the position of one side of the electronic component body 10 protruding from the multiple recesses 102 can be aligned with high precision.

[0035] In the electronic component element 10 inserted and clamped in each of the recesses 102, one of the surfaces protruding from the recesses 102 may be polished with a polishing plate. In this case, the element 10 is held so as to be surrounded by the bottom surface portion 104, the side surface portion 103, and the peripheral surface portion 122, so that the element 10 can be polished while being held in a stable position. As a result, the internal electrodes can be accurately exposed on the polished one surface of the element 10. Furthermore, because the hardness of the bottom surface portion 104 is lower than the hardness of the side surface portion 103, damage to the other surface of the element 10 opposite the polished one surface due to impact during polishing can be prevented. In this embodiment, the bottom surface portion 104 is made of an elastic body 115, so that the elastic body 115 can absorb stress during polishing, effectively preventing damage to the other surface of the element 10 opposite the polished one surface.

[0036] Next, a portion of the functional member is applied to the element body (step S8). FIG. 6 is a cross-sectional view showing a state in which a portion of the functional member is being applied to the element body of an electronic component that has been placed in a transfer jig according to one embodiment of the present invention. As shown in FIG. 6, an electronic component manufacturing apparatus 1 according to one embodiment of the present invention includes a transfer jig 100 and an abutment mechanism 200. Transfer jig 100 is capable of clamping electronic component element bodies 10 that have been placed in each of a plurality of recesses 102 and are positioned on bottom surfaces 104 of the plurality of recesses 102. Abutment mechanism 200 is capable of abutting functional member 11 against electronic component element body 10 that has been clamped in transfer jig 100, thereby applying a portion of functional member 11 to element body 10.

[0037] In this embodiment, the contact mechanism 200 includes a flat plate 210 and an elastic body 220 arranged on the surface of the flat plate 210. The elastic body 220 is made of, for example, rubber. The functional member 11 is arranged on the surface of the elastic body 220.

[0038] When the abutment mechanism 200 abuts the functional member 11 against the element body 10 of the electronic component held in the transferring jig 100, the portion of the functional member 11 that was in contact with the element body 10 is punched out and adheres to the element body 10. The functional member 11 is, for example, a conductive member. The conductive member may contain, for example, Ni as a main component and 20 vol % to 30 vol % of dielectric particles.

[0039] Fig. 7 is a cross-sectional view showing the state in which an electronic component element held in a transferring jig according to one embodiment of the present invention is being transferred to another transferring jig. As shown in Fig. 7, two transferring jigs 100 are arranged so that their recesses 102 face each other, and when movable plate 120 of transferring jig 100 that has been holding electronic component element 10 is moved in the direction of the arrow, electronic component element 10 is released from clamping, and electronic component element 10 moves by gravity to each of the multiple recesses 102 of the other transferring jig 100.

[0040] 6, another transferring jig 100 and a contact mechanism 200 are used to apply a portion of functional member 11 to the other surface of element body 10 of the electronic component, thereby forming a chip.

[0041] Next, the chip is fired (step S9). Specifically, the chip is heated, which fires the dielectric material and conductive material contained in the chip, forming a laminate. The firing temperature is set appropriately depending on the dielectric material and conductive material. The fired chip is plated to form external electrodes.

[0042] By going through the above-described series of steps, a multilayer ceramic capacitor can be manufactured.

[0043] In this embodiment, it is possible to avoid using an adhesive material containing a thermally foamable adhesive, thereby reducing the environmental impact. In this embodiment, the opening area of ​​each of the plurality of recesses 102 is narrowed by the movable plate 120, but this is not limited to this, and for example, the opening area of ​​each of the plurality of recesses 102 may be narrowed by a mesh-like movable member.

[0044] (Experimental example) Below, we will explain the results of an experiment in which the hardness of the bottom surface 104 was changed, the base body 10 and the functional member 11 were abutted together, and whether or not a portion of the functional member 11 could be attached to one side of the base body 10, and whether or not the other side of the base body 10 was damaged, were confirmed.

[0045] The experimental conditions were set as follows. The dimensions of the electronic component element 10 were 1.35 mm in length, 0.75 mm in width, and 0.74 mm in thickness. The thickness of the functional member 11 was 30 μm. The thickness of the elastic body 220 of the contact mechanism 200 was 250 μm, and the Asker C hardness of the elastic body 220 was 50 degrees. The load per chip applied by the contact mechanism 200 was 0.027 kN. The hardness of the bottom surface portion 104 was measured using a Shore A hardness tester.

[0046] Fig. 8 is a cross-sectional view showing the state in which the Shore A hardness of the bottom surface portion is being measured. As shown in Fig. 8, the Shore A hardness of the bottom surface portion 104 was measured at 10 locations by pressing the indenter 21 of the Shore A hardness tester 20 against the bottom surface portion 104, and the average value of the measurements at the 10 locations was taken as the Shore A hardness of the bottom surface portion 104.

[0047] [Table 1]

[0048] As shown in Table 1, when the Shore A hardness (HS) of the bottom surface portion 104 was 15 or more and 66 or less, it was possible to apply a part of the functional member 11 to one surface of the element body 10, and no damage was observed on the other surface of the element body 10. When the Shore A hardness (HS) of the bottom surface portion 104 was 10, it was not possible to apply a part of the functional member 11 to one surface of the element body 10. When the Shore A hardness (HS) of the bottom surface portion 104 was 73 or more, damage was observed on the other surface of the element body 10.

[0049] From the above experimental results, it was confirmed that when the Shore A hardness (HS) of the bottom surface portion 104 is 15 or more and 66 or less, it is possible to attach a part of the functional member 11 to the element body 10 while suppressing damage to the element body 10.

[0050] In the above-described embodiments, configurations that can be combined may be combined with each other.

[0051] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0052] 1 Manufacturing apparatus, 10 Body, 11 Functional member, 20 Shore A hardness tester, 21 Indenter, 100 Insertion jig, 101 Main surface, 102, 111 Recess, 103, 112 Side portion, 104, 113 Bottom portion, 110 Bottom plate, 115, 220 Elastic body, 120 Movable plate, 121, 131, 141 Through hole, 122, 132, 142 Peripheral surface portion, 130 Upper plate, 140 Lead-in plate, 200 Contact mechanism, 210 Flat plate.

Claims

1. A feeding jig having a plurality of recesses formed on a main surface thereof, each recess being adapted to receive an element body of an electronic component, Each of the plurality of recesses has a side surface and a bottom surface, the hardness of the bottom surface portion is lower than the hardness of the side surface portion, A transfer jig configured to narrow the opening area of ​​each of the plurality of recesses so that the element body of the electronic component transferred into each of the plurality of recesses can be clamped while positioned on the bottom surface portion.

2. a movable plate that changes the opening area of ​​each of the plurality of recesses by moving in a direction along the main surface; a plurality of through holes are formed in the movable plate, each of which constitutes a part of each of the plurality of recesses in a first state in which an opening area of ​​each of the plurality of recesses is not narrowed; Each of the plurality of through holes is surrounded by a peripheral surface portion, 2. The transferring jig of claim 1, wherein in a second state in which the opening area of ​​each of the plurality of recesses is narrowed by the movable plate, the base body of the electronic component transferred into each of the plurality of recesses is positioned on the bottom surface portion and can be clamped between the side surface portion and the peripheral surface portion.

3. 3. The transferring jig according to claim 1, wherein the bottom surface portion has a Shore A hardness (HS) of 15 or more and 66 or less.

4. clamping, with a feeding jig, element bodies of electronic components that are respectively fed into a plurality of recesses and positioned on bottom surfaces of the plurality of recesses; abutting the base body of the electronic component held by the transfer jig against a functional member and applying a portion of the functional member to the base body.

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