Holding plate and cleaning device

Abstract

To provide a holding plate capable of holding and cleaning a workpiece in a non-contact manner without requiring replacement of a special table and without causing a decrease in productivity, and provide a cleaning device capable of easily installing the holding plate.SOLUTION: A holding table 20 which is interposed between a table 4 and a workpiece W held by the table 4 to support the workpiece W in a non-contact manner with respect to the table 4 includes: a held surface held by the table 4; a support surface which supports at least a part of an outer edge part of the workpiece in a state where a central part of the workpiece W is held in the non-contact manner with respect to the table 4 on the opposite side of the held surface; and a gripping member 21 which holds at least a part of an outer edge part of the workpiece W supported on the support surface. A cleaning device further includes fixing means (a suction port 4a and a clamp 6) for detachably fixing a holding plate 20 to the table 4.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a holding plate that is interposed between a table and a workpiece held on the table to support the workpiece without contacting the table, and to a cleaning device on which the holding plate can be installed. [Background technology]

[0002] For example, in the manufacturing process of semiconductor devices such as ICs and LSIs used in electronic devices, the backside of a wafer is ground by a grinding machine to thin the wafer to a predetermined thickness in order to reduce the size and weight of the semiconductor device. Then, the wafer with the ground backside is cut by a cutting machine along grid-like planned dividing lines called streets to obtain multiple semiconductor chips.

[0003] Here, since processing debris such as grinding debris and cutting debris adhere to wafers ground by a grinding device or wafers cut by a cutting device and contaminate the wafers, the processed wafers are cleaned and removed by a cleaning device. That is, in the cleaning device, the wafer is held on a table and rotated at high speed, and cleaning water is sprayed onto the upper surface of the wafer. The cleaning water is spread over the entire upper surface of the wafer by the centrifugal force of the wafer rotating at high speed, and the processing debris adhering to the upper surface of the wafer is blown outward in the radial direction from the outer periphery of the wafer together with the cleaning water and removed (see, for example, Patent Documents 1 and 2).

[0004] Incidentally, when a wafer having protruding bumps on its back surface, opposite the front surface on which devices are formed, is held backside down on the table of a cleaning device, the area of ​​the wafer where the bumps are formed must be held without contacting the table. In such cases, it was necessary to replace the table with a special one that can hold the back surface of the wafer without contacting it. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-128359 [Patent Document 2] Japanese Patent Application Laid-Open No. 2016-207800 Summary of the Invention [Problem to be solved by the invention]

[0006] However, as in the past, replacing a special table that can hold a wafer without contact required a great deal of time and effort, which led to a problem of reduced productivity.

[0007] The present invention has been made in consideration of the above problems, and its purpose is to provide a holding plate that can hold and clean a workpiece without contact, without requiring the replacement of a special table and without reducing productivity, and a cleaning device that can easily install the holding plate. [Means for solving the problem]

[0008] The present invention is a holding plate that is interposed between a table and a workpiece held on the table and supports the workpiece without contacting the table, and is characterized by comprising a held surface that is held on the table, a support surface on the opposite side of the held surface that supports at least a portion of the outer end of the workpiece while keeping the central portion of the workpiece out of contact with the table, and a holding portion that holds at least a portion of the outer end of the workpiece supported on the support surface.

[0009] The present invention also provides a cleaning device comprising a table onto which the holding plate can be installed and which rotates while holding the center of the workpiece without contact with a holding surface via the holding plate, and a spray nozzle which sprays cleaning fluid toward the workpiece held on the holding surface of the table, and which is characterized by comprising a fixing means for removably fixing the holding plate to the table. [Effects of the Invention]

[0010] With the holding plate of the present invention, workpieces that cannot be cleaned with their entire underside in contact with the top surface of the table of the cleaning device can be cleaned by attaching the holding plate to the table.In this case, there is no need to replace the table with a special table as in the past, which saves the time and effort required to replace the table, and the workpieces can be cleaned efficiently in a short amount of time, thereby increasing productivity.

[0011] Furthermore, with the cleaning device according to the present invention, when the holding plate is placed on the top surface of the table, the holding plate can be easily and efficiently fixed to the top surface of the table in the same way as a normal workpiece that does not have any protrusions such as bumps on its underside is fixed to a table, for example, by suction due to negative pressure generated at a suction port opening on the top surface of the table that constitutes the fixing means and by holding it with a clamp that operates by centrifugal force caused by the rotation of the table.This eliminates the time and effort required to change to another table, and allows the workpiece to be cleaned efficiently in a short amount of time, thereby increasing productivity. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a cutaway perspective view of a cleaning device in which a holding plate according to the present invention can be installed. [Figure 2] FIG. 2 is a plan view of the holding plate according to the first embodiment of the present invention. [Figure 3] FIG. 3 is an enlarged cross-sectional view taken along the line AA in FIG. 2. [Figure 4] FIG. 3 is an enlarged cross-sectional view taken along the line BB in FIG. 2. [Figure 5] 1 is a plan view showing a state in which a workpiece is held on a table using a holding plate according to a first embodiment of the present invention. FIG. [Figure 6] FIG. 6 is an enlarged cross-sectional view taken along the line CC in FIG. 5. [Figure 7] FIG. 6 is an enlarged cross-sectional view taken along the line DD in FIG. 5. [Figure 8]1A to 1C are diagrams showing a workpiece, in which (a) is a plan view, (b) is a side view, and (c) is a bottom view. [Figure 9] FIG. 10 is a plan view of a holding plate according to a second embodiment of the present invention. [Figure 10] FIG. 10 is an enlarged cross-sectional view taken along the line EE in FIG. 9. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0014] [Cleaning equipment configuration] First, the configuration of a cleaning device in which a holding plate according to the present invention can be installed will be described with reference to FIG.

[0015] The cleaning device 1 shown in Fig. 1 cleans a workpiece that has been machined by a processing device (not shown), such as a grinding device or a cutting device, and removes machining debris and the like adhering to the machined surface (top surface) of the workpiece. A cylindrical cleaning case 3 with a bottom is accommodated in the upper part of the interior of a housing 2. The cleaning case 3 is open at the top and contains a disk-shaped table 4 that rotates while holding a machined workpiece W (shown in Fig. 8) and an injection nozzle 5 that injects a cleaning fluid toward the machined surface (top surface) of the workpiece W. A rotation shaft 4A extends vertically downward from the center of the table 4, and this rotation shaft 4A is rotated together with the table 4 at a predetermined speed around its vertical central axis by a drive source (not shown), such as an electric motor, connected to the rotation shaft 4A.

[0016] The circular upper surface of the table 4 forms a holding surface that holds the rectangular workpiece W shown in Fig. 8 via holding plate 20 shown in Fig. 2 or holding plate 30 shown in Fig. 9, and suction ports 4a are opened at four locations on the same circle on this holding surface at equal angular pitches (90° pitches) in the circumferential direction. Although not shown, the four suction ports 4a are selectively connected to a suction source (not shown), such as a vacuum pump or an ejector.

[0017] Clamps 6 are attached at four locations on the outer periphery of table 4 (at intermediate positions between two adjacent suction ports 4a in the circumferential direction) at equal angular intervals (90° intervals). As shown in FIG. 6, each clamp 6 has its middle portion supported by a shaft 8 at the tip of a bracket 7 that extends horizontally radially outward from the outer periphery of table 4 so as to be rotatable up and down, with one end forming a pressing portion 6A and the other end forming a weight portion 6B. The four suction ports 4a and clamps 6 form a holding means for suction-holding a workpiece other than workpiece W shown in FIG. 8 on the holding surface of table 4, or a fixing means for detachably fixing holding plate 20 shown in FIG. 2 or holding plate 30 shown in FIG. 9 to the holding surface of table 4.

[0018] 1, a hollow rotary shaft 9 is provided vertically near the table 4, and an arm 10 extends horizontally from the upper end of the rotary shaft 9. A jet nozzle 5 is attached to the tip of the arm 10 with its jet outlet (not shown) facing downward. The length of the arm 10 is set to a value that allows the jet nozzle 5 attached to its tip to move above the center of the holding surface of the table 4.

[0019] As shown in Fig. 1, the lower half of the interior of the housing 2 accommodates a rectangular box-shaped filtration tank 11 that stores cleaning water as a cleaning water supply source, a filter 12, a pump 13, and a bubble generator 14. Pipe a extending from an outlet 11a that opens at the bottom of the filtration tank 11 is connected to the bottom of the filter 12, and pipe b extending from the top of the filter 12 is connected to an intake port 13a of the pump 13. Pipe c extending from a discharge port 13b of the pump 13 is connected to the bottom of the bubble generator 14, and pipe d extending upward from the top of the bubble generator 14 is connected to the rotating shaft 9. Pure water is preferably used as the cleaning water.

[0020] In the cleaning apparatus 1 configured as described above, when the workpiece is a normal disc-shaped wafer or the like, and the workpiece is to be cleaned by being sucked and held on the holding surface of the table 4 so that the entire underside of the workpiece is in close contact with the holding surface, the workpiece can be held and cleaned directly on the upper surface of the table 4 without using the holding plate 20 shown in FIG. 2 or the holding plate 30 shown in FIG. 9.

[0021] That is, when a workpiece (not shown) is placed on the holding surface of table 4 and four suction ports 4a opening on the holding surface of table 4 are connected to a suction source (not shown), the workpiece is sucked and held on the top surface of table 4 by the negative pressure generated at each suction port 4a. When table 4 is then rotated at high speed together with the workpiece, centrifugal force causes the weight portion 6B of each clamp 6 to bounce up, causing the holding portion 6A of each clamp 6 to press down on the top surface of the workpiece, and the workpiece is fixed at four points on its periphery by the clamps 6. Therefore, the workpiece is held on the top surface of table 4 by suction due to the negative pressure generated at the four suction ports 4a and by fixation by the four clamps 6. Then, while the workpiece is held on table 4 and rotating at high speed in this manner, the top surface of the workpiece is cleaned by the cleaning fluid (actually, a mixture of air bubbles and cleaning water, as described below) sprayed from spray nozzle 5 onto the top surface of the workpiece.

[0022] However, for example, in the case of a workpiece W having a large number of bumps B protruding from its underside as shown in Fig. 8, the workpiece W cannot be held with the entire underside in close contact with the table 4 of the cleaning apparatus 1. Here, the details of such a workpiece W will be explained based on Fig. 8. As shown in Fig. 8(a), a rectangular substrate T such as a wafer of the workpiece W has a plurality of (ten in the illustrated example) rectangular devices D such as ICs or LSIs mounted on its front surface (top surface), and as shown in Figs. 8(b) and 8(c), a plurality of (ten in the illustrated example for each) bumps B protruding from the back surface (bottom surface) of each device D.

[0023] Therefore, for cleaning the workpiece W as shown in FIG. 8, a holding plate (for example, the holding plate 20 shown in FIG. 2 or the holding plate 30 shown in FIG. 9) described below is used, and each of the holding plates will be described below.

[0024] [Retaining Plate] First Embodiment First, the holding plate 20 according to the first embodiment will be described below with reference to FIGS.

[0025] As shown in FIG. 2, the holding plate 20 according to the first embodiment includes a plate body 20A formed in a generally ring shape. As shown in FIGS. 3 and 4, the upper surface of the plate body 20A forms a support surface 20a that supports the outer end of the workpiece W, and the lower surface forms a held surface 20b where the holding plate 20 is held on the table 4 of the cleaning apparatus 1 (see FIGS. 3 and 4). A complex-shaped cavity S is formed in the center of the plate body 20A. Four linearly cut straight portions 20c are formed at equal angular intervals (90° intervals) in the circumferential direction at four locations on the outer periphery of the plate body 20A. Trapezoidal first recesses S1 of the cavity S are formed radially inward of the four locations where these straight portions 20c are formed. Rectangular second recesses S2 are formed radially inward of each first recess S1 of the cavity S, and are continuous with the first recesses S1.

[0026] Incidentally, a total of four workpieces W are set and supported at the four locations where the second recesses S2 are formed on the support surface 20a, which is the upper surface of the plate main body 20A, as shown in Fig. 5, and gripping members 21 constituting holding parts that hold the outer ends of the workpieces W are respectively installed at the four locations on the support surface (upper surface) 20a of the plate main body 20A. Here, the four gripping members 21 are arranged point-symmetrically with respect to the center of the holding plate 20, as shown in Fig. 2, and two pairs of gripping members 21 are arranged so as to face each other radially.

[0027] Here, each gripping member 21 is made up of a leaf spring, and as shown in Figure 3, it is composed of a base end 21a fixed to the support surface 20a, which is the upper surface of the plate main body 20A, a vertical portion 21b that stands vertically upward from the base end 21a, and a bifurcated spring portion 21c that extends diagonally downward from the upper end of the vertical portion 21b so as to straddle the first recess S1 of the hollow portion S, and the tip of each spring portion 21c respectively forms a V-shaped pressing portion 21d that presses against the upper surface of the outer end of the workpiece W.

[0028] 2, a pair of guide members 22 for supporting the short-side side surfaces of the workpieces W are installed on both sides of the support surface 20a, which is the upper surface of the plate body 20A, straddling each second recess S2. Here, as shown in FIG. 4, each guide member 22 has a fitting groove 22a formed on the inner surfaces facing each other across the second recess S2 of the hollow portion S, along the longitudinal direction (the direction perpendicular to the plane of the paper in FIG. 4), into which the outer end of each workpiece W fits.

[0029] Therefore, when cleaning a workpiece W such as that shown in Figure 8 in a cleaning device, the table 4 does not need to be replaced with a special one, and the workpiece W shown in Figure 8 can be cleaned as follows by setting the holding plate 20 on the top surface of the table 4.

[0030] That is, the holding plate 20 is placed on the upper surface of the table 4 of the cleaning device 1 with the held surface (lower surface) 20b facing downward, and four suction ports 4a (see FIG. 1) opening on the upper surface of the table 4 are connected to a suction source (not shown). Then, a negative pressure is generated at each suction port 4a by the suction source, and the holding plate 20 is attracted by this negative pressure and held on the upper surface of the table 4. Then, as shown in FIG. 5, four workpieces W are set on the holding plate 20 thus held on the upper surface of the table 4. That is, the short-side ends of each workpiece W are fitted into the corresponding fitting grooves 22a (see FIG. 7) of the pair of guide members 22 of the holding plate 20 to position the workpiece W. Then, the workpiece W is slid radially outward, and the outer ends of the long sides of the workpieces W are fitted between the pressing portion 21d of the gripping member 21 and the support surface 20a, which is the upper surface of the holding plate 20, as shown in FIG. 6, and the outer ends are clamped between the pressing portion 21d of the gripping member 21 and the holding plate 20.

[0031] Then, each workpiece W is set on the holding plate 20 with a pair of ends on its short sides and one (radially outward) outer end on its long sides held by the holding plate 20, but when the workpiece W is set on the holding plate 20 in this manner, the center of the workpiece W (the part indicated by W1 in FIG. 5) faces the hollow portion S of the holding plate 20 and is therefore not in contact with the holding plate 20. Note that one of the outer ends on the long sides of each workpiece W (radially inward) is not supported in any way and is in a free state.

[0032] Thus, when the workpiece W is supported by the holding plate 20 installed on the table 4 as described above, by connecting the four suction ports 4a (see FIG. 5) opening on the holding surface of the table 4 to a suction source (not shown), the negative pressure generated at each suction port 4a causes the holding plate 20 to be sucked and held on the top surface of the table 4. Thereafter, when the table 4 is rotated at high speed around the center of the rotation axis 4A by a rotation mechanism (not shown), the weight portion 6B of each clamp 6, which was in a vertical position when stationary as shown by the chain line in FIG. 6, jumps up in the direction of the arrow due to centrifugal force, and the pressing portion 6A of each clamp 6 presses down on the top surface of the holding plate 20, and the four points on the outer periphery of the holding plate 20 are fixed by the clamps 6.

[0033] Therefore, the holding plate 20 is held on the top surface of the table 4 together with the four workpieces W by suction due to the negative pressure generated in the four suction ports 4a and by fixation by the four clamps 6. Then, in this state in which the holding plate 20 together with the workpieces W is held on the table 4 and rotates at high speed, the top surface of each workpiece W is cleaned by the cleaning fluid (actually, a mixed fluid of air bubbles and cleaning water (two-fluid or nanobubble water) as described below) sprayed from the spray nozzle 5 onto the top surface of the workpieces W.

[0034] 1 is driven, the cleaning water in the filtration tank 11 flows through pipe a into the filter 12 and is purified while passing through the filter 12. The cleaning water that has been purified by passing through the filter 12 is then guided into the pump 13 from the intake port 13a of the pump 13 through pipe b, and after being pressurized by the pump 13, flows from the discharge port 13b to pipe c and is introduced into the bubble generator 14.

[0035] The cleaning water that flows into the bubble generator 14 becomes mixed with many small air bubbles that are generated in the bubble generator 14 due to the generation of cavitation, turning it into cleaning water containing air bubbles, that is, a mixed fluid of air and cleaning water, and this mixed fluid passes through the insides of the piping d, the rotating shaft 9, and the arm 10 and is supplied to the jet nozzle 5 at the tip of the arm 10. Here, when cleaning the workpiece W, the rotating shaft 9 is rotated by a rotation mechanism (not shown), so that the arm 10 extending horizontally from the upper end of the rotating shaft 9 and the jet nozzle 5 attached to the tip of the arm 10 rotate horizontally around the rotating shaft 9, and the jet nozzle 5 is positioned so that its jet port (not shown) opens toward the workpiece W.

[0036] Thus, as described above, when the mixed fluid is supplied to the injection nozzle 5, the injection port of which opens toward the workpieces W, the mixed fluid is injected from the injection port of the injection nozzle 5 toward the workpieces W, which are rotating at high speed. The mixed fluid then spreads over the entire upper surface of each workpiece W due to the centrifugal force of the workpieces W, which are rotating at high speed, and the machining chips adhering to the upper surface of each workpiece W are washed away by the mixed fluid. Thereafter, when the table 4 is rotated at an even higher speed together with the holding plate 20 and the workpieces W, the centrifugal force acting on the mixed fluid causes the mixed fluid to be blown radially outward from the outer edge of each workpiece W, and the upper surface of each workpiece W dries.

[0037] As described above, cleaning of a workpiece W as shown in FIG. 8, which has protruding bumps B on its underside and therefore cannot be done with the entire underside in close contact with the top surface of the table 4 of the cleaning device 1, can be done by installing a holding plate 20 on the table 4. In this case, there is no need to replace the table 4 with a special table as in the past, which saves the time and effort required to replace the table, and the workpiece W can be cleaned efficiently in a short time, which ultimately results in increased productivity.

[0038] Furthermore, with the cleaning device 1 according to this embodiment, when the holding plate 20 is placed on the upper surface of the table 4, it can be easily and efficiently fixed to the upper surface of the table 4 in the same way as fixing a normal workpiece that does not have any protrusions such as bumps on its underside to the table 4 by suction due to the negative pressure generated in the suction port 4a that constitutes the fixing means and by holding it with the clamp 6 that operates by the centrifugal force caused by the rotation of the table 4, thereby also improving productivity.

[0039] In addition, in this embodiment, as shown in FIG. 2, the four gripping members 21 are arranged point-symmetrically around the center of the holding plate 20, so that the weight balance of the holding plate 20 is well maintained, and even when the holding plate 20 rotates at high speed, vibrations are kept small.

[0040] Second Embodiment Next, a holding plate 30 according to a second embodiment will be described below with reference to FIGS.

[0041] As shown in Fig. 9, the holding plate 30 according to the second embodiment also has a substantially ring-shaped plate body 30A, similar to the holding plate 20 according to the first embodiment. As shown in Fig. 10, the upper surface of this plate body 30A forms support surfaces 30a that support the outer corners of four workpieces W, and the lower surface forms a held surface 30b where the holding plate 30 is held on the table 4 (see Fig. 1) of the cleaning apparatus 1. A complex-shaped cavity S is formed in the center of this plate body 30A. In addition, linearly cut straight portions 30c are formed at four locations on the outer periphery of the plate body 30A at equal angular intervals (90°) in the circumferential direction, and rectangular first recesses S1 and second recesses S2 of the cavity S are formed radially inward of the four locations where these straight portions 30c are formed.

[0042] 8 are set and supported on the support surface 30a, which is the upper surface of the plate body 30A on which the second recesses S2 are formed, as shown by the chain lines in Fig. 9 (only one workpiece W is shown by the chain line in Fig. 9), and support members 31, which are L-shaped in plan view and form holding portions that hold the outer corners of each workpiece W, are installed around the four second recesses S2 on the support surface 30a of the plate body 30A. Here, the four support members 31 are arranged point-symmetrically with respect to the center of the holding plate 30, as shown in Fig. 9, and two pairs of support members 31 are arranged so as to face each other radially.

[0043] Therefore, when cleaning a workpiece W such as that shown in FIG. 8 in the cleaning device 1 shown in FIG. 1, the workpiece W can be cleaned as follows by setting the holding plate 30 on the top surface of the table 4 without replacing the table 4 with a special one.

[0044] That is, the holding plate 30 is placed on the upper surface of the table 4 of the cleaning device 1 with the held surface 30b facing downward, and four suction ports 4a (see FIG. 1) opening on the upper surface of the table 4 are connected to a suction source (not shown). Then, a negative pressure is generated at each suction port 40a by the suction source, and the holding plate 30 is sucked and held on the upper surface of the table 4 by this negative pressure. Then, four workpieces W are set on the holding plate 30 thus sucked and held on the upper surface of the table 4. That is, each workpiece W is supported horizontally at four points on the holding plate 30 with the outer corners of each workpiece W abutting against each of the four support members 31 and positioned (see FIG. 10).

[0045] Each workpiece W is then set on the holding plate 30 with its outer corners positioned and held by the holding plate 30. When each workpiece W is set on the holding plate 30 in this manner, the central portion of the workpiece W (the portion indicated by W1 in Figure 9) faces the second recess S2 of the hollow portion S of the holding plate 30 and is therefore not in contact with the holding plate 30.

[0046] Thus, when the workpiece W is supported by the holding plate 30 installed on the table 4 as described above, by connecting the four suction ports 4a (see FIG. 1) opening on the holding surface of the table 4 to a suction source (not shown), the holding plate 30 is sucked and held on the top surface of the table 4 by the negative pressure generated at each suction port 4a. Then, when the table 4 shown in FIG. 1 is rotated at high speed around the center of the rotation axis 4A by a rotation mechanism (not shown), the four clamps 6 shown in FIG. 1 are actuated by centrifugal force to press the outer periphery of the upper surface of the holding plate 30, respectively, as described above, and the four locations on the outer periphery of the holding plate 30 are fixed by the clamps 6. The number of suction ports 4a arranged on the table 4 is not limited to four. For example, if the hollow portion S of the holding plate 30 of this embodiment is a dense body, a single suction port may be arranged to suck this portion.

[0047] Therefore, the holding plate 30 is held on the top surface of the table 4 together with the four workpieces W by suction due to the negative pressure generated in the four suction ports 4a and by fixation by the four clamps 6. Then, in this state in which the holding plate 30 is held on the table 4 together with the workpieces W and rotates at high speed, the top surface of each workpiece W is cleaned by the cleaning fluid (actually, a mixed fluid of air bubbles and cleaning water) sprayed onto the top surface of the workpieces W from the spray nozzle 5 shown in Fig. 1. Note that cleaning of each workpiece W with the mixed fluid is performed in the same manner as described above, so a repeated explanation of this will be omitted.

[0048] Therefore, by using the holding plate 30 of this embodiment, it is possible to clean a workpiece W as shown in Figure 8, which has protruding bumps B on its underside and therefore cannot be cleaned with the entire underside in close contact with the top surface of the table 4 of the cleaning device 1.In this case, there is no need to replace the table 4 with a special table as in the conventional case, so the time and effort required to replace the table can be saved, and the workpiece W can be cleaned efficiently in a short time, resulting in increased productivity.

[0049] Furthermore, in this embodiment, the holding plate 30 is fixed to the table 4 with the holding plate 30 placed on the top surface of the table 4, and is held by the clamp 6 which operates by suction due to negative pressure generated in the suction port 4a which constitutes the fixing means and centrifugal force due to the rotation of the table 4. This allows the holding plate 30 to be fixed to the top surface of the table 4 easily and with good workability, in the same way as fixing a normal workpiece which does not have any protrusions such as bumps on the underside to the table 4, thereby also improving productivity.

[0050] In addition, in this embodiment, as shown in FIG. 9, the four support members 31 are arranged so as to be point-symmetrical about the center of the holding plate 30, so that the weight balance of the holding plate 30 is well maintained, and even when the holding plate 30 rotates at high speed, vibrations are kept small.

[0051] In the above embodiment, the holding plates 20, 30 used to clean the rectangular workpiece W shown in FIG. 8 and the cleaning device 1 on which the holding plates 20, 30 can be installed have been described. However, the holding plates and cleaning device of the present invention can also be applied to cleaning any other workpiece that needs to be partially held in non-contact with the table and cleaned.

[0052] Furthermore, the present invention is not limited to the application of the above-described embodiments, and it goes without saying that various modifications are possible within the scope of the claims and the technical ideas described in the specification and drawings. [Explanation of symbols]

[0053] 1: cleaning device, 2: housing, 3: cleaning case, 4: table, 4A: rotating shaft, 4a: suction port, 5: injection nozzle, 6: clamp, 6A: clamp holding part, 6B: weight part of clamp, 7: bracket, 8: shaft, 9: rotating shaft, 10: arm, 11: filtration tank, 11a: outlet of filtration tank, 12: filter, 13: pump, 13a: pump suction port; 13b: pump discharge port; 14: bubble generator; 20: holding plate, 20A: plate body, 20a: supporting surface, 20b: held surface, 20c: straight portion, 21: gripping member (holding portion), 21a: base end portion, 21b: vertical portion, 21c: spring portion, 21d: pressing portion, 22: guide member, 22a: fitting groove, 30: holding plate, 30A: plate body, 30a: supporting surface, 30b: held surface, 30c: straight portion, 31: support member (holding portion), a to d: piping, B: bump, D: device, S: cavity, S1: first recess, S2: second recess, T: substrate, W: workpiece, W1: Non-contact part of workpiece

Claims

1. A holding plate is interposed between a table and a workpiece held on the table to support the workpiece without contacting the table, a held surface held by the table; a support surface that supports at least a part of the outer end of the workpiece on the opposite side of the held surface while keeping the central portion of the workpiece out of contact with the table; a holding portion that holds at least a portion of the outer end portion of the work supported on the support surface; A holding plate comprising:

2. 2. The holding plate according to claim 1, wherein the holding portion is formed of a gripping portion that presses against an upper surface of the workpiece to grip the workpiece between the support surface and the workpiece.

3. 2. The holding plate according to claim 1, wherein the holding portion is composed of a plurality of support members that support at least two corners of the workpiece.

4. 2. The holding plate according to claim 1, wherein at least two of the holding portions are arranged opposite each other and symmetrically about the center of the table.

5. A cleaning device comprising: a table on which the holding plate according to any one of claims 1 to 4 can be installed, which rotates while holding a central portion of a workpiece by a holding surface via the holding plate in a non-contact manner; and a spray nozzle that sprays a cleaning fluid toward the workpiece held on the holding surface of the table, A cleaning apparatus comprising: a fixing means for detachably fixing the holding plate to the table.

Images