Adhering device

Abstract

To realize a good bonding state over an entire region between bonding surfaces of two workpieces.SOLUTION: An adhering device includes: a support mechanism; a seal mechanism; and an internal pressure adjustment mechanism. The support mechanism supports a first workpiece and a second workpiece in a chamber in a state in which their bonding surfaces face each other. The sealing mechanism makes it possible to selectively form, in the chamber, a sealed state in which the first region and the second region are sealed and a released state in which the seal between the two regions is released. An internal pressure adjusting mechanism is a mechanism that adjusts an internal pressure of the chamber, and is configured to be capable of individually adjusting the internal pressure of a first region and the internal pressure of a second region when the sealed state is formed by the sealing mechanism. The support mechanism and the seal mechanism are configured to support the first workpiece while a back surface of the first workpiece is exposed to the second region and to form the sealed state.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a bonding technique for workpieces such as wafers and substrates. [Background technology]

[0002] Patent Document 1 discloses a technique for bonding two workpieces (such as wafers or substrates) together with an adhesive. Specifically, the technique involves sandwiching the two workpieces between two holders (holding parts that chuck the two workpieces, respectively) with an adhesive between them, and then applying pressure to the back surfaces of the two workpieces to bond them together. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-27118 Summary of the Invention [Problem to be solved by the invention]

[0004] On the other hand, with the above technology disclosed in Patent Document 1, pressure can only be applied indirectly to the back surface of the workpiece via the holding part. Therefore, the structure and strength of the holding part itself, as well as the structure of the transmission mechanism that transmits force to the holding part, are likely to affect how pressure is applied to the back surface of the workpiece, which causes the problem of making it difficult to apply pressure evenly to the back surface of the workpiece (the surface opposite to the bonding surface). This problem makes it difficult to achieve a good bonding state across the entire bonding surface of the two workpieces.

[0005] SUMMARY OF THE INVENTION An object of the present invention is to provide a method for obtaining a good bonding state over the entire bonding surface of two workpieces. [Means for solving the problem]

[0006] A bonding device according to the present invention is a bonding device that bonds a first workpiece and a second workpiece in a chamber, and includes a support mechanism, a sealing mechanism, and an internal pressure adjustment mechanism (Aspect 1). The support mechanism supports the first workpiece and the second workpiece in the chamber with their bonding surfaces facing each other. The sealing mechanism enables selective formation of a sealed state in the chamber, in which a first region including the region on the bonding surface side of the first workpiece and a second region including the region on the back side of the first workpiece are sealed, and an unsealed state in which the seal between these two regions is released. The internal pressure adjustment mechanism adjusts the internal pressure of the chamber, and is configured to be able to individually adjust the internal pressure of the first region and the internal pressure of the second region when the sealed state is formed by the sealing mechanism. The support mechanism and the sealing mechanism are configured to support the first workpiece while leaving the back side of the first workpiece exposed to the second region, and to be able to form a sealed state.

[0007] According to the first aspect, when a sealed state (a state in which the first and second regions are sealed) is formed, the back surface of the first workpiece can be exposed to the second region, and by increasing the internal pressure of the second region, it becomes possible to directly and evenly pressurize the back surface of the first workpiece with the gas in the second region. Also, by making the internal pressure of the second region higher than the internal pressure of the first region, it becomes possible to use the resulting pressure difference to evenly press the first workpiece toward the second workpiece.

[0008] The bonding apparatus according to Aspect 1 may have the following configuration (Aspect 2). The support mechanism may include a ring portion that supports the peripheral portion of the first workpiece from below, and a stage portion that supports the second workpiece below the first workpiece. The first workpiece may be supported by the ring portion with its bonding surface facing downward, and the second workpiece may be supported by the stage portion with its bonding surface facing upward. The sealing mechanism may also include an annular sealing portion that sandwiches the peripheral portion of the first workpiece between the ring portion and the sealing portion from above, thereby dividing the interior of the chamber into two regions, an inside and an outside of the sealing portion, and sealing between these regions, such that the inside region of the sealing portion forms the second region, and the outside region of the sealing portion forms the first region.

[0009] According to the above-mentioned aspect 2, by supporting the peripheral portion of the first work from below with the ring portion, it is possible to reliably prevent the first work from falling inside the chamber while leaving the portion of the bonding surface (lower surface) of the first work where the second work is to be bonded exposed and not blocked.

[0010] Furthermore, by sandwiching the peripheral edge of the first workpiece between the annular seal and the ring portion from above, it becomes possible to fix the first workpiece onto the ring portion while forming a sealed state in two areas, the inside and outside of the seal portion (the inside second area and the outside first area).This not only makes it possible to use the differential pressure between the first area and the second area to evenly press the first workpiece toward the second workpiece, but also makes it possible to prevent the first workpiece from shifting position or becoming loose, which may occur at that time.

[0011] The bonding apparatus according to Aspect 1 may have the following configuration (Aspect 3). The support mechanism may include a ring portion that supports the peripheral portion of the first workpiece from below and a chuck portion that chucks the second workpiece above the first workpiece, and the first workpiece may be supported by the ring portion with its bonding surface facing upward, and the second workpiece may be chucked by the chuck portion with its bonding surface facing downward. The sealing mechanism may also include an annular sealing portion that sandwiches the peripheral portion of the first workpiece between the ring portion and the sealing portion from above, thereby dividing the interior of the chamber into two regions, an inside and an outside of the sealing portion, and sealing between these regions, so that the inside region of the sealing portion forms the first region and the outside region of the sealing portion forms the second region.

[0012] According to the above-mentioned aspect 3, by supporting the peripheral portion of the first work from below with the ring portion, it is possible to reliably prevent the first work from falling inside the chamber while leaving exposed the portion of the back surface (bottom surface) of the first work that needs to be pressurized (the portion that overlaps with the entire second work when viewed in a plan view from above or below).

[0013] Furthermore, by sandwiching the peripheral edge of the first workpiece between the annular seal and the ring portion from above, it becomes possible to fix the first workpiece onto the ring portion while forming a sealed state in two areas, the inside and outside of the seal portion (the inside first area and the outside second area).This not only makes it possible to use the differential pressure between the first area and the second area to evenly press the first workpiece toward the second workpiece, but also makes it possible to prevent the first workpiece from shifting position or becoming loose, which may occur at that time.

[0014] The bonding apparatus according to the above-mentioned aspect 2 or 3 may further include a control unit that performs the following process (aspect 4). After the first workpiece and the second workpiece are supported by the support mechanism, the control unit controls the internal pressure adjustment mechanism to reduce the internal pressure of the chamber to a predetermined pressure before causing the sealing mechanism to form a sealed state. Then, the control unit controls the sealing mechanism to form a sealed state. Thereafter, the control unit controls the internal pressure adjustment mechanism to increase the internal pressure of the second region to be higher than the internal pressure of the first region.

[0015] According to the above-mentioned aspect 4, the internal pressure of the chamber (in other words, the internal pressure of both the first and second regions) is reduced to a predetermined pressure to increase the degree of vacuum before forming a sealed state, and then the first workpiece and the second workpiece are bonded together, thereby making it possible to prevent air bubbles from being trapped between the first workpiece and the second workpiece, which would hinder bonding.

[0016] The bonding device according to Aspect 4 above may have the following configuration (Aspect 5). The ring portion may be configured so that, when viewed in plan from above or below, a space of a predetermined width is formed between the ring portion and the second workpiece supported by the support mechanism, and a first workpiece of a size that can be supported by the ring portion may be used. The control unit may then increase the internal pressure of the second region to be higher than the internal pressure of the first region, thereby utilizing the space of the predetermined width to deflect the peripheral edge of the first workpiece toward the first region.

[0017] According to the above-mentioned aspect 5, by bending the peripheral portion of the first workpiece toward the first region, it is possible to improve poor bonding between the peripheral portion of the second workpiece (a workpiece smaller in size than the first workpiece) and the first workpiece.

[0018] In the bonding device according to any one of the above-mentioned aspects 2 to 5, the support mechanism may include a fixing portion that temporarily fixes the first workpiece by clamping the peripheral portion of the first workpiece between the support mechanism and the ring portion (Aspect 6).

[0019] According to the above-mentioned aspect 6, it is possible to temporarily fix the first workpiece W1 on the ring portion even before the sealed state is formed (before the first workpiece is fixed on the ring portion by the annular sealing portion), thereby making it possible to prevent the first workpiece from shifting in position or loosening, which may occur before the sealed state is formed.

[0020] The bonding device according to any one of the above-mentioned aspects 1 to 6 may be provided with the following alignment mechanism (Aspect 7). This alignment mechanism adjusts the positional relationship between the first workpiece and the second workpiece based on an image captured by a camera from the second region side.

[0021] In the above-mentioned laminating device, the first workpiece can be supported and sealed while the back surface of the first workpiece is exposed to the second area, so that the back surface of the first workpiece can be photographed with a camera through the second area. Moreover, if the first workpiece itself is optically transparent, the second workpiece can also be photographed with a camera. In this way, when both the first workpiece and the second workpiece can be photographed with a camera, according to the above-mentioned aspect 7, the positional relationship between the first workpiece and the second workpiece can be determined based on the image obtained by photographing with the camera, and based on that, the alignment mechanism can adjust them so that they have the desired positional relationship. [Effects of the Invention]

[0022] According to the present invention, a good bonding state can be obtained over the entire bonding surface of two workpieces. [Brief explanation of the drawings]

[0023] [Figure 1] FIG. 1 is a conceptual diagram showing a bonding apparatus according to an embodiment. [Figure 2] 10A to 10C are conceptual diagrams showing state changes of the laminating device caused by execution of laminating processing. [Figure 3] 10A to 10C are conceptual diagrams showing state changes of the laminating device caused by execution of laminating processing. [Figure 4]10A to 10C are conceptual diagrams showing state changes of the laminating device caused by execution of laminating processing. [Figure 5] 10A to 10C are conceptual diagrams showing state changes of the laminating device caused by execution of laminating processing. [Figure 6] 10A to 10C are conceptual diagrams illustrating changes in the state of the workpiece caused by the execution of the bonding process in the embodiment. [Figure 7] 10A and 10B are conceptual diagrams showing changes in the state of the workpiece caused by the execution of the bonding process in the first modified example. [Figure 8] 10A is a conceptual diagram showing a bonding device according to a second modified example, and FIG. 10B is a conceptual diagram showing a change in state of the bonding device caused by execution of a bonding process in the second modified example. DETAILED DESCRIPTION OF THE INVENTION

[0024] [1] Implementation [1-1] Lamination device 1 is a conceptual diagram showing a bonding apparatus according to an embodiment. In this embodiment, the bonding apparatus is an apparatus that bonds two workpieces to be bonded (hereinafter, these will be referred to as a "first workpiece W1" and a "second workpiece W2" to distinguish them from each other) with a resin such as an adhesive, and includes a chamber mechanism 1, a support mechanism 2, a sealing mechanism 3, an alignment mechanism 4, an internal pressure adjustment mechanism 5, and a control unit 9. The configuration of each unit will be specifically described below.

[0025] <Chamber mechanism 1> The chamber mechanism 1 includes a first chamber forming section 11, a second chamber forming section 12, and a drive section 13.

[0026] The first chamber forming section 11 and the second chamber forming section 12 are sections that form an enclosed space (hereinafter, this enclosed space will be referred to as "chamber 10") for the bonding process of the first work W1 and the second work W2, and are configured to be able to selectively form and open the chamber 10.

[0027] Specifically, the first chamber forming section 11 and the second chamber forming section 12 are configured so that at least one of them moves vertically by the power of the drive section 13, so that they approach each other and combine to form the chamber 10, and also so that they move away from each other to open the chamber 10.

[0028] More specifically, first chamber forming section 11 is composed of first cylindrical section 111 and top plate 112. First cylindrical section 111 is disposed so that its central axis direction coincides with the vertical direction, and the upper end of first cylindrical section 111 thus disposed is closed by top plate 112. Second chamber forming section 12 is composed of second cylindrical section 121 and bottom plate 122. Second cylindrical section 121 is disposed so that its central axis direction coincides with the vertical direction, and the lower end of second cylindrical section 121 thus disposed is closed by bottom plate 122. The annular lower end surface of first cylindrical section 111 and the annular upper end surface of second cylindrical section 121 are in contact with each other without any gap, thereby forming chamber 10 between top plate 112 and bottom plate 122.

[0029] Furthermore, in this embodiment, a portion of the top plate 112 (the central portion in the example of Figure 1) is formed from an optically transparent member 140X (such as quartz) so that the inside of the chamber 10 can be photographed by a camera 40 from outside the top plate 112.

[0030] <Support mechanism 2 and sealing mechanism 3> The support mechanism 2 is a mechanism that supports the first workpiece W1 and the second workpiece W2 in the chamber 10 with their bonding surfaces F11 and F21 facing each other.

[0031] The sealing mechanism 3 is a mechanism that makes it possible to selectively form a sealed state Qs or an released state Qt within the chamber 10. Here, the sealed state Qs is a state in which a first region R1 including an area on the bonding surface F11 side of the first workpiece W1 and a second region R2 including an area on the back surface F12 side of the first workpiece W1 are sealed. On the other hand, the released state Qt is a state in which the seal between the first region R1 and the second region R2 is released.

[0032] In this embodiment, the support mechanism 2 and the sealing mechanism 3 are configured to support the first workpiece W1 while leaving the back surface F12 of the first workpiece W1 exposed to the second region R2, and to be able to form a sealed state Qs.

[0033] Specifically, the support mechanism 2 includes a ring portion 21 and a stage portion 22 .

[0034] The ring portion 21 is a portion that supports the peripheral portion of the first workpiece W1 from below. The first workpiece W1 is placed on this ring portion 21 with its bonding surface F11 facing downward. Such a ring portion 21 makes it possible to reliably prevent the first workpiece W1 from falling inside the chamber 10 while leaving the portion of the bonding surface F11 (lower surface) of the first workpiece W1 to which the second workpiece W2 is bonded exposed without blocking it.

[0035] The stage part 22 is a part that supports the second workpiece W2 below the first workpiece W1 (the first workpiece W1 supported by the ring part 21), and has a chuck function (vacuum suction, electrostatic chuck, etc.) for holding (fixing) the second workpiece W2 placed thereon. The second workpiece W2 is placed on this stage part 22 with its bonding surface F21 facing upward.

[0036] Furthermore, the sealing mechanism 3 includes an annular sealing portion 31 and a driving portion 32 .

[0037] The sealing portion 31 is a portion that divides the inside of the chamber 10 into two areas, an inside and an outside of the sealing portion 31, and seals between these areas by sandwiching the peripheral portion of the first workpiece W1 from above (from the back surface F12 side) between it and the ring portion 21. In the example of Fig. 1, the sealing portion 31 is an annular bellows that expands and contracts due to the power of the driving portion 32, and is attached to the underside of the top plate 112 so that it can sandwich the peripheral portion of the first workpiece W1 from above (from the back surface F12 side) between it and the ring portion 21 by expanding vertically downward.

[0038] With such a support mechanism 2 and sealing mechanism 3, by sandwiching the peripheral edge of the first workpiece W1 from above with the annular sealing portion 31, it becomes possible to form a second region R2 by the inner region of the sealing portion 31 (the region where the back surface F12 of the first workpiece W1 is exposed) and a first region R1 by the outer region of the sealing portion 31 (the portion leading to the region on the laminating surface F11 side of the first workpiece W1) in a sealed state Qs (see also FIG. 4(B)). Moreover, it becomes possible to fix the first workpiece W1 onto the ring portion 21.

[0039] In addition to these components, the support mechanism 2 further includes a fixing unit 23 and a driving unit 24.

[0040] The fixing portion 23 is a portion that temporarily fixes the first workpiece W1 by clamping the peripheral portion of the first workpiece W1 between itself and the ring portion 21. In the example of FIG. 1, the fixing portion 23 is configured as a stick-shaped member that moves up and down by the power of the drive portion 24, and is provided at multiple locations on the top plate 112. Then, by moving the fixing portion 23 downward, the peripheral portion of the first workpiece W1 can be clamped at multiple locations between itself and the ring portion 21 and temporarily fixed. Note that the fixing portion 23 may have a chuck function (such as vacuum suction or electrostatic chuck) for lifting the first workpiece W1 from the ring portion 21.

[0041] The fixing portion 23 makes it possible to temporarily fix the first workpiece W1 onto the ring portion 21 even before the sealing state Qs is formed (before the first workpiece W1 is fixed onto the ring portion 21 by the annular sealing portion 31), thereby making it possible to prevent misalignment or loosening of the first workpiece W1 that may occur before the sealing state Qs is formed.

[0042] <Alignment mechanism 4> The alignment mechanism 4 is a mechanism that makes it possible to adjust the positional relationship between the first workpiece W1 and the second workpiece W2. In this embodiment, the alignment mechanism 4 is configured to adjust the position of the stage unit 22 in a horizontal plane, thereby adjusting the positional relationship. The positional relationship is then adjusted based on an image captured by the camera 40 from the outside of the top plate 112 (in other words, the side of the second region R2). More specifically, this is as follows.

[0043] In this embodiment, as described above, the first workpiece W1 can be supported and the sealed state Qs can be formed while the back surface F12 of the first workpiece W1 is exposed in the second region R2. In addition, a portion of the top plate 112 (the central portion in the example of FIG. 1) is formed of an optically transparent member 140X (quartz, etc.). Therefore, the back surface F12 of the first workpiece W1 can be photographed by the camera 40 through the second region R2. Moreover, if the first workpiece W1 itself is optically transparent, the second workpiece W2 can also be photographed by the camera 40. In this way, when both the first workpiece W1 and the second workpiece W2 can be photographed by the camera 40, the positional relationship between the first workpiece W1 and the second workpiece W2 (such as the position of the alignment mark) can be determined based on the image captured by the camera 40, and the alignment mechanism 4 can adjust them to achieve the desired positional relationship.

[0044] Furthermore, in this embodiment, the alignment mechanism 4 is configured to be able to move the stage portion 22 up and down, and by moving the stage portion 22 upward, the bonding surface F21 of the second work W2 on the stage portion 22 can be brought close to or into contact with the bonding surface F11 of the first work W1 supported by the ring portion 21.

[0045] <Internal pressure adjustment mechanism 5> The internal pressure adjustment mechanism 5 is a mechanism that adjusts the internal pressure of the chamber 10. In this embodiment, the internal pressure adjustment mechanism 5 is configured to be able to individually adjust the internal pressure of the first region R1 and the internal pressure of the second region R2 when the sealing state Qs is formed by the sealing mechanism 3.

[0046] Specifically, the internal pressure adjustment mechanism 5 includes a pressure reducing section 51 and a pressure increasing section 52 .

[0047] The pressure reducing unit 51 is a unit such as a vacuum pump that reduces the internal pressure of the chamber 10 to a predetermined pressure by exhausting air from the chamber 10. Here, the predetermined pressure is a pressure lower than atmospheric pressure, for example, a pressure corresponding to the degree of vacuum required within the chamber 10. In this embodiment, the pressure reducing unit 51 is configured to maintain the internal pressure of the first region R1 at the predetermined pressure even after the pressure inside the chamber 10 is reduced and the sealing mechanism 3 seals the gap between the first region R1 and the second region R2.

[0048] The pressure intensifier 52 is a component, such as a compression pump, that increases the internal pressure of the chamber 10 by supplying air into the chamber 10. In this embodiment, the pressure intensifier 52 is configured to be able to increase the internal pressure of the first region R1 and the internal pressure of the second region R2 individually when the sealing mechanism 3 seals the space between the first region R1 and the second region R2.

[0049] <Control Unit 9> The control unit 9 is composed of a processing device (such as a CPU) and a storage device (such as a RAM or a ROM), and controls each part of the bonding apparatus (such as the chamber mechanism 1, the support mechanism 2, the sealing mechanism 3, the alignment mechanism 4, and the internal pressure adjustment mechanism 5). The control unit 9 executes a program to perform the bonding process described below.

[0050] Here, the program is installed in the control unit 9, and before installation, it may be stored in a readable state on a portable storage medium (for example, a flash memory, etc.), or may be stored in a downloadable state on another server, etc. The bonding process described below is not limited to being realized by software through execution of a program, but may also be realized by hardware using a processing circuit built in the control unit 9.

[0051] [1-2] Bonding process 2(A) to 5(B) are conceptual diagrams sequentially showing changes in the state of the bonding device that occur as the bonding process is performed.

[0052] With the chamber 10 open, the control unit 9 controls a transport hand (not shown) that transports the first workpiece W1 and the second workpiece W2 to place the second workpiece W2 on the stage unit 22 with its bonding surface F21 facing upward, and then places the first workpiece W1 on the ring unit 21 with its bonding surface F11 facing downward (step S101; see FIG. 2(A)). In this embodiment, the second workpiece W2 has a resin layer Yr formed on its bonding surface F21, and is placed on the stage unit 22 with the resin layer Yr facing upward. Here, the resin layer Yr is a layer containing a resin (such as an adhesive) for bonding the first workpiece W1 and the second workpiece W2 together.

[0053] As a result, the first workpiece W1 and the second workpiece W2 are supported by the support mechanism 2 with their bonding surfaces F11 and F21 facing each other (in this embodiment, with the resin layer Yr on the bonding surface F21 facing the bonding surface F11).

[0054] After step S101, the control unit 9 controls the drive unit 13 of the chamber mechanism 1 to combine the first chamber forming unit 11 and the second chamber forming unit 12 without any gaps, thereby forming a chamber 10 (sealed space) (step S102; see Figure 2(B)).

[0055] Furthermore, in step S102, the control unit 9 controls the drive unit 24 of the support mechanism 2 to move the fixing unit 23 downward, thereby clamping the peripheral edge of the first workpiece W1 at multiple points between the fixing unit 23 and the ring unit 21, thereby temporarily fixing the first workpiece W1. This makes it possible to prevent the first workpiece W1 from shifting in position or becoming loose, which may occur before the sealing state Qs (see FIG. 3(B)) is formed.

[0056] After step S102, the control unit 9 controls the pressure reducing unit 51 of the internal pressure adjusting mechanism 5 to reduce the pressure inside the chamber 10, thereby reducing the internal pressure of the chamber 10 to a predetermined atmospheric pressure (step S103; see FIG. 3(A)).

[0057] Here, when the pressure is reduced in step S103, an air current may be generated in the chamber 10 due to exhaust by the pressure reduction unit 51. On the other hand, in this embodiment, the first workpiece W1 is fixed onto the ring unit 21 by the fixing unit 23, and the second workpiece W2 is fixed onto the stage unit 22 by the chuck function of the stage unit 22. Therefore, even if an air current is generated in the chamber 10 when the pressure is reduced, there is almost no displacement or loosening of the first workpiece W1 and the second workpiece W2.

[0058] After step S103, the control unit 9 controls the drive unit 32 of the sealing mechanism 3 to extend the annular sealing unit 31 vertically downward, thereby sandwiching the peripheral edge of the first workpiece W1 between the sealing unit 31 and the ring unit 21 from above (from the back surface F12 side), thereby dividing the interior of the chamber 10 into two regions, inside and outside the sealing unit 31, and sealing between these regions (step S104; see FIG. 3(B)). In this way, the control unit 9 forms a second region R2 by the inner region of the sealing unit 31 (the region where the back surface F12 of the first workpiece W1 is exposed) and a first region R1 by the outer region of the sealing unit 31 (the portion leading to the region on the bonding surface F11 side of the first workpiece W1), as a sealed state Qs. The control unit 9 also fixes the first workpiece W1 onto the ring unit 21.

[0059] After step S104, the control unit 9 controls the alignment mechanism 4 to adjust the positional relationship between the first workpiece W1 and the second workpiece W2 (step S105, FIG. 4(A)). In this embodiment, the control unit 9 adjusts the position of the stage unit 22 in the horizontal plane based on an image captured by the camera 40 from the outside of the top plate 112 (in other words, the side of the second region R2), thereby aligning the position of the second workpiece W2 with the correct position relative to the first workpiece W1. As an example, the control unit 9 recognizes the alignment marks provided on the first workpiece W1 and the second workpiece W2 based on the image captured by the camera 40, and adjusts the position of the stage unit 22 in the horizontal plane so that these marks are aligned.

[0060] Furthermore, in step S105, the control unit 9 controls the alignment mechanism 4 to move the stage unit 22 upward while maintaining the adjusted position in the horizontal plane, thereby bringing the bonding surface F21 of the second workpiece W2 on the stage unit 22 closer to the bonding surface F11 of the first workpiece W1, thereby bringing the resin layer Yr on the bonding surface F21 into contact with the bonding surface F11 (see Figure 4(A)).

[0061] In this way, by bringing the resin layer Yr on the laminating surface F21 into contact with the laminating surface F11 in step S105 after increasing the degree of vacuum in the first region R1 in step S104, even if a void Xs (a small closed space; see FIG. 6) occurs due to the unevenness of the surface of the resin layer Yr, the void Xs is brought into a high vacuum state similar to that in the first region R1. Therefore, by pressing the first workpiece W1 toward the second workpiece W2 in step S106 described below, and by returning the pressure inside the chamber 10 to atmospheric pressure after step S106 (i.e., by exposing the first workpiece W1 and the second workpiece W2 after the laminating process to atmospheric pressure), the void Xs can be eliminated by the external pressing force. Therefore, by performing lamination through steps S104 and S105, it is possible to prevent air bubbles, which may interfere with lamination, from being present between the first workpiece W1 and the second workpiece W2.

[0062] After step S105, the control unit 9 controls the pressure increase unit 52 of the internal pressure adjustment mechanism 5 to increase the pressure in the second region R2, thereby making the internal pressure in the second region R2 higher than the internal pressure in the first region R1 (step S106; see FIG. 4(B)). Specifically, the control unit 9 controls the internal pressure adjustment mechanism 5 to increase only the internal pressure in the second region R2 while maintaining the internal pressure in the first region R1 at a predetermined air pressure.

[0063] At this time, the back surface F12 of the first workpiece W1 is exposed in the second region R2, and so by increasing the internal pressure of the second region R2 in step S106, it becomes possible to directly and uniformly pressurize the back surface F12 of the first workpiece W1 using the gas in the second region R2. Also, by making the internal pressure of the second region R2 higher than the internal pressure of the first region R1 in step S106, it becomes possible to use the resulting pressure difference to uniformly press the first workpiece W1 toward the second workpiece W2. This makes it possible to obtain a good bonding state across the entire bonding surfaces F11 and F21 of the two workpieces.

[0064] Furthermore, in this embodiment, the first workpiece W1 is fixed onto the ring portion 21 by the sealing portion 31, so that step S106 not only enables the uniform pressing described above, but also prevents the first workpiece W1 from shifting position or loosening, which may occur at that time.

[0065] After step S106, the control unit 9 controls the pressure increasing unit 52 of the internal pressure adjustment mechanism 5 to increase the pressure in the first region R1, thereby increasing the internal pressure in the first region R1 to approximately the same as the internal pressure in the second region R2 (step S107; see Figure 5(A)).

[0066] After step S107, the control unit 9 controls the drive unit 32 of the sealing mechanism 3 to shrink the annular sealing unit 31 vertically upward, thereby transitioning the inside of the chamber 10 from the sealed state Qs to the released state Qt (step S108; see FIG. 5(B)). Thereafter, the control unit 9 returns the inside of the chamber 10 to atmospheric pressure and then opens it, and controls the transport hand (not shown) to remove the workpieces (first workpiece W1 and second workpiece W2) after the bonding process from the bonding device.

[0067] [2] Variation [2-1] First modified example As shown in FIG. 7A, if the film thickness of the resin layer Yr on the bonding surface F21 is smaller at the periphery of the second workpiece W2 (in other words, if the height of the resin layer Yr from the bonding surface F21 is lower), even if the resin layer Yr on the bonding surface F21 is brought into contact with the bonding surface F11 while the vacuum level in the first region R1 is increased in steps S104 and S105 as described above, a gap Xs (a small, closed space) is unlikely to form between the bonding surface F11 of the first workpiece W1 and the resin layer Yr at the periphery of the second workpiece W2. In other words, at the periphery of the second workpiece W2, only a gap Xt that is open to the first region R1 is formed between the bonding surface F11 of the first workpiece W1 and the resin layer Yr. When the pressure inside the chamber 10 is returned to atmospheric pressure, this open gap Xt similarly returns to atmospheric pressure, remaining open even after the bonding process and causing bonding defects.

[0068] Therefore, in the above-mentioned step S106, the control unit 9 may increase the internal pressure in the second region R2 to be higher than the internal pressure in the first region R1, and utilize the resulting pressure difference and the space between the second work W2 supported on the stage portion 22 and the ring portion 21 to deflect the peripheral portion of the first work W1 toward the first region R1, as shown in Figure 7(B).

[0069] Here, the size and shape of the deflected portion change depending on the width Lz of the space. Therefore, the width Lz of the space is adjusted by changing the configuration (size, etc.) of the ring portion 21, and the size and shape of the deflected portion are adjusted by using a first workpiece W1 of a size that can be supported by the ring portion 21. Then, by finding an appropriate predetermined width for the width Lz of the space, it becomes possible to bring the resin layer Yr and the bonding surface F11 of the first workpiece W1 into contact even on the peripheral edge portion of the second workpiece W2 (see FIG. 7(B)).

[0070] According to this lamination process, even on the peripheral portion of the second workpiece W2, voids Xs (small closed spaces) due to the unevenness of the surface of the resin layer Yr can be formed in a high-vacuum atmosphere (here, the first region R1), and the voids Xs can be eliminated by applying pressure from the outside. Therefore, it is possible to improve lamination defects between the peripheral portion of the second workpiece W2 (a workpiece smaller in size than the first workpiece W1) and the first workpiece W1.

[0071] [2-2] Second variant 8(A) is a conceptual diagram showing a bonding apparatus according to a second modified example. In the following, parts of the configuration of the bonding apparatus according to the second modified example that are different from the bonding apparatus of the above-described embodiment will be described.

[0072] <Chamber mechanism 1> In this modified example, a portion of the bottom plate 122 (the central portion in the example of Figure 1) is formed of an optically transparent material 140X (such as quartz) so that the inside of the chamber 10 can be photographed by a camera 40 from outside the bottom plate 122.

[0073] <Support mechanism 2, sealing mechanism 3, and alignment mechanism 4> In this modification, the support mechanism 2 includes a ring portion 21 and a chuck portion 25.

[0074] The ring portion 21, like that described in the above embodiment, is a portion that supports the peripheral portion of the first workpiece W1 from below. In this modified example, the first workpiece W1 is placed on this ring portion 21 with its bonding surface F11 facing upward. Such a ring portion 21 makes it possible to reliably prevent the first workpiece W1 from falling inside the chamber 10 while leaving exposed the portion of the back surface F12 (lower surface) of the first workpiece W1 that requires pressure (the portion that overlaps with the entire second workpiece W2 when viewed from above or below in a plan view).

[0075] The chuck portion 25 is a portion that chucks the second workpiece W2 at a position above the first workpiece W1 (the first workpiece W1 supported by the ring portion 21), and is provided with a chucking function (vacuum suction, electrostatic chuck, etc.) that enables such chucking. The second workpiece W2 is chucked by this chuck portion 25 with its bonding surface F21 facing downward.

[0076] In this modification, the positional relationship between the first workpiece W1 and the second workpiece W2 is adjusted by adjusting the position of the chuck portion 25 in the horizontal plane by the alignment mechanism 4. The positional relationship is adjusted based on an image captured by the camera 40 from the outside of the bottom plate 122 (in other words, the side of the second region R2).

[0077] The sealing mechanism 3 includes an annular sealing portion 31 and a driving portion 32, similar to those described in the above embodiment.

[0078] On the other hand, in this modified example, the peripheral edge of the first workpiece W1 is sandwiched from above (from the lamination surface F11 side) between the sealing portion 31 and the ring portion 21, so that in the sealed state Qs, a first region R1 is formed by the region inside the sealing portion 31, and a second region R2 is formed by the region outside the sealing portion 31 (the portion leading to the region where the back surface F12 of the first workpiece W1 is exposed) (see FIG. 8(A)). Moreover, as in the above embodiment, the first workpiece W1 is fixed onto the ring portion 21.

[0079] Also in this modification, in step S106, the internal pressure of the second region R2 is made higher than the internal pressure of the first region R1 (see FIG. 8(B)). This makes it possible to directly and uniformly pressurize the back surface F12 of the first workpiece W1 by the gas in the second region R2. The differential pressure generated at this time can be used to uniformly press the first workpiece W1 toward the second workpiece W2, thereby making it possible to obtain a good bonding state across the entire bonding surfaces F11 and F21 of the two workpieces.

[0080] Also in this modified example, the first workpiece W1 is fixed onto the ring portion 21 by the sealing portion 31, so that step S106 not only enables the uniform pressing as described above, but also prevents the first workpiece W1 from shifting position or loosening, which may occur at that time.

[0081] [2-3] Other variations The above-mentioned bonding device is not limited to bonding the first work W1 and the second work W2 with resin (resin layer Yr), but can also be applied to directly bonding the bonding surfaces F11 and F12 together, or to bonding using a material other than resin (such as metal).

[0082] The above-described laminating device may be modified as appropriate to a configuration in which the support mechanism 2 does not have the fixing portion 23. In this case, instead of the fixing portion 23, the ring portion 21 itself may be modified to have a chuck function (vacuum suction, electrostatic chuck, etc.) for temporarily holding (fixing) the first workpiece W1.

[0083] The above-described embodiments and modifications should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined not by the above-described embodiments and modifications, but by the claims. Furthermore, the scope of the present invention is intended to include all modifications that are equivalent to the scope of the claims and fall within the scope thereof.

[0084] Furthermore, from the above-described embodiments and variations, a portion of the configuration of the bonding device may be extracted as the subject of the invention, or a portion or all of the bonding process, or a program for executing them, etc. may be extracted. [Explanation of symbols]

[0085] 1. Chamber mechanism 2 Support mechanism 3 Sealing mechanism 4 Alignment mechanism 5. Internal pressure adjustment mechanism 9 Control Unit 10 Chambers 11 First chamber forming section 12 Second chamber forming section 13 Drive unit 21 Ring section 22 Stage Section 23 Fixed part 24 Drive unit 25 Chuck part 31 Seal part 32 Drive unit 40 Camera 51 Pressure reducing section 52 Pressure booster Lz width Qs Sealed condition Qt Released State R1 1st area R2 2nd area W1 First Work W2 Second Work Xs void Xt Open Gap Yr resin layer 111 First cylindrical part 112 Top plate 121 Second cylindrical section 122 Bottom plate 140X Light-transmitting material F11, F21 pasting surface F12 back

Claims

1. a bonding apparatus that bonds a first workpiece and a second workpiece together in a chamber, a support mechanism that supports the first workpiece and the second workpiece in the chamber with their bonding surfaces facing each other; a sealing mechanism that selectively forms, within the chamber, a sealed state in which a first region including a region on the bonding surface side of the first workpiece and a second region including a region on the back surface side of the first workpiece are sealed, and a released state in which the seal between the two regions is released; an internal pressure adjustment mechanism that adjusts the internal pressure of the chamber, and is configured to be able to individually adjust the internal pressure of the second region and the internal pressure of the first region when the sealed state is formed by the sealing mechanism; Equipped with The bonding device is configured such that the support mechanism and the sealing mechanism are capable of supporting the first workpiece while leaving the back surface of the first workpiece exposed to the second region and forming the sealed state.

2. The support mechanism includes: a ring portion that supports a peripheral portion of the first workpiece from below; a stage portion that supports the second workpiece below the first workpiece; Equipped with The first workpiece is supported by the ring portion with its bonding surface facing downward, and the second workpiece is supported by the stage portion with its bonding surface facing upward, 2. The bonding device according to claim 1, wherein the sealing mechanism includes an annular sealing portion, and the sealing portion sandwiches the peripheral edge of the first workpiece from above between the sealing portion and the ring portion, thereby dividing the inside of the chamber into two areas, an inside area and an outside area of ​​the sealing portion, and sealing between these areas, thereby forming the second area by the area inside the sealing portion and the first area by the area outside the sealing portion.

3. The support mechanism includes: a ring portion that supports a peripheral portion of the first workpiece from below; a chuck portion that chucks the second workpiece at a position above the first workpiece; Equipped with The first workpiece is supported by the ring portion with its bonding surface facing upward, and the second workpiece is chucked by the chuck portion with its bonding surface facing downward, 2. The bonding device according to claim 1, wherein the sealing mechanism includes an annular sealing portion, and the sealing portion sandwiches the peripheral edge of the first workpiece from above between the sealing portion and the ring portion, thereby dividing the inside of the chamber into two areas, an inside area and an outside area of ​​the sealing portion, and sealing between these areas, thereby forming the first area by the inside area of ​​the sealing portion and the second area by the outside area of ​​the sealing portion.

4. Further comprising a control unit, The control unit After the first workpiece and the second workpiece are supported by the support mechanism, and before the sealing mechanism is caused to establish the sealed state, the internal pressure of the chamber is reduced to a predetermined atmospheric pressure by controlling the internal pressure adjustment mechanism; Thereafter, the sealing mechanism is controlled to form the sealed state; The bonding apparatus according to claim 2 or 3, wherein the internal pressure adjusting mechanism is then controlled to increase the internal pressure in the second region to be higher than the internal pressure in the first region.

5. The ring portion is configured so that a space of a predetermined width is formed between the second workpiece supported by the support mechanism and the ring portion when viewed from above or below in a plan view, and the first workpiece is used in a size that can be supported by the ring portion; 5. The bonding device according to claim 4, wherein the control unit uses the space of the predetermined width to bend the peripheral portion of the first workpiece toward the first region by increasing the internal pressure of the second region to be higher than the internal pressure of the first region.

6. The bonding device according to claim 2 or 3, wherein the support mechanism includes a fixing part that temporarily fixes the first workpiece by sandwiching a peripheral edge of the first workpiece between the fixing part and the ring part.

7. an alignment mechanism that adjusts the positional relationship between the first workpiece and the second workpiece based on an image captured by a camera from the second area side; The laminating apparatus according to any one of claims 1 to 3, further comprising:

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