Resin molding device and manufacturing method for the resin molded article

Abstract

To provide a resin molding device and a manufacturing method of a resin molded article, which are capable of suppressing occurrence of a defect that may be caused by continuing compression molding when an electronic component falls from a substrate.SOLUTION: A resin molding device performs compression molding. The resin molding device includes: a mold; a mold clamping mechanism; and a sensor. The mold includes: an upper mold and a lower mold opposed to the upper mold. The mold clamping mechanism clamps the mold. The mold clamping is performed in a state where a molding object is disposed on the lower surface of the upper mold and the resin is disposed on the upper surface of a lower mold. The molded object includes a substrate and a plurality of electronic components disposed on the substrate. In a state in which the molded object is disposed on the lower surface of the upper mold, each of the plurality of electronic components is located below the substrate. The sensor detects that at least a part of the plurality of electronic components falls downward from the substrate in a state in which the molded object is disposed on the lower surface of the upper mold.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product. [Background technology]

[0002] Japanese Patent Application Laid-Open Publication No. 2023-3677 (Patent Document 1) discloses a compression molding apparatus. This compression molding apparatus performs resin encapsulation molding of a workpiece using an encapsulation mold including an upper mold and a lower mold. The workpiece includes a substrate and electronic components arranged on the substrate. In this compression molding apparatus, the workpiece is held on the lower surface of the upper mold. With the workpiece held on the lower surface of the upper mold, the electronic components are positioned below the substrate (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2023-3677 Summary of the Invention [Problem to be solved by the invention]

[0004] In the compression molding apparatus disclosed in Patent Document 1, for example, there is a possibility that an electronic component may fall off the substrate. For example, if compression molding is performed with an electronic component dropped onto the lower mold, problems such as damage to the lower mold or the substrate may occur.

[0005] The present invention has been made to solve such problems, and its purpose is to provide a resin molding device that is configured to prevent the occurrence of problems that may arise when compression molding is continued if an electronic component falls from a substrate, and a method for manufacturing a resin molded product using the resin molding device. [Means for solving the problem]

[0006] A resin molding apparatus according to one aspect of the present invention performs compression molding. The resin molding apparatus includes a molding die, a clamping mechanism, and a sensor. The molding die includes an upper die and a lower die facing the upper die. The clamping mechanism clamps the molding die. The clamping is performed with an object to be molded placed on the lower surface of the upper die and resin placed on the upper surface of the lower die. The object to be molded includes a substrate and multiple electronic components placed on the substrate. With the object to be molded placed on the lower surface of the upper die, each of the multiple electronic components is located below the substrate. With the object to be molded placed on the lower surface of the upper die, the sensor detects that at least some of the multiple electronic components have fallen downward from the substrate.

[0007] A method for manufacturing a resin molded product according to another aspect of the present invention uses the resin molding apparatus described above and includes placing an object to be molded on the lower surface of an upper mold, placing resin on the upper surface of a lower mold, and clamping the molds. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a resin molding device having a configuration for preventing defects that may occur when compression molding is continued if an electronic component falls from a substrate, and a method for manufacturing a resin molded product using the resin molding device. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a diagram schematically illustrating a plan view of the resin molding apparatus. [Figure 2] FIG. 2 is a diagram schematically illustrating a part of a plane of a resin molded portion. [Figure 3] FIG. 3 is a diagram schematically illustrating a part of the cross section taken along the line III-III in FIG. 2. [Figure 4] FIG. 4 is a diagram schematically illustrating a part of the cross section taken along line IV-IV in FIG. 2. [Figure 5] 3 is a diagram schematically showing a part of the VV cross section of FIG. 2. FIG. [Figure 6] 6 is a diagram schematically illustrating a part of a cross section taken along line VI-VI in FIG. 4. [Figure 7]FIG. 2 is a diagram schematically illustrating an example of an optical path extending in the left-right direction. [Figure 8] FIG. 8 is a diagram schematically illustrating a cross section taken along line VIII-VIII in FIG. 2. [Figure 9] 4 is a flowchart showing a basic operation procedure of the resin molding device. [Figure 10] 10 is a flowchart showing a procedure for starting and stopping drop detection of an electronic component. [Figure 11] 10 is a flowchart showing a procedure for detecting a drop of an electronic component. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment according to one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail below with reference to the drawings. Note that identical or corresponding parts in the drawings are designated by the same reference numerals, and their description will not be repeated. For ease of understanding, each drawing is drawn schematically, with objects appropriately omitted or exaggerated. The directions indicated by arrows U, D, F, B, L, and R in each drawing will be defined as upward, downward, forward, backward, leftward, and rightward, respectively, in the following description.

[0011] [1. Configuration of resin molding equipment] <1-1. Overall configuration of resin molding equipment> FIG. 1 is a diagram schematically showing a plan view of a resin molding apparatus 1 according to the present embodiment. The resin molding apparatus 1 is configured to resin-seal a substrate (a molding object O1 before resin molding) on ​​which electronic components such as semiconductor chips are mounted, to manufacture a resin-molded product (a molding object O1 after resin molding). The resin molding apparatus 1 employs a compression molding method as the resin molding method. In the resin molding apparatus 1, the component mounting surface of the substrate on which the electronic components are mounted is resin-sealed.

[0012] Examples of the substrate include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, and ceramic substrates. The substrate may be a carrier used in FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). The substrate may or may not already have wiring.

[0013] 1, the resin molding apparatus 1 includes a substrate loading / unloading module 10, a substrate transfer module 20, two molding modules 30, a resin supply module 40, and a control unit 50. The control unit 50 includes, for example, a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory). The control unit 50 is configured to control each of the substrate loading / unloading module 10, the substrate transfer module 20, the two molding modules 30, and the resin supply module 40 according to, for example, a control program.

[0014] Each of the substrate load / unload module 10, the substrate transfer module 20, the molding module 30, and the resin supply module 40 is detachable and replaceable with other modules. In addition, in the resin molding apparatus 1, each of the substrate load / unload module 10, the substrate transfer module 20, the molding module 30, and the resin supply module 40 can be increased or decreased.

[0015] The substrate loading / unloading module 10 is configured to load a substrate (molding object O1 before resin molding) on ​​which electronic components are mounted, and to unload a resin-molded product (molding object O1 after resin molding). As an example, the substrate has a rectangular shape, and each side of the substrate is 600 mm. The substrate loading / unloading module 10 includes a loading section 11, an unloading section 12, an inspection section 13, and an arm mechanism 14.

[0016] The carry-in section 11 accommodates the molding object O1 before resin molding. The carry-out section 12 accommodates the molding object O1 (resin molded product) after resin molding. Each of the carry-in section 11 and the carry-out section 12 can accommodate a plurality of molding objects O1. The inspection section 13 inspects the resin molded product. The resin molded product is placed in the inspection section 13 and is inspected.

[0017] The arm mechanism 14 moves the workpiece O1 to a predetermined position. The arm mechanism 14 includes a suction hand unit 14a, an arm unit 14b, and a drive unit 14c. The suction hand unit 14a is capable of holding the workpiece O1 by suctioning the workpiece O1. The suction hand unit 14a is attached to the arm unit 14b. The drive unit 14c drives the arm unit 14b. The drive unit 14c realizes, for example, the rotation and movement of the arm unit 14b.

[0018] The substrate transfer module 20 is configured to transfer the molding object O1 between the substrate load / unload module 10 and the molding module 30. The substrate transfer module 20 includes a loader 21 and an unloader 22.

[0019] The loader 21 receives the molding object O1 before resin molding from the arm mechanism 14, and transports the molding object O1 to a resin molding section 300 (described later) of the molding module 30. The unloader 22 receives the resin molded product from the resin molding section 300, and transports the resin molded product to the substrate load / unload module 10. Each of the loader 21 and the unloader 22 is movable along a rail L1 extending in the left-right direction. In this embodiment, the loader 21 and the unloader 22 are connected to each other, and the loader 21 and the unloader 22 move integrally.

[0020] The molding module 30 is configured to perform resin molding of the molding object O1 by using the resin material supplied from the resin supply module 40. In this embodiment, two molding modules 30 are arranged adjacent to each other. By performing resin molding in parallel in the two molding modules 30, the manufacturing efficiency of resin molded products is improved. Each molding module 30 includes a resin molding section 300. The resin molding section 300 will be described in detail later.

[0021] The resin supply module 40 is configured to supply resin material to the resin molding section 300 of the molding module 30. The resin supply module 40 includes two resin material storage devices 100, two small trays 41, two small tray transport mechanisms 42, a large tray 43, and a large tray transport mechanism 44.

[0022] Each resin material storage device 100 stores resin material. A small tray 41 is associated with each resin material storage device 100. The small tray 41 can hold resin material on its upper surface. In a plan view, the size of the small tray 41 is, for example, about one-fourth the size of the large tray 43. Each resin material storage device 100 supplies resin material to the associated small tray 41. For example, two resin material storage devices 100 supply resin material in parallel to the small trays 41 associated with them.

[0023] A small tray conveying mechanism 42 is associated with each small tray 41. Each small tray conveying mechanism 42 moves the associated small tray 41 between the resin material storage device 100 and the large tray 43. After the small tray 41 moves above the large tray 43, the resin material is supplied from the small tray 41 to the large tray 43. The large tray 43 is capable of holding the resin material on its upper surface. The planar shape of the large tray 43 is, for example, approximately the same as the planar shape (e.g., rectangular) of the cavity (described later) in the resin molding section 300.

[0024] By supplying resin material to large tray 43 from small tray 41 multiple times, the amount of resin material required for one resin molding is supplied to the upper surface of large tray 43. By controlling the supply position of resin material to large tray 43 by small tray 41 each time, uneven distribution of resin material on large tray 43 is suppressed.

[0025] The large tray transport mechanism 44 moves the large tray 43. The large tray transport mechanism 44 moves along rail L1. After the large tray 43 moves to a predetermined position in the resin molding section 300, the resin material is supplied from the large tray 43 into the cavity in the resin molding section 300.

[0026] <1-2. Structure of the resin molded part> FIG. 2 is a diagram schematically illustrating a portion of the plane of resin molding unit 300. As shown in FIG. 2, resin molding unit 300 includes molding die 305 and optical sensors 352, 354, 356, and 358. In a plan view, molding die 305 has a rectangular shape. Molding die 305 has opposing sides SD1 and SD2 and opposing sides SD3 and SD4. Optical sensor 352 is disposed along side SD1, and optical sensor 354 is disposed along side SD2. Optical sensor 356 is disposed along side SD3, and optical sensor 358 is disposed along side SD4. The periphery of molding die 305 is surrounded by optical sensors 352, 354, 356, and 358. Optical sensors 352, 354, 356, and 358 will be described in detail later.

[0027] Fig. 3 is a diagram schematically illustrating a portion of the cross section taken along line III-III in Fig. 2. As shown in Fig. 3, the resin molding unit 300 includes a fixed platen 310, a molding die 305, a movable platen 340, a mold clamping mechanism 350, and a base 360.

[0028] The stationary platen 310, the movable platen 340, and the base 360 ​​are each a plate-like member that is rectangular in plan view. Tie bars (not shown) extend downward from each of the four corners of the stationary platen 310. The movable platen 340 is located below the stationary platen 310. Tie bars pass through each of the four corners of the movable platen 340, and the movable platen 340 is movable in the vertical direction relative to the tie bars. The mold clamping mechanism 350 is fixed on the base 360, and moves the movable platen 340 in the vertical direction. The mold clamping mechanism 350 is realized by, for example, a combination of a servo motor and a ball screw, or a combination of a hydraulic cylinder and a link mechanism.

[0029] The forming mold 305 includes an upper mold 320 and a lower mold 330. The forming mold 305 is disposed between a stationary platen 310 and a movable platen 340. More specifically, the upper mold 320 is fixed to the lower surface of the stationary platen 310, and the lower mold 330 is fixed to the upper surface of the movable platen 340. As the movable platen 340 moves up and down, the lower mold 330 also moves up and down together with the movable platen 340. As the movable platen 340 rises, the forming mold 305 is clamped, and as the movable platen 340 descends, the forming mold 305 is opened.

[0030] The lower mold 330 includes a base plate 334, a bottom member 331, springs 333, and side members 332. The base plate 334 is a plate-like member that is rectangular in a plan view. The base plate 334 is fixed to the upper surface of a movable platen 340. The bottom member 331 is a block-like member that is rectangular in a plan view. The bottom member 331 is fixed to the upper surface of the base plate 334, and is located approximately in the center of the base plate 334. The side members 332 are frame-like members that surround the periphery of the bottom member 331. The side members 332 are fixed to the base plate 334 via multiple springs 333.

[0031] The upper surface of the side member 332 is located higher than the upper surface of the bottom member 331, and a cavity (recess) is formed in the upper surface of the lower mold 330. A release film F1 is placed in this cavity, and a resin material R1 is placed on the release film F1. A molding object O1 is placed on the lower surface of the upper mold 320. The molding object O1 includes a substrate P1 and multiple electronic components C1 mounted on the substrate P1. With the molding object O1 placed on the lower surface of the upper mold 320, each of the multiple electronic components C1 is located below the substrate P1. With the release film F1 with the resin material R1 placed in the cavity of the lower mold 330 and the molding object O1 placed on the lower surface of the upper mold 320, the molding mold 305 is clamped, whereby the component mounting surface of the molding object O1 is resin-sealed.

[0032] In this manner, with the molding object O1 placed on the lower surface of the upper mold 320, each of the electronic components C1 is located below the substrate P1. For example, if a foreign object is caught between the substrate P1 and the electronic component C1, the electronic component C1 may fall off the substrate P1. If compression molding is performed with the electronic component C1 dropped onto the lower mold 330, problems such as damage to the lower mold 330 or the substrate P1 may occur.

[0033] To prevent such problems from occurring, optical sensors 352, 354, 356, and 358 are arranged around molding die 305 in resin molding unit 300. As will be described in detail below, optical sensors 352, 354, 356, and 358 detect when at least some of the electronic components C1 have fallen downward from substrate P1. For example, optical sensors 352 and 356 have the same configuration, and optical sensors 354 and 358 have the same configuration.

[0034] 4 is a schematic diagram illustrating a portion of the cross section taken along line IV-IV in FIG. 2. As illustrated in FIG. 4, the optical sensor 352 includes a plurality of light-emitters 362 and a plurality of light-receivers 364. Each of the plurality of light-emitters 362 includes a plurality of light-emitting elements arranged in the front-rear direction, and each light-emitting element emits light into the space between the upper mold 320 and the lower mold 330. Each of the plurality of light-emitters 362 is associated with one of a plurality of light-receivers 364 (described below) included in the optical sensor 354 and emits light to the associated light-receiver 364. Each of the plurality of light-receivers 364 includes a plurality of light-receiving elements arranged in the front-rear direction, and each light-receiving element receives light. Each of the plurality of light-receivers 364 is associated with one of a plurality of light-emitters 362 (described below) included in the optical sensor 354 and receives light emitted by the associated light-emitter 362. When the amount of light received per unit time in at least one of the plurality of light receivers 364 becomes equal to or less than a predetermined amount, a drop of the electronic component C1 is detected. The plurality of light emitters 362 are aligned in a line in the front-rear direction. The plurality of light receivers 364 are aligned in a line in the front-rear direction. In the optical sensor 352, the plurality of light emitters 362 are positioned above the plurality of light receivers 364.

[0035] The plurality of light-emitters 362 and the plurality of light-receivers 364 are arranged in a staggered pattern. That is, the plurality of light-emitters 362 and the plurality of light-receivers 364 are arranged such that, in the front-to-rear direction, a light-receiver 364 is located between two adjacent light-emitters 362, and a light-emitter 362 is located between two adjacent light-receivers 364. The light-emitting element may be configured using a light-emitting diode, a laser diode, or the like. The light-receiving element may be configured using a photodiode, a phototransistor, or the like.

[0036] FIG. 5 is a schematic diagram illustrating a portion of the VV cross section of FIG. 2. As illustrated in FIG. 5, the optical sensor 354 includes a plurality of light-emitters 362 and a plurality of light-receivers 364. Each of the plurality of light-emitters 362 emits light into the space between the upper mold 320 and the lower mold 330. More specifically, each of the plurality of light-emitters 362 is associated with one of the plurality of light-receivers 364 included in the optical sensor 352 and emits light to the associated light-receiver 364. Each of the plurality of light-receivers 364 is associated with one of the plurality of light-emitters 362 included in the optical sensor 352 and receives the light emitted by the associated light-emitter 362. When the amount of light received by each light-receiver 364 falls below a predetermined amount, a drop of the electronic component C1 is detected. The plurality of light-emitters 362 are arranged in a line in the front-rear direction. The plurality of light-receivers 364 are arranged in a line in the front-rear direction. In the optical sensor 354 , a plurality of light projectors 362 are positioned below a plurality of light receivers 364 .

[0037] For example, light-emitters 362A and 362B (see FIG. 4) in optical sensor 352 correspond to light-receivers 364C and 364D in optical sensor 354, respectively, and light-receivers 364A and 364B (see FIG. 4) in optical sensor 352 correspond to light-emitters 362C and 362D in optical sensor 354, respectively. That is, optical paths from optical sensor 352 to optical sensor 354 are formed between light-emitter 362A and light-receiver 364C and between light-emitter 362B and light-receiver 364D, respectively, and optical paths from optical sensor 354 to optical sensor 352 are formed between light-emitter 362C and light-receiver 364A and between light-emitter 362D and light-receiver 364B, respectively.

[0038] 2, in the space between the upper mold 320 and the lower mold 330, a plurality of optical paths LP1 between the optical sensors 352 and 354 and a plurality of optical paths LP1 between the optical sensors 356 and 358 intersect with each other in a plan view. As a result, a plurality of optical paths LP1 are formed in a mesh pattern in the space between the upper mold 320 and the lower mold 330. Then, based on the light reception results of each light receiver 364, it is detected that at least some of the plurality of electronic components C1 have fallen downward from the substrate P1. Therefore, according to the resin molding apparatus 1, even if the electronic component C1 falls with its long side parallel to one optical path LP1 (for example, the optical path LP1 between the optical sensors 352 and 354), the electronic component C1 can block the other optical path LP1 (for example, the optical path LP1 between the optical sensors 356 and 358), thereby preventing missed detection due to the falling posture of the electronic component C1.

[0039] As described above, in the resin molding apparatus 1, the light-emitters 362 included in the optical sensor 352 and the light-receivers 364 included in the optical sensor 352 are arranged in a staggered pattern, and the light-emitters 362 included in the optical sensor 354 and the light-receivers 364 included in the optical sensor 354 are arranged in a staggered pattern. Therefore, according to the resin molding apparatus 1, the width between adjacent light paths LP1 is relatively narrow, so that the falling of the electronic component C1 can be detected with relatively high accuracy. Furthermore, according to the resin molding apparatus 1, there is a certain amount of space between adjacent light-emitters 362 and between adjacent light-receivers 364, so that each light-receiver 364 is unlikely to receive light irradiated by any light other than the corresponding light-emitter 362, so that the occurrence of erroneous detection of the falling of the electronic component C1 can be suppressed.

[0040] FIG. 6 is a schematic diagram illustrating a portion of the cross section taken along line VI-VI in FIG. 4. As shown in FIG. 6, in the optical sensor 352, a portion of the light-emitter 362 is covered by a cover 382, ​​and a portion of the light-receiver 364 is covered by a cover 384. Each of the covers 382 and 384 has an L-shape. A slit S1 is formed in the surface of the cover 382 facing the light-emitting element of the light-emitter 362. Light emitted by the light-emitter 362 enters the space between the upper mold 320 and the lower mold 330 through the slit S1. In addition, a slit S2 is formed in the surface of the cover 384 facing the light-receiving element of the light-receiver 364. The light-receiver 364 receives the light that has passed through the slit S2. In the optical sensor 354, the light-emitter 362 and the light-receiver 364 are also covered by the covers 382 and 384, respectively.

[0041] 7 is a diagram schematically illustrating an example of an optical path LP1 extending in the left-right direction. As shown in FIG. 7, for example, the spread of light emitted by a projector 362 included in the optical sensor 352 is suppressed by a slit S1 in the cover 382. If the cover 382 were not provided, there is a possibility that the light emitted by the projector 362 would be reflected by the lower surface of the upper mold 320 or the upper surface of the lower mold 330.

[0042] When such reflection occurs, light emitted by a light projector 362 other than the light projector 362 associated with the light receiver 364 easily enters the light receiver 364 included in the optical sensor 354. As a result, false detection of the drop of the electronic component C1 is likely to occur. In the resin molding apparatus 1, the slit S1 formed in the cover 382 suppresses the spread of light emitted by the light projector 362, so that reflection of light at each of the upper mold 320 and the lower mold 330 can be suppressed.

[0043] Furthermore, in the resin molding apparatus 1, light emitted by a light projector 362 included in the optical sensor 352 passes through the slit S2 and is received by a light receiver 364 included in the optical sensor 354. Therefore, according to the resin molding apparatus 1, the angle at which light enters each light receiver 364 is limited, so that it is possible to prevent light reflected by each of the upper mold 320 and the lower mold 330 from entering each light receiver 364.

[0044] Fig. 8 is a schematic diagram showing a cross section taken along line VIII-VIII in Fig. 2. As shown in Fig. 8, between optical sensors 356 and 358, a portion of each optical path LP1 is inclined with respect to the lower surface of upper mold 320 and the upper surface of lower mold 330. Optical sensor 356 is disposed so that a light projector 362 and a light receiver 364 included in optical sensor 356 each face obliquely upward and rearward, and optical sensor 358 is disposed so that a light projector 362 and a light receiver 364 included in optical sensor 358 each face downward. Optical sensor 358 is disposed, for example, along the side surface of upper mold 320. A mirror 370 is arranged on the optical path between the optical sensors 356 and 358 to reflect the light emitted by the light projector 362 included in the optical sensor 356 toward the light receiver 364 included in the optical sensor 358, and to reflect the light emitted by the light projector 362 included in the optical sensor 358 toward the light receiver 364 included in the optical sensor 356.

[0045] By moving the optical sensor 358 and the mirror 370 upward, entry and exit paths for the loader 21, large tray transport mechanism 44, etc. are secured in the space between the upper mold 320 and the lower mold 330. In this way, according to the resin molding apparatus 1, even if there is a restriction on the size of the space between the upper mold 320 and the lower mold 330, it is possible to easily secure entry and exit paths for various mechanisms (for example, the loader 21, unloader 22, large tray transport mechanism 44, etc.) into the space, compared to a case where the entire optical path LP1 between the optical sensors 356, 358 is parallel to the lower surface of the upper mold 320 and the upper surface of the lower mold 330, respectively.

[0046] [2. Operation] <2-1.Basic operation> 9 is a flowchart showing the basic operation procedure of the resin molding apparatus 1. The process shown in this flowchart is repeatedly executed by the control unit 50 at predetermined intervals, for example.

[0047] 9, the control unit 50 controls the arm mechanism 14 to transport the workpiece O1 accommodated in the carry-in unit 11 to the loader 21 (step S100). The control unit 50 controls the loader 21 to place the workpiece O1 on the upper surface of the upper mold 320 (step S110). Specifically, the control unit 50 controls the loader 21 to enter the space between the upper mold 320 and the lower mold 330, controls the loader 21 to place the workpiece O1 on the upper surface of the upper mold 320, and controls the loader 21 to retreat from the space between the upper mold 320 and the lower mold 330.

[0048] The control unit 50 executes a process for placing the release film F1 on the upper surface of the lower mold 330 (step S120). The control unit 50 controls the large tray conveying mechanism 44 and the large tray 43 to place the resin material R1 on the upper surface of the lower mold 330 (on the release film F1) (step S130). Specifically, the control unit 50 controls the large tray conveying mechanism 44 to enter the space between the upper mold 320 and the lower mold 330, controls the large tray conveying mechanism 44 and the large tray 43 to place the resin material R1 on the upper surface of the lower mold 330, and controls the large tray conveying mechanism 44 to exit the space between the upper mold 320 and the lower mold 330. Note that, prior to step S130, the supply of the resin material R1 from the resin material storage device 100 to the small tray 41 and the supply of the resin material R1 from the small tray 41 to the large tray 43 are each performed in parallel.

[0049] The control unit 50 controls the heating unit (not shown) to melt the resin material R1 placed on the upper surface (inside the cavity) of the lower mold 330 (step S140). Once the resin material R1 has melted, the control unit 50 controls the mold clamping mechanism 350 to clamp the forming mold 305 (step S150). Once the compression molding is complete, the control unit 50 controls the mold clamping mechanism 350 to open the mold (step S160).

[0050] The control unit 50 controls the unloader 22 to hold the manufactured resin molded product, and controls the arm mechanism 14 to receive the resin molded product from the unloader 22 (step S170). The control unit 50 controls the arm mechanism 14 to transport the resin molded product to the inspection unit 13, and controls the inspection unit 13 to inspect the transported resin molded product (step S180). The control unit 50 controls the arm mechanism 14 to transport the inspected resin molded product to the carry-out unit 12 (step S190). Through these procedures, the resin molded product is manufactured.

[0051] <2-2. Fall detection operation> 10 is a flowchart showing the procedure for starting and stopping drop detection of the electronic component C1. The process shown in this flowchart is executed by the control unit 50 repeatedly at a predetermined interval, for example.

[0052] 10, after the object O1 is placed on the lower surface of the upper mold 320, the control unit 50 determines whether or not the loader 21 has completely retracted from the space between the upper mold 320 and the lower mold 330 (step S200). If it is determined that the loader 21 has not completely retracted (NO in step S200), the control unit 50 executes the process of step S200 again.

[0053] On the other hand, when it is determined that the exit of the loader 21 is completed (YES in step S200), the control unit 50 executes a process for starting detection of a drop of the electronic component C1 (step S210). Specifically, the control unit 50 controls each of the optical sensors 352, 354, 356, and 358 so that each projector 362 starts emitting light, and starts acquiring the light reception results of each photoreceiver 364 from each of the optical sensors 352, 354, 356, and 358.

[0054] The control unit 50 determines whether or not the timing has come for the large tray transport mechanism 44 to enter the space between the upper mold 320 and the lower mold 330 (step S220). If it is determined that the timing for the large tray transport mechanism 44 to enter has not come (NO in step S220), the control unit 50 continues the drop detection process and executes the process of step S220.

[0055] On the other hand, when it is determined that the timing for the large tray transport mechanism 44 to enter has arrived (YES in step S220), the control unit 50 executes a process for stopping the detection of the drop of the electronic component C1 (step S230). Specifically, the control unit 50 controls each of the optical sensors 352, 354, 356, and 358 so that the light projectors 362 stop emitting light.

[0056] In this way, in the resin molding apparatus 1, drop detection of the electronic component C1 is not performed while the loader 21 or the like is entering the space between the upper mold 320 and the lower mold 330. Therefore, the resin molding apparatus 1 can prevent the occurrence of a situation in which the drop of the electronic component C1 is erroneously detected due to light being blocked by the entry of the loader 21 or the like.

[0057] 11 is a flowchart showing the procedure for detecting a drop of the electronic component C1. The process shown in this flowchart is executed by the control unit 50, for example, during the execution of the process for detecting a drop of the electronic component C1.

[0058] 11, control unit 50 determines whether the amount of light received per unit time in any of multiple light receivers 364 included in optical sensors 352, 354, 356, and 358 has decreased to or below a predetermined amount (step S300). Note that the predetermined amount is determined in advance through experiments, and information regarding the predetermined amount is stored in a memory (not shown) within control unit 50. If it is determined that the amount of light received per unit time in each light receiver 364 is greater than the predetermined amount (NO in step S300), control unit 50 executes the process of step S300 again.

[0059] On the other hand, if it is determined that the amount of light received per unit time at any of the multiple light receivers 364 is less than or equal to a predetermined amount (YES in step S300), the control unit 50 executes processing to stop compression molding in the resin molding unit 300 (step S310).

[0060] In this way, compression molding is stopped when it is detected that at least some of the electronic components C1 have fallen downward from the substrate P1 in the resin molding apparatus 1. Therefore, according to the resin molding apparatus 1, compression molding is stopped when the electronic components C1 have fallen from the substrate P1, and therefore, damage to the substrate P1 and the lower mold 330 caused by continuing compression molding when the electronic components C1 have fallen from the substrate P1 can be suppressed.

[0061] [3. Features] As described above, in the resin molding apparatus 1 according to this embodiment, the optical sensors 352, 354, 356, 358 detect that at least some of the electronic components C1 have fallen downward from the substrate P1 with the molding object O1 placed on the lower surface of the upper mold 320. Therefore, the resin molding apparatus 1 can take appropriate measures when the electronic component C1 has fallen from the substrate P1, and can therefore suppress, for example, the occurrence of problems that may occur when compression molding is continued when the electronic component C1 has fallen from the substrate P1.

[0062] The resin molding apparatus 1 is an example of a "resin molding apparatus" in the present invention. The upper mold 320 is an example of an "upper mold" in the present invention, and the lower mold 330 is an example of a "lower mold" in the present invention. The molding mold 305 is an example of a "molding mold" in the present invention. The mold clamping mechanism 350 is an example of a "mold clamping mechanism" in the present invention. The optical sensors 352, 354, 356, and 358 are an example of a "sensor" in the present invention. The control unit 50 is an example of a "control unit" in the present invention. The configuration consisting of multiple light-emitters 362 included in the optical sensors 352, 354, 356, and 358 is an example of a "light-emitter unit" in the present invention. The configuration consisting of multiple light-receivers 364 included in the optical sensors 352, 354, 356, and 358 is an example of a "light-receiving unit" in the present invention.

[0063] 4. Other Embodiments The concept of the above embodiment is not limited to the embodiment described above. Hereinafter, examples of other embodiments to which the concept of the above embodiment can be applied will be described.

[0064] <4-1> In the above embodiment, the drop of the electronic component C1 is detected by the optical sensors 352, 354, 356, and 358. However, the drop of the electronic component C1 does not necessarily have to be detected by an optical sensor. For example, the space between the upper mold 320 and the lower mold 330 may be continuously imaged from the side by an image sensor, and the drop of the electronic component C1 may be detected based on moving image data.

[0065] <4-2> In the above embodiment, the mirror 370 is disposed on the optical path between the optical sensors 356 and 358. However, the mirror 370 does not necessarily have to be disposed on the optical path between the optical sensors 356 and 358. For example, the optical sensor 358 may be disposed so as to face diagonally downward and forward, thereby ensuring entry and exit paths for the loader 21, large tray transport mechanism 44, etc. Furthermore, in the optical sensor 356, the light emitter 362 and the light receiver 364 do not have to be covered by the covers 382 and 384, respectively. In the optical sensor 358, the light emitter 362 and the light receiver 364 do not have to be covered by the covers 382 and 384, respectively.

[0066] <4-3> In the above embodiment, when a drop of the electronic component C1 is detected, compression molding is stopped in the resin molding apparatus 1. However, when a drop of the electronic component C1 is detected, compression molding in the resin molding apparatus 1 does not necessarily have to be immediately stopped. For example, when a drop of the electronic component C1 is detected, a buzzer may sound, or a screen may be displayed on the display asking the operator whether it is okay to stop compression molding.

[0067] <4-4> In the above embodiment, the light emitted by each light projector 362 may be continuous light or pulsed light.

[0068] <4-5> In the above embodiment, no intermediate plate was provided between the upper mold 320 and the lower mold 330 in the molding die 305. However, an intermediate plate may be provided between the upper mold 320 and the lower mold 330. The intermediate plate is a frame-shaped member with a rectangular hole formed in the center, and is configured to sandwich the release film F1 together with the lower mold 330. For example, by sandwiching the release film F1 between the intermediate plate and the lower mold 330, the tension applied to the release film F1 increases.

[0069] <4-6> In the above embodiment, each projector 362 includes multiple light-emitting elements. However, the configuration of each projector 362 is not limited to this. For example, the number of light-emitting elements included in projector 362 may be one. In this case, projector 362 may further include a branching member that branches the path of light emitted by the single light-emitting element into multiple paths, and the branched light may be guided to multiple light-emitting ports. In this case, the light-emitting element and the branching member may be connected by one optical fiber, and the branching member and the multiple light-emitting ports may be connected by multiple optical fibers.

[0070] Furthermore, in the above embodiment, each light receiver 364 includes multiple light receiving elements. However, the configuration of each light receiver 364 is not limited to this. For example, the light receiver 364 may include only one light receiving element. In this case, the light receiver 364 may further include an aggregation member that aggregates light guided through the multiple light receiving ports, and the aggregated light may be received by a single light receiving element. In this case, the multiple light receiving ports and the aggregation member may be connected by multiple optical fibers, and the aggregation member and the light receiving element may be connected by a single optical fiber.

[0071] The above describes exemplary embodiments of the present invention. That is, the detailed description and the accompanying drawings are disclosed for the purpose of illustrative explanation. Therefore, some of the components described in the detailed description and the accompanying drawings may be non-essential components for solving the problems. Therefore, just because these non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately recognized that these non-essential components are essential.

[0072] Furthermore, the above-described embodiments are merely illustrative of the present invention in all respects. Various improvements and modifications to the above-described embodiments are possible within the scope of the present invention. For example, at least a portion of the configuration of any of the embodiments may be combined with at least a portion of the configuration of any of the other embodiments. In other words, when implementing the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0073] [5. Notes] <Technology 1> (composition) A resin molding apparatus for performing compression molding, a molding die including an upper die and a lower die facing the upper die; a mold clamping mechanism for clamping the molding die, the mold clamping is performed in a state where a molding object is placed on the lower surface of the upper mold and a resin is placed on the upper surface of the lower mold; the molding object includes a substrate and a plurality of electronic components arranged on the substrate, With the molding object placed on the lower surface, each of the plurality of electronic components is located below the substrate, The resin molding apparatus further includes a sensor that detects whether at least some of the plurality of electronic components have fallen downward from the substrate while the molding object is placed on the lower surface. (Effects, etc.) In this resin molding apparatus, a sensor detects that at least some of the electronic components have fallen from the substrate while the molding object is placed on the underside of the upper mold. Therefore, this resin molding apparatus can take appropriate measures when an electronic component falls from the substrate, thereby preventing problems that may occur when compression molding is continued after an electronic component has fallen from the substrate.

[0074] <Technology 2> (composition) The resin molding device of Technology 1 further includes a control unit that executes processing to stop the compression molding when the sensor detects that at least some of the plurality of electronic components have fallen downward from the substrate. (Effects, etc.) In this resin molding apparatus, compression molding is stopped when a sensor detects that at least some of the electronic components have fallen from the substrate. Therefore, with this resin molding apparatus, compression molding is stopped when an electronic component falls from the substrate, so that damage to the substrate and the lower mold caused by continuing compression molding when an electronic component falls from the substrate can be suppressed.

[0075] <Technology 3> (composition) The sensor a light projecting unit that projects light into a space between the upper mold and the lower mold when the mold clamping is not performed; a light receiving unit that receives the light irradiated by the light projecting unit, The resin molding device according to Technology 1 or Technology 2, wherein the sensor detects that at least some of the electronic components have fallen downward from the board based on the light reception result by the light receiving unit. (Effects, etc.) In this resin molding device, it is detected that at least some of the electronic components have fallen from the substrate based on the light reception result by the light receiving unit. Therefore, with this resin molding device, it is possible to take appropriate measures when an electronic component has fallen from the substrate, and therefore it is possible to suppress the occurrence of problems that may occur when compression molding is continued when an electronic component has fallen from the substrate.

[0076] <Technology 4> (composition) The resin molding device according to Technology 3, wherein at least a part of the optical path between the light projecting unit and the light receiving unit is inclined with respect to each of the lower surface and the upper surface. (Effects, etc.) In this resin molding apparatus, at least a portion of the optical path between the light-projecting unit and the light-receiving unit is inclined with respect to the lower surface of the upper mold and the upper surface of the lower mold. Therefore, with this resin molding apparatus, even if there is a restriction on the size of the space between the upper mold and the lower mold, it is easier to ensure entry and exit paths for various mechanisms (e.g., mechanisms for transporting the object to be molded or resin) into the space, compared to a case in which the entire optical path between the light-projecting unit and the light-receiving unit is parallel to the lower surface of the upper mold and the upper surface of the lower mold.

[0077] <Technology 5> (composition) the light-projecting unit includes a first light-projecting unit and a second light-projecting unit, the light receiving unit includes a first light receiving unit and a second light receiving unit, In a plan view, the shape of the mold is rectangular, the rectangle includes first and second sides opposed to each other, and third and fourth sides opposed to each other, the first light-emitting portion is formed along the first side, the first light receiving portion is formed along the second side, the second light-emitting portion is formed along the third side, The resin molding device according to Technology 3 or Technology 4, wherein the second light receiving portion is formed along the fourth side. (Effects, etc.) In this resin molding device, the optical path between the first light-emitting unit and the first light-receiving unit and the optical path between the second light-emitting unit and the second light-receiving unit intersect. Therefore, with this resin molding device, even if an electronic component is dropped with its long side parallel to one of the optical paths, the electronic component can block the other optical path, thereby preventing detection failures due to the dropped posture of the electronic component.

[0078] <Technology 6> (composition) the light-projecting unit includes a first light-projecting unit and a second light-projecting unit, each of the first light-projecting unit and the second light-projecting unit includes a plurality of light-projectors; the light receiving unit includes a first light receiving unit and a second light receiving unit, each of the first light receiving unit and the second light receiving unit includes a plurality of light receivers; In a plan view, the shape of the mold is rectangular, the rectangle includes a first side and a second side opposite each other, a plurality of light-emitters included in the first light-emitter unit are arranged in a row along the first side, a plurality of light receivers included in the first light receiving unit are arranged in a row along the first side, a plurality of light-emitters included in the first light-emitter unit are located above a plurality of light-receivers included in the first light-receiving unit, a plurality of light-emitters included in the first light-emitter unit and a plurality of light-receivers included in the first light-receiving unit are arranged in a staggered pattern, a plurality of light-emitters included in the second light-emitter unit are arranged in a row along the second side, a plurality of light receivers included in the second light receiving unit are arranged in a row along the second side, a plurality of light-emitters included in the second light-emitter unit are located below a plurality of light-receivers included in the second light-receiving unit, The resin molding device of Technology 3 or Technology 4, wherein the plurality of light-emitters included in the second light-emitter unit and the plurality of light-receivers included in the second light-receiving unit are arranged in a staggered pattern. (Effects, etc.) In this resin molding apparatus, the multiple light-emitters included in the first light-emitter unit and the multiple light-receivers included in the first light-receiving unit are arranged in a staggered pattern, and the multiple light-emitters included in the second light-emitter unit and the multiple light-receivers included in the second light-receiving unit are arranged in a staggered pattern. Therefore, with this resin molding apparatus, the width between each optical path is relatively narrow, allowing for relatively high-accuracy detection of falling electronic components. Furthermore, with this resin molding apparatus, there is a certain amount of space between adjacent light-emitters and adjacent light-receivers, making it difficult for each light-receiver to receive light irradiated by any light other than the corresponding light-emitter, thereby reducing the occurrence of false detection of falling electronic components.

[0079] <Technology 7> (composition) At least a portion of each of the plurality of light projectors is covered by a first cover having a first slit formed therein; The resin molding device of Technology 6, wherein each of the plurality of light projectors irradiates light into the space through the first slit. (Effects, etc.) In this resin molding apparatus, light emitted by each of the plurality of light projectors enters the space between the upper mold and the lower mold through the first slit, and therefore, with this resin molding apparatus, the first slit suppresses the spread of light, thereby suppressing reflection of light from each of the upper mold and the lower mold.

[0080] <Technology 8> (composition) At least a portion of each of the plurality of light receivers is covered with a second cover having a second slit formed therein; The resin molding device according to Technology 6 or Technology 7, wherein each of the plurality of light receiving sections receives the light irradiated by the light projecting section through the second slit. (Effects, etc.) In this resin molding apparatus, the light emitted by the light-projecting unit enters each of the plurality of light-receiving units through the second slit, and therefore, the angle of incidence of the light to each light-receiving unit is limited, thereby making it possible to prevent light reflected by each of the upper and lower molds from entering each light-receiving unit.

[0081] <Technology 9> (composition) A method for manufacturing a resin molded product using a resin molding device according to any one of techniques 1 to 8, placing the molding object on the lower surface; placing a resin on the upper surface; and clamping the molding die. (Effects, etc.) In this method for manufacturing a resin molded product, a sensor detects that at least some of the electronic components have fallen from the substrate while the molding object is placed on the lower surface of the upper mold. Therefore, this method for manufacturing a resin molded product allows appropriate measures to be taken when an electronic component has fallen from the substrate, thereby preventing, for example, problems that may occur when compression molding is continued after an electronic component has fallen from the substrate. [Explanation of symbols]

[0082] 1 resin molding device, 10 substrate loading / unloading module, 11 loading section, 12 unloading section, 13 inspection section, 14 arm mechanism, 14a suction hand section, 14b arm section, 14c drive section, 20 substrate transfer module, 21 loader, 22 unloader, 30 molding module, 40 resin supply module, 41 small tray, 42 small tray transport mechanism, 43 large tray, 44 large tray transport mechanism, 50 control section, 100 resin material storage device, 300 resin molding section, 305 molding mold, 310 fixed platen, 320 upper mold, 330 lower mold, 331 bottom member, 332 side member, 333 spring, 334 base plate, 340 movable platen, 350 mold clamping mechanism, 352, 354, 356, 358 optical sensor, 360 substrate, 362 Emitter, 364 receiver, 370 mirror, 382, ​​384 cover, C1 electronic component, F1 release film, L1 rail, LP1 optical path, O1 molding object, P1 substrate, R1 resin material, S1, S2 slit, SD1, SD2, SD3, SD4 sides.

Claims

1. A resin molding apparatus for performing compression molding, a molding die including an upper die and a lower die facing the upper die; a mold clamping mechanism for clamping the molding die, the mold clamping is performed in a state where a molding object is placed on the lower surface of the upper mold and a resin is placed on the upper surface of the lower mold; the molding object includes a substrate and a plurality of electronic components arranged on the substrate, With the molding object placed on the lower surface, each of the plurality of electronic components is located below the substrate, The resin molding apparatus further includes a sensor that detects whether at least some of the plurality of electronic components have fallen downward from the substrate while the molding object is placed on the lower surface.

2. The resin molding apparatus according to claim 1, further comprising a control unit that executes processing to stop the compression molding when the sensor detects that at least some of the plurality of electronic components have fallen downward from the substrate.

3. The sensor a light projecting unit that projects light into a space between the upper mold and the lower mold when the mold clamping is not performed; a light receiving unit that receives the light irradiated by the light projecting unit, 3. The resin molding apparatus according to claim 1, wherein the sensor detects whether at least some of the electronic components have fallen downward from the substrate based on the light reception result from the light receiving section.

4. The resin molding apparatus according to claim 3 , wherein at least a part of an optical path between the light projecting unit and the light receiving unit is inclined with respect to each of the lower surface and the upper surface.

5. the light-projecting unit includes a first light-projecting unit and a second light-projecting unit, the light receiving unit includes a first light receiving unit and a second light receiving unit, In a plan view, the shape of the mold is rectangular, the rectangle includes first and second sides opposed to each other, and third and fourth sides opposed to each other, the first light-emitting portion is formed along the first side, the first light receiving portion is formed along the second side, the second light-emitting portion is formed along the third side, The resin molding apparatus according to claim 3 or 4, wherein the second light receiving portion is formed along the fourth side.

6. the light-projecting unit includes a first light-projecting unit and a second light-projecting unit, each of the first light-projecting unit and the second light-projecting unit includes a plurality of light-projectors; the light receiving unit includes a first light receiving unit and a second light receiving unit, each of the first light receiving unit and the second light receiving unit includes a plurality of light receivers; In a plan view, the shape of the mold is rectangular, the rectangle includes a first side and a second side opposite each other, a plurality of light-emitters included in the first light-emitter unit are arranged in a row along the first side, a plurality of light receivers included in the first light receiving unit are arranged in a row along the first side, a plurality of light-emitters included in the first light-emitter unit are located above a plurality of light-receivers included in the first light-receiving unit, a plurality of light-emitters included in the first light-emitter unit and a plurality of light-receivers included in the first light-receiving unit are arranged in a staggered pattern, a plurality of light-emitters included in the second light-emitter unit are arranged in a row along the second side, a plurality of light receivers included in the second light receiving unit are arranged in a row along the second side, a plurality of light-emitters included in the second light-emitter unit are located below a plurality of light-receivers included in the second light-receiving unit, 5. The resin molding apparatus according to claim 3, wherein the plurality of light-emitters included in the second light-emitter section and the plurality of light-receivers included in the second light-receiving section are arranged in a staggered pattern.

7. At least a portion of each of the plurality of light projectors is covered by a first cover having a first slit formed therein; The resin molding apparatus according to claim 6 , wherein each of the plurality of light projectors irradiates the space with light through the first slit.

8. At least a portion of each of the plurality of light receivers is covered with a second cover having a second slit formed therein; 8. The resin molding apparatus according to claim 6, wherein each of the plurality of light receiving sections receives the light emitted by the light projecting section through the second slit.

9. A method for manufacturing a resin molded product using the resin molding apparatus according to any one of claims 1 to 8, placing the molding object on the lower surface; placing a resin on the upper surface; and clamping the molding die.

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