Printed circuit board, and electronic control device

Abstract

To provide a printed circuit board capable of improving the reliability of solder connections.SOLUTION: The printed circuit board includes: an insulated circuit board; and a power supply pattern 12 formed on at least one surface S1 of the insulated circuit board as part of the conductive wiring. The printed circuit board also includes an insulating portion 18 on one side of which a power supply pattern is not formed; and a terminal land 14 that is a part where the solder connects, where another part is formed adjacent to the insulating part with a part of which is connected to the power supply pattern. The printed circuit board further includes a conductive extension pattern 17a surrounded by the insulating portion extending from the terminal land.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a printed circuit board and an electronic control device. [Background technology]

[0002] One example of a printed circuit board is the technology disclosed in Patent Document 1. The printed circuit board has a thermal land in which at least half of the circumference of a through hole is covered with a solid pattern. The thermal land consists of the solid pattern, multiple bridge circuits that connect the solid pattern to the through hole, and a thermal gap. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-109020 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the thermal land bridge is directly connected to the solid pattern. Therefore, heat during soldering on a printed circuit board is dissipated into the solid pattern. This can lead to reduced solderability and reduced solder connection reliability. Furthermore, further improvements are needed for printed circuit boards and electronic control devices in the above and other aspects not mentioned.

[0005] One disclosed object is to provide a printed circuit board with improved solder connection reliability. Another disclosed object is to provide an electronic control device with improved solder connection reliability. [Means for solving the problem]

[0006] The printed circuit board disclosed herein is An insulating substrate (11), a solid pattern (12, 13) that is part of a conductive wiring portion and is provided on at least one surface of the insulating substrate; a non-formed portion (18) on one surface where no solid pattern is formed; an electrode connection portion (14) which is a portion to which the solder (50) is connected, and which is provided so that a portion of the electrode connection portion is continuous with the solid pattern and another portion of the electrode connection portion is adjacent to the non-formed portion; The conductive extension patterns (17a to 17e) are surrounded by the non-forming portion and extend from the electrode connection portion.

[0007] The printed circuit board disclosed herein has an electrode connection portion, part of which is connected to the solid pattern and part of which is adjacent to the non-forming portion. The extension pattern extending from the electrode connection portion is surrounded by the non-forming portion. Therefore, the extension pattern is heated when soldering to the electrode connection portion, and heat is not easily dissipated into the solid pattern. Therefore, the printed circuit board can suppress deterioration of solderability and improve solder connection reliability.

[0008] The electronic control device disclosed herein comprises: An electronic control device comprising a printed circuit board (10) and electronic components (40) mounted on the printed circuit board, The printed circuit board is An insulating substrate (11), a solid pattern (12, 13) that is part of a conductive wiring portion and is provided on at least one surface of the insulating substrate; a non-formed portion (18) on one surface where no solid pattern is formed; an electrode connection portion (14) which is a portion to which the solder (50) is connected, and which is provided so that a portion of the electrode connection portion is continuous with the solid pattern and another portion of the electrode connection portion is adjacent to the non-formed portion; The conductive extension patterns (17a to 17e) are surrounded by non-forming portions and extend from the electrode connection portions, The electronic component is electrically connected to the wiring portion.

[0009] In this way, the electronic control device includes the above-described printed circuit board, and therefore the reliability of the solder connections in the electronic control device is improved.

[0010] The various aspects disclosed in this specification employ different technical means to achieve their respective objectives. The reference numerals in parentheses in the claims and in this section are intended to exemplify correspondences with the following embodiments and are not intended to limit the technical scope. The objectives, features, and advantages disclosed in this specification will become more apparent by reference to the following detailed description and the accompanying drawings. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a plan view showing a schematic configuration of an electronic control device according to a first embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 2 is an enlarged plan view of part III in FIG. [Figure 4] FIG. 10 is a plan view showing a schematic configuration of an electronic control device in a first modified example. [Figure 5] FIG. 10 is a plan view showing a schematic configuration of an electronic control device in a second modified example. [Figure 6] FIG. 11 is a plan view showing a schematic configuration of an electronic control device in a third modified example. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. [Figure 8] FIG. 10 is a cross-sectional view showing a schematic configuration of an electronic control device according to a second embodiment. [Figure 9] FIG. 10 is a partial plan view showing a schematic configuration of an electronic control device according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, several embodiments for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, parts corresponding to matters described in the preceding embodiment may be assigned the same reference numerals, and duplicated explanations may be omitted. In each embodiment, when only a part of the configuration is described, the other parts of the configuration may be applied by referring to the other embodiment described previously.

[0013] In the following description, the three mutually orthogonal directions are referred to as the X direction, the Y direction, and the Z direction, and the plane defined by the X direction and the Y direction is referred to as the XY plane.

[0014] (First embodiment) A printed circuit board 10 of this embodiment and an electronic control device 100 including the printed circuit board 10 will be described with reference to FIGS. 1 to 3. FIG.

[0015] <Electronic control device 100> 1 and 2, the electronic control device 100 includes a printed circuit board 10, a power connector 21, an external connector 22, and electronic components 40. The electronic control device 100 may further include a housing to accommodate these components. The printed circuit board 10 will be described later. A structure in which the connectors 21, 22, and electronic components 40 are mounted on the printed circuit board 10 can also be called a circuit board or a printed circuit board.

[0016] The power connector 21 is mounted on the printed circuit board 10. The power connector 21 is a connector for electrically connecting the electronic control device 100 to a power supply device provided outside the electronic control device 100. The power supply device is a device that supplies operating power to the electronic components 40, etc.

[0017] The power connector 21 includes, for example, a power terminal 21a, a ground terminal 21b, and a connector case 21c. The connector case 21c holds the power terminal 21a and the ground terminal 21b so that both ends of the power terminal 21a and the ground terminal 21b are exposed. The terminals 21a and 21b are electrically connected to the wiring portion of the printed circuit board 10 via a conductive connecting member. The conductive connecting member can be made of solder, silver paste, or the like.

[0018] The external connector 22 is mounted on the printed circuit board 10. The external connector 22 is a connector for electrically connecting the electronic control device 100 to a load device provided outside the electronic control device 100. The load device is a device that is driven and controlled by the electronic control device 100.

[0019] The external connector 22 includes, for example, a power terminal 22a, a ground terminal 22b, and a connector case 22c. The connector case 22c holds the power terminal 22a and the ground terminal 22b so that both ends of the power terminal 22a and the ground terminal 22b are exposed. Both terminals 22a and 22b are electrically connected to the wiring portion of the printed circuit board 10 via a conductive connecting member.

[0020] The power connector 21 and the external connector 22 correspond to insertion-mounted components. The terminals 21a, 21b, 22a, and 22b correspond to the terminals of the insertion-mounted components. In Fig. 2, for the sake of simplicity, the connector cases 21c and 22c and the power terminals 21a and 22a are shown by dashed double-dashed lines.

[0021] The electronic components 40 are mounted on the printed circuit board 10. The electronic components 40 are components that constitute an electronic circuit together with the wiring portion of the printed circuit board 10. A plurality of electronic components 40 are mounted on the printed circuit board 10. In other words, the electronic control device 100 is equipped with a plurality of electronic components 40. The terminals of the electronic components 40 are electrically connected to the wiring portion of the printed circuit board 10 via conductive connecting members. The electronic components 40 can also be considered circuit elements or circuit devices.

[0022] The electronic components 40 include switching elements, resistor elements, capacitor elements, coils, etc. The switching elements are semiconductor switching elements such as MOSFETs and IGBTs. One of the electronic components 40 may be a drive circuit that outputs a drive signal to an external load. One of the electronic components 40 may be a power supply circuit that generates internal power for the electronic control device 100 from power supplied from a power supply device. Note that the printed circuit board 10 may have a drive circuit and a power supply circuit mounted thereon as the electronic components 40.

[0023] In this embodiment, a surface-mount type electronic component 40 is used as an example. However, the present disclosure is not limited to this, and an insertion-mount type electronic component 40 can also be used. The surface-mount type electronic component 40 is also referred to as an SMD 40. SMD is an abbreviation for Surface Mount Device. The insertion-mount type electronic component 40 is also referred to as a THD 40. THD is an abbreviation for Through Hole Device.

[0024] <Printed circuit board 10> Here, the printed circuit board 10 will be described with reference to Figures 1, 2 and 3. The printed circuit board 10 includes an electrically insulating substrate 11 and conductive wiring portions 12 to 15 and 17a.

[0025] As shown in Figures 1 and 2, insulating substrate 11 has one surface S1 and a back surface S2 that is the opposite surface to the first surface. One surface S1 and the back surface S2 are flat surfaces along the XY plane. Insulating substrate 11 has four side surfaces S3 to S6. Side surfaces S3 to S6 are surfaces that are continuous with one surface S1 and the back surface S2. First side surface S3 and second side surface S4 are surfaces that face each other. Third side surface S5 and fourth side surface S6 are surfaces that face each other.

[0026] The wiring portions 12 to 15, 17a include wiring patterns 12 to 14, 17a formed by patterning a conductive thin film (such as copper foil), and interlayer connection portions 15 formed in through holes 16 by plating or the like.

[0027] As shown in FIG. 2, the through hole 16 is a hole formed from one surface S1 to the back surface S2 of the insulating substrate 11. The through hole 16 is a hole constituting a through hole. The insulating substrate 11 has an interlayer connection portion 15 formed on the surface constituting the through hole 16. The interlayer connection portion 15 is connected to a terminal land 14 formed on the one surface S1. The interlayer connection portion 15 can also be called a through electrode portion. The terminal land 14 will be explained later.

[0028] The through-holes include terminal lands 14, interlayer connection portions 15, and through holes 16. The through-holes are electrodes for connectors 21 and 22, which are insertion-mounted components. That is, terminals 21a, 21b, 22a, and 22b of connectors 21 and 22 are inserted into through holes 16. Terminals 21a, 21b, 22a, and 22b are electrically connected to terminal lands 14 and interlayer connection portions 15 by solder 50.

[0029] In this embodiment, an example is adopted in which through holes are formed in two locations for the power supply pattern 12, which will be described later, and in two locations for the ground pattern 13. Furthermore, the printed circuit board 10 may have through holes for the THD 40 formed therein.

[0030] 2, for simplicity, the solder 50 is shown only on the power terminal 22a side. However, the solder 50 is provided corresponding to each of the terminals 21a, 21b, 22a, and 22b. Therefore, the solder 50 is connected to each through-hole.

[0031] 1 and 2, the power supply pattern 12 is provided on at least one surface S1 of the insulating substrate 11. The power supply pattern 12 is a wiring pattern for passing current. Therefore, the power supply pattern 12 can also be said to be a wiring pattern for supplying current. The power supply pattern 12 is also a wiring pattern to which the power supply terminals 21a and 22a are electrically connected.

[0032] A plurality of power supply patterns 12 are formed on one surface S1. The power supply patterns 12 are electrically connected to terminals of electronic components 40. Adjacent power supply patterns 12 are electrically connected via the electronic components 40.

[0033] 1, the ground pattern 13 is provided on at least one surface S1 of the insulating substrate 11. The ground pattern 13 is a wiring pattern for passing a current, similar to the power supply pattern 12. Therefore, the ground pattern 13 can also be said to be a wiring pattern for a current. The ground pattern 13 is also a wiring pattern to which the ground terminals 21b and 22b are electrically connected.

[0034] 1 to 3 indicate the general direction of current. That is, in power supply pattern 12, current flows from power supply terminal 21a toward electronic component 40. In addition, in power supply pattern 12, current flows from electronic component 40 toward power supply terminal 22a. Meanwhile, in ground pattern 13, current flows from ground terminal 22b toward ground terminal 21b.

[0035] The power supply pattern 12 and the ground pattern 13 correspond to solid patterns. A solid pattern is part of the wiring section. A solid pattern is a wiring pattern that is painted solid. The power supply pattern 12 and the ground pattern 13 are wiring patterns that have a larger area than the terminal land 14, which will be explained later. The power supply pattern 12 and the ground pattern 13 are wiring patterns for passing a large current. The power supply pattern 12 and the ground pattern 13 are wiring patterns that have a larger area than the signal wiring, i.e., are wide wiring patterns. The signal wiring is, for example, a wiring pattern connected to the gate electrode of a MOSFET. Hereinafter, the power supply pattern 12 and the ground pattern 13 will also be collectively referred to as solid patterns.

[0036] 1 to 3, printed circuit board 10 has an insulating section 18 on one surface S1 where power supply pattern 12 and ground pattern 13 are not formed. Insulating section 18 is formed by patterning power supply pattern 12 and ground pattern 13 so that one surface S1 is exposed. Insulating section 18 is provided around terminal lands 14, which will be described later.

[0037] The insulating portion 18 is provided to improve the solderability of the terminal land 14. In other words, the insulating portion 18 is provided to prevent heat from escaping from the terminal land 14 to the solid pattern during soldering. The insulating portion 18 corresponds to a non-formed portion. The insulating portion 18 can also be said to be an area where the solid pattern is removed. The reference line RL in FIG. 3 is an imaginary line indicating the boundary between the power supply pattern 12 and the insulating portion 18.

[0038] 1, 2, and 3, terminal lands 14 are provided in series with the power supply pattern 12 and the ground pattern 13. In other words, the terminal lands 14 are wiring patterns that are continuous with the power supply pattern 12 and the ground pattern 13. The terminal lands 14 are portions to which solder 50 is connected. In this embodiment, as an example, an example is adopted in which two terminal lands 14 are provided for the power supply pattern 12 and two terminal lands 14 are provided for the ground pattern 13. In the following, the terminal lands 14 to which the power supply terminal 21a is connected will be used for explanation.

[0039] As shown in Fig. 3, the terminal land 14 is provided in a ring shape around the through hole 16. A portion of the terminal land 14 is continuous with the power supply pattern 12. Furthermore, another portion of the terminal land 14 is provided adjacent to the insulating portion 18. The terminal land 14 corresponds to an electrode connection portion. The terminal land 14 can also be called a through-hole land.

[0040] The terminal land 14 can be divided into a communication portion 141 and an insulating side portion 142, with the reference line RL as the boundary. The communication portion 141 is a portion that is connected to the power supply pattern 12. The communication portion 141 is a portion that is closer to the power supply pattern 12 than the reference line RL. The communication portion 141 can also be said to be a portion that is closer to the electronic component 40 than the reference line RL. The communication portion 141 can also be considered to be part of the power supply pattern 12.

[0041] The insulating side portion 142 is a portion adjacent to the insulating portion 18. The insulating side portion 142 is a portion closer to the insulating portion 18 than the reference line RL. The insulating side portion 142 can also be said to be a portion on the opposite side of the reference line RL from the electronic component 40. The insulating side portion 142 can also be considered to be a portion extended from the power supply pattern 12. Adjacent means adjacent when viewed in the XY plane as shown in FIG. 3.

[0042] The extension pattern 17a is a wiring pattern surrounded by the insulating portion 18 and extended from the terminal land 14. A portion of the extension pattern 17a is continuous with the insulating side portion 142. The extension pattern 17a is not in direct contact with the power supply pattern 12. It can be said that the extension pattern 17a extends from the terminal land 14 to a position where it is not connected to the power supply pattern 12. In other words, the extension pattern 17a is a portion separated from the power supply pattern 12. The extension pattern 17a is provided in the insulating portion 18 without connecting the terminal land 14 and the power supply pattern 12. In this embodiment, as an example, a rectangular extension pattern 17a is adopted. However, the present disclosure is not limited to this.

[0043] The terminal land 14 on the ground pattern 13 side can be divided into a communicating portion 141 and an insulating side portion 142, as described above. Furthermore, an extension pattern 17a is provided in a continuous manner on the terminal land 14 on the ground pattern 13 side. In this case, the communicating portion 141 is a portion on the ground pattern 13 side of the reference line RL. The insulating side portion 142 is a portion on the insulating portion 18 side of the reference line RL. The communicating portion 141 can also be considered to be part of the ground pattern 13. The insulating side portion 142 can also be considered to be a portion extended from the ground pattern 13. The extension pattern 17a is not in direct contact with the ground pattern 13.

[0044] Here, the positional relationship between the power supply pattern 12, terminal lands 14, and insulating portion 18 will be described. As shown in FIG. 1, the power supply pattern 12 is provided closer to the electronic component 40 than the terminal lands 14. In other words, most of the power supply pattern 12 is provided closer to the electronic component 40 than the terminal lands 14. The insulating portion 18 is provided on the opposite side of the terminal lands 14 from the electronic component 40. Therefore, in the current direction, the insulating portion 18, terminal lands 14, and power supply pattern 12 are arranged in this order. In the printed circuit board 10, an extension pattern 17a is provided on the insulating portion 18 arranged in this manner.

[0045] Therefore, when a current flows through the solid pattern of the terminal land 14, the current density is higher in the connecting portion 141 than in the insulating side portion 142. In the printed circuit board 10, the wiring pattern is arranged so that the connecting portion 141, which has a high current density, is connected to the solid pattern, and the insulating side portion 142, which has a low current density, does not come into direct contact with the solid pattern, taking into account the direction of current flow.

[0046] Next, the widths of the solid pattern and the terminal lands 14 will be described. Here, width refers to the width (length) in the Y direction. As shown in FIGS. 1 and 3, the width WW of the solid pattern is wider than the width LW of the terminal land 14. The width LW of the terminal land 14 is the width of the portion of the terminal land 14 that is connected to the solid pattern. This makes it easier for current to flow between the terminal land 14 and the solid pattern on the printed circuit board 10. Note that the width LW of the terminal land 14 is preferably set to a level that does not adversely affect the insulating portion 18 due to the temperature generated by the terminal land 14 when a current is passed through the solid pattern.

[0047] <Effects> As described above, the printed circuit board 10 has terminal lands 14, some of which are connected to the solid pattern and other parts of which are adjacent to the insulating portion 18. The extension pattern 17a extending from the terminal land 14 is surrounded by the insulating portion 18. Therefore, the extension pattern 17a is heated when soldering to the terminal land 14, and the heat is not easily dissipated into the solid pattern. In addition, the heat of the extension pattern 17a is transferred to the terminal land 14.

[0048] Therefore, the printed circuit board 10 can suppress a decrease in temperature of the terminal lands 14 and even the interlayer connections 15 during soldering. As a result, the printed circuit board 10 can suppress a decrease in solderability and improve the connection reliability of the solder 50. In other words, the printed circuit board 10 can improve the connection reliability of the solder 50 compared to a configuration (comparative example) that includes thermal lands in which the terminal lands 14 and the solid pattern are connected via a bridge.

[0049] Furthermore, in the comparative example, a current flows through the bridge. As a result, heat is generated in the bridge. In particular, when a large current flows through a solid pattern, the temperature rise in the bridge is significant. Therefore, in the comparative example, when the glass transition temperature of the insulating substrate is exceeded, the reliability and quality of the printed circuit board deteriorates.

[0050] In contrast, unlike the bridge, the printed circuit board 10 has the communicating portion 141 connected to the solid pattern. Therefore, the width of the communicating portion 141, where the current density is high, is wider in the printed circuit board 10 than in the comparative example. Therefore, the printed circuit board 10 can suppress heat generation due to current flow, and suppress deterioration in the reliability quality of the printed circuit board 10. In this way, the printed circuit board 10 can simultaneously suppress heat generation due to current flow and improve the connection reliability of the solder 50.

[0051] The electronic control device 100 includes such a printed circuit board 10 and electronic components 40 mounted on the printed circuit board 10. Therefore, the electronic control device 100 has improved connection reliability of the solder 50. Furthermore, the electronic control device 100 can suppress heat generation due to current flow.

[0052] The preferred embodiments of the present disclosure have been described above. However, the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the present disclosure. Below, Modifications 1 to 3 and the second embodiment will be described as other aspects of the present disclosure. The above embodiments, Modifications 1 to 3, and the second embodiment can be implemented independently, or can be implemented in appropriate combinations. The present disclosure is not limited to the combinations shown in the embodiments, and can be implemented in various combinations.

[0053] (Variation 1) 4, the printed circuit board 10 may have a plurality of extension patterns 17b extending from the terminal lands 14. The plurality of extension patterns 17b may be provided radially. Furthermore, the extension patterns 17b may be provided in a curved line.

[0054] (Variation 2) 5, the printed circuit board 10 may be provided with a T-shaped extension pattern 17c. That is, the extension pattern 17c includes a portion that extends linearly from the insulating side portion 142 and a portion that is perpendicular to the portion.

[0055] As described above, the extension patterns 17a to 17c are formed in the insulating portion 18. The shape and area of ​​the insulating portion 18 are limited to prevent the printed circuit board 10 from becoming large. Therefore, it is preferable that the extension patterns 17a to 17c are formed in the limited insulating portion 18 so as to ensure the amount of heat received during soldering.

[0056] (Variation 3) 6 and 7, the extended pattern 17d may be laminated in multiple layers with insulating substrates 11 interposed therebetween. In other words, the printed circuit board 10 is a multilayer board in which wiring patterns are laminated in multiple layers with insulating substrates 11 interposed therebetween. The extended pattern 17d may be provided on each layer of the printed circuit board 10.

[0057] Furthermore, the stacked extended patterns 17d may be electrically connected by interlayer connection portions 17d1. The interlayer connection portions 17d1 are provided on the insulating substrate 11 and connected to the extended patterns 17d of each layer. The interlayer connection portions 17d1 are so-called via holes.

[0058] (Second embodiment) An electronic control device 101 and a printed circuit board 10a according to a second embodiment will be described with reference to Figures 8 and 9. Figure 8 is a cross-sectional view corresponding to Figure 2. Figure 9 is a partial plan view of an area including terminal lands 14. The electronic control device 101 differs from the electronic control device 100 mainly in that it includes an inter-board connector 23. The printed circuit board 10a also differs from the printed circuit board 10 mainly in the configuration of the terminal lands 14.

[0059] The electronic control device 101 includes a printed circuit board 10a. A board-to-board connector 23 is mounted on the printed circuit board 10a instead of the connectors 21 and 22. The board-to-board connector 23 is a connector that electrically connects printed circuit boards arranged opposite each other.

[0060] 8 and 9, the printed circuit board 10a is provided with a power supply pattern 12, which is a part of a solid pattern, as in the above embodiment. The printed circuit board 10a also has an insulating portion 18 on one surface S1 where no solid pattern is formed. Electronic components 40 are mounted on the printed circuit board 10a.

[0061] 8 and 9, board-to-board connector 23 includes power terminal 23a, connector case 23c, and signal terminal 23d. Connector case 23c holds power terminal 23a and signal terminal 23d so that a portion of power terminal 23a and a portion of signal terminal 23d are exposed. Unlike connectors 21 and 22, board-to-board connector 23 is a surface-mounted connector. Board-to-board connector 23 corresponds to a surface-mounted component.

[0062] 9, the printed circuit board 10a is provided with a signal pattern 19, which is part of the wiring pattern. The signal pattern 19 is connected to a signal land 191. The signal land 191 is connected to a signal terminal 23d. The signal land 191 can also be called a signal pad.

[0063] Furthermore, the printed circuit board 10a has terminal lands 14 on one surface S1. The power supply terminals 23a are connected to the terminal lands 14. In other words, the terminal lands 14 are lands for surface mounting. The terminal lands 14 can also be called terminal pads.

[0064] As in the above embodiment, the terminal land 14 is a portion to which the solder 50 is connected. A portion of the terminal land 14 is connected to the solid pattern, and another portion is provided adjacent to the insulating portion 18. Here, as an example, the terminal land 14 is provided so as to be connected to the power supply pattern 12. Furthermore, the printed circuit board 10a is surrounded by the insulating portion 18 and is provided with a conductive extension pattern 17e extending from the terminal land 14.

[0065] The electronic control device 101 can achieve the same effects as the electronic control device 100.

[0066] Although the present disclosure has been described with reference to the embodiments, it is understood that the present disclosure is not limited to the embodiments or structures. The present disclosure also encompasses various modifications and modifications within the scope of equivalents. In addition, although various combinations and forms are shown in the present disclosure, other combinations and forms including only one element, more, or less than one element are also within the scope and spirit of the present disclosure.

[0067] (Disclosure of technical ideas) This specification discloses multiple technical ideas described in the following multiple clauses. Some clauses may be written in a multiple dependent form, with the subsequent clause referring to the preceding clause as an alternative. Furthermore, some clauses may be written in a multiple dependent form, referring to another multiple dependent clause. These multiple dependent clauses define multiple technical ideas.

[0068] (Technical thought 1) An insulating substrate (11), a solid pattern (12, 13) that is a part of a conductive wiring portion and is provided on at least one surface of the insulating substrate; a non-formed portion (18) on the one surface where the solid pattern is not formed; an electrode connection portion (14) which is a portion to which solder (50) is connected, and which is provided with a portion connected to the solid pattern and another portion adjacent to the non-formed portion; The printed circuit board comprises a conductive extension pattern (17a to 17e) surrounded by the non-forming portion and extending from the electrode connection portion.

[0069] (Technical thought 2) The wiring board according to Technical Idea 1, wherein the width (WW) of the solid pattern is wider than the width (LW) of the portion of the electrode connection portion that is continuous with the solid pattern.

[0070] (Technical Thought 3) The printed circuit board according to Technical Idea 1 or 2, wherein a plurality of the extension patterns are extended to the electrode connection portion.

[0071] (Technical Thought 4) The printed circuit board according to Technical Idea 3, wherein the plurality of extension patterns are arranged radially.

[0072] (Technical Thought 5) the solid pattern is electrically connected to an electronic component and is provided closer to the electronic component than the electrode connection portion; The printed circuit board according to any one of Technical Ideas 1 to 4, wherein the non-forming portion is provided on the opposite side of the electrode connection portion from the electronic component.

[0073] (Technical Thought 6) The printed circuit board according to Technical Idea 5, wherein the electronic component is a power supply circuit.

[0074] (Technical Thought 7) The printed circuit board according to Technical Idea 5, wherein the electronic component is a drive circuit.

[0075] (Technical Thought 8) The insulating substrate has a through hole (16) formed from the one surface to the opposite surface of the one surface, The printed circuit board according to any one of Technical Ideas 1 to 7, wherein the electrode connection portion is provided around the through hole on the one surface and is connected to a terminal of an insertion-mounted component.

[0076] (Technical Thought 9) The printed circuit board according to any one of Technical Concepts 1 to 7, wherein the electrode connection portion is provided on the one surface and is connected to a terminal of a surface-mounted component.

[0077] (Technical Thought 10) The printed circuit board according to any one of Technical Concepts 1 to 9, wherein the extended pattern is laminated in a plurality of layers with the insulating substrate interposed therebetween.

[0078] (Technical Thought 11) The printed circuit board according to Technical Idea 10 has an interlayer connection portion (17d1) provided on the insulating substrate and electrically connecting the stacked extended patterns.

[0079] (Technical Thought 12) An electronic control device comprising a printed circuit board (10) and electronic components (40) mounted on the printed circuit board, The printed circuit board is An insulating substrate (11), a solid pattern (12, 13) that is a part of a conductive wiring portion and is provided on at least one surface of the insulating substrate; a non-formed portion (18) on the one surface where the solid pattern is not formed; an electrode connection portion (14) which is a portion to which solder (50) is connected, and which is provided with a portion connected to the solid pattern and another portion adjacent to the non-formed portion; and a conductive extension pattern (17a to 17e) surrounded by the non-forming portion and extending from the electrode connection portion, The electronic component is an electronic control device electrically connected to the wiring portion. [Explanation of symbols]

[0080] 10, 10a...printed circuit board, 11...insulating substrate, 12...power supply pattern, 13...ground pattern, 14...terminal land, 141...communicating portion, 142...insulating side portion, 15...interlayer connection portion, 16...through hole, 17a to 17e...extension patterns, 17d1...interlayer connection portion, 18...insulating portion, 40...electronic component, 50...solder, 100, 101...electronic control device,

Claims

1. An insulating substrate (11); a solid pattern (12, 13) that is a part of a conductive wiring portion and is provided on at least one surface of the insulating substrate; a non-formed portion (18) on the one surface where the solid pattern is not formed; an electrode connection portion (14) which is a portion to which solder (50) is connected, a portion of which is continuous with the solid pattern and another portion of which is adjacent to the non-formed portion; The printed circuit board comprises a conductive extension pattern (17a to 17e) surrounded by the non-forming portion and extending from the electrode connection portion.

2. 2. The printed circuit board according to claim 1, wherein a width (WW) of the solid pattern is wider than a width (LW) of a portion of the electrode connection portion that is continuous with the solid pattern.

3. The printed circuit board according to claim 1 or 2, wherein a plurality of the extension patterns extend from the electrode connection portion.

4. The printed circuit board according to claim 3 , wherein the plurality of extension patterns are provided radially.

5. the solid pattern is electrically connected to an electronic component and is provided closer to the electronic component than the electrode connection portion; 3. The printed circuit board according to claim 1, wherein the non-forming portion is provided on the opposite side of the electrode connection portion from the electronic component.

6. 6. The printed circuit board according to claim 5, wherein the electronic component is a power supply circuit.

7. 6. The printed circuit board according to claim 5, wherein the electronic component is a drive circuit.

8. The insulating substrate has a through hole (16) formed from the one surface to the opposite surface of the one surface, The printed circuit board according to claim 1 or 2, wherein the electrode connection portion is provided on the one surface around the through hole and is connected to a terminal of an insertion-mounted component.

9. 3. The printed circuit board according to claim 1, wherein the electrode connection portion is provided on the one surface and is connected to a terminal of a surface-mounted component.

10. 3. The printed circuit board according to claim 1, wherein the extended pattern is laminated in a plurality of layers with the insulating substrate interposed therebetween.

11. The printed circuit board according to claim 10, further comprising an interlayer connection portion (17d1) provided on the insulating substrate and electrically connecting the laminated extended patterns.

12. An electronic control device comprising a printed circuit board (10) and electronic components (40) mounted on the printed circuit board, The printed circuit board is An insulating substrate (11); a solid pattern (12, 13) that is a part of a conductive wiring portion and is provided on at least one surface of the insulating substrate; a non-formed portion (18) on the one surface where the solid pattern is not formed; an electrode connection portion (14) which is a portion to which solder (50) is connected, a portion of which is continuous with the solid pattern and another portion of which is adjacent to the non-formed portion; and a conductive extension pattern (17a to 17e) surrounded by the non-forming portion and extending from the electrode connection portion, The electronic component is an electronic control device electrically connected to the wiring portion.

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