Method for manufacturing base material including conductive pattern, method for manufacturing electronic device, method for manufacturing electromagnetic wave shield film, method for manufacturing planar heating element, and article for manufacturing base material including conductive pattern

Abstract

To improve adhesion, when a conductive pattern is provided on a base material using a conductive composition containing conductive particles.SOLUTION: A method for manufacturing a base material including a conductive pattern includes: a transfer step of bringing a provisional pattern provided on the surface of an easily peelable base material by a conductive composition containing conductive particles into contact with an adhesive layer provided on the surface of a base material different from the easily peelable base material, and obtaining a transfer pattern where the provisional pattern is transferred onto the surface of the adhesive layer; and a pressing step of applying at least pressure to the transfer pattern to obtain a conductive pattern.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a substrate having a conductive pattern, a method for manufacturing an electronic device, a method for manufacturing an electromagnetic wave shielding film, a method for manufacturing a sheet heating element, and an article for use in manufacturing a substrate having a conductive pattern. [Background technology]

[0002] A known technique involves forming a pattern on a substrate using a conductive composition containing conductive particles and then heating the pattern to obtain a conductive pattern. This technique is thought to be applicable to printed electronics, which has been actively developed in recent years. Printed electronics is a technology that uses printing technology to form electronic circuits, sensors, elements, etc. on a substrate such as a film.

[0003] Patent document 1 describes a method for forming a conductive film pattern, which includes the steps of forming a first conductive film pattern on a separation substrate provided with a porous receiving layer, and separating the first conductive film pattern from the separation substrate by adhering it to a substrate.

[0004] Patent Document 2 describes a transfer substrate used to temporarily hold a pattern and transfer the held pattern to a transfer target, the transfer substrate having at least a porous layer on a support and a release layer on the porous layer, the porous layer containing at least one compound selected from glycerin and polyglycerin. Patent Document 2 also describes that a conductive pattern is obtained by using this transfer substrate to form a pattern using ink or paste containing conductive fine particles.

[0005] Patent Document 3 describes a method for manufacturing a smooth wired circuit board, including (1) forming a B-stage adhesive layer on an amorphous insulating substrate using a thermosetting resin, and (2) adhesively transferring a conductive pattern formed on a film-like temporary substrate by screen printing or the like to this adhesive layer. According to the description in Patent Document 3, this manufacturing method provides a smooth wired circuit board in which the conductive pattern, which serves as the contact point of the switch, is smoothly and satisfactorily embedded so as to obtain stable switch characteristics in a printed wiring board used for a switch substrate such as a slide switch.

[0006] Patent Document 4 describes a transfer object characterized by having a substrate on which a pattern is formed using a conductive material transferred from a relief printing plate, and an adhesive layer applied to the surface of the substrate and used to adhere the conductive material.

[0007] Patent Document 5 describes a method for manufacturing a wiring board in which a conductor pattern is transferred onto a substrate by intaglio printing. Specifically, this manufacturing method includes: (1) an intaglio printing process for forming grooves on the surface of a flexible film; (2) a filling process for filling the grooves with a conductive paste after the intaglio printing process; (3) a drying process for evaporating and drying the solvent contained in the conductive paste after the filling process; (4) a transfer process for bonding the dried intaglio with the conductive paste to the substrate, which has been previously coated with a thermoplastic adhesive, after the drying process; (5) a film peeling process for peeling the film from the substrate and transferring the conductive paste onto the substrate to form a conductor pattern; and (6) a firing process for firing the conductive paste after the film peeling process. A heating process is inserted between the film peeling process and the firing process to prevent the adhesive from flowing during the firing process. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-281658 [Patent Document 2] Japanese Patent Application Publication No. 2020-161619 [Patent Document 3] Japanese Patent Application Publication No. 7-45159 [Patent Document 4] Japanese Patent Application Laid-Open No. 2004-095882 [Patent Document 5] Japanese Patent Application Laid-Open No. 2004-319731 Summary of the Invention [Problem to be solved by the invention]

[0009] When a conductive pattern is provided on a substrate using a conductive composition containing conductive particles, adhesion problems such as peeling of the pattern may arise. The present inventors have now conducted various studies with the aim of improving adhesion when forming a conductive pattern on a substrate using a conductive composition containing conductive particles. [Means for solving the problem]

[0010] The present inventors have completed the invention provided below and solved the above problems.

[0011] 1. a transfer step in which a temporary pattern formed on the surface of an easily peelable substrate using a conductive composition containing conductive particles is brought into contact with an adhesive layer formed on the surface of a substrate different from the easily peelable substrate, thereby obtaining a transfer pattern in which the temporary pattern is transferred to the surface of the adhesive layer; a pressing step of applying at least pressure to the transfer pattern to obtain a conductive pattern; A method for manufacturing a substrate having a conductive pattern, comprising: 2. 1. A method for manufacturing a substrate having the conductive pattern according to claim 1, the adhesive layer is at least one of a thermosetting layer and a photosetting layer, A method for manufacturing a substrate having a conductive pattern, comprising an adhesive layer curing step of progressing the curing of the adhesive layer between the transfer step and the pressing step. 3. A method for manufacturing a substrate having a conductive pattern according to 1. or 2., 10. A method for manufacturing a substrate having a conductive pattern, wherein the conductive particles in the temporary pattern are substantially not sintered. 4. A method for manufacturing a substrate having the conductive pattern according to any one of 1. to 3., A method for manufacturing a substrate having a conductive pattern, wherein the temporary pattern is substantially uncured. 5. A method for manufacturing a substrate having the conductive pattern according to any one of 1. to 4., a step of removing an oxide film, after the transferring step and before or simultaneously with the pressing step, bringing a component X capable of removing an oxide film on the surface of the conductive particles into contact with the transferred pattern. 6. A method for manufacturing a substrate provided with the conductive pattern according to any one of 1. to 5., In the pressing step, the transfer pattern is pressed while being heated. 7. 6. A method for manufacturing a substrate having the conductive pattern according to claim 6, In the pressing step, the transfer pattern is pressed with a pressure of 1 to 5000 MPa and heated at a temperature of 50 to 400°C. 8. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 7., The method for manufacturing a substrate having a conductive pattern, wherein the conductive composition is in a paste state at room temperature. 9. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 8., The method for producing a substrate having a conductive pattern, wherein the amount of the resin component in the conductive composition is 15 parts by mass or less per 100 parts by mass of the conductive particles. 10. A method for manufacturing a substrate having the conductive pattern according to any one of 1. to 9., A method for producing a substrate having a conductive pattern, wherein the conductive composition does not substantially contain a curable component other than the conductive particles. 11. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 10., The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. 50 A method for producing a substrate provided with a conductive pattern, wherein the thickness is 0.5 to 100 μm. 12. A method for manufacturing a substrate provided with the conductive pattern according to any one of 1. to 11., In the pressing step, the exposed surface of the transfer pattern is covered with a member, and then the transfer pattern is at least pressed. 13. A method for manufacturing a substrate provided with the conductive pattern according to any one of 1. to 12., The method for producing a substrate having a conductive pattern, wherein the easily peelable substrate is a resin film or a release paper. 14. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 13., A method for producing a substrate provided with a conductive pattern, comprising a peeling step of peeling off the easily peelable substrate before the pressing step. 15. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 14., The method for manufacturing a substrate having a conductive pattern, wherein the substrate is flexible. 16. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 15., A method for manufacturing a substrate having a conductive pattern, wherein the substrate is at least one selected from the group consisting of polyester, polyolefin, and polycarbonate. 17. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 15., The method for manufacturing a substrate having a conductive pattern, wherein the substrate is made of polyimide. 18. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 15., The method for manufacturing a substrate having a conductive pattern, wherein the substrate is paper. 19. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 18., The method for producing a substrate provided with a conductive pattern, wherein the adhesive layer has a thickness of 1 to 30 μm. 20. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 19., A method for producing a substrate provided with a conductive pattern, wherein the provisional pattern has a height of 0.5 to 100 μm. twenty one. A method for manufacturing a substrate provided with the conductive pattern according to any one of 1. to 20., A method for manufacturing a substrate provided with a conductive pattern, wherein in the transfer step, pressure is applied to enhance adhesion between the temporary pattern and the adhesive layer. twenty two. A method for manufacturing an electronic device, comprising manufacturing an electronic device using a substrate having a conductive pattern obtained by the method for manufacturing a substrate having a conductive pattern according to any one of 1. to 21. twenty three. 22. A method for producing an electronic device according to claim 22, comprising the steps of: The method for manufacturing an electronic device, wherein the electronic device is an RF tag. twenty four. A method for producing an electromagnetic wave shielding film, comprising producing an electromagnetic wave shielding film using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern according to any one of 1. to 21. twenty five. A method for producing a sheet heating element, comprising producing a sheet heating element using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern described in any one of 1. to 21. 26. A substrate; a cured adhesive layer provided on the surface of the substrate, the cured adhesive layer being a cured product of a material having at least one of photocuring and thermosetting properties; a pattern formed on the surface of the cured adhesive layer using a conductive composition containing conductive particles; 1. An article for producing a substrate with a conductive pattern, comprising: 27. 26. An article according to any one of the preceding paragraphs, The article, wherein the amount of the resin component in the pattern is 15 parts by mass or less per 100 parts by mass of the conductive particles. 28. 26. or 27., The pattern is substantially free of any curable component other than the conductive particles. 29. An article according to any one of 26. to 28., The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. 50 The particle size is 0.5 to 100 μm. 30. An article according to any one of 26. to 29., The article, wherein the substrate is flexible. 31. An article according to any one of 26. to 30., The article, wherein the substrate is at least one selected from the group consisting of polyester, polyolefin, and polycarbonate. 32. An article according to any one of 26. to 30., The article, wherein the substrate is a polyimide. 33. An article according to any one of 26. to 30., The article, wherein the substrate is paper. 34. An article according to any one of 26. to 33., The article, wherein the cured adhesive layer has a thickness of 1 to 30 μm. 35. An article according to any one of 26. to 34., An article, wherein a portion of the cured adhesive layer is cured while infiltrating into gaps between the conductive particles in the pattern. [Effects of the Invention]

[0012] According to the present invention, when a conductive pattern is provided on a substrate using a conductive composition containing conductive particles, the adhesion of the conductive pattern is improved. [Brief explanation of the drawings]

[0013] [Figure 1] 10A to 10C are diagrams illustrating a method for manufacturing a substrate provided with a conductive pattern. [Figure 2] 10A to 10C are diagrams for explaining a method for manufacturing a substrate provided with a conductive pattern. [Figure 3] 1A and 1B are diagrams for explaining the shape of a conductive pattern formed in an example. [Figure 4] 1 is an electron microscope image of a cross section of a substrate provided with a conductive pattern produced in Example I-1. [Figure 5] 1 is an electron microscope image of a cross section of a substrate provided with a conductive pattern produced in Example II-1. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings, similar components are denoted by similar reference numerals and descriptions thereof will be omitted where appropriate. To avoid complexity, (i) when there are multiple identical components in the same drawing, only one of them is given a symbol, and not all of them, or (ii) particularly in Figure 2 and subsequent figures, components similar to those in Figure 1 are not given a symbol again. All drawings are for illustrative purposes only, and the shapes and dimensional ratios of the components in the drawings do not necessarily correspond to the actual products.

[0015] In this specification, unless otherwise specified, the expression "X to Y" in the description of a numerical range means at least X and at most Y. For example, "1 to 5% by mass" means "at least 1% by mass and at most 5% by mass."

[0016] In the description of groups (atomic groups) in this specification, when a notation does not specify whether the group is substituted or unsubstituted, it encompasses both groups having no substituents and groups having a substituent. For example, the term "alkyl group" encompasses not only alkyl groups having no substituents (unsubstituted alkyl groups) but also alkyl groups having a substituent (substituted alkyl groups). In this specification, the term "(meth)acrylic" represents a concept that encompasses both acrylic and methacrylic. The same applies to similar terms such as "(meth)acrylate." Unless otherwise specified, the term "organic group" as used herein means an atomic group obtained by removing one or more hydrogen atoms from an organic compound. For example, a "monovalent organic group" refers to an atomic group obtained by removing one hydrogen atom from any organic compound. In this specification, the term "electronic device" is used to encompass elements, devices, final products, etc. to which electronic engineering technology is applied, such as semiconductor chips, semiconductor elements, printed wiring boards, electric circuit display devices, information and communication terminals, light-emitting diodes, physical batteries, and chemical batteries.

[0017] <Method of manufacturing a substrate provided with a conductive pattern> The method for manufacturing a substrate having a conductive pattern of this embodiment includes the steps of: a transfer step in which a temporary pattern formed on the surface of an easily peelable substrate using a conductive composition containing conductive particles is brought into contact with an adhesive layer formed on the surface of a substrate different from the easily peelable substrate, thereby obtaining a transfer pattern in which the temporary pattern is transferred to the surface of the adhesive layer; a pressing step of applying at least pressure to the transfer pattern to obtain a conductive pattern; Includes:

[0018] In this embodiment, the transfer pattern containing conductive particles is pressed against the adhesive layer rather than the substrate itself, which results in good adhesion of the final conductive pattern. In conventional conductive pattern formation, a conductive composition containing conductive particles is often pattern-printed onto a substrate by a printing method such as screen printing or inkjet printing. However, these printing methods, in principle, make it difficult to apply a large amount of pressure to the conductive composition during printing. In contrast, when pattern printing is performed by "transfer" using an easily peelable substrate, as in the present embodiment, a large amount of pressure can be applied to the conductive composition during printing. This large pressure is thought to be advantageous for improving adhesion. In other words, in the present embodiment, adhesion is not improved simply by providing an adhesive layer; rather, it is thought that the adhesion of the conductive pattern is particularly good due to both the provision of an adhesive layer and the adoption of a transfer method that allows for the application of high pressure during pattern formation. Incidentally, it is possible that the adhesion of the conductive pattern will be particularly good if part of the adhesive layer penetrates into the gaps between the conductive particles in the transferred pattern.

[0019] Additionally, the pressing process likely sinters the conductive particles in the transferred pattern, which tends to improve the conductivity of the resulting conductive pattern. Furthermore, it is thought that finer and more accurate conductive patterns can be formed by forming patterns using a method known as "transfer," rather than by directly applying or printing the conductive composition onto a substrate.

[0020] Hereinafter, this embodiment will be described in more detail with reference to FIGS.

[0021] (Formation of temporary patterns on the surface of an easily peelable substrate: Figure 1P1, Figure 1P2) In this embodiment, a temporary pattern can be provided on the surface of the easily peelable substrate using a conductive composition containing conductive particles. Specifically, first, as shown in Fig. 1P1, a pattern 3 made of a conductive composition containing conductive particles, typically in the form of a paste containing a solvent, is formed on the surface of an easily peelable substrate 5. Thereafter, by volatilizing the solvent in the pattern 3, a temporary pattern (pattern 3B) can be obtained on the easily peelable substrate 5, as shown in Fig. 1P2.

[0022] The method for forming the pattern 3 is not particularly limited. Various coating and printing techniques can be applied. The pattern 3 may be provided on the entire surface of the easily peelable substrate 5, or on only a portion of the surface of the easily peelable substrate 5. In the former case, the pattern 3 can be formed by coating using a device such as a blade coater, air knife coater, doctor coater, roll coater, bar coater (rod coater), or curtain coater. In the latter case, the pattern 3 can be formed by various printing methods, such as screen printing, gravure printing, letterpress printing, lithographic printing (offset printing), inkjet printing, and transfer printing. By appropriately designing the "pattern" during printing, it is possible to produce a substrate having a pattern structure, such as a conductive film (circuit pattern) that can function as a circuit or a mesh pattern with electromagnetic wave shielding properties. When the pattern 3 is provided on only a portion of the surface of the easily peelable substrate 5, it is preferable that the printing "pattern" be appropriately designed depending on the intended use of the substrate having the final conductive pattern. In order to prevent the pattern 3 from being formed in any location other than the desired location on the easily peelable substrate 5, for example, a film with holes cut out therein may be placed on the easily peelable substrate 5, a conductive composition may be applied or printed on top of it, and then the film may be removed.

[0023] The easily peelable substrate 5 is not particularly limited as long as it can be easily peeled in the peeling step described below, that is, as long as the temporary pattern (pattern 3B) can be easily separated. Specific examples of the easily peelable substrate 5 include resin films. More specifically, examples include resin films with a silicone resin applied to the surface and resin films with a silicone resin kneaded into them. The main material of these resin films is not particularly limited, but in consideration of strength and cost, polyester-based materials are preferred, and polyethylene terephthalate is more preferred. In addition, various films commercially available under names such as "release film" and "peeling film" can also be used as the easily peelable substrate 5. Furthermore, release paper can also be used as the easily releasable substrate 5. Release paper typically refers to laminated paper in which a thin film-like resin is laminated on paper to give it easy releasability. Release paper is sometimes expressed as release paper. As for the release paper, various types of commercially available release paper can be used as appropriate.

[0024] The easily peelable substrate 5 may be in the form of a film or sheet as shown in FIG. 1P1 or 1P2, or may be in the form of a roll, for example. For example, a roll whose surface is made of metal or resin, on which a temporary pattern can be formed and from which the temporary pattern can be easily separated, may be used as the easily peelable substrate 5. Use of a roll-shaped easily peelable substrate 5 can be expected to improve the productivity of substrates having conductive patterns. The easily peelable substrate 5 may be disposable or may be reused.

[0025] The surface of the easily peelable substrate 5 is usually flat. The surface of the easily peelable substrate 5 usually does not have any recesses or protrusions. The easily peelable substrate 5 is usually not an intaglio or relief printing plate.

[0026] When the easily peelable substrate 5 is in the form of a film or sheet, its thickness is not particularly limited, but taking into consideration the handleability and transfer accuracy of the easily peelable substrate 5, it is preferably 10 to 250 μm, more preferably 10 to 100 μm.

[0027] The heating conditions for volatilizing the solvent in pattern 3 to obtain a temporary pattern (pattern 3B) can be, for example, 50 to 150°C for 1 to 60 minutes. However, it is preferable to set the temperature at a level that does not damage the easily peelable substrate 5. Heating can be performed, for example, by applying hot air to pattern 3, or by placing the easily peelable substrate 5 and pattern 3 on a hot plate. As a further example, heating by light is also possible. Specific examples include heating using a far-infrared heating furnace (IR oven) or Adphos NIR (ultra-near infrared), heating with a high-brightness LED, and laser heating.

[0028] The height of the provisional pattern (pattern 3B) is preferably 0.5 to 100 μm, more preferably 5 to 60 μm, and even more preferably 10 to 40 μm. When this height is 0.5 μm or more, the conductivity of the final conductive pattern can be improved. On the other hand, when this height is 100 μm or less, the entire substrate provided with the final conductive pattern can be made thinner. This is preferable, for example, from the viewpoint of miniaturization and weight reduction of electronic devices.

[0029] It is preferable that the conductive particles in the temporary pattern (pattern 3B) are not substantially sintered. In this embodiment, the conductive particles are usually sintered in the pressing step described below. Furthermore, it is preferable that the temporary pattern (pattern 3B) is substantially uncured. Specifically, even if the conductive composition contains a curable resin, a crosslinking agent, or the like, it is preferable that the curable resin or crosslinking agent in the temporary pattern (pattern 3B) is substantially unreacted before the transfer step.

[0030] The conductive composition for forming the temporary pattern (pattern 3B) is preferably in a paste state at room temperature for ease of pattern formation. From the viewpoint of further increasing the conductivity of the finally obtained conductive pattern, the amount of the resin component in the conductive composition is preferably 15 parts by mass or less, i.e., 0 to 15 parts by mass, more preferably 0 to 10 parts by mass, and even more preferably 0 to 5 parts by mass, per 100 parts by mass of the conductive particles. The remaining component in the conductive composition is preferably conductive particles. If there is no problem with pattern formability, the conductive composition may not contain a resin component. From the viewpoint of improving conductivity, it is preferable that the conductive composition does not substantially contain a curable component other than the conductive particles. On the other hand, from the viewpoint of improving the pattern formability, i.e., the printability and coatability of the conductive composition, the conductive composition may contain a resin component such as a resin or a binder. From the viewpoint of fully obtaining the effect of using the resin component, the amount of the resin component in the conductive composition is preferably 1 to 15 parts by mass, more preferably 1 to 10 parts by mass, and even more preferably 1 to 5 parts by mass, per 100 parts by mass of the conductive particles. The remaining component in the conductive composition is preferably the conductive particles. In particular, when the final conductive pattern is provided on a paper substrate, the amount of the resin component may be relatively large, taking into consideration that the resin component will penetrate into the paper substrate. In this case, the amount of the resin component in the conductive composition is preferably 5 to 30 parts by mass, and more preferably 10 to 20 parts by mass, per 100 parts by mass of the conductive particles. Specific examples of resin components that can be contained in the conductive composition include polyvinylpyrrolidone, polyester, epoxy resin, (meth)acrylic resin, polyvinyl acetal, cellulose resin (e.g., ethyl cellulose), and phenol resin.

[0031] The conductive composition may contain a solvent. When the conductive composition contains a solvent, the conductive composition can be easily applied or printed onto a substrate. The solvent typically contains an organic solvent. The solvent may contain water as long as the conductive particles can be appropriately dispersed in the solvent. The type of solvent is not particularly limited, as long as it does not substantially alter the components in the conductive composition. The amount of the solvent used may be adjusted as appropriate depending on the coating / printing method of the conductive composition, etc. The amount of the solvent used is, for example, 3 to 30 mass %, preferably 5 to 25 mass %, and more preferably 10 to 20 mass % of the total conductive composition.

[0032] The conductive particles contained in the conductive composition preferably contain at least one element selected from the group consisting of silver and copper, from the viewpoints of availability and good conductivity. Specifically, the conductive particles preferably include at least one selected from the group consisting of particles primarily composed of silver and particles primarily composed of copper. Here, the expression "primarily composed of silver" means that the ratio of silver element to all constituent elements in the particles is preferably 50 mol% or more, more preferably 75 mol% or more, even more preferably 90 mol% or more, and particularly preferably 95 mol% or more. Similarly, the expression "primarily composed of copper" means that the ratio of copper element to all constituent elements in the particles is preferably 50 mol% or more, more preferably 75 mol% or more, even more preferably 90 mol% or more, and particularly preferably 95 mol% or more. It should be noted that the conductive particles may contain elements other than silver and copper, such as gold, aluminum, platinum, palladium, iridium, tungsten, nickel, tantalum, lead, and zinc, as long as the desired conductivity is achieved.

[0033] The conductive particles may contain two or more elements. For example, conductive particles in which the surfaces of copper particles are silver-plated (silver-coated copper particles) are preferably used in this embodiment. Silver-coated copper particles are particles whose main component is copper, and the surfaces of the copper particles are plated with silver in an amount of up to 35 mass% based on the total mass of the particles, for example.

[0034] The particle diameter D at which the cumulative frequency reaches 50% in the volume-based cumulative particle diameter distribution curve obtained when the particle diameter of conductive particles is measured by the laser diffraction scattering method. 50 is preferably 0.5 to 100 μm, more preferably 0.6 to 50 μm, even more preferably 0.7 to 30 μm, and particularly preferably 0.7 to 20 μm. D 50 By making the ρ appropriately large, the number of grain boundaries between conductive particles per unit volume can be reduced, which is thought to lead to a smaller specific resistance of the resulting conductive pattern. D 50 It is believed that by not making the size too large, the "gaps" between the conductive particles are reduced, which leads to a smaller specific resistance of the resulting conductive pattern. By the way, D 50 It is considered that when D is an appropriate value, a part of the adhesive layer 2 easily penetrates into the gaps between the conductive particles in the temporary pattern (pattern 3B). 50 It is believed that an appropriate value of ρ also contributes to further improving adhesion. With nano-sized conductive particles, the adhesive layer 2 does not easily penetrate into the gaps between the conductive particles.

[0035] Conductive particles can be purchased from, for example, DOWA Electronics Co., Ltd., Fukuda Metal Foil and Powder Co., Ltd. Two or more different conductive particles may be mixed together for the purpose of adjusting or optimizing the particle size distribution or for other purposes.

[0036] From the viewpoint of further reducing the resistivity of the final conductive pattern, it is preferable that the proportion of conductive particles in the conductive composition is high. Specifically, the proportion of conductive particles in the total non-volatile components of the conductive composition is preferably 95% by mass or more, more preferably 97% by mass or more, even more preferably 98% by mass or more, and particularly preferably 99% by mass or more. In other words, from the viewpoint of further reducing the resistivity of the resulting conductive pattern, it is preferable that the conductive composition is substantially free of resin components such as resins and binders. Here, "substantially free of resin components" means that the composition does not contain any resin components at all, or that the amount of resin components contained is so small that the expected effect of using the resin components cannot be obtained (for example, 1% by mass or less, specifically 0.5% by mass or less, of the total non-volatile components of the conductive composition). The conductive composition does not need to contain resins or binders as long as the desired conductive pattern can be obtained.

[0037] The conductive composition may or may not contain various additive components found in conventional ink compositions and conductive pastes.

[0038] (Formation of an adhesive layer on a substrate: Figure 1A) 1A is a diagram showing that an adhesive layer 2 is provided on the surface of a substrate 1 different from an easily peelable substrate 5. In FIG.

[0039] The substrate 1 is usually in the form of a film, sheet or plate, and from the viewpoint of industrial productivity, the shape of the substrate 1 is preferably any of these. The substrate 1 is preferably flexible. By employing a flexible substrate 1, a flexible printed circuit (FPC) can be manufactured. By using a flexible substrate 1, pressing using a "roll" becomes easier in the pressing step described below. This is preferable from the viewpoint of mass production. Just to be clear, the substrate 1 may be a rigid substrate that does not have flexibility. The thickness of the substrate 1 is not particularly limited and can be appropriately set depending on the final use (electronic device, RF tag, electromagnetic wave shielding film, planar heating element, etc.) described below and various other circumstances. The thickness of the substrate 1 is typically 10 to 250 μm, preferably 30 to 100 μm. However, from the viewpoint of suppressing curling due to shrinkage when the adhesive layer 2 hardens, it is preferable that the substrate 1 be somewhat thick. Specifically, the thickness of the substrate 1 is preferably 100 to 250 μm, more preferably 100 to 150 μm. The substrate 1 may have a single layer structure or a laminated structure of two or more layers.

[0040] Considering cost and end use, the substrate 1 is preferably at least one selected from the group consisting of polyesters such as PET (polyethylene terephthalate) and PEN (polyethylene naphthalate), polyolefins such as polyethylene and polypropylene, polycarbonate, polyimide, and paper. Here, the paper may be coated paper (paper whose surface is coated with a coating agent) or ordinary uncoated paper. Furthermore, the substrate 1 is not limited to PET and other materials, and general resin films can also be used. Furthermore, the substrate 1 may be transparent or opaque. Examples of opaque resin films include foamed resin films such as foamed PET film and foamed resin sheets. In this embodiment, a conductive pattern with sufficiently low resistivity can be obtained without heating or by heating at a relatively low temperature in the pressing step. Therefore, a substrate 1 with low heat resistance, such as polyester, polyolefin, polycarbonate, or paper, can also be suitably used as the substrate. Furthermore, when a substrate 1 with high heat resistance, such as polyimide, is used, the resistivity of the resulting conductive pattern can be further reduced by performing high-temperature heating in the pressing step.

[0041] The adhesive layer 2 is preferably thermosetting or photosetting. More preferably, the adhesive layer 2 is formed from a thermosetting resin material or a photosetting resin material. When the substrate 1 is light-transmitting, the adhesive layer 2 can be photosetting, so that the adhesive layer 2 can be cured by irradiating light from the substrate 1 side. When the substrate 1 is not light-transmitting, the adhesive layer 2 can be thermosetting, so that the adhesive layer 2 can be cured by heating. Just to be clear, the adhesive layer 2 may have both thermosetting and photocuring properties, or may have only one of the thermosetting and photocuring properties.

[0042] Various thermosetting or photocurable resin materials can be used as materials for forming the adhesive layer 2. Specific examples include thermosetting or photocurable resin materials such as epoxy resin-containing materials, polymerizable (meth)acrylate-containing materials, urethane-based materials, urethane (meth)acrylate-containing materials, and silicone-based materials. The adhesive layer 2 can also be made of a commercially available product. For example, the adhesive layer 2 can be made of various thermosetting or photocurable resin materials that are known or commercially available as hard coating agents. In addition, various thermosetting or photocurable resin materials that are known or commercially available as primers can also be used.

[0043] When the adhesive layer 2 is thermosetting, it is preferable to form the adhesive layer 2 so that the thermosetting proceeds at a heating temperature that does not damage the substrate 1. For example, when the substrate 1 is made of a resin, it is preferable to design the adhesive layer 2 so that the curing reaction proceeds sufficiently when heated at a temperature lower than the glass transition temperature of the resin.

[0044] 1A, the adhesive layer 2 is preferably in an uncured or semi-cured state, more preferably in an uncured state. The adhesive layer being in an uncured or semi-cured state is believed to allow a portion of the adhesive layer 2 to penetrate into the gaps between the conductive particles in the temporary pattern (pattern 3B) in the transfer step described below. This is believed to contribute to further improving the adhesion of the final conductive pattern.

[0045] The thickness of the adhesive layer 2 is not particularly limited, but considering the need to obtain sufficient adhesiveness and to appropriately control penetration into the temporary pattern described above, it is preferably 1 to 30 μm, and more preferably 5 to 15 μm. The adhesive layer 2 may be a single layer or may be two or more layers. For example, if the substrate 1 is paper, a two-layer adhesive layer 2 may be used in consideration of penetration into the fibrous paper. In this case, the first adhesive layer closest to the paper plays the role of "sealing."

[0046] (Transfer process: Figure 2B) In the transfer step, a temporary pattern (pattern 3B) as shown in Figure 1P2 is brought into contact with an adhesive layer 2 provided on the surface of the substrate 1. This causes the temporary pattern (pattern 3B) to be transferred to the surface of the adhesive layer 2, resulting in a transferred pattern (pattern 3B). In the transfer step, pressing may or may not be performed to improve adhesion between the temporary pattern (pattern 3B) and the adhesive layer 2. As long as the temporary pattern (pattern 3B) is properly separated from the easily peelable substrate 5 at an appropriate stage, pressing may or may not be performed. When pressing, care should be taken to minimize changes in the shape of the temporary pattern (pattern 3B). From the viewpoint of improving adhesion, pressing is usually preferable. Incidentally, in the examples described below, after the temporary pattern and the adhesive layer are brought into contact, pressing is performed using a roller from the side of the easily peelable substrate 5. In addition to pressing using a roller, pressing using a flat press is also possible. If the adhesive layer 2 is uncured or semi-cured, it is believed that part of the adhesive layer 2 penetrates into the gaps between the conductive particles in the temporary pattern (pattern 3B) during this transfer process, which is believed to contribute to further improving the adhesion of the final conductive pattern.

[0047] (Adhesive layer curing process: Figure 2C) In this embodiment, it is preferable to perform an adhesive layer curing step between the transfer step and the pressing step to promote curing of the adhesive layer 2. This hardens the adhesive layer 2, and tends to further increase the adhesion between the temporary pattern (pattern 3B) and the cured adhesive layer 2B obtained by hardening the adhesive layer 2. The adhesive layer 2 can be cured by light such as ultraviolet light if the adhesive layer 2 is photocurable. Alternatively, the adhesive layer 2 can be cured by heating if the adhesive layer 2 is thermosetting. FIG. 2C shows an embodiment in which the adhesive layer 2 is cured by ultraviolet (UV) irradiation from the transparent substrate 1 side. The conditions for light irradiation and heating may be adjusted and optimized as appropriate depending on the specific material that constitutes the adhesive layer 2. However, when curing the adhesive layer 2 by heating, care must be taken to avoid damaging the substrate 1 with heat.

[0048] In the adhesive layer curing step, it is preferable to completely cure the adhesive layer 2, but it is also possible to cure it to a certain extent without completely curing it. In either case, it is sufficient to improve the adhesion between the temporary pattern (pattern 3B) and the cured adhesive layer 2B obtained by curing the adhesive layer 2.

[0049] (Peeling process: Figure 2D) Before the pressing step described below, a peeling step is preferably carried out in which the easily peelable substrate 5 is peeled off from the pattern 3B. Just to be clear, in Figure 2, the peeling step is depicted between the adhesive layer hardening step (C) and the oxide film removal step (E), but as long as a substrate having the desired conductive pattern is ultimately obtained, the peeling step may also be performed, for example, between the transfer step (B) and the adhesive layer hardening step (C). As long as the easily peelable substrate 5 can be appropriately peeled from the pattern 3B, the specific peeling method and conditions are not particularly limited.

[0050] (Oxide film removal process: Figure 2E) In this embodiment, it is preferable to carry out an oxide film removal step after the transfer step, before or simultaneously with the pressing step described below, in which a component X capable of removing an oxide film on the surface of the conductive particles is brought into contact with the transferred pattern (pattern 3B). By carrying out the oxide film removal step, sintering of the conductive particles is facilitated in the pressing step described below, and the conductivity of the finally obtained conductive pattern tends to be further enhanced.

[0051] It is preferable that component X penetrates into the interior of the transfer pattern (pattern 3B) through the gaps between the conductive particles that make up the transfer pattern (pattern 3B). This tends to further increase the conductivity of the finally obtained conductive pattern. For this reason, in the oxide film removal step, the transfer pattern (pattern 3B) in contact with component X may be pressed to promote penetration of component X into the interior of the transfer pattern (pattern 3B). In this case, the oxide film removal step and the pressing step described below may be performed simultaneously. Of course, the oxide film removing step may be performed as a separate step from the pressing step.

[0052] The oxide film removal step can be carried out by contacting, and preferably penetrating, a liquid 7 containing component X, which is capable of removing oxide films on the surfaces of conductive particles, into the transfer pattern (pattern 3B), as shown in FIG. 2E. While FIG. 2E shows an embodiment in which the liquid 7 containing component X is dropped or sprayed onto the transfer pattern (pattern 3B), the transfer pattern (pattern 3B) may also be immersed in the liquid containing component X. Alternatively, the liquid 7 containing component X may be brought into contact with the embedded pattern (pattern 3B) using an inkjet method or a dispenser method. The liquid containing component X is preferably water in which component X is dissolved or dispersed. The use of water is preferable from the viewpoints of reducing the environmental load and process safety (non-flammability). Of course, an organic solvent in which component X is dissolved or dispersed can also be used. Instead of using a liquid containing component X, the oxide film removal step may be carried out by bringing component X in a gaseous state into contact with the transfer pattern (pattern 3B). It is also conceivable to bring a sheet containing component X into contact with pattern 3B, preferably by applying pressure, thereby causing component X to permeate into pattern 3B. Specific examples of the sheet here include paper or nonwoven fabric containing component X, and resin sheets having component X coated or printed on their surfaces. Additionally, the method for contacting and permeating component X into the transfer pattern (pattern 3B) is not particularly limited.

[0053] Component X is not particularly limited as long as it is capable of removing the oxide film on the surface of the conductive particles. In this specification, "removal" of an oxide film includes not only the removal of the oxide itself present on the surface of a conductive particle, but also the case where the oxide undergoes a chemical change such as reduction, causing the oxide to return to a non-oxide state.

[0054] According to the findings of the present inventors, it is preferable to include at least one selected from the group consisting of organic acids, phosphorus oxoacids, and hydrazine or its derivatives, which are particularly suitable when the conductive particles include copper or silver.

[0055] Examples of organic acids include carboxylic acids such as citric acid, formic acid, acetic acid, malonic acid, malic acid, tartaric acid, ascorbic acid, succinic acid, fumaric acid, and propionic acid. Specific examples of phosphorus oxoacids include phosphinic acid, phosphonic acid, phosphorous acid, phosphoric acid, diphosphoric acid, triphosphoric acid, and metatriphosphoric acid. Of these, phosphinic acid is particularly preferred. Examples of hydrazine or its derivatives include hydrazine itself; hydrazine salts such as hydrazine monohydrochloride, hydrazine dihydrochloride, hydrazine monohydrobromide, and hydrazine sulfate; and other compounds having an -NH-NH2 structure.

[0056] Additionally, from the viewpoint of removing an oxide film, a compound having a small pKa in water can be used as component X. Specifically, a compound having a pKa in water of -5.0 to 5.0 is preferred as component X, and a compound having a pKa of -4.0 to 4.5 is more preferred as component X. Incidentally, when component X is a polybasic acid, it is preferred that the smallest pKa among the multiple pKas is within the above range. Considering only the small pKa and the resulting ability to remove oxide films, it is conceivable to use an inorganic acid such as hydrochloric acid, nitric acid, or sulfuric acid as component X. However, taking into consideration the inconvenience that may occur if the acid remains in pattern 3B, an organic acid is preferred as component X. The pKa value used here can be a value at room temperature (e.g., 25°C). However, from the viewpoint of the removability of the oxide film in the actual process, it can be said that it is preferable to use a pKa value at the temperature in the penetration step or conductive film formation step.

[0057] Additionally, any compound capable of returning an oxide film to a non-oxidized state by a reduction reaction can also be used as component X. For example, a compound having an aldehyde group can be used as component X because it may be able to reduce an oxide.

[0058] Furthermore, compounds that have a small pKa in water and can return an oxidized film to a non-oxidized state through a reduction reaction are also preferably used as component X. An example of such a compound is formic acid. Formic acid has the advantage that it is easily volatile and therefore does not easily remain in the pattern.

[0059] In addition to the above, examples of component X include pyrogallol, phenidone, hydroquinone, and orthoaminophenol, which are known to function as reducing agents in the field of silver halide photography. If a conductive pattern having a lower resistivity can be obtained by infiltrating a certain compound A into pattern 3B compared to a conductive pattern without infiltrating the compound A, then the compound A can be used as component X.

[0060] When a liquid in which component X is dissolved or dispersed is brought into contact with pattern 3B, the concentration of component X in the liquid may be adjusted as appropriate. The concentration may be adjusted from the viewpoints of allowing a sufficient amount of component X to penetrate into pattern 3B and reducing the amount of residual component X to suppress corrosion or deterioration of the conductive pattern. The concentration of component X in the liquid is, for example, 0.05 to 50 mol / L, preferably 0.1 to 40 mol / L, more preferably 0.1 to 30 mol / L, even more preferably 0.1 to 10 mol / L, and particularly preferably 0.15 to 5.0 mol / L. Of course, a liquid containing component X at a concentration lower than the concentrations shown here may be used, or a liquid containing component X at a concentration higher than the concentrations shown here (for example, saturation concentration) may be used.

[0061] When performing an oxide film removal step, it is preferable to press at least the transfer pattern (pattern 3B) before the oxide film removal step, specifically after the peeling step and before the oxide film removal step. This makes it easier to maintain the shape of the transfer pattern (pattern 3B) during the oxide film removal step. In particular, when a liquid in which component X is dissolved or dispersed is allowed to penetrate into the transfer pattern (pattern 3B) during the oxide film removal step, it is easier to prevent at least a portion of the transfer pattern (pattern 3B) from being deformed or collapsed by the liquid. In particular, when a conductive composition substantially free of a resin component is used, the transfer pattern (pattern 3B) is prone to deformation and collapse, so pressing as described herein is preferable. In other words, when a conductive composition containing a resin component is used, the transfer pattern (pattern 3B) is less prone to deformation and collapse than a conductive composition substantially free of a resin component, so the shape of the transfer pattern (pattern 3B) may be sufficiently maintained even without pressing.

[0062] When pressing the transfer pattern (pattern 3B) before the oxide film removal step, the method can be performed, for example, as described in the pressing step (FIG. 2F) described later. However, it is preferable that the pressure be appropriately adjusted. From the viewpoint of maintaining the shape of the transfer pattern (pattern 3B), a high pressure is preferable. However, from the viewpoint of the permeability of component X, it is preferable that there be an appropriate gap between the conductive particles, so it is preferable that the pressure is not too high.

[0063] Specifically, the pressure applied to the transfer pattern (pattern 3B) in the pressing process before the oxide film removal process is P first In the conductive film forming process described later, the pressure applied to the transfer pattern (pattern 3B) is P second When P first <P second More specifically, P first HA P second It is preferable that the pressure in the pressing step is 0.9 times or less, more preferably 0.75 times or less, and even more preferably 0.6 times or less. In other words, it is preferable that the pressure in the pressing step is sufficiently smaller than the pressure required to compress and sinter the conductive particles together in the pressing step.

[0064] From various perspectives, P first and P second It is preferable to optimize each of these values. P first is preferably 1 to 500 MPa, more preferably 10 to 200 MPa, and even more preferably 20 to 100 MPa. first By setting the pressure to 1 MPa or more, it is easy to reliably and sufficiently obtain the effect of easily maintaining the shape of the transfer pattern (pattern 3B) in the subsequent process. first By making the pressure at most 500 MPa, sufficient gaps for the penetration of component X tend to remain in the transfer pattern (pattern 3B). Also, P secondis, for example, 1 MPa or more, preferably 10 MPa or more, more preferably 10 to 5000 MPa, even more preferably 20 to 1000 MPa, particularly preferably 30 to 300 MPa, and especially preferably 50 to 250 MPa. second By setting the pressure to a certain value, the resistivity of the conductive pattern obtained at the end can be further reduced. In addition, by not applying too much pressure, damage to the substrate 1 and the transfer pattern (pattern 3B) can be suppressed. Incidentally, if the strength of the substrate 1 is sufficient, the pressure can be increased to further reduce the resistivity of the conductive pattern obtained at the end.

[0065] When the oxide film removal step is performed, a process for reducing the amount of component X remaining in the transfer pattern (pattern 3B) may be performed. By performing this process, the resistivity of the finally obtained conductive pattern can be further reduced. This process may be performed before or after the pressing step described below. For example, if component X has the property of volatilizing when heated, it is conceivable to carry out a process of volatilizing component X remaining in the transfer pattern (pattern 3B) by heating the transfer pattern (pattern 3B) to an appropriate temperature. As another example, it is conceivable to carry out a process of bringing the transfer pattern (pattern 3B) into contact with a liquid such as water to elute component X remaining in the transfer pattern (pattern 3B).

[0066] More specifically, examples of the treatment for reducing the amount of component X remaining in the transfer pattern (pattern 3B) include the following methods (i) to (v). (i) An air flow is applied to the transfer pattern (pattern 3B). (ii) An inert gas such as nitrogen gas is sprayed toward the transfer pattern (pattern 3B). (iii) A liquid-absorbent member such as a sponge is pressed against the transfer pattern (pattern 3B) to absorb the solution or dispersion containing component X. In the continuous process shown in FIG. 2, it is preferable to use a roll-shaped sponge as the liquid-absorbent member. After absorbing the solution or dispersion, the transfer pattern (pattern 3B) may be brought into contact with a liquid such as water (washed), and then the liquid-absorbent member may be pressed against the transfer pattern (pattern 3B) again. (iv) The solution or dispersion containing component X is "squeezed" by applying pressure to the transfer pattern (pattern 3B) using a roll. The transfer pattern (pattern 3B) may then be brought into contact with a liquid such as water (washed), and the liquid may then be squeezed out again using a roll. By appropriately controlling the pressure and not applying heat when applying pressure, the solution or dispersion containing component X can be squeezed out without sintering the conductive particles in the transfer pattern (pattern 3B). (v) A combination of two or more of the above (i) to (iv), such as a combination of (i) and (ii), or a combination of (iii) and (iv).

[0067] (Pressing process: Figure 2F) In the pressing step, at least pressure is applied to the transfer pattern (pattern 3B). This increases the conductivity of the transfer pattern (pattern 3B) to obtain the conductive pattern 3C. Preferably, the pressing step sinters the conductive particles in the transfer pattern (pattern 3B).

[0068] As shown in FIG. 2F, the pressure is preferably applied by covering the exposed surface of the transfer pattern (pattern 3B) with member 6 and then at least pressurizing the transfer pattern (pattern 3B). For example, the pressure can be applied by sandwiching a laminate of the substrate 1, cured adhesive layer 2B, transfer pattern (pattern 3B), and member 6 between two opposing rolls 10A and 10B and transporting the laminate between the two rolls. Member 6 is preferably a film-like material. 2F, liquid 7 containing component X, which can remove the oxide film on the surface of the conductive particles as described in FIG. 2E, is present above the transfer pattern (pattern 3B). In this case, it is thought that component X penetrates into the transfer pattern (pattern 3B) by applying pressure, removing the oxide film from the conductive particles while simultaneously sintering the conductive particles. In other words, FIGS. 2E and 2F can be said to represent an embodiment in which the oxide film removal process and the pressing process are performed simultaneously.

[0069] There are several advantages to using the member 6 when applying pressure. Examples of the advantages include the following: Damage to the roll 10A can be suppressed. In addition, it may be possible to suppress the transfer pattern (pattern 3B) from peeling off or adhering to the roll 10A in whole or in part. Direct contact of the roll 10A with the transfer pattern (pattern 3B) is avoided, making it easier to prevent unintended deformation or collapse of the transfer pattern (pattern 3B). The member 6 functions as a "buffer," making it easier to apply pressure uniformly to the transfer pattern (pattern 3B). This leads to, for example, an improvement in the yield of the substrate having the final conductive pattern. Furthermore, when the oxide film removal step and the pressing step are performed simultaneously, applying pressure uniformly to the transfer pattern (pattern 3B) is also preferable because it leads to the component X penetrating uniformly into the transfer pattern (pattern 3B).

[0070] From one viewpoint, the material of the member 6 can be the same as that of the base material 1. That is, the member 6 can be preferably a polyester film such as a PET film. From another perspective, in order to prevent peeling or damage to the transfer pattern (pattern 3B), an easily peelable film or release paper can be preferably used as the member 6. A specific example of the easily peelable film or release paper is the easily peelable substrate 5 mentioned in FIG. From another perspective, the member 6 may be made of a non-resin material such as aluminum foil.

[0071] On the other hand, in order to simplify the manufacturing process by reducing the amount of process materials and reduce waste, pressurization may be performed without using the member 6.

[0072] FIG. 2F shows an embodiment in which the transfer pattern (pattern 3B) is pressed by two opposing rolls 10A and 10B, but it goes without saying that the transfer pattern (pattern 3B) may be pressed by other methods. As one example, a laminate of the substrate 1, the cured adhesive layer 2B, the transfer pattern (pattern 3B), and the member 6 may be sandwiched between two flat plates and pressed (flat press). As another example, a laminate of the substrate 1, the cured adhesive layer 2B, the transfer pattern (pattern 3B), and the member 6 may be placed on a flat plate, and a roll may be applied from above to pressurize the transfer pattern (pattern 3B) while rolling. As yet another example, a roll may be applied from below to pressurize the transfer pattern (pattern 3B) while rolling the roll.

[0073] In the pressing step, it is preferable to apply pressure to the transfer pattern (pattern 3B) while heating it, which tends to improve the conductivity of the conductive pattern 3C. Preferably, the transfer pattern (pattern 3B) is pressed at a pressure of 1 to 5000 MPa and heated at a temperature of 50 to 400°C. More preferably, the transfer pattern (pattern 3B) is pressed at a pressure of 5 to 1000 MPa and heated at a temperature of 70 to 200°C. Even more preferably, the transfer pattern (pattern 3B) is pressed at a pressure of 10 to 300 MPa and heated at a temperature of 80 to 150°C. The lower limit of the pressure may be 30 MPa or 50 MPa. As shown in FIG. 2F, when the pressing step is performed using two opposing rolls 10A and 10B, it is preferable to use rolls with built-in heaters that can adjust the temperature.

[0074] The time for the pressing step is not particularly limited. The time can be adjusted and determined appropriately from the viewpoints of improving conductivity through sufficient sintering of the conductive particles and industrial productivity. The time for the pressing step (the time during which the transfer pattern (pattern 3B) is actually pressed) is preferably 1 millisecond to 10 seconds, more preferably 10 milliseconds to 3 seconds, and even more preferably 30 milliseconds to 1 second. This value is a preferred pressing time, particularly when the transfer pattern (pattern 3B) is pressed by two opposing rolls 10A and 10B.

[0075] (Other optional processes) The method for manufacturing a substrate provided with a conductive pattern according to this embodiment may include steps other than the steps described above. For example, if the member 6 is used in the pressing step, the member 6 is removed after the pressing step is completed. As another example, after the pressing step, a removal step may be performed to remove component X remaining on the surface or inside the obtained conductive pattern. Specific examples include a step of immersing the substrate provided with the obtained conductive pattern in a liquid (water or an organic solvent) capable of dissolving or dispersing component X, or a step of pouring a liquid (water or an organic solvent) onto the surface of the conductive pattern to wash away the remaining component X. Another possible step is to vaporize and remove the remaining component X by heating the substrate provided with the obtained conductive pattern at a temperature that does not damage the substrate 1.

[0076] (Substrate with conductive pattern: G in Figure 2) By carrying out the above series of steps, a substrate having a conductive pattern can be produced, as shown in Figure 2G, in which a cured adhesive layer 2B is provided on the surface of substrate 1 and a conductive pattern 3C is provided on the surface of cured adhesive layer 2B opposite to the substrate 1 side. Preferably, the conductive particles in the conductive pattern 3C are sintered. Preferably, conductive pattern 3C and cured adhesive layer 2B are not clearly separated, and part of cured adhesive layer 2B penetrates into the gaps between the conductive particles in conductive pattern 3C. This embodiment is preferable from the viewpoint of further improving adhesion.

[0077] <Electronic device manufacturing method> An electronic device can be manufactured using a substrate having a conductive pattern obtained as described above. By appropriately designing the temporary pattern, a substrate having a conductive pattern (circuit pattern) that can function as a circuit can be manufactured. Then, by combining this substrate with other electronic elements, an electronic device can be manufactured.

[0078] Here, some examples of electronic devices will be described. However, it should be noted that the electronic devices including the substrate with the conductive pattern obtained by the manufacturing method of this embodiment are not limited to these examples. Sensors: For example, a substrate having a conductive pattern obtained by the manufacturing method of this embodiment can be applied to conductive members / circuits in sensors such as pressure sensors and vital sensors. Solar cells: For example, a substrate having a conductive pattern obtained by the manufacturing method of this embodiment can be applied to the current collecting wiring of a solar cell. Membrane switch: A membrane switch is a thin sheet-like switch made by printing circuits and contacts on a film and then laminating it. The method for manufacturing a substrate with a conductive pattern according to this embodiment can be applied to form the circuits and contacts. Touch sensor / touch panel: For example, the method for manufacturing a substrate having a conductive pattern of this embodiment can be applied to form lead wiring in a touch sensor / touch panel. It is also conceivable that the method for manufacturing a substrate having a conductive pattern of this embodiment can be applied to form transparent electrodes in a touch sensor / touch panel. Flexible substrate: Conventionally, a circuit is formed by first coating the entire surface of a flexible film with a metal film and then removing unnecessary parts of the metal film using chemicals. Instead of this conventional method, it is possible to form a circuit using the manufacturing method of a substrate with a conductive pattern of this embodiment.

[0079] In particular, in electronic devices where circuits have conventionally been formed using conductive paste, by using the manufacturing method of this embodiment to form circuits, the resistivity of the circuits can be reduced, and improved performance of the electronic devices can be expected.

[0080] A particularly preferred example of the electronic device is an RF tag. That is, the method for producing a conductive substrate of this embodiment is preferably used to produce a conductive circuit such as an antenna portion of an RF tag. For the specific structure of the RF tag, reference can be made to, for example, Japanese Patent Application Laid-Open No. 2003-332714 and Japanese Patent Application Laid-Open No. 2020-46834.

[0081] <Method of manufacturing electromagnetic wave shielding film> As an application other than electronic devices, the method for manufacturing a substrate having a conductive pattern according to the present embodiment can be used to manufacture an electromagnetic wave shielding film. Specifically, in the lamination step, the conductive composition is printed in a pattern specific to the electromagnetic wave shielding film (such as a mesh pattern), thereby manufacturing the electromagnetic wave shielding film.

[0082] <Method of manufacturing a sheet heating element> As another application, the method for manufacturing a substrate having a conductive pattern according to this embodiment may be used to manufacture a sheet heating element. A sheet heating element is an element that generates heat by passing an electric current through electrical wiring provided on a substrate. A specific example of a sheet heating element is a sheet heating element for preventing fogging or cold weather, such as on the rear window of a passenger car.

[0083] <Article for manufacturing a substrate having a conductive pattern> For example, an article as shown in FIG. 2D, which includes a substrate 1, a cured adhesive layer 2B provided on the surface of the substrate 1, and a pattern 3B provided on the surface of the cured adhesive layer 2B using a conductive composition containing conductive particles, can be considered a "semi-finished product" for producing a substrate with a conductive pattern. In other words, an article such as that shown in FIG. 2D is useful as an "article for manufacturing a substrate having a conductive pattern," and it is possible to transfer this article to a third party, who can then carry out the pressing step to manufacture a substrate having a conductive pattern. 2D, the easily peelable substrate 5 is peeled off, but the "article for manufacturing a substrate having a conductive pattern" may be formed without peeling off the easily peelable substrate 5. From the viewpoint of suppressing deterioration of the pattern 3B, the article for manufacturing a substrate having a conductive pattern may be provided with the easily peelable substrate 5.

[0084] Although FIG. 2D has already been specifically described, for completeness, we will list possible features of an article for producing a substrate with a conductive pattern as shown in FIG. 2D. The amount of the resin component in pattern 3B is preferably 15 parts by mass or less, i.e., 0 to 15 parts by mass, more preferably 0 to 10 parts by mass, and even more preferably 0 to 5 parts by mass, per 100 parts by mass of the conductive particles. It is preferable that the pattern 3B does not substantially contain a curable component other than the conductive particles. The particle diameter D at which the cumulative frequency reaches 50% in the volume-based cumulative particle diameter distribution curve obtained when the particle diameters of the conductive particles in pattern 3B are measured by the laser diffraction scattering method. 50 is preferably 0.5 to 100 μm, more preferably 0.6 to 50 μm, even more preferably 0.7 to 30 μm, and particularly preferably 0.7 to 20 μm The substrate 1 is preferably flexible. The substrate 1 is preferably at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper. The thickness of the cured adhesive layer 2B is preferably 1 to 30 μm, and more preferably 5 to 15 μm. A portion of cured adhesive layer 2B is cured while penetrating into the gaps between conductive particles in pattern 3B. This aspect is believed to particularly contribute to improving the adhesion of the final conductive pattern.

[0085] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations may be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention. [Example]

[0086] The embodiments of the present invention will be described in detail based on Examples and Comparative Examples. However, it should be noted that the present invention is not limited to the Examples.

[0087] <Example I. Example using paper substrate> (Production of conductive resin composition) Manufacturing Example 1 (without resin components) Fukuda Metal Foil and Powder Co., Ltd.'s D 50 77.0 parts by mass of copper powder with a particle size of 5 μm and 23.0 parts by mass of an organic solvent were weighed and kneaded with a spatula to obtain a kneaded mixture, which was then stirred using a planetary centrifugal mixer. In this way, a conductive composition was obtained for Production Example 1. This composition was in a paste state at 23°C.

[0088] Manufacturing example 2 (contains resin components) 15.0 parts by mass of commercially available phenoxy resin and 85.0 parts by mass of organic solvent were weighed into a glass bottle, placed in a hot air circulating atmospheric oven, and heated at 120°C for 6 hours to completely dissolve the resin, thereby preparing a 15.0% by mass solution of phenoxy resin. Fukuda Metal Foil and Powder Co., Ltd.'s D 50 75.3 parts by mass of copper powder with a particle size of 5 μm, 12.9 parts by mass of the 15% by mass solution of the phenoxy resin, and 11.9 parts by mass of an organic solvent were weighed and kneaded with a spatula, and then stirred using a planetary centrifugal mixer. In this way, a conductive composition of formulation 2 was obtained. This composition was in a paste state at 23°C.

[0089] (Example I-1: Production of a substrate with a conductive pattern) A substrate having a conductive pattern was manufactured by the following process. (i) Formation of a temporary pattern on the surface of an easily peelable substrate: corresponding to Figure 1P1 and Figure 1P2 (ii) Formation of an adhesive layer on the substrate: Corresponding to Figure 1A (iii) Transfer step: corresponds to Figure 2B (iv) Adhesive layer curing process: equivalent to Figure 2C (v) Pressing before oxide film removal process: not shown (vi) Peeling process: corresponds to Figure 2D (vii) Oxide film removal process and pressing process: corresponding to Figure 2E and Figure 2F

[0090] Each process will be described in detail below.

[0091] (i) Formation of a temporary pattern on the surface of an easily peelable substrate: corresponding to Figure 1P1 and Figure 1P2 The conductive composition of Production Example 1 (containing no resin component) was screen-printed onto an easily peelable substrate to form a provisional pattern under the following specific conditions. -Easy-to-peel substrate: Fujimori Kogyo Co., Ltd. uses a PET film with a silicone resin surface coating. Printing machine: A screen printing machine, Desk Top 38SA type (Micro-Tec) was used. Screen: 325 mesh, wire diameter 16 μm, emulsion thickness 28 μm. Printing conditions: printing pressure 0.18 MPa, squeegee speed 30 mm / sec, clearance (distance between screen and substrate) 2.0 mm, attack angle 80°. Overall shape of the pattern: The antenna pattern was as shown in Figure 3. In this pattern, the width of the thin line portion was 200 μm.

[0092] The easily peelable substrate after screen printing was placed in a hot air circulating atmospheric oven and heated at 100°C for 15 minutes, thereby volatilizing the solvent. In this manner, a provisional pattern having a height of 50 μm was formed on the surface of the easily peelable substrate.

[0093] (ii) Formation of an adhesive layer on the substrate: Corresponding to Figure 1A To prevent curling, double-sided coated paper, Mirror Coat Platinum (180 μm thick, manufactured by Oji Paper Co., Ltd.), was selected as the substrate. Furthermore, the adhesive layer was made to have a two-layer structure, taking into consideration penetration into the paper. The specific procedure for forming the adhesive layer was as follows: First, a mixture of epoxy resin YX7200B35 (Mitsubishi Chemical Corporation) and the solvent tetrahydrofuran was prepared in a mass ratio of 1:1. This mixture was applied to the surface of the substrate using a bar coater to a wet thickness of 30 μm. The substrate was then placed in a hot air circulating atmospheric oven and heated at 100°C for 15 minutes. This volatilized the solvent, forming the first adhesive layer. Next, a UV hard coating agent, HX-RSC (Kyoeisha Chemical Co., Ltd., urethane acrylate material), was applied to the first adhesive layer using a bar coater to a wet thickness of 15 μm. The substrate was then placed in a hot air circulating atmospheric oven and heated at 80°C for 5 minutes. This volatilized the solvent, forming a second adhesive layer (dry thickness 6 μm). In this manner, a substrate provided with an adhesive layer was obtained.

[0094] (iii) Transfer step: corresponds to Figure 2B The substrate with the adhesive layer formed in step (ii) was placed on top of the provisional pattern obtained in step (i) so that the provisional pattern and the adhesive layer were in contact with each other. Then, a 2 kg roller was used to apply pressure. This transferred the provisional pattern to the adhesive layer, forming a transfer pattern.

[0095] (iv) Adhesive layer curing process: equivalent to Figure 2C After the above (iii) is completed, the adhesive layer to which the transfer pattern has been transferred is irradiated with UV-LED irradiation equipment (Matsuo Sangyo Co., Ltd.) that emits ultraviolet light with a wavelength of 365 nm, with an integrated light dose of UVA: 6000 mJ / cm 2 The adhesive layer was cured by ultraviolet light from the side of the easily peelable substrate, to form a cured adhesive layer.

[0096] (v) Pressing before oxide film removal process After the above (iv) was completed, the laminate including the substrate, the cured adhesive layer, the transfer pattern, and the easily peelable substrate was roll-pressed under the following conditions using a load-adjustable roll press machine SA-602 (Tester Sangyo Co., Ltd.) equipped with two opposing rolls. Roll temperature: 110°C, pressure: 20 MPa, conveying speed: 0.1 m / min, gap: 90-100 μm (Note 1: Although the roll press is equipped with a non-contact temperature sensor, the roll temperature was measured using a contact thermometer for more accurate temperature measurement.) (Note 2: The pressure was calculated using the following formula.) Roll width: 165 mm, contact width between rolls: 3 mm, pressure area: 495 mm 2 The pressure was set to 10kN. 2 Since a force of 10kN was applied to the area, 10kN ÷ 495mm 2 Based on the calculation, the pressure was calculated to be 20 MPa.

[0097] (vi) Peeling process: corresponds to Figure 2D After the above (v) was completed, the easily peelable substrate was peeled off by hand.

[0098] (vii) Oxide film removal process and pressing process: corresponding to Figure 2E and Figure 2F An oxide film removal solution (formic acid aqueous solution) was sprayed onto the pattern (transfer pattern) after (vi) above. The amount sprayed was approximately 20 μL for an area of ​​approximately 30 mm × 20 mm on the substrate. A film-like member (the same as the easily peelable substrate on which the provisional pattern was formed, manufactured by Fujimori Kogyo Co., Ltd.) was then placed on top of it. In this state, a roll press treatment was performed using a load-adjustable roll press machine SA-602 (Tester Sangyo Co., Ltd.) equipped with two opposing rolls. The treatment conditions were as follows: Roll temperature: 110°C, pressure: 40 MPa, conveying speed: 0.1 m / min, gap: 40-50 μm (Note: The roll temperature and pressure were determined in the same manner as in Notes 1 and 2 of (v) Pressing before the oxide film removal step.)

[0099] In this manner, the pattern (transfer pattern) was pressed while the oxide film remover solution was allowed to penetrate into the gaps between the conductive particles in the pattern (transfer pattern), thereby obtaining a conductive pattern.

[0100] Through the above series of steps, a substrate with a conductive pattern was obtained, in which a conductive antenna pattern was formed on the paper substrate via a cured adhesive layer.

[0101] (Example I-2: Production of a substrate with a conductive pattern) The same process as in Example I-1 was carried out, except that the conductive composition of Production Example 2 (containing a resin component) was used instead of Production Example 1 (containing no resin component), and a substrate provided with a conductive pattern was then produced.

[0102] (Example I-3: Production of a substrate with a conductive pattern) The same process as in Example I-1 was carried out, except that the conductive composition used was Production Example 2 (containing a resin component) instead of Production Example 1 (containing no resin component), and (v) pressing was not performed before the oxide film removal step. A substrate having a conductive pattern was then produced.

[0103] (Comparative Example I-1: Production of a substrate with a conductive pattern) The same process as in Example I-1 was carried out, except that the transfer step (iii) was carried out directly on the substrate without forming an adhesive layer on the substrate as in (ii) above. However, in this example, the adhesive strength of the conductive pattern was extremely weak, and the conductive pattern peeled off from the substrate when even a slight force was applied.

[0104] (Evaluation: Adhesion) The substrates with conductive patterns of Examples I-1 to I-3 were each bent by hand and returned to their original flat shape, and this operation was repeated five times. The presence or absence of peeling of the conductive pattern was then confirmed visually and under magnification. The case where no peeling of the conductive pattern was observed was evaluated as good, and the case where peeling of the conductive pattern was observed was evaluated as bad.

[0105] (Evaluation: Resistance value) In the patterns having the shapes shown in FIG. 3 obtained in Examples I-1 to I-3, the resistance values ​​between points 1 and 2 and between points 3 and 4 were measured.

[0106] (Evaluation: Pattern formation accuracy) The conductive patterns obtained in Examples I-1 to I-3 were observed under magnification to evaluate whether the temporary patterns formed on the easily peelable substrates were transferred to the substrates almost as they were. Specifically, it was evaluated whether a portion of the temporary pattern with a line width of 200 μm was transferred to the substrate within a line width variation range of ±20 μm to form a conductive pattern. When the line width variation was within the range of ±20 μm, it was evaluated as good, and when the line width variation exceeded the range of ±20 μm, it was evaluated as bad.

[0107] The above information is summarized in the table below. In the table below, Comparative Example I-1 had a poor evaluation result for adhesion, so no other evaluations were made.

[0108] [Table 1]

[0109] As shown in the above table, the method for manufacturing a substrate having a conductive pattern according to this embodiment made it possible to manufacture a substrate having a conductive pattern with a good adhesion evaluation. Furthermore, the resistance value of the conductive pattern on the substrate provided with the obtained conductive pattern was sufficiently small, confirming good conductivity. Incidentally, the resistance value of an aluminum foil antenna (similar in shape and overall size to the antenna in Figure 3) that has already been put into practical use, measured in the same manner as above (Evaluation: Resistance Value), is approximately 6.2 Ω. The evaluation of the resistance values ​​of Examples I-1 to I-3 showed resistance values ​​similar to or smaller than 6.2 Ω, despite the narrow wiring width. Therefore, it can be said that the conductivity of the conductive patterns obtained in Examples I-1 to I-3 is comparable to or exceeds the conventional level of technology. Furthermore, the conductive pattern was formed with good precision.

[0110] (Additional evaluation: Antenna performance) An IC chip with an antenna (inlay) was produced by arranging an IC chip and an antenna on the substrate having the conductive pattern obtained in Example 1. Then, the antenna performance was evaluated using this inlay. The maximum communication distance was measured using the obtained inlay. Measurement results showed that the maximum communication distance was 6.7m (990MHz).

[0111] For reference, the maximum communication distance of an already-used aluminum foil antenna (similar in shape and overall size to the antenna in Figure 3) was measured to be 3.0 m (960 MHz). Considering this, it can be said that the substrate with the conductive pattern obtained in this example is preferably applicable to the manufacture of antenna parts in RF tags, for example.

[0112] Example II: Example using polyethylene terephthalate (PET) substrate (Example II-1: Production of a substrate with a conductive pattern) A substrate having a conductive pattern was manufactured by the following process. (i) Formation of a temporary pattern on the surface of an easily peelable substrate: corresponding to Figure 1P1 and Figure 1P2 (ii) Formation of an adhesive layer on the substrate: Corresponding to Figure 1A (iii) Transfer step: corresponds to Figure 2B (iv) Adhesive layer curing process: equivalent to Figure 2C (v) Pressing before oxide film removal process: not shown (vi) Peeling process: corresponds to Figure 2D (vii) Oxide film removal process and pressing process: corresponding to Figure 2E and Figure 2F

[0113] Each process will be described in detail below.

[0114] (i) Formation of a temporary pattern on the surface of an easily peelable substrate: corresponding to Figure 1P1 and Figure 1P2 A temporary pattern was formed on the surface of an easily peelable substrate in the same manner as in (i) of Example I-1, except that the conductive composition of Production Example 2 (with resin component) was used instead of Production Example 1 (without resin component).

[0115] (ii) Formation of an adhesive layer on the substrate: Corresponding to Figure 1A The substrate was selected to be a PET film, Lumirror U34 (75 μm thick), manufactured by Toray Industries, Inc. Unlike the paper substrate used in Example I, the components constituting the adhesive layer do not substantially penetrate the PET film, so the adhesive layer was a single layer. Specifically, a UV hard coating agent, HX-RSC (Kyoeisha Chemical Co., Ltd., urethane acrylate-based material), was applied to the surface of the PET film using a bar coater to a wet thickness of 30 μm. The substrate was then placed in a hot air circulating atmospheric oven and heated at 80°C for 15 minutes. This volatilized the solvent, forming an adhesive layer (dry thickness 4 μm). In this manner, a substrate provided with an adhesive layer was obtained.

[0116] (iii) Transfer step: corresponds to Figure 2B The temporary pattern was transferred to the adhesive layer side in the same manner as in Example I-1(iii).

[0117] (iv) Adhesive layer curing process: equivalent to Figure 2C The adhesive layer was cured to form a cured adhesive layer in the same manner as in (iv) of Example I-1.

[0118] (v) Pressing before oxide film removal process Roll pressing was carried out in the same manner as in Example I-1 (v).

[0119] (vi) Peeling process: corresponds to Figure 2D The easily peelable substrate was peeled off in the same manner as in (vi) of Example I-1.

[0120] (vii) Oxide film removal process and pressing process: corresponding to Figure 2E and Figure 2F The oxide film removing step and the pressing step were carried out in the same manner as in (vii) of Example I-1.

[0121] (Comparative Example II-1: Production of a substrate with a conductive pattern) The same process as in Example II-1 was carried out, except that the transfer step (iii) was carried out directly on the substrate without forming an adhesive layer on the substrate as in (ii) above. However, in this example, the adhesive strength of the conductive pattern was extremely weak, and the conductive pattern peeled off from the substrate when even a slight force was applied.

[0122] (Evaluation: Adhesion) In the same manner as in the adhesion evaluation in Example I, the presence or absence of peeling of the conductive pattern was confirmed by visual inspection and observation under magnification.

[0123] (Evaluation: Resistance value) The resistance value was measured in the same manner as in Example I.

[0124] (Evaluation: Pattern formation accuracy) The pattern formation accuracy was evaluated in the same manner as in Example I.

[0125] The above information is summarized in the table below. In the table below, Comparative Example II-1 had a poor evaluation result for adhesion, so no other evaluations were made.

[0126] [Table 2]

[0127] As shown in the table above, even when a PET film was used as the substrate, the method for manufacturing a substrate with a conductive pattern of this embodiment was able to manufacture a substrate with a conductive pattern that had a good adhesion evaluation. Furthermore, the resistance value of the conductive pattern on the substrate provided with the obtained conductive pattern was sufficiently small, and it was confirmed that the conductive pattern had good conductivity. Incidentally, the values ​​of 12.5Ω and 12.8Ω measured in Example II-1 are larger than the resistance values ​​of the conductive patterns obtained in Examples I-1 to I-3, but can be said to be sufficiently small when considering application to, for example, RF tags. Furthermore, the conductive pattern was formed with good precision.

[0128] <Reference: Electron microscope of pattern cross section> The substrate with the conductive pattern obtained in Example I-1 was cut, and the cross section of the conductive pattern portion was photographed with an electron microscope. The photographed image is shown in Figure 4. From this figure, it can be seen that the adhesive layer has hardened in a state where the components (resin, etc.) that make up the adhesive layer have penetrated into the gaps between the conductive particles to a depth of about 4.0 μm. The substrate with the conductive pattern obtained in Example II-1 was cut, and the cross section of the conductive pattern was photographed using an electron microscope. The photographed image is shown in Figure 5. From this figure, it can be seen that the adhesive layer was cured in a state in which the components (resin, etc.) that make up the adhesive layer had penetrated into the gaps between the conductive particles to a depth of approximately 15.7 μm. It is believed that the penetration of resin or the like into the gaps between the conductive particles in the conductive pattern, as shown in these figures, contributes to the good adhesion of the conductive pattern.

[0129] 4 and 5, conductive patterns with good conductivity were obtained in Examples I-1 and II-1 even when resin or the like was seeped into a portion of the conductive pattern. Even if the conductive particles are not sintered in the portion of the conductive pattern close to the cured adhesive layer, the resistance value of the conductive pattern is thought to be sufficiently small if the conductive particles near the surface of the conductive pattern (for example, up to a depth of about 5 μm or about 10 μm from the surface of the conductive pattern) are sufficiently sintered. [Explanation of symbols]

[0130] 1 Base material 2 Adhesive layer 2B Cured adhesive layer 3 patterns 3B Provisional Pattern 3C Conductive Pattern 5. Easy-to-peel substrate 6. Member (preferably film-like material) 7. A liquid containing component X capable of removing oxide films on the surfaces of conductive particles 10A roll 10B roll

Claims

1. a transfer step in which a temporary pattern formed on the surface of an easily peelable substrate using a conductive composition containing conductive particles is brought into contact with an adhesive layer formed on the surface of a substrate different from the easily peelable substrate, thereby obtaining a transfer pattern in which the temporary pattern is transferred to the surface of the adhesive layer; a pressing step of applying at least pressure to the transfer pattern to obtain a conductive pattern; A method for manufacturing a substrate having a conductive pattern, comprising:

2. A method for manufacturing a substrate provided with the conductive pattern according to claim 1, comprising: the adhesive layer is at least one of a thermosetting layer and a photosetting layer, A method for manufacturing a substrate having a conductive pattern, comprising an adhesive layer curing step of progressing the curing of the adhesive layer between the transfer step and the pressing step.

3. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising:

10. A method for manufacturing a substrate having a conductive pattern, wherein the conductive particles in the temporary pattern are substantially not sintered.

4. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for manufacturing a substrate having a conductive pattern, wherein the temporary pattern is substantially uncured.

5. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: a step of removing an oxide film, after the transferring step and before or simultaneously with the pressing step, bringing a component X capable of removing an oxide film on the surface of the conductive particles into contact with the transferred pattern.

6. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: In the pressing step, the transfer pattern is pressed while being heated.

7. A method for manufacturing a substrate provided with the conductive pattern according to claim 6, comprising: In the pressing step, the transfer pattern is pressed with a pressure of 1 to 5000 MPa and heated at a temperature of 50 to 400°C.

8. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate having a conductive pattern, wherein the conductive composition is in a paste state at room temperature.

9. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for producing a substrate having a conductive pattern, wherein the amount of the resin component in the conductive composition is 15 parts by mass or less per 100 parts by mass of the conductive particles.

10. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for producing a substrate having a conductive pattern, wherein the conductive composition does not substantially contain a curable component other than the conductive particles.

11. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. ５０ The method for manufacturing a substrate having a conductive pattern, wherein the thickness is 0.5 to 100 μm.

12. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: In the pressing step, the exposed surface of the transfer pattern is covered with a member, and then the transfer pattern is at least pressed.

13. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for producing a substrate having a conductive pattern, wherein the easily peelable substrate is a resin film or a release paper.

14. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for producing a substrate provided with a conductive pattern, comprising a peeling step of peeling off the easily peelable substrate before the pressing step.

15. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate having a conductive pattern, wherein the substrate is flexible.

16. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for manufacturing a substrate having a conductive pattern, wherein the substrate is at least one selected from the group consisting of polyester, polyolefin, and polycarbonate.

17. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate having a conductive pattern, wherein the substrate is made of polyimide.

18. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate having a conductive pattern, wherein the substrate is paper.

19. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate provided with a conductive pattern, wherein the adhesive layer has a thickness of 1 to 30 μm.

20. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for manufacturing a substrate provided with a conductive pattern, wherein the height of the temporary pattern is 0.5 to 100 μm.

21. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for manufacturing a substrate provided with a conductive pattern, wherein in the transfer step, pressure is applied to enhance adhesion between the temporary pattern and the adhesive layer.

22. A method for producing an electronic device, comprising the steps of: producing an electronic device using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern according to claim 1 or 2.

23. 23. The method of manufacturing an electronic device according to claim 22, comprising: The method for manufacturing an electronic device, wherein the electronic device is an RF tag.

24. A method for producing an electromagnetic wave shielding film, comprising producing an electromagnetic wave shielding film using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern according to claim 1 or 2.

25. A method for producing a sheet heating element, comprising producing a sheet heating element using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern according to claim 1 or 2.

26. A substrate; a cured adhesive layer provided on the surface of the substrate, the cured adhesive layer being a cured product of a material having at least one of photocuring and thermosetting properties; a pattern formed on the surface of the cured adhesive layer using a conductive composition containing conductive particles; 1. An article for producing a substrate with a conductive pattern, comprising:

27. 27. The article of claim 26, The amount of the resin component in the pattern is 15 parts by mass or less per 100 parts by mass of the conductive particles.

28. 28. The article of claim 26 or 27, The pattern is substantially free of any curable component other than the conductive particles.

29. 28. The article of claim 26 or 27, The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. ５０ is 0.5 to 100 μm.

30. 28. The article of claim 26 or 27, The article, wherein the substrate is flexible.

31. 28. The article of claim 26 or 27, The article, wherein the substrate is at least one selected from the group consisting of polyester, polyolefin, and polycarbonate.

32. 28. The article of claim 26 or 27, The article, wherein the substrate is a polyimide.

33. 28. The article of claim 26 or 27, The article, wherein the substrate is paper.

34. 28. The article of claim 26 or 27, The article, wherein the cured adhesive layer has a thickness of 1 to 30 μm.

35. 28. The article of claim 26 or 27, An article, wherein a portion of the cured adhesive layer is cured while infiltrating into gaps between the conductive particles in the pattern.

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