Solid-state imaging element package, solid-state imaging element package assembly, transparent substrate with rib, and method for manufacturing solid-state imaging element package

Abstract

To provide a solid-state imaging element package having high imaging quality.SOLUTION: A solid-state imaging element package 1 includes: a transparent substrate 10; an element substrate 20 which has an imaging part 21 facing the transparent substrate 10; and a frame 30 having a square shape in a plan view which is interposed between the transparent substrate 10 and the element substrate 20 and disposed so as to surround the imaging part 21. The frame 30 includes four ribs 31 which are linearly formed and arranged apart from each other in a square shape whose corners are opened in plan view and an adhesive agent block 32 into which at least the end of the rib 31 is embedded and which closes a gap between the ribs 31.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a solid-state imaging device package, a solid-state imaging device package assembly, a transparent substrate with ribs, and a method for manufacturing a solid-state imaging device package. [Background technology]

[0002] Solid-state imaging devices (solid-state imaging element packages) such as CMOS image sensors and CCD image sensors are used in digital cameras, smartphones, etc. In recent years, their use has increased due to their widespread use in surveillance cameras in automobiles and factories, and there is an increasing demand for them to be more compact and have higher resolution.

[0003] A solid-state imaging device package is a package in which an element substrate having an imaging unit (light receiving element) and a transparent substrate such as glass are bonded together at a distance by a frame that surrounds the imaging unit, and which has a hollow space that contains the imaging unit. A solid-state imaging device package is manufactured by applying an adhesive whose main component is epoxy resin, acrylic resin, or the like to the element substrate to a certain thickness to form a frame, and then sealing the upper opening of the frame with a transparent substrate (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-296453 Summary of the Invention [Problem to be solved by the invention]

[0005] In the manufacturing process of conventional solid-state imaging element packages, when a transparent substrate is laminated to an element substrate via an adhesive, there is a risk that the adhesive may be crushed by the weight of the transparent substrate, causing the transparent substrate to tilt, or that the adhesive may be pushed out to the vicinity of the light-receiving element, thereby degrading imaging quality.

[0006] Therefore, an object of the present invention is to provide a solid-state imaging device package, a solid-state imaging device package assembly, a transparent substrate with ribs, and a method for manufacturing a solid-state imaging device package that have high imaging quality. [Means for solving the problem]

[0007] (1) A solid-state imaging element package according to one embodiment of the present invention comprises a transparent substrate, an element substrate having an imaging section facing the transparent substrate, and a frame having a rectangular shape in a planar view, interposed between the transparent substrate and the element substrate and arranged to surround the imaging section, wherein the frame has four ribs each formed in a straight line and arranged spaced apart from each other in a square shape with open corners in a planar view, and adhesive blocks in which at least the ends of the ribs are embedded and which close the gaps between the ribs.

[0008] (2) In the solid-state imaging device package of (1), the ribs may be formed from a resin composition containing a colorant.

[0009] (3) A solid-state imaging element package assembly according to one embodiment of the present invention has a plurality of solid-state imaging element packages (1) to (2), and the transparent substrate and the element substrate are formed as an integrated aggregate transparent substrate and aggregate element substrate, respectively, via a dicing space.

[0010] (4) A ribbed transparent substrate according to one embodiment of the present invention comprises a transparent substrate and four ribs each formed linearly on one main surface of the transparent substrate and spaced apart from one another in a rectangular shape with open corners in a planar view.

[0011] (5) A method for manufacturing a solid-state imaging element package according to one embodiment of the present invention is a method for manufacturing a solid-state imaging element package comprising a transparent substrate, an element substrate having an imaging section, and a frame interposed between the transparent substrate and the element substrate and arranged to surround the imaging section, the method comprising the steps of: forming four linear ribs on the transparent substrate that are spaced apart from each other in a rectangular shape with open corners in a planar view; applying adhesive to the element substrate at least to the corners of the square formed by the four ribs; and joining the transparent substrate and the element substrate to form adhesive blocks that close the gaps between the ribs by inserting the ends of the ribs into the adhesive.

[0012] (6) In the solid-state imaging element package manufacturing method of (5), the transparent substrate and the element substrate are provided as an aggregate transparent substrate and an aggregate element substrate, respectively, in which a plurality of them are integrated, and the steps of forming the rib, applying the adhesive, and bonding the transparent substrate and the element substrate are performed using the aggregate transparent substrate and the aggregate element substrate, and the solid-state imaging element package manufacturing method may further include a step of dicing the solid-state imaging element package into individual pieces after the step of bonding the transparent substrate and the element substrate.

[0013] (7) In the method for manufacturing a solid-state imaging device package according to (5) to (6), the ribs may be formed of a negative photosensitive resin. [Effects of the Invention]

[0014] According to the present invention, a solid-state imaging device package with high imaging quality can be provided. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a schematic plan view of a solid-state imaging device package according to a first embodiment of the present invention. [Figure 2] 2 is a cross-sectional view of the solid-state imaging device package taken along line XX in FIG. 1. [Figure 3]2 is a flowchart showing a manufacturing procedure of the solid-state imaging element package of FIG. [Figure 4] 1 is a schematic perspective view showing a ribbed transparent substrate according to an embodiment of the present invention. [Figure 5] FIG. 10 is a schematic cross-sectional view of a solid-state imaging device package according to a second embodiment of the present invention. [Figure 6] 6 is a flowchart showing a manufacturing procedure of the solid-state imaging element package of FIG. 5. [Figure 7] 1 is a schematic plan view of a solid-state imaging device package assembly according to an embodiment of the present invention; [Figure 8] 8 is a cross-sectional view of the solid-state imaging device package assembly shown in FIG. 7 along the line YY. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings. For convenience, hatching and component symbols may be omitted. Also, the dimensions of various components in the drawings have been adjusted for clarity.

[0017] First Embodiment Fig. 1 is a schematic plan view of a solid-state imaging element package 1 according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view of the solid-state imaging element package 1 taken along line XX in Fig. 1. The solid-state imaging element package 1 includes a transparent substrate 10, an element substrate 20 having an imaging unit 21 facing the transparent substrate 10, and a frame 30 interposed between the transparent substrate 10 and the element substrate 20 and disposed so as to surround the imaging unit 21.

[0018] The transparent substrate 10 protects the imaging unit 21 and allows light to enter the imaging unit 21. Examples of materials for the transparent substrate 10 include glass, transparent ceramics such as sapphire, and transparent plastics such as acrylic resin and polycarbonate. Among these, transparent ceramics are preferred as the material for the transparent substrate 10 from the viewpoint of reliability, and glass is particularly preferred from the viewpoint of versatility. There are no particular limitations on the type of glass used for the transparent substrate 10, and examples include quartz glass, borosilicate glass, and alkali-free glass.

[0019] The element substrate 20 is a structural member that supports the imaging unit 21 and is made of a material having sufficient rigidity. The element substrate 20 may be a substrate that holds a semiconductor element (chip) on which the imaging unit 21 is formed, or may be a semiconductor wafer on which the imaging unit 21 is formed. The element substrate 20 may also be a simple support that does not have any components that are electrically incorporated into a circuit, but is preferably a circuit board on which a circuit that supplies power to the imaging unit 21 and extracts signals from the imaging unit 21 is formed. In this embodiment, the element substrate 20 is intended to be a circuit board on which a circuit including terminals for electrical connection with the imaging unit 21 is formed.

[0020] The imaging unit 21 may be a solid-state imaging element such as a CMOS image sensor. As described above, the imaging unit 21 may be integrated with the element substrate 20, but is typically an independent semiconductor element that has only an imaging function and is mounted on the element substrate 20. Wire bonding may be used as a method for mounting the imaging unit 21, which is an independent semiconductor element, on the element substrate 20, but flip-chip bonding is preferably used to reduce the size of the solid-state imaging element package 1.

[0021] Examples of materials for the element substrate 20 include resin materials such as polyimide, polyester, epoxy resin, bismaleimide triazine resin, and phenolic resin; composite materials obtained by impregnating paper, glass fiber nonwoven fabric, or the like with these resins; ceramic materials such as alumina, aluminum nitride, beryllium oxide, and silicon nitride; and metal materials. Among these, glass epoxy substrates, ceramic substrates, and bismaleimide triazine resin substrates are preferably used as the element substrate 20. The element substrate 20 may also be one in which a circuit having a metal wiring pattern or metal bumps is formed on or inside the surface of such an insulating substrate.

[0022] The frame 30 is formed in a rectangular shape in a plan view, surrounding the imaging unit 21 with a gap therebetween. The frame 30 holds the transparent substrate 10 and the element substrate 20 parallel to each other, and defines an airtight space in which the imaging unit 21 is enclosed. The frame 30 has four ribs 31 that are each formed linearly and arranged spaced apart from each other in a rectangular shape with open corners in a plan view, and four adhesive blocks 32 in which the ends of the ribs 31 are embedded and which close the gaps between the ribs 31.

[0023] To prevent the frame 30 from protruding due to manufacturing errors while miniaturizing the solid-state imaging device package 1, the distance between the frame 30 and the outer edge of the transparent substrate 10 is preferably 1 μm to 1 mm, and more preferably 10 μm to 0.5 mm. To sufficiently prevent light from entering the imaging unit 21 obliquely from the opening of the frame 30 on the transparent substrate 10 side, the height of the frame 30 is preferably 50 μm to 200 μm, and more preferably 80 μm to 150 μm.

[0024] The ribs 31 determine the gap between the transparent substrate 10 and the element substrate 20. For this reason, the ribs 31 are preferably made of a material with a relatively high compressive strength (elastic modulus). The compressive strength of the ribs 31 is 0.1 N / cm 2 More than 10N / cm 2 Less than 0.5N / cm is preferable. 2 More than 1.0N / cm 2The following are more preferable: Note that if a material with an excessively high compressive strength is used, there is a risk that productivity will decrease and costs will unnecessarily increase.

[0025] The ribs 31 are preferably formed from a photosensitive resin so that they can be precisely formed by photography. In particular, by improving the positional accuracy and flatness of the inner peripheral surface of the ribs 31, it is possible to prevent light reflected by the inner peripheral surface of the ribs 31 from entering the imaging unit 21, thereby improving image quality. The width of the ribs 31 in a plan view is preferably 30 μm to 300 μm, and more preferably 50 μm to 200 μm, in order to ensure the strength required to accurately determine the distance between the transparent substrate 10 and the element substrate 20 while miniaturizing the solid-state imaging device package 1.

[0026] The ribs 31 are preferably formed from a negative photosensitive resin in terms of strength, adhesion, chemical resistance, film thickness range, etc. The ribs 31 formed by photolithography using a negative photosensitive resin have a uniform height, which allows the transparent substrate 10 to be attached parallel to the element substrate 20. As the negative photosensitive resin for forming the ribs 31, an acrylic photosensitive resin, an epoxy photosensitive resin, a siloxane photosensitive resin, etc. can be suitably used. Furthermore, the photosensitive resin for forming the ribs 31 may contain a radical polymerization initiator or the like to enable further thermal curing.

[0027] Furthermore, the ribs 31 are preferably formed from a resin composition containing a colorant to provide light absorption (light blocking) that prevents light from passing through the ribs 31 or being reflected by the inner circumferential surface of the ribs 31 and entering the imaging unit 21. Examples of colorants contained in the ribs 31 include organic pigments, inorganic pigments, dyes, etc. From the viewpoint of heat resistance and colorability, it is preferable to use a pigment as the colorant. The colorant may be any color, such as red, yellow, or blue, but is preferably a color that absorbs a wide range of wavelengths, typically black, to suppress light from entering from the side and re-reflecting light inside.

[0028] Black pigments that absorb a wide range of wavelengths in the visible light region include black organic pigments and black inorganic pigments. Examples of black organic pigments include anthraquinone-based black pigments, perylene-based black pigments, azo-based black pigments, and lactam-based black pigments. Among these, perylene-based black pigments and lactam-based black pigments are preferred due to their excellent light-blocking properties. Examples of black inorganic pigments include carbon black and black low-order titanium oxynitride. Examples of inorganic pigments other than black include composite metal oxide pigments, titanium oxide, barium sulfate, lead sulfate, yellow lead, red iron oxide, ultramarine, Prussian blue, chromium oxide, antimony white, zinc sulfide, zinc, manganese purple, cobalt purple, and magnesium carbonate. Specific examples of chromatic pigments include Color Index (CI) Pigment Yellow 1, 10, and 83; CI Pigment Orange 2, 5, and 13; CI Pigment Red 1, 2, and 3; CI Pigment Green 7, 10, and 36; and CI Pigment Blue 1, 2, and 15. These pigments can be used alone or in various combinations. Examples of dyes include azo compounds, anthraquinone compounds, perylene compounds, perinone compounds, phthalocyanine compounds, carbonium compounds, and indigoid compounds.

[0029] The colorant content of the rib 31 is preferably 0.2% by mass or more and 30% by mass or less, more preferably 0.5% by mass or more and 15% by mass or less, and even more preferably 0.8% by mass or more and 10% by mass or less. By setting the colorant content at or above the lower limit, flare due to light reflection can be effectively suppressed. Specifically, the transmittance at 500 nm is preferably 30% or less, more preferably 10% or less, and even more preferably 3% or less. Furthermore, by setting the colorant content at or below the upper limit, the formability and adhesiveness of the rib 31 can be ensured.

[0030] By arranging the ribs 31 at a distance from each other, the adhesive blocks 32 can absorb thermal displacement, particularly during the heating process when manufacturing the solid-state imaging device package 1 and when mounting the solid-state imaging device package 1 on an electronic device, and prevent the corners of the frame 30 from breaking due to thermal stress. The distance between the ribs 31 (the minimum distance between two adjacent ribs 31) is preferably 0.001% to 30% of the average length of the ribs 31, and more preferably 0.01% to 10%. If the distance between the ribs 31 is too small, thermal stress may not be sufficiently alleviated, while if the distance between the ribs 31 is too large, the adhesive blocks 32 may become large, which may cause light reflected by the adhesive blocks 32 to enter the imaging unit 21.

[0031] The adhesive block 32 ensures the bonding strength between the transparent substrate 10 and the element substrate 20. The adhesive block 32 also holds the ends of the ribs 31, ensuring the airtightness of the space in which the imaging unit 21 is located. For this reason, the adhesive block 32 can be made of a material with a relatively low compressive strength compared to the ribs 31, which ensure dimensional accuracy. A specific compressive strength of the adhesive block 32 is 0.001 N / cm 2 More than 0.05N / cm 2 Preferably less than 0.005N / cm 2 More than 0.02N / cm 2 The following is more preferable. Specifically, the adhesive block 32 may be formed from an adhesive such as an epoxy adhesive, an acrylic adhesive, or a urethane adhesive. In particular, the adhesive block 32 is preferably formed from a photosensitive adhesive that can harden quickly enough to prevent deformation.

[0032] Similarly to the ribs 31, the adhesive blocks 32 preferably contain a colorant to suppress light transmission and reflection. The colorant contained in the adhesive blocks 32 can be the same as the colorant contained in the ribs 31. Since the adhesive blocks 32 cannot be expected to have the same shape precision as the ribs 31, it is preferable that the adhesive blocks 32 be selectively placed at the corners of the frame 30 so as not to be present on all four sides directly facing the sides of the imaging unit 21, in order to prevent light from being incident on the imaging unit 21 due to unexpected reflection.

[0033] As described above, the solid-state imaging element package 1 having a rectangular frame 30 consisting of four ribs 31 and four adhesive blocks 32 effectively suppresses the inclination of the transparent substrate 10 relative to the element substrate 20 and reliably suppresses unintended incidence of light into the imaging section 21, resulting in excellent imaging quality.

[0034] The solid-state imaging device package 1 can be manufactured by a method for manufacturing a solid-state imaging device package according to an embodiment of the present invention, as shown in Fig. 3. The method for manufacturing a solid-state imaging device package shown in Fig. 3 includes a rib forming step (step S01), an adhesive applying step (step S02), and a bonding step (step S03).

[0035] In the rib forming process of step S01, four ribs 31 are formed on the transparent substrate 10, as shown in FIG. 4. The ribs 31 are preferably formed by photolithography using a negative photosensitive resin, which can be formed to a uniform height and have a desired planar shape. In the rib forming process, the amount of light irradiation in the photolithography is adjusted so that the photosensitive resin (the ribs 31 to be formed) is in a semi-cured state (B stage). The ribbed transparent substrate obtained in this rib forming process is itself one embodiment of the ribbed transparent substrate according to the present invention.

[0036] In the adhesive application step of step S02, an adhesive is applied to the element substrate 20 to form four adhesive blocks 32. The adhesive can be applied by a method such as dispensing or screen printing. To ensure the shape accuracy of the frame 30, the adhesive applied to the transparent substrate 10 may be semi-cured, for example, by exposing a photosensitive adhesive to light, before the subsequent bonding step.

[0037] In the bonding process of step S03, the transparent substrate 10 and the element substrate 20 are overlapped so that the ribs 31 are inserted into the adhesive applied to the element substrate 20, thereby forming adhesive blocks 32 that hold the ends of the ribs 31 with the adhesive, and the transparent substrate 10 and the element substrate 20 are bonded together with the resin composition that forms the ribs 31 and the adhesive that forms the adhesive blocks 32. This results in a solid-state imaging element package 1. In this bonding process, it is preferable to perform a treatment such as heating to promote hardening of the resin composition that forms the ribs 31 and the adhesive that forms the adhesive blocks 32.

[0038] As described above, by forming the frame 30 using the ribs 31 with high shape precision and the adhesive blocks 32 with high adhesive strength and the ability to relieve thermal stress, it is possible to manufacture a solid-state imaging element package 1 that can reliably protect the imaging section 21 and has excellent imaging quality.

[0039] Second Embodiment 5 is a schematic cross-sectional view of a solid-state imaging device package 1A according to a second embodiment of the present invention. In the description of the solid-state imaging device package 1A according to this embodiment, the same components as those in the solid-state imaging device package 1 in FIG. 1 are designated by the same reference numerals, and redundant description may be omitted.

[0040] The solid-state imaging element package 1A comprises a transparent substrate 10A, an element substrate 20 having an imaging section 21 facing the transparent substrate 10A, and a frame 30A interposed between the transparent substrate 10 and the element substrate 20 and arranged to surround the imaging section 21.

[0041] In addition to the configuration of the transparent substrate 10 of the solid-state imaging device package 1 in FIG. 1 , the transparent substrate 10A has a light-shielding film 11 formed on its outer periphery. The light-shielding film 11 defines an optical path through which light from a subject enters the imaging section 21. While the light-shielding film 11 may be formed on one of the main surfaces of the transparent substrate 10A, it is preferable to form the light-shielding film 11 on the main surface of the transparent substrate 10A facing the element substrate 20. This prevents not only light from entering the internal space of the solid-state imaging device package 1 (the space defined by the transparent substrate 10A, the element substrate 20, and the frame 30A) from the outside, but also light reflected inside the solid-state imaging device package 1 from being re-reflected by the transparent substrate 10A and entering the imaging section 21. In this case, the frame 30A is bonded to the transparent substrate 10A via the light-shielding film 11. The light-shielding film 11 can also function as a surface treatment film that improves the adhesion of the transparent substrate 10A to the frame 30A. This allows the frame 30A, which has high formability, to be reliably bonded to the transparent substrate 10A. Moreover, the light-shielding film 11 is preferably formed so as to overlap the frame 30A so as not to form a path for light to reach the imaging unit 21 on the outside.

[0042] The light-shielding film 11 is formed from a resin composition containing a colorant. The light-shielding film 11 can be formed by any method, such as printing. However, by forming the light-shielding film 11 from a photosensitive resin composition, the light-shielding film 11 can be formed with a uniform thickness and an accurate planar shape using photolithography techniques. The photosensitive resin composition contains a resin component having a reactive group, such as an epoxy group or an acrylic group, and a photopolymerization initiator. The colorant contained in the photosensitive resin composition may be the same as the colorant contained in the rib 31 of the solid-state imaging device package 1 in FIG. 1.

[0043] The colorant content in the light-shielding film 11 is preferably 0.5% by mass or more and 30% by mass or less, more preferably 1.0% by mass or more and 20% by mass or less, and particularly preferably 1.5% by mass or more and 15% by mass or less. By setting the colorant content at or above the lower limit, the light transmittance of the light-shielding film 11 can be sufficiently reduced, thereby effectively suppressing flare and ghosting. Specifically, the light transmittance of the light-shielding film 11 at 500 nm is preferably 30% or less, more preferably 10% or less, and even more preferably 3% or less. Furthermore, by setting the colorant content at or below the upper limit, it is possible to prevent the colorant from remaining on the surface of the transparent substrate 10A after removing the photosensitive resin composition from areas not irradiated with light.

[0044] The thickness of the light-shielding film 11 is preferably 0.5 μm or more and 30 μm or less, and more preferably 1 μm or more and 10 μm or less. By setting the thickness of the light-shielding film 11 to be equal to or greater than the above-mentioned lower limit, sufficient light-shielding properties can be imparted. Furthermore, by setting the thickness of the light-shielding film 11 to be equal to or less than the above-mentioned upper limit, it is possible to prevent errors in the thickness of the light-shielding film 11 from causing the transparent substrate 10A to tilt relative to the element substrate 20.

[0045] The frame 30A has four ribs 31A that are each formed linearly and arranged spaced apart in a square shape with open corners in a plan view, four adhesive blocks 32 in which the ends of the ribs 31A are embedded and which close the gaps between the ribs 31A, and a thin adhesive layer 33 interposed between the ribs 31A and the element substrate 20. That is, in the frame 30A of this embodiment, the ribs 31A differ from the ribs 31 of the solid-state imaging element package 1 of FIG. 1 in that the ribs 31A are joined to the element substrate 20 by the adhesive layer 33.

[0046] The adhesive that forms the adhesive layer 33 can be the same as the adhesive that forms the adhesive block 32. The adhesive that forms the adhesive layer 33 may be the same as the adhesive that forms the adhesive block 32 in order to facilitate the manufacture of the solid-state imaging element package 1A, or may be an adhesive that does not contain a filler such as a colorant in order to improve adhesive strength.

[0047] The thickness of the adhesive layer 33 is sufficiently small and easy to control, so that the solid-state imaging device package 1A of this embodiment can also effectively prevent the transparent substrate 10A from tilting relative to the device substrate 20.

[0048] The solid-state imaging device package 1A of Fig. 5 can be manufactured by an embodiment of a method for manufacturing a solid-state imaging device package according to the present invention shown in Fig. 6. The method for manufacturing a solid-state imaging device package of Fig. 6 includes a light-shielding film forming step (step S11), a rib forming step (step S12), an adhesive applying step (step S13), a bonding step (step S14), and a dicing step (step S15).

[0049] In the light-shielding film forming step S11, a light-shielding film 11 is formed on the outer periphery of one main surface of the transparent substrate 10A. The light-shielding film 11 can be formed by photolithography of a photosensitive resin composition, coating of a paint, or the like, but is preferably formed by photolithography of a photosensitive resin composition, which has high shape accuracy. In addition, to improve productivity, the transparent substrate 10A is provided as an aggregate transparent substrate 110 in which multiple transparent substrates 10A are integrated together.

[0050] In the rib forming step S12, ribs 31A are formed on the transparent substrate 10A. The ribs 31A are preferably formed by photolithography using a negative photosensitive resin, which can be formed to a uniform height and a desired planar shape. Furthermore, an adhesive block bake may be performed in which the exposed photosensitive resin is further heated to completely harden it.

[0051] In the adhesive application step of step S13, an adhesive for forming the adhesive layer 33 and an adhesive for forming the adhesive blocks 32 are applied to the element substrate 20. The adhesive can be applied by a method such as dispensing or screen printing. The adhesive for forming the adhesive layer 33 and the adhesive for forming the adhesive blocks 32 may be applied separately. The adhesive for forming the adhesive layer 33 may be applied to the rib 31A. Similarly to the transparent substrate 10A, the element substrate 20 is provided as an aggregate element substrate 120 in which a plurality of element substrates 20 are integrated together in order to improve productivity.

[0052] In the bonding process of step S14, the transparent substrate 10A and the element substrate 20 are overlapped so that the ribs 31 are inserted into the adhesive applied to the element substrate 20, and the transparent substrate 10A and the element substrate 20 are bonded together by the adhesive applied to the element substrate 20. By pressing the transparent substrate 10A and the element substrate 20 together with an appropriate force, the thickness of the adhesive layer 33 can be made uniform, and therefore the distance between the transparent substrate 10A and the element substrate 20 can be made uniform. As a result, as shown in FIGS. 7 and 8, a solid-state imaging element package assembly 100 is obtained in which multiple solid-state imaging element packages 1A are integrated and lined up with dicing spaces between them. This solid-state imaging element package assembly 100 is itself an embodiment of the solid-state imaging element package assembly according to the present invention.

[0053] In the dicing step of step S15, the solid-state imaging element package assembly 100 obtained in the bonding step is diced to separate the solid-state imaging element packages 1. Dicing can be performed using a rotary blade such as a diamond cutter, for example.

[0054] Although the present invention has been described above with reference to the preferred embodiments, the present invention is not limited to the above-described embodiments and various modifications and variations are possible. For example, in the solid-state imaging device package according to the present invention, the adhesive block may be formed in the shape of a single rectangular frame in which the four ribs are entirely embedded. [Example]

[0055] The present invention will be specifically described below based on examples, but the present invention is not limited to the following examples.

[0056] Example 1 Four rectangular ribs, each 200 μm wide and 100 μm high, were formed on a glass substrate (transparent substrate) using an epoxy cation-curing negative photosensitive resin. The spacing between opposing ribs was 15 mm and 10 mm, and the distance between the ribs at the corners was 1 μm. The compressive strength of the fully cured ribs was measured and found to be 0.7 N / cm. 2 The compressive strength was measured using a nanoindentation tester "ENT-NEXUS (registered trademark)" manufactured by Rionix Corporation, at an environmental temperature of 60°C, an indenter approach speed of 100 nm / sec, a maximum load of 5 N, and a load application speed of 0.6 mN / sec. Furthermore, an acrylic adhesive was applied to an element substrate having an imaging section with an effective area of ​​6.2 mm x 4.6 mm at positions facing the corners of the rectangle formed by the four ribs, and the glass substrate and element substrate were bonded together so that the ends of the ribs were inserted into the adhesive, thereby creating a solid-state imaging element package. Note that the adhesive applied to the element substrate without bonding it to the glass substrate was completely cured, and the compressive strength was measured in the same way as for the ribs, resulting in a value of 0.01 N / cm 2 It was.

[0057] Example 2 A solid-state imaging device package was produced under the same conditions as in Example 1, except that the distance between the ribs at the corners was set to 700 μm.

[0058] Example 3 A solid-state imaging device package was produced under the same conditions as in Example 1, except that the distance between the ribs at the corners was set to 3 mm.

[0059] Example 4 A solid-state imaging device package was produced under the same conditions as in Example 1, except that the distance between the ribs at the corners was set to 5 mm.

[0060] Example 5 A solid-state imaging element package was produced under the same conditions as in Example 1, except that 1% by mass of carbon black was blended into the epoxy cation-curing negative photosensitive resin that formed the ribs, and the distance between the ribs at the corners was set to 700 μm.

[0061] (Comparative Example 1) Without forming ribs, an acrylic adhesive was applied to the element substrate in a rectangular frame shape, and the glass substrate and the element substrate were joined to form a solid-state imaging element package.

[0062] (Comparative Example 2) A solid-state imaging device package was produced under the same conditions as in Example 1, except that the four ribs were formed into an integrated square frame shape.

[0063] (Substrate tilt) For Examples 1 to 5 and Comparative Example 1, the height of the glass substrate near the inner corners of the frame was measured using an Olympus 3D measuring laser microscope "LEXT (registered trademark) OLS5100," with the Sogi substrate as the reference point. If the difference between the maximum and minimum values ​​was less than 3 μm, it was rated as "A," if it was 3 μm or more but less than 5 μm, it was rated as "B," if it was 5 μm or more but less than 10 μm, it was rated as "C," and if it was 10 μm or more, it was rated as "D."

[0064] (thermal shock resistance) Two samples were prepared for each of Examples 1 to 5 and Comparative Example 1, and a thermal shock test was performed using a Hitachi Global Life Solutions heat shock tester "ES-57L." The thermal shock test consisted of holding the optical semiconductor device in a -50°C atmosphere for 30 minutes, followed by holding it in a 125°C atmosphere for 30 minutes, with one cycle being considered. After 1000 cycles, the simulated samples were removed and observed from the glass substrate side using an optical microscope to check for resin peeling and cracks. Regarding peeling, samples with no rib peeling were rated "A," samples with a total of one peeled area across the two samples were rated "B," and samples with a total of two or more peeled areas across the two samples were rated "C." Regarding cracking, samples with no rib cracking were rated "A," samples with a total of one cracked area across the two samples were rated "B," and samples with a total of two or more cracked areas across the two samples were rated "C."

[0065] (Ghost Index) For Examples 1 to 5 and Comparative Example 1, the ghost flare evaluation system "GCS-2T" manufactured by Tsubosaka Electric Co., Ltd. was used to calculate the number of pixels that exceeded 1 / 100 million of the brightness of the light source divided by the total number of pixels, and the percentage of this value relative to the value for Comparative Example 1 was used as the ghost index.

[0066] The preparation conditions and evaluation results of Examples 1 to 5 and Comparative Example 1 are summarized in the following table.

[0067] [Table 1]

[0068] As described above, it was confirmed that by forming four ribs spaced apart in a square shape with open corners, it is possible to suppress the tilt of the glass substrate relative to the element substrate, thereby reducing the ghost index and improving resistance to temperature changes. [Explanation of symbols]

[0069] 1 Solid-state imaging device package 10 Transparent substrate 11 Light-shielding film 20 Element substrate 21 Imaging unit 30 frames 31 Ribs 32 Adhesive Block 33 Adhesive layer 100 Solid-state imaging device package assembly 110 Collective transparent substrate 130 Aggregate element substrate

Claims

1. A transparent substrate; an element substrate having an imaging unit facing the transparent substrate; a frame having a rectangular shape in a plan view, which is interposed between the transparent substrate and the element substrate and disposed so as to surround the imaging unit; Equipped with The frame is Four ribs each formed linearly and arranged spaced apart from one another in a square shape with open corners in a plan view; adhesive blocks in which at least the ends of the ribs are embedded and which close the gaps between the ribs; A solid-state imaging device package comprising:

2. 2. The solid-state imaging device package according to claim 1, wherein the rib is formed from a resin composition containing a colorant.

3. a plurality of solid-state imaging device packages according to claim 1 or 2; The solid-state imaging device package assembly, wherein the transparent substrate and the element substrate are respectively formed as an integrated aggregate transparent substrate and aggregate element substrate via a dicing space.

4. A transparent substrate; four ribs formed linearly on one main surface of the transparent substrate and spaced apart from one another in a rectangular shape with open corners in a plan view; A ribbed transparent substrate comprising:

5. 1. A method for manufacturing a solid-state imaging device package, the method comprising: manufacturing a solid-state imaging device package including a transparent substrate; an element substrate having an imaging unit; and a frame having a square shape in a plan view, the frame being interposed between the transparent substrate and the element substrate and disposed so as to surround the imaging unit, the method comprising: forming four linear ribs spaced apart from one another in a square shape with open corners in a plan view on the transparent substrate; applying an adhesive to the element substrate so as to face at least corners of a rectangle defined by the four ribs; bonding the transparent substrate and the device substrate together to form four adhesive blocks that close the gaps between the ribs by inserting ends of the ribs into the adhesive; A method for manufacturing a solid-state imaging device package, comprising:

6. the transparent substrate and the element substrate are respectively provided as an aggregate transparent substrate and an aggregate element substrate in which a plurality of substrates are integrated; the step of forming the rib, the step of applying the adhesive, and the step of forming the transparent substrate and the adhesive block are performed using the aggregate transparent substrate and the aggregate element substrate; 6. The method for manufacturing a solid-state imaging device package according to claim 5, further comprising the step of dividing the solid-state imaging device package into individual pieces by dicing after the step of bonding the transparent substrate and the device substrate.

7. 7. The method for manufacturing a solid-state image pickup device package according to claim 5, wherein the ribs are formed of a negative photosensitive resin.

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