Component mounting machine

Abstract

To provide a technique capable of more reliably determining whether or not an amount of waste in a waste box exceeds a predetermined amount as compared with the related art.SOLUTION: A technique disclosed in the present specification is embodied by a component mounting machine that mounts a component on a substrate. The component mounting machine includes: a disposal box that is open at an upper side and houses waste generated in the component mounting machine; a camera that can capture a box image that is an image at a predetermined height in the disposal box from above the disposal box; and a control device. The control device includes: a determination part that determines whether or not an amount of the waste contained in the disposal box exceeds a predetermined amount based on the box image captured by the camera; and an execution part that executes a predetermined process for preventing the waste in the disposal box from affecting the mounting of the component when the determination part determines that the amount of waste in the disposal box exceeds the predetermined amount.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a component mounter, and more particularly to a component mounter equipped with a waste box for collecting waste generated by the component mounter. [Background technology]

[0002] The component mounter disclosed in Patent Document 1 is equipped with a component disposal box for discarding components that are determined to be unmountable. The component disposal box is equipped with a fullness detection unit that detects when the amount of discarded components accumulated in the component disposal box is approaching fullness. The fullness detection unit is configured using, for example, a photoelectric sensor, a proximity sensor, a laser sensor, an ultrasonic sensor, etc. The detection area of ​​the fullness detection unit is limited to the vicinity of the upper end of the component disposal box. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-102479 Summary of the Invention [Problem to be solved by the invention]

[0004] In the component mounter disclosed in Patent Document 1, discarded components are stored in the component disposal box through a disposal port formed on the top surface of the component disposal box. The sensor of the fullness detection unit detects whether discarded components are present in a portion of the horizontal cross section of the component disposal box at the height where the sensor is located (i.e., near the position where the sensor is located). In other words, the portion of the horizontal cross section near the top end of the component disposal box is the detection area of ​​the fullness detection unit. Therefore, with the technology of Patent Document 1, even if the component disposal box is not full, if the discarded components are unevenly stored in the component disposal box, the fullness detection unit may detect the discarded components and erroneously determine that the component disposal box is approaching full. This specification provides a technology that can more reliably determine whether the amount of waste in the disposal box exceeds a predetermined amount compared to conventional technology.

[0005] The technology disclosed in this specification is embodied in a mounter that mounts components on a circuit board. The mounter includes a waste box that is open at the top and that stores waste generated by the mounter, a camera that can capture a box image that is an image of the waste box at a predetermined height from above the waste box, and a control device. The control device includes a determination unit that determines whether the amount of waste stored in the waste box exceeds a predetermined amount based on the box image captured by the camera, and an execution unit that executes a predetermined process to prevent the waste in the waste box from affecting the mounting of the components when the determination unit determines that the amount of waste in the waste box exceeds the predetermined amount.

[0006] The mounter determines whether the amount of waste stored in the waste box exceeds a predetermined amount based on a box image, which is an image of the inside of the waste box captured from above. Therefore, compared to conventional technology that uses a sensor to detect the presence of waste in the upper area of ​​the waste box, it can more reliably determine whether the amount of waste in the waste box exceeds a predetermined amount.

[0007] Furthermore, the method executed by the component mounter and the computer program for causing the control device of the component mounter to execute the processing are also novel and useful. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a side view of the component mounter according to the embodiment. [Figure 2] FIG. 2 is a cross-sectional view of the component mounter taken along line II-II in FIG. [Figure 3] An enlarged view of the area enclosed by line III in Figure 2. [Figure 4] 10 is a flowchart of a waste amount determination process. DETAILED DESCRIPTION OF THE INVENTION

[0009] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0010] In the mounter disclosed in this specification, the predetermined height may be lower than the height of the upper surface of the waste box. In this case, the waste box may include a mark arranged at the predetermined height within the waste box, facing the camera and having a brightness different from that of the component. The control device may further include a memory that stores a shape of the mark, and the determination unit may determine that the amount of waste exceeds the predetermined amount when the shape of the mark in the box image captured by the camera differs from the shape in the memory.

[0011] When the amount of waste in the waste box exceeds a predetermined amount, the waste covers the mark from above. That is, when the amount of waste in the waste box exceeds the predetermined amount, the shape of the mark in the box image changes depending on the waste. With this configuration, it is relatively easy to determine whether the amount of waste exceeds the predetermined amount based on the shape of the mark.

[0012] In the mounter disclosed in this specification, the disposal box may have a rectangular shape in a plan view, and in this case, the marks may be arranged on two of the four corners of the disposal box that face each other.

[0013] With this configuration, the number of marks can be reduced compared to a configuration in which marks are placed on all four corners, for example, and it is therefore possible to determine whether the amount of waste exceeds a predetermined amount with relatively simple image processing.

[0014] In the mounter disclosed in this specification, the mark may be disposed on a slope that is displaced downward inward from the inner wall of the disposal box.

[0015] For example, in a configuration in which the mark is arranged on a horizontal surface, when waste falls onto the mark from above the waste box, the waste may remain on the mark. In this case, the shape of the mark in the box image is deformed by the waste that remains on the mark. This may result in the waste amount in the waste box being determined to exceed the predetermined amount even though it has not yet reached the predetermined amount. With this configuration, even if the waste falls onto the mark, the waste falls along the slope without remaining on the mark. This prevents the waste amount in the waste box from being determined to exceed the predetermined amount even though it has not yet reached the predetermined amount.

[0016] The mounter disclosed in this specification may further include a nozzle for suctioning the component, and a mounting head for holding the nozzle and movable along the board. In this case, the camera may be fixed to the mounting head.

[0017] With this configuration, the camera moves along the board together with the mounting head that holds the nozzle. This eliminates the need for a dedicated movement mechanism for the camera, as opposed to a configuration that includes a movement mechanism that moves only the camera along the board, and allows the camera to move along the board using the movement mechanism that moves the nozzle.

[0018] In the component mounting machine disclosed in this specification, the camera may be further configured to capture at least one of an image of the component mounted on the board and an image of a board mark located on the board.

[0019] With this configuration, the camera that captures the box image can capture at least one of images of the components mounted on the board and images of the board marks, eliminating the need for a dedicated camera for capturing box images.

[0020] In the mounter disclosed in the present specification, the predetermined height may be the same height as the board after the components have been mounted.

[0021] With this configuration, the camera can capture, for example, the board and the box image with the same depth of field, eliminating the need to adjust the camera's focus and enabling a simple configuration to determine whether the amount of waste exceeds a predetermined amount.

[0022] In the component mounter disclosed in this specification, the determination unit may determine whether the amount of waste exceeds the predetermined amount after mounting of the component on the board is completed.

[0023] After the mounting of components on a board is completed, no waste will be generated before the mounting of components on a new board begins, and it is estimated that the amount of waste in the waste box will be at its maximum at that time. With this configuration, it is possible to efficiently determine whether the amount of waste in the waste box exceeds a predetermined amount at the time when it is estimated that the amount of waste in the waste box will be at its maximum.

[0024] In the mounter disclosed in this specification, the predetermined process may include a process of notifying that the waste in the waste box has exceeded the predetermined amount.

[0025] With this configuration, the user can be notified that the amount of waste in the waste box has exceeded a predetermined amount, which allows the user to, for example, collect the waste from the waste box.

[0026] (Example) The component mounter 10 shown in Figures 1 and 2 is a device that mounts components 4 on the surface 3 of a board 2. The component mounter 10 is also called an electronic component mounting device or a chip mounter. The board 2 is a circuit board, and the components 4 are electronic components. Typically, the component mounter 10 is installed alongside other board work machines such as a solder printer and a board inspection machine, forming a continuous mounting line.

[0027] 1 and 2, the component mounter 10 includes a touch screen 11, a component feeder unit 12, a feeder holder 14, a head unit 15 including a mounting head 16 and a head moving device 18, a board conveyor 20, a control device 22, a downward camera 21, a mark camera 30, and a waste box 40. The touch screen 11 displays, for example, information related to the component mounter 10 and accepts operations from a user. In a modified example, the component mounter 10 may include a display and an operation unit (e.g., a mouse and a keyboard) instead of the touch screen 11.

[0028] 2 in particular, component feeder unit 12 has multiple feeders arranged in the +X direction (i.e., the upward direction on the paper surface of FIG. 2), and each feeder stores multiple components 4. Each feeder of component feeder unit 12 is detachably attached to feeder holder 14 and supplies components 4 to mounting head 16.

[0029] As shown in FIG. 1 , the mounting head 16 has a cylindrical nozzle 6. The nozzle 6 extends downward (i.e., in the −Z direction) from the mounting head 16. The nozzle 6 is detachably attached to the mounting head 16. The mounter 10 maintains a negative pressure inside the nozzle 6 using a compressor (not shown), thereby adsorbing a component 4 to the tip of the nozzle 6. The mounting head 16 can move the nozzle 6 along the Z axis (i.e., up and down on the paper surface of FIG. 1 ) to move the nozzle 6 toward and away from each feeder of the component feeder unit 12 or the surface 3 of the board 2. When the negative pressure inside the nozzle 6 is released while the mounting head 16 has the tip of the nozzle 6 approaching the surface 3, the component 4 is mounted on the surface 3. Note that the mounting head 16 is not limited to having a single nozzle 6, and may have multiple nozzles 6.

[0030] The head moving device 18 moves the mounting head 16 between each feeder of the component feeder unit 12 and the board 2. As an example, the head moving device 18 in this embodiment is an XY robot that moves a moving base 18a along the XY plane, and the mounting head 16 and mark camera 30 are fixed to the moving base 18a. Note that the mounting head 16 is not limited to being fixed to the moving base 18a, but may also be detachably attached to the moving base 18a.

[0031] The board conveyor 20 is a device that carries in, positions, and carries out the board 2. As an example, the board conveyor 20 of this embodiment has a pair of belt conveyors and a support device (not shown) that supports the board 2 from below.

[0032] As shown in FIG. 2, the lower camera 21 is disposed between the component feeder unit 12 and the board conveyor 20. The lower camera 21 has a lens disposed facing upward. The lower camera 21 captures an adsorption image, which is an image of the underside of the component 4 adsorbed to the nozzle 6, from below. The lower camera 21 is configured to be able to communicate with the control device 22. The lower camera 21 captures an adsorption image based on an imaging instruction transmitted from the control device 22, and transmits image data of the captured adsorption image to the control device 22. This allows the control device 22 to determine, for example, whether the component 4 is properly adsorbed to the nozzle 6 based on the adsorption image.

[0033] The waste box 40 temporarily stores waste W1 generated by the component mounter 10. Here, the waste W1 includes, for example, components 4 determined to have not been properly picked up by the nozzle 6 based on the suction image. The waste box 40 is disposed adjacent to the downward camera 21 between the component feeder unit 12 and the board conveyor 20. An opening is provided on the top surface 42 of the waste box 40, connecting the inside of the waste box 40 to the outside. That is, the waste box 40 is open at the top. For example, if the control device 22 determines based on the above-described suction image that the component 4 has not been properly picked up by the nozzle 6, the control device 22 moves the mounting head 16 above the waste box 40 to release the negative pressure inside the nozzle 6. This causes the component 4 to fall from the bottom end of the nozzle 6 and be collected in the waste box 40 through the opening in the top surface 42 of the waste box 40.

[0034] 1, the upper surface 42 of the disposal box 40 is located above the surface 3 of the substrate 2 supported by the support device of the substrate conveyor 20. In other words, the height H1 of the surface 3 of the substrate 2 is lower than the height H2 of the upper surface 42 of the disposal box 40. Also, as shown in FIG. 2, a circular substrate mark 2M is provided on the surface 3 of the substrate 2. The substrate mark 2M is a mark that serves as a reference for the position of the substrate 2 in a planar view. The substrate mark 2M is printed, for example, on the surface 3 of the substrate 2. Therefore, the height of the substrate mark 2M is the same as the height H1 of the surface 3 of the substrate 2.

[0035] The control device 22 controls the operation of the component mounter 10. The control device 22 is configured to be able to communicate with, for example, the head unit 15 in addition to the mark camera 30 and the lower camera 21. As shown in the lower part of FIG. 1, the control device 22 includes a CPU 24 and a memory 26. The memory 26 is configured with a volatile memory and a non-volatile memory. The memory 26 stores a production program for mounting components 4 on the board 2. The memory 26 also stores mark shape information MI. The mark shape information MI is information indicating the shapes of the first mark 52F and the second mark 52S (see FIG. 3) on the disposal box 40. Details will be described later with reference to FIG. 3, but in this embodiment, each of the marks 52F and 52S has a circular shape. Therefore, the mark shape information MI includes first center coordinates (X1, X1) indicating the center position of the first mark 52F, second center coordinates (X2, X2) indicating the center position of the second mark 52S, and a radius R1 of each of the marks 52F and 52S.

[0036] The CPU 24 executes various processes in accordance with a program (for example, a production program) stored in the memory 26. In this embodiment, the CPU 24 executes a waste amount determination process, which will be described with reference to FIG.

[0037] The mark camera 30 is fixed to the mounting head 16 and moves integrally with the moving base 18a along with the mounting head 16. The mark camera 30 may be, for example, a CCD camera. The mark camera 30 includes a lens 32. The lens 32 is capable of capturing an image with a predetermined depth of field. In this embodiment, the depth of field set for the lens 32 includes the distance D1 between the tip of the lens 32 and the surface 3 of the board 2. The mark camera 30 is configured to be able to communicate with the control device 22. The control device 22 moves the mark camera 30 above the board mark 2M and causes the mark camera 30 to capture an image of the board mark 2M to capture the image. For example, the control device 22 compares the center position of the image of the board mark 2M with board reference coordinates (not shown) previously stored in the memory 26. The control device 22 recognizes the position of the board 2 in the mounter 10 based on the image of the board mark 2M captured by the mark camera 30 and can determine whether the position is accurate. Furthermore, the mark camera 30 captures an after-mounting image, which is an image of the component 4 mounted on the front surface 3 of the board 2, from above through the lens 32. The mark camera 30 captures the after-mounting image based on an imaging instruction transmitted from the control device 22, and transmits image data of the captured after-mounting image to the control device 22. As a result, the control device 22 determines whether the component 4 has been properly mounted on the front surface 3 of the board 2 based on the image data (after-mounting image) received from the mark camera 30. Furthermore, the mark camera 30 captures a box image, which is an image of the inside of the disposal box 40, based on an imaging instruction transmitted from the control device 22, and transmits image data of the captured box image to the control device 22. Note that in a modified example, the mark camera 30 does not need to capture either the image of the board mark 2M or the after-mounting image.

[0038] The box image is an image for determining whether the amount of waste W1 in the waste box 40 at the time of image capture has reached a threshold amount. That is, the box image is an image for determining to what height the waste W1 has been accommodated in the waste box 40. In this embodiment, the box image is an image for determining whether the waste W1 has been accommodated up to a height H1 in the waste box 40. As will be described in detail later with reference to FIG. 3, the height H1 is the height of the bottom end P1 (see FIG. 3) of each mark 52F, 52S in the waste box 40. The height H1 is the height that is estimated to be reached when the amount of waste W1 in the waste box 40 reaches the threshold amount. The threshold amount is set to the amount of waste W1 that may exceed the upper surface 42 of the waste box 40 if the component 4 mounting process continues for several hours after the image capture, e.g., 95% of the capacity of the waste box 40. The threshold amount, i.e., the height H1, is determined based on the size and defect rate of the component 4, etc., but can be changed by the user afterward. In this embodiment, the height H1 is lower than the top surface 42 of the disposal box 40, so even if the waste W1 in the disposal box 40 reaches the height H1, the waste W1 will not immediately protrude upward from the top surface 42 of the disposal box 40.

[0039] As described above, the mark camera 30 captures the post-mounting image. In this embodiment, the mark camera 30, which captures the post-mounting image, is moved above the waste box 40 together with the mounting head 16 to capture the box image. This eliminates the need for the component mounter 10 to have a dedicated camera for capturing the box image, simplifying the configuration. As described above, the height H1 is the height of the surface 3 of the board 2 supported by the support device of the board conveyor 20. In other words, the box image is an image at the same height as the board mark 2M and the post-mounting image. This allows the mark camera 30 to capture the post-mounting image and the box image with the same depth of field. This eliminates the need to set a new depth of field to capture the box image, and the need to adjust the focus of the mark camera 30, making it possible to capture the box image with a simple configuration.

[0040] The detailed structure of the disposal box 40 will be described with reference to Figure 3. The upper part of Figure 3 shows a plan view of the disposal box 40. The lower part of Figure 3 shows a cross-sectional view of the disposal box 40 taken along line AA in the plan view of Figure 3. Also, on the right side of Figure 3, an enlarged view B of the area surrounded by the dashed line in the cross-sectional view is shown. Furthermore, above the enlarged view B, an enlarged view C of the first mark support portion 50F in plan view is shown.

[0041] As shown in the plan view of FIG. 3, the disposal box 40 has a rectangular shape extending in the X-axis direction in plan view. The disposal box 40 includes four inner walls 44, a first mark support member 50F, and a second mark support member 50S. The four inner walls 44 define the interior space of the disposal box 40, and include a pair of inner walls 44 extending in the X-axis direction and a pair of inner walls 44 extending in the Y-axis direction. Each mark support member 50F, 50S is located at the connection portion between two adjacent inner walls 44. The first mark support member 50F includes a first mark 52F, a first upper surface 54F, and a first main body 56F. Similarly, the second mark support member 50S includes a second mark 52S, a second upper surface 54S, and a second main body 56S. The mark support members 50F, 50S have similar configurations. Therefore, in this embodiment, the configuration of the first mark support portion 50F will be mainly described.

[0042] As shown in the cross-sectional view of FIG. 3, the first body 56F of the first mark support unit 50F extends upward from the bottom surface of the disposal box 40 along the inner wall 44. The first top surface 54F is provided at the upper end of the first body 56F. The first top surface 54F exposes the top surface of the first mark 52F. The first top surface 54F extends from the inner wall 44 in a direction intersecting the up-down direction (i.e., the Z-axis direction). Therefore, the first top surface 54F and the top surface of the first mark 52F face the lens 32 of the mark camera 30. As a result, the first mark 52F is included in the box image captured by the mark camera 30.

[0043] The top surface of the first mark 52F has a circular shape with a radius R1 in a plan view. The first mark 52F is made of, for example, a white plate member. In contrast, the first top surface 54F and the waste W1 (e.g., the component 4) are, for example, black. That is, the brightness of the first mark 52F is higher than the brightness of the surrounding first top surface 54F and waste W1.

[0044] When capturing a box image, the control device 22 moves the placement head 16 so that the center (optical axis) of the lens 32 of the mark camera 30 coincides with the reference point BP. In this embodiment, the control device 22 causes the mark camera 30 to capture a box image using the center of the waste box 40 as the reference point BP. Therefore, the mark shape information MI in the memory 26 indicates a shape with the coordinates of the reference point BP set as the origin coordinate (0, 0). As shown in the plan view of FIG. 3 , the mark shape information MI indicates a circular shape with a radius R1 centered on a first center point MC1 located at first center coordinates (X1, Y1) and a circular shape with a radius R1 centered on a second center point MC2 located at second center coordinates (X2, Y2). As described above, the brightness of each mark 52F, 52S is higher than the brightness of the surrounding area and the waste W1, so each mark 52F, 52S is easily distinguishable in the box image. The reference point BP is a position that serves as a reference when capturing a box image, is a position that is stored in advance in the memory 26, and may be changed by the user afterwards.

[0045] When a threshold amount of waste W1 is contained in the waste box 40 and the waste W1 reaches a height H1, the waste W1 may, for example, be positioned above the first mark 52F and cover the first mark 52F. When the control device 22 receives image data of the box image from the mark camera 30, the control device 22 determines whether the brightness of an area surrounded by a circle with a radius R1 centered at a first center coordinate (X1, Y1) in the box image represented by the received image data is higher than that of its surrounding area. Similarly, the control device 22 determines whether the brightness of an area surrounded by a circle with a radius R1 centered at a second center coordinate (X2, Y2) is higher than that of its surrounding area. That is, the control device 22 determines whether the top surfaces of the first mark 52F and the second mark 52S are exposed in the box image. When the brightness of each area indicated by the mark shape information MI is high, the control device 22 determines that the top surfaces of the first mark 52F and the second mark 52S are exposed in the box image, and therefore determines that the waste W1 is not contained up to the height H1. On the other hand, for example, as shown in the enlarged view C of FIG. 3, when waste W1 reaches the first mark 52F, the brightness of the portion covered by the waste W1 decreases. As a result, the area surrounded by a circle of radius R1 centered at the first center coordinates (X1, Y1) indicated by the mark shape information MI stored in memory 26 differs from the shape of the first mark 52F in the box image. In this case, the control device 22 determines that the waste W1 is contained at least up to the bottom end P1 of the first mark 52F. In this way, the mounter 10 of this embodiment can relatively easily determine whether the amount of waste W1 exceeds the threshold amount based on the shapes of each mark 52F, 52S.

[0046] 3, the first upper surface 54F forms a slope that slopes downward from the inner wall 44 toward the inside of the waste box 40 (i.e., the left side of the enlarged view B). Therefore, even if waste W1 falls directly above the first mark 52F, the waste W1 does not remain on the first mark 52F, as indicated by the arrow F1, but falls from the first mark 52F along the first upper surface 54F. Therefore, the waste W1 that falls directly above the first mark 52F does not remain on the first mark 52F, thereby preventing the first mark 52F from being covered. This prevents the control device 22 from determining that the waste W1 is contained up to the height H1 when the amount of waste W1 actually contained in the waste box 40 is less than the height H1.

[0047] Furthermore, as shown in the plan view of FIG. 3 , the marks 52F and 52S are arranged at opposing corners. This allows for a reduced number of marks compared to, for example, a configuration in which marks are arranged at all four corners, thereby enabling the amount of waste W1 to be determined with relatively simple image processing. Furthermore, for example, in a configuration in which the marks 52F and 52S are arranged at two adjacent corners, marks are not arranged at the two opposite corners. In this case, even if the waste W1 is piled up above the height H1 around the two corners where no marks are arranged, the waste W1 may not cover the marks. In this case, the control device 22 cannot determine that the waste W1 is stored above the height H1 based on the box image. In this embodiment, the marks 52F and 52S are arranged at diagonally opposite corners. Because the distance between the marks 52F and 52S can be increased, it is possible to more reliably determine that the waste W1 is stored above the height H1 compared to a configuration in which the marks 52F and 52S are arranged at two adjacent corners. Furthermore, even if there are multiple marks 52 (detection points) in the disposal box 40, they can be photographed with one mark camera 30, so there is no need to provide a sensor for each detection point, and the hardware configuration of the device does not become complicated.

[0048] Next, with reference to FIG. 4, the waste amount determination process executed by the CPU 24 of the control device 22 will be described. The waste amount determination process is a process for determining whether the amount of waste W1 in the waste box 40 exceeds a predetermined amount. In this embodiment, the CPU 24 executes the process of FIG. 4 in response to the completion of mounting of components 4 included in a job received from a higher-level management device (not shown). When mounting of components 4 is completed, the components 4 are not picked up by the nozzle 6 until mounting of the components 4 on the next board 2 begins, and no waste W1 is generated. Therefore, the amount of waste W1 in the waste box 40 at that time is at its maximum. By executing the waste amount determination process when mounting of components 4 is completed, for example, it is possible to prevent unnecessary waste amount determination processes from being executed, and the waste determination process can be executed efficiently.

[0049] In S2, the CPU 24 uses the mounting head 16 to move the mark camera 30 to above the waste box 40.

[0050] Next, in S4, the CPU 24 transmits an image capture instruction to the mark camera 30. In response to this, the mark camera 30 captures a box image.

[0051] In S10, the CPU 24 receives image data of the box image captured in S4 from the mark camera 30, thereby acquiring the box image.

[0052] In S20, the CPU 24 compares the shapes of the marks 52F and 52S in the box image acquired in S10 with the shapes indicated by the mark shape information MI stored in the memory 26, as described above. If both the marks 52F and 52S match (YES in S20), the CPU 24 determines that the waste W1 in the disposal box 40 has not yet reached height H1, and ends the processing of FIG. 4. If either the marks 52F or 52S do not match (NO in S20), the CPU 24 determines that the waste W1 in the disposal box 40 may have reached height H1, and proceeds to S30. Note that in a modified example, the CPU 24 may determine YES in S20 if either the marks 52F and 52S match, and may determine NO in S20 if neither the marks 52F and 52S match.

[0053] In S30, the CPU 24 displays a collection screen SC1 on the touch screen 11. As shown in FIG. 4, the collection screen SC1 includes a message urging the user to collect the waste in the waste box 40. This notifies the user that the waste box 40 contains waste W1 that exceeds the height H1. This allows the user to collect the waste W1 in the waste box 40 before the waste W1 is stored in the waste box 40 to the point where it protrudes beyond the top surface 42 of the waste box 40.

[0054] (Effects of this embodiment) In this way, the mounter 10 of this embodiment determines whether waste W1 is contained in the waste box 40 at a height greater than H1 based on the box image, which is an image at height H1 inside the waste box 40. Therefore, compared to the prior art in which a sensor detects the presence of waste W1 in the upper region of the waste box 40, it is possible to more reliably determine whether the amount of waste W1 in the waste box 40 exceeds a predetermined amount.

[0055] (Correspondence) The height H1 is an example of a "predetermined height." The mark camera 30 is an example of a "camera." The display of the collection screen SC1 in FIG. 4 is an example of a "predetermined process."

[0056] The process of S20 is an example of a process executed by a "determining unit." The process of S30 is an example of a process executed by an "executing unit."

[0057] Points to note about this embodiment are described below. The shape of each mark 52F, 52S is not limited to a circle. For example, each mark 52F, 52S may be a rectangle or a triangle. In this case, the mark shape information MI may include, for example, the coordinates of each vertex.

[0058] The waste box 40 of the component mounter 10 may not include the first mark support part 50F and the second mark support part 50S. In that case, for example, if the overall brightness of the box image at height H1 is lower than a predetermined brightness in S20 of Fig. 4, the CPU 24 may determine NO in S20 and execute the process of S30. In a further modification, the first mark support part 50F may be disposed in the center of the waste box 40, for example.

[0059] The disposal box 40 may include only the first mark support portion 50F. In another modification, a mark support portion may be disposed at each of the four corners of the disposal box 40. Even if the number of marks increases, there is only one mark camera 30, so there is no need to change the hardware configuration. In yet another modification, the disposal box 40 does not have to have a rectangular shape, and may have, for example, a cylindrical shape.

[0060] Each of the upper surfaces 54F, 54S does not have to form a slope that displaces downward toward the inside. For example, each of the upper surfaces 54F, 54S may extend horizontally.

[0061] The mark camera 30 does not have to be fixed to the mounting head 16. In that case, the mark camera 30 may be configured to be movable independently of the mounting head 16.

[0062] The component mounter 10 may be equipped with a dedicated camera located above the disposal box 40.

[0063] The height H1 may be different from the height of the surface 3 of the supported substrate 2. In that case, for example, the control device 22 may capture an image of the surface 3 of the substrate 2 after the components 4 are mounted, and then change the depth of field of the mark camera 30 to cause the mark camera 30 to capture a box image.

[0064] The CPU 24 of the control device 22 does not have to execute the process of Fig. 4 after the mounting of the components 4 is completed. For example, the process of Fig. 4 may be executed before starting a new mounting process, or may be executed at predetermined intervals.

[0065] 4, the CPU 24 of the control device 22 may sound an alarm instead of displaying the collection screen SC1 on the touch screen 11. In this modification, sounding an alarm is an example of a "predetermined process." In a further modification, the CPU 24 may, for example, stop mounting the components 4 until collection of the waste W1 in the waste box 40 is confirmed. In this case, the CPU 24 may again determine the amount of waste W1 in the waste box 40 based on the box image in response to receiving a collection completion notification from the user indicating that the user has collected the waste W1 in the waste box 40. In this modification, stopping mounting the components 4 is an example of a "predetermined process."

[0066] Although specific examples of the technology disclosed in this specification have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Furthermore, the technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings simultaneously achieves multiple objectives, and achieving one of those objectives itself has technical utility.

[0067] This specification also discloses the technical idea of ​​changing "the component mounter according to claim 2" to "the component mounter according to claim 2 or 3" in claim 4. Similarly, the technical idea of ​​changing "the component mounter according to claim 1" to "the component mounter according to any one of claims 1 to 4" in claim 5, the technical idea of ​​changing "the component mounter according to claim 1" to "the component mounter according to any one of claims 1 to 7" in claim 8, and the technical idea of ​​changing "the component mounter according to claim 1" to "the component mounter according to any one of claims 1 to 8" in claim 9 are also disclosed. is also disclosed. [Explanation of symbols]

[0068] 2: Circuit board 2M: PCB mark 3: Surface 4: Parts 6: Nozzle 10: Component mounting machine 11: Touchscreen 12: Parts feeder unit 14: Feeder holder 15: Head unit 16: Mounting head 18: Head moving device 18a: Mobile base 20: PCB conveyor 21: Downward camera 22: Control device 24: CPU 26: Memory 30: Mark Camera 32: Lens 40: Disposal box 42:Top surface 44:Inner wall 50F: First mark support part 50S: Second mark support part 52F: First mark 52S: Second mark 54F: 1st top surface 54S: 2nd top surface 56F: First body 56S: 2nd body H1: Height H2: Height MC1: 1st center point MC2: 2nd center point R1: Radius SC1: Recovery screen W1: Waste

Claims

1. A component mounter that mounts components on a board, a waste box that is open at the top and that collects waste generated by the component mounter; a camera capable of capturing a box image, which is an image at a predetermined height within the disposal box, from above the disposal box; a control device; The control device a determination unit that determines whether the amount of the waste stored in the waste box exceeds a predetermined amount based on the box image captured by the camera; an execution unit that executes a predetermined process to prevent the waste in the waste box from affecting the mounting of the components when the determination unit determines that the amount of the waste in the waste box exceeds the predetermined amount; Equipped with Component mounting machine.

2. The predetermined height is lower than the height of the upper surface of the waste box, the disposal box includes a mark disposed at the predetermined height within the disposal box, the mark facing the camera and having a brightness different from that of the component; the control device further includes a memory that stores the shape of the mark; the determination unit determines that the amount of waste exceeds the predetermined amount when the shape of the mark in the box image captured by the camera differs from the shape in the memory. The component mounter according to claim 1 .

3. The waste box has a rectangular shape in a plan view, The mounter according to claim 2 , wherein the marks are arranged on two mutually opposing corners of the four corners of the disposal box.

4. 3. The mounter according to claim 2, wherein the mark is disposed on a slope that is inclined downward from the inner wall of the disposal box toward the inside.

5. The component mounter further comprises: a nozzle for suctioning the component; a mounting head that holds the nozzle and is movable along the substrate; Equipped with The camera is fixed to the mounting head. The component mounter according to claim 1 .

6. 6. The component mounter according to claim 5, wherein the camera is further configured to be capable of capturing at least one of an image of the component mounted on the board and an image of a board mark located on the board.

7. 7. The component mounter according to claim 6, wherein the predetermined height is the same height as the board after the components are mounted.

8. The component mounter according to claim 1 , wherein the determination unit determines whether or not the amount of the waste exceeds the predetermined amount after mounting of the components on the board is completed.

9. 2. The mounter according to claim 1, wherein the predetermined process includes a process of notifying that the amount of waste in the waste box has exceeded the predetermined amount.

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