Temperature sensor
The temperature sensor uses a leaf spring member with a locking portion and protrusion to securely attach to a socket without deforming it, addressing detachment issues and enhancing thermal conductivity and thinness.
Patent Information
- Application Number
- JP2024048248
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-25
- Publication Date
- 2025-10-07
AI Technical Summary
Conventional temperature sensors require an elastic socket to fit a retaining piece, which restricts material and structure choices and risks detachment due to deformation.
A temperature sensor with a leaf spring member featuring an upper plate portion with a locking portion that fits into a through-hole, using a biasing force to secure the sensor in place without deforming the socket, and a protrusion for easy insertion and removal.
The sensor can be easily inserted and securely retained in the socket without elastic deformation, preventing detachment and allowing for reliable attachment and removal, with improved thermal conductivity and reduced thickness.
Smart Images

Figure 2025147816000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a temperature sensor that can be easily attached to an object to be measured. [Background technology]
[0002] 2. Description of the Related Art Conventionally, when a temperature sensor is attached to a measurement object such as a module component, the temperature sensor is attached by inserting the temperature sensor into a socket portion provided in the measurement object. For example, Patent Document 1 describes a temperature sensor that is inserted into a socket of a module component. This temperature sensor has a retaining piece that fits into a hole in the socket, and an arm that elastically deforms to press the temperature sensor against the socket. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-173927 Summary of the Invention [Problem to be solved by the invention]
[0004] The above conventional techniques still have the following problems. That is, with the temperature sensor of Patent Document 1, in order to fit the fixed, protruding retaining piece into the hole, the part that becomes the socket of the module component also needs to be elastic and deform, which has the disadvantage of imposing restrictions on the material and structure of the socket side.In addition, because the socket side is also elastic and deforms, there is a risk that if the inserted temperature sensor is pulled against the elasticity, the socket will deform and the retaining piece will come off the hole, causing the temperature sensor to come out.
[0005] The present invention has been made in view of the above-mentioned problems, and has an object to provide a temperature sensor that can be inserted into an object to be measured and can be reliably prevented from coming out. [Means for solving the problem]
[0006] In order to solve the above problems, the present invention employs the following configuration: That is, a temperature sensor according to a first invention is a temperature sensor to be inserted into a sensor hole of a socket provided in an object to be measured, comprising: a strip-shaped insulating substrate; a heat-sensitive element provided on one end of the insulating substrate; a pair of pattern wirings formed on the insulating substrate and connected at one end to the heat-sensitive element; and a leaf spring member attached to the one end of the insulating substrate, wherein the leaf spring member comprises: a bottom plate portion having one end of the insulating substrate fixed to an upper surface thereof; and an upper plate portion connected to one end of the bottom plate portion, extending gradually away from the bottom plate portion toward the other end of the bottom plate portion and exerting a biasing force in a direction away from the bottom plate portion; the socket portion has a through hole penetrating from within the sensor hole to its upper surface; and the upper plate portion has a locking portion protruding upward and fitting into the through hole when inserted into the sensor hole.
[0007] In this temperature sensor, the upper plate portion protrudes upward and has a locking portion that fits into the through hole when inserted into the sensor hole.When the leaf spring member is inserted into the sensor hole in the socket portion and the locking portion is inserted up to the position of the through hole, the spring force of the upper plate portion causes the leaf spring member to expand into the sensor hole and the locking portion fits into the through hole. In other words, the retaining portion is constantly pressed into the through-hole by the biasing force of the leaf spring member, and the retaining portion is retained by the inner wall of the through-hole, so that the retaining portion functions as a stopper and prevents the temperature sensor from slipping out of the sensor hole in the socket. Therefore, even if the socket does not elastically deform, the temperature sensor can be easily inserted and fitted, and is reliably prevented from slipping out. Furthermore, when it is desired to remove the temperature sensor from the socket portion, the temperature sensor can be easily removed by pushing the locking portion in the through hole downward against the spring force to the sensor hole and pulling out the leaf spring member from the sensor hole. Furthermore, since the top plate portion extends from one end to the other end while gradually moving away from the bottom plate portion, it has a tapered shape and can be easily inserted into the sensor hole.
[0008] The temperature sensor of the second invention is characterized in that, in the first invention, the other end of the upper plate portion is provided with a protrusion that abuts against the surface of the socket portion where the sensor hole opens when inserted into the sensor hole and the locking portion fits into the through hole. In other words, this temperature sensor has a protrusion at the other end of the upper plate that abuts against the surface of the sensor hole in the socket when the temperature sensor is inserted into the sensor hole and the locking portion fits into the through hole. The abutment of the protrusion against the surface of the sensor hole prevents the leaf spring from being inserted further into the sensor hole and also positions the leaf spring. Furthermore, when removing the temperature sensor, the protrusion can be pushed down to push the locking portion down from the through hole to the sensor hole, and then the protrusion can be used as a handle to pull the leaf spring, making it easy to remove the leaf spring from the sensor hole.
[0009] A temperature sensor according to a third invention is the temperature sensor according to the first or second invention, characterized in that the insulating substrate is formed of an insulating film. That is, in this temperature sensor, the insulating substrate is formed of an insulating film, so that the heat capacity can be reduced, the thermal conductivity is improved, and the sensor can be made thinner. [Effects of the Invention]
[0010] According to the present invention, the following effects are achieved. In other words, according to the temperature sensor of the present invention, the upper plate portion protrudes upward and is provided with a locking portion that fits into the through hole when inserted into the sensor hole, so that the locking portion is always pressed into the through hole by the urging force and is locked onto the inner wall of the through hole, causing the locking portion to function as a stopper and preventing the temperature sensor from slipping out of the sensor hole in the socket portion. Therefore, the temperature sensor of the present invention can be easily inserted without the socket portion itself undergoing elastic deformation, and the locking portion is biased and firmly fitted regardless of whether the socket portion undergoes elastic deformation or not, thereby ensuring a reliable anti-detachment effect. [Brief explanation of the drawings]
[0011] [Figure 1] 1 is a perspective view showing a first embodiment of a temperature sensor according to the present invention. [Figure 2] FIG. 2 is a side view showing a temperature sensor in the first embodiment. [Figure 3] FIG. 2 is a perspective view showing one end side of an insulating substrate on which a heat-sensitive element is provided in the first embodiment. [Figure 4] FIG. 2 is a perspective view showing the temperature sensor (a) before and (b) after insertion into a socket portion in the first embodiment. [Figure 5] 10A is a perspective view showing a state in which a cable is connected to an insulating substrate, (b) the state in which the connection part of the cable is protected by a shrinkable tube and pressed with a metal plate, and (c) the entire temperature sensor in a second embodiment of the temperature sensor according to the present invention. DETAILED DESCRIPTION OF THE INVENTION
[0012] A first embodiment of a temperature sensor according to the present invention will be described below with reference to FIGS.
[0013] As shown in Figures 1 to 4, the temperature sensor 1 of this embodiment is a temperature sensor 1 that is inserted into a sensor hole 2a of a socket portion 2 provided in an object to be measured, and includes a strip-shaped insulating substrate 3, a heat-sensitive element 4 provided on one end side of the insulating substrate 3, a pair of pattern wirings 5 formed on the insulating substrate 3 and one end of which is connected to the heat-sensitive element 4, and a leaf spring member 6 attached to one end side of the insulating substrate 3.
[0014] The plate spring member 6 includes a bottom plate portion 6a having one end side of the insulating substrate 3 fixed to its upper surface, and an upper plate portion 6b connected to one end of the bottom plate portion 6a, extending gradually away from the bottom plate portion 6a toward the other end side of the bottom plate portion 6a, and exerting a biasing force in a direction away from the bottom plate portion 6a. The bottom plate portion 6a extends in a strip shape along the insulating substrate 3. As shown in FIG. 4, the socket portion 2 has a through-hole 2b that penetrates from the sensor hole 2a to the upper surface.
[0015] The upper plate portion 6b has a locking portion 6c that protrudes upward and fits into the through-hole 2b when inserted into the sensor hole 2a. In this embodiment, a pair of locking portions 6c are provided on both sides of the upper plate portion 6b so as to protrude upward. The locking portion 6c has a triangular shape in a side view, with the height gradually increasing from one end to the other end.
[0016] The other end of the upper plate portion 6b is provided with a protrusion 6d that abuts against the surface where the sensor hole 2a of the socket portion 2 is open when the upper plate portion 6b is inserted into the sensor hole 2a and the locking portion 6c fits into the through hole 2b, as shown in (b) of Figure 4. In this embodiment, protrusions 6d are provided on both other ends of the bottom plate portion 6a. That is, the other end of the top plate portion 6b is provided with a protruding portion 6d bent upward at a right angle, and the other end of the bottom plate portion 6a is provided with a protruding portion 6d bent downward at a right angle.
[0017] The upper plate portion 6b has an upper plate step portion 6e in the middle that is slightly lower than one end side, and an engaging portion 6c is formed on the other end side of the upper plate step portion 6e. The bottom plate portion 6a and the upper plate portion 6b are connected at one end in a U-shape when viewed from the side, and the entire leaf spring member 6 has a tapered shape when viewed from the side. The plate spring member 6 is formed by processing a metal plate such as a copper alloy.
[0018] The insulating substrate 3 is formed of an insulating film such as a polyimide resin sheet, etc. The insulating substrate 3 extends long and protrudes from the bottom plate portion 6a to the other end side. The pattern wiring 5 is formed on the insulating substrate 3 using a pattern of copper foil or the like, and extends from the thermal element 4 to the other end. That is, the insulating substrate 3 on which the pattern wiring 5 is formed is a so-called FPC. A reinforcing plate 9 made of a metal plate, a resin plate or the like is adhered to the rear surface of the other end of the insulating substrate 3 for fitting with an external connector.
[0019] The insulating substrate 3 is adhered onto the upper plate portion 6b with an epoxy adhesive, double-sided tape, a TIM (Thermal Interface Material), or the like. As shown in FIG. 3, the heat-sensitive element 4 is, for example, a chip thermistor, and is sealed in a dome shape with sealing resin 4a made of epoxy resin or the like. The heat-sensitive element 4 may be a flake thermistor, a thin film thermistor, or the like.
[0020] In this way, in the temperature sensor 1 of this embodiment, the upper plate portion 6b protrudes upward and has a locking portion 6c that fits into the through hole 2b when inserted into the sensor hole 2a.Therefore, when the leaf spring member 6 is inserted into the sensor hole 2a of the socket portion 2 and the locking portion 6c is inserted up to the position of the through hole 2b, the spring force of the upper plate portion 6b causes the leaf spring member 6 to expand into the sensor hole 2a, and the locking portion 6c fits into the through hole 2b.
[0021] That is, the locking portion 6c is constantly pressed into the through hole 2b by the biasing force of the leaf spring member 6, and the locking portion 6c is locked to the inner wall of the through hole 2b, so that the locking portion 6c functions as a stopper and prevents the temperature sensor 1 from coming out of the sensor hole 2a of the socket portion 2. Therefore, even if the socket portion 2 does not elastically deform, the temperature sensor 1 can be easily inserted and fitted, and can be reliably prevented from coming out.
[0022] Furthermore, when it is desired to remove the temperature sensor 1 from the socket portion 2, the temperature sensor 1 can be easily removed by pushing the locking portion 6c in the through hole 2b downward to the sensor hole 2a against the spring force and pulling out the leaf spring member 6 from the sensor hole 2a. The upper plate portion 6b extends from one end to the other end, gradually moving away from the bottom plate portion 6a, and therefore has a tapered shape, making it easy to insert into the sensor hole 2a.
[0023] In addition, the other end of the upper plate portion 6b is provided with a protrusion 6d that abuts against the opening surface of the sensor hole 2a of the socket portion 2 when it is inserted into the sensor hole 2a and the locking portion 6c fits into the through hole 2b.By abutting the protrusion 6d against the opening surface of the sensor hole 2a, the leaf spring member 6 is prevented from being inserted further into the sensor hole 2a and can be positioned.
[0024] Furthermore, when removing the temperature sensor 1, the protrusion 6d is pressed down to push the locking portion 6c down from the through hole 2b to the sensor hole 2a, and the protrusion 6d can then be pulled as a handle, making it easy to remove the leaf spring member 6 from the sensor hole 2a. Furthermore, since the insulating substrate 3 is made of an insulating film, the heat capacity can be reduced, the thermal conductivity is improved, and the thickness can be reduced.
[0025] Next, a second embodiment of a temperature sensor according to the present invention will be described below with reference to Fig. 5. In the following description of each embodiment, the same components as those described in the above embodiment will be denoted by the same reference numerals, and the description thereof will be omitted.
[0026] The difference between the second embodiment and the first embodiment is that in the first embodiment, the insulating substrate 3 extends a long distance from the bottom plate portion 6a to the outside, and a reinforcing plate 9 for fitting with an external connector is adhered to the other end of the insulating substrate 3, whereas in the temperature sensor 21 of the second embodiment, as shown in FIG. 5, the insulating substrate 23 does not protrude from the other end of the bottom plate portion 26a of the leaf spring member 26, and a pair of cables 29, which are lead wires, are connected to the other end of the insulating substrate 23.
[0027] One end of the pair of cables 29 is connected to the other end of the pattern wiring 5 with solder H. The connection portion of the pair of cables 29 is covered and protected together with the insulating substrate 23 and the other end of the bottom plate portion 26a by a shrinkable tube 29a. Furthermore, the bottom plate portion 26a of the second embodiment extends longer than that of the first embodiment in order to allow for connection of the cable 29. In the second embodiment, the protrusion 6d is not formed on the other end of the bottom plate portion 26a.
[0028] Furthermore, a pair of sheet metal portions 26f are formed at the other end of the bottom plate portion 26. The sheet metal portions 26f are bent so as to surround the shrink tube 29a from both sides and press the shrink tube 29a. The other end of insulating substrate 23 is elevated by the thickness of shrinkable tube 29a, so that an inclined step 23a is formed midway.
[0029] The technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. [Explanation of symbols]
[0030] 1, 21... temperature sensor, 2... socket portion, 2a... sensor hole, 2b... through hole, 3, 23... insulating substrate, 4... heat-sensitive element, 5... pattern wiring, 6, 26... leaf spring member, 6a, 26a... bottom plate portion, 6b... upper plate portion, 6c... engaging portion, 6d... protruding portion
Claims
1. A temperature sensor that is inserted into a sensor hole of a socket portion provided in an object to be measured, a strip-shaped insulating substrate; a heat-sensitive element provided on one end side of the insulating substrate; a pair of pattern wirings formed on the insulating substrate and one end of which is connected to the thermal element; a leaf spring member attached to one end side of the insulating substrate, the plate spring member includes a bottom plate portion having one end of the insulating substrate fixed to an upper surface thereof; an upper plate portion connected to one end of the bottom plate portion, extending gradually away from the bottom plate portion toward the other end side of the bottom plate portion, and exerting a biasing force in a direction away from the bottom plate portion; the socket portion has a through hole that penetrates from the sensor hole to the upper surface, A temperature sensor characterized in that the upper plate portion has a locking portion that protrudes upward and fits into the through hole when inserted into the sensor hole.
2. 2. The temperature sensor according to claim 1, A temperature sensor characterized in that the other end of the upper plate portion is provided with a protrusion that abuts against the surface of the socket portion where the sensor hole opens when inserted into the sensor hole and the engaging portion fits into the through hole.
3. 3. The temperature sensor according to claim 1, A temperature sensor characterized in that the insulating substrate is formed of an insulating film.
Citation Information
Patent Citations
Temperature sensor and assembly structure of temperature sensor
JP2014173927A