Honeycomb structure

The honeycomb structure design addresses non-heat-generating areas by using slits and conductive connectors to direct current flow through detours, enhancing heat distribution across connected sections.

JP2025150929APending Publication Date: 2025-10-09NGK INSULATORS LTD
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Patent Information

Application Number
JP2024052093
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-03-27
Publication Date
2025-10-09

AI Technical Summary

Technical Problem

When connecting multiple honeycomb structure parts to form a larger honeycomb heater, there are areas where no current flows and no heat is generated, leading to undesirable non-heat-generating regions.

Method used

A honeycomb structure design that includes first and second honeycomb structure sections with outer peripheral walls, partition walls, and slits defining current paths, arranged such that slits in perpendicular directions form detours with conductive connectors connecting the outer peripheral walls, reducing non-heat-generating areas by ensuring current flow through detours.

Benefits of technology

The design minimizes non-heat-generating regions by directing current flow through detours, ensuring more uniform heat generation across the connected honeycomb structure.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a honeycomb structure capable of reducing an area generating no heat when connecting and using a plurality of honeycomb structural parts.SOLUTION: A honeycomb structure 1 comprises: a first honeycomb structural part 11 and a second honeycomb structural part 12 each having slits 103, and a conductive connection body 13 for partially connecting outer peripheral walls 100 facing each other of the first honeycomb structural part 11 and the second honeycomb structural part 12. The plurality of slits 103 include first slits 1031 and second slits 1032. In the first honeycomb structural part 11 and the second honeycomb structural part 12, the nearest slits 103 related to a horizontal direction HD of the outer peripheral walls 100 facing each other are arranged so as to be the same as those of the first slits 1031 and the second slits 1032. The conductive connection body 13 partially connects the outer peripheral walls 100 of the first honeycomb structural part 11 and the second honeycomb structural part 12 in a vertical direction VD at the same base end sides.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] The present invention relates to a honeycomb structure. [Background technology]

[0002] The following Patent Document 1 describes "a honeycomb heater having a heater body formed mainly from conductive ceramics and heater through-holes provided in the heater body, characterized in that the heater body is provided with cut grooves that change the effective length and effective width of the heater body to change the resistance value." [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 7-085952 Summary of the Invention [Problem to be solved by the invention]

[0004] When preparing multiple honeycomb structure parts (heater bodies) as described in Patent Document 1 and connecting their outer walls to form a larger honeycomb structure (honeycomb heater), if the outer walls are directly connected to each other, there may be areas where no current flows and no heat is generated, as shown in Figure 7, which is not desirable.

[0005] The present invention has been made to solve the above-mentioned problems, and one of its objects is to provide a honeycomb structure that can reduce the non-heat-generating area when multiple honeycomb structure parts are connected and used. [Means for solving the problem]

[0006] Item 1. In one embodiment, the present invention provides a first honeycomb structure section and a second honeycomb structure section, each having an outer peripheral wall, partition walls disposed inside the outer peripheral wall and defining a plurality of cells that form flow paths extending from one end face to the other end face, and a plurality of slits disposed at a distance from each other and configured to define current paths between the outer edge of the outer peripheral wall and between each other, the first honeycomb structure section and the second honeycomb structure section being arranged so that the outer peripheral walls face each other, and a conductive connector that partially connects the facing outer peripheral walls of the first honeycomb structure section and the second honeycomb structure section, wherein when directions perpendicular to each other on the faces of the first honeycomb structure section and the second honeycomb structure section that are perpendicular to the extending direction of the cells are defined as vertical and horizontal directions, the plurality of slits are arranged in a direction perpendicular to the vertical direction. The present invention relates to a honeycomb structure including a first slit having one end as a base end and the other end as a tip end, and a second slit having the other end in the vertical direction as a base end and the one end as a tip end, wherein the current path is a detour in which current flows vertically along the first slit and the second slit and then turns back at the tips of the first slit and the second slit before proceeding horizontally, the first honeycomb structure portion and the second honeycomb structure portion are arranged such that the nearest slit in the horizontal direction of the facing outer walls is the same one of the first slit and the second slit, and the conductive connector partially connects the outer walls of the first honeycomb structure portion and the second honeycomb structure portion in the vertical direction at the base end side of the same one.

[0007] Item 2. The present invention may relate to the honeycomb structure according to Item 1, wherein the plurality of slits further include a third slit extending in the horizontal direction, the detour path of the first honeycomb structure portion includes a first detour path and a second detour path separated by the third slit, the detour path of the second honeycomb structure portion includes a third detour path and a fourth detour path separated by the third slit and a turning path connecting the third detour path and the fourth detour path, and the conductive connector includes a first connector connecting the first detour path of the first honeycomb structure portion and the third detour path of the second honeycomb structure portion, and a second connector connecting the fourth detour path of the second honeycomb structure portion and the second detour path of the first honeycomb structure portion.

[0008] Item 3. The present invention may relate to the honeycomb structure according to Item 1 or 2, wherein the mutually facing outer peripheral walls of the first honeycomb structure part and the second honeycomb structure part include a first part that contacts a side surface of the conductive connector in the horizontal direction and a second part that extends in the vertical direction from the first part, and further includes an insulator that joins the second parts of the first honeycomb structure part and the second honeycomb structure part.

[0009] Item 4. The present invention may relate to the honeycomb structure according to any one of Items 1 to 3, wherein the mutually facing outer peripheral walls of the first honeycomb structure part and the second honeycomb structure part include a first part that contacts a side surface of the conductive connector in the horizontal direction and a second part that extends in the vertical direction from the first part, and further includes a second part connector that connects the second parts of the first honeycomb structure part and the second honeycomb structure part via an insulating coating.

[0010] Item 5. The present invention may relate to the honeycomb structure according to any one of Items 1 to 4, wherein the first honeycomb structure part and the second honeycomb structure part are mainly composed of conductive ceramics. [Effects of the Invention]

[0011] According to one embodiment of the honeycomb structure of the present invention, the first honeycomb structure portion and the second honeycomb structure portion are arranged so that the nearest slits in the horizontal direction of the outer walls facing each other are the same one of the first slit and the second slit, and the conductive connector partially connects the outer walls of the first honeycomb structure portion and the second honeycomb structure portion in the vertical direction at the base end side of the same one, so that when multiple honeycomb structure portions are connected and used, the area that does not generate heat can be made smaller. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing a honeycomb structure according to a first embodiment of the present invention. [Figure 2] 2 is a front view showing the faces of the first honeycomb structure section and the second honeycomb structure section perpendicular to the extending direction of the cells in FIG. 1. FIG. [Figure 3]FIG. 3 is an explanatory view showing an example of a method for connecting the first honeycomb structure section and the second honeycomb structure section shown in FIG. 2. [Figure 4] FIG. 10 is a front view showing a honeycomb structure according to a second embodiment of the present invention. [Figure 5] FIG. 10 is a front view showing a honeycomb structure according to a third embodiment of the present invention. [Figure 6] FIG. 10 is a front view showing a honeycomb structure according to a fourth embodiment of the present invention. [Figure 7] FIG. 10 is an explanatory diagram showing a non-heat generating region that occurs in the prior art. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to each embodiment, and the components can be modified and embodied without departing from the spirit of the present invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in each embodiment. For example, some components may be omitted from all the components shown in the embodiments. Furthermore, components of different embodiments may be appropriately combined.

[0014] Embodiment 1 1 is a perspective view showing a honeycomb structure 1 according to a first embodiment of the present invention. As shown in FIG. 1, the honeycomb structure 1 has a first honeycomb structure portion 11, a second honeycomb structure portion 12, and a conductive connector 13.

[0015] The first honeycomb structure portion 11 and the second honeycomb structure portion 12 each have an outer peripheral wall 100, partition walls 101 arranged inside the outer peripheral wall 100 to define a plurality of cells 102 that form flow paths extending from one end face to the other end face, and a plurality of slits 103 arranged at a distance from each other and configured to define electrical paths between the outer edge of the outer peripheral wall 100 and between each other.

[0016] The first honeycomb structure section 11 and the second honeycomb structure section 12 may be columnar members. A columnar shape can be understood as a three-dimensional shape having a thickness in the extension direction of the cells 102 (the axial direction of the first honeycomb structure section 11 and the second honeycomb structure section 12). The ratio (aspect ratio) of the axial length of the first honeycomb structure section 11 and the second honeycomb structure section 12 to the width or diameter of the end face of the first honeycomb structure section 11 and the second honeycomb structure section 12 is arbitrary. The columnar shape may include a shape (flat shape) in which the axial length of the first honeycomb structure section 11 and the second honeycomb structure section 12 is shorter than the width or diameter of the end face.

[0017] The outer shapes of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 are not particularly limited as long as they are columnar, and may be other shapes such as a columnar shape with circular end faces (cylindrical shape), a columnar shape with oval end faces, or a columnar shape with polygonal end faces (quadrilateral, pentagonal, hexagonal, heptagonal, octagonal, etc.). The outer shapes of the illustrated first honeycomb structure portion 11 and the second honeycomb structure portion 12 are quadrilateral (rectangular). The size of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 is set to be quadrilateral (rectangular) in order to increase heat resistance (to suppress cracks extending in the circumferential direction of the outer peripheral wall 100). 2 It is preferable that the thickness is 5000 to 25000 mm 2 It is more preferable that the end faces of the pillar-shaped honeycomb structures are polygonal. A plurality of pillar-shaped honeycomb structures each having a polygonal end face can be joined together and used.

[0018] There are no restrictions on the shape of the cells 102 in the plane perpendicular to the extension direction of the cells 102 (the end face or cross section of the first honeycomb structure part 11 and the second honeycomb structure part 12), but a square, hexagon, octagon, or a combination of these is preferred. Of these, a square and a hexagon are preferred. By using such a cell shape, the pressure loss when a fluid such as exhaust gas flows through the first honeycomb structure part 11 and the second honeycomb structure part 12 is reduced, and the purification performance of the catalyst is improved.

[0019] The thickness of the partition walls 101 that define the cells 102 is preferably 0.1 to 0.8 mm, and more preferably 0.1 to 0.6 mm. When the thickness of the partition walls 101 is 0.1 mm or more, it is possible to prevent a decrease in the strength of the first honeycomb structure portion 11 and the second honeycomb structure portion 12. When the thickness of the partition walls 101 is 0.8 mm or less, it is possible to prevent an increase in pressure loss when exhaust gas flows through the first honeycomb structure portion 11 and the second honeycomb structure portion 12 when the first honeycomb structure portion 11 and the second honeycomb structure portion 12 are used as catalyst carriers to support a catalyst. In the present invention, the thickness of the partition walls 101 is defined as the length of a portion of a line segment that connects the centers of gravity of adjacent cells 102 and that passes through the partition walls 101 in a plane perpendicular to the extension direction of the cells 102.

[0020] The first honeycomb structure portion 11 and the second honeycomb structure portion 12 have a cell density of 4 to 150 cells / cm in a plane perpendicular to the extending direction of the cells 102. 2 It is preferable that the number of cells is 7 to 100. 2 By setting the cell density in this range, it is possible to increase the purification performance of the catalyst while minimizing the pressure loss when exhaust gas flows through it. 2 If the cell density is 150 cells / cm or more, a sufficient catalyst carrying area is ensured. 2 If the cell density is less than this value, when the first honeycomb structure portion 11 and the second honeycomb structure portion 12 are used as catalyst carriers to support a catalyst, excessive pressure loss during the flow of exhaust gas is suppressed. The cell density is a value obtained by dividing the number of cells by the area of ​​one end face portion of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 excluding the outer peripheral wall 100 portion.

[0021] Providing the peripheral wall 100 on the first honeycomb structure portion 11 and the second honeycomb structure portion 12 is useful from the viewpoint of ensuring the structural strength of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 and suppressing leakage of the fluid flowing through the cells 102 from the peripheral wall 100. Specifically, the thickness of the peripheral wall 100 is preferably 0.05 mm or more, more preferably 0.10 mm or more, and even more preferably 0.15 mm or more. However, if the peripheral wall 100 is too thick, the strength becomes too high, which disrupts the strength balance with the partition walls 101 and reduces thermal shock resistance. Therefore, the thickness of the peripheral wall 100 is preferably 1.0 mm or less, more preferably 0.7 mm or less, and even more preferably 0.5 mm or less. Here, the thickness of the peripheral wall 100 is defined as the thickness in the direction normal to the tangent of the peripheral wall 100 at the measurement point when the portion of the peripheral wall 100 whose thickness is to be measured is observed on a plane perpendicular to the extension direction of the cells 102.

[0022] The first honeycomb structure portion 11 and the second honeycomb structure portion 12 are formed of a conductive material and are heated by passing an electric current through them. The first honeycomb structure portion 11 and the second honeycomb structure portion 12 may be mainly composed of conductive ceramics. When the first honeycomb structure portion 11 and the second honeycomb structure portion 12 are mainly composed of conductive ceramics, this means that the first honeycomb structure portion 11 and the second honeycomb structure portion 12 contain 90 mass % or more of conductive ceramics as a whole. Alternatively, the first honeycomb structure portion 11 and the second honeycomb structure portion 12 may be made of metal. There are no particular restrictions on the volume resistivity of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 as long as they can generate heat by Joule heat when electric current is passed through them, but a volume resistivity of 0.001 Ωcm or more and 200 Ωcm or less is preferable, and a volume resistivity of 1 Ωcm or more and 200 Ωcm or less is more preferable. In the present invention, the volume resistivity of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 is a value measured at 25° C. by the four-terminal method.

[0023] When the first honeycomb structure portion 11 and the second honeycomb structure portion 12 are mainly composed of conductive ceramics, the conductive ceramics can be selected from the group consisting of oxide ceramics such as alumina, mullite, zirconia, and cordierite, and non-oxide ceramics such as silicon carbide, silicon nitride, and aluminum nitride, but are not limited thereto. Silicon carbide-silicon composites and silicon carbide / graphite composites can also be used. Among these, from the viewpoint of achieving both heat resistance and conductivity, it is preferable that the material of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 contains a silicon-silicon carbide composite or a ceramics mainly composed of silicon carbide. When the conductive material of the first honeycomb structural member 11 and the second honeycomb structural member 12 is said to be mainly composed of silicon-silicon carbide composite material, it means that the first honeycomb structural member 11 and the second honeycomb structural member 12 contain 90 mass% or more of the silicon-silicon carbide composite material (total mass). Here, the silicon-silicon carbide composite material contains silicon carbide particles as aggregate and silicon as a binder that bonds the silicon carbide particles, and it is preferable that multiple silicon carbide particles are bonded by the silicon so as to form pores between the silicon carbide particles. When the conductive material of the first honeycomb structural member 11 and the second honeycomb structural member 12 is said to be mainly composed of silicon carbide, it means that the first honeycomb structural member 11 and the second honeycomb structural member 12 contain 90 mass% or more of the silicon carbide (total mass).

[0024] When the first honeycomb structure portion 11 and the second honeycomb structure portion 12 contain a silicon-silicon carbide composite material, the ratio of the "mass of silicon as a binder" contained in the first honeycomb structure portion 11 and the second honeycomb structure portion 12 to the sum of the "mass of silicon carbide particles as aggregate" contained in the first honeycomb structure portion 11 and the second honeycomb structure portion 12 and the "mass of silicon as a binder" contained in the first honeycomb structure portion 11 and the second honeycomb structure portion 12 is preferably 10 to 40 mass%, and more preferably 15 to 35 mass%.

[0025] The outer peripheral wall 100 and the partition walls 101 may be dense. When they are dense, the porosity of the outer peripheral wall 100 and the partition walls 101 may be 10% or less, or 5% or less. Furthermore, the outer peripheral wall 100 and the partition walls 101 may be porous, and when they are porous, the porosity of the outer peripheral wall 100 and the partition walls 101 is preferably 35 to 60%, and more preferably 35 to 45%. The porosity is a value measured with a mercury porosimeter.

[0026] The average pore diameter of the outer peripheral wall 100 and the partition walls 101 of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 is preferably 2 to 15 μm, and more preferably 4 to 8 μm. The average pore diameter is a value measured by a mercury porosimeter.

[0027] As described above, the multiple slits 103 are arranged spaced apart from one another and configured to define current paths between the slits 103 and the outer edge of the outer peripheral wall 100. The arrangement of the multiple slits 103 will be described in detail later.

[0028] The slits 103 may be formed by cutting out or removing the outer peripheral wall 100 and / or the partition walls 101. The slits 103 may extend in the extension direction of the cells 102 from one end face to the other end face of the first honeycomb structure section 11 and the second honeycomb structure section 12. The slits 103 may extend from the outer surfaces (outer surfaces of the outer peripheral wall 100) of the first honeycomb structure section 11 and the second honeycomb structure section 12 toward the inside in the width direction or radial direction of the first honeycomb structure section 11 and the second honeycomb structure section 12.

[0029] The slits 103 may be filled with a filler. The filler preferably fills at least a portion of the space of the slits 103. The filler preferably fills 50% or more of the space of the slits 103, and more preferably fills the entire space of the slits 103. When the main component of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 is silicon carbide or a silicon-silicon carbide composite, the filler preferably contains 20% or more by mass of silicon carbide, more preferably 20 to 70% by mass. This allows the thermal expansion coefficient of the filler to be close to the thermal expansion coefficients of the first honeycomb structure portion 11 and the second honeycomb structure portion 12, thereby improving the thermal shock resistance of the first honeycomb structure portion 11 and the second honeycomb structure portion 12. The filler may contain 30% or more by mass of silica, alumina, etc. The Young's modulus of the filler is preferably 500 kPa or more and 1500 MPa or less. By setting the Young's modulus within this range, stress can be efficiently buffered by the slits 103 during thermal shock, and the mechanical strength of the slits 103 can be maintained, preventing chipping and cracking during manufacture and use. It is more preferable that the Young's modulus of the filler be 10 MPa or more and 1000 MPa or less. This can ensure the above-mentioned effects.

[0030] The first honeycomb structure portion 11 and the second honeycomb structure portion 12 are arranged so that their outer peripheral walls 100 face each other. The conductive connector 13 partially connects the outer peripheral walls 100 of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 that face each other.

[0031] In this embodiment, the first honeycomb structure portion 11 and the second honeycomb structure portion 12 have a rectangular outer shape, and their opposing outer peripheral walls 100 extend parallel to each other and are spaced apart from each other. The conductive connector 13 is made of a rectangular member and is disposed between the opposing outer peripheral walls 100. However, the outer shapes of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 may be changed as desired, and the outer shape of the conductive connector 13 may be changed appropriately depending on the outer shapes of the first honeycomb structure portion 11 and the second honeycomb structure portion 12.

[0032] A pair of electrode terminals 14 for applying a voltage to the honeycomb structure 1 may be connected to the honeycomb structure 1. One electrode terminal 14 may be connected to the first honeycomb structure portion 11, and the other electrode terminal 14 may be connected to the second honeycomb structure portion 12 so that current flows through both the first honeycomb structure portion 11 and the second honeycomb structure portion 12. In some cases, it may be understood that the first honeycomb structure portion 11 is located upstream of the second honeycomb structure portion 12 in terms of the direction of current flow.

[0033] The electrode terminals 14 may have any shape, but may be columnar. The electrode terminals 14 may be provided so as to stand upright relative to the surface of the outer wall 100. When a voltage is applied to the honeycomb structure 1 through the electrode terminals 14, it is possible to cause the honeycomb structure 1 to generate heat by Joule heat. The applied voltage is preferably 12 to 900 V, more preferably 48 to 600 V, but the applied voltage can be changed as appropriate.

[0034] The electrode terminals 14 are made of ceramic or carbon. When the electrode terminals 14 are made of ceramic, they can be electrically connected to the honeycomb structure 1. A metal terminal may be joined to the tip of each of the electrode terminals 14. The ceramic or carbon electrode terminals 14 can be joined to the metal terminals by crimping, welding, a conductive adhesive, or the like. The metal terminals can be made of a conductive metal such as an iron alloy or a nickel alloy.

[0035] Ceramics constituting the electrode terminal 14 include, but are not limited to, silicon carbide (SiC), metal compounds such as metal silicides, such as tantalum silicide (TaSi2) and chromium silicide (CrSi2), and composites (cermets) containing one or more metals. Specific examples of cermets include composites of metal silicon and silicon carbide, composites of metal silicides, such as tantalum silicide or chromium silicide, and metal silicon and silicon carbide, and composites in which one or more of the above metals are added with one or more insulating ceramics, such as alumina, mullite, zirconia, cordierite, silicon nitride, and aluminum nitride, to reduce thermal expansion. The carbon constituting the electrode terminal 14 is preferably primarily composed of carbon. "To be primarily composed of carbon" means that the carbon content of the electrode terminal 14 is 50% by mass or more of the total components constituting the electrode terminal 14. The carbon content is more preferably 80% by mass or more, and even more preferably 90% by mass or more.

[0036] Although not shown, the honeycomb structure 1 may further include an electrode layer provided between the outer wall 100 and the electrode terminal 14. The electrode layer is formed of a conductive material. The electrode layer is preferably an oxide ceramic or a mixture of a metal or a metal compound and an oxide ceramic. The metal may be either a single metal or an alloy, and examples of suitable metals include silicon, aluminum, iron, stainless steel, titanium, tungsten, and Ni-Cr alloys. The metal compound may be a material other than an oxide ceramic, such as a metal oxide, a metal nitride, a metal carbide, a metal silicide, a metal boride, or a composite oxide, and examples of suitable metal compounds include FeSi2, CrSi2, alumina, silica, and titanium oxide. The metal and the metal compound may be used alone or in combination. Specific examples of the oxide ceramic include glass, cordierite, and mullite. The glass may further contain an oxide of at least one component selected from the group consisting of B, Mg, Al, Si, P, Ti, and Zr. It is more preferable that the electrode layer further contains at least one selected from the above group, since the strength of the electrode layer is further improved.

[0037] Although there are no particular restrictions on the region where the electrode layers are formed, from the viewpoint of improving the uniform heat generation of the honeycomb structure 1, it is preferable that each electrode layer extend in a strip shape on the outer surface of the outer peripheral wall 100 in the circumferential direction of the outer peripheral wall 100 and in the extending direction of the cells 102. Specifically, it is desirable that each electrode layer extend over 80% or more of the length between both end faces of the honeycomb structure 1, preferably over 90% or more of the length, and more preferably over the entire length, from the viewpoint of facilitating the spread of current in the axial direction of the electrode layer.

[0038] The thickness of each electrode layer is preferably 0.01 to 5 mm, and more preferably 0.01 to 3 mm. By setting the thickness within this range, uniform heat generation can be improved. When the thickness of each electrode layer is 0.01 mm or more, electrical resistance is appropriately controlled, allowing for more uniform heat generation. When the thickness is 5 mm or less, the risk of breakage is reduced. The thickness of each electrode layer is defined as the thickness in the direction normal to the tangent at the measurement point on the outer surface of each electrode layer when the portion of the electrode layer whose thickness is to be measured is observed on a plane perpendicular to the extension direction of the cell 102.

[0039] There is no particular restriction on the electrical resistivity of the electrode layer, but it is not particularly limited to 1×10 -7 ~5×10 -1 The electrical resistance of the electrode layer is preferably 5×10 Ω·m. -1 If the electrical resistance is Ω·m or less, the resistance during electrical heating can be reduced. The electrical resistance of the electrode layer is 5×10 -7 ~2.5×10 -1 Ω·m is more preferable, and 1×10 -6 ~1.25×10 -1 It is even more preferable that the electrical resistivity is Ω·m. In the present invention, the electrical resistivity of the electrode layer is a value measured at 400° C. by the four-terminal method.

[0040] A catalyst may be supported on the first honeycomb structure portion 11 and the second honeycomb structure portion 12. Various catalysts can be used, and examples of the catalyst that can be used include a three-way catalyst and / or nickel oxide.

[0041] 2 is a front view showing the faces of the first honeycomb structure section 11 and the second honeycomb structure section 12 perpendicular to the extension direction of the cells 102 in FIG. 1. For the sake of explanation, the directions perpendicular to each other on the faces of the first honeycomb structure section 11 and the second honeycomb structure section 12 perpendicular to the extension direction of the cells 102 are referred to as the longitudinal direction VD and the transverse direction HD. The longitudinal direction VD may be understood as the extension direction of first slits 1031 and second slits 1032 described below, and the transverse direction HD may be understood as the direction in which the first slits 1031 and second slits 1032 are spaced apart. More generally, the longitudinal direction VD may be referred to as the first direction, and the transverse direction HD may be referred to as the second direction.

[0042] The multiple slits 103 include first slits 1031 and second slits 1032. The first slit 1031 has one end (lower in the drawing) in the vertical direction VD as a base end 103b and the other end (upper in the drawing) as a tip end 103a. The second slit 1032 has the other end (upper in the drawing) in the vertical direction VD as a base end 103b and one end (lower in the drawing) as a tip end 103a. In the current path, current I flows in the vertical direction VD along the first slits 1031 and the second slits 1032, turns back at the tips 103a of the first slits 1031 and the second slits 1032, and forms a detour 104 that travels in the horizontal direction HD.

[0043] The first slits 1031 and the second slits 1032 may extend in the vertical direction VD and be spaced apart from each other in the horizontal direction HD. The first slits 1031 and the second slits 1032 may be alternately arranged in the horizontal direction HD. When viewed in the horizontal direction HD, the first slits 1031 and the second slits 1032 may be arranged to overlap each other. In other words, the tip 103a of the first slit 1031 may be arranged in a position beyond the position of the tip 103a of the second slit 1032 in the vertical direction VD, and the tip 103a of the second slit 1032 may be arranged in a position beyond the position of the tip 103a of the first slit 1031 in the vertical direction VD. The base ends 103b of the first slits 1031 and the second slits 1032 may be provided at the outer edge positions of the outer peripheral wall 100 on the surfaces of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 perpendicular to the extension direction of the cells 102.

[0044] The first honeycomb structure portion 11 and the second honeycomb structure portion 12 are arranged so that the nearest slits 103 in the horizontal direction HD of the outer peripheral walls 100 facing each other (the slits 103 closest to the outer peripheral walls 100 facing each other in the horizontal direction HD) are the same one of the first slits 1031 and the second slits 1032. In the embodiment shown in Fig. 2, the first honeycomb structure portion 11 and the second honeycomb structure portion 12 are arranged so that the nearest slits 103 in the horizontal direction HD of the outer peripheral walls 100 facing each other are the second slits 1032.

[0045] The conductive connector 13 partially connects the outer peripheral walls 100 of the first honeycomb structure section 11 and the second honeycomb structure section 12 in the vertical direction VD (extension direction of the first slits 1031 and the second slits 1032) on the base end 103b side of the same section (second slit 1032). In other words, the conductive connector 13 does not completely connect the opposing outer peripheral walls 100 of the first honeycomb structure section 11 and the second honeycomb structure section 12 in the vertical direction VD. In further other words, the conductive connector 13 connects the downstream portion 104a and the upstream portion 104b of the detour 104 of the first honeycomb structure section 11 and the second honeycomb structure section 12. This makes it possible to reduce the non-heat-generating region when the first honeycomb structure section 11 and the second honeycomb structure section 12 are used in a connected state.

[0046] The mutually facing outer peripheral walls 100 of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 may include a first portion 100a in contact with the side surface of the conductive connector 13 in the horizontal direction HD, and a second portion 100b extending from the first portion 100a in the vertical direction VD. In this embodiment, a gap is formed between the first honeycomb structure portion 11 and the second portion 100b of the second honeycomb structure portion 12.

[0047] One end face (the upper end face in the drawing) of the conductive connector 13 in the longitudinal direction VD may be disposed at the outer edge position of the outer peripheral wall 100 on the surface of the first honeycomb structure section 11 and the second honeycomb structure section 12 perpendicular to the extending direction of the cells 102. However, the end face of the conductive connector 13 may also be disposed outward in the longitudinal direction VD from the outer edge position of the outer peripheral wall 100. Alternatively, the end face of the conductive connector 13 may also be disposed inward in the longitudinal direction VD from the outer edge position of the outer peripheral wall 100. In this case, the distance between one end face of the conductive connector 13 in the longitudinal direction VD and the outer edge position of the outer peripheral wall 100 may be appropriately set so that the first honeycomb structure section 11 and the second honeycomb structure section 12 are electrically connected to each other.

[0048] The extension width of the conductive connectors 13 in the vertical direction VD may be set as appropriate so that the first honeycomb structure section 11 and the second honeycomb structure section 12 are electrically connected to each other. However, it is preferable that the extension width of the conductive connectors 13 be 50% or more and 200% or less of the distance D1 in the vertical direction VD from the tip of the nearest slit 103 to the outer edge of the outer peripheral wall 100 (the width of the current path at the tip of the slit 103). This is because if the extension width of the conductive connectors 13 is too narrow, there is a concern that the resistance will increase and heat will be generated locally in the conductive connectors 13, and if the extension width is too wide, there is a concern that the current will be short-circuited and the area where heat is not generated will become large. The extension width of the conductive connectors 13 in the horizontal direction HD may be set as appropriate so that the first honeycomb structure section 11 and the second honeycomb structure section 12 are electrically connected to each other. However, it may be, for example, 10% or more and 100% or less of D1.

[0049] The lengths of the first honeycomb structure part 11, the second honeycomb structure part 12, and the conductive connector 13 may be the same or similar in the extension direction of the cells 102. For example, the length of the conductive connector 13 in the extension direction of the cells 102 may be 50% or more and 100% or less of the lengths of the first honeycomb structure part 11 and the second honeycomb structure part 12 in the extension direction of the cells 102.

[0050] Various materials can be used as the material for the conductive connector 13, such as a Si--SiC based composite material, a Si metal-impregnated Si--SiC based composite material, and the like.

[0051] Next, Fig. 3 is an explanatory diagram showing an example of a method for connecting the first honeycomb structure portion 11 and the second honeycomb structure portion 12 shown in Fig. 2. The first honeycomb structure portion 11 and the second honeycomb structure portion 12 may be connected as shown in Fig. 3. That is, as shown in the upper part of Fig. 3, the first honeycomb structure portion 11 and the second honeycomb structure portion 12 may be arranged so that the nearest slits 103 in the horizontal direction HD of the outer peripheral walls 100 facing each other are the same, and a conductive connector 13 may be arranged between the outer peripheral walls 100 facing each other. By firing in this state, the outer peripheral walls 100 of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 facing each other are connected to each other via the conductive connector 13. At this time, the conductive connector 13 may connect the entire outer peripheral walls 100 of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 facing each other in the vertical direction VD.

[0052] Next, as shown in the lower part of Fig. 3, the conductive connectors 13 may be removed from the portions of the outer walls 100 of the first honeycomb structure section 11 and the second honeycomb structure section 12 that face each other and where it is not desired to pass current between them. For example, the conductive connectors 13 may be removed by electrical discharge machining.

[0053] Embodiment 2 FIG. 4 is a front view showing a honeycomb structure 1 according to a second embodiment of the present invention. In the first embodiment, a gap is provided between the second portions 100b (portions extending in the vertical direction VD from the first portion 100a in contact with the side surfaces of the conductive connectors 13 in the horizontal direction HD) of the outer peripheral walls 100 of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 facing each other. However, an insulator 15 may be disposed between the second portions 100b, and the insulator 15 may join the second portions 100b of the first honeycomb structure portion 11 and the second honeycomb structure portion 12. The honeycomb structure 1 may further include an insulator 15 joining the second portions 100b of the first honeycomb structure portion 11 and the second honeycomb structure portion 12. By providing such an insulator 15, the connection strength between the first honeycomb structure portion 11 and the second honeycomb structure portion 12 can be increased.

[0054] Various materials may be used for the insulator 15, such as aluminum oxide, silicon nitride, cordierite, etc. The other configurations are the same as those in the first embodiment.

[0055] Embodiment 3 FIG. 5 is a front view showing a honeycomb structure 1 according to a third embodiment of the present invention. In the second embodiment, the second portions 100b of the outer walls 100 facing each other are connected by an insulator 15. However, the second portions 100b may be connected by another member as long as the conduction of electricity can be prevented. For example, as shown in FIG. 5, the honeycomb structure 1 may further have a second portion connector 16 that connects the second portions 100b of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 via an insulating coating 16a.

[0056] Various materials may be used for the insulating coating 16a, such as aluminum oxide, silicon nitride, cordierite, etc. Various materials may be used for the second partial connector 16, such as Si-SiC composite material, Si metal-impregnated Si-SiC composite material, etc.

[0057] The insulating coating 16 a may be provided on the second portions 100 b of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 , or may be provided on the second portion connector 16 .

[0058] 5, the second partial connector 16 may be disposed adjacent to the conductive connector 13 in the longitudinal direction VD. When disposed in this manner, the second partial connector 16 may be further connected to the conductive connector 13 via an insulating coating 16a. In this case, the insulating coating 16a may be provided on the second partial connector 16 or on the conductive connector 13.

[0059] Alternatively, the second partial connector 16 may be disposed at a distance from the conductive connector 13 in the vertical direction VD. In this case, a gap or an insulator 15 may be provided between the conductive connector 13 and the second partial connector 16. The other configurations are the same as those in the first and second embodiments.

[0060] Embodiment 4 Fig. 6 is a front view showing a honeycomb structure 1 according to a fourth embodiment of the present invention. As shown in Fig. 6, the multiple slits 103 may further include a third slit 1033 extending in the horizontal direction HD. The detour 104 of the first honeycomb structure portion 11 may include a first detour 1041 and a second detour 1042 separated by the third slit 1033, and the detour 104 of the second honeycomb structure portion 12 may include a third detour 1043 and a fourth detour 1044 separated by the third slit 1033, and a return path 1045 connecting the third detour 1043 and the fourth detour 1044.

[0061] The conductive connector 13 may include a first connector 131 connecting the first detour 1041 of the first honeycomb structure section 11 and the third detour 1043 of the second honeycomb structure section 12, and a second connector 132 connecting the fourth detour 1044 of the second honeycomb structure section 12 and the second detour 1042 of the first honeycomb structure section 11.

[0062] In the first detour 1041 and the third detour 1043 on the lower side of the figure, the first slit 1031 may extend from the outer edge position of the outer peripheral wall 100, and the second slit 1032 may extend from the third slit 1033. In the second detour 1042 and the fourth detour 1044 on the upper side of the figure, the second slit 1032 may extend from the outer edge position of the outer peripheral wall 100, and the first slit 1031 may extend from the third slit 1033.

[0063] The pair of electrode terminals 14 may be connected to the first honeycomb structure portion 11, and more specifically, one of the pair of electrode terminals 14 may be connected to the position of the first detour 1041 of the first honeycomb structure portion 11, and the other may be connected to the position of the second detour 1042 of the first honeycomb structure portion 11. The current I from one electrode terminal 14 may flow in order through the first detour 1041, the first connector 131, the third detour 1043, the return path 1045, the fourth detour 1044, the second connector 132, and the second detour 1042, and return to the other electrode terminal 14.

[0064] The second portions 100b of the outer peripheral walls 100 of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 are provided between the first connector 131 and the second connector 132. In the illustrated embodiment, a gap is formed between the second portions 100b of the first honeycomb structure portion 11 and the second honeycomb structure portion 12. However, as in the second embodiment, the second portions 100b may be connected by an insulator 15. Alternatively, as in the third embodiment, the second portions 100b of the first honeycomb structure portion 11 and the second honeycomb structure portion 12 may be connected by a second portion connector 16 via an insulating coating 16a. The other configurations are the same as those of the first to third embodiments.

[0065] Although the preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the present invention is not limited to these examples. It is clear that a person skilled in the art to which the present invention pertains can conceive of various modifications and alterations within the scope of the technical ideas set forth in the claims, and it is understood that these also naturally fall within the technical scope of the present invention.

[0066] For example, in the first to fourth embodiments, two honeycomb structure portions (the first honeycomb structure portion 11 and the second honeycomb structure portion 12) are connected together, but three or more honeycomb structure portions may be connected together.

[0067] When three or more honeycomb structure parts are connected in the modes such as embodiments 1 to 3, two honeycomb structure parts adjacent to each other in the direction of current flow among the three or more honeycomb structure parts may be understood as the first honeycomb structure part 11 and the second honeycomb structure part 12.

[0068] When three or more honeycomb structure parts are connected in an aspect such as the fourth embodiment, a plurality of first honeycomb structure parts 11 may be connected in order by the conductive connectors 13, and the second honeycomb structure part 12 may be connected to the first honeycomb structure part 11 at a position where the current is turned back by the conductive connectors 13. In this case, the first detours 1041 of the plurality of first honeycomb structure parts 11 may be connected to each other by the conductive connectors 13, and the second detours 1042 of the plurality of first honeycomb structure parts 11 may be connected to each other by different conductive connectors 13. [Explanation of symbols]

[0069] 1: Honeycomb structure 11: First honeycomb structure 12: Second honeycomb structure 13: Conductive connector 131: First connector 132: Second connector 15: Insulator 16: Second partial connector 16a: Insulation coating 100: Outer wall 100a: 1st part 100b: 2nd part 101: Bulkhead 102: Cell 103: Slit 1031: First slit 1032: Second slit 1033: 3rd slit 103a: Tip 103b: Proximal end 104: Detour 1041 :1st detour 1042:Second detour 1043: 3rd detour 1044: 4th detour 1045: Turning Point

Claims

1. a first honeycomb structure section and a second honeycomb structure section, each having an outer peripheral wall, partition walls disposed inside the outer peripheral wall to define a plurality of cells forming flow paths extending from one end face to the other end face, and a plurality of slits disposed apart from each other and configured to define current paths between the outer edge of the outer peripheral wall and between each other, the first honeycomb structure section and the second honeycomb structure section being disposed so that the outer peripheral walls face each other; a conductive connector that partially connects the opposing outer peripheral walls of the first honeycomb structure portion and the second honeycomb structure portion; Equipped with When directions perpendicular to each other on the surfaces of the first honeycomb structure portion and the second honeycomb structure portion perpendicular to the extending direction of the cells are defined as a vertical direction and a horizontal direction, the plurality of slits include first slits having one end side relating to the vertical direction as a base end and the other end side as a tip end, and second slits having the other end side relating to the vertical direction as a base end and one end side as a tip end, and the current path is a detour path in which current flows along the first slits and the second slits in the vertical direction and proceeds in the horizontal direction while turning back at the tips of the first slits and the second slits, the first honeycomb structure portion and the second honeycomb structure portion are arranged such that the nearest slits in the lateral direction of the outer peripheral walls facing each other are the same one of the first slits and the second slits, the conductive connector partially connects the outer peripheral walls of the first honeycomb structure portion and the second honeycomb structure portion in the vertical direction at the base end side of the conductive connector; Honeycomb structure.

2. the plurality of slits further include a third slit extending in the horizontal direction, the detour path of the first honeycomb structure portion includes a first detour path and a second detour path separated by the third slit, the detour path of the second honeycomb structure portion includes a third detour path and a fourth detour path separated by the third slit, and a turning path connecting the third detour path and the fourth detour path, The conductive connector is a first connector connecting the first detour path of the first honeycomb structure portion and the third detour path of the second honeycomb structure portion; a second connector connecting the fourth detour path of the second honeycomb structure portion and the second detour path of the first honeycomb structure portion; Including, The honeycomb structure according to claim 1 .

3. the outer peripheral walls of the first honeycomb structure portion and the second honeycomb structure portion facing each other include a first portion in contact with a side surface of the conductive connector in the horizontal direction, and a second portion extending in the vertical direction from the first portion, The honeycomb structure further includes an insulator that joins the second portion of the first honeycomb structure and the second honeycomb structure. The honeycomb structure according to claim 1 or 2.

4. the outer peripheral walls of the first honeycomb structure portion and the second honeycomb structure portion facing each other include a first portion in contact with a side surface of the conductive connector in the horizontal direction, and a second portion extending in the vertical direction from the first portion, a second portion connector that connects the second portions of the first honeycomb structure portion and the second honeycomb structure portion via an insulating coat; Further provided with The honeycomb structure according to claim 1 or 2.

5. 3. The honeycomb structure according to claim 1, wherein the first honeycomb structure portion and the second honeycomb structure portion are mainly composed of conductive ceramics.

Citation Information

Patent Citations

  • Honeycomb heater

    JP1995085952A