Optical waveguide component and method for manufacturing the same

Abstract

To provide an optical waveguide component and a method for manufacturing the optical waveguide component that enable reduction of time required for manufacture.SOLUTION: An optical waveguide component comprises: a base board having a first surface; an optical waveguide provided on the first surface; protrusions provided on the first surface; and a glass block including an optical fiber and having a recess into which the protrusions are fitted. The optical waveguide and the optical fibers are optically coupled.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an optical waveguide component and a method for manufacturing an optical waveguide component. [Background technology]

[0002] There is an optical waveguide component that includes a polymer waveguide on a substrate and an optical fiber mounted in a glass block. In manufacturing such an optical waveguide component, the polymer waveguide and the optical fiber are optically coupled by aligning the cores, applying an ultraviolet-curable adhesive, and then curing the adhesive by irradiating the optical fiber with ultraviolet light. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2022-509356 [Patent Document 2] Japanese Patent Application Publication No. 2018-040925 [Patent Document 3] Japanese Patent Application Laid-Open No. 2005-326602 Summary of the Invention [Problem to be solved by the invention]

[0004] Recently, there has been an increasing demand for shortening the time required to manufacture optical waveguide components.

[0005] An object of the present disclosure is to provide an optical waveguide component and a method for manufacturing an optical waveguide component that can shorten the time required for manufacturing the optical waveguide component. [Means for solving the problem]

[0006] According to one embodiment of the present disclosure, there is provided an optical waveguide component comprising: a substrate having a first surface; an optical waveguide provided on the first surface; a convex portion provided on the first surface; and a glass block including an optical fiber and having a concave portion formed therein into which the convex portion fits, wherein the optical waveguide and the optical fiber are optically coupled. [Effects of the Invention]

[0007] According to the present disclosure, the time required for manufacturing can be reduced. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view illustrating an optical waveguide component according to a first embodiment. [Figure 2] 1A and 1B are perspective views (part 1) illustrating a method for manufacturing the optical waveguide component according to the first embodiment. [Figure 3] FIG. 4 is a perspective view (part 2) illustrating the method for manufacturing the optical waveguide component according to the first embodiment. [Figure 4] FIG. 10 is a third perspective view illustrating the method for manufacturing the optical waveguide component according to the first embodiment. [Figure 5] FIG. 10 is a perspective view (part 4) illustrating the method for manufacturing the optical waveguide component according to the first embodiment. [Figure 6] FIG. 5 is a fifth perspective view illustrating the method for manufacturing the optical waveguide component according to the first embodiment. [Figure 7] FIG. 10 is a perspective view (part 6) illustrating the method for manufacturing the optical waveguide component according to the first embodiment. [Figure 8] FIG. 10 is a perspective view (part 7) illustrating the method for manufacturing the optical waveguide component according to the first embodiment. [Figure 9] FIG. 10 is a cross-sectional view illustrating an optical waveguide component according to a second embodiment. [Figure 10] FIG. 10 is a cross-sectional view illustrating an optical waveguide component according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In this specification and drawings, components having substantially the same functional configurations are designated by the same reference numerals, and redundant description may be omitted.

[0010] (First embodiment) First, a first embodiment will be described. The first embodiment relates to an optical waveguide component.

[0011] [Structure of optical waveguide components] A description will be given of the structure of the optical waveguide component according to the first embodiment. Fig. 1 is a perspective view illustrating the optical waveguide component according to the first embodiment.

[0012] As shown in FIG. 1, the optical waveguide component 1 according to the first embodiment includes a substrate 10, an optical waveguide 20, a protrusion 26, a glass block 40, and an optical semiconductor chip 50.

[0013] The substrate 10 is, for example, a wiring substrate, and has a wiring pattern (not shown) and electrodes (not shown). The substrate 10 has one surface 11 as a first surface. The optical waveguide 20 and the protrusion 26 are provided on the one surface 11 of the substrate 10.

[0014] In this embodiment, for convenience, the optical waveguide 20 side is referred to as the upper side or one side, and the opposite side is referred to as the lower side or other side, with the substrate 10 as the reference. The upper surface of each part is referred to as the one side or top surface, and the lower surface is referred to as the other side or bottom surface. However, the optical waveguide component 1 can be used upside down or positioned at any angle. Furthermore, a planar view refers to viewing an object from the normal direction of one surface of the substrate 10, and a planar shape refers to the shape of the object viewed from the normal direction of one surface of the substrate 10.

[0015] The optical waveguide 20 has a first cladding layer 21, a plurality of core layers 22, and a second cladding layer 23. The optical waveguide 20 is a polymer waveguide.

[0016] The first cladding layer 21 is provided on the surface 11 of the substrate 10. The material of the first cladding layer 21 is, for example, an organic resin such as an epoxy resin or a polyimide resin. The thickness of the first cladding layer 21 is, for example, about 10 μm to 30 μm.

[0017] The core layers 22 are provided in a strip shape on the first cladding layer 21. The material of the core layers 22 is, for example, an organic resin such as an epoxy resin or a polyimide resin. For example, the cross section of the core layers 22 perpendicular to the extension direction is rectangular. To obtain a single-mode optical waveguide, the core layers 22 may have a very small cross-sectional area. For example, the width of the core layers 22 is 5 μm to 10 μm, and the height is 5 μm to 10 μm.

[0018] The second cladding layer 23 is provided on the first cladding layer 21 and the plurality of core layers 22. The second cladding layer 23 covers the plurality of core layers 22. The material of the second cladding layer 23 is, for example, an organic resin such as an epoxy resin or a polyimide resin. The thickness of the second cladding layer 23 is, for example, about 10 μm to 30 μm.

[0019] In the optical waveguide 20, the refractive index of the core layer 22 is higher than the refractive indexes of the first cladding layer 21 and the second cladding layer 23.

[0020] The optical semiconductor chip 50 includes an optical element (not shown) and is mounted on the substrate 10. The optical semiconductor chip 50 has a plurality of electrodes 51 and is flip-chip mounted on the substrate 10. The optical semiconductor chip 50 is disposed on one side in the extension direction of the core layer 22, and the optical element is optically coupled to the optical waveguide 20. The optical element may be either a light-receiving element or a light-emitting element.

[0021] The protrusions 26 are disposed on the other side of the core layer 22 in the extension direction. In plan view, the optical waveguide 20 is located between the optical semiconductor chip 50 and the protrusions 26. For example, a plurality of protrusions 26 are provided. The protrusions 26 have a cylindrical shape. In plan view, the diameter of the protrusions 26 is, for example, approximately 50 μm to 500 μm. For example, the protrusions 26 are formed from the same material as the first cladding layer 21. Furthermore, the height of the protrusions 26 may be equal to the thickness of the first cladding layer 21. The protrusions 26 are positioned further outside the two core layers 22 that are positioned outermost in the direction in which the multiple core layers 22 are arranged (the direction perpendicular to the extension direction).

[0022] The glass block 40 includes an optical fiber 42. For example, the cross section perpendicular to the extending direction of the core of the optical fiber 42 is circular. The diameter of the core of the optical fiber 42 is, for example, about 127 μm to 250 μm. The optical waveguide 20 and the optical fiber 42 are optically coupled.

[0023] The glass block 40 is formed with recesses 46 into which the protrusions 26 fit. The recesses 46 are provided in the same number as the protrusions 26. The recesses 46 have a cylindrical shape. In plan view, the diameter of the recesses 46 is, for example, approximately 51 μm to 501 μm. The depth of the recesses 46 is slightly greater than the height of the protrusions 26. The depth of the recesses 46 may be equal to the height of the protrusions 26. The recesses 46 are formed on the lower surface 41 of the glass block 40.

[0024] The glass block 40 is bonded to the first cladding layer 21 and the core layer 22 by the second cladding layer 23 .

[0025] [Manufacturing method for optical waveguide components] Next, a description will be given of a method for manufacturing the optical waveguide component according to the first embodiment. Figures 2 to 8 are perspective views illustrating an example of the method for manufacturing the optical waveguide component according to the first embodiment.

[0026] 2, a glass block 40 is prepared. The glass block 40 includes an optical fiber 42. A recess 46 is formed in the lower surface 41 of the glass block 40. The recess 46 can be formed by, for example, drilling.

[0027] Also, as shown in FIG. 3, a substrate 10 is prepared. The substrate 10 is formed from an insulating resin material such as glass epoxy resin. The substrate 10 may be a rigid substrate with high rigidity, or a flexible substrate with low rigidity. The substrate 10 includes an insulating material called a support or base material. The substrate 10 is a large substrate for multiple panel manufacturing, in which multiple product regions R are partitioned, and is ultimately cut along the boundaries between the product regions R to obtain individual optical waveguide components.

[0028] As shown in FIG. 4, a first cladding layer 21 and protrusions 26 are formed on a substrate 10. The first cladding layer 21 is formed collectively across a plurality of product regions R. To form the first cladding layer 21 and the protrusions 26, for example, formation of an ultraviolet curable resin, exposure, development, and heat treatment are carried out in this order. The ultraviolet curable resin may be formed by attaching a resin sheet or by applying a liquid resin. For example, the temperature for the heat treatment is 150°C to 200°C.

[0029] 5, a plurality of core layers 22 are formed in a strip-like pattern on the first cladding layer 21. In forming the core layers 22, for example, formation of an ultraviolet curable resin, exposure, development, and heat treatment are performed in this order.

[0030] Next, as shown in FIG. 6, the optical semiconductor chip 50 is mounted on the substrate 10 for each product area R.

[0031] 7, for each product region R, the glass block 40 is attached to the substrate 10 while fitting the convex portion 26 into the concave portion 46. As a result, the optical waveguide 20 and the optical fiber 42 are optically coupled.

[0032] 8, the second cladding layer 23 is formed on the first cladding layer 21 and the core layer 22. The second cladding layer 23 is formed collectively across multiple product regions R. The second cladding layer 23 is formed so as to contact each glass block 40. To form the second cladding layer 23, for example, ultraviolet curable resin is formed, exposed to light, developed, and heated in this order. If the material of the second cladding layer 23 contains an adhesive, the second cladding layer 23 bonds the first cladding layer 21 and the core layer 22 to the glass block 40.

[0033] Next, the second cladding layer 23, the core layer 22, the first cladding layer 21, and the substrate 10 are cut into individual pieces using a rotating blade or the like of a cutting device along the boundaries between the product regions R. As a result, a plurality of optical waveguide components 1 according to the first embodiment are obtained (see FIG. 1).

[0034] In this manner, the optical waveguide component 1 according to the first embodiment can be manufactured.

[0035] In the first embodiment, a recess 46 is formed in the glass block 40, and a protrusion 26 is provided on the surface 11 of the substrate 10, and the protrusion 26 fits into the recess 46. The first cladding layer 21, the core layer 22, the second cladding layer 23, and the protrusion 26 can be formed with high positional accuracy by, for example, photolithography. Furthermore, the optical fiber 42 can be formed with high positional accuracy in the glass block 40, and the recess 46 can also be formed with high positional accuracy in the glass block 40. Therefore, the optical waveguide 20 and the optical fiber 42 can be optically coupled with high positional accuracy by passive alignment. In other words, optical coupling with high positional accuracy can be achieved without performing alignment.

[0036] Furthermore, since the second cladding layer 23 allows the glass block 40 to be bonded to the first cladding layer 21 and the core layer 22, no separate adhesive is required to bond the optical waveguide 20 and the glass block 40 together.

[0037] Furthermore, by forming the second cladding layer 23 over a plurality of product regions R, the glass blocks 40 can be attached to the substrate 10 in a plurality of product regions R at the same time.

[0038] In this way, in the first embodiment, the time required to manufacture the optical waveguide component 1 can be shortened.

[0039] (Second embodiment) Next, a second embodiment will be described. The second embodiment differs from the first embodiment mainly in the configuration of the second cladding layer. Fig. 9 is a cross-sectional view illustrating an optical waveguide component according to the second embodiment.

[0040] 9, in the optical waveguide component 2 according to the second embodiment, the second cladding layer 23 covers part of the upper surface 43 of the glass block 40. Other configurations of the second embodiment are similar to those of the first embodiment.

[0041] The second embodiment can also achieve the same effects as the first embodiment. Furthermore, in the second embodiment, the contact area between the second cladding layer 23 and the glass block 40 is larger than in the first embodiment. Therefore, a higher adhesive strength can be obtained between the glass block 40 and the first cladding layer 21 and between the glass block 40 and the core layer 22.

[0042] (Third embodiment) Next, a third embodiment will be described. The third embodiment differs from the first embodiment mainly in the configuration of the second cladding layer. Fig. 10 is a cross-sectional view illustrating an optical waveguide component according to the third embodiment.

[0043] As shown in FIG. 10 , the optical waveguide component 3 according to the third embodiment has a second clad layer 70 instead of the second clad layer 23. The second clad layer 70 has a first layer 71 and a second layer 72. The first layer 71 is provided on the first clad layer 21 and the multiple core layers 22. The first layer 71 covers the multiple core layers 22. The material of the first layer 71 is the same as the material of the second clad layer 23. The first layer 71 is thinner than the second clad layer 23, and the thickness of the first layer 71 is, for example, approximately 5 μm to 20 μm. The second layer 72 is provided on the first layer 71. The second layer 72 is formed of a material with higher adhesive strength than the first layer 71. The second layer 72 is thinner than the second clad layer 23, and the thickness of the second layer 72 is, for example, approximately 5 μm to 20 μm. The thicknesses of the first layer 71 and the second layer 72 are approximately the same as the thickness of the second clad layer 23. Other configurations of the third embodiment are similar to those of the first embodiment.

[0044] The third embodiment can also achieve the same effects as the first embodiment. In the third embodiment, the second cladding layer 70 has a first layer 71 and a second layer 72, and the second layer 72 is formed of a material with higher adhesive strength than the first layer 71. Therefore, higher adhesive strength can be obtained between the glass block 40 and the first cladding layer 21 and between the glass block 40 and the core layer 22.

[0045] When manufacturing the optical waveguide component 3, for example, the first layer 71 is formed before the glass block 40 is attached, and the second layer 72 is formed after the glass block 40 is attached.

[0046] Although the preferred embodiments have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims. [Explanation of symbols]

[0047] 1, 2, 3 Optical waveguide components 10 Substrate 11 sides 20 Optical waveguide 21 First cladding layer 22 Core layer 23, 70 Second cladding layer 26 Convex part 40 Glass Block 41 Bottom surface 42 Optical Fiber 43 Top 46 Recess 50 Optical semiconductor chip 51 electrode 71 1st layer 72 2nd layer

Claims

1. a substrate having a first surface; an optical waveguide provided on the first surface; a protrusion provided on the first surface; a glass block including an optical fiber and having a recess formed therein into which the protrusion fits; and an optical waveguide component, in which the optical waveguide and the optical fiber are optically coupled;

2. The optical waveguide component according to claim 1 , wherein there are a plurality of pairs of the convex portion and the concave portion.

3. The protrusion has a cylindrical shape, The optical waveguide component according to claim 1 , wherein the recess has a cylindrical shape.

4. 3. The optical waveguide component according to claim 1, wherein the optical waveguide is a polymer waveguide.

5. The optical waveguide is a first cladding layer disposed on the first surface; a core layer provided on the first clad layer; a second clad layer provided on the first clad layer and the core layer; and 3. The optical waveguide component according to claim 1, wherein the second cladding layer bonds the first cladding layer and the core layer to the glass block.

6. The optical waveguide is a first cladding layer disposed on the first surface; a core layer provided on the first clad layer; a second clad layer provided on the first clad layer and the core layer; and 3. The optical waveguide component according to claim 1, wherein the height of the convex portion is equal to the thickness of the first cladding layer.

7. 3. The optical waveguide component according to claim 1, further comprising an optical semiconductor chip mounted on the substrate and optically coupled to the optical waveguide.

8. forming an optical waveguide and a protrusion on a first surface of a substrate having the first surface; providing a glass block containing an optical fiber and having a recess formed therein; attaching the glass block to the substrate while fitting the protrusion into the recess; and A method for manufacturing an optical waveguide component, optically coupling the optical waveguide and the optical fiber.

9. The step of forming the optical waveguide includes: forming a first cladding layer on the first surface; forming a core layer on the first clad layer; forming a second clad layer on the first clad layer and the core layer; and the glass block is attached to the substrate between the step of forming the core layer and the step of forming the second clad layer; 9. The method for manufacturing an optical waveguide component according to claim 8, wherein the second clad layer bonds the first clad layer and the core layer to the glass block.

10. The step of forming the optical waveguide includes: forming a first cladding layer on the first surface; forming a core layer on the first clad layer; forming a second clad layer on the first clad layer and the core layer; and The method for manufacturing an optical waveguide component according to claim 8 , wherein the convex portion is formed simultaneously with the first cladding layer.

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