Separation apparatus, substrate processing apparatus, and separation method

Abstract

To provide a separation apparatus, a substrate processing apparatus, and a separation method that make it easy to determine the progress of separation.SOLUTION: A separation device 1 according to an embodiment includes two holders (first holder 110, second holder 120) that hold both sides of a plate member (bonded substrate S), a heating unit 510 that heats one of the two holders, a rotation drive unit 122 that drives at least one of the two holders to rotate the plate members held in the two holders, a nozzle 30 that separates the plate members by ejecting a fluid toward the outer periphery of the rotating plate members, and a temperature detection unit 520 that detects the temperature of the plate members from the other of the two holders while the plate members are being separated.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a separation apparatus, a substrate processing apparatus, and a separation method. [Background technology]

[0002] There are cases where a technology is required to separate a plate member into a pair of substrates. For example, in the manufacturing process of a three-dimensional semiconductor device, a laminated substrate (plate member) made by bonding two substrates together is separated to transfer a layer formed on one substrate to the other substrate, thereby forming a uniform thin film.

[0003] As a technique for separating such plate components, a technique has been proposed in which the opposing surfaces of a bonded substrate made of two substrates are sandwiched between a pair of holders, and while rotating, high-pressure water (a water jet) is supplied toward the outer periphery of the bonded substrate, thereby utilizing the wedge effect of the fluid to separate the bonded substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-353081 Summary of the Invention [Problem to be solved by the invention]

[0005] Separation of bonded substrates using a water jet proceeds from the periphery toward the center of the bonded substrate, but because it is difficult to visually distinguish the separated areas of the bonded substrates, it is difficult to determine the progress of separation. This can result in insufficient separation time, leaving unseparated layers, or in continued waste of fluid even though separation is already complete.

[0006] The present invention has been made to solve the above-mentioned problems, and its object is to provide a separation device, a substrate processing apparatus, and a separation method that make it easy to determine the progress of separation of plate members. [Means for solving the problem]

[0007] An embodiment of the present invention includes two holders that hold both sides of a plate member, a heating unit that heats one of the two holders, a rotation drive unit that drives at least one of the two holders to rotate the plate members held by the two holders, a nozzle that separates the plate members by ejecting a fluid toward the outer periphery of the rotating plate members, and a temperature detection unit that detects the temperature of the plate members from the other of the two holders while the plate members are being separated.

[0008] In the substrate processing apparatus of the embodiment, the plate member is a bonded substrate formed by bonding two substrates together, and the apparatus includes the separating apparatus and a surface processing apparatus that processes the surfaces of the separated substrates.

[0009] The separation method of the embodiment includes a rotation process in which two holders hold and rotate a plate member, a heating process in which one of the two holders is heated, a separation process in which a nozzle ejects a fluid toward the outer periphery of the rotating plate member to separate the plate member, and a detection process in which a temperature detection unit detects a change in the temperature of the plate member during the separation process. [Effects of the Invention]

[0010] According to the embodiments of the present invention, it is possible to provide a separation apparatus, a substrate processing apparatus, and a separation method that make it easy to determine the progress of separation of plate members. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 2 is a side view showing the separation device of the embodiment. [Figure 2] FIG. 10 is a plan view showing the bonded substrate, the positioning unit, and the nozzle when the bonded substrate is carried in. [Figure 3] 10 is a plan view showing the bonded substrates, the positioning portion, and the nozzles when the bonded substrates are positioned before the separation step. FIG. [Figure 4] 10A and 10B are plan views showing displacement of the nozzle to a separation start position and a central separation position. [Figure 5] FIG. 10 is a plan view showing the bonded substrates, the positioning unit, and the nozzle during the separation process. [Figure 6] 10 is a plan view showing the bonded substrates, the positioning unit, and the nozzle in a step of separating the center of the bonded substrates. FIG. [Figure 7] 10 is a flowchart showing a procedure for separating bonded substrates according to an embodiment. [Figure 8] 5A to 5C are explanatory views showing a separation step of the bonded substrates according to the embodiment. [Figure 9] FIG. 10 is an explanatory diagram showing the transition of temperature change of the bonded substrate (second substrate) from the start to the end of separation. [Figure 10] FIG. 10 is a side view showing a modified example of the separation device in which a holder detector is provided in the second holder. [Figure 11] 11 is an explanatory view showing a separation step of the modified example of FIG. 10. FIG. [Figure 12] FIG. 10 is a side view showing a modified example of the separating device in which the temperature detecting unit is provided so as to be movable to the central region. [Figure 13] 13 is an explanatory view showing a separation step of the modified example of FIG. 12. FIG. [Figure 14] FIG. 10 is a side view showing a modified example of the separating device in which a heating unit is provided in each of the first holder and the second holder, and a temperature detecting unit capable of detecting the temperature of the central region is added. [Figure 15] 15 is an explanatory view showing a separation step of the modified example of FIG. 14. FIG. [Figure 16] 1 is a plan view showing a substrate processing apparatus including a substrate separating apparatus according to an embodiment; DETAILED DESCRIPTION OF THE INVENTION

[0012] A separation device according to an embodiment will be described with reference to the drawings. The drawings are schematic diagrams, and the size, proportions, and the like of each part are exaggerated for ease of understanding. As shown in FIG. 1, the separation device 1 is a device that separates plate members by discharging a fluid from a nozzle 30. In FIG. 1, the gripping unit 210 and the support unit 220 at the front are omitted. The plate members may be two plates bonded together and separated by the separation device 1, or a single plate that is separated (divided) into two by the separation device 1.

[0013] The plate member of this embodiment is a bonded substrate S. The bonded substrate S is a circular substrate formed by bonding a first substrate Sa and a second substrate Sb together. The first substrate Sa has a bonding surface Sa1 and a surface Sa2 that is the surface opposite to the bonding surface. The second substrate Sb has a bonding surface Sb1 and a surface Sb2 that is the surface opposite to the bonding surface Sb1. In other words, the bonded substrate S is a pair of circular surfaces, and has surfaces Sa2 and Sb2 that are exposed surfaces opposite the bonded surfaces of the first substrate Sa and the second substrate Sb.

[0014] The first substrate Sa is, for example, a substrate having a porous layer formed on the surface of a semiconductor wafer and a single-crystal Si layer formed thereon. The second substrate Sb is, for example, a substrate having a single-crystal Si layer formed on the surface of a semiconductor wafer. The first substrate Sa and the second substrate Sb are bonded together via an insulating layer formed on the first substrate Sa or the second substrate Sb to form a bonded substrate S. In the following description, even if the first substrate Sa and the second substrate Sb are separated from each other, the bonded substrate S will be referred to as a bonded substrate S as long as the bonding surfaces Sa1 and Sb1 are overlapping.

[0015] In the following description, the direction along the rotation axis of the bonded substrate S is the Z direction, the direction in which the nozzle 30 ejects the fluid in a plane perpendicular to the Z direction is the Y direction, and the direction perpendicular to the Y direction is the X direction. The rotation plane of the bonded substrate S is parallel to the XY plane. In this embodiment, the Z direction is the vertical direction and the XY directions are the horizontal directions, but the installation direction of the separating apparatus 1 is not limited to this.

[0016] The separating apparatus 1 separates the first substrate Sa of the bonded substrate S from the porous layer to form multiple single-crystal Si layers on the second substrate Sb. The separating apparatus 1 includes a holding unit 10, a positioning unit 20, a nozzle 30, a nozzle driving unit 40, a heating unit 510, a temperature detection unit 520, a fluid removal unit 60, and a control unit 100.

[0017] [Holding part] The holding unit 10 holds and rotates both sides (Sa2 and Sb2) of the bonded substrate S. The holding unit 10 has a first holder 110 and a second holder 120. The first holder 110 and the second holder 120 are two holders that hold both sides of the bonded substrate S. In this embodiment, the first holder 110 and the second holder 120 are arranged one above the other so as to hold both sides of the bonded substrate S from above and below in the vertical direction.

[0018] (First holder) The first holder 110 includes a first holding body 111 and a support mechanism 112. The first holding body 111 is a circular plate having a diameter smaller than the diameter of the surface of the bonded substrate S. The first holder 110 is formed of a material that can prevent scratches on the bonded substrate S and prevent particle generation due to friction with the bonded substrate S. For example, the first holder 110 is formed of a resin material such as PEEK. The support mechanism 112 is connected to the center of the surface of the first holding body 111 via a support shaft 112a extending in the Z direction and rotatably supports the first holding body 111 such that its center corresponds to the rotation center Ct. In this embodiment, the support shaft 112a is connected via a pulley and a timing belt to a drive source that rotates a second holding body 121 (described later) and rotates in synchronization with the second holding body 121.

[0019] In this embodiment, the surface of the first holder 111 fixed to the support shaft 112a faces up, and the opposite surface faces down. Although not shown, the first holder 111 has a suction hole formed in the surface that contacts the bonded substrate S, and by connecting an exhaust device to this suction hole, one surface of the bonded substrate S (the exposed surface Sa2 of the first substrate Sa) can be suction-held by negative pressure.

[0020] (Second holder) The second holder 120 has a second holding body 121, a rotation drive unit 122, and an attachment / detachment drive unit 123. The second holding body 121 is a circular plate having the same diameter as the first holding body 111. Like the first holder 110, the second holder 120 is also formed from a material that can prevent scratches on the bonded substrate S and prevent the generation of particles due to friction with the bonded substrate S. For example, the second holder 120 is formed from a resin material such as PEEK.

[0021] The rotation drive unit 122 rotates the bonded substrate S. The rotation drive unit 122 has a drive shaft 122a extending in the Z direction connected to the center of the second holder 121, and rotatably supports the second holder 121. The rotation drive unit 122 has a motor as a drive source that rotates the second holder 121. The drive shaft 122a is the shaft of the motor, and when the motor is activated, the second holder 121 rotates around the rotation center Ct. Note that it is sufficient for the rotation drive unit 122 to drive at least one of the two holders (either one or both) to rotate the bonded substrate S held by the two holders. For this reason, the rotation drive unit 122 may be a rotation drive unit 122 that rotates the first holder 110, or a rotation drive unit 122 that rotates both the first holder 110 and the second holder 120.

[0022] In this embodiment, the surface of the second holder 121 attached to the drive shaft 122a faces downward, and the opposite surface faces upward and faces the first holder 111. In other words, the first holder 111 and the second holder 121 are disposed facing each other at a distance so that their centers of rotation Ct coincide. Although not shown, the second holder 121 has a suction hole that opens on the surface that contacts the bonded substrate S, and by connecting an exhaust device to this suction hole, the other surface of the bonded substrate S (the exposed surface Sb2 of the second substrate Sb) can be suction-held by negative pressure.

[0023] The attachment / detachment driving unit 123 causes the holding unit 10 to hold the bonded substrate S. The attachment / detachment driving unit 123 moves the second holding body 121 in a direction toward or away from the first holding body 111. The attachment / detachment driving unit 123 has a cylinder as a driving source. The bonded substrate S is inserted between the first holding body 111 and the second holding body 121, which are spaced apart, and the attachment / detachment driving unit 123 moves the second holding body 121 toward the first holding body 111, so that the bonded substrate S can be sandwiched and held between the first holding body 111 and the second holding body 121.

[0024] [Positioning part] The positioning unit 20 positions the center Cs of the bonded substrate S to the center of rotation Ct of the holding unit 10 (see FIGS. 2 and 3). That is, the center Cs of the bonded substrate S arranged between the first holding body 111 and the second holding body 121 is aligned with the center of rotation Ct of the first holding body 111 and the second holding body 121. The positioning unit 20 has a gripping unit 210, a support unit 220, an axial direction driving unit 230, and an opening / closing driving unit 240.

[0025] (gripping part) The gripping parts 210 grip the outer periphery of the bonded substrate S. The outer periphery of the bonded substrate S is the side surface along the outer edge of the circumference. A plurality of gripping parts 210 are arranged at equal intervals at positions surrounding the holding part 10, that is, at positions along the outer periphery of the bonded substrate S held by the holding part 10. The gripping parts 210 in this embodiment are four upright pins.

[0026] (Support part) Each of the gripping portions 210 is attached to the support portion 220. Four support portions 220 are provided in one-to-one correspondence with the gripping portions 210.

[0027] (Axial drive unit) The axial driving unit 230 moves the gripping unit 210 and the support unit 220 in an axial direction parallel to the rotation axis of the holding unit 10. The axial driving unit 230 has a support unit 231, a biasing unit 232, and an absorbing unit 233. The support unit 231 is an upright member that supports the gripping unit 210 and the support unit 220 at its tip. The biasing unit 232 is provided so as to be movable in the axial direction by a driving mechanism such as a cam rotated by a cylinder. The absorbing unit 233 is interposed between the biasing unit 232 and the support unit 231 and transmits the movement of the biasing unit 232 to the support unit 231 and absorbs vibrations of the bonded substrate S. The absorbing unit 233 may be, for example, a compression spring, a leaf spring, an elastic body made of rubber or resin, a cylinder, or the like, as long as it can absorb vibrations.

[0028] The opening / closing drive unit 240 moves the gripping unit 210 and the support unit 220 between a closed position where the gripping unit 210 contacts the outer periphery of the bonded substrate S, and an open position where the gripping unit 210 is separated from the outer periphery of the bonded substrate S. The position of the gripping unit 210 is set so that the center Cs of the bonded substrate S is aligned with the rotation center Ct when the gripping unit 210 is in the closed position. The opening / closing drive unit 240 has an arm 241 that moves in the radial direction of the bonded substrate S (centripetal and centrifugal directions relative to the rotation center Ct) by a drive mechanism such as a cam that rotates by a cylinder (not shown). A support unit 231 is connected to the arm 241 so as to be axially movable.

[0029] [nozzle] The nozzle 30 separates the bonded substrate S into a first substrate Sa and a second substrate Sb by ejecting a fluid toward the outer periphery of the rotating bonded substrate S. The nozzle 30 of this embodiment ejects a fluid toward the outer periphery of the bonded substrate S that is held by the holder 10 and rotating, and then is positioned by the positioning unit 20 and ejects the fluid toward the outer periphery of the bonded substrate S that is stationary.

[0030] The nozzle 30 of this embodiment is a spraying device that performs water jet processing by spraying high-pressure fluid water (water jet) onto a target object. The nozzle 30 is connected via piping, valves, and the like to a supply device 31 that includes a pump and the like for supplying high-pressure water. The nozzle 30 is configured to be able to discharge high-pressure fluid, has a very small hole diameter (0.1 to 1 mm), and the thickness of the tip of the nozzle 30 is thick enough to withstand high-pressure water (1 to 5 cm). As shown in FIG. 4, the discharge port at the tip of the nozzle 30 is provided in a direction toward the outer periphery of the bonded substrate S, and the axis of the nozzle 30 is parallel to the plane of rotation of the bonded substrate S. The temperature of the fluid is at least 10°C lower than the heating temperature of the bonded substrate S by the heating unit 510, for example, 20 to 35°C.

[0031] [Nozzle drive unit] The nozzle driving unit 40 moves the nozzle 30 to a position where the fluid can be ejected onto the outer periphery of the bonded substrate S. As shown in FIG. 4 , the nozzle driving unit 40 of this embodiment can move the nozzle 30 in a direction along the outer periphery of the bonded substrate S. The nozzle driving unit 40 moves the nozzle 30 in accordance with a change in the temperature of the bonded substrate S detected by a temperature detection unit 520. The nozzle driving unit 40 has a contact / separation mechanism 41 and a position adjustment mechanism 42.

[0032] (approach / separate mechanism) The contact / separation mechanism 41 moves the nozzle 30 between a standby position where the discharge port is separated from the outer periphery of the bonded substrate S, as shown in Fig. 3, and a discharge position where the nozzle 30 approaches the outer periphery and can separate the bonded substrate S by discharging fluid, as shown in Figs. 4 to 6. That is, the contact / separation mechanism 41 moves the nozzle 30 in the Y direction. The contact / separation mechanism 41 can be, for example, a ball screw mechanism driven by a servo motor.

[0033] (position adjustment mechanism) The position adjustment mechanism 42 moves the nozzle 30 between a separation start position (see the nozzle 30 indicated by the solid line in FIG. 4) along a tangent to the outer periphery of the bonded substrate S that is held and rotated by the holder 10, and a central separation position (see FIG. 6) toward the center Cs of the bonded substrate S. In other words, the position adjustment mechanism 42 moves the nozzle 30 along the X direction. The position adjustment mechanism 42 can be, for example, a ball screw mechanism driven by a servo motor.

[0034] The contact / separation mechanism 41 and the position adjustment mechanism 42 allow the nozzle 30 to move in an arc from the separation start position to the central separation position while maintaining the discharge position. This allows the fluid discharged from the nozzle 30 to be sprayed toward a partial region on the periphery of the bonded substrate S, as shown by Ra in FIG. 4 . This partial region is a region on the periphery of the bonded substrate S that includes an arc with a central angle of 90 degrees. Since the bonded substrate S rotates at least during separation of the periphery, even if the fluid is discharged to a partial region on the periphery, the discharged fluid can reach the entire periphery. As the bonded substrate S separates, the fluid also reaches the center of the bonded substrate S through the gap between the first substrate Sa and the second substrate Sb.

[0035] [Heating section] As shown in FIG. 1, the heating unit 510 heats the first holder 110, which is one of the two holders. That is, the heating unit 510 is provided in the first holder 110, which is arranged above. The heating unit 510 of this embodiment is a flat heater, and is provided inside the first holder 111. For example, the heating unit 510 is built in near the surface of the first holder 111 that comes into contact with the bonded substrate S. The heating unit 510 heats the bonded substrate S, for example, to the heat-resistant temperature of the first holder 110. Preferably, the bonded substrate S is heated to 50 to 100°C (50°C or higher and 100°C or lower).

[0036] [Temperature detection section] The temperature detection unit 520 detects the temperature of the bonded substrate S from the other of the two holders while the bonded substrate S is being separated. The temperature detection unit 520 of this embodiment is provided on the side of the second holder 120 arranged below. The temperature detection unit 520 has a non-contact detection unit 521 and a drive unit 522. The non-contact detection unit 521 detects the temperature of the rotating bonded substrate S in a non-contact manner. For example, a thermograph or a radiation thermometer can be used as the non-contact detection unit 521.

[0037] The non-contact detection unit 521 is disposed in the vicinity of the second holder 120 so as to detect the temperature of the bonded substrate S from the second holder 120 side, that is, from the second substrate Sb side of the bonded substrate S.

[0038] The driving unit 522 is a moving mechanism that moves the non-contact detection unit 521 in the radial direction of the bonded substrate S. The driving unit 522 can be, for example, a ball screw mechanism that is driven by a servo motor and horizontally moves an arm having the non-contact detection unit 521 at its tip.

[0039] [Fluid removal section] The fluid removal unit 60 removes the fluid from the surface of the bonded substrate S. The fluid removal unit 60 blows out gas in a direction parallel to the surface of the bonded substrate S. In this way, the fluid removal unit 60 blows away droplets adhering to the upper and lower surfaces of the bonded substrate S. The liquid remaining on the upper surface of the bonded substrate S prevents heat from being released to the liquid on the surface, which would hinder heating, and prevents liquid from adhering to the lower surface, which would hinder temperature detection by the temperature detection unit 520.

[0040] The fluid removal unit 60 has a removal nozzle 61 and a gas supply device 62. The removal nozzle 61 is a jetting device that ejects gas. The gas supply device 62 is a device that includes a pump and the like that supplies gas, and is connected to the removal nozzle 61 via piping, valves, and the like.

[0041] The removal nozzle 61 extends to a position close to the surface of the bonded substrate S, and the outlet at the tip of the removal nozzle 61 is provided so as to face in a direction parallel to the surface of the bonded substrate S. Therefore, the removal nozzle 61 discharges gas in a direction parallel to the surface of the bonded substrate S. Furthermore, the discharge direction of the gas from the removal nozzle 61 is parallel to the discharge direction of the fluid from the nozzle 30, and is not opposed to it, so the discharge of the fluid from the nozzle 30 is not hindered.

[0042] The removal nozzles 61 are arranged one on each side of the bonded substrate S so that the fluid can be removed from both surfaces of the bonded substrate S. The removal nozzle 61A attached to the support mechanism 112 removes the fluid from the upper surface of the bonded substrate S (the exposed surface Sa2 of the first substrate Sa), and the removal nozzle 61B attached to the rotation drive unit 122 removes the fluid from the lower surface of the bonded substrate S (the exposed surface Sb2 of the second substrate Sb).

[0043] [Control device] The control device 100 is a device that controls the separating apparatus 1, and controls the operations of the holding unit 10, the positioning unit 20, the nozzle 30, the nozzle driving unit 40, the heating unit 510, the temperature detection unit 520, and the fluid removal unit 60. The control device 100 can be realized, for example, by a dedicated electronic circuit or a computer that operates on a predetermined program. The control device 100 also has a memory unit that stores information necessary for the processing of each unit of the separating apparatus 1. The memory unit stores, for example, a set temperature (described later), the time from when the nozzle 30 reaches a position corresponding to the periphery of the central region of the bonded substrate S until the center Cs separates, and the like.

[0044] More specifically, the control device 100 controls the rotation and movement of the second holder 121 by controlling the rotation drive unit 122 and the attachment / detachment drive unit 123. The control device 100 also controls the movement of the gripper 210 and the support unit 220 by controlling the axial drive unit 230 and the opening / closing drive unit 240. Furthermore, the control device 100 controls the discharge of fluid from the nozzle 30, the movement of the nozzle 30, the heating of the first holder 110, the movement of the non-contact detection unit 521, and the discharge of gas from the removal nozzle 61 by controlling the supply device 31, the contact / separation mechanism 41, the position adjustment mechanism 42, the heating unit 510, the drive unit 522, and the gas supply device 62.

[0045] In particular, the control device 100 of this embodiment controls the nozzle drive unit 40 to move the nozzle 30 in accordance with the temperature of the bonded substrate S detected by the temperature detection unit 520. For example, the control device 100 detects the temperature using the temperature detection unit 520 at predetermined intervals or in real time, and determines whether the temperature has fallen below a set temperature, which is a threshold value previously set in a storage unit, for a predetermined period of time or more to determine the separation status of the bonded substrate S. In response to this, the nozzle drive unit 40 moves the nozzle 30 from the separation start position to the periphery of the central region. After reaching the periphery of the central region, the nozzle 30 stops when the time until the center Cs, previously set in the storage unit, has elapsed. An example of such movement of the nozzle 30 in accordance with temperature detection and elapsed time will be described later.

[0046] The control device 100 has a display device and an input device (not shown), and the change in the temperature of the surface of the bonded substrate S detected by the temperature detection unit 520 is displayed on the display device, and in response to this, the operator can use the input device to input instructions for the operation of each part of the separation device 1. This allows the operator to determine that separation is complete and stop the separation device 1. When the temperature at a certain position on the surface of the bonded substrate S becomes lower than a set temperature, the control device 100 can also determine that separation has occurred at that position and display that fact on the display device.

[0047] [Operation] The operation of the separation apparatus 1 as described above will be described with reference to the flowchart in FIG. 7 and the explanatory diagram in FIG. 8 in addition to the above-mentioned FIGS. 1 to 6. Note that Ph1 in FIG. 8 is a fixed reference position of the lower surface of the first holding body 111, and Ph2 is a transfer position which is the position of the lower surface of the support part 220 when the support part 220 transfers the bonded substrate S between the robot arm M. Ps1 is a separation position which is the height position of the lower surface of the second substrate Sb when the bonded substrate S is sandwiched between the first holding body 111 and the second holding body 121 and separated by discharging a fluid from the nozzle 30 while being rotated. Ps2 is a receiving position where the second holding body 121 receives the bonded substrate S from the robot arm M, and is also a position where the positioning part 20 positions the bonded substrate S in the horizontal direction.

[0048] First, the second holding body 121 is located at a position separated from the first holding body 111 (FIG. 8(A)). The gripping portion 210 and the support portion 220 are located at the delivery position Ph2 and also at the open position. As shown in FIG. 2, the robot arm M of the transport device carries in the bonded substrate S (FIG. 8(B), step S101). The second holding body 121 rises to the receiving position Ps2, and the robot arm M descends, so that the second holding body 121 comes into contact with the lower surface of the second substrate Sb, and the robot arm M delivers the bonded substrate S to the second holding body 121 (FIG. 8(C), step S102).

[0049] As shown in FIG. 3, the gripping unit 210 moves to the closed position to grip the outer periphery of the bonded substrate S, thereby positioning the center Cs of the bonded substrate S at the center of rotation Ct (FIG. 8(D), step S103). Thereafter, the gripping unit 210 moves to the open position, and the second holder 121 rises to hold the bonded substrate S by contacting it with the first holder 111 and sandwiching it between them, positioning the bonded substrate S at the separation position Ps1 and holding it by suction using the negative pressure of the suction holes (FIG. 8(E), step S104). The heating unit 510 also heats the bonded substrate S (heating step: step S105). That is, by heating the first holder 110 (first holder 111), the second substrate Sb, which is one of the substrates in contact with the first holder 111, is heated via the first substrate Sa, which is the other substrate.

[0050] In this state, the second holder 121 rotates, thereby rotating the bonded substrate S together with the first holder 111 (rotation step: step S106). Then, as shown by the nozzle 30 indicated by the solid line in FIG. 4, the nozzle 30 moves to a separation start position (step S107), and the temperature detection unit 520 (non-contact detection unit 521) starts detecting the temperature of the bonded substrate S (detection step: step S108). The nozzle 30 ejects fluid toward the outer periphery of the bonded substrate S (separation step: step S109). This starts separation of the bonded substrate S. Along with the ejection of this fluid, gas is blown out from the removal nozzle 61. This removes the fluid from the surface of the bonded substrate S, preventing it from interfering with heating or temperature detection.

[0051] When the control device 100 determines that the bonding surfaces Sa1 and Sb1 corresponding to the position of the temperature change in the bonded substrate S detected by the temperature detection unit 520 have separated (YES in step S110), the nozzle 30 moves to follow the separated region (shown by the hatched area in the figure) as shown in Fig. 5 (step S111). The nozzle 30 moves to the periphery of the central region of the bonded substrate S (a position corresponding to the periphery of the first holder 111 and the second holder 121), and when the temperature detection unit 520 detects that separation has occurred up to the periphery of the central region (YES in step S112), the nozzle 30 moves to a position corresponding to the center Cs (center separation position) as shown in Fig. 6. After a preset time until the center Cs separates has elapsed (YES in step S113), the control device 100 determines that the center Cs has separated and stops discharging the fluid from the nozzle 30 (step S114). The rotation of the bonded substrate S stops as the rotation of the first holder 111 and the second holder 121 stops (step S115). Note that the temperature detection of the bonded substrate S by the temperature detection unit 520 (non-contact detection unit 521), heating by the heating unit 510, and blowing of gas from the removal nozzle 61 also stop.

[0052] Thereafter, the supply of negative pressure to the first holder 111 and the second holder 121 is released, and the second holder 121 descends to the receiving position Ps2, where it hands over the bonded substrate S to the robot arm M of the transport device, and the robot arm M then carries out the bonded substrate S (see Figures 8(C) and (B), step S116).

[0053] [Temperature measurement and nozzle movement] The temperature measurement and movement of the nozzle 30 in the separation process described above will be described in more detail with reference to Fig. 9. Fig. 9 is a diagram showing the temperature change of the bonded substrate S (second substrate Sb) from the start to the end of separation as viewed from the bottom (surface Sb2 side), with regions of the bonded substrate S being distinguished according to differences in the temperature of the heated bonded substrate S. Specifically, the following are distinguished: region AR1 where the heating unit 510 is present; region AR2 held by the first holder 110 and the second holder 120; region AR3 around region AR2; and region AR4 from region AR3 to the outer periphery of the bonded substrate S. Furthermore, region AR2, which includes region AR1, corresponds to the central region described above.

[0054] [Temperature detection starts] As shown in FIG. 9A, before separation begins due to the ejection of fluid from the nozzle 30, the region AR1 of the first substrate Sa where the heating unit 510 is located is heated, thereby heating the second substrate Sb via the first substrate Sa. The region AR2 of the second substrate Sb reaches a temperature equivalent to the heating temperature (60°C). The outer regions AR3 and AR4 are also heated by heat transfer from the regions AR1 and AR2, but their temperatures are lower than those of the regions AR1 and AR2. However, their temperatures are higher than the set temperature. The set temperature is the temperature of the second substrate Sb at the time of separation, and varies depending on the radial position of the second substrate Sb, decreasing from the center to the periphery. The set temperature is determined in advance by simulation or experiment based on the heating temperature and the temperature of the fluid.

[0055] As shown in FIG. 9(B), even after separation of the bonded substrate S begins, heat from the heated first substrate Sa is transferred to the second substrate Sb, so that regions AR1 and AR2 of the second substrate Sb are maintained at 60°C, just as they were before separation began. Regions AR3 and AR4 are heated by heat transfer from region AR2, but because fluid penetrates between the first substrate Sa and the second substrate Sb, the temperature of the fluid-penetrated regions drops and becomes lower than before separation began. The control device 100 determines that region AR4, whose temperature has dropped below the set temperature, is a region where separation has been completed, and moves the nozzle 30 toward the center and the temperature detection unit 520 toward the center.

[0056] As the penetration of the fluid progresses, the low-temperature region expands toward the center. Then, as described above, when the temperature of the regions other than regions AR1 and AR2 of the first substrate Sa becomes lower than the set temperature as shown in FIG. 9(C), the control device 100 determines that separation of the outer peripheral region outside the periphery of the central region is complete. Furthermore, as described above, after the predetermined time until separation of the center Cs has elapsed, the control device 100 determines that all regions have been separated as shown in FIG. 9(D), and stops discharging fluid from the nozzle 30 and blowing gas from the removal nozzle 61.

[0057] [effect] (1) The separation device 1 of this embodiment has two holders (first holder 110, second holder 120) that hold both sides of a plate member (bonded substrate S), a heating unit 510 that heats one of the two holders, a rotation drive unit 122 that rotates the plate members held by the two holders by driving at least one of the two holders, a nozzle 30 that separates the plate members by ejecting a fluid toward the outer periphery of the rotating plate members, and a temperature detection unit 520 that detects the temperature of the plate members from the other of the two holders while the plate members are being separated.

[0058] In addition, the separation method of this embodiment includes a rotation process in which two holders (first holder 110, second holder 120) hold and rotate a plate member (bonded substrate S), a heating process in which one of the two holders (first holder 110) is heated, a separation process in which a nozzle 30 separates the plate member by ejecting a fluid toward the outer periphery of the rotating plate member, and a detection process in which a temperature detection unit 520 detects a change in the temperature of the plate member during the separation process.

[0059] When the plate members separate, fluid penetrates into the internal region of the plate members, changing the temperature of the heated plate members. Therefore, by heating the plate members from one holder side while detecting the temperature from the other holder side, the progress of separation of the plate members can be determined. This allows the separation device 1 to be stopped when separation is complete, preventing unseparated layers from remaining and wasting fluid. This reduces stress on the plate members caused by excessive fluid discharge, reduces running costs by reducing the amount of fluid used, and shortens takt time.

[0060] When plate members separate, their positions change, so it is conceivable to detect the change in height of both or one side of the plate members using a laser displacement sensor or the like. However, even after separation, the displacement may be small, or accurate detection of the displacement may be difficult due to vibration or bending of the substrate, making it difficult to understand the change due to separation of the plate members. After extensive research, the inventors noticed that when the temperature of a plate member with one side heated is measured from the other side, the temperature of the other side drops significantly due to fluid infiltration into the internal region of the plate member during separation. In other words, they found that the progress of separation can be clearly determined by monitoring the temperature change of the plate members during separation. Therefore, as in this embodiment, by heating the plate members from one holder side during separation and detecting the temperature from the other holder side, the separation status can be determined more accurately than by detecting the displacement of the plate members.

[0061] (2) Two holders (first holder 110, second holder 120) are arranged vertically so as to hold both surfaces of a plate member (bonded substrate S) from above and below, and a heating unit 510 is provided in the upper holder (first holder 110), and a temperature detection unit 520 is provided on the lower holder (second holder 120). Since the fluid ejected from the nozzle 30 is less likely to remain below the plate member than above it, detecting the temperature from below reduces the possibility that the fluid will interfere with temperature detection of the plate member.

[0062] (3) The separating device 1 has a nozzle driving unit 40 that moves the nozzle 30 in response to changes in the temperature of the plate member (bonded substrate S) detected by the temperature detection unit 520. This allows the nozzle 30 to change the ejection position of the fluid in accordance with the separated region moving from the outer periphery toward the center Cs of the bonded substrate S, preventing the nozzle 30 from moving while leaving unseparated areas, thereby reducing separation defects. Furthermore, the position of the nozzle 30 can be changed and ejection can be stopped in accordance with the progress of separation, eliminating waste of fluid.

[0063] (4) The separating device 1 has a fluid removal unit 60 that removes the fluid on the surface of the bonded substrate S. Therefore, by removing the fluid on the surface where the temperature detection unit 520 detects a change in temperature, that is, the surface of the bonded substrate S, highly accurate detection can be performed.

[0064] (5) The temperature detection unit 520 has a non-contact detection unit 521 that detects the temperature of the rotating plate member (bonded substrate S) in a non-contact manner, thereby preventing damage and contamination of the rotating plate member.

[0065] (6) The temperature detection unit 520 has a driving unit 522 that moves the non-contact detection unit 521 in the radial direction of the plate member (bonded substrate S). Therefore, the location where the temperature is detected can be changed depending on the separation state of the rotating plate member.

[0066] [Variations] The present embodiment can also be modified as follows. (1) The temperature detection unit 520 may have a holder detection unit 523 provided in the other holder (second holder 120). For example, as shown in FIGS. 10 and 11, the holder detection unit 523 may be provided in the second holder 120. The holder detection unit 523 is a thermocouple or the like that directly detects the temperature of the plate member (bonded substrate S). As shown in FIG. 11(E), when separation of the central region begins, the holder detection unit 523 begins detecting the temperature of the central region. When the control device 100 determines that the temperature has fallen below a set temperature, it determines that separation is complete. According to this modification, separation of the center Cs can also be detected based on the temperature. As a result, the progress of separation of the center Cs can be detected more accurately.

[0067] (2) The supporting unit 220 may have a gripping unit 210 that grips the outer periphery of a plate member (bonded substrate S) in contact with one holder (first holder 110). The plate member is gripped by the gripping unit 210, one holder is brought into contact with the plate member and heated by the heating unit 510, and the other holder (second holder 120) is retracted from the plate member. In this state, the temperature detecting unit 520 detects the temperature of the central region of the plate member. In this embodiment, as shown in FIG. 12, the driving unit 522 can move the non-contact detecting unit 521 to a position where the central region of the plate member (bonded substrate S) can be detected. The supporting unit 220 also has a mounting surface that supports the bonded substrate S. In this modification, the surface of the bonded substrate S that is held by the second holder 120, i.e., the exposed surface Sb2 of the second substrate Sb, is mounted on this mounting surface.

[0068] As shown in FIG. 13(F), after separating the outer peripheral region and before separating the central region, the support unit 220 is raised by the axial drive unit 230, the bonded substrate S is placed on the support unit 220, and the second holder 121 is retracted. Then, the non-contact detection unit 521 is moved to the location where the second holder 121 was. When separation of the central region begins, the non-contact detection unit 521 begins detecting the temperature of the central region, and when it is determined that the temperature has fallen below a predetermined set temperature, it is determined that separation is complete. In this embodiment, it is possible to detect the progress of separation of the central region and accurately determine the final separation of the center Cs.

[0069] In the above embodiment, the heating unit 510 is provided on the first holder 111 and the temperature detection unit 520 is provided on the second holder 121 side, but the arrangement may be reversed, that is, the temperature detection unit 520 may be provided on the first holder 111 side and the heating unit 510 may be provided on the second holder 121. By providing the temperature detection unit 520 on the first holder 111 side in the direction opposite to the direction of gravity, the fluid ejected from the nozzle 30 is less likely to adhere to the temperature detection unit 520, thereby reducing the possibility that the fluid adhering to the temperature detection unit 520 will interfere with temperature detection of the plate member.

[0070] (3) A heating unit 510 may also be provided on the other holder (second holder 120), and a temperature detection unit 520 may also be provided on the opposite side of the other holder holding the plate member (bonded substrate S). That is, as shown in Fig. 14, a heating unit 510A for heating the bonded substrate S is provided on the first holder 111, and a heating unit 510B for heating the bonded substrate S is also provided on the second holder 121. Furthermore, a non-contact detection unit 521A of the temperature detection unit 520 is provided on the second holder 121 side so as to be movable by a driving unit 522A, and a non-contact detection unit 521B is also provided on the opposite side of the second holder 121 (the side of the first substrate Sa of the bonded substrate S) so as to be movable by a driving unit 522B. The side opposite to the second holder 121 referred to here may be the side of the first substrate Sa of the bonded substrate S held by the second holder 121 during temperature detection, and does not necessarily have to be always on the side opposite to the second holder 121. The non-contact detection unit 521B provided on the side opposite to the second holder 121 across the bonded substrate S in this way can be moved from the outer periphery of the bonded substrate S to above the central region by the drive unit 522B.

[0071] 15(E), when separating the outer peripheral region, heating is performed by the heating unit 510A of the first holder 111, and temperature detection is performed from below by the non-contact detection unit 521A. As shown in Fig. 15(F), when separating the central region, suction by the first holder 111 is stopped and the bonded substrate S is released, then the second holder 121 is lowered, the bonded substrate S is gripped by the gripping unit 210, and the non-contact detection unit 521B moves above the central region of the bonded substrate S. Heating is performed by the heating unit 510B of the second holder 121, and temperature detection is performed from above by the non-contact detection unit 521B.

[0072] When separation of the central region begins, non-contact detection unit 521B starts detecting the temperature of the central region, and when it is determined that the temperature has fallen below a set temperature, it is determined that separation is complete. This also makes it possible to detect separation of center Cs.

[0073] (4) In the above embodiment, the nozzle driving unit 40 continuously changes the position of the nozzle 30. However, the nozzle driving unit 40 may intermittently change the position between the separation start position and the central separation position. For example, a plurality of stop positions are set between the separation start position and the central separation position, and the nozzle 30 temporarily stops at the plurality of stop positions and discharges fluid depending on the progress of separation detected by the temperature detection unit 520. Because the peripheral speed varies between the outer periphery and the center Cs of the bonded substrate S, continuous discharge would result in locations where the amount of fluid discharged would be excessive. However, by stopping at each stop position and discharging fluid, and then moving on after separation has reached that location, fluid waste can be prevented and separation can be ensured.

[0074] (5) In the above embodiment, the fluid removal unit 60 removes the fluid by blowing gas from the removal nozzle 61. However, the fluid may also be removed by suction using the removal nozzle 61 connected to an air suction device.

[0075] (6) In order for the positioning unit 20 to position the bonded substrate S, the number of positions at which the positioning unit 20 comes into contact with the outer periphery may be three or more. In other words, the number of the multiple gripping units 210 is three or more as long as they can position the center Cs of the circular bonded substrate S.

[0076] (7) The axis of rotation of the bonded substrate S by the holder 10 is not limited to the vertical direction. For example, the holder 10 may be configured so that the bonded substrate S rotates around a horizontal axis, and the nozzle 30 may eject a fluid in the vertical direction relative to the outer periphery of the bonded substrate S. The holder 10 only needs to be able to hold and rotate at least one of the two surfaces of the bonded substrate S. Therefore, the holder 10 may be configured so that the bonded substrate S is held by either the first holder 111 or the second holder 121. Furthermore, the rotation driver 122 may be configured to rotate either the first holder 111 or the second holder 121, or both. The attachment / detachment driver 123 may be configured so that either the first holder 111 or the second holder 121 is moved, or both are moved.

[0077] (8) As shown in FIG. 16, the separating device 1 can be configured as part of a substrate processing apparatus 2. For example, the substrate processing apparatus 2 can be a single-wafer processing apparatus including a separating device 1 and multiple chambers 1a accommodating surface processing apparatuses 3 for processing the surfaces of the separated first substrate Sa and second substrate Sb. The surface processing apparatus 3 processes the bonded substrates S, which are transported in a cassette (FOUP) 1b in a pre-processing step, one by one in each chamber 1a. The surface processing apparatus 3 is, for example, a cleaning apparatus that cleans the surfaces of the separated first substrate Sa and second substrate Sb with a cleaning solution. The bonded substrates S are removed one by one from the cassette 1b by a transfer robot 1c and temporarily placed in a buffer unit 1d. Then, the transfer robot 1e transports the bonded substrates S to the respective chambers 1a, separates them, and cleans them. The surface processing apparatus 3 cleans the surfaces of the separated first substrate Sa and second substrate Sb with a cleaning solution.

[0078] [Other embodiments] The present invention is not limited to the above-described embodiments, but also includes other embodiments shown above. The present invention also includes combinations of all or any of the above-described embodiments and other embodiments. Furthermore, various omissions, substitutions, and modifications can be made to these embodiments without departing from the scope of the invention, and such modifications are also included in the present invention. [Explanation of symbols]

[0079] 1 Separation device 1a Chamber 1b cassette 1c Transport robot 1d Buffer Unit 1e Transport robot 2. Substrate processing equipment 3. Surface treatment equipment 10 Holding part 20 Positioning part 30 nozzles 31 Feeding device 40 Nozzle drive unit 41 Approach / separation mechanism 42 Position adjustment mechanism 60 Fluid removal section 61, 61A, 61B Removal nozzle 62 Air supply device 100 control device 110 First Holder 111 First Holder 112 Support mechanism 112a Support shaft 120 Second Holder 121 Second Holder 122 Rotation drive unit 122a Drive shaft 123 Detachable drive unit 210 Gripping part 220 Support part 230 Axial drive unit 231 Pillar section 232 energizing section 233 Absorption section 240 Opening and closing drive unit 241 Arm 510, 510A, 510B heating section 520 Temperature detection unit 521, 521A, 521B Non-contact detection unit 522, 522A, 522B drive unit 523 Holder detector S laminated substrate

Claims

1. two holders for holding both surfaces of the plate member; a heating unit that heats one of the two holders; a rotation drive unit that drives at least one of the two holders to rotate the plate members held by the two holders; a nozzle that ejects a fluid toward the outer periphery of the rotating plate member to separate the plate member; a temperature detection unit that detects the temperature of the plate member from the other of the two holders while the plate member is being separated; A separation device comprising:

2. the two holders are arranged vertically so as to hold both surfaces of the plate member from above and below in the vertical direction, The heating unit is provided in a holder disposed above the heating unit, The temperature detection unit is provided on the side of a holder arranged below.

2. The separation device according to claim 1.

3. 2. The separating apparatus according to claim 1, further comprising a nozzle driving unit that moves the nozzle in response to a change in the temperature of the plate member detected by the temperature detecting unit.

4. 2. The separation device according to claim 1, further comprising a fluid removal section for removing fluid from the surface of the plate member.

5. 2. The separating apparatus according to claim 1, wherein the temperature detecting section includes a non-contact detecting section that detects the temperature of the rotating plate member in a non-contact manner.

6. 6. The separating apparatus according to claim 5, wherein the temperature detecting unit has a driving unit that moves the non-contact detecting unit in the radial direction of the plate member.

7. 2. The separating apparatus according to claim 1, wherein the temperature detecting section includes a holder detecting section provided on the other holder.

8. a gripping portion that grips the outer periphery of the plate member that is in contact with one of the holders, the plate member is gripped by the gripping unit, one holder is brought into contact with the plate member and heated by the heating unit, and the other holder is retracted from the plate member, and the temperature detection unit detects the temperature of the central region of the plate member.

2. The separation device according to claim 1.

9. The heating unit is also provided on the other holder, The temperature detection unit is also provided on the opposite side of the other holder that holds the plate member.

2. The separation device according to claim 1.

10. the plate member is a bonded substrate formed by bonding two substrates together, A separation device according to any one of claims 1 to 9; a surface treatment device for treating the surface of the separated substrate; A substrate processing apparatus comprising:

11. a rotating step in which two holders hold and rotate the plate member; a heating step of heating one of the two holders; a separation step in which a nozzle ejects a fluid toward an outer periphery of the rotating plate member to separate the plate member; a detection step in which a temperature detection unit detects a change in the temperature of the plate member in the separation step; A separation method comprising:

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