Molding apparatus and molding method

Abstract

To properly prevent interference between a molded object and a flattening member to ensure the shape accuracy and dimensional accuracy of the molded object.SOLUTION: A molding apparatus that repeatedly performs fluid discharge processing, flattening processing, and curing processing to laminate-mold a molded object containing a substrate layer on a molding stand comprises: a lifting unit that relatively lifts and lowers a flattening member used in the flattening processing relative to the molding stand; a measuring unit that measures a height position of a target object; a setting unit that causes the measuring unit to measure an upper surface height of the molding stand, and sets a height in which a height based on a target thickness of the substrate layer is corrected on the basis of a measurement value of the upper surface height to a target height of the flattening member relative to the molding stand; and a control unit that controls the lifting unit to lift or lower the flattening member to the target height.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present specification discloses a molding apparatus and a molding method. [Background technology]

[0002] Conventionally, a molding apparatus has been proposed that ejects a fluid onto a molding table and then flattens the fluid with a flattening member to form a base layer (solidified layer). For example, Patent Document 1 describes a device that detects whether or not there is a protrusion protruding from the base layer, and if a protrusion is detected, removes the protrusion before flattening the base layer, thereby avoiding interference (collision) between the protrusion and the flattening member and preventing damage to the flattening member. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-026577 Summary of the Invention [Problem to be solved by the invention]

[0004] As described above, preventing damage to the planarizing member is important for properly performing planarization and ensuring the shape and dimensional accuracy of the molded object. However, factors other than the protrusions may cause interference between the base layer and the planarizing member, damaging the planarizing member or impairing the shape and dimensions of the molded object.

[0005] A primary object of the present disclosure is to appropriately prevent interference between a molded object and a flattening member, thereby ensuring shape accuracy and dimensional accuracy of the molded object. [Means for solving the problem]

[0006] The present disclosure has adopted the following means to achieve the above-mentioned main object.

[0007] The molding apparatus of the present disclosure includes: A modeling apparatus that performs additive manufacturing of a model including a base layer on a modeling table by repeatedly performing a fluid discharging process, a flattening process, and a hardening process, a lifting unit that lifts and lowers a flattening member used in the flattening process relative to the modeling table; a measuring unit for measuring the height position of an object; a setting unit that causes the measuring unit to measure the height of an upper surface of the modeling table, and sets a target height of the flattening member relative to the modeling table, the height being obtained by correcting a height based on the target thickness of the base material layer based on the measured value of the upper surface height; a control unit that controls the lifting unit so as to raise the flattening member to the target height; The gist of the project is to provide the following:

[0008] In the modeling apparatus of the present disclosure, the target height of the flattening member relative to the modeling table is set to a height based on the target thickness of the base material layer, corrected based on the measured value of the height of the top surface of the modeling table, and the lifting unit is controlled to raise the flattening member to the target height. This makes it possible to appropriately prevent interference between the model and the flattening member and ensure the shape and dimensional accuracy of the model, even if the modeling table is deformed, such as by being distorted upward. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing an outline of the configuration of a production system 1 including a molding apparatus 10. [Figure 2] FIG. 1 is a block diagram showing an outline of the configuration of a modeling apparatus 10. [Figure 3] 10 is a flowchart illustrating an example of a forming process. [Figure 4] FIG. 1 is an explanatory diagram showing an example of an outline of a forming process. [Figure 5] 10 is a flowchart showing an example of a target height setting process. [Figure 6] FIG. 4 is an explanatory diagram showing an example of height measurement points. [Figure 7] 10 is a flowchart showing an example of a correction process based on the stage height. [Figure 8] FIG. 10 is an explanatory diagram showing an example of correction based on the stage height. [Figure 9] FIG. 10 is an explanatory diagram showing an example of correction based on the stage height. [Figure 10] FIG. 2 is an explanatory diagram showing an example of a shaped object including a mark M. [Figure 11] 10 is a flowchart showing an example of a correction process based on a build height. [Figure 12] FIG. 10 is an explanatory diagram showing an example of correction based on the build height. [Figure 13] FIG. 10 is an explanatory diagram showing an example of correction based on the build height. [Figure 14] FIG. 10 is an explanatory diagram showing an example of a part to be molded including a base part BP. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the present disclosure will be described with reference to the drawings. Fig. 1 is a configuration diagram showing an outline of the configuration of a production system 1 including a molding apparatus 10. Fig. 2 is a block diagram showing an outline of the configuration of the molding apparatus 10. In this embodiment, the left-right direction (X-axis), front-rear direction (Y-axis), and up-down direction (Z-axis) are as shown in Fig. 1.

[0011] The production system 1 includes a three-dimensional modeling apparatus (hereinafter, modeling apparatus) 10 that models a shaped object, including, for example, a base layer and a circuit (wiring), on a rectangular plate-shaped pallet P, and a mounting apparatus 80 that mounts components on the circuit (wiring) on ​​the substrate modeled on the pallet P. The production system 1 may include two or more mounting apparatuses 80, or may include only the modeling apparatus 10 without the mounting apparatus 80. The modeling apparatus 10 includes a control unit 20, a memory unit 22, a communication unit 24, an operation panel 26, a first discharge unit 30, a flattening unit 35, a second discharge unit 40, a height sensor 45, a UV irradiation unit 47, an upper surface heating unit 48, a press heating unit 49, a transport unit 50, a stage unit 60, and first and second transfer units 70 and 75. All components except the operation panel 26 are housed in a housing 12 of the modeling apparatus 10.

[0012] The control unit 20 is configured as a microprocessor centered on a CPU 20a and includes a ROM 20b for storing processing programs, a RAM 20c used as a work area, and a timer 20d for executing timing processing, and controls the entire modeling apparatus 10. The memory unit 22 is configured, for example, with an HDD or SSD, and stores modeling jobs including modeling information such as the shape and size of the model (three-dimensional object) and circuit information (wiring information) such as the circuit (wiring) pattern. The communication unit 24 is an interface used to communicate with each device in the production system 1, such as the mounting device 80 and a management device (not shown). The control unit 20 exchanges information with each device in the production system 1 via the communication unit 24. The operation panel 26 is a touch-panel display disposed at the top of the front of the housing 12, and displays various information to the operator and accepts various operations from the operator.

[0013] The first ejection unit 30 includes a first inkjet head 31 and a second inkjet head 32 that eject liquid materials using an inkjet system, and an X-axis moving unit 33. The first inkjet head 31 ejects resin ink for forming circuit boards. The resin ink is a liquid material such as a liquid curable resin (e.g., UV-curable resin, thermosetting resin, or two-part curable resin), a thermoplastic resin, or a slurry made by mixing a solvent with a solid material such as an inorganic substance. The second inkjet head 32 ejects a conductive metal ink, such as silver ink, in which metal particles are dispersed in a solvent, for forming circuits (wiring). The X-axis moving unit 33 includes a guide rail provided in the X-axis direction on the front of a gate-shaped frame, and two sliders on which the inkjet heads 31 and 32 are respectively arranged. The X-axis moving unit 33 moves each slider along the guide rail, thereby moving (scanning) each inkjet head 31 and 32 in the X-axis direction.

[0014] The flattening unit 35 includes a roller 36 (flattening member) for flattening the liquid material on the pallet P, and a roller lifting unit 37, and is disposed on the rear surface of the frame of the X-axis moving unit 33. The roller lifting unit 37 is configured to be able to raise and lower the roller 36 using, for example, a cylinder, and raises and lowers the roller 36 in the Z-axis direction between an upper standby position and a lower flattening position (working position). The flattening unit 35 flattens the surface of the resin ink ejected onto the pallet P, for example, by smoothing it with the roller 36 while moving the pallet P relative to the pallet P in the Y-axis direction. The flattening member is the cylindrical roller 36, but may also be a flat blade or the like.

[0015] The second dispensing unit 40 includes a first dispenser head 41 and a second dispenser head 42 that dispense liquid materials using a dispenser method, and an X-axis moving unit 43. The first dispenser head 41 dispenses a conductive paste, such as silver paste, for forming electrodes. The conductive paste is, for example, a liquid resin in which a conductive material having conductivity is dispersed. For example, a conductive paste in which metal particles are dispersed in a resin that hardens when heated is used. The second dispenser head 42 dispenses a resin paste, such as a thermosetting resin, as an underfill for sealing components. The thermosetting resin is, for example, a liquid resin having insulating properties. Note that the second dispensing unit 40 may include more dispenser heads so that it can dispense more types of liquid materials. The X-axis moving unit 43 includes a guide rail provided in the X-axis direction on the front surface of a gate-shaped frame and a slider on which the heads 41 and 42 are arranged together. The X-axis moving unit 43 moves the sliders to move (scan) the heads 41 and 42 in the X-axis direction.

[0016] The height sensor 45 measures the height position of an object such as the upper surface of the stage 61 of the stage unit 60, the upper surface of the pallet P placed on the stage 61, or the surface of a model on the pallet P. The height sensor 45 is configured as, for example, a contact-type sensor that can move up and down in the Z-axis direction, and is attached to a slider of the X-axis moving unit 43 so that it can move in the X-axis direction. Note that the height sensor 45 is not limited to a contact-type sensor, and may also be a reflective sensor, such as a laser sensor, that has a light-emitting unit that emits light downward and a light-receiving unit that receives reflected light.

[0017] The UV irradiation unit 47 is equipped with UV lamps such as mercury lamps, metal halide lamps, and UV-LEDs, and irradiates the UV-curable resin dispensed onto the pallet P with UV light to cure it. The top surface heating unit 48 is equipped with infrared heaters such as halogen heaters, ceramic heaters, and carbon heaters, and heats and cures the metal ink dispensed onto the pallet P. Note that the molding of the resin layer and the molding of the circuit (wiring) are repeated multiple times to layer-by-layer molded objects on the pallet P. The press heating unit 49 is equipped with a metal flat plate, a heater for heating the flat plate, and an elevator that can raise and lower the pallet P and apply pressure to press it against the plate from below. The press heating unit 49 cures the conductive paste or underfill by heating the flat plate while applying pressure to press the pallet P, which carries the molded object before or after component mounting, relative to the flat plate.

[0018] The transport unit 50 includes a belt conveyor 52 that transports the pallet P along the X-axis direction. By driving the belt conveyor 52, the transport unit 50 transports the pallet P to be carried into the mounting device 80 and the pallet P carried out from the mounting device 80 in the X-axis direction.

[0019] The stage unit 60 includes a stage 61 formed in a rectangular shape in a top view, a stage lifting / lowering unit 62, and a Y-axis moving unit 64. The stage unit 60 holds the pallet P placed on the stage 61 and moves the pallet P in the Y-axis direction and raises and lowers the pallet P in the Z-axis direction. The stage lifting / lowering unit 62 holds the placed pallet P and raises and lowers the pallet P by moving the stage 61, which can abut against the underside of the pallet P, in the Z-axis direction. The stage lifting / lowering unit 62 is configured to raise and lower the stage 61 (pallet P) using, for example, a servo motor, and is capable of fine-tuning the height position of the stage 61 (pallet P) in micrometer increments, for example. The Y-axis moving unit 64 is movable along guide rails 11 arranged in the center of the lower part of the molding apparatus 10 from front to rear in the Y-axis direction. The Y-axis moving unit 64 includes a slider on which the stage lifting / lowering unit 62 is arranged, and moves the stage lifting / lowering unit 62 in the Y-axis direction. The gate-shaped frames of the X-axis moving parts 33, 44 in the first discharge unit 30 and the second discharge unit 40 are disposed so as to straddle the guide rails 11. The stage lifting part 62 moves in the Y-axis direction by the slider of the Y-axis moving part 64, and moves to processing positions below the first discharge unit 30, the flattening unit 35, the second discharge unit 40, the UV irradiation unit 47, and the upper surface heating unit 48. The stage unit 60 also moves to a position where the pallet P is transferred between the transport unit 50, a position where the pallet P is transferred between the press heating unit 49, a position where the pallet P is attached and detached by an operator, etc.

[0020] The first transfer unit 70 transfers the pallet P in the X-axis direction to be handed over between the transport unit 50 and the stage unit 60, and includes a pusher lifting / lowering unit 71 and an X-axis moving unit 72. The pusher lifting / lowering unit 71 raises and lowers a pusher (not shown) in the Z-axis direction using, for example, a cylinder between an upper position where it does not interfere with the pallet P and a lower position where it can abut against the side of the pallet P. The X-axis moving unit 72 includes a guide rail provided along the X-axis direction on a gate-shaped frame that straddles the guide rail 11, and a slider on which the pusher lifting / lowering unit 71 is disposed and movable along the guide rail, and moves the pusher lifting / lowering unit 71 in the X-axis direction. In this embodiment, the frame and guide rail of the X-axis moving unit 72 are shared with the frame and guide rail of the X-axis moving unit 44 described above, and the slider of the X-axis moving unit 72 is provided separately from the slider of the X-axis moving unit 44. The second transfer unit 75 transfers the pallet P in the X-axis direction to be handed over between the press heating unit 49 and the stage unit 60. Similar to the first transfer unit 70, the second transfer unit 75 includes a pusher lifting section 76 that raises and lowers the pusher in the Z-axis direction, and an X-axis moving section 77 that moves the pusher lifting section 76 in the X-axis direction, and therefore a description thereof will be omitted.

[0021] As shown in FIG. 1, the mounting device 80 includes a transport unit 81, a component supply unit 82, a mounting head 83, an XY-axis moving unit 85, a parts camera 86, a nozzle stocker 87, and an operation panel 88.

[0022] The transport unit 81 includes a belt conveyor that transports the pallet P along the X-axis direction, and transports the pallet P to be loaded into the modeling apparatus 10 and the pallet P unloaded from the modeling apparatus 10. The component supply unit 82 is, for example, a tape feeder equipped with a reel on which components are stored at predetermined intervals on tape. Multiple tape feeders are detachably attached to the front side of the mounting apparatus 80. The mounting head 83 includes one or more nozzles that pick up components and a nozzle lifting unit that raises and lowers the nozzles in the Z-axis direction, and mounts the components picked up by the nozzles in predetermined positions on the pallet P. The XY-axis moving unit 85 includes a Y-axis slider that moves along the Y-axis guide rail and the Y-axis guide rail, and an X-axis slider that moves along the X-axis guide rail and the X-axis guide rail provided on the Y-axis slider and on which the mounting head 83 is disposed. The XY-axis moving unit 85 moves the Y-axis slider and the X-axis slider to move the mounting head 83 in the X and Y directions. The imaging range of the parts camera 86 is above, and the camera captures an image of the component picked up by the nozzle of the mounting head 83 from below to generate a captured image. The nozzle stocker 87 is configured to be able to accommodate a variety of nozzles of different sizes and shapes. The nozzles accommodated in the nozzle stocker 87 can be automatically attached to and detached from the mounting head 83. The operation panel 88 is configured as a touch panel display, and displays various information to the worker and accepts various operations from the worker.

[0023] Next, the modeling process of the modeling device 10 configured as described above will be described. FIG. 3 is a flowchart showing an example of the modeling process. FIG. 4 is an explanatory diagram showing an example of the outline of the modeling process. In this embodiment, the resin layer (substrate layer B) modeled with the resin ink ejected from the first inkjet head 31 includes a flattened layer that is flattened by the roller 36 and a smooth layer that is not flattened (see FIG. 4). The flattened layer and the smooth layer are modeled to have the same thickness.

[0024] In the molding process, the control unit 20 first sets a target thickness Ta of the planarizing layer (S100), and then executes a target height setting process to set a target height Ra of the roller 36 (S105). Each base material layer B, such as the planarizing layer or the smooth layer, is designed to be molded to a predetermined thickness, such as several tens of μm. For this reason, the target thickness Ta of the planarizing layer and the target thickness of the smooth layer are usually set to that predetermined thickness. The target height setting process of S105 will be described in detail later, but the target height Ra of the roller 36 is set to a height that flattens the upper surface of the resin layer formed to the target thickness Ta.

[0025] Next, the control unit 20 determines whether or not to perform correction based on the top surface height (also referred to as stage height) of the stage 61 (pallet P) of the stage unit 60 (S110). In this embodiment, the control unit 20 normally determines to perform correction based on the top surface height in S110. Furthermore, the control unit 20 determines to perform correction based on the top surface height at least in S110 after the circuit (wiring) is formed in S155 and the process returns to S100. Note that it is possible to not perform correction based on the top surface height when forming a predetermined planarization layer, for example, by setting by the operator on the operation panel 26. If the control unit 20 determines to perform correction, it executes correction processing based on the stage height (S115). If the control unit 20 determines not to perform correction, it skips S115.

[0026] The control unit 20 also determines whether or not to perform correction based on the surface height (also referred to as the printing height) of the object on the stage 61 (pallet P) (S120). If the control unit 20 determines to perform correction, it executes correction processing based on the printing height (S125). If the control unit 20 determines not to perform correction, it skips S125. Note that before the first base material layer B is printed, correction based on the surface height of the object cannot be performed, and therefore the control unit 20 determines not to perform correction in S120. The correction processing in S115 and S125 will be described in detail later.

[0027] Next, the control unit 20 controls the elevation of the roller 36 so that the height position of the roller 36 is the target height Ra (S130), and then forms a planarized layer (S135). In S130, the roller elevation unit 37 lowers the roller 36 to the planarization position, and the servo motor fine-tunes the height position of the stage 61 so that the distance between the lower end of the roller 36 and the upper surface of the stage 61 (pallet P) is the target height Ra. In S135, the ejection of the resin ink (FIG. 4(1)), planarization by the roller 36 (FIG. 4(2)), and curing by irradiation with UV light (FIG. 4(3)) are repeated i times (a predetermined number of times, for example, about 30 times) to form one planarized layer (base layer B). In this embodiment, the roller 36 is maintained at the target height Ra while one planarized layer is being formed.

[0028] Furthermore, once the flattening layer has been formed, the control unit 20 determines whether or not to form a smooth layer (S140). If it is determined that a smooth layer should be formed, the control unit 20 forms the smooth layer (S145). If it is determined that a smooth layer should not be formed, the control unit 20 skips S145. In S145, one smooth layer (base layer B) is formed by repeating the ejection of resin ink (FIG. 4(4)) and curing by irradiation with UV light (FIG. 4(5)) j times (a predetermined number of times, for example, about 30 times). Note that although the i times for the flattening layer and the j times for the smooth layer are the same number of times, they may be different numbers of times.

[0029] As described above, the planarizing layer and the smooth layer differ in whether or not they are planarized by the roller 36. Here, minute irregularities may be formed on the surface of the base layer B (resin layer) due to factors such as the amount of ink ejected from each nozzle of the first inkjet head 31 and the size of the ink droplets. These irregularities have a height of, for example, ±10 μm, and are difficult to completely remove even when planarized with the roller 36. For this reason, such minute irregularities are formed on the surface of the planarizing layer. On the other hand, the smoothing layer is formed under different conditions from the planarizing layer, such as the amount of ink ejected from each nozzle of the first inkjet head 31, the size of the ink droplets, the number of scans of the first inkjet head 31, and the scanning speed. As a result, the smoothing layer has less surface irregularities than the planarizing layer, or the height of the irregularities is reduced to, for example, ±1 μm or less, resulting in a smoother surface. Forming a smooth layer is not essential; all of the base layer B may be formed as a planarizing layer.

[0030] Next, the control unit 20 determines whether or not to form a circuit (wiring) (S150). If it determines to form a circuit, it forms the circuit (wiring) (S155). If it determines not to form a circuit, it skips S155. In S155, the discharge of the metal ink (FIG. 4(6)) and curing by heating (FIG. 4(7)) are repeated k times (a predetermined number of times, for example, about 80 times) to form the circuit C (wiring). Then, the control unit 20 determines whether or not the modeling is completed (S160). If it determines that the modeling is not completed, it returns to S100. The control unit 20 sequentially forms a planarizing layer, a smoothing layer, and a circuit (wiring), and if it determines that the modeling is completed in S160, it ends the modeling process.

[0031] Details of S105, S115, and S125 will be described below. First, the target height setting process of S105 will be described based on the flowchart in Fig. 5. In this process, the control unit 20 first determines whether or not it is before the first layer is formed, that is, whether or not it is the timing to start forming a new object on the pallet P (S200). Note that before the first layer is formed, the curing process has not yet been performed, and therefore the stage 61 and the pallet P are in an initial state where no deformation has occurred due to the heat caused by the curing process.

[0032] When the control unit 20 determines that the first layer has not yet been built, it measures the height of the upper surface of each measurement point S on the stage 61 and sets the reference height Sa (S210). For example, the control unit 20 sets the reference height Sa to the lowest measurement value among the measurements of each measurement point S. Next, the control unit 20 sets the target height Ra of the roller 36 by adding the target thickness Ta of the flattening layer to the set reference height Sa (S220), and ends this process. On the other hand, when the control unit 20 determines that the first layer has not yet been built, i.e., the second or subsequent layer has not yet been built, it sets the target height Ra of the roller 36 by adding the target thickness Ta of the flattening layer to the target height Ra used in building the previous flattening layer, i.e., the previous target height Ra', and ends this process.

[0033] FIG. 6 is an explanatory diagram showing an example of height measurement locations. FIG. 6 shows a top view of the stage 61, pallet P, base material layer B, etc. In this embodiment, a rectangular film F, which is slightly smaller than the pallet P, is attached to the top surface of the pallet P placed on the stage 61, and an object such as the base material layer B is formed on the film F. Measurement points S for the stage height are set at four locations (S1 to S4), for example, near the four corners of the film F, in a non-printing area where an object such as the base material layer B is not to be formed. FIG. 6 also shows an example of the measured values ​​of the top surface height at each measurement point S. The values ​​in the upper row indicate the measured values ​​in the initial state, all of which are 0 μm. The values ​​in the lower row are measured values ​​after deformation, which will be described later. The printing height is measured on the surface (top surface) of mark M. This mark M is formed to the same thickness (surface height) as the planarizing layer and the smooth layer during printing of the planarizing layer in S135 and the smooth layer in S145. Furthermore, in this embodiment, the marks M are formed at positions near the measurement points S1 to S4. That is, the marks M are provided at a total of four locations (M1 to M4) in the non-printing region of the film F. In this way, the measurement points S1 to S4 and the marks M1 to M4 are provided on the film F, but for the sake of convenience in explanation and illustration, they will be described as being on the stage 61. Note that the target height Ra of the roller 36 is also actually the height relative to the upper surface of the film F, but for the sake of convenience in explanation and illustration, it will be described as the height relative to the upper surface of the stage 61.

[0034] Next, the correction process based on the stage height in S115 will be described with reference to the flowchart in Fig. 7. Figs. 8 and 9 are explanatory diagrams showing an example of correction based on the stage height. In this embodiment, as shown in Fig. 10, an object is additively manufactured including the mark M; however, for the sake of convenience of explanation and illustration, the mark M is omitted from Figs. 8, 9, and the explanatory diagrams from Fig. 12 onwards. Figs. 8 and 9 illustrate two of the four measurement points S, and the measurement point S on the right side of the figures is set to the reference height Sa.

[0035] In this process, the control unit 20 determines whether the first layer has not yet been formed (S300), as in S200. If the control unit 20 determines that the first layer has not yet been formed, the control unit 20 calculates an initial difference ΔSa between the highest measurement value among the measurement values ​​of each measurement point S measured in S210 and the reference height Sa (S310). Next, the control unit 20 corrects the target height Ra of the roller 36 by adding the initial difference ΔSa to the target height Ra set in S220 (S320), and ends this process. Through the processes of S220 and S320, the target height Ra becomes the height obtained by adding the target thickness Ta and the initial difference ΔSa to the reference height Sa.

[0036] Normally, in the initial state, there is no distortion or other deformation of the stage 61, so there is almost no variation in the measurements of each measurement point S (see Figure 8(1)). Therefore, the initial difference ΔSa is approximately equal to the error in the measurements of each measurement point S and is close to zero. Therefore, the corrected target height Ra is almost the same as the target height Ra set in S220. However, due to variations in the top surface height caused by manufacturing errors or long-term use, a relatively large initial difference ΔSa may occur, as shown in Figures 8(2) and 8(3), for example. In such a case, when flattening is performed with the roller 36 at the target height Ra set in S220 (the height obtained by adding the reference height Sa to the target thickness Ta), the roller 36 may interfere with the model (the first base layer B) (the area surrounded by the dashed line in Figure 8(2)). This may result in poor flattening, such as damage to the model due to strong friction between the model and the roller 36, or the resin ink may be spread and become unstable. Therefore, in this embodiment, an initial difference ΔSa between the highest measured value and the reference height Sa in the initial state is calculated, and flattening by the roller 36 is performed at a target height Ra corrected by the initial difference ΔSa (see FIG. 8(3)). As a result, even if a relatively large initial difference ΔSa occurs in the initial state, flattening by the roller 36 can be performed appropriately.

[0037] Furthermore, if the control unit 20 determines in S300 that the first layer has not yet been modeled, i.e., that the second or subsequent layers have not yet been modeled, it measures the top surface height of each measurement point S and acquires the measurement value Sb (S330). Next, the control unit 20 calculates the height change amount from the previous measurement value for each measurement point S and acquires the maximum height change amount ΔSb among the height changes for each measurement point S (S340). Then, the control unit 20 corrects the target height Ra set in S230 by adding the height change amount ΔSb to the target height Ra (S350), and ends this process. Through the processes of S230 and S350, the target height Ra becomes the height obtained by adding the target thickness Ta and the height change amount ΔSb to the previous target height Ra'. As described above, FIG. 6 shows the measurement value of the top surface height at each measurement point S, and the numerical value below each measurement point S indicates the change amount from the previous time (e.g., the initial state). 6, the variations at measurement points S1 to S4 are shown as +20 μm, −10 μm, 0 μm, and +30 μm. Of these, the maximum height variation ΔSb is +30 μm, and the target height Ra is corrected by this value.

[0038] FIG. 9(1) shows the continuation of the modeling process from FIG. 8(3) and illustrates a case where the degree of deformation of the stage 61 remains unchanged. In this case, the height change amount ΔSb is close to 0 (not shown in FIG. 9(1)), and flattening by the roller 36 can be appropriately performed at the target height Ra set in S230, i.e., the target height Ra obtained by adding the target thickness Ta to the previous target height Ra'. On the other hand, the upper surface height may change relatively significantly due to deformation such as distortion of the stage 61. For example, FIG. 9(2) illustrates a case where the left side of the stage 61 in FIG. 9 becomes higher and the maximum height change amount ΔSb is obtained. In this case, when flattening by the roller 36 is performed at the target height Ra set in S230 (the height obtained by adding the target thickness Ta to the previous target height Ra'), the roller 36 may interfere with the model (base layer B) (the area indicated by the dashed dotted line in FIG. 9(2)). This may result in poor flattening, such as damage to the model or an unstable shape, as described above. Therefore, in this embodiment, the maximum height change amount ΔSb among the changes in the upper surface height from the previous time is calculated, and flattening by the roller 36 is performed at the target height Ra corrected by the height change amount ΔSb (the height obtained by adding the target thickness Ta and the height change amount ΔSb to the previous target height Ra') (see FIG. 9(3)). As a result, even if the degree of deformation of the stage 61 changes, flattening by the roller 36 can be performed appropriately based on the height change amount.

[0039] Next, the correction process based on the build height in S125 will be described with reference to the flowchart in FIG. 11. In this process, the control unit 20 first measures the surface height of each mark M to obtain a measurement value Mb (S400). The surface height of the mark M is the same as the surface height of the base material layer B. In other words, S400 is equivalent to a process of having the height sensor 45 measure the surface height of the base material layer B after the build has been completed. Next, the control unit 20 calculates the build thickness Tb based on the difference between the measurement value Mb of each mark M and the measurement value Sb of the measurement point S corresponding to the mark M (for example, the measurement point S1 corresponding to the mark M1) (S410). The measurement value Sb is obtained in S330 of the correction process based on the stage height. If the correction process based on the stage height has not been performed, the control unit 20 may measure the top surface heights of the measurement points S1 to S4 in S400 to obtain the measurement value Sb. The object thickness Tb in S410 may be calculated by, for example, calculating the difference between the measurement values ​​Mb and Sb at corresponding positions and calculating the maximum value of the differences, or may be calculated as the average value or minimum value of the differences.

[0040] Next, the control unit 20 calculates the thickness difference ΔTb by subtracting the design thickness Td from the building thickness Tb (S420). The design thickness Td is the cumulative value obtained by accumulating the target thicknesses of each base material layer B (flattening layer and smooth layer) that have been additively built up to the previous time. If the building thickness Tb is thicker than the design thickness Td, the difference ΔTb will be positive, and if the building thickness Tb is thinner than the design thickness Td, the difference ΔTb will be negative.

[0041] The control unit 20 then determines whether the calculated difference ΔTb is outside a predetermined range (S430). If it is determined that the difference ΔTb is not outside the predetermined range, it determines that the printing thickness Tb is not significantly different from the design thickness Td and no correction is necessary, and terminates this process. The predetermined range is, for example, a range in which the roller 36 and the object do not rub against each other strongly and the surface of the object can be smoothed by the roller 36. On the other hand, if the control unit 20 determines that the calculated difference ΔTb is outside the predetermined range, it determines whether the current printing is for an intermediate layer (S440). If it determines that the current printing is for an intermediate layer, the control unit 20 corrects the target height Ra of the roller 36 by adding the difference ΔTb to the target height Ra set in S230 or the target height Ra corrected in S350 (S450), and terminates this process. On the other hand, if the control unit 20 determines that the formation is not of an intermediate layer, i.e., that the formation is of the final layer, it corrects the target thickness Ta of the final layer of the flattening layer by adding the difference ΔTb to the target thickness Ta set in S100 (S460), and terminates this process.

[0042] FIG. 12(1) shows a case where the modeling process continues while the stage 61 is deformed, such as tilted. As shown in the figure, the modeling thickness Tb on the right side of the figure increases by the amount of tilt of the stage 61. FIG. 12(2) also shows a case where the tilt direction of the stage 61 changes during the modeling process, for example, the stage changes from a downward-sloping rightward tilt to a downward-sloping leftward tilt. In this case, the target height Ra of the roller 36 is corrected according to the height change amount ΔSb of the stage 61 by the stage height correction process described above. However, the increase in the modeling thickness Tb is not reflected in the correction, and the model may interfere with the roller 36 (the area indicated by the dashed-dotted line in FIG. 12(2)). This can result in poor flattening, such as damage to the model or an unstable shape, as described above.

[0043] Therefore, in this embodiment, when the object to be built is an intermediate layer (for example, when the uppermost layer in FIG. 13 (FIG. 12) is an intermediate layer), the difference ΔTb between the build thickness Tb and the design thickness Td is calculated, and flattening by the roller 36 is performed at a target height Ra corrected by the difference ΔTb (see FIG. 13(1)). This makes it possible to appropriately prevent the roller 36 from interfering with the object when the build thickness Tb is thicker than the design thickness Td. Although not shown in the drawings, when the build thickness Tb is thinner than the design thickness Td, the target height Ra is lowered by correcting with the difference ΔTb, so that flattening by the roller 36 can be appropriately performed. Furthermore, in this embodiment, when the object to be built is the final layer (for example, when the top layer in FIG. 13 (FIG. 12) is the final layer), the difference ΔTb between the build thickness Tb and the design thickness Td is calculated, and the target height Ra of the roller 36 is not corrected, but the flattened layer is built at the target thickness Ta corrected by the difference ΔTb (see FIG. 13(2)). As a result, even if the build thickness Tb during the process is thicker or thinner than the design thickness Td, the build thickness Tb (finished thickness) when the final layer is built can be adjusted to the original design thickness Td.

[0044] Here, in the modeling process, a pedestal portion BP may be formed using resin ink ejected from the first inkjet head 31. FIG. 14 is an explanatory diagram showing an example of a modeling location including the pedestal portion BP. For example, after the resin layer B1 is modeled, the pedestal portion BP is modeled in a substantially circular shape with a predetermined thickness in a top view so as to partially protrude from the resin layer B1. Note that each mark M is modeled to have the same thickness as the resin layer B1. Note that each mark M may also be modeled to have the same thickness as the pedestal portion BP. Thereafter, a circuit C1 (wiring) is modeled on the resin layer B1. The circuit C1 is modeled to cover the pedestal portion BP. Furthermore, the resin layer B2 is modeled so that the circuit C1 is exposed in the portion covering the pedestal portion BP. At this time, the designed thickness of the resin layer B2 is greater than the thickness of the pedestal portion BP. After the resin layer B2 is modeled, the circuit C2 is modeled on the resin layer B2. The circuit C2 is shaped so as to be electrically connected to the exposed portion of the circuit C1. A component Pa is mounted on this circuit C2. The terminals of the component Pa are electrically connected to the circuit C2 via bump electrodes Bu formed from the conductive paste dispensed from the first dispenser head 41.

[0045] In this way, the base portion BP (hereinafter, including a portion of the circuit C1 covering the base portion BP) is shaped to partially protrude above the resin layer B1. If such a base portion BP is present, interference between the base portion BP and the roller 36 is likely to occur depending on the degree of deformation of the stage 61 when the resin layer B2 is being shaped. In this embodiment, the target height Ra of the roller 36 is corrected by a correction process based on the stage height and a correction process based on the shaping height, so interference between the base portion BP and the roller 36 can be appropriately prevented.

[0046] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The roller lifting unit 37 and the stage lifting unit 62 of this embodiment correspond to the lifting unit of the present disclosure, the height sensor 45 corresponds to the measurement unit, the control unit 20 that executes S115 (correction process based on stage height) and S125 (correction process based on modeling height) of the modeling process corresponds to the setting unit, and the control unit 20 that executes S130 of the modeling process corresponds to the lifting control unit. Note that this embodiment also clarifies an example of a modeling method of the present disclosure by explaining the operation of the modeling apparatus 10.

[0047] In the object-forming apparatus 10 of the present embodiment described above, the target height Ra of the roller 36 (flattening member) is set to a height based on the target thickness Ta of the flattening layer (base layer B), corrected based on the measured value of the height of the upper surface of the stage 61 (pallet P), and the roller 36 is set to the target height Ra. This makes it possible to appropriately prevent interference between the object and the roller 36, and ensure the shape and dimensional accuracy of the object, even if the stage 61 is deformed.

[0048] Furthermore, in the modeling device 10, the height sensor 45 measures the top surface height of each measurement point S (S1 to S4) set at the four corners outside the modeling area on the stage 61 (pallet P). Therefore, even if the degree of deformation such as distortion or tilt varies depending on the position of the top surface of the stage 61, interference between the modeled object and the roller 36 can be appropriately prevented.

[0049] Furthermore, in the modeling apparatus 10, when modeling the first flattening layer, the height sensor 45 measures the top surface height before the first flattening process in that modeling. Then, the target height Ra is set by adding an initial difference ΔSa between the reference height Sa determined based on the measurements of each measurement point S and the highest measurement value to the sum of the reference height Sa and the target thickness Ta. Therefore, even if a relatively large initial difference ΔSa occurs in the initial state, flattening by the roller 36 can be performed appropriately.

[0050] Furthermore, in the modeling apparatus 10, when the second or subsequent flattening layers are modeled, the height sensor 45 measures the top surface height before the first flattening process in that modeling. Then, the target height Ra is set by adding the maximum height change ΔSb, among the height changes for each measurement point S between the measurement value at each measurement point S and the measurement value when the previous target height Ra' was set, to the sum of the target height Ra' and the target thickness Ta. Therefore, even if the degree of deformation of the stage 61 has changed since the previous time, flattening by the rollers 36 can be performed appropriately.

[0051] Furthermore, in the modeling apparatus 10, before the first discharge process in modeling the flattened layer, the height sensor 45 measures the upper surface height to correct the target height Ra, and the roller 36 is set to the target height Ra by the time the first flattening process begins. Therefore, there is no need to measure the upper surface height before the flattening process after the discharge process, and the flattening process can be started quickly after the discharge process, thereby shortening the processing time from the discharge process to the curing process.

[0052] Furthermore, in the molding apparatus 10, the roller 36 is maintained at the target height Ra until molding of one flattened layer is completed. Therefore, compared to setting the target height Ra each time a flattening process is performed when molding one flattened layer, it is possible to prevent time loss due to measurement by the height sensor 45 and height adjustment of the roller 36.

[0053] Furthermore, in the modeling apparatus 10, the height sensor 45 measures the top surface height at least before the discharge process in modeling the next planarization layer after the circuit has been modeled. Here, in the hardening process of the circuit, the stage 61 (pallet P) is also heated by baking, which causes deformation and the degree of deformation is likely to change, so it is very significant to measure the top surface height and correct the target height Ra in modeling the planarization layer after the circuit has been modeled.

[0054] Furthermore, in the modeling apparatus 10, when modeling the second or subsequent flattening layer, the height sensor 45 measures the surface height of the base layer B in addition to the top surface height of the stage 61, and the target height Ra can be set to a height that is further corrected based on the modeling thickness Tb calculated from the measured top surface height Sb and the measured surface height Mb. Therefore, when the modeling thickness Tb is thicker than the design thickness Td, it is possible to appropriately prevent the rollers 36 from interfering with the model.

[0055] Furthermore, the modeling apparatus 10 performs the discharge process by correcting the target thickness Ta of the flattening layer based on the modeling thickness Tb so that the model is formed according to the design value. Therefore, even if the modeling thickness Tb of the base material layer B during modeling becomes larger or smaller than the design thickness Td, the finished thickness can be made according to the design value.

[0056] Furthermore, in the discharging process, the modeling apparatus 10 forms a mark M (mark portion) outside the modeling area that has the same thickness as the base material layer B, and causes the height sensor 45 to measure the surface height of the mark M as the surface height of the base material layer B. Therefore, even when a contact-type height sensor 45 is used, the modeling thickness Tb can be obtained without touching the surface of the model (base material layer B).

[0057] It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be embodied in various forms as long as they fall within the technical scope of the present disclosure.

[0058] In the above-described embodiment, in steps S440 to S460 of the correction process based on the build height, the target height Ra of the roller 36 is corrected for the intermediate layer, and the target thickness Ta of the planarizing layer is corrected for the final layer. However, this is not limited to this. For example, the process may determine whether to correct the target height Ra of the roller 36 or the target thickness Ta of the planarizing layer based on instructions from the operator. The process may also be determined based on the positive or negative value of the difference ΔTb or the extent to which it deviates from the predetermined range. Furthermore, although steps S440 to S460 are executed when the difference ΔTb is outside the predetermined range in step S430, steps S440 to S460 may be executed regardless of the value of the difference ΔTb, and step S430 may be omitted. Furthermore, steps S430, S440, and S460 may be omitted, and the target height Ra may be corrected without correcting the target thickness Ta. Alternatively, the processes of S430, S440, and S450 may be omitted by correcting the target thickness Ta without correcting the target height Ra. Note that the correction target in one correction process is not limited to either the target height Ra or the target thickness Ta, and may be both.

[0059] In the embodiment, the mark M is formed and the surface height of the mark M is measured, but this is not limiting, and the actual surface height of the base material layer B may be measured without forming the mark M.

[0060] In the embodiment, the roller 36 is maintained at the target height Ra until the formation of one flattening layer is completed, but this is not limited to this. For example, in the formation of one flattening layer, as the number of times the resin ink is ejected increases up to a predetermined number (i times), the target height Ra of the roller 36 may be raised by the thickness of the resin ink. In this case, correction processing based on the stage height and correction processing based on the modeling height may be performed on the target height Ra, as in the embodiment.

[0061] In the embodiment, the correction process based on the stage height is performed at least at the timing before the discharge process in forming the next planarization layer after the circuit is formed, but this is not limited to this. For example, the correction process at this timing may be omitted in consideration of the heating conditions when the circuit (wiring) is formed.

[0062] In the embodiment, the height of the upper surface of the stage 61 is measured before the first discharge process in forming the flattening layer, and the target height Ra is corrected, but this is not limited to this. For example, the height of the upper surface of the stage 61 may be measured after the first discharge process and before the first flattening process, and the target height Ra may be corrected.

[0063] In the embodiment, in the molding of the first flattening layer, the target height Ra is corrected by adding the initial difference ΔSa between the reference height Sa and the highest measured value to the sum of the reference height Sa and the target thickness Ta, but this is not limited to this. Any processing may be used as long as it reflects the initial difference ΔSa in the correction of the target height Ra. Furthermore, because the initial difference ΔSa is often relatively small, the correction using the initial difference ΔSa may be omitted, for example, based on instructions from the operator.

[0064] In the embodiment, in the modeling of the second and subsequent flattening layers, the target height Ra is corrected by adding the maximum height change amount ΔSb among the height changes for each measurement point S to the sum of the previous target height Ra' and target thickness Ta, but this is not limited to this. Any processing may be used as long as it reflects the height change amount ΔSb in the correction of the target height Ra. Alternatively, the processing is not limited to deriving the height change amount ΔSb from the previous time, and the target height Ra may be corrected by deriving the height change amount relative to the reference height Sa.

[0065] In the embodiment, four measurement points S are illustrated as an example. However, this is not limited thereto. Three or more measurement points S may be set. At least three measurement points S may be set. Outside the printing area on the stage 61 (printing table), at least three measurement points S may be set in the vicinity of at least two of the four sides of the rectangle. Preferably, the measurement points S set in the vicinity of the same side are set at positions spaced apart (for example, positions near both ends of the side). While the stage 61 and the pallet P are rectangular in top view, this is not limiting and other shapes may be used. For convenience, the measurement of the top surface height of the stage 61 has been described. However, the measurement of the top surface height of the pallet P or the top surface height of the film F may also be performed. In practice, when the top surface height of the stage 61 is measured, processing is required to reflect the thickness of the pallet P or the film F in the measurement value. When the top surface height of the pallet P is measured, processing is required to reflect the thickness of the film F in the measurement value. Therefore, to avoid complex processing, it is preferable to measure the top surface height of the film F. Furthermore, since the film F is not essential, it is preferable to measure the top surface height of the pallet P when the film F is not used. In this way, the "top surface height of the modeling table" is not limited to the top surface height of the stage 61, but also includes the top surface height of the pallet (flat member) P and the top surface height of the film F attached to the pallet P.

[0066] In the embodiment, both the correction process based on the stage height and the correction process based on the modeling height can be executed, but this is not limited to this, and only one of the correction processes may be executed. For example, the processes of S120 and S125 in the modeling process may be omitted, and only the correction process based on the stage height may be executed. Furthermore, the processes of S110 and S115 in the modeling process may be omitted, and only the correction process based on the modeling height may be executed.

[0067] The present disclosure may be configured as follows. For example, the second modeling apparatus of the present disclosure may include: A modeling apparatus that performs additive manufacturing of a model including a base layer on a modeling table by repeatedly performing a fluid discharging process, a flattening process, and a hardening process, a lifting unit that lifts and lowers a flattening member used in the flattening process relative to the modeling table; a measuring unit for measuring the height position of an object; a setting unit that causes the measuring unit to measure the height of an upper surface of the modeling table and the height of a surface of the modeled base layer, calculates a modeling thickness of the base layer from the measured values ​​of the upper surface height and the surface height, and sets a target height of the flattening member relative to the modeling table that is a height based on the target thickness of the base layer, corrected based on the modeling thickness of the base layer; and a lifting control unit that controls the lifting unit so as to raise the flattening member to the target height; The gist of the project is to provide the following:

[0068] In a second modeling apparatus according to the present disclosure, the target height of the flattening member relative to the modeling table is set to a height based on the target thickness of the base layer, corrected based on the modeling thickness of the base layer. The lifting unit is then controlled to raise the flattening member to the target height. This makes it possible to appropriately prevent interference between the model and the flattening member and ensure the shape and dimensional accuracy of the model, even when the modeling thickness of the base layer differs from the target thickness.

[0069] The molding method of the present disclosure includes: A manufacturing method for layer-by-layer manufacturing of a model including a base layer on a modeling table by repeatedly performing a fluid discharging process, a flattening process, and a hardening process, the method comprising: (a) causing a measuring unit to measure the height of the upper surface of the modeling table; (b) setting a target height of a flattening member used in the flattening process relative to the building table, the height being obtained by correcting a height based on the target thickness of the base material layer based on the measured value of the upper surface height; (c) raising and lowering the flattening member relative to the build table so that the flattening member reaches the target height; The gist is that it includes the following.

[0070] In the modeling method according to the present disclosure, similar to the modeling apparatus according to the present disclosure described above, even if the modeling table is deformed, such as warped upward, interference between the model and the flattening member can be appropriately prevented, thereby ensuring the shape and dimensional accuracy of the model. In this modeling method, various aspects of the modeling apparatus according to the present disclosure or the second modeling apparatus described above may be employed, or a step that realizes the function of any of the modeling apparatus according to the present disclosure or the second modeling apparatus may be added.

[0071] A second modeling method of the present disclosure includes: A manufacturing method for layer-by-layer manufacturing of a model including a base layer on a modeling table by repeatedly performing a fluid discharging process, a flattening process, and a hardening process, the method comprising: (a) causing a measuring unit to measure the height of an upper surface of the modeling table and the height of a surface of the modeled base material layer, and calculating a modeling thickness of the base material layer from the measured values ​​of the upper surface height and the measured values ​​of the surface height; (b) setting a target height of a flattening member used in the flattening process relative to the building table to a height obtained by correcting a height based on the target thickness of the base material layer based on a building thickness of the base material layer; (c) raising and lowering the flattening member relative to the build table so that the flattening member reaches the target height; The gist is that it includes the following.

[0072] In the second modeling method of the present disclosure, similar to the second modeling apparatus of the present disclosure described above, even when the modeling thickness of the base material layer differs from the target thickness, interference between the model and the flattening member can be appropriately prevented, thereby ensuring the shape accuracy and dimensional accuracy of the model. In this second modeling method, various aspects of the modeling apparatus or the second modeling apparatus described above may be adopted, or a step that realizes the function of any of the modeling apparatus or the second modeling apparatus of the present disclosure may be added.

[0073] This specification also discloses the technical idea of ​​changing the "modeling apparatus according to claim 3" in claim 4, which was originally filed, to "the modeling apparatus according to any one of claims 1 to 3," the technical idea of ​​changing the "modeling apparatus according to claim 1 or 2" in claim 5, which was originally filed, to "the modeling apparatus according to any one of claims 1 to 4," the technical idea of ​​changing the "modeling apparatus according to claim 5" in claim 6, which was originally filed, to "the modeling apparatus according to any one of claims 1 to 5," the technical idea of ​​changing the "modeling apparatus according to claim 1 or 2" in claim 7, which was originally filed, to "the modeling apparatus according to any one of claims 1 to 6," the technical idea of ​​changing the "modeling apparatus according to claim 1" in claim 8, which was originally filed, to "the modeling apparatus according to any one of claims 1 to 7," and the technical idea of ​​changing the "modeling apparatus according to claim 8 or 9" in claim 11, which was originally filed, to "the modeling apparatus according to any one of claims 8 to 10." [Industrial Applicability]

[0074] The present disclosure is applicable to the technical field of additive manufacturing of a shaped object involving a planarization process using a planarizing member. [Explanation of symbols]

[0075] 1 Production system, 10 3D modeling device, 11 Y-axis rail, 12 Housing, 20 Control unit, 20a CPU, 20b ROM, 20c RAM, 20d Timer, 22 Memory unit, 24 Communication unit, 26, 88 Operation panel, 30 First discharge unit, 31 First inkjet head, 32 Second inkjet head, 33, 43 X-axis moving unit, 35 Flattening unit, 36 Roller, 37 Roller lifting unit, 40 Second discharge unit, 41 First dispenser head, 42 Second dispenser head, 45 Height sensor, 47 UV irradiation unit, 48 Upper surface heating unit, 49 Press heating unit, 50 Transport unit, 52 Belt conveyor, 60 Stage unit, 61 Stage, 62 Stage lifting unit, 64 Y-axis moving unit, 70 First transfer unit, 71, 76 Pusher lifting unit, 72, 77 X-axis moving part, 75 second transfer unit, 80 mounting device, 81 transport unit, 82 component supply unit, 83 mounting head, 85 XY-axis moving part, 86 parts camera, 87 nozzle stocker, B base material layer, BP pedestal part, Bu bump electrode, C circuit, P pallet, Pa component.

Claims

1. A modeling apparatus that performs additive manufacturing of a model including a base layer on a modeling table by repeatedly performing a fluid discharging process, a flattening process, and a hardening process, a lifting unit that lifts and lowers a flattening member used in the flattening process relative to the modeling table; a measuring unit for measuring the height position of an object; a setting unit that causes the measuring unit to measure the height of an upper surface of the modeling table, and sets a target height of the flattening member relative to the modeling table, the height being obtained by correcting a height based on the target thickness of the base material layer based on the measured value of the upper surface height; a lifting control unit that controls the lifting unit so as to raise the flattening member to the target height; A molding apparatus comprising:

2. The building platform is formed in a rectangular shape when viewed from above, the setting unit causes the measuring unit to measure the top surface heights of at least three measurement points set in areas near at least two of the four sides of the rectangle outside the printing area on the printing table; The molding apparatus according to claim 1 .

3. In the modeling of a first layer of the base material layer, the setting unit causes the measurement unit to measure the top surface heights of a plurality of measurement points before the initial flattening process of the modeling of the first layer, and sets the target height to a height corrected by adding a difference between a reference height determined based on the measurement values ​​of the plurality of measurement points and the highest measurement value among the plurality of measurement points to a sum of the reference height and a target thickness of the base material layer. The molding apparatus according to claim 1 or 2.

4. In the modeling of the second or subsequent layer of the base material layer, the setting unit causes the measurement unit to measure the upper surface heights of the plurality of measurement points by the time of the first planarization process of the modeling of the second or subsequent layer, and sets the target height to a height corrected by adding the maximum amount of change for each of the measurement points between the measurement values ​​of the plurality of measurement points and the measurement values ​​when the target height was previously set to the sum of the previous target height and the target thickness of the base material layer. The molding apparatus according to claim 3 .

5. the setting unit causes the measuring unit to measure the upper surface height and set the target height before the first discharging process in the modeling of the base material layer; the lifting control unit controls the lifting unit so that the flattening member reaches the target height by the start of the first flattening process in the modeling of the base material layer. The molding apparatus according to claim 1 or 2.

6. the lifting control unit controls the lifting unit to maintain the flattening member at the target height until the formation of one layer of the base material layer is completed. The molding apparatus according to claim 5 .

7. the modeling device models a circuit on the base material layer by repeatedly performing a discharging process and a curing process; the setting unit causes the measuring unit to measure the upper surface height at least before the dispensing process in modeling of the next base material layer after the circuit is modeled, The molding apparatus according to claim 1 or 2.

8. In the modeling of the second or subsequent layer of the base material layer, the setting unit is capable of causing the measuring unit to measure the surface height of the modeled base material layer in addition to the top surface height, and setting the target height to a height further corrected based on a modeling thickness of the base material layer calculated from the measured value of the top surface height and the measured value of the surface height. The molding apparatus according to claim 1 .

9. A modeling apparatus that performs additive manufacturing of a model including a base layer on a modeling table by repeatedly performing a fluid discharging process, a flattening process, and a hardening process, a lifting unit that lifts and lowers a flattening member used in the flattening process relative to the modeling table; a measuring unit for measuring the height position of an object; a setting unit that causes the measuring unit to measure the height of an upper surface of the modeling table and the height of a surface of the modeled base layer, calculates a modeling thickness of the base layer from the measured values ​​of the upper surface height and the surface height, and sets a target height of the flattening member relative to the modeling table that is a height based on the target thickness of the base layer, corrected based on the modeling thickness of the base layer; and a lifting control unit that controls the lifting unit so as to raise the flattening member to the target height; A molding apparatus comprising:

10. the modeling device performs the discharging process by correcting a target thickness of the base material layer based on the modeling thickness so that the modeled object is modeled according to a design value. The molding apparatus according to claim 8 or 9.

11. In the discharging process, the modeling device forms a predetermined mark portion having the same thickness as the base material layer outside the modeling area on the modeling table, the setting unit causes the measuring unit to measure the surface height of the mark portion as the surface height; The molding apparatus according to claim 8 or 9.

12. A manufacturing method for layer-by-layer manufacturing of a model including a base layer on a modeling table by repeatedly performing a fluid discharging process, a flattening process, and a hardening process, the method comprising: (a) causing a measuring unit to measure the height of the upper surface of the modeling table; (b) setting a target height of a flattening member used in the flattening process relative to the building table, the height being obtained by correcting a height based on the target thickness of the base material layer based on the measured value of the upper surface height; (c) raising and lowering the flattening member relative to the build table so that the flattening member reaches the target height; A molding method including:

13. A manufacturing method for layer-by-layer manufacturing of a model including a base layer on a modeling table by repeatedly performing a fluid discharging process, a flattening process, and a hardening process, the method comprising: (a) measuring the height of an upper surface of the modeling table and the height of a surface of the modeled base material layer with a measuring unit, and calculating a modeling thickness of the base material layer from the measured values ​​of the upper surface height and the measured values ​​of the surface height; (b) setting a target height of a flattening member used in the flattening process relative to the building table to a height obtained by correcting a height based on the target thickness of the base material layer based on a building thickness of the base material layer; (c) raising and lowering the flattening member relative to the build table so that the flattening member reaches the target height; A molding method including:

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