Cutting device

Abstract

To shorten the cleaning time of a wafer.SOLUTION: A cutting device (1) comprises: a chuck table (21) that holds a wafer (W); a cutting mechanism (50) that cuts the wafer using a rotating cutting blade (54); an X-axis moving mechanism (15) that moves the chuck table and the cutting mechanism relative to each other in the cutting feed direction of the cutting blade; a cutting water nozzle (58) that supplies cutting water (L) to the wafer and the cutting blade; and a duct (70) that causes the cutting water subjected to the centrifugal force of the cutting blade to flow rearward in the cutting feed direction from a machining point (K) where the cutting blade contacts the wafer. The duct is formed into a tubular shape by an inclined plate (75) connected to a bottom plate (74) and inclined obliquely upward, two side plates (77) connected to the bottom plate and the inclined plate, and a top plate (76) connecting the two side plates, and has an inlet (71) that allows cutting water to enter from the front side in the cutting feed direction, and an outlet (72) that discharges the cutting water from the rear side. The outlet opens at an angle of 85 to 90 degrees relative to the inclined plate.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a cutting device that cuts a wafer with a cutting blade. [Background technology]

[0002] Patent Documents 1 and 2 disclose cutting devices that cut wafers with a cutting blade while supplying cutting water. The cutting devices in Patent Documents 1 and 2 are equipped with a straightening plate to prevent the cutting water, which contains cutting chips that are subjected to the centrifugal force of the rotating cutting blade, from adhering to the wafer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2021-178394 [Patent Document 2] Japanese Patent Application Publication No. 06-224297 Summary of the Invention [Problem to be solved by the invention]

[0004] However, some of the spray that hits the straightening plate turns into droplets and drips onto the wafer being processed, contaminating the top surface of the wafer, which results in a problem of longer cleaning times in the spinner cleaning device that cleans the processed wafers, resulting in reduced productivity.

[0005] The present invention has been made in view of the above points, and one of its objects is to provide a cutting device that can shorten the time required to clean a wafer. [Means for solving the problem]

[0006] One embodiment of the cutting device of the present invention is a cutting device comprising: a chuck table that holds a wafer with a holding surface; a cutting mechanism that cuts the wafer with a rotating cutting blade; a cutting feed mechanism that moves the chuck table and the cutting mechanism relatively in the cutting feed direction of the cutting blade; and a cutting water supply unit that supplies cutting water to the wafer and the cutting blade. The cutting water is subjected to centrifugal force by the cutting blade and is provided with a duct that flows rearward in the cutting feed direction from the processing point where the cutting blade contacts the wafer. The duct is formed in a cylindrical shape by a bottom plate parallel to the holding surface, an inclined plate connected to the rear end of the bottom plate in the cutting feed direction and inclined diagonally upward, two opposing side plates connected to the bottom plate and the inclined plate, and a top plate connecting the upper ends of the two side plates. The duct has an inlet for introducing the cutting water from the front in the cutting feed direction and an outlet for discharging the cutting water from the rear in the cutting feed direction, and the outlet opens at an angle of 85 to 90 degrees relative to the inclined plate. [Effects of the Invention]

[0007] According to the present invention, the outlet of the duct opens at an angle of 85 to 90 degrees relative to the inclined plate, so that the cutting water subjected to the centrifugal force of the cutting blade can fly in a parabolic arc in the cutting feed direction, so as to jump over the wafer. This prevents cutting water containing cutting debris from adhering to the top surface of the cut wafer, and shortens the time required to clean the wafer. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic perspective view of a cutting device according to an embodiment. [Figure 2] FIG. 2A is a schematic perspective view of a cutting mechanism and a duct in the embodiment, and FIG. 2B is a schematic perspective view of the duct. [Figure 3] FIG. 2 is a side view of a cutting mechanism and a duct according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, a cutting device 1 according to this embodiment will be described with reference to the accompanying drawings. Note that the cutting device 1 according to this embodiment is not limited to the configuration shown below and can be modified as appropriate. For the sake of convenience, some components are omitted in FIG. 1.

[0010] First, the overall configuration of the cutting device 1 will be described with reference to Fig. 1. Fig. 1 is a schematic perspective view of the cutting device in the embodiment. The X-axis direction (cutting feed direction, front-rear direction), Y-axis direction (indexing feed direction, left-right direction), and Z-axis direction (cutting feed direction, height direction) used in the following description are perpendicular to one another. Of the two arrows indicating the X-axis direction, the +X side is the front and the -X side is the rear. Of the two arrows indicating the Y-axis direction, the +Y side is the left and the -Y side is the right. Of the two arrows indicating the Z-axis direction, the +Z side is the up and the -Z side is the down.

[0011] As shown in FIG. 1, the cutting device 1 is configured to cut a wafer W held on a chuck table 21 using a cutting blade 54 of a cutting mechanism 50 (see FIG. 2) provided above the chuck table 21.

[0012] The wafer W is a disk-shaped wafer made of a semiconductor such as silicon. The front surface (upper surface) of the wafer W is divided into a plurality of regions by a plurality of mutually intersecting planned dividing lines (streets), and devices such as ICs (Integrated Circuits) are formed in each of the divided regions.

[0013] For example, a tape (dicing tape) T having a diameter larger than that of the wafer W is attached to the back surface (lower surface) of the wafer W. The outer periphery of the tape T is fixed to an annular frame F that surrounds the wafer W. In this way, the wafer W is cut while supported by the frame F via the tape T so that the front surface side is exposed.

[0014] In this embodiment, the wafer W is a disk-shaped wafer made of a semiconductor such as silicon, but there are no limitations on the material, shape, structure, size, etc. of the wafer W. For example, a substrate made of other semiconductors, ceramics, resin, metal, etc. may also be used as the wafer W.

[0015] Similarly, there are no restrictions on the type, number, shape, structure, size, arrangement, etc. of devices formed on the wafer W. Devices do not have to be formed on the wafer W. Also, the wafer W may be processed in a state where the tape T is not attached, where the wafer W is not supported by the frame F, etc.

[0016] An X-axis movement mechanism (cutting feed mechanism) 15 that moves the chuck table 21 in the X-axis direction, which is the cutting feed direction of the cutting blade 54, is disposed on the base 11. The X-axis movement mechanism 15 has a pair of guide rails 16 that are arranged on the base 11 and are parallel to the X-axis direction, and an X-axis table 17 that is slidably mounted on the pair of guide rails 16. A nut portion (not shown) is formed on the back side of the X-axis table 17, and a feed screw 18 is threadedly engaged with this nut portion. When a drive motor 19 connected to one end of the feed screw 18 is driven to rotate, the chuck table 21 is fed for cutting along the pair of guide rails 16 in the X-axis direction. This allows the X-axis movement mechanism 15 to move the chuck table 21 and the cutting mechanism 50 relatively in the X-axis direction.

[0017] A chuck table 21 for holding the wafer W and a rotation mechanism 22 are provided on the X-axis table 17. The chuck table 21 has a holding surface 23 made of a porous ceramic material that is formed parallel to the horizontal plane, and the wafer W is held by suction due to the negative pressure generated on the holding surface 23.

[0018] Four clamps 25 are arranged around the chuck table 21 to fix from all sides an annular frame F that supports the wafer W. The X-axis moving mechanism 15, including the X-axis table 17, is covered from above by a table cover and a bellows-like cover (neither of which are shown). However, the chuck table 21, the clamps 25, etc. are exposed above the respective covers.

[0019] A water case 27 is provided around the X-axis moving mechanism 15 to temporarily store waste cutting water used when cutting the wafer W. The waste water stored in the water case 27 is discharged to the outside of the cutting device 1 via a drain (not shown) or the like.

[0020] The rotation mechanism 22 is composed of a motor disposed below the chuck table 21, a rotation shaft whose axial direction is in the Z-axis direction (vertical direction), and the like, and rotates the chuck table 21 around the center of the holding surface 23. In addition, a gate-shaped upright wall portion 12 is provided on the upper surface of the base 11 so as to straddle the movement path of the chuck table 21.

[0021] The standing wall portion 12 is provided with a Y-axis movement mechanism 31 that moves the pair of cutting mechanisms 50 in the Y-axis direction. The standing wall portion 12 is also provided with a pair of Z-axis movement mechanisms 41 that are provided to move each of the pair of cutting mechanisms 50 independently in the Z-axis direction.

[0022] The Y-axis movement mechanism 31 has a pair of guide rails 34 that are parallel to the Y-axis direction and are arranged on the front surface of the standing wall portion 12, and a pair of Y-axis tables 35 that are slidably installed on the pair of guide rails 34. A nut portion (not shown) is formed on the rear side of the Y-axis table 35, and a feed screw 36 is threadedly engaged with the nut portion. A drive motor 37 is connected to one end of the feed screw 36 for the Y-axis table 35. The feed screw 36 is rotated by the drive motor 37, thereby moving each Z-axis movement mechanism 41 and each cutting mechanism 50 along the guide rails 34 in the Y-axis direction.

[0023] Each Z-axis movement mechanism 41 has a pair of guide rails 44 arranged on the Y-axis table 35 and parallel to the Z-axis direction, and a Z-axis table 45 slidably installed on the pair of guide rails 44. A nut portion (not shown) is formed on the rear side of the Z-axis table 45, and a feed screw 46 is threadedly engaged with the nut portion. A drive motor 47 is connected to one end of the feed screw 46 for the Z-axis table 45. The drive motor 47 rotates the feed screw 46, causing the Z-axis table 45 to move (up and down) along the guide rails 44 in the Z-axis direction.

[0024] A camera 48 used to capture an image of the wafer W or the like and a cutting mechanism 50 used to cut the wafer W are fixed to the bottom of each Z-axis table 45. By moving the Y-axis table 35 in the Y-axis direction by the Y-axis moving mechanism 31, the camera 48 and the cutting mechanism 50 are moved in the Y-axis direction (indexing feed). In addition, by moving the Z-axis table 45 in the Z-axis direction by each Z-axis moving mechanism 41, the camera 48 and the cutting mechanism 50 are moved in the Z-axis direction (cutting feed).

[0025] A processing chamber (not shown) is formed on the upper part of the base 11. When cutting the wafer W, the chuck table 21, cutting mechanism 50, etc. are housed inside this processing chamber. A duct unit is connected to the processing chamber, for example, which can suck in atomized cutting water generated inside and discharge it to the outside of the processing chamber. In addition, the upper part of the base 11 is covered by a housing cover (not shown) which can house the above-mentioned processing chamber.

[0026] The cutting device 1 is provided with a control unit 49 that controls all parts of the device. The control unit 49 is composed of a processor that executes various processes, a memory, etc. The control unit 49 controls various operations such as cutting by the cutting mechanism 50, including driving the movement mechanisms 15, 31, and 41, in accordance with a control program stored in the memory.

[0027] Next, the cutting mechanism 50 will be described. Fig. 2A is a schematic perspective view of the cutting mechanism and a duct. As shown in Fig. 2A, the cutting mechanism 50 includes a cylindrical spindle housing 51. A spindle 52, which serves as a rotation axis generally parallel to the Y-axis direction, is rotatably held in the spindle housing 51.

[0028] An annular cutting blade 54 is attached to one end of the spindle 52 via a disk-shaped mounter 53 or the like. The cutting blade 54 is formed, for example, by fixing abrasive grains such as diamond with a binder such as resin or metal, and is capable of cutting into the wafer W. A rotational drive source (not shown) such as a motor is connected to the other end of the spindle 52, and the cutting blade 54 attached to one end of the spindle 52 rotates in a rotational direction R1 by a force transmitted from the rotational drive source. In the cutting mechanism 50, the rotating cutting blade 54 cuts the wafer W.

[0029] A blade cover 56 is provided on one end of the spindle housing 51 so as to surround the outer periphery of the cutting blade 54 when it is attached to the spindle 52. A cutting water inlet 57 is provided on the upper part of the blade cover 56.

[0030] A cutting water nozzle (cutting water supply unit) 58 is provided at the bottom of the blade cover 56, supplying cutting water to the wafer W and the cutting blade 54 during cutting. The cutting water nozzle 58 is an L-shaped pipe, and FIG. 2A and FIG. 3, which will be described later, show a portion extending horizontally from the middle to the tip. The cutting water nozzles 58 are arranged in a pair on either side of the cutting blade 54 in the Y-axis direction, and one of the cutting water nozzles 58 is not shown. Cutting water is supplied to each cutting water nozzle 58 via a cutting water inlet 57. When cutting the wafer W, cutting water is sprayed from the pair of cutting water nozzles 58 onto the cutting blade 54. For example, water (pure water) or a liquid in which chemicals are added to water is used as the cutting water.

[0031] Fig. 3 is a side view of the cutting mechanism and duct. As shown in Fig. 3, the blade cover 56 is formed in a block shape, and has a recess 60 that is arc-shaped in cross section on the underside to accommodate the cutting blade 54. Therefore, the recess 60 is disposed above the upper region of the cutting blade 54 with a predetermined clearance, and the lower region of the cutting blade 54 protrudes downward from the lower opening of the recess 60.

[0032] More specifically, when viewed from the side (Y-axis direction), the recess 60 covers a range of approximately 180° in the circumferential direction of the upper part of the cutting blade 54, and a front end 61 (end on the +X side) of the recess 60 is located below the center of the cutting blade 54. Moreover, an end of a rear end 62 (end on the -X side) of the recess 60 is located above the center of the cutting blade 54. A sloped surface 63 is formed continuously at the rear end 62 of the recess 60, and the sloped surface 63 is formed to be approximately parallel to the radial direction of the cutting blade 54 and to gradually slope upward from the rear end 62 toward the rear. In addition, an injection port (cutting water supply part) 611 is provided at the front end 61 of the recess 60 to inject cutting water onto the tip of the cutting blade 54, and cutting water supplied from the cutting water inlet 610 is sprayed onto the cutting blade 54.

[0033] A duct 70 is provided at the rear lower portion of the blade cover 56 to suppress scattering of cutting water caused by the rotation of the cutting blade 54. Fig. 2B is a schematic perspective view of the duct.

[0034] 2B, the duct 70 is formed in a cylindrical shape that opens roughly in the cutting feed direction (X-axis direction), with an inlet 71 for letting in cutting water L at the front of the cutting feed direction (+X direction) and an outlet 72 for letting out cutting water L at the rear of the cutting feed direction (-X direction). The duct 70 is positioned so that the center position in the Y-axis direction of the duct 70 and the center position in the Y-axis direction of the cutting blade 54 are aligned.

[0035] The duct 70 is formed into a cylindrical shape and includes a bottom plate 74, an inclined plate 75, a top plate 76, two side plates 77, and a canopy 78.

[0036] The bottom plate 74 is oriented horizontally and is approximately parallel to the holding surface 23 of the chuck table 21. The bottom plate 74 is positioned above the lower end of the cutting blade 54 and below the cutting water nozzle 58. The front end of the bottom plate 74 is positioned rearward from the outer circumferential edge of the cutting blade 54 with a slight gap therebetween.

[0037] The inclined plate 75 is connected to the rear end of the bottom plate 74 and is inclined obliquely upward from the connection position. The inclination angle θ1 of the inclined plate 75 is set within a range of 30 to 45 degrees with respect to the horizontal plane H. In this embodiment, since the holding surface 23 of the chuck table 21 is parallel to the horizontal plane H, even when the holding surface 23 is used as the reference for the inclination angle θ1, the angle range is the same as that described above.

[0038] The top plate 76 is connected to the rear end of the inclined surface 63 of the blade cover 56 and is disposed on the same plane as the inclined surface 63. Therefore, the top plate 76 extends in a direction that gradually slopes upward toward the rear, and is formed so that the vertical separation width between the top plate 76 and the inclined plate 75 gradually decreases toward the rear.

[0039] The two side plates 77 are provided parallel to the ZX plane, formed with the same surface shape, and arranged facing each other in the Y-axis direction. The two side plates 77 are connected to both ends of the bottom plate 74, the inclined plate 75, and the top plate 76 in the Y-axis direction. The upper ends 771 of the two side plates 77 are connected by the top plate 76. The curved lower ends 772 of the two side plates 77 are connected by the bottom plate 74 and the inclined plate 75, and are formed into a curved shape corresponding to the intersection angle between the bottom plate 74 and the inclined plate 75 when viewed from the side (Y-axis direction). The rear end of the lower ends 772 is located forward of the rear end of the inclined plate 75; in other words, the rear end side of the inclined plate 75 is arranged so as to protrude rearward from an outlet-forming end 774 (described later) of the side plate 77.

[0040] Each of the two side plates 77 has an inlet forming end 773 at the front that forms the inlet 71, and an outlet forming end 774 at the rear that forms the outlet 72. The inlet forming end 773 slopes obliquely upward as it extends rearward, and extends approximately parallel to the inclined plate 75 when viewed from the side. The inlet forming ends 773 of the two side plates 77 form both sides of the inlet 71 in the Y-axis direction.

[0041] The outlet forming end 774 connects the rear ends of the upper end 771 and the lower end 772 and extends obliquely upward as it moves forward. The outlet forming ends 774 of the two side plates 77 form both sides of the outlet 72 in the Y-axis direction. When viewed from the side, the included angle of the outlet forming end 774 with respect to the inclined plate 75 is the angle θ2 between the inclined plate 75 and the opening of the outlet 72, and this angle θ2 is set to be 85 to 90 degrees (greater than or equal to 85 degrees and less than or equal to 90 degrees).

[0042] The canopy 78 is connected to the rear end of the top plate 76 in a continuous manner, and is disposed above the outlet 72. The width of the canopy 78 in the Y-axis direction is set to be the same as that of the top plate 76. The position of the rear end (tip) of the canopy 78 in the X-axis direction and the position of the rear end of the inclined plate 75 are disposed so as to be substantially aligned.

[0043] When the cutting device 1 cuts the wafer W, the control unit 49 controls the driving of the X-axis moving mechanism 15, the rotation mechanism 22, the Y-axis moving mechanism 31, and the Z-axis moving mechanism 41. Through this control, the relative positions of the chuck table 21 and the cutting blade 54 in the X-axis and Y-axis directions are adjusted, and the cutting blade 54 is positioned above the end of the planned dividing line of the wafer W.

[0044] Next, while rotating the cutting blade 54, the cutting mechanism 50 is moved downward (cutting feed) by the Z-axis moving mechanism 41, and the rotating cutting blade 54 cuts into the wafer W held on the holding surface 23 of the chuck table 21. As shown in Fig. 3, the processing point K is the range where the cutting blade 54 comes into contact with and cuts into the wafer W.

[0045] While the cutting blade 54 is cutting into the wafer W at the processing point K, the chuck table 21 is moved in the X-axis direction (cutting feed direction) by the X-axis movement mechanism 15. As a result, the chuck table 21 and the cutting mechanism 50 are moved relatively in the X-axis direction, and the wafer W is cut along the planned dividing line extending in the X-axis direction.

[0046] When cutting along one planned dividing line is completed, the Z-axis moving mechanism 41 moves the cutting mechanism 50 upward, and the cutting blade 54 is separated from the wafer W. Thereafter, the Y-axis moving mechanism 31 moves the Y-axis table 35 in the Y-axis direction (indexing feed), and the cutting blade 54 is positioned above the end of the next uncut planned dividing line. Then, in the same manner as above, the Z-axis moving mechanism 41 moves the cutting blade 54 downward, and then the X-axis moving mechanism 15 moves the chuck table 21 in the X-axis direction, and the wafer W is cut along the planned dividing line.

[0047] When cutting along all the planned dividing lines aligned in the Y-axis direction is completed, the chuck table 21 is rotated 90 degrees by the rotation mechanism 22. As a result, a plurality of uncut planned dividing lines are aligned in the Y-axis direction (extending toward the X-axis direction) on the wafer W on the chuck table 21. Then, in the same manner as above, cutting is performed sequentially along all the uncut planned dividing lines.

[0048] During cutting of the wafer W by the cutting mechanism 50, the cutting blade 54 rotates at high speed in the rotation direction R1. Therefore, the cutting water L supplied from the cutting water nozzle 58 is subjected to centrifugal force by the cutting blade 54, and is scattered backward from the vicinity of the processing point K. Here, in this embodiment, the duct 70 is provided, so that the cutting water L flows backward from the processing point K in the cutting feed direction (X-axis direction).

[0049] To further explain the flow of the cutting water L, the cutting water L splashing backward from the processing point K enters the inlet 71 of the duct 70 and is introduced into the duct 70. The cutting water L introduced into the duct 70 flows backward above the bottom plate 74, is guided diagonally upward from below by the inclined plate 75, and is then held down from above by the top plate 76. The angle θ2 between the opening of the outlet 72 of the duct 70 and the inclined plate 75 is 85 to 90 degrees, so the cutting water L flowing through the duct 70 flows (splashes) backward in the cutting feed direction, drawing a parabola and jumping over the wafer W, as shown in FIG. 3. This prevents the cutting water L containing cutting debris from adhering to the top surface of the cut wafer W, shortens the cleaning time in the spinner cleaning device that cleans the wafer W, and improves productivity. Note that the cutting water L indicated by the arrow in FIG. 3 shows a portion of the cutting water L rising diagonally backward in the parabola.

[0050] Furthermore, since the cutting water L follows a parabolic trajectory and jumps over the wafer W before falling, the cutting water L is prevented from bouncing off the sides of the processing chamber (not shown) that houses the chuck table 21, cutting mechanism 50, etc., and the amount of spray that splashes into the processing chamber is reduced.

[0051] Furthermore, by opening the outlet 72 at an angle of 85 to 90 degrees relative to the inclined plate 75, dripping of the cutting water L from the outlet 72 to the outside of the duct 70 can be suppressed, which also prevents the cutting water L from adhering to the top surface of the wafer W.

[0052] Here, the above-mentioned action and effect can be more effectively achieved by setting the inclination angle θ1 of the inclined plate 75 within the range of 30 to 45 degrees with respect to the horizontal plane H. If the inclination angle θ1 is set to be less than 30 degrees, more cutting water L will drip from the outlet 72, and if the inclination angle θ1 is set to be greater than 45 degrees, the spray (mist) will rise upward and the amount of spray will increase.

[0053] In addition, since a canopy 78 is positioned above the outlet 72 of the duct 70, even if the scattered cutting water L becomes a fine spray, it can be made to fall into the duct 70 as droplets that condense on or near the surface of the canopy 78, thereby also reducing the amount of spray that scatters into the machining chamber.

[0054] Furthermore, a bottom plate 74 parallel to the holding surface 23 is formed in the duct 70, and the front end of the bottom plate 74 is positioned as close as possible to the outer periphery of the cutting blade 54, thereby reducing the amount of spray that scatters and preventing cutting water L from dripping outside the duct 70.

[0055] Furthermore, since the rear end of the eave 78 and the rear end of the inclined plate 75 are aligned in the vertical direction, even if cutting water L adhering to the eave 78 falls, it can be received by the inclined plate 75, which also prevents the cutting water L from dripping outside the duct 70.

[0056] Furthermore, the inclined plate 75 and the top plate 76 are configured to be inclined so that the vertical width of the internal space gradually decreases from the inlet 71 of the duct 70 toward the outlet 72. This makes it possible to adjust the direction and flight distance of the cutting water L flowing from the duct 70 by adjusting the inclination angle of the inclined plate 75 and the top plate 76 according to conditions such as the amount of cutting water L supplied, the diameter of the cutting blade 54, and the rotation speed.

[0057] The above-mentioned moving mechanisms 15, 31, 41 can be variously modified, such as by using a cylinder or a linear motor, as long as they can move the object to be moved in the same manner as in the above-mentioned embodiment.

[0058] Furthermore, the embodiments of the present invention are not limited to the above-described embodiments and modifications, and may be variously changed, substituted, or modified within the scope of the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0059] As described above, the present invention has the effect of preventing the cutting water subjected to the centrifugal force of the cutting blade from adhering to the upper surface of the wafer, thereby shortening the time required to clean the wafer. [Explanation of symbols]

[0060] 1:Cutting device 15: X-axis movement mechanism (cutting feed mechanism) 21: Chuck table 23: Holding surface 50: Cutting mechanism 54: Cutting blade 58: Cutting water nozzle (cutting water supply part) 611: Jet port (cutting water supply part) 70: Duct 71: Entrance 72: Exit 74:Bottom plate 75: Inclined plate 76: Top plate 77: Side panel 78: Eaves K: Machining point L: Cutting water W: wafer θ1: Inclination angle

Claims

1. A cutting device comprising: a chuck table that holds a wafer by a holding surface; a cutting mechanism that cuts the wafer with a rotating cutting blade; a cutting feed mechanism that moves the chuck table and the cutting mechanism relatively in a cutting feed direction of the cutting blade; and a cutting water supply unit that supplies cutting water to the wafer and the cutting blade, a duct for causing the cutting water subjected to centrifugal force by the cutting blade to flow rearward in the cutting feed direction from the processing point where the cutting blade comes into contact with the wafer; The duct is a cylindrical shape formed by a bottom plate parallel to the holding surface, an inclined plate connected to the rear end of the bottom plate in the cutting feed direction and inclined obliquely upward, two opposing side plates connected to the bottom plate and the inclined plate, and a top plate connecting the upper ends of the two side plates, and having an inlet for introducing the cutting water from the front in the cutting feed direction and an outlet for discharging the cutting water from the rear in the cutting feed direction, The outlet of the cutting device opens at an angle of 85 to 90 degrees relative to the inclined plate.

2. 2. The cutting device according to claim 1, further comprising a canopy above the outlet.

3. 2. The cutting device according to claim 1, wherein the inclination angle of the inclined plate is within a range of 30 degrees to 45 degrees with respect to the holding surface.

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