Processing device

Abstract

To provide a processing device which can accurately detect vibration during processing.SOLUTION: A processing device 1 includes, at least, holding tables for holding workpieces and a rough grinding unit 10 and a finish grinding unit 20 having grinding spindles 12, 22, spindle housings 14, 24 respectively supporting the spindles 12, 22 in a rotatable manner, and grinding wheels respectively fixed to lower ends of the spindles 12, 22. The processing device 1 includes vibration detection sensors 90 at upper ends of the spindles 12, 22 of the grinding units 10, 20.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a processing device. [Background technology]

[0002] Wafers, which have multiple devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) formed on their surface, have their back surfaces ground to a specified thickness, and then are divided into individual devices using a dividing machine, which are then used in electrical equipment such as mobile phones and personal computers.

[0003] The grinding process for grinding the back surface of the wafer uses a known grinding device, and a grinding wheel (hereinafter referred to as a processing tool) is attached to the spindle of the grinding device to process the wafer to a predetermined thickness through rough grinding and finish grinding (see, for example, Patent Document 1).

[0004] In cutting and grinding processes (hereinafter referred to as processing equipment), if there is an abnormality in the condition of the processing tool (such as blemishes in the grinding wheel) or an abnormality in the processing load, appropriate processing cannot be performed, resulting in processing defects.

[0005] To solve this problem, a processing device has been developed and put into practical use in which an AE (Acoustic Emission) sensor is arranged in a mount for fixing a processing tool to the tip of the processing unit of the processing device, to detect vibrations when an abnormality occurs during processing (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-288881 [Patent Document 2] Japanese Patent Application Laid-Open No. 2016-150394 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in the case of Patent Document 2, if the AE sensor is disposed on the mount of the processing unit, the wiring to the AE sensor must be disposed inside the processing unit, which raises concerns about the influence of vibration loss.

[0008] Therefore, there was a problem that vibrations during machining could not be detected with high accuracy.

[0009] An object of the present invention is to provide a machining apparatus that can detect vibrations during machining with high accuracy. [Means for solving the problem]

[0010] In order to solve the above-mentioned problems and achieve the object, the processing apparatus of the present invention includes at least a processing unit having a holding table for holding a workpiece, a spindle, a housing for rotatably supporting the spindle, and a processing tool fixed to one end of the spindle, and is characterized by having a vibration detection sensor at the other end of the spindle. [Effects of the Invention]

[0011] The present invention has an effect of being able to detect vibrations occurring during machining with high precision. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view schematically illustrating an example of the configuration of a processing device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view schematically showing a workpiece to be processed by the processing device shown in FIG. [Figure 3] FIG. 3 is a cross-sectional view schematically showing the configuration of a rough grinding unit and a finish grinding unit of the grinding apparatus shown in FIG. [Figure 4] FIG. 4 is a cross-sectional view schematically showing the configuration of the upper ends of the rough grinding unit and the finish grinding unit shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0014] [Embodiment 1] A processing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view schematically showing an example of the configuration of the processing apparatus according to the first embodiment. FIG. 2 is a perspective view schematically showing a workpiece to be processed by the processing apparatus shown in FIG. 1. FIG. 3 is a cross-sectional view schematically showing the configuration of a rough grinding unit and a finish grinding unit of the grinding apparatus shown in FIG. 1. FIG. 4 is a cross-sectional view schematically showing the configuration of the upper ends of the rough grinding unit and the finish grinding unit shown in FIG. 3.

[0015] (Workpiece) The processing apparatus 1 shown in Fig. 1 according to the first embodiment is a grinding apparatus that grinds a workpiece 200 shown in Fig. 2. The workpiece 200 to be processed by the processing apparatus 1 shown in Fig. 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, whose substrate is made of silicon, sapphire, gallium, or the like. The workpiece 200 has devices (not shown) formed in each region defined by planned dividing lines set in a grid pattern on a surface 201 of the substrate shown in Fig. 2.

[0016] The device is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), a MEMS (Micro Electro Mechanical Systems), or a semiconductor memory (storage device).

[0017] In addition, in embodiment 1, the workpiece 200 has the back surface 202 behind the front surface 201 ground by the processing device 1 to thin it to a predetermined finished thickness, and then is divided into individual devices along the planned division lines.

[0018] 2, the workpiece 200 has a surface protection tape 210 attached to its surface 201 to protect devices. Note that in the present invention, the workpiece 200 does not necessarily have to have devices formed on its surface 201, and the surface protection tape 210 does not necessarily have to be attached to its surface 201.

[0019] (Processing equipment) The processing apparatus 1 is a grinding apparatus that grinds the back surface 202 of the workpiece 200 to thin the workpiece 200 to a predetermined finish thickness. As shown in Fig. 1, the processing apparatus 1 includes an apparatus base 2, a turntable 5, a plurality of (three in the first embodiment) holding tables 6 installed on the turntable 5, a rough grinding unit 10, a finish grinding unit 20, a grinding feed unit 30, a cassette mounting table 8, an alignment unit 40, a transport unit 50, a cleaning unit 60, and a control unit 100.

[0020] The turntable 5 is a disk-shaped table provided on the upper surface of the device base 2, and is rotatable about an axis parallel to the Z-axis direction in a horizontal plane, and is rotationally driven at a predetermined timing. The Z-axis direction is parallel to the vertical direction. On the turntable 5, for example, three holding tables 6 are arranged at equal intervals, for example, at a phase angle of 120 degrees. That is, the turntable 5 has multiple holding tables 6 arranged at equal angles (120 degrees in the first embodiment) in the circumferential direction.

[0021] The upper surfaces of these three holding tables 6 are made of a porous material such as porous ceramics, and serve as holding surfaces 61 on which the workpiece 200 is placed via surface protection tape 210. That is, the holding tables 6 have holding surfaces 61. The holding surfaces 61 of the holding tables 6 are connected to a suction source (not shown), and the holding surfaces 61 are sucked by the suction source, thereby suction-holding the workpiece 200 placed on the holding surfaces 61 to the holding surfaces 61 via the surface protection tape 210.

[0022] During grinding, the holding table 6 is rotated by a rotation mechanism about an axis parallel to the Z-axis direction. By the rotation of the turntable 5, the holding table 6 is moved sequentially to a carry-in / out position 301, a rough grinding position 302, a finish grinding position 303, and again to the carry-in / out position 301. That is, by rotating about its axis, the turntable 5 positions each holding table 6 at the predetermined grinding positions 302, 303.

[0023] The loading / unloading position 301 is an area where the workpiece 200 is loaded onto or unloaded from the holding table 6, the rough grinding position 302 is an area where the rough grinding unit 10 performs rough grinding (corresponding to grinding) on ​​the workpiece 200 held on the holding table 6, and the finish grinding position 303 is an area where the finish grinding unit 20 performs finish grinding (corresponding to grinding) on ​​the workpiece 200 held on the holding table 6.

[0024] The rough grinding unit 10 is a processing unit that is disposed above the holding table 6 positioned at the rough grinding position 302, and is equipped with a rough grinding wheel 11 having an annular arrangement of rough grinding grinding stones 112 for rough grinding the exposed back surface 202 of the workpiece 200 held by the holding table 6, and that performs rough grinding of the back surface 202 of the workpiece 200 held on the holding surface 61 of the holding table 6 at the rough grinding position 302. The finish grinding unit 20 is disposed above the holding table 6 positioned at the finish grinding position 303, and is equipped with a finish grinding wheel 21 having an annular arrangement of finish grinding grinding stones 212 for finish grinding the back surface 202 of the workpiece 200 held by the holding table 6, and that performs finish grinding of the back surface 202 of the workpiece 200 held on the holding surface 61 of the holding table 6 at the finish grinding position 303.

[0025] The grinding units 10 and 20 are supported via a grinding feed unit 30 on an upright column 3 erected from one end of the device base 2 in the Y-axis direction parallel to the horizontal direction. As shown in Fig. 3, the grinding units 10 and 20 have spindles 12 and 22 arranged to extend along the Z-axis direction, spindle motors 13 and 23 that rotate the spindle 22 about its axis, spindle housings 14 and 24 (corresponding to housings) that support the spindle 22 rotatably about its axis, and grinding wheels 11 and 21 (corresponding to processing tools).

[0026] The spindles 12, 22 are formed in a cylindrical shape with their axes aligned along the Z-axis direction, which is the vertical direction. The spindle 22 has a disk-shaped mount 121, 221 at its lower end, which is one of its tips, to which the grinding wheels 11, 21 can be fixed. In other words, the grinding wheels 11, 21 are fixed to the lower ends of the spindles 12, 22. The spindles 12, 22 are arranged coaxially with the mounts 121, 221.

[0027] In the first embodiment, as shown in FIG. 3, the spindles 12, 22 include cylindrical portions 122, 222 arranged coaxially with each other, and disk-shaped portions 123, 223 provided in the center of the cylindrical portions 122, 222 and having a larger diameter than the cylindrical portions 122, 222.

[0028] The spindle motors 13, 23 are attached to the upper ends (corresponding to the other ends) of the spindles 12, 22. In the first embodiment, the spindle motors 13, 23 include rotors (not shown) attached to the outer peripheral surfaces of the cylindrical portions 122, 222 of the spindles 12, 22, and stators 132, 232 attached to the inner peripheral surfaces of the spindle housings 14, 24. When power is applied to the coils of the stators 132, 232, the rotors, i.e., the spindles 12, 22, rotate around their axes.

[0029] The spindle housings 14, 24 are cylindrically formed and include cylindrical portions 141, 241 that house the columnar portions 122, 222 and disk portions 123, 223 of the spindles 12, 22 inside with the lower and upper ends of the spindles 12, 22 exposed, and covers 142, 242 that are attached to the base ends of the cylindrical portions 141, 241 and cover the upper ends of the spindles 12, 22. The spindle housings 14, 24 support the spindles 12, 22 rotatably about their axes via air bearings 16, 26.

[0030] The air bearings 16, 26 include a plurality of air outlets 161, 261 and air supply passages 162, 262 that are provided in the spindle housings 14, 24 and communicate with the air outlets 161, 261. Some of the air outlets 161, 261 open to the inner circumferential surface of the cylindrical portions 141, 241 of the spindle housings 14, 24 and face the outer circumferential surface of the central portions of the columnar portions 122, 222 of the spindles 12, 22. The remaining air outlets 161, 261 open to the inner circumferential surface of the accommodation portions 143, 243 that accommodate the disk portions 123, 223 inside the cylindrical portions 141, 241 of the spindle housings 14, 24 and face both surfaces of the disk portions 123, 223 of the spindles 12, 22.

[0031] The air supply passages 162, 262 are passages provided in the spindle housings 14, 24, and are supplied with compressed air from air supply sources 163, 263. The air bearings 16, 26 eject the compressed air supplied from the air supply sources 163, 263 through the air supply passages 162, 262 and from the air outlets 161, 261, thereby supporting the spindles 12, 22 rotatably about their axes.

[0032] The grinding wheels 11, 21 are fixed to the underside of the mounts 121, 221. The grinding wheels 11, 21 include a wheel base 111, 211 formed in an annular shape and fixed to the underside of the mounts 121, 221, and a plurality of grinding stones 112, 212 arranged in an annular shape on the underside of the wheel base 111, 211. The grinding stones 112, 212 are arranged at equal intervals in the circumferential direction of the wheel base 111, 211, and are fixed to the underside of the wheel base 111, 211 in plurality.

[0033] The grinding wheels 112, 212 are configured as a single so-called segment grinding wheel formed into a single mass by mixing abrasive grains such as diamond or CBN (Cubic Boron Nitride) with a bonding material (also called a bond material) made of metal, ceramic, resin, etc. The grinding wheels 112, 212 grind the back surface 202 of the workpiece 200. In the first embodiment, the diameter of the circle formed by connecting the outer edges of the grinding wheels 212 is equal to the outer diameter of the workpiece 200, but it does not have to be equal.

[0034] In the grinding units 10, 20, the grinding wheels 11, 21 are fixed to mounts 121, 221 provided at the lower ends of the spindles 12, 22 using bolts or the like, and the grinding stones 112, 212 of the grinding wheels 11, 21 are arranged facing the holding surface 61 of the holding table 6. In the grinding units 10, 20, the spindles 12, 22 and the grinding wheels 11, 21 are rotated about their axes by the spindle motors 13, 23, and grinding water is supplied to the back surface 202 of the workpiece 200 held on the holding table 6 at grinding positions 302, 303, while the grinding stones 112, 212 are moved closer to the holding table 6 at a predetermined feed rate by the grinding feed unit 30, thereby roughly grinding or finish grinding the back surface 202 of the workpiece 200.

[0035] The grinding feed unit 30 moves the grinding units 10, 20 in the Z-axis direction, thereby moving the grinding units 10, 20 relatively closer to and farther away from the holding table 6. In the first embodiment, the grinding feed unit 30 is mounted on an upright column 3 that stands from one end of the device base 2 in the Y-axis direction, which is parallel to the horizontal direction. The grinding feed unit 30 includes a well-known ball screw that is rotatable about its axis, a well-known motor that rotates the ball screw about its axis, and well-known guide rails that support the spindle housings 14, 24 of the grinding units 10, 20 so that they are movable in the Z-axis direction.

[0036] In embodiment 1, the rough grinding unit 10 and the finish grinding unit 20 are arranged such that the axes of the grinding wheels 11, 21, which are the centers of rotation, and the axes of the holding table 6, which are the centers of rotation, are parallel to each other and spaced apart horizontally, and the grinding wheels 112, 212 pass over the center of the back surface 202 of the workpiece 200 held on the holding table 6.

[0037] The cassette 7 is placed on the cassette placing table 8. The cassette 7 is a storage container having a plurality of slots for storing a plurality of workpieces 200. The cassette 7 stores a plurality of workpieces 200 before and after grinding. In the first embodiment, a pair of cassette placing tables 8 are provided, and a cassette 7 is placed on each of them. The cassette placing tables 8 support the cassette 7 so that it can be raised and lowered along the Z-axis direction. The alignment unit 40 is a table on which the workpiece 200 removed from the cassette 7 is temporarily placed and its center is aligned.

[0038] The transport unit 50 transports the workpiece 200. The transport unit 50 includes a carry-in unit 51, a carry-out unit 52, and a carry-in / out unit 53.

[0039] The carry-in unit 51 has a suction pad 511 at its tip end that adsorbs the workpiece 200, and is formed in the shape of an arm that is provided on the device base 2 so as to be able to swing freely around its base end. The carry-in unit 51 adsorbs and holds the workpiece 200 before grinding, which has been aligned by the alignment unit 40, onto the holding table 6 located at the carry-in / out position 301.

[0040] The carry-out unit 52 has a suction pad 521 at its tip end for suctioning the workpiece 200, and is formed in the shape of an arm that is provided on the apparatus base 2 so as to be able to swing freely around its base end. The carry-out unit 52 suction-holds the ground workpiece 200 on the holding table 6 located at the carry-in / out position 301 to the suction pad 521, and carries it out to the cleaning unit 60.

[0041] The carry-in / out unit 53 takes out the workpiece 200 before grinding from the cassette 7 and transports it to the alignment unit 40, and also takes out the workpiece 200 after grinding from the cleaning unit 60 and transports it to the cassette 7. The carry-in / out unit 53 is, for example, a robot pick equipped with a U-shaped hand, and uses the U-shaped hand to suction-hold and transport the workpiece 200.

[0042] The cleaning unit 60 cleans the workpiece 200 after grinding, and removes contamination such as grinding dust adhering to the back surface 202 that has been ground.

[0043] 3 and 4, the processing device 1 is also equipped with a vibration detection sensor 90. The vibration detection sensor 90 is provided at the upper ends of the spindles 12 and 22. The vibration detection sensor 90 includes a piezoelectric element 91 disposed within the spindles 12 and 22, a rotating-side coil 92 provided on the end faces of the upper ends of the spindles 12 and 22 and connected to the piezoelectric element 91, and a fixed-side coil 93 provided on the inner surfaces of the covers 142 and 242 opposite the rotating-side coil 92.

[0044] The piezoelectric element 91 is deformed by the vibration of the spindles 12 and 22, and generates a voltage according to the vibration of the spindles 12 and 22. The voltage generated by the piezoelectric element 91 changes periodically as the spindles 12 and 22 vibrate.

[0045] The rotating side coil 92 and the fixed side coil 93 are well-known coils. The rotating side coil 92 generates a magnetic flux that changes periodically with the vibration of the spindles 12, 22 due to the voltage generated by the piezoelectric element 91. The rotating side coil 92 is connected to the control unit 100, and electromagnetic induction occurs between the rotating side coil 92 and the rotating side coil 93, and the magnetic flux generated by the rotating side coil 92 generates an induced current that changes periodically with the vibration of the spindles 12, 22. The fixed side coil 93 outputs the generated induced current to the control unit 100.

[0046] The vibration detection sensor 90 detects vibration of the spindles 12, 22 by outputting to the control unit 100 an induced current that periodically changes due to vibration of the spindles 12, 22 from the fixed-side coil 93. In this way, the vibration detection sensor 90 is a so-called AE (Acoustic Emission) sensor that detects vibration of the spindles 12, 22.

[0047] The control unit 100 controls each of the above-mentioned constituent units constituting the processing apparatus 1, causing the processing apparatus 1 to execute processing operations on the workpiece 200. The control unit 100 is a computer having an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device.

[0048] The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the processing device 1 to the above-mentioned components of the processing device 1 via the input / output interface device. The control unit 100 is also connected to a display unit configured with a liquid crystal display device or the like that displays the status and images of the processing operation, an input unit that the operator uses to register processing content information, and a notification unit that notifies the operator.

[0049] The input unit is composed of at least one of a touch panel provided on the display unit, a keyboard, etc. The notification unit notifies the operator by emitting at least one of sound, light, and a message on the touch panel.

[0050] Furthermore, the control unit 100 calculates the frequency and amplitude of the vibration of the spindles 12, 22 based on the induced current from the fixed-side coil 93 of the vibration detection sensor 90, and stores the calculated frequency and amplitude of the vibration of the spindles 12, 22.

[0051] Next, a description will be given of the processing operation of the processing device 1. In the first embodiment, the operator places the cassette 7 containing the workpiece 200 on the cassette mounting table 8 of the device base 2 with the back surface 202 facing upward in the processing device 1. The processing device 1 starts the processing operation when the processing conditions are registered in the control unit 100 and the control unit 100 receives an instruction from the operator to start the processing operation.

[0052] In the first embodiment, in the processing operation, the control unit 100 of the processing apparatus 1 rotates the spindles 12, 22 of the grinding units 10, 20 around their axes at rotation speeds determined by the processing conditions. In the first embodiment, in the processing operation, the processing apparatus 1 causes the carry-in / out unit 53 to take out one workpiece 200 from one of the cassettes 7 and carry it into the alignment unit 40, and causes the alignment unit 40 to align the center of the workpiece 200.

[0053] In the processing operation of the first embodiment, the control unit 100 of the processing device 1 causes the workpiece 200, which is aligned with the suction pad 511 of the carry-in unit 51, to be sucked and held thereon, and causes the carry-in unit 51 to carry it onto the holding surface 61 of the holding table 6 located at the carry-in / out position 301. In the processing operation of the first embodiment, the control unit 100 causes the workpiece 200 to be sucked and held onto the holding surface 61 of the holding table 6 located at the carry-in / out position 301, via the surface protection tape 210.

[0054] In the first embodiment, in a processing operation, the control unit 100 of the processing apparatus 1 rotates the turntable 5 to move the holding table 6 holding the workpiece 200 at the carry-in / out position 301 to the rough grinding position 302. In the first embodiment, in a processing operation, the control unit 100 of the processing apparatus 1 rotates the holding table 6 about its axis, supplies grinding water, and rough grinds the workpiece 200 with the rough grinding unit 10. In the first embodiment, in a processing operation, the control unit 100 of the processing apparatus 1 rough grinds the workpiece 200, and then rotates the turntable 5 to move the holding table 6 holding the workpiece 200 after rough grinding to the finish grinding position 303.

[0055] In the first embodiment, in the processing operation, the control unit 100 of the processing apparatus 1 supplies grinding water and the finish grinding unit 20 finish-grinds the workpiece 200. In the first embodiment, in the processing operation, the control unit 100 finish-grinds the workpiece 200, and then the processing apparatus 1 rotates the turntable 5 to move the holding table 6, which holds the workpiece 200 after the finish grinding and whose rotation around its axis has stopped, to the carry-in / out position 301.

[0056] In the first embodiment, during the processing operation, the processing device 1 stops the rotation and suction holding of the holding table 6 located at the carry-in / out position 301. In the first embodiment, during the processing operation, the control unit 100 causes the carry-out unit 52 to transport the workpiece 200 after finish grinding from the holding table 6 at the carry-in / out position 301 to the cleaning unit 60, where it is cleaned and dried, and then the carry-in / out unit 53 stores it in the cassette 7.

[0057] In addition, each time the control unit 100 rotates the turntable 5 by 120 degrees, the processing device 1 transports the workpiece 200 from the holding table 6 at the loading / unloading position 301, which holds the workpiece 200 after finish grinding, to the cleaning unit 60, loads the workpiece 200 before grinding onto the holding table 6 located at the loading / unloading position 301, roughly grinds the workpiece 200 before grinding held on the holding table 6 at the rough grinding position 302, and finishes grinding the workpiece 200 after rough grinding held on the holding table 6 at the finish grinding position 303.

[0058] In this way, the processing apparatus 1 cleans, carries out, and carries in the workpiece 200 to the holding table 6 at the carry-in / out position 301 every time the control unit 100 rotates the turntable 5 by 120 degrees, and positions the workpiece 200 held on the holding surface 61 of the holding table 6 at the rough grinding position 302 and the finish grinding position 303 in that order, and performs rough grinding and finish grinding in that order. When the control unit 100 has performed rough grinding and finish grinding on all of the workpieces 200 in the cassette 7, the processing operation of the processing apparatus 1 ends.

[0059] As described above, the processing device 1 of embodiment 1 is equipped with a vibration detection sensor 90 at the upper end of the spindle 12, 22, so that the vibration of the processing point and the grinding wheels 11, 21 can be detected directly by the vibration detection sensor 90 without the need to run wiring through the grinding units 10, 20.

[0060] As a result, the processing device 1 according to the first embodiment has the effect of being able to detect vibrations during grinding with high precision.

[0061] Furthermore, in the processing device 1 according to the first embodiment, the vibration detection sensor 90 includes a rotating-side coil 92 connected to a piezoelectric element 91 disposed inside the spindle 12, 22, and a fixed-side coil 93 that generates electromagnetic induction between the rotating-side coil 92 and is provided on the inner surface of the cover 142, 242. As a result, the processing device 1 according to the first embodiment can detect the vibration of the spindle 12, 22, i.e., the grinding wheels 11, 21, without running wiring between the cover 142, 242 and the spindle 12, 22.

[0062] The present invention is not limited to the above-described embodiment, and can be implemented in various modifications without departing from the gist of the present invention. [Explanation of symbols]

[0063] 1 Processing equipment 6 Holding table 10 Rough grinding unit (processing unit) 11 Grinding wheels (machining tools) 12 spindles 14 Spindle housing (housing) 20 Finish grinding unit (processing unit) 21 Grinding wheels (machining tools) 22 Spindle 24 Spindle housing (housing) 90 Vibration detection sensor 200 Workpiece

Claims

[Claim 1] a holding table for holding the workpiece; a machining unit having a spindle, a housing that rotatably supports the spindle, and a machining tool fixed to one end of the spindle; At least a vibration detection sensor provided at the other end of the spindle; Processing equipment.

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