Inductor component

Abstract

To provide an inductor component in which direct current resistance is reduced while damage to a cover insulation layer is reduced.SOLUTION: An inductor component includes: a base insulation layer having a base upper surface; a first wall portion provided on the base upper surface and extending around a turning axis in an up-down direction; a second wall portion provided on the base upper surface and extending parallel to the first wall portion around the turning axis; a wiring conductor located between the first and second wall portions on the base upper surface and having a conductor upper surface opposite in the up-down direction to a surface of the wiring conductor in contact with the base insulation layer; a cover insulation layer laminated on the conductor upper surface; and a magnetic body. The cover insulation layer includes a cover portion overlapping the wiring conductor in plan view and a protruding portion located on an opposite side of the first wall portion from the cover portion in a radial direction of the turning axis. A thickness of the protruding portion is greater than that of the cover portion.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to inductor components. [Background technology]

[0002] Patent Document 1 discloses a magnetic coil including first, second, and third magnetic members, a plurality of conductor layers disposed between the first and second magnetic members, and a plurality of insulating resin layers disposed between the plurality of conductor layers. Each of the plurality of conductor layers includes a spiral pattern wound in a spiral shape. The third magnetic member is embedded in an inner diameter region of the spiral pattern. The plurality of insulating resin layers have protruding portions protruding into the inner diameter region. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-152043 Summary of the Invention [Problem to be solved by the invention]

[0004] The coil component of Patent Document 1 still has room for improvement in terms of reducing DC resistance while suppressing damage to the insulating coating layer.

[0005] An object of the present disclosure is to provide an inductor component that can reduce DC resistance while suppressing damage to a coating insulating layer. [Means for solving the problem]

[0006] An inductor component according to one aspect of the present disclosure includes: a base insulating layer having a base top surface; a first wall portion provided on the upper surface of the base and extending around a pivot axis along a vertical direction intersecting the upper surface of the base; a second wall portion provided on the upper surface of the base portion and extending parallel to the first wall portion around the pivot axis; a wiring conductor located between the first wall portion and the second wall portion on the base upper surface, the wiring conductor having a conductor upper surface that is the opposite surface to the surface that contacts the base insulating layer in the vertical direction; a covering insulating layer laminated on the upper surface of the conductor; a magnetic body covering the base insulating layer, the first wall portion, the second wall portion, the wiring conductor, and the covering insulating layer; Equipped with The covering insulating layer is a covering portion overlapping the wiring conductor in a plan view seen from the top-bottom direction; a protruding portion located on the opposite side of the covering portion with respect to the first wall portion in a radial direction relative to the pivot shaft; and The thickness of the protrusion is greater than the thickness of the covering portion. [Effects of the Invention]

[0007] According to the inductor component of the above aspect, it is possible to reduce the DC resistance while suppressing damage to the covering insulating layer. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view illustrating an inductor component according to one embodiment of the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] 2 is a schematic plan view illustrating layers of a first inductor wiring and a third inductor wiring of the inductor component of FIG. 1. FIG. [Figure 4] 2 is a schematic plan view illustrating layers of a second inductor wiring and a fourth inductor wiring of the inductor component of FIG. 1. FIG. [Figure 5] FIG. 3 is an enlarged cross-sectional view of a region Z1 shown in FIG. 2. [Figure 6] Cross-sectional view taken along line VI-VI in Figure 1. [Figure 7] FIG. 6 is an enlarged cross-sectional view of a region Z2 shown in FIG. 5. [Figure 8] FIG. 6 is an enlarged cross-sectional view of a region Z3 shown in FIG. 5. [Figure 9]FIG. 7 is an enlarged cross-sectional view of a region Z4 shown in FIG. 6. [Figure 10] FIG. 2 is a cross-sectional view showing a first modified example of the inductor component of FIG. [Figure 11] 1. FIG. 4 is a cross-sectional view showing a second modified example of the inductor component of FIG. [Figure 12] FIG. 2 is a cross-sectional view showing a third modified example of the inductor component of FIG. [Figure 13] FIG. 2 is a first diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1; [Figure 14] FIG. 2 is a second diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 15] FIG. 3 is a third diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 16] FIG. 4 is a fourth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 17] 1. FIG. 5 is a fifth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 18] FIG. 6 is a sixth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 19] 7 is a seventh diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1. FIG. [Figure 20] 8 is an eighth diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1; [Figure 21] 9 is a ninth diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1. FIG. [Figure 22] FIG. 19 is a tenth diagram illustrating an example of a method for manufacturing the inductor component of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] Various aspects of the present disclosure will now be described.

[0010] According to a first aspect of the present disclosure, a base insulating layer having a base top surface; a first wall portion provided on the upper surface of the base and extending around a pivot axis along a vertical direction intersecting the upper surface of the base; a second wall portion provided on the upper surface of the base portion and extending parallel to the first wall portion around the pivot axis; a wiring conductor located between the first wall portion and the second wall portion on the base upper surface, the wiring conductor having a conductor upper surface that is the opposite surface to the surface that contacts the base insulating layer in the vertical direction; a covering insulating layer laminated on the upper surface of the conductor; a magnetic body covering the base insulating layer, the first wall portion, the second wall portion, the wiring conductor, and the covering insulating layer; Equipped with The covering insulating layer is a covering portion overlapping the wiring conductor in a plan view seen from the top-bottom direction; a protruding portion located on the opposite side of the covering portion with respect to the first wall portion in a radial direction relative to the pivot shaft; and a thickness of the protrusion in the up-down direction that is greater than the thickness of the covering portion; An inductor component is provided.

[0011] A second aspect of the present disclosure provides the inductor component according to the first aspect, wherein the thickness of the first wall portion and the second wall portion is greater than the thickness of the wiring conductor.

[0012] According to a third aspect of the present disclosure, the first wall portion has an inner wall surface that contacts the wiring conductor and an outer wall surface that is the opposite surface to the inner wall surface and contacts the magnetic body; The covering insulating layer has a covering side surface facing the radial direction and positioned closer to the second wall portion in the radial direction than the outer wall surface. The inductor component according to the first or second aspect is provided.

[0013] According to a fourth aspect of the present disclosure, the covering insulating layer has a covering lower surface facing the base insulating layer in the vertical direction and a covering upper surface that is the surface opposite to the covering lower surface, The upper coated surface is smoother than the lower coated surface. The inductor component according to any one of the first to third aspects is provided.

[0014] According to a fifth aspect of the present disclosure, the covering portion has a covering portion lower surface that contacts the wiring conductor, the protrusion has a protrusion lower surface facing the base insulating layer in the up-down direction, The surface roughness of the lower surface of the covering portion is different from the surface roughness of the lower surface of the protrusion portion. According to a fourth aspect, there is provided an inductor component.

[0015] According to a sixth aspect of the present disclosure, The protrusion has a protrusion side surface facing the radial direction, the side surface of the protrusion has a plurality of straight line portions with different inclinations in a cross section intersecting with the direction in which the wiring conductor extends; The inductor component according to any one of the first to fifth aspects is provided.

[0016] According to a seventh aspect of the present disclosure, The protrusion has a protrusion side surface facing the radial direction, the side surface of the protrusion has a straight portion and a curved portion in a cross section intersecting with the direction in which the wiring conductor extends; The inductor component according to any one of the first to sixth aspects is provided.

[0017] According to an eighth aspect of the present disclosure, the protrusion has a protrusion lower surface facing the base insulating layer in the up-down direction, the lower surface of the protrusion has an inclined portion that is inclined upward in the radial direction toward the first wall portion in a cross section intersecting with the direction in which the wiring conductor extends, The inductor component according to any one of the first to seventh aspects is provided.

[0018] According to a ninth aspect of the present disclosure, the covering insulating layer has a covering lower surface facing the base insulating layer in the vertical direction and a covering upper surface that is the surface opposite to the covering lower surface, a third wall portion provided on the upper surface of the coating and extending around the pivot axis; a fourth wall portion provided on the upper surface of the coating and extending parallel to the third wall portion around the pivot axis; an upper wiring conductor located between the third wall portion and the fourth wall portion on the coating upper surface, the upper wiring conductor having an upper conductor surface that is the opposite surface to the surface that contacts the coating insulating layer in the vertical direction; Further provided with the covering insulating layer contains an inorganic filler, the transparency of the covering insulating layer is lower than the transparency of the first wall portion and the transparency of the second wall portion; the thickness of the covering insulating layer is smaller than the thickness of the first wall portion and the thickness of the second wall portion; The inductor component according to any one of the first to eighth aspects is provided.

[0019] According to a tenth aspect of the present disclosure, an external terminal provided on an outer surface of the magnetic body; a connection wiring provided on the magnetic body, extending along the vertical direction, and connecting the external terminal and the wiring conductor; Further provided with a pad portion connected to the connection wiring is provided at an end portion of the wiring conductor in the plan view; The inductor component according to any one of the first to ninth aspects is provided.

[0020] According to an eleventh aspect of the present disclosure, The covering portion is a first portion that contacts the pad portion in the vertical direction; a second portion that contacts a portion of the wiring conductor that is different from the pad portion in the vertical direction; and The thickness of the first portion is smaller than the thickness of the second portion. According to a tenth aspect, there is provided an inductor component.

[0021] According to a twelfth aspect of the present disclosure, the protrusion is located closer to the pivot axis than the first wall portion in the radial direction, the covering insulating layer further has an outward protruding portion located on the opposite side of the covering portion with respect to the first wall portion in the radial direction and located farther from the pivot axis than the first wall portion, the thickness of the outward protrusion is different from the thickness of the protrusion; The inductor component according to any one of the first to eleventh aspects is provided.

[0022] According to a thirteenth aspect of the present disclosure, there is provided the inductor component according to the twelfth aspect, wherein a thickness of the protrusion is greater than a thickness of the outward protrusion.

[0023] According to a fourteenth aspect of the present disclosure, the covering insulating layer has a covering lower surface facing the base insulating layer in the vertical direction and a covering upper surface that is the surface opposite to the covering lower surface, a third wall portion provided on the upper surface of the coating and extending around the pivot axis; a fourth wall portion provided on the upper surface of the coating and extending parallel to the third wall portion around the pivot axis; an upper wiring conductor located between the third wall portion and the fourth wall portion on the coating upper surface, the upper wiring conductor having an upper conductor surface that is the opposite surface to the surface that contacts the coating insulating layer in the vertical direction; an upper covering insulating layer laminated on an upper surface of the upper conductor; Further provided with The upper covering insulating layer is an upper covering portion overlapping the upper wiring conductor in the plan view; an upper protrusion located on the opposite side of the third wall portion from the upper covering portion in the radial direction; and the thickness of the upper protrusion is different from the thickness of the protrusion; The inductor component according to any one of the first to thirteenth aspects is provided.

[0024] According to a fifteenth aspect of the present disclosure, there is provided the inductor component according to the fourteenth aspect, wherein a thickness of the upper protrusion is greater than a thickness of the protrusion.

[0025] According to a sixteenth aspect of the present disclosure, the covering insulating layer has a covering lower surface facing the base insulating layer in the vertical direction and a covering upper surface that is the surface opposite to the covering lower surface, a third wall portion provided on the upper surface of the coating and extending around the pivot axis; a fourth wall portion provided on the upper surface of the coating and extending parallel to the third wall portion around the pivot axis; an upper wiring conductor located between the third wall portion and the fourth wall portion on the coating upper surface, the upper wiring conductor having an upper conductor surface that is the opposite surface to the surface that contacts the coating insulating layer in the vertical direction; Further provided with a portion of the covering insulating layer sandwiched between the first wall portion or the second wall portion and the third wall portion or the fourth wall portion in the vertical direction includes a portion of the covering insulating layer where the thickness of the covering insulating layer is smallest; The inductor component according to any one of the first to fifteenth aspects is provided.

[0026] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The following description does not limit the present disclosure, but is merely exemplary in nature, and can be modified as appropriate without departing from the spirit of the present disclosure. The drawings are schematic, and the ratios of the dimensions do not necessarily correspond to the actual ones. In the following description, terms such as "about," "approximately," or "substantially" mean that the values, shapes, etc. following these terms include an acceptable range of error as determined by a person skilled in the art.

[0027] In the following description, terms indicating specific directions or positions (e.g., terms including "up," "down," "right," and "left") are used as necessary, but the use of these terms is intended to facilitate understanding of the present disclosure with reference to the drawings, and the meanings of these terms do not limit the technical scope of the present disclosure.

[0028] In the following description, "thickness" and "height" refer to the dimensions of a member in the vertical direction Z unless otherwise specified.

[0029] 1 and 2, the inductor component 1 of the present disclosure includes a base insulating layer 71, insulating first and second wall portions 73 and 76, a first conductor layer 11, a first inductor wiring 21, and a covering insulating layer 72. Provided above the covering insulating layer 72 are insulating third and fourth wall portions 74 and 77, a second conductor layer 12, a second inductor wiring 22, and an upper covering insulating layer 75. The above-mentioned components are located inside a magnetic body 2 containing a magnetic material.

[0030] In this embodiment, the magnetic body 2 has a substantially rectangular parallelepiped shape. The magnetic body 2 has dimensions of, for example, 1.2 × 2.1 × 0.55 mm. The magnetic body 2 has an outer surface that intersects (for example, is perpendicular to) the vertical direction, for example, the Z direction. Hereinafter, this outer surface may be referred to as the main surface 202. As shown in FIG. 1, the main surface 202 is provided with a plurality of external terminals 101 to 106 and an insulating layer 78. The insulating layer 78 has a thickness of, for example, 10 μm. The external terminals 101 to 106 are formed, for example, from a laminate of Cu / Ni / Au (=5 / 5 / 0.1 μm).

[0031] The magnetic body 2 is formed, for example, from a composite of resin and inorganic filler (e.g., a composite of epoxy and FeSiCr). The resin includes, for example, epoxy, acrylic, liquid crystal polymer, phenol, or a combination thereof, and is responsible for the strength and good insulating properties of the magnetic body 2. The inorganic filler included in the magnetic body 2 includes, for example, a metal magnetic powder (e.g., Fe, FeSi-based, FeSiCr-based, FeNi-based, or other materials containing Fe as a main component). In this case, the magnetic body 2 has high magnetic permeability and high magnetic saturation density. The inorganic filler does not need to be a single type of magnetic powder; it may be a combination of magnetic powders with different compositions and particle sizes, or it may contain an insulating filler such as silica to ensure a linear expansion coefficient and insulating properties.

[0032] As shown in FIG. 2, the base insulating layer 71, the covering insulating layer 72, and the upper covering insulating layer 75 each have a generally plate shape that intersects with the vertical direction Z. The covering insulating layer 72 is located higher than the base insulating layer 71. The upper covering insulating layer 75 is located higher than the covering insulating layer 72. As shown in FIG. 5, the base insulating layer 71 has a base upper surface 71a facing the covering insulating layer 72. The covering insulating layer 72 has a covering lower surface 72a facing the base insulating layer 71 and a covering upper surface 72b that is the surface opposite the covering lower surface 72a. The upper covering insulating layer 75 has an upper covering lower surface 75a facing the covering insulating layer 72 and an upper covering upper surface 75b that is the surface opposite the upper covering lower surface 75a.

[0033] As an example, the upper coating surface 72b is smoother than the lower coating surface 72a. That is, the surface roughness of the upper coating surface 72b is smaller than that of the lower coating surface 72a. Furthermore, the upper coating upper surface 75b is smoother than the upper coating lower surface 75a. That is, the surface roughness of the upper coating upper surface 75b is smaller than that of the upper coating lower surface 75a. The surface roughness may be, for example, Line Edge Roughness (LER). A method for measuring the LER will now be described. An image of a cross section of the inductor component 1 intersecting the direction in which the wiring conductor 81 extends is acquired. In the image, edge points of the measurement surface (for example, the lower coating surface 72a or the upper coating surface 72b) are detected. The deviation between each edge point and an approximation line of the edge points based on the least squares method is calculated. The average deviation is taken as the LER of the measurement surface.

[0034] The first conductor layer 11 is provided on the base upper surface 71a. The second conductor layer 12 is provided on the coated upper surface 72b. The first inductor wiring 21 is provided on the first conductor layer 11. The first inductor wiring 21 is located between the first conductor layer 11 and the coated insulating layer 72 in the up-down direction Z. The second inductor wiring 22 is provided on the second conductor layer 12. The second inductor wiring 22 is located on the opposite side of the coated insulating layer 72 from the first inductor wiring 21.

[0035] As an example, the first conductor layer 11 has a thickness in the vertical direction Z of less than 1.0 μm. The thickness of the first conductor layer 11 is smaller than 1 / 100 of the thickness of the first inductor wiring 21. The second conductor layer 12 may also be configured in the same manner as the first conductor layer 11. In other words, the second conductor layer 12 may be configured to have a thickness of less than 1.0 μm and smaller than 1 / 100 of the thickness of the second inductor wiring 22.

[0036] As an example, each of the first conductor layer 11 and the second conductor layer 12 includes a single layer (Cu or Ag) or a plurality of layers (for example, Ti / Cu) stacked along the vertical direction Z.

[0037] The first conductor layer 11 and the first inductor wiring 21 constitute a "wiring conductor" in the present disclosure. The second conductor layer 12 and the second inductor wiring 22 constitute an "upper wiring conductor" in the present disclosure. In the following description, the first conductor layer 11 and the first inductor wiring 21 may be collectively referred to as a wiring conductor 81, and the second conductor layer 12 and the second inductor wiring 22 may be collectively referred to as an upper wiring conductor 82.

[0038] 3, the wiring conductor 81 extends around a first pivot axis A1 that intersects (e.g., is perpendicular to) the base upper surface 71a. As shown in Fig. 4, the upper wiring conductor 82 extends around a second pivot axis A2 that intersects (e.g., is perpendicular to) the coating upper surface 72b.

[0039] As shown in FIG. 5 , the wiring conductor 81 has a conductor upper surface 81a, which is the surface opposite to the surface that contacts the base insulating layer 71 in the vertical direction Z. The covering insulating layer 72 is laminated on the conductor upper surface 81a. That is, the conductor upper surface 81a is covered by the covering insulating layer 72. The upper wiring conductor 82 has an upper conductor upper surface 82a, which is the surface opposite to the surface that contacts the covering insulating layer 72 in the vertical direction Z. The upper covering insulating layer 75 is laminated on the upper conductor upper surface 82a. That is, the upper conductor upper surface 82a is covered by the upper covering insulating layer 75.

[0040] 2 and 3, the first wall portion 73 and the second wall portion 76 are provided on both sides of the wiring conductor 81 in the radial direction of the first pivot axis A1. That is, the wiring conductor 81 is located between the first wall portion 73 and the second wall portion 76 on the base upper surface 71a. As shown in FIG. 3, the first wall portion 73 and the second wall portion 76 extend around the first pivot axis A1 along the wiring conductor 81 on the base upper surface 71a. Note that the radial direction of the first pivot axis A1 is, for example, a direction that intersects both the up-down direction Z and the extension direction of the wiring conductor 81. In other words, the radial direction of the first pivot axis A1 is a direction that extends radially from the first pivot axis A1 or a direction that converges toward the first pivot axis A1 when viewed along the first pivot axis A1.

[0041] 5, the first wall portion 73 and the second wall portion 76 extend upward from the base upper surface 71a. The first wall portion 73 has an inner wall surface 73a that contacts the wiring conductor 81 and an outer wall surface 73b that is the opposite surface to the inner wall surface 73a and contacts the magnetic body 2. The second wall portion 76 is located on the opposite side of the wiring conductor 81 from the first wall portion 73 in the radial direction. The second wall portion 76 may be in contact with the wiring conductor 81 on both of its two wall surfaces facing in the radial direction. Alternatively, the second wall portion 76 may be in contact with the wiring conductor 81 on one of its two wall surfaces and the magnetic body 2 on the other.

[0042] The first wall portion 73 has a lower edge portion 731 that contacts the base upper surface 71a and an upper edge portion 732 that is located on the opposite side of the lower edge portion 731 in the vertical direction Z. The first wall portion 73 has a thickness in the vertical direction Z between the lower edge portion 731 and the upper edge portion 732. The second wall portion 76 has a lower edge portion 761 that contacts the base upper surface 71a and an upper edge portion 762 that is located on the opposite side of the lower edge portion 761 in the vertical direction Z. The second wall portion 76 has a thickness in the vertical direction Z between the lower edge portion 761 and the upper edge portion 762. In this embodiment, the upper edges 732, 762 are located above the wiring conductors 81.

[0043] 2 and 4, the third wall portion 74 and the fourth wall portion 77 are provided on both sides of the upper wiring conductor 82 in the radial direction of the second pivot axis A2. That is, the upper wiring conductor 82 is located between the third wall portion 74 and the fourth wall portion 77 on the coated upper surface 72b. As shown in FIG. 4, the third wall portion 74 and the fourth wall portion 77 extend around the second pivot axis A2 along the upper wiring conductor 82 on the coated upper surface 72b. The radial direction of the second pivot axis A2 is, for example, a direction intersecting both the up-down direction Z and the extension direction of the upper wiring conductor 82. In other words, the radial direction of the second pivot axis A2 is a direction extending radially from the second pivot axis A2 or a direction converging toward the first pivot axis A1 when viewed along the second pivot axis A2.

[0044] The third wall portion 74 and the fourth wall portion 77 extend upward from the coating upper surface 72b. As shown in FIG. 5, the third wall portion 74 has an upper inner wall surface 74a that contacts the upper wiring conductor 82 and an upper outer wall surface 74b that is the opposite surface to the upper inner wall surface 74a and contacts the magnetic body 2. The fourth wall portion 77 is located on the opposite side of the upper wiring conductor 82 from the third wall portion 74 in the radial direction. The fourth wall portion 77 may be in contact with the upper wiring conductor 82 on both of its two wall surfaces facing in the radial direction. Alternatively, the fourth wall portion 77 may be in contact with the upper wiring conductor 82 on one of its two wall surfaces and the magnetic body 2 on the other.

[0045] 3 and 4, the inductor component 1 includes a third conductor layer 13, a fourth conductor layer 14, a third inductor wiring 23 provided on the third conductor layer 13, and a fourth inductor wiring 24 provided on the fourth conductor layer 14. The third conductor layer 13 is provided on the base upper surface 71a and is electrically independent from the first conductor layer 11. The fourth conductor layer 14 is provided on the coated upper surface 72b and is electrically independent from the second conductor layer 12.

[0046] 3, when viewed along the up-down direction Z, the third conductor layer 13 is positioned symmetrically to the first conductor layer 11 with respect to a first center line CL1 extending along the base upper surface 71a in the short-side direction of the inductor component 1 (for example, the X direction), and has a shape symmetrical to the first conductor layer 11 with respect to the first center line CL1. The third inductor wiring 23 is positioned symmetrical to the first inductor wiring 21 with respect to the first center line CL1, and has a shape symmetrical to the first inductor wiring 21 with respect to the first center line CL1. The third inductor wiring 23 is positioned around a third pivot axis A3 that is positioned symmetrical to the first pivot axis A1 with respect to the first center line CL1.

[0047] 4, when viewed in the up-down direction Z, the fourth conductor layer 14 is positioned symmetrically to the second conductor layer 12 with respect to a second center line CL2 extending on the coated upper surface 72b in the short-side direction X, and has a shape symmetrical to the second conductor layer 12 with respect to the second center line CL2. The fourth inductor wiring 24 is positioned symmetrical to the second inductor wiring 22 with respect to the second center line CL2, and has a shape symmetrical to the second inductor wiring 22 with respect to the second center line CL2. The fourth inductor wiring 24 is positioned around a fourth pivot axis A4 that is positioned symmetrical to the second pivot axis A2 with respect to the second center line CL2.

[0048] For example, the first pivot axis A1 and the second pivot axis A2 are located on the same line (see FIG. 2), and the third pivot axis A3 and the fourth pivot axis A4 are located on the same line. The first center line CL1 and the second center line CL2 are located at approximately the center of the inductor component 1 in the longitudinal direction (e.g., the Y direction) when viewed along the vertical direction Z.

[0049] As shown in FIG. 3, the wiring conductor 81 has, for example, a spiral shape when viewed in the up-down direction Z. Two pad portions 818 are provided on both ends of the wiring conductor 81 in the direction in which the wiring conductor 81 extends. As shown in FIG. 6, for example, the thickness of the pad portion 818 is greater than the thickness of a portion of the wiring conductor 81 that is different from the pad portion 818 (for example, a portion of the wiring conductor 81 excluding the pad portion 818). In this embodiment, two via conductors 51 and 52 are connected to the two pad portions 818, respectively. The first inductor wiring 21 is formed, for example, of an L / S / t (=100 / 10 / 150 μm) laminate.

[0050] The wiring conductor 81 has a first portion 811 to a seventh portion 817 .

[0051] The first portion 811 extends from an end portion located near the first pivot axis A1 to which the via conductor 51 is connected in a direction away from the first center line CL1 along the longitudinal direction Y. As an example, the portion of the first portion 811 to which the via conductor 51 is connected constitutes a first output portion.

[0052] The second portion 812 extends in the short direction X from one of both ends of the first portion 811 in the longitudinal direction Y that is farther from the first center line CL1.

[0053] The third portion 813 extends from one of both ends of the second portion 812 in the short-side direction X that is farther from the first portion 811 along the longitudinal direction Y in a direction approaching the first center line CL1.

[0054] The fourth portion 814 extends from one of the ends of the third portion 813 in the longitudinal direction Y that is farther from the second portion 812 in the short direction X toward the first portion 811.

[0055] The fifth portion 815 extends from one of both ends of the fourth portion 814 in the short-side direction X that is farther from the third portion 813 along the longitudinal direction Y in a direction away from the first center line CL1. The fifth portion 815 is located farther from the first pivot axis A1 in the short-side direction X than the first portion 811, and a part of the fifth portion 815 overlaps with the first portion 811 when viewed along the short-side direction X. The fifth portion 815 and the first portion 811 are insulated from each other by the second wall portion 76.

[0056] The sixth portion 816 extends from one of the ends of the fifth portion 815 in the longitudinal direction Y that is farther from the fourth portion 814 in the short direction X toward the third portion 813. The sixth portion 816 is located farther from the first pivot axis A1 in the longitudinal direction Y than the second portion 812, and a part of the sixth portion 816 overlaps with the second portion 812 when viewed along the longitudinal direction Y. The sixth portion 816 and the second portion 812 are insulated from each other by the second wall portion 76.

[0057] The seventh portion 817 extends from one of the ends of the sixth portion 816 in the short-side direction X that is farther from the fifth portion 815 along the longitudinal direction Y in a direction approaching the first center line CL1. The seventh portion 817 is located farther from the first pivot axis A1 than the third portion 813 in the short-side direction X, and a portion of the seventh portion 817 overlaps with the third portion 813 when viewed along the short-side direction X. The seventh portion 817 and the third portion 813 are insulated from each other by the second wall portion 76. A via conductor 52 is connected to one of the ends of the seventh portion 817 in the long-side direction Y that is closer to the first center line CL1. As an example, the portion of the seventh portion 817 to which the via conductor 52 is connected configures a first input section.

[0058] 3, the magnetic body 2 has therein a first region B1 that is closer to the first pivot axis A1 than the wiring conductor 81, and a second region B2 that is farther from the first pivot axis A1 than the wiring conductor 81. In this embodiment, the first region B1 is surrounded by the first portion 811 to the fourth portion 814 and part of the fifth portion 815 of the wiring conductor 81 when viewed along the vertical direction Z.

[0059] 4, the upper wiring conductor 82 is positioned around a second pivot axis A2 along the vertical direction Z. In this embodiment, the upper wiring conductor 82 has a spiral shape that is spiraled in the opposite direction to the wiring conductor 81 when viewed along the vertical direction Z.

[0060] The upper wiring conductor 82 is formed of, for example, an L / S / t (=100 / 10 / 150 μm) laminate. Two pad portions 828 are provided on both ends of the upper wiring conductor 82 in the direction in which the upper wiring conductor 82 extends. For example, the thickness of the pad portion 828 is greater than the thickness of a portion of the upper wiring conductor 82 different from the pad portion 828, for example, the thickness of a portion of the upper wiring conductor 82 excluding the pad portion 828. In this embodiment, via conductors 53 and 54 extending in the vertical direction Z are connected to the two pad portions 828. As shown in FIG. 2 , the via conductor 53 connects the upper wiring conductor 82 and the connection wiring 61. The connection wiring 61 extends in the vertical direction Z in the magnetic body 2 and connects the upper wiring conductor 82 and the external terminal 101 via the via conductor 53. An upper covering insulating layer 75 is located between the upper wiring conductor 82 and the connection wiring 61 in the vertical direction Z. The upper covering insulating layer 75 has a thickness of, for example, 15 μm.

[0061] As shown in FIG. 4, the upper wiring conductor 82 has a first portion 821 to a seventh portion 827.

[0062] The first portion 821 extends from an end portion located near the first pivot axis A1 to which the via conductor 53 is connected in the longitudinal direction Y toward the second center line CL2. As an example, the portion of the first portion 821 to which the via conductor 53 is connected constitutes the second output portion. When viewed in the vertical direction Z, the via conductor 51 and the via conductor 53 are adjacent to each other. In other words, the first output portion and the second output portion are adjacent to each other. "The first output portion and the second output portion are adjacent to each other" refers to a state in which the via conductor 51 and the via conductor 53 are located within a very small area (e.g., within 20 μm) when viewed in the vertical direction Z. In this embodiment, the via conductor 51 and the via conductor 53 are located at a distance of approximately 10 μm when viewed in the vertical direction Z.

[0063] The second portion 822 extends in the short direction X from one of both ends of the first portion 821 in the longitudinal direction Y that is closer to the second center line CL2.

[0064] The third portion 823 extends from one of both ends of the second portion 822 in the short-side direction X that is farther from the first portion 821 along the longitudinal direction Y in a direction away from the second center line CL2.

[0065] The fourth portion 824 extends from one of the ends of the third portion 823 in the longitudinal direction Y that is farther from the second portion 822 in the short direction X toward the first portion 821.

[0066] The fifth portion 825 extends from one of both ends of the fourth portion 824 in the short-side direction X that is farther from the third portion 823 along the longitudinal direction Y in a direction approaching the second center line CL2. The fifth portion 825 is located farther from the second pivot axis A2 than the first portion 821 in the short-side direction X, and a part of the fifth portion 825 overlaps with the first portion 821 when viewed along the short-side direction X. The fifth portion 825 and the first portion 821 are insulated from each other by the fourth wall portion 77.

[0067] The sixth portion 826 extends from one of the ends of the fifth portion 825 in the longitudinal direction Y that is farther from the fourth portion 824 in the short direction X toward the third portion 823. The sixth portion 826 is located farther from the second pivot axis A2 in the longitudinal direction Y than the second portion 822, and a part of the sixth portion 826 overlaps with the second portion 822 when viewed along the longitudinal direction Y. The sixth portion 826 and the second portion 822 are insulated from each other by the fourth wall portion 77.

[0068] The seventh portion 827 extends from one of the ends of the sixth portion 826 in the short-side direction X that is farther from the fifth portion 825 along the longitudinal direction Y in a direction away from the second center line CL2. The seventh portion 827 is located farther from the second pivot axis A2 than the third portion 823 in the short-side direction X, and a portion of the seventh portion 827 overlaps with the third portion 823 when viewed along the short-side direction X. The seventh portion 827 and the third portion 823 are insulated from each other by the fourth wall portion 77. A via conductor 54 is connected to one of the ends of the seventh portion 827 in the long-side direction Y that is closer to the second center line CL2 (i.e., the pad portion 828). As an example, the portion of the seventh portion 827 to which the via conductor 54 is connected constitutes a second input portion. As shown in FIGS. 3 and 4 , when viewed along the up-down direction Z, the via conductors 52 and 54 are spaced apart in the longitudinal direction Y. That is, the first input section and the second input section are positioned apart in the longitudinal direction Y. When viewed along the up-down direction Z, the via conductors 52 and 54 are positioned apart by 200 μm or more (for example, 500 μm), thereby separating the first input section and the second input section.

[0069] 4, the magnetic body 2 has therein a first region C1 that is closer to the second pivot axis A2 than the upper wiring conductor 82, and a second region C2 that is farther from the second pivot axis A2 than the upper wiring conductor 82. In this embodiment, the first region C1 is surrounded by the first portion 821 to the fifth portion 825 of the upper wiring conductor 82 when viewed along the up-down direction Z.

[0070] As shown in FIG. 5 , the covering insulating layer 72 is positioned across the conductor upper surface 81a, the upper edge 732 of the first wall portion 73, and the upper edge 762 of the second wall portion 76. For example, the transparency of the covering insulating layer 72 is lower than the transparency of the first wall portion 73 and the transparency of the second wall portion 76. The transparency is, for example, visible light transmittance. A method for measuring visible light transmittance will be described. To measure visible light transmittance, a measurement object (e.g., the covering insulating layer 72, the first wall portion 73, or the second wall portion 76) having a predetermined thickness is used. The predetermined thickness is, for example, 20 μm. Visible light is irradiated onto one surface in the thickness direction of the measurement object. A light receiver is used to measure the intensity of the transmitted light that has passed through the measurement object on the other surface in the thickness direction of the measurement object. The ratio of the intensity of the transmitted light to the intensity of the visible light irradiated onto the one surface is calculated. The ratio is converted to a value per 20 μm of the measurement object's thickness, which is taken as the visible light transmittance.

[0071] As an example, the covering insulating layer 72 and the upper covering insulating layer 75 are formed of an insulating material consisting of an epoxy-based material and an inorganic filler, and the first to fourth wall portions 73, 76, 74, and 77 are formed of an acrylic-based insulating material. Examples of the inorganic filler include silica, calcium carbonate, and titanium oxide. The particle size (D50) of the inorganic filler contained in the covering insulating layer 72 is preferably sufficiently small compared to the thickness of the covering portion 721 described below. For example, the particle size of the inorganic filler is 1 / 10 or less of the thickness of the covering portion 721 or 1 μm or less. The first to fourth wall portions 73, 76, 74, and 77 may not contain inorganic filler. Since the first to fourth wall portions 73, 76, 74, and 77 do not contain inorganic filler, a decrease in the molding precision of the first to fourth wall portions 73, 76, 74, and 77 is suppressed.

[0072] 7, the covering insulating layer 72 has a covering portion 721, a protruding portion 722, and an intermediate portion 723 located between the covering portion 721 and the protruding portion 722 in the radial direction of the first pivot axis A1 (the X direction in FIG. 7). The covering portion 721 is a portion that overlaps the wiring conductor 81 in a plan view seen from the up-down direction Z. The protruding portion 722 is a portion that is located on the opposite side of the first wall portion 73 from the covering portion 721 in the radial direction. The intermediate portion 723 is a portion that is located between the inner wall surface 73a and the outer wall surface 73b of the first wall portion 73 in a plan view.

[0073] The covering portion 721 has a covering portion lower surface 721a that contacts the wiring conductor 81. The protrusion 722 has a protrusion portion lower surface 722a that faces the base insulating layer 71 (see FIG. 5) in the vertical direction Z, and a protrusion portion side surface 722b that connects the protrusion portion lower surface 722a and the covering upper surface 72b and faces in the radial direction. The surface roughness of the protrusion portion lower surface 722a is different from the surface roughness of the covering portion lower surface 721a. For example, the surface roughness of the covering portion lower surface 721a is greater than the surface roughness of the protrusion portion lower surface 722a.

[0074] In this embodiment, the protruding portion 722 is located closer to the first pivot axis A1 in the radial direction of the first pivot axis A1 than the first wall portion 73. In other words, the protruding portion 722 is located in the first region B1 of the magnetic body 2.

[0075] The thickness of the protrusion 722 is greater than the thickness of the covering portion 721. The thickness of the protrusion 722 is the dimension in the vertical direction Z between the height position of the covering upper surface 72b and the height position of the protrusion lower surface 722a. However, if the protrusion lower surface 722a is not flat in the cross section of the wiring conductor 81, the height position of a straight line that is parallel to the main surface 202 and has the smallest difference from the actual protrusion lower surface 722a according to the least squares method is considered to be the height position of the protrusion lower surface 722a. Note that the cross section of the wiring conductor 81 is a cross section that intersects (for example, is perpendicular to) the direction in which the wiring conductor 81 extends.

[0076] The thickness of the coating portion 721 is the dimension in the vertical direction Z between the height position of the upper coating surface 72b and the height position of the lower coating surface 72a (for example, the height position of the conductor upper surface 81a). However, if the lower coating surface 72a is not flat in the cross section of the wiring conductor 81 (see FIG. 7), the height position of the lower coating surface 72a is considered to be the height position of a line V1 that is parallel to the main surface 202 and has the smallest difference from the actual lower coating surface 72a as determined by the least squares method. In the example shown in FIG. 7, the lower coating surface 72a is curved so as to protrude upward. In one example, the thickness of the coating portion 721 is smaller than the thickness of the first wall portion 73 and the thickness of the second wall portion 76. In this embodiment, the thickness of the coating portion 721 is 15 μm, and the thicknesses of the first wall portion 73 and the second wall portion 76 are 165 μm. 2, 5, 6, and 15 to 22, the curved shape of the conductor upper surface 81a is omitted, and the conductor upper surface 81a is shown as a flat surface. In the cross sections shown in FIGS. 2, 5, 6, and 15 to 22, the conductor upper surfaces 81a may have the same shape as one another or different shapes. Similarly, the upper conductor upper surfaces 82a may have the same shape as one another or different shapes as one another in the cross sections.

[0077] In this embodiment, the intermediate portion 723 is also a portion sandwiched between the first wall portion 73 and the third wall portion 74 in the vertical direction Z. For example, the intermediate portion 723 includes a portion of the covering insulating layer 72 where the thickness of the covering insulating layer 72 is smallest. In other words, the thickness of the intermediate portion 723 is smaller than the thickness of the covering portion 721.

[0078] As shown in FIG. 5, the upper covering insulating layer 75 is positioned across the upper conductor upper surface 82a, the third wall portion 74, and the fourth wall portion 77. As shown in FIG. 8, the upper covering insulating layer 75 has an upper covering portion 751, an upper protruding portion 752, and an intermediate portion 753 located between the upper covering portion 751 and the upper protruding portion 752 in the radial direction (X direction in FIG. 8) with respect to the second pivot axis A2. The upper covering portion 751 is a portion that overlaps the upper wiring conductor 82 in a plan view. The upper protruding portion 752 is a portion that is located on the opposite side of the third wall portion 74 from the upper covering portion 751 in the radial direction. The upper protruding portion 752 has an upper protruding portion lower surface 752a that faces the base insulating layer 71 in the up-down direction Z.

[0079] The thickness of the upper protrusion 752 is greater than the thickness of the upper covering portion 751. The thickness of the upper protrusion 752 is the dimension between the height position of the upper covering upper surface 75b and the height position of the upper protrusion lower surface 752a. If the upper protrusion lower surface 752a is not flat in the cross section of the upper wiring conductor 82, the height position of a straight line that is parallel to the main surface 202 and has the smallest difference from the actual upper protrusion lower surface 752a according to the least squares method is considered to be the height position of the upper protrusion lower surface 752a.

[0080] For example, the thickness of the upper protrusion 752 is different from the thickness of the protrusion 722. In this embodiment, the thickness of the upper protrusion 752 is greater than the thickness of the protrusion 722.

[0081] The thickness of the upper coating portion 751 is the dimension between the height position of the upper coating upper surface 75b and the height position of the upper coating lower surface 75a (for example, the height position of the upper conductor upper surface 82a). However, if the upper coating lower surface 75a is not flat in the cross section of the upper wiring conductor 82 (see FIG. 8), the height position of a straight line that is parallel to the main surface 202 and has the smallest difference from the actual upper coating lower surface 75a by the least squares method is considered to be the height position of the upper coating lower surface 75a.

[0082] In this embodiment, the thickness of the upper covering portion 751 is greater than the thickness of the covering portion 721 (see FIG. 7).

[0083] In this embodiment, the intermediate portion 753 is a portion that overlaps with the third wall portion 74 in a plan view. For example, the intermediate portion 753 includes a portion of the upper covering insulating layer 75 that has the smallest thickness. In other words, the thickness of the intermediate portion 753 is smaller than the thickness of the upper covering portion 751.

[0084] As shown in FIG. 6 , the covering insulating layer 72 is provided with a via conductor 51 that penetrates the covering insulating layer 72 in the vertical direction Z and connects a pad portion 818 of the wiring conductor 81 and the upper wiring conductor 82. As shown in FIG. 9 , the via conductor 51 has a tapered shape that becomes thinner in the vertical direction Z from the wiring conductor 81 to the upper wiring conductor 82. That is, a contact surface 51a of the via conductor 51 with the wiring conductor 81 is larger than a contact surface 51b of the via conductor 51 with the upper wiring conductor 82. The via conductor 51 has a via side surface 51c that faces in the radial direction and contacts the covering insulating layer 72. In a cross section of the wiring conductor 81, the inclination angle of the via side surface 51c with respect to the vertical direction Z is, for example, greater than 0 degrees and equal to or less than 35 degrees.

[0085] 6, the thickness of the wiring conductor 81 is greater in the pad portion 818 than in a portion other than the pad portion 818. For example, the thickness of the pad portion 818 is greater than the thickness of the portion of the wiring conductor 81 excluding the pad portion 818.

[0086] 9, the covering portion 721 has a first portion 724 that contacts the pad portion 818 and a second portion 725 that contacts a portion of the wiring conductor 81 that is different from the pad portion 818. The thickness of the first portion 724 is smaller than the thickness of the second portion 725.

[0087] The covering insulating layer 72 has a covering side surface 72c that faces in the radial direction and is located closer to the second wall portion 76 in the radial direction than the outer wall surface 73b. As an example, the covering side surface 72c is located between the outer wall surface 73b and the inner wall surface 73a in the radial direction. The covering side surface 72c is located in a portion of the covering insulating layer 72 excluding the protruding portion 722.

[0088] In addition to the protrusion 722, the covering insulating layer 72 has an outward protrusion 726 located on the opposite side of the first wall portion 73 from the covering portion 721 in the radial direction of the first pivot axis A1. The outward protrusion 726 is located farther from the first pivot axis A1 than the first wall portion 73 in the radial direction of the first pivot axis A1. The thickness of the outward protrusion 726 is greater than the thickness of the covering portion 721. For example, the thickness of the outward protrusion 726 is different from the thickness of the protrusion 722. In this embodiment, the thickness of the protrusion 722 is greater than the thickness of the outward protrusion 726.

[0089] Modified examples of the protrusion 722 will be described. In the modified example shown in FIG. 10, the protrusion side surface 722b has multiple straight line portions with different inclinations in the cross section of the wiring conductor 81. In the example shown in FIG. 10, the protrusion side surface 722b is composed of a first straight line portion 722c extending upward from the protrusion lower surface 722a and a second straight line portion 722d extending downward from the coating upper surface 72b. The second straight line portion 722d extends along the up-down direction Z in the cross section of the wiring conductor 81. On the other hand, the first straight line portion 722c is inclined so as to approach the first wall portion 73 in the radial direction as it extends downward.

[0090] In the modified example shown in Fig. 11, the protrusion side surface 722b has a straight portion and a curved portion in the cross section of the wiring conductor 81. In the example shown in Fig. 11, the protrusion side surface 722b has a straight portion 722e extending downward from the coating upper surface 72b and a curved portion 722f extending downward from the lower end of the straight portion 722e. The straight portion 722e is inclined so as to approach the first wall portion 73 in the radial direction as it extends downward. In addition, in the modified example shown in Fig. 11, the conductor upper surface 81a is curved so as to protrude upward.

[0091] 12, in the cross section of the wiring conductor 81, the protrusion lower surface 722a has an inclined portion 722h that is inclined upward in the radial direction as it approaches the first wall portion 73. In the example shown in FIG. 12, the entire protrusion lower surface 722a is formed by the inclined portion 722h. A magnetic body 2 is arranged between the inclined portion 722h in the radial direction and the outer wall surface 73b.

[0092] An example of a method for manufacturing the inductor component 1 will be described with reference to Figures 13 to 22. In the following description, the third conductor layer 13, the fourth conductor layer 14, the third inductor wiring 23, and the fourth inductor wiring 24 will be omitted. Figures 13 to 22 are drawings corresponding to a cross section taken along line II-II in Figure 1. In the manufacturing method shown in Figures 13 to 22, some or all of the steps are automatically performed using, for example, a manufacturing device for the inductor component 1.

[0093] As shown in FIGS. 13 and 14 , the manufacturing equipment forms a base insulating layer 71 on a first laminate 1001, which is formed by laminating an adhesive layer 1100 and a seed layer (conductor) 1200 on a substrate 1000. Then, a pattern seed 1300 and a permanent resist 1400 are formed on the base insulating layer 71 and the seed layer 1200 to form a second laminate 1002. The pattern seed 1300 constitutes the first conductor layer 11. The base insulating layer 71 is formed, for example, by a process including laminating an insulating layer, photolithography (photolithography), and curing. The pattern seed 1300 is formed, for example, by a process including sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1400 is formed, for example, by a process including permanent resist lamination, photolithography, and curing. A portion of the permanent resist 1400 constitutes the first wall portion 73.

[0094] As shown in FIG. 15 , the manufacturing equipment simultaneously forms the first inductor wiring 21 and the sacrificial copper 1500 on the second laminate 1002, and then forms the covering insulating layer 72 on the first inductor wiring 21. The first inductor wiring 21 and the sacrificial copper 1500 are formed by, for example, a process including electrolytic plating (e.g., electrolytic copper plating). At this time, the pad portion 818 can be formed thicker by passing a larger current through the pad portion 818 than through portions other than the pad portion 818 to cause plating growth. An additive may also be used to promote plating growth in the pad portion 818. The covering insulating layer 72 is formed by, for example, a process including insulating layer lamination, photolithography, and curing. In this case, the magnetic path opening 1501 and the via conductors 51 and 52 are simultaneously formed during the photolithography process. The tapered via conductor 51 (see FIG. 9 ) can be formed by, for example, adjusting the focus position during photolithography or laser processing. 10 to 12 can be realized by using a plurality of dry film resists to form the covering insulating layer 72. In this case, a plurality of dry film resists with different light absorption bands can also be used.

[0095] As shown in FIG. 16 , the manufacturing equipment forms a pattern seed 1600 located on the covering insulating layer 72 and a permanent resist 1700 on the third laminate 1003 to form a fourth laminate 1004. The pattern seed 1600 constitutes the second conductor layer 12. The pattern seed 1600 is formed by a process including, for example, sputtering (seed formation), resist lamination, photolithography, seed etching, and resist peeling. The permanent resist 1700 is formed by a process including permanent resist lamination, photolithography, and hardening. A portion of the permanent resist 1700 constitutes the third wall portion 74.

[0096] The pattern seed 1600 may be formed of the same material as the pattern seed 1300 of the second laminate 1002, or may be formed of a material different from that of the pattern seed 1300. The pattern seeds 1300 and 1600 are formed by selecting the optimum material for each layer. For example, by forming the first-layer pattern seed 1300 from a conductive material containing Ti, it is possible to improve adhesion to the base insulating layer 71 and the seed layer 1200. By forming the second-layer pattern seed 1600 from the same conductive material as the second inductor wiring 22 (for example, only Cu), it is possible to improve connectivity with the via conductors 53 and 54.

[0097] 17 , the manufacturing equipment simultaneously forms the second inductor wiring 22 and the sacrificial copper 1800 on the fourth laminate 1004, then forms an upper covering insulating layer 75 on the second inductor wiring 22, and forms a connecting wiring 61 on the upper covering insulating layer 75 to form a fifth laminate 1005. The second inductor wiring 22 and the sacrificial copper 1800 are formed, for example, by a process including electrolytic plating (e.g., electrolytic copper plating). The upper covering insulating layer 75 is formed by a process including insulating layer lamination, photolithography, and curing. In this case, the magnetic path opening 1801 and the via conductors 53 and 54 are simultaneously formed during the photolithography process. The connecting wiring 61 is formed, for example, by a process including sputtering (full-surface seed formation), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching.

[0098] 18, the manufacturing equipment forms a protective layer 1900 on the connection wiring 61 of the fifth laminate 1005, and then removes the sacrificial copper 1500 and 1800 to form a magnetic path hole 2000, thereby forming a sixth laminate 1006. The protective layer 1900 is formed, for example, by a process including resist lamination and photolithography. The sacrificial copper 1500 and 1800 are removed, for example, by etching. If the first layer pattern seed 1300 contains Ti, Ti etching is performed after Cu etching, leaving a portion of the seed layer 1200.

[0099] As shown in FIG. 19 , the manufacturing equipment removes the protective layer 1900 of the sixth laminate 1006, then forms a magnetic layer 2100, and forms a solder resist (insulating layer) 2200 on the magnetic layer 2100 to form the seventh laminate 1007. The protective layer 1900 is removed, for example, by a process including resist stripping. The magnetic layer 2100 is formed, for example, by a process including magnetic material pressing, hardening, and grinding. The grinding exposes the connection wiring 61 to the outside. The magnetic layer 2100 constitutes a part of the magnetic material. The solder resist 2200 is formed, for example, by a process including solder resist lamination, photolithography, and hardening. The solder resist 2200 has openings 2201 that expose the connection wiring 61 to the outside. The solder resist 2200 constitutes the insulating layer 78.

[0100] 20 , the manufacturing equipment removes the substrate 1000, the adhesive layer 1100, and the seed layer 1200 from the seventh laminate 1007 to create an eighth laminate 1008. The substrate 1000 and the adhesive layer 1100 are removed, for example, by mechanically peeling off the adhesive layer 1100. The seed layer 1200 is removed, for example, by wet etching or polishing. When the seed layer 1200 is removed by wet etching, part of the metal magnetic powder in the magnetic layer 2100 is etched, roughening the surface, thereby improving adhesion with the magnetic layer 2300 formed in the next process.

[0101] As shown in FIG. 21 , the manufacturing equipment forms a magnetic layer 2300 on the eighth laminate 1008 to form a ninth laminate 1009. The magnetic layer 2300 is formed, for example, by a process including magnetic material pressing, hardening, and grinding. Grinding is performed to adjust the thickness of the magnetic body 2. The thickness of the magnetic body 2 may be adjusted by adjusting the amount of pressing when forming the magnetic layer 2300 without grinding. The magnetic layer 2300 constitutes a part of the magnetic material.

[0102] 22, the manufacturing equipment forms external terminals 101 on the ninth laminate 1009, forms a tenth laminate 1010, and then singulates the tenth laminate 1010 to form the inductor component 1 shown in FIG. 2. The external terminals 101 are formed by a process including, for example, sputtering (Cu seed), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching. The singulation is performed, for example, along the dashed lines shown in FIG. 22.

[0103] Instead of forming the external terminals 101, the exposed connection wiring 61 may serve as the external terminals. By adopting a configuration in which the external terminals 101 are formed in the openings 2201 of the solder resist 2200 and connected to the connection wiring 61, as in this embodiment, the area of ​​the external terminals 101 can be increased, thereby improving the adhesive strength of the inductor component 1 to other devices, etc. Furthermore, the external terminals 101 can be formed in any shape, such as a convex shape, which improves the degree of freedom when mounting the inductor component 1.

[0104] The external terminals 101 may be formed without forming the solder resist 2200. The external terminals 101 may be formed by forming a seed layer on the entire surface and then performing electrolytic plating, as with the connection wiring 61. In this case, the external terminals 101 have a structure similar to that of Cu bumps.

[0105] The inductor component 1 can provide the following effects.

[0106] The inductor component 1 includes a base insulating layer 71 having a base top surface 71a, a first wall 73, a second wall 76, a wiring conductor 81, a covering insulating layer 72, and a magnetic body 2. The first wall 73 is provided on the base top surface 71a and extends around a first pivot axis A1 along the vertical direction Z. The second wall 76 is provided on the base top surface 71a and extends parallel to the first wall 73 around the first pivot axis A1. The wiring conductor 81 is located between the first wall 73 and the second wall 76 on the base top surface 71a and has a conductor top surface 81a that is opposite to the surface that contacts the base insulating layer 71 in the vertical direction Z. The covering insulating layer 72 is laminated on the conductor top surface 81a. The magnetic body 2 covers the base insulating layer 71, the first wall 73, the second wall 76, the wiring conductor 81, and the covering insulating layer 72. The covering insulating layer 72 includes a covering portion 721 overlapping the wiring conductor 81 in a plan view and a protruding portion 722 located on the radially opposite side of the first wall portion 73 from the covering portion 721. The thickness of the protruding portion 722 is greater than the thickness of the covering portion 721. With this configuration, the thickness of the covering portion 721 is smaller than the thickness of the protruding portion 722, thereby increasing the length of the coil provided in the inductor component in the vertical direction Z. This reduces the DC resistance compared to a configuration in which the thickness of the covering portion 721 is greater than the thickness of the protruding portion 722. On the other hand, if the thickness of the protruding portion 722 decreases along with the thickness of the covering portion 721, the deformation resistance of the protruding portion 722 decreases. Therefore, the possibility of the protruding portion 722 deforming during the manufacturing process of the inductor component 1 increases. With this configuration, the thickness of the protruding portion 722 is greater than the thickness of the covering portion 721, thereby reducing the deformation resistance of the protruding portion 722 and making the covering insulating layer 72 less likely to be damaged. Therefore, damage to the covering insulating layer 72 can be suppressed and the DC resistance can be reduced.

[0107] Furthermore, since the protrusion 722 is provided, the covering insulating layer 72 is formed so as to bite into the magnetic body 2 in a radial direction away from the wiring conductor 81. This improves the adhesion between the covering insulating layer 72, the wiring conductor 81 in contact with the covering insulating layer 72, and the magnetic body 2.

[0108] The thicknesses of the first wall portion 73 and the second wall portion 76 are greater than the thickness of the wiring conductor 81. With this configuration, the conductor upper surface 81a is located lower than the upper edge portions 732 and 762, and is therefore more reliably covered by the first wall portion 73, the second wall portion 76, and the covering insulating layer 72. Furthermore, compared to a configuration in which the thicknesses of the first wall portion 73 and the second wall portion 76 are smaller than the thickness of the wiring conductor 81, the thickness of the covering portion 721 can be made greater, thereby improving the insulation between the wiring conductor 81 and the upper wiring conductor 82. Therefore, deterioration in the insulation of the wiring conductor 81 can be further suppressed.

[0109] The covering insulating layer 72 has a covering side surface 72c that faces in the radial direction and is located closer to the second wall portion 76 in the radial direction than the outer wall surface 73b. With this configuration, the volume of the covering insulating layer 72 provided around the wiring conductor 81 (for example, the first region B1 and the second region B2) can be reduced at a position different from the protruding portion 722. This allows the volume of the magnetic body 2 to be increased by the amount of the reduced volume of the covering insulating layer 72. Therefore, the magnetic resistance around the wiring conductor 81 is reduced, further improving the inductance acquisition efficiency.

[0110] The coated upper surface 72b is smoother than the coated lower surface 72a. This configuration makes it easier to form connection wiring, upper wiring conductors 82, etc. on the coated upper surface 72b compared to a configuration in which the coated upper surface 72b is rougher than the coated lower surface 72a.

[0111] The coating 721 has a coating lower surface 721a that contacts the wiring conductor 81. The protrusion 722 has a protrusion lower surface 722a that faces the base insulating layer 71 in the vertical direction Z. The surface roughness of the coating lower surface 721a is different from the surface roughness of the protrusion lower surface 722a. This configuration allows the surface roughness of the coating lower surface 721a and the protrusion lower surface 722a to be changed in consideration of the adhesion between the wiring conductor 81, the coating insulating layer 72, and the magnetic body 2, thereby improving the design flexibility of the inductor component 1. For example, by making the surface roughness of the coating lower surface 721a greater than that of the protrusion lower surface 722a, the contact area between the coating insulating layer 72 and the wiring conductor 81 can be increased compared to a configuration in which the surface roughness of the coating lower surface 721a is smaller than that of the protrusion lower surface 722a. This increases the adhesion between the coating insulating layer 72 and the wiring conductor 81.

[0112] The protrusion 722 has a protrusion side surface 722b facing in the radial direction. In one example, the protrusion side surface 722b has a plurality of straight line portions 722c and 722d with different inclinations in a cross section of the wiring conductor 81. In another example, the protrusion side surface 722b has a straight line portion 722e and a curved line portion 722f in a cross section of the wiring conductor 81. With this configuration, the contact area between the protrusion 722 and the magnetic body 2 is increased, and the adhesion between the protrusion 722 and the magnetic body 2 is improved, compared to a configuration in which the protrusion side surface 722b is composed of a single straight line portion in the cross section.

[0113] The protrusion lower surface 722a has an inclined portion 722h that is inclined upward in the radial direction toward the first wall portion 73 in the cross section of the wiring conductor 81. With this configuration, the magnetic body 2 is disposed between the inclined portion 722h in the radial direction and the outer wall surface 73b. Therefore, the protrusion 722 is formed so as to bite downward into the magnetic body 2. This can improve the adhesion between the magnetic body 2 and the covering insulating layer 72 and the wiring conductor 81 in contact with the covering insulating layer 72.

[0114] The covering insulating layer 72 has a covering lower surface 72a facing the base insulating layer 71 in the vertical direction Z and a covering upper surface 72b opposite the covering lower surface 72a. The inductor component 1 further includes a third wall portion 74 provided on the covering upper surface 72b and extending around the second pivot axis A2, a fourth wall portion 77 provided on the covering upper surface 72b and extending parallel to the third wall portion 74 around the second pivot axis A2, and an upper wiring conductor 82. The upper wiring conductor 82 is located between the third wall portion 74 and the fourth wall portion 77 on the covering upper surface 72b and has an upper conductor upper surface 82a opposite the surface in contact with the covering insulating layer 72 in the vertical direction Z. The covering insulating layer 72 contains an inorganic filler. The transparency of the covering insulating layer 72 is lower than the transparency of the first wall portion 73 and the transparency of the second wall portion 76. The thickness of the coating portion 721 is smaller than the thickness of the first wall portion 73 and the thickness of the second wall portion 76. With this configuration, the inductor component 1 further includes an upper wiring conductor 82, thereby increasing the coil length and improving inductance acquisition efficiency. The coating insulating layer 72 contains an inorganic filler, thereby improving the insulation resistance and mechanical strength of the coating insulating layer 72. This allows the thickness of the coating insulating layer 72 to be reduced while suppressing a decrease in the insulation properties of the wiring conductor 81 and a decrease in the mechanical strength of the coating insulating layer 72, compared to a configuration in which the coating insulating layer 72 does not contain an inorganic filler. Furthermore, because the thickness of the coating insulating layer 72 is smaller than the thicknesses of the first wall portion 73 and the second wall portion 76, the volume of the coating insulating layer 72 in the inductor component 1 is reduced, compared to a configuration in which the thickness of the coating insulating layer 72 is greater than the thicknesses of the first wall portion 73 and the second wall portion 76. The volume of the magnetic body 2 can be increased by the amount corresponding to the reduction in the volume of the coating insulating layer 72. This reduces the magnetic resistance around the wiring conductor 81, improving the efficiency of obtaining inductance. Because the transparency of the covering insulating layer 72 is lower than the transparency of the first wall portion 73 and the second wall portion 76, the wiring conductor 81 covered by the covering insulating layer 72 is less visible from the outside of the inductor component 1. This makes it possible to suppress a decrease in yield due to appearance defects that do not affect the performance of the inductor component 1, such as differences in the degree of oxidation of the wiring conductor 81.

[0115] The inductor component 1 further includes an external terminal 101 provided on the main surface 202 of the magnetic body 2, and a connection wiring 61 provided on the magnetic body 2, extending in the up-down direction Z, and connecting the external terminal 101 and a wiring conductor (e.g., an upper wiring conductor 82). A pad portion (e.g., a pad portion 828) connected to the connection wiring 61 is provided at an end of the wiring conductor in a plan view. In a configuration in which the external terminal 101 is provided on a side surface of the magnetic body 2, a fillet must be provided. On the other hand, according to the above configuration, the external terminal 101 is provided on the main surface 202, and the external terminal 101 and the upper wiring conductor 82 are connected by the connection wiring 61. This eliminates the need to provide a fillet, and the number of components that can be arranged on the magnetic body 2 increases. That is, the packaging density of the inductor component 1 is improved.

[0116] The covering portion 721 has a first portion 724 that contacts the pad portion 818 in the vertical direction Z and a second portion 725 that contacts a portion of the wiring conductor 81 that is different from the pad portion 818 in the vertical direction Z. The thickness of the first portion 724 is smaller than the thickness of the second portion 725. With this configuration, when a via conductor 51 that connects to the pad portion 818 is provided in the first portion 724, the thickness of the via conductor 51 is smaller than in a configuration in which the pad portion 818 is thinner, and the mechanical stress that the via conductor 51 receives is reduced. This makes it possible to suppress malfunction of the inductor component 1 due to damage to the via conductor 51. Because the thickness of the via conductor 51 is reduced, the amount of residue generated during the formation of the via conductor 51 can be reduced, thereby improving the connection strength of the via conductor 51.

[0117] The protruding portion 722 is located closer to the first pivot axis A1 in the radial direction than the first wall portion 73. The covering insulating layer 72 further has an outward protruding portion 726 located on the opposite side of the first wall portion 73 from the covering portion 721 in the radial direction and farther from the first pivot axis A1 than the first wall portion 73. The thickness of the outward protruding portion 726 is different from the thickness of the protruding portion 722. With this configuration, the thickness of the protruding portion can be determined depending on whether the protruding portion is located in the first region B1 or the second region B2 of the magnetic body 2. This improves the design freedom of the inductor component 1.

[0118] The thickness of the protruding portion 722 is greater than the thickness of the outward protruding portion 726. In the first region B1 of the inductor component 1 where magnetic flux concentrates, the protruding portion 722 functions as an air gap. With this configuration, the air gap provided in the first region B1 is larger than in a configuration in which the thickness of the protruding portion 722 is greater than the thickness of the outward protruding portion 726. This makes it easier for the magnetic flux to saturate when the current flowing through the wiring conductor 81 increases. This improves the DC superposition characteristics of the inductor component 1.

[0119] The inductor component 1 further includes an upper covering insulating layer 75 laminated on the upper surface 82a of the upper conductor. The upper covering insulating layer 75 includes an upper covering portion 751 overlapping the upper wiring conductor 82 in a plan view and an upper protruding portion 752 located on the radially opposite side of the third wall portion 74 from the upper covering portion 751. The thickness of the upper protruding portion 752 is different from the thickness of the protruding portion 722. When the upper wiring conductor 82 is provided, the thickness of the magnetic body 2 increases compared to a configuration in which the upper wiring conductor 82 is not provided, and the mechanical strength of the inductor component 1 is likely to decrease. With this configuration, both the protruding portion 722 and the upper protruding portion 752 are provided and are each formed to dig into the magnetic body 2 in the radial direction. This improves the adhesion between the covering insulating layer 72, the wiring conductor 81, the upper covering insulating layer 75, and the upper wiring conductor 82 and the magnetic body 2, thereby improving the mechanical strength of the inductor component 1. Furthermore, according to the above configuration, the thickness of the protrusion 722 and the upper protrusion 752 can be determined taking into consideration the characteristics of the inductor component 1, the insulating properties of the wiring conductors 81 and 82, the deformation resistance of the protrusion 722 and the upper protrusion 752, etc., thereby improving the design freedom of the inductor component 1.

[0120] The thickness of the upper protrusion 752 is greater than the thickness of the protrusion 722. During the manufacturing process of the inductor component 1, the magnetic material constituting the magnetic body 2 is, for example, pressed downward. At this time, the upper protrusion 752 located at the top is subjected to greater mechanical stress than the protrusion 722 located at the bottom. According to the above configuration, the thickness of the upper protrusion 752 is greater than the thickness of the protrusion 722, and therefore the deformation resistance of the upper protrusion 752 is better than the deformation resistance of the protrusion 722. Therefore, damage to the upper covering insulating layer 75 during the manufacturing process of the inductor component 1 can be suppressed.

[0121] The portion of the covering insulating layer 72 sandwiched between the first wall portion 73 or the second wall portion 76 and the third wall portion 74 or the fourth wall portion 77 in the vertical direction Z (e.g., the middle portion 723) includes the portion of the covering insulating layer 72 where the thickness of the covering insulating layer 72 is the smallest. The portion of the covering insulating layer 72 sandwiched between the two wall portions 73, 76, 74, and 77 on the top and bottom has high insulation properties. By reducing the thickness of the covering insulating layer 72 in such a portion, the volume of the covering insulating layer 72 can be reduced while suppressing a decrease in the insulation properties of the wiring conductor 81. The volume of the magnetic body 2 can be increased by the amount corresponding to the decrease in the volume of the covering insulating layer 72. This reduces the magnetic resistance around the wiring conductor 81, improving the inductance acquisition efficiency. Therefore, the inductance acquisition efficiency can be improved while suppressing a decrease in the insulation properties of the wiring conductor.

[0122] The inductor component 1 may be configured to include wiring conductor layers located on three or more imaginary planes that are parallel to one another. In this case, three or more insulating layers may also be provided. On the other hand, the inductor component 1 may be configured without the third wall portion 74, the fourth wall portion 77, the upper wiring conductor 82, or the upper covering insulating layer 75.

[0123] Each of the base upper surface 71a and the covering upper surface 72b may be provided with one or more conductor layers.

[0124] The shape and size of each part constituting the inductor component 1 are not limited to the above-described embodiments and can be set arbitrarily depending on the design of the inductor component 1. For example, the thickness of the first conductor layer 11 of the inductor component 1 is not limited to being less than 1.0 μm and less than 1 / 100 of the thickness of the first inductor wiring.

[0125] Each inductor wiring may have a spiral shape when viewed in the vertical direction Z. For example, each inductor wiring may be a curve with one or more windings (turns), or a curve with less than one winding. Each inductor wiring may have a linear shape in part.

[0126] In the above embodiment, the upper wiring conductor 82 constitutes the "upper wiring conductor" in the present disclosure, but is not limited to this. For example, the upper wiring conductor 82 can also be an example of the "wiring conductor" in the present disclosure. In this case, the third wall portion 74 corresponds to the "first wall portion" in the present disclosure, and the fourth wall portion 77 corresponds to the "second wall portion" in the present disclosure. The covering insulating layer 72 corresponds to the "base insulating layer" in the present disclosure, and the upper covering insulating layer 75 corresponds to the "covering insulating layer" in the present disclosure.

[0127] The embodiments and modifications of the present disclosure can be combined with each other, or with modifications, or with each other. Features included in the embodiments and modifications of the present disclosure can also be combined with each other.

[0128] The disclosure of the present disclosure may vary in structural details, and changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the claimed disclosure. [Industrial Applicability]

[0129] According to the present disclosure, it is possible to reduce DC resistance while suppressing damage to the covering insulating layer, and therefore it is useful for various inductor components. [Explanation of symbols]

[0130] 1. Inductor components 2 Magnetic material 202 Main surface 51~54 Via conductors 51c Via side 61 Connection wiring 71 Base insulation layer 71a Base top surface 72 Insulating coating layer 72a Covered bottom surface 72b Top surface of coating 72c Coated Side 721 Covering part 721a Lower side of sheathing 722 Protrusion 722a Protruding lower surface 722b Projection side 722c 1st straight section 722d 2nd straight section 722e Straight section 722f Curved section 722h Slope 723 Middle section 73 1st wall section 73a Inner wall 73b External wall surface 731 Lower edge 732 Upper edge 74 Third wall 75 Top insulation layer 751 Upper covering part 752 Upper protrusion 76 Second wall section 761 Lower edge 762 Upper edge 77 4th wall 81 Wiring conductor 81a Conductor top surface 818 Pad section 82 Upper wiring conductor 82a Upper conductor top surface 101~106 External terminals A1 First pivot axis A2 2nd pivot axis

Claims

1. a base insulating layer having a base top surface; a first wall portion provided on the upper surface of the base portion and extending around a pivot axis along a vertical direction intersecting the upper surface of the base portion; a second wall portion provided on an upper surface of the base portion and extending parallel to the first wall portion around the pivot axis; a wiring conductor located between the first wall portion and the second wall portion on the base upper surface, the wiring conductor having a conductor upper surface that is the opposite surface to the surface that contacts the base insulating layer in the vertical direction; a covering insulating layer laminated on the upper surface of the conductor; a magnetic body covering the base insulating layer, the first wall portion, the second wall portion, the wiring conductor, and the covering insulating layer; Equipped with The covering insulating layer is a covering portion overlapping the wiring conductor in a plan view seen from the top-bottom direction; a protruding portion located on the opposite side of the covering portion with respect to the first wall portion in a radial direction relative to the pivot shaft; and a thickness of the protrusion in the up-down direction that is greater than the thickness of the covering portion; Inductor components.

2. The inductor component according to claim 1 , wherein the thickness of the first wall portion and the second wall portion is greater than the thickness of the wiring conductor.

3. the first wall portion has an inner wall surface that contacts the wiring conductor and an outer wall surface that is the opposite surface to the inner wall surface and contacts the magnetic body; The covering insulating layer has a covering side surface facing the radial direction and positioned closer to the second wall portion in the radial direction than the outer wall surface. The inductor component according to claim 1 or 2.

4. the covering insulating layer has a covering lower surface facing the base insulating layer in the vertical direction and a covering upper surface that is the surface opposite to the covering lower surface, the upper coated surface is smoother than the lower coated surface; The inductor component according to claim 1 or 2.

5. the covering portion has a covering portion lower surface that contacts the wiring conductor, the protrusion has a protrusion lower surface facing the base insulating layer in the up-down direction, The surface roughness of the lower surface of the covering portion is different from the surface roughness of the lower surface of the protrusion portion. The inductor component according to claim 4 .

6. The protrusion has a protrusion side surface facing the radial direction, the side surface of the protrusion has a plurality of straight line portions with different inclinations in a cross section intersecting with the direction in which the wiring conductor extends; The inductor component according to claim 1 or 2.

7. The protrusion has a protrusion side surface facing the radial direction, the side surface of the protrusion has a straight portion and a curved portion in a cross section intersecting with the direction in which the wiring conductor extends; The inductor component according to claim 1 or 2.

8. the protrusion has a protrusion lower surface facing the base insulating layer in the up-down direction, the lower surface of the protrusion has an inclined portion that is inclined upward in the radial direction toward the first wall portion in a cross section intersecting the direction in which the wiring conductor extends, The inductor component according to claim 1 or 2.

9. the covering insulating layer has a covering lower surface facing the base insulating layer in the vertical direction and a covering upper surface that is the surface opposite to the covering lower surface, a third wall portion provided on the upper surface of the coating and extending around the pivot axis; a fourth wall portion provided on the upper surface of the coating and extending parallel to the third wall portion around the pivot axis; an upper wiring conductor located between the third wall portion and the fourth wall portion on the coating upper surface, the upper wiring conductor having an upper conductor surface that is the opposite surface to the surface that contacts the coating insulating layer in the vertical direction; Further provided with the covering insulating layer contains an inorganic filler, the transparency of the covering insulating layer is lower than the transparency of the first wall portion and the transparency of the second wall portion; the thickness of the covering insulating layer is smaller than the thickness of the first wall portion and the thickness of the second wall portion; The inductor component according to claim 1 or 2.

10. an external terminal provided on an outer surface of the magnetic body; a connection wiring provided on the magnetic body, extending along the vertical direction, and connecting the external terminal and the wiring conductor; Further provided with a pad portion connected to the connection wiring is provided at an end portion of the wiring conductor in the plan view; The inductor component according to claim 1 or 2.

11. The covering portion is a first portion that contacts the pad portion in the vertical direction; a second portion that contacts a portion of the wiring conductor that is different from the pad portion in the vertical direction; and The thickness of the first portion is smaller than the thickness of the second portion. The inductor component according to claim 10.

12. the protrusion is located closer to the pivot axis than the first wall portion in the radial direction, the covering insulating layer further includes an outward protruding portion located on the opposite side of the covering portion with respect to the first wall portion in the radial direction and located farther from the pivot axis than the first wall portion, the thickness of the outward protrusion is different from the thickness of the protrusion; The inductor component according to claim 1 or 2.

13. The inductor component of claim 12 , wherein the thickness of the protrusion is greater than the thickness of the outward protrusion.

14. the covering insulating layer has a covering lower surface facing the base insulating layer in the vertical direction and a covering upper surface that is the surface opposite to the covering lower surface, a third wall portion provided on the upper surface of the coating and extending around the pivot axis; a fourth wall portion provided on the upper surface of the coating and extending parallel to the third wall portion around the pivot axis; an upper wiring conductor located between the third wall portion and the fourth wall portion on the coating upper surface, the upper wiring conductor having an upper conductor surface that is the opposite surface to the surface that contacts the coating insulating layer in the vertical direction; an upper covering insulating layer laminated on an upper surface of the upper conductor; Further provided with The upper covering insulating layer is an upper covering portion overlapping the upper wiring conductor in the plan view; an upper protrusion located on the opposite side of the third wall portion from the upper covering portion in the radial direction; and the thickness of the upper protrusion is different from the thickness of the protrusion; The inductor component according to claim 1 or 2.

15. The inductor component of claim 14 , wherein the thickness of the upper protrusion is greater than the thickness of the protrusion.

16. the covering insulating layer has a covering lower surface facing the base insulating layer in the vertical direction and a covering upper surface that is the surface opposite to the covering lower surface, a third wall portion provided on the upper surface of the coating and extending around the pivot axis; a fourth wall portion provided on the upper surface of the coating and extending parallel to the third wall portion around the pivot axis; an upper wiring conductor located between the third wall portion and the fourth wall portion on the coating upper surface, the upper wiring conductor having an upper conductor surface that is the opposite surface to the surface that contacts the coating insulating layer in the vertical direction; Further provided with a portion of the covering insulating layer sandwiched between the first wall portion or the second wall portion and the third wall portion or the fourth wall portion in the vertical direction includes a portion of the covering insulating layer where the thickness of the covering insulating layer is smallest; The inductor component according to claim 1 or 2.

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