Press device, press method, resin sealing device, and resin sealing method

Abstract

To provide a press device capable of adjusting the tilt of a movable platen, a press method, a resin sealing device, and a resin sealing method.SOLUTION: A press device comprises a base 252, a tie bar 254 that is erected on the base 252, a stationary platen 256 that is fixed to the tie bar 254, a movable platen 258 that moves in a vertical direction, and a drive part 260 for driving the movable platen 258. The drive part 260 is constituted to be capable of individually controlling a plurality of drive mechanisms 262. The movable platen 258 is constituted not to be guided by the tie bar 254.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a press apparatus, a press method, a resin sealing apparatus, and a resin sealing method. [Background technology]

[0002] 2. Description of the Related Art As examples of resin sealing apparatuses and resin sealing methods for sealing a workpiece having electronic components mounted on a substrate with sealing resin to form a molded product, transfer molding and compression molding methods are known.

[0003] The transfer molding method is a technology in which a pot is provided to supply a predetermined amount of resin to a pair of sealing regions (cavities) provided in a sealing mold comprising an upper mold and a lower mold, workpieces are placed in positions corresponding to the sealing regions, the upper and lower molds are clamped together, and the resin is poured from the pot into the cavity to seal the workpieces. The compression molding method is a technology in which a predetermined amount of sealing resin is supplied to a sealing region (cavity) provided in a sealing mold comprising an upper mold and a lower mold, the workpiece is placed in the sealing region, and the upper and lower molds are clamped together to seal the workpieces (see Patent Document 1: JP 2023-176518 A).

[0004] In either method, a press device is provided that closes the sealing mold to seal the workpiece with resin. The press device generally has a configuration in which the sealing mold is fixed to a pair of movable and fixed platens, and a closing force (pressure) is applied to the sealing mold by driving (pushing) the movable platen toward the fixed platen using a drive device. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2023-176518 Summary of the Invention [Problem to be solved by the invention]

[0006] To reduce the total thickness variation (TTV) of molded products, it is necessary to precisely adjust the distance between the fixed platen and the movable platen when the mold is closed so that the upper and lower dies are parallel. For this reason, the movable platen is generally configured to slide along tie bars, i.e., is guided by tie bars.

[0007] In press machines, there is a demand for adjusting the tilt of the movable platen for the purpose of molding adjustments. However, because the movable platen is configured to be guided by tie bars, the clearance between the movable platen and the tie bars is very small, making it nearly impossible (or difficult) to adjust the tilt of the movable platen. [Means for solving the problem]

[0008] The present invention has been made in view of the above circumstances, and has an object to provide a press apparatus, a press method, a resin sealing apparatus, and a resin sealing method in which the inclination of a movable platen can be adjusted.

[0009] The present invention solves the above problems by the solution means described below as one embodiment.

[0010] A press device according to one embodiment comprises a base, tie bars erected on the base, a fixed platen fixed to the tie bars, a movable platen that moves in an up-and-down direction, and a drive unit that drives the movable platen, wherein the drive unit is configured to be able to individually control a plurality of drive mechanisms, and the movable platen is configured not to be guided by the tie bars.

[0011] It is also preferable that the drive unit is made up of three of the drive mechanisms.

[0012] Furthermore, it is preferable that each of the drive mechanisms comprises a drive source, a nut rotatably mounted on the base, and a ball screw threaded onto the nut, and that the drive force of the drive source is transmitted to the nut, causing the nut to rotate, thereby causing the ball screw to move linearly in the vertical direction.

[0013] It is also preferable to further include a detection means for detecting the tilt state of the movable platen.

[0014] A resin sealing apparatus according to one embodiment is required to include the above-described press device.

[0015] Furthermore, a pressing method according to one embodiment is a pressing method using a pressing device that includes a base, tie bars erected on the base, a fixed platen fixed to the tie bars, a movable platen that moves in an up-and-down direction, and a drive unit that drives the movable platen, and requires that the method includes a step of adjusting the inclination of the movable platen after test pressing.

[0016] It is also preferable that the tilt state of the movable platen be detected by a detection means for detecting the tilt state of the movable platen.

[0017] Furthermore, a resin sealing method according to one embodiment is required to include the above-described pressing method. [Effects of the Invention]

[0018] The pressing device, pressing method, resin sealing device, and resin sealing method according to the present invention make it possible to adjust the tilt of the movable platen, thereby enabling the processing of high-precision molded products (with small TTV). [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a plan view illustrating an example of a resin sealing apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is a side view illustrating an example of a press device of the resin sealing apparatus according to the embodiment of the present invention. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4] 4 is a schematic enlarged view of a part of the cross section taken along line IV-IV in FIG. 2. [Figure 5] FIG. 3 is an enlarged view of a portion V in FIG. 2. DETAILED DESCRIPTION OF THE INVENTION

[0020] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a plan view (schematic diagram) showing an example of a resin sealing apparatus 1 according to this embodiment. For ease of explanation, arrows in the drawing indicate the left-right direction (X direction), the front-rear direction (Y direction), and the up-down direction (Z direction) of the resin sealing apparatus 1. In addition, in all the drawings used to explain each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

[0021] The resin sealing apparatus 1 according to this embodiment is an apparatus that seals a workpiece (molded product) with resin using a sealing mold 202 that includes an upper mold 204 and a lower mold 206. Hereinafter, the resin sealing apparatus 1 will be described taking as an example a compression molding apparatus that holds a workpiece with a workpiece holder 205 provided on the lower mold 206, covers a cavity 208 (including part of the mold surface) provided on the upper mold 204 in a corresponding arrangement with a release film (hereinafter simply referred to as "film"), clamps the upper mold 204 and the lower mold 206, and seals the workpiece with sealing resin. However, the present invention is not limited to this.

[0022] First, the workpiece to be molded has a configuration in which electronic components are mounted on a substrate (all not shown). More specifically, examples of the substrate include plate-shaped members such as a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, and a wafer. Examples of the electronic components include a semiconductor chip, an MEMS chip, a passive element, a heat sink, a conductive member, a spacer, and a coil sheet. The shape of the substrate may be rectangular (strip-shaped), square, circular, or the like. The number of electronic components mounted on one substrate may be one or multiple (for example, in a matrix).

[0023] Examples of methods for mounting electronic components on a substrate include wire bonding mounting, flip chip mounting, etc. Alternatively, in the case of a configuration in which the substrate (glass or metal carrier plate) is peeled off from the molded product after resin sealing, electronic components can be attached using a heat-peelable adhesive tape or an ultraviolet-curable resin that hardens when exposed to ultraviolet light.

[0024] On the other hand, an example of the sealing resin is a granular thermosetting resin (for example, an epoxy resin containing a filler). Note that the sealing resin is not limited to the above-mentioned granular resin, and may be a powder resin, a crushed resin, a solid resin, a liquid resin, or a resin that is a combination of two or more of these, or may be a resin other than an epoxy thermosetting resin.

[0025] As examples of films, film materials having excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride, are preferably used.

[0026] Next, an overview of the resin sealing apparatus 1 according to this embodiment will be described. As shown in FIG. 1, the resin sealing apparatus 1 mainly comprises a supply unit 100A that supplies workpieces and sealing resin, a press unit 100B that seals the workpieces with sealing resin and processes them into molded products, and a storage unit 100C that stores the molded products. As an example, the supply unit 100A, press unit 100B, and storage unit 100C are arranged in this order along the X direction in FIG. 1. However, the configuration is not limited to the above, and the equipment configuration within the unit, the number of units (particularly the number of press units), the arrangement order of the units, and the like can be changed. Furthermore, a configuration including units other than those described above (all not shown) is also possible.

[0027] Furthermore, the resin sealing apparatus 1 has a guide rail 300 linearly provided between each unit, and a transport device (first loader) 302 for transporting the workpiece and sealing resin, and a transport device (second loader) 304 for transporting the molded product are provided so as to be movable between predetermined units along the guide rail 300. However, the configuration is not limited to the above, and a configuration may also be adopted in which a common (single) transport device (loader) is provided for transporting the workpiece and the molded product (not shown). Furthermore, the transport device may be configured to include a robot hand or the like instead of a loader.

[0028] In addition, in the resin sealing apparatus 1, a control unit 150 that controls the operation of each mechanism in each unit is disposed in the supply unit 100A (it may be disposed in another unit).

[0029] (supply unit) The supply unit 100A is equipped with a work supply magazine 102 that stores a plurality of workpieces. A known stack magazine, slit magazine, or the like may be used as the work supply magazine 102. A work table (not shown) on which the workpieces taken out from the work supply magazine 102 are placed may also be provided.

[0030] The supply unit 100A (or another unit) is also provided with a resin supply mechanism 104 including a hopper, a feeder, etc. In this embodiment, the resin supply mechanism 104 supplies sealing resin to the upper surface of the workpiece taken out from the workpiece supply magazine 102. The workpiece to which the sealing resin has been supplied (placed) is held by the first loader 302, and is transported from the supply unit 100A to the press unit 100B and set at a predetermined position in the sealing mold 202.

[0031] (storage unit) The storage unit 100C is equipped with a storage magazine 112 that stores a plurality of molded products. A known stack magazine, slit magazine, or the like is used as the storage magazine 112. The molded products formed in the press unit 100B are held by the second loader 304, transported from the press unit 100B to the storage unit 100C, and stored in the storage magazine 112.

[0032] (Press unit) The press unit 100B is equipped with a sealing mold 202 having a pair of molds that can be opened and closed (for example, a combination of a plurality of mold blocks, mold plates, and other components made of alloy tool steel). The press unit 100B is also equipped with a press device 250 that opens and closes the sealing mold 202 to seal the workpiece with resin. As an example, the press unit 100B is configured to include one press device 250, but may also be configured to include multiple press devices (not shown).

[0033] The sealing mold 202 includes an upper mold 204 and a lower mold 206 as a pair of molds disposed between a pair of platens 256, 258 in the press device 250. The upper mold 204 is assembled to the platen 256 on the upper side in the vertical direction, and a cavity 208 is provided on the lower surface of the upper mold 204 (the surface on the lower mold 206 side). The lower mold 206 is assembled to the platen 258 on the lower side, and is provided with a workpiece holding portion 205 that holds a workpiece at a predetermined position on the upper surface of the lower mold 206 (the surface on the upper mold 204 side). The workpiece transferred from the supply unit 100A is held by the workpiece holding portion 205 of the lower mold 206, and is sealed with sealing resin by performing a clamping operation between the upper mold 204 and the lower mold 206, and is molded into a molded product.

[0034] In addition, in this embodiment, as an example, a film supply mechanism (not shown) is provided that transports (supplies) a roll-shaped film into the sealing mold 202. Note that, depending on the configuration of the workpiece, a strip-shaped film may be used instead of a roll-shaped film.

[0035] Next, the press device 250 will be described in detail. Fig. 2 is a side view of the press device 250. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 2. Fig. 4 is a schematic enlarged view of a portion of the cross-section taken along line IV-IV in Fig. 2. Fig. 5 is an enlarged view of part V in Fig. 2.

[0036] The press device 250 includes a base 252, a plurality of tie bars 254 erected on the base 252, a platen 256 suspended between the plurality of tie bars 254, a platen 258 disposed opposite the platen 256, and a drive unit 260 that drives the platen 258. In this embodiment, the platen 256 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 254), and the platen 258 on the lower side is set as a movable platen (a platen that moves in the axial direction (up and down direction) of the tie bars 254). However, this is not limiting, and the platen may be set upside down, i.e., the upper side may be a movable platen and the lower side may be a fixed platen (not shown).

[0037] The drive unit 260 is composed of multiple drive mechanisms 262. Each drive mechanism 262 includes a drive source 264 that is individually controlled by the control unit 150, a nut 268 rotatably attached to the base 252 via a bearing 266, and a ball screw 270 that is threadedly engaged with the nut 268 and protrudes from the base 252 so as to be parallel to the axial direction (vertical direction) of the tie bar 254. A pulley 272 is attached to the drive source 264, and a pulley 274 is attached to the nut 268, with a belt (not shown) stretched between the pulleys 272 and 274. When the drive source 264 is activated, a drive force (rotation) is transmitted to the nut 268 via the belt, causing the nut 268 to rotate. When the nut 268 rotates, the ball screw 270 moves linearly in the axial direction (vertical direction) of the tie bar 254. That is, the drive unit 260 is configured to drive the movable platen 258 in multiple axes by individually controlling the heights of a plurality of ball screws 270 connected in parallel to the movable platen 258 .

[0038] In this embodiment, the drive unit 260 is made up of three drive mechanisms 262A, 262B, and 262C, and the movable platen 258 is supported at three points and the height at each point is controlled, thereby defining the surface direction of the movable platen 258. It is also possible to support the movable platen 258 at four or more points and control the height at each point, thereby controlling the surface direction of the movable platen 258. However, three-point support has the advantages of facilitating the control of adjusting the tilt of the movable platen 258 and reducing the number of parts, thereby enabling the press device 250 to be made lighter and less expensive.

[0039] This allows the movable platen 258 to be driven with high precision, thereby realizing a configuration in which the movable platen 258 is not guided by the tie bars 254. Furthermore, by using a servo motor (not shown) as the drive source 264, the movable platen 258 can be driven with extremely high precision.

[0040] The press apparatus 250 also includes a plurality of link mechanisms 280 (the number of which corresponds to the number of drive mechanisms 262) that connect each drive mechanism 262 (ball screw 270) of the drive unit 260 to the movable platen 258. Each link mechanism 280 includes a bearing unit 282 that supports the movable platen 258, a pin (rotating shaft) 284 attached to the bearing unit 282, a first link member 286 that connects the ball screw 270 to the pin 284, and a second link member 288 that connects the movable platen 258 to the pin 284. In this embodiment, the bearing unit 282 is configured by externally fitting a case 282B onto a self-aligning roller bearing 282A. The pin 284 is provided so as to be perpendicular to the axial direction of the tie bar 254. The first link member 286 is a U-shaped member in cross section having a bottom portion 286A and both wall portions 286B, and an insertion hole 286b through which the pin 284 is inserted is formed in both wall portions 286B. The second link member 288 is a plate-shaped member in which a notch 288a into which the pin 284 is fitted is formed. That is, each link mechanism 280 is configured such that a bearing unit 282 is disposed at an inner position of the first link member 286, a second link member 288 is disposed at an outer position of the first link member 286, and the pin 284 passes through a hole 282a of the bearing unit 282 (self-aligning roller bearing 282A), an insertion hole 286b in both wall portions 286B of the first link member 286, and a notch 288a of the second link member 288.

[0041] With this, the first link member 286 restricts rotation of the ball screw 270, while the bearing unit 282 can allow tilt of the movable platen 258 (specifically, tilt in all directions within the range of the circumferential direction (arrow A) of the pin 284 and the allowable alignment angle θ of the self-aligning roller bearing 282A). Therefore, the movable platen 258 can follow the ball screws 270 that are set at different heights, that is, the movable platen 258 can be connected to each drive mechanism 262 so as to be tiltable. Furthermore, by reducing the number of parts and narrowing the gaps between the parts, it is possible to suppress transmission errors in the driving force and drive the movable platen 258 with high precision, and also to reduce the weight of the press device 250.

[0042] The press apparatus 250 according to this embodiment is provided with the above-described configuration, and thus is capable of adjusting the inclination of the movable platen 258. As a result, for example, after a step of assembling the sealing mold 202 to the fixed platen 256 and the movable platen 258 and performing a trial press, in a step of adjusting the molding based on the results of the trial press, the inclination of the movable platen 258 and, ultimately, the parallelism between the upper mold 204 and the lower mold 206 can be adjusted. This makes it possible to process a molded product with high precision (with a small TTV). Furthermore, the number of times the trial press process and the adjustment process are repeated can be reduced, significantly shortening the lead time.

[0043] As an example, the press device 250 may be configured to include a tilt detection means (not shown) that detects the tilt state of the movable platen 258. The tilt detection means is connected to the control unit 150, and the control unit 150 individually controls each drive source 264 based on a signal output from the tilt detection means. This makes it possible to detect the tilt state of the movable platen 258 and adjust the tilt of the movable platen 258 during the mold closing process in which the sealing mold 202 is closed (however, the tilt state may be detected constantly, or the tilt may be adjusted during a process other than the mold closing process). Note that the tilt detection means may include multiple sets of linear scales and probes that measure the drive amount of the movable platen 258, a load sensor that measures the load distribution on the movable platen 258, or the like (neither of which is shown).

[0044] As described above, the pressing apparatus, pressing method, resin sealing apparatus, and resin sealing method according to the present invention make it possible to adjust the tilt of the movable platen, thereby enabling the processing of high-precision molded products (with small TTV).

[0045] The press device 250 according to this embodiment has been described with reference to an example in which a sealing mold 202 (having a cavity 208 in the upper mold 204) for a resin sealing device using a compression molding method is attached, but the present invention is not limited to this and can be similarly applied to a sealing mold for a resin sealing device using a compression molding method (having a cavity in the lower mold 206) or a sealing mold for resin sealing using a transfer molding method (both not shown). [Explanation of symbols]

[0046] 1 Resin sealing equipment 202 Sealing mold 250 Press Equipment 252 Foundation 254 Tie Bar 256 Fixed Platen 258 Movable Platen 260 Drive Unit 280 Link Mechanism

Claims

1. The printing apparatus includes a base, tie bars erected on the base, a fixed platen fixed to the tie bars, a movable platen that moves in a vertical direction, and a drive unit that drives the movable platen, the drive unit is configured to be able to individually control a plurality of drive mechanisms, The movable platen is not guided by the tie bars. A press device characterized by:

2. The drive unit is composed of three of the drive mechanisms.

2. The press device according to claim 1, wherein:

3. The drive mechanism includes: a drive source, a nut rotatably provided on the base, and a ball screw threadedly engaged with the nut; The driving force of the driving source is transmitted to the nut, causing the nut to rotate, thereby causing the ball screw to move linearly in the vertical direction.

3. The press device according to claim 1 or 2, wherein:

4. Further comprising a detection means for detecting the tilt state of the movable platen.

3. The press device according to claim 1 or 2, wherein:

5. A resin sealing apparatus comprising the press device according to any one of claims 1 to 4.

6. A pressing method using a pressing device including a base, tie bars erected on the base, a fixed platen fixed to the tie bars, a movable platen that moves in a vertical direction, and a drive unit that drives the movable platen, The method further comprises a step of adjusting the inclination of the movable platen after the step of performing test printing. A pressing method characterized by:

7. The tilt state of the movable platen is detected by a detection means for detecting the tilt state of the movable platen.

7. The pressing method according to claim 6, wherein:

8. A resin sealing method comprising the pressing method according to claim 6 or 7.

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