Semiconductor package

Abstract

To provide a semiconductor package.SOLUTION: The technical concept of the present invention provides a semiconductor package which includes a package substrate comprising a substrate body having an upper surface and a lower surface opposite the upper surface, and a plurality of substrate pads arranged in spaced apart relation on the lower surface; and a plurality of interconnected balls physically connected to a plurality of substrate pads, and in which a plurality of interconnected balls include metal core solder balls containing a metal core, and a plurality of core-free solder balls having the same volume as the metal core solder balls.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to semiconductor packages. [Background technology]

[0002] As electronic devices become smaller, semiconductor packages tend to become lighter, thinner, and smaller. Furthermore, as the functions of electronic devices become more complex, modular semiconductor packages, in which multiple semiconductor packages are mounted on a package substrate, are becoming more common. This can lead to warpage, or bending of the package substrate, due to thermal and mechanical stresses applied to the semiconductor package or package substrate included in the modular semiconductor package. Summary of the Invention [Problem to be solved by the invention]

[0003] SUMMARY OF THE INVENTION An object of the present invention is to provide a board-level semiconductor package that can easily electrically connect a semiconductor package or a module semiconductor package including a warped package substrate to a board substrate. [Means for solving the problem]

[0004] The technical idea of ​​the present invention to solve the above problem provides a semiconductor package including: a package substrate including a substrate body having an upper surface and a lower surface opposite to the upper surface, and a plurality of substrate pads arranged spaced apart from each other on the lower surface; and a plurality of connecting balls physically connected to the plurality of substrate pads, wherein the plurality of connecting balls include metal-core solder balls including a metal core, and a plurality of core-free solder balls having the same volume as the metal-core solder balls.

[0005] The technical idea of ​​the present invention to solve the above problem provides a semiconductor package including: a package substrate including a substrate body having an upper surface and a lower surface opposite to the upper surface, and a plurality of substrate pads arranged spaced apart from each other on the lower surface; and a plurality of connecting balls physically connected to the plurality of substrate pads; wherein the plurality of connecting balls include a first metal core solder ball including a first metal core, a plurality of core-free solder balls, and a second metal core solder ball arranged between the first metal core solder ball and the plurality of core-free solder balls and including a second metal core having a larger diameter than the first metal core, and wherein the first metal core solder ball, the second metal core solder ball, and the plurality of core-free solder balls have the same volume as each other.

[0006] The technical idea of ​​the present invention to solve the above problem provides a semiconductor package including: a package substrate including a substrate body having an upper surface and a lower surface opposite to the upper surface, and a plurality of substrate pads arranged spaced apart from each other on the lower surface; and a plurality of connecting balls physically connected to the plurality of substrate pads; wherein the package substrate has a downwardly convex negative warpage, and the plurality of connecting balls include a first metal core solder ball arranged at a center of the package substrate and including a first metal core, a second metal core solder ball arranged adjacent to the first metal core solder ball and including a second metal core having a larger diameter than the first metal core, and a plurality of core-free solder balls arranged adjacent to the second metal core solder ball, and the first metal core solder ball, the second metal core solder ball, and the plurality of core-free solder balls have the same volume as each other. [Effects of the Invention]

[0007] The semiconductor package of the present invention may include a plurality of metal core solder balls each having a metal core with a different diameter. Since the package substrate of the semiconductor package is prone to warping, it is necessary to solve the problem of height differences due to warping when the solder balls attached to the package substrate are attached to the board substrate.

[0008] The metal core solder balls arranged on the outermost periphery of the package substrate having an upward convex warp may have a relatively small diameter metal core and a relatively large volume core solder layer. Since the metal core solder balls arranged on the outermost periphery of the package substrate are subject to higher stress than the metal core solder balls arranged in the center, the volume of the core solder layer may be increased to alleviate the burden of stress applied to the metal core.

[0009] In addition, the vertical distance between the package substrate and the board substrate at the outermost edge of the package substrate is narrower than the vertical distance between the package substrate and the board substrate at the center of the package substrate, so that the diameter of the metal core solder ball is relatively small and a core solder layer with sufficient volume can be provided to easily connect the package substrate and the board substrate.

[0010] The vertical spacing between the package substrate and the board substrate at the center of the package substrate is relatively wide, so that the core-free solder balls disposed at the center of the package substrate have a sufficient vertical length to easily connect the package substrate and the board substrate. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a cross-sectional view showing a semiconductor package according to an embodiment of the present invention; [Figure 2] 2 is a cross-sectional view illustrating the connection between the board substrate and the module-type semiconductor package in FIG. 1. FIG. [Figure 3] 2 is an enlarged cross-sectional view of a portion of the semiconductor package shown in FIG. 1. FIG. [Figure 4] 2 is an enlarged cross-sectional view of a metal core solder ball used in the semiconductor package shown in FIG. 1. [Figure 5] FIG. 4 is an example of a planar layout diagram showing connection balls arranged on substrate pads of the package substrate of FIGS. 1 and 3. [Figure 6A]6 is a perspective view showing an example of a process of forming solder balls on substrate pads of the package substrate of FIG. 5. FIG. [Figure 6B] 6 is a perspective view showing an example of a process of forming solder balls on substrate pads of the package substrate of FIG. 5. FIG. [Figure 6C] 6 is a perspective view showing an example of a process of forming solder balls on substrate pads of the package substrate of FIG. 5. FIG. [Figure 6D] 6 is a perspective view showing an example of a process of forming solder balls on substrate pads of the package substrate of FIG. 5. FIG. [Figure 6E] 6 is a perspective view showing an example of a process of forming solder balls on substrate pads of the package substrate of FIG. 5. FIG. [Figure 6F] 6 is a perspective view showing an example of a process of forming solder balls on substrate pads of the package substrate of FIG. 5. FIG. [Figure 6G] 6 is a perspective view showing an example of a process of forming solder balls on substrate pads of the package substrate of FIG. 5. FIG. [Figure 6H] 6 is a perspective view showing an example of a process of forming solder balls on substrate pads of the package substrate of FIG. 5. FIG. [Figure 6I] 6 is a perspective view showing an example of a process of forming solder balls on substrate pads of the package substrate of FIG. 5. FIG. [Figure 6J] 6 is a perspective view showing an example of a process of forming solder balls on substrate pads of the package substrate of FIG. 5. FIG. [Figure 7] FIG. 10 is a planar layout diagram showing connection balls arranged on substrate pads of a package substrate according to another embodiment of the technical concept of the present invention. [Figure 8] 10 is a cross-sectional view showing a semiconductor package according to another embodiment of the present invention; [Figure 9] 9 is an enlarged cross-sectional view of a portion of the semiconductor package shown in FIG. 8. FIG. [Figure 10]9 is a partially enlarged planar layout diagram of the semiconductor package shown in FIG. 8. FIG. [Figure 11] 10 is a cross-sectional view showing a semiconductor package according to another embodiment of the present invention; [Figure 12] 1 is a cross-sectional view showing a semiconductor package according to an embodiment of the present invention, the semiconductor package including a package substrate having negative warpage; [Figure 13] 13 is a planar layout diagram showing connection balls arranged on substrate pads of the package substrate of FIG. 12. FIG. [Figure 14] 10 is a planar layout diagram showing connection balls arranged on substrate pads of a package substrate according to another embodiment of the technical concept of the present invention; FIG. [Figure 15] 10 is a cross-sectional view showing a semiconductor package according to another embodiment of the present invention, which includes a package substrate having negative warpage. [Figure 16] 16 is an enlarged cross-sectional view of a portion of the semiconductor package shown in FIG. 15. [Figure 17] FIG. 16 is a partially enlarged planar layout diagram of the semiconductor package of FIG. [Figure 18] 10 is a cross-sectional view showing a semiconductor package according to another embodiment of the present invention, which includes a package substrate having negative warpage. [Figure 19] 10 is a cross-sectional view showing a semiconductor package according to another embodiment of the present invention; [Figure 20] 1 is a block diagram illustrating a schematic configuration of a semiconductor package according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as being limited to the embodiments described below, and may be embodied in various other forms. The following embodiments are provided not to complete the present invention, but to fully convey the scope of the present invention to those skilled in the art.

[0013] FIG. 1 is a cross-sectional view of a semiconductor package 10 according to an embodiment of the technical concept of the present invention.

[0014] 1, the semiconductor package 10 may include a module-type semiconductor package 500 including a board substrate 100, a package substrate 200, and a plurality of semiconductor devices 241 and 242, and connecting balls 300. Hereinafter, in the drawings, a first horizontal direction (X direction) may be a direction parallel to the board substrate 100, a second horizontal direction (Y direction) may be a direction parallel to the board substrate 100 and perpendicular to the first horizontal direction (X direction), and a vertical direction (Z direction) may be a direction perpendicular to the board substrate 100. The semiconductor package 10 referred to in this specification may be a board-level semiconductor package.

[0015] The board substrate 100 may include a board body 110 having an upper surface 110a and a lower surface 110b, a plurality of board pads 130 spaced apart from one another on the upper surface 110a of the board body 110, and a board protection layer 120 insulating the board pads 130.

[0016] The board body 110 may include at least one of a prepreg resin, a thermosetting epoxy resin, a thermoplastic epoxy resin, and a resin containing a filler. The board substrate 100 may refer to the board body 110 in a narrow sense. The board substrate 100 may also be referred to as a motherboard substrate. The board substrate 100 may be a printed circuit board (PCB).

[0017] The board pads 130 may be arranged spaced apart in a first horizontal direction (X direction) and a second horizontal direction (Y direction) on the upper surface 110a of the board body 110. The board pads 130 may be a single layer or a composite layer of a metal such as tin, silver, or copper. The board protection layer 120 may be arranged in an area of ​​the upper surface 110a of the board body 110 excluding the board pads 130. The board protection layer 120 may be a solder resist layer.

[0018] The package substrate 200 may include a substrate body 210 having an upper surface 210a and a lower surface 210b, a plurality of substrate pads 230 spaced apart from one another on the lower surface 210b of the substrate body 210, and a substrate protection layer 220 insulating the substrate pads 230.

[0019] The substrate body 210 may include at least one of a prepreg resin, a thermosetting epoxy resin, a thermoplastic epoxy resin, and a resin including a filler. The package substrate 200 may refer to the substrate body 210 in a narrow sense. The package substrate 200 may be a printed circuit board (PCB).

[0020] The package substrate 200 may have warpage due to the manufacturing process. In some embodiments, the package substrate 200, i.e., the substrate body 210, may have a positive warpage that is convex upward. The substrate pads 230 may be spaced apart in a first horizontal direction (X direction) and a second horizontal direction (Y direction) on the lower surface 210b of the substrate body 210.

[0021] The substrate pads 230 are a single layer or a composite layer of a metal such as tin, silver, copper, etc. The substrate protection layer 220 may be disposed on the lower surface 210b of the substrate body 210 in an area excluding the substrate pads 230. The substrate protection layer 220 may be a solder resist layer.

[0022] A plurality of semiconductor devices 241, 242 are disposed spaced apart from one another on the upper surface 210a of the package substrate 200, i.e., the substrate body 210. The semiconductor devices 241, 242 may include memory semiconductor packages and non-memory semiconductor packages. The semiconductor devices 241, 242 may include a first semiconductor device 241 and a second semiconductor device 242 in cross section. In the cross section of this embodiment, the semiconductor devices 241, 242 include two semiconductor devices, but it is sufficient that at least one semiconductor device is disposed. The plurality of semiconductor devices 241, 242 may be mounted on the substrate body 210 using a flip chip method, a wire bonding method, or the like. The method for mounting the plurality of semiconductor devices 241, 242 on the substrate body 210 is not limited thereto.

[0023] A structure including the package substrate 200 and the semiconductor devices 241, 242 arranged on the substrate body 210 is also referred to as a modular semiconductor package 500. In this embodiment, a plurality of semiconductor devices 241, 242 are arranged on the package substrate 200, but in some embodiments, a semiconductor chip may be arranged on the package substrate 200.

[0024] In addition, the package substrate 200 may further include a stiffener 250 extending along the outer edge of the upper surface 210a of the substrate body 210 and enclosing the plurality of semiconductor devices 241, 242 in the lateral direction (X direction and / or Y direction). The stiffener 250 has a frame shape and may serve to reduce warpage of the substrate body 210 during the package formation process. In one embodiment, the stiffener 250 may include a metal material such as copper (Cu). However, the material included in the stiffener 250 is not limited to a metal material and may include glass fiber.

[0025] The connection balls 300 may be disposed between the board substrate 100 and the package substrate 200 to electrically connect the board pads 130 and the substrate pads 230. The connection balls 300 may include a plurality of first metal core solder balls 310, second metal core solder balls 320, first core-free solder balls 330, and second core-free solder balls 340.

[0026] The first metal core solder ball 310 may include a first metal core 312 and a first core solder layer 314 surrounding the first metal core 312. The second metal core solder ball 320 may include a second metal core 322 and a second core solder layer 324 surrounding the second metal core 322. In this case, the first metal core solder ball 310 and the second metal core solder ball 320 may have the same volume, and the second metal core 322 may have a larger diameter than the first metal core 312. In one embodiment, the first metal core 312 and the second metal core 322 may be spherical. However, the shapes of the first metal core 312 and the second metal core 322 are not necessarily limited to spherical, and if they have other shapes, the height of the second metal core 322 in the vertical direction (Z direction) may be greater than the height of the first metal core 312 in the vertical direction (Z direction). The first metal core 312 and the second metal core 322 may include at least one of copper (Cu), nickel (Ni), a copper-coated polymer, or a nickel-coated polymer, and the melting points of the first metal core 312 and the second metal core 322 may be 260° C. or higher. The first core solder layer 314 and the second core solder layer 324 may include a solder composition including Sn as a base metal and Ag, Cu, Bi, and Ni as auxiliary metals.

[0027] The plurality of core-free solder balls 330, 340 may include a first core-free solder ball 330 and a second core-free solder ball 340. The core-free solder balls 330, 340 may refer to solder balls without a metal core. The second core-free solder ball 340 may be a core-free solder ball located in the center of the package substrate 200, and the first core-free solder ball 330 may be a core-free solder ball located in a first horizontal direction (X direction) with the second core-free solder ball 340 sandwiched therebetween.

[0028] The height of the second core-free solder ball 340 in the vertical direction (Z direction) is greater than the height of the first core-free solder ball 330 in the vertical direction (Z direction). The package substrate 200 shown in FIG. 1 may have a positive warpage that is convex upward at its center. Therefore, when the connecting ball 300 attached to the package substrate 200 is attached to the board pad 130, it is necessary to overcome the problem caused by the vertical gap due to the warpage. The vertical gap between the package substrate 200 and the board substrate 100 at the center of the package substrate 200 is relatively wider than that at the outer periphery. Therefore, in order to stably connect the board pad 230 located at the center of the package substrate 200 and the board pad 130 located at the center of the board substrate 100, the second core-free solder ball 340 has a relatively large height in the vertical direction (Z direction). The height of the second core-free solder balls 340 in the vertical direction (Z direction) is increased, and the connectivity of the solder balls, that is, the solderability, may be improved.

[0029] The first core-free solder ball 330 and the second core-free solder ball 340 may be made of a solder material. In this case, the solder material may be made of the same material as the first core solder layer 314 and the second core solder layer 324. The core-free solder balls 330, 340, the first metal core solder ball 310, and the second metal core solder ball 320 may be disposed on the board pad 230 to electrically connect the board pad 130 and the board pad 230. The strength of the first metal core solder ball 310 and the second metal core solder ball 320 is greater than that of the core-free solder balls 330, 340.

[0030] As described above, the package substrate 200 may have warpage during the manufacturing process. For example, as described above, the package substrate 200, i.e., the substrate body 210, may have a positive warpage that is convex upward. As a result, the first metal core solder balls 310 and the second metal core solder balls 320 may be disposed at the outer periphery of the package substrate 200. In particular, the first metal core solder balls 310 may be disposed at the outermost periphery of the package substrate 200, and the second metal core solder balls 320 may be disposed closer to the center of the package substrate 200 than the first metal core solder balls 310. By disposing the metal core solder balls at the outer periphery of the package substrate 200, which has a positive warpage, it is possible to prevent short circuits between the connecting balls at the outer periphery of the package substrate 200. If the volume of the solder material of a connecting ball disposed at the outer periphery of the package substrate 200 is excessively large, the probability of short circuits between adjacent connecting balls increases. To prevent this, the connection balls (e.g., the first metal core solder ball 310 and the second metal core solder ball 320) disposed in the outer shell may include a metal core to reduce the volume of the solder material contained in the connection balls in the outer shell.

[0031] FIG. 2 is a cross-sectional view illustrating the combination of the board substrate and the modular semiconductor package 500 shown in FIG.

[0032] Specifically, the same reference numerals in Fig. 2 as in Fig. 1 indicate the same components. In Fig. 2, the contents described in Fig. 1 are explained briefly or omitted. The semiconductor package 10 can couple a board substrate 100 and a modular semiconductor package 500 including semiconductor devices 241 and 242 mounted on a package substrate 200 using connecting balls 300p.

[0033] The semiconductor package 10 may be formed by disposing a modular semiconductor package 500, each having connection balls 300p formed on its bottom, on a board substrate 100, and bonding the board pads 130 of the board substrate 100 to the connection balls 300p by using solder paste 350. The connection balls 300p shown in FIG. 2 are connection balls that are not fused with the solder paste 350, unlike the connection balls 300 shown in FIG.

[0034] More specifically, the board substrate 100 may include a board body 110 having an upper surface 110a and a lower surface 110b, a plurality of board pads 130 spaced apart from one another on the upper surface 110a of the board body 110, and a board protection layer 120 insulating the board pads 130.

[0035] The package substrate 200 may include a substrate body 210 having an upper surface 210a and a lower surface 210b, a plurality of substrate pads 230 spaced apart from one another on the lower surface 210b of the substrate body 210, and a substrate protection layer 220 insulating the substrate pads 230. A connecting ball 300p is disposed on the substrate pad 230 disposed on the lower surface 210b of the substrate body 210.

[0036] The connected balls 300p may include a plurality of metal-core solder balls 310p, 320p and a plurality of core-free solder balls 330p, 340p. Unlike the plurality of metal-core solder balls 310, 320 and the plurality of core-free solder balls 330p, 340 shown in FIG. 1, the plurality of metal-core solder balls 310p, 320p and the plurality of core-free solder balls 330p, 340p shown in FIG. 2 are connected balls before being fused with solder paste 350. Therefore, the plurality of metal-core solder balls 310p, 320p and the plurality of core-free solder balls 330p, 340p have the same width in the lateral direction (X direction and / or Y direction) and the same height in the vertical direction (Z direction). The plurality of solder pastes 350 have the same volume. Therefore, even when the connecting balls 300p of FIG. 2 are fused with the solder paste 350, the connecting balls 300 can maintain the same volume as each other, as shown in FIG.

[0037] Semiconductor devices 241 and 242 are disposed spaced apart from each other on the upper surface 210a of the substrate body 210. The connecting balls 300p may include a plurality of metal-core solder balls 310p and 320p and a plurality of core-free solder balls 330p and 340p. The package substrate 200, i.e., the substrate body 210, may have a positive warpage that is convex upward.

[0038] Because the package substrate 200 has a positive convex warp upward, the gap between the outer periphery of the package substrate 200 and the outer periphery of the board substrate 100 is small, and the gap between the center of the package substrate 200 and the center of the board substrate 100 is large. As a result, even if the gap between the package substrate 200 and the board substrate 100 is narrow, the outer periphery of the package substrate 200 can accommodate metal core solder balls 310p, 320p, which can prevent short circuits between adjacent solder balls and improve package flatness.

[0039] First and second core-free solder balls 330p and 340p may be disposed in the center of the package substrate 200. The first and second core-free solder balls 330p and 340p may have a larger volume than the core solder layers 314p and 324p of the first and second metal-core solder balls 310p and 320p. The larger the volume of these solder balls, the higher the connectivity, such as the wetting of the connecting balls. As a result, the center of the package substrate 200 may easily connect the package substrate 200 and the board substrate 100 using the core-free solder balls 330p and 340p, even if the gap between the package substrate 200 and the board substrate 100 is wide.

[0040] FIG. 3 is an enlarged cross-sectional view of a portion of the semiconductor package 10 shown in FIG.

[0041] Hereinafter, the description of the components already mentioned in FIG. 1 will be omitted or will be briefly described.

[0042] 3, the diameter d of the plurality of substrate pads 230 may be the same. Also, because the package substrate 200 has a positive warp, the connecting balls 300 increase in height in the vertical direction (Z direction) from the outer periphery to the center of the package substrate 200. That is, the vertical height (h1) of the first metal core solder ball 310 in the vertical direction (Z direction) is lower than the vertical height (h2) of the second metal core solder ball 320 in the vertical direction (Z direction), and the vertical height (h2) of the second metal core solder ball 320 in the vertical direction (Z direction) is lower than the vertical height (h3) of the first core-free solder ball 330 in the vertical direction (Z direction). Also, the vertical height (h3) of the first core-free solder ball 330 in the vertical direction (Z direction) is lower than the vertical height (h4) of the second core-free solder ball 340.

[0043] However, since the volumes of the connecting balls 300 are all the same, the width in the lateral direction (X direction and / or Y direction) of the first metal core solder ball 310 is larger than the width in the lateral direction (X direction and / or Y direction) of the second metal core 320, which in turn is wider than the width in the lateral direction (X direction and / or Y direction) of the first core-free solder ball 330. Also, the width in the lateral direction (X direction and / or Y direction) of the first core-free solder ball 330 is wider than the width in the lateral direction (X direction and / or Y direction) of the second core-free solder ball 340.

[0044] In addition, the diameter c1 of the first metal core 312 is smaller than the diameter c2 of the second metal core 322. Since the gap between the package substrate 200 and the board substrate 100 is narrowest at the outermost periphery of the package substrate 200, the diameter c1 of the first metal core 312 is smaller than the diameter c2 of the second metal core 322.

[0045] According to one embodiment, the diameter c1 of the first metal core 312 may be 0.3 to 0.9 times the height in the vertical direction (Z direction) of the nearest core-free solder ball, and the diameter c2 of the second metal core 322 may be 0.5 to 0.9 times the height in the vertical direction (Z direction) of the nearest core-free solder ball. For example, the diameter c1 of the first metal core 312 may be 0.3 to 0.9 times the height h3 in the vertical direction (Z direction) of the first core-free solder ball 330. Furthermore, the diameter c2 of the second metal core 322 may be 0.5 to 0.9 times the height h3 in the vertical direction (Z direction) of the first core-free solder ball 330. If the diameter c1 of the first metal core 312 or the diameter c2 of the second metal core 322 is greater than 0.9 times the height in the vertical direction (Z direction) of the nearest adjacent core-free solder ball, the amount of the first core solder layer 314 and the second core solder layer 324 will be too small, resulting in poor solderability between the substrate pad 230 and the board pad 130. If the diameter c1 of the first metal core 312 is less than 0.3 times the height in the vertical direction (Z direction) of the nearest adjacent core-free solder ball or the diameter c2 of the second metal core 322 is less than 0.5 times the height in the vertical direction (Z direction) of the nearest adjacent core-free solder ball, the volume of the metal core will be too small, increasing the likelihood of short circuits occurring with adjacent connecting balls and potentially increasing the stress applied to the first metal core solder ball 310 and the second metal core solder ball 320.

[0046] Fig. 4 is an enlarged cross-sectional view of a first metal core solder ball 310p used in the semiconductor package 10 shown in Fig. 2. Hereinafter, a description will be given with reference to Fig. 4 as well as Fig. 2.

[0047] Specifically, as described above, the semiconductor package 10 of FIG. 2 uses a first metal core solder ball 310p including a first metal core 312p and a first core solder layer 314p surrounding the first metal core 312p, and a second metal core solder ball 320p including a second metal core 322p and a second core solder layer 324p surrounding the second metal core 322p.

[0048] As shown in FIG. 4, the semiconductor package 10 of FIG. 2 uses a metal core solder ball 310p including a metal core 312p, an interface layer 313p surrounding the metal core 312p, and a core solder layer 314p surrounding the interface layer 313p. The interface layer 313p is a material layer that facilitates bonding between the metal core 312p and the core solder layer 314p. In some embodiments, the interface layer 313p may be a nickel (Ni) layer. The first metal core solder ball 310p shown in FIG. 4 is a detailed version of the first metal core solder ball 310p shown in FIG. 1. Although only the first metal core solder ball 310p is shown in FIG. 4, the second metal core solder ball 320p may have a similar structure to the first metal core solder ball 310p, differing only in the volume of its metal core and core solder layer.

[0049] FIG. 5 is an example of a planar layout diagram showing the connection balls 300 arranged on the substrate pads 230 of the package substrate 200 of FIGS.

[0050] Specifically, in Figures 5 and 6, the same component numbers as in Figures 1 to 3 indicate the same components. In Figures 5 and 6, the contents explained in Figures 1 and 3 are explained briefly or omitted. The planar layout diagram SBL in Figure 5 shows connecting balls 300 arranged on the lower surface 210b of the substrate body 210 that constitutes the package substrate 200. Figure 1 is also a cross-sectional view taken along line A-A' in Figure 5.

[0051] The package substrate 200, i.e., the substrate body 210, may have a rectangular shape. The connection balls 300 may be disposed on the substrate pads 230 on the lower surface 210b of the substrate body 210. A substrate protection layer 220 for insulating the substrate pads 230 may be disposed on the lower surface 210b of the substrate body 210.

[0052] The connecting ball 300 may include a first metal core solder ball 310 , a second metal core solder ball 320 , a first core-free solder ball 330 , and a second core-free solder ball 340 .

[0053] The first and second metal core solder balls 310 and 320 may be disposed on outer peripheries CSBR1-1 and CSBR1-2 of the package substrate 200, i.e., the substrate body 210. The first metal core solder ball 310 may be disposed on the first outer periphery CSBR1-1 near the two edges of the rectangular package substrate 200. The first outer periphery CSBR1-1 is the outer periphery closest to the two edges of the package substrate 200. The second metal core solder ball 320 may be disposed on the second outer periphery CSBR1-2 adjacent to the first outer periphery CSBR1-1 of the rectangular package substrate 200. The second outer periphery CSBR1-2 is located on the outer periphery of the substrate body 210, but is located closer to the center of the substrate body 210 than the first outer periphery CSBR1-1.

[0054] In some embodiments, the first metal core solder balls 310 may be disposed only on the first outer portion CSBR1-1, and the second metal core solder balls 320 may be disposed only on the second outer portion CSBR1-2. In some embodiments, the first metal core solder balls 310 and the second metal core solder balls 320 in FIG. 5 are disposed near both edges of the package substrate 200, but are not disposed near some of the edges.

[0055] The first and second core-free solder balls 330, 340 may be disposed in the center (SBR) of the package substrate 200, i.e., the substrate body 210. The first and second core-free solder balls 330, 340 may be disposed inside the second outer borders (CSBR1-2) of the rectangular package substrate 200. The second core-free solder ball 340 may be disposed in the center (SBR) of the substrate body 210. The second core-free solder balls 340 may be formed in plural, and the plurality of second core-free solder balls 340 may be arranged in parallel along the second horizontal direction (Y direction). The first core-free solder balls 330 may also be formed in plural, and the plurality of first core-free solder balls 330 may also be arranged in parallel in a row along the second horizontal direction (Y direction). In this case, the plurality of first core-free solder balls 330 in one row and the plurality of first core-free solder balls 330 in the other row, sandwiching the second core-free solder balls 340 therebetween, may be arranged spaced apart in the second horizontal direction (Y direction).

[0056] 6A to 6J are perspective views illustrating an example of a process of forming connection balls 300 on the substrate pads 230 of the package substrate of FIGS. 1 and 5. FIG.

[0057] 6A, a plurality of substrate pads 230 are formed on a package substrate 200. The plurality of substrate pads 230 are spaced apart from each other in a first horizontal direction (X direction) and a second horizontal direction (Y direction).

[0058] The diameters of the substrate pads 230 formed on the package substrate 200 may be the same. However, depending on the embodiment, the diameter of the substrate pads located on the outermost periphery of the package substrate 200 may be the largest, and the diameter of the substrate pads may become smaller toward the center of the package substrate 200.

[0059] 6B, a first solder mask 410a having first openings 420a is disposed on the package substrate 200. The first openings 420a disposed in the first solder mask 410a may be formed to correspond to the substrate pads 230. A first metal core solder material 430a is coated or applied onto the first solder mask 410a.

[0060] 6C, first metal core solder balls 310 may be formed on substrate pads 230 by passing first metal core solder material 430b through first openings 420a formed in first solder mask 410a of FIG. 6B. The substrate pads 230 and first metal core solder balls 310 are bonded to each other through a heat treatment.

[0061] 6D, a first metal core solder ball 310 may be formed on a substrate pad 230 of a package substrate 200. The first metal core solder ball 310 may be formed on an outer periphery of the package substrate 200.

[0062] 6E, a second solder mask 410b having second openings 420b is disposed on the package substrate 200. The second openings 420b disposed in the second solder mask 410b may be formed to correspond to the substrate pads 230. A second metal core solder material 430b is coated or applied onto the second solder mask 410b. The second openings 420b of the second solder mask 410b are arranged closer to the center of the package substrate 200 than the first openings 420a of the first solder mask 410a of FIG. 6B.

[0063] 6F, second metal core solder balls 320 may be formed on substrate pads 230 by passing second metal core solder material 430b through second openings 420b formed in second solder mask 410b of FIG. 6E. The substrate pads 230 and second metal core solder balls 320 are bonded to each other through a heat treatment.

[0064] 6G, a second metal core solder ball 320 may be formed on a substrate pad 230 of a package substrate 200. The second metal core solder ball 320 may be formed closer to the center of the package substrate 200 than the first metal core solder ball 310.

[0065] 6H to 6J are perspective views illustrating an exemplary process of forming first and second core-free solder balls 330 and 340 on the substrate pads 230 of the package substrate 200. FIG.

[0066] Referring to FIG. 6H, a third solder mask 410c having third openings 420c is disposed on the package substrate 200 resulting from FIG. 6G. The third openings 420c disposed in the third solder mask 410c may correspond to the substrate pads 230. A core-free solder material 430c is coated or applied onto the third solder mask 410c. In this case, the third openings 420c of the third solder mask 410c may be arranged along rows and columns on the package substrate 200. The first openings 420a shown in FIG. 6B, the second openings 420b shown in FIG. 6E, and the third openings 420c shown in FIG. 6H may all have the same size. The first metal core solder material 430a shown in FIG. 6B, the second metal core solder material 430b shown in FIG. 6E, and the core-free solder material 430c shown in FIG. 6H may all have a spherical shape with the same volume.

[0067] 6I, core-free solder balls 330, 340 may be formed on the substrate pads 230 by passing core-free solder material 430c through the third openings 420c formed in the third solder mask 410c of FIG. 6H. Then, the substrate pads 230 and the core-free solder balls 330, 340 are bonded to each other through a heat treatment.

[0068] 6J, core-free solder balls 330 and 340 may be formed on the substrate pads 230 of the package substrate 200. The core-free solder balls 330 and 340 may be formed in the center of the package substrate 200.

[0069] FIG. 7 is an exemplary planar layout diagram showing connection balls 300 disposed on substrate pads 230 of a package substrate 200a according to another embodiment of the technical concept of the present invention.

[0070] Referring to FIG. 7, the planar layout SBL-1 of FIG. 7 is another example of the planar layout SBL of FIG. 5. The planar layout SBL-1 of FIG. 7 may be the same as the planar layout SBL of FIG. 5, except that the first metal core solder balls 310 are arranged near the four edges of the rectangular package substrate 200a. In FIG. 7, reference numerals that are the same as or similar to those in FIGS. 1 and 5 indicate the same or similar components. In FIG. 7, the details described in FIGS. 1 and 5 are briefly described or omitted.

[0071] 7 shows the connection balls 300 disposed on the lower surface 220b (see FIG. 1) of the substrate body 210 constituting the package substrate 200a. The package substrate 200a, i.e., the substrate body 210, may be rectangular. The connection balls 300 may be disposed on the substrate pads 230 on the lower surface 220b of the substrate body 210. A substrate protection layer 220 for insulating the substrate pads 230 may be disposed on the lower surface 220b of the substrate body 210.

[0072] The connecting ball 300 may include a first metal core solder ball 310 , a second metal core solder ball 320 , a first core-free solder ball 330 , and a second core-free solder ball 340 .

[0073] The first metal core solder balls 310 may be disposed on the package substrate 200a, i.e., the first outer portion CSBR2-1 of the substrate body 210. The first outer portion CSBR2-1 may be a square ring-shaped region extending along the vicinity of the four edges of the package substrate 200a.

[0074] The second metal core solder balls 320 may be disposed on the package substrate 200a, i.e., the second outer portion CSBR2-2 of the substrate body 210. The second outer portion CSBR2-2 is an area of ​​the package substrate 200a surrounded by the square-ring-shaped first outer portion CSBR2-1. The second outer portion CSBR2-2 may be a rectangular area surrounded by the first outer portion CSBR2-1, extending in the second horizontal direction (Y direction) along the vicinity of two edges.

[0075] In some embodiments, the first and second metal core solder balls 310, 320 may be disposed only on at least one of the first outer portion CSBR2-1 and the second outer portion CSBR2-2. In some embodiments, the first metal core solder balls 310 in FIG. 7 are disposed near all four edges of the package substrate 200a, but in some embodiments, they are not disposed near some of the four edges of the package substrate 200a.

[0076] The first and second core-free solder balls 330 and 340 may be disposed in a center portion SBR-1 of the package substrate 200a, i.e., the substrate body 210. The first and second core-free solder balls 330 and 340 may be disposed inside first and second outer portions CSBR2-1 and CSBR2-2 of the rectangular package substrate 200a.

[0077] The diameters of the substrate pads 230 on which the first and second core-free solder balls 330 and 340 and the first and second metal-core solder balls 310 and 320 are disposed may be configured to be the same.

[0078] Fig. 8 is a cross-sectional view showing a semiconductor package 11 according to another embodiment of the technical concept of the present invention, and Fig. 9 is an enlarged cross-sectional view of a portion of the semiconductor package 11 shown in Fig. 8. Fig. 10 is an enlarged planar layout view of a portion of the semiconductor package shown in Fig. 8.

[0079] 8 is substantially the same as or similar to the semiconductor package 10 shown in Figures 1 to 3, except that the diameters of the plurality of substrate pads 230a-230d arranged on the underside of the substrate body 210 vary depending on their positions. Hereinafter, the semiconductor package 11 shown in Figure 8 will be mainly described with respect to the differences from the semiconductor package 10 shown in Figures 1 to 3, and descriptions of components already mentioned will be omitted or simplified.

[0080] The modular semiconductor package 500b may include a board substrate 100, a package substrate 200b, and a plurality of connecting balls 300. The package substrate 200b of the semiconductor package 11 may include a plurality of substrate pads 230a-230d arranged on the lower surface of the substrate body 210. In this case, the plurality of substrate pads 230a-230d may include a first substrate pad 230a, a second substrate pad 230b, a third substrate pad 230c, and a fourth substrate pad 230d. A plurality of metal-core solder balls 310, 320 may be attached to the first substrate pad 230a and the second substrate pad 230b, and a plurality of core-free solder balls 330, 340 may be attached to the third substrate pad 230c and the fourth substrate pad 230d.

[0081] As described above, the package substrate 200b may have warpage due to the manufacturing process. For example, as described above, the package substrate 200b, i.e., the substrate body 210, may have upwardly convex positive warpage. As a result, the plurality of metal core solder balls 310 and 320 may be disposed on the outer periphery of the package substrate 200b.

[0082] The diameters of the substrate pads 230a-230d may be configured to decrease from the outer periphery to the center of the package substrate 200b. A first metal core solder ball 310 may be disposed on the first substrate pad 230a disposed on the outermost periphery of the package substrate 200b, and a second core-free solder ball 340 may be disposed on the fourth substrate pad 230d disposed in the center of the package substrate 200b. A second metal core solder ball 320 may be disposed on the second substrate pad 230b disposed between the first substrate pad 230a and the fourth substrate pad 230d along the first horizontal direction (X direction), and a first core-free solder ball 330 may be disposed on the third substrate pad 230c disposed between the second substrate pad 230b and the fourth substrate pad 230d along the first horizontal direction (X direction).

[0083] The first metal core solder ball 310, the second metal core solder ball 320, the first core-free solder ball 330, and the second core-free solder ball 340 may have the same volume. However, because the package substrate 200b has a convex positive curvature, the vertical (Z-direction) height of the multiple connection balls 300 connected to the flat board substrate 100 decreases from the center to the periphery of the package substrate 200b. Although the multiple connection balls 300 have the same volume, their vertical (Z-direction) heights vary, and therefore their horizontal (X-direction and / or Y-direction) widths may also vary inversely proportional to their vertical (Z-direction) heights. The diameters of the multiple board pads 230a-230d may vary corresponding to the horizontal (X-direction and / or Y-direction) widths of the different connection balls 300.

[0084] The first substrate pad 230a may be located at a first outer portion CSBR1-1 of the substrate body 210, and the second substrate pad 230b may be located at a second outer portion CSBR1-2 of the substrate body 210. In addition, the third substrate pad 230c and the fourth substrate pad 230d may be located at a center portion SBR of the substrate body 210.

[0085] The first metal core solder balls 310 may be disposed on the package substrate 200b, i.e., the first outer portion CSBR1-1 of the substrate body 210. The first metal core solder balls 310 may be disposed on the first outer portion CSBR1-1 near two edges of the rectangular package substrate 200b.

[0086] In some embodiments, the first metal core solder balls 310 may be disposed only on the first outer portion CSBR1-1. In some embodiments, the first metal core solder balls 310 in FIG. 10 are disposed near both edges of the package substrate 200b, but are not disposed near some of the edges.

[0087] The first and second core-free solder balls 330 and 340 may be disposed in a center portion SBR of the package substrate 200b, i.e., the substrate body 210. The first and second core-free solder balls 330 and 340 may be disposed inside a first outer portion CSBR1-1 of the rectangular package substrate 200b.

[0088] In some embodiments, the second metal core solder balls 320 may be disposed on the package substrate 200b, i.e., the second outer portion CSBR1-2 of the substrate body 210. The second metal core solder balls 320 may be disposed on the second outer portion CSBR1-2 located between the first outer portion CSBR1-1 and the center portion SBR of the rectangular package substrate 200b.

[0089] The diameters of the substrate pads 230a-230d on which the connecting balls 300 are disposed may differ between the outer portions CSBR1-1, CSBR1-2 and the center portion SBR of the package substrate 200b. For example, the diameter of the first substrate pad 230a on which the first metal core solder ball 310 is disposed may be larger than the diameter of the second substrate pad 230b on which the second metal core solder ball 320 is disposed. Also, the diameters of the substrate pads may be smaller toward the center of the package substrate 200b within the center portion SBR. For example, the diameter of the third substrate pad 230c on which the first core-free solder ball 330 is disposed may be larger than the diameter of the fourth substrate pad 230d on which the second core-free solder ball 340 is disposed.

[0090] The diameter d1 of the first substrate pad 230a is larger than the diameter d2 of the second substrate pad 230b, which is larger than the diameter d3 of the third substrate pad 230c. The diameter d3 of the third substrate pad 230c is larger than the diameter d4 of the fourth substrate pad 230d. Similarly, referring back to FIG. 9 , the width of the first metal core solder ball 310 attached to the first substrate pad 230a is larger than the width of the second metal core solder ball 320 attached to the second substrate pad 230b, which is larger than the width of the first core-free solder ball 330 attached to the third substrate pad 230c. The width of the first core-free solder ball 330 is also larger than the width of the second core-free solder ball 340 attached to the fourth substrate pad 230d.

[0091] As described above, the first and second metal core solder balls 310, 320 and the first and second core-free solder balls 330, 340 have the same volume. However, because the heights of the first and second metal core solder balls 310, 320 and the first and second core-free solder balls 330, 340 may differ due to warpage of the package substrate 200b, the widths in the lateral directions (X direction and / or Y direction) of the first and second metal core solder balls 310, 320 and the first and second core-free solder balls 330, 340 may also differ accordingly.

[0092] FIG. 11 is a cross-sectional view showing a semiconductor package 12 according to another embodiment of the technical concept of the present invention.

[0093] The semiconductor package 12 shown in Fig. 11 is substantially the same as or similar to the semiconductor package 10 shown in Fig. 1, except that the plurality of connecting balls 300a do not include second metal core solder balls. Therefore, descriptions of the components already mentioned with reference to Fig. 1 will be omitted or simplified.

[0094] 11, the semiconductor package 12 may include a board substrate 100, a package substrate 200c, and connecting balls 300a. In this case, the connecting balls 300a may include a first metal core solder ball 310 and first and second core-free solder balls 330, 340 disposed near the outermost edge of the package substrate 200c. In this case, the first metal core solder ball 310 and the first and second core-free solder balls 330, 340 are the same as the first metal core solder ball 310 and the first and second core-free solder balls 330, 340 described with reference to FIG. 1, and therefore detailed description thereof will be omitted.

[0095] The connecting ball 300a may include a third core-free solder ball 320a located between the first metal-core solder ball 310 and the first core-free solder ball 330 in the first horizontal direction (X direction). The third core-free solder ball 320a may be a connecting ball made of solder material only, without including a metal core. The third core-free solder ball 320a may have substantially the same size as the second metal-core solder ball 320 shown in FIG. 1.

[0096] FIG. 12 is a cross-sectional view showing a semiconductor package 13 according to an embodiment of the technical concept of the present invention, which includes a package substrate 200-1a having negative warpage.

[0097] Specifically, the semiconductor package 13 is identical to the semiconductor package 10 of FIG. 1 except that the package substrate 200-1a has a downwardly convex negative warpage. In FIG. 12, reference numerals that are the same as or similar to those in FIG. 1 indicate the same or similar components. In FIG. 12, descriptions of the same or similar content as in FIG. 1 are simplified or omitted.

[0098] The semiconductor package 13 may include a modular semiconductor package 500-1a including a board substrate 100, a package substrate 200-1a, connecting balls 300-1, and a plurality of semiconductor devices 241, 242. The board substrate 100 may include a board body 110 having an upper surface 110a and a lower surface 110b, a plurality of board pads 130, and a board protective layer 120. The board substrate 100 may refer to the board body 110 in a narrow (limited) sense.

[0099] The package substrate 200-1a may include a substrate body 210-1 having an upper surface 210a-1 and a lower surface 210b-1, a plurality of substrate pads 230-1 spaced apart from one another on the lower surface 210b-1 of the substrate body 210-1, and a substrate protection layer 220-1 insulating the substrate pads 230-1. The package substrate 200-1a may refer to the substrate body 210-1 in a narrower (limited) sense.

[0100] The package substrate 200-1a may have warpage due to the manufacturing process. In some embodiments, the package substrate 200-1a, i.e., the substrate body 210-1, may have a negative warpage that is convex downward.

[0101] A plurality of semiconductor devices 241, 242 are arranged spaced apart from each other on the package substrate 200-1a, i.e., on the upper surface 210a-1 of the substrate body 210-1. The plurality of semiconductor devices 241, 242 may include a first semiconductor device 241 and a second semiconductor device 242 in cross section.

[0102] A structure including the package substrate 200-1a and the plurality of semiconductor devices 241, 242 arranged on the package substrate 200-1a is also referred to as a modular semiconductor package 500-1a. In this embodiment, the plurality of semiconductor devices 241, 242 are arranged on the package substrate 200-1a, but at least one semiconductor chip may be arranged on the package substrate 200-1a.

[0103] The connection ball 300-1 may be disposed between the board substrate 100 and the package substrate 200-1a to electrically connect the board pad 130 and the board pad 230-1. The connection ball 300-1 may include first and second metal core solder balls 310-1 and 320-1 and first and second core-free solder balls 330-1 and 340-1. The first metal core solder ball 310-1 may include a first metal core 312-1 and a first core solder layer 314-1 surrounding the first metal core 312-1, and the second metal core solder ball 320-1 may include a second metal core 322-1 and a second core solder layer 324-1 surrounding the second metal core 322-1.

[0104] The first and second core-free solder balls 330-1 and 340-1 may refer to solder balls without a metal core. The first and second core-free solder balls 330-1 and 340-1 may be made of the same material as the first and second core solder layers 314-1 and 324-1. The first and second metal core solder balls 310-1 and 320-1 and the first and second core-free solder balls 330-1 and 340-1 may be disposed on the board pad 230-1 to electrically connect the board pad 130 and the board pad 230-1.

[0105] The plurality of substrate pads 230-1 may have the same diameter. As described above, the package substrate 200-1a may have warpage due to the manufacturing process. For example, as described above, the package substrate 200-1a, i.e., the substrate body 210-1, may have a negative warpage that is convex downward. As a result, the first and second metal core solder balls 310-1 and 320-1 are positioned at the center of the package substrate 200-1a.

[0106] In particular, a first metal core solder ball 310-1 may be located at the center of the package substrate 200-1a, and a second metal core solder ball 320-1 may be located spaced apart in the first horizontal direction (X direction) across the first metal core solder ball 310-1. Because the substrate body 210-1 has a negative warp, the height of the first metal core solder ball 310-1 located at the center in the vertical direction (Z direction) is shorter than the height of the second metal core solder ball 320-1 in the vertical direction (Z direction).

[0107] In addition, the second core-free solder balls 340-1 may be located near the outermost edge of the package substrate 200-1a, and the first core-free solder balls 330-1 may be located between the second core-free solder balls 340-1 and the second metal-core solder balls 320-1. Similar to the first and second metal-core solder balls 310-1 and 320-1, the substrate body 210-1 has a negative warpage, so the height in the vertical direction (Z direction) of the second core-free solder balls 340-1 located at the outermost edge is greater than the height in the vertical direction (Z direction) of the first core-free solder balls 330-1.

[0108] The package substrate 200-1a, i.e., the substrate body 210-1, may have a downwardly convex negative warpage. Accordingly, the first metal core solder ball 310-1 and the second metal core solder ball 320-1 may be disposed at the center of the package substrate 200-1. In particular, the first metal core solder ball 310-1 may be disposed near the central axis of the package substrate 200-1, and the second metal core solder ball 320-1 may be disposed closer to the outer periphery of the package substrate 200-1 than the first metal core solder ball 310-1. By disposing the metal core solder balls at the center of the package substrate 200-1, which has a negative warpage, it is possible to prevent short circuits between the connecting balls at the center of the package substrate 200-1. If the solder material volume of a connecting ball disposed at the center of the package substrate 200-1 is excessively large, the probability of short circuits occurring between adjacent connecting balls increases. To prevent this, the centrally located connection balls (e.g., the first metal core solder ball 310-1 and the second metal core solder ball 320-1) may include a metal core to reduce the volume of the solder material contained in the central connection balls.

[0109] FIG. 13 is an example of a planar layout diagram showing the connection balls 330-1 arranged on the substrate pads 230-1 of the package substrate 200-1a of FIG.

[0110] Specifically, in Figure 13, the same reference numerals as in Figure 12 indicate the same components. In Figure 13, the content explained in Figure 12 is explained briefly or omitted. The planar layout diagram SBL-2 in Figure 13 shows the coupling balls 300-1 arranged on the lower surface 210b-1 of the substrate body 210-1 that constitutes the package substrate 200-1a. Figure 12 is also a cross-sectional view taken along line B-B' in Figure 13.

[0111] The package substrate 200-1a, i.e., the substrate body 210-1, may be rectangular. The connection balls 300-1 may be disposed on the substrate pads 230-1 on the lower surface 210b-1 of the substrate body 210-1. A substrate protection layer 220 may be disposed on the lower surface 210b-1 of the substrate body 210-1 to insulate the substrate pads 230-1.

[0112] The connection ball 300-1 may include first and second metal core solder balls 310-1 and 320-1 and first and second core-free solder balls 330-1 and 340-1. The first metal core solder ball 310-1 may be disposed in a first center portion CSBR3-1 of the package substrate 200-1a, i.e., the substrate body 210-1. The second metal core solder ball 320-1 may be disposed in a second center portion CSBR3-2 of the substrate body 210-1. In this case, the second center portion CSBR3-2 may be a region of the package substrate 200-1a spaced apart in the first horizontal direction (X direction) from the first center portion CSBR3-1. The first and second core-free solder balls 330-1 and 340-1 may be disposed in an outer periphery SBR-2 of the package substrate 200-1a, i.e., the substrate body 210-1. The first and second core-free solder balls 330-1 and 340-1 may be arranged on an outer shell SBR-2 extending along the vicinity of two edges of the rectangular package substrate 200-1a.

[0113] In the outer portion SBR-2, the first and second core-free solder balls 330-1 and 340-1 may be arranged so that their diameters become smaller as they approach the outermost edge of the substrate body 210-1. That is, the second core-free solder balls 340-1, which have a smaller diameter than the first core-free solder balls 330-1, may be positioned near the two outermost edges of the substrate body 210-1.

[0114] FIG. 14 is a planar layout diagram showing connection balls 300-1 arranged on substrate pads 230-1 of a package substrate 200-1b according to another embodiment of the technical concept of the present invention.

[0115] Specifically, the planar layout SBL-3 may be the same as that shown in FIG. 13, except that the first and second metal core solder balls 310-1 and 320-1 are freely arranged on the lower surface 210b-1 of the package substrate 200-1b. In FIG. 14, reference numerals that are the same as or similar to those in FIGS. 12 and 13 indicate the same or similar components. In FIG. 14, the details described in FIGS. 12 and 13 will be briefly described or omitted.

[0116] The package substrate 200-1b, i.e., the substrate body 210-1, may be rectangular. The connection balls 300-1 may be disposed on the substrate pads 230-1 on the lower surface 210b-1 of the substrate body 210-1. A substrate protection layer 220-1 may be disposed on the lower surface 210b-1 of the substrate body 210-1 to insulate the substrate pads 230-1.

[0117] The connecting ball 300-1 may include first and second metal core solder balls 310-1 and 320-1 and a plurality of core-free solder balls 330-1, 340-1, 360-1, and 370-1. The first and second metal core solder balls 310-1 and 320-1 may be freely disposed in the package substrate 200-1b, i.e., the substrate body 210-1, regardless of whether they are located in the center or the outer periphery. The plurality of core-free solder balls 330-1, 340-1, 360-1, and 370-1 may be freely disposed in the package substrate 200-1b, i.e., the substrate body 210-1, regardless of whether they are located in the center or the outer periphery.

[0118] The first and second metal core solder balls 310-1 and 320-1 may be disposed in a center portion CSBR-3 of the substrate body 210-1. In some embodiments, unlike FIG. 14, the first and second metal core solder balls 310-1 and 320-1 may be disposed in an outer portion SBR-3 of the substrate body 210-1.

[0119] The plurality of core-free solder balls 330-1, 340-1, 360-1, and 370-1 may include a first core-free solder ball 330-1, a second core-free solder ball 340-1, a third core-free solder ball 360-1, and a fourth core-free solder ball 370-1. Here, the third core-free solder ball 360-1 may be a connected ball that is shorter in height in the vertical direction (Z direction) and wider in width in the horizontal direction (X direction and / or Y direction) than the first core-free solder ball 330-1 and the second core-free solder ball 340-1. And, the fourth core-free solder ball 370-1 may be a connected ball that is shorter in height in the vertical direction (Z direction) and wider in width in the horizontal direction (X direction and / or Y direction) than the third core-free solder ball 360-1. As described above, the heights of the first core-free solder ball 330-1, the second core-free solder ball 340-1, the third core-free solder ball 360-1, and the fourth core-free solder ball 370-1 increase in the order of the first core-free solder ball 330-1, the second core-free solder ball 340-1, the third core-free solder ball 360-1, and the fourth core-free solder ball 370-1.

[0120] Fig. 15 is a cross-sectional view showing a semiconductor package 14 according to another embodiment of the technical concept of the present invention, which includes a package substrate 200-1c having negative warpage, and Fig. 16 is an enlarged cross-sectional view of a portion of the semiconductor package 14 shown in Fig. 15. Fig. 17 is an enlarged planar layout view of a portion of the semiconductor package 14 of Fig. 15.

[0121] The semiconductor package 14 shown in Figure 15 is substantially the same as or similar to the semiconductor package 13 shown in Figure 12, except that the diameters of the plurality of substrate pads 230a-1 to 230d-1 arranged on the underside of the substrate body 210-1 vary depending on their positions. Hereinafter, the semiconductor package 14 shown in Figure 15 will be mainly described with respect to the differences from the semiconductor package 13 shown in Figure 12, and descriptions of components already mentioned will be omitted or simplified.

[0122] The modular semiconductor package 500-1c may include a board substrate 100, a package substrate 200-1c, and a plurality of connecting balls 300-1. The package substrate 200-1c of the semiconductor package 14 may include a plurality of substrate pads 230a-1 through 230d-1 arranged on a lower surface of a substrate body 210-1. In this case, the plurality of substrate pads 230a-1 through 230d-1 may include a first substrate pad 230a-1, a second substrate pad 230b-1, a third substrate pad 230c-1, and a fourth substrate pad 230d-1. A plurality of metal-core solder balls 310-1 and 320-1 may be attached to the first substrate pad 230a-1 and the second substrate pad 230b-1, and a plurality of core-free solder balls 330-1 and 340-1 may be attached to the third substrate pad 230c-1 and the fourth substrate pad 230d-1.

[0123] As described above, the package substrate 200-1c may have warpage due to the manufacturing process. For example, as described above, the package substrate 200-1c, i.e., the substrate body 210-1, may have a negative warpage that is convex downward. This allows the multiple metal core solder balls 310-1 and 320-1 to be positioned at the center of the package substrate 200-1c.

[0124] The diameters of the substrate pads 230a-1 to 230d-1 may be configured to decrease from the center to the periphery of the package substrate 200-1c. A first metal core solder ball 310-1 may be disposed on the first substrate pad 230a-1 disposed in the center of the package substrate 200-1c, and a second core-free solder ball 340-1 may be disposed on the fourth substrate pad 230d-1 disposed in the outermost part of the package substrate 200-1c. In addition, a second metal core solder ball 320-1 may be arranged on the second substrate pad 230b-1 arranged between the first substrate pad 230a-1 and the fourth substrate pad 230d-1 along the first horizontal direction (X direction), and a first core-free solder ball 330-1 may be arranged on the third substrate pad 230c-1 arranged between the second substrate pad 230b-1 and the fourth substrate pad 230d-1 along the first horizontal direction (X direction).

[0125] The first metal core solder ball 310-1, the second metal core solder ball 320-1, the first core-free solder ball 330-1, and the second core-free solder ball 340-1 may have the same volume. However, because the package substrate 200-1c has a downwardly convex negative warp, the connecting balls 300-1 connected to the flat board substrate 100 decrease in height in the vertical direction (Z direction) from the outer periphery of the package substrate 200-1c to the center. Although the connecting balls 300-1 have the same volume, their heights in the vertical direction (Z direction) vary, and therefore their widths in the horizontal direction (X direction and / or Y direction) may also vary inversely proportional to their heights in the vertical direction (Z direction). The diameters of the substrate pads 230a-1 to 230d-1 may vary corresponding to the widths in the horizontal direction (X direction and / or Y direction) of the different connecting balls 300-1.

[0126] Because package substrate 200-1 has negative warpage, the vertical (Z-direction) height of connecting ball 300-1 decreases from the outer periphery to the center of package substrate 200-1. That is, the vertical (Z-direction) height h5 of first metal core solder ball 310-1 is lower than the vertical (Z-direction) height h6 of second metal core solder ball 320-1, and the vertical (Z-direction) height h6 of second metal core solder ball 320-1 is lower than the vertical (Z-direction) height h7 of first core-free solder ball 330-1. Furthermore, the vertical (Z-direction) height h7 of first core-free solder ball 330-1 is lower than the vertical (Z-direction) height h8 of second core-free solder ball 340-1.

[0127] The connection balls 300-1 may be disposed on the plurality of substrate pads 230a-1 to 230d-1 on the lower surface of the substrate body 210-1.

[0128] The plurality of substrate pads 230a-1 to 230d-1 may include a first substrate pad 230a-1, a second substrate pad 230b-1, a third substrate pad 230c-1, and a fourth substrate pad 230d-1. The first substrate pad 230a-1 may be located at the center of the substrate body 210-1 in a plan view, and the pair of second substrate pads 230b-1 may be spaced apart in the first horizontal direction (X direction) with the first substrate pad 230a-1 sandwiched between them. The pair of fourth substrate pads 230d-1 may be located near the outermost edges of the substrate body 210-1 in a plan view, and the pair of third substrate pads 230c-1 may be located between the second substrate pad 230b-1 and the fourth substrate pad 230d-1 in the first horizontal direction (X direction).

[0129] The first metal core solder ball 310-1 may be disposed on the first substrate pad 230a-1, the second metal core solder ball 320-1 may be disposed on the second substrate pad 230b-1, the first core-free solder ball 330-1 may be disposed on the third substrate pad 230c-1, and the second core-free solder ball 340-1 may be disposed on the fourth substrate pad 230d-1.

[0130] In this case, the first substrate pad 230a-1 may be located at a first center portion CSBR3-1 of the substrate body 210-1, the second substrate pad 230b-1 may be located at a second center portion CSBR3-2 of the substrate body 210-1, and the third and fourth substrate pads 230c-1 and 230d-1 may be located at an outer portion SBR-2 of the substrate body 210-1.

[0131] The first and second core-free solder balls 330-1 and 340-1 may be disposed on the outer periphery SBR-2 of the package substrate 200-1c, i.e., the substrate body 210-1. The first and second core-free solder balls 330-1 and 340-1 may be disposed on the outer periphery SBR-2 near two edges of the rectangular package substrate 200-1c. In this case, the second core-free solder ball 340-1, which has a narrower width in the lateral direction (X direction and / or Y direction) than the first core-free solder ball 330-1, may be disposed on the outermost periphery of the substrate body 210-1, and may be disposed farther from the center of the substrate body 210-1 than the first core-free solder ball 330-1.

[0132] The first metal core solder ball 310-1 may be disposed in a first center portion CSBR3-1 of the package substrate 200-1c, i.e., the substrate body 210-1, and the second metal core solder ball 320-1 may be disposed in a second center portion CSBR3-2 located between the first center portion CSBR3-1 and the outer portion SBR-2 of the rectangular package substrate 200-1c.

[0133] The diameters of the substrate pads 230a-1 to 230d-1, on which the connecting balls 300 are disposed, may differ among the outer portion SBR-2, the first center portion CSBR3-1, and the second center portion CSBR3-2 of the package substrate 200-1c. For example, the diameter of the first substrate pad 230a-1, on which the first metal core solder ball 310-1 is disposed, may be larger than the diameter of the second substrate pad 230b-1, on which the second metal core solder ball 320-1 is disposed. Furthermore, the diameters of the substrate pads may be smaller toward the outermost portion of the package substrate 200-1c within the outer portion SBR-2. For example, the diameter of the fourth substrate pad 230d-1, on which the second core-free solder ball 340-1 is disposed, may be smaller than the diameter of the third substrate pad 230c-1, on which the first core-free solder ball 330-1 is disposed.

[0134] 16, the width of first metal core solder ball 310-1 attached to first substrate pad 230a-1 is greater than the width of second metal core solder ball 320-1 attached to second substrate pad 230b-1, and the width of second metal core solder ball 320-1 is greater than the width of first core-free solder ball 330-1 attached to third substrate pad 230c-1. Also, the width of the first core-free solder ball 330-1 is greater than the width of the second core-free solder ball 340-1 attached to the fourth board pad 230d-1.

[0135] As described above, the first and second metal core solder balls 310-1, 320-1 and the first and second core-free solder balls 330-1, 340-1 have the same volume. However, because the heights of the first and second metal core solder balls 310-1, 320-1 and the first and second core-free solder balls 330-1, 340-1 differ due to warpage of the package substrate 200-1c, the widths in the lateral directions (X and / or Y directions) of the first and second metal core solder balls 310-1, 320-1 and the first and second core-free solder balls 330-1, 340-1 may also differ accordingly.

[0136] According to one embodiment, the diameter c1 of the first metal core 312-1 may be 0.3 to 0.9 times the height in the vertical direction (Z direction) of the nearest core-free solder ball, and the diameter c2 of the second metal core 322-1 may be 0.5 to 0.9 times the height in the vertical direction (Z direction) of the nearest core-free solder ball. For example, the diameter c1 of the first metal core 312-1 may be 0.3 to 0.9 times the height h7 in the vertical direction (Z direction) of the first core-free solder ball 330-1. Furthermore, the diameter c2 of the second metal core 322-1 may be 0.5 to 0.9 times the height h7 in the vertical direction (Z direction) of the first core-free solder ball 330-1. The explanation for this is similar to that for FIG. 3, so a detailed explanation will be omitted.

[0137] FIG. 18 is a cross-sectional view showing a semiconductor package 15 according to another embodiment of the technical concept of the present invention, which includes a package substrate 200-1d having negative warpage.

[0138] The semiconductor package 15 shown in Fig. 18 is substantially the same as or similar to the semiconductor package 14 shown in Fig. 12, except that the plurality of connecting balls 300-1a does not include second metal core solder balls. Therefore, the description of the components already mentioned with reference to Fig. 12 will be omitted or simplified.

[0139] 18, the semiconductor package 15 may include a board substrate 100, a package substrate 200-1d, and connecting balls 300-1a. The connecting balls 300-1a may include a first metal core solder ball 310-1 disposed at the center of the package substrate 200-1d and first and second core-free solder balls 330-1 and 340-1 disposed outside the first metal core solder ball 310-1. The first metal core solder ball 310-1 and the first and second core-free solder balls 330-1 and 340-1 are the same as the first metal core solder ball 310-1 and the first and second core-free solder balls 330-1 and 340-1 described with reference to FIG. 12, and therefore, detailed description thereof will be omitted.

[0140] The connection ball 300-1a may include a third core-free solder ball 320a-1 located between the first metal-core solder ball 310-1 and the first core-free solder ball 330-1 in the first horizontal direction (X direction). The third core-free solder ball 320a-1 is a connection ball made of solder material only, without including a metal core. The third core-free solder ball 320a-1 may have substantially the same size as the second metal-core solder ball 320-1 shown in FIG. 12.

[0141] FIG. 19 is a cross-sectional view showing a semiconductor package 16 according to another embodiment of the technical concept of the present invention.

[0142] 19 is substantially the same as or similar to the semiconductor package 10 shown in FIG. 1, except that the semiconductor package 16 includes a heat slug 260 instead of the stiffener 250 (see FIG. 1) disposed on the upper surface 210a of the substrate body 210. Therefore, descriptions of the components already mentioned with reference to FIG. 1 will be omitted or simplified.

[0143] The package substrate 200d of the modular semiconductor package 500d may include a heat slug 260 disposed on the top surface 210a of the substrate body 210. The heat slug 260 may externally surround the first semiconductor device 241 and the second semiconductor device 242 mounted on the substrate body 210. The heat slug 260 may be formed on the substrate body 210 and configured to dissipate heat generated by the first semiconductor device 241 and the second semiconductor device 242. Because the heat slug 260 dissipates heat generated by the first semiconductor device 241 and the second semiconductor device 242, the semiconductor package 16 according to an embodiment of the present invention may dissipate heat generated by the first semiconductor device 241 and the second semiconductor device 242, thereby improving the operational reliability of the entire semiconductor package 16.

[0144] According to one embodiment, heat slug 260 may include a metal, which is a material with a higher thermal conductivity than air. For example, heat slug 260 may include copper (Cu), iron (Fe), nickel (Ni), cobalt (Co), tungsten (W), chromium (Cr), silver (Ag), gold (Au), platinum (Pt), tin (Sn), aluminum (Al), magnesium (Mg), silicon (Si), zinc (Zn), or a combination thereof.

[0145] The heat slug 260 may be attached to a region adjacent to the outer edge of the upper surface of the substrate body 210. In this case, since the substrate body 210 may have a warp, the upper surface of the heat slug 260 may also bend in response to the warp of the substrate body 210.

[0146] FIG. 20 is a block diagram showing a schematic configuration of a semiconductor package according to an embodiment of the technical concept of the present invention.

[0147] Specifically, the semiconductor package 1100 may include a microprocessing unit 1110, a memory 1120, an interface 1130, a graphics processing unit 1140, a functional block 1150, and a bus 1160 connecting them. The semiconductor package 1100 may include both the microprocessing unit 1110 and the graphics processing unit 1140, or may include only one of them.

[0148] The microprocessing unit 1110 may include cores and an L2 cache. For example, the microprocessing unit 1110 may include multiple cores. The cores of the multiple cores may have the same or different performance. The cores of the multiple cores may be activated simultaneously or at different times. The memory 1120 may store results of processing by the functional block 1150 under the control of the microprocessing unit 1110. For example, the microprocessing unit 1110 may store data in the memory 1120 by flushing the data stored in the L2 cache. The interface 1130 may interface with external devices. For example, the interface 1130 may interface with a camera, a liquid crystal display (LCD), a speaker, etc.

[0149] The graphics processing unit 1140 may perform graphics functions. For example, the graphics processing unit 1140 may perform video codec or process 3D graphics. The functional blocks 1150 may perform various functions. For example, if the semiconductor package 1100 is an application processor (AP) used in a mobile device, some of the functional blocks 1150 may perform communication functions.

[0150] The semiconductor package 1100 may include any one of the board-level semiconductor packages exemplified in this invention. The microprocessing unit 1110 and / or the graphics processing unit 1140 may include any one of the board-level semiconductor packages described above. The memory 1120 may include any one of the board-level semiconductor packages described above. The interface 1130 and the functional block 1150 may include any one of the board-level semiconductor packages described above.

[0151] As described above, exemplary embodiments have been disclosed in the drawings and specification. Although specific terms have been used to describe the embodiments in this specification, these terms are used solely for the purpose of explaining the technical idea of ​​the present invention and are not intended to limit the meaning or the scope of the present invention as set forth in the claims. Therefore, a person skilled in the art would understand that various modifications and equivalent embodiments are possible. Therefore, the true technical scope of protection of the present invention should be determined by the technical idea of ​​the claims. [Explanation of symbols]

[0152] 10-17 Semiconductor Package 100 board substrate 110 board body 130 Board Pad 200 package substrate 210 PCB body 241, 242 Semiconductor devices 250 Reinforcement 260 Heat Slug 310 First metal core solder ball 320 Secondary metal core solder ball 330 1st core-free solder ball 340 Second core-free solder ball

Claims

1. a package substrate including a substrate body having an upper surface and a lower surface opposite to the upper surface, and a plurality of substrate pads disposed spaced apart from one another on the lower surface; a plurality of connecting balls physically connected to the plurality of substrate pads; The plurality of connecting balls are A semiconductor package comprising: a metal-core solder ball including a metal core; and a plurality of core-free solder balls having the same volume as the metal-core solder ball.

2. 2. The semiconductor package of claim 1, wherein the diameter of the substrate pads physically connected to the metal-core solder balls among the plurality of substrate pads is larger than the diameter of the substrate pads physically connected to the plurality of core-free solder balls among the plurality of substrate pads.

3. further comprising a board substrate including a plurality of spaced-apart board pads; The semiconductor package according to claim 1 , wherein the plurality of connecting balls are disposed between the board substrate and the package substrate.

4. 4. The semiconductor package of claim 3, wherein the vertical height of the plurality of core-free solder balls is greater than the vertical height of the metal-core solder ball.

5. at least one semiconductor device disposed on the top surface of the substrate body; 2. The semiconductor package of claim 1, further comprising a stiffener extending along an outer edge of the substrate body to laterally seal the at least one semiconductor device.

6. 2. The semiconductor package according to claim 1, wherein the package substrate has a positive warp that is convex upward or a negative warp that is convex downward.

7. 2. The semiconductor package of claim 1, wherein the metal core solder balls are disposed near the outer edge of the package substrate.

8. 2. The semiconductor package of claim 1, wherein the plurality of core-free solder balls have a vertical height that increases toward the center of the package substrate.

9. 2. The semiconductor package of claim 1, wherein the vertical height of the core-free solder balls increases as they approach the outer edge of the package substrate.

10. The diameter of the metal core is 2. The semiconductor package of claim 1, wherein the vertical height of the core-free solder ball closest to the metal-core solder ball is 0.3 to 0.9 times the vertical height of the core-free solder ball closest to the metal-core solder ball among the plurality of core-free solder balls.

11. the metal core comprises at least one of copper, nickel, a copper-coated polymer, or a nickel-coated polymer; 2. The semiconductor package according to claim 1, wherein the melting point of the metal core is 260[deg.] C. or higher.

12. a package substrate including a substrate body having an upper surface and a lower surface opposite to the upper surface, and a plurality of substrate pads disposed spaced apart from one another on the lower surface; a plurality of connecting balls physically connected to the plurality of substrate pads; The plurality of connecting balls are a first metal core solder ball including a first metal core, a plurality of core-free solder balls, and a second metal core solder ball disposed between the first metal core solder ball and the plurality of core-free solder balls and including a second metal core having a diameter larger than that of the first metal core; The first metal core solder ball, the second metal core solder ball, and the plurality of core-free solder balls have the same volume as one another.

13. a vertical height of the plurality of core-free solder balls is greater than a vertical height of the second metal-core solder ball; 13. The semiconductor package of claim 12, wherein the vertical height of the second metal core solder ball is greater than the vertical height of the first metal core solder ball.

14. 13. The semiconductor package of claim 12, wherein a diameter of the substrate pads physically connected to the first metal core solder ball among the plurality of substrate pads is larger than a diameter of the substrate pads physically connected to the second metal core solder ball among the plurality of substrate pads.

15. the package substrate has a rectangular shape in a horizontal view; 13. The semiconductor package of claim 12, wherein the first metal core solder ball is disposed farther from the center of the package substrate than the second metal core solder ball.

16. at least one semiconductor device disposed on the top surface of the substrate body; 13. The semiconductor package of claim 12, further comprising: a heat slug externally surrounding the at least one semiconductor device on the top surface of the substrate body.

17. The diameter of the first metal core is 13. The semiconductor package of claim 12, wherein the vertical height of the core-free solder ball closest to the first metal core solder ball is 0.3 to 0.9 times the vertical height of the core-free solder ball closest to the first metal core solder ball among the plurality of core-free solder balls.

18. a package substrate including a substrate body having an upper surface and a lower surface opposite to the upper surface, and a plurality of substrate pads disposed spaced apart from one another on the lower surface; a plurality of connecting balls physically connected to the plurality of substrate pads; the package substrate has a downwardly convex negative warpage; The plurality of connecting balls are a first metal core solder ball disposed at a center of the package substrate and including a first metal core; a second metal core solder ball disposed adjacent to the first metal core solder ball and including a second metal core having a diameter larger than that of the first metal core; and a plurality of core-free solder balls disposed adjacent to the second metal core solder ball; The first metal core solder ball, the second metal core solder ball, and the plurality of core-free solder balls have the same volume as one another.

19. The semiconductor package of claim 18 , further comprising a substrate protection layer disposed on the lower surface of the substrate body and configured to insulate the plurality of substrate pads.

20. the first metal core solder ball includes a first core solder layer surrounding the first metal core; the second metal core solder ball includes a second core solder layer surrounding the second metal core; 20. The semiconductor package of claim 18, wherein the first core solder layer, the second core solder layer, and the plurality of core-free solder balls are made of the same material.

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