Cutting device

Abstract

To remove cut chips adhering to a protective cover of a cutting blade.SOLUTION: A cutting device comprises: a holding table having a holding surface for holding a work-piece; a cutting part that has a spindle having one end fixed with an annular cutting blade and acting as a rotating shaft for the cutting blade and a protective cover capable of covering and protecting the cutting blade, and can cut the work-piece held on the holding table with the cutting blade; a jetting part that can jet fluid; and a jetting-destination changing part that can change a jetting-destination of the fluid by the jetting part, using the holding table and the protective cover. Preferably, the cutting device further comprises a moving part that relatively moves the holding table and the cutting part in a first direction along the holding surface. The jetting part has a rod-like main body that can extend in a second direction crossing the first direction to jet the fluid. Either or both of the moving part and the jetting-destination changing part can jet the fluid onto the whole of the holding surface.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a cutting device that cuts a workpiece such as a semiconductor wafer with a cutting blade. [Background technology]

[0002] In the device chip manufacturing process, a disk-shaped wafer is used, on which devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are formed in multiple regions defined by multiple intersecting dividing lines (streets). By dividing this wafer along the dividing lines, multiple device chips, each equipped with a device, are obtained. The device chips are installed in various electronic devices, such as mobile phones and personal computers.

[0003] Semiconductor wafers are divided, for example, by a cutting device equipped with an annular cutting blade (see Patent Document 1). The cutting device includes a holding table (chuck table) that holds a workpiece such as a semiconductor wafer, and a cutting section (cutting unit) that cuts the workpiece held by the holding table with a cutting blade.

[0004] When the cutting blade is rotated and cut into the workpiece, the workpiece is cut. During this process, friction generates cutting heat, cutting chips, and scraps separated from the workpiece. Therefore, while cutting is being performed, cutting water, such as pure water, is sprayed onto the cutting blade and workpiece to remove the cutting heat and cutting chips. The cutting section is provided with a jet nozzle for spraying cutting water onto the cutting blade and workpiece, and the cutting water is sprayed from this jet nozzle.

[0005] However, because the cutting blade rotates at high speed when cutting a workpiece, cutting the workpiece with the cutting blade while supplying cutting water causes the cutting water containing cutting chips and scraps to scatter over a wide area. Therefore, a technology has been developed in which a puddle is formed where the cutting water will splash, and the cutting chips and scraps that have splashed into the puddle are washed away by running water (see Patent Document 1).

[0006] In order to reliably cut the workpiece from top to bottom with the cutting blade, the cutting depth of the cutting blade must be controlled with high precision so that the bottom of the cutting blade is slightly lower than the bottom of the workpiece. Therefore, in the cutting device, a setup process is performed before the workpiece is cut with the cutting blade.

[0007] In the setup process, the cutting blade is lowered from above onto the frame of the holding table (chuck table), and the height of the cutting blade when contact between the frame and the cutting blade is detected is set as the reference height. Here, contact between the holding table and the cutting blade is detected by detecting the occurrence of electrical conduction between them (see Patent Document 2). [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 2019-192846 [Patent Document 2] Japanese Patent Application Publication No. 11-254259 Summary of the Invention [Problem to be solved by the invention]

[0009] Most of the cutting chips generated when cutting a workpiece are removed by cutting water, but some of them adhere to the protective cover surrounding the cutting blade. Over time, the cutting chips that adhere to the protective cover may fall off the protective cover and adhere to the top surface of the holding table.

[0010] If the setup process is performed with cutting chips adhering to the top surface of the holding table, the power supply to the cutting blade and holding table is detected when the cutting blade comes into contact with the cutting chips before it touches the top surface of the holding table. In this case, a height position different from the height position that should be the reference height is set as the reference height, and the cutting blade will not cut into the workpiece as expected when cutting the workpiece.

[0011] The present invention has been made in view of the above problems, and has an object to provide a cutting device that can efficiently remove cutting chips adhering to the protective cover of the cutting blade and the holding table. [Means for solving the problem]

[0012] According to one aspect of the present invention, there is provided a cutting device having a holding table with a holding surface for holding a workpiece, a spindle having an annular cutting blade fixed to one end thereof as the axis of rotation of the cutting blade, and a protective cover for covering and protecting the cutting blade, the cutting device comprising: a cutting section for cutting the workpiece held on the holding table with the cutting blade; an injection section for injecting a fluid; and an injection destination change section for switching the destination of the fluid sprayed by the injection section using the holding table and the protective cover.

[0013] Preferably, the device further includes a moving unit that moves the holding table and the cutting unit relatively in a first direction along the holding surface, and the spraying unit has a rod-shaped main body that extends in a second direction intersecting the first direction and can spray the fluid, and the fluid can be sprayed over the entire holding surface by one or both of the moving unit and the spray destination changing unit.

[0014] More preferably, the injection unit has in the main body a first injection nozzle capable of injecting the fluid toward the holding table and a second injection nozzle capable of injecting the fluid toward the protective cover, and the injection destination change unit is composed of a shield capable of shielding one or both of the first injection nozzle and the second injection nozzle, and a shield movement unit that moves the shield relative to the first injection nozzle and the second injection nozzle.

[0015] Alternatively, preferably, the injection unit has a pair of rod-shaped bodies that sandwich the cutting blade covered with the protective cover from both sides, and the injection destination change unit rotates each of the pair of bodies around its respective extension direction, thereby switching the destination of the fluid injected by the injection unit between the cutting blade, the protective cover, and the holding table.

[0016] Preferably, the jetting destination changing section is driven by the flow or pressure of the fluid supplied from a fluid supply source. [Effects of the Invention]

[0017] A cutting device according to one aspect of the present invention includes an injection unit capable of injecting a fluid, and an injection destination change unit that switches the destination of the fluid injected by the injection unit between a holding table and a protective cover. Therefore, by injecting fluid from the injection unit onto the holding table or the protective cover, cutting debris adhering to these can be removed. In particular, because the injection destination change unit can switch the destination of the fluid injected by the injection unit, there is no need to provide dedicated injection units used only for cleaning each of these.

[0018] Therefore, one aspect of the present invention provides a cutting device that can efficiently remove cutting chips that have adhered to the protective cover of the cutting blade and the holding table. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 2 is a perspective view schematically showing a cutting device. [Figure 2] FIG. 1 is a perspective view schematically showing a workpiece being cut by a cutting device. [Figure 3] FIG. 10 is a cross-sectional view schematically showing a state in which a workpiece held by a holding table is being cut. [Figure 4] FIG. 4 is a side view schematically showing the internal configuration of the protective cover of the cutting unit. [Figure 5]Figure 5(A) is a cross-sectional view schematically showing an ejection section that ejects fluid toward a cutting blade, Figure 5(B) is a cross-sectional view schematically showing an ejection section that ejects fluid toward a protective cover, and Figure 5(C) is a cross-sectional view schematically showing an ejection section that ejects fluid toward a holding table. [Figure 6] Figure 6(A) is a side view showing a schematic configuration example of the injection nozzle (injection unit) and the shielding unit, Figure 6(B) is a cross-sectional view showing a schematic configuration example of the injection unit that injects fluid toward the protective cover, and Figure 6(C) is a cross-sectional view showing a schematic configuration example of the injection unit that injects fluid toward the holding table. [Figure 7] 10 is a diagram schematically illustrating an ejection unit that oscillates using the flow of fluid as a driving source. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0020] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, a workpiece to be machined by a cutting device according to this embodiment will be described. FIG. 2 is a perspective view schematically showing a workpiece 1 being cut by a cutting device 2. FIG. 3 is a cross-sectional view schematically showing a workpiece 1 being cut by a cutting device 2.

[0021] The workpiece 1 is, for example, a disk-shaped wafer made of a semiconductor material such as silicon, and has a front surface and a back surface that are generally parallel to each other. A plurality of planned division lines (not shown) are set on the front surface of the workpiece 1, and are arranged in a grid pattern so as to intersect with each other. Devices (not shown), such as ICs and LSIs, are formed in each of the areas defined by the planned division lines on the front surface of the workpiece 1.

[0022] When the workpiece 1 is divided along the planned division lines, a plurality of thin chips (device chips) each equipped with a device are manufactured. A cutting device equipped with an annular cutting blade is used to divide the workpiece 1. The device chips manufactured by dividing the workpiece 1 are mounted in various electronic devices such as mobile phones and personal computers.

[0023] There are no limitations on the material, structure, size, etc. of the workpiece 1. For example, the workpiece 1 may be a substrate made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), sapphire, glass (quartz glass, borosilicate glass, etc.), etc. The workpiece 1 does not have to be disk-shaped, and may be a rectangular plate-shaped. There are also no limitations on the type, number, shape, structure, size, arrangement, etc. of devices, and the workpiece 1 does not have to have any devices formed thereon.

[0024] The workpiece 1 to be cut by the cutting device 2 is carried into the cutting device 2 in a state where it is integrated with an annular frame 5 having an opening with a diameter larger than that of the workpiece 1, and a tape (sheet) 3 attached to the annular frame 5 so as to cover the opening of the annular frame 5. When the workpiece 1, the tape 3, and the annular frame 5 are integrated to form a frame unit 7, the workpiece 1 can be handled via the annular frame 5, making it easy to handle the workpiece 1 and chips.

[0025] Next, a cutting device 2 that cuts a workpiece 1 will be described. FIG. 1 is a perspective view that schematically shows the cutting device 2. The cutting device 2 includes a base 4 that supports each of its components. An opening 4a is formed in the front corner of the base 4, and within this opening 4a is provided a cassette support table 6 that is raised and lowered by a lifting mechanism (not shown). Cassettes 8 that house multiple workpieces 1, each of which is part of a frame unit 7, are mounted on the upper surface of the cassette support table 6. For ease of explanation, only the outline of the cassette 8 is shown in FIG. 1.

[0026] A rectangular opening 4b is formed on the side of the cassette support base 6 so that its longitudinal direction is along the X-axis direction (front-rear direction, processing feed direction). A ball screw type X-axis movement mechanism (not shown), a table cover 10 that covers the top of the X-axis movement mechanism, and a dustproof and drip-proof cover 12 are arranged inside the opening 4b. The X-axis movement mechanism has an X-axis movement table (not shown) covered by the table cover 10, and moves this X-axis movement table in the X-axis direction.

[0027] A holding table (chuck table) 14 is disposed on the upper surface of the X-axis moving table so as to be exposed from the table cover 10. The holding table 14 has the function of suction-holding the workpiece 1 placed on the holding surface 14c exposed upward. The holding table 14 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis that is roughly parallel to the Z-axis direction (vertical direction).

[0028] 3 includes a cross-sectional view showing the holding table 14. The holding table 14 includes a porous member 14b having the same diameter as the workpiece 1 and a frame 14a that covers the porous member 14b. A suction path is formed inside the holding table 14, one end of which is connected to a suction source (not shown) such as an ejector provided outside the holding table 14. The other end of the suction path reaches the porous member 14b.

[0029] The upper surface of the porous member 14b is exposed on the holding surface 14c of the holding table 14. The upper surface of the porous member 14b has the same diameter as the workpiece 1 and is formed to be approximately parallel to the X-axis and Y-axis directions. Furthermore, a plurality of clamps 16 are provided around the periphery of the holding table 14 to fix the annular frame 5 that supports the workpiece 1.

[0030] When the workpiece 1 is held by the holding table 14, first, the frame unit 7 including the workpiece 1 is placed on the holding surface 14c of the holding table 14. Then, the suction source and the porous member 14b are connected via the suction path, and negative pressure is applied to the workpiece 1 via the tape 3 attached to the workpiece 1.

[0031] The cutting device 2 is provided with a transport mechanism (not shown) in an area adjacent to the opening 4b that transports the workpiece 1 to the holding table 14, etc. The frame unit 7 including the workpiece 1 is transported from the cassette 8 to the holding table 14 by the transport mechanism.

[0032] Two cutting units 18 that use annular cutting blades to cut the workpiece 1 are provided above the holding table 14. A gate-shaped support structure 20 for supporting the cutting units 18 is disposed on the upper surface of the base 4 so as to straddle the opening 4b.

[0033] Two moving units 22 are provided on the upper front surface of the support structure 20 to move the cutting section 18 in the Y-axis and Z-axis directions, respectively. Each moving unit 22 includes a Y-axis moving plate 26. The Y-axis moving plate 26 is slidably mounted on a pair of Y-axis guide rails 24 that are arranged on the front surface of the support structure 20 along the Y-axis direction.

[0034] A nut portion (not shown) is provided on the back surface (rear surface) of Y-axis moving plate 26, and a Y-axis ball screw 28 that is generally parallel to Y-axis guide rail 24 is threadedly engaged with this nut portion. A Y-axis pulse motor 30 is connected to one end of Y-axis ball screw 28. When Y-axis pulse motor 30 rotates Y-axis ball screw 28, Y-axis moving plate 26 moves in the Y-axis direction along Y-axis guide rail 24.

[0035] A pair of Z-axis guide rails 32 are provided along the Z-axis direction on the surface (front surface) side of the Y-axis moving plate 26. A Z-axis moving plate 34 is slidably attached to the pair of Z-axis guide rails 32.

[0036] A nut portion (not shown) is provided on the back surface (rear surface) of Z-axis moving plate 34, and Z-axis ball screw 36, which is provided in a direction generally parallel to Z-axis guide rail 32, is threadedly engaged with this nut portion. Z-axis pulse motor 38 is connected to one end of Z-axis ball screw 36, and by rotating Z-axis ball screw 36 with Z-axis pulse motor 38, Z-axis moving plate 34 moves in the Z-axis direction along Z-axis guide rail 32.

[0037] The cutting unit 18 is fixed to the lower part of the Z-axis moving plate 34. A camera unit 40 is provided adjacent to the cutting unit 18 to photograph the workpiece 1 held by suction on the holding table 14. The configuration of the cutting unit 18 will be described in detail later. The positions of the cutting unit 18 and the camera unit 40 in the Y-axis and Z-axis directions are controlled by the moving unit 22.

[0038] An opening 4c is formed at a position opposite to opening 4b from opening 4a. A cleaning unit 44 for cleaning workpiece 1 is disposed within opening 4c, and workpiece 1 cut on holding table 14 is cleaned by cleaning unit 44. Workpiece 1 cleaned by cleaning unit 44 is stored back into cassette 8.

[0039] Furthermore, a spray nozzle (spray unit) 42 is disposed on the upper surface of the base 4 so as to straddle the opening 4b in the Y-axis direction (indexing feed direction, second direction) perpendicular to the X-axis direction (first direction). FIG. 6(A) is a front view schematically showing the spray nozzle 42. The spray nozzle 42 has a pipe-like / rod-like main body 82 and a support pillar 84 that supports one end of the main body 82. FIG. 6(C) is a cross-sectional view schematically showing the spray nozzle 42. A first spray port group 97 is formed in the main body 82. The first spray port group 97 is composed of a plurality of first spray ports 96 facing downward and aligned along the extension direction (Y-axis direction) of the main body 82.

[0040] The main body 82 of the injection nozzle 42 is hollow, and one end is connected to a fluid supply source (not shown). Fluid (e.g., pure water, a mixture of water and high-pressure gas, etc.) supplied from the fluid supply source into the main body 82 is ejected downward from the first injection port 96. This forms a fluid curtain. By moving the holding table 14 along the X-axis direction so as to cross this fluid curtain, the upper surface (holding surface 14c) of the holding table 14 can be cleaned. Other configurations of the injection nozzle 42 will be described in detail later.

[0041] Next, the cutting section (cutting unit) 18 will be described in detail. Fig. 2 is a perspective view that schematically shows the workpiece 1 being cut by the cutting section 18. Fig. 3 is a cross-sectional view that schematically shows the workpiece 1 being cut by the cutting section 18. Fig. 5(A) and other figures schematically show the inside of the protective cover 52 of the cutting section 18. Note that the camera unit 40 and other figures are omitted from Fig. 2 and other figures.

[0042] As shown in FIG. 5(A) and other figures, the cutting unit 18 is equipped with a spindle 56 having an axis that is generally parallel to the Y-axis direction. A rotary drive source (not shown), such as a motor, is connected to one end (base end) of the spindle 56. The one end of the spindle 56, the rotary drive source, and the like, are housed in a spindle housing 46 fixed to the Z-axis moving plate 34. Meanwhile, an annular cutting blade 58 is attached to the other end (tip end) of the spindle 56.

[0043] The cutting blade 58 is a so-called hub-type cutting blade that has an annular base made of a material such as aluminum with a through-hole formed in the center, and a cutting blade fixed to the outer periphery of the base. A cutting blade (grinding wheel portion) including countless abrasive grains and a binder (bond) that disperses and fixes the abrasive grains is fixed to the outer periphery of the base. For example, the abrasive grains are made of a material such as diamond or cubic boron nitride (cBN), and the binder is a nickel plating layer or the like. However, the cutting blade 58 is not limited to the hub-type.

[0044] A protective cover 52 is disposed around the cutting blade 58 attached to the spindle 56 to cover and protect the cutting blade 58. The protective cover 52 is shaped so as to be able to cover most of the outer periphery of the cutting blade 58 except for the lower end portion.

[0045] The cutting unit 18 is provided with a pair of first nozzles (jetting units) 60 disposed below the protective cover 52 so as to sandwich the lower part of the cutting blade 58. FIG. 4 includes a side view of one of the first nozzles 60. A body 61 of the first nozzle 60 is formed with a plurality of jetting ports 80 facing the cutting blade 58. The first nozzles 60 jet cutting fluid (fluid) onto the cutting blade 58.

[0046] A supply pipe (not shown) that passes through the inside of the protective cover 52 is connected to the base end of the first nozzle 60, and a connection portion 50 that protrudes from the upper surface of the protective cover 52 is provided at the base end of the supply pipe.

[0047] Furthermore, a second nozzle 68a that sprays cutting fluid (fluid) toward the outer periphery of the cutting blade 58 is provided at a position above the first nozzle 60 on the protective cover 52. A supply pipe 68 (see FIG. 3) that passes through the inside of the protective cover 52 is connected to the upstream side of the second nozzle 68a, and a connection part 50 that protrudes from the upper surface of the protective cover 52 is provided at the base end side of the supply pipe 68.

[0048] A supply source 62 that supplies cutting fluid (fluid) is connected to the connection part 50 via pipes 66a, 66b provided with a valve 64. When an open state in which the valve 64 is open is selected, cutting fluid is supplied from the supply source 62 to the first nozzle 60 and the second nozzle 68a. When a closed state in which the valve 64 is closed is selected, cutting fluid is no longer supplied from the supply source 62 to the first nozzle 60 and the second nozzle 68a. The cutting fluid (fluid) supplied from the supply source 62 is, for example, pure water or a liquid in which chemicals are added to water.

[0049] In the cutting device 2, the workpiece 1 contained in the cassette 8 is placed on the holding table 14 by the transport unit, and the workpiece 1 is suction-held by the holding table 14. Then, the camera unit 40 confirms the position of the area to be cut on the workpiece 1.

[0050] Next, when the rotation drive source housed in the spindle housing 46 is operated to rotate the spindle 56, the cutting blade 58 begins to rotate, and the cutting edge of the rotating cutting blade 58 is caused to cut into the workpiece 1 held by suction on the holding table 14, thereby cutting the workpiece 1. When the workpiece 1 is cut, a cutting groove 9 is formed in the workpiece 1 as shown in FIG. 2.

[0051] In order to reliably cut the workpiece 1 from its top to bottom with the cutting blade 58, it is necessary to control the cutting depth of the cutting blade 58 with high precision so that the bottom end of the cutting blade 58 is slightly lower than the bottom end of the workpiece 1. Therefore, in the cutting device 2, a setup process is carried out before the cutting blade 58 cuts the workpiece 1.

[0052] In the setup process, the cutting blade 58 is lowered from above onto the frame 14a of the holding table (chuck table) 14, and the height of the cutting blade 58 when contact between the frame 14a and the cutting blade 58 is detected is set as the reference height. Here, contact between the holding table 14 and the cutting blade 58 is detected by detecting the occurrence of electrical conduction between them.

[0053] When the cutting blade 58 cuts the workpiece 1, cutting fluid (fluid) is sprayed from the first nozzle 60 and the second nozzle 68a onto the workpiece 1 and the cutting blade 58, and the cutting fluid removes cutting chips and frictional heat generated by cutting. However, some cutting chips are scattered along with the cutting fluid and adhere to the protective cover 52 surrounding the cutting blade 58. Over time, the cutting chips that have adhered to the protective cover 52 may fall off the protective cover 52 and adhere to the upper surface of the holding table 14.

[0054] If the setup process is performed with cutting chips adhering to the upper surface of the holding table 14, energization of the cutting blade 58 and the holding table is detected when the cutting edge of the cutting blade 58 comes into contact with the cutting chips before it comes into contact with the upper surface of the holding table 14. In this case, a height position different from the height position that should be the reference height is set as the reference height, and when cutting the workpiece 1, the cutting blade 58 does not cut into the workpiece 1 as expected.

[0055] Therefore, in the cutting device 2 according to this embodiment, a fluid is sprayed onto the protective cover 52 that protects the cutting blade 58 and onto the holding table 14, thereby efficiently removing cutting debris adhering to these. Below, the cutting device 2 will be further described, focusing on the configuration related to the spraying of fluid onto the protective cover 52, etc.

[0056] In the cutting device 2 according to this embodiment, a fluid is sprayed onto the protective cover 52 from the first nozzle (spray unit) 60 and the spray nozzle (spray unit) 42 provided in the cutting unit 18, and the protective cover 52 is cleaned with the fluid. However, in conventional general cutting devices, the first nozzle 60 and the spray nozzle 42 are not configured to be able to spray fluid onto the protective cover 52. Therefore, the cutting device 2 according to this embodiment is provided with a spray destination changing unit so that the fluid can be sprayed onto the protective cover 52 from the first nozzle 60 etc.

[0057] That is, the cutting device 2 according to this embodiment includes a jetting destination changing unit that can switch the jetting destination of the fluid from the first nozzle (jetting unit) 60 and the jet nozzle (jetting unit) 42 using the holding table 14 and the protective cover 52.

[0058] First, we will explain the jet destination change unit that acts on the first nozzle (jetting unit) 60, which has a pair of rod-shaped bodies 61 that sandwich the cutting blade 58 covered by the protective cover 52 from both sides, and can change the destination of the fluid jetted by the first nozzle 60 to the protective cover 52.

[0059] Fig. 4 is a side view that schematically shows the internal configuration of the cutting unit 18. Fig. 4 shows the cutting unit 18 with the protective cover 52 partially removed and the injection unit including the first nozzle (injection unit) 60 slid from a predetermined position. In this state, the first nozzle 60 is removed from the side of the cutting blade 58, making it possible to replace the cutting blade 58.

[0060] For example, the jet destination changing unit 71 includes a rotary drive source 70 such as a motor, a spindle 72 rotated by the rotary drive source 70, a pulley 74 provided at the tip of the spindle 72, and a belt 76 looped around the pulley 74. Furthermore, the belt 76 is looped around a pulley 78 provided at the base end of the first nozzle 60. The first nozzle 60 is rotatably provided in the cutting unit 18.

[0061] The jet destination changing unit 71 can change the orientation of the first nozzle (jetting unit) 60 by operating the rotary drive source 70. That is, when the rotary drive source 70 is operated to rotate the spindle 72, the pulley 74 rotates, the belt 76 wound around the pulley 78 turns, and the pulley 78 rotates, changing the orientation of the first nozzle 60. When the orientation of the first nozzle 60 changes, the jet destination of the jet port 80 formed in the main body 61 changes.

[0062] Figures 5(A), 5(B), and 5(C) are cross-sectional views schematically showing first nozzles (ejectors) 60 facing in different directions. Figure 5(A) shows the first nozzle 60 with the ejection port 80 facing the cutting edge of the cutting blade 58, Figure 5(B) shows the first nozzle 60 with the ejection port 80 facing the protective cover 52, and Figure 5(C) shows the first nozzle 60 with the ejection port 80 facing the holding table 14.

[0063] When cutting the workpiece 1 with the cutting blade 58, the first nozzle 60 is oriented so that the ejection port 80 faces the cutting edge of the cutting blade 58, as shown in Fig. 5(A). When a fluid is ejected from the ejection port 80 in this state, the fluid is ejected onto the cutting edge of the cutting blade 58 and the workpiece 1. In this case, the fluid removes cutting chips, frictional heat, and the like generated by cutting. In other words, the fluid functions as a cutting fluid.

[0064] When cleaning the protective cover 52 with the fluid jetted from the first nozzle 60, the first nozzle 60 is oriented so that the jet nozzle 80 faces the protective cover 52, as shown in Fig. 5(B) . When the fluid is jetted from the jet nozzle 80 in this state, the fluid is jetted directly onto the protective cover 52. Therefore, cutting chips and the like adhering to the protective cover 52 are washed away by the fluid.

[0065] When cutting chips and the like are removed from the protective cover 52, they do not fall from the protective cover 52 onto the holding table 14. In this case, during the setup process of the cutting blade 58 (cutting unit 18), electrical conduction between the cutting blade 58 and the holding table 14 via the cutting chips does not occur. In other words, when the cutting edge of the cutting blade 58 comes into contact with the upper surface of the frame 14a of the holding table 14, electrical conduction occurs between them. Therefore, the setup process is performed appropriately, and the cutting blade 58 is positioned at an appropriate height when cutting the workpiece 1.

[0066] 5(C), when the ejection port 80 of the first nozzle (ejection unit) 60 is directed downward, it is also possible to clean the holding table 14. In this case, the holding table 14 to be cleaned is moved in advance to below the cutting unit 18. Then, when fluid is ejected from the ejection port 80, the holding table 14 is cleaned by the fluid.

[0067] In this way, the jetting destination changing unit 71 rotates each of the pair of bodies 61 of the first nozzle (jetting unit) 60 around the respective extension directions, thereby switching the destination of the fluid jetted by the first nozzle 60 between the cutting blade 58, the protective cover 52, and the holding table 14. In this case, the cutting device 2 does not require a dedicated nozzle for cleaning the protective cover 52, and the protective cover 52 can be easily and efficiently cleaned.

[0068] However, although the case where the orientation of the first nozzle (ejection section) 60 can be changed so that the ejection port 80 faces downward has been described, the ejection port 80 does not need to face downward, and the holding table 14 does not need to be cleaned by the fluid ejected from the first nozzle 60.

[0069] Furthermore, although the case where the ejection destination changing unit 71 changes the orientation of the first nozzle 60 has been described, the ejection destination changing unit 71 may change the ejection destination of the fluid by a method other than changing the orientation of the first nozzle 60. For example, the main body 61 of the first nozzle 60 may be provided with a plurality of second ejection ports (not shown) facing upward in addition to the ejection port 80.

[0070] The first nozzle 60 may be provided with a shield (not shown) that switchably blocks either the jet orifice 80 or the second jet orifice. The jet destination of the fluid may be switched by moving the shield to switch the target that the shield blocks between the jet orifice 80 and the second jet orifice. In this case, the shield may be moved by power transmitted from the rotation drive source 70 via a belt 76 or the like. That is, the jet destination changing unit 71 may move the shield instead of the main body 61.

[0071] Next, a case where a fluid is sprayed onto the protective cover 52 or the like by the spray nozzle (spray unit) 42 will be described. Fig. 6(A) shows a side view of the spray nozzle 42 and a partial cross-sectional side view that schematically shows a shield 90. The spray nozzle (spray unit) 42 extends in a second direction (Y-axis direction) that intersects with the first direction (X-axis direction) and has a rod-shaped main body 82 that can spray a fluid. When the holding table 14 passes through the area below the spray nozzle 42 while spraying a fluid downward from the spray nozzle 42, the holding surface 14c of the holding table 14 can be cleaned.

[0072] More specifically, the cutting device 2 includes a moving unit (X-axis moving mechanism) that moves the holding table 14 and the cutting unit 18 relatively in a first direction (X-axis direction) along the holding surface 14c. The spray nozzle (spray unit) 42 includes a first nozzle group 97 in the main body 82, the first nozzle group 97 having a plurality of first nozzles 96 that can spray fluid toward the holding table 14. When the moving unit is operated while spraying fluid from the spray nozzle 42, the holding table 14 is moved below the spray nozzle 42, and the holding table 14 can be washed with the fluid.

[0073] Furthermore, the injection nozzle (injection unit) 42 has a second injection port group 92 in the main body 82, which has a plurality of second injection ports 94 that can inject fluid toward the protective cover 52 of the cutting unit 18. For example, the first injection port 96 faces downward in the Z axis direction, while the second injection port 94 faces rearward in the X axis direction. However, the first injection port 96 does not need to face downward in the Z axis direction without deviation, and the second injection port 94 does not need to face rearward in the X axis direction without deviation.

[0074] The cutting device 2 is equipped with a cylindrical shield 90 having a slit 98 formed therein, and a shield moving unit 88 that moves the shield 90, as a jetting destination changing unit. For example, the shield moving unit 88 is supported by a support column 86 provided at a position adjacent to the opening 4b of the base 4, and has a built-in rotation drive source such as a motor. The shield 90 has an inner diameter corresponding to the outer diameter of the main body 82, and accommodates the main body 82 while partially covering it. That is, the shield 90 is equipped with a slit 98 that extends in the extension direction of the main body 82, and a portion of the main body 82 is exposed by the slit 98.

[0075] The shield 90 is rotatable relative to the main body 82. When the shield moving unit 88 is operated, the shield 90 moves (rotates) to change the area exposed by the notch 98 in the main body 82 of the jet nozzle 42. In other words, the jet destination changing unit is made up of the shield 90 that can shield one or both of the first jet port group 97 (first jet port 96) and the second jet port group 92 (second jet port 94), and the shield moving unit 88 that moves the shield 90 relative to the first jet port group 97 (first jet port 96) and the second jet port group 92 (second jet port 94).

[0076] 6(B) is a cross-sectional view that schematically shows the injection nozzle (injection unit) 42 in a state in which the first injection port group 97 (first injection port 96) is shielded by the shield 90. When a fluid is supplied to the injection nozzle 42 in a state in which the first injection port group 97 (first injection port 96) is shielded by the shield 90, the injection of the fluid from the first injection port 96 is hindered by the shield 90, and therefore the fluid is injected from the second injection port 94 and onto the protective cover 52.

[0077] 6(C) is a cross-sectional view schematically showing the jet nozzle (jetting unit) 42 in a state in which the second jet nozzle group 92 (second jet nozzles 94) is shielded by the shield 90. When a fluid is supplied to the jet nozzle 42 in a state in which the second jet nozzle group 92 (second jet nozzles 94) is shielded by the shield 90, the jetting of the fluid from the second jet nozzle 94 is hindered by the shield 90, and the fluid is jetted from the first jet nozzle 96 and sprayed downward. At this time, if the moving unit (X-axis moving mechanism) is operated to move the holding table 14 so that it passes through the area below the jet nozzle 42, the fluid can be sprayed onto the entire holding surface 14c of the holding table 14.

[0078] However, it is considered that the cleaning power of the fluid acting on the holding surface 14c of the holding table 14 may be uneven due to the arrangement of the first jetting nozzles 96. That is, the holding surface 14c directly below the first jetting nozzle 96 receives a relatively strong jet of fluid, while the holding surface 14c directly below the space between two adjacent first jetting nozzles 96 receives a relatively weak jet of fluid. Therefore, in order to jet the fluid uniformly onto the holding surface, the jetting nozzle (jetting unit) 42 may oscillate while jetting the fluid.

[0079] The injection nozzle (injection unit) 42 swings (vibrates, moves back and forth) along the Y-axis direction (second direction), for example. In this case, the fluid is injected evenly over the entire area of ​​the holding surface 14c, so the entire area of ​​the holding surface 14c is uniformly cleaned. Furthermore, when the injection nozzle 42 swings along the Y-axis direction, the fluid is injected uniformly from the second injection port 94 onto the protective cover 52, so the outer surface of the protective cover 52 is also uniformly cleaned.

[0080] As described above, the cutting device 2 according to this embodiment includes a jetting destination changing unit (shield 90, shield moving unit 88) that can switch the destination of the fluid jetted by the jet nozzle (jetting unit) 42 between the holding table 14 and the protective cover 52. Therefore, by jetting fluid from the jetting unit onto the holding table 14 and the protective cover 52, cutting chips adhering to these can be removed.

[0081] Up to this point, a case has been described in which the shield moving unit 88 moves the shield 90 and switches the nozzles (first nozzle 96, second nozzle 94) that are blocked in the jet nozzle 42, thereby causing the jet destination changing unit to change the jet destination of the fluid from the jet nozzle 42. However, the jet destination changing unit may change the jet destination of the fluid from the jet nozzle (jet unit) 42 by a method other than moving the shield 90.

[0082] For example, the jetting destination changing unit may be configured with a rotation mechanism that rotates the main body 82 of the jet nozzle 42 around the extension direction, instead of the shielding body 90 and the shielding body moving unit 88. In this case, the main body 82 may be rotated (moved) by power transmitted from a rotation drive source via a belt or the like. In other words, the jetting destination changing unit may move the main body 82 instead of the shielding body 90.

[0083] In this case, the main body 82 does not need to have two groups of ejection ports, but only one group of ejection ports. The ejection destination changing unit rotates (moves) the main body 82 to change the direction of the ejection ports and switch the ejection destination of the fluid.

[0084] Furthermore, the jet destination changing unit that changes the destination of the fluid ejected from the ejector (first nozzle 60, jet nozzle 42) may be driven by electricity supplied from the cutting device 2. However, the power source for the jet destination changing unit is not limited to electricity, and the jet destination changing unit may be realized by a mechanism other than a motor. Alternatively, the jet destination changing unit may be driven by the flow or pressure of the fluid supplied from a fluid supply source. In this case, the cutting device 2 includes a power generating unit in the fluid flow path to the ejector, or in a branch path branching off from the flow path.

[0085] Furthermore, if the ejection unit (first nozzle 60, ejection nozzle 42) is oscillating, the ejection unit may be oscillated using the flow or pressure of fluid supplied from a fluid supply source as a driving source. Next, a configuration of the ejection unit that oscillates the ejection unit using the flow or pressure of fluid as a driving source will be described.

[0086] Fig. 7 is a diagram showing a schematic configuration of an ejection unit (ejection nozzle 42) that oscillates using a fluid flow or pressure as a driving source. Fig. 7 includes a side view showing the oscillating ejection unit (ejection nozzle 42), a block showing an oscillating unit 112 that oscillates the ejection unit, and a cross-sectional view showing a power generating unit 100 that generates power for the oscillating unit 112 from the fluid flow or pressure supplied from a fluid supply source.

[0087] Fluid is supplied to the injection nozzle 42 from a fluid supply source 114 through a supply path. The fluid is then injected from the first injection port 96 or the second injection port 94 of the main body 82. Meanwhile, the supply path branches, and a speed controller 116 and a power generating unit 100 are provided in the branch path.

[0088] The speed controller 116 has a function of adjusting the flow rate of the fluid flowing into the branch passage, and adjusts the flow rate of the fluid so that the fluid flows into the branch passage at a flow rate that is necessary and sufficient for the operation of the power generating unit 100.

[0089] The power generating unit 100 has, for example, an impeller 102 that rotates around a rotary shaft 104. The impeller 102 receives fluid flowing through a branch passage and rotates around the rotary shaft 104. A conversion mechanism, such as a crankshaft, that converts rotational motion into reciprocating motion is connected to the impeller 102. A rod (output shaft) 106 that reciprocates due to this conversion mechanism is connected to an oscillating unit 112 via a bending portion 108, a rod 110, etc.

[0090] When fluid is supplied from fluid supply source 114 toward the injection unit (injection nozzle 42), some of the fluid flows through a branched path and rotates impeller 102 of power generating unit 100. Then, a conversion mechanism such as a crankshaft converts the rotational motion of impeller 102 into reciprocating motion of rod 106, which is transmitted to oscillating unit 112. This causes oscillating unit 112 to oscillate, and injection nozzle 42 (main body 82) to oscillate. When injection nozzle 42 oscillates while ejecting fluid, the holding surface of holding table 14, the outer surface of protective cover 52, and the like are uniformly cleaned.

[0091] In this way, when the jetting part (jet nozzle 42) can be oscillated using the flow of fluid supplied from the fluid supply source 114 as a driving source, the cutting device 2 does not need to consume power to oscillate the jetting part. Therefore, the cutting device 2 can efficiently and uniformly clean the holding table 14 and the protective cover 52.

[0092] Here, the first nozzle 60 of the cutting unit 18, which sprays cutting fluid (fluid), may also oscillate along its extension direction. The first nozzle 60 of the cutting unit 18 may oscillate using the flow or pressure of cutting fluid (fluid) supplied from a fluid supply source 62 as a driving source. In this case, a branch path may be provided in the piping 66a or supply pipe connecting the fluid supply source 62 and the first nozzle 60, and a power generating unit may be provided in this branch path. Furthermore, a swinging unit that swings the first nozzle 60 may be provided in the main body 61 of the first nozzle 60, and the swinging unit may be mechanically connected to this power generating unit.

[0093] The present invention is not limited to the above-described embodiment, and various modifications can be made. For example, in the above-described embodiment, the ejection unit (e.g., the ejection nozzle 42 and the first nozzle 60) is oscillated using a fluid as a driving source, but one aspect of the present invention is not limited to this.

[0094] For example, the power generating unit 100 provided in a branch path branching off from a supply path that supplies fluid from the supply source 114 to the jetting unit may be connected to the jetting destination changing unit and may supply power to the jetting destination changing unit. In other words, the jetting destination changing unit may be driven by the flow or pressure of the fluid supplied from the fluid supply source 114. Even in this case, the cutting device 2 does not need to consume power to operate the jetting destination changing unit. This allows the holding table 14 and protective cover 52 to be cleaned efficiently.

[0095] Furthermore, in the above embodiment, the main body 61, 82 of the ejection unit (ejection nozzle 42, first nozzle 60) is described as having a plurality of ejection ports 80, 94, 96 for ejecting fluid, but one aspect of the present invention is not limited to this. That is, the ejection unit may have only one ejection port 80, 94, 96 for ejecting fluid. In this case, in order to eject fluid over a wide range toward the ejection target, the ejection port 80, 94, 96 may have an elongated slit shape that extends along the extension direction of the main body 61, 82.

[0096] In the above embodiment, the fluid ejected from the ejection unit (ejection nozzle 42, first nozzle 60) is a liquid such as pure water, but the fluid ejected from the ejection unit is not limited to a liquid. For example, the fluid may be a gas such as high-pressure air (high-pressure gas), and the ejection unit may be capable of selectively ejecting either a liquid or a gas, or may be capable of ejecting both simultaneously.

[0097] For example, when the spraying unit (spray nozzle 42, first nozzle 60) sprays high-pressure air as a fluid, the target of the spraying can be dried. When the spraying unit sprays a liquid such as pure water to clean the target and then sprays high-pressure air, the liquid adhering to the target can be removed and a drying process can be performed. Also, when the spraying unit sprays a liquid such as pure water and high-pressure air simultaneously as a fluid, i.e., when spraying a mixed fluid, the fluid is sprayed onto the target with a strong spray force, so the target can be thoroughly cleaned.

[0098] The structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0099] 1 Workpiece 3 Tape 5 Annular frame 7 Frame Unit 9 Cutting groove 2 Cutting equipment 4 Foundation 4a,4b,4c opening 6 Cassette support stand 8 cassettes 10. Table Cover 12 Dustproof / waterproof cover 14 Holding table 14a Frame 14b Porous material 14c holding surface 16 Clamp 18 Cutting section 20 Support structure 22 Mobile Unit 24,32 guide rail 26,34 Moving plate 28,36 Ball screw 30,38 Pulse motor 40 Camera Unit 42 Injection nozzle 44 Cleaning Unit 46 Spindle housing 50 Connection 52 Protective cover 56 Spindle 58 Cutting Blade 60 No. 1 nozzle 61 Main Unit 62 Source 64 valves 66a, 66b Piping 68 Supply pipe 68a No. 2 nozzle 70 Rotational drive source 71 Jet destination change unit 72 Spindle 74,78 Pulley 76 Belt 78 Pulley 80 injection port 82 Main Unit 84,86 Support column 88 Shield moving part 90 Shield 92 2nd injection port group 94 2nd injection port 96 1st injection port 97 1st injection port group 98 Notch 100 Power generation section 102 Impeller 104 Rotational Axis 106,110 rods 108 Bend 112 Swinging part 114 Source 116 Speed ​​Controller

Claims

1. a holding table having a holding surface for holding a workpiece; a cutting unit having a spindle having an annular cutting blade fixed to one end thereof and serving as a rotation axis of the cutting blade, and a protective cover capable of covering and protecting the cutting blade, and capable of cutting the workpiece held on the holding table with the cutting blade; an ejection unit capable of ejecting a fluid; an ejection destination changing unit that switches the ejection destination of the fluid by the ejection unit using the holding table and the protective cover; cutting equipment.

2. a moving unit that relatively moves the holding table and the cutting unit in a first direction along the holding surface, The injection unit is a rod-shaped body extending in a second direction intersecting the first direction and capable of ejecting the fluid; The fluid can be sprayed onto the entire holding surface by one or both of the moving unit and the spray destination changing unit. The cutting device according to claim 1 .

3. the ejection unit has a first ejection port in the main body that can eject the fluid toward the holding table and a second ejection port that can eject the fluid toward the protective cover, 3. The cutting device according to claim 2, wherein the jet destination changing unit is configured with a shield that can shield one or both of the first jet nozzle and the second jet nozzle, and a shield moving unit that moves the shield relative to the first jet nozzle and the second jet nozzle.

4. The injection unit has a pair of rod-shaped bodies that sandwich the cutting blade covered with the protective cover from both sides, 2. The cutting device according to claim 1, wherein the jetting destination changing unit switches the jetting destination of the fluid from the jetting unit between the cutting blade, the protective cover, and the holding table by rotating each of the pair of main bodies around the respective extension directions.

5. 5. The cutting device according to claim 1, wherein the jet destination changing unit is driven by a flow or pressure of the fluid supplied from a fluid supply source.

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