Substrate including alignment mark and edge detection device for substrate including alignment mark

Abstract

To provide a substrate including an alignment mark that can accurately detect a position of an edge of the substrate, and an edge detection device of the substrate including the alignment mark.SOLUTION: An active matrix substrate (2), which is a substrate including alignment marks (ALM1 and ALM2), includes an active matrix substrate (2) and the alignment marks (ALM1 and ALM2) provided on part of a first surface (2S1) that is a surface on one side of the active matrix substrate (2). Each of the active matrix substrate (2) and the alignment marks (ALM1 and ALM2) has a cutting line (SDL1, SDL2), and the cutting line (SDL2) of the alignment mark (ALM1, ALM2) coincides with the cutting line (SDL1) of the active matrix substrate (2) in a plan view.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a substrate including an alignment mark and an apparatus for detecting an edge of a substrate including an alignment mark. [Background technology]

[0002] In various fields, research and development is being actively conducted to more effectively utilize alignment marks provided on substrates. For example, Patent Document 1 describes a method for improving the recognition rate of alignment marks, and Patent Document 2 describes an edge position detection device that accurately measures the line width of a mark and detects the edge position of the mark on a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-9315 [Patent Document 2] Japanese Patent Application Laid-Open No. 2006-29892 Summary of the Invention [Problem to be solved by the invention]

[0004] The method for improving the recognition rate of alignment marks described in Patent Document 1 solves problems that can arise when alignment marks on a substrate are not recognized. Furthermore, the edge position detection device described in Patent Document 2 accurately measures the line width of the mark to detect the edge position of the mark. However, for example, during the process of dividing a mother substrate into multiple substrates, possible division tolerances can cause variations in the position of the alignment marks on the individual substrates. If such variations in the position of the alignment marks occur, the positions of the substrate edges detected based on the positions of the alignment marks on each of the individual substrates also vary, resulting in a problem that the positions of the substrate edges cannot be detected with high accuracy. Furthermore, conventional edge detection methods include detecting edges by setting a threshold value between the brightness difference between the detection target area and the surrounding area or by setting a threshold value for the brightness change rate (differential processing). However, with such conventional edge detection methods, the brightness / contrast of the acquired image changes due to fluctuations in light source brightness, fluctuations in the angle of the object to be detected relative to the light source, and image blurring, resulting in a deviation from the threshold value and errors, making stable detection difficult and lengthening processing times.

[0005] One aspect of the present disclosure aims to provide a substrate including an alignment mark that can detect the position of the edge of the substrate with high accuracy, and an edge detection device for a substrate including an alignment mark that can detect the position of the edge of the substrate stably and with high accuracy in a relatively short period of time. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems, the substrate including the alignment mark of the present disclosure has the following features: a substrate; and an alignment mark provided on a part of a first surface, which is one surface of the substrate; the substrate and the alignment mark each have a cutting line; The cutting line of the alignment mark coincides with the cutting line of the substrate in a plan view.

[0007] In order to solve the above-mentioned problems, the edge detection device for a substrate including an alignment mark of the present disclosure comprises: a mounting table on which a substrate including the alignment mark is placed; a functional unit including an imaging unit that images the alignment mark; a storage unit in which data of a first image of the alignment mark in a plan view, including an end of the alignment mark where a cutting line of the alignment mark is located, obtained from the imaging unit, is stored; a control unit that detects the position of a portion of the edge of the substrate by comparing data of a second image of the alignment mark in a plan view obtained from the imaging unit, the second image including the edge of the alignment mark where the cutting line of the alignment mark is located, with data of the first image in the storage unit; One of the mounting table and the functional unit is movable in the X direction, the Y direction, and the Z direction relative to the other of the mounting table and the functional unit. [Effects of the Invention]

[0008] According to one aspect of the present disclosure, it is possible to provide a substrate including an alignment mark that can detect the position of an edge of the substrate with high accuracy, and an edge detection device for a substrate including an alignment mark. [Brief explanation of the drawings]

[0009] [Figure 1] 2 is a plan view of the display device of Embodiment 1, viewed from the second surface side of the active matrix substrate. FIG. [Figure 2] 3 is an enlarged view of alignment marks provided on a first surface of an active matrix substrate of the display device of Embodiment 1, viewed from a second surface side of the active matrix substrate. FIG. [Figure 3] 3 is a diagram showing alignment marks provided on a first surface of an active matrix substrate of the display device of Embodiment 1, as viewed from the side of the active matrix substrate. FIG. [Figure 4] 1 is a perspective view showing a part of a display device according to a first embodiment. [Figure 5] 2 is a diagram showing a cross section taken along line AA' of the display device of embodiment 1 shown in FIG. [Figure 6] 1 is a diagram showing a schematic configuration of an edge detection device for an active matrix substrate including alignment marks provided in the display device of Embodiment 1. FIG. [Figure 7] 7 is a diagram for explaining a process of applying a conductive resin to a predetermined position of the display device of the first embodiment using the edge detection device shown in FIG. 6. FIG. [Figure 8] 7 is a diagram illustrating a process performed in the edge detection device shown in FIG. 6 to compare first image data with second image data and detect the position of a portion of an edge of the active matrix substrate. FIG. [Figure 9] 7 is a diagram showing a case where a nozzle for dispensing conductive resin is moved to a position for applying conductive resin detected by the edge detection device shown in FIG. 6 when a display device of embodiment 1 is separated from a mother display device including multiple display devices without separation tolerance. [Figure 10] 7 is a diagram showing a case where a display device of embodiment 1 is separated from a mother display device including multiple display devices with a positive separation tolerance, and the nozzle that dispenses the conductive resin is moved to the application position of the conductive resin detected by the edge detection device shown in FIG. [Figure 11] 7 is a diagram showing a case where a display device of embodiment 1 is separated from a mother display device including multiple display devices with a negative separation tolerance, and the nozzle that dispenses the conductive resin is moved to the application position of the conductive resin detected by the edge detection device shown in FIG. [Figure 12] 7A to 7C are diagrams illustrating a process in which the edge detection device shown in FIG. 6 detects the position of a part of an edge of an active matrix substrate including a conventional alignment mark. [Figure 13] 7 is a diagram showing a case where a conventional display device is separated from a mother display device including multiple display devices without separation tolerance, and the nozzle for dispensing conductive resin is moved to the application position of the conductive resin detected by the edge detection device shown in FIG. [Figure 14]7 is a diagram showing the case where a conventional display device is separated from a mother display device including multiple display devices with a positive separation tolerance, and the nozzle that dispenses the conductive resin is moved to the application position of the conductive resin detected by the edge detection device shown in FIG. [Figure 15] 7 is a diagram showing a case where a conventional display device is separated from a mother display device including multiple display devices with a negative separation tolerance, and the nozzle that dispenses the conductive resin is moved to the application position of the conductive resin detected by the edge detection device shown in FIG. [Figure 16] 7 is a diagram showing a case where the functional section of the edge detection device shown in FIG. 6 further includes a temperature adjusting section that adjusts the temperature of a storage section of conductive resin. FIG. [Figure 17] 1 is a diagram showing a schematic configuration of an edge detection device having a tilting mechanism for tilting the display device of Embodiment 1, which is provided with an active matrix substrate including alignment marks, at an angle of 45 degrees or less with respect to a plane. [Figure 18] 18 is a diagram showing a case where the functional section of the edge detection device having the tilting mechanism shown in FIG. 17 further includes a light irradiation section. FIG. [Figure 19] 18 is a diagram for explaining a step of moving a nozzle for dispensing conductive resin to a conductive resin application position detected by the edge detection device shown in FIG. 17, and a step of applying conductive resin. FIG. [Figure 20] 10A and 10B are diagrams for explaining problems that arise in a process of applying a conductive resin to a part of an edge of a conventional active matrix substrate including an alignment mark. [Figure 21] 4 is a diagram for explaining the finished dimensions of the conductive resin applied to the display device of the first embodiment. FIG. [Figure 22] 10 is a diagram for explaining the degree of variation in the finished dimensions of the conductive resin applied to the display device of the first embodiment. FIG. [Figure 23] 10A and 10B are diagrams for explaining the degree of variation in the finished dimensions of a conductive resin applied to a conventional display device equipped with an active matrix substrate including a conventional alignment mark. DETAILED DESCRIPTION OF THE INVENTION

[0010] The following describes embodiments of the present disclosure with reference to Figures 1 to 23. For the sake of convenience, components having the same functions as those described in specific embodiments will be denoted by the same reference numerals, and their description may be omitted.

[0011] [Embodiment 1] FIG. 1 is a plan view of a display device 1 of Embodiment 1, as viewed from the second surface 2S2 side of an active matrix substrate 2. FIG. 2 is an enlarged view of alignment marks ALM1 provided on a first surface 2S1 of an active matrix substrate 2 of the display device 1 of Embodiment 1, as viewed from the second surface 2S2 side of the active matrix substrate 2. FIG. 3 is a view of alignment marks ALM1 provided on a first surface 2S1 of an active matrix substrate 2 of the display device 1 of Embodiment 1, as viewed from the side surface 2SIS side of the active matrix substrate 2. FIG. 4 is a perspective view showing a part of the display device 1 of Embodiment 1. FIG. 5 is a view showing a cross section of the display device 1 of Embodiment 1 taken along line A-A' shown in FIG.

[0012] As shown in FIG. 1, the display device 1 includes an active matrix substrate 2 that includes alignment marks ALM1 and ALM2. In this embodiment, as shown in FIGS. 4 and 5, a counter substrate 3 is provided on a first surface 2S1 side of the active matrix substrate 2. Although not shown, a plurality of pixel electrodes are provided on the first surface 2S1 of the active matrix substrate 2, and a counter substrate 3 is provided so as to face the plurality of pixel electrodes. In this embodiment, a liquid crystal layer (not shown) is further provided between the plurality of pixel electrodes of the active matrix substrate 2 and the counter substrate 3. In the case of a TN (Twisted Nematic) type in which liquid crystal molecules contained in the liquid crystal layer are controlled by a vertical electric field, a common counter electrode facing the plurality of pixel electrodes is provided on the counter substrate 3. In the case of an IPS (In Plane Switching) type in which liquid crystal molecules contained in the liquid crystal layer are controlled by a horizontal electric field, the common counter electrode is provided on the first surface 2S1 of the active matrix substrate 2 together with the plurality of pixel electrodes. As described above, in this embodiment, the display device 1 is described as a liquid crystal display device, but is not limited to this as long as it includes an active matrix substrate 2 that includes alignment marks ALM1 and ALM2. For example, the display device may include OLEDs (organic light-emitting diodes) or QLEDs (quantum dot light-emitting diodes) as light-emitting elements at positions corresponding to the plurality of pixel electrodes on the active matrix substrate 2. In this embodiment, the substrate including alignment marks ALM1 and ALM2 is described as an active matrix substrate 2, but the substrate including alignment marks ALM1 and ALM2 is not limited to a substrate for a display device and may be a substrate used in various fields other than a display device. The substrate including alignment marks ALM1 and ALM2 may be, for example, a semiconductor wafer, a flexible printed circuit board, a color filter substrate, a mask, an IC chip, or the like.

[0013] As shown in FIG. 2, the alignment mark ALM1 provided on the first surface 2S1, which is one surface of the active matrix substrate 2 shown in FIG. 3, has a cutting line SDL2. Also, as shown in FIG. 1, the active matrix substrate 2 has cutting lines that form the ends E1, E2, E3, and E4. As shown in FIG. 2, the cutting line SDL2 of the alignment mark ALM1 coincides with the cutting line SDL1 that forms the end E3 of the active matrix substrate 2 in a plan view. In this embodiment, as shown in FIG. 1, an alignment mark ALM2 is provided together with the alignment mark ALM1 on the first surface 2S1, which is the surface of the active matrix substrate 2 opposite the second surface 2S2. Like the alignment mark ALM1, the alignment mark ALM2 also has a cutting line, and the cutting line of the alignment mark ALM2 coincides with the cutting line SDL1 that forms the end E3 of the active matrix substrate 2 in a plan view. The alignment marks ALM1 and ALM2 can be formed using, for example, an Al-based material, a W-based material, or a carbon-based material. Suitable Al-based materials include, for example, an Al-Si laminate, a Mo-Al-Mo laminate, and a Ti-Al-TiN laminate, and suitable W-based materials include, for example, a W-Ta laminate.

[0014] 1 is obtained through a process of dividing a mother display device including a plurality of display devices into a plurality of display devices to form individual display devices. In this dividing process, cutting lines are formed to form the ends E1, E2, E3, and E4 of the active matrix substrate 2, and when the cutting line to form the end E3 of the active matrix substrate 2 is formed, the cutting line for each of the alignment marks ALM1 and ALM2 is also formed. Therefore, the cutting lines for each of the alignment marks ALM1 and ALM2 coincide with the cutting line that forms the end E3 of the active matrix substrate 2 in a plan view.

[0015] 1, the active matrix substrate 2 included in the display device 1 includes a first region R1 and a second region R2 that surrounds the first region R1 and includes all of the edges of the active matrix substrate 2: edge E1, edge E2, edge E3, and edge E4. In Fig. 1, the second region R2 including edge E1, the second region R2 including edge E2, and the second region R2 including edge E4 are illustrated as if they have no width, but in reality, they have a predetermined width, just like the second region R2 including edge E3.

[0016] As shown in FIGS. 1 and 2 , each of the alignment marks ALM1 and ALM2 is provided in the second region R2—in this embodiment, the second region R2 includes the edge E3—and is a continuous film formed from the edge E3 of the active matrix substrate 2 in a first direction D1, which is a direction perpendicular to the edge E3. Note that a continuous film refers to a film that is not divided by materials other than the material constituting the continuous film in a single plane. In this embodiment, as shown in FIG. 2 , a case will be described in which each of the alignment marks ALM1 and ALM2 is formed from a plurality of (e.g., five) continuous films formed in the first direction D1, which is a direction perpendicular to the edge E3 formed from the edge E3 of the active matrix substrate 2 along the second direction D2. However, this is not limiting, and each of the alignment marks ALM1 and ALM2 may be formed from a single continuous film formed from the edge E3 of the active matrix substrate 2 in the first direction D1, which is a direction perpendicular to the edge E3.

[0017] In the active matrix substrate 2 shown in FIG. 1, a first region R1 is a display region, and a second region R2 is a non-display region. A first surface 2S1 of the active matrix substrate 2 in the display region is provided with a plurality of pixel electrodes (not shown), and the first surface 2S1 of the non-display region of the active matrix substrate 2 is provided with alignment marks ALM1 and ALM2. The alignment marks ALM1 and ALM2 preferably have a shape that prevents the positions of the alignment marks ALM1 and ALM2 in a second direction D2 shown in FIG. 2 from changing in an image captured by the imaging unit 24, even when the imaging unit 24 (e.g., a camera) described later is moved along a first direction D1 shown in FIG. 2, which is the separation tolerance direction of the display device 1. Furthermore, as shown in FIG. 2, the alignment marks ALM1 and ALM2 are preferably formed as a plurality of continuous films each having a predetermined line width and a predetermined line-to-line width, in order to improve recognition rate.

[0018] As will be described later, in this embodiment, the alignment marks ALM1 and ALM2 provided on the first surface 2S1 of the active matrix substrate 2 are detected from the second surface 2S2 side of the active matrix substrate 2, so the active matrix substrate 2 is preferably a glass substrate or a light-transmitting resin substrate on which the pixel electrodes and alignment marks ALM1 and ALM2 are provided.

[0019] As shown in FIGS. 4 and 5, in this embodiment, the active-matrix substrate 2 includes a flexible printed circuit board 10 including first connection pads CP1 and CP1'. A wiring pattern HP including second connection pads CP2 and CP2' is provided on a second surface 2S2 facing the first surface 2S1 of the non-display area, which is the second region R2 including the edge E3 of the active-matrix substrate 2. In this embodiment, a transparent electrode layer 8 made of, for example, ITO (indium tin oxide) is provided over the entire second surface 2S2 of the active-matrix substrate 2. To reduce the resistance of the transparent electrode layer 8, a wiring pattern HP including second connection pads CP2 and CP2' electrically connected to the transparent electrode layer 8 is provided around the periphery of the second surface 2S2 of the active-matrix substrate 2. As shown in FIG. 5, the flexible printed circuit board 10 is provided on a portion of the first surface 2S1 of the non-display area of ​​the active-matrix substrate 2 so that the first connection pads CP1 and CP1' are located near the second connection pads CP2 and CP2'.

[0020] 5, in the active matrix substrate 2 including the alignment marks ALM1 and ALM2 provided in the display device 1, a conductive resin CR2 is provided as a continuous film on at least a portion of the first connection pads CP1′, at least a portion of the second connection pads CP2′, and a side surface 2SIS of the end E3 of the portion of the active matrix substrate 2 where the second connection pads CP2′ are provided. Although not shown, in the active matrix substrate 2 including the alignment marks ALM1 and ALM2 provided in the display device 1, a conductive resin CR1 is provided as a continuous film on at least a portion of the first connection pads CP1, at least a portion of the second connection pads CP2, and a side surface 2SIS of the end E3 of the portion of the active matrix substrate 2 where the second connection pads CP2 are provided. Note that in this embodiment, a resin containing Ag particles, which are conductive particles, is used as the conductive resin CR1 and CR2, but the present invention is not limited to this. As will be described in more detail below, the alignment marks ALM1 and ALM2 provided on the active matrix substrate 2 enable alignment that follows any separation tolerances that may arise in the process of dividing a mother display device including a plurality of display devices into individual display devices, and the positions of the edges of the active matrix substrate 2 can be detected with high precision, enabling the conductive resins CR1 and CR2 to be applied with high precision and in a stable manner without being affected by the separation tolerances. In this embodiment, an example will be described in which the alignment marks ALM1 and ALM2 are used to accurately detect an edge E3 of the active matrix substrate 2, and the conductive resins CR1 and CR2 are applied with high precision to predetermined positions on the edge E3. However, the type of process is not particularly limited as long as it is performed based on the positions of the edges of the substrate that are accurately detected using the alignment marks ALM1 and ALM2.

[0021] FIG. 6 is a diagram showing a schematic configuration of an edge detection device 20 for an active matrix substrate 2 including alignment marks ALM1 and ALM2 provided in the display device 1 of Embodiment 1. FIG. 7 is a diagram for explaining a process of applying conductive resins CR1 and CR2 to predetermined positions of the display device 1 of Embodiment 1 using the edge detection device 20 shown in FIG. 6. FIG. 8 is a diagram for explaining a process performed by the edge detection device 20 shown in FIG. 6 to compare data of a first image GZ1 with data of a second image GZ2 to detect the position of a portion of the edge E3 of the active matrix substrate 2. FIG. 9 is a diagram showing a case where the display device 1 of Embodiment 1 is separated from a mother display device including multiple display devices without any separation tolerance, and the nozzle 23N for dispensing the conductive resin CR1 is moved to the application position of the conductive resin CR1 detected by the edge detection device 20 shown in FIG. 6. 10 is a diagram showing a case where the nozzle 23N for dispensing the conductive resin CR1 is moved to the application position of the conductive resin CR1 detected by the edge detection device 20 shown in FIG. 6 when the display device 1 of Embodiment 1 is separated from the mother display device including multiple display devices with a positive separation tolerance. FIG. 11 is a diagram showing a case where the nozzle 23N for dispensing the conductive resin CR1 is moved to the application position of the conductive resin CR1 detected by the edge detection device 20 shown in FIG. 6 when the display device 1 of Embodiment 1 is separated from the mother display device including multiple display devices with a negative separation tolerance. FIG. 12 is a diagram for explaining a process in which the edge detection device 20 shown in FIG. 6 detects the position of a part of the edge E3 of the active matrix substrate 102 including the conventional alignment mark ALM101. FIG. 13 is a diagram showing a case where the nozzle 23N for dispensing the conductive resin CR1 is moved to the application position of the conductive resin CR1 detected by the edge detection device 20 shown in FIG. 6 when the conventional display device is separated from the mother display device including multiple display devices without a separation tolerance. Figure 14 shows the case where a conventional display device is separated from a mother display device containing multiple display devices with a positive separation tolerance, and the nozzle 23N that dispenses the conductive resin CR1 is moved to the application position of the conductive resin CR1 detected by the edge detection device 20 shown in Figure 6.Figure 15 shows the case where a conventional display device is separated from a mother display device containing multiple display devices with a negative separation tolerance, and the nozzle 23N that dispenses the conductive resin CR1 is moved to the application position of the conductive resin CR1 detected by the edge detection device 20 shown in Figure 6.

[0022] As shown in FIG. 6, the edge detection device 20 includes a mounting table 28 on which a display device 1 having an active matrix substrate 2 including alignment marks ALM1 and ALM2 is mounted, a functional unit 22 having an imaging unit 24 that images the alignment marks ALM1 and ALM2, a memory unit (not shown) that stores data of a first image GZ1 in a plan view of the alignment marks ALM1 and ALM2 including the edges of the alignment marks ALM1 and ALM2 where the cutting line SDL2 (shown in FIG. 2) of the alignment marks ALM1 and ALM2 obtained from the imaging unit 24 is located, and and a control unit (not shown) that detects the position of a portion of the edge E3 of the active matrix substrate 2 by comparing data of a second image GZ2 of the alignment marks ALM1 and ALM2 in a planar view, the second image GZ2 including the edges of the alignment marks ALM1 and ALM2 where the cutting lines SDL2 of the alignment marks ALM1 and ALM2 are located, with data of the first image GZ1 stored in the memory unit. One of the mounting table 28 and the functional unit 22 is movable relative to the other of the mounting table 28 and the functional unit 22 in the X direction, which is the left-right direction in FIG. 6, the Y direction, which is the depth direction in FIG. 6, and the Z direction, which is the up-down direction in FIG. 6. That is, it is only necessary that one of the mounting table 28 and the functional unit 22 is movable relative to the other of the mounting table 28 and the functional unit 22 in each of the X direction, the Y direction, and the Z direction. The edge detection device 20 detects the alignment marks ALM1 and ALM2 provided on the first surface 2S1 of the active matrix substrate 2 from the second surface 2S2 side of the active matrix substrate 2. The storage unit and the control unit may be provided, for example, inside the support unit 21. In this embodiment, a case will be described as an example in which the functional unit 22 moves relative to the mounting base 28 in the X direction, which is the left-right direction in Fig. 6, and in the Z direction, which is the up-down direction in Fig. 6, and the mounting base 28 moves relative to the functional unit 22 in the Y direction, which is the depth direction in Fig. 6, but this is not limiting. That is, in this embodiment, the functional unit 22 is movable in the X direction and Z direction relative to the fixed support unit 21 and is fixed in the Y direction, and the mounting base 28 is movable in the Y direction relative to the fixed support unit 21 and is fixed in the X direction and Z direction.The edge detection device 20 can detect the position of the edge of the substrate more stably, in a shorter time, and with higher accuracy than the conventional edge detection methods described above.

[0023] In this embodiment, the alignment marks ALM1 and ALM2 are used to accurately detect the edge E3 of the active-matrix substrate 2 and to apply the conductive resins CR1 and CR2 to predetermined positions on the edge E3 with high accuracy. Therefore, the functional unit 22 of the edge detection device 20 includes a storage unit 23 for the conductive resins CR1 and CR2, as shown in FIG. 6 . A nozzle 23N that dispenses the conductive resins CR1 and CR2 toward the mounting table 28 is provided on the surface of the storage unit 23 facing the mounting table 28. The control unit then moves one of the mounting table 28 and the functional unit 22 relative to the other of the mounting table 28 and the functional unit 22 based on the detected position of the edge of the active-matrix substrate 2. That is, the edge detection device 20 shown in FIG. 6 further detects the application positions of the conductive resins CR1 and CR2 based on the detected position of the edge E3 of the active-matrix substrate 2 using the alignment marks ALM1 and ALM2, and moves the nozzle 23N that dispenses the conductive resins CR1 and CR2 to the application positions. The control unit then dispenses the conductive resins CR1 and CR2 at predetermined positions through the nozzles 23N, forming the conductive resins CR1 and CR2 into the shapes shown in FIG. 5. As shown in FIG. 6, the functional unit 22 of the edge detection device 20 preferably includes a rangefinder 25 that measures the distance in the Z direction between the active matrix substrate 2 provided in the display device 1 and the nozzles 23N. The rangefinder 25 may be, for example, a laser rangefinder. When the rangefinder 25 is provided, the nozzles 23N can be brought closer to the display device 1 while measuring the distance in the Z direction between the active matrix substrate 2 and the nozzles 23N. When the rangefinder 25 is not provided, the control unit may simply lower the functional unit 22 by a fixed distance in the Z direction.

[0024] In this embodiment, as shown in Figure 7, in the edge detection device 20, a process (S1) of detecting and imaging the alignment mark ALM1, a process (S2) of detecting and imaging the alignment mark ALM2, a process (S3) of detecting the application position of the conductive resin CR1, a process (S4) of detecting the application position of the conductive resin CR2, a process (S5) of applying the conductive resin CR1, and a process (S6) of applying the conductive resin CR2 are performed in this order, as an example, but this is not limited to this. For example, one of the steps (S1) and (S2) may be performed first, followed by the other of the steps (S1) and (S2), followed by one of the steps (S3) and (S4), followed by the other of the steps (S3) and (S4), followed by one of the steps (S5) and (S6), followed by the other of the steps (S5) and (S6). Furthermore, the steps (S1), (S3), and (S5) may be performed in this order, followed by the steps (S2), (S4), and (S6) in this order, or the steps (S2), (S4), and (S6) may be performed in this order, followed by the steps (S1), (S3), and (S5) in this order.

[0025] 7, in the step (S1) of detecting and imaging the alignment mark ALM1, as shown in Fig. 8, first, the control unit 29 provided in the edge detection device 20 reads out data of a first image GZ1 in a plan view of the alignment mark ALM1, which includes the end of the alignment mark ALM1 where the cutting line SDL2 of the alignment mark ALM1 is located, which has been obtained in advance by the imaging unit 24 and which is stored in the memory provided in the edge detection device 20, and compares it with data of the captured image obtained from the imaging unit 24. In this step, in order to stably detect the alignment mark ALM1 in a short time, the alignment mark ALM1 is taught to the edge detection device 20 in advance, and pattern matching is performed between the data of the captured image obtained from the imaging unit 24 and the data of the first image GZ1, which is the teaching image, thereby detecting the alignment mark ALM1 in the captured image obtained from the imaging unit 24. In the process of detecting the alignment mark ALM1 using such pattern matching, a portion having the same shape as the first image GZ1, which is the teaching image, is searched for within the captured image obtained from the imaging unit 24. If the matching rate of that portion is equal to or greater than a certain level, that portion is recognized as the alignment mark ALM1, and its position is detected. In this embodiment, the data of the captured image obtained from the imaging unit 24 is data of a second image GZ2 of the alignment mark ALM1 in a planar view, including the end of the alignment mark ALM1 where the cutting line SDL2 of the alignment mark ALM1 is located, as shown in FIG. 8. The control unit 29 can detect a partial position of the end E3 of the active matrix substrate 2, for example, a central position of the region where the alignment mark ALM1 is provided (the position where the dotted lines intersect in FIG. 8), as the detection position EP of the alignment mark ALM1.In the process (S2) of detecting and imaging the alignment mark ALM2 shown in Figure 7, similar to the process (S1) of detecting and imaging the alignment mark ALM1 shown in Figure 7 described above, the control unit 29 can detect the position of a part of the end E3 of the active matrix substrate 2, for example, the central position of the area in which the alignment mark ALM2 is provided, as the detection position EP of the alignment mark ALM2.

[0026] 7, the control unit 29 included in the edge detection device 20 can detect, as the application position of the conductive resin CR1, a position moved a predetermined distance inward of the active matrix substrate 2 along the edge E3 of the active matrix substrate 2 from the detection position EP of the alignment mark ALM1. As shown in FIG. 1, the position where the conductive resin CR1 is formed is a predetermined distance inward of the active matrix substrate 2 from the position where the alignment mark ALM1 is provided, along the edge E3 of the active matrix substrate 2. Note that, in the detection step (S4) of the application position of the conductive resin CR2 shown in FIG. 7, similarly to the above-described detection step (S3) of the application position of the conductive resin CR1 shown in FIG. 7, the control unit 29 can detect, as the application position of the conductive resin CR2, a position moved a predetermined distance inward of the active matrix substrate 2 along the edge E3 of the active matrix substrate 2 from the detection position EP of the alignment mark ALM2.

[0027] The alignment marks ALM1 and ALM2 provided on the active-matrix substrate 2 enable alignment that follows separation tolerances that may occur in the process of dividing a mother display device including multiple display devices into multiple display devices and singulating it into individual devices. This allows the position of the edge of the active-matrix substrate 2 to be detected with high accuracy, enabling the conductive resins CR1 and CR2 to be applied with high accuracy and stability, without being affected by the separation tolerances. The control unit 29 detects the application position of the conductive resin CR1 by moving the position detected by the alignment mark ALM1 a predetermined distance inward along the edge E3 of the active-matrix substrate 2 from the detection position EP of the alignment mark ALM1. The control unit 29 then moves the nozzle 23N that dispenses the conductive resin CR1 to this detected application position of the conductive resin CR1. As shown in FIG. 9 , when the display device 1 is ideally divided without separation tolerances from the mother display device including multiple display devices, the nozzle 23N is accurately positioned over a portion of the edge E3 of the active-matrix substrate 2. 10, even when the display device 1 is separated from the mother display device including multiple display devices with a positive separation tolerance (for example, separation tolerance = +4.0 mm), the nozzle 23N is accurately positioned on a part of the edge E3 of the active matrix substrate 2. Furthermore, as shown in FIG. 11, even when the display device 1 is separated from the mother display device including multiple display devices with a negative separation tolerance (for example, separation tolerance = -4.0 mm), the nozzle 23N is accurately positioned on a part of the edge E3 of the active matrix substrate 2.

[0028] In the process of detecting and imaging the conventional alignment mark ALM101, as shown in Fig. 12, first, the control unit 29 provided in the edge detection device 20 reads out data of a first image GZ1 in a planar view of the conventional alignment mark ALM101 that was previously obtained by the imaging unit 24 and that is stored in the memory provided in the edge detection device 20, and compares it with data of the captured image obtained from the imaging unit 24. The data of the captured image obtained from the imaging unit 24 is data of a second image GZ2 in a planar view of the conventional alignment mark ALM101, as shown in Fig. 12. The control unit 29 can detect the center of the conventional alignment mark ALM101 as the detection position EP of the conventional alignment mark ALM101. To detect the application position of the conductive resin CR1 from the detection position EP of the conventional alignment mark ALM101, the control unit 29 first horizontally moves the detection position EP of the conventional alignment mark ALM101 toward the edge E3 of the active matrix substrate 102 by the shortest distance DIS between the detection position EP of the conventional alignment mark ALM101 and the edge E3 of the active matrix substrate 102, and then moves the detection position EP a predetermined distance inward along the edge E3 of the active matrix substrate 102, and can detect this position as the application position of the conductive resin CR1. As shown in Fig. 13, when the conventional display device is ideally separated without any separation tolerance from a mother display device including multiple display devices, the nozzle 23N is accurately positioned on a part of the edge E3 of the active matrix substrate 102. However, as shown in FIG. 14, when a conventional display device is separated from a mother display device including multiple display devices with a positive separation tolerance (for example, separation tolerance = +4.0 mm), the application position of the conductive resin CR1 detected by the control unit 29 is not part of the end E3 of the active matrix substrate 102, but is located more inward on the active matrix substrate 102 than the end E3 of the active matrix substrate 102, and the nozzle 23N is also located more inward on the active matrix substrate 102 than the end E3 of the active matrix substrate 102, rather than part of the end E3 of the active matrix substrate 102.15 , when a conventional display device is separated from a mother display device including multiple display devices with a negative separation tolerance (for example, a separation tolerance of −4.0 mm), the application position of the conductive resin CR1 detected by the control unit 29 is not part of the edge E3 of the active matrix substrate 102 but outside the edge E3 of the active matrix substrate 102, and the nozzle 23N is also not part of the edge E3 of the active matrix substrate 102 but is located outside the edge E3 of the active matrix substrate 102. As described above, in the case of the conventional alignment mark ALM101 provided on the active matrix substrate 102, alignment that follows the separation tolerance that may occur in the process of separating a mother display device including multiple display devices into individual display devices is impossible, and therefore the position of the edge of the active matrix substrate 102 cannot be detected with high accuracy, and the effect of the separation tolerance is significant, resulting in only low-precision application of the conductive resin.

[0029] As shown in FIG. 16, the functional unit 22 of the edge detection device 20 shown in FIG. 6 may further include a temperature adjustment unit 36 ​​that adjusts the temperature of the conductive resin storage unit 23. The temperature adjustment unit 36 ​​may be, for example, a Peltier element, and a heat sink unit 37 may be provided in contact with the temperature adjustment unit 36, and a fan 38 may be provided near the heat sink unit 37. The functional unit 22 may also include a holder 35 that surrounds a portion of the conductive resin storage unit 23. As shown in FIG. 16, by providing a temperature adjustment mechanism that adjusts the temperature of the conductive resin storage unit 23, the viscosity of the conductive resin can be maintained constant, and the amount of conductive resin applied can be further stabilized.

[0030] FIG. 17 is a diagram showing a schematic configuration of an edge detection device 40 including a tilting mechanism 41 that tilts the display device 1 of Embodiment 1, which includes an active matrix substrate 2 including alignment marks ALM1 and ALM2, at an angle of 45 degrees or less with respect to a plane. FIG. 18 is a diagram showing a case where the functional unit 22 of the edge detection device 40 including the tilting mechanism 41 shown in FIG. 17 further includes a light irradiator 42. FIG. 19 is a diagram illustrating a process of moving a nozzle 23N that dispenses conductive resin CR to the application position of the conductive resin CR detected by the edge detection device 40 shown in FIG. 17, and a process of applying the conductive resin CR. FIG. 20 is a diagram illustrating a problem in the process of applying conductive resins CR′ and CR″ to parts of the edge of an active matrix substrate 102 including conventional alignment marks ALM101. FIG. 21 is a diagram illustrating the finished dimensions of the conductive resin CR applied to the display device 1 of Embodiment 1. FIG. 22 is a diagram illustrating the degree of variation in the finished dimensions of the conductive resin CR applied to the display device 1 of Embodiment 1. FIG. 23 is a diagram illustrating the degree of variation in the finished dimensions of conductive resins CR′ and CR″ applied to a conventional display device equipped with an active matrix substrate 102 including a conventional alignment mark ALM101.

[0031] 17 , the mounting table 28 included in the edge detection device 40 is equipped with a tilting mechanism 41 that tilts the active-matrix substrate 2, including the alignment marks ALM1 and ALM2 included in the display device 1, at an angle of 45 degrees or less with respect to a plane so that part of the edge E3 of the active-matrix substrate 2 approaches the nozzle 23N. In this case, the data of the first image GZ1 and the data of the second image GZ2, which are captured images obtained by the imaging unit 24 included in the edge detection device 40, are data obtained when the active-matrix substrate 2 is tilted. In other words, the data of the first image GZ1 and the data of the second image GZ2 are captured images obtained by the imaging unit 24 capturing, in plan view, the plane, for example, the mounting table 28, which serves as a reference for tilting the active-matrix substrate 2, when the active-matrix substrate 2 is tilted.

[0032] As shown in FIG. 18 , the functional unit 22 included in the edge detection device 40 preferably includes a light irradiator 42. The light irradiator 42 is positioned so that at least a portion of light L1 emitted from the light irradiator 42 is specularly reflected by the alignment marks ALM1 and ALM2 and enters the imaging unit 24 as light L2. Note that, while a case where one light irradiator 42 is added will be described here as an example, this is not limiting, and multiple light irradiators 42 may be added. When the display device 1 is tilted on the mounting base 28 of the edge detection device 40, the epi-illumination provided in the imaging unit 24 alone cannot provide a sufficient contrast difference between the alignment marks ALM1 and ALM2 and their surroundings. Therefore, by adding the light irradiator 42, a high recognition rate of the alignment marks ALM1 and ALM2 can be maintained even when the display device 1 is tilted on the mounting base 28 of the edge detection device 40.

[0033] 19, the process of moving the nozzle 23N that dispenses the conductive resin CR to the application position of the conductive resin CR detected by the edge detection device 40 and the process of applying the conductive resin CR are both performed with the active matrix substrate 2 tilted at an angle of 45 degrees or less with respect to a plane so that a portion of the edge E3 of the active matrix substrate 2 approaches the nozzle 23N. As shown in FIG. 19, the conductive resin CR is adhered in a hemispherical shape to the tip of the nozzle 23N. Because the active matrix substrate 2 is tilted when the nozzle 23N approaches a portion of the edge E3 of the active matrix substrate 2, the conductive resin CR adhered to the tip of the nozzle 23N is forced to come into contact with both the side surface 2SIS, which is the cut surface of the active matrix substrate 2, and the second surface 2S2 of the active matrix substrate 2, thereby wetting both the side surface 2SIS and the second surface 2S2 of the active matrix substrate 2. In this way, the conductive resin CR is forced to contact both the side surface 2SIS and the second surface 2S2 of the active matrix substrate 2 to ensure wettability, which causes the conductive resin CR to flow stably and in a balanced manner to both the side surface 2SIS of the active matrix substrate 2, i.e., the flexible printed circuit board 10 side, and the second surface 2S2 side of the active matrix substrate 2. The active matrix substrate 2 is preferably inclined at an angle of 45 degrees or less with respect to the plane so that part of the end E3 of the active matrix substrate 2 approaches the nozzle 23N, more preferably at an angle of 5 degrees to 15 degrees, and most preferably at an angle of 10 degrees with respect to the plane.

[0034] As shown in FIG. 20 , the process of applying conductive resin CR′ and CR″ to a portion of the edge of active-matrix substrate 102 including conventional alignment marks ALM101 results in the following problem. When a conventional display device including active-matrix substrate 102 is cut with a cutting tolerance, as described above, nozzle 23N ends up being positioned on the inside of active-matrix substrate 102 or on the outside of edge E3 of active-matrix substrate 102, rather than on a portion of edge E3 of active-matrix substrate 102. When nozzle 23N is positioned on the inside of active-matrix substrate 102 and active-matrix substrate 102 is not tilted relative to a plane (CASE 1 shown in FIG. 20 ), capillary action occurring from the gap between the top surface of active-matrix substrate 102 and nozzle 23N causes the conductive resin CR′ to flow only toward the top surface of active-matrix substrate 102, and not toward the side surface, which is the cut surface of active-matrix substrate 102, i.e., the flexible printed circuit board 10. Furthermore, when the nozzle 23N is positioned above and outside the end E3 of the active matrix substrate 102 and the active matrix substrate 102 is not inclined relative to the plane (CASE 2 shown in FIG. 20), a phenomenon occurs in which the conductive resin CR'' does not flow onto the upper surface of the active matrix substrate 102.

[0035] 17, using edge detection device 40, the shape of the conductive resin CR applied to display device 1 in a state where the active matrix substrate 2 is tilted at an angle of 10 degrees relative to a plane so that part of edge E3 approaches nozzle 23N can be defined by the width Wa in the first direction D1 (see FIG. 2) of the conductive resin CR formed on second surface 2S2 of active matrix substrate 2, the width Wb in the first direction D1 (see FIG. 2) of the conductive resin CR formed on flexible printed circuit board 10, the thickness Wd of the conductive resin CR formed on second surface 2S2 of active matrix substrate 2, and the width Wc in the second direction D2 (see FIG. 2), which is the depth direction in FIG. 21, of the conductive resin CR (not shown). It is important that the width Wa, width Wb, width Wc, and thickness Wd each fall within a reference dimension, and further, it is preferable that there is little variation therein. If the width Wa, width Wb, width Wc and thickness Wd deviate from the standard dimensions, it may result in serious defects such as a reduction in the cross-sectional area of ​​the conductive resin CR required for electrical connection, an increase in connection resistance due to a reduction in the cross-sectional area of ​​the conductive resin CR on the first connection pads CP1·CP1′ and the second connection pads CP2·CP2′, interference with the backlight unit, and a reduction in the degree of bending of the flexible printed circuit board 10.

[0036] As shown in Figure 22, when the display device 1 includes an active matrix substrate 2 including alignment marks ALM1 and ALM2 and is tilted at 10 degrees relative to the plane, the degree of variation in the finished dimensions of the conductive resin CR applied to the display device 1 includes an active matrix substrate 2 including alignment marks ALM1 and ALM2 is small, i.e., the degree of variation in each of the widths Wa, Wb, Wc, and Wd is small, resulting in a stable conductive resin CR. On the other hand, as shown in Figure 23, when the active matrix substrate 102 is not tilted relative to the plane, the degree of variation in the finished dimensions of the conductive resin CR' and CR'' applied to a conventional display device includes an active matrix substrate 102 including a conventional alignment mark ALM101 is relatively large, i.e., the degree of variation in the widths Wa', Wb', Wc', and Wd' corresponding to the widths Wa, Wb, Wc, and Wd, respectively, resulting in only unstable conductive resins CR' and CR''. [Industrial Applicability]

[0037] The present disclosure can be used for a substrate including an alignment mark and an edge detection device for a substrate including an alignment mark. [Explanation of symbols]

[0038] 1 Display device 2. Active matrix substrate 2S1 First surface of active matrix substrate 2S2 Second surface of the active matrix substrate Side of 2SIS active matrix substrate 3 Opposing substrate 8 Transparent electrode layer 10 Flexible printed circuit board 20, 40 Edge detection device 21 Support part 22 Functional Section 23 Conductive resin reservoir 23N nozzle 24 Imaging unit 25 Rangefinder 28 Mounting table 29 Control Unit 36 Temperature adjustment section 41 Tilt mechanism 42 Light irradiation unit ALM1, ALM2 alignment marks SDL1 active matrix substrate cutting line SDL2 alignment mark cutting line CR, CR1, CR2 Conductive resin E1 to E4 Edges of the active matrix substrate R1 1st area R2 2nd area GZ1 1st image GZ2 2nd image D1 1st direction D2 2nd direction CP1, CP1' First connection pad CP2, CP2' Second connection pads HP wiring pattern EP detection position L1 Light emitted from the light irradiation unit L2 Light specularly reflected from the alignment mark

Claims

1. a substrate; and an alignment mark provided on a part of a first surface, which is one surface of the substrate; the substrate and the alignment mark each have a cutting line; A substrate including an alignment mark, wherein a cutting line of the alignment mark coincides with a cutting line of the substrate in a plan view.

2. the substrate includes a first region and a second region surrounding the first region and including all edges of the substrate; 2. The substrate including an alignment mark according to claim 1, wherein the alignment mark is a continuous film provided in the second region and formed in a first direction from a partial edge of the substrate to a direction perpendicular to the partial edge.

3. 3. The substrate including an alignment mark according to claim 2, wherein said alignment mark is composed of a plurality of said continuous films.

4. the first area is a display area, the second region is a non-display region, 4. The substrate including an alignment mark according to claim 3, wherein the substrate is an active matrix substrate having a plurality of pixel electrodes on the first surface of the display area and the alignment mark on the first surface of the non-display area.

5. the active matrix substrate is a substrate in which the pixel electrodes and the alignment marks are provided on a glass substrate or a light-transmitting resin substrate, a flexible printed circuit board including a first connection pad; a wiring pattern including second connection pads is provided on a second surface of the active matrix substrate, the second surface facing the first surface of the non-display area; 5. The substrate including the alignment mark of claim 4, wherein the flexible printed circuit board is provided on a portion of the first surface of the non-display area of ​​the active matrix substrate so that the first connection pads are located in the vicinity of the second connection pads.

6. an opposing substrate is provided on the first surface side of the active matrix substrate, the opposing substrate facing the pixel electrodes of the active matrix substrate; The substrate including an alignment mark according to claim 5 , further comprising a liquid crystal layer between the pixel electrodes of the active matrix substrate and the opposing substrate.

7. 7. A substrate including an alignment mark as described in claim 6, wherein a conductive resin is provided as a continuous film on at least a portion of the first connection pad, at least a portion of the second connection pad, and a side surface of an end of a portion of the active matrix substrate between the first connection pad and the second connection pad.

8. a mounting table on which a substrate including the alignment mark according to any one of claims 1 to 6 is mounted; a functional unit including an imaging unit that images the alignment mark; a storage unit in which data of a first image of the alignment mark in a plan view, the first image including an end of the alignment mark where a cutting line of the alignment mark is located, obtained from the imaging unit, is stored; a control unit that detects the position of a portion of the edge of the substrate by comparing data of a second image of the alignment mark in a plan view obtained from the imaging unit, the second image including the edge of the alignment mark where the cutting line of the alignment mark is located, with data of the first image in the storage unit; The apparatus for detecting an edge of a substrate including an alignment mark, wherein one of the mounting table and the functional unit is movable in an X direction, a Y direction, and a Z direction relative to the other of the mounting table and the functional unit.

9. the functional portion includes a reservoir portion of a conductive resin; a nozzle for discharging the conductive resin toward the stage is provided on a surface of the storage unit facing the stage; 9. The edge detection device for a substrate including an alignment mark as described in claim 8, wherein the control unit moves one of the mounting table and the functional unit relative to the other of the mounting table and the functional unit based on the detected position of a portion of the edge of the substrate.

10. 10. The device for detecting an edge of a substrate including an alignment mark according to claim 9, wherein the functional section includes a temperature adjusting section that adjusts the temperature of the storage section for the conductive resin.

11. the mounting table includes a tilting mechanism that tilts the substrate including the alignment mark at an angle of 45 degrees or less with respect to a plane so that a part of an edge of the substrate approaches the nozzle; 10. The apparatus for detecting an edge of a substrate including an alignment mark according to claim 9, wherein the first image data and the second image data are data obtained when the substrate including the alignment mark is tilted.

12. the functional unit includes a light irradiating unit, 12. The edge detection device for a substrate including an alignment mark according to claim 11, wherein the light irradiation unit is arranged at a position where at least a portion of the light emitted from the light irradiation unit is specularly reflected by the alignment mark and incident on the imaging unit.

Images