A method for embedding a heat dissipation copper column in a microwave printed circuit board

Abstract

The application discloses a method for embedding heat-dissipating copper columns in a microwave printed circuit board, and relates to the technical field of embedding heat-dissipating copper columns in a microwave printed circuit board. The method comprises the following steps: S1, taking out a microwave printed circuit board; S2, taking out two heat-dissipating copper columns B; S3, supporting the two heat-dissipating copper columns B on the tabletop of a table; S4, making the two heat-dissipating copper columns B respectively in interference fit with two through holes of the microwave printed circuit board; S5, taking out a strip-shaped copper plate; S6, taking out a strip-shaped copper plate and a strip-shaped solidification sheet; S7, fixing the strip-shaped copper plate and the microwave printed circuit board together; S8, turning up the left and right end portions of the strip-shaped copper plate; S9, operating a spot welding machine so that the spot welding head on the spot welding machine touches the top surface of the turned-up portion; and S10, taking away the microwave printed circuit board embedded with the two heat-dissipating copper columns B from the table. The method has the advantages that the heat-dissipating efficiency of the microwave printed circuit board is improved, and the embedding quality of the heat-dissipating copper columns B is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of embedding heat dissipation copper columns in microwave printed circuit boards, and particularly relates to a method for embedding heat dissipation copper columns in microwave printed circuit boards. BACKGROUND

[0002] The microwave printed circuit board refers to a printed circuit board used in a microwave frequency band (generally 1 GHZ-200 GHZ), and is made of polytetrafluoroethylene (PTFE), ceramic and the like. The microwave printed circuit board has good dielectric constant stability, low loss characteristics and the like, and is particularly suitable for different microwave band applications. The microwave printed circuit board is usually installed on a mechanical device, and is used to control normal operation of various power assemblies of the mechanical device.

[0003] The structure of a microwave printed circuit board 1 produced in a workshop is shown in Figures 1-2 Two through holes 2 are formed on the edge of the microwave printed circuit board 1, and the two through holes 2 are on the same straight line. In order to increase the heat dissipation efficiency of the microwave printed circuit board 1, a heat dissipation copper column A3 shown in Figures 3-4 is embedded in each of the two through holes 2 of the microwave printed circuit board 1. The heat dissipation copper column A3 is in a cylindrical shape, and a central hole 4 is formed in the heat dissipation copper column A3 along an axial direction of the heat dissipation copper column A3. The heat dissipation copper column A3 is in interference fit with the through hole 2. As shown in Figures 5-6 , it is a structure schematic view of the microwave printed circuit board 1 embedded with two heat dissipation copper columns A3.

[0004] When the microwave printed circuit board 1 embedded with the two heat dissipation copper columns A3 works, heat generated on the microwave printed circuit board 1 is transferred to the heat dissipation copper column A3, and the heat is released to the atmosphere through the central hole 4 of the heat dissipation copper column A3, thereby achieving the purpose of heat dissipation of the microwave printed circuit board 1.

[0005] The method for embedding the two heat dissipation copper columns A3 in the microwave printed circuit board 1 by workers in the workshop is as follows.

[0006] S1, a worker takes out one microwave printed circuit board 1, and then places the microwave printed circuit board 1 on the tabletop 5 of a table, as shown in Figure 7 .

[0007] S2, the worker takes out two heat dissipation copper columns A3, wherein the outer diameter of the heat dissipation copper column A3 is slightly larger than the diameter of the through hole 2 of the microwave printed circuit board 1.

[0008] S3, the worker aligns the lower end of one heat dissipation copper column A3 with the top of the left through hole 2, as shown in Figure 8As shown, and then use wooden hammer to knock down the top end of the heat dissipation copper column A3, under the knocking of the wooden hammer, the heat dissipation copper column A3 gradually enters into the through hole 2; when the heat dissipation copper column A3 is completely interference fitted with the through hole 2, thereby completing the embedding of the first heat dissipation copper column A3 in the left through hole 2 of the microwave printed circuit board 1;

[0009] S4, the worker repeats the operation of step S3 once, that is, the second heat dissipation copper column A3 is embedded in the right through hole 2 of the microwave printed circuit board 1, thereby finally realizing the embedding of two heat dissipation copper columns A3 in the microwave printed circuit board 1, as shown in Figures 5-6 As shown is a structure schematic diagram of the microwave printed circuit board 1 embedded with two heat dissipation copper columns A3;

[0010] S5, the worker takes away the microwave printed circuit board 1 embedded with two heat dissipation copper columns A3 from the tabletop 5;

[0011] S6, the worker repeats the operation of steps S1-S5 multiple times, that is, two heat dissipation copper columns A3 are embedded in multiple microwave printed circuit boards 1.

[0012] However, the method used in the workshop can embed two heat dissipation copper columns A3 in the microwave printed circuit board 1, but there are still the following technical defects in technology:

[0013] I, in step S3, when the heat dissipation copper column A3 is completely interference fitted with the through hole 2, a large number of protrusions 6 appear on the inner wall of the heat dissipation copper column A3, as shown Figure 9 As shown (because the material of the inner wall of the heat dissipation copper column A3 is irregularly deformed during the knocking of the wooden hammer on the top end of the heat dissipation copper column A3, thus producing protrusions 6 on the inner wall of the heat dissipation copper column A3), and the existence of these protrusions 6 blocks the smooth release of heat on the microwave printed circuit board 1 to the atmosphere through the center hole 4, thereby causing the heat on the microwave printed circuit board 1 to take a long time to be completely released to the atmosphere, thus reducing the heat dissipation efficiency of the microwave printed circuit board 1.

[0014] II, since the heat dissipation copper column A3 is only interference fitted with the through hole 2 to be fixed in the through hole 2, when the microwave printed circuit board 1 works in a long-term vibration working environment, the heat dissipation copper column A3 will be shaken out of the through hole 2, causing the entire microwave printed circuit board 1 to be unable to continue to be used, which not only reduces the embedding quality of the heat dissipation copper column A3, but also shortens the service life of the microwave printed circuit board 1. SUMMARY

[0015] The purpose of the present application is to overcome the shortcomings of the prior art and provide a method for embedding heat dissipation copper columns in a microwave printed circuit board.

[0016] The application discloses a method for embedding heat-dissipating copper columns in a microwave printed circuit board.

[0017] S1, a worker takes out a microwave printed circuit board and then places the microwave printed circuit board on the top surface of a table;

[0018] S2, the worker takes out two heat-dissipating copper columns B, wherein the outer diameter of the heat-dissipating copper columns B is smaller than the diameter of the through holes of the microwave printed circuit board, and a tapered hole is formed in the heat-dissipating copper columns B along the axial direction of the heat-dissipating copper columns B;

[0019] S3, the worker puts one heat-dissipating copper column B into the left through hole of the microwave printed circuit board and then puts the other heat-dissipating copper column B into the right through hole of the microwave printed circuit board, at this time, the two heat-dissipating copper columns B are supported on the top surface of the table;

[0020] S4, the two heat-dissipating copper columns B are respectively in interference fit with the two through holes of the microwave printed circuit board, and the specific operation steps are as follows:

[0021] S41, the worker takes out an expansion assembly which is composed of a tapered head and a cylindrical head which are sequentially and integrally connected, and the tapered head is matched with the tapered hole of the heat-dissipating copper column B;

[0022] S42, the worker puts the tapered head of the expansion assembly into the tapered hole of the left heat-dissipating copper column B and then knocks the cylindrical head of the expansion assembly downward with a wooden mallet, under the knocking of the wooden mallet, the tapered head gradually expands the circumferential material of the heat-dissipating copper column B outward; after knocking for a period of time, the heat-dissipating copper column B is expanded in the left through hole, so that the left heat-dissipating copper column B is in interference fit with the left through hole;

[0023] S43, the worker repeats the operation of step S42 once, so that the right heat-dissipating copper column B is in interference fit with the right through hole, and finally the two heat-dissipating copper columns B are respectively in interference fit with the two through holes of the microwave printed circuit board;

[0024] S44, the worker takes away the microwave printed circuit board with the two heat-dissipating copper columns B in interference fit from the table;

[0025] S5, the worker takes out a strip-shaped copper plate and a strip-shaped curing sheet, wherein the longitudinal width of the strip-shaped curing sheet is equal to the longitudinal width of the strip-shaped copper plate, and the horizontal length of the strip-shaped curing sheet is smaller than the horizontal length of the strip-shaped copper plate; then the worker places the strip-shaped copper plate on the top surface of a wooden base plate;

[0026] Then the worker places the strip-shaped curing sheet on the top surface of the strip-shaped copper plate, and then adjusts the position of the strip-shaped curing sheet so that the strip-shaped curing sheet is located at the middle part of the strip-shaped copper plate and the front and rear end faces of the strip-shaped curing sheet are flush with the front and rear end faces of the strip-shaped copper plate;

[0027] Then the worker places the microwave printed circuit board with the two heat dissipation copper columns B in interference fit on the top surface of the strip-shaped curing sheet, and then the worker adjusts the position of the microwave printed circuit board so that the left and right end surfaces of the microwave printed circuit board are flush with the left and right end surfaces of the strip-shaped curing sheet, and ensures that the conical holes of the two heat dissipation copper columns B of the microwave printed circuit board are directly above the strip-shaped curing sheet;

[0028] S6, the worker first presses the microwave printed circuit board with his hand to fix the microwave printed circuit board, the strip-shaped curing sheet and the strip-shaped copper plate on the top surface of the wooden backing plate;

[0029] Then the worker operates the vertical drilling machine to make the drill bit of the vertical drilling machine pass through the conical hole of one of the heat dissipation copper columns B to drill holes in the strip-shaped curing sheet and the strip-shaped copper plate, thereby drilling a through hole P and a through hole R in the strip-shaped curing sheet and the strip-shaped copper plate, respectively, wherein the through hole P and the through hole R are in communication with the conical hole of the heat dissipation copper column B;

[0030] Then the worker operates the vertical drilling machine to make the drill bit of the vertical drilling machine pass through the conical hole of the other heat dissipation copper column B to drill holes in the strip-shaped curing sheet and the strip-shaped copper plate, thereby drilling another through hole P and another through hole R in the strip-shaped curing sheet and the strip-shaped copper plate, respectively, thereby realizing the drilling of two through holes P and two through holes R in the strip-shaped curing sheet and the strip-shaped copper plate, respectively;

[0031] Then the worker mills a U-shaped groove at the left and right end portions of the strip-shaped copper plate through the milling cutter of the horizontal milling machine;

[0032] S7, fix the strip-shaped copper plate and the microwave printed circuit board together, the specific operation steps are:

[0033] S71, the worker turns the strip-shaped copper plate, the strip-shaped curing sheet and the microwave printed circuit board on the wooden backing plate onto the tabletop of the table, and ensures that the two U-shaped grooves of the strip-shaped copper plate are both outside the table to facilitate subsequent flanging of the strip-shaped copper plate;

[0034] S72, control the hot press head of the hot press to move downward so that the hot press head is pressed on the top surface of the microwave printed circuit board, the heat on the hot press head is transferred to the microwave printed circuit board, and the microwave printed circuit board further transfers the heat to the strip-shaped curing sheet, and after a certain period of pressure holding, the heated strip-shaped curing sheet fixes the strip-shaped copper plate and the microwave printed circuit board with the two heat dissipation copper columns B in interference fit;

[0035] S73, control the hot press head of the hot press to move upward so that the hot press head moves away from the microwave printed circuit board;

[0036] S8. The worker flips the left and right ends of the strip copper plate upward to obtain the folded part covering the top surface of the heat dissipation copper pillar B. At this time, the U-shaped groove of the folded part is connected to the conical hole of the heat dissipation copper pillar B.

[0037] S9. The worker operates the spot welding machine so that the spot welding head touches the top surface of the folded part. The spot welding head welds the folded part to the top surface of the heat dissipation copper pillar B, thus finally realizing the embedding of two heat dissipation copper pillars B in the microwave printed circuit board.

[0038] S10. The worker removes the microwave printed circuit board with two heat dissipation copper pillars B embedded in it from the table.

[0039] S11. Workers can repeat steps S1 to S10 multiple times to embed two heat dissipation copper pillars B in multiple microwave printed circuit boards.

[0040] In step S2, the height of the heat dissipation copper pillar B is equal to the thickness of the microwave printed circuit board.

[0041] In step S41, the conical head of the tightening assembly is coaxial with the cylindrical head.

[0042] In step S6, the diameter of the through hole P of the strip-shaped cured sheet is equal to the diameter of the through hole R of the strip-shaped copper plate.

[0043] The present invention has the following advantages: improving the heat dissipation efficiency of microwave printed circuit boards, greatly improving the embedding quality of heat dissipation copper pillars B, and extending the service life of microwave printed circuit boards. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the structure of a microwave printed circuit board produced in a certain workshop.

[0045] Figure 2 for Figure 1 CC section view;

[0046] Figure 3 This is a schematic diagram of the structure of the heat dissipation copper pillar A in the prior art;

[0047] Figure 4 for Figure 3 Main section diagram;

[0048] Figure 5 A schematic diagram of a microwave printed circuit board with two embedded heat dissipation copper pillars A;

[0049] Figure 6 for Figure 5 DD sectional view;

[0050] Figure 7 This is a schematic diagram showing how to place a microwave printed circuit board flat on a tabletop.

[0051] Figure 8 A schematic diagram showing how to align the lower end of a heat dissipation copper pillar A with the top port of the through hole on the left side of a microwave printed circuit board;

[0052] Figure 9 A schematic diagram showing numerous protrusions on the inner wall of the copper pillar A used for heat dissipation;

[0053] Figure 10 This is a schematic diagram of the structure of the heat dissipation copper pillar B of the present invention;

[0054] Figure 11 for Figure 10 Main section diagram;

[0055] Figure 12 This is a schematic diagram showing two heat dissipation copper pillars B supported on the tabletop.

[0056] Figure 13 This is a schematic diagram of the structure of the expansion assembly of the present invention;

[0057] Figure 14 This is a schematic diagram of inserting the conical head of the expansion assembly into the conical hole of the left heat dissipation copper pillar B;

[0058] Figure 15 A schematic diagram of a microwave printed circuit board with two heat dissipation copper pillars B for interference fit.

[0059] Figure 16 This is a schematic diagram of the structure of the strip copper plate of the present invention;

[0060] Figure 17 for Figure 16 Top view;

[0061] Figure 18 This is a schematic diagram of the structure of the strip-shaped cured sheet of the present invention;

[0062] Figure 19 for Figure 18 Top view;

[0063] Figure 20 This is a schematic diagram showing a strip of copper plate placed flat on the top surface of a wooden pad.

[0064] Figure 21 for Figure 20 Top view;

[0065] Figure 22 A schematic diagram showing how to align the front and rear ends of the strip-shaped cured sheet with the front and rear ends of the strip-shaped copper plate, respectively.

[0066] Figure 23 for Figure 22 Top view;

[0067] Figure 24Fig. 1 is a schematic view of the left and right end faces of the microwave printed circuit board being flush with the left and right end faces of the strip-shaped curing sheet;

[0068] Figure 25 Fig. 2 is a top view of the microwave printed circuit board; Figure 24

[0069] Figure 26 Fig. 3 is a schematic view of the drill bit drilling a through hole P and a through hole R in the strip-shaped curing sheet and the strip-shaped copper plate, respectively;

[0070] Figure 27 Fig. 4 is a schematic view of the drill bit drilling two through holes P and two through holes R in the strip-shaped curing sheet and the strip-shaped copper plate, respectively;

[0071] Figure 28 Fig. 5 is a schematic view of a U-shaped groove being milled at the left and right end portions of the strip-shaped copper plate;

[0072] Figure 29 Fig. 6 is a top view of the microwave printed circuit board; Figure 28

[0073] Fig. 7 is a schematic view of the strip-shaped copper plate, the strip-shaped curing sheet and the microwave printed circuit board being turned together on the table top of the wooden base plate; Figure 30

[0074] Fig. 8 is a schematic view of the hot press head being pressed on the top surface of the microwave printed circuit board; Figure 31

[0075] Fig. 9 is a schematic view of the left and right end portions of the strip-shaped copper plate being turned upward; Figure 32

[0076] Fig. 10 is a II part enlarged view of the microwave printed circuit board; Figure 33 Figure 32 Fig. 11 is a schematic view of the spot welding head touching the top surface of the turned-up portion;

[0077] Figure 34 Fig. 12 is a schematic view of the microwave printed circuit board embedded with two heat dissipation copper columns B;

[0078] Figure 35 Fig. 1 is a schematic view of the left and right end faces of the microwave printed circuit board being flush with the left and right end faces of the strip-shaped curing sheet;

[0079] Fig. 1 is a schematic view of the left and right end faces of the microwave printed circuit board being flush with the left and right end faces of the strip-shaped curing sheet;

[0080] 1-microwave printed circuit board, 2-through hole, 3-heat dissipation copper column A, 4-center hole, 5-table, 6-protruding portion;

[0081] 7-heat dissipation copper column B, 8-tapered hole, 9-tapered head, 10-cylindrical head, 11-strip-shaped copper plate, 12-U-shaped groove, 13-through hole R, 14-strip-shaped curing sheet, 15-through hole P, 16-hot press head, 17-turned-up portion, 18-spot welding head, 19-wooden base plate, 20-drill bit. DETAILED DESCRIPTION​​

[0082] The application will be further described in conjunction with the accompanying drawings whose protective scope does not limit to the following description:

[0083] A method for embedding heat-dissipating copper columns in a microwave printed circuit board, comprising the following steps:

[0084] S1, a worker takes out a microwave printed circuit board 1 and then places it on the tabletop of a table 5;

[0085] S2, the worker takes out two heat-dissipating copper columns B7 as shown in the figure, wherein the outer diameter of the heat-dissipating copper column B7 is smaller than the diameter of the through hole 2 of the microwave printed circuit board 1, a tapered hole 8 is formed along the axial direction of the heat-dissipating copper column B7, and the height of the heat-dissipating copper column B7 is equal to the thickness of the microwave printed circuit board 1; Figures 10-11

[0086] S3, the worker puts one heat-dissipating copper column B7 into the left through hole 2 of the microwave printed circuit board 1, and then puts another heat-dissipating copper column B7 into the right through hole 2 of the microwave printed circuit board 1, at this time, the two heat-dissipating copper columns B7 are supported on the tabletop of the table 5, as shown in the figure; Figure 12

[0087] S4, the two heat-dissipating copper columns B7 are respectively in interference fit with the two through holes 2 of the microwave printed circuit board 1, and the specific operation steps are as follows:

[0088] S41, the worker takes out an expansion assembly as shown in the figure, which is composed of a tapered head 9 and a cylindrical head 10 which are sequentially and integrally connected, the tapered head 9 of the expansion assembly is coaxial with the cylindrical head 10, and the tapered head 9 is matched with the tapered hole 8 of the heat-dissipating copper column B7; Figure 13

[0089] S42, the worker puts the tapered head 9 of the expansion assembly into the tapered hole 8 of the left heat-dissipating copper column B7, as shown in the figure, and then knocks the cylindrical head 10 of the expansion assembly downward with a wooden hammer, under the knocking of the wooden hammer, the tapered head 9 gradually expands the circumferential material of the heat-dissipating copper column B7 outward; after a period of knocking, the heat-dissipating copper column B7 is expanded in the left through hole 2, so that the left heat-dissipating copper column B7 is in interference fit with the left through hole 2; Figure 14

[0090] S43, the worker repeats the operation of step S42 once, so that the right heat-dissipating copper column B7 is in interference fit with the right through hole 2, and then finally the two heat-dissipating copper columns B7 are respectively in interference fit with the two through holes 2 of the microwave printed circuit board 1;

[0091] S44, the worker takes away the microwave printed circuit board 1 with the two heat-dissipating copper columns B7 in interference fit from the table 5, as shown in the figure; Figure 15 ​​​​Structure diagram of microwave printed circuit board 1 with two heat dissipation copper columns B7 in interference fit;

[0092] Wherein, it is known from step S4 that since the tapered head 9 of the expansion assembly is in constant contact with the tapered hole 8 of the heat dissipation copper column B7, the circumferential material of the heat dissipation copper column B7 is expanded outward, so that when the heat dissipation copper column B7 is completely interference fit with the through hole 2, there will be no protruding part 6 on the inner wall of the heat dissipation copper column B7, thereby ensuring that the heat on the microwave printed circuit board 1 can be smoothly released to the atmosphere through the tapered hole 8, thereby realizing the complete release of the heat on the microwave printed circuit board 1 to the atmosphere in a short time. As can be seen, compared with the embedding method shown in Figures 3-9 , the heat dissipation efficiency of the microwave printed circuit board 1 is greatly improved.

[0093] S5, the worker takes out a strip-shaped copper plate 11 as shown in Figures 16-17 and a strip-shaped curing sheet 14 as shown in Figures 18-19 , wherein the longitudinal width of the strip-shaped curing sheet 14 is equal to the longitudinal width of the strip-shaped copper plate 11, and the horizontal length of the strip-shaped curing sheet 14 is less than the horizontal length of the strip-shaped copper plate 11; then the worker lays the strip-shaped copper plate 11 flat on the top surface of the wooden base plate 19, as shown in Figures 20-21 ;

[0094] Then the worker lays the strip-shaped curing sheet 14 flat on the top surface of the strip-shaped copper plate 11, and then the worker adjusts the position of the strip-shaped curing sheet 14 so that the strip-shaped curing sheet 14 is in the middle of the strip-shaped copper plate 11, and the front and rear end faces of the strip-shaped curing sheet 14 are flush with the front and rear end faces of the strip-shaped copper plate 11, as shown in Figures 22-23 ;

[0095] Then the worker lays the microwave printed circuit board 1 with two heat dissipation copper columns B7 in interference fit on the top surface of the strip-shaped curing sheet 14, and then the worker adjusts the position of the microwave printed circuit board 1 so that the left and right end faces of the microwave printed circuit board 1 are flush with the left and right end faces of the strip-shaped curing sheet 14, as shown in Figures 24-25 , and ensures that the tapered holes 8 of the two heat dissipation copper columns B7 of the microwave printed circuit board 1 are directly above the strip-shaped curing sheet 14;

[0096] S6, the worker first presses the microwave printed circuit board 1 with his hand to fix the microwave printed circuit board 1, the strip-shaped curing sheet 14 and the strip-shaped copper plate 11 on the top surface of the wooden base plate 19;

[0097] Then the worker operates the vertical drilling machine so that the drill bit 20 of the vertical drilling machine penetrates through the tapered hole 8 of one heat dissipation copper column B7 to drill holes in the strip-shaped curing sheet 14 and the strip-shaped copper plate 11, thereby drilling a through hole P15 and a through hole R13 in the strip-shaped curing sheet 14 and the strip-shaped copper plate 11, respectively, as shown inFigure 26 As shown, the through hole P15 and the through hole R13 are both communicated with the tapered hole 8 of the heat dissipation copper column B7, and the diameter of the through hole P15 of the strip-shaped solidified sheet 14 is equal to the diameter of the through hole R13 of the strip-shaped copper plate 11;

[0098] Then the worker operates the vertical drilling machine to make the drill bit 20 of the vertical drilling machine pass through the tapered hole 8 of the other heat dissipation copper column B7 to drill the strip-shaped solidified sheet 14 and the strip-shaped copper plate 11, so as to drill another through hole P15 and another through hole R13 in the strip-shaped solidified sheet 14 and the strip-shaped copper plate 11 respectively, thereby realizing the drilling of two through holes P15 and two through holes R13 in the strip-shaped solidified sheet 14 and the strip-shaped copper plate 11 respectively, as shown in Figure 27 ;

[0099] Then the worker mills a U-shaped groove 12 at each of the left and right ends of the strip-shaped copper plate 11 by the milling cutter of the horizontal milling machine, as shown in Figures 28-29 ;

[0100] S7, fix the strip-shaped copper plate 11 and the microwave printed circuit board 1 together, and the specific operation steps are as follows:

[0101] S71, the worker rotates the strip-shaped copper plate 11, the strip-shaped solidified sheet 14 and the microwave printed circuit board 1 on the wooden base plate 19 to the tabletop of the table 5, as shown in Figure 30 , to ensure that the two U-shaped grooves 12 of the strip-shaped copper plate 11 are outside the table 5, so as to facilitate the subsequent flanging of the strip-shaped copper plate 11;

[0102] S72, control the hot head 16 of the hot press to move downward, so that the hot head 16 is pressed on the top surface of the microwave printed circuit board 1, as shown in Figure 31 , the heat on the hot head 16 is transferred to the microwave printed circuit board 1, and the microwave printed circuit board 1 further transfers the heat to the strip-shaped solidified sheet 14, and after a certain time of pressure keeping, the heated strip-shaped solidified sheet 14 fixes the strip-shaped copper plate 11 and the microwave printed circuit board 1 with the two heat dissipation copper columns B7 in interference fit;

[0103] S73, control the hot head 16 of the hot press to move upward, so that the hot head 16 is away from the microwave printed circuit board 1;

[0104] S8, the worker turns up the left and right ends of the strip-shaped copper plate 11 to obtain the folded part 17 covering the top surface of the heat dissipation copper column B7, as shown in Figures 32-33 , at this time, the U-shaped groove 12 of the folded part 17 is communicated with the tapered hole 8 of the heat dissipation copper column B7;

[0105] S9, the worker operates the spot welding machine to make the spot welding head 18 on the spot welding machine touch the top surface of the folded part 17, as shown in Figure 34As shown, the spot welding head 18 welds the folded part 17 on the top surface of the heat dissipation copper column B7, thereby finally embedding two heat dissipation copper columns B7 in the microwave printed circuit board 1, as shown in Figure 35 As shown is a structural schematic diagram of the microwave printed circuit board 1 embedded with two heat dissipation copper columns B7; when the microwave printed circuit board 1 embedded with two heat dissipation copper columns B7 is working, the heat generated thereon is transferred to the heat dissipation copper columns B7, a part of the heat is sequentially released to the atmosphere through the tapered hole 8 of the heat dissipation copper column B7 and the U-shaped slot 12 of the folded part 17, and another part of the heat is sequentially released to the atmosphere through the tapered hole 8, the through hole P and the through hole R, thereby achieving the purpose of heat dissipation of the microwave printed circuit board 1;

[0106] S10, the worker takes the microwave printed circuit board 1 embedded with two heat dissipation copper columns B7 from the table 5;

[0107] S11, the worker repeats the operations of steps S1-S10 multiple times, that is, two heat dissipation copper columns B7 are embedded in multiple microwave printed circuit boards 1.

[0108] In step S4, the heat dissipation copper column B7 is tightly expanded in the through hole 2 of the microwave printed circuit board 1, and in steps S8-S9, the heat dissipation copper column B7 is fixed vertically between the folded part 17 and the strip-shaped copper plate 11, thereby firmly fixing the heat dissipation copper column B7, so that when the microwave printed circuit board 1 works in a vibrating working environment for a long time, the heat dissipation copper column B7 will not be shaken out of the through hole 2, ensuring that the microwave printed circuit board 1 can be used continuously. Therefore, compared with the method shown in Figures 3-9 As shown, the spot welding head 18 welds the folded part 17 on the top surface of the heat dissipation copper column B7, thereby finally embedding two heat dissipation copper columns B7 in the microwave printed circuit board 1, as shown in

Claims

1. A method for embedding heat dissipation copper pillars within a microwave printed circuit board, characterized in that: It comprises the following steps: S1, the worker takes out a microwave printed circuit board (1), and then places it on the table (5) surface; S2, the worker takes out two heat dissipation copper column B (7), wherein the outer diameter of the heat dissipation copper column B (7) is smaller than the diameter of the through hole (2) of the microwave printed circuit board (1), and the heat dissipation copper column B (7) is provided with a tapered hole (8) along the axial direction; S3, the worker puts one heat dissipation copper column B (7) into the left through hole (2) of the microwave printed circuit board (1), and then puts the other heat dissipation copper column B (7) into the right through hole (2) of the microwave printed circuit board (1), at this time, the two heat dissipation copper column B (7) are supported on the table (5) surface; S4, make two heat dissipation copper column B (7) respectively with two through hole (2) of the microwave printed circuit board (1) interference fit, its specific operation steps are: S41, the worker takes out an expansion assembly, which is composed of a tapered head (9) and a cylindrical head (10) connected in sequence, the tapered head (9) is matched with the tapered hole (8) of the heat dissipation copper column B (7); S42, the worker puts the tapered head (9) of the expansion assembly into the tapered hole (8) of the left heat dissipation copper column B (7), and then knocks the cylindrical head (10) of the expansion assembly with a wooden hammer, under the knocking of the wooden hammer, the tapered head (9) gradually expands the circumferential material of the heat dissipation copper column B (7) outward; after a period of time, the heat dissipation copper column B (7) is expanded in the left through hole (2), so that the left heat dissipation copper column B (7) is interference fit with the left through hole (2); S43, the worker repeats the operation of step S42 once, so that the right heat dissipation copper column B (7) is interference fit with the right through hole (2), and then finally makes two heat dissipation copper column B (7) respectively with two through hole (2) of the microwave printed circuit board (1) interference fit; S44, the worker takes away the microwave printed circuit board (1) with two heat dissipation copper column B (7) from the table (5); S5, the worker takes out a strip copper plate (11) and a strip curing piece (14), wherein the longitudinal width of the strip curing piece (14) is equal to the longitudinal width of the strip copper plate (11), and the horizontal length of the strip curing piece (14) is less than the horizontal length of the strip copper plate (11); then the worker places the strip copper plate (11) on the top surface of the wooden base plate (19); Then the worker places the strip curing piece (14) on the top surface of the strip copper plate (11), and then adjusts the position of the strip curing piece (14) so that the strip curing piece (14) is in the middle of the strip copper plate (11), and the front and rear end faces of the strip curing piece (14) are flush with the front and rear end faces of the strip copper plate (11); Then the worker places the microwave printed circuit board (1) with the two heat dissipation copper columns B (7) in interference fit on the top surface of the strip-shaped curing sheet (14), and then adjusts the position of the microwave printed circuit board (1) so that the left and right end faces of the microwave printed circuit board (1) are flush with the left and right end faces of the strip-shaped curing sheet (14), and ensures that the tapered holes (8) of the two heat dissipation copper columns B (7) of the microwave printed circuit board (1) are directly above the strip-shaped curing sheet (14); S6, the worker first presses the microwave printed circuit board (1) with his hand to fix the microwave printed circuit board (1), the strip-shaped curing sheet (14) and the strip-shaped copper plate (11) on the top surface of the wooden backing plate (19); Then the worker operates the vertical drilling machine to make the drill bit (20) of the vertical drilling machine pass through the tapered hole (8) of one of the heat dissipation copper columns B (7) to drill holes in the strip-shaped curing sheet (14) and the strip-shaped copper plate (11), thereby drilling a through hole P (15) and a through hole R (13) in the strip-shaped curing sheet (14) and the strip-shaped copper plate (11) respectively, wherein the through hole P (15) and the through hole R (13) are in communication with the tapered hole (8) of the heat dissipation copper column B (7); Then the worker operates the vertical drilling machine to make the drill bit (20) of the vertical drilling machine pass through the tapered hole (8) of the other heat dissipation copper column B (7) to drill holes in the strip-shaped curing sheet (14) and the strip-shaped copper plate (11), thereby drilling another through hole P (15) and another through hole R (13) in the strip-shaped curing sheet (14) and the strip-shaped copper plate (11) respectively, thereby drilling two through holes P (15) and two through holes R (13) in the strip-shaped curing sheet (14) and the strip-shaped copper plate (11) respectively; Then the worker mills a U-shaped groove (12) at the left and right ends of the strip-shaped copper plate (11) through the milling cutter of the horizontal milling machine; S7, the strip-shaped copper plate (11) and the microwave printed circuit board (1) are fixed together, and the specific operation steps are as follows: S71, the worker turns the strip-shaped copper plate (11), the strip-shaped curing sheet (14) and the microwave printed circuit board (1) on the wooden backing plate (19) together onto the tabletop (5) of the table, and ensures that the two U-shaped grooves (12) of the strip-shaped copper plate (11) are outside the tabletop (5) to facilitate subsequent flanging of the strip-shaped copper plate (11); S72, control the hot head (16) of the hot press to move downward, so that the hot head (16) is pressed on the top surface of the microwave printed circuit board (1), the heat on the hot head (16) is transferred to the microwave printed circuit board (1), and the microwave printed circuit board (1) further transfers the heat to the strip-shaped curing sheet (14), after a certain pressure holding time, the heated strip-shaped curing sheet (14) fixes the strip-shaped copper plate (11) and the microwave printed circuit board (1) with the two heat dissipation copper columns B (7) in interference fit; S73, control the hot head (16) of the hot press to move upward, so that the hot head (16) moves away from the microwave printed circuit board (1); S8, the worker turns up the left and right ends of the strip-shaped copper plate (11) to obtain the folded part (17) covering the top surface of the heat dissipation copper column B (7), at this time, the U-shaped slot (12) of the folded part (17) is in communication with the tapered hole (8) of the heat dissipation copper column B (7); S9, the worker operates the spot welding machine to make the spot welding head (18) on it touch the top surface of the folded part (17), and the spot welding head (18) welds the folded part (17) on the top surface of the heat dissipation copper column B (7), thereby finally realizing the embedding of two heat dissipation copper columns B (7) in the microwave printed circuit board (1); S10, the worker takes away the microwave printed circuit board (1) embedded with two heat dissipation copper columns B (7) from the table (5); S11, the worker repeats the operations of steps S1-S10 multiple times, that is, two heat dissipation copper columns B (7) can be embedded in multiple microwave printed circuit boards (1).

2. The method of claim 1, wherein: The height of the heat dissipation copper column B (7) in step S2 is equal to the thickness of the microwave printed circuit board (1). ​ 3. The method of claim 1, wherein: The tapered head (9) and the cylindrical head (10) of the expansion assembly in step S41 are on the same axis. ​ 4. The method of claim 1, wherein: The diameter of the through hole P (15) of the strip-shaped cured sheet (14) in step S6 is equal to the diameter of the through hole R (13) of the strip-shaped copper plate (11).

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