Machining device inspection method and testing member

Abstract

To provide a machining device inspection method capable of simplifying inspection work for appropriately detecting a slanting cut of a workpiece while simplifying a mechanism of a machining device more than conventionally, and a testing member used for inspection of the machining device.SOLUTION: This machining device inspection method comprises: a testing member preparation step of preparing a testing member having a plurality of test pieces and a support member for supporting the test pieces; a testing member holding step of holding the support member side of the testing member by a second chuck table of a machining device provided with a first chuck table for holding a workpiece, the second chuck table for holding the testing member, and a cutting blade; a test piece machining step of machining the test pieces of the testing member by a cutting unit; a test piece peeling step of peeling the test pieces machined in the test piece machining step from the support member; and a test piece inspection step of inspecting the test pieces peeled in the test piece peeling step.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a method for inspecting a processing device and a test member. [Background technology]

[0002] Device chips mounted on electrical devices such as mobile phones and personal computers (PCs) are manufactured by subjecting wafers made of semiconductors such as silicon to various processes. In the device chip manufacturing process, for example, planned division lines (streets) are set in a grid pattern on the front surface of the wafer. Devices such as integrated circuits (ICs) are formed in multiple areas separated by the planned division lines. The back surface of the wafer with devices formed on its front surface is ground using a grinding device or the like to form it to a predetermined thickness, and then the wafer is divided along the planned division lines using a processing device such as a cutting device. This produces multiple device chips, each having a device.

[0003] The above-mentioned cutting device includes, for example, a holding table that holds a workpiece (wafer) and a cutting unit. The cutting unit has a spindle with one end connected to a rotary drive source such as a motor. An annular cutting blade is attached to the other end of the spindle. When cutting the workpiece, the rotary drive source is operated to rotate the cutting blade together with the spindle, and the cutting blade cuts into the workpiece held by the holding table, forming a kerf in the workpiece that is perpendicular to the top surface of the workpiece. By forming the kerf along the planned dividing line, the workpiece can be divided along the planned dividing line.

[0004] When forming a groove in a workpiece with a cutting blade, there are various reasons why the cutting blade may cut into the workpiece in a state where it is positioned in a direction tilted relative to the direction perpendicular to the top surface of the workpiece. For example, this can occur when the cutting blade is unevenly worn or when the spindle in the cutting device is not properly attached and the axis of the spindle is tilted. When the cutting blade cuts into the workpiece in such a state, a groove is formed in the workpiece in a direction tilted relative to the direction perpendicular to the top surface of the workpiece, resulting in a so-called oblique cut.

[0005] A method for processing a workpiece that prevents the workpiece from being cut in a manner that would cause a diagonal cut is disclosed, for example, in Patent Document 1. Patent Document 1 discloses a method for processing a workpiece (wafer) that includes a cut groove forming step in which a cutting blade is used to cut a test piece from one end to the other to form a cut groove, an imaging step in which, after the cut groove forming step, an image is taken of the side surface of one end or the other end of the test piece to form an image including the cut groove, and a determination step in which the need for cutting blade replacement is determined based on the inclination of the inner surface of the cut groove detected from the image. Patent Document 1 discloses that by inspecting the state of the cut groove from the image of the test piece and appropriately determining the timing for cutting blade replacement, it is possible to prevent the workpiece from being cut in a manner that would cause a diagonal cut. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2021-022657 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in the workpiece processing method described in Patent Document 1, a complex mechanism is provided in the processing device to inspect the cut grooves formed in the test piece. Specifically, the processing device described in Patent Document 1 is provided with a rotation drive mechanism that rotates the test piece chuck table to capture images of the cut grooves formed in the test piece from the side of the test piece. Alternatively, the processing device is provided with an imaging unit for capturing images of the cut grooves, separate from an imaging unit for capturing images of the workpiece. This has led to the problem of the device's mechanism becoming complicated.

[0008] On the other hand, if the mechanism of the device described in Patent Document 1 is omitted, the test pieces will be inspected outside the processing device, and each time an inspection is performed, the test pieces will need to be loaded into the device, processed, and then the processed test pieces will need to be removed from the device, which makes the work involved in inspecting the test pieces time-consuming.

[0009] In view of the above circumstances, the object of the present invention is to provide an inspection method for a processing device that can simplify the mechanism of the processing device compared to conventional methods while simplifying the work involved in inspection to properly detect diagonal cuts in the workpiece, and a test member to be used in inspecting the processing device. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided an inspection method for a processing device equipped with a cutting unit that cuts a workpiece, the inspection method comprising: a test member preparation step of preparing a test member having a plurality of test pieces and a support member that supports the plurality of test pieces; a test member holding step of holding the support member side of the test member by the second chuck table of the processing device, the second chuck table being equipped with a first chuck table that holds the workpiece, a second chuck table that holds the test member, and the cutting unit that cuts the workpiece and the test pieces with a cutting blade; a test piece processing step of processing the test pieces of the test member held by the second chuck table by the cutting unit; a test piece peeling step of peeling the test pieces processed in the test piece processing step from the support member held by the second chuck table; and a test piece inspection step of inspecting the test pieces peeled in the test piece peeling step.

[0011] Preferably, the method further comprises a test piece peel stress reducing step of reducing the peel stress of the test piece against the support member.

[0012] Preferably, the support member contains a foaming agent that foams when heated, and in the test piece peel stress reduction step, the support member is heated to a temperature equal to or higher than the foaming temperature of the foaming agent.

[0013] Preferably, the support member comprises a thermoplastic resin.

[0014] Preferably, in the test piece processing step, the cutting blade is cut into the test piece to form a cutting groove in the test piece that is exposed on the side of the test piece, and in the test piece inspection step, the side of the test piece that has been peeled off in the test piece peeling step and where the cutting groove is exposed is inspected.

[0015] According to another aspect of the present invention, there is provided a test member for use in an inspection method for a processing device equipped with a cutting unit that cuts a workpiece, the test member having a plurality of test pieces and a support member that supports the plurality of test pieces, the support member being configured so that the test pieces can be peeled off from the support member.

[0016] Preferably, the test piece comprises carbon or silicon.

[0017] Preferably, the test member is held by the second chuck table of the processing device, which includes a first chuck table for holding the workpiece, a second chuck table for holding the test piece, and a cutting unit for cutting the workpiece and the test piece with a cutting blade.

[0018] Preferably, the support member contains a foaming agent that foams upon heating.

[0019] Preferably, the support member comprises a thermoplastic resin. [Effects of the Invention]

[0020] The processing device used in the processing device inspection method of the present invention includes a first chuck table for holding a workpiece, a second chuck table for holding a test member, and a cutting unit for cutting the workpiece and the test member.The test piece supported by a support member for the test member held by the second chuck table is cut, and the test piece is peeled off from the support member, allowing the cutting groove formed in the test piece to be inspected outside the processing device.

[0021] According to the above-described configuration, a test member containing a test piece for checking the condition of the cutting blade is held and processed on a second table provided separately from the first table that holds the workpiece. Then, by peeling the test piece from the test member, the test piece can be inspected outside the cutting device. This eliminates the need to provide a complex mechanism in the processing device, as in Patent Document 1, and also eliminates the need to load and unload the test piece each time an inspection is performed. Therefore, according to the above-described configuration, the processing device mechanism can be simplified, while the inspection work required to properly detect oblique cuts in the workpiece can be simplified. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 is a perspective view of a processing device, which is a cutting device. [Figure 2] FIG. 2(A) is a perspective view of the test member, and FIG. 2(B) is a side view of the test member. [Figure 3] FIG. 3 is a flowchart of a method for inspecting a processing device. [Figure 4] Figure 4(A) is a side view of the test member and the first cutting unit in the test piece processing process, Figure 4(B) is a side view of the test member and the hot air blower in the peel stress reduction process, and Figure 4(C) is a side view of the test member after the test piece peeling process has been carried out. [Figure 5] FIG. 5 is a side view of a test piece in which a normal cutting groove has been formed. [Figure 6] FIG. 6 is a side view of a test piece in which an abnormal cutting groove was formed. [Figure 7] FIG. 7 is a side view of the second chuck table and the test member according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0023] A first embodiment of the present invention will be described below with reference to the accompanying drawings. First, a cutting device will be taken as an example of a processing device capable of performing an inspection using a test member according to the present invention, and its configuration will be described. FIG. 1 is a perspective view of a processing device 2, which is a cutting device. Note that in FIG. 1, some of the components are expressed as functional blocks. Furthermore, the X-axis (processing feed axis), Y-axis (indexing feed axis), and Z-axis (vertical axis) used in the following description are perpendicular to one another.

[0024] As shown in Fig. 1, the processing device 2 includes a base 4 that supports various components. An opening 4a is formed in a corner of the upper surface of the base 4, and a cassette table 6 that is raised and lowered by a lifting mechanism (not shown) is disposed within this opening 4a. A cassette 8 that can accommodate workpieces 11 to be processed by the processing device 2 is placed on the upper surface of the cassette table 6. For ease of explanation, only the outline of the cassette 8 is shown in Fig. 1.

[0025] 1, a rectangular opening 4b is formed adjacent to cassette table 6 along the Y-axis, with its length aligned with the X-axis. A ball screw type chuck table moving mechanism (processing feed mechanism) 10 is disposed within opening 4b. Chuck table moving mechanism 10 includes a rotational drive source (not shown) such as a motor connected to the end of a ball screw, and an X-axis moving table (not shown) having a nut portion coupled to the ball screw, and moves the X-axis moving table along the X-axis.

[0026] The top of the X-axis moving table is covered by a table cover 10a. In addition, accordion-shaped dustproof and drip-proof covers 10b that expand and contract in accordance with the movement of the X-axis moving table and table cover 10a are attached to both ends of the table cover 10a in the direction along the X-axis. A disk-shaped table base (not shown) that supports a first chuck table 12 via a bearing (not shown) is arranged above the X-axis moving table. The first chuck table 12, which holds a workpiece 11 to be cut by the processing device 2, is arranged on the top surface of the table base in a manner that it is exposed from the table cover 10a.

[0027] 1, workpiece 11 is a disk-shaped semiconductor device substrate made of semiconductor materials such as silicon (Si) and silicon carbide (SiC). That is, workpiece 11 is configured in a disk shape having a circular first surface (front surface) 11a and a circular second surface (back surface) 11b opposite first surface 11a. However, the material and shape of workpiece 11 are not limited to these.

[0028] 1, a notch 11c is formed in a part of the outer periphery (peripheral edge) of the workpiece 11 to indicate the crystal orientation of the workpiece 11. Note that an orientation flat may be formed in the workpiece 11 instead of the notch 11c. Furthermore, the workpiece 11 does not necessarily have to be formed with the notch 11c or the orientation flat.

[0029] 1, a plurality of linear dividing lines 13 (streets) having a predetermined width are set in a grid pattern on a first surface 11a of the workpiece 11. The dividing lines 13 divide the first surface 11a of the workpiece 11 into a plurality of regions. A device 15 such as an integrated circuit is provided in each of the plurality of regions. However, the workpiece 11 does not necessarily have to be provided with the device 15.

[0030] 1, when processing workpiece 11, for ease of handling (transporting, holding, etc.) workpiece 11, workpiece 11 is supported by an annular frame 19 via tape 17. Frame 19 is made of a metal such as SUS (stainless steel), and a circular opening 19a is provided in the center of frame 19, penetrating frame 19 in the thickness direction. The diameter of opening 19a is larger than the diameter of workpiece 11 (the width of first surface 11a and second surface 11b).

[0031] A circular tape 17 is fixed to the workpiece 11 and the frame 19. For example, the tape 17 includes a film-like base material and an adhesive layer (glue layer) provided on the base material. The base material is made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, and the adhesive layer is made of an epoxy-based, acrylic-based, or rubber-based adhesive. The adhesive layer may be made of an ultraviolet-curing resin that hardens when exposed to ultraviolet light. However, the tape 17 may also be a thermocompression sheet that does not include an adhesive layer and can be thermocompression bonded to the workpiece 11 and the frame 19.

[0032] With the workpiece 11 placed inside the opening 19a of the frame 19, the center of the tape 17 is attached to the second surface 11b of the workpiece 11, and the outer periphery of the tape 17 is attached to the frame 19. As a result, the workpiece 11 is supported by the frame 19 via the tape 17, and a frame unit 21 is formed in which the workpiece 11, the frame 19, and the tape 17 are integrated.

[0033] The first chuck table 12 includes a disk-shaped frame 14 made of a metal such as stainless steel. A recess with a circular opening at the top end is formed on the upper surface of the frame 14. A disk-shaped holding plate 16 that matches the shape of the recess is fitted into the recess.

[0034] The holding plate 16 is made of a porous plate-like material such as ceramics, and holds the workpiece 11 on its upper surface (holding surface) 16a. The upper surface (holding surface) 16a of the holding plate 16 is configured to be generally parallel to the X-axis and Y-axis when the holding plate 16 is fitted into the recess. The first chuck table 12 rotates around a rotation axis that is generally perpendicular to the upper surface 16a of the holding plate 16.

[0035] A suction source (not shown) is connected to the bottom of the recess in the frame 14 via a flow path (not shown) provided inside the frame 14 or a valve (not shown) located outside the frame 14. Therefore, when the valve is opened, negative pressure from the suction source acts on the upper surface 16a of the holding plate 16 through the flow path or the like. As the suction source, for example, a vacuum pump combining an air supply source and an ejector is used. However, a rotary pump or the like may also be used as the suction source.

[0036] The first chuck table 12 is connected to a rotary drive source (not shown) such as a motor, and rotates around a rotation axis that is roughly parallel to the Z axis. The first chuck table 12 is also moved along the X axis together with the X axis moving table by the above-mentioned chuck table moving mechanism 10 (processing feed).

[0037] Additionally, on the X-axis moving table described above, a second chuck table 54 that holds a test member 23 (described later) is disposed adjacent to the first chuck table 12 and is exposed from the table cover 10a. The test member 23 will be described in detail later.

[0038] The second chuck table 54 is configured in the shape of a quadrangular prism with a rectangular upper surface (holding surface) 54a. The second chuck table 54 has a suction groove 54b provided in the upper surface 54a. A suction source (not shown) is connected to the bottom of the suction groove 54b via a flow path (not shown) provided inside the second chuck table 54 or a valve (not shown) arranged outside the second chuck table 54. Therefore, similar to the first chuck table 12, when the valve is opened, negative pressure from the suction source acts on the upper surface 54a of the second chuck table 54 through the flow path, etc.

[0039] Similar to the first chuck table 12, the second chuck table 54 is moved along the X-axis together with the X-axis moving table by the chuck table moving mechanism 10 (processing feed). That is, the first chuck table 12 and the second chuck table 54 are connected to a common chuck table moving mechanism 10, and the chuck table moving mechanism 10 moves the first chuck table 12 and the second chuck table 54 in conjunction with each other along the X-axis direction.

[0040] Above the opening 4b, one or more transport mechanisms (not shown) are arranged that can transport the above-mentioned workpiece 11, test member 23, etc. to the first chuck table 12, the second chuck table 54, etc. For example, the workpiece 11 transported by the transport mechanism is placed on the upper surface 16a of the first chuck table 12 so that the first surface 11a is exposed upward. Note that the test member 23 can also be transported to the second chuck table 54 manually. In this case, the transport mechanism that transports the test member 23 can be omitted.

[0041] A gate-shaped support structure 20 is provided on the upper surface of the base 4, spanning the opening 4b along the Y axis. A pair of cutting unit movement mechanisms (indexing feed mechanism, cutting feed mechanism) 22 is disposed above the support structure 20. The structures of the pair of cutting unit movement mechanisms 22 are substantially the same except that they are configured to be symmetrical (mirror image) with respect to a plane parallel to the X axis and Z axis. The same components of the pair of cutting unit movement mechanisms 22 are assigned the same reference numerals, and redundant explanations will be omitted.

[0042] Each cutting unit moving mechanism 22 shares a pair of Y-axis guide rails 24 that are fixed to the front (surface) of the support structure 20 and are generally parallel to the Y-axis. A Y-axis moving plate 26 provided in each cutting unit moving mechanism 22 is attached to the pair of Y-axis guide rails 24 in a manner that allows it to slide along the Y-axis. A nut portion (not shown) that constitutes a ball screw is provided on the rear side (back side) of each Y-axis moving plate 26, and a screw shaft 28 that is generally parallel to the Y-axis guide rails 24 is rotatably connected to each nut portion.

[0043] A rotary drive source 30 such as a motor is connected to one end of each screw shaft 28. When each rotary drive source 30 rotates the screw shaft 28, the Y-axis moving plate 26 connected to the screw shaft 28 moves along the Y-axis guide rails 24. A pair of Z-axis guide rails 32 that are generally parallel to the Z-axis are fixed to the front (surface) of each Y-axis moving plate 26. A Z-axis moving plate 34 is attached to the pair of Z-axis guide rails 32 fixed to each Y-axis moving plate 26 in a manner that allows it to slide along the Z-axis.

[0044] A nut portion (not shown) constituting a ball screw is provided on the rear side (back surface side) of each Z-axis moving plate 34, and a screw shaft 36 that is generally parallel to the Z-axis guide rail 32 is rotatably connected to each nut portion. A rotational drive source 38 such as a motor is connected to one end of each screw shaft 36. By rotating the screw shaft 36 with each rotational drive source 38, the corresponding Z-axis moving plate 34 moves along the Z-axis guide rail 32.

[0045] A first cutting unit 40a is fixed to the lower part of the Z-axis moving plate 34 that constitutes one of the cutting unit moving mechanisms 22. The first cutting unit 40a is equipped with a cylindrical spindle housing 42. As shown in FIG. 4(A), this spindle housing 42 accommodates a spindle 44 having an axis that is generally parallel to the Y-axis. A cutting blade 46 is attached to one end (tip) of the spindle 44, and a motor (not shown) that serves as a rotational drive source for the spindle 44 is connected to the other end of the spindle 44.

[0046] The cutting blade 46 is an annular member in which abrasive grains made of, for example, diamond or the like are dispersed and fixed by a binder such as metal, resin, or ceramic, and is formed with a width (length along the Y-axis, thickness) of 2 mm to 3 mm.

[0047] 1, a cover 48 capable of partially covering a cutting blade 46 attached to a spindle 44 is provided at the end of the spindle housing 42 constituting the first cutting unit 40a on the opening 4b side. A pair of nozzles 50 capable of supplying a processing liquid (processing fluid) such as pure water to the cutting blade 46 is arranged below the cover 48 so as to sandwich the cutting blade 46 therebetween.

[0048] A camera 52 capable of capturing images of the workpiece 11 held on the first chuck table 12 is disposed adjacent to the first cutting unit 40a along the X-axis. Similar to the first cutting unit 40a, the camera 52 is fixed to the lower part of the Z-axis moving plate 34 that constitutes one of the cutting unit moving mechanisms 22.

[0049] Therefore, when one Y-axis moving plate 26 is moved along the Y-axis by one cutting unit moving mechanism 22, the first cutting unit 40a and the camera 52 move along the Y-axis (indexing feed). Also, when one Z-axis moving plate 34 is moved along the Z-axis by one cutting unit moving mechanism 22, the first cutting unit 40a and the camera 52 move along the Z-axis (cutting feed).

[0050] A second cutting unit 40b having the same configuration and function as the first cutting unit 40a is fixed to the lower part of the Z-axis moving plate 34 that constitutes the other cutting unit moving mechanism 22. A camera 52 is disposed adjacent to the second cutting unit 40b along the X-axis.

[0051] 1, opening 4c is formed at a position opposite opening 4a with respect to opening 4b. A cleaning unit 56 for cleaning workpiece 11 and the like after processing is disposed within opening 4c. For example, cleaning unit 56 includes a spinner table that holds and rotates workpiece 11 and the like, and a nozzle that supplies a liquid (cleaning liquid) such as pure water to workpiece 11 and the like held by the spinner table.

[0052] A controller 58 is connected to the various components of the processing device 2 described above. The operation of each component is controlled by this controller 58. The controller 58 is configured by a computer including, for example, a processing device 58a such as a central processing unit (CPU) and a storage device 58b such as a main storage device (Dynamic Random Access Memory) and / or an auxiliary storage device (hard disk drive, flash memory, etc.). The processing device 58a operates in accordance with a program (software) stored in the storage device 58b, thereby realizing the functions of the controller 58. However, the controller 58 may also be realized by hardware alone.

[0053] Next, the test member according to this embodiment will be described. Fig. 2(A) is a perspective view of the test member 23, and Fig. 2(B) is a side view of the test member 23. As shown in Fig. 2(A) and Fig. 2(B), the test member 23 has a plurality of test pieces 25. As shown in Fig. 2(B), each test piece 25 is configured in the shape of a plate having a rectangular first surface (surface) 25a and a rectangular second surface 25b opposite to the first surface 25a.

[0054] The vertical length of the first surface 25a and the second surface 25b of the test piece 25 is, for example, 20 mm to 50 mm, and the horizontal (width) length is, for example, 10 mm to 30 mm. The thickness of the test piece 25 is, for example, 0.5 mm to 3 mm. Examples of materials for the test piece 25 are the same as those for the workpiece 11 described above. Specifically, the workpiece 11 is made of a material containing silicon (Si) or carbon (C). Specific examples of materials containing silicon or carbon include single crystal silicon, carbon, and single crystal silicon carbide (SiC). More specifically, the material for the test piece 25 may be the same as the material for the region (machined region) of the workpiece 11 that is cut by the cutting blade 46 (see FIG. 1). However, the shape, size, and material of the test piece 25 are not limited to these.

[0055] As shown in FIGS. 2(A) and 2(B), the test member 23 has a support member 27 that supports a plurality of test specimens 25. In FIGS. 2(A) and 2(B), seven test specimens 25 are supported by the support member 27. For example, the support member 27 has the same shape as the test member 23. That is, the support member 27 is configured in a plate shape having a rectangular first surface (surface) 27a and a rectangular second surface 27b opposite the first surface 27a. Each of the seven test specimens is arranged on the support member 27 so that the second surface 25b of the test specimen 25 is supported by the first surface 27a of the support member 27.

[0056] Each test piece 25 is arranged so that its width direction is along the length direction of the support member 27. Seven test pieces 25 are arranged adjacent to each other along the length direction of the support member 27. In this way, the seven test pieces 25 are supported by the support member 27. Adjacent test pieces 25 may be in contact with each other, or a gap may be provided between adjacent test pieces 25. However, the shape of the support member 27 and the number of test pieces 25 supported by the support member 27 are not limited to these.

[0057] The support member 27 has a size capable of supporting seven test pieces 25. Specifically, the vertical length of the first surface 27a and the second surface 27b of the support member 27 is, for example, 20 mm or more and 50 mm or less, and the horizontal length is, for example, 50 mm or more and 100 mm or less. The thickness of the support member 27 is, for example, 0.1 mm or more and 3 mm or less. However, as long as the support member 27 can support seven test pieces 25, the size of the support member 27 is not limited to this.

[0058] The support member 27 is bonded to the test piece 25 with an adhesive strength sufficient to prevent the test piece 25 supported by the support member 27 from peeling off from the support member 27 due to impact during cutting, etc. However, it is preferable that the support member 27 has a property such that its adhesive strength to the test piece 25 decreases when subjected to a predetermined treatment.

[0059] An example of a support member 27 having the above-described properties is an adhesive sheet whose adhesive strength to the test piece 25 decreases when heated. Specifically, an adhesive sheet containing a foaming agent that foams when heated can be used. The adhesive sheet has a substrate and an adhesive layer provided on the substrate and containing a foaming agent. Examples of materials for the substrate include paper, cloth, resin film, foam, and metal foil. Examples of resins that make up the resin film include PET (polyethylene terephthalate), PP (polypropylene), and PE (polyimide). Examples of foams include foam materials such as PE (polyethene). Examples of adhesives that make up the adhesive layer include rubber-based resins, acrylic-based resins, and urethane-based resins. However, the materials for the substrate and adhesive are not limited to these.

[0060] As a foaming agent that foams upon heating, for example, thermally expandable microspheres (microcapsules) can be used. Examples of the configuration of thermally expandable microcapsules include microcapsules having an outer shell and a foaming component housed inside the outer shell. Examples of materials for the outer shell include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone. Examples of materials for the foaming component include substances that gasify and expand upon heating. Specific examples include isobutane, propane, and pentane. However, the materials constituting the thermally expandable microcapsules are not limited to these.

[0061] In addition to the thermally expandable microcapsules described above, various foaming agents that foam upon heating can be used, such as inorganic foaming agents and organic foaming agents. Examples of inorganic foaming agents include ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium boron hydroxide, and various azides. Examples of organic blowing agents include water, fluorinated alkane compounds such as trichloromonofluoromethane and dichloromonofluoromethane, azo compounds such as azobisisobutyronitrile, azodicarbonamide and barium azodicarboxylate, hydrazine compounds such as paratoluenesulfonylhydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, 4,4'-oxybis(benzenesulfonylhydrazide) and allylbis(sulfonylhydrazide), semicarbazide compounds such as p-toluylenesulfonylsemicarbazide and 4,4'-oxybis(benzenesulfonylsemicarbazide), triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole, and N-nitroso compounds such as N,N'-dinitrosopentamethyleneterolamine and N,N'-dimethyl-N,N'-dinitrosoterephthalamide. However, the inorganic and organic foaming agents are not limited to these.

[0062] When the adhesive layer constituting the adhesive sheet contains the above-mentioned foaming agent that expands upon heating, the foaming agent expands upon heating, forming irregularities in the adhesive layer. This reduces the contact area between the adhesive layer and the adherend, reducing adhesion to the adherend. Therefore, when the support member 27 is composed of the above-mentioned adhesive sheet, heating the adhesive surface between the test piece 25 and the support member 27 reduces the adhesive strength of the support member 27 to the test piece 25, making it possible to easily peel the test piece 25 from the support member 27.

[0063] As a commercially available pressure sensitive adhesive sheet whose adhesive strength decreases when heated as described above, for example, a heat release sheet (product name: REVALPHA (registered trademark)) manufactured by Nitto Denko Corporation can be used.

[0064] The support member 27 may also be an adhesive sheet whose adhesive strength to the test piece 25 decreases when irradiated with ultraviolet light. Specifically, an adhesive sheet formed as an ultraviolet-curable resin adhesive layer on a substrate can be used. In this case, by irradiating the adhesive surface between the test piece 25 and the support member 27 with ultraviolet light, the adhesive strength of the support member 27 to the test piece 25 decreases, making it possible to easily peel the test piece 25 from the support member 27.

[0065] Furthermore, the support member 27 may be a sheet (thermocompression sheet) that can be thermocompressed to the test piece 25. The thermocompression sheet is made of a thermoplastic resin with a melting point lower than that of the test piece 25 and does not contain an adhesive (glue). For example, a polyolefin-based sheet, a styrene-based sheet, a polyester-based sheet, etc. are used as the thermocompression sheet. Examples of polyolefin-based sheets include polyethylene sheets and polypropylene sheets. Examples of styrene-based sheets include polystyrene sheets. Examples of polyester-based sheets include polyethylene terephthalate sheets and polyethylene naphthalate sheets.

[0066] When the support member 27 is made of one of these thermoplastic resins, the test piece 25 and the support member 27 are heated to a temperature near the melting point of the thermoplastic resin while being pressed with a predetermined pressure in a direction that brings them relatively closer to each other, whereby the test piece 25 is thermocompression-bonded to the support member 27. In this way, multiple test pieces 25 are fixed to the support member 27. Note that when the support member 27 is made of a thermocompression-bonded sheet, the test piece 25 and the support member 27 may be able to be separated by moving them relatively away from each other, even without heating or the like to reduce the adhesive strength of the support member 27 to the test piece 25, as described above.

[0067] As described above, the test member 23 according to this embodiment is configured so that the test piece 25 can be easily peeled off from the support member 27. The support member 27 may be supported by a rigid substrate to facilitate handling of the test member 23. Examples of rigid substrates include resins (vinyl chloride resin, acrylic resin, etc.) and metals (aluminum, stainless steel, other alloys, etc.).

[0068] Next, an inspection method for the processing device 2 using the test member 23 according to the present embodiment will be described. Fig. 3 is a flowchart of the inspection method for the processing device 2. As shown in Fig. 3, the inspection method for the processing device according to the present embodiment includes a test member preparing step S1, a test member holding step S2, a test piece processing step S3, a test piece peeling stress reducing step S4, a test piece peeling step S5, and a test piece inspecting step S6.

[0069] In the test member preparation step S1, the above-described test member 23 is prepared. Note that in the test member preparation step S1, the person who implements the inspection method of the processing device 2 may form the test member 23, or the person who implements the inspection method of the processing device 2 may obtain the test member 23 formed by a third party.

[0070] In the test member holding step S2, the test member 23 prepared in the test member preparing step S1 is held by the second chuck table 54 (see FIG. 1 ) of the processing device 2. Specifically, the test member 23 is automatically placed on the second chuck table 54 by a transport mechanism so that the second surface 27b of the support member 27 contacts the upper surface 54a of the second chuck table 54. Next, by operating a suction source connected to the second chuck table 54, negative pressure is applied to the second surface 27b of the support member 27 via the upper surface 54a of the second chuck table 54. As a result, the support member 27 side of the test member 23 is sucked onto the second chuck table 54 and held thereon. However, the test member 23 may also be placed on the second chuck table 54 manually by an operator.

[0071] In the test piece processing step S3, one of the test pieces 25 of the test member 23 held by the second chuck table 54 is processed by the first cutting unit 40a. FIG. 4(A) is a side view of the test member 23 and the first cutting unit 40a in the test piece processing step S3. First, the positional relationship between the cutting blade 46 and the test piece 25 is adjusted. Specifically, the position of the second chuck table 54 in the direction along the X-axis is adjusted by the chuck table moving mechanism 10 (see FIG. 1) so that the cutting blade 46 does not overlap the test piece 25 when viewed from above.

[0072] The position of the first cutting unit 40a in the direction along the Y axis is adjusted by the cutting unit moving mechanism 22 (see FIG. 1) so that the position in the Y axis direction of the side surface corresponding to the short side of a predetermined test piece 25 coincides with the position of the cutting blade 46. Furthermore, the height of the first cutting unit 40a is adjusted by the cutting unit moving mechanism 22 (see FIG. 1) so that the lower end of the cutting blade 46 is positioned a predetermined distance (the distance equivalent to the cutting depth) below the first surface 25a of the test piece 25.

[0073] Next, machining fluid is supplied from the nozzle 50 (see FIG. 1) to the tip of the cutting blade 46. Then, a motor (not shown), which is a rotation drive source, rotates the cutting blade 46 together with the spindle 44, while the chuck table moving mechanism 10 moves the second chuck table 54 along the X-axis. This causes the cutting blade 46 and the second chuck table 54 to move relatively along the X-axis (machining feed). As a result, while machining fluid is being supplied to the cutting blade 46, the cutting blade 46 cuts into the test piece 25. By cutting the cutting blade 46 into the test piece 25, a cut groove 25c (see FIG. 4(B)) is formed in one of the test pieces 25, which is exposed on the side surface of the test piece 25.

[0074] For example, if the material of the test piece 25 is Si and the thickness of the test piece 25 is 1 mm, the cutting depth of the cutting blade 46 (the cutting depth set in the processing device 2) is set to 0.5 mm, the feed rate (the rate at which the second chuck table 54 is fed in the X-axis direction) is set to 5 mm / sec, the rotation speed of the spindle 44 is set to 30,000 rpm, and the supply rate of the processing fluid is set to 4 L / min. Note that while FIG. 4(A) illustrates the state in which the test piece 25 located at the end of the test member 23 is being processed, the test piece 25 to be processed is not limited to the test piece 25 located at the end, and any test piece 25 may be used.

[0075] Next, the test piece peel stress reduction step S4 is performed. Fig. 4(B) is a side view of the test member and the hot air blower in the peel stress reduction step. As shown in Fig. 4(B), the test piece peel stress reduction step S4 is a step for reducing the peel stress of the test piece 25 relative to the support member 27, so that the processed test piece 25 can be easily peeled from the support member 27 in the test piece peeling step S5 that is performed next.

[0076] Specifically, hot air 29 having a predetermined heating temperature is supplied by a hot air blower 60 such as a dryer so as to heat the adhesive surface between the processed test piece 25 and the support member 27. At this time, it is preferable that the hot air 29 is supplied only to the adhesive surface between the processed test piece 25 and the support member 27, and is supplied only partially to the test member 23 so as not to be supplied to the adhesive surface between the unprocessed test piece 25 and the support member 27. This makes it possible to prevent the unprocessed test piece 25 from being unintentionally peeled off from the support member 27.

[0077] For example, if the support member 27 is an adhesive sheet containing a foaming agent that foams when heated, the support member 27 is heated to a temperature at which the foaming agent starts to foam (foaming temperature). For example, the heating temperature is preferably set to a temperature that is 10°C or higher and 40°C or lower than the foaming temperature. More specifically, the heating temperature depends on the foaming agent material, but when the above-mentioned thermally expandable microspheres are used as the foaming agent, for example, the heating temperature is set to 90°C or higher and 260°C or lower, more preferably 100°C or higher and 220°C, and the heating time (the time the heat is maintained) is set to, for example, 5 seconds or higher and 60 seconds or lower.

[0078] However, the content of the treatment performed on the support member 27 in the test specimen peel stress reduction step S4 is appropriately selected depending on the properties of the support member 27. For example, if the support member 27 is a pressure-sensitive adhesive sheet whose adhesive strength to the test specimen 25 decreases when irradiated with ultraviolet light, ultraviolet light is irradiated onto the adhesive surface between the processed test specimen 25 and the support member 27. At this time, the ultraviolet light irradiation area is adjusted so that the ultraviolet light is not irradiated onto the adhesive surface between the unprocessed test specimen 25 and the support member 27, and the ultraviolet light is irradiated partially onto the test member 23. Furthermore, if the test specimen 25 can be peeled from the support member 27 in the test specimen peeling step S5 described below without performing a treatment to reduce the adhesive strength of the support member 27, the test specimen peel stress reduction step S4 can be omitted.

[0079] Next, in the test piece peeling step S5, the processed test piece 25 is peeled off from the support member 27. FIG. 4(C) is a side view of the test member 23 after the test piece peeling step S5 has been performed. In the test piece peeling step S5, the test piece 25 processed in the test piece processing step S3 is peeled off from the support member 27 held by the second chuck table 54 (see FIG. 1). For example, the processed test piece 25 can be peeled off from the support member 27 by using a pickup tool to suck and pull the test piece 25.

[0080] Next, in the test piece inspection step S6, the processed test piece 25 is inspected. In the test piece inspection step S6, the test piece 25 peeled off from the support member 27 in the test piece peeling step S5 is inspected. In the inspection of the test piece 25, the side of the test piece 25 where the cut groove 25c is exposed is observed with an optical microscope or the like, and the shape of the cut groove 25c is examined. FIG. 5 is a side view of the test piece 25 in which a normal cut groove 25c is formed, and FIG. 6 is a side view of the test piece 25 in which an abnormal cut groove 25d is formed.

[0081] As shown in Fig. 5, when the cutting blade 46 normally cuts into the test piece 25, a cut groove 25c is formed that extends along a direction approximately perpendicular to the first surface 25a of the test piece 25 (thickness direction of the test piece 25). On the other hand, as shown in Fig. 6, when the cutting blade 46 abnormally cuts into the test piece 25, a cut groove 25d is formed that extends along a direction inclined relative to the direction perpendicular to the first surface 25a of the test piece (thickness direction of the test piece 25), so-called oblique cutting occurs.

[0082] As described above, causes of oblique cutting include uneven wear of the cutting blade 46 and improper installation of the spindle 44 in the processing device 2. In addition to these, oblique cutting can also occur when the supply pressures of the machining fluid supplied from the pair of nozzles 50 differ from each other for some reason, causing stronger pressure to be applied to one side of the cutting blade 46 than to the other side.

[0083] For example, in the test piece inspection step S6, the test piece 25 peeled off from the support member 27 in the test piece peeling step S5 is automatically or manually carried out from the processing device 2, and an image of the side surface of the test piece 25 on which the cut groove 25c is formed is taken. This allows a captured image to be obtained that shows the cut groove 25c exposed on the side surface of the test piece 25. Then, the shape of the cut groove 25c is identified based on the captured image, and it is inspected whether or not the cut groove 25c has been processed normally.

[0084] For example, the inclination angle of the cut groove 25c with respect to the direction perpendicular to the first surface 25a of the test piece 25 is specified, and whether or not oblique cutting has occurred is determined based on the inclination angle of the cut groove 25c. The determination of oblique cutting may be performed automatically by applying predetermined image processing to the captured image, or may be performed by an inspector visually inspecting the captured image.

[0085] The inspection method for the processing device 2 according to this embodiment is completed by sequentially performing the test member preparation step S1 to the test piece inspection step S6. If it is found in the test piece inspection step S6 that an abnormal cutting groove 25d has been formed in the test member 23, the processing of the workpiece 11 by the processing device 2 is interrupted, and the cutting blade 46 is replaced and the processing device 2 is adjusted (such as by inspecting and adjusting the axis of the spindle 44 and inspecting and adjusting the nozzle 50). In this way, the condition of the processing device 2 can be inspected based on the cutting groove 25c formed in the test piece 25.

[0086] In the above embodiment (first embodiment), the case where the adhesive surface between the test piece 25 and the support member 27 is heated by supplying hot air 29 from the hot air blower 60 in the test piece peel stress reduction step S4 has been described (see FIG. 4(B)). However, the method for reducing the peel stress of the test piece 25 relative to the support member 27 is not limited to the above. Another example of the test piece peel stress reduction step S4 will be described.

[0087] Fig. 7 is a side view of the second chuck table 62 and the test member 23 according to the second embodiment. As shown in Fig. 7, the second chuck table 62 according to the second embodiment has heat sources 64 on the first surface 62a side. In Fig. 7, seven heat sources 64 are provided on the second chuck table 62. Also, in Fig. 7, suction grooves and the like provided in the second chuck table 62 are not shown.

[0088] For example, the heat sources 64 are composed of heating wires that generate heat when supplied with electricity, and are arranged at approximately the same pitch as the multiple test pieces 25. Each of the multiple heat sources 64 is configured independently and can be heated individually. When the test member 23 is placed on the second chuck table 62, each test piece 25 is positioned so that it overlaps with the heat source 64, with the support member 27 sandwiched between them.

[0089] In the second embodiment, in the test piece peel stress reduction step S4, the support member 27 is heated by a heat source 64 instead of the hot air blower 60 used in the first embodiment. Specifically, the heat source 64, which is disposed at a position overlapping with the test piece 25 (the test piece 25 having the cutting groove 25c formed therein) processed in the test piece processing step S3, is heated. As a result, the region of the support member 27 that is in contact with the test piece 25 having the cutting groove 25c formed therein is partially heated, and the adhesive force between the test piece 25 and the support member 27 is reduced.

[0090] The width of the heat source 64 (the length in the Y-axis direction in FIG. 7) is preferably smaller than the width of the test piece 25. Specifically, the difference between the width of the heat source 64 and the width of the test piece 25 is preferably 3 mm or more and 6 mm or less. This makes it possible to intensively heat only the area of ​​the support member 27 that is in contact with the test piece 25 to be peeled (the processed test piece 25), thereby reducing the peel stress of the test piece 25, while preventing other areas of the support member 27 (the area that is in contact with the unprocessed test piece 25) from being heated.

[0091] Note that a Peltier element may be used as the heat source 64 instead of a heating wire. In this case, the Peltier element arranged at a position overlapping the processed test piece 25 in the test piece processing step S3 is heated, and the other Peltier elements are controlled to be cooled. This allows for concentrated heating of only the area of ​​the support member 27 that is in contact with the test piece 25 to be peeled (the processed test piece 25), thereby reducing the peel stress of the test piece 25, while preventing heating of other areas of the support member 27 (areas in contact with the unprocessed test piece 25). Furthermore, in the test piece peel stress reduction step S4, the hot air blower 60 used in the first embodiment and the heat source 64 used in the second embodiment may be used in combination.

[0092] 7, seven heat sources 64 are provided on the second chuck table 62, but there is no limit to the number of heat sources 64, and the number may be greater than the number of test specimens 25 supported by the support member 27, or may be less than the number of test specimens 25 supported by the support member 27. The same applies to the Peltier elements. There is no limit to the number and arrangement of the heat sources 64 and Peltier elements, as long as it is possible to intensively heat only the area of ​​the support member 27 that is in contact with the test specimen 25 to be peeled (the processed test specimen 25) to reduce the peel stress of the test specimen 25, while preventing other areas of the support member 27 (the area in contact with the unprocessed test specimen 25) from being heated.

[0093] As described above, the processing apparatus used in the processing apparatus inspection method of the present invention includes a first chuck table for holding a workpiece, a second chuck table for holding a test member of the present invention, and a cutting unit for cutting the workpiece and the test member. The processing apparatus inspection method of the present invention cuts a test piece supported on the test member held by the second chuck table and then peels the test piece from the support member, thereby inspecting the cut grooves formed in the test piece outside the processing apparatus. This eliminates the need for a complex mechanism in the processing apparatus, as in Patent Document 1, and also eliminates the need to load and unload test pieces each time an inspection is performed. Therefore, the processing apparatus mechanism can be simplified, while the inspection work required to properly detect oblique cuts in the workpiece can be simplified.

[0094] In addition, the structures, methods, etc. according to the above-described embodiments and modifications may be modified and implemented without departing from the scope of the present invention. [Explanation of symbols]

[0095] 11: Workpiece 11a: Front page 11b:Second side 11c: Notch 13: Planned division line 15: Device 17: Film 19: Frame 19a:Aperture 21: Frame unit 23: Test member 25: Test piece 25a: 1st side (front) 25b: 2nd side (back side) 25c: Cutting groove 25d: Cutting groove 27: Support member 27a: 1st side (front) 27b: 2nd side (back side) 29: Hot air 2: Processing equipment (cutting equipment) 4: Base 4a, 4b, 4c: opening 6: Cassette table 8: Cassette 10: Chuck table moving mechanism (processing feed mechanism) 10a: Table cover 10b: Dustproof / waterproof cover 12: First chuck table 14:Frame body 16: Holding plate 16a:Top surface (holding surface) 18: Clamp 20:Support structure 22: Cutting unit movement mechanism (indexing feed mechanism, cutting feed mechanism) 24: Y-axis guide rail 26: Y-axis moving plate 28: Screw shaft 30: Rotation drive source 32: Z-axis guide rail 34: Z-axis moving plate 36: Screw shaft 38: Rotation drive source 40a: First cutting unit 40b: Second cutting unit 42: Spindle housing 44: Spindle 46: Cutting blade 48: Cover 50: Nozzle 52: Camera 54: Second chuck table 54a: Holding surface 54b: Suction groove 56: Cleaning unit 58: Controller 58a: Processing device 58b: Storage device 60: Hot air blower 62: Second chuck table 64: Heating wire

Claims

1. 1. A method for inspecting a processing device equipped with a cutting unit that cuts a workpiece, comprising: a test member preparing step of preparing a test member having a plurality of test pieces and a support member that supports the plurality of test pieces; a test member holding step of holding the support member side of the test member by the second chuck table of the processing device, the second chuck table including a first chuck table for holding the workpiece, a second chuck table for holding the test member, and a cutting unit for cutting the workpiece and the test piece with a cutting blade; a test piece processing step of processing the test piece of the test member held by the second chuck table by the cutting unit; a test piece peeling step of peeling the test piece processed in the test piece processing step from the support member held by the second chuck table; and a test piece inspection step of inspecting the test piece peeled off in the test piece peeling step.

2. 2. The method for inspecting a processing device according to claim 1, further comprising a test piece peel stress reducing step of reducing a peel stress of the test piece relative to the support member.

3. the support member contains a foaming agent that foams upon heating; 3. The method for inspecting a processing device according to claim 2, wherein the test piece peel stress reducing step comprises heating the support member to a temperature equal to or higher than the foaming temperature of the foaming agent.

4. The method for inspecting a processing device according to claim 2 , wherein the support member comprises a thermoplastic resin.

5. In the test piece processing step, the cutting blade is caused to cut into the test piece, thereby forming a cutting groove in the test piece that is exposed on a side surface of the test piece; 5. The method for inspecting a processing device according to claim 1, wherein the test piece inspecting step inspects the side surface of the test piece peeled off in the test piece peeling step, where the cut groove is exposed.

6. A test member used in a method for inspecting a processing device equipped with a cutting unit that cuts a workpiece, a plurality of test pieces and a support member that supports the plurality of test pieces; The support member is configured to allow the test specimen to be peeled from the support member.

7. 7. The test member of claim 6, wherein the test specimen comprises carbon or silicon.

8. 7. The test member according to claim 6, wherein the test member is held by the second chuck table of the processing device, the processing device comprising: a first chuck table for holding the workpiece; a second chuck table for holding the test piece; and a cutting unit for cutting the workpiece and the test piece with a cutting blade.

9. 9. A test member according to any one of claims 6 to 8, wherein the support member contains a foaming agent that foams upon heating.

10. 9. A test member according to any one of claims 6 to 8, wherein the support member comprises a thermoplastic resin.

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