Jig and checking method

Abstract

To provide a jig and a checking method that makes it easy to observe machined grooves regardless of the type of test piece while keeping costs down.SOLUTION: A jig 70 for checking a processed groove 96 of a test piece 90 having the processed groove 96 exposed on opposing first and second side surfaces 91 and 92 includes a first mirror 61 arranged opposite the first side surface 91, a first holding portion 71 that holds the first mirror 61, a second mirror 62 arranged opposite the second side surface 92 and tilting downward as it approaches the second side surface 92 so as to reflect light emitted from the imaging unit 30 toward the first mirror 61, and a second holding portion 72 that holds the second mirror 62.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a jig and a method for checking a machined groove formed in a test piece. [Background technology]

[0002] 2. Description of the Related Art Cutting machines that use cutting blades are used to separate various plate-shaped workpieces, such as semiconductor wafers, ceramics, resin package substrates, SiC wafers, and sapphire wafers, into individual device chips.

[0003] The cutting device performs cutting using a processing tool called a cutting blade, which is made of a binder with abrasive grains dispersed in it. However, when cutting a workpiece with the cutting blade, if the cutting force of the cutting blade is weaker than the workpiece, the cutting force may be too strong and the cutting edge may be tilted, resulting in a so-called oblique cut.

[0004] When a diagonal cut occurs, the inclined shape of the tip of the cutting blade is transferred to the workpiece, making it impossible to machine the workpiece into the desired shape. Therefore, a method is used in which the machined side surface of the machined groove formed by cutting a test piece is imaged to determine whether the cutting blade should be replaced (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-22657 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the cutting device described in Patent Document 1 has the problem that a test piece chuck table with a rotation drive mechanism must be prepared in order to observe the cut groove from above using an imaging unit that moves integrally with the cutting unit, which increases costs. Also, when a carbon block, which has good machinability, is used as the test piece, there is the problem that the illumination emitted from the imaging unit makes it difficult to observe the outline of the machined groove formed in the carbon block.

[0007] Therefore, when checking the processed grooves in a test piece formed by a processing tool, a method was desired that would allow for easy observation of the processed grooves while keeping costs down, even when a carbon block was used for the test piece.

[0008] The present invention provides a jig and a confirmation method that can easily observe machined grooves regardless of the type of test piece while keeping costs down. [Means for solving the problem]

[0009] The present invention provides A jig for checking a processed groove of a test piece having a processed groove exposed on a first side surface and a second side surface facing each other, a first mirror disposed to face the first side surface; a first holding portion that holds the first mirror; a second mirror disposed to face the second side surface and tilting downward as it approaches the second side surface so as to reflect light emitted from the imaging device toward the first mirror; and a second holding portion that holds the second mirror.

[0010] The present invention also provides A method for confirming a processed groove of a test piece having a processed groove exposed on a first side surface and a second side surface facing each other, comprising: a holding step of holding the test piece on a holding table of a processing device that processes the test piece; a machining step of machining the test piece held by the holding table with a machining tool to form machined grooves exposed on the first side surface and the second side surface of the test piece; a positioning step of positioning the jig so that the first mirror faces the first side surface of the test piece and so that the second mirror faces the second side surface of the test piece; After the placing step, the method includes an observation step of irradiating the second mirror with light from a light source from above the test piece while observing the processed groove of the test piece reflected on the second mirror from above the test piece. [Effects of the Invention]

[0011] According to the present invention, it is possible to easily observe machined grooves using a relatively inexpensive method regardless of the type of test piece. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a flowchart showing the flow of an embodiment of the verification method of the present invention. [Figure 2] FIG. 2 is a perspective view of the cutting device 1 and a workpiece 200. As shown in FIG. [Figure 3] FIG. 3 is a cross-sectional view of the vicinity of the holding table 10 for explaining the holding step S10. [Figure 4] FIG. 4 is a cross-sectional view of the periphery of the holding table 10 during processing, for explaining the processing step S11. [Figure 5] FIG. 5 is a cross-sectional view of the periphery of the holding table 10 after processing, for explaining the processing step S11. [Figure 6] FIG. 6 is a perspective view of the jig 70 of the first embodiment. [Figure 7] FIG. 7 is a side view of the jig 70 of the first embodiment as seen from the direction of arrow A in FIG. [Figure 8] FIG. 8 is a perspective view of the jig 70 and the test piece 90 supported by the annular frame 205, for explaining the disposing step S12. [Figure 9]FIG. 9 is a perspective view of the test piece 90 supported by the annular frame 205 after the jig 70 has been placed. [Figure 10] FIG. 10 is a cross-sectional view of the periphery of the holding table 10 after the jig 70 has been placed. [Figure 11] FIG. 11 is a cross-sectional view of the vicinity of the holding table 10 for explaining the observation step S13. [Figure 12] FIG. 12 is a cross-sectional view of the periphery of the holding table 10 for explaining the observation step S13 using the jig 70 according to the modified example of the first embodiment. [Figure 13] FIG. 13 is a perspective view of a jig 70 according to the second embodiment. [Figure 14] FIG. 14 is a side view of the jig 70 of the second embodiment as seen from the direction of arrow A in FIG. [Figure 15] FIG. 15 is a perspective view of a jig 70 according to the third embodiment. [Figure 16] FIG. 16 is a side view of the jig 70 of the third embodiment as seen from the direction of arrow A in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, an embodiment of a method for checking a processed groove according to the present invention will be described with reference to the drawings.

[0014] 1 is a flowchart of one embodiment of a method for checking a processed groove of the present invention. As shown in FIG. 1, the checking method of this embodiment includes a holding step S10, a processing step S11, a placement step S12, and an observation step S13. Note that the checking method of the present invention may include other processes as long as it includes the processing step S11, the placement step S12, and the observation step S13. For example, a transport step of transporting the processed test piece to another position may be included between the processing step S11 and the observation step S13.

[0015] First, a cutting device 1 that can be used in the checking method of this embodiment will be described with reference to Fig. 2. Fig. 2 is a perspective view of the cutting device 1 and a workpiece 200.

[0016] The cutting device 1 is a device that cuts (machines) a plate-shaped workpiece 200 and divides the workpiece 200 into individual chips 203. The workpiece 200 is a disk-shaped semiconductor wafer or optical device wafer made of silicon, sapphire, gallium, or the like. The workpiece 200 may also be any of a variety of plate-shaped processing materials, such as a plate-shaped inorganic material substrate made of ceramics, glass, or sapphire, or a plate-shaped ductile material such as metal or resin.

[0017] As shown in FIG. 2, the workpiece 200 has a back surface 204 attached to a disc-shaped adhesive sheet 206 to which an annular frame 205 is attached, and is placed in the opening inside the annular frame 205 .

[0018] The cutting device 1 is a device that holds a workpiece 200, on which a planned division line 202 has been formed, on a holding table 10 and cuts the workpiece 200 with a cutting blade along the planned division line 202. As shown in Fig. 2, the cutting device 1 includes a holding table 10 that holds the workpiece 200 by suction on a holding surface 11, a cutting unit 20 that cuts the workpiece 200 held on the holding table 10 with a cutting blade 21 attached to a spindle 22, and an imaging unit 30 that takes an image of the workpiece 200 held on the holding table 10.

[0019] The cutting device 1 includes an X-axis moving unit 41 that moves the holding table 10 for processing in the X-axis direction parallel to the horizontal direction and the short side direction of the device body 2, a Y-axis moving unit 42 that indexes and moves the cutting unit 20 in the Y-axis direction that is parallel to the horizontal direction and the longitudinal direction of the device body 2 and perpendicular to the X-axis direction, a Z-axis moving unit 43 that moves the cutting unit 20 for cutting in the Z-axis direction that is parallel to the vertical direction that is perpendicular to both the X-axis direction and the Y-axis direction, and a rotational moving unit 44 that rotates the holding table 10 around an axis parallel to the Z-axis direction and is moved for processing in the X-axis direction together with the holding table 10 by the X-axis moving unit 41.

[0020] The holding table 10 is disk-shaped, and the holding surface 11 that holds the workpiece 200 is made of porous ceramic or the like. The holding table 10 is movable by an X-axis movement unit 41 and rotatable by a rotation movement unit 44. The holding table 10 is connected to a vacuum suction source (not shown), and is sucked by the vacuum suction source to suck and hold the workpiece 200. A plurality of clamps 12 that clamp an annular frame 205 are provided around the holding table 10.

[0021] The cutting unit 20 includes a spindle 22 on which a cutting blade 21 is attached, which cuts the workpiece 200 held on the holding table 10. The cutting unit 20 is provided so as to be movable in the Y-axis direction by a Y-axis movement unit 42 relative to the workpiece 200 held on the holding table 10, and is also provided so as to be movable in the Z-axis direction by a Z-axis movement unit 43.

[0022] The cutting unit 20 is mounted on a support frame 3 that stands upright from the device main body 2 via a Y-axis moving unit 42, a Z-axis moving unit 43, etc. The cutting unit 20 is capable of positioning the cutting blade 21 at any position on the holding surface 11 of the holding table 10 by the Y-axis moving unit 42 and the Z-axis moving unit 43.

[0023] The cutting unit 20 includes a cutting blade 21, a spindle 22 having the cutting blade 21 attached to the tip thereof, a spindle housing 23 which can be moved in the Y-axis direction and the Z-axis direction by a Y-axis moving unit 42 and a Z-axis moving unit 43 and which accommodates the spindle 22 so that the spindle 22 can rotate freely around the axis S, and a spindle motor (not shown) which is accommodated in the spindle housing 23 and rotates the spindle 22 around the axis S.

[0024] The cutting blade 21 is an extremely thin cutting grindstone having a roughly ring shape. The spindle 22 cuts the workpiece 200 by rotating the cutting blade 21. The spindle 22 is housed in a spindle housing 23, which is supported by a Z-axis movement unit 43. The axial centers S of the spindle 22 and cutting blade 21 of the cutting unit 20 are set parallel to the Y-axis direction. In other words, if the direction along which the axial center S of the spindle 22 runs is referred to as the axial direction, then the axial direction is parallel to the Y-axis direction.

[0025] The X-axis movement unit 41 moves the holding table 10 in the X-axis direction, which is the processing feed direction, to perform processing feed between the holding table 10 and the cutting unit 20 relative to each other along the X-axis. The Y-axis movement unit 42 moves the cutting unit 20 in the Y-axis direction, which is the indexing feed direction, to perform index feed between the holding table 10 and the cutting unit 20 relative to each other along the Y-axis. The Z-axis movement unit 43 moves the cutting unit 20 in the Z-axis direction, which is the cutting feed direction, to perform cutting feed between the holding table 10 and the cutting unit 20 relative to each other along the Z-axis.

[0026] The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 each include a well-known ball screw that is rotatable around its axis, a well-known pulse motor that rotates the ball screw around its axis, and a well-known guide rail that supports the holding table 10 or the cutting unit 20 so that it can move freely in the X-axis, Y-axis, or Z-axis direction.

[0027] The cutting device 1 also includes an X-axis position detection unit (not shown) for detecting the position of the holding table 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction, and a Z-axis position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit may be configured with a linear scale parallel to the X-axis direction or the Y-axis direction and a read head. The Z-axis position detection unit detects the position of the cutting unit 20 in the Z-axis direction using pulses from a pulse motor. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the position of the holding table 10 in the X-axis direction and the position of the cutting unit 20 in the Y-axis direction or the Z-axis direction to the control unit 100. Note that each position is determined by the distance in the X-axis direction, the Y-axis direction, and the Z-axis direction from a preset reference position.

[0028] The cutting device 1 also includes a cassette elevator 50 on which a cassette 51 containing the workpiece 200 before and after cutting is placed and which moves the cassette 51 in the Z-axis direction, and a transport unit (not shown) which moves the workpiece 200 in and out of the cassette 51 and transports the workpiece 200.

[0029] The cassette 51 also contains one test piece 90 shown in Fig. 3. The test piece 90 is used to detect the occurrence of so-called oblique cuts, which occur when cutting is performed with the tip of the cutting blade 21 tilted, and to determine whether the cutting blade 21 should be replaced.

[0030] The test piece 90 is, for example, a carbon block. The test piece 90 of this embodiment is a rectangular parallelepiped with a rectangular bottom that is long in one direction. The material, shape, size, etc. of the test piece 90 can be changed as appropriate. The size of the test piece 90 is, for example, a rectangular parallelepiped with a length of 3 mm, a width of 3 mm, and a length of 50 mm.

[0031] The test piece 90 is supported by the annular frame 205, and when determining whether or not to replace the cutting blade 21, the test piece 90 is carried out of the cassette 51, then sucked and held on the holding table 10, and the annular frame 205 is clamped by the clamping unit 12. As will be described in detail later, after a machining groove 96 is formed in the test piece 90, the test piece 90 is placed on the annular frame 205 together with the jig 70, and the machining groove 96 is observed with the test piece 90 held by the jig 70.

[0032] The imaging unit 30 is fixed so as to move integrally with the cutting unit 20. The imaging unit 30 includes a light source such as an LED and an imaging element. The imaging element is, for example, a charge-coupled device (CCD) imaging element or a complementary metal-oxide semiconductor (CMOS) imaging element. The imaging unit 30 captures images of the workpiece 200 and the test piece 90 held on the holding table 10 and outputs the captured images to the control unit 100. The image of the workpiece 200 captured by the imaging unit 30 is used for aligning the workpiece 200 with the cutting unit 20, and the image of the test piece 90 captured by the imaging unit 30 is used for determining whether the cutting blade 21 should be replaced.

[0033] The control unit 100 controls each of the above-mentioned components of the cutting device 1, and causes the cutting device 1 to perform a machining operation on the workpiece 200 in accordance with the machining conditions. The control unit 100 is composed of a computer having an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device.

[0034] Next, one embodiment of the method for checking the processed groove 96 of the present invention will be described in detail with reference to Figures 3 to 11. The timing for checking the processed groove 96 using the test piece 90 is, for example, every time a preset number of workpieces 200 are cut, and this can be registered in the control unit 100 as part of the processing conditions.

[0035] First, the holding step S10 will be described with reference to Fig. 3. Fig. 3 is a cross-sectional view of the periphery of the holding table 10 for explaining the holding step S10.

[0036] (holding step) The holding step S10 is a process of placing the test piece 90 on the holding table 10. In the holding step S10, the transport unit is controlled to remove the test piece 90 from the cassette 51 and place the test piece 90 on the holding surface 11 of the holding table 10 via the adhesive sheet 206. The test piece 90 is preferably placed so that the longest of its three sides faces the Y-axis direction. This eliminates the need to replace the test piece 90 with a new one each time the confirmation method is performed; the test piece 90 can be reused by moving the cutting position in the Y-axis direction. The control unit 100 controls the vacuum suction source and the like to suction-hold the test piece 90 on the holding surface 11 of the holding table 10 via the adhesive sheet 206, and clamps the annular frame 205 with the clamp unit 12.

[0037] (Processing step) Next, the processing step S11 will be described with reference to FIGS. In the processing step S11, the cutting blade 21 is moved in the X-axis direction relative to the test piece 90. Specifically, the holding table 10 that holds the test piece 90 is processed and fed in the X-axis direction by the X-axis moving unit 41 relative to the test piece 90.

[0038] 4 is a cross-sectional view of the vicinity of the holding table 10 during processing, illustrating the processing step S11. As shown in Fig. 4, in processing step S11, the cutting blade 21 is positioned at a height position where it cuts a distance Za into the test piece 90, and the cutting blade 21 is moved relatively in the X-axis direction from the first side surface 91 side to the second side surface 92 side of the test piece 90, or from the second side surface 92 side to the first side surface 91 side (see also Fig. 8). Note that the distance Za is smaller than the thickness Zb of the test piece 90.

[0039] 5 is a cross-sectional view of the holding table 10 and its periphery after machining, illustrating machining step S11. As shown in FIG. 5, a machined groove 96 extending along the X-axis direction is formed in the test piece 90. Referring also to FIG. 8, one end of the machined groove 96 is exposed on the first side surface 91 of the test piece 90, and the other end is exposed on the second side surface 92. That is, the machined groove 96 is exposed on the first side surface 91 and the second side surface 92 of the test piece 90, which are opposite to each other in the X-axis direction.

[0040] Here, we will explain the jig 70 used when observing the processed groove 96. Fig. 6 is a perspective view of the jig 70 of the first embodiment, and Fig. 7 is a side view of the jig 70 of the first embodiment as seen from the direction of arrow A in Fig. 6.

[0041] As shown in Figures 6 and 7, the jig 70 includes a first mirror 61 arranged along the vertical direction, a first holding part 71 that holds the first mirror 61, a second mirror 62 that is tilted downward at an angle of 45° as it approaches the first mirror 61 and is arranged so as to reflect light emitted from the imaging unit 30 toward the first mirror 61, a second holding part 72 that holds the second mirror 62, and a bottom surface 73 that connects the lower part of the first holding part 71 and the lower part of the second holding part 72.

[0042] The first mirror 61 and the second mirror 62 can be formed, for example, by mirror-finishing a semiconductor wafer or the like. Note that the first mirror 61 and the second mirror 62 may be made of any material as long as they have the function of reflecting visible light, and there are no particular limitations on the material.

[0043] The first holding part 71 preferably has a vertical surface on the surface facing the second mirror 62. The second holding part 72 preferably has an inclined surface on the surface facing the first mirror 61 that slopes downward at an angle of 45° as it approaches the first mirror 61. This allows the first mirror 61 and the second mirror 62 to be made of plate-shaped mirror members, thereby reducing manufacturing costs. The first mirror 61 and the second mirror 62 each have a size of, for example, a thin plate measuring 10 mm in height, 50 mm in width, and 0.63 mm in thickness.

[0044] The bottom surface 73 has a test specimen holding portion 74 that holds the test specimen 90. Specifically, the test specimen holding portion 74 is a rectangular through-hole 75 formed in the bottom surface 73. The through-hole 75 is preferably formed so that it can accommodate the bottom surface of the test specimen 90 and determines the relative position of the jig 70 with the test specimen 90 accommodated therein. The through-hole 75 may be formed to have the same shape as the bottom surface of the test specimen 90 but slightly larger than the bottom surface, or may be provided with a positioning portion that is larger than the bottom surface.

[0045] In the placement step S12, the jig 70 configured in this manner is placed so that the test piece 90 with the processed groove 96 formed therein is accommodated in the through hole 75. In other words, the jig 70 is placed so that the through hole 75 surrounds the test piece 90. The placement may be performed manually or automatically by a transport unit (not shown).

[0046] Figure 8 is an oblique view of the jig 70 and the test piece 90 supported by the annular frame 205 to explain the placement step S12, Figure 9 is an oblique view of the test piece 90 supported by the annular frame 205 after the jig 70 has been placed, and Figure 10 is a cross-sectional view of the area around the holding table 10 after the jig 70 has been placed.

[0047] By positioning the jig 70 in this manner, the first mirror 61 is positioned to face the first side surface 91 of the test piece 90, and the second mirror 62 is positioned to face the second side surface 92 of the test piece 90, and is positioned so as to be inclined downward at an angle of 45° as it approaches the second side surface 92. When the jig 70 is positioned, the jig 70 together with the test piece 90 is suction-held to the holding surface 11 via the adhesive sheet 206.

[0048] 10, the height H1 of the first mirror 61 and the second mirror 62 is preferably higher than the height H2 of the test piece 90 held by the jig 70. This allows the entire processed groove 96 to be observed in the observation step S13 described later.

[0049] 11 is a cross-sectional view of the periphery of the holding table 10 to explain the observation step S13. In the observation step S13, the imaging unit 30 is moved relatively to the jig 70 so that it is positioned above the second mirror 62. As a result, light emitted from the light source of the imaging unit 30 is reflected in the X-axis direction by the second mirror 62 located below toward the first mirror 61. The reflected light from the second mirror 62 is then further reflected by the first mirror 61, returns to the second mirror 62, and is then reflected upward by the second mirror 62. In contrast, if the first mirror 61 is not provided, the light emitted from the imaging unit 30 is reflected in the X-axis direction by the second mirror 62 located below. However, since there is no first mirror 61 facing the second mirror 62, the light may be absorbed by the test piece 90 or pass around the test piece 90, and the amount of light required for observation may not be obtained.

[0050] According to the jig 70 of this embodiment, when observing the processed grooves 96 of the test piece 90 reflected on the second mirror 62 from above, if light is irradiated from the light source of the upper imaging unit 30 onto the second mirror 62 tilted at 45 degrees, the light is reflected by the second mirror 62 toward the first mirror 61, then reflected by the first mirror 61 back to the second mirror 62, and reflected upward by the second mirror 62, making it easy to see the processed grooves 96 of the test piece 90 from above. This makes it possible to easily observe the processed grooves in a relatively inexpensive manner regardless of the type of test piece 90.

[0051] In the above embodiment, the first mirror 61 is disposed along the vertical direction, and the second mirror 62 is disposed so as to be tilted vertically downward at an angle of 45° as it approaches the second side surface 92. However, this is not limited to this, and the tilt angle of the second mirror 62 is not limited to 45° and may be deviated from 45° as long as the second mirror 62 is disposed so that light emitted from the light source of the imaging unit 30 is reflected by it toward the first mirror 61. In this case, the first mirror 61 is also disposed so as to be deviated from the vertical direction, and the light source of the imaging unit 30 is also disposed so as to be deviated from the vertical direction relative to the second mirror 62. In this case, it is preferable that the optical axis of the lens of the imaging unit 30 and the optical axis of the light source coincide with each other.

[0052] FIG. 12 is a cross-sectional view of the vicinity of the holding table 10 to explain the observation step S13 using a jig 70 according to a modification of the first embodiment. The jig 70 according to the modification shown in FIG. 12 illustrates an example in which the first mirror 61, the second mirror 62, and the imaging unit 30 are arranged at a slight clockwise tilt while maintaining their relative positional relationship, compared to the jig 70 according to the first embodiment shown in FIG. 10. Therefore, by adjusting the positions of the first mirror 61 and the second mirror 62 according to the angle of the imaging unit 30, for example, when the angle of the imaging unit 30 is shifted from the downward vertical direction, the machined groove 96 of the test piece 90 can be easily observed. This allows the machined groove 96 to be easily observed using a relatively inexpensive method regardless of the type of test piece 90.

[0053] Other embodiments of the jig 70 will be described below. Fig. 13 is a perspective view of a jig 70 of the second embodiment, and Fig. 14 is a side view of the jig 70 of the second embodiment as viewed from the direction of arrow A in Fig. 13. The jig 70 of the second embodiment differs from the jig 70 of the first embodiment in that a first holding portion 71 that holds the first mirror 61 and a second holding portion 72 that holds the second mirror 62 are independent. That is, the jig 70 of the second embodiment does not have a bottom surface 73 that connects the lower part of the first holding portion 71 and the second holding portion 72.

[0054] Therefore, in the placement step S12, the first holding part 71 is positioned so that the first mirror 61 faces the first side surface 91, sandwiching the test piece 90, and the second holding part 72 is positioned so that the second mirror 62 faces the second side surface 92, and so that the second mirror 62 tilts downward as it approaches the second side surface 92, thereby reflecting the light irradiated from the imaging unit 30 toward the first mirror 61.

[0055] Even with the jig 70 of the second embodiment, when observing the machined grooves 96 of the test piece 90 reflected on the second mirror 62 from above, if light is irradiated onto the tilted second mirror 62 from the light source of the upper imaging unit 30, the light is reflected by the second mirror 62 toward the first mirror 61, then reflected by the first mirror 61 back to the second mirror 62, and then reflected upward by the second mirror 62, making it easy to see the machined grooves 96 of the test piece 90 from above. This makes it possible to easily observe the machined grooves in a relatively inexpensive manner regardless of the type of test piece 90.

[0056] FIG. 15 is a perspective view of a jig 70 of the third embodiment, and FIG. 16 is a side view of the jig 70 of the third embodiment as viewed from the direction of arrow A in FIG. 15. The jig 70 of the third embodiment differs from the jig 70 of the first embodiment in that a through-hole 75 is not provided in the test piece holding portion 74. That is, in the jig 70 of the third embodiment, a test piece 90 is placed on the test piece holding portion 74 located on the bottom surface 73 connecting the lower part of the first holding portion 71 and the second holding portion 72. The test piece holding portion 74 may have a flat surface on which the test piece 90 is fixed by adhesive or the like, or may have a recess provided so that the test piece 90 is accommodated in the recess.

[0057] When the jig 70 of this embodiment is used, in the holding step S10, a transport unit (not shown) is controlled to remove the jig 70 and the test piece 90 fixed to the jig 70 from the cassette 51, and the test piece 90 fixed to the jig 70 is placed on the holding surface 11 of the holding table 10 via the adhesive sheet 206. Then, in the processing step S11, the cutting blade 21 is moved relative to the test piece 90 in the X-axis direction to form a processed groove 96 extending along the X-axis direction. Subsequently, in the observation step S13, the imaging unit 30 is moved relatively to the jig 70 so as to be positioned above the second mirror 62.

[0058] As a result, light emitted from the light source of the imaging unit 30 is reflected in the X-axis direction by the second mirror 62 located below toward the first mirror 61. The light reflected from the second mirror 62 is then further reflected by the first mirror 61, returns to the second mirror 62, and is reflected upward by the second mirror 62. Therefore, the machined groove 96 of the test piece 90 can be easily seen from above, and even when the jig 70 of this embodiment is used, the machined groove can be easily observed using a relatively inexpensive method regardless of the type of test piece 90.

[0059] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present invention is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications or alterations within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present invention. Furthermore, the components of the above-described embodiments may be combined in any manner without departing from the spirit of the invention.

[0060] For example, in the above embodiment, a cutting groove formed by a cutting blade was used as an example of a processing groove, but this is not limited to this. The jig and confirmation method of the present invention can be applied to any processing groove formed by a processing device, such as a groove formed by a grinding wheel or a groove formed by a laser processing device.

[0061] This specification describes at least the following items. Note that the components in parentheses correspond to those in the above-described embodiment, but are not limited to these.

[0062] (1) A jig (jig 70) for checking a processed groove (processed groove 96) of a test piece (test piece 90) having a first side surface (first side surface 91) and a second side surface (second side surface 92) facing each other, a first mirror (first mirror 61) disposed so as to face the first side surface; a first holding portion (first holding portion 71) that holds the first mirror; a second mirror (second mirror 62) disposed to face the second side surface and tilting downward as it approaches the second side surface so as to reflect light emitted from an imaging device (imaging unit 30) toward the first mirror; a second holding portion (second holding portion 72) that holds the second mirror; jig.

[0063] According to (1), when observing the processed grooves of a test piece reflected in the second mirror from above, if light is irradiated from a light source above onto the tilted second mirror, the light is reflected by the second mirror toward the first mirror, then reflected by the first mirror back to the second mirror, and then reflected upward by the second mirror, making it easy to see the processed grooves of the test piece from above. This makes it possible to easily observe the processed grooves of a test piece using a relatively inexpensive method regardless of the type of test piece.

[0064] (2) The jig according to (1), the first mirror is arranged along the vertical direction, the second mirror is disposed so as to be inclined downward in the vertical direction at an angle of 45° as it approaches the second side surface; jig.

[0065] According to (2), it is only necessary to irradiate the second mirror with light from above in the vertical direction, and it is not necessary to adjust the positional relationship between the first mirror and the second mirror.

[0066] (3) The jig according to (1), Further provided is a bottom surface (bottom surface 73) that connects the lower portion of the first holding portion and the lower portion of the second holding portion, The bottom surface has a test strip holding portion (test strip holding portion 74) that holds the test strip. jig.

[0067] According to (3), the jig can be handled as a single unit, improving convenience.

[0068] (4) The jig according to (3), The test piece holding portion is a through hole (through hole 75) provided in the bottom surface so as to surround the test piece. jig.

[0069] According to (4), after the test piece is processed, the jig can be installed from above the test piece, so the test piece can be processed without taking the jig into consideration.

[0070] (5) The jig according to (1), The height (height H1) of the first mirror and the second mirror is greater than the height (height H2) of the test piece. jig.

[0071] According to (5), the processed groove can be observed as a whole.

[0072] (6) The jig according to (2), the second holding portion has an inclined surface that inclines downward at an angle of 45° as it approaches the second side surface, The second mirror is held by the inclined surface. jig.

[0073] According to (6), a plate-shaped mirror can be used as the second mirror, which reduces the manufacturing cost of the jig.

[0074] (7) A method for confirming a processed groove (processed groove 96) of a test piece (test piece 90) having a first side surface (first side surface 91) and a second side surface (second side surface 92) facing each other, the method comprising: a holding step (holding step S10) of holding the test piece on a holding table (holding table 10) of a processing device (cutting device 1) that processes the test piece; a processing step (processing step S11) of processing the test piece held by the holding table with a processing tool (cutting blade 21) to form the processed grooves exposed on the first side surface and the second side surface of the test piece; an arrangement step (arrangement step S12) of arranging the jig (jig 70) according to any one of (1) to (6) so that the first mirror faces the first side surface of the test piece and so that the second mirror faces the second side surface of the test piece; After the placing step, an observation step (observation step S13) is provided in which the processed groove of the test piece reflected on the second mirror from above the test piece is observed while irradiating the second mirror with light from a light source from above the test piece. How to check.

[0075] According to (7), when observing the processed grooves of the test piece reflected on the second mirror from above, if light is irradiated from a light source above onto the tilted second mirror, the light is reflected by the second mirror toward the first mirror, then reflected by the first mirror back to the second mirror, and then reflected upward by the second mirror, making it easier to see the processed grooves of the test piece from above. This makes it possible to observe the processed grooves using a relatively inexpensive jig.

[0076] (8) The confirmation method according to (7), The jig has a through hole (through hole 75) formed in a bottom surface (bottom surface 73) connecting a lower portion of the first holding portion and a lower portion of the second holding portion, In the placing step, the jig is placed on the test piece from above so that the through hole surrounds the test piece. How to check.

[0077] According to (8), after the test piece is processed, the jig can be placed from above the test piece, so the test piece can be processed without taking the jig into consideration. [Explanation of symbols]

[0078] 1 Cutting equipment (processing equipment) 10 Holding table 21 Cutting blade (processing tool) 30 Imaging unit (imaging device) 61 1st mirror 62 Second mirror 70 Jig 71 1st holding part 72 Second holding part 73 bottom 74 Test piece holder 75 through holes 90 test specimens 91 First aspect 92 Second aspect 96 Machining groove S10 Hold step S11 Processing step S12 Placement Step S13 Observation step

Claims

1. A jig for checking a processed groove of a test piece having a processed groove exposed on a first side surface and a second side surface facing each other, a first mirror disposed to face the first side surface; a first holding portion that holds the first mirror; a second mirror disposed to face the second side surface and tilting downward as it approaches the second side surface so as to reflect light emitted from the imaging device toward the first mirror; a second holding portion that holds the second mirror, jig.

2. The jig according to claim 1, the first mirror is arranged along the vertical direction, the second mirror is disposed so as to be inclined downward in the vertical direction at an angle of 45° as it approaches the second side surface; jig.

3. The jig according to claim 1, a bottom surface connecting a lower portion of the first holding portion and a lower portion of the second holding portion; The bottom surface has a test strip holder that holds the test strip. jig.

4. The jig according to claim 3, The test piece holding portion is a through hole provided in the bottom surface so as to surround the test piece. jig.

5. The jig according to claim 1, The height of the first mirror and the second mirror is greater than the height of the test piece. jig.

6. The jig according to claim 2, the second holding portion has an inclined surface that inclines downward at an angle of 45° as it approaches the second side surface, The second mirror is held by the inclined surface. jig.

7. A method for confirming a processed groove of a test piece having a processed groove exposed on opposing first and second side surfaces, comprising: a holding step of holding the test piece on a holding table of a processing device that processes the test piece; a machining step of machining the test piece held by the holding table with a machining tool to form the machined grooves exposed on the first side surface and the second side surface of the test piece; a positioning step of positioning the jig according to any one of claims 1 to 6 so that the first mirror faces the first side surface of the test piece and so that the second mirror faces the second side surface of the test piece; After the placing step, an observation step of observing the processed groove of the test piece reflected on the second mirror from above the test piece while irradiating the second mirror with light from a light source from above the test piece, How to check.

8. 8. The verification method according to claim 7, The jig has a through hole in a bottom surface connecting a lower portion of the first holding portion and a lower portion of the second holding portion, In the placing step, the jig is placed on the test piece from above so that the through hole surrounds the test piece. How to check.

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